Cleaning sheet demand evaluation method and device, equipment and storage medium

Abstract

The invention relates to the technical field of semiconductors, in particular to a cleaning sheet demand evaluation method, device and equipment and a storage medium, and the method comprises the steps: obtaining the material information of a production task and the configuration information of a processing cavity, so as to generate a first pre-distribution scheme for confirming the information of a required cleaning sheet, judging whether the acquired cleaning sheet supply information can meet the required cleaning sheet information or not; if not, checking the state of the production task; if the production task is in progress, the configuration information of the processing chamber is adjusted to generate a second pre-distribution scheme; replacing the first pre-distribution scheme with the second pre-distribution scheme, and returning to execute the required clean film information confirmed based on the generated first pre-distribution scheme; according to the method disclosed by the invention, the pre-distribution scheme is adjusted by evaluating the supply cleaning film information and the demand cleaning film information, so that the situation that the whole task action sequence is deleted due to the missing of the cleaning film in the algorithm planning process, and then the invalid time consumption is caused is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular, to a method, device, equipment, and storage medium for evaluating the demand for cleaning wafers. Background Art

[0002] Semiconductor integrated equipment is a crucial support for the development of the semiconductor industry, and its importance is self-evident; with the continuous progress of semiconductor wafer manufacturing processes, the process complexity and control precision requirements of integrated equipment during wafer processing are also increasing day by day to achieve higher production yields.

[0003] In the current production and processing process of semiconductor integrated equipment, in order to ensure the quality of wafers, cleaning wafers (Dummy) are usually introduced at specific times to maintain and clean the processing chambers; the use of cleaning wafers is restricted by both the configuration of the processing chamber and the recipe configuration of the path of the wafers to be processed, and the insertion time can be before or after the processing of the wafers to be processed, or after reaching a certain number of wafers; therefore, in the scenario of mixed processing of multiple types of wafers, the use of cleaning wafers poses a major challenge to wafer scheduling; during scheduling, not only the outfeed and processing sequences of the wafers to be processed and the cleaning wafers need to be planned, but also the connection problem between the two in the processing chamber needs to be considered. Otherwise, it may cause the scheduling algorithm to fall into deadlock or cause the processing chamber to wait idle, thus affecting the usage efficiency of semiconductor integrated equipment.

[0004] In the existing wafer scheduling algorithms with cleaning wafers, the common practice is to trigger the type and quantity of the required cleaning wafers before and after the wafers to be processed enter the processing chamber and lock this information; subsequently, the scheduling time will be traced back to an appropriate time, that is, some of the currently planned actions will be deleted to ensure that the triggered cleaning wafers can be outfed in time and enter the processing chamber for cleaning; the cleaning wafers can be recycled to provide cleaning services for different processing chambers, but the number of times they can be used shall not exceed a preset maximum limit (limit); once all the cleaning wafers reach their maximum limit values, there will be no available cleaning wafers. If a task still requires a cleaning wafer but cannot obtain it at this time, all the previously planned action lists of this task must be deleted, the task cannot be outfed for processing, and an error message indicating a lack of cleaning wafers will be fed back to replace the cleaning wafers.

[0005] The main problems faced by existing scheduling technologies are as follows. In the case of a shortage of cleaning wafers, a large amount of computing time is required to determine the tasks that ultimately cannot produce wafers due to the shortage of cleaning wafers. These tasks did not lack cleaning wafers in the early stage, but in the later stage, due to the shortage of cleaning wafers, all the action sequences calculated in the early stage were deleted, thus increasing the response time of the scheduling algorithm and reducing the equipment production capacity. In addition, for those tasks that need to be recalculated due to a shortage of cleaning wafers in the later stage, if the demand for cleaning wafers can be met to continue production by reducing the number of processing chambers, the current scheduling technology cannot effectively handle this situation. The main reason is the lack of an assessment of whether the cleaning wafers can meet the cleaning wafer requirements of all tasks in each processing chamber.

[0006] It can be seen that the existing technology still needs to be improved. Summary of the Invention

[0007] In order to overcome the deficiencies of the existing technology, the purpose of the present invention is to provide a method for evaluating the demand for cleaning wafers. By evaluating the information on the supply of cleaning wafers and the information on the demand for cleaning wafers, the pre-allocation plan is adjusted, thereby avoiding the deletion of the entire task action sequence due to the lack of cleaning wafers during the algorithm planning process, and further avoiding the resulting ineffective time consumption.

[0008] The first aspect of the present invention provides a method for evaluating the demand for cleaning wafers, including: obtaining the material information of the production task and the configuration information of the processing chamber, generating a first pre-allocation plan based on the material information and the configuration information; confirming the information on the demand for cleaning wafers based on the generated first pre-allocation plan, where the information on the demand for cleaning wafers includes the type of the demanded cleaning wafers and the quantity corresponding to the type; obtaining the information on the supply of cleaning wafers, and determining whether the information on the supply of cleaning wafers can meet the information on the demand for cleaning wafers; if it cannot be met, determining whether the production task is in progress; if the production task is in progress, adjusting the configuration information of the processing chamber, and generating a second pre-allocation plan based on the material information and the adjusted configuration information; replacing the first pre-allocation plan with the second pre-allocation plan, and returning to execute the step of confirming the information on the demand for cleaning wafers based on the generated first pre-allocation plan.

[0009] Optionally, in the first implementation manner of the first aspect of the present invention, the obtaining of the material information of the production task and the configuration information of the processing chamber, and generating a first pre-allocation plan based on the material information and the configuration information includes: obtaining the material information of the production task and the configuration information of the processing chamber, where the material information includes the number of production subtasks, the path recipe corresponding to the production subtask, and the number of wafers to be processed; the configuration information includes the number of processing chambers, the path recipe corresponding to the processing chamber, the initial processing cumulative value, and the cumulative processing limit value; confirming the upper limit value of the first type of cleaning group number according to the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; confirming the upper limit value of the second type of cleaning group number according to the number of wafers to be processed and the number of processing chambers; generating a first pre-allocation plan according to the material information and the configuration information, and the cleaning group number of the generated first pre-allocation plan simultaneously satisfies the upper limit value of the first type of cleaning group number and the upper limit value of the second type of cleaning group number.

[0010] Optionally, in the second implementation manner of the first aspect of the present invention, the generating a first pre-allocation plan according to the material information and the configuration information, and the cleaning group number of the generated first pre-allocation plan simultaneously satisfies the upper limit value of the first type of cleaning group number and the upper limit value of the second type of cleaning group number includes: generating a first allocation plan based on the upper limit value of the first type of cleaning group number and the number of processing chambers; calculating the remaining number of wafers to be processed based on the number of wafers to be processed and the number of wafers to be processed included in the first allocation plan; generating a second allocation plan based on the initial processing cumulative value, the upper limit value of the first type of cleaning group number, and the remaining number of wafers to be processed; judging whether the sum of the cleaning group numbers of the first allocation plan and the second allocation plan satisfies the upper limit value of the second type of cleaning group number; if it is satisfied, integrating the first allocation plan and the second allocation plan to obtain a first pre-allocation plan; if it is not satisfied, generating a third allocation plan based on the number of processing chambers and the upper limit value of the second type of cleaning group number, and integrating the first allocation plan, the second allocation plan, and the third allocation plan to obtain a first pre-allocation plan.

[0011] Optionally, in the third implementation manner of the first aspect of the present invention, the confirming the required cleaning sheet information based on the generated first pre-allocation plan, where the required cleaning sheet information includes the type of the required cleaning sheet and the quantity corresponding to the type, includes: obtaining the preset cleaning rules of the processing chamber; confirming the required cleaning sheet information based on the preset cleaning rules of the processing chamber and the generated first pre-allocation plan, where the required cleaning sheet information includes the type of the required cleaning sheet and the quantity corresponding to the type.

[0012] Optionally, in the fourth implementation manner of the first aspect of the present invention, after obtaining the cleaning sheet supply information and determining whether the cleaning sheet supply information can meet the required cleaning sheet information, the method further includes: if the cleaning sheet supply information can meet the required cleaning sheet information, performing a production task based on the generated first pre-allocation plan; when the production task ends, updating the cleaning sheet supply information based on the required cleaning sheet information.

[0013] Optionally, in the fifth implementation manner of the first aspect of the present invention, if it cannot be satisfied, it is determined whether the production task is in progress, and then the following includes: if the production task has not started, stop performing the production task and output the material information corresponding to the production task.

[0014] Optionally, in the sixth implementation manner of the first aspect of the present invention, if the production task is in progress, adjusting the configuration information of the processing chamber and generating a second pre-allocation plan based on the material information and the adjusted configuration information, including: if the production task is in progress, reducing the number of processing chambers to adjust the configuration information of the processing chamber; confirming the upper limit value of the first type of cleaning group number according to the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; confirming the upper limit value of the second type of cleaning group number according to the number of wafers to be processed and the adjusted number of processing chambers; generating a second pre-allocation plan according to the material information and the configuration information, and the number of cleaning groups of the generated second pre-allocation plan simultaneously meets the upper limit values of the first type of cleaning group number and the second type of cleaning group number.

[0015] The second aspect of the present invention provides a cleaning sheet demand evaluation device, including: a first generation module, configured to obtain the material information of the production task and the configuration information of the processing chamber, and generate a first pre-allocation plan based on the material information and the configuration information; a confirmation module, configured to confirm the required cleaning sheet information based on the generated first pre-allocation plan, where the required cleaning sheet information includes the type of the required cleaning sheet and the quantity corresponding to the type; a first judgment module, configured to obtain the cleaning sheet supply information and judge whether the cleaning sheet supply information can meet the required cleaning sheet information; a second judgment module, configured to judge whether the production task is in progress if it cannot be satisfied; a second generation module, configured to adjust the configuration information of the processing chamber if the production task is in progress, and generate a second pre-allocation plan based on the material information and the adjusted configuration information; an iteration module, configured to replace the first pre-allocation plan with the second pre-allocation plan and return to execute the confirmation of the required cleaning sheet information based on the generated first pre-allocation plan.

[0016] In a third aspect of the present invention, a cleaning sheet demand assessment device is provided. The cleaning sheet demand assessment device includes: a memory and at least one processor, wherein instructions are stored in the memory; and at least one of the processors invokes the instructions in the memory to cause the cleaning sheet demand assessment device to execute each step of the cleaning sheet demand assessment method described in any one of the above.

[0017] In a fourth aspect of the present invention, a computer-readable storage medium is provided. Instructions are stored on the computer-readable storage medium, and when the instructions are executed by a processor, each step of the cleaning sheet demand assessment method described in any one of the above is implemented.

[0018] In the technical solution of the present invention, by evaluating the supply cleaning sheet information and the demand cleaning sheet information, the pre-allocation scheme is adjusted, thereby avoiding the deletion of the entire task action sequence due to the lack of cleaning sheets during the algorithm planning process, and further avoiding the resulting ineffective time consumption; the technical solution of the present invention evaluates the cleaning sheet demand before the wafer scheduling algorithm planning, which not only ensures that the function of the wafer scheduling algorithm is not affected, but also ensures the stability of production capacity; in addition, the technical solution of the present invention has the characteristics of rapid evaluation and can complete the evaluation of the cleaning sheet missing task in an extremely short time (only 2 milliseconds). BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of a semiconductor combination device applicable to the cleaning sheet demand assessment method provided by an embodiment of the present invention; Figure 2 It is a first flowchart of the cleaning sheet demand assessment method provided by an embodiment of the present invention; Figure 3 It is a second flowchart of the cleaning sheet demand assessment method provided by an embodiment of the present invention; Figure 4 It is a schematic structural diagram of a cleaning sheet demand assessment device provided by an embodiment of the present invention; Figure 5 It is a schematic structural diagram of a cleaning sheet demand assessment device provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The present invention provides a method, apparatus, device and storage medium for evaluating the demand for cleaning sheets. In the present invention, the terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and the above-mentioned drawings of the present invention are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order different from that shown or described herein. In addition, the term "comprising" or "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products or devices.

[0021] For ease of understanding, the semiconductor combination device applicable to the embodiments of the present invention will be described below. Please refer to Figure 1, this semiconductor combination equipment consists of three main regions: the atmospheric end region, the vacuum lock region, and the vacuum end region; the atmospheric end region is composed of a wafer loader (LP), a buffer module (Buffer), a wafer pre-aligner (Aligner), an atmospheric end robot (ATR), a cooler module (Cooler), and a dummy wafer container (DummyPort); the vacuum lock region includes a vacuum lock transfer module (LL), and the vacuum end region is composed of a processing chamber (Ch) and a vacuum end robot (VTR); the wafer loader, as the entrance and exit of the equipment, allows the whole cassette of wafers to enter, and after each wafer is processed according to the recipe path, the whole cassette leaves. In this embodiment, the semiconductor combination equipment is configured with 4 wafer loaders, respectively labeled as LP1 to LP4, and the capacity of each wafer loader is 25 wafers; the buffer module is set to prevent processed and unprocessed wafers from existing in the same wafer loader at the same time. This embodiment includes 4 buffer modules, labeled as Buffer1 to Buffer4, and the capacity of each buffer module is also 25 wafers; the wafer pre-aligner is responsible for calibrating the position of the wafers to avoid damage or dropping during the processing; the atmospheric end robot is responsible for transporting wafers between the wafer loader, the wafer pre-aligner, the buffer module, the vacuum lock transfer module, the cooler module, and the dummy wafer container; the cooler module is used to cool the processed wafers; the dummy wafer container is used to store dummy wafers, and its capacity is 25 wafers; the vacuum lock transfer module is responsible for performing the evacuation action and the backfilling action. Through the evacuation action, the unprocessed wafers at the atmospheric end are transferred to the vacuum end, and through the backfilling action, the processed wafers at the vacuum end are transferred back to the atmospheric end. In this embodiment, the semiconductor combination equipment includes 4 vacuum lock transfer modules, respectively labeled as LA, LB, LC, and LD; the processing chamber is used for processing wafers, and the cleaning of dummy wafers is also carried out for the processing chamber. This embodiment includes 6 processing chambers, respectively labeled as Ch1 to Ch6; the vacuum end robot is responsible for transporting wafers between each processing chamber and between the processing chamber and the vacuum lock transfer module.

[0022] The processing flow of the semiconductor combination equipment disclosed in this embodiment is as follows: The atmospheric end manipulator is responsible for transporting the wafers to be processed from the wafer loader / unloader to the wafer pre-aligner for calibration, and then transporting them to the vacuum lock transfer module; after receiving the wafers in the atmosphere, the vacuum lock transfer module performs a vacuum pumping operation. After the vacuum pumping is completed, the vacuum end manipulator takes out the unprocessed wafers from the vacuum lock transfer module and places them into the processing chamber for processing; if the wafer path recipe specifies that the processing chamber needs to be cleaned before processing, a cleaning wafer must be used for cleaning first, and then the wafer can enter the processing chamber; after the wafer is processed according to the recipe path, the vacuum end manipulator takes it out of the processing chamber and puts it back into the vacuum lock transfer module. If the wafer is the last one of the task, or the processing chamber has accumulated a fixed number of processes and the wafer post-cleaning is configured in the path recipe, the wafer needs to be cleaned with a cleaning wafer after leaving the processing chamber; after receiving the wafer, the vacuum lock transfer module performs a ventilation operation; finally, the atmospheric end manipulator puts the processed wafer into the cooling module for cooling and finally into the wafer loader / unloader. If there are unprocessed wafers for this task in the wafer loader / unloader, the wafer needs to be buffered in the buffer module first and then transferred to the wafer loading / unloading when there are no unprocessed wafers in the wafer loader / unloader.

[0023] Further, for ease of understanding, the specific process of the embodiment of the present invention will be described below. Please refer to Figure 2 , an embodiment of the cleaning wafer demand assessment method in the embodiment of the present invention includes: 101. Obtain the material information of the production task and the configuration information of the processing chamber, and generate a first pre-allocation plan based on the material information and the configuration information; 102. Confirm the required cleaning wafer information based on the generated first pre-allocation plan, where the required cleaning wafer information includes the type of the required cleaning wafer and the quantity corresponding to the type; 103. Obtain the cleaning wafer supply information and determine whether the cleaning wafer supply information can meet the required cleaning wafer information; In this embodiment, the cleaning wafer supply information includes the type of the supplied cleaning wafer and the quantity corresponding to the type; if the type of the supplied cleaning wafer covers all the types of the required cleaning wafers, and the quantity of each type of the supplied cleaning wafer is not less than the corresponding quantity of the required cleaning wafer, then the cleaning wafer supply information meets the required cleaning wafer information; otherwise, if any type of the required cleaning wafer is missing from the type of the supplied cleaning wafer, or the quantity of any type of the supplied cleaning wafer is less than the corresponding quantity of the required cleaning wafer, then the cleaning wafer supply information does not meet the required cleaning wafer information.

[0024] 104. If it cannot be satisfied, determine whether the production task is in progress; In this embodiment, by determining whether the cleaning sheet supply information can meet the required cleaning sheet information, if it cannot be met, it is further determined whether the production task is in progress. This step improves the flexibility and adaptability of the first pre-allocation scheme, ensuring that in the case of insufficient cleaning sheets, the first pre-allocation scheme can be adjusted in a timely manner to avoid the interruption of the wafer scheduling scheme.

[0025] 105. If the production task is in progress, adjust the configuration information of the processing chamber, and generate a second pre-allocation scheme based on the material information and the adjusted configuration information; In this embodiment, if the production task is not in progress, stop executing the production task and output the material information corresponding to the production task.

[0026] 106. Replace the first pre-allocation scheme with the second pre-allocation scheme, and return to execute the confirmation of the required cleaning sheet information based on the generated first pre-allocation scheme; In this embodiment, if the production task is in progress and the supply of cleaning sheets is insufficient, automatically adjust the configuration information of the processing chamber, and generate a second pre-allocation scheme based on the material information and the adjusted configuration information; this step not only improves the accuracy of the production plan, but also ensures that the production task can proceed smoothly, improving production efficiency and product quality; at the same time, replacing the first pre-allocation scheme with the second pre-allocation scheme and returning to execute the relevant steps realizes the automation and intelligence of the generation of the pre-allocation scheme.

[0027] The present application discloses a method for evaluating the demand for cleaning sheets. By evaluating the supply cleaning sheet information and the required cleaning sheet information, the pre-allocation scheme is adjusted, thereby avoiding the invalid time consumption caused by the deletion of the entire task action sequence due to the lack of cleaning sheets during the algorithm planning process; the technical solution of the present invention evaluates the demand for cleaning sheets before the wafer scheduling algorithm planning, which not only ensures that the function of the wafer scheduling algorithm is not affected, but also ensures the stability of production capacity; in addition, the technical solution of the present invention has the characteristics of rapid evaluation and can complete the evaluation of the cleaning sheet missing task in an extremely short time (only 2 milliseconds).

[0028] Furthermore, the second embodiment of the method for evaluating the demand for cleaning sheets in the embodiments of the present invention includes: 201. Obtain the material information of the production task and the configuration information of the processing chamber. The material information includes the number of production subtasks, the path recipe corresponding to the production subtask, and the number of wafers to be processed; the configuration information includes the number of processing chambers, the path recipe corresponding to the processing chamber, the initial processing cumulative value, and the cumulative processing limit value; In this embodiment, the path recipes of all wafers to be processed within the production subtask need to be consistent with the path recipe of the processing chamber to avoid conflicts between the production subtask and the configuration of the processing chamber during the execution process.

[0029] 202. Confirm the upper limit value of the first type of cleaning group number according to the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value. 203. Confirm the upper limit value of the second type of cleaning group number according to the number of wafers to be processed and the number of processing chambers. In this embodiment, according to the preset cleaning rules for processing chambers, it can be clearly seen that Predryclean, Dummy cleaning, and Postdryclean only need to be executed before and after the production subtask enters the processing chamber. Therefore, once the cleaning requirements are specified in the wafer path recipe of the production subtask, the more processing chambers involved when the production subtask starts, the more Predryclean, Dummy cleaning, and Postdryclean cleaning group numbers are required, which in turn leads to an increase in the number of cleaning wafers required. Through analysis, it is obtained that for a production subtask containing w_num wafers that needs to pass through ch_num processing chambers in parallel, the upper limit value of the Predryclean, Dummy cleaning, and Postdryclean cleaning group numbers is min(w_num, ch_num), that is, the maximum value of the total cleaning group numbers depends on the smaller value of w_num and ch_num.

[0030] Next, ILC cleaning and ILCDummy cleaning are related to the cumulative processing limit value (ilc_limit) in the wafer path recipe of the production subtask. When the number of process times of the production subtask accumulated in the processing chamber reaches ilc_limit, a set of ILC and ILCDummy cleaning will be generated. Therefore, during the generation of the pre-allocation scheme, if the number of wafers in the production subtask is fixed, the number of ILC and ILCDummy cleaning should be increased as much as possible. Analysis shows that in a production subtask containing w_num wafers, if the initial cumulative value (ilc_init) of the processing chamber is 0, the upper limit value of the ILC and ILCDummy cleaning group numbers that can be generated is int(w_num / ilc_limit), that is, if the ilc_init value is not 0, the upper limit value will be greater than int(w_num / ilc_limit), resulting in additional ILC and ILCDummy cleaning. The specific quantity depends on the ilc_init value and the remaining number of wafers w_num - int(w_num / ilc_limit)*ilc_limit. Here, int represents the rounding function, which is used to convert the division result into an integer. That is, when ilc_init is 0, the maximum number of ILC and ILCDummy cleaning group numbers that can be generated is the result of rounding down the number of wafers to be processed (w_num) divided by the cumulative processing limit value (ilc_limit) per group.

[0031] Finally, the OLC cleaning and OLCDummy cleaning configuration information is carried out in the processing chamber, which occurs when the used processing chamber is cleaned after the production task ends; when the cumulative process count olc_count accumulates to the olc_limit value, a set of OLC cleaning and OLCDummy cleaning will be generated; therefore, when calculating the maximum number of OLC and OLCDummy cleaning groups, if the sum of the olc_count of the processing chamber and the maximum number of wafers that the processing chamber can process in the production task exceeds olc_limit, a set of OLC and OLCDummy cleaning operations for this processing chamber needs to be calculated, that is, the upper limit of the total number of cleaning groups is still min(w_num, ch_num).

[0032] Based on the analysis of the upper limit values of the number of cleaning groups for each type, the 7 types of cleaning with cleaning wafers covered by the preset processing chamber cleaning rules are divided into two categories; the first category is ILC type cleaning, including ILC cleaning and ILCDummy cleaning, and the upper limit value of the number of cleaning groups of the first type is recorded as ILC_max = int(w_num / ilc_limit); the second category is non-ILC (NILC) type cleaning, including Predryclean, Dummy cleaning, Postdryclean, OLC cleaning and OLCDummy cleaning, and the upper limit value of the number of cleaning groups of the second type is recorded as NILC_max = min(w_num, ch_num).

[0033] 204. Generate a first pre-allocation plan according to the material information and configuration information, and the number of cleaning groups of the generated first pre-allocation plan simultaneously satisfies the upper limit value of the number of cleaning groups of the first type and the upper limit value of the number of cleaning groups of the second type.

[0034] Please refer to Figure 3 , the third embodiment of the cleaning wafer demand assessment method in the embodiments of the present invention includes:[[]] 301. Generate a first allocation plan based on the upper limit value of the number of cleaning groups of the first type and the number of processing chambers; 302. Calculate the remaining number of wafers to be processed based on the number of wafers to be processed and the number of wafers to be processed included in the first allocation plan; 303. Generate a second allocation plan based on the initial processing cumulative value, the upper limit value of the number of cleaning groups of the first type and the remaining number of wafers to be processed; 304. Determine whether the sum of the number of cleaning groups of the first allocation plan and the number of cleaning groups of the second allocation plan satisfies the upper limit value of the number of cleaning groups of the second type; 305. If it is satisfied, integrate the first allocation plan and the second allocation plan to obtain a first pre-allocation plan; 306. If not satisfied, generate a third allocation plan based on the number of processing chambers and the upper limit value of the second type of cleaning group number, and integrate the first allocation plan, the second allocation plan, and the third allocation plan to obtain a first preliminary allocation plan; In this embodiment, the production subtasks included in the production task will be sorted according to the priority and allocated in sequence. First, calculate the maximum number of ILC cleaning groups ILC_max and the maximum number of non-ILC cleaning groups NILC_max that each processing chamber can generate when the initial ilc_init is 0, and record the current cumulative process times ilc_count and olc_count of each processing chamber. Then, perform three rounds of allocation: In the first round, allocate to each processing chamber one by one in units of ilc_limit, aiming to generate the maximum number of ILC_max groups of ILC cleaning while generating as many groups of NILC cleaning as possible to reach NILC_max. In the second round, sort the parallel processing chambers in descending order of the ilc_count value, and then allocate the remaining wafers to be processed (less than ilc_limit) to the processing chambers one by one. When ilc_count reaches ilc_limit, an additional group of ILC cleaning and ILCDummy cleaning will be generated, and then allocate to the next processing chamber, and so on until all wafers to be processed are allocated. In the third round of allocation, first check whether the number of NILC cleaning groups has reached its maximum value NILC_max after all wafers to be processed are allocated. If not, add dummy wafers to the unopened processing chambers until NILC_max is reached. After each production subtask is allocated, update the ilc_count and olc_count of each processing chamber according to the number of wafers to be processed allocated to the processing chamber, as the initial processing cumulative value when allocating wafers to be processed for the next production task or production subtask. Since the above allocation process aims to maximize the two major types of cleaning, the number of cleaning wafer groups obtained by the generated first preliminary allocation plan theoretically ensures that the number of cleaning wafers required for the actual planning of the algorithm will not exceed this value, that is, the evaluated number of cleaning wafers is the upper limit value of the actual requirement.

[0035] Illustrate with an example: (1) Assume w_num = 20, ch_num = 6, ilc_limit = 3, ilc_count of Ch2 = 1, and ilc_count of the remaining processing chambers = 0. First, calculate ILC_max = int(w_num / ilc_limit) = 6, NILC_max = min(w_num, ch_num) = 6. Allocate according to the above - mentioned process. In the first round, allocate 3 wafers to be processed to each processing chamber. Sort the processing chambers in descending order of ilc_count. In the second round, preferentially allocate the remaining 2 wafers to be processed to Ch2. The number of processed times in Ch2 and the remaining 2 wafers to be processed can generate a group of ILC - type cleaning. Therefore, 7 groups of ILC - type cleaning can be achieved, that is, ILC_max + 1 = 7 groups, and the NILC - type cleaning reaches the maximum value of 6 groups. The first pre - allocation plan generated meets the requirements. (2) Assume w_num = 10, ch_num = 6, ilc_limit = 3, and ilc_init of each processing chamber = 0. First, calculate ILC_max = int(w_num / ilc_limit) = 3, NILC_max = min(w_num, ch_num) = 6. Allocate according to the above - mentioned process. In the first round, allocate 3 wafers to be processed to Ch1 / Ch2 / Ch3 respectively. In the second round, allocate the remaining 1 wafer to be processed to Ch4, and try to open as many processing chambers as possible. Since ch_num < w_num, the NILC_max has not been reached after all wafers to be processed are allocated. Therefore, in the third round, add 2 virtual wafers to be processed to Ch5 / Ch6 to make the first pre - allocation plan generated meet the requirements.

[0036] Further, the fourth embodiment of the cleaning sheet demand assessment method in the embodiments of the present invention includes: 401. Obtain the preset cleaning rules for the processing chambers; In this embodiment, the preset cleaning rules for the processing chambers are: cleaning work needs to be carried out before, during, after the execution of the production subtask, and after the production task is completed. Specifically: The cleaning before the start of the production subtask should be completed before processing the first wafer in each processing chamber. The cleaning types at this stage include Predryclean, and 0 or 1 clean / mix - type cleaning sheet can be selected for use, as well as Dummy cleaning. Dummy cleaning is carried out after Predryclean and requires 1 or more dummy / mix - type cleaning sheets, and the specific quantity is determined by the path recipe. Cleaning during the production subtask is triggered when the cumulative processing value of the processing chamber reaches a preset limit value. The cleaning types at this time include ILC cleaning, and it is also possible to choose not to use or use 1 clean / mix type cleaning sheet, as well as ILC Dummy cleaning, which is performed after ILC cleaning and requires 1 to multiple dummy / mix type cleaning sheets, and the specific quantity is determined by the path recipe; Cleaning after the production subtask is completed should be carried out after the processing of the last wafer is finished. The cleaning type is Postdryclean, and it is possible to choose not to use or use 1 clean / mix type Dummy sheet; Finally, the cleaning after the production task is completed is triggered after the production task ends. If the cumulative number of processed wafers in the processing chamber reaches olc_limit, cleaning is required. The cleaning types at this stage include OLC cleaning, and it is possible to choose not to use or use 1 clean / mix type Dummy sheet, as well as OLC Dummy cleaning, which is performed after OLC cleaning and requires 1 to multiple dummy / mix type cleaning sheets, and the specific quantity is determined by the path recipe.

[0037] 402. Confirm the required cleaning sheet information based on the preset cleaning rules of the processing chamber and the generated first pre-allocation plan. The required cleaning sheet information includes the type of the required cleaning sheet and the quantity corresponding to the type; In this embodiment, by accurately confirming the information of the required cleaning sheets according to the preset cleaning rules of the processing chamber and the generated first pre-allocation plan, not only the accuracy and efficiency of cleaning sheet allocation are improved, but also the problems of insufficient cleaning or resource waste caused by manual judgment errors or improper operations are effectively avoided, thereby improving the cleaning quality of the processing chamber and the overall production efficiency.

[0038] Furthermore, the fifth embodiment of the cleaning sheet requirement assessment method in the embodiment of the present invention includes: 501. If the cleaning sheet supply information can meet the required cleaning sheet information, execute the production task based on the generated first pre-allocation plan; 502. When the production task ends, update the cleaning sheet supply information based on the required cleaning sheet information; In this embodiment, when the production task is successfully completed, the cleaning sheet supply information is updated in a timely manner based on the latest required cleaning sheet information, ensuring the timeliness and accuracy of the supply cleaning sheet information, providing reliable data support for subsequent production tasks, and ensuring the dynamic balance between the supply and demand of cleaning sheets.

[0039] Furthermore, the sixth embodiment of the cleaning sheet requirement assessment method in the embodiment of the present invention includes: 601. If the production task is in progress, reduce the number of processing chambers to adjust the configuration information of the processing chambers; In this embodiment, when generating the first second pre-allocation plan, one processing chamber can be disabled first according to the path recipe; if the required cleaning sheet information corresponding to the first generated second pre-allocation plan still cannot be satisfied by the supplied cleaning sheet information, then one more processing chamber is disabled according to the path recipe, that is, two processing chambers are disabled, and so on.

[0040] 602. Confirm the upper limit value of the first type of cleaning group number according to the number of wafers to be processed, the initial processing cumulative value, and the cumulative processing limit value; 603. Confirm the upper limit value of the second type of cleaning group number according to the number of wafers to be processed and the adjusted number of processing chambers; 604. Generate a second pre-allocation plan according to the material information and the configuration information, and the number of cleaning groups of the generated second pre-allocation plan simultaneously satisfies the upper limit value of the first type of cleaning group number and the upper limit value of the second type of cleaning group number; In this embodiment, the generation method of the second pre-allocation plan refers to the generation method of the above-mentioned first pre-allocation plan. When the required cleaning sheet information confirmed by the second pre-allocation plan can be satisfied by the cleaning sheet supply information, generate a constraint condition to adjust the material information of the production task, and the constraint condition includes a set of production subtasks that cannot be executed and information on processing chambers that are prohibited from entering.

[0041] The cleaning sheet demand evaluation method in the embodiment of the present invention is described above. Next, the cleaning sheet demand evaluation device in the embodiment of the present invention will be described. Please refer to Figure 4 , an embodiment of the cleaning sheet demand evaluation device in the embodiment of the present invention includes: The first generation module 701 is used to obtain the material information and the configuration information of the processing chambers of the production task, and generate a first pre-allocation plan based on the material information and the configuration information; The confirmation module 702 is used to confirm the required cleaning sheet information based on the generated first pre-allocation plan, and the required cleaning sheet information includes the type of the required cleaning sheet and the quantity corresponding to the type; The first judgment module 703 is used to obtain the cleaning sheet supply information and judge whether the cleaning sheet supply information can satisfy the required cleaning sheet information; The second judgment module 704 is used to judge whether the production task is in progress if it cannot be satisfied; The second generation module 705 is used to, if the production task is in progress, adjust the configuration information of the processing chambers, and generate a second pre-allocation plan based on the material information and the adjusted configuration information; An iterative module 706 is configured to replace the first pre-allocation scheme with the second pre-allocation scheme and return to execute the confirmation requirement cleaning sheet information based on the generated first pre-allocation scheme.

[0042] Based on the same idea as the method in the above embodiment, the device provided in this application can implement the method of the above embodiment.

[0043] Above Figure 4 The cleaning sheet requirement evaluation device in the embodiment of the present invention is described in detail from the perspective of modular functional entities. Next, the cleaning sheet requirement evaluation device in the embodiment of the present invention will be described in detail from the perspective of hardware processing.

[0044] Figure 5 FIG. is a schematic structural diagram of a cleaning sheet requirement evaluation device provided by an embodiment of the present invention. The cleaning sheet requirement evaluation device 800 may vary greatly due to different configurations or performances, and may include one or more processors (central processing units, CPUs) 810 (for example, one or more processors) and a memory 820, and one or more storage media 830 for storing application programs 833 or data 832 (for example, one or more mass storage devices). Among them, the memory 820 and the storage media 830 may be transient storage or persistent storage. The program stored in the storage media 830 may include one or more modules (not shown in the figure), and each module may include a series of instruction operations on the cleaning sheet requirement evaluation device 800. Further, the processor 810 may be configured to communicate with the storage media 830 and execute a series of instruction operations in the storage media 830 on the cleaning sheet requirement evaluation device 800 to implement the steps of the cleaning sheet requirement evaluation method provided in the above method embodiments.

[0045] The cleaning sheet requirement evaluation device 800 may further include one or more power supplies 840, one or more wired or wireless network interfaces 850, one or more input / output interfaces 860, and / or one or more operating systems 831, such as Windows Serve, Mac OS X, Unix, Linux, FreeBSD, and so on. Those skilled in the art can understand that Figure 5 The shown structure of the cleaning sheet requirement evaluation device does not constitute a limitation on the cleaning sheet requirement evaluation device, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0046] The present invention also provides a computer-readable storage medium, which may be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium. Instructions are stored in the computer-readable storage medium. When the instructions are run on a computer, the computer is caused to execute the steps of the cleaning sheet demand assessment method.

[0047] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described system, device, or unit can refer to the corresponding processes in the foregoing method embodiments and will not be described herein again.

[0048] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0049] Finally, it should be noted that the above are only preferred examples of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for evaluating the demand for cleaning tablets, characterized in that: include: Acquire material information of the production task and configuration information of the processing chamber, and generate a first pre-allocation plan based on the material information and the configuration information; confirming the required cleaning tablet information based on the generated first pre-allocation scheme, the required cleaning tablet information including the type of the required cleaning tablet and the quantity corresponding to the type; Acquire cleaning sheet supply information, and determine whether the cleaning sheet supply information can meet the required cleaning sheet information; If it cannot be met, it is determined whether the production task is in progress; If the production task is in progress, the configuration information of the processing chamber is adjusted, and a second pre-allocation plan is generated based on the material information and the adjusted configuration information; The second pre-allocation scheme is adopted to replace the first pre-allocation scheme, and the process returns to confirm the required cleaning sheet information based on the generated first pre-allocation scheme.

2. The cleaning sheet demand assessment method according to claim 1, characterized in that: The obtaining of material information of the production task and configuration information of the processing chamber, and generating a first pre-allocation scheme based on the material information and the configuration information, comprises: Obtaining material information of the production task and configuration information of the processing chamber, wherein the material information includes the number of production subtasks, the path formula corresponding to the production subtasks, and the number of wafers to be processed; the configuration information includes the number of processing chambers, the path formula corresponding to the processing chambers, the initial processing cumulative value, and the cumulative processing limit value; Determine the upper limit of the number of first-type cleaning groups according to the number of wafers to be processed, the initial processing cumulative value and the cumulative processing limit value; Determine the upper limit of the number of second type cleaning groups according to the number of wafers to be processed and the number of processing chambers; A first pre-allocation scheme is generated according to the material information and the configuration information, wherein the number of cleaning groups of the generated first pre-allocation scheme satisfies both an upper limit value of the number of first-type cleaning groups and an upper limit value of the number of second-type cleaning groups.

3. The cleaning sheet demand assessment method according to claim 2, characterized in that: The generating of the first pre-allocation scheme according to the material information and the configuration information, wherein the number of cleaning groups of the generated first pre-allocation scheme satisfies both the upper limit of the number of first-type cleaning groups and the upper limit of the number of second-type cleaning groups, comprises: generating a first allocation plan based on an upper limit value of the number of first-type cleaning groups and the number of processing chambers; Calculating the remaining number of wafers to be processed based on the number of wafers to be processed and the number of wafers to be processed included in the first allocation plan; Generate a second allocation plan based on the initial processing cumulative value, the upper limit of the number of first-type cleaning groups, and the number of remaining wafers to be processed; Determine whether the sum of the number of cleaning groups of the first allocation scheme and the number of cleaning groups of the second allocation scheme meets the upper limit of the number of cleaning groups of the second type; If satisfied, the first allocation plan and the second allocation plan are integrated to obtain a first pre-allocation plan; If not, a third allocation scheme is generated based on the number of processing chambers and the upper limit of the number of second-type cleaning groups, and the first allocation scheme, the second allocation scheme and the third allocation scheme are integrated to obtain a first preliminary allocation scheme.

4. The cleaning sheet demand assessment method according to claim 1, characterized in that: The step of confirming the required cleaning tablet information based on the generated first pre-allocation scheme, wherein the required cleaning tablet information includes the type of the required cleaning tablet and the quantity corresponding to the type, includes: Obtaining preset processing chamber cleaning rules; The required cleaning sheet information is confirmed based on the preset processing chamber cleaning rule and the generated first pre-allocation scheme, where the required cleaning sheet information includes the type of the required cleaning sheet and the quantity corresponding to the type.

5. The cleaning sheet demand assessment method according to claim 1, characterized in that: The step of obtaining the cleaning sheet supply information and determining whether the cleaning sheet supply information can meet the required cleaning sheet information further includes: If the cleaning sheet supply information can satisfy the required cleaning sheet information, executing the production task based on the generated first pre-allocation scheme; When the production task is completed, the cleaning sheet supply information is updated based on the required cleaning sheet information.

6. The cleaning sheet demand assessment method according to claim 1, characterized in that: If the above cannot be met, it is determined whether the production task is in progress, and then includes: If the production task is not carried out, the production task will be stopped and the material information corresponding to the production task will be output.

7. The cleaning sheet demand assessment method according to claim 2, characterized in that: If the production task is in progress, the configuration information of the processing chamber is adjusted, and a second pre-allocation scheme is generated based on the material information and the adjusted configuration information, including: If the production task is in progress, the number of processing chambers is reduced to adjust the configuration information of the processing chambers; Determine the upper limit of the number of first-type cleaning groups according to the number of wafers to be processed, the initial processing cumulative value and the cumulative processing limit value; Determine the upper limit of the number of second type cleaning groups according to the number of wafers to be processed and the number of processing chambers after adjustment; A second pre-allocation scheme is generated according to the material information and the configuration information, wherein the number of cleaning groups of the generated second pre-allocation scheme satisfies both an upper limit value of the number of first-type cleaning groups and an upper limit value of the number of second-type cleaning groups.

8. A cleaning sheet demand assessment device, characterized in that: include: A first generating module, used for acquiring material information of a production task and configuration information of a processing chamber, and generating a first pre-allocation plan based on the material information and the configuration information; a confirmation module, configured to confirm the required cleaning tablet information based on the generated first pre-allocation scheme, wherein the required cleaning tablet information includes the type of the required cleaning tablet and the quantity corresponding to the type; A first judgment module is used to obtain the cleaning sheet supply information and judge whether the cleaning sheet supply information can meet the required cleaning sheet information; The second judgment module is used to judge whether the production task is in progress if the requirement cannot be met; A second generating module, used for adjusting the configuration information of the processing chamber if the production task is in progress, and generating a second pre-allocation plan based on the material information and the adjusted configuration information; The iteration module is used to replace the first pre-allocation scheme with the second pre-allocation scheme, and return to confirm the required cleaning sheet information based on the generated first pre-allocation scheme.

9. A cleaning sheet demand assessment device, characterized in that: The cleaning sheet demand assessment device comprises: a memory and at least one processor, wherein instructions are stored in the memory; At least one of the processors calls the instructions in the memory to enable the cleaning sheet requirement assessment device to perform each step of the cleaning sheet requirement assessment method according to any one of claims 1 to 7.

10. A computer-readable storage medium having instructions stored thereon, characterized in that: When the instructions are executed by a processor, the steps of the cleaning sheet requirement assessment method according to any one of claims 1 to 7 are implemented.

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