Wafer transfer channel isolation device and wafer processing device

Abstract

The invention provides a wafer transfer channel isolation device and a wafer processing device, the wafer transfer channel isolation device comprises a blocking door which is arranged on a wafer transfer channel and can be opened and closed, after the blocking door is closed, a reaction chamber and the wafer transfer channel are separated in an airtight mode, and after the blocking door is opened, the wafer transfer channel is opened. According to the invention, the communication space between the wafer conveying channel and the reaction chamber can be reduced, the useless space of the process reaction can be reduced, meanwhile, retained air or other unnecessary impurities can be isolated and blocked, the vacuum property of the reaction chamber is improved, the process efficiency is improved, and the product quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing equipment, and more specifically, to a wafer transfer channel isolation device and a wafer processing device. Background Art

[0002] CVD (Chemical Vapor Deposition) is a technology that forms solid deposits on the gas phase or gas-solid interface through chemical reactions by using various energy sources such as heating, plasma excitation, or light radiation in a reaction chamber. Simply put, two or more gaseous raw materials are introduced into a reaction chamber, and then they react with each other to form a new material, which is deposited on the surface of the wafer.

[0003] In existing CVD equipment, wafers are transported through a horizontal channel connecting the outside and the reaction chamber (Chamber). A gate valve for wafers to enter is provided at the end of the transfer channel connected to the outside. The transfer channel between the gate valve and the reaction chamber is relatively long, resulting in a large space between the reaction chamber and the gate valve. This part of the space is useless space (Dead Volume) for the process, increasing the space for the process reaction, increasing the process time, affecting the stability and accuracy of the process, and reducing the product quality. Moreover, the long transfer channel space will retain air or other unnecessary particles (Particles). If they enter the reaction chamber to participate in the process, it is difficult to maintain an accurate vacuum state, which also reduces the process efficiency, affects the stability and accuracy of the process, and reduces the product quality. Summary of the Invention

[0004] In view of the above problems, the purpose of the present invention is to provide a wafer transfer channel isolation device and a wafer processing device, which add an openable and closable shutter in the wafer transfer channel, reduce the communication space between the wafer transfer channel and the reaction chamber, reduce the useless space for the process reaction, minimize the process reaction space, and at the same time isolate and block the retained air or other unnecessary impurities, improve the vacuum of the reaction chamber, improve the process efficiency, and improve the product quality.

[0005] A wafer transfer channel isolation device provided by the present invention includes an openable and closable shutter provided on the wafer transfer channel. After the shutter is closed, it hermetically separates the reaction chamber and the wafer transfer channel, and after the shutter is opened, the wafer transfer channel is opened.

[0006] The shutter is vertically provided in the wafer transfer channel.

[0007] The door blocking device includes a door panel that can move up and down. When the door blocking device is closed, the door panel moves up from the outside of the wafer transfer channel into the wafer transfer channel. When the door blocking device is opened, the door panel moves down from inside the wafer transfer channel to the outside of the wafer transfer channel.

[0008] The door blocking device further includes a lifting seat, and the lower end of the door panel is connected to the inside of the lifting seat through a lifting cylinder.

[0009] The lifting seat is fixed to the outside of the outer shell of the reaction chamber. When the door blocking device is closed, the lifting cylinder extends, and the door panel moves up through the outer shell into the wafer transfer channel. When the door blocking device is opened, the lifting cylinder retracts, and the door panel moves down into the lifting seat.

[0010] The lifting seat is a box body, the door panel is a flat door, the cylinder of the lifting cylinder is fixed to the bottom of the lifting seat, the lifting end of the lifting cylinder is connected to the lower end of the flat door, and a first door panel outlet is provided at the top of the lifting seat. The area of the first door panel outlet is the same as the cross-sectional area of the flat door, and the flat door moves up and down in the first door panel outlet.

[0011] After the flat door moves up, it is tangent to the middle of the edge of the reaction chamber and seals the cross-section of the wafer transfer channel.

[0012] The lifting seat is a box body, the door panel is an arc-shaped door, the shape of the arc-shaped door corresponds to the arc of the edge of the reaction chamber, the cylinder of the lifting cylinder is fixed to the bottom of the lifting seat, the lifting end of the lifting cylinder is connected to the lower end of the arc-shaped door, and a second door panel outlet is provided at the top of the lifting seat. The second door panel outlet has the same cross-sectional area as the arc-shaped door, and the arc-shaped door moves up and down in the second door panel outlet.

[0013] After the arc-shaped door is closed, it seals the arc-shaped opening where the reaction chamber communicates with the wafer transfer channel.

[0014] The lifting seat is an arc-shaped box body.

[0015] The material of the door panel is the same as that of the reaction chamber.

[0016] The area of the door panel is larger than the cross-sectional area of the wafer transfer channel. There is a storage groove on the peripheral wall of the wafer transfer channel that can accommodate the edge of the door panel.

[0017] On the other hand, a wafer processing apparatus provided by the present invention includes a reaction chamber for processing wafers, a gate valve for allowing wafers to enter and exit, and a wafer transfer channel disposed between the reaction chamber and the gate valve. The above-mentioned wafer transfer channel isolation device is provided on the wafer transfer channel.

[0018] By using the above-mentioned wafer transfer channel isolation device and wafer processing apparatus according to the present invention, a shutter is provided at the front end of the wafer transfer channel. The shutter can isolate the reaction chamber and the wafer transfer channel. During the process, the space of the wafer transfer channel is separated from the reaction chamber, minimizing the useless space in the reaction chamber during the process. Basically, only the space of the reaction chamber itself participates in the process, and the wafer transfer channel no longer participates in the process, minimizing the reaction chamber, reducing the process processing time, improving the equipment operation efficiency, improving the use efficiency of materials and energy, thereby improving the economy and production efficiency of the manufacturing process. The shutter can also prevent the air and particles remaining in the wafer transfer channel from entering the reaction chamber, keeping the reaction chamber pure. The original gate valve and shutter in the wafer transfer channel are used to isolate from the outside world in a dual manner, maintaining the accurate vacuum state of the reaction chamber.

[0019] The present invention improves the stability and accuracy of the CVD process, reduces the production cost of the CVD process and improves the production efficiency.

[0020] To achieve the above and related purposes, one or more aspects of the present invention include features that will be described in detail later and particularly pointed out in the claims. The following description and the accompanying drawings illustrate certain exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By referring to the following description in conjunction with the accompanying drawings and the content of the claims, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easier to understand. In the drawings:

[0022] Figure 1 is a schematic structural diagram of a CVD process equipment in the prior art;

[0023] Figure 2 is Figure 1 the rear view of

[0024] Figure 3 is Figure 2 the A-A cross-sectional view of

[0025] Figure 4 is Figure 2 the B-B cross-sectional view of

[0026] Figure 5 Schematic structural diagram of a wafer transfer channel isolation device according to Embodiment 1 of the present invention;

[0027] Figure 6 is Figure 5 rear view of;

[0028] Figure 7 is Figure 6 C-C cross-sectional view of;

[0029] Figure 8 is Figure 6 D-D cross-sectional view of;

[0030] Figure 9 Schematic structural diagram of a shutter according to Embodiment 1 of the present invention;

[0031] Figure 10 Top view of a wafer transfer channel isolation device according to Embodiment 2 of the present invention;

[0032] Figure 11 Side view of a wafer transfer channel isolation device according to Embodiment 2 of the present invention;

[0033] Figure 12 Top view of a wafer transfer channel isolation device according to Embodiment 3 of the present invention;

[0034] Figure 13 Schematic structural diagram of a shutter according to Embodiment 3 of the present invention;

[0035] Figure 14 Schematic structural diagram of a shutter according to Embodiment 4 of the present invention;

[0036] Figure 15 Schematic structural diagram of a wafer processing device according to Embodiment 5 of the present invention;

[0037] Wherein, 1 - wafer transfer channel;

[0038] 2 - shutter, 21 - door panel, 211 - flat door, 212 - arc door, 22 - lifting seat, 221 - first door panel outlet, 222 - second door panel outlet, 23 - lifting cylinder, 24 - arc-shaped box body, 241 - third door panel outlet 241;

[0039] 3 - reaction chamber; 4 - outer housing; 5 - gate valve.

[0040] In all the drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed implementation manners

[0041] In the following description, for purposes of explanation, in order to provide a thorough understanding of one or more embodiments, numerous specific details are set forth. However, it is apparent that the embodiments can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

[0042] The present invention can be subjected to various changes and can have various embodiments. Specific embodiments are illustrated in the drawings and described. However, the present invention is not limited to this specific embodiment, and all changes, equivalents, and alternatives falling within the spirit and technical scope of the present invention should be understood to be included.

[0043] Ordinal terms such as first, second, etc. may be used to describe various components, but the components are not limited to these terms. These terms are only used to distinguish one component from another. For example, without departing from the scope of the claims of the present invention, the second component can be named the first component, and similarly, the first component can also be named the second component. The term "and / or" includes a combination of multiple recited items or one of the multiple recited items.

[0044] It should be understood that when referring to a certain component being "connected" or "contacted" with other components, this includes not only the case where the component is directly connected or contacted with other components, but also should be understood to include the case where other components exist in between. Conversely, when referring to a certain component being "directly connected" or "directly contacted" with other components, it should be understood that no other components exist in between.

[0045] In the description of the embodiments, when it is described that a certain component is formed "on or under" another component, "on or under" includes both cases where the two components are in direct contact with each other and cases where at least one other component is disposed between the two components. And when expressed as "on" or "under", based on a certain component, it not only refers to the upper direction but also can include the lower direction.

[0046] The terms used in this application are only used to describe specific embodiments and do not limit the present invention. Unless otherwise clearly specified in the context, singular expressions include plural expressions. In this application, it should be understood that terms such as "including" or "having" are used to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and do not preclude the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0047] Unless otherwise defined, including technical or scientific terms, all terms used herein have the same meaning as commonly understood by those of ordinary skill in the art. Terms defined in commonly used dictionaries shall be interpreted to have meanings consistent with the context of the relevant technology. If not clearly defined in this application, they shall not be construed as ideal or overly formal meanings.

[0048] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0049] As Figures 1 - 4 As commonly shown, the CVD process equipment in the prior art includes a reaction chamber 3. A horizontal wafer transfer channel 1 is connected to one side of the reaction chamber 3. A gate valve 5 is provided at the end of the wafer transfer channel 1 facing the outside. The end of the wafer transfer channel 1 facing the reaction chamber 3 is arc-shaped and connected to the reaction chamber 3. After the gate valve 5 is opened, wafers from the outside are transported into the reaction chamber 3 through the wafer transfer channel 1. After the wafer transportation is completed, the gate valve 5 is closed, and the CVD process starts. Due to the need to transport wafers, the width and length of the wafer transfer channel 1 are relatively large. During the CVD process, the wafer transfer channel 1 becomes a useless space, which has a certain impact on the process in the reaction chamber 3.

[0050] In addition, during the wafer transportation process, air and particles will enter the wafer transfer channel 1. These air and particles stay in the wafer transfer channel 1 and will enter the reaction chamber 3 during the process, which has a certain impact on the process.

[0051] Embodiment 1

[0052] As Figures 5 - 9 As commonly shown, the wafer transfer channel isolation device proposed in this embodiment can be used in wafer processing devices such as deposition equipment and etching equipment. Deposition equipment includes, for example, CVD equipment, PECVD equipment, etc. The wafer transfer channel is separated from the reaction chamber to remove the useless space during the process and ensure the vacuum of the reaction chamber.

[0053] In this embodiment, a shutter 2 is added to the original wafer transfer channel 1 of the wafer processing device to isolate the reaction chamber 3 and the wafer transfer channel 1, so that the reaction chamber 3 basically only has its own space.

[0054] The wafer transfer channel isolation device includes an openable and closable shutter 2 provided on the wafer transfer channel 1. After the shutter 2 is closed, it hermetically separates the reaction chamber 3 and the wafer transfer channel 1. After the shutter 2 is opened, the wafer transfer channel 1 is opened.

[0055] After the wafer transfer is completed, the shutter 2 closes and the process begins. During the process, the shutter 2 is used to partition the reaction chamber 3 and the wafer transfer channel 1, reducing the useless reaction space. The gate valve 5 and the shutter 2 close simultaneously to tightly isolate the reaction chamber 3 from the outside world, making the vacuum in the reaction chamber 3 stronger.

[0056] During the wafer transfer process, the shutter 2 is fully open, and the wafer is transported unobstructed in the wafer transfer channel 1.

[0057] To minimize the reaction space and basically retain the space of the reaction chamber 3 itself, the wafer transfer channel 1 basically no longer forms redundant reaction space. The shutter 2 can be vertically arranged in the wafer transfer channel 1. After the shutter 2 closes, it greatly separates the reaction chamber 3 and the wafer transfer channel 1, greatly reducing the useless reaction space.

[0058] In this embodiment, the reaction chamber 3 is cylindrical, and the wafer transfer channel 1 communicates with the arc-shaped opening on the side wall of the reaction chamber 3. To greatly reduce the communication space between the wafer transfer channel 1 and the reaction chamber 3, the middle arc surface of the arc-shaped opening is inscribed with the shutter 2, and the shutter 2 vertically covers the cross-section of the wafer transfer channel 1. The shutter 2 closes the wafer transfer channel 1 with great airtightness.

[0059] To facilitate the opening and closing of the shutter 2, in this embodiment, the shutter 2 may include a door panel 21 that moves up and down. When the shutter 2 closes, the door panel 21 moves up from the outside of the wafer transfer channel 1 into the wafer transfer channel 1 to close the inside of the wafer transfer channel 1; when the shutter 2 opens, the door panel 21 moves down from the inside of the wafer transfer channel 1 to the outside of the wafer transfer channel 1, and the inside of the wafer transfer channel 1 is completely open, without affecting the normal transfer of the wafer.

[0060] The door panel 21 of the shutter 2 can be arranged below the wafer transfer channel 1, and the door panel 21 can move vertically up and down. When the door panel 21 moves up, it can extend into the wafer transfer channel 1 to close the wafer transfer channel 1 and separate the wafer transfer channel 1 and the reaction chamber 3; when the door panel 21 moves down, it can withdraw from the wafer transfer channel 1 to restore the connection between the wafer transfer channel 1 and the reaction chamber 3.

[0061] To facilitate the up and down movement of the door panel 21, in this embodiment, the shutter 2 may further include a lifting seat 22. The lower end of the door panel 21 can be connected to the inside of the lifting seat 22 through a lifting cylinder 23, and the door panel 21 is driven to move up and down by the lifting cylinder 23.

[0062] To stably and conveniently fix the lifting seat 22, the lifting seat 22 can be fixed to the outer side below the housing 4 of the reaction chamber 3. When the shutter 2 closes, the lifting cylinder 23 extends, and the door panel 21 moves up through the housing 4 into the wafer transfer channel 1; when the shutter 2 opens, the lifting cylinder 23 retracts, and the door panel 21 moves down into the housing 4.

[0063] The lifting seat 22 can be tightly fixed under the outer housing 4. The lifting cylinder 23 is fixed inside the lifting seat 22. After the door panel 21 is connected to the lifting cylinder 23, the door panel 21 passes through the lifting seat 22 and then is inserted into the outer housing 4. When the shutter 2 is opened, the door panel 21 cannot be higher than the inner wall of the wafer transfer channel 1 and cannot interfere with the transfer of wafers; when the shutter 2 is closed, the door panel 21 extends into the interior of the wafer transfer channel 1 until it completely blocks the cross-section of the wafer transfer channel 1.

[0064] In this embodiment, as Figure 9 shown, the shutter 2 is planar, the lifting seat 22 can be a square box, the door panel 21 is a planar door 211, and after the planar door 211 rises, it can cover the cross-section of the wafer transfer channel 1. The width of the planar door 211 is the same as the width of the cross-section of the wafer transfer channel 1, and the height of the planar door 211 can be higher than the height of the cross-section of the wafer transfer channel 1.

[0065] The cylinder of the lifting cylinder 23 is fixed at the bottom of the lifting seat 22, and the lifting end of the lifting cylinder 23 is connected to the lower end of the planar door 211. A first door panel outlet 221 is provided at the top of the lifting seat 22. The shape and area of the first door panel outlet 221 are the same as the shape and area of the cross-section of the planar door 211. The planar door 221 extends out of the first door panel outlet 221. The first door panel outlet 221 allows the planar door 211 to extend out in the lifting seat 22, and the planar door 211 moves up and down in the first door panel outlet 221. The first door panel outlet 221 plays a limiting role on the door panel of the planar door 211 to keep the planar door 211 vertical.

[0066] The volume of the lifting seat 22 is determined according to the sizes of the lifting cylinder 23 and the door panel 21. The space inside the lifting seat 22 can accommodate the lifting of the lifting cylinder 23 and the lower end of the planar door 211.

[0067] The lifting end of the lifting cylinder 23 moves up and down inside the lifting seat 22, thereby driving the planar door 211 to move up and down. The lower end of the planar door 211 is always located inside the lifting seat 22, and the planar door 211 is located in the outer housing 4 after being opened.

[0068] The stroke of the lifting cylinder 23 cannot be less than the height of the wafer transfer channel 1. In this embodiment, the stroke of the lifting cylinder 23 is equal to the height of the wafer transfer channel 1. After the planar door 211 is opened, the upper end of the planar door 211 can be flush with the bottom of the wafer transfer channel 1. After the door panel 21 is closed, the upper end of the door panel 21 can be in close contact with the top of the wafer transfer channel 1 to ensure complete blocking of the cross-section of the wafer transfer channel 1. A notch adapted to the thickness of the planar door 211 is provided at the bottom of the wafer transfer channel 1, and the planar door 211 and the notch can be closely fitted.

[0069] In order to ensure a tight fit between the door panel 21 and the notch, a sealing ring is provided around the notch. The sealing ring enables the outer wall of the door panel 21 to fit tightly with the notch, ensuring a tight isolation between the inside of the wafer transfer channel and the outer housing. After the door panel 21 is closed, the left and right sides and the upper side of the door panel 21 are in close contact with the inner wall of the wafer transfer channel 1, ensuring that the reaction chamber and the wafer transfer channel are hermetically separated after the door is closed.

[0070] The sealing ring is a heat-resistant sealing ring.

[0071] After the flat door 211 is closed, it is tangent to the middle of the arc-shaped opening, isolating the wafer transfer channel 1 and the reaction chamber 3 at the vertical edge of the reaction chamber, closing the wafer transfer channel 1 in a large range, and basically only leaving the space of the reaction chamber 3 itself for the process, optimizing the reaction space.

[0072] During the process reaction, the gate valve 5 and the door 2 are closed simultaneously. By using the original gate valve 5 and door 2 in the wafer transfer channel 1 to isolate from the outside world, it can ensure an absolute vacuum in the reaction chamber 3, thereby improving the stability and accuracy of the process.

[0073] In order to adapt to the reaction environment of the process, the material of the door panel 21 is the same as that of the wall of the reaction chamber 3. In this embodiment, it can be AL6061-T6 aluminum alloy. The thickness of the door panel 21 can be determined according to the process conditions.

[0074] Embodiment 2

[0075] As Figure 10 and Figure 11 shown, based on Embodiment 1, for the wafer transfer channel isolation device provided in this embodiment, in order to more tightly isolate the wafer transfer channel 1 and the reaction chamber 3, the door panel 21 is inserted around the wafer transfer channel 1.

[0076] In this embodiment, the area of the door panel 21 is larger than the cross-sectional area of the wafer transfer channel 1. A receiving groove for accommodating the edge of the door panel 21 is provided on the peripheral wall of the wafer transfer channel 1.

[0077] Openings adapted to the thickness of the door panel 21 are provided at the top, left, and right of the wafer transfer channel 1. The three openings form a receiving groove connecting the top, left, and right of the wafer transfer channel 1. After the door panel 21 is lifted, the upper and side edges of the door panel 21 are located in the receiving groove.

[0078] When the door panel 21 is closed, all four sides of the door panel 21 are located outside the wall surface of the wafer transfer channel 1 and should fit tightly with the openings and notches on the wall surface.

[0079] In order to ensure a tight fit between the storage groove and the door panel 21, sealing strips are provided at the edges of all three openings, and also at the edge of the slot opening. The side walls of the door panel 21 are all in contact with the sealing strips. The sealing strips can make the side walls of the door panel 21 fit tightly with the storage groove and the slot opening, ensuring a tight isolation between the inside of the wafer transfer channel and the outer housing, and also ensuring that the reaction chamber and the wafer transfer channel are hermetically separated after the shutter is closed.

[0080] The sealing strip is a heat-resistant sealing strip.

[0081] Embodiment 3

[0082] As Figure 12 and Figure 13 shown, based on Embodiments 1 and 2, the wafer transfer channel isolation device provided in this embodiment has a shutter in an arc shape in order to reduce the useless reaction space in a larger range. After the shutter is closed, it closes the arc-shaped opening.

[0083] The lifting seat 22 can be a box body, and the door panel 21 is an arc-shaped door 212. The shape of the arc-shaped door 212 corresponds to the arc of the arc-shaped opening. After the arc-shaped door 212 rises, it can tightly cover the arc-shaped opening of the wafer transfer channel 1.

[0084] The cylinder of the lifting cylinder 23 is fixed at the bottom of the lifting seat 22, and the lifting end of the lifting cylinder 23 is connected to the lower end of the arc-shaped door 212. A second door panel outlet 222 is provided at the top of the lifting seat 22. The shape and area of the second door panel outlet 222 are the same as the cross-sectional shape and area of the arc-shaped door 212. The arc-shaped door 212 extends out of the second door panel outlet 222. The second door panel outlet 222 serves as a limit for the door panel of the arc-shaped door 212, keeping the arc-shaped door 212 vertical.

[0085] The volume of the lifting seat 22 is determined according to the sizes of the lifting cylinder 23 and the arc-shaped door 212. The space inside the lifting seat 22 can accommodate the lifting of the lifting cylinder 23 and the lower end of the arc-shaped door 212.

[0086] The lifting end of the lifting cylinder 23 moves up and down inside the lifting seat 22, thereby driving the arc-shaped door 212 to move up and down. The lower end of the arc-shaped door 212 is always located inside the lifting seat 22, and the arc-shaped door 212 is located in the outer housing 4 after it is opened.

[0087] The stroke of the lifting cylinder 23 is not less than the height of the wafer transfer channel 1. In this embodiment, the stroke of the lifting cylinder 23 is equal to the height of the wafer transfer channel 1. After the arc-shaped door 212 is opened, the upper end of the arc-shaped door 212 is flush with the bottom of the wafer transfer channel 1. After the arc-shaped door 212 is closed, the edge of the arc-shaped door 212 is located in the receiving groove and the slot, and is closely attached to the receiving groove and the slot. The arc-shaped door 212 is along the arc-shaped opening and completely covers the arc-shaped opening.

[0088] After the arc-shaped door 212 is closed, it is completely attached to the outer wall of the arc-shaped reaction chamber, completely isolating the wafer transfer channel 1 and the reaction chamber 3, closing the wafer transfer channel 1 to the greatest extent, and only leaving the space of the reaction chamber 3 itself for the CVD process, so that the reaction space reaches the optimum.

[0089] During the CVD process reaction, the gate valve 5 and the arc-shaped door 212 are closed at the same time, which can ensure the absolute vacuum of the reaction chamber 3, thereby improving the stability and accuracy of the process.

[0090] Embodiment 4

[0091] As Figure 14 shown, for the wafer transfer channel isolation device provided in this embodiment, on the basis of Embodiment 3, in order to be adapted to the arc-shaped door 212, the lifting seat can be an arc-shaped box body 24.

[0092] The arc of the arc-shaped box body 24 is the same as the arc of the arc-shaped door 212, and the arc-shaped door 212 can move up and down in the arc-shaped box body 24. The arc-shaped box body 24 is fixed below the outer shell 4.

[0093] The cylinder of the lifting cylinder 23 is fixed at the bottom of the arc-shaped box body 24, and the lifting end of the lifting cylinder 23 is connected to the lower end of the arc-shaped door 212. A third door plate outlet 241 is provided at the top of the arc-shaped box body 2. The shape and area of the third door plate outlet 241 are the same as the cross-sectional shape and area of the arc-shaped door 212. The arc-shaped door 212 extends out of the third door plate outlet 241. The third door plate outlet 241 is for the arc-shaped door 212 to extend out in the arc-shaped box body 2, and the arc-shaped door 212 moves up and down in the third door plate outlet 241. The third door plate outlet 241 plays a limiting role on the door plate of the arc-shaped door 212 to keep the arc-shaped door 212 vertical.

[0094] The volume and width of the arc-shaped box body 2 can be determined according to the sizes of the lifting cylinder 23 and the arc-shaped door 212. The space inside the arc-shaped box body 24 can accommodate the lifting of the lifting cylinder 23 and the lower end of the arc-shaped door 212.

[0095] The lifting end of the lifting cylinder 23 moves up and down in the lifting seat 22, thereby driving the arc-shaped door 212 to move up and down. The lower end of the arc-shaped door 212 is always located inside the arc-shaped box body 2, and the arc-shaped door 212 is located in the outer shell 4 after being opened.

[0096] Example 5

[0097] As Figure 15 shown, the wafer processing apparatus provided in this embodiment includes a reaction chamber 3 for processing wafers, a gate valve 5 for allowing wafers to enter and exit, and a wafer transfer channel 1 provided between the reaction chamber 3 and the gate valve 5. Any one of the wafer transfer channel isolation devices described in Embodiments 1-4 may be provided on the wafer transfer channel 1.

[0098] The shutter 2 in Embodiment 1, 2, 3 or 4 is added on the wafer transfer channel 1. After the shutter 2 is closed, the reaction chamber 3 and the wafer transfer channel 1 are separated. After the shutter 2 is opened, the wafer transfer channel 1 is opened. The shutter 2 can seal the arc-shaped opening of the wafer transfer channel 1, remove the useless space, and optimize the process reaction space.

[0099] Specifically, the lifting seat 22 of the shutter 2 can be fixed below the outer casing 4 of the reaction chamber 3, and the door panel 21 of the shutter 2 passes through the outer casing 4 and extends into the wafer transfer channel 1 to seal the arc-shaped opening of the wafer transfer channel 1.

[0100] During the process, only the space of the reaction chamber 3 itself is left in the wafer transfer channel 1 for the process, removing the space of the wafer transfer channel, and making the reaction space optimal. At the same time, during the process reaction, the gate valve 5 and the shutter 2 are closed at the same time, which can ensure the absolute vacuum of the process, thereby improving the stability and accuracy of the process.

[0101] As described above, the wafer transfer channel isolation device according to the present invention and the wafer transfer channel of the CVD equipment are described by way of example with reference to the drawings. However, those skilled in the art should understand that various improvements can be made to the wafer transfer channel isolation device and the wafer transfer channel of the CVD equipment proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the appended claims.

Claims

1. A wafer transfer channel isolation device, characterized in that, it includes an openable and closable shutter disposed on the wafer transfer channel. After the shutter is closed, it hermetically separates the reaction chamber and the wafer transfer channel, and after the shutter is opened, the wafer transfer channel is opened.

2. The wafer transfer channel isolation device according to claim 1, characterized in that, the shutter is vertically disposed in the wafer transfer channel.

3. The wafer transfer channel isolation device according to claim 1, characterized in that, the shutter includes a door panel that can move up and down. When the shutter is closed, the door panel moves up from the outside of the wafer transfer channel into the wafer transfer channel. When the shutter is opened, the door panel moves down from the inside of the wafer transfer channel to the outside of the wafer transfer channel.

4. The wafer transfer channel isolation device according to claim 3, characterized in that, the shutter further includes a lifting seat, and the lower end of the door panel is connected to the inside of the lifting seat through a lifting cylinder.

5. The wafer transfer channel isolation device according to claim 4, characterized in that, the lifting seat is fixed on the outside of the outer shell of the reaction chamber. When the shutter is closed, the lifting cylinder extends, and the door panel passes through the outer shell and moves up into the wafer transfer channel. When the shutter is opened, the lifting cylinder retracts, and the door panel moves down into the lifting seat.

6. The wafer transfer channel isolation device according to claim 4, characterized in that, the lifting seat is a box body, the door panel is a flat door. The cylinder of the lifting cylinder is fixed at the bottom of the lifting seat, the lifting end of the lifting cylinder is connected to the lower end of the flat door. A first door panel outlet is provided at the top of the lifting seat, and the area of the first door panel outlet is the same as the cross-sectional area of the flat door. The flat door moves up and down in the first door panel outlet.

7. The wafer transfer channel isolation device according to claim 6, characterized in that, after the flat door moves up, it is tangent to the middle of the edge of the reaction chamber and seals the cross-section of the wafer transfer channel.

8. The wafer transfer channel isolation device according to claim 4, characterized in that, the lifting seat is a box body, the door panel is an arc-shaped door, and the shape of the arc-shaped door corresponds to the arc of the edge of the reaction chamber. The cylinder of the lifting cylinder is fixed at the bottom of the lifting seat, the lifting end of the lifting cylinder is connected to the lower end of the arc-shaped door. A second door panel outlet is provided at the top of the lifting seat, and the second door panel outlet has the same cross-sectional area as the arc-shaped door. The arc-shaped door moves up and down in the second door panel outlet.

9. The wafer transfer channel isolation device according to claim 8, characterized in that, after the arc-shaped door is closed, it seals the arc-shaped opening where the reaction chamber communicates with the wafer transfer channel.

10. The wafer transfer channel isolation device according to claim 8, characterized in that, the lifting seat is an arc-shaped box body.

11. The wafer transfer channel isolation device according to claim 3, characterized in that, the material of the door panel is the same as the material of the reaction chamber.

12. The wafer transfer channel isolation device according to claim 3, characterized in that, the area of the door panel is larger than the cross-sectional area of the wafer transfer channel, and a receiving groove capable of accommodating the edge of the door panel is provided on the peripheral wall of the wafer transfer channel.

13. A wafer processing device, comprising a reaction chamber for processing wafers, a gate valve for allowing wafers to enter and exit, and a wafer transfer channel provided between the reaction chamber and the gate valve, characterized in that, the wafer transfer channel isolation device according to any one of claims 1-12 is provided on the wafer transfer channel.

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