Tin liquid type rapid welding system for diode

Abstract

The invention discloses a tin liquid type rapid welding system for diodes, and relates to the field of diode welding, the tin liquid type rapid welding system comprises a welding workbench, a tool notch is formed in the top surface of the welding workbench, one end of the tool notch penetrates through the side wall of the welding workbench, and a turnover clamping mechanism is arranged in the tool notch; the overturning clamping mechanism is used for clamping a circuit board carrying a diode, a tin liquid type welding device is arranged above the welding workbench and comprises a lifting box and a tin liquid dropper, the lifting box has the freedom degree of moving in the height direction of the welding workbench, a tin liquid cavity is formed in the lifting box, and the tin liquid dropper is arranged in the tin liquid cavity. An electric heating piece is installed on the outer side wall of the lifting box, a piston plate is arranged in the tin liquid cavity in a sliding fit mode, a plurality of tin liquid droppers are connected to the bottom of the lifting box, the tin liquid droppers correspond to diode welding point positions on the circuit board in a one-to-one mode, the tin liquid droppers are communicated with the tin liquid cavity, and welding operation of all diodes can be completed in a narrow space. And the welding efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of diode soldering, and specifically to a molten tin type rapid soldering system for diodes. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature, and are widely used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields, such as diodes. A diode is also called a crystal diode, simply referred to as a diode (diode). In addition, there are early vacuum electronic diodes; it is an electronic device with unidirectional conduction current. Inside a semiconductor diode, there is a PN junction and two lead terminals. This electronic device has the transduction of unidirectional current according to the direction of the applied voltage. The diode is one of the most commonly used electronic components. Its greatest characteristic is unidirectional conduction, that is, current can only flow through the diode in one direction. The functions of the diode include rectifier circuits, detection circuits, voltage stabilization circuits, and various modulation circuits. Therefore, multiple diodes are soldered on the circuit board at the same time. When soldering, multiple diodes need to be soldered one by one, resulting in low soldering efficiency and affecting production efficiency. Secondly, since the positive and negative pins of the diode need to be soldered to the holes on the circuit board, the distance between the positive and negative pins of the diode is small, resulting in a small movement space for the soldering gun, and it is easy to collide with the pins to be soldered during soldering, causing the pins to bend and affecting the soldering quality. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a molten tin type rapid soldering system for diodes to solve the deficiencies of the prior art.

[0004] The purpose of the present invention is achieved through the following technical solutions: A molten tin type rapid soldering system for diodes includes a soldering workbench. A tooling slot is opened on the top surface of the soldering workbench. One end of the tooling slot penetrates through the side wall of the soldering workbench. A flipping clamping mechanism is arranged in the tooling slot. The flipping clamping mechanism is used to clamp the circuit board carrying the diode. Above the soldering workbench, there is a molten tin type soldering device. The molten tin type soldering device includes a lifting box and a molten tin dropper. The lifting box has the freedom to move in the height direction of the soldering workbench. A molten tin cavity is arranged inside the lifting box. An electric heating sheet is installed on the outer side wall of the lifting box. A piston plate is slidably fitted in the molten tin cavity. The bottom of the lifting box is connected with a plurality of the molten tin droppers. The plurality of molten tin droppers correspond one by one to the diode soldering points on the circuit board. The molten tin droppers communicate with the molten tin cavity. The molten tin droppers are sleeved on the pins of the diode and contact the circuit board. Under the pressure of the piston plate, the molten tin is dripped from the molten tin droppers into the diode soldering points.

[0005] Further, the tin liquid dropper includes a connecting pipe, a one-way pipe, and a liquid dropping pipe. The two ends of the one-way pipe are coaxially connected to the liquid dropping pipe and the connecting pipe respectively. The end of the connecting pipe away from the one-way pipe communicates with the tin liquid chamber. The inner hole diameter of the connecting pipe and the inner diameter of the liquid dropping pipe are both smaller than the inner hole diameter of the one-way pipe. A steel ball spring is arranged inside the one-way pipe. One end of the steel ball spring is connected to the step formed by the one-way pipe and the liquid dropping pipe, and the other end is connected with a steel ball. Under the action of the steel ball spring, the steel ball blocks the inner hole of the connecting pipe.

[0006] Further, a vibration liquid dropping mechanism is arranged on the lifting box. The vibration liquid dropping mechanism includes a vibration plate. The vibration plate has a degree of freedom to move in the horizontal direction. A through hole is formed in the vibration plate at a position corresponding to the tin liquid dropper. The tin liquid dropper passes through the through hole, and a rubber block is fixed on the inner wall of the through hole.

[0007] Further, a vibration sliding groove is formed at the bottom of the lifting box. A guide rod is fixed in the vibration sliding groove. A guide slider is slidably penetrated on the guide rod. A spring is sleeved on the guide rod. The two ends of the spring are respectively connected to the guide slider and the lifting box. A motor seat is arranged on the side wall of the lifting box. A motor is installed on the motor seat. The output shaft of the motor is connected with a cam. A wedge surface is arranged on the top surface of the vibration plate near one end of the cam. The wedge surface is located on the rotation path of the cam.

[0008] Further, the tin liquid type welding device further includes a welding frame. A first cylinder is vertically installed on the welding frame. The telescopic shaft of the first cylinder is connected to a lifting cross beam. The lifting box is fixedly installed on the lifting cross beam. A second cylinder is vertically installed on the lifting cross beam. The telescopic shaft of the second cylinder is connected with a pressing rod. The pressing rod movably penetrates into the tin liquid chamber and is connected to the piston plate.

[0009] Further, a tin replenishing box is installed on the lifting cross beam. A plurality of tin bars are stacked along the length direction of the tin replenishing box. A blanking port is formed at the bottom of the tin replenishing box. The tin replenishing box is connected with a blanking pipeline at the blanking port. The end of the blanking pipeline away from the tin replenishing box communicates with the tin liquid chamber. A pushing cylinder is installed at one end of the tin replenishing box away from the blanking port. The telescopic shaft of the pushing cylinder movably penetrates into the tin replenishing box and is connected to a pushing plate.

[0010] Further, the flipping and clamping mechanism includes a flipping arm and a moving flipping arm which are oppositely arranged. The flipping arm is rotationally connected to the welding workbench through a first shaft. A second shaft is fixed at one end of the moving flipping arm away from the flipping arm. The second shaft movably penetrates through the welding workbench. Tooling grooves are formed on one side of the flipping arm close to the moving flipping arm and one side of the moving flipping arm close to the flipping arm. One end of the tooling groove is provided with an opening. A tooling pressing plate is arranged in the tooling groove. Pressing driving mechanisms are arranged at both ends of the top of the tooling pressing plate. The pressing driving mechanism includes a pressing shaft, a pressing spring and an electromagnet. A driving groove is formed on the inner top wall of the tooling groove corresponding to the position of the pressing driving mechanism. The electromagnet is installed in the driving groove. One end of the pressing shaft is slidably adapted to the driving groove and is connected with a permanent magnet, and the other end is connected with the tooling pressing plate. A pressing spring is arranged between the permanent magnet and the electromagnet, and the pressing spring is connected with the pressing shaft.

[0011] Further, one end of the second shaft away from the moving flipping arm penetrates through the welding workbench and is connected to the output shaft of a driving motor. The housing of the driving motor is installed on a driving base. The driving base is connected to the telescopic shaft of a driving cylinder. The cylinder body of the driving cylinder is installed on the welding workbench.

[0012] Further, the flipping and clamping mechanism further includes a receiving plate and a mounting plate. Receiving electromagnets are embedded on the top surfaces of the flipping arm and the moving flipping arm. A plurality of magnets are embedded on one surface of the mounting plate. The plurality of magnets correspond to the plurality of receiving electromagnets one by one. The end face of the mounting plate provided with the magnets is connected to the receiving plate through a receiving spring. The mounting plate is magnetically adsorbed on the flipping arm and the moving flipping arm, so that the receiving plate contacts the tube body end of the diode under the action of the receiving spring.

[0013] Further, a pushing plate is arranged on the inner bottom wall of the tooling groove opening. The pushing plate is connected to the telescopic shaft of a pushing plate cylinder. The cylinder body of the pushing plate cylinder is installed on the welding workbench. The pushing plate is used for pushing the mounting plate out from the opening end of the tooling groove opening.

[0014] The beneficial effects of the present invention are as follows: 1. Abandon the traditional welding method of a welding torch, melt the welding rod into tin liquid in the tin liquid cavity of the lifting box, and drip the tin liquid through the tin liquid dropper sleeve on the pin to weld the pin of the diode on the hole position of the circuit board. The welding operation of the diode can be completed in a narrow space, which will not affect the adjacent pins, improving the welding quality. At the same time, corresponding tin liquid droppers can be set according to the welding hole positions of the diodes, so that the welding operations of multiple diodes can be completed simultaneously, improving the welding efficiency.

[0015] 2. After the tin liquid is dropped into the welding hole position, the reciprocating motion of the vibration plate causes the tin liquid dropper to vibrate, so that the tin liquid adhering to the inner wall of the dropper falls, ensuring that the welding amount meets the requirements, avoiding the situation of insufficient welding, and at the same time avoiding the situation of tin liquid dripping when the tin liquid type welding device is reset. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of a tin liquid type rapid welding system for a diode of the present invention Figure 1 ; Figure 2 is a schematic diagram of the internal structure of the lifting box in a tin liquid type rapid welding system for a diode of the present invention; Figure 3 is Figure 2 an enlarged view at B in Figure 4 is a schematic structural diagram of a tin liquid type rapid welding system for a diode of the present invention Figure 2 ; Figure 5 is Figure 4 an enlarged view at A in Figure 6 is a schematic diagram of the cooperation between the lifting box and the vibration plate in a tin liquid type rapid welding system for a diode of the present invention; Figure 7 is a schematic structural diagram of a tin liquid type rapid welding system for a diode of the present invention Figure 3 ; Figure 8 is a schematic structural diagram of the flipping and clamping mechanism in a tin liquid type rapid welding system for a diode of the present invention; Figure 9 is Figure 8 an enlarged view at C in Figure 10 is a schematic structural diagram of a tin liquid type rapid welding system for a diode of the present invention Figure 4 ; Figure 11 is a schematic diagram of the internal structure of the tin replenishing box in a tin liquid type rapid welding system for a diode of the present invention; In the figure, 1 - welding workbench, 2 - tooling notch, 3 - lifting box, 4 - tin liquid dropper, 5 - tin liquid chamber, 6 - electric heating sheet, 7 - piston plate, 8 - connecting pipe, 9 - one-way pipe, 10 - dropping pipe, 11 - steel ball spring, 12 - steel ball, 13 - vibrating plate, 14 - through hole, 15 - rubber block, 16 - vibrating chute, 17 - guide rod, 18 - guide slider, 19 - spring, 20 - motor base, 21 - motor, 22 - cam, 23 - wedge surface, 24 - welding rack, 25 - first cylinder, 26 - lifting crossbeam, 27 - second cylinder, 28 - pressing rod, 29 - tin replenishing box, 30 - blanking port, 31 - blanking pipeline, 32 - pushing cylinder, 33 - pushing plate, 34 - flipping arm, 35 - moving flipping arm, 36 - first shaft, 37 - second shaft, 38 - tooling slot, 39 - tooling pressing plate, 40 - pressing shaft, 41 - pressing spring, 42 - electromagnet, 43 - permanent magnet, 44 - driving motor, 45 - driving base, 46 - driving cylinder, 47 - receiving plate, 48 - mounting plate, 49 - receiving electromagnet, 50 - receiving spring, 51 - pushing plate, 52 - pushing plate cylinder. Detailed implementation mode

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0018] Embodiment 1: As Figures 1 to 11As shown in the figure, a tin liquid type rapid welding system for a diode includes a welding workbench 1. A tooling notch 2 is opened on the top surface of the welding workbench 1. One end of the tooling notch 2 penetrates through the side wall of the welding workbench 1. A flipping clamping mechanism is arranged in the tooling notch 2. The flipping clamping mechanism is used to clamp the circuit board carrying the diode. Above the welding workbench 1, a tin liquid type welding device is arranged. The tin liquid type welding device includes a lifting box 3 and tin liquid droppers 4. The lifting box 3 has the freedom to move along the height direction of the welding workbench 1. A tin liquid cavity 5 is arranged inside the lifting box 3. An electric heating sheet 6 is installed on the outer side wall of the lifting box 3. A piston plate 7 is slidably fitted in the tin liquid cavity 5. A plurality of tin liquid droppers 4 are connected to the bottom of the lifting box 3. The plurality of tin liquid droppers 4 correspond one by one to the diode welding points on the circuit board. The tin liquid droppers 4 communicate with the tin liquid cavity 5. The tin liquid droppers 4 are sleeved on the pins of the diode and contact the circuit board. Under the pressure of the piston plate 7, the tin liquid is dripped from the tin liquid droppers 4 into the welding points of the diode. The circuit board carrying the diode is tooled on the welding workbench 1 through the flipping clamping mechanism, making the pins of the diode face upward and exposed, facilitating the welding operation of the tin liquid type welding device on the pins of the diode. The positions of the tin liquid droppers 4 are set according to the welding holes of the circuit board diodes, so that the plurality of tin liquid droppers 4 correspond one by one to the welding holes of the diodes. Tin bars or tin wires are added into the tin liquid cavity 5 of the lifting box 3, and the tin bars or tin wires are melted into tin liquid by the electric heating sheet 6. During welding, the lifting box 3 moves downward, making the tin liquid droppers 4 contact the circuit board corresponding to the welding holes, and the pins of the diode are located inside the tin liquid droppers 4. Then the piston plate 7 moves downward, making the tin liquid drip out from the tin liquid droppers 4. Under the action of the tin liquid droppers 4, the dripping liquid can smoothly fall on the welding holes, realizing the automatic welding of the diode. Since the pins penetrate into the tin liquid droppers 4, the dripping tin liquid can wrap the pins for welding. It is not necessary for the tin liquid droppers 4 to move around the welding holes for one week for welding, and the occupied space of the tin liquid droppers 4 is small, enabling the welding operation of the diode to be completed in a narrow space, not affecting the adjacent pins, improving the welding quality. At the same time, corresponding tin liquid droppers can be set according to the welding holes of the diodes, so that the welding operations of multiple diodes can be completed simultaneously, improving the welding efficiency; since the tin liquid droppers 4 contact the circuit board, they can also block the outflow of the tin liquid, making the tin liquid accurately reach the position of the welding holes, effectively avoiding the problem of short circuit between the two pins of the diode and improving the welding quality; it should be noted that since the tin liquid is easy to solidify, in order to avoid the problem of solidification when the tin liquid drips in the tin liquid droppers 4, electrode wires are set so that the electrode wires are connected to the outer wall of the tin liquid droppers 4, and the tin liquid droppers 4 are heated through the electrode wires to ensure that the tin liquid will not solidify in the tin liquid droppers 4 and can smoothly fall on the welding holes of the diode.

[0019] Further, the tin - liquid soldering device further includes a soldering frame 24. A first cylinder 25 is vertically installed on the soldering frame 24. The telescopic shaft of the first cylinder 25 is connected to a lifting cross - beam 26. The lifting box 3 is fixedly installed on the lifting cross - beam 26. A second cylinder 27 is vertically installed on the lifting cross - beam 26. The telescopic shaft of the second cylinder 27 is connected to a pressing rod 28. The pressing rod 28 movably penetrates into the tin - liquid cavity 5 and is connected to a piston plate 7. By the telescopic movement of the first cylinder 25, the lifting cross - beam 26 moves up and down, causing the lifting box 3 to drive the tin - liquid dropper 4 to move up and down. When the lifting box 3 moves downward, it solders the diode. The second cylinder 27 drives the piston plate 7 to move through the pressing rod 28, and presses the tin liquid out of the tin - liquid cavity 5 to complete the soldering operation.

[0020] Embodiment Two: Based on Embodiment One, as Figure 1 and Figure 11 shown, a tin - replenishing box 29 is installed on the lifting cross - beam 26. A number of tin bars are stacked along the length direction of the tin - replenishing box 29. A blanking port 30 is opened at the bottom of the tin - replenishing box 29. The tin - replenishing box 29 is connected to a blanking pipeline 31 at the blanking port 30. One end of the blanking pipeline 31 away from the tin - replenishing box 29 communicates with the tin - liquid cavity 5. A pushing cylinder 32 is installed at one end of the tin - replenishing box 29 away from the blanking port 30. The telescopic shaft of the pushing cylinder 32 movably penetrates into the tin - replenishing box 29 and is connected to a pushing plate 33. By judging the height of the tin liquid in the tin - liquid cavity 5 according to the telescopic length of the second cylinder 27, when the height of the tin liquid is lower than the set value, the pushing cylinder 32 drives the pushing plate 33 to move close to the tin bar, and pushes the tin bar into the tin - liquid cavity 5 through the pushing plate 33 to complete the automatic tin - replenishing operation. Each time, one tin bar is added. After all the tin bars in the tin - replenishing box 29 are added, an operator stacks tin bars into the tin - replenishing box 29, so as to ensure that the tin liquid in the tin - liquid cavity 5 will not be interrupted.

[0021] Embodiment Three: Based on Embodiment Two, as Figures 1 to 10As shown, the flipping and clamping mechanism includes a flipping arm 34 and a movable flipping arm 35 which are arranged oppositely. The flipping arm 34 is rotationally connected to the welding workbench 1 through a first shaft 36. A second shaft 37 is fixed at one end of the movable flipping arm 35 away from the flipping arm 34. The second shaft 37 is movably inserted through the welding workbench 1. Tooling grooves 38 are formed on one side of the flipping arm 34 close to the movable flipping arm 35 and on one side of the movable flipping arm 35 close to the flipping arm 34. One end of the tooling groove 38 is provided with an opening. A tooling pressing plate 39 is arranged in the tooling groove 38. Pressing drive mechanisms are arranged at both ends of the top of the tooling pressing plate 39. The pressing drive mechanism includes a pressing shaft 40, a pressing spring 41 and an electromagnet 42. Drive grooves are formed on the inner top wall of the tooling groove 38 corresponding to the positions of the pressing drive mechanisms. The electromagnet 42 is installed in the drive groove. One end of the pressing shaft 40 is slidably fitted in the drive groove and is connected with a permanent magnet 43. The other end is connected with the tooling pressing plate 39. A pressing spring 41 is arranged between the permanent magnet 43 and the electromagnet 42. The pressing spring 41 is connected with the pressing shaft 40. Since the flipping arm 34 only has a rotational degree of freedom, taking the closed end of the tooling groove 38 of the flipping arm 34 as the coordinate origin, first, the circuit board carrying the diodes is loaded between the flipping arm 34 and the movable flipping arm 35, so that both ends of the circuit board are respectively located in the two tooling grooves 38. Then, the movable flipping arm 35 moves close to the flipping arm 34, so as to adjust the position of the circuit board, make both ends of the circuit board respectively contact the side walls of the two tooling grooves 38, and complete the positioning in the length direction of the circuit board. Then, the circuit board is pushed to make one side of the circuit board contact the sealed end of the tooling groove 38, and complete the positioning in the width direction of the circuit board, thereby positioning the circuit board tooling on the flipping and clamping mechanism and also facilitating the positioning of the tin liquid dropper 4. After the position of the circuit board is positioned, the coordinates of the welding holes on it are determined. Then, the position of the tin liquid dropper 4 is set according to the welding hole coordinates, so that a plurality of tin liquid droppers 4 correspond to a plurality of welding holes one by one, and the batch production of the same circuit board is completed. When the circuit board is positioned, the circuit board is fixed by the pressing drive mechanism. The electromagnet 42 is energized to generate a magnetic pole with the same magnetism as the permanent magnet 43, so that the electromagnet 42 repels the permanent magnet 43 when energized, the pressing shaft 40 stretches the pressing spring 41 to drive the tooling pressing plate 39 to move close to the circuit board, so that the tooling pressing plate 39 contacts the circuit board to complete the fixing operation. Then, the flipping arm 34 and the movable flipping arm 35 drive the circuit board to rotate 180° at the same time, so that the pins of the diodes face upward and are in a state to be welded. Then, all the diodes are welded by the tin liquid type welding device. Finally, the welded circuit board is taken off, and the above operations are repeated to weld the diodes on the next circuit board.

[0022] Further, one end of the second shaft 37 away from the moving and flipping arm 35 passes through the welding workbench 1 and is connected to the output shaft of the driving motor 44. The housing of the driving motor 44 is installed on the driving base 45. The driving base 45 is connected to the telescopic shaft of the driving cylinder 46. The cylinder block of the driving cylinder 46 is installed on the welding workbench 1. The first shaft 36 is also driven by a motor. First, the driving cylinder 46 drives the moving and flipping arm 35 to move close to the flipping arm 34 to complete the tooling positioning of the circuit board. Then, the driving motor 44 drives the moving and flipping arm 35 to rotate 180° through the second shaft 37, so that the pins of the diode are in a state to be welded. After welding is completed, the flipping arm 34 and the moving and flipping arm 35 rotate back to carry out the tooling for the next circuit board.

[0023] Embodiment 4: Based on Embodiment 3, as Figures 1 to 9 shown, the flipping and clamping mechanism further includes a receiving plate 47 and a mounting plate 48. Receiving electromagnets 49 are embedded in the top surfaces of both the flipping arm 34 and the moving and flipping arm 35. A plurality of magnets are embedded in one surface of the mounting plate 48. The plurality of magnets correspond to the plurality of receiving electromagnets 49 one by one. The end surface of the mounting plate 48 provided with the magnets is connected to the receiving plate 47 through a receiving spring 50. The mounting plate 48 is magnetically adsorbed on the flipping arm 34 and the moving and flipping arm 35, so that the receiving plate 47 contacts the body end of the diode under the action of the receiving spring 50. A push plate 51 is provided on the inner bottom wall of the tooling notch 2. The push plate 51 is connected to the telescopic shaft of a push plate cylinder 52. The cylinder block of the push plate cylinder 52 is installed on the welding workbench 1. The push plate 51 is used to push the mounting plate 48 out from the open end of the tooling notch 2. Since the pins of the diode pass through the welding holes and are pre-arranged on the circuit board, during the flipping process of the circuit board, the diode may fall off. Therefore, after the circuit board positioning tooling is completed, the receiving plate 47 is installed first, and then the circuit board is flipped 180°. The mounting plate 48 is brought into contact with the flipping arm 34 and the moving and flipping arm 35. At this time, the receiving plate 47 will contact the body end of the diode and compress the receiving spring 50. Then, the receiving electromagnet 49 is energized to magnetically adsorb the magnet, thereby fixing the mounting plate 48 on the flipping arm 34 and the moving and flipping arm 35. At this time, the receiving plate 47 contacts the body end of the diode under the action of the receiving spring 50, thereby limiting the diode and ensuring that the diode will not fall off during the flipping process of the circuit board. When the welding is completed, the diode is welded on the circuit board and will not fall off at this time. Then, the receiving electromagnet 49 is powered off, and the mounting plate 48 falls to the bottom of the tooling notch 2 under its own weight. Then, the push plate cylinder 52 drives the push plate 51 to push the mounting plate 48 out of the tooling notch 2. At the same time, the flipping arm 34 and the moving and flipping arm 35 rotate back to unload the welded circuit board and tool the next circuit board.

[0024] Embodiment 5: Based on Embodiment 4, as Figures 1 to 5As shown, the tin liquid dropper 4 includes a connecting pipe 8, a one-way pipe 9, and a dropping pipe 10. The two ends of the one-way pipe 9 are coaxially connected to the dropping pipe 10 and the connecting pipe 8 respectively. The end of the connecting pipe 8 away from the one-way pipe 9 communicates with the tin liquid cavity 5. The inner hole diameter of the connecting pipe 8 and the inner diameter of the dropping pipe 10 are both smaller than the inner hole diameter of the one-way pipe 9. A steel ball spring 11 is arranged in the one-way pipe 9. One end of the steel ball spring 11 is connected to the step formed by the one-way pipe 9 and the dropping pipe 10, and the other end is connected with a steel ball 12. Under the action of the steel ball spring 11, the steel ball 12 blocks the inner hole of the connecting pipe 8, making the tin liquid dropper 4 only conduct in one direction, that is, the tin liquid can only enter the tin liquid dropper 4 from the tin liquid cavity 5. When the piston plate 7 moves downward to squeeze the tin liquid, under the action of pressure, the steel ball 12 squeezes the steel ball spring 11 to compress, so that the inner hole of the connecting pipe 8 communicates with the inner hole of the one-way pipe 9, so that the tin liquid in the tin liquid cavity 5 can smoothly pass through the tin liquid dropper 4 and drop on the welding hole position of the circuit board. After the piston plate 7 stops moving, the steel ball 12 resets under the reaction force of the steel ball spring 11, thus blocking the inner hole of the connecting pipe 8 and preventing the tin liquid in the tin liquid cavity 5 from flowing out, realizing a stable tin liquid type welding operation; It should be noted that the melting temperature of the solder is generally between 183°C and 227°C. The temperature in the tin liquid cavity 5 needs to be above the solder melting temperature to ensure that the solder is always in a liquid state. The steel ball spring 11 is made of a high-temperature alloy material, and the temperature resistance range is between 300°C and 950°C, so that the steel ball spring 11 can be used in a high-temperature environment. Secondly, due to the action of the electrode wire on the tin liquid dropper 4, the temperature in the one-way pipe 9 is higher than the tin liquid melting temperature, which can ensure that the solder in the one-way pipe 9 is in a liquid state and will not affect the compression and reset of the steel ball spring 11.

[0025] Embodiment Six: On the basis of Embodiment Five, as Figures 1 to 7As shown in the figure, a vibration dripping mechanism is provided on the lifting box 3. The vibration dripping mechanism includes a vibration plate 13. The vibration plate 13 has a degree of freedom to move in the horizontal direction. A through hole 14 is provided in the vibration plate 13 at a position corresponding to the tin liquid dropper 4. The tin liquid dropper 4 passes through the through hole 14. A rubber block 15 is fixed on the inner wall of the through hole 14. A vibration sliding groove 16 is provided at the bottom of the lifting box 3. A guide rod 17 is fixed in the vibration sliding groove 16. A guide slider 18 is slidably penetrated on the guide rod 17. A spring 19 is sleeved on the guide rod 17. The two ends of the spring 19 are respectively connected to the guide slider 18 and the lifting box 3. A motor base 20 is provided on the side wall of the lifting box 3. A motor 21 is installed on the motor base 20. The output shaft of the motor 21 is connected to a cam 22. A wedge surface 23 is provided on the top surface of the vibration plate 13 near one end of the cam 22. The wedge surface 23 is located on the rotation path of the cam 22. When the tin liquid dropper 4 contacts the circuit board, the vibration dripping mechanism acts to vibrate the tin liquid dropper 4, so that the tin liquid in the tin liquid dropper 4 can be maximally pressed against the welding position, avoiding the situation of insufficient soldering. At the same time, when the lifting box 3 resets, the tin liquid remaining in the tin liquid dropper 4 will not drip on the non-welding position of the circuit board. The specific vibration principle is as follows: The motor 21 drives the cam 22 to rotate, so that the eccentric end of the cam 22 presses the wedge surface 23 of the vibration plate 13. Under the action of the wedge surface 23, the vibration plate 13 presses the spring 19 to drive the rubber block 15 to move closer to the tin liquid dropper 4, so that the rubber block 15 impacts the tin liquid dropper 4. When the eccentric end of the cam 22 moves away from the wedge surface 23, the vibration plate 13 moves away from the tin liquid dropper 4 under the reaction force of the spring 19. Repeating this process, under the rotation of the cam 22, the rubber block 15 rapidly impacts the tin liquid dropper 4 multiple times, causing the tin liquid dropper 4 to vibrate, so that the tin liquid remaining in the tin liquid dropper 4 drips down.

Claims

1. A tin liquid type rapid welding system for diodes, characterized in that: The invention comprises a welding workbench (1), wherein a tooling slot (2) is provided on the top surface of the welding workbench (1), one end of the tooling slot (2) passes through the side wall of the welding workbench (1), a flip clamping mechanism is arranged in the tooling slot (2), and the flip clamping mechanism is used to clamp a circuit board carrying a diode, and a tin liquid welding device is arranged above the welding workbench (1), and the tin liquid welding device comprises a lifting box (3) and a tin liquid dropper (4), and the lifting box (3) has the freedom to move along the height direction of the welding workbench (1), and the lifting box (4) is provided with a plurality of lifting boxes (3) and a plurality of lifting boxes (4). 3) is provided with a tin liquid cavity (5), an outer wall of the lifting box (3) is installed with an electric heating plate (6), a piston plate (7) is slidably adapted in the tin liquid cavity (5), a plurality of tin liquid droppers (4) are connected to the bottom of the lifting box (3), the plurality of tin liquid droppers (4) correspond to the diode welding points on the circuit board one by one, the tin liquid droppers (4) are connected to the tin liquid cavity (5), the tin liquid droppers (4) are sleeved on the pins of the diode and contact the circuit board, and the tin liquid is dripped from the tin liquid droppers (4) into the welding points of the diode under the pressure of the piston plate (7).

2. The tin liquid type rapid welding system of a diode according to claim 1, characterized in that: The tin liquid dropper (4) comprises a connecting tube (8), a one-way tube (9) and a dropper (10), the two ends of the one-way tube (9) are coaxially connected to the dropper (10) and the connecting tube (8), respectively; one end of the connecting tube (8) away from the one-way tube (9) is connected to the tin liquid cavity (5); the inner diameter of the connecting tube (8) and the inner diameter of the dropper (10) are both smaller than the inner diameter of the one-way tube (9); a steel ball spring (11) is arranged inside the one-way tube (9); one end of the steel ball spring (11) is connected to a step formed by the one-way tube (9) and the dropper (10), and the other end is connected to a steel ball (12); under the action of the steel ball spring (11), the steel ball (12) blocks the inner hole of the connecting tube (8).

3. The tin liquid type rapid welding system of a diode according to claim 1, characterized in that: The lifting box (3) is provided with a vibrating dripping mechanism, the vibrating dripping mechanism comprising a vibrating plate (13), the vibrating plate (13) having the freedom to move in a horizontal direction, the vibrating plate (13) having a through hole (14) at a position corresponding to the tin liquid dripping tube (4), the tin liquid dripping tube (4) passing through the through hole (14), and a rubber block (15) being fixed to the inner wall of the through hole (14).

4. The tin liquid type rapid soldering system for diodes according to claim 3, characterized in that: A vibration chute (16) is provided at the bottom of the lifting box (3), a guide rod (17) is fixed in the vibration chute (16), a guide slider (18) is slidably penetrated on the guide rod (17), a spring (19) is sleeved on the guide rod (17), two ends of the spring (19) are respectively connected to the guide slider (18) and the lifting box (3), a motor seat (20) is provided on the side wall of the lifting box (3), a motor (21) is installed on the motor seat (20), an output shaft of the motor (21) is connected to a cam (22), and a wedge surface (23) is provided on the top surface of the vibration plate (13) close to one end of the cam (22), and the wedge surface (23) is located on the rotation path of the cam (22).

5. The tin liquid type rapid welding system of a diode according to claim 1, characterized in that: The tin liquid welding device also includes a welding frame (24), a first cylinder (25) is vertically mounted on the welding frame (24), a telescopic shaft of the first cylinder (25) is connected to a lifting beam (26), the lifting box (3) is fixedly mounted on the lifting beam (26), a second cylinder (27) is vertically mounted on the lifting beam (26), the telescopic shaft of the second cylinder (27) is connected to a pressing rod (28), and the pressing rod (28) is movably inserted into the tin liquid chamber (5) and connected to the piston plate (7).

6. The tin liquid type rapid soldering system for diodes according to claim 5, characterized in that: A tin filling box (29) is installed on the lifting beam (26), and a plurality of tin bars are stacked in the tin filling box (29) along its length direction. A discharge port (30) is provided at the bottom of the tin filling box (29), and a discharge pipe (31) is connected to the discharge port (30) of the tin filling box (29). The end of the discharge pipe (31) away from the tin filling box (29) is connected to the tin liquid chamber (5). A push cylinder (32) is installed at the end of the tin filling box (29) away from the discharge port (30), and the telescopic shaft of the push cylinder (32) is movably inserted into the tin filling box (29) to connect to a push plate (33).

7. The tin liquid type rapid soldering system for diodes according to claim 1, characterized in that: The flip clamping mechanism comprises a flip arm (34) and a movable flip arm (35) which are arranged opposite to each other. The flip arm (34) is rotatably connected to the welding workbench (1) via a first shaft (36). A second shaft (37) is fixed to one end of the movable flip arm (35) away from the flip arm (34). The second shaft (37) is movably arranged on the welding workbench (1). A tooling groove (38) is provided on one side of the flip arm (34) close to the movable flip arm (35) and on another side of the movable flip arm (35) close to the flip arm (34). One end of the tooling groove (38) is provided with an opening. A tooling pressure is provided in the tooling groove (38). The tooling pressure plate (39) is provided with a downward pressing driving mechanism at both ends of the top of the tooling pressure plate (39), and the downward pressing driving mechanism comprises a downward pressing shaft (40), a downward pressing spring (41) and an electromagnet (42). A driving groove is provided on the inner top wall of the tooling groove (38) corresponding to the position of the downward pressing driving mechanism, and the electromagnet (42) is installed in the driving groove. One end of the downward pressing shaft (40) is slidably adapted to the driving groove and is connected to a permanent magnet (43), and the other end is connected to the tooling pressure plate (39). A downward pressing spring (41) is provided between the permanent magnet (43) and the electromagnet (42), and the downward pressing spring (41) is connected to the downward pressing shaft (40).

8. The tin liquid type rapid soldering system for diodes according to claim 7, characterized in that: One end of the second shaft (37) away from the movable flip arm (35) passes through the welding workbench (1) and is connected to the output shaft of the drive motor (44); the housing of the drive motor (44) is mounted on a drive base (45); the drive base (45) is connected to the telescopic shaft of the drive cylinder (46); and the cylinder body of the drive cylinder (46) is mounted on the welding workbench (1).

9. The tin liquid type rapid soldering system for diodes according to claim 8, characterized in that: The flip clamping mechanism further comprises a receiving plate (47) and a mounting plate (48), the top surfaces of the flip arm (34) and the top surfaces of the movable flip arm (35) are both embedded with receiving electromagnets (49), one surface of the mounting plate (48) is embedded with a plurality of magnets, the plurality of magnets correspond one to one with the plurality of receiving electromagnets (49), the end surface of the mounting plate (48) provided with the magnets is connected to the receiving plate (47) via a receiving spring (50), the mounting plate (48) is magnetically adsorbed on the flip arm (34) and the movable flip arm (35), so that the receiving plate (47) contacts the tube end of the diode under the action of the receiving spring (50).

10. The tin liquid type rapid soldering system for diodes according to claim 9, characterized in that: The inner bottom wall of the tooling slot (2) is provided with a push plate (51), the push plate (51) being connected to the telescopic shaft of a push plate cylinder (52), the cylinder body of the push plate cylinder (52) being mounted on the welding workbench (1), and the push plate (51) being used to push the mounting plate (48) out of the open end of the tooling slot (2).

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