Cooling device and electronic module

Abstract

The invention relates to a cooling device and an electronic module. The cooling device comprises a flow channel for guiding the flow of the fluid for cooling. The flow is guided in particular from a fluid inlet to a fluid outlet, the fluid inlet and the fluid outlet each being arranged at an end of the flow channel. The flow channel has a first flow path for the fluid in the direction of the first flow axis, a downstream deflection region for the fluid, and a second flow path for the fluid downstream of the deflection region in the direction of the second flow axis. In this case, the second flow axis differs in its spatial orientation from the first flow axis, such that in this way, the fluid flow in the second flow path is diverted to another flow direction relative to the first flow path. At least one cooling fin oriented in the direction of the respective flow axis is arranged in the flow channel within at least one of the flow paths. Furthermore, the flow channel has a plurality of cooling pins, which are arranged in the diverting region according to a pattern layout.

Description

Technical Field

[0001] The invention relates to a cooling device for an electronic module and an electronic module comprising the cooling device. Background Art

[0002] A plurality of electronic modules have a requirement for forming a high heat zone in the electronic module due to power loss, and the heat zone must be dissipated by means of a corresponding cooling device to ensure the operation of the electronic module. A simple heat sink is, for example, a heat-conducting volume body composed of a heat-conducting material, such as aluminum, copper or its alloy, which is thermally connected to the hot zone of the electronic module by one of its sides, especially to a circuit board or an electrical structural element with heat loss, such as a power semiconductor. By transmitting and flowing out the heat to the heat sink, the heat is output to the environment, especially via natural and effective convection. If the heat dissipation performance of such a heat sink is insufficient, the heat dissipation performance can be improved by using an additional air flow caused by aiming at the heat sink by means of a blower. This air-supported heat dissipation usually allows air flow in only one direction, so that there are structural limitations in the implementation. Alternatively, the cooling device through which the liquid flows can also be provided with a flow channel, and the coolant moves through the flow channel by means of a connected pump. When the coolant flows through the area of ​​the hot zone thermally connected to the cooling device, the heat is extracted from the hot zone by absorption in the coolant. The liquid flow follows the direction of the flow channel here, so that the liquid flow can also change its direction. However, the change of direction has an undesirable pressure loss because the liquid is subject to friction on the curved walls of the flow channel and the liquid becomes blocked.

[0003] The structure of a heat exchanger is known from the publication WO 2007 / 104580 A2. The heat exchanger has flow channels arranged side by side, wherein the flow channels are flowed through in two directions, for example by exhaust gas to be cooled. Here, the flow channels themselves are circulated from the outside by a coolant, which then conducts heat from the exhaust gas. The flow channels are rotated 180° from the initial orientation after passing through a deflection region in the flow channels. A continuous cooling element extends through the flow channel, which divides the flow channel into smaller partial channels. In the deflection region, the flow of the fluid through the separated cooling elements is forcibly guided and suffers severe friction losses. As a result, a high pressure loss is generated in the heat exchanger and, if necessary, signs of wear are also generated, which may have an adverse effect on the service life of the heat exchanger.

[0004] European published document EP 0 219 657 A2 discloses a cooling device having a cooling substrate and a plurality of cooling pins arranged on the cooling substrate in a certain pattern. The cooling pins are implemented cylindrically and each has two wing-shaped protruding trapezoidal structural elements. The structural elements of all the cooling pins are oriented in the same direction in the flow direction of the fluid. When flowed around by the liquid, corresponding to the pin height, different flow layers are formed due to the different flow inhibition effects of the trapezoidal structural elements. Summary of the Invention

[0005] The object of the present invention is to show high heat dissipation performance in a cooling device or an electronic module while having a low pressure loss in the flow of a cooling fluid for heat dissipation.

[0006] This object is solved by a cooling device of an electronic module according to the present invention and an electronic module including such a cooling device.

[0007] The present invention relates to a cooling device for an electronic module, the cooling device comprising a flow channel for guiding the flow of a fluid for cooling. In particular, the flow is guided from a fluid inlet to a fluid outlet, the fluid inlet and the fluid outlet being arranged at the ends of the flow channel respectively. The flow channel has a first flow path for the fluid in the direction of a first flow axis, a subsequent turning region for the fluid, and a second flow path for the fluid subsequent to the turning region in the direction of a second flow axis. Here, the second flow axis is different from the first flow axis in its spatial orientation, such that in this way, the fluid flow in the second flow path is turned relative to the first flow path (and caused by the turning region) to another flow direction. At least one cooling fin oriented in the direction of the respective flow axis is arranged in the flow channel within at least one of the flow paths. At least one cooling fin has an extension length that reaches at most the length of the associated flow path. The longitudinal extension dimension is always greater than the width and / or height of the cooling fin here. A plurality of cooling fins extend parallel to and spaced apart from each other. In addition, the flow channel has a plurality of cooling pins, which are arranged in the turning region according to a pattern layout. Thus, advantageously, different from additionally known embodiments, in the turning region, more paths with the least resistance are open for the flowing fluid. Thus, the fluid can flow through at different cooling pins and / or between differently arranged cooling pins, so that there is more free space for the flow movement. Here, the cooling pins have a positive impact on the hydrodynamics of the fluid through their spacing from each other and their flow-favorable shape geometry, such that the cooling pins support the flow from the first arranged cooling pin to the last arranged cooling pin in their increased resulting direction change, with the transition to the fluid flow in the turning region of the subsequent flow path. In particular, the direction change of the fluid is achieved here without a large pressure loss. This effect is promoted in particular by cooling pins having a circular or elliptical cross-section. In the case of an elliptical cross-section, the cooling pins are preferably each twisted around their pin axis in a pattern layout. The twist angle of the cooling pins relative to other cooling pins within this pattern layout depends on their position within the turning region here. The cooling pins closest to the turning region and in the transition of the first flow path have an orientation corresponding to the first flow axis or deviate therefrom only by a small twist angle. The farther the cooling pins are from the first flow path and the closer they are positioned to the second flow path, the more the twist angle increases in the same direction of rotation, such that the cooling pins closest to the turning region and in the transition of the second flow path have an orientation corresponding to the second flow axis or deviate therefrom only by a small twist angle. Thus, advantageously, it is achieved that, with cooling pins arranged in a pattern layout in the turning region which otherwise has a pressure loss, high heat dissipation performance can be achieved with a low pressure loss in the fluid.

[0008] It has generally been found advantageous to form the pattern layout, in particular, on the basis of a structured grid of lines, in particular a rectangular grid of lines, a curved grid of lines or a grid of lines with inclined intersections, where the pin axes are then arranged at the grid points of the intersecting grid of lines. The pattern layout regarding the spacing of the cooling pins, their geometry and their positioning and / or orientation in the turning region can be determined by simple experiments or with the aid of previous simulations, taking into account the desired operating parameters of the cooling device.

[0009] In an advantageous embodiment of the cooling device, two flow paths are arranged side by side, where the respective flow axes of the flow paths are inclined to one another at an angle between 5° and 45°, in particular between 5° and 30°, for example between 5° and 15°, in the direction of the arranged turning region. With a smaller angle of inclination, the two flow paths are arranged increasingly parallel to one another. Thus, the flow direction of the fluid corresponds to a one-sided or two-sided open U or V. Overall, a very compact cooling device can be achieved in this way, such that in the assumed x-direction and the assumed y-direction, the thermally adaptable cooling level for heat dissipation purposes can be adapted application-specifically. Here, an optimal compact rectangular embodiment can be used. In addition, the preset inclination of the flow paths relative to one another advantageously ensures that the fluid flows, in particular, at a favorable angle into the turning region from the first flow path, relative to the nearest arranged cooling pins and the channel walls accommodating the cooling pins. Thus, the flow change is promoted already at the beginning, since the conditions for flowing through or past between the cooling pins can be achieved with a reduced inhibition of the fluid flow. In particular in the case of a plurality of cooling fins, in the case of a partial fluid flow being formed within the first and / or second flow path, the inclination and design of the pattern layout of the cooling pins are determined such that the partial fluid flow does not meet the nearest arranged cooling pins directly, but preferably flows directionally into the intermediate space between two respective cooling pins.

[0010] A great advantage results in an embodiment of the cooling device in which, in a top view of the pattern layout in the direction of the pin axes, the flow channels in the turning region have a base surface in the form of a trapezoid (in particular a right-angled trapezoid), where the two flow paths of the flow channels are arranged on the bottom side of the base surface at the turning region. Thus, also in the turning region, the largest possible partial surface can be brought close to the cooling surface available for heat dissipation of the electronic module. In the case of a lower inclination of the flow paths relative to one another, an almost rectangularly usable cooling surface is produced in the above-mentioned base surface of the turning region.

[0011] It is advantageous in such an embodiment that the pattern layout can now include cooling pins which are also arranged in the corner regions of the trapezoid, in particular in the corner regions of the sides parallel to the bottom side. The cooling pins can generally additionally maximize the heat dissipation performance within the turning region or the cooling device.

[0012] Thus, overall it is advantageous that in a top view of the pattern layout in the direction of the pin axis, the flow axis of the flow path associated with the fluid inlet intersects the baseline in the turning region at an angle between 95° and 135°, in particular between 95° and 120°, for example between 95° and 105°. Further preferably, another flow path intersects the baseline, in particular at 90°, i.e., perpendicularly. Overall, in this way, the cooling device can be constructed most compactly and, in this case, has a high heat dissipation performance with a reduced pressure loss.

[0013] What is confirmed by a particular embodiment of the cooling device is that in the flow channels within the first and / or second flow path, a plurality of cooling fins arranged side by side are integrally formed by a corrugated plate transverse to the respective flow axis. In particular, in this case, the cooling fins within the two flow paths are formed by an integral corrugated plate. For example, the wall for separating the two flow paths can be realized by a separating element in the form of a wall, which is additionally exemplary formed on a cover element, which overall also provides part of the additional wall of the flow channel. Here, the separating element is sealed relative to the particularly flat bridging surface of the corrugated plate, which connects the cooling fins respectively formed in the first and second flow paths. The corrugated plate is made of a heat-conducting material, in particular made of a metal plate, for example made of one of copper, aluminum or their alloys. Alternatively, the cooling fins can also be constructed from individual plate elements. The cooling fins can in particular be constructed from a stack of laminations, for example to increase the heat capacity.

[0014] Generally advantageously, the cooling device has a heat sink, which has an endothermic surface and a heat-dissipating surface. Here, the cooling fins and the cooling pins are arranged in thermal connection on the heat-dissipating surface, and the heat sink is constructed such that in the thermal contact of the endothermic surface with the electronic module, the heat losses generated during operation in the electronic module are transferred to the cooling fins and the cooling pins. What is confirmed as particularly advantageous is a heat sink in the form of a so-called evaporation chamber, a cooling tube (heat pipe) constructed to a certain extent in a plane. In this way, in combination with the air flow, a very fast, efficient and cooling device with a particularly high heat dissipation performance can be realized.

[0015] Preferably, at least the part of the heat sink including the heat dissipation surface forms at least a part of the flow channel. Therefore, this part can only be provided through the heat dissipation surface. On the contrary, through other mating parts that are particularly U-shaped in cross-section, such as cover elements, by placing the end sides of the two sides on the heat dissipation surface, a flow channel that is circumferentially closed in cross-section is constructed, especially between the fluid inlet and the fluid outlet. Here, the mating part is particularly closely connected to the heat dissipation surface. This can be achieved by material locking, for example, by means of an adhesive layer or a solder layer or by welding. Therefore, the mating part provides the side surface and the basic surface of the flow channel that is arranged opposite to the heat dissipation surface through the two side edges. Alternatively, the side surface can also be provided partially or completely by the heat sink. In this case, recesses are introduced into the heat sink, and the basic surface is functionally constructed as a heat dissipation surface, which also forms one of the basic surfaces of the flow channel. Generally, the mating part can particularly have a flow-supporting shaped structural element connected to the heat sink on its basic surface opposite to the heat dissipation surface. For example, the structural element is at least two, three or more spaced-apart tabs arranged concentrically, especially shaped in an arc, such as semi-circularly. Here, the structural element is arranged relative to the pattern layout of the cooling pins such that the structural element as a guiding element supports the flow past the cooling pins and / or through two corresponding cooling pins. Preferably, the structural element only partially sinks into the flow channel, for example, up to a maximum of 20%-75% of the height of the flow channel, especially up to a maximum of 20%-45%. The height of the flow channel is defined here by the distance dimension between the heat dissipation surface and the basic surface of the mating part opposite thereto. The structural element is arranged without collision relative to the pattern layout of the cooling pins.

[0016] Additional advantages have been demonstrated in an embodiment of the cooling device, in which each cooling pin has a radially protruding connecting flange at its end. The connecting flange is connected to the heat dissipation surface of the heat sink in a material-locking manner, especially in a circumferential manner on the end side and / or on the edge side. In addition, the heat dissipation surface and the cooling pin each have complementary positioning elements in the connection area, which are especially in the form of protruding structural elements and recesses that accommodate the structural elements in a shape-fitting manner. In the functional connection of the complementary positioning elements, a form-fitting and / or force-locking structure is used to determine the position of the cooling pin on the heat dissipation surface before the material connection. If the heat dissipation surface is provided, for example, by a sheet metal part (especially in the case of constructing the heat sink as an evaporation chamber), then, for example, sheet metal protrusions protruding from the heat dissipation surface can be constructed by an extrusion process. The sheet metal protrusions determine the positions of the cooling pins that can be connected to the heat dissipation surface and are arranged in a pattern layout. The cooling pin has a correspondingly shaped void (especially in the form of a circular blind hole) in the region of the radially protruding connecting flange on the end side. By inserting the sheet metal protrusion into the correspondingly shaped void, the especially gapless position of the corresponding cooling pin is determined. The corresponding sheet metal protrusions and the correspondingly shaped voids associated therewith can be matched to each other such that an interference fit or a press fit can be formed in the connection. Alternatively, the sheet metal protrusion can also be replaced by a press-in pin pressed into the sheet metal.

[0017] In a further preferred embodiment of the cooling device, a fluid pump, especially a blower, is arranged at the fluid inlet or the fluid outlet. The fluid pump enables or can enable fluid flow, especially air flow, in the flow channel. Here, the fluid pump arranged at the fluid inlet is implemented as blowing, and the fluid pump arranged at the fluid outlet is implemented as sucking. In addition, the fluid pump is constructed such that, by means of the fluid flow generated by the fluid pump, heat can be guided out of the cooling device from the cooling fins and the cooling pins via the fluid outlet. In particular, in the case of a blower, the possibility of effectively structuring a directional change of the air flow by means of the flow channel is provided.

[0018] A further advantageous embodiment of the cooling device is one in which the flow path directly connected to the fluid pump via the fluid inlet or the fluid outlet on the end side is constructed to be shorter than another flow path, at least by one length dimension, where the combined length of the projection of the directly connected flow path onto the length of the other flow path and the net height of the fluid pump in the direction of the flow axis of the connected flow path do not exceed the length of the other flow path. Thus, the longer flow path determines the maximum length extension of the cooling device, where the flow paths arranged side by side are adapted such that, together with the fluid pump connected there, they extend maximally to this length. Thus, a very advantageous overall structural arrangement is produced, which ensures the compactness of the cooling device.

[0019] The invention also relates to an electronic module, which includes at least one circuit carrier and electrical and / or electronic structural elements that have heat losses during operation. Here, the circuit carrier is thermally connected at least indirectly to a cooling device according to at least one of the above-described embodiments. Thus, a heat flow can be achieved between at least one hot zone of the electronic module and the cooling device thermally connected to the hot zone, so that heat can be effectively removed from the electronic module. In this way, the service life of the electronic module can be ensured during the operating time, and the cooling device can operate very efficiently due to low pressure losses and high heat dissipation capacity.

[0020] In an advantageous embodiment of the electronic module, the electronic module has a housing that houses the circuit carrier, wherein the cooling device projects at least partially through a housing opening on the side of the housing, and / or a fluid pump is arranged on the side of the housing in mechanical connection with the housing and is connected to a fluid inlet or a fluid outlet of the cooling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Further advantages, features and details of the invention result from the following description of preferred embodiments and with the aid of the drawings. Among them:

[0022] Figure 1 A cross-sectional view of an embodiment of the electronic module taken through the region of the hot zone is shown in perspective view,

[0023] Figure 2 Shown in top view is Figure 1 the electronic module,

[0024] Figures 3a - 3c Shown in defined fragmentary views are respectively parts of embodiments of the cooling device included in Figure 1 and Figure 2 respectively.

[0025] In the drawings, components having the same function are respectively provided with the same reference numerals. DETAILED DESCRIPTION

[0026] Figure 1A cross-sectional view of an embodiment of an electronic module 200 is shown in perspective view in the region of the hot zone 22. The electronic module 200 here includes a circuit carrier 10, and at least on one side, electrical and / or electronic structural elements 20 are arranged on the circuit carrier in the case of forming a circuit 21. Here, during the operation of the electronic module 200, at least one or more of the structural elements 20 have heat losses, so that a hot zone 22 is locally formed on the electronic module 200 there. For example, such a structural element 20 can also be a power semiconductor, a microcontroller, a capacitor, a transformer, etc. For example, the electronic module 200 is a control unit, but of course it can also be provided in other forms. The circuit carrier 10 is accommodated in a housing 30 and fixed there. The housing 30 is preferably constructed in a multi-piece manner and, for example, has a housing lower part 31 and a housing upper part 32. At least in the region of the hot zone 22, the circuit carrier 10 is at least indirectly thermally connected to an exemplary embodiment of a cooling device 100. For this purpose, the cooling device 100 includes a heat sink 110 having a heat absorption surface 111 and a heat dissipation surface 112. The heat sink 110 is also exemplarily arranged above at least one of the electrical and / or electronic structural elements 20 having heat losses in the region of the hot zone 22, and the two are thermally connected to each other through a thermal coupling layer 40, especially a TIM layer (thermal interface material). Heat is transferred to or absorbed by the heat sink 110 through the coupling layer 40 in the case of forming a heat flow. The hot zone 22 can be dissipated by heat absorption or heat flow with the aid of the cooling device 100. The heat sink 110 is preferably an evaporation chamber, but is sometimes also referred to as a flat heat pipe, especially when a large amount of heat should be quickly dissipated. The heat dissipation principle is generally known and is based on repeated evaporation and condensation processes. With the evaporation chamber, effective heat diffusion is additionally generated in the region of the hot zone 22. Alternatively, the heat sink 110 can also be applied in other forms, for example, as a metal volume body made of especially one of aluminum, copper or their alloys. The absorbed heat is transferred to the heat dissipation surface 112 through an effective heat flow, and is transferred to a heat dissipation structure 120 arranged on the heat dissipation surface 112 there. The heat dissipation structure 120 is arranged in a flow channel 130 of the cooling device 100 here. The wall 135 of the flow channel 130 is formed by the heat dissipation surface 112 of the heat sink 110 here. In the case of an evaporation chamber as the heat sink 110, the evaporation chamber is provided by a metal plate. The other wall part of the flow channel 130 is provided by a cover element 140 which is part of the cooling device 100. The cover element 140 is located on the heat dissipation surface 112 at the edge side here and is hermetically sealed with respect to the heat dissipation surface. The cooling device 100 protrudes from the housing 30 at least partially through a void in the housing upper part 32, for example. Preferably, the cooling device 100 is mechanically connected to the housing 30, especially the housing upper part 32, by means of a threaded connection, for example.

[0027] Figure 2 Is shown in a top viewFigure 1The electronic module 200, wherein the cover element 140 is shown transparently for better understanding. The flow guidance S (exemplarily directed in one direction) of the fluid 150 to be cooled can be achieved via the flow channel 130. The fluid then flows through the heat dissipation structure 120 and continues to absorb and carry away heat there. It can be recognized that the flow channel 130 has a first flow path 130.1 in the direction of the first flow axis S1 of the fluid 150, a subsequent turning region 130.3 for the fluid 150, and a second flow path 130.2 that is subsequent to the turning region 130.3 in the direction of the second flow axis S2 of the fluid 150. In the turning region 130.3, the flow direction of the fluid 150 is changed starting from the orientation of the first flow axis S1, such that the orientation of the second flow axis S2 is different from that of the first flow axis S1. Inside the flow channel 130, the heat dissipation structure 120 arranged there is implemented in different forms locally. Thus, in at least one of the flow paths 130.1, 130.2, preferably in both flow paths, the heat dissipation structure 120 is respectively configured as at least one or more cooling fins 120.1 arranged parallel to each other and preferably oriented in the direction of the respective flow axes S1, S2. In contrast, the heat dissipation structure 120 in the turning region 130.3 is configured in the form of cooling pins 120.2, and the cooling pins are arranged in a defined pattern layout M. In the shown spatial coordinate system, the pattern layout M has a plurality of cooling pins 120.2 oriented in the direction of the x-axis and a plurality of cooling pins 120.2 arranged at intervals from each other in the corresponding line arrangement in the direction of the y-axis. The line arrangement coincides with a rectangular line grid G here, and the pin axes of the respective cooling pins 120.2 are arranged at the grid points of the intersecting line grid. In addition to the rectangular line grid, the cooling pins 120.2 can also be arranged as the pattern layout M according to a curved line grid or a line grid with obliquely intersecting grid lines. Similarly, the line grid G can be twisted relative to the x-axis or y-axis in other embodiments of the cooling device 100. In this embodiment, the two flow paths 130.1, 130.2 are arranged side by side and almost parallel to each other. Together with the turning region 130.3, they form a U-shaped or V-shaped flow channel 130. Here, the two flow paths 130.1, 130.2 preferably incline towards the turning region 130.3 arranged between them. Thus, the first and the flow axes S1, S2 enclose an angle between 5 - 45°, especially 5 - 30°, for example 5 - 15° with each other at the common intersection point. Preferably, the two flow paths 130.1, 130.2 and the turning region 130.3 respectively at least partially or completely cover the surface of the circuit carrier 10. Due to the inclination of the first flow path 130.1 relative to the second flow path 130.2, the base surface 130.31 of the turning region 130.3 is configured as trapezoidal, and as the inclination angle decreases, this base surface almost becomes rectangular.Here, the cooling pins 120.2 are also arranged in the corner regions of the base surface 130.31 within the turning region 130.3. The flow paths 130.1, 130.2 are respectively arranged on the bottom side 130.31a of the base surface 130.31. Here, the first flow axis S1 preferably intersects the baseline 130.31a at an angle between 95° and 135°, in particular between 95° and 120°, for example between 95° and 105°. In contrast, the second flow axis S2 preferably intersects the baseline 130.31a perpendicularly, i.e., at 90°. Thus, overall, the first flow path 130.1 is arranged obliquely with respect to the line grid G of the pattern layout M of the cooling pins 120.2.

[0028] At the ends of the flow paths 130.1, 130.2 facing away from the turning region 130.3, a fluid inlet 131 or a fluid outlet 132 is respectively constructed. At the fluid inlet 131, the fluid 150 is introduced into the flow channel 130, and at the fluid outlet 132, the fluid 140 is again discharged from the flow channel 130. To achieve fluid flow, a fluid pump 160 is arranged at the fluid inlet 131 or the fluid outlet 132 as an additional part of the cooling device 100. If the fluid inlet 131 is connected to the fluid pump 150, then the fluid pump is implemented as a blowing or pumping one. In contrast, if the fluid pump 160 is connected to the fluid outlet 132, then the fluid pump 160 is constructed as a suction one. Preferably, the fluid pump 160 is constructed as a blower or a suction pump, so that air flow as a cooling fluid within the flow channel 130 can be achieved by means of this fluid pump. Alternatively, the fluid 150 can also be a coolant, such as water, wherein the fluid pump 160 is designed to achieve the liquid flow of this coolant. Generally preferably, the fluid pump 160 is mechanically connected to the housing 30, in particular the upper housing part 32.

[0029] For a compact implementation of the cooling device 110 or the electronic module 200, the flow paths 130.1, 130.2 coupled to the fluid pump 160 at the end side are constructed shorter than the other flow paths 130.1, 130.2. This implementation enables that the combined length L of the projections of the directly coupled flow paths 130.1, 130.2 onto the length of the other flow paths 130.1, 130.2 and the net height H of the fluid pump 160 in the direction of the flow axes S1, S2 of the coupled flow paths 130.1, 130.2 do not exceed the length L of the other flow paths 130.1, 130.2 here.

[0030] Figures 3a - 3c Separate fragmentary views show a part of the cooling device 100 included in Figure 1 and Figure 2 respectively.

[0031] Figure 3aShown again separately is the heat dissipation structure 120 disposed on the heat dissipation surface 112 of the heat sink 110. The heat dissipation surface 112 is, for example or preferably, a sheet element of an evaporation chamber (as the heat sink 110). The cooling fins 120.1 disposed as part of the heat dissipation structure 120 in at least one or both of the flow paths 130.1, 130.2 are preferably integrally formed by a corrugated plate, which is thermally connected to the heat dissipation surface 112 of the heat sink 110, for example, by material locking. Here, the cooling fins 120.1 of the first and second flow paths 130.1, 130.2 are connected to each other via a particularly flat bridging surface 120.1a. A separating element is closely located on this bridging surface, which is particularly formed on the cover element 140 and separates the first and second flow paths 130.1, 130.2 from each other or forms the first and second flow paths as part of the channel wall 135. Alternatively, the cooling fins 120.1 can be separately made of corrugated plates for the two flow paths 130.1, 130.2 respectively. Further alternatively, the cooling fins 120.2 can be separately made of sheet elements or stacks of sheets respectively.

[0032] Figure 3b A fragment of the electronic module 200 in the region of the cooling pins 120.2 is shown. Here, the heat sink 110 is shown as an evaporation chamber, including a lower sheet 111a and an upper sheet 112a. However, the subsequent embodiments are also applicable to other forms of heat sinks 110 that are correspondingly adapted. Here, each cooling pin 120.2 has a radially protruding connecting flange 120.2a at its end. In particular, the connecting flange is connected to the heat dissipation surface 112 of the heat sink 110 by material locking 125 around the end side and / or edge side, for example, by welding. The heat dissipation surface 112 and the cooling pins 120.2 have complementary positioning elements 115 in the connection region, which are in the form of protruding structural elements 115.1 and recesses 115.2 that accommodate the structural elements 115.1 in a shape - adapted manner. In the functional connection of the complementary positioning elements 115, a form - fit and / or force - fit is thus constructed to determine the position of the corresponding cooling pins 120.2 on the heat dissipation surface 112 before material connection.

[0033] Figure 3c Shown is the cover element 140, which together with the heat dissipation surface 112 forms a wall 135 that encloses the flow channel 130 in a closed - loop manner in cross - section. In the turning region 130.3, the cover element 140 also has flow - supporting, protruding structural elements 140.1 that are respectively formed on the cover element 140. The structural elements 140.1 are formed, for example, as at least two, three or more spaced - apart tabs arranged concentrically, and are particularly formed in an arc shape, for example, a semi - circular shape. The structural elements 140.1 are arranged without collision with respect to the pattern layout M of the cooling pins 120.2.

Claims

1. A cooling device (100) for an electronic module (200), comprising a flow channel (130) for guiding the flow of a fluid (150) to be cooled, in particular from a fluid inlet (131) to a fluid outlet (132), wherein: The flow channel (130) comprises a first flow path (130.1) for the fluid (150) in the direction of a first flow axis (S1), a deflection region (130.3) for the fluid (150) arranged downstream and a second flow path (130.2) for the fluid (150) in the direction of a second flow axis (S2) arranged downstream of the deflection region (130.3), wherein the second flow axis (S2) differs from the first flow axis (S1) in its spatial orientation, and wherein at least one cooling fin (120.1) oriented in the direction of the respective flow axis (S1, S2) is arranged in the flow channel (130) within at least one of the flow paths (130.1, 130.2), It is characterized in that the flow channel (130) has a plurality of cooling pins (120.2), which are arranged in the deflection area (130.3) according to a pattern layout (M).

2. The cooling device (100) according to claim 1, characterized in that: The two flow paths (130.1, 130.2) are arranged side by side, wherein the corresponding flow axes (S1, S2) of the two flow paths are inclined to each other in the direction of the arranged deflection area (130.3) at an angle (α) between 5-45°, in particular between 5-30°, for example between 5-15°.

3. The cooling device (100) according to claim 1 or 2, characterized in that: In a top view of the pattern layout (M) in the direction of the pin axis, the flow channel (130) in the turning area (130.3) has a basic surface (130.31) in the form of a trapezoid, in particular a right-angled trapezoid, wherein the two flow paths (130.1, 130.2) of the flow channel (130) are arranged on the bottom side (130.31a) of the basic surface in the turning area (130.3).

4. The cooling device (100) according to claim 3, characterized in that: The pattern layout (M) comprises cooling pins (120.2), which are also arranged in the corner regions of the trapezoid, in particular in the corner regions of the sides parallel to the bottom side (130.31a).

5. The cooling device (100) according to claim 3 or 4, characterized in that: In a top view of the pattern layout (M) in the direction of the pin axis, the flow axis (S1, S2) of the flow path (130.1, 130.2) associated with the fluid inlet (131) intersects the baseline (130.31a) in the turning area (130.3) at an angle (β) between 95° and 135°, in particular between 95° and 120°, for example between 95° and 105°.

6. The cooling device (100) according to any one of the preceding claims, characterized in that In the flow channel (130) within the first flow path (130.1) and / or the second flow path (130.2), a plurality of cooling fins (120.1) arranged side by side, in particular the cooling fins (120.1) within the two flow paths (130.1, 130.2) are constructed integrally by means of a corrugated plate transverse to the corresponding flow axis (S1, S2).

7. The cooling device (100) according to any one of the preceding claims, characterized in that The cooling device (100) has a heat sink (110), in particular in the form of an evaporation chamber, the heat sink having a heat absorbing surface (111) and a heat dissipating surface (112), wherein the cooling fins (120.1) and the cooling pins (120.2) are arranged on the heat dissipating surface (112) in a thermally connected manner, and the heat sink (110) is constructed so that when the heat absorbing surface (111) is in thermal contact with the electronic module (200), heat losses generated in the electronic module (200) during operation are transferred to the cooling fins (120.1) and the cooling pins (120.2).

8. The cooling device (100) according to claim 7, characterized in that: A portion of the heat sink (110) that at least includes the heat sink surface (112) forms at least a portion of the flow channel (130).

9. The cooling device (100) according to claim 7 or 8, characterized in that: The portion of the heat sink (110) comprising the heat dissipation surface (112) and a cover element (140) arranged flat on the portion of the heat sink (110) together form a flow channel (130) which is enclosed in cross section, in particular between the fluid inlet (131) and the fluid outlet (132).

10. The cooling device (100) according to any one of claims 7 to 9, characterized in that: Each cooling pin (120.2) has a radially protruding connecting flange (120.2a) at its end, and the connecting flange is connected to the heat dissipation surface (112) of the heat dissipation body (110) by means of material locking (125) in a circumferential manner, in particular at the end side and / or at the edge side, wherein the heat dissipation surface (112) and the cooling pin (120.2) have complementary positioning elements (115) in the connection area, and the complementary positioning elements are in the form of a protruding structural element (115.1) and a recess (115.2) that accommodates the structural element (115.1) in a shape-fitting manner, wherein in the functional connection of the complementary positioning elements (115), a shape-locking and / or force-locking structure is used to determine the position of the cooling pin (120.2) on the heat dissipation surface (112) before material connection.

11. The cooling device (100) according to any one of the preceding claims, characterized in that A fluid pump (160), in particular a blower, is arranged at the fluid inlet (131) or the fluid outlet (132) to form a fluid flow, in particular an air flow, in the flow channel (130), wherein the fluid pump (160) arranged at the fluid inlet (131) is implemented as a blowing pump, and the fluid pump (160) arranged at the fluid outlet (132) is implemented as a suction pump, and the fluid pump (160) is constructed so that heat is guided out of the cooling fin (120.1) and the cooling pin (120.2) from the cooling device (100) via the fluid outlet (132) by means of the generated fluid flow.

12. The cooling device (100) according to claim 11, characterized in that: A flow path (130.1, 130.2) directly connected to the fluid pump (160) via the fluid inlet (131) or the fluid outlet (132) at the end side is constructed shorter than another flow path (130.1, 130.2), at least by one length dimension, wherein a combined length (L) of the directly connected flow path (130.1, 130.2) projected onto a length (l) of the other flow path (130.1, 130.2) and a clear height (H) of the fluid pump (160) in the direction of a flow axis (S1, S2) of the connected flow path (130.1, 130.2) do not exceed the length (l) of the other flow path (130.1, 130.2).

13. An electronic module (200) comprising at least one circuit carrier (10) and electrical and / or electronic components (20) having heat losses during operation, wherein: The circuit carrier (10) is at least indirectly thermally connected to a cooling device (100) according to any one of the preceding claims.

14. The electronic module (200) according to claim 13 and claim 9, 11 or 12, characterized in that The electronic module (200) has a housing (30) for accommodating the circuit carrier (10), wherein the cooling device (100) at least partially protrudes through a housing recess on the housing side, and / or the fluid pump (160) is arranged on the housing side, in particular mechanically connected to the housing (30) and connected to a fluid inlet (131) or a fluid outlet (132) of the cooling device (100).

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