Vertical electrolysis subtractive wet process equipment for treating fine lines of 3 mu m / 3 mu m or below
By adopting vertical electrolytic subtraction wet method equipment in PCB etching technology, and using the titanium cathode plate and nozzle straw structure, the problem that the prior art is difficult to achieve fine lines below 3μm/3μm, and an efficient and uniform etching effect is achieved.
Patent Information
- Application Number
- CN202311686912.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2025-06-13
AI Technical Summary
The existing PCB etching technology is difficult to achieve fine lines below 3μm/3μm, mainly due to insufficient uniformity of the spray structure and insufficient small and uneven molecules of the atomized particle.
Using a vertical electrolytic subtraction wet method, the titanium cathode plate is fixed to the right end of the spray plate, combined with the potassium in the reservoir to produce an electrochemical reaction with the copper on the surface of the PCB substrate, and the nozzle and straw structure are used to ensure the flow and uniformity of the electric field ions, and the etching of the metal surface is achieved.
The problem of insufficient reaction uniformity of the spray structure is effectively solved, efficient etching of fine lines below 3μm/3μm is achieved, and the accuracy and coverage of the lines are improved.
Smart Images
Figure CN120152172A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of PCB etching, and more specifically to a wet equipment for vertical electrolytic subtractive method for processing micro-lines below 3μm / 3μm. Background Art
[0002] With the upgrading of demand and rapid expansion in the global electronic product market, the miniaturization, high precision, and ultra-fine printed circuit board technology of electronic products are entering a period of rapid development. In order to meet the growing market demand, especially in the field of ultra-fine circuit technology, traditional backward etching technology is being replaced by advanced PCB etching technology.
[0003] Deficiencies of the prior art: The existing etching methods mainly include immersion, bubbling, splashing, and spray etching. Immersion and bubbling etching will cause relatively large undercutting. The undercutting generated by splashing and spray etching is relatively small. Although spray etching has the smallest undercutting and the best etching effect, in the current market's second-class etching and vacuum etching technologies, the line width and line pitch in the etching subtractive method can only reach 8μm / 8μm or more, and cannot achieve micro-lines below 3μm / 3μm. The main influencing factors and deficiencies are as follows: 1. The uniformity of the spray pressure cannot meet 100%. 2. The balance of the spray flow rate and coverage area is not stable enough. 3. The atomized particles generated by spraying can reach below 10μm, and the proportion of particles below 3μm is very small, so the permeability to products with a line width and line pitch of less than 3μm is very poor. Summary of the Invention
[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wet equipment for vertical electrolytic subtractive method for processing micro-lines below 3μm / 3μm to solve the problems existing in the above-mentioned background art.
[0005] The present invention provides the following technical solutions: A wet equipment for vertical electrolytic subtractive method for processing micro-lines below 3μm / 3μm, including a liquid storage tank, an electrolytic etching tank is fixedly connected to the upper end of the liquid storage tank, a guide rod is fixedly connected inside the electrolytic etching tank, a guide wheel is slidably connected to the circumferential surface of the guide rod, a rotating shaft is rotatably connected inside the guide wheel, a spray disc is fixedly connected to the right end of the rotating shaft, a titanium cathode plate is fixedly connected to the right end of the spray disc, bottom plates are fixedly connected to both the left and right sides of the upper end of the electrolytic etching tank, a guide post is fixedly connected to the upper end of the bottom plate, a sliding plate is slidably connected to the circumferential surface of the guide post, a connecting plate is fixedly connected to the upper end of the sliding plate, the left connecting plate is fixedly connected to the spray disc, the right connecting plate is fixedly connected to a mounting frame, a quick-release is arranged inside the mounting frame, and a PCB substrate is fixedly connected inside the quick-release;
[0006] Preferably, a first flow channel and a second flow channel are opened inside the spray disc, a nozzle is fixedly connected to the output end of the first flow channel, and a suction pipe is fixedly connected to the output end of the second flow channel.
[0007] Preferably, a plurality of through holes are formed on the surface of the titanium cathode plate, and the through holes correspond to the nozzles and the suction pipes respectively.
[0008] Preferably, an input pipe and a reflux pipe are fixedly connected to the front end of the electrolytic etching tank. The input pipe is fixedly connected to the first flow channel through a corrugated hose, and the reflux pipe is fixedly connected to the second flow channel through a corrugated hose.
[0009] Preferably, the input pipes are connected by a first connecting pipe, and the reflux pipes are connected by a second connecting pipe. The input end of the first connecting pipe is fixedly connected to the spray pump in the liquid storage tank, and the input end of the second connecting pipe is fixedly connected to the vacuum pump in the liquid storage tank.
[0010] Preferably, a rotating frame is fixedly connected to the upper end of the bottom plate. A driving shaft is rotatably connected inside the rotating frame. A cam is fixedly connected to the circumferential surface of the driving shaft. A guiding frame is slidably connected to the circumferential surface of the cam, and the guiding frame is fixedly connected to the sliding plate.
[0011] Preferably, a positioning frame is fixedly connected to the upper end of the bottom plate. A motor is fixedly connected to the rear end of the positioning frame. The output end of the motor is fixedly connected to the driving shaft, and the driving shaft is rotatably connected to the positioning frame.
[0012] Preferably, a cleaning tank is fixedly connected to the upper end of the liquid storage tank. A first water washing tank, an acid washing tank, a second water washing tank and an air drying tank are sequentially arranged inside the cleaning tank.
[0013] The technical effects and advantages of the present invention are as follows:
[0014] 1. In the present invention, the titanium cathode plate is fixed to the right end of the spray disc, and then the PCB substrate is quickly fixed to the mounting rack. Then, an appropriate amount of current is applied to the titanium cathode plate through an external rectifier to form an electric field. Combining with the chemical reaction between the potion obtained in the liquid storage tank and the copper on the surface of the PCB substrate, the problem of insufficient reaction uniformity of the spraying structure is solved.
[0015] 2. In the present invention, through the spraying of the nozzles and the adsorption of the suction pipes in the spray disc structure, the flow and uniformity of the electric field ions are ensured. When a suitable amount of current is provided by the DC power supply, the metal ions on the anode will migrate towards the cathode direction, and at the same time, an oxidation reaction will occur on the anode, and the metal ions will be oxidized into metal ions, thereby realizing the etching of the metal surface. The ion reaction migration solves the problem that the atomized particle molecules are not small enough and uneven. Then, the slider reciprocates up and down on the circumferential surface of the guiding column, driving the spray disc and the titanium cathode plate to reciprocate up and down with the mounting rack and the PCB substrate, making the reaction more sufficient and the coverage area wider. Description of the Drawings
[0016] Figure 1 This is the overall structural schematic diagram of the present invention.
[0017] Figure 2 This is the schematic diagram of the partial split structure in the present invention.
[0018] Figure 3 This is the schematic diagram of the titanium cathode plate and the PCB substrate structure in the present invention.
[0019] Figure 4 This is the schematic diagram of the cross-sectional structure of the spray disc of the present invention.
[0020] The reference numerals are: 1, liquid storage tank; 2, electrolytic etching tank; 3, guide rod; 4, guide wheel; 5, rotating shaft; 6, spray disc; 7, titanium cathode plate; 8, bottom plate; 9, guide post; 10, slide plate; 11, connecting plate; 12, mounting rack; 13, quick release; 14, PCB substrate; 15, first flow channel; 16, second flow channel; 17, nozzle; 18, suction pipe; 19, through hole; 20, input pipe; 21, return pipe; 22, corrugated hose; 23, first connecting pipe; 24, second connecting pipe; 25, rotating frame; 26, drive shaft; 27, cam; 28, guide frame; 29, positioning frame; 30, motor; 31, cleaning tank; 311, first water washing tank; 312, pickling tank; 313, second water washing tank; 314, air drying tank. Detailed implementation manners
[0021] Next, the technical solutions in the present invention will be clearly and completely described in conjunction with the drawings in the present invention. In addition, the forms of each structure described in the following embodiments are only examples. A wet equipment for the vertical electrolytic subtractive method with fine lines below 3μm / 3μm involved in the present invention is not limited to the structures described in the following embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.
[0022] The present invention provides a wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm, including a liquid storage tank 1. A electrolytic etching tank 2 is fixedly connected to the upper end of the liquid storage tank 1. A guide rod 3 is fixedly connected inside the electrolytic etching tank 2. A guide wheel 4 is slidably connected to the circumferential surface of the guide rod 3. A rotating shaft 5 is rotatably connected inside the guide wheel 4. A spray disc 6 is fixedly connected to the right end of the rotating shaft 5. A titanium cathode plate 7 is fixedly connected to the right end of the spray disc 6. Bottom plates 8 are fixedly connected to both the left and right sides of the upper end of the electrolytic etching tank 2. A guide post 9 is fixedly connected to the upper end of the bottom plate 8. A sliding plate 10 is slidably connected to the circumferential surface of the guide post 9. A connecting plate 11 is fixedly connected to the upper end of the sliding plate 10. The connecting plate 11 on the left side is fixedly connected to the spray disc 6, and the connecting plate 11 on the right side is fixedly connected to a mounting bracket 12. A quick-release mechanism 13 is arranged inside the mounting bracket 12. A PCB substrate 14 is fixedly connected inside the quick-release mechanism 13. During operation, the titanium cathode plate 7 is fixed to the right end of the spray disc 6, and then the PCB substrate 14 is fixed to the mounting bracket 12 through the quick-release mechanism 13. Then, an appropriate amount of current is supplied to the titanium cathode plate 7 by an external rectifier to form an electric field. Combining with the chemical reaction between the potion obtained in the liquid storage tank 1 and the copper on the surface of the PCB substrate 14, the problem of insufficient reaction uniformity of the spraying structure is solved. Coupled with the spraying of the nozzles 17 and the adsorption of the suction pipes 18 in the structure of the spray disc 6, it ensures the flow and uniformity of the electric field ions. When a DC power supply provides an appropriate amount of current, the metal ions on the anode will migrate towards the cathode direction, and at the same time, an oxidation reaction occurs on the anode, and the metal ions are oxidized to metal ions, thereby realizing the etching of the metal surface. The ion reaction migration solves the problem that the atomized particle molecules are not small enough and uneven. Then, the slider reciprocates up and down on the circumferential surface of the guide post 9, driving the spray disc 6 and the titanium cathode plate 7 to reciprocate up and down with the mounting bracket 12 and the PCB substrate 14, making the reaction more sufficient and the coverage area wider.
[0023] Further, a first flow channel 15 and a second flow channel 16 are opened inside the spray disc 6. The output end of the first flow channel 15 is fixedly connected to a nozzle 17, and the output end of the second flow channel 16 is fixedly connected to a suction pipe 18. During operation, by injecting the potion into the first flow channel 15, the potion will be sprayed out through the nozzle 17, and then the potion is adsorbed through the suction pipe 18, so that the potion is output through the second flow channel 16, ensuring the flow and uniformity of the electric field ions in the electrolytic etching tank 2.
[0024] Further, a plurality of through holes 19 are opened on the surface of the titanium cathode plate 7, and the through holes 19 correspond to the nozzles 17 and the suction pipes 18 respectively. During operation, through the plurality of through holes 19 opened on the surface of the titanium cathode plate 7, which correspond to the nozzles 17 and the suction pipes 18 respectively, the potion can pass through the titanium cathode plate 7, enabling the potion to circulate in the electrolytic etching tank 2.
[0025] Further, an input pipe 20 and a return pipe 21 are fixedly connected to the front end of the electrolytic etching tank 2. The input pipe 20 is fixedly connected to the first flow channel 15 through a corrugated hose 22, and the return pipe 21 is fixedly connected to the second flow channel 16 through a corrugated hose 22. During operation, the input pipe 20 is connected to the first flow channel 15 and the return pipe 21 is connected to the second flow channel 16 through the corrugated hose 22, which also does not interfere with the input and output of the chemical solution when the spraying disc 6 reciprocates up and down.
[0026] Further, the input pipes 20 are connected through a first connecting pipe 23, and the return pipes 21 are connected through a second connecting pipe 24. The input end of the first connecting pipe 23 is fixedly connected to the spraying pump in the liquid storage tank 1, and the input end of the second connecting pipe 24 is fixedly connected to the vacuum pump in the liquid storage tank 1. During operation, under the action of the spraying pump, the chemical solution in the liquid storage tank 1 can be pumped out and sprayed through the nozzle 17, and under the action of the vacuum pump, the chemical solution in the electrolytic etching tank 2 can be sucked out through the suction pipe 18, thereby realizing the effect of circulating the chemical solution in the electrolytic etching tank 2.
[0027] Further, a rotating frame 25 is fixedly connected to the upper end of the bottom plate 8. A driving shaft 26 is rotatably connected inside the rotating frame 25. A cam 27 is fixedly connected to the circumferential surface of the driving shaft 26. A guiding frame 28 is slidably connected to the circumferential surface of the cam 27. The guiding frame 28 is fixedly connected to the sliding plate 10. During operation, by controlling the rotation of the driving shaft 26, the driving shaft 26 will drive the cam 27 to rotate. After the cam 27 rotates, it drives the guiding frame 28 to move up and down. The guiding frame 28 drives the sliding plate 10 to move up and down, and the sliding plate 10 drives the connecting plate 11 to move up and down, thereby achieving the effect of driving the spraying disc 6 and the titanium cathode plate 7 and the mounting frame 12 and the PCB substrate 14 to reciprocate up and down, making the reaction of the PCB substrate 14 more sufficient and the coverage area wider.
[0028] Further, a positioning frame 29 is fixedly connected to the upper end of the bottom plate 8. A motor 30 is fixedly connected to the rear end of the positioning frame 29. The output end of the motor 30 is fixedly connected to the driving shaft 26. The driving shaft 26 is rotatably connected to the positioning frame 29. During operation, by controlling the operation of the motor 30, the effect of driving the driving shaft 26 to rotate is achieved.
[0029] Further, a cleaning tank 31 is fixedly connected to the upper end of the liquid storage tank 1. A first water washing tank 311, a pickling tank 312, a second water washing tank 313 and a drying tank 314 are sequentially arranged inside the cleaning tank 31. During operation, when the etching of the PCB substrate 14 is completed, it is placed in the first water washing tank 311 to wash the chemical solution on the surface, then pickled in the pickling tank 312, then placed in the second water washing tank 313 for water washing, and finally placed in the drying tank 314 for drying, thereby achieving the effect of cleaning the PCB substrate 14 after the etching is completed.
[0030] Working principle of the present invention: Fix the titanium cathode plate 7 at the right end of the spray disc 6, then fix the PCB substrate 14 on the mounting rack 12 through the quick-release mechanism 13. Then, apply an appropriate amount of current to the titanium cathode plate 7 through an external rectifier to form an electric field. Combine the chemical solution obtained in the liquid storage tank 1 with the copper on the surface of the PCB substrate 14 to generate an electrochemical reaction, solving the problem of insufficient reaction uniformity of the spraying structure. Under the action of the spray pump, the chemical solution in the liquid storage tank 1 can be pumped out and sprayed through the nozzle 17. Under the action of the vacuum pump, the chemical solution in the electrolytic etching tank 2 can be sucked out through the suction pipe 18, thus realizing the effect of circulating the chemical solution in the electrolytic etching tank 2, ensuring the flow and uniformity of electric field ions. When the DC power supply provides an appropriate amount of current, the metal ions on the anode will migrate towards the cathode direction, and at the same time, an oxidation reaction occurs on the anode, and the metal ions are oxidized to metal ions, thus realizing the etching of the metal surface. The ion reaction migration solves the situation that the atomized particle molecules are not small enough and uneven. Then, by controlling the operation of the motor 30, the motor 30 drives the drive shaft 26 to rotate, the drive shaft 26 drives the cam 27 to rotate, after the cam 27 rotates, it drives the guide frame 28 to move up and down, the guide frame 28 drives the slide plate 10 to move up and down, and the slide plate 10 drives the connecting plate 11 to move up and down, thereby achieving the effect of driving the spray disc 6, the titanium cathode plate 7, the mounting rack 12, and the PCB substrate 14 to move up and down reciprocally, making the reaction of the PCB substrate 14 more sufficient and the coverage area wider. When the etching of the PCB substrate 14 is completed, place it in the first water washing tank 311 to wash the chemical solution on the surface, then perform pickling in the pickling tank 312, then place it in the second water washing tank 313 for water washing, and finally place it in the air drying tank 314 for air drying, thereby achieving the effect of cleaning the PCB substrate 14 after the etching is completed.
[0031] Finally, several points should be noted: First, in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, which can be mechanical connection or electrical connection, or the internal connection of two components, and can be directly connected. "Up", "down", "left", "right", etc. are only used to represent the relative position relationship. When the absolute position of the object being described changes, the relative position relationship may change;
[0032] Secondly: In the attached drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are involved. For other structures, reference can be made to the usual designs. Without conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
[0033] Finally: The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm, including a liquid storage tank (1). Characterized in that: The upper end of the liquid storage tank (1) is fixedly connected with an electrolytic etching tank (2). Inside the electrolytic etching tank (2), a guide rod (3) is fixedly connected. A guide wheel (4) is slidably connected to the circumferential surface of the guide rod (3). A rotating shaft (5) is rotatably connected inside the guide wheel (4). The right end of the rotating shaft (5) is fixedly connected with a spray disc (6). The right end of the spray disc (6) is fixedly connected with a titanium cathode plate (7). On both the left and right sides of the upper end of the electrolytic etching tank (2), a bottom plate (8) is fixedly connected. A guide post (9) is fixedly connected to the upper end of the bottom plate (8). A slide plate (10) is slidably connected to the circumferential surface of the guide post (9). A connecting plate (11) is fixedly connected to the upper end of the slide plate (10). The connecting plate (11) is fixedly connected with the spray disc (6). The connecting plate (11) is fixedly connected with a mounting frame (12). A quick release (13) is arranged inside the mounting frame (12). A PCB substrate (14) is fixedly connected inside the quick release (13).
2. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm according to claim 1. Characterized in that: A first flow channel (15) and a second flow channel (16) are opened inside the spray disc (6). The output end of the first flow channel (15) is fixedly connected with a nozzle (17). The output end of the second flow channel (16) is fixedly connected with a suction pipe (18).
3. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm according to claim 2. Characterized in that: A plurality of through holes (19) are opened on the surface of the titanium cathode plate (7). The through holes (19) correspond to the nozzles (17) and the suction pipes (18).
4. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm according to claim 3. Characterized in that: An input pipe (20) and a return pipe (21) are fixedly connected to the front end of the electrolytic etching tank (2). The input pipe (20) is fixedly connected with the first flow channel (15) through a corrugated hose (22). The return pipe (21) is fixedly connected with the second flow channel (16) through a corrugated hose (22).
5. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm according to claim 4. Characterized in that: The input pipes (20) are connected through a first connecting pipe (23). The return pipes (21) are connected through a second connecting pipe (24). The input end of the first connecting pipe (23) is fixedly connected with a spray pump inside the liquid storage tank (1). The input end of the second connecting pipe (24) is fixedly connected with a vacuum pump inside the liquid storage tank (1).
6. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm according to claim 1. Characterized in that: The upper end of the bottom plate (8) is fixedly connected with a rotating frame (25). A driving shaft (26) is rotatably connected inside the rotating frame (25). A cam (27) is fixedly connected to the circumferential surface of the driving shaft (26). A guiding frame (28) is slidably connected to the circumferential surface of the cam (27). The guiding frame (28) is fixedly connected to the sliding plate (10).
7. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm according to claim 6, characterized in that: A positioning frame (29) is fixedly connected to the upper end of the bottom plate (8). A motor (30) is fixedly connected to the rear end of the positioning frame (29). A fixed connection is provided between the output end of the motor (30) and the driving shaft (26). The driving shaft (26) is rotatably connected to the positioning frame (29).
8. A wet equipment for vertical electrolytic subtractive method for processing microcircuits below 3μm / 3μm according to claim 1, characterized in that: A cleaning box (31) is fixedly connected to the upper end of the liquid storage tank (1). A first water washing tank (311), a pickling tank (312), a second water washing tank (313) and a drying tank (314) are sequentially arranged inside the cleaning box (31).