Outer packaging material for vacuum heat-insulating material, vacuum heat-insulating material, and article with vacuum heat-insulating material

Abstract

In the present disclosure, provided is an outer packaging material for a vacuum heat insulating material, the outer packaging material having a film having: a base material having polyethylene terephthalate; and an inorganic layer that is arranged on at least one surface of the base material and is formed from an inorganic material, and the lamellar period of the polyethylene terephthalate base material is 13.0-16.0 nm (inclusive).

Description

Technical Field

[0001] The present disclosure relates to an outer packaging material for a vacuum insulation material capable of forming a vacuum insulation material, a vacuum insulation material, and an article with a vacuum insulation material. Background Art

[0002] In recent years, for the purpose of energy saving of articles, vacuum insulation materials are being used. A vacuum insulation material is a member in which a core material is disposed in a bag body of an outer packaging material and the inside of the bag body is maintained in a vacuum state with a pressure lower than that of the atmosphere, and since heat convection inside is suppressed, good heat insulation performance can be exhibited. It should be noted that the above-mentioned outer packaging material used for the vacuum insulation material will be described as an outer packaging material for a vacuum insulation material or simply as an outer packaging material.

[0003] When a vacuum insulation material is exposed to high temperatures, there is a problem that the heat insulation performance of the vacuum insulation material decreases over time even if the initial thermal conductivity is low. In response to such a problem, for example, Patent Document 1 discloses an outer packaging material for a vacuum insulation material, which, based on the size of the outer packaging material for a vacuum insulation material when the temperature of the atmosphere is 20°C, when the temperature of the atmosphere is changed from 20°C to 145°C and the temperature of the atmosphere is maintained at 145°C for 1 hour, and then the temperature of the atmosphere is changed from 145°C to 20°C, the size change rate of the outer packaging material for a vacuum insulation material is 1% or less. It is described that: by making the size change rate of the outer packaging material for a vacuum insulation material within a specific range in this way, an outer packaging material that can maintain high gas barrier performance even at high temperatures can be obtained, and a vacuum insulation material that can maintain heat insulation performance for a long time even at high temperatures can be formed. On the other hand, in the above Patent Document 1, the policy related to a material with a low size change rate is not clear.

[0004] Patent Document 2 discloses an outer packaging material for a vacuum insulation material, which is characterized in that, in order to form a vacuum insulation material that can maintain heat insulation performance for a long time even at high temperatures, for the purpose of reducing the size change rate of the outer packaging material for a vacuum insulation material in a high-temperature environment, it has at least a film that can be heat-sealed and a gas barrier film, and the film that can be heat-sealed contains an amorphous copolyester resin.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-180822

[0008] Patent Document 2: Japanese Patent Application Laid-Open No. 2017-210986 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] The present disclosure is an invention completed in view of the above circumstances, and its main object is to provide an outer packaging material for a vacuum insulation material, etc., which can form a vacuum insulation material that can maintain its heat insulation performance for a long time even at high temperatures.

[0011] Means for Solving the Problems

[0012] The present disclosure provides an outer packaging material for a vacuum insulation material, which has a film, and the film has: a base material having polyethylene terephthalate; and an inorganic layer disposed on at least one surface of the above base material and formed of an inorganic substance, and the lamellar period of the above base material is 13.0 nm or more and 16.0 nm or less.

[0013] In addition, the present disclosure provides a vacuum insulation material having a core material and an outer packaging material enclosing the above core material, and the above outer packaging material is the above outer packaging material for vacuum insulation.

[0014] In addition, the present disclosure provides an article with a vacuum insulation material, which includes an article having a heat insulation region and a vacuum insulation material, and the vacuum insulation material has a core material and an outer packaging material enclosing the above core material, and the above outer packaging material is the above outer packaging material for vacuum insulation.

[0015] Advantages of the Invention

[0016] According to the present disclosure, it is possible to provide: an outer packaging material for a vacuum insulation material that can form a vacuum insulation material that can maintain its heat insulation performance for a long time even at high temperatures. Brief Description of the Drawings

[0017] Figure 1 It is a schematic cross-sectional view showing an example of the outer packaging material for a vacuum insulation material of the present disclosure.

[0018] Figure 2 It is a schematic diagram of the laminated structure of the crystalline part and the amorphous part of a crystalline polymer.

[0019] Figure 3 It is a graph showing the relationship between the lamellar period and the dimensional change of a PET base material.

[0020] Figure 4 It is a schematic cross-sectional view showing another example of the outer packaging material for a vacuum insulation material of the present disclosure.

[0021] Figure 5 It is a schematic cross-sectional view showing another example of the outer packaging material for a vacuum insulation material of the present disclosure.

[0022] Figure 6Schematic perspective view and cross-sectional view showing an example of the vacuum insulation material of the present disclosure. Detailed implementation mode

[0023] The implementation modes of the present disclosure include an outer packaging material for a vacuum insulation material, a vacuum insulation material, and an article with a vacuum insulation material. Hereinafter, the implementation modes of the present disclosure will be described with reference to the drawings and the like. However, the present disclosure can be implemented in a variety of different ways and is not limited to the content described in the following illustrated implementation modes. In addition, in order to make the description clearer, compared with the implementation modes, the drawings sometimes schematically show the width, thickness, shape, etc. of each part, but this is only an example and does not limit the interpretation of the present disclosure. In addition, in this specification and each figure, sometimes the same reference numerals are given to elements that are the same as those described in the figure that has already appeared, and detailed descriptions are appropriately omitted. In addition, for the convenience of description, sometimes statements such as above or below are used for description, but the up and down directions can also be reversed.

[0024] In addition, in this specification, when a certain structure of a certain member or a certain area, etc. is "above (or below)" another structure of another member or another area, etc., unless otherwise specified, it includes not only the case of being immediately above (or below) another structure, but also the case of being above (or below) another structure, that is, it also includes the case of being above (or below) another structure and having other constituent elements therebetween.

[0025] The outer packaging material is required to have various functions such as gas barrier performance for preventing gases such as water vapor and oxygen from permeating from the outside to the inside of the heat insulation material, and heat bonding performance for covering and hermetically sealing the core material. Therefore, the above-mentioned outer packaging material is formed in the form of a laminate of multiple films having these various functional characteristics. As a general form of the outer packaging material, it is a form in which a film that can be heat-sealed, a gas barrier film, and a protective film are laminated. In addition, as the gas barrier film used as the outer packaging material, a film formed of a resin substrate and a gas barrier layer disposed on at least one surface side of the resin substrate is sometimes used.

[0026] The inventors of the present application found that when the outer packaging material is exposed to high temperatures, in the multiple layers forming the outer packaging material, the expansion and contraction of the resin substrate of the gas barrier film affect the deterioration of the gas barrier layer and directly affect the gas barrier performance of the outer packaging material. For example, if the size of the above-mentioned resin substrate shrinks, compressive stress is also applied to the above-mentioned gas barrier layer, and if the size of the above-mentioned resin substrate expands, tensile stress is also applied to the gas barrier layer. Therefore, cracks are generated in the gas barrier layer, and the gas barrier performance of the gas barrier film is reduced. It is speculated that the reason is that the heat-induced expansion and contraction of such a resin substrate reduces the vacuum degree inside the vacuum insulation material.

[0027] The inventors of the present application have studied materials for resin substrates that can suppress dimensional changes due to temperature variations. As a result, it has been found that a substrate having polyethylene terephthalate with a specific lamellar period (hereinafter, sometimes referred to as a PET substrate) has small dimensional changes due to temperature variations. Specifically, it has been found that the dimensional change rate before and after holding at a high temperature described below, and the dimensional change rates in each process of the heating process, the constant temperature process, and the cooling process are small. And it has been found that by using a PET substrate having a specific lamellar period as the resin substrate of the gas barrier film, high gas barrier performance can be maintained even at high temperatures, and it becomes an outer packaging material for a vacuum insulation material that can form a vacuum insulation material capable of maintaining heat insulation performance for a long time.

[0028] Hereinafter, the outer packaging material for a vacuum insulation material, the vacuum insulation material, and the article with a vacuum insulation material of the present disclosure will be described separately.

[0029] A. Outer packaging material for vacuum insulation material

[0030] Figure 1 FIG. is a schematic cross-sectional view showing an example of the outer packaging material for a vacuum insulation material of the present disclosure. The outer packaging material 10 for a vacuum insulation material of the present disclosure has a film 3, and the film 3 has a PET substrate 1 and an inorganic layer 2 formed of an inorganic substance disposed on at least one surface of the PET substrate 1. In the present disclosure, the lamellar period of the PET substrate (the lamellar period of polyethylene terephthalate forming the PET substrate, hereinafter used with the same meaning) is 13.0 nm or more and 16.0 nm or less.

[0031] According to the present disclosure, by using a PET substrate formed of polyethylene terephthalate (hereinafter, referred to as PET) having a lamellar period within a specified range as the resin substrate of the above-mentioned film (hereinafter, sometimes referred to as a gas barrier film), it is possible to suppress dimensional changes of the PET substrate due to temperature variations, and it is possible to suppress the generation of cracks in the inorganic layer when exposed to high temperatures. Therefore, high gas barrier performance can be maintained even at high temperatures, and it becomes an outer packaging material for a vacuum insulation material that can form a vacuum insulation material capable of maintaining heat insulation performance for a long time.

[0032] Hereinafter, each configuration and characteristic of the outer packaging material for a vacuum insulation material in the present disclosure will be described in detail.

[0033] 1. Gas barrier film

[0034] The gas barrier film in the present disclosure has a PET substrate and an inorganic layer formed of an inorganic substance disposed on at least one surface of the PET substrate.

[0035] 1-1. PET substrate

[0036] The outer packaging material for the vacuum insulation material in the present disclosure contains a PET substrate as a resin substrate for supporting the inorganic layer described below. The PET substrate has PET as the main component. Here, "as the main component" means the component with the highest content in the substrate constituent components.

[0037] (1) Lamellar period

[0038] The lamellar period of the PET substrate in the present disclosure is 13.0 nm or more and 16.0 nm or less, preferably 13.0 nm or more and 15.0 nm or less, more preferably 14.0 nm or more and 15.0 nm or less.

[0039] The lamellar period of the PET substrate in the present disclosure can be obtained from the X-ray distribution obtained by small-angle X-ray measurement (SAXS). As Figure 2 shown, generally, a crystalline polymer has a regular laminated structure (periodic structure) formed by the repetition of a crystalline part 21 and an amorphous part 22. Here, the size of the repeating unit formed by the crystalline part 21 and the amorphous part 22 is called the lamellar period L (long-period length). This lamellar period L can be obtained from the scattering peak position of the long-period structure measured by the small-angle X-ray scattering method.

[0040] <Measurement of crystal structure>

[0041] (Fabrication of sample)

[0042] Cut the PET substrate into a rectangle of 1 cm (MD direction) × 1 cm (TD direction).

[0043] (Measurement device)

[0044] NANO-inXider manufactured by Xenocs

[0045] (Measurement conditions)

[0046] · Wavelength: Cu Kα1 line (1.54 Å)

[0047] · Output power of X-ray generator: 50 kV - 0.6 mA

[0048] · Observation mode: Transmission

[0049] · Accumulation time: 10 minutes

[0050] · Detector: PILATUS 200K

[0051] · Sample size: Rectangle of 1 cm × 1 cm

[0052] · Set the sample so that the MD direction is the meridian direction of the detector

[0053] Using the above measurement device, irradiate the sample with Cu Kα1 rays to obtain a two-dimensional scattering pattern in the detector. From the obtained two-dimensional scattering pattern, the angle formed by the straight line connecting the maximum point of the scattering peak intensity in the region where the scattering vector q = 0.1 / nm -1 or more and the beam center with the meridian direction is taken as the main azimuth direction, and the spectrum in the region where the azimuth angle is ±5 degrees with respect to the main azimuth angle is integrated in the azimuth direction to extract a one-dimensional scattering spectrum. If the peak position of the one-dimensional scattering spectrum is set as q L , then the lamellar period (long period length) L of the repeating structure of the lamellae in the main azimuth direction is obtained by L = 2π / q L .

[0054] Herein, Figure 3 (a) is a graph showing the dimensional change (expansion and contraction) of the PET substrate when the PET substrate 1 with a long lamellar period and the PET substrate 2 with a short lamellar period are exposed to high temperature. Additionally, Figure 3 (b) is a schematic diagram of the lamellar structure of the PET substrate 1, Figure 3 (c) is a schematic diagram of the lamellar structure of the PET substrate 2. As Figure 3 shown in (a), the dimensional change of the PET substrate 1 during the heating process and the cooling process is large. It is speculated that the reason is that, as described later, in the comparison between films with the same degree of crystallinity, a long lamellar period means a large region that flows significantly when exposed to a high temperature above the glass transition temperature and below the melting point, resulting in a larger coefficient of thermal expansion. It should be noted that the dimensional change rate of the PET substrate 1 before and after the high-temperature holding during the heating process, the constant-temperature process, and the cooling process is relatively small.

[0055] As Figure 3 shown in (a), the dimensional change of the PET substrate 2 during the heating process and the cooling process is small. Additionally, the dimensional change during the heating process, the constant-temperature process, and the cooling process (before and after the high-temperature holding) is large. Specifically, if heated, although the size elongates, it then shrinks during the heating process, and also shrinks during the constant-temperature process. Then, it shrinks during the cooling process. In the comparison between films with the same degree of crystallinity, a short lamellar period means a small region that flows significantly when exposed to a high temperature above the glass transition temperature and below the melting point. The reason is that in a high temperature above the glass transition temperature and below the melting point, the region that can flow significantly is limited to the amorphous part, especially the amorphous part except for the region close to the crystalline part. Therefore, the shorter the lamellar period, the more the region of the amorphous part close to the crystalline part, and the smaller the region that flows significantly in the high-temperature region above the glass transition temperature and below the melting point. It is speculated that the reason for the smaller dimensional change of the PET substrate 2 during the heating process and the cooling process is that when exposed to a high temperature above the glass transition temperature and below the melting point, the region that can flow significantly is small, resulting in a smaller coefficient of thermal expansion.

[0056] In addition, the reason for the large dimensional change of the PET substrate 2 before and after maintaining a high temperature, assuming that it has undergone a temperature increase process, a constant temperature process, and a temperature decrease process, is that there are few regions in the temperature range above the glass transition temperature during the manufacturing process of the PET substrate 2 where it can flow significantly. Therefore, the strain of the structure remains without being eliminated and persists even in a low temperature region where the entire region loses fluidity, such as at room temperature.

[0057] It should be noted that in the case of a long lamellar period like the PET substrate 1, since it has a structure with less strain inherently, it shows a restorability of elongation during the temperature increase process and contraction during the temperature decrease process, and thus the dimensional change rate before and after maintaining a high temperature is relatively small.

[0058] On the other hand, in the present disclosure, by setting the lamellar period of the PET substrate within the above range, the dimensional change due to temperature variation can be suppressed. Specifically, it is possible to reduce the dimensional change rate of the PET substrate before and after maintaining a high temperature, as well as the dimensional change rate in each process of the temperature increase process, the constant temperature process, and the temperature decrease process. Therefore, by using such a specific PET substrate as the resin substrate of the gas barrier film, it is possible to maintain high gas barrier performance even at high temperatures, and it becomes an outer packaging material for a vacuum insulation material that can form a vacuum insulation material capable of maintaining heat insulation performance for a long time.

[0059] The PET substrate in the present disclosure can be an unstretched substrate or a uniaxially or biaxially stretched substrate, but a biaxially stretched substrate is preferred. The stretching direction of the biaxially stretched PET substrate is not particularly limited. For example, stretching can be performed in the MD direction and the TD direction.

[0060] As a method for setting the lamellar period of the PET substrate within the above range, there are a method of adjusting the annealing temperature and a method of adjusting the cooling rate when crystallizing it from the molten state. For example, when the annealing temperature is set to a high temperature, the lamellar period tends to become longer, and when it is set to a low temperature, the lamellar period tends to become shorter. In addition, when the cooling rate when crystallizing it from the molten state is slowed down, the lamellar period tends to become longer, and when it is accelerated, the lamellar period tends to become shorter.

[0061] In addition, commercially available PET with a lamellar period within the above range can also be purchased and used as the PET substrate. As PET with a lamellar period within the above range, for example, PT10 (manufactured by China Sanfangxiang Co., Ltd.) can be cited. On the other hand, most commercially available PET has a lamellar period smaller than the above range. For example, the lamellar period of CB981 (manufactured by KOLON Co., Ltd.) is 12.3 nm.

[0062] The crystallinity of the PET substrate in the present disclosure is not particularly limited. For example, it is 20% or more and 40% or less, and can be 25% or more and 35% or less.

[0063] (2) Dimensional change rate

[0064] The PET substrate in the present disclosure has a small dimensional change with respect to temperature variations. Specifically, when based on the size of the above PET substrate at an atmosphere temperature of 20°C, when the temperature of the above atmosphere is changed from 20°C to 145°C, and after maintaining the temperature of the above atmosphere at 145°C for 1 hour, the dimensional change rate of the above PET substrate when the temperature of the above atmosphere is changed from 145°C to 20°C (hereinafter, sometimes denoted as "dimensional change rate of the PET substrate before and after high-temperature holding") is, for example, 1% or less, preferably 0.5% or less.

[0065] Here, Patent Document 1 discloses the following: By making the dimensional change rate of the outer packaging material before and after high-temperature holding 1% or less, preferably 0.5% or less, even when the outer packaging material is exposed to heat, the stress applied to the gas barrier layer can be suppressed, and thus the generation of cracks in the gas barrier layer can be suppressed. Therefore, it is considered that if the dimensional change rate of the above PET substrate before and after high-temperature holding is within the above range, even when the outer packaging material is exposed to heat, the stress applied to the inorganic layer (gas barrier layer) can be suppressed, the generation of cracks in the inorganic layer (gas barrier layer) can be suppressed, and the following outer packaging material can be obtained, which can form a vacuum insulation material that can maintain the heat insulation performance for a long time even at high temperatures. Among them, in gas barrier performance, the water vapor barrier performance is mainly exerted by the gas barrier layer forming the gas barrier film, but due to the dimensional change of the PET substrate, the inorganic layer (gas barrier layer) deteriorates, and thus there is a tendency for the above physical properties to be easily reduced. In the present disclosure, the dimensional change rate of the above PET substrate before and after high-temperature holding can be within the above range, the deterioration of the inorganic layer (gas barrier layer) and the deterioration of the water vapor transmission rate before and after high-temperature holding can be suppressed, and thus high gas barrier performance, especially high water vapor barrier performance, can be exerted regardless of temperature changes.

[0066] In addition, in the present disclosure, when the temperature of the above atmosphere is changed from 20°C to 145°C (hereinafter sometimes referred to as the "heating process"), the dimensional change rate of the above PET substrate is, for example, 1% or less, preferably 0.5% or less, and particularly preferably 0.3% or less. In addition, regarding the dimensional change rate of the above PET substrate when the temperature of the above atmosphere is maintained at 145°C for 1 hour (hereinafter sometimes referred to as the "constant temperature process"), it is, for example, 0.5% or less, preferably 0.3% or less. Furthermore, regarding the dimensional change rate of the above PET substrate when the temperature of the atmosphere is changed from 145°C to 20°C (hereinafter sometimes referred to as the "cooling process"), it is preferably 0.5% or less, and particularly preferably 0.4% or less.

[0067] Patent Document 1 discloses that the dimensional change rate of the above packaging material in the heating process is preferably 1% or less, the dimensional change rate of the above packaging material in the constant temperature process is preferably 0.5% or less, and in addition, the dimensional change rate of the above packaging material in the cooling process is preferably 1% or less. It is disclosed that if the dimensional change rate in each process is within the above range, even when the packaging material is exposed to heat, the stress applied to the gas barrier layer can be suppressed, and thus cracks can be suppressed from occurring in the gas barrier layer. In the present disclosure, it is also considered that if the dimensional change rate of the PET substrate in each of the above processes is within the above range, even when the packaging material is exposed to heat, the stress applied to the inorganic layer (gas barrier layer) can be suppressed, cracks can be suppressed from occurring in the inorganic layer (gas barrier layer), and a packaging material can be obtained that can form a vacuum heat insulating material that can maintain the heat insulating performance for a long time even at high temperatures.

[0068] It should be noted that the dimensional change rate of the above PET substrate when the temperature of the atmosphere is changed from 20°C to 145°C is sometimes referred to as the "dimensional change rate of the PET substrate in the heating process". In addition, the dimensional change rate of the above PET substrate when the temperature of the above atmosphere is maintained at 145°C for 1 hour is sometimes referred to as the "dimensional change rate of the PET substrate in the constant temperature process". Furthermore, the dimensional change rate of the above PET substrate when the temperature of the atmosphere is changed from 145°C to 20°C is sometimes referred to as the "dimensional change rate of the PET substrate in the cooling process".

[0069] The dimensional change rate of the PET substrate in each of the heating process, the constant temperature process, and the cooling process refers to the value obtained by the following method: For the test specimen, using a thermomechanical analyzer (TMA: Thermomechanical Analyzer), under the following conditions, in the heating process from 20°C to 145°C, the subsequent constant temperature process at 145°C for 1 hour, and the subsequent cooling process from 145°C to 20°C, the average of the dimensional change rate with respect to the initial value (the dimension at 20°C before heating) in the continuous film forming direction (MD direction), i.e., the length direction of the PET substrate, and the dimensional change rate with respect to the initial value (the dimension at 20°C before heating) in the width direction of the PET substrate is measured. The dimensional change rate of the PET substrate before and after the high temperature holding refers to the value obtained by the following method: For the test specimen, using a thermomechanical analyzer, under the following conditions, the average of the dimensional change rate with respect to the initial value (the dimension at 20°C before heating) in the continuous film forming direction (MD direction), i.e., the length direction of the PET substrate, and the dimensional change rate with respect to the initial value (the dimension at 20°C before heating) in the width direction of the PET substrate, which has undergone the heating process, the constant temperature process, and the cooling process, is measured.

[0070] Thermomechanical analyzer: TMA / SS6100 manufactured by Hitachi High-Tech Science Corporation

[0071] Measurement mode: Tensile mode, load 15 mN

[0072] Test specimen: Rectangle with 13 mm (long side direction) × 5 mm (short side direction)

[0073] Distance between chucks: 10 mm

[0074] Initial heating temperature: 20°C

[0075] Final heating temperature: 145°C (holding time at 145°C: 1 hour)

[0076] Final cooling temperature: 20°C

[0077] Heating and cooling rates: 10°C / min

[0078] Measurement atmosphere: Under nitrogen purge

[0079] Dimensional measurement frequency: Every 0.16 minutes

[0080] It should be noted that the dimensional change rate before and after the high temperature holding based on the above method is defined by the following formula (3). Among them, the dimension of the PET substrate at 20°C before heating is set as L in formula (3). 0Set the size of the PET substrate that has undergone the heating process, constant temperature process, and cooling process to L in Formula (3). 1 .

[0081] The dimensional change rate (%) before and after high-temperature holding = |L 0 -L 1 | / L 0 ×100 ··· Formula (3)

[0082] In addition, the dimensional change rate in each of the heating process, constant temperature process, and cooling process based on the above method is defined by the following Formula (4). Among them, set the size of the PET substrate at 20°C before heating to L in Formula (4). 0 Set the minimum size of the packaging material obtained during the measurement process to L in Formula (4). min Set the maximum size of the PET substrate obtained during this process to L in Formula (4). max .

[0083] The dimensional change rate in each process (%) = (L max -L min ) / L 0 ×100 ··· Formula (4)

[0084] (3) Others

[0085] The PET substrate may or may not have transparency. Various plastic compounding agents, additives, etc. may be included in the PET substrate. As additives, for example, lubricants, crosslinking agents, antioxidants, ultraviolet absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents, pigments, resins for modification, etc. can be cited.

[0086] The above PET substrate can be subjected to surface treatment. This is because it can improve the adhesion with the inorganic layer. As the above surface treatment, for example, plasma treatment, oxidation treatment disclosed in Japanese Patent Laid-Open No. 2014-180837, concavity-convex treatment (roughening treatment), easy-bonding coating treatment, etc. can be cited.

[0087] The thickness of the PET substrate is not particularly limited. For example, it is in the range of 6 μm to 200 μm, preferably 9 μm to 100 μm, and more preferably 10 μm to 50 μm.

[0088] 1-2. Inorganic layer

[0089] The inorganic layer in the present disclosure is a thin film formed of an inorganic substance and is disposed on at least one surface side of the above PET substrate. The above inorganic layer functions as a gas barrier layer that exhibits gas barrier properties by being formed on one surface of the PET substrate.

[0090] As the inorganic layer, there is no particular limitation as long as it is formed of an inorganic substance and can exhibit the desired gas barrier property. For example, a metal layer formed of a metal, a layer mainly composed of an inorganic compound, etc. can be used. The inorganic layer may or may not have transparency.

[0091] Examples of the metal for forming the above metal layer include a metal vapor deposition film formed of a metal such as aluminum, stainless steel, titanium, nickel, iron, copper, or an alloy containing them.

[0092] In addition, as the inorganic compound of the layer mainly composed of the above inorganic compound, any material that can exhibit the desired gas barrier property can be used. For example, one or more inorganic compounds selected from inorganic oxides, inorganic oxynitrides, inorganic nitrides, inorganic carbon oxides, inorganic oxynitridocarbonides, zinc silicon oxide, etc. can be cited. Specifically, an inorganic compound containing one or more atoms selected from silicon, aluminum, magnesium, calcium, potassium, tin, sodium, titanium, boron, yttrium, zirconium, cerium, and zinc can be cited. More specifically, silicon oxide, aluminum oxide, magnesium oxide, titanium oxide, tin oxide, zinc silicon alloy oxide, indium alloy oxide, silicon nitride, aluminum nitride, titanium nitride, silicon oxynitride, etc. can be cited. Aluminum oxide (aluminum oxide) and silicon oxide (silicon dioxide) are particularly preferred. The above inorganic compounds can be used alone or in any proportion by mixing the above materials.

[0093] In the present disclosure, as the inorganic substance for forming the inorganic layer, aluminum, aluminum oxide, or silicon oxide is preferred. The inorganic layer may be a vapor deposition film formed by a vapor deposition method or a coating film formed by a coating method such as coating. Among them, from the viewpoints of high adhesion to the PET substrate and high gas barrier performance, a vapor deposition film is preferred. In the case of a vapor deposition film, it can be formed by single vapor deposition or multiple vapor depositions. That is, one inorganic layer can be a single film formed by one vapor deposition or can be formed by multiple vapor depositions to have a laminated structure.

[0094] The thickness of the inorganic layer is not particularly limited and is preferably in the range of 10 nm to 300 nm. By setting the thickness of the inorganic layer within the above range, the barrier property can be maintained, the flexibility can be sufficiently maintained, and barrier failure is less likely to occur.

[0095] 1-3. Other layer configurations

[0096] The film in the present disclosure may have an overcoat layer in such a manner as to cover the surface side of the inorganic layer on the side opposite to the PET substrate. This is because the gas barrier performance of the gas barrier film can be improved by having the overcoat layer. Such an overcoat layer is not particularly limited, and substances generally used as overcoat agents can be used. For example, as the main component of the overcoat layer, a mixed compound containing an organic part and an inorganic part can be used. Specifically, the overcoat layer described in Japanese Patent Application Laid-Open No. 2017-180822 can be adopted, and thus the description here is omitted.

[0097] 1-4. Others

[0098] As the gas barrier performance of a single (one) gas barrier film in the present disclosure, the oxygen transmission rate is preferably 0.1 cc / (m 2 ·day·atm) or less, and more preferably 0.05 cc / (m 2 ·day·atm) or less. In addition, the water vapor transmission rate is preferably 0.1 g / (m 2 ·day) or less, and more preferably 0.05 g / (m 2 ·day) or less. By making the oxygen and water vapor transmission rates of the gas barrier film within the above ranges, it is possible to prevent moisture, gas, etc. penetrating from the outside from easily penetrating into the core material inside the vacuum insulation material. In addition, by using a plurality of such gas barrier films having gas barrier performance, etc., the gas barrier performance of the packaging material can be further improved. It should be noted that the above oxygen transmission rate and water vapor transmission rate can be measured by the same method as the method described in the item "3. Characteristics of the packaging material for vacuum insulation materials" described later.

[0099] 2. Layer structure of the packaging material for vacuum insulation materials

[0100] 2-1. Gas barrier film

[0101] The packaging material for vacuum insulation materials in the present disclosure only needs to have at least one of the above-mentioned gas barrier films having a specific PET substrate and an inorganic layer, and preferably has two or more. This is because the gas barrier performance of the packaging material can be further improved.

[0102] When the packaging material has two or more of the above-mentioned gas barrier films having a specific PET substrate and an inorganic layer, the composition of each gas barrier film, such as the material of the inorganic layer of the gas barrier film and the presence or absence of an overcoat layer, can be the same or different. Multiple films having the same functions and characteristics can be used. In addition, by using films having different functions and characteristics in configurations corresponding to their respective functions and characteristics, the functions and characteristics of each film can be exerted.

[0103] In addition, the outer packaging material for the vacuum insulation material in the present disclosure may also have one or more other films having gas barrier properties in addition to the above-mentioned gas barrier film having a specific PET substrate.

[0104] As the other film having gas barrier properties, a film having a resin substrate and an inorganic layer disposed on at least one surface side of the resin substrate can be cited. As the resin substrate, a resin substrate other than the above-mentioned specific PET substrate can be cited. The resin used in the resin substrate is not particularly limited. For example, polyolefin resins such as polyethylene and polypropylene, polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT), cyclic polyolefin resins, polystyrene resins, acrylonitrile-styrene copolymers (AS resins), acrylonitrile-butadiene-styrene copolymers (ABS resins), poly(meth)acrylic resins, polycarbonate resins, ethylene-vinyl ester copolymers and their saponified products, various polyamide resins such as various nylons, polyimide resins, polyurethane resins, acetal resins, cellulose resins and other various resins can be used.

[0105] The thickness of the resin substrate is not particularly limited. For example, it is in the range of 6 μm to 200 μm, and more preferably 9 μm to 100 μm. In addition, the resin substrate can be a single layer or a multilayer body formed by laminating a plurality of resin layers. In the above multilayer body, each resin layer can be formed of different resins or the same resin.

[0106] As the inorganic layer in the other film, the same inorganic layer as the inorganic layer in the above-mentioned gas barrier film having a specific PET substrate can be cited.

[0107] 2-2. Film capable of heat welding

[0108] The outer packaging material for the vacuum insulation material in the present disclosure usually has a film capable of heat welding disposed on one main surface side. Such a film capable of heat welding is a film that can be welded by heating. The above-mentioned film capable of heat welding is a member that bears one surface in the thickness direction of the outer packaging material for the vacuum insulation material, and is a member that contacts the core material when manufacturing the vacuum insulation material using the outer packaging material for the vacuum insulation material in the present disclosure, and also joins the ends of the opposing outer packaging materials for the vacuum insulation material when sealing the core material.

[0109] As the material of the above heat-sealable film, from the aspect of being able to be melted by heating and welded, thermoplastic resins are preferred. For example, there can be mentioned: linear low-density polyethylene (LLDPE), high-density polyethylene (HDPE) and other polyethylenes, polyolefin resins such as unstretched polypropylene (CPP), polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyvinyl acetate resins, polyvinyl chloride resins, poly(meth)acrylic resins, urethane resins, polyvinyl alcohol resins and ethylene-vinyl alcohol copolymer (EVOH) resins, polyphenylene sulfide (PPS) resins, tetrafluoroethylene (C 2 F 4 ), ethylene (C 2 H 4 ) copolymer (ETFE) resins, etc.

[0110] In the present disclosure, it can be appropriately selected from the above resins according to the set melting point of the heat-sealable film. For example, linear low-density polyethylene (LLDPE) has high versatility and can be heat-sealed at a relatively low temperature. However, since the melting point of LLDPE is low, the size of the heat-sealable film is likely to change due to temperature changes. However, the outer packaging material in the present disclosure can suppress the overall size change of the outer packaging material when using LLDPE as the heat-sealable film by having the above-mentioned film containing a specific PET substrate, and can suppress the reduction of the gas barrier performance of the outer packaging material.

[0111] The melting point of the above heat-sealable film is preferably 50 °C or higher, more preferably 80 °C or higher, still more preferably 100 °C or higher, and particularly preferably 145 °C or higher. In addition, the above melting point is preferably 300 °C or lower, more preferably 290 °C or lower, still more preferably 280 °C or lower. In addition, regarding the above heat-sealable film, by setting the above melting point to 145 °C or higher, even if the outer packaging material of the present disclosure is exposed to a high-temperature environment for a long time, it is possible to suppress the thermal deterioration and size change of the heat-sealable film itself, and it is possible to suppress the overall size change of the outer packaging material caused by the size change of the heat-sealable film. In addition, the higher the melting point of the heat-sealable film, the more it is possible to suppress the peeling of the sealing surface due to exposure to the ambient temperature when the outer packaging material of this method is used in the manufacture of a vacuum insulation material. Therefore, a vacuum insulation material that can withstand use in a higher-temperature environment can be obtained. As the melting point of the above heat-sealable film set according to such a view, for example, it can be set within the range of 145 °C to 300 °C, within the range of 145 °C to 290 °C, or within the range of 145 °C to 280 °C.

[0112] The melting point of the above-mentioned heat-sealable film in the outer packaging material can be measured by the following method. First, peel the heat-sealable film from the outer packaging material to obtain a measurement sample of about 10 mg. Place this measurement sample in an aluminum cell, and use a differential scanning calorimeter (DSC204 manufactured by NETZSCH) to heat from 20 °C to 300 °C at a heating rate of 10 °C / minute in a nitrogen atmosphere, and hold at this temperature for 10 minutes. Further cool to 20 °C at a cooling rate of 10 °C / minute, hold at this temperature for 10 minutes, and then heat to 300 °C again at a heating rate of 10 °C / minute (second heating). The intersection of the tangent at the melting point observed during the second heating and the baseline of the DSC curve on the lower temperature side than the above-mentioned melting point can be set as the melting point of the heat-sealable film.

[0113] The above-mentioned heat-sealable film may also contain other materials such as anti-blocking agents, lubricants, flame retardants, fillers, etc.

[0114] The thickness of the above-mentioned heat-sealable film is preferably, for example, in the range of 20 μm to 100 μm, more preferably in the range of 25 μm to 90 μm, and particularly preferably in the range of 30 μm to 80 μm. If the thickness of the heat-sealable film is greater than the above range, the gas barrier performance of the outer packaging material may be reduced, etc. If the thickness is less than the above range, the desired adhesive force may sometimes not be obtained.

[0115] 2-3. Protective film

[0116] The outer packaging material of this embodiment preferably has a protective film in addition to the heat-sealable film and the gas barrier film. The arrangement position of the above-mentioned protective film in the outer packaging material is not particularly limited, and it is preferably arranged at a position on the side of the gas barrier film opposite to the heat-sealable film, etc., which becomes the outermost layer (the outermost surface layer) when a vacuum insulation material is formed.

[0117] As the above-mentioned protective film, a resin with a melting point higher than that of the heat-sealable film can be used, and it can be in the form of a sheet or a film. Specifically, as such a protective film, the protective film described in Japanese Patent Application Laid-Open No. 2017-180822 can be adopted, so the description here is omitted.

[0118] 2-4. Regarding the layer structure

[0119] The outer packaging material for a vacuum insulation material in the present disclosure has at least one of the above-mentioned gas barrier films having a specific PET substrate and the above-mentioned inorganic layer. The order of the above-mentioned PET substrate and the above-mentioned inorganic layer is not particularly limited, and can be appropriately set according to the layer structure of each layer other than the gas barrier film used together with the outer packaging material, the number of gas barrier films, etc. For example, as Figure 1As illustrated, when forming a vacuum insulation material using the packaging material 10 with the gas barrier film 3 having the specific PET group 1 and the inorganic layer 2 as described above, it can be configured such that the inorganic layer 2 is on the inner side of the PET substrate 1. That is, the packaging material 10 of the present disclosure can have a film 4 capable of heat welding and the gas barrier film 3, and the gas barrier film 3 has the inorganic layer 2 and the PET substrate 1 in sequence from the side of the film 4 capable of heat welding.

[0120] In addition, as Figure 4 illustrated in (a), in the case where the packaging material 10 has a protective film 5, etc., the gas barrier film 3 can also be configured such that the inorganic layer 2 is on the outer side of the PET substrate 1. That is, the packaging material 10 of the present disclosure can have a film 4 capable of heat welding, the gas barrier film 3 disposed on one surface of the film 4 capable of heat welding, and a protective film 5 disposed on the surface of the gas barrier film 3 opposite to the film 1 capable of heat welding, and the gas barrier film 3 has the PET substrate 1 and the inorganic layer 2 in sequence from the side of the film 4 capable of heat welding.

[0121] When the packaging material 10 has two of the above gas barrier films, it can be configured as Figure 4 illustrated in (b), such that the inorganic layers 2 of two adjacent gas barrier films 3a, 3b face each other, or it can be configured as Figure 4 illustrated in (c), such that the inorganic layers 2 of both of two adjacent gas barrier films 3a, 3b are on the inner side of the PET substrate 1, or it can be configured as Figure 5 illustrated in (a), such that the inorganic layers 2 of both of two adjacent gas barrier films 3a, 3b are on the outer side of the PET substrate 1.

[0122] Regarding the packaging material of the present disclosure, as Figure 5 illustrated in (b) and Figure 5 illustrated in (c), when the gas barrier film 3 is disposed on the outermost layer of the vacuum insulation material, from the viewpoint of protecting the inorganic layer 2, the outermost gas barrier film 3a is preferably configured such that the inorganic layer 2 is on the inner side of the PET substrate 1.

[0123] In addition, the packaging material of the present disclosure can, on the basis of the above gas barrier film having a specific PET substrate, further include other gas barrier films. For example, in Figure 4 illustrated in (b), Figure 4 illustrated in (c), Figure 5 illustrated in (a), one of the two gas barrier films 3 can be another gas barrier film. In addition, in Figure 5 illustrated in (b) and Figure 5In (c), one or two of the three gas barrier films 3 may be other films having gas barrier properties.

[0124] The thickness of the above-mentioned outer packaging material is not particularly limited as long as the desired gas barrier performance and strength can be obtained. For example, it is preferably in the range of 30 μm to 200 μm, and more preferably in the range of 50 μm to 150 μm.

[0125] The method for laminating the above-mentioned outer packaging material is not particularly limited as long as the desired outer packaging material structure can be obtained, and known methods can be used. For example, a dry lamination method in which each layer formed in advance is laminated using the above-mentioned interlayer adhesive; a method in which each material of the gas barrier film extruded and heat-melted using a T-die or the like is laminated, and a film capable of heat-sealing is laminated on the obtained laminate via an interlayer adhesive, etc.

[0126] 3. Characteristics of the Outer Packaging Material for Vacuum Insulation Materials

[0127] The outer packaging material for the vacuum insulation material of the present disclosure has excellent gas barrier performance. Specifically, it is preferably that the water vapor transmission rate of the above-mentioned outer packaging material for the vacuum insulation material in an atmosphere of a temperature of 40 °C and a humidity of 90% RH is 0.01 g / (m 2 ·day) or less. In addition, it is preferably that the oxygen transmission rate of the above-mentioned outer packaging material for the vacuum insulation material in an atmosphere of a temperature of 100 °C and a humidity of 0% RH is 0.05 cc / (m 2 ·day·atm) or less. Further, it is preferably that the deterioration amount of the water vapor transmission rate of the above-mentioned outer packaging material for the vacuum insulation material after being stored for 500 hours in an atmosphere at a temperature of 145 °C is 0.01 g / (m 2 ·day) or less. This is because an outer packaging material that can maintain high gas barrier performance even at high temperatures can be obtained. Therefore, the above-mentioned outer packaging material can form a vacuum insulation material that can maintain heat insulation performance for a long time even at high temperatures.

[0128] The water vapor transmission rate of the above-mentioned outer packaging material can be measured using a water vapor transmission rate measuring device (manufactured by Technolox, UK, DELTAPERM) in an atmosphere of a measurement temperature of 40 °C and a humidity of 90% RH, in accordance with ISO-15106-5:2015 (differential pressure method). The measurement is carried out as follows: The surface of the outer packaging material that is on the gas barrier film side with respect to the film capable of heat-sealing in the thickness direction of the outer packaging material is made the high-humidity side (water vapor supply side), and it is installed between the upper chamber and the lower chamber of the above-mentioned device. At a transmission area of 64 cm 2It is carried out under the following conditions. At least 3 samples are measured under one condition, and the average value of their measured values is taken as the value of the water vapor transmission rate under this condition. Hereinafter, the water vapor transmission rate described in this specification can be measured using the same method as the above method.

[0129] The oxygen transmission rate of the above outer packaging material can refer to JIS K 7126-2A:2006 (Plastics - Films and Sheets - Test Method for Gas Transmission Rate - Part 2: Isobaric Method, Appendix A: Test Method for Oxygen Transmission Rate Based on Electrochemical Sensor Method), and is measured using an oxygen transmission rate measuring device (manufactured by MOCON, USA, OXTRAN) under the conditions of a measurement temperature of 100 °C and a humidity of 0%RH. The measurement is carried out as follows: The surface of the outer packaging material that is on the gas barrier film side with respect to the film that can be heat-sealed in the thickness direction of the outer packaging material is brought into contact with oxygen and installed in the above device. Under the condition of a permeation area of 50 cm 2 It is carried out under the following conditions. The above measurement is carried out according to the following steps. First, the inside of the above device is purged by supplying a carrier gas at a flow rate of 10 cc / min for more than 60 minutes. The above carrier gas can use nitrogen containing about 5% hydrogen. After purging, a test gas is introduced into the above device. As the time from the start of the inflow until the equilibrium state is reached, 12 hours is ensured, and then the above measurement is started. The above test gas uses at least 99.5% dry oxygen. At least 3 samples are measured under one condition, and the average value of their measured values is taken as the value of the oxygen transmission rate under this condition.

[0130] 4. Others

[0131] The outer packaging material for the vacuum insulation material of the present disclosure may or may not have transparency, and can be appropriately set according to the use of the vacuum insulation material using the outer packaging material for the vacuum insulation material of the present disclosure. Regarding the transparency of the above outer packaging material for the vacuum insulation material, it is not strictly specified by the transmittance and can be appropriately determined according to the use and the like.

[0132] When the outer packaging material for the vacuum insulation material of the present disclosure has transparency, the vacuum insulation material using the above outer packaging material for the vacuum insulation material can visually identify its interior. Therefore, by putting a detection agent together with the core material inside the vacuum insulation material, the vacuum state inside can be visually confirmed according to the change of the detection agent.

[0133] As a manufacturing method of the outer packaging material for the vacuum insulation material of the present disclosure, for example, a method of laminating each pre-manufactured film via the above adhesive layer can be cited. In addition, the raw materials of each heat-melted film can be successively extruded using a T-die or the like and then laminated to manufacture the outer packaging material for the vacuum insulation material of the present invention.

[0134] The outer packaging material for the vacuum insulation material of the present disclosure can be used for the vacuum insulation material. In the vacuum insulation material, the outer packaging material for the vacuum insulation material of the present disclosure can be used by being disposed opposite to each other with the core material interposed therebetween in such a manner that the film capable of heat fusion bonding becomes the core material side.

[0135] B. Vacuum Insulation Material

[0136] The vacuum insulation material of the present disclosure is characterized in that it is a vacuum insulation material having a core material and an outer packaging material enclosing the core material, and the outer packaging material is the outer packaging material described in the above item “A. Outer Packaging Material for Vacuum Insulation Material”.

[0137] Figure 6 (a) is a schematic perspective view showing an example of the vacuum insulation material of the present disclosure, Figure 6 (b) is Figure 6 The X-X cross-sectional view of (a). Figure 6 The exemplified vacuum insulation material 50 has a core material 11 and an outer packaging material 10 enclosing the core material 11, and the outer packaging material 10 is Figure 1 the outer packaging material for the vacuum insulation material described above. The vacuum insulation material 50 is a bag body formed by opposing two outer packaging materials 10 with their respective films capable of heat fusion bonding facing each other, and the end portions 12 are joined by heat fusion bonding. The core material 11 is enclosed in the bag body, and the inside of the bag body is decompressed.

[0138] According to the present disclosure, since the outer packaging material enclosing the core material is the outer packaging material for the vacuum insulation material described in the above item “A. Outer Packaging Material for Vacuum Insulation Material”, a vacuum insulation material capable of maintaining good heat insulation performance even at high temperatures is obtained. Hereinafter, each component of the vacuum insulation material of the present disclosure will be described.

[0139] 1. Outer Packaging Material for Vacuum Insulation Material

[0140] The outer packaging material for the vacuum insulation material in the present disclosure is a member for enclosing the core material, which is the same as the outer packaging material for the vacuum insulation material described in the above item “A. Outer Packaging Material for Vacuum Insulation Material”, and thus the description thereof is omitted here.

[0141] 2. Core Material

[0142] The core material in the present disclosure is a member enclosed by the outer packaging material for the vacuum insulation material. It should be noted that “enclosing” means sealing inside the bag body formed by using the outer packaging material for the vacuum insulation material.

[0143] The core material preferably has a low thermal conductivity. In addition, the core material can be made into a porous material having a porosity of 50% or more, particularly 90% or more.

[0144] As the material for forming the core material, powders, foams, fibrous materials, etc. can be used. The above-mentioned powders can be either inorganic or organic, for example, dry silica, wet silica, precipitated silica powder, conductive powder, calcium carbonate powder, pearlite, clay, talc, etc. Among them, regarding the mixture of dry silica and conductive powder, since the reduction in heat insulation performance accompanying the increase in the internal pressure of the vacuum insulation material is small, it is advantageous for use in the temperature range where the internal pressure increases. In addition, if a substance with a small infrared absorption rate such as titanium oxide, aluminum oxide, indium-doped tin oxide, etc. is added to the above-mentioned materials as a radiation suppression material, the infrared absorption rate of the core material can be reduced.

[0145] As the above-mentioned foam, urethane foam, styrene foam, phenolic foam, etc. can be used. Among them, a foam forming continuous bubbles is preferred.

[0146] The above-mentioned fibrous material can be an inorganic fiber or an organic fiber, but from the viewpoint of heat insulation performance, inorganic fibers are preferably used. Examples of such inorganic fibers include glass fibers such as glass wool and glass fiber, alumina fiber, silica alumina fiber, silica fiber, ceramic fiber, asbestos, etc. These inorganic fibers are preferred in terms of low thermal conductivity and being easier to handle than powders.

[0147] The core material can use the above-mentioned materials alone or can be a composite material in which two or more materials are mixed.

[0148] 3. Others

[0149] In the vacuum insulation material of the present disclosure, the core material is enclosed inside the outer packaging material for the vacuum insulation material, and the inside is decompressed to a vacuum state. The degree of vacuum inside the vacuum insulation material is preferably 5 Pa or less, for example. This is because heat conduction caused by the convection of the air remaining inside can be reduced, and excellent heat insulation can be exhibited.

[0150] The lower the thermal conductivity of the vacuum insulation material, the more preferred. For example, the thermal conductivity (initial thermal conductivity) is preferably 5 mW / (mK) or less. This is because it is difficult for the vacuum insulation material to conduct heat to the outside, and a high heat insulation effect can be achieved. Among them, the above-mentioned initial thermal conductivity is more preferably 4 mW / (mK) or less. The thermal conductivity can be set as the value measured under the conditions of 30 °C on the high temperature side, 10 °C on the low temperature side, and an average temperature of 20 °C according to JIS A1412-2:1999.

[0151] In addition, since the vacuum insulation material of the present disclosure uses the above-mentioned outer packaging material for the vacuum insulation material, the deterioration of the heat insulation performance is suppressed.

[0152] The manufacturing method of the vacuum insulation material of the present disclosure can use general methods. For example, prepare two outer packaging materials for vacuum insulation materials described in the above item "A. Outer packaging material for vacuum insulation materials", overlap the heat-sealable films of each other facing each other, heat-seal the outer edges of three sides, and obtain a bag body with one side open. After putting the core material into the bag body from the opening, suck air from the opening, and seal the opening in a state where the inside of the bag body is decompressed, thereby obtaining a vacuum insulation material.

[0153] The vacuum insulation material of the present disclosure can be used for items that require heat insulation, for example. The above items will be described later.

[0154] C. Articles with vacuum insulation materials

[0155] The article with a vacuum insulation material of the present disclosure is an article with a vacuum insulation material having an article with a heat insulation region and a vacuum insulation material. The above vacuum insulation material has a core material and an outer packaging material enclosing the core material. The above outer packaging material is the outer packaging material for vacuum insulation materials described in the above item "A. Outer packaging material for vacuum insulation materials".

[0156] According to the present disclosure, the vacuum insulation material for an article is formed of the outer packaging material described in the item "A. Outer packaging material for vacuum insulation materials". Therefore, the vacuum insulation material can exhibit good heat insulation performance for a long time. By making an article have such a vacuum insulation material, energy conservation of an article in a high-temperature environment or a high-temperature and high-humidity environment, and an object using the article can be achieved.

[0157] Regarding the vacuum insulation material and the outer packaging material for vacuum insulation materials used therein in the present disclosure, detailed descriptions have been made in the above items "B. Vacuum insulation material" and "A. Outer packaging material for vacuum insulation materials". Therefore, the description here is omitted.

[0158] The article in the present disclosure has a heat insulation region. Here, the above heat insulation region refers to a region thermally insulated by a vacuum insulation material, for example, a region where heat is kept or cold is kept, a region surrounding a heat source / cooling source, or a region isolated from a heat source / cooling source. These regions can be a space or an object.

[0159] Examples of the above article include: electrical equipment such as refrigerators, freezers, warmers, and coolers, containers such as heat-insulating containers, cold-insulating containers, transport containers, containers, and storage containers, transportation means such as vehicles, airplanes, and ships, buildings such as houses and warehouses, and building materials such as wall materials and floor materials.

[0160] The present disclosure is not limited to the above-described embodiments. The above-described embodiments are illustrative, and technical solutions having substantially the same constitution as the technical concept described in the claimed scope of the present disclosure and exhibiting the same effects are included in the technical scope of the present disclosure.

[0161] Example

[0162] Examples and comparative examples are shown below to more specifically illustrate the present invention.

[0163] A PET substrate having a lamellar period shown in Table 1 was prepared. The lamellar period of the PET substrate is a value obtained by the above method. The dimensional change rate of the PET substrate before and after high-temperature holding, and the dimensional change rate of the PET substrate in each of the heating process, the constant-temperature process, and the cooling process were determined. The dimensional change rate is a value obtained by the above method. The results are shown in Table 1.

[0164] [Table 1]

[0165]

[0166] From the results in Table 1, it was confirmed that the dimensional change rates of the PET substrates of Examples 1 to 3 having a lamellar period of 13.0 nm or more and 16.0 nm or less before and after high-temperature holding, and in each of the heating process, the constant-temperature process, and the cooling process were small. Therefore, it is considered that by using it as a resin substrate for a gas barrier film, high gas barrier performance can be maintained even at high temperatures, and it becomes an outer packaging material for a vacuum insulation material capable of forming a vacuum insulation material that can maintain heat insulation performance for a long time. On the other hand, it was confirmed that in Comparative Examples 2 to 4, since the lamellar period was small, strain remained during the manufacturing process, so they shrank during the heating process and the dimensional change rate became large. Further, the strain was not repaired and remained during the cooling process, and the dimensional change rate before and after high-temperature holding was large. On the other hand, it was confirmed that in Comparative Example 1, since the lamellar period was large, the dimensional change rate was large particularly during the cooling process.

[0167] Thus, in the present disclosure, for example, the following inventions are provided.

[0168] [1] An outer packaging material for a vacuum insulation material, which has a film, the film having: a substrate having polyethylene terephthalate; and an inorganic layer disposed on at least one surface of the substrate and formed of an inorganic substance, wherein the lamellar period of the substrate is 13.0 nm or more and 16.0 nm or less.

[0169] [2] The outer packaging material for a vacuum insulation material according to [1], wherein the inorganic substance forming the inorganic layer is aluminum, aluminum oxide, or silicon oxide.

[0170] [3] A vacuum thermal insulation material having a core material and an outer packaging material encapsulating the core material, wherein the outer packaging material is the outer packaging material for vacuum thermal insulation as described in [1] or [2].

[0171] [4] An article with a vacuum thermal insulation material, comprising an article having a heat insulation region and a vacuum thermal insulation material, wherein the vacuum thermal insulation material has a core material and an outer packaging material encapsulating the core material, and the outer packaging material is the outer packaging material for vacuum thermal insulation as described in [1] or [2].

[0172] Explanation of reference numerals

[0173] 1 ··· PET substrate

[0174] 2 ··· Inorganic layer

[0175] 3 ··· Gas barrier film

[0176] 4 ··· Heat-sealable film

[0177] 5 ··· Protective film

[0178] 10 ··· Outer packaging material for vacuum thermal insulation material

[0179] 11 ··· Core material

[0180] 50 ··· Vacuum thermal insulation material

Claims

1. An outer packaging material for a vacuum insulation material, which has a film, and the film has: a base material having polyethylene terephthalate; and an inorganic layer disposed on at least one surface of the base material and formed of an inorganic substance. The lamellar period of the base material is 13.0 nm or more and 16.0 nm or less.

2. The outer packaging material for a vacuum insulation material according to claim 1. Wherein, The inorganic substance forming the inorganic layer is aluminum, aluminum oxide or silicon oxide.

3. A vacuum insulation material, which has a core material and an outer packaging material encapsulating the core material. The outer packaging material is the outer packaging material for vacuum insulation according to claim 1 or 2.

4. An article with a vacuum insulation material, which includes an article having a heat insulation area and a vacuum insulation material. The vacuum insulation material has a core material and an outer packaging material encapsulating the core material. The outer packaging material is the outer packaging material for vacuum insulation according to claim 1 or 2.

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