Machining method for air passage hole in semiconductor workpiece

Abstract

The invention provides a method for machining an air passage hole in a semiconductor workpiece, which comprises the following steps of: (1) sequentially carrying out first hole milling treatment and first hole drilling treatment on the semiconductor workpiece to obtain a semi-finished air passage hole; (2) sequentially carrying out second hole milling treatment and second drilling treatment on the semi-finished air passage hole to obtain a finished air passage hole; and the second drilling treatment is carried out by adopting a ball head gun drill. According to the method, two times of hole milling treatment and two times of hole drilling treatment are adopted, the airway hole is fully machined, the roughness Ra of the interior of the finished airway hole is 0.4 micrometer or below, and the subsequent use requirement is met.

Description

Technical Field

[0001] The present invention relates to the technical field of machining, and particularly to a method for machining an air passage hole on a semiconductor workpiece. Background Art

[0002] At present, when processing a hole passage with a milling cutter or other tools, generally a tool adapted to the hole diameter is used. However, this method not only requires a very high number of tools, but also requires the tool to be adapted to the inner diameter of the hole diameter. With the increasing requirement for the roughness of the hole passage, the existing mechanical machining milling has insufficient machining accuracy and slow machining efficiency.

[0003] CN215356368U discloses a milling cutter for improving stability in mechanical machining, including a milling cutter body and a connecting shaft. Two fixed shafts are fixedly connected to the bottom of the milling cutter body. A positioning sleeve is fixedly connected to the top of the connecting shaft. Two vertical grooves are opened in the top of the connecting shaft, and transverse grooves are opened in both sides of the connecting shaft. A rotating groove is opened in the bottom of the fixed shaft. A rotating shaft is fixedly connected to the inner wall surface of the rotating groove, and a rotating plate is movably sleeved on the rotating shaft. The milling cutter for improving stability in mechanical machining realizes the fixed connection between the movable shaft and the connecting shaft through the cooperation of the vertical groove and the transverse groove for connecting the fixed shaft and the movable shaft, the first connecting hole, the second connecting hole and the reinforcing rod. The positioning sleeve and the milling cutter body have a positioning and reinforcing effect. The milling cutter for improving stability in mechanical machining can realize the quick disassembly and assembly of the milling cutter body without the aid of external tools, has simple operation, high stability and is convenient to use.

[0004] CN215545236U discloses a milling cutter for mechanical machining that can be quickly replaced, including a machining mechanical main body. A milling cutter mounting head is arranged at the bottom of the machining mechanical main body, and a plurality of through holes are opened on the outer wall of the milling cutter mounting head. A limiting clamping rod is arranged on one side of the first spring. The milling cutter for mechanical machining that can be quickly replaced is provided with a first spring on the outer wall of the machining milling cutter main body, a limiting clamping rod is arranged on one side of the first spring, and a connecting rod insertion hole with a hexagonal structure is opened inside the machining milling cutter main body. After the machining milling cutter main body is inserted into the milling cutter mounting head, the positioning connecting rod inside the milling cutter mounting head is inserted into the inside of the connecting rod insertion hole, and the limiting clamping rod is stuck inside the through hole on the surface of the milling cutter mounting head. Thus, not only can the milling cutter mounting head and the machining milling cutter main body be connected and fixed, but also the phenomenon that the machining milling cutter main body rotates inside the milling cutter mounting head can be avoided, and at the same time, it is convenient to disassemble and replace, improving the replacement efficiency.

[0005] CN105414968A discloses a processing method for improving the surface roughness of deep small holes on alloy steel parts, which includes the following steps: (1) Select carbide as the tool material; (2) Manufacture a drill bit and a reamer that match the size of the small hole on the part according to the diameter size of the small hole on the part; (3) Check whether there are cracks and sand holes on the cutting edge of the reamer; (4) Roughly drill a small hole smaller than the design requirement of the hole with a drill bit; (5) Use the qualified reamer to perform a linear machining along the depth direction in the small hole once to complete, and flush the reamer with a coolant at the same time.

[0006] However, for the above-mentioned disclosed milling cutters and processing methods, the surface roughness Ra of the machined hole cannot reach below 0.4 μm. Summary of the Invention

[0007] In view of the problems existing in the prior art, the present invention provides a processing method for the air passage holes on a semiconductor workpiece. By adopting two milling hole treatments and two drilling treatments, the air passage holes are fully processed, and the surface roughness Ra in the finished air passage holes is achieved to be below 0.4 μm, meeting the subsequent use requirements.

[0008] To achieve this purpose, the present invention adopts the following technical solutions:

[0009] The present invention provides a processing method for the air passage holes on a semiconductor workpiece, and the processing method includes the following steps:

[0010] (1) Perform the first milling hole treatment and the first drilling treatment on the semiconductor workpiece in sequence to obtain a semi-finished air passage hole;

[0011] (2) Perform the second milling hole treatment and the second drilling treatment on the semi-finished air passage hole in sequence to obtain a finished air passage hole;

[0012] The second drilling treatment is performed using a ball nose gun drill.

[0013] The processing method for the air passage holes on the semiconductor workpiece of the present invention first performs the first milling hole treatment and the first drilling treatment on the semiconductor workpiece in sequence to obtain a semi-finished air passage hole with the depth meeting the requirements but the diameter and surface roughness still needing further treatment; based on this semi-finished air passage hole, continue to perform the second milling hole treatment, and use a ball nose gun drill to perform the second drilling treatment to obtain a high-quality air passage hole with the diameter meeting the requirements and the surface roughness Ra below 0.4 μm. The processing method of the present invention is simple to operate, has a fast processing efficiency, and the quality of the finished air passage holes is high, meeting the subsequent use requirements, and is suitable for wide range of popularization and application.

[0014] Preferably, the material of the semiconductor workpiece in step (1) includes aluminum or stainless steel.

[0015] Preferably, the first milling hole treatment in step (1) is performed using a first milling cutter.

[0016] Preferably, the diameter of the first milling cutter is 4.0 mm.

[0017] Preferably, the first milling process mills the semiconductor workpiece to a diameter of 4.81 - 4.83 mm, such as 4.81 mm, 4.815 mm, 4.82 mm, 4.825 mm, 4.828 mm, or 4.83 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable; the depth is 1 / 20 - 1 / 10 of the target depth of the air passage hole, such as 1 / 20, 3 / 50, 2 / 25, 9 / 100, or 1 / 10, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.

[0018] Preferably, the first drilling process in step (1) is carried out using a gun drill.

[0019] Preferably, the diameter of the gun drill is 4.8 - 4.83 mm, such as 4.8 mm, 4.815 mm, 4.82 mm, 4.825 mm, 4.828 mm, or 4.83 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.

[0020] Preferably, the machining allowance for the diameter of the semi-finished air passage hole in step (1) is 0.1 - 0.3 mm, such as 0.1 mm, 0.12 mm, 0.15 mm, 0.2 mm, 0.25 mm, or 0.3 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable; the depth is the target depth of the air passage hole.

[0021] Preferably, the second milling process in step (2) is carried out using a second milling cutter.

[0022] Preferably, the diameter of the second milling cutter is 4.0 mm.

[0023] Preferably, the second milling process mills the semi-finished air passage hole to a diameter of 5.01 - 5.03 mm, such as 5.01 mm, 5.015 mm, 5.018 mm, 5.02 mm, 5.025 mm, 5.027 mm, or 5.03 mm, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable; the depth is 1 / 20 - 1 / 10 of the target depth of the air passage hole, such as 1 / 20, 3 / 50, 2 / 25, 9 / 100, or 1 / 10, etc., but not limited to the listed values, and other unlisted values within this range are equally applicable.

[0024] Preferably, the ball diameter of the ball nose gun drill in step (2) is 5.0 - 5.03 mm. For example, it can be 5.0 mm, 5.015 mm, 5.018 mm, 5.02 mm, 5.025 mm, 5.027 mm, or 5.03 mm, etc., but is not limited to the listed values. Other unlisted values within this range are equally applicable.

[0025] In the processing method of the present invention, a milling cutter is first used to mill a smaller depth, and then a gun drill is used to drill to the target depth of the air passage hole. In this way, the shallow hole milled by the milling cutter can provide an accurate initial guide for the gun drill to avoid deflection when the gun drill cuts in; moreover, the shallow hole milled by the milling cutter can ensure that a smooth chip removal path is formed from the beginning for the gun drill, avoiding chip blockage and affecting the processing efficiency.

[0026] Preferably, the finished air passage hole in step (2) includes at least 1 group of mutually perpendicular cross - holes. For example, it can be 1 group, 2 groups, 3 groups, 5 groups, or 7 groups, etc.

[0027] Preferably, the diameter of the finished air passage hole is 5.0 - 5.03 mm. For example, it can be 5.0 mm, 5.015 mm, 5.018 mm, 5.02 mm, 5.025 mm, 5.027 mm, or 5.03 mm, etc., but is not limited to the listed values. Other unlisted values within this range are equally applicable;

[0028] The depth is 260 - 400 mm. For example, it can be 260 mm, 300 mm, 330 mm, 350 mm, 370 mm, or 400 mm, etc., but is not limited to the listed values. Other unlisted values within this range are equally applicable

[0029] Preferably, the surface roughness Ra in the finished air passage hole in step (2) is below 0.4 μm. For example, it can be 0.4 μm, 0.39 μm, 0.38 μm, 0.35 μm, 0.32 μm, 0.3 μm, or 0.2 μm, etc., but is not limited to the listed values. Other unlisted values within this range are equally applicable.

[0030] As a preferred technical solution of the present invention, the processing method includes the following steps:

[0031] (1) Use a first milling cutter with a diameter of 4.0 mm to perform the first milling hole treatment on the semiconductor workpiece, milling to a diameter of 4.81 - 4.83 mm and a depth of 1 / 20 - 1 / 10 of the target depth of the air passage hole; then use a gun drill with a diameter of 4.8 - 4.83 mm to perform the first drilling treatment to obtain a semi - finished air passage hole;

[0032] The material of the semiconductor workpiece includes aluminum or stainless steel; the machining allowance for the diameter of the semi-finished air duct hole is 0.1 - 0.3 mm, and the depth is the target depth of the air duct hole;

[0033] (2) Use a second milling cutter with a diameter of 4.0 mm to perform a second milling operation on the semi-finished air duct hole, milling to a diameter of 5.01 - 5.03 mm and a depth of 1 / 20 - 1 / 10 of the target depth of the air duct hole; then use a ball nose gun drill with a ball nose diameter of 5.0 - 5.03 mm to perform a second drilling operation to obtain a finished air duct hole with a diameter of 5.0 - 5.03 mm, a depth of 260 - 400 mm, and a surface roughness Ra of less than 0.4 μm;

[0034] The finished air duct hole includes at least one set of mutually perpendicular cross holes.

[0035] Compared with the prior art, the present invention has at least the following beneficial effects:

[0036] The processing method of the air duct hole on the semiconductor workpiece provided by the present invention is simple to operate and the step design is reasonable. By using a milling cutter and a gun drill to perform two milling operations and two drilling operations, the surface roughness Ra inside the finished air duct hole is less than 0.4 μm, meeting the subsequent use requirements, and solving the problem that the existing processing methods cannot guarantee the high surface roughness requirements inside the air duct hole. Description of the Drawings

[0037] Figure 1 is a schematic structural view of the air duct hole on the semiconductor workpiece in Embodiment 1 of the present invention.

[0038] Figure 2 is a top view of the air duct hole on the semiconductor workpiece in Embodiment 1 of the present invention.

[0039] In the figure: 1 - semiconductor workpiece; 2 - air duct hole. Detailed Description of the Invention

[0040] The technical solution of the present invention will be further described below in conjunction with the drawings and through specific embodiments.

[0041] The present invention will be further described in detail below. However, the following examples are only simple examples of the present invention and do not represent or limit the scope of the protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

[0042] It should be understood that in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0043] Embodiment 1

[0044] This embodiment provides a method for machining an air passage hole on a semiconductor workpiece. The machining method includes the following steps:

[0045] (1) Use a first milling cutter with a diameter of 4.0 mm to perform a first milling operation on the semiconductor workpiece until the diameter reaches 4.8 mm and the depth reaches 1 / 20 of the target depth of the air passage hole; then use a gun drill with a diameter of 4.8 mm to perform a first drilling operation to obtain a semi-finished air passage hole;

[0046] The material of the semiconductor workpiece is aluminum; the diameter machining allowance of the semi-finished air passage hole is 0.2 mm, and the depth is the target depth of the air passage hole;

[0047] (2) Use a second milling cutter with a diameter of 4.0 mm to perform a second milling operation on the semi-finished air passage hole until the diameter reaches 5.01 mm and the depth reaches 1 / 20 of the target depth of the air passage hole; then use a ball nose gun drill with a ball nose diameter of 5.0 mm to perform a second drilling operation to obtain a finished air passage hole with a diameter of 5.0 mm and a depth of 400 mm;

[0048] The finished air passage hole includes 3 groups of mutually perpendicular cross holes.

[0049] The schematic structural diagram of the air passage hole on the semiconductor workpiece in this embodiment is as Figure 1 shown, and the top view is as Figure 2 shown.

[0050] Embodiment 2

[0051] This embodiment provides a method for machining an air passage hole on a semiconductor workpiece. The machining method includes the following steps:

[0052] (1) Use a first milling cutter with a diameter of 4.0 mm to perform a first milling operation on the semiconductor workpiece until the diameter reaches 4.83 mm and the depth reaches 1 / 10 of the target depth of the air passage hole; then use a gun drill with a diameter of 4.83 mm to perform a first drilling operation to obtain a semi-finished air passage hole;

[0053] The material of the semiconductor workpiece is aluminum; the diameter machining allowance of the semi-finished air passage hole is 0.17 mm, and the depth is the target depth of the air passage hole;

[0054] (2) Use a second milling cutter with a diameter of 4.0 mm to perform a second milling operation on the semi-finished air passage hole, milling it to a diameter of 5.03 mm and a depth of 1 / 10 of the target depth of the air passage hole; then use a ball nose drill with a ball nose diameter of 5.03 mm to perform a second drilling operation to obtain a finished air passage hole with a diameter of 5.03 mm and a depth of 260 mm;

[0055] The finished air passage hole includes two sets of mutually perpendicular cross holes.

[0056] Example 3

[0057] This example provides a method for machining an air passage hole on a semiconductor workpiece, and the machining method includes the following steps:

[0058] (1) Use a first milling cutter with a diameter of 4.0 mm to perform a first milling operation on the semiconductor workpiece, milling it to a diameter of 4.817 mm and a depth of 2 / 25 of the target depth of the air passage hole; then use a gun drill with a diameter of 4.816 mm to perform a first drilling operation to obtain a semi-finished air passage hole;

[0059] The material of the semiconductor workpiece is stainless steel; the diameter machining allowance of the semi-finished air passage hole is 0.23 mm, and the depth is the target depth of the air passage hole;

[0060] (2) Use a second milling cutter with a diameter of 4.0 mm to perform a second milling operation on the semi-finished air passage hole, milling it to a diameter of 5.022 mm and a depth of 3 / 50 of the target depth of the air passage hole; then use a ball nose drill with a ball nose diameter of 5.02 mm to perform a second drilling operation to obtain a finished air passage hole with a diameter of 5.02 mm and a depth of 300 mm;

[0061] The finished air passage hole includes one set of mutually perpendicular cross holes.

[0062] Example 4

[0063] This example provides a method for machining an air passage hole on a semiconductor workpiece, and the machining method includes the following steps:

[0064] (1) Use a first milling cutter with a diameter of 4.0 mm to perform a first milling operation on the semiconductor workpiece, milling it to a diameter of 4.82 mm and a depth of 1 / 10 of the target depth of the air passage hole; then use a gun drill with a diameter of 4.82 mm to perform a first drilling operation to obtain a semi-finished air passage hole;

[0065] The material of the semiconductor workpiece is stainless steel; the diameter machining allowance of the semi-finished air passage hole is 0.24 mm, and the depth is the target depth of the air passage hole;

[0066] (2) Use a second milling cutter with a diameter of 4.0 mm to perform a second milling operation on the semi-finished air duct hole until the diameter reaches 5.01 mm and the depth reaches 1 / 20 of the target depth of the air duct hole; then use a ball nose gun drill with a ball nose diameter of 5.03 mm to perform a second drilling operation to obtain a finished air duct hole with a diameter of 5.03 mm and a depth of 360 mm;

[0067] The finished air duct hole includes two groups of mutually perpendicular cross holes.

[0068] From the comprehensive implementation of Examples 1 to 4, it can be seen that the processing method of the air duct hole on the semiconductor workpiece provided by the present invention is simple in operation, reasonable in step design, and the surface roughness Ra in the processed finished air duct hole is below 0.4 μm.

[0069] Example 5

[0070] This example provides a processing method for the air duct hole on a semiconductor workpiece. Except that the first milling operation mills the semiconductor workpiece to the target depth of the air duct hole, the rest are the same as in Example 1.

[0071] Example 6

[0072] This example provides a processing method for the air duct hole on a semiconductor workpiece. Except that the second milling operation mills the semi-finished air duct hole to the target depth of the air duct hole, the rest are the same as in Example 1.

[0073] From the comprehensive implementation of Example 1 and Examples 5 to 6, it can be seen that in Examples 5 and 6, the milling operations directly mill to the target depth of the air duct hole. Such operations have no practical material removal significance and will greatly extend the processing time.

[0074] Comparative Example 1

[0075] This comparative example provides a processing method for the air duct hole on a semiconductor workpiece. The processing method includes:

[0076] Directly use a ball nose gun drill with a ball nose diameter of 5.0 mm to perform a drilling operation to obtain a finished air duct hole with a diameter of 5.0 mm and a depth of 400 mm.

[0077] In this comparative example, since only one drilling operation is performed, the surface roughness Ra in the obtained finished air duct hole is relatively high, which is 3.2 μm and cannot meet the subsequent use requirements.

[0078] Comparative Example 2

[0079] This comparative example provides a processing method for the air duct hole on a semiconductor workpiece. Except that a non-ball nose gun drill is used for the second drilling operation, the rest are the same as in Example 1.

[0080] In this comparative example, since the second drilling process uses a non-ball nose gun drill, it cannot effectively reduce the roughness inside the finished air passage hole. As a result, the roughness of the finally obtained finished air passage hole is relatively high, failing to meet the subsequent usage requirements.

[0081] Comparative Example 3

[0082] This comparative example provides a method for machining an air passage hole on a semiconductor workpiece. Except for not performing the first milling hole process, the rest are the same as in Example 1.

[0083] In this comparative example, due to not performing the first milling hole process, the gun drill will deflect when cutting in; moreover, directly performing gun drilling on the semiconductor workpiece will cause chip jamming, thereby affecting the machining efficiency.

[0084] In summary, the method for machining an air passage hole on a semiconductor workpiece provided by the present invention is simple to operate and has a reasonable step design. By using a milling cutter and a gun drill for two milling hole processes and two drilling processes, the roughness Ra inside the finished air passage hole is achieved to be below 0.4 μm, meeting the subsequent usage requirements.

[0085] The applicant declares that the above description is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed by the present invention fall within the protection scope and the disclosure scope of the present invention.

Claims

1. A method for processing an airway hole on a semiconductor workpiece, characterized in that: The processing method comprises the following steps: (1) performing a first milling process and a first drilling process on a semiconductor workpiece in sequence to obtain a semi-finished gas duct hole; (2) performing a second milling process and a second drilling process on the semi-finished airway hole in sequence to obtain a finished airway hole; The second drilling process is performed using a ball-end gun drill.

2. The processing method according to claim 1, characterized in that: The material of the semiconductor workpiece in step (1) includes aluminum or stainless steel.

3. The processing method according to claim 1 or 2, characterized in that: Step (1) the first milling hole processing is performed using a first milling cutter; Preferably, the diameter of the first milling cutter is 4.0 mm; Preferably, the first milling process mills the semiconductor workpiece to a diameter of 4.81-4.83 mm and a depth of 1 / 20-1 / 10 of the target depth of the airway hole.

4. The processing method according to any one of claims 1 to 3, characterized in that: The first drilling process in step (1) is performed by using a gun drill; Preferably, the diameter of the gun drill is 4.8-4.83 mm.

5. The processing method according to any one of claims 1 to 4, characterized in that: The diameter machining allowance of the semi-finished airway hole in step (1) is 0.1-0.3 mm, and the depth is the target depth of the airway hole.

6. The processing method according to any one of claims 1 to 5, characterized in that: Step (2) the second milling process is performed using a second milling cutter; Preferably, the diameter of the second milling cutter is 4.0 mm; Preferably, the second milling process mills the semi-finished airway hole to a diameter of 5.01-5.03 mm and a depth of 1 / 20-1 / 10 of the target depth of the airway hole.

7. The processing method according to any one of claims 1 to 6, characterized in that: The ball head diameter of the ball head gun drill in step (2) is 5.0 to 5.03 mm.

8. The processing method according to any one of claims 1 to 7, characterized in that: The finished airway holes in step (2) include at least one group of mutually perpendicular cross holes.

9. The processing method according to any one of claims 1 to 8, characterized in that: The diameter of the finished airway hole in step (2) is 5.0-5.03 mm, and the depth is 260-400 mm; Preferably, the roughness Ra inside the airway hole of the finished product is less than 0.4 μm.

10. The processing method according to any one of claims 1 to 9, characterized in that: The processing method comprises the following steps: (1) using a first milling cutter with a diameter of 4.0 mm to perform a first milling process on the semiconductor workpiece, milling to a diameter of 4.81 to 4.83 mm, and a depth of 1 / 20 to 1 / 10 of the target depth of the airway hole; then using a gun drill with a diameter of 4.8 to 4.83 mm to perform a first drilling process to obtain a semi-finished airway hole; The material of the semiconductor workpiece includes aluminum or stainless steel; the diameter machining allowance of the semi-finished gas channel hole is 0.1-0.3 mm, and the depth is the target depth of the gas channel hole; (2) using a second milling cutter with a diameter of 4.0 mm to perform a second milling process on the semi-finished airway hole, milling to a diameter of 5.01 to 5.03 mm and a depth of 1 / 20 to 1 / 10 of the target depth of the airway hole; then using a ball head gun drill with a ball head diameter of 5.0 to 5.03 mm to perform a second drilling process, obtaining a finished airway hole with a diameter of 5.0 to 5.03 mm, a depth of 260 to 400 mm, and a roughness Ra of less than 0.4 μm; The finished airway holes include at least one group of mutually perpendicular cross holes.

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