Vapor chamber assembly and electronic equipment

Abstract

The invention discloses a vapor chamber assembly and electronic equipment, and belongs to the technical field of vapor chambers. The vapor chamber assembly comprises a vapor chamber, the vapor chamber is provided with a vapor chamber, the vapor chamber is provided with a heat source area and a condensation area, the vapor chamber comprises a working medium and magnetic particles, and the working medium and the magnetic particles are located in the vapor chamber; the first electromagnetic part is arranged on the vapor chamber, the first electromagnetic part is connected with the two opposite sides of the vapor chamber, and the first electromagnetic part is located between the heat source area and the condensation area; the second electromagnetic part is located at the edge of the vapor chamber; when the first electromagnetic part is in a power-on state and the second electromagnetic part is in a power-off state, the magnetic particles are adsorbed to the first electromagnetic part, a first cavity and a second cavity are defined by the magnetic particles and the cavity wall of the soaking cavity, and at least one part of the working medium is located in the first cavity; and when the second electromagnetic part is in a power-on state and the first electromagnetic part is in a power-off state, the magnetic particles are adsorbed to the second electromagnetic part, the magnetic particles are collected, and separation of the soaking cavity is removed.

Description

Technical Field

[0001] This application belongs to the technical field of heat pipes, and particularly relates to a heat pipe assembly and an electronic device. Background Art

[0002] With the continuous expansion of the application scenarios of electronic devices, users' requirements for the battery capacity of electronic devices are also getting higher and higher. However, under low-temperature conditions, the battery performance deteriorates, mainly manifested in the slowdown of the chemical reaction rate of the battery, resulting in a reduction in its capacity. At the same time, low temperature will increase the internal resistance of the battery, which will lead to a voltage drop, thus possibly affecting the normal operation of the electronic device (for example, the electronic device cannot be turned on under low-temperature conditions), and the increased internal resistance may also cause more energy loss. In addition, under low-temperature conditions, the charging efficiency of the battery is significantly reduced, resulting in a slower charging speed.

[0003] In related technologies, the electronic device also includes a heat pipe. The heat pipe is disposed opposite to the battery. By reducing the size of the heat pipe, the size of the heat pipe is adapted to the size of the battery to reduce heat leakage, thereby increasing the heating speed of the battery. However, reducing the size of the heat pipe will reduce the heat dissipation performance of the whole machine, which is not conducive to the heat dissipation of the electronic device and reduces the performance of the electronic device. Summary of the Invention

[0004] This application aims to provide a heat pipe assembly and an electronic device, which solve the problem in related technologies that by adapting the sizes of the heat pipe and the battery to increase the heating speed of the battery, the heat dissipation performance of the whole machine is reduced, which is not conducive to the heat dissipation of the electronic device.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of this application provides a heat pipe assembly, including: a heat pipe, the heat pipe is provided with a heat pipe cavity, the heat pipe cavity has a heat source area and a condensation area, the heat pipe includes a working medium and magnetic particles, and both the working medium and the magnetic particles are located in the heat pipe cavity; a first electromagnetic component, disposed on the heat pipe, the first electromagnetic component is connected to opposite sides of the heat pipe, and the first electromagnetic component is located between the heat source area and the condensation area; a second electromagnetic component, disposed on the heat pipe, the second electromagnetic component is located at the edge of the heat pipe; when the first electromagnetic component is in the energized state and the second electromagnetic component is in the de-energized state, the magnetic particles are adsorbed at the first electromagnetic component, and the magnetic particles and the cavity wall of the heat pipe cavity enclose a first chamber and a second chamber, and at least a part of the working medium is located in the first chamber; when the second electromagnetic component is in the energized state and the first electromagnetic component is in the de-energized state, the magnetic particles are adsorbed at the second electromagnetic component to collect the magnetic particles and release the partition of the heat pipe cavity.

[0007] In a second aspect, an embodiment of this application provides an electronic device, including: the heat pipe assembly as in the first aspect.

[0008] In an embodiment of the present application, the heat pipe assembly includes a heat pipe, a first electromagnetic component, and a second electromagnetic component.

[0009] The heat pipe is provided with a heat pipe cavity. The heat pipe includes a working medium and magnetic particles. Both the working medium and the magnetic particles are located in the heat pipe cavity. That is, the heat pipe cavity serves to accommodate the working medium and the magnetic particles, and the magnetic particles can flow in the heat pipe cavity along with the working medium.

[0010] The heat pipe cavity has a heat source area and a condensation area. The heat pipe assembly is used for an electronic device. The heat source area of the heat pipe cavity is disposed opposite to the device to be cooled of the electronic device. For example, the electronic device includes a controller, and the controller is disposed opposite to the heat source area. Taking the device to be cooled as the controller as an example, when the temperature of the controller is high, the working medium will vaporize, that is, a phase change between vapor and liquid occurs, so as to absorb the heat generated by the operation of the controller. The heat rapidly diffuses in the heat pipe to achieve the purpose of heat dissipation, and can play a role in reducing the temperature of the controller. Specifically, since the vapor pressure in the heat source area is higher than that in the condensation area, under the action of the pressure, the vapor will flow from the heat source area to the condensation area, and condense into a liquid after reaching the condensation area. The condensed liquid will flow back to the heat source area and cycle repeatedly to export the heat of the controller and achieve the purpose of reducing the temperature of the controller.

[0011] Both the first electromagnetic component and the second electromagnetic component are disposed on the heat pipe. The heat pipe serves as an installation carrier for the first electromagnetic component and the second electromagnetic component, and has the function of installing and fixing the first electromagnetic component and the second electromagnetic component.

[0012] When the first electromagnetic component is in the energized state, the magnetic particles are adsorbed at the first electromagnetic component. When the first electromagnetic component is in the de-energized state, the first electromagnetic component cannot attract the magnetic particles.

[0013] When the second electromagnetic component is in the energized state, the magnetic particles are adsorbed at the second electromagnetic component. When the second electromagnetic component is in the de-energized state, the second electromagnetic component cannot attract the magnetic particles.

[0014] When the electronic device is in a low-temperature environment, when the first electromagnetic component is in the energized state and the second electromagnetic component is in the de-energized state, the magnetic particles are adsorbed at the first electromagnetic component, and the magnetic particles and the cavity wall of the heat pipe enclose a first chamber and a second chamber. That is to say, the first electromagnetic component works, the second electromagnetic component stops working, the magnetic particles follow the working medium to flow, and the magnetic particles are adsorbed to the first electromagnetic component. The magnetic particles divide the heat pipe into a first chamber and a second chamber. Since the first electromagnetic component is connected to the opposite sides of the heat sink, and the first electromagnetic component is located between the heat source area and the condensation area, therefore, the heat source area and the condensation area are located in different chambers, and the magnetic particles have the function of separating the heat source area and the condensation area, and the working medium in the first chamber will not flow to the second chamber. Specifically, the first chamber is disposed opposite to the battery of the electronic device, and the size of the first chamber is adapted to the size of the battery. The volume of the first chamber is smaller than the volume of the heat pipe, and the first chamber is separated from the condensation area, and the cavity wall of the first chamber is adapted to the boundary area of the battery, and the cavity wall of the first chamber can block the working medium in the first chamber from flowing to the second chamber. In this way, it can hinder the heat transfer of the working medium in the first chamber, reduce the further heat transfer to the second chamber, and the heat cannot be effectively transferred to the condensation area of the second chamber, so as to reduce the heat dissipation performance of the heat sink, and the heat is more stacked in the first chamber. In this way, it can help the battery to quickly warm up and ensure the use performance of the battery of the electronic device in a low-temperature environment.

[0015] When the temperature of the battery reaches the required temperature, the second electromagnetic component is in the energized state and the first electromagnetic component is in the de-energized state, and the magnetic particles are adsorbed at the second electromagnetic component to collect the magnetic particles and release the separation of the heat pipe. That is to say, the second electromagnetic component works, the first electromagnetic component stops working, the magnetic particles flow with the working medium, and the magnetic particles are adsorbed to the second electromagnetic component. Since the arrangement position of the magnetic particles is changed, at this time, the magnetic particles no longer have the function of separating the heat pipe. That is, the heat pipe will not be separated into a first chamber and a second chamber by the magnetic particles. At this time, the working medium can reciprocate between the heat source area and the condensation area. The second electromagnetic component works to collect the magnetic particles to the edge of the heat sink, avoiding hindering the reciprocating movement of the working medium between the heat source area and the condensation area. That is to say, the channel that hinders the movement of the working medium between the heat source area and the condensation area is opened, and the heat sink restores its normal heat dissipation function, which can ensure the volume of the heat pipe, the working medium can be normally vaporized and liquefied in the heat pipe, and can quickly transfer heat, meeting the heat dissipation requirements of the electronic device.

[0016] When the electronic device is in a normal temperature environment, the second electromagnetic component is in the energized state and the first electromagnetic component is in the de-energized state, and the magnetic particles are adsorbed at the second electromagnetic component. The setting of the magnetic particles does not affect the normal heat transfer function of the heat sink, which can ensure the volume of the heat pipe, the working medium can be normally vaporized and liquefied in the heat pipe, and can quickly transfer heat, ensuring the heat dissipation performance of the electronic device.

[0017] That is to say, the structure of the heat pipe assembly is reasonably set in this application. By defining the cooperation structure of the heat pipe, the first electromagnetic component, and the second electromagnetic component, the heat transfer structure inside the heat pipe is changed through the first electromagnetic component, the second electromagnetic component, and the magnetic particles. It is possible to adjust the effective heat dissipation area of the heat pipe targeted according to the external environmental temperature, so that the effective heat dissipation size of the heat pipe matches the size of the battery in a low-temperature environment, which can hinder the heat transfer to the condensation area, reduce the heat transfer performance of the heat pipe, and make the heat concentratedly supplied to the battery, greatly improving the temperature rise efficiency of the battery. The heat pipe assembly can not only meet the demand for high-efficiency heat conduction capacity when the electronic device is in a normal temperature environment, quickly take away the heat of the electronic device, but also meet the usage demand of quickly warming up the battery when the electronic device is in a low-temperature environment. That is to say, it can meet the usage demands of the electronic device under different working conditions, ensure the usage performance of the electronic device, improve the usage adaptability of the electronic device, and is beneficial to enhancing the market competitiveness of the electronic device.

[0018] Additional aspects and advantages of this application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of this application. Description of the Drawings

[0019] The above and / or additional aspects and advantages of this application will become apparent and be easily understood from the description of the embodiments in conjunction with the following drawings, where:

[0020] Figure 1 is a schematic structural diagram of the heat pipe assembly, the battery, and the controller in the first embodiment of this application when the second electromagnetic component is in the energized state and the first electromagnetic component is in the de-energized state;

[0021] Figure 2 is a schematic structural diagram of the heat pipe assembly in the first embodiment of this application from the first perspective when the second electromagnetic component is in the energized state and the first electromagnetic component is in the de-energized state;

[0022] Figure 3 is a schematic structural diagram of the heat pipe assembly in the first embodiment of this application from the second perspective when the second electromagnetic component is in the energized state and the first electromagnetic component is in the de-energized state;

[0023] Figure 4 is a schematic structural diagram of the heat pipe assembly, the battery, and the controller in the first embodiment of this application when the first electromagnetic component is in the energized state and the second electromagnetic component is in the de-energized state;

[0024] Figure 5 is a schematic structural diagram of the heat pipe assembly in the first embodiment of this application from the first perspective when the first electromagnetic component is in the energized state and the second electromagnetic component is in the de-energized state;

[0025] Figure 6 It is a schematic structural diagram of a second perspective when the first electromagnetic component of the heat pipe assembly in the first embodiment of the present application is in an energized state and the second electromagnetic component is in a de-energized state;

[0026] Figure 7 It is a schematic structural diagram when, in the heat pipe assembly, battery and controller in the second embodiment of the present application, the second electromagnetic component is in an energized state and the first electromagnetic component is in a de-energized state;

[0027] Figure 8 It is a schematic structural diagram of a first perspective when the second electromagnetic component of the heat pipe assembly in the second embodiment of the present application is in an energized state and the first electromagnetic component is in a de-energized state;

[0028] Figure 9 is Figure 8 A partial enlarged view of the heat pipe assembly shown at A;

[0029] Figure 10 is Figure 8 A partial enlarged view of the heat pipe assembly shown at B;

[0030] Figure 11 It is a schematic structural diagram of a second perspective when the second electromagnetic component of the heat pipe assembly in the second embodiment of the present application is in an energized state and the first electromagnetic component is in a de-energized state;

[0031] Figure 12 It is a schematic structural diagram of a first perspective when the first electromagnetic component of the heat pipe assembly in the second embodiment of the present application is in an energized state and the second electromagnetic component is in a de-energized state;

[0032] Figure 13 It is a schematic structural diagram of a second perspective when the first electromagnetic component of the heat pipe assembly in the second embodiment of the present application is in an energized state and the second electromagnetic component is in a de-energized state;

[0033] Figure 14 It is a schematic partial structural diagram of an electronic device in an embodiment of the present application.

[0034] Reference numerals:

[0035] Figures 1 to 14 The corresponding relationship between the reference numerals and the component names in

[0036] 10 heat pipe assembly, 100 heat pipe, 110 heat chamber, 112 heat source area, 114 condensation area, 115 first chamber, 116 second chamber, 120 working fluid, 130 magnetic particles, 140 corner, 150 housing, 152 first opening, 154 second opening, 156 first plate body, 158 second plate body, 160 side wall of the heat pipe, 200 first electromagnetic component, 202 first electromagnetic part, 204 second electromagnetic part, 212 third electromagnetic segment, 213 fourth electromagnetic segment, 214 fifth electromagnetic segment, 216 sixth electromagnetic segment, 218 seventh electromagnetic segment, 300 second electromagnetic component, 310 third electromagnetic part, 320 fourth electromagnetic part, 330 first electromagnetic segment, 340 second electromagnetic segment, 40 battery, 50 controller, 60 housing, 70 electronic device. Detailed implementation manners

[0037] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0038] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects. The character " / " generally means an "or" relationship between the associated objects before and after.

[0039] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0040] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or a welded connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0041] The following will describe the heat pipe assembly 10 and the electronic device 70 provided in the embodiments of the present application with reference to the attached Figures 1 to 14 drawings.

[0042] As Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 and Figure 13 shown, in some embodiments of the present application, a heat pipe assembly 10 is provided, including: a heat pipe 100, the heat pipe 100 is provided with a heat pipe cavity 110, the heat pipe cavity 110 has a heat source area 112 and a condensation area 114, the heat pipe 100 includes a working fluid 120 and magnetic particles 130, and both the working fluid 120 and the magnetic particles 130 are located in the heat pipe cavity 110; a first electromagnetic member 200, provided on the heat pipe 100, the first electromagnetic member 200 is connected to opposite sides of the heat pipe 100, and the first electromagnetic member 200 is located between the heat source area 112 and the condensation area 114; a second electromagnetic member 300, provided on the heat pipe 100, the second electromagnetic member 300 is located at the edge of the heat pipe 100; when the first electromagnetic member 200 is in the energized state and the second electromagnetic member 300 is in the de-energized state, the magnetic particles 130 are adsorbed at the first electromagnetic member 200, and the magnetic particles 130 and the cavity wall of the heat pipe cavity 110 enclose a first chamber 115 and a second chamber 116, and at least a part of the working fluid 120 is located in the first chamber 115; when the second electromagnetic member 300 is in the energized state and the first electromagnetic member 200 is in the de-energized state, the magnetic particles 130 are adsorbed at the second electromagnetic member 300 to collect the magnetic particles 130 and release the partition of the heat pipe cavity 110.

[0043] In the embodiments of the present application, the heat pipe assembly 10 includes a heat pipe 100, a first electromagnetic member 200, and a second electromagnetic member 300.

[0044] The heat pipe 100 is provided with a heat pipe cavity 110. The heat pipe 100 includes a working medium 120 and magnetic particles 130. Both the working medium 120 and the magnetic particles 130 are located in the heat pipe cavity 110. That is, the heat pipe cavity 110 functions to accommodate the working medium 120 and the magnetic particles 130. The magnetic particles 130 can flow in the heat pipe cavity 110 along with the working medium 120.

[0045] The heat pipe cavity 110 has a heat source area 112 and a condensation area 114. The heat pipe assembly 10 is used for the electronic device 70. The heat source area 112 of the heat pipe cavity 110 is disposed opposite to the device to be cooled of the electronic device 70. For example, the electronic device 70 includes a controller 50, and the controller 50 is disposed opposite to the heat source area 112. Taking the device to be cooled as the controller 50 as an example, when the temperature of the controller 50 is high, the working medium 120 will vaporize, that is, a phase change between vapor and liquid occurs, so as to absorb the heat generated by the operation of the controller 50. The heat rapidly diffuses in the heat pipe 100 to achieve the purpose of heat dissipation, and can play a role in reducing the temperature of the controller 50. Specifically, since the vapor pressure in the heat source area 112 is higher than the vapor pressure in the condensation area 114, therefore, under the action of the pressure, the vapor will flow from the heat source area 112 to the condensation area 114, and will condense into a liquid after reaching the condensation area 114. The condensed liquid will flow back to the heat source area 112 and circulate repeatedly to conduct the heat of the controller 50 and achieve the purpose of reducing the temperature of the controller 50.

[0046] Both the first electromagnetic member 200 and the second electromagnetic member 300 are provided on the heat pipe 100. The heat pipe 100 serves as an installation carrier for the first electromagnetic member 200 and the second electromagnetic member 300, and functions to install and fix the first electromagnetic member 200 and the second electromagnetic member 300.

[0047] When the first electromagnetic member 200 is in the energized state, the magnetic particles 130 are adsorbed at the first electromagnetic member 200. When the first electromagnetic member 200 is in the de-energized state, the first electromagnetic member 200 cannot attract the magnetic particles 130.

[0048] When the second electromagnetic member 300 is in the energized state, the magnetic particles 130 are adsorbed at the second electromagnetic member 300. When the second electromagnetic member 300 is in the de-energized state, the second electromagnetic member 300 cannot attract the magnetic particles 130.

[0049] When the electronic device 70 is in a low-temperature environment, when the first electromagnetic component 200 is in an energized state and the second electromagnetic component 300 is in a de-energized state, the magnetic particles 130 are adsorbed at the first electromagnetic component 200, and the magnetic particles 130 and the cavity wall of the heat pipe 110 enclose a first chamber 115 and a second chamber 116. That is to say, the first electromagnetic component 200 works, the second electromagnetic component 300 stops working, the magnetic particles 130 follow the working fluid 120 to flow, and the magnetic particles 130 are adsorbed to the first electromagnetic component 200. The magnetic particles 130 divide the heat pipe 110 into a first chamber 115 and a second chamber 116. Since the first electromagnetic component 200 is connected to the opposite sides of the heat sink 100 and the first electromagnetic component 200 is located between the heat source area 112 and the condensation area 114, the heat source area 112 and the condensation area 114 are located in different chambers. The magnetic particles 130 have the function of separating the heat source area 112 and the condensation area 114, and the working fluid 120 in the first chamber 115 will not flow to the second chamber 116. Specifically, the first chamber 115 is disposed opposite to the battery 40 of the electronic device 70, and the size of the first chamber 115 is adapted to the size of the battery 40. The volume of the first chamber 115 is smaller than the volume of the heat pipe 110, and the first chamber 115 is separated from the condensation area 114. The cavity wall of the first chamber 115 is adapted to the boundary area of the battery 40. The cavity wall of the first chamber 115 can block the working fluid 120 in the first chamber 115 from flowing to the second chamber 116. In this way, it can hinder the heat transfer of the working fluid 120 in the first chamber 115, reduce the further heat transfer to the second chamber 116, and the heat cannot be effectively transferred to the condensation area 114 of the second chamber 116, so as to reduce the heat dissipation performance of the heat sink 100. The heat is more stacked in the first chamber 115. In this way, it can help the battery 40 to quickly heat up and ensure the use performance of the battery 40 of the electronic device 70 in a low-temperature environment.

[0050] When the temperature of the battery 40 reaches the required temperature, the second electromagnetic component 300 is powered on, and the first electromagnetic component 200 is powered off, and the magnetic particles 130 are adsorbed on the second electromagnetic component 300 to collect the magnetic particles 130 and release the separation of the heat-saturating chamber 110. That is, the second electromagnetic component 300 works, the first electromagnetic component 200 stops working, the magnetic particles 130 flow with the working fluid 120, and the magnetic particles 130 are adsorbed on the second electromagnetic component 300. Since the arrangement position of the magnetic particles 130 is changed, at this time, the magnetic particles 130 no longer have the function of separating the heat-saturating chamber 110, that is, the heat-saturating chamber 110 will not be separated into the first chamber 115 and the second chamber 116 by the magnetic particles 130, and at this time, the working fluid 120 can reciprocate between the heat source area 112 and the condensation area 114. The second electromagnetic component 300 has the function of collecting the magnetic particles 130 to the edge of the heat spreader 100 to avoid hindering the reciprocating movement of the working medium 120 in the heat source area 112 and the condensation area 114. In other words, the channel that hinders the movement of the working medium 120 in the heat source area 112 and the condensation area 114 is opened, and the heat spreader 100 restores the normal heat dissipation function, which can ensure the volume of the heat spreader chamber 110. The working medium 120 can be normally vaporized and liquefied in the heat spreader chamber 110, and heat can be transferred quickly, which can meet the heat dissipation requirements of the electronic device 70.

[0051] When the electronic device 70 is in a normal temperature environment, the second electromagnetic component 300 is powered on, and the first electromagnetic component 200 is powered off. The magnetic particles 130 are adsorbed on the second electromagnetic component 300. The arrangement of the magnetic particles 130 does not affect the normal heat transfer function of the heat spreader 100, and can ensure the volume size of the heat spreader chamber 110. The working fluid 120 can be normally vaporized and liquefied in the heat spreader chamber 110, and can quickly transfer heat, thereby ensuring the heat dissipation performance of the electronic device 70.

[0052] In other words, the present application reasonably sets up the structure of the heat spreader assembly 10, by limiting the matching structure of the heat spreader 100, the first electromagnetic component 200 and the second electromagnetic component 300, and changing the heat transfer structure inside the heat spreader 100 through the first electromagnetic component 200, the second electromagnetic component 300 and the magnetic particles 130. The effective heat dissipation area of ​​the heat spreader 100 can be adjusted in a targeted manner according to the external ambient temperature, so that the effective heat dissipation size of the heat spreader 100 in a low temperature environment is adapted to the size of the battery 40, which can hinder the heat transfer to the condensation zone 114, reduce the heat transfer performance of the heat spreader 100, and concentrate the heat on the battery 40, thereby greatly improving the heating efficiency of the battery 40. The heat spreader assembly 10 can not only meet the high-efficiency heat conduction capability requirements of the electronic device 70 in a normal temperature environment, and can quickly take away the heat of the electronic device 70, but also meet the use requirements of the fast-heating battery 40 when the electronic device 70 is in a low-temperature environment. In other words, it can meet the use requirements of the electronic device 70 under different working conditions, ensure the use performance of the electronic device 70, improve the use adaptability of the electronic device 70, and help to improve the market competitiveness of the electronic device 70.

[0053] Exemplarily, the working medium 120 includes water or other liquids that are easily evaporated and condensed.

[0054] Exemplarily, when the first electromagnetic component 200 is in a powered-on state and the second electromagnetic component 300 is in a powered-off state, a portion of the working fluid 120 is located in the first chamber 115 .

[0055] Exemplarily, when the first electromagnetic component 200 is in a powered-on state and the second electromagnetic component 300 is in a powered-off state, the working fluid 120 is entirely located in the first chamber 115 .

[0056] Exemplarily, the magnetic particles 130 include at least one of the following or a combination thereof: iron particles, nickel particles, and cobalt particles.

[0057] In some embodiments, Figure 2 As shown, the second electromagnetic member 300 is disposed at the edge of the end surface of the heat spreader 100 in the thickness direction.

[0058] In this embodiment, the arrangement position of the second electromagnetic component 300 is defined, specifically, the second electromagnetic component 300 is arranged at the edge of the end surface of the vapor chamber 100 in the thickness direction. That is, along the thickness direction of the vapor chamber 100, the second electromagnetic component 300 is arranged at the end surface of the vapor chamber 100, and the second electromagnetic component 300 is located at the edge of the end surface.

[0059] By defining the installation position of the second electromagnetic component 300, the position of the magnetic particles 130 collected can be indirectly defined. Specifically, when the second electromagnetic component 300 is in the energized state and the first electromagnetic component 200 is in the de-energized state, the magnetic particles 130 are adsorbed at the edge of the end face of the heat sink 100 in the thickness direction. In this way, the main space of the heat dissipation cavity 110 can be ensured, and the normal movement of the working medium 120 in the heat dissipation cavity 110 can be avoided, providing structural support for ensuring the heat dissipation performance of the heat sink 100.

[0060] It can be understood that the heat sink 100 has a first end face and a second end face with a relatively large area, and the direction from the first end face to the second end face is the thickness direction of the heat sink 100.

[0061] In some other embodiments, the second electromagnetic component 300 is arranged in the middle area of the end face of the heat sink 100 in the thickness direction.

[0062] In some other embodiments, the second electromagnetic component 300 is arranged between the middle area and the edge of the end face of the heat sink 100 in the thickness direction.

[0063] In some embodiments, as Figure 1 and Figure 4 shown, the heat sink 100 has a plurality of corners 140, the number of the second electromagnetic components 300 is plural, and each second electromagnetic component 300 is located at one corner 140.

[0064] In this embodiment, the number and arrangement position of the second electromagnetic components 300 are defined.

[0065] The number of the second electromagnetic components 300 is plural. The heat sink 100 has a plurality of corners 140, and each second electromagnetic component 300 is located at one corner 140.

[0066] When the number of the second electromagnetic components 300 and the number of the corners 140 are both plural and the number of the second electromagnetic components 300 is equal to the number of the corners 140, the plurality of second electromagnetic components 300 and the plurality of corners 140 are in one-to-one correspondence.

[0067] When the number of the second electromagnetic components 300 and the number of the corners 140 are both plural and the number of the second electromagnetic components 300 is less than the number of the corners 140, each second electromagnetic component 300 is located at one corner 140.

[0068] The installation positions of multiple second electromagnetic components 300 indirectly define the positions for collecting magnetic particles 130. Specifically, when the second electromagnetic components 300 are in the energized state and the first electromagnetic component 200 is in the de-energized state, magnetic particles 130 are adsorbed at at least some of the multiple corners 140. In this way, the main space of the heat pipe 110 can be ensured, and the normal movement of the working fluid 120 in the heat pipe 110 can be avoided, providing a structural support for ensuring the heat dissipation performance of the heat sink 100.

[0069] This setting balances the collection positions of the magnetic particles 130 and avoids the situation where too many magnetic particles 130 are collected in a local area of the heat pipe 110, resulting in hindering the movement of the working fluid 120.

[0070] In some embodiments, as Figure 1 shown, the second electromagnetic component 300 includes a first electromagnetic segment 330 and a second electromagnetic segment 340 connected to each other, and the extending directions of the first electromagnetic segment 330 and the second electromagnetic segment 340 are different.

[0071] In this embodiment, the structure of the second electromagnetic component 300 is further defined. The second electromagnetic component 300 includes a first electromagnetic segment 330 and a second electromagnetic segment 340, the first electromagnetic segment 330 and the second electromagnetic segment 340 are connected, and the extending directions of the first electromagnetic segment 330 and the second electromagnetic segment 340 are different. The first electromagnetic segment 330 and the second electromagnetic segment 340 are configured in a right-angled structure, or the first electromagnetic segment 330 and the second electromagnetic segment 340 are configured in an acute-angled structure, or the first electromagnetic segment 330 and the second electromagnetic segment 340 are configured in an obtuse-angled structure.

[0072] This setting can increase the adsorption area of the second electromagnetic component 300 when the size of the second electromagnetic component 300 is fixed, enabling the second electromagnetic component 300 to magnetically attract a large number of magnetic particles 130 and meeting the usage requirements for effective magnetic attraction between the magnetic particles 130 and the second electromagnetic component 300 when the second electromagnetic component 300 is in the energized state.

[0073] In some embodiments, as Figure 1 shown, the first electromagnetic component 200 includes a third electromagnetic segment 212, a fourth electromagnetic segment 213, and a fifth electromagnetic segment 214. The third electromagnetic segment 212 is connected to the first side of the heat sink 100, the fifth electromagnetic segment 214 is connected to the second side of the heat sink 100, the fourth electromagnetic segment 213 is connected between the third electromagnetic segment 212 and the fifth electromagnetic segment 214, and the fourth electromagnetic segment 213 is recessed in the direction of the condensation area 114.

[0074] In this embodiment, the structure of the first electromagnetic component 200 is further defined.

[0075] Specifically, the first electromagnetic member 200 includes a third electromagnetic segment 212, a fourth electromagnetic segment 213, and a fifth electromagnetic segment 214. The fourth electromagnetic segment 213 is connected between the third electromagnetic segment 212 and the fifth electromagnetic segment 214. The fourth electromagnetic segment 213 is recessed in the direction of the condensation region 114. The third electromagnetic segment 212 is connected to the first side of the heat spreader 100, and the fifth electromagnetic segment 214 is connected to the second side of the heat spreader 100. That is to say, the first electromagnetic member 200 includes a trough-shaped structure with flanges. The bottom of the trough-shaped structure is closer to the condensation region 114 than the flanges. In other words, the opening of the trough-shaped structure is closer to the heat source region 112 than the bottom of the trough-shaped structure. The working fluid 120 can move between the heat source region 112 and the bottom of the trough-shaped structure via the opening of the trough-shaped structure.

[0076] Among them, the third electromagnetic segment 212 is connected to the first side of the heat spreader 100, and the fifth electromagnetic segment 214 is connected to the second side of the heat spreader 100. In this way, the magnetic particles 130 adsorbed on the first electromagnetic member 200 will abut against the side wall 160 of the heat spreader.

[0077] The shape of the first electromagnetic member 200 determines the distribution position of the magnetic particles 130, and the shape of the structure enclosed by the first electromagnetic member 200 and the magnetic particles 130 is the same. It can be understood that the magnetic particles 130 also abut against the two side walls of the heat dissipation cavity 110 in the thickness direction.

[0078] In this way, when the first electromagnetic member 200 is in the energized state and the second electromagnetic member 300 is in the de-energized state, the magnetic particles 130 enclose a trough-shaped structure with flanges. The magnetic particles 130 are located between the heat source region 112 and the condensation region 114, and the magnetic particles 130 abut against the side wall 160 of the heat spreader. In this way, the sealing performance of the formed first chamber 115 and second chamber 116 can be ensured, the heat source region 112 and the condensation region 114 can be effectively insulated, the working fluid 120 in the first chamber 115 can be prevented from flowing into the second chamber 116, and the effectiveness and reliability of supplying heat to the battery 40 can be ensured.

[0079] In some embodiments, as Figure 7 shown, the first electromagnetic member 200 further includes a sixth electromagnetic segment 216 and a seventh electromagnetic segment 218; the sixth electromagnetic segment 216 is connected between the fourth electromagnetic segment 213 and the first side of the heat spreader 100, and the sixth electromagnetic segment 216 is arranged opposite to and spaced from the third electromagnetic segment 212; the seventh electromagnetic segment 218 is connected between the fourth electromagnetic segment 213 and the second side of the heat spreader 100, and the seventh electromagnetic segment 218 is arranged opposite to and spaced from the fifth electromagnetic segment 214.

[0080] In this embodiment, the structure of the first electromagnetic member 200 is further defined.

[0081] The first electromagnetic component 200 includes a third electromagnetic segment 212, a fourth electromagnetic segment 213, a fifth electromagnetic segment 214, a sixth electromagnetic segment 216, and a seventh electromagnetic segment 218.

[0082] The sixth electromagnetic segment 216 is connected between the fourth electromagnetic segment 213 and the first side of the heat sink 100, and the seventh electromagnetic segment 218 is connected between the fourth electromagnetic segment 213 and the second side of the heat sink 100. The sixth electromagnetic segment 216 is disposed opposite to and spaced apart from the third electromagnetic segment 212. The seventh electromagnetic segment 218 is disposed opposite to and spaced apart from the fifth electromagnetic segment 214.

[0083] In this way, the magnetic particles 130 adsorbed on the sixth electromagnetic segment 216 will abut against the side wall 160 of the heat sink, and the magnetic particles 130 adsorbed on the seventh electromagnetic segment 218 will abut against the side wall 160 of the heat sink.

[0084] The shape of the first electromagnetic component 200 determines the distribution position of the magnetic particles 130, and the shape of the structure enclosed by the first electromagnetic component 200 and the magnetic particles 130 is the same. It can be understood that the magnetic particles 130 also abut against the two side walls of the heat sink cavity 110 in the thickness direction.

[0085] In this way, when the first electromagnetic component 200 is in the energized state and the second electromagnetic component 300 is in the de-energized state, the shape of the structure enclosed by the magnetic particles 130 is the same as the shape of the structure enclosed by the third electromagnetic segment 212, the fourth electromagnetic segment 213, the fifth electromagnetic segment 214, the sixth electromagnetic segment 216, and the seventh electromagnetic segment 218. The magnetic particles 130 are located between the heat source area 112 and the condensation area 114, and the magnetic particles 130 abut against the side wall 160 of the heat sink. In this way, the sealing performance of the formed first chamber 115 and second chamber 116 can be ensured, the heat source area 112 and the condensation area 114 can be effectively insulated, the working fluid 120 in the first chamber 115 can be prevented from flowing into the second chamber 116, and the effectiveness and reliability of heating the battery 40 can be ensured.

[0086] In some embodiments, at least one of the first electromagnetic component 200 and the second electromagnetic component 300 is located on one side of the heat sink 100.

[0087] In this embodiment, the cooperation structure of the heat sink 100, the first electromagnetic component 200, and the second electromagnetic component 300 is further defined.

[0088] At least one of the first electromagnetic component 200 and the second electromagnetic component 300 is located on one side of the heat sink 100, that is, at least one of the first electromagnetic component 200 and the second electromagnetic component 300 is located outside the heat sink 100. In other words, the first electromagnetic component 200 is located outside the heat sink 100, or the second electromagnetic component 300 is located outside the heat sink 100, or both the first electromagnetic component 200 and the second electromagnetic component 300 are located outside the heat sink 100.

[0089] In some embodiments, at least one of the first electromagnetic member 200 and the second electromagnetic member 300 is located within the heat dissipation cavity 110.

[0090] In this embodiment, the cooperation structure of the heat dissipation plate 100, the first electromagnetic member 200 and the second electromagnetic member 300 is further defined.

[0091] At least one of the first electromagnetic member 200 and the second electromagnetic member 300 is located within the heat dissipation cavity 110. That is, the first electromagnetic member 200 is located within the heat dissipation cavity 110, or the second electromagnetic member 300 is located within the heat dissipation cavity 110, or both the first electromagnetic member 200 and the second electromagnetic member 300 are located within the heat dissipation cavity 110.

[0092] In some embodiments, as Figure 2 , Figure 3 , Figure 5 and Figure 6 shown, when both the first electromagnetic member 200 and the second electromagnetic member 300 are located on one side of the heat dissipation plate 100, the first electromagnetic member 200 and the second electromagnetic member 300 are disposed on the same end surface of the heat dissipation plate 100 in the thickness direction.

[0093] In this embodiment, the cooperation structure of the heat dissipation plate 100, the first electromagnetic member 200 and the second electromagnetic member 300 is further defined.

[0094] When both the first electromagnetic member 200 and the second electromagnetic member 300 are located on one side of the heat dissipation plate 100, the first electromagnetic member 200 and the second electromagnetic member 300 are disposed on the same end surface of the heat dissipation plate 100 in the thickness direction. That is, the first electromagnetic member 200 and the second electromagnetic member 300 are located on the same side of the heat dissipation plate 100 in the thickness direction. This setting can reduce the overall thickness of the heat dissipation plate assembly 10 while ensuring the effectiveness and feasibility of the first electromagnetic member 200 and the second electromagnetic member 300 in adsorbing the magnetic particles 130, and can reduce the internal space occupancy rate of the heat dissipation plate assembly 10 for the electronic device 70, which is beneficial to the thinning of the electronic device 70.

[0095] In some embodiments, when both the first electromagnetic member 200 and the second electromagnetic member 300 are located within the heat dissipation cavity 110, the first electromagnetic member 200 and the second electromagnetic member 300 are disposed on the same end surface of the heat dissipation plate 100 in the thickness direction.

[0096] In this embodiment, the cooperation structure of the heat dissipation plate 100, the first electromagnetic member 200 and the second electromagnetic member 300 is further defined.

[0097] When both the first electromagnetic member 200 and the second electromagnetic member 300 are located within the heat sink cavity 110, the first electromagnetic member 200 and the second electromagnetic member 300 are disposed on the same end surface of the heat sink plate 100 in the thickness direction. That is, the first electromagnetic member 200 and the second electromagnetic member 300 are located on the same side of the heat sink plate 100 in the thickness direction. This arrangement can reduce the overall thickness of the heat sink plate assembly 10 while ensuring the effectiveness and feasibility of the first electromagnetic member 200 and the second electromagnetic member 300 in adsorbing the magnetic particles 130, and can reduce the occupancy rate of the internal space of the electronic device 70 by the heat sink plate assembly 10, which is beneficial to the thinness and lightness of the electronic device 70.

[0098] In some embodiments, as Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 and Figure 13 shown, the heat sink plate 100 includes a housing 150, a heat sink cavity 110 is provided inside the housing 150, along the thickness direction of the heat sink plate 100, the housing 150 includes a first plate body 156 and a second plate body 158; the first electromagnetic member 200 includes a first electromagnetic part 202 and a second electromagnetic part 204, and the second electromagnetic member 300 includes a third electromagnetic part 310 and a fourth electromagnetic part 320; the first electromagnetic part 202 and the third electromagnetic part 310 are both disposed on the first plate body 156, the second electromagnetic part 204 and the fourth electromagnetic part 320 are both disposed on the second plate body 158, the first electromagnetic part 202 and the second electromagnetic part 204 are disposed opposite to each other, and the third electromagnetic part 310 and the fourth electromagnetic part 320 are disposed opposite to each other.

[0099] In this embodiment, the cooperation structure of the heat sink plate 100, the first electromagnetic member 200 and the second electromagnetic member 300 is further defined.

[0100] The heat sink plate 100 includes a housing 150, and a heat sink cavity 110 is provided inside the housing 150.

[0101] The housing 150 includes a first plate body 156 and a second plate body 158, and the first plate body 156 and the second plate body 158 are arranged along the thickness direction of the heat sink plate 100.

[0102] The first electromagnetic member 200 includes a first electromagnetic part 202 and a second electromagnetic part 204, and the second electromagnetic member 300 includes a third electromagnetic part 310 and a fourth electromagnetic part 320. When the first electromagnetic part 202 is in an energized state, it can magnetically attract the magnetic particles 130. When the second electromagnetic part 204 is in an energized state, it can magnetically attract the magnetic particles 130. When the third electromagnetic part 310 is in an energized state, it can magnetically attract the magnetic particles 130. When the fourth electromagnetic part 320 is in an energized state, it can magnetically attract the magnetic particles 130.

[0103] The first electromagnetic part 202 and the third electromagnetic part 310 are both arranged on the first plate body 156, and the second electromagnetic part 204 and the fourth electromagnetic part 320 are both arranged on the second plate body 158. That is to say, the first plate body 156 serves as the installation carrier for the first electromagnetic part 202 and the third electromagnetic part 310, and has the function of installing and fixing the first electromagnetic part 202 and the third electromagnetic part 310. The second plate body 158 serves as the installation carrier for the second electromagnetic part 204 and the fourth electromagnetic part 320, and has the function of installing and fixing the second electromagnetic part 204 and the fourth electromagnetic part 320.

[0104] Specifically, the first electromagnetic part 202 and the second electromagnetic part 204 are arranged opposite to each other. This arrangement is more conducive to the magnetic particles 130 being adsorbed between the first electromagnetic part 202 and the second electromagnetic part 204, so that the magnetic particles 130 can abut between the first plate body 156 and the second plate body 158, providing a structural support for the magnetic particles 130 to block the flow of the working medium 120 between the heat source area 112 and the condensation area 114.

[0105] Specifically, the third electromagnetic part 310 and the fourth electromagnetic part 320 are arranged opposite to each other. This arrangement is more conducive to the magnetic particles 130 being adsorbed between the third electromagnetic part 310 and the fourth electromagnetic part 320, so that the magnetic particles 130 can abut between the first plate body 156 and the second plate body 158, providing a structural support for the magnetic particles 130 to block the flow of the working medium 120 between the heat source area 112 and the condensation area 114.

[0106] Exemplarily, at least one of the first electromagnetic part 202 and the third electromagnetic part 310 is located outside the first plate body 156.

[0107] Exemplarily, at least one of the first electromagnetic part 202 and the third electromagnetic part 310 is located inside the first plate body 156.

[0108] Exemplarily, at least one of the second electromagnetic part 204 and the fourth electromagnetic part 320 is located outside the second plate body 158.

[0109] Exemplarily, at least one of the second electromagnetic part 204 and the fourth electromagnetic part 320 is located inside the second plate body 158.

[0110] Exemplarily, both the first plate body 156 and the second plate body 158 are provided with a first opening 152. The first electromagnetic part 202 is arranged in the first opening 152 of the first plate body 156, and the second electromagnetic part 204 is arranged in the first opening 152 of the second plate body 158. That is to say, the first electromagnetic component 200 is embedded in the first plate body 156 and the second plate body 158.

[0111] Exemplarily, both the first plate body 156 and the second plate body 158 are provided with a second opening 154. The third electromagnetic part 310 is arranged in the second opening 154 of the first plate body 156, and the fourth electromagnetic part 320 is arranged in the second opening 154 of the second plate body 158. That is to say, the second electromagnetic component 300 is embedded in the first plate body 156 and the second plate body 158.

[0112] In some embodiments, such as Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 and Figure 13 shown, the heat pipe 100 includes a housing 150, and a heat pipe cavity 110 is arranged inside the housing 150; the housing 150 is provided with a first opening 152, the first opening 152 communicates with the heat pipe cavity 110, and the first electromagnetic component 200 is arranged in the first opening 152; and / or the housing 150 is provided with a second opening 154, the second opening 154 communicates with the heat pipe cavity 110, and the second electromagnetic component 300 is arranged in the second opening 154.

[0113] In this embodiment, the cooperation structure of the heat pipe 100, the first electromagnetic component 200 and the second electromagnetic component 300 is further defined.

[0114] The heat pipe 100 includes a housing 150, and a heat pipe cavity 110 is arranged inside the housing 150.

[0115] The housing 150 is provided with a first opening 152, and / or the housing 150 is provided with a second opening 154.

[0116] When the housing 150 is provided with the first opening 152, the first opening 152 communicates with the heat pipe cavity 110, and the first electromagnetic component 200 is arranged in the first opening 152. It can also be said that the first electromagnetic component 200 is embedded in the first opening 152, or that the first electromagnetic component 200 is embedded in the housing 150. It can be understood that the first electromagnetic component 200 has the function of blocking the first opening 152. It can also be said that the first electromagnetic component 200 can not only attract the magnetic particles 130 in the energized state, but also form a part of the cavity wall of the heat pipe cavity 110.

[0117] When the housing 150 is provided with the second opening 154, the second opening 154 communicates with the heat pipe cavity 110, and the second electromagnetic component 300 is arranged in the second opening 154. It can also be said that the second electromagnetic component 300 is embedded in the second opening 154, or that the second electromagnetic component 300 is embedded in the housing 150. It can be understood that the second electromagnetic component 300 has the function of blocking the second opening 154. It can also be said that the second electromagnetic component 300 can not only attract the magnetic particles 130 in the energized state, but also form a part of the cavity wall of the heat pipe cavity 110.

[0118] While ensuring the effectiveness and feasibility of the first electromagnetic component 200 and the second electromagnetic component 300 in adsorbing the magnetic particles 130, this setting can reduce the overall thickness of the heat pipe assembly 10, reduce the internal space occupancy rate of the heat pipe assembly 10 for the electronic device 70, and is beneficial to the thinning of the electronic device 70.

[0119] As Figure 14 shown, the electronic device 70 according to some other embodiments of the present application includes: the heat pipe assembly 10 as in any of the above embodiments.

[0120] Since the electronic device 70 provided by the present application includes the heat pipe assembly 10 as in any of the above embodiments, it has all the beneficial effects of the above heat pipe assembly 10, and will not be elaborated one by one here.

[0121] Exemplarily, the electronic device 70 may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also referred to as an AR (Augmented Reality) device), a virtual reality device (also referred to as a VR (Virtual Reality) device), and a handheld game console, etc.

[0122] In some embodiments, as Figure 14 shown, the electronic device 70 further includes: a housing 60, the heat pipe assembly 10 is disposed in the housing 60; a controller 50, disposed in the housing 60, and the controller 50 is disposed opposite to the heat source area 112; a battery 40, disposed in the housing 60; when the first electromagnetic component 200 is in an energized state and the second electromagnetic component 300 is in a de-energized state, the first chamber 115 is disposed opposite to the battery 40, and along the thickness direction perpendicular to the housing 60, the second chamber 116 is located on one side of the battery 40.

[0123] In this embodiment, the structure of the electronic device 70 is defined.

[0124] The electronic device 70 further includes a housing 60, a controller 50, and a battery 40.

[0125] The heat pipe assembly 10, the controller 50, and the battery 40 are all disposed in the housing 60.

[0126] The controller 50 is disposed opposite to the heat source area 112.

[0127] When the first electromagnetic component 200 is in the energized state and the second electromagnetic component 300 is in the de-energized state, the first chamber 115 is disposed opposite to the battery 40. Along the thickness direction perpendicular to the housing 60, the second chamber 116 is located on one side of the battery 40. Exemplarily, the shape of the first chamber 115 is adapted to the shape of the battery 40. For example, the side walls of the first chamber 115 are disposed opposite to the side walls of the battery 40. This ensures the mating dimensions between the first chamber 115 and the battery 40, providing a structural support for improving the heating rate of the battery 40.

[0128] Along the thickness direction perpendicular to the housing 60, the second chamber 116 is located on one side of the battery 40. That is, along the thickness direction perpendicular to the housing 60, the condensation area 114 is located on one side of the battery 40, so as to reduce the influence of the condensation area 114 on the heating of the battery 40.

[0129] Exemplarily, at least one of the first electromagnetic component 200 and the second electromagnetic component 300 is an electromagnetic sheet.

[0130] Exemplarily, the heat pipe assembly 10 of the present application includes a heat pipe 100, a first electromagnetic component 200, and a second electromagnetic component 300. The heat dissipation area of the heat pipe 100 is adjusted. During daily use, the heat pipe 100 has a large heat dissipation area, meeting the usage requirements of efficient heat conduction of the product and being able to quickly take away the heat of the electronic device 70. In a low-temperature environment, when the battery 40 heating program of the electronic device 70 is started, the heat transfer structure inside the heat pipe 100 is changed by the first electromagnetic component 200, the second electromagnetic component 300, and the magnetic particles 130, reducing the effective heat dissipation area of the heat pipe 100, making the effective heat dissipation surface of the heat pipe 100 the same size as the battery 40, being able to disrupt the path of heat transfer to the condensation area 114 of the heat pipe 100, reducing the heat transfer performance of the heat pipe 100, so that the heat is concentrated and supplied to the battery 40, and being able to improve the heating efficiency of the battery 40.

[0131] Exemplarily, the heat pipe 100 further includes a working medium 120. The working medium 120 is located in the heat pipe cavity 110 of the heat pipe 100, and the working medium 120 is pure water. When the main heat source (such as the controller 50) of the electronic device 70 operates at high power, the water vaporizes into water vapor in the heat pipe 100, and a large amount of heat is carried away during the vaporization process. The water vapor will condense back into liquid water in the condensation area 114 and then flow back to the heat source area 112, and so on in a cycle, being able to quickly take away the heat and reduce the temperature of the electronic device 70.

[0132] To adjust the effective heat dissipation area of the heat pipe 100, a first electromagnetic component 200 and a second electromagnetic component 300 can be arranged on the heat pipe 100. At the same time, a small amount of magnetic particles 130 are added to the internal working fluid 120 of the heat pipe 100 (the size of the magnetic particles 130 is extremely small, and the magnetic particles 130 can flow along with the working fluid 120 inside the heat pipe 100). By the adsorption and aggregation of the first electromagnetic component 200 and the second electromagnetic component 300 on the magnetic particles 130, the use requirement of blocking the heat transfer channels inside the heat pipe 100 can be met.

[0133] Exemplarily, the heat pipe assembly 10 includes a heat pipe 100, a first electromagnetic component 200 and a second electromagnetic component 300. A working fluid 120 and magnetic particles 130 are arranged in the heat pipe cavity 110 of the heat pipe 100. The second electromagnetic component 300 is used to store the magnetic particles 130 in the energized state. The installation position of the first electromagnetic component 200 can be flush with the position of the battery 40 according to requirements.

[0134] Exemplarily, in the normal state, the second electromagnetic components 300 located at the four corners of the heat pipe 100 work, adsorbing the magnetic particles 130 inside the heat pipe 100 at the four corners of the heat pipe 100, without affecting the normal heat transfer function of the heat pipe 100, maintaining the normal size of the heat pipe cavity 110, and enabling the working fluid 120 to vaporize and liquefy normally in the heat pipe cavity 110, so as to quickly transfer heat.

[0135] When in a low-temperature environment and the battery 40 heating program needs to be started, the second electromagnetic component 300 stops working, and the first electromagnetic component 200 works. The magnetic particles 130 flow along with the working fluid 120 and are adsorbed to the position of the first electromagnetic component 200, forming an internal flow channel blocking structure of the heat pipe 100 in the boundary region of the battery 40, hindering the heat transfer of the working fluid 120, preventing heat from being transferred to the external area of the battery 40, and the heat cannot be effectively transferred to the condensation area 114. The heat dissipation performance of the heat pipe 100 drops significantly, and the heat accumulates at the battery 40, helping the battery 40 to quickly warm up.

[0136] When the temperature of the battery 40 reaches the required temperature, the first electromagnetic component 200 stops working, and the second electromagnetic component 300 works. The magnetic particles 130 are gradually adsorbed to the four corners of the heat pipe 100 to store the magnetic particles 130, the blocking channel of the working fluid 120 is opened, and the heat pipe 100 resumes its normal heat dissipation function.

[0137] Due to the extremely limited internal space of the electronic device 70, by arranging the first electromagnetic component 200 and the second electromagnetic component 300 on the vapor chamber 100 and cooperating with the magnetic particles 130, although the heat transfer path of the working medium 120 can be well isolated, additional space needs to be reserved for the first electromagnetic component 200 and the second electromagnetic component 300, resulting in the thickening of the whole machine. For this reason, in this application, a first opening 152 and a second opening 154 are arranged on the outer shell 150 of the vapor chamber 100, so that the first electromagnetic component 200 is embedded in the first opening 152 and the second electromagnetic component 300 is embedded in the second opening 154. In this way, the internal space of the electronic device 70 will not be additionally occupied. Exemplarily, the outer shell 150 includes a stainless steel shell and / or a copper shell.

[0138] The heat dissipation area of the vapor chamber assembly 10 of this application is adjustable, which helps to improve the heating efficiency of the battery 40 in a low-temperature environment, and further improves the performance of the battery 40 in a low-temperature environment, enhancing the user experience.

[0139] When starting the battery 40 heating program, by hindering the heat transfer area of the vapor chamber 100, reducing the heat transfer performance of the vapor chamber 100, and improving the heating efficiency of the battery 40, there is no need to additionally increase the load, saving the power consumption of the battery 40.

[0140] When the battery 40 heating program is not started, the large-area heat transfer performance of the vapor chamber assembly 10 can be maintained, without affecting the heat dissipation requirements for the user's daily use.

[0141] Among them, Figure 1 and Figure 4 the dotted arrows in indicate the flow path of the working medium 120. Figure 4 In, the solid arrows above and below the first electromagnetic component 200 both indicate the flow path of the magnetic particles 130, and the magnetic particles 130 are adsorbed by the first electromagnetic component 200 to the position of the first electromagnetic component 200.

[0142] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0143] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of this application, and the scope of this application is defined by the claims and their equivalents.

Claims

1. A vapor chamber assembly, characterized in that: include: A soaking plate, wherein the soaking plate is provided with a soaking chamber, wherein the soaking chamber has a heat source area and a condensation area, and the soaking plate includes a working fluid and magnetic particles, wherein the working fluid and the magnetic particles are both located in the soaking chamber; A first electromagnetic component is disposed on the vapor chamber, the first electromagnetic component connects two opposite sides of the vapor chamber, and the first electromagnetic component is located between the heat source area and the condensation area; A second electromagnetic component is provided on the vapor chamber, wherein the second electromagnetic component is located at an edge of the vapor chamber; When the first electromagnetic component is in a powered-on state and the second electromagnetic component is in a powered-off state, the magnetic particles are adsorbed on the first electromagnetic component, the magnetic particles and the cavity wall of the heat-averaging cavity enclose a first cavity and a second cavity, and at least a portion of the working fluid is located in the first cavity; When the second electromagnetic component is in a powered-on state and the first electromagnetic component is in a powered-off state, the magnetic particles are adsorbed on the second electromagnetic component to collect the magnetic particles and release the partition of the heat-averaging chamber.

2. The vapor chamber assembly according to claim 1, characterized in that: The second electromagnetic component is arranged at the edge of the end surface of the heat spreader in the thickness direction.

3. The vapor chamber assembly according to claim 2, characterized in that: The vapor chamber has a plurality of corners, and the number of the second electromagnetic components is plural, and each of the second electromagnetic components is located at one of the corners.

4. The vapor chamber assembly according to claim 3, characterized in that: The second electromagnetic member includes a first electromagnetic segment and a second electromagnetic segment connected to each other, and the first electromagnetic segment and the second electromagnetic segment extend in different directions.

5. The vapor chamber assembly according to any one of claims 1 to 4, characterized in that: The first electromagnetic component includes a third electromagnetic segment, a fourth electromagnetic segment and a fifth electromagnetic segment, the third electromagnetic segment is connected to the first side of the heat spreader, the fifth electromagnetic segment is connected to the second side of the heat spreader, the fourth electromagnetic segment is connected between the third electromagnetic segment and the fifth electromagnetic segment, and the fourth electromagnetic segment is recessed toward the condensation zone.

6. The vapor chamber assembly according to claim 5, characterized in that: The first electromagnetic member further includes a sixth electromagnetic segment and a seventh electromagnetic segment; The sixth electromagnetic segment is connected between the fourth electromagnetic segment and the first side of the vapor chamber, and the sixth electromagnetic segment is opposite to the third electromagnetic segment and arranged at an interval; The seventh electromagnetic segment is connected between the fourth electromagnetic segment and the second side of the vapor chamber, and the seventh electromagnetic segment is opposite to the fifth electromagnetic segment and is arranged at an interval.

7. The vapor chamber assembly according to any one of claims 1 to 4, characterized in that: At least one of the first electromagnetic component and the second electromagnetic component is located on one side of the vapor chamber; or At least one of the first electromagnetic member and the second electromagnetic member is located in the heat-absorbing chamber.

8. The vapor chamber assembly according to claim 7, characterized in that: When the first electromagnetic component and the second electromagnetic component are both located on one side of the vapor chamber, or when the first electromagnetic component and the second electromagnetic component are both located in the vapor chamber, the first electromagnetic component and the second electromagnetic component are arranged on the same end surface of the vapor chamber in the thickness direction.

9. The vapor chamber assembly according to any one of claims 1 to 4, characterized in that: The heat spreader includes a shell, the heat spreader cavity is arranged in the shell, and along the thickness direction of the heat spreader, the shell includes a first plate body and a second plate body; The first electromagnetic component includes a first electromagnetic part and a second electromagnetic part, and the second electromagnetic component includes a third electromagnetic part and a fourth electromagnetic part; The first electromagnetic part and the third electromagnetic part are both arranged on the first plate body, the second electromagnetic part and the fourth electromagnetic part are both arranged on the second plate body, the first electromagnetic part and the second electromagnetic part are arranged opposite to each other, and the third electromagnetic part and the fourth electromagnetic part are arranged opposite to each other.

10. An electronic device, characterized in that: include: The vapor chamber assembly according to any one of claims 1 to 9.

11. The electronic device according to claim 10, characterized in that: Also includes: A housing, wherein the heat sink assembly is disposed in the housing; A controller is disposed in the housing, and the controller is disposed opposite to the heat source area; A battery, disposed in the housing; When the first electromagnetic member is in a powered-on state and the second electromagnetic member is in a powered-off state, the first chamber is arranged opposite to the battery, and the second chamber is located on one side of the battery along a direction perpendicular to the thickness of the shell.

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