Heating mantle and heating device

Abstract

The invention provides a heating cover, and relates to the technical field of printed circuit board assemblies, and the heating cover comprises a cover body, a heat conduction unit and a soaking unit. A covering end is arranged at the bottom of the cover body, an opening is formed in the top, and the opening area of the opening is smaller than the sectional area of the covering end; at least part of the heat conduction unit extends into the cover body from the opening and comprises a heat conduction end located in the cover body and a connecting end connected with an external heating mechanism, and the heat conduction end is provided with a plurality of first heat conduction holes distributed at intervals in the circumferential direction of the heat conduction end; the soaking unit is arranged in the covering end, a soaking cavity is defined by the soaking unit, the inner wall of the cover body and the heat conduction end, a plurality of first soaking holes are formed in the edge area of the soaking unit at intervals, and the first soaking holes extend perpendicular to the cross section of the covering end. The invention further provides a heating device which comprises the heating mechanism and the heating cover.

Description

Technical Field

[0001] This application relates to the technical field of printed circuit board assemblies, specifically including the soldering of chips in the ball grid array package category, and more specifically relates to a heating cover and a heating device. Background Art

[0002] With the iterative upgrade of the computing power of electronic products, more and more main computing unit devices such as CPUs, GPUs, and DPUs are used. Chips of this type widely adopt the ball grid array (BGA) packaging technology. Due to the large number of solder joints and large heat capacity, the required heat input significantly increases, resulting in severe challenges for chips (BGA packaged devices) using the ball grid array packaging technology during soldering and rework.

[0003] The local heating of traditional hot air guns is limited by low thermal efficiency and insufficient temperature control accuracy, and it is difficult to meet the requirements of uniform heating. The existing local heating cover technology combines an external expanded cavity with a central heating hole and a full-hole heat sink design. Although local heating can be achieved, in the soldering of BGA packaged devices, due to the thermal resistance effect caused by the thickness of the BGA packaged device body, there is a heating lag of 5 - 10 seconds for the solder balls in the central area, forming a temperature gradient of more than 5°C with the surrounding area, and the larger the device size, the more significant the deterioration of the thermal field uniformity; secondly, the full-through hole design of the heat sink forces the hot air flow field to concentrate on the center and blow directly, mismatching with the actual heat coupling path of the BGA packaged device that depends on the gaps around to conduct heat to the center, resulting in redundant heat accumulation in the central area and attenuation of the heat conduction efficiency at the edge, increasing heat loss and delaying the overall temperature rise; in addition, during use, a gap needs to be left between the bottom end of the hot air cover and the circuit board to discharge hot air, but the concentrated hot air of local heating will diffuse around parallel to the plate surface, generating a lateral blowing force that easily causes displacement of small resistor-capacitor devices or damage to thermosensitive devices near the welding device, leading to secondary soldering defects. This severely restricts the yield, rework efficiency, and long-term reliability of high-density BGA packaged devices.

[0004] Therefore, there is an urgent need for a heating cover for chips using the ball grid array packaging technology to optimize the thermal field distribution, improve the energy utilization rate, and eliminate hot air interference to meet the precise soldering requirements of advanced packaging chips. Summary of the Invention

[0005] In view of the above problems, this application provides a heating cover and a heating device set according to the body structure and welding heat conduction principle of chips using the ball grid array packaging technology, which improves the heating efficiency and does not affect adjacent devices.

[0006] According to the first aspect of the present application, a heating cover is provided, including a cover body, a heat conduction unit, and a heat equalization unit: a covering end is provided at the bottom of the cover body, and an opening is provided at the top. The opening area of the opening is smaller than the cross-sectional area of the covering end; at least a part of the heat conduction unit extends into the cover body through the opening, including a heat conduction end located inside the cover body and a connection end connected to an external heating mechanism. A plurality of first heat conduction holes are provided at the heat conduction end and are spaced circumferentially along the heat conduction end; the heat equalization unit is arranged inside the covering end and encloses a heat equalization cavity with the inner wall of the cover body and the heat conduction end. A plurality of first heat equalization holes are spaced at the edge area of the heat equalization unit, and the plurality of first heat equalization holes extend perpendicular to the cross-section of the covering end.

[0007] According to an embodiment of the present application, a second heat conduction hole is provided at the center of the end face of the heat conduction end, and a second heat equalization hole is provided at the center of the heat equalization unit. The second heat conduction hole and the second heat equalization hole are coaxial.

[0008] According to an embodiment of the present application, the total cross-sectional area of the plurality of first heat equalization holes is larger than the cross-sectional area of the second heat equalization hole.

[0009] According to an embodiment of the present application, the first heat conduction holes are provided at the connection positions of the end plate and the side plate of the heat conduction end.

[0010] According to an embodiment of the present application, a plurality of heat overflow ports are provided at the bottom of the side wall of the covering end, and the plurality of heat overflow ports are spaced parallel to the edge of the covering end.

[0011] According to an embodiment of the present application, the heating cover further includes a heat insulation plate, which is arranged outside the covering end and extends obliquely upward from below the plurality of heat overflow ports.

[0012] According to an embodiment of the present application, the upper end of the heat insulation plate is at least higher than the upper edge of the heat overflow port to change the flow direction of the heat medium overflowing from the heat overflow port, so that the heat medium is away from the devices around the chip.

[0013] According to an embodiment of the present application, the included angle between the heat insulation plate and the vertical direction is 15° to 60°.

[0014] According to an embodiment of the present application, the heating cover further includes a mounting member, which is arranged at the connection end and is used to connect the heating mechanism.

[0015] According to the second aspect of the present application, a heat device is provided, including a heating mechanism and the above-mentioned heating cover. The heating mechanism is configured to generate a heat medium; the heating cover is arranged at the output end of the heating mechanism and is configured to guide the heat medium to heat the chip on the circuit board and the solder located between the chip and the circuit board.

[0016] The heating cover provided by the embodiment of the present application effectively solves the problems of thermal resistance effect and thermal field uniformity in the soldering of chips in the ball grid array packaging technology through the collaborative design of the cover body, the heat conduction unit, and the heat equalization unit. The heat equalization cavity formed inside the cover body, in cooperation with a plurality of first heat conduction holes and a plurality of first heat equalization holes, evenly disperses the heat medium produced by the external heating mechanism to the peripheral edge regions of the covered end, so as to heat the side of the covered chip and the solder between the chip and the circuit board, improving the problems of less heat medium flow in the circumferential region of the existing hot air cover and low heat conduction efficiency of the thermal resistance of the chip using the ball grid array packaging technology, ensuring that heat is evenly conducted from the surrounding gaps to the center, thereby significantly reducing the heating lag of the solder in the central region and improving the thermal field uniformity. In addition, the heat equalization unit optimizes the heat medium flow path, avoids redundant heat accumulation in the central region and attenuation of heat conduction efficiency at the edge, reduces heat loss and accelerates the overall temperature rise, ensures efficient and uniform heating of the chips and solder using the ball grid array packaging technology, and significantly improves the soldering quality and process reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Through the following description of the embodiments of the present application with reference to the drawings, the above content and other objects, features, and advantages of the present application will become clearer. In the drawings:

[0018] Figure 1 A perspective view of the heating cover according to an embodiment of the present application is schematically shown;

[0019] Figure 2 A perspective view of a partially cut-away heating cover according to an embodiment of the present application is schematically shown;

[0020] Figure 3 An exploded view of the heating cover according to an embodiment of the present application is schematically shown;

[0021] Figure 4 A perspective view of the cover body according to an embodiment of the present application is schematically shown.

[0022] Figure 5 A perspective view of the heat conduction unit according to an embodiment of the present application is schematically shown;

[0023] Figure 6 A perspective view of the heat equalization unit according to an embodiment of the present application is schematically shown;

[0024] Figure 7 A flow diagram of the heat medium inside the heating cover according to an embodiment of the present application is schematically shown;

[0025] Figure 8 A perspective view of the mounting member according to an embodiment of the present application is schematically shown.

[0026] In the above-mentioned drawings, the specific meanings of the reference numerals are as follows:

[0027] 1. Cover body;

[0028] 11. Covering end;

[0029] 12. Opening;

[0030] 13. Heat overflow port;

[0031] 14. First connecting member;

[0032] 2. Heat conduction unit;

[0033] 21. Heat conduction end;

[0034] 22. Connection end;

[0035] 23. First heat conduction hole;

[0036] 24. Second heat conduction hole;

[0037] 25. Second connecting member;

[0038] 3. Heat equalizing unit;

[0039] 31. First heat equalizing hole;

[0040] 32. Second heat equalizing hole;

[0041] 33. Third connecting member;

[0042] 4. Heat equalizing cavity;

[0043] 5. Heat insulation board;

[0044] 6. Mounting member;

[0045] 61. Mounting hole;

[0046] 7. Chip;

[0047] 8. Solder;

[0048] 9. Circuit board. Detailed implementation manners

[0049] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present application. In the following detailed description, for the sake of explanation, numerous specific details are set forth in order to provide a comprehensive understanding of the embodiments of the present application. However, it is obvious that one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily obscuring the concepts of the present application.

[0050] The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the present application. The terms "including", "comprising", etc. as used herein indicate the presence of the described features, steps, operations, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

[0051] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those of ordinary skill in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0052] In the case of using expressions such as "at least one of A, B, and C, etc.", generally it should be interpreted according to the meaning commonly understood by those of ordinary skill in the art (for example, "a system having at least one of A, B, and C" should include, but not be limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0053] Existing heating covers generally adopt a cavity structure design, and their outer contour usually exceeds the chip body by 0.5 - 1 mm. It is mainly composed of a central air inlet hole and a heat sink plate assembly. During operation, hot air is injected into the cavity through the air inlet hole, and after heat flow distribution through the uniformly distributed through-hole structure on the surface of the heat sink plate, the device is heated. Although this solution can achieve the local heating function, there are significant technical defects when dealing with the soldering or rework of chips using the Ball Grid Array (BGA) packaging technology (i.e., BGA packaged devices).

[0054] Among them, the three-dimensional stacked structure of BGA packaged devices forms a large thermal resistance barrier, resulting in the temperature rise rate of the solder at the bottom central area (mainly in the form of solder balls) being significantly lagged behind that of the surrounding exposed solder. In the measured data, under the same heat input conditions, there is a temperature difference advantage of about 5 °C between the peripheral solder and the central area, and the time to reach the soldering temperature is advanced by 5 - 10 seconds. This uneven thermal field distribution phenomenon deteriorates exponentially with the increase in device size, seriously affecting the uniform formation of the alloy layer at the welding interface.

[0055] Among them, this is because the above-mentioned thermal resistance structure causes the temperature rise in the central area of BGA packaged devices to mainly rely on the lateral conduction of heat along the sidewalls of the device and the gap between the circuit boards, rather than the ideal direct conduction along the vertical direction of the body. The existing solution adopts a heat sink plate structure with uniformly opened holes throughout the area, combined with a heat flow distribution method with central air inlet, which essentially forms a contradictory distribution with too high heat flow density in the central area and insufficient heat supply in the edge area. This thermal field configuration has a structural contradiction with the three-dimensional heat conduction path characteristics of BGA packaged devices, not only causing ineffective heat accumulation in the central area but also exacerbating the uneven heating of the overall device.

[0056] Furthermore, there is a 1 mm gap between the bottom surface of the current heating cover and the circuit board to control heat dissipation. During actual use, due to local heating, heat dissipation around the heating cover is inevitable. During the heat dissipation process, since the heat dissipates parallel to the circuit board, a relatively large lateral blowing force will be generated on the small resistor-capacitor components around the BGA package device, resulting in frequent phenomena such as the small resistor-capacitor components being blown away or some heat-sensitive devices being scalded, thus causing secondary soldering defects.

[0057] In view of the structural characteristics and welding heat conduction mechanism of the chip using the ball grid array packaging technology, the present application proposes a heating cover, aiming to solve at least some of the above technical problems of the traditional heating cover.

[0058] Figure 1 Schematically shows a perspective view of the heating cover according to an embodiment of the present application; Figure 2 Schematically shows a perspective view of a partial cross-section of the heating cover according to an embodiment of the present application; Figure 3 Schematically shows an exploded view of the heating cover according to an embodiment of the present application.

[0059] As Figures 1 to 3 shown, an embodiment of the present application provides a heating cover, which is applicable to a heating device for heating a chip 7 and solder 8 using the ball grid array packaging technology, including a cover body 1, a heat conduction unit 2 and a heat equalization unit 3. A covering end 11 is provided at the bottom of the cover body 1, and an opening 12 is provided at the top. The opening area of the opening 12 is smaller than the cross-sectional area of the covering end 11; at least a part of the heat conduction unit 2 extends into the cover body 1 through the opening 12, including a heat conduction end 21 located inside the cover body 1 and a connection end 22 connected to an external heating mechanism. A plurality of first heat conduction holes 23 are provided on the heat conduction end 21 at intervals along the circumference of the heat conduction end 21; the heat equalization unit 3 is arranged inside the covering end 11, and together with the inner wall of the cover body 1 and the heat conduction end 21, a heat equalization cavity 4 is formed. A plurality of first heat equalization holes 31 are provided at intervals in the edge area of the heat equalization unit 3, and the plurality of first heat equalization holes 31 extend perpendicular to the cross-section of the covering end 11.

[0060] Specifically, the heat medium generated by the external heating mechanism diffuses to the circumferential area at the edge of the heat equalization cavity 4 through the heat conduction unit 2 and the plurality of first heat conduction holes 23 provided on the heat conduction unit 2, and is evenly guided to the side and top of the chip 7 through the plurality of first heat equalization holes 31 of the heat equalization unit 3.

[0061] According to the above setting method, through the collaborative design of the cover body 1, the heat conduction unit 2 and the heat equalizing unit 3, efficient and uniform heat transfer and distribution are achieved. A covering end 11 is provided at the bottom of the cover body 1. The heat conduction unit 2 extends into the cover body 1 through the top opening 12, and efficiently introduces external heat medium into the heat equalizing cavity 4 through a plurality of first heat conduction holes 23 distributed at circumferential intervals; the heat equalizing unit 3 and the inner wall of the cover body 1 and the heat conduction end 21 enclose the heat equalizing cavity 4, and a plurality of first heat equalizing holes 31 are arranged in its edge area to ensure that heat is evenly distributed to the side of the chip 7 and the solder 8 between the chip 7 and the circuit board 9. The overall structure is compact, the heat field distribution is optimized, and it is applicable to the heating scenarios of the chip 7 and the solder 8 in the ball grid array packaging technology with high requirements for heating uniformity and energy efficiency, significantly improving the heating efficiency and quality.

[0062] Figure 4 Schematically shows a perspective view of the cover body 1 according to an embodiment of the present application.

[0063] In a schematic embodiment, as Figure 4 shown, the cover body 1 of the heating cover adopts an inverted cup-shaped structure, and the bottom is an open covering end 11. Among them, the specific shape structure and size of the covering end 11 are customized according to the shape and size of the chip 7 to be heated to ensure the perfect adaptation of the heating device to the target chip 7.

[0064] Specifically, in order to achieve efficient and uniform heating of the chip 7 body and the bottom solder 8, the shape of the cover body 1 is strictly matched with the shape of the chip 7 to be heated. At the same time, the size of the covering end 11 is slightly larger than the outer contour of the chip 7 to ensure that the cover body 1 can completely cover the chip 7 without causing interference or thermal influence to other surrounding devices. It not only ensures the heating effect and efficiency, but also avoids potential damage to adjacent devices caused by heat field diffusion.

[0065] In a schematic embodiment, the cover body 1 is made of a high-temperature resistant alloy material.

[0066] Figure 5 Schematically shows a perspective view of the heat conduction unit according to an embodiment of the present application.

[0067] In a schematic embodiment, as Figure 1 、 Figure 4 and Figure 5 shown, the shape of the opening 12 matches the cross-section of the heat conduction unit 2. Among them, the shape of the opening 12 is not limited to a square, and can also be circular or other geometric shapes to adapt to the outer contour of different target heating areas; correspondingly, the shape of the heat conduction unit 2 is optimized according to the shape of the opening 12 to ensure efficient heat transfer and uniform distribution. This flexible design not only improves the heat transfer efficiency of the heating device, but also expands its application scenarios, enabling it to adapt to a variety of heating requirements, while optimizing the overall structure, reducing energy loss, and significantly improving the heating efficiency and quality.

[0068] In a schematic embodiment, as Figure 5 shown, the first heat conduction holes 23 are arranged at the connection positions of the end plate and the side plate (i.e., the end face and the side wall) of the heat conduction end 21, that is, the openings of the first heat conduction holes 23 face the outer peripheral direction of the heat conduction end 21 and the lower part of the heat conduction end 21, so as to guide the heat medium to the circumferential edge and the bottom of the heat sink cavity 4, wherein the heat medium comes from an external heating mechanism.

[0069] According to the above setting method, the external heat medium can be efficiently guided to the circumferential edge and the bottom of the heat sink cavity 4, ensuring uniform distribution of heat in the heat sink cavity 4. By guiding the heat medium to the circumferential edge and the bottom and cooperating with the first heat conduction holes 23, the concentration of heat in the middle region is effectively avoided, and at the same time, the heating effect in the edge region is enhanced, thereby improving the overall heating uniformity and efficiency.

[0070] According to an embodiment of the present disclosure, as Figure 5 shown, the cross section of the heat conduction unit 2 is square, and the first heat conduction holes 23 are arranged at the four corners of the heat conduction end 21, which can uniformly guide the heat medium to the adjacent two side plates and the end plate, but the present application is not limited thereto, and the first heat conduction holes 23 can also be arranged at the connection positions of the end plate and the side plate (i.e., the edges of the heat conduction end 21).

[0071] In a schematic embodiment, the central axis of the heat conduction unit 2 coincides with the central axis of the cover body 1, so that the two sides of the formed heat sink cavity 4 symmetric about the central axis have the same size. This symmetric design can ensure uniform distribution of heat in the heat sink cavity 4 and avoid local heat concentration or uneven distribution caused by asymmetric structure. Through the coincidence of the central axes, the heat medium can be efficiently transferred from the heat conduction unit 2 to each region of the heat sink cavity 4, and at the same time, the overall stability and heating efficiency of the heating device are enhanced. This optimized design significantly improves the heating uniformity and thermal energy utilization rate, and is applicable to scenarios with high requirements for heating accuracy and uniformity.

[0072] Figure 6 Schematically shows a three-dimensional view of the heat sink unit according to an embodiment of the present application.

[0073] In a schematic embodiment, a plurality of first heat sink holes 31 are configured as multiple rows of holes arranged at intervals in the edge region of the heat sink unit 3, forming a multi-layered annular distribution at the edge of the heat sink unit 3.

[0074] Specifically, as Figure 2 and Figure 6As shown, the soaking unit 2 and the cover 1 are configured in the same square structure, and two rows of first soaking holes 31 are provided in the strip-shaped area near the side edge of the soaking unit 2. This multi-row design further optimizes the uniformity of the thermal field distribution by increasing the heat medium shunt path, while reducing the local concentration phenomenon of the heat medium flow, providing a more efficient and controllable thermal field environment for the synchronous heating of the chip 7 and the solder 8.

[0075] Furthermore, in the orthographic projection perpendicular to the central axis of the cover 1, a plurality of first soaking holes 31 are distributed between the side wall of the heat conduction unit 2 and the side wall of the cover 1, that is, in the strip-shaped area where the heat conduction unit 2 and the soaking unit 3 do not overlap.

[0076] According to the above setting method, through the uniform distribution of the multi-row first soaking holes 31, the heat medium can be efficiently guided to the edge area of the covering end 21, ensuring the uniform diffusion and transfer of heat within the covering end 21. At the same time, the overlapping strip-shaped area design between the heat conduction unit 2 and the soaking unit 3 optimizes the heat conduction path, significantly improving the heating uniformity and heat energy utilization rate of the heat medium in the circumferential direction, optimizing the heat flow field distribution, realizing the uniform conduction of heat from the periphery to the center, significantly improving the thermal field uniformity, reducing heat loss, and accelerating the overall temperature rise, ensuring the efficient and uniform heating of the chip and the solder, thereby greatly improving the welding quality and process stability.

[0077] In an alternative embodiment, a plurality of first soaking holes 31 can be replaced by a plurality of soaking channels, and the plurality of soaking channels are configured to be evenly spaced along the outer peripheral edge of the soaking unit 3, guiding the heat medium to the side of the chip 7 through the evenly distributed channels to achieve a more uniform heat distribution.

[0078] In an alternative embodiment, a plurality of first soaking holes 31 can be replaced by a plurality of air guiding grille plates, and the heat medium is evenly guided to the side of the chip 7 through the air guiding channels on the air guiding grille plates to achieve a more efficient heat distribution.

[0079] In a schematic embodiment, as Figure 5 and Figure 6 shown, a second heat conduction hole 24 is provided at the center of the end face of the heat conduction end 21, and a second soaking hole 32 is provided at the center of the soaking unit 3, and the second heat conduction hole 24 and the second soaking hole 32 are coaxial.

[0080] According to the above setting method, through the coaxial arrangement of the second heat conduction hole 24 and the second soaking hole 32, the external heat medium can be efficiently guided to the central area at the top of the chip 7, and cooperate with the first heat conduction hole 23 and the first soaking hole 31 in the edge area to achieve the uniform distribution of the thermal field. At the same time, the coaxial design of the second heat conduction hole 24 and the second soaking hole 32 optimizes the heat conduction path, significantly improving the heat conduction efficiency and heating effect.

[0081] In a schematic embodiment, a plurality of second heat dissipation holes 32 are provided, and the plurality of second heat dissipation holes 32 are evenly distributed in the middle of the heat dissipation unit 3 for accurately guiding the heat medium to the central part at the top of the chip 7 to achieve efficient heating of the central area.

[0082] In a schematic embodiment, the total cross-sectional area of the plurality of first heat dissipation holes 311 is greater than the cross-sectional area of the second heat dissipation holes (32).

[0083] According to the above setting method, the heat medium passing through the second heat dissipation hole 321 can conduct downward, and does not flow completely straight up and down. Instead, most of the heat medium conducts downward through the plurality of first heat dissipation holes 311 to achieve the dispersed conduction of the heat medium. This structure optimizes the heat flow field distribution, avoids the over-concentration of the heat medium in the central area, improves the heat field uniformity, reduces the heat loss, and accelerates the overall temperature rise, thereby ensuring the efficient and uniform heating of the chip 7 and the solder 8, and greatly improving the welding quality and process stability.

[0084] In a schematic embodiment, the diameter of the second heat dissipation hole 321 is 10 mm.

[0085] Figure 7 Schematically shows the flow diagram of the heat medium in the heating cover according to the embodiment of the present application.

[0086] Specifically, according to the above setting method, as Figure 7 shown, the external heat medium is dispersed to the four peripheral edges and the central area in the cover body 1 through the first heat conduction hole 21 and the second heat conduction hole 22 of the heat conduction unit 2. At the same time, the heat dissipation unit 3 evenly outputs the heat medium, avoiding the direct blowing of the heat medium concentrated in the center of the chip 7, ensuring that the heat conducts uniformly from the gaps around the chip 7 to the center, thereby significantly reducing the heat lag of the solder 8 in the central area of the chip 7 and controlling the temperature gradient within 5 °C, improving the heat field uniformity; in addition, by optimizing the heat medium flow path, avoiding the redundant accumulation of heat in the central area and the attenuation of the heat conduction efficiency at the edge, reducing the heat loss and accelerating the overall temperature rise, ensuring the efficient and uniform heating of the chip 7 and the solder 8, and significantly improving the welding quality and process reliability.

[0087] In a schematic embodiment, as Figure 4 shown, a plurality of heat overflow ports 13 are provided at the bottom of the side wall of the covering end 11, and the plurality of heat overflow ports 13 are spaced apart parallel to the edge of the covering end for discharging a part of the heat medium in the cover body 1.

[0088] According to the above-mentioned arrangement, by arranging a plurality of heat spill ports 13 at intervals in the circumferential direction at the cover end 11, active diversion and pressure balance of the heat medium in the cover body 1 are achieved. The heat spill ports 13 discharge part of the heat medium in a directional manner to avoid overload of the heat medium in the cavity, and at the same time balance the heat field distribution through the circumferential layout to reduce lateral heat wind dissipation. While ensuring the stability of the heat field in the cover body 1, the thermal shock to the surrounding devices is effectively reduced.

[0089] According to an embodiment of the present application, the opening diameter of the heat overflow vent is 3 mm.

[0090] In an illustrative embodiment, Figure 4 As shown, the heat overflow port 13 adopts a through hole structure penetrating the side wall of the cover end 11, and a plurality of through holes are evenly distributed along the circumference of the cover end 11 to form an annular heat medium overflow channel.

[0091] In an alternative embodiment, the heat spill outlet 13 is designed as a notch structure extending upward from the bottom end surface of the cover end 11, and a plurality of notches are evenly arranged along the circumference of the cover body 1, so that the end surface of the cover end 11 presents a tooth-like profile. When the cover end 11 contacts the circuit board 9, the internal heat medium can overflow in a directional manner through the notch gap.

[0092] In another alternative embodiment, the heat overflow port 13 is further optimized to be a through groove structure extending circumferentially along the cover end 11, and the through grooves are evenly distributed on the cover end 11 to form a continuous heat medium overflow path, thereby improving the accuracy of thermal field control.

[0093] In an illustrative embodiment, Figure 1 and Figure 2 As shown, the heating cover also includes a heat insulation plate 5, which is arranged on the outer periphery of the cover end 11, and extends obliquely upward from the bottom of the multiple heat overflow ports 13 (that is, the side of the cover end 11 facing the opening 12 is upward), and is configured to block part of the heat medium discharged from the multiple heat overflow ports 13 to heat other devices around the chip 7.

[0094] According to the above-mentioned setting method, a physical barrier to the overflow of heat medium is formed by setting a heat insulation plate 5 on the periphery of the cover end 11. The inner edge of the heat insulation plate 5 is closely matched with the outer edge of the heat overflow port 13, effectively preventing the heat medium discharged from the heat overflow port 13 from diffusing to other devices around the chip 7. This design limits the lateral conduction range of the overflow heat medium to the target area through localized thermal field control, thereby improving the process safety of the heating process.

[0095] According to an embodiment of the present application, the heat insulation board 5 is made of high temperature resistant heat insulation material.

[0096] In an illustrative embodiment, the upper end of the heat insulation board 5 is at least higher than the upper edge of the heat overflow port 13 to change the flow direction of the heat medium overflowing from the heat overflow port 13 and keep the heat medium away from the devices around the chip 7 .

[0097] According to the above setting method, it effectively avoids the direct escape of the heat medium and affects the normal operation of the devices around the chip 7. At the same time, it reduces heat loss and improves the utilization rate of thermal energy. By optimizing the flow direction of the heat medium, the heat insulation plate 5 not only protects the safety of the surrounding devices, but also enhances the overall stability and heating efficiency of the heating device.

[0098] In a schematic embodiment, the heat insulation plate 5 and the cover body 1 are integrally formed.

[0099] In a schematic embodiment, as Figure 1 shown, the included angle between the heat insulation plate 5 and the vertical direction is 15 to 60°.

[0100] Specifically, the size of the included angle is determined by the height of the small resistor-capacitor devices around the chip 7. The higher the height of the surrounding devices, the smaller the included angle, and vice versa. The heat insulation plate 5 converts the flow direction of the overflowing heat from the horizontal direction to an upward slope of 15 to 60°. Through the inclined design, it guides the heat medium gas flow to discharge along a specific angle, effectively dispersing the hot air impact force. At the same time, it optimizes the heat field distribution by adjusting the angle, reduces the thermal impact on the surrounding devices, and improves the control accuracy and safety of the heating process.

[0101] In an alternative embodiment, the wind-blocking part of the heat insulation plate 5 is configured as an arc structure, and its radius of curvature smoothly transitions with the extending direction of the heat overflow port 13, and the arc surface faces the direction of the heat overflow port 13. Through this arc design, it guides the heat medium gas flow to uniformly diffuse along the tangent direction, further reducing the hot air impact force.

[0102] In an alternative embodiment, the heat insulation plate 5 adopts a right-angle profile structure, and multiple heat insulation plates 5 are uniformly distributed along the outer periphery of the cover body 1 and form a continuous channel in the circumferential direction. Part of the heat medium discharged from the heat overflow port 13 is discharged vertically upward through the directional guidance of the channel. This design optimizes the heat medium flow path through the geometric characteristics of the right-angle profile, effectively reducing the lateral escape of the heat medium. At the same time, it enhances the uniformity of the heat field distribution by using the continuous structure of the channel. This configuration significantly reduces the thermal impact on the surrounding devices and improves the energy utilization efficiency and process controllability of the heating process.

[0103] Figure 8 Schematically shows a three-dimensional view of the mounting member 6 according to an embodiment of the present application;

[0104] In a schematic embodiment, as Figure 8 shown, the heating cover further includes a mounting member 6, which is arranged at the connection end 22 and is configured to connect the heating mechanism and the heat conduction unit 2.

[0105] Specifically, the mounting member 6 is designed with a standardized interface to ensure the sealing and stability of the heat medium transmission, while simplifying the assembly and disassembly process of the heating cover. By optimizing the connection method, the reliability of the heating cover and the convenience of maintenance are improved, providing stable hardware support for efficient heat conduction.

[0106] In a schematic embodiment, as Figure 8 shown, the mounting member 6 adopts a plate-like structure, and a plurality of mounting holes 61 are evenly distributed on its surface for connecting to the output end of the heating mechanism.

[0107] Specifically, the mounting holes 61 adopt a calabash mouth positioning and opening design. This structure not only realizes quick installation and precise positioning but also ensures the firmness of the connection, effectively preventing the heating cover from loosening or falling off during use. By optimizing the structure of the mounting member 6, the assembly efficiency and connection reliability of the heating cover are significantly improved, while simplifying the maintenance operation, providing hardware guarantee for the efficient and stable operation of the heating device.

[0108] In an alternative embodiment, the mounting member 6 adopts an annular snap structure, and a plurality of symmetrically distributed elastic claws are provided on its inner wall, and hook-shaped protrusions are designed at the ends of the claws. An annular groove is provided at the corresponding position of the output end of the heating mechanism. During installation, the claws are elastically deformed by axial pressing, and automatically locked after the hook-shaped protrusions are embedded in the groove. This structure can realize one-handed quick disassembly and assembly, and at the same time ensure the sealing of the heat medium transmission through multi-point elastic contact, which is suitable for scenarios where the heating cover needs to be replaced frequently.

[0109] Furthermore, the mounting member 6 can also adopt a threaded connection structure or a quick-release pin, etc., and this application is not limited to this.

[0110] In a schematic embodiment, the cover body 1, the heat conduction unit 2, the heat equalization unit 3 and the mounting member 6 are connected by welding or bonding to form a heating cover. Specifically, as Figures 1 to 7 shown, a plurality of first connecting members 14 are circumferentially arranged at the top opening 12 of the cover body 1, a plurality of second connecting members 25 are circumferentially arranged at the connecting end 22 of the heat conduction unit 2, and a plurality of third connecting members 33 are circumferentially arranged on the heat equalization unit 3. Among them, the cover body 1 and the heat conduction unit 2 are connected through the first connecting members 14, the heat conduction unit 2 and the mounting member 6 are connected through the second connecting members 25, and the inner wall of the cover body 1 and the heat equalization unit 3 are connected through the third connecting members 33. This multi-connecting member design ensures the precise positioning and firm connection between components through a modular assembly method, while simplifying the assembly and maintenance process of the heating cover, providing a reliable structural basis for efficient heat conduction and stable operation.

[0111] An embodiment of the present application further provides a heating device, including a heating mechanism and a heating cover; the heating mechanism is configured to generate a heat medium, and the heating cover is disposed at the output end of the heating mechanism and is configured to guide the heat medium to heat the chip 7 on the circuit board 9 and the solder 8 located between the chip 7 and the circuit board 9, so that the solder 8 melts and electrically connects the chip 7 and the circuit board 9.

[0112] According to the embodiments of the present application, the heating mechanism includes, but is not limited to, a hot air gun, a hot air generator, a heating wire heater, etc.; the heat medium includes high-temperature gases, such as inert gases like air and nitrogen.

[0113] For the heating cover and the heating device of the present application, by optimizing the heat field distribution and air flow control, while ensuring the heating efficiency, the heating uniformity of the solder balls in the central area at the bottom of the chip 7 is significantly improved, achieving an ideal heating-up slope and speed; at the same time, a specially designed hot air overflow structure effectively suppresses the lateral escape of hot air, reduces the lateral blowing force on the surrounding small resistor-capacitor components, and avoids device displacement or thermal damage. Under the same heating temperature and time conditions, it can not only meet the requirements of the welding temperature curve, but also minimize the negative impact of hot air on the surrounding devices, providing an efficient and reliable solution for the welding and repair of the chip 7 using the ball grid array packaging technology, and is particularly suitable for high-density assembly scenarios.

[0114] Those skilled in the art can understand that the features described in the various embodiments of the present application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in the present application. In particular, without departing from the spirit and teachings of the present application, the features described in the various embodiments of the present application can be combined and / or combined in various ways. All such combinations and / or combinations fall within the scope of the present application.

[0115] The above describes the embodiments of the present application. However, these embodiments are only for illustrative purposes and not for limiting the scope of the present application. Although the embodiments are described separately above, this does not mean that the measures in the respective embodiments cannot be used advantageously in combination. Without departing from the scope of the present application, those skilled in the art can make various substitutions and modifications, and all such substitutions and modifications should fall within the scope of the present application.

Claims

1. A heating hood, characterized in that: include: A cover body, wherein a cover end is provided at the bottom of the cover body, and an opening is provided at the top, wherein the opening area of ​​the opening is smaller than the cross-sectional area of ​​the cover end; A heat conduction unit, at least partially extending from the opening into the cover, comprises a heat conduction end located in the cover and a connection end connected to an external heating mechanism, wherein the heat conduction end is provided with a plurality of first heat conduction holes spaced apart along the circumference of the heat conduction end; as well as A heat equalizing unit is arranged in the cover end, and forms a heat equalizing cavity with the inner wall of the cover body and the heat conducting end. A plurality of first heat equalizing holes are arranged at intervals in the edge area of ​​the heat equalizing unit, and the plurality of first heat equalizing holes extend perpendicular to the cross section of the cover end.

2. The heating hood according to claim 1, characterized in that A second heat conducting hole is arranged at the center of the end surface of the heat conducting end, a second heat averaging hole is arranged at the center of the heat averaging unit, and the second heat conducting hole and the second heat averaging hole are coaxial.

3. The heating hood according to claim 2, characterized in that The total cross-sectional area of ​​the plurality of first heat-balancing holes is greater than the cross-sectional area of ​​the second heat-balancing holes.

4. The heating mantle according to claim 1, characterized in that The first heat conduction hole is arranged at the connection position between the end plate and the side plate of the heat conduction end.

5. The heating hood according to any one of claims 1 to 4, characterized in that: A plurality of heat overflow openings are arranged at the bottom of the side wall of the cover end, and the plurality of heat overflow openings are spaced and distributed parallel to the edge of the cover end.

6. The heating mantle according to claim 5, characterized in that It also includes a heat insulation plate, which is arranged on the outer side of the cover end and extends obliquely upward from below the plurality of heat overflow ports.

7. The heating mantle according to claim 6, characterized in that The upper end of the heat insulation plate is at least higher than the upper edge of the heat overflow port, so as to change the flow direction of the heat medium overflowing from the heat overflow port and keep the heat medium away from the devices around the chip.

8. The heating mantle according to claim 6, characterized in that The angle between the heat insulation board and the vertical direction is 15-60°.

9. The heating mantle according to claim 1, characterized in that It also includes a mounting piece, which is arranged at the connecting end and is used for connecting the heating mechanism.

10. A heating device, characterized in that: include: a heating mechanism configured to generate a heat medium; as well as The heating hood according to any one of claims 1 to 9, wherein the heating hood is disposed at an output end of the heating mechanism and is configured to guide the heat medium to heat the chip on the circuit board and the solder between the chip and the circuit board.

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