Pyrography film and application thereof

Abstract

The pyrograph film comprises a base material, a release layer and an ink absorption layer, the release layer is arranged on the surface of one side of the base material, and the ink absorption layer is arranged on the surface of the side, opposite to the base material, of the release layer; the pyrograph film further comprises a matte layer and a protective layer, the matte layer is arranged on the surface of the side, opposite to the release layer, of the base material, and the protective layer is arranged on the surface of the side, opposite to the release layer, of the ink absorption layer. According to the pyrograph film, the whole structure of the pyrograph film is simplified by arranging the ink absorption layer on the surface of the release layer, and compared with a traditional pyrograph film, the pyrograph film has the advantages that the uncertainty of interlayer separation can be reduced by directly arranging the ink absorption layer on the surface of the release layer, the stripping performance of patterns at high temperature and high pressure is optimized, and the service life of the pyrograph film is prolonged. The efficiency of the transfer printing process is improved, and meanwhile the definition and integrity of transfer printing patterns are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of heat transfer films, and particularly to a heat transfer film. Background Art

[0002] A heat transfer film is a functional material that transfers patterns to the surfaces of substrates such as fabrics, plastics, and metals through a hot pressing process. Its core technology is based on the combination of the adhesive properties of hot melt adhesives and printing processes, and is widely used in the fields of clothing, packaging, advertising, and home decoration. Existing heat transfer films generally consist of a substrate layer, a release layer, a pattern layer, and a hot melt adhesive layer; among them, the substrate layer is usually a PET film, providing mechanical strength and high temperature resistance; the release layer is usually a silicone oil coating for easy pattern peeling; the pattern layer is usually screen printing or digital printing ink to carry pattern information; the hot melt adhesive layer is usually EVA or PUR glue for bonding.

[0003] In current practical applications, the pattern layer is usually indirectly combined with the release layer through other functional layers such as an intermediate buffer layer to stabilize the printing process of the pattern layer. However, this setting method increases the uncertainty of interlayer separation and affects the stability of the pattern transfer process. Summary of the Invention

[0004] Based on this, it is necessary to provide a heat transfer film to address the technical problem of insufficient hot stamping stability of existing heat transfer films.

[0005] A heat transfer film includes a substrate, a release layer, and an ink absorption layer. The release layer is disposed on one surface of the substrate, and the ink absorption layer is disposed on the surface of the release layer facing away from the substrate.

[0006] The heat transfer film further includes a matte layer and a protective layer. The matte layer is disposed on the surface of the substrate facing away from the release layer, and the protective layer is disposed on the surface of the ink absorption layer facing away from the release layer.

[0007] In one embodiment, the thickness of the above heat transfer film is set to 80 - 100 μm.

[0008] In one embodiment, the thickness of the above heat transfer film is set to 81 - 82 μm.

[0009] In one embodiment, the above substrate is made of one of PET and PP.

[0010] In one embodiment, the above substrate is made of PET.

[0011] In one embodiment, the thickness of the above substrate is set to 30 - 80 μm.

[0012] In one embodiment, the thickness of the above substrate is set to 75 μm.

[0013] In one embodiment, the tensile strength of the above-mentioned substrate is defined as greater than 100 MPa, and the thermal shrinkage rate of the substrate is limited to less than 0.5%.

[0014] In one embodiment, the above-mentioned release layer is made of one of silicone resin and fluorinated polymer coating.

[0015] In one embodiment, the above-mentioned release layer is made of silicone resin.

[0016] In one embodiment, the thickness of the above-mentioned release layer is set to 1 - 3 μm, and the release force is defined as 0.5 - 1.5 N / cm.

[0017] In one embodiment, the above-mentioned ink absorption layer is set as a highly absorbent coating.

[0018] In one embodiment, the above-mentioned ink absorption layer is made of one of polyurethane coating and nano - coating.

[0019] In one embodiment, the thickness of the above-mentioned ink absorption layer is set to 1 - 10 μm, its ink adsorption force is defined as greater than 90%, and its temperature resistance range is defined as 150 - 200 °C.

[0020] In one embodiment, the above-mentioned matte layer is made of one of polyester coating and wear - resistant material with matte treatment.

[0021] In one embodiment, the thickness of the above-mentioned matte layer is set to 1 - 12 μm, its surface glossiness is defined as less than 30 GU, and its scratch resistance is defined as greater than 2H.

[0022] In one embodiment, the above-mentioned protective layer is a composite coating made of antistatic agent and water - blocking molecules.

[0023] In one embodiment, the surface resistivity of the above-mentioned protective layer is defined as 10 6 -10 12 Ω / sq, and its water vapor transmission rate is limited to less than 5 g / m² / day (38 °C, 90% RH).

[0024] The above heat transfer film is applied to the heat transfer process of fabrics or leathers. The heat transfer process includes the following steps: printing ink onto the corresponding side surface of the heat transfer film through a printer; sprinkling a preset amount of hot melt powder onto the corresponding side surface of the heat transfer film, and then feeding it into a baking machine for baking at 60 - 80 °C for 2 min and then baking at 120 - 140 °C for 2.5 - 3 min; the baked heat transfer film transfers the pattern onto the surface of the target product through a heat press. The air pressure of the heat press is set to 0.2 - 0.3 MPa, the temperature is set to 150 - 160 °C, and the heat transfer time is set to 8 s; after the heat transfer is completed, the waste film is torn off, leaving the printed pattern.

[0025] In one embodiment, the above ink uses DTF ink.

[0026] In one embodiment, the above hot melt powder uses DTF hot melt powder, and the hot melt powder is prepared by mixing medium powder and coarse powder with preset particle sizes in a preset ratio. Among them, the particle size of the medium powder is set to 80 - 170 μm, and the particle size of the coarse powder is set to 120 - 250 μm.

[0027] In summary, the heat transfer film disclosed by the present invention simplifies the overall structure of the heat transfer film by setting an ink absorption layer on the surface of the release layer, and at the same time strengthens the integrity of the pattern peeling of the heat transfer film, thereby improving the processing yield during heat transfer processing. Specifically, in traditional heat transfer films, the pattern layer is indirectly combined with the release layer through other functional layers, increasing the complexity of release during pattern transfer. Compared with traditional heat transfer films, the heat transfer film of the present invention can reduce the uncertainty of interlayer separation by setting an ink absorption layer on the surface of the release layer, optimize the peeling performance of the pattern under high temperature and high pressure, improve the efficiency of the transfer process, and at the same time ensure the clarity and integrity of the transferred pattern; the ink absorption layer is directly exposed on the surface of the release layer, which can better fix the ink, avoid ink diffusion or blurring, and thus significantly maintain the color saturation and contrast of the pattern, greatly improving the pattern transfer effect. Description of the Drawings

[0028] Figure 1 It is a schematic structural diagram of the heat transfer film in one embodiment. Detailed Embodiments

[0029] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention is provided in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0030] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0032] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation.

[0035] Please refer to Figure 1 , the present invention discloses a heat transfer film 10, which includes a substrate 100, a release layer 200 and an ink absorption layer 300. The release layer 200 is disposed on one surface of the substrate 100, and the ink absorption layer 300 is disposed on the surface of the release layer 200 facing away from the substrate 100; wherein, the substrate 100 is used to support the overall structure of the heat transfer film 10, providing sufficient mechanical strength and thermal stability, and the ink absorption layer 300 can interact with the adapted ink; while the release layer 200 can ensure the peelability of the ink absorption layer 300, thereby ensuring the integrity of the transferred pattern; based on this, the ink is sprayed onto the ink absorption layer 300 through a spraying device, and then a pattern film layer with a preset color, pattern and adhesion function is formed, and is attached to the surface of a target article such as a fabric or a leather product by means of heat transfer, thereby realizing the heat transfer function of the heat transfer film 10. On this basis, the heat transfer film 10 further includes a matte layer 400 and a protective layer 500. The matte layer 400 is disposed on the surface of the substrate 100 facing away from the release layer 200, and the protective layer 500 is disposed on the surface of the ink absorption layer 300 facing away from the release layer 200; thus, the matte layer 400 can effectively improve the anti-slip, wear-resistant and anti-fouling and fingerprint-resistant properties of the surface of the heat transfer film 10, thereby effectively avoiding the slippage and misalignment of the heat transfer film 10 with the printer during the actual printing process, and greatly improving the actual application effect of the heat transfer film 10; while the protective layer 500 can enhance the anti-static and moisture-proof functions of the ink absorption side of the heat transfer film 10, and can effectively reduce the excessive adhesion of the hot melt powder during actual application, which is beneficial to the control of the adhesion amount of the hot melt powder on the surface of the heat transfer film 10. In the traditional heat transfer film 10, the pattern layer is indirectly combined with the release layer 200 through other functional layers, increasing the complexity of release during pattern transfer. Compared with the traditional heat transfer film 10, the heat transfer film 10 of the present invention can reduce the uncertainty of interlayer separation by disposing the ink absorption layer 300 on the surface of the release layer 200, optimize the peeling performance of the pattern under high temperature and high pressure, improve the efficiency of the transfer process, and at the same time ensure the clarity and integrity of the transferred pattern; the ink absorption layer 300 is directly exposed on the surface of the release layer 200, which can better fix the ink, avoid ink diffusion or blurring, and thus significantly maintain the color saturation and contrast of the pattern, greatly improving the pattern transfer effect.

[0036] Further, the thickness of the heat transfer film 10 is set to 80 - 100 μm. In one embodiment, the thickness of the heat transfer film 10 is set to 81 - 82 μm.

[0037] Further, the substrate 100 is made of one of PET and PP, providing good mechanical strength, temperature resistance, and surface smoothness for the entire heat transfer film 10. In one embodiment, the substrate 100 is made of PET, providing strong support, good mechanical properties, transparency, and temperature resistance. Specifically, the thickness of the substrate 100 is set to 30 - 80 μm. Preferably, in one embodiment, the thickness of the substrate 100 is set to 75 μm; in another embodiment, the tensile strength of the substrate 100 is limited to be greater than 100 MPa, and the thermal shrinkage rate of the substrate 100 is limited to be less than 0.5%.

[0038] Further, the release layer 200 is made of one of silicone resin and fluoropolymer coating to achieve complete peeling of the pattern and ensure the quality of the pattern after hot stamping. In one of the embodiments, the release layer 200 is made of silicone resin; in another embodiment, the thickness of the release layer 200 is set to 1 - 3 μm, and the release force is limited to 0.5 - 1.5 N / cm.

[0039] Further, the ink absorption layer 300 is set as a highly absorbent coating to carry the ink and enhance the adhesion of the pattern, ensuring clear and saturated colors of the pattern after hot stamping. Specifically, the ink absorption layer 300 is made of one of polyurethane coating and nano - coating. In one of the embodiments, the thickness of the ink absorption layer 300 is set to 1 - 10 μm, its ink adsorption capacity is limited to be greater than 90%, and its temperature resistance range is limited to 150 - 200 °C.

[0040] Further, the matte layer 400 is made of one of polyester coating and wear - resistant materials with matte treatment to provide anti - slip and anti - misalignment performance. At the same time, it can also provide excellent anti - glare performance, reduce light reflection, and have certain wear resistance. In one embodiment, the thickness of the matte layer 400 is set to 1 - 12 μm, its surface glossiness is limited to be less than 30 GU, and its scratch resistance is limited to be greater than 2H.

[0041] Further, the protective layer 500 is a composite coating made of antistatic agent and water - blocking molecules to achieve antistatic and moisture - proof performance on the surface of the heat transfer film 10, thereby reducing the excessive adhesion of hot - melt powder on the surface of the heat transfer film 10. In one embodiment, the surface resistivity of the protective layer 500 is limited to 10 6 -10 12 Ω / sq, and its water vapor transmission rate is limited to be less than 5 g / m² / day (38 °C, 90% RH).

[0042] The hot stamping film 10 disclosed by the present invention is applied to the hot stamping process of fabrics or leathers. The hot stamping process includes the following steps: printing ink onto the corresponding side surface of the hot stamping film 10 through a printer; sprinkling a preset amount of hot melt powder on the corresponding side surface of the hot stamping film 10, and then feeding it into a baking machine to bake for 2 minutes under the condition of 60 - 80 °C, and then bake for 2.5 - 3 minutes under the condition of 120 - 140 °C; the baked hot stamping film 10 stamps the pattern onto the surface of the target product through a hot press. The air pressure of the hot press is set to 0.2 - 0.3 MPa, the temperature is set to 150 - 160 °C, and the hot stamping time is set to 8 s; after the hot stamping is completed, the waste film is torn off, leaving the printed pattern.

[0043] In one embodiment, the ink uses DTF ink; in another embodiment, the hot melt powder uses DTF hot melt powder, and the hot melt powder is prepared by mixing medium powder and coarse powder with a preset particle size in a preset ratio. Among them, the particle size of the medium powder is set to 80 - 170 μm, and the particle size of the coarse powder is set to 120 - 250 μm.

[0044] In summary, the hot stamping film disclosed by the present invention simplifies the overall structure of the hot stamping film by setting an ink absorption layer on the surface of the release layer, and at the same time strengthens the integrity of the pattern peeling of the hot stamping film, thereby improving the processing yield during hot stamping. Specifically, in traditional hot stamping films, the pattern layer is indirectly combined with the release layer through other functional layers, increasing the complexity of release during pattern transfer. Compared with traditional hot stamping films, the hot stamping film of the present invention can reduce the uncertainty of interlayer separation by setting an ink absorption layer on the surface of the release layer, optimize the peeling performance of the pattern under high temperature and high pressure, improve the efficiency of the transfer process, and at the same time ensure the clarity and integrity of the transferred pattern; the ink absorption layer is directly exposed on the surface of the release layer, which can better fix the ink, avoid ink diffusion or blurring, and thus significantly maintain the color saturation and contrast of the pattern, greatly improving the pattern transfer effect.

[0045] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0046] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent should be subject to the appended claims.

Claims

1. A heat transfer film, characterized in that: include: A substrate, a release layer and an ink absorbing layer, wherein the release layer is disposed on one side of the substrate, and the ink absorbing layer is disposed on the side of the release layer facing away from the substrate; The heat transfer film further comprises a matte layer and a protective layer. The matte layer is arranged on a surface of the substrate facing away from the release layer, and the protective layer is arranged on a surface of the ink absorbing layer facing away from the release layer.

2. The heat transfer film according to claim 1, characterized in that: The thickness of the heat transfer film is set to 80-100 μm.

3. The heat transfer film according to claim 2, characterized in that: The thickness of the heat transfer film is set to 81-82 μm.

4. The heat transfer film according to claim 1, characterized in that: The substrate thickness is set to 30-80 μm.

5. The heat transfer film according to claim 4, characterized in that: The substrate thickness is set to 75 μm.

6. An application of the heat transfer film according to any one of claims 1 to 5, characterized in that: The heat transfer film is applied to a hot stamping process for fabrics or leather, and the hot stamping process comprises the following steps: printing ink onto the corresponding side surface of the heat transfer film through a printer; sprinkling two preset hot-melt powders on the corresponding side surface of the heat transfer film, and then feeding the film into a baking machine for baking at 60-80°C for 2 minutes, and then baking at 120-140°C for 2.5-3 minutes; the baked heat transfer film is heat-stamped onto the surface of a target product through a hot stamping machine, the air pressure of the hot stamping machine is set to 0.2-0.3MPa, the temperature is set to 150-160°C, and the hot stamping time is set to 8s; after hot stamping, the waste film is torn off to leave the printed pattern.

7. The heat transfer film according to claim 6, characterized in that: The hot melt powder adopts DTF hot melt powder.

8. The heat transfer film according to claim 7, characterized in that: The hot melt powder is prepared by mixing medium powder and coarse powder with preset particle sizes according to a preset ratio.

9. The heat transfer film according to claim 8, characterized in that: The particle size of the medium powder is set to 80-170 μm.

10. The heat transfer film according to claim 8, characterized in that: The particle size of the coarse powder is set to 120-250 μm.

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