Cleaning method and cleaning equipment for semiconductor workpiece storage device

Abstract

The invention relates to a cleaning method and cleaning equipment for a semiconductor workpiece storage device. The cleaning method comprises the steps that a cover body and a box body are dried at a drying station, the semiconductor workpiece storage device comprises the cover body and the box body, and the cover body is detachably connected to the box body; environment atmosphere control is kept for the cover body and the box body; the cover body and the box body are locked; and the locked semiconductor workpiece storage device is subjected to discharging. According to the cleaning method, the environment atmosphere where the dried cover body and the dried box body are located is the dry environment atmosphere all the time, the situation that water vapor in air is attached to the surfaces of the box body and the cover body can be reduced, and then the influence of the air containing the water vapor on the dryness of the box body and the cover body can be greatly reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor wafer manufacturing, and particularly to a cleaning method and cleaning equipment for a semiconductor workpiece storage device. Background Art

[0002] FOSB (Front Opening Shipping Box) is a packaging and transportation tool used in the semiconductor manufacturing process. The wafers carried by FOSB are mainly used for circulation between wafer manufacturers and chip manufacturers.

[0003] In order to keep the silicon wafers inside it clean, dry and stable during transportation and storage, and thus ensure the stability and reliability in the semiconductor manufacturing process, FOSB is not designed with air inlet holes and air outlet holes.

[0004] During the cleaning process of FOSB, in order to improve the cleaning effect, the cover and the box body of FOSB are separated for cleaning, and after the cleaning process is completed, the cover and the box body are locked again. Generally, the FOSB is first cleaned by a cleaning device, and then dried by a drying device. After the drying operation is completed, the drying device needs to be opened to lock the cover and the box body of the FOSB. Since the cleaning device and the drying device are located in the same enclosed space, even if the drying device has thoroughly dried the cover and the box body, when the cleaning device is opened, humid air will escape from the cleaning device into the enclosed space, and water vapor in the air may adhere to the surfaces of the cover and the box body of the FOSB after the drying process, thus affecting the drying effect of the FOSB after drying. Summary of the Invention

[0005] In view of this, embodiments of the present application provide a cleaning method and cleaning equipment for a semiconductor workpiece storage device to solve at least one problem in the background art.

[0006] In a first aspect, embodiments of the present application provide a cleaning method for a semiconductor workpiece storage device, and the cleaning method includes: Performing a drying process on the cover and the box body at a drying station, where the semiconductor workpiece storage device includes a cover and a box body, and the cover is detachably connected to the box body; Maintaining environmental atmosphere control over the cover and the box body; Locking the cover and the box body; Unloading the semiconductor workpiece storage device after locking; Wherein, maintaining environmental atmosphere control over the cover and the box body includes: Purge the cover body and the box body during the locking process with a clean and dry gas; the relative humidity of the clean and dry gas is less than 1%.

[0007] Combined with the first aspect of the present application, in an alternative embodiment, before locking the cover body and the box body, it includes: Transfer the cover body and the box body that have completed the drying process to the locking station; Purge the cover body and the box body during the process of transferring from the drying station to the locking station, as well as the cover body and the box body located at the locking station with a clean and dry gas.

[0008] Combined with the first aspect of the present application, in an alternative embodiment, transferring the cover body and the box body that have completed the drying process to the locking station includes: Transfer one of the box body and the cover body to the locking station first; Then transfer the other one of the box body and the cover body to the locking station; While transferring the other one of the box body and the cover body, purge the box body or the cover body at the locking station.

[0009] Combined with the first aspect of the present application, in an alternative embodiment, before locking the cover body and the box body, it further includes: Purge the surfaces of the cover body and the box body with the clean and dry gas, and make the surface temperatures of the cover body and the box body less than a preset temperature range.

[0010] Combined with the first aspect of the present application, in an alternative embodiment, the relative humidity of the clean and dry gas is less than 0.1%, and the temperature is less than 25 degrees.

[0011] Combined with the first aspect of the present application, in an alternative embodiment, when locking the cover body and the box body, it further includes: Purge the inner cavity of the box body with a clean and dry gas for a first preset duration.

[0012] Combined with the first aspect of the present application, in an alternative embodiment, the cleaning method further includes: Before drying, clean the semiconductor workpiece storage device.

[0013] Combined with the first aspect of the present application, in an alternative embodiment, the purge flow rate of the clean and dry gas is 1000 LPM - 3000 LPM; the clean and dry gas includes nitrogen and / or compressed dry air.

[0014] Second aspect, an embodiment of the present application provides a cleaning device for a semiconductor workpiece storage device, the cleaning device comprising: A drying unit for drying the cover and the box body, the semiconductor workpiece storage device comprising a cover and a box body, the cover being detachably connected to the box body; An environmental atmosphere control unit for maintaining environmental atmosphere control over the cover and the box body; A locking mechanism for locking or unlocking the cover and the box body; A blanking unit for blanking the semiconductor workpiece storage device after locking; Wherein, the environmental atmosphere control unit further comprises: A sub-airflow supply component for providing a clean and dry gas with a relative humidity of less than 1%, and for purging the cover and the box body during the locking process with the clean and dry gas.

[0015] The cleaning method for the semiconductor workpiece storage device provided by the embodiment of the present application, after completing the drying treatment of the cover and the box body, maintains environmental atmosphere control over the cover and the box body, so that the environmental atmosphere where the cover and the box body are located after the drying treatment is always a dry environmental atmosphere, which can reduce the occurrence of water vapor in the air adhering to the surfaces of the box body and the cover, and further can greatly reduce the influence of the air containing water vapor on the dryness of the box body and the cover; in addition, it can further effectively ensure the dryness and humidity of the internal space after the box body and the cover in the dry environmental atmosphere are locked.

[0016] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments and descriptions thereof of the present application are used to explain the present application and do not constitute an improper limitation of the present application. In the drawings: Figure 1 is a top view of the internal structure of the cleaning device for the semiconductor workpiece storage device provided by the embodiment of the present application; Figure 2 is a schematic perspective view of the cleaning device for the semiconductor workpiece storage device provided by the embodiment of the present application; Figure 3 is a schematic structural view of the semiconductor workpiece storage device and the locking mechanism in the cleaning device for the semiconductor workpiece storage device provided by the embodiment of the present application; Figure 4 is a schematic overall flow chart of the cleaning method for the semiconductor workpiece storage device provided by the embodiment of the present application.

[0018] Reference numerals: 10, Loading unit; 20, Cleaning unit; 210, Cleaning device; 30, Drying unit; 310, Drying device; 40, Unloading unit; 50, Manipulator; 60, Frame; 70, Locking mechanism; 80, Semiconductor workpiece storage device; 810, Cover; 820, Box; 90, Ambient atmosphere control unit; 910, Fan filter unit. Detailed implementation manners

[0019] In order to make the technical solutions and beneficial effects of the present invention more obvious and understandable, the following will be described in detail by listing specific embodiments. Among them, the drawings are not necessarily drawn to scale, and local features can be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0020] In the description of the present invention, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of simplifying the description of the present invention, rather than indicating that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, that is, it cannot be understood as a limitation to the present invention.

[0021] In the present invention, the terms "first" and "second" are only used for the purpose of clear description, and cannot be understood as the relative importance of the indicated features or the number of the indicated technical features. Therefore, the features defined with "first" and "second" can clearly include at least one such feature. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc.; the meaning of "several" is at least one, such as one, two, three, etc.; unless otherwise specifically defined.

[0022] In the present invention, unless otherwise clearly defined, the terms "installation", "connection", "connection", "fixation", "setting", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can also be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0023] In the present invention, unless otherwise clearly defined, when a first feature is "on", "above", "over", "upward", "under", "beneath", "below", or "downward" of a second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may be in indirect contact through an intermediate medium. Moreover, when the first feature is "above", "over", or "upward" of the second feature, the first feature may be directly above or obliquely above the second feature, or merely indicate that the horizontal height of the first feature is higher than the horizontal height of the second feature. When the first feature is "under", "beneath", or "downward" of the second feature, the first feature may be directly below or obliquely below the second feature, or merely indicate that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0024] A semiconductor workpiece storage device is used to accommodate or place a substrate. Exemplarily, the substrate is a semiconductor workpiece product such as a wafer. The semiconductor workpiece storage device in the embodiment of the present application is a FOSB (Front Opening Shipping Box), and of course, the semiconductor workpiece storage device may also be other storage devices.

[0025] The embodiment of the present application provides a cleaning device for a semiconductor workpiece storage device. Please refer to Figures 1 to 3 , the cleaning device includes a loading unit 10, a cleaning unit 20, a drying unit 30, an unloading unit 40, and a manipulator 50. The cleaning unit 20, the drying unit 30, and the manipulator 50 are located in a closed space formed by a frame 60 of the cleaning device. The loading unit 10 and the unloading unit 40 penetrate the frame 60. The loading unit 10 is used to transfer the semiconductor workpiece storage device 80 to be cleaned from outside the frame 60 to inside the frame 60, and the unloading unit 40 is used to transfer the semiconductor workpiece storage device 80 that has been cleaned from inside the frame 60 to outside the frame 60. The manipulator 50 is used to pick up the semiconductor workpiece storage device 80 and make it operate between the loading unit 10, the cleaning unit 20, the drying unit 30, and the unloading unit 40. The semiconductor workpiece storage device 80 includes a cover body 810 and a box body 820, and the cover body 810 is detachably connected to the box body 820.

[0026] The cleaning unit 20 includes a cleaning device 210. When the cleaning device 210 cleans the semiconductor workpiece storage device 80, the semiconductor workpiece storage device 80 is located in a closed cleaning space of the cleaning device 210. After the cleaning is completed, when the cleaning device 210 is opened and the semiconductor workpiece storage device 80 is taken out from the cleaning space of the cleaning device 210, the humid gas in the cleaning space will also escape, increasing the humidity of the air in the space where the cleaning unit 20 and the drying unit 30 are located together.

[0027] The drying unit 30 includes a drying device 310 which is used to dry the semiconductor workpiece storage device 80 after cleaning. The semiconductor workpiece storage device 80 is located in the enclosed drying space of the drying device 310. After the drying operation is completed, when the drying device 310 is opened, there is a situation that affects the dryness of the semiconductor workpiece storage device 80.

[0028] The cleaning equipment further includes a locking mechanism 70 which is used to lock or unlock the cover 810 and the box body 820 of the semiconductor workpiece storage device 80. The cover 810 and the box body 820 can be locked or unlocked through the knob assembly of the locking mechanism 70. That is to say, the knob assembly can realize the closed connection between the cover 810 and the box body 820, and can also realize the separation between the cover 810 and the box body 820. The locking mechanism 70 can be integrated on the manipulator 50, but of course it is not limited to this.

[0029] The cleaning equipment further includes an environmental atmosphere control unit 90 which is used to maintain environmental atmosphere control for the cover 810 and the box body 820. The environmental atmosphere control unit 90 includes a fan filter unit 910 (FFU, Fan Filter Unit) and a purging unit (not shown in the figure). An exhaust unit is provided at the bottom of the cleaning equipment. Under the action of the exhaust unit, the fan filter unit 910 can supply the generated clean gas from top to bottom of the whole equipment and act on the inside of the whole equipment. That is to say, it can at least act on the cleaning unit 20 and the drying unit 30 in the frame body. The purging unit includes a pipeline assembly communicated with the fan filter unit 910 and a nozzle. The clean and dry gas is purged onto the surfaces of the cover and the box body through the nozzle. Specifically, the nozzle is arranged at the locking station and is used to purge the cover and the box body during the locking process. The nozzle can also be arranged on the path of the cover or the box body transferring from the drying station to the locking station and is used to purge the surface of the cover or the box body during the transfer process of the cover and the box body.

[0030] In an alternative embodiment, the environmental atmosphere control unit further includes a clean and dry gas supply unit which is used to supply clean and dry gas to the purging unit. Specifically, the clean and dry gas is nitrogen and / or compressed dry air. In this embodiment, the relative humidity of the clean and dry gas is less than 1%.

[0031] In the related art, the environmental humidity in a semiconductor manufacturing factory is generally controlled at 45 + / - 3% RH (temperature is 22 + / - 0.5 °C). The environmental atmosphere control unit 90 of a cleaning device usually directly extracts the gas in the semiconductor manufacturing factory environment, filters it, and then sends it into the cleaning device. However, due to factors such as filter materials and filtration costs, the filtration unit of the cleaning device generally only filters particulate matter and lacks an effective means for filtering moisture. Therefore, the humidity inside the cleaning device also remains at about 45 + / - 3% RH.

[0032] In the cleaning requirements of a semiconductor manufacturing factory for a semiconductor workpiece storage device, the humidity inside the semiconductor workpiece storage device after cleaning is generally required to be less than 5% (less than 3% in advanced manufacturing processes). Therefore, if the box body and the cover are directly locked after drying, the humidity of the atmosphere remaining in the box body will remain at about 45% RH, which is far higher than the control requirement of less than 5%. That is, if the water vapor in the atmosphere inside the semiconductor workpiece storage device is not effectively treated, it will cause the humidity inside the semiconductor workpiece storage device to exceed the standard.

[0033] Based on this, the embodiments of the present application utilize a plurality of sub-airflow supply components. The gas supply sources of the plurality of sub-airflow supply components are clean and dry gases after further drying. The high-humidity atmosphere inside the box body is replaced with a gas having a relative humidity value less than the humidity control requirement inside the semiconductor workpiece storage device, so as to ensure that the humidity level of the atmosphere inside the box body is lower than the humidity control requirement inside the semiconductor workpiece storage device before the box body and the cover are closed. Preferably, the relative humidity of the clean and dry gas is less than 1% RH.

[0034] It should be noted that the relative humidity (Relative Humidity, RH) in the embodiments of the present application refers to the ratio of the actual water vapor content in the air to the maximum water vapor content that the air can accommodate at this temperature. The temperature corresponding to the humidity in the embodiments of the present application is 22 + / - 0.5 °C. Specifically, in an alternative embodiment, please refer to Figure 3, the fan filter unit 910 includes a plurality of sub-airflow supply components, and the plurality of sub-airflow supply components can purge the surfaces of the cover 810 and the box body 820 of the dried semiconductor workpiece storage device 80 at different workstations. Of course, the space where the semiconductor workpiece storage device 80 is located can also be dried and cleaned, so that the semiconductor workpiece storage device 80 can continuously be in a dry environmental atmosphere. It should be noted that during the drying process of the semiconductor workpiece storage device 80 in the drying device 310, in order to improve the drying effect, the cover 810 and the box body 820 of the semiconductor workpiece storage device 80 are in a separated state. After the drying operation is completed, it is necessary to open the drying device 310 to lock the cover 810 and the box body 820. Before locking the cover 810 and the box body 820, during the process of opening the drying device 310, water vapor in the air may adhere to the surfaces of the box body 820 and the cover 810, thus affecting the dryness of the cover 810 and the box body 820.

[0035] In addition, the FOSB is not designed with an inflation hole and an exhaust hole. Compared with the FOUP (Front Opening Unified Pod) with an inflation hole and an exhaust hole, the FOSB cannot reduce the humidity inside the FOSB by filling clean and dry gas into the inflation hole to displace the gas with a higher humidity inside.

[0036] Based on this, the embodiment of the present application provides a cleaning method for a semiconductor workpiece storage device. This cleaning method controls the environmental atmosphere for the cover and the box body after the drying process to reduce the adhesion of water vapor in the air to the surfaces of the box body and the cover, and can ensure the humidity of the internal space after the cover and the box body are locked, greatly reducing the influence on the dryness of the box body and the cover.

[0037] Specifically, please refer to Figure 4 , a cleaning method for a semiconductor workpiece storage device provided by the embodiment of the present application includes the following steps: S1. Perform a drying process on the cover and the box body at the drying station. The semiconductor workpiece storage device includes a cover and a box body, and the cover is detachably connected to the box body.

[0038] S2. Control the environmental atmosphere for the cover and the box body.

[0039] S3. Lock the cover and the box body.

[0040] S4. Unload the semiconductor workpiece storage device after the locking is completed.

[0041] In the above cleaning method, after the drying treatment of the cover body and the box body is completed, the environmental atmosphere of the cover body and the box body is controlled. It can be understood that the environmental atmosphere in which the cover body and the box body are located after the drying treatment is always a dry environmental atmosphere, which can reduce the occurrence of water vapor in the air adhering to the surfaces of the box body and the cover body, and further can greatly reduce the influence of the air containing water vapor on the dryness of the box body and the cover body.

[0042] In an alternative embodiment, step S2 includes: Blowing the cover body and the box body with a clean and dry gas.

[0043] It can be understood that after the drying treatment of the cover body and the box body is completed, continuously blowing the cover body and the box body with a clean and dry gas can prevent the air containing water vapor in the same space from moving towards the surfaces of the cover body and the box body, and further can prevent water vapor from adhering to the surfaces of the cover body and the box body, so that the cover body and the box body are kept in a dry environmental atmosphere, thereby reducing the influence of water vapor in the air on the dryness of the cover body and the box body.

[0044] In an alternative embodiment, the relative humidity of the clean and dry gas is less than 0.1%, and the temperature of the clean and dry gas is less than 25°C.

[0045] By blowing the surfaces of the cover body and the box body with a low-humidity and low-temperature gas, the temperature and humidity of their surfaces can be quickly reduced, and at the same time, the temperature and humidity of the environment where the box body and the cover body are located can also be controlled, ensuring the temperature and humidity of the gas remaining in the internal space of the box body when the box body and the cover body are locked. Blowing the box body and the cover body with a clean and dry gas with a relative humidity less than 0.1%RH can further improve the drying effect of the box body and the cover body.

[0046] The clean and dry gas is one or more of nitrogen, compressed dry air, and clean dry air, and the embodiments of the present application do not make specific limitations.

[0047] In an alternative embodiment, the cover body and the box body during the locking process are blown with a clean and dry gas. Blowing the cover body and the box body during the locking process with a clean and dry gas can ensure that before the box body and the cover body are sealed, the water vapor in the atmosphere inside the cleaning device does not adhere to the surfaces of the box body and the cover body again, and further can ensure the drying effect after the box body and the cover body are locked.

[0048] In an alternative embodiment, before step S3, it further includes: Moving the cover body and the box body that have completed the drying treatment to the locking station.

[0049] Blowing the cover body and the box body during the process of moving from the drying station to the locking station, as well as the cover body and the box body located at the locking station, with a clean and dry gas.

[0050] It can be understood that after the drying device finishes drying the cover body and the box body, the drying device is opened, and the cover body and the box body in the drying device are moved to the locking station, so as to lock the cover body and the box body by using the locking mechanism. During the process of moving the cover body and the box body from the drying station to the locking station, and during the process of locking the cover body and the box body at the locking station, the cover body and the box body are continuously purged with clean and dry gas, so that the cover body and the box body are always in a dry environmental atmosphere, thereby greatly reducing the influence of the air containing water vapor on the dryness of the cover body and the box body.

[0051] In an alternative embodiment, moving the cover body and the box body that have completed the drying process to the locking station includes: Transfer one of the box body and the cover body to the locking station first.

[0052] Then transfer the other one of the box body and the cover body to the locking station.

[0053] While transferring the other one of the box body and the cover body, purge the box body or the cover body at the locking station.

[0054] It can be understood that after the cover body and the box body complete the drying process, the box body is first transferred to the locking station, and then the cover body is transferred to the locking station. During the process of transferring the cover body, the box body located at the locking station is purged, and the cover body during the transfer process is also purged. Of course, the cover body can also be transferred to the locking station first, and then the box body is transferred to the locking station. During the process of transferring the box body, the cover body located at the locking station is purged. The embodiments of the present application can greatly reduce the situation where water vapor adheres to the surface of the cover body or the box body waiting at the locking station.

[0055] Implementable, during the drying process of the drying device, the cover body of the semiconductor workpiece storage device is connected to the cover body of the drying device, and the box body of the semiconductor workpiece storage device is located in the closed drying space of the drying device. When the drying operation is completed, the drying device is opened, the cover body of the semiconductor workpiece storage device follows the opening of the cover body of the drying device and is moved to the locking station, and the manipulator moves the box body located in the drying space to the position of the cover body, that is, the locking station. It can be understood that after the cover body of the drying device is opened, the cover body of the semiconductor workpiece storage device is immediately moved to the locking station. The box body moved from the drying space to the locking station is purged with clean and dry gas, and the cover body of the semiconductor workpiece storage device that has been moved to the locking station first is purged.

[0056] In an alternative embodiment, the cover body and the box body that have completed the drying process are locked at the locking station, and the locking station is located at the drying unit.

[0057] It can be implemented that after the drying device finishes drying the cover body and the box body, the drying device is opened, the cover body is connected to the door body of the drying device, and the locking mechanism picks up the box body in the drying device and locks the box body and the cover body.

[0058] In an alternative embodiment, the cover body and the box body that have completed the drying process are locked.

[0059] It can be implemented that after the drying device finishes drying the cover body and the box body, the drying device is opened, the opening of the box body faces upward and is located in the drying chamber of the drying device, and the manipulator carrying the locking mechanism picks up the cover body and locks the cover body and the box body located in the drying chamber.

[0060] In an alternative embodiment, before locking the cover body and the box body, it further includes: Using a clean and dry gas to purge the surfaces of the cover body and the box body, and making the surface temperatures of the cover body and the box body less than a preset temperature range.

[0061] On the one hand, water vapor will liquefy on the surface of the semiconductor workpiece storage device during the cooling process. Using a clean and dry gas to purge the surfaces of the cover body and the box body, and making the surface temperatures of the cover body and the box body less than a preset temperature range can greatly reduce the possibility of water vapor liquefying on the surfaces of the cover body and the box body. On the other hand, when the FOSB is closed, as the internal temperature decreases, the internal pressure of the FOSB decreases, generating a negative pressure inside the FOSB. Compared with the situation where the inside of the FOSB is at a positive pressure, when the inside of the FOSB is in a negative pressure environment, external contaminants are more likely to enter the inside under the action of atmospheric pressure, affecting the cleanliness inside the FOSB.

[0062] In an alternative embodiment, the preset temperature range is less than 45 degrees.

[0063] In an alternative embodiment, step S4 further includes: Using a clean and dry gas to purge the inner cavity of the box body for a first preset duration.

[0064] Using a clean and dry gas to purge the inner cavity of the box body before locking for a first preset duration can further ensure the drying effect of the internal space of the semiconductor workpiece storage device before locking. The first preset duration is 30s, 50s, 1min, 2min, 3min, etc., and the embodiments of the present application do not make specific limitations and can be set according to requirements.

[0065] In an alternative embodiment, before step S1, it further includes: Before drying the semiconductor workpiece storage device, cleaning the semiconductor workpiece storage device. Cleaning the semiconductor workpiece storage device can remove internal contaminants such as particles, metals, and AMC to improve the cleaning effect of the semiconductor workpiece storage device.

[0066] In an alternative embodiment, the purge flow rate of the clean and dry gas is from 1000 LPM to 3000 LPM. The purge within this flow rate range can keep the cover and the cassette of the semiconductor workpiece storage device in a dry ambient atmosphere, effectively isolating them from the water vapor-containing air, and greatly reducing the occurrence of water vapor in the air adhering to the surfaces of the cover and the cassette.

[0067] It should be understood that the above embodiments are all exemplary and do not cover all possible implementation manners. Without departing from the scope of the present disclosure, various deformations and changes can also be made based on the above embodiments. Similarly, any combination of the technical features of the above embodiments can be made to form additional embodiments of the present application that may not be explicitly described. Therefore, the above embodiments only represent several implementation manners of the present application and do not limit the protection scope of the patent of the present application.

Claims

1. A method for cleaning a semiconductor workpiece storage device, characterized in that: The cleaning method comprises: Drying the cover body and the box body at a drying station, wherein the semiconductor workpiece storage device comprises a cover body and a box body, and the cover body is detachably connected to the box body; Maintaining environmental atmosphere control on the cover and the box body; Locking the cover body and the box body; unloading the semiconductor workpiece storage device after the locking is completed; Wherein, maintaining the environmental atmosphere of the cover body and the box body includes: The cover body and the box body are purged during the locking process using clean dry gas; the relative humidity of the clean dry gas is less than 1%.

2. The cleaning method of the semiconductor workpiece storage device according to claim 1, characterized in that: Before locking the cover body and the box body, the method includes: Move the cover body and the box body after drying to a locking station; The cover body and the box body in the process of being moved from the drying station to the locking station, and the cover body and the box body located at the locking station are purged by using clean dry gas.

3. The cleaning method of the semiconductor workpiece storage device according to claim 2, characterized in that: The cover body and the box body which have been dried are moved to a locking station, comprising: Transferring one of the box body and the cover body to the locking station first; Then, transferring the other of the box body and the cover body to the locking station; While the other of the box body and the cover body is being transferred, the box body or the cover body in the locking station is purged.

4. The cleaning method of the semiconductor workpiece storage device according to claim 1, characterized in that: Before locking the cover body and the box body, the method further includes: The clean dry gas is used to purge the surface of the cover and the box body, and the surface temperature of the cover and the box body is made to be less than a preset temperature range.

5. The cleaning method of the semiconductor workpiece storage device according to claim 4, characterized in that: The relative humidity of the clean dry gas is less than 0.1%, and the temperature is less than 25°C.

6. The cleaning method of the semiconductor workpiece storage device according to claim 1, characterized in that: The cover body and the box body are locked together, further comprising: The inner cavity of the box body is purged with clean dry gas for a first preset time period.

7. The cleaning method of the semiconductor workpiece storage device according to claim 1, characterized in that: The cleaning method further comprises: Before drying, the semiconductor workpiece storage device is cleaned.

8. The cleaning method of the semiconductor workpiece storage device according to claim 1, characterized in that: The purge flow rate of the clean dry gas is 1000LPM-3000LPM; the clean dry gas includes nitrogen and / or compressed dry air.

9. A cleaning device for a semiconductor workpiece storage device, characterized in that: The cleaning equipment comprises: A drying unit, used for drying the cover body and the box body, wherein the semiconductor workpiece storage device comprises a cover body and a box body, and the cover body is detachably connected to the box body; An environmental atmosphere control unit, used to maintain environmental atmosphere control on the cover and the box body; A locking mechanism, used to lock or unlock the cover and the box body; A material unloading unit unloads the semiconductor workpiece storage device after locking; Wherein, the environmental atmosphere control unit also includes: The sub-airflow supply component is used to provide clean dry gas with a relative humidity of less than 1%, and is used to use the clean dry gas to purge the cover body and the box body during the locking process.

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