Heat dissipation back splint and electronic equipment
By introducing thermal insulation intervals into the heat dissipation back clip, the cooling capacity loss problem caused by the magnet being close to the cold guide plate is solved, and the heat dissipation efficiency and user experience are improved.
Patent Information
- Application Number
- CN202510289316.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2025-06-13
AI Technical Summary
In the existing heat dissipation back clip, the magnet is close to the cold guide plate, causing heat conduction, causing cooling capacity loss and affecting the heat dissipation efficiency.
A heat dissipation back clip is designed, using a heat insulation bracket, a cold guide plate, a semiconductor refrigeration plate and a magnetic suction piece. A heat insulation interval is set between the cold guide plate and the magnetic suction piece to increase the heat transfer thermal resistance and reduce the loss of cooling capacity.
By reducing the cooling capacity loss, the cooling capacity of the heat dissipation back clip is improved, the heat dissipation efficiency of electronic devices is enhanced, and the user's thermal experience is improved.
Smart Images
Figure CN120152226A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of heat dissipation of electronic devices, and particularly to a heat dissipation back clip and an electronic device provided with the heat dissipation back clip. Background Art
[0002] In response to the increasing heat dissipation requirements of existing electronic devices such as mobile phones in scenarios such as games and live broadcasts, some current mobile phones use heat dissipation back clips for heat dissipation; the heat dissipation back clip generally pumps out the heat of the electronic device through a TEC refrigeration chip and then dissipates it to the environment through a fan. In order to facilitate the user experience of the heat dissipation back clip and increase the expandability of the added value of the heat dissipation back clip, the existing heat dissipation back clip is detachably positioned on the back of the electronic device by a magnetic attraction method. In order to ensure the strength of the magnetic attraction, the magnets of the heat dissipation back clip are usually placed under the cold guide plate and around the TEC refrigeration chip; when the TEC refrigeration chip starts to work, the temperature of the cold end of the TEC refrigeration chip drops rapidly. Since the cold guide plate is closely attached to the cold end of the TEC refrigeration chip, the temperature of the cold guide plate also drops rapidly. However, the magnets of the existing heat dissipation back clip are closely attached to the cold guide plate, and the heat of the magnets is conducted to the cold guide plate, causing the temperature of the cold guide plate to rise to a certain extent and resulting in cold loss. Summary of the Invention
[0003] The present application provides a heat dissipation back clip for reducing cold loss, and an electronic device provided with the heat dissipation back clip.
[0004] A heat dissipation back clip provided by the present application, the heat dissipation back clip includes a heat insulation bracket, a cold guide plate, a thermoelectric cooling plate and a magnetic attraction member, the cold guide plate is arranged on one side of the heat insulation bracket; the thermoelectric cooling plate is arranged on the heat insulation bracket, and the cold end of the thermoelectric cooling plate contacts the cold guide plate; the magnetic attraction member is arranged on the heat insulation bracket, the magnetic attraction member is close to the cold guide plate, and there is a heat insulation interval between the magnetic attraction member and the cold guide plate.
[0005] The present application also provides an electronic device, which includes a middle frame, a main board, a heat-conducting back cover, and a heat dissipation back clip; the main board is arranged in the inner cavity of the middle frame, the heat-conducting back cover covers the back of the middle frame, the heat dissipation back clip is magnetically connected to the heat-conducting back cover, the heat dissipation back clip includes a heat insulation bracket, a cold guide plate, a thermoelectric cooling plate and a magnetic attraction member, the cold guide plate is arranged on one side of the heat insulation bracket; the thermoelectric cooling plate is arranged on the heat insulation bracket, the cold end of the thermoelectric cooling plate contacts the cold guide plate; the magnetic attraction member is arranged on the heat insulation bracket, the magnetic attraction member is close to the cold guide plate, and there is a heat insulation interval between the magnetic attraction member and the cold guide plate, and the cold generated by the heat dissipation back clip is conducted to the heat-conducting back cover.
[0006] The heat dissipation back clip of the present invention is positioned at the back of the electronic device. The heat generated during the operation of the electronic device is conducted to the heat-conducting back cover. Since the cold end of the semiconductor refrigeration plate contacts the cold-conducting plate, the operation of the semiconductor refrigeration plate causes the cold quantity generated at its cold end to be conducted to the cold-conducting plate, so that the cold quantity on the cold-conducting plate is conducted to the heat-conducting back cover of the electronic device, thereby realizing efficient and rapid heat dissipation of the electronic device. Since there is a heat insulation interval between the cold-conducting plate and the magnetic attraction member, the heat transfer thermal resistance between the cold-conducting plate and the magnetic attraction member is increased, the heat exchange amount between the magnetic attraction member and the cold-conducting plate is reduced, and the cold quantity on the cold-conducting plate conducted to the magnetic attraction member is reduced. Thus, the cold quantity at the cold end of the cold-conducting plate can be reduced, the refrigeration capacity of the heat dissipation back clip is increased, the heat dissipation efficiency of the electronic device is improved, and the thermal experience of the user using the electronic device is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the implementation manners will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0008] Figure 1 It is a three-dimensional structural schematic diagram of the heat dissipation back clip in one embodiment of the present application.
[0009] Figure 2 It is Figure 1 a three-dimensional structural schematic diagram of the heat dissipation back clip from another perspective in
[0010] Figure 3 It is Figure 1 a side structural schematic diagram of the heat dissipation back clip in
[0011] Figure 4 It is Figure 1 a sectional view of the heat dissipation back clip in
[0012] Figure 5 It is Figure 1 a three-dimensional structural exploded schematic diagram of the heat dissipation back clip in
[0013] Figure 6 It is Figure 2 a three-dimensional structural exploded schematic diagram of the heat dissipation back clip in
[0014] Figure 7 It is Figure 5 a further three-dimensional structural exploded schematic diagram of the heat dissipation back clip in
[0015] Figure 8 It is Figure 6 a further three-dimensional structural exploded schematic diagram of the heat dissipation back clip in
[0016] Figure 9 It isFigure 7 Further three-dimensional structural decomposition schematic diagram of the heat dissipation back clip in
[0017] Figure 10 is Figure 8 Further three-dimensional structural decomposition schematic diagram of the heat dissipation back clip in
[0018] Figure 11 Three-dimensional structural schematic diagram of the electronic device in one embodiment of the present application.
[0019] Figure 12 is Figure 11 Three-dimensional structural schematic diagram of the electronic device from another perspective in
[0020] Figure 13 is Figure 11 Three-dimensional structural decomposition schematic diagram of the electronic device in
[0021] Figure 14 is Figure 12 Three-dimensional structural decomposition schematic diagram of the electronic device in
[0022] Main label description:
[0023] 100, heat dissipation back clip; 20, heat insulation bracket; 201, first side; 202, positioning ring groove; 203, connection hole; 204, clamping groove; 205, second side; 220, first mounting hole; 223, positioning plate; 224, positioning cylinder; 225, positioning hole; 226, positioning flange; 227, card slot; 40, heat conduction plate; 42, heat insulation interval; 44, circuit board; 442, avoidance opening; 443, second mounting hole; 46, heat dissipation component; 47, radiator; 470, heat conduction substrate; 471, accommodation space; 472, heat dissipation fins; 4702, first fixing hole; 4720, ventilation slot; 473, wind shield; 4732, wire passing slot; 48, fan; 481, fan body; 4812, air inlet slot; 4814, air outlet slot; 483, fan bracket; 4830, positioning part; 4831, positioning piece; 4832, connecting piece; 4835, supporting part; 4837, second fixing hole; 49, covering component; 490, covering shell; 491, outer peripheral wall; 4901, inner cavity; 4912, air outlet; 4914, clamping block; 492, cover plate; 4921, clamping column; 4922, air inlet; 4924, connecting ring groove; 4925, arc-shaped supporting piece; 4926, locking hole; 496, protection frame; 4961, positioning ring; 4963, baffle; 4965, ventilation hole; 4966, card hole; 50, semiconductor refrigeration plate; 60, magnetic attraction part; 62, heat insulation part; 300, electronic device; 310, middle frame; 320, main board; 322, heat source; 330, heat conduction back cover; 340, battery; 350, magnet. Detailed implementation manners
[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0025] In addition, the descriptions of the following embodiments refer to the attached drawings for illustrating specific embodiments in which the present application can be implemented. The directional terms mentioned in the present application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only refer to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application.
[0026] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "installed", "connected", "connected", "disposed on..." shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0027] Please refer to Figures 1-4, in one embodiment of the present invention, the heat dissipation back clip 100 is used to dissipate heat from an electronic device, and the back of the electronic device has a magnet; the heat dissipation back clip 100 includes a heat insulation bracket 20, a cold conduction plate 40, a semiconductor refrigeration plate 50 and a magnetic attraction member 60. The cold conduction plate 40 is disposed on one side of the heat insulation bracket 20; the semiconductor refrigeration plate 50 is disposed on the heat insulation bracket 20, and the cold end of the semiconductor refrigeration plate 50 contacts the cold conduction plate 40; the magnetic attraction member 60 is disposed on the heat insulation bracket 20, the magnetic attraction member 60 is close to the cold conduction plate 40, and there is a heat insulation gap 42 between the magnetic attraction member 60 and the cold conduction plate 40, that is, the magnetic attraction member 60 and the cold conduction plate 40 are thermally isolated through the heat insulation gap 42, and neither the cold quantity nor the heat quantity on the cold conduction plate 40 will be conducted to the magnetic attraction member 60. When using the heat dissipation back clip 100, the heat dissipation back clip 100 is placed on the back of the electronic device, and the magnetic attraction member 60 of the heat dissipation back clip 100 adsorbs with the magnet of the electronic device, so that the heat dissipation back clip 100 is positioned on the electronic device, and the cold conduction plate 40 is attached to the back of the electronic device; the semiconductor refrigeration plate 50 of the heat dissipation back clip 100 works to generate cold quantity at the cold end of the semiconductor refrigeration plate 50, and the cold quantity is directly conducted to the cold conduction plate 40, and the cold quantity on the cold conduction plate 40 is conducted to the back of the electronic device to quickly and efficiently dissipate heat from the heat source in the electronic device. Optionally, the thickness of the heat insulation gap 42 is greater than or equal to 20 μm, and the thermal conductivity of the air in the heat insulation gap 42 is as low as 0.02 W / mK.
[0028] It can be understood that the cold conduction plate 40 can be made of a polymer material with high cold conduction efficiency to enhance the cold conduction effect of the cold conduction plate 40. The cold conduction plate 40 can be, but is not limited to, a liquid-cooled film cold conduction plate, an ultra-thin cold conduction plate, a semiconductor cold conduction plate, an aluminum cold conduction plate, a copper cold conduction plate, etc. The electronic device can be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart watch, a VR head-mounted display, a smart wearable device, etc., and the heat source can be, but is not limited to, a processor, an image sensor, a memory module, a radio frequency circuit, a screen display circuit, a WIFI module, a Bluetooth module or a camera module, etc. "Connection" in the description of the embodiments of the present invention includes two cases of direct connection and indirect connection. For example, the connection between A and B includes the direct connection between A and B or the connection through a third element C or more other elements. Connection also includes two cases of integrated connection and non-integrated connection. Integrated connection means that A and B are integrally formed and connected, and non-integrated connection means that A and B are non-integrally formed and connected.
[0029] The heat dissipation back clip 100 of the present invention is positioned on the back of the electronic device, and the heat generated by the operation of the electronic device is conducted to the thermal conductive back cover. Since the cold end of the semiconductor refrigeration plate 50 is in direct contact with the cold conduction plate 40, the semiconductor refrigeration plate 50 works to generate cold energy at its cold end and conduct it to the cold conduction plate 40, so that the cold energy on the cold conduction plate 40 is conducted to the thermal conductive back cover of the electronic device, so as to achieve efficient and rapid heat dissipation of the electronic device. Since there is a heat insulation interval 42 between the cold conduction plate 40 and the magnetic suction member 60, the heat transfer resistance between the cold conduction plate 40 and the magnetic suction member 60 is increased, the heat exchange between the magnetic suction member 60 and the cold conduction plate 40 is reduced, and the cold energy on the cold conduction plate 40 is reduced. Conducted to the magnetic suction member 60, the cold energy at the cold end of the cold conduction plate 40 can be reduced, the cooling capacity of the heat dissipation back clip 100 is increased, the heat dissipation efficiency of the electronic device is improved, and the thermal experience of the user using the electronic device is enhanced.
[0030] Optionally, a heat insulating member 62 is provided in the heat insulating space 42 between the cold conducting plate 40 and the magnetic member 60, and the heat insulating member 62 is clamped by the magnetic member 60 and the cold conducting plate 40; the heat insulating member 62 is used for thermal isolation between the cold conducting plate 40 and the magnetic member 60, reducing the heat exchange between the cold conducting plate 40 and the magnetic member 60, and reducing the cold amount on the cold conducting plate 40 to be conducted to the magnetic member 60. Specifically, the heat insulating member 62 is attached to the surface of the cold conducting plate 40 facing the semiconductor refrigeration plate 50, the heat insulating member 62 is arranged around the semiconductor refrigeration plate 50, and the magnetic member 60 and the semiconductor refrigeration plate 50 are spaced apart from each other, and the magnetic member 60 is attached to the surface of the heat insulating member 62 facing away from the cold conducting plate 40, and the magnetic member 60 and the semiconductor refrigeration plate 50 are spaced apart from each other.
[0031] like Figure 4 As shown, a first mounting hole 220 is provided in the middle of the thermal insulation bracket 20, and the first mounting hole 220 passes through the two opposite side surfaces of the thermal insulation bracket 20, and the semiconductor refrigeration plate 50 can be accommodated in the first mounting hole 220, and the cold end and the hot end of the semiconductor refrigeration plate 50 are respectively exposed to the two opposite side surfaces of the thermal insulation bracket 20; one side surface of the thermal insulation bracket 20 is provided with a positioning ring groove 202 around the first mounting hole 220, and the magnetic attraction member 60 is a magnetic attraction ring positioned in the positioning ring groove 202; when the semiconductor refrigeration plate 50 is accommodated in the first mounting hole 220 of the thermal insulation bracket 20 and the magnetic attraction ring is positioned in the positioning ring groove 202, the cold end of the semiconductor refrigeration plate 50 and the magnetic attraction member 60 are located on the same side of the thermal insulation bracket 20; the cold conduction plate 40 can cover the positioning ring groove 202, so that the thermal insulation member 62 is located between the magnetic attraction ring and the cold conduction plate 40.
[0032] like Figures 5-10As shown, on the side of the heat insulation bracket 20 provided with the positioning ring groove 202, there is a clamping groove 204. The positioning ring groove 202 communicates with the clamping groove 204. The heat insulation member 62 is a heat insulation ring plate accommodated in the positioning ring groove 202, and the heat conduction plate 40 is positioned in the clamping groove 204. Specifically, the heat insulation bracket 20 is of a disc-shaped structure. On the first side surface 201 of the heat insulation bracket 20, there is a circular clamping groove 204. The positioning ring groove 202 is located at the bottom surface of the heat insulation bracket 20 where the clamping groove 204 is located. The positioning ring groove 202 surrounds the edge of the clamping groove 204 in a circle. The first mounting hole 220 is located in the middle of the bottom surface of the heat insulation bracket 20 where the clamping groove 204 is located. In this embodiment, the first mounting hole 220 is a rectangular hole, and the semiconductor refrigeration plate 50 is a rectangular plate that can be positioned in the first mounting hole 220. In other embodiments, the first mounting hole 220 can also be, but is not limited to, a circular hole, an oval hole, or a polygonal hole, etc. The semiconductor refrigeration plate 50 can also be, but is not limited to, a circular semiconductor refrigeration plate, an oval semiconductor refrigeration plate, or a polygonal semiconductor refrigeration plate; the semiconductor refrigeration plate 50 can be positioned in the first mounting hole 220. On the bottom surface of the heat insulation bracket 20 at the positioning ring groove 202, there are a plurality of connection holes 203. The plurality of connection holes 203 are arranged in a circle around the circumferential direction of the positioning ring groove 202. In this embodiment, there are four connection holes 203 on the bottom surface of the positioning ring groove 202.
[0033] Optionally, on the side of the heat insulation bracket 20 facing away from the magnetic attraction member 60, around the first mounting hole 220, there is a positioning plate 223 for positioning the semiconductor refrigeration plate 50. Specifically, on the second side surface 205 of the heat insulation bracket 20 facing away from the first side surface 201, around the edge of the first mounting hole 220, there are a plurality of protruding positioning plates 223. The semiconductor refrigeration plate 50 is accommodated in the first mounting hole 220, and the plurality of positioning plates 223 surround the outer peripheral surface of the semiconductor refrigeration plate 50. Around the first mounting hole 220 on the second side surface 205 of the heat insulation bracket 20, there are a plurality of positioning cylinders 224. The plurality of positioning cylinders 224 are respectively close to the outer peripheral edge of the heat insulation bracket 20. Each positioning cylinder 224 is provided with a positioning hole 225 along its axial direction; in this embodiment, around the first mounting hole 220 on the second side surface 205 of the heat insulation bracket 20, there are four positioning cylinders 224, and the four positioning cylinders 224 are respectively close to the outer peripheral edge of the heat insulation bracket 20; the positioning holes 225 of the four positioning cylinders 224 are respectively aligned with the four connection holes 203. On the peripheral edge of the second side surface 205 of the heat insulation bracket 20, there is a positioning flange 226. The positioning flange 226 is close to the heat insulation bracket 20 and surrounds the heat insulation bracket 20 in a circle around the circumferential direction. On the positioning flange 226, there are a plurality of card slots 227. The plurality of card slots 227 are arranged at intervals in a circle along the circumferential direction of the positioning flange 226; in this embodiment, there are eight card slots 227 on the positioning flange 226, and the eight card slots 227 are evenly spaced in a circle along the circumferential direction of the positioning flange 226.
[0034] As Figure 9 and Figure 10As shown, the heat dissipation back clip 100 further includes a heat dissipation component 46. The heat dissipation component 46 includes a radiator 47 and a fan 48. The radiator 47 is disposed on the side of the heat insulation bracket 20 away from the magnetic attraction member 60, and the radiator 47 contacts the hot end of the semiconductor refrigeration plate 50. A receiving space 471 is provided on the side of the radiator 47 away from the semiconductor refrigeration plate 50, and the fan 48 is received in the receiving space 471. The heat generated at the hot end of the semiconductor refrigeration plate 50 is conducted to the radiator 47, and the cold air generated by the operation of the fan 48 is discharged from the heat dissipation back clip 100 after heat exchange with the radiator 47. In this embodiment, the radiator 47 includes a rectangular heat conduction substrate 470, a plurality of heat dissipation fins 472, and two windshields 473. A part of the heat dissipation fins 472 is disposed at one end of one surface of the heat conduction substrate 470, and another part of the heat dissipation fins 472 is disposed at the opposite end of the one surface of the heat conduction substrate 470. The two windshields 473 are respectively located at the opposite side edges of the heat conduction substrate 470. The heat dissipation fins 472 at the opposite ends of the heat conduction substrate 470 and the two windshields 473 enclose the receiving space 471, and a ventilation groove 4720 is formed between every two adjacent heat dissipation fins 472. The ventilation groove 4720 communicates with the receiving space 471. The fan 48 can be completely received in the receiving space 471 to reduce the superimposed thickness of the fan 48 and the radiator 47, and can reduce the overall thickness of the heat dissipation back clip 100.
[0035] In this embodiment, the length direction of each heat dissipation fin 472 is parallel to the length direction of the heat conduction substrate 470, and the length direction of the windshield 473 is parallel to the length direction of the heat conduction substrate 470; the length direction of the ventilation groove 4720 between every two adjacent heat dissipation fins 472 is parallel to the length direction of the heat conduction substrate 470. One of the windshields 473 is provided with a wire passing groove 4732 communicating with the receiving space 471, and a wire passes through the wire passing groove 4732 and is connected to the fan 48 in the receiving space 471. Optionally, the opposite ends of the plurality of heat dissipation fins 472 at the same end of the heat conduction substrate 470 are respectively formed into arc shapes. A plurality of first fixing holes 4702 are provided on the surface of the heat conduction substrate 470 away from the heat dissipation fins 472, and the plurality of first fixing holes 4702 are respectively located around the heat conduction substrate 470. When the radiator 47 is placed on the heat insulation bracket 20, the plurality of first fixing holes 4702 respectively face the plurality of positioning holes 225 of the heat insulation bracket 20. In this embodiment, four first fixing holes 4702 are provided on the surface of the heat conduction substrate 470 away from the heat dissipation fins 472, and the four first fixing holes 4702 are respectively located at the four corners of the heat conduction substrate 470.
[0036] Understandably, the heat sink 47 can be made of, but not limited to, heat dissipation materials such as aluminum, copper, high thermal conductivity polymers, etc.; the heat sink 47 can be a heat conduction substrate 470 thinned aluminum extrusion, die-casting, shovel teeth, inserted teeth and other types of heat sinks, or a more lightweight thin metal sheet heat sink, or a heat sink made of high thermal conductivity polymer material. In other embodiments, the heat conduction substrate 470 can be, but not limited to, a circular sheet, an elliptical sheet, a polygonal sheet, etc., and a plurality of heat dissipation fins are arranged at intervals around the heat conduction substrate 470, and these heat dissipation fins enclose a receiving space.
[0037] The fan 48 includes a fan main body 481 and a fan frame 483. The fan main body 481 is connected to the fan frame 483, and the fan frame 483 and the fan main body 481 are accommodated in the accommodation space 471 together. The fan main body 481 has an air inlet groove 4812 and an air outlet groove 4814. When the fan frame 483 and the fan main body 481 are accommodated in the accommodation space 471, the air inlet groove 4812 faces away from the heat conduction substrate 470, and the air outlet groove 4814 faces the ventilation groove 4720; since the fan frame 483 and the fan main body 481 are both accommodated in the accommodation space 471, therefore, the fan frame 483 and the fan main body 481 do not increase the thickness of the heat sink 47. The fan frame 483 includes a positioning portion 4830 and a supporting portion 4835. The positioning portion 4830 is connected to one end of the supporting portion 4835, and the end of the supporting portion 4835 away from the positioning portion 4830 is connected to the fan main body 481. The positioning portion 4830 includes a positioning piece 4831 and a connecting piece 4832. The connecting piece 4832 is connected to the edge of the positioning piece 4831, and the connecting piece 4832 is parallel to the positioning piece 4831. One end of the supporting portion 4835 is connected to the middle of the positioning piece 4831; in this embodiment, the positioning piece 4831 is a circular piece, and a plurality of connecting pieces 4832 are connected to the outer peripheral surface of the circular piece, and the plurality of connecting pieces 4832 are evenly spaced around the circumference of the circular piece. A second fixing hole 4837 is provided at one end of each connecting piece 4832 away from the positioning piece 4831. The supporting portion 4835 is a supporting cylinder. One end of the supporting cylinder away from the positioning portion 4830 supports the fan main body 481, the other end of the supporting cylinder is connected to the middle of the positioning piece 4831, and the axis of the supporting cylinder is collinear with the axis of the positioning piece 4831.
[0038] Optionally, the heat dissipation back clip 100 further includes a circuit board 44, on which a plurality of electronic devices are provided. A relief opening 442 is provided in the middle of the circuit board 44. The circuit board 44 is clamped between the radiator 47 and the heat insulation bracket 20. The semiconductor refrigeration plate 50 passes through the relief opening 442. The hot end of the semiconductor refrigeration plate 50 contacts the heat conduction substrate 470 of the radiator 47, and the cold end of the semiconductor refrigeration plate 50 contacts the heat conduction plate 40. In this embodiment, the relief opening 442 is a rectangular groove, and the opening area of the rectangular groove is larger than the opening area of the first mounting hole 220 of the heat insulation bracket 20. When the circuit board 44 is placed on the second side surface 205 of the heat insulation bracket 20, the four positioning plates 223 are respectively received in the relief opening 442, and the positioning plates 223 are attached to the inner peripheral surface of the relief opening 442. A plurality of second mounting holes 443 are provided on the circuit board 44. The plurality of second mounting holes 443 are located around the relief opening 442, and the plurality of second mounting holes 443 are respectively aligned with the positioning holes 225 of the plurality of positioning cylinders 224 of the heat insulation bracket 20. Specifically, the circuit board 44 is a circular circuit board, and the diameter of the circuit board 44 is less than or equal to the inner diameter of the positioning flange 226, so that the circuit board 44 can be received in the inner cavity of the positioning flange 226.
[0039] The heat dissipation back clip 100 also includes a covering component 49, which is used to cover the heat dissipation component 46. The covering component 49 includes a covering shell 490 and a protective frame 496 connected to the covering shell 490. The covering shell 490 includes an outer peripheral wall 491 and a cover plate 492. The periphery of the cover plate 492 is sealed and connected to the edge of one end of the outer peripheral wall 491 away from the heat insulation bracket 20. The outer peripheral wall 491 and the cover plate 492 surround the inner cavity 4901 of the covering shell 490. The middle part of the cover plate 492 is provided with an air inlet 4922, and the air inlet 4922 is connected to the inner cavity 4901 of the covering shell 490. In this embodiment, the air inlet 4922 is a circular through hole. The outer peripheral wall 491 is provided with an air outlet 4912, and the air outlet 4912 is connected to the inner cavity 4901 of the covering shell 490. In this embodiment, the peripheral wall 491 is a cylinder, and the cover plate 492 is a circular plate, the outer periphery of which is sealedly connected to the edge of one end of the cylinder. The peripheral wall 491 is provided with two air outlets 4912, which are located at opposite ends of the radial direction of the peripheral wall 491. When the cover shell 490 covers the radiator 47, the two air outlets 4912 are respectively opposite to the ventilation slots 4720 at opposite ends of the radiator 47, and the cover shell 490 covers the fan body 481 and the radiator 47 to play a protective role. Since the air inlet 4922 is located in the middle of the cover plate 492 and the air outlet 4912 is located on the peripheral wall 491, the air inlet 4922 and the air outlet 4912 are respectively located at different positions of the cover shell 490, and the interval between the air inlet 4922 and the air outlet 4912 is large, which can prevent the hot air discharged from the air outlet 4912 from flowing back to the air inlet 4922, thereby improving the heat dissipation effect. In other embodiments, more than three air outlets 4912 are provided on the peripheral wall 491, and the more than three air outlets 4912 are evenly spaced and arranged in a circle around the circumference of the peripheral wall 491.
[0040] The inner surface of the cover plate 492 is provided with a connecting ring groove 4924 around the air inlet 4922. The cover plate 492 is provided with clamping posts 4921 on the inner bottom surface of the connecting ring groove 4924. The outer peripheral edge of the protection frame 496 can be clamped in the connecting ring groove 4924, and the clamping posts 4921 can be clamped in the protection frame 496. In this embodiment, the cover plate 492 is provided with a plurality of clamping posts 4921 on the inner bottom surface of the connecting ring groove 4924, and the plurality of clamping posts 4921 are arranged in a circle around the circumferential direction of the connecting ring groove 4924. The inner surface of the cover plate 492 is provided with arc-shaped support pieces 4925 around the air inlet 4922, and the arc-shaped support pieces 4925 are used to connect to the fan frame 483. In this embodiment, the inner surface of the cover plate 492 is provided with two arc-shaped support pieces 4925 around the air inlet 4922, and the two arc-shaped support pieces 4925 are located at opposite ends in the radial direction of the air inlet 4922. Each arc-shaped support piece 4925 is provided with a locking hole 4926. The inner peripheral surface of the outer peripheral wall 491, on the side away from the cover plate 492, is provided with a plurality of clamping blocks 4914, and the plurality of clamping blocks 4914 are arranged in a circle at intervals around the circumferential direction of the outer peripheral wall 491. The plurality of clamping blocks 4914 can be respectively clamped in a plurality of card slots 227 of the heat insulation bracket 20. In this embodiment, the inner peripheral surface of the outer peripheral wall 491, on the side away from the cover plate 492, is provided with eight clamping blocks 4914, and the eight clamping blocks 4914 are evenly arranged in a circle at intervals around the circumferential direction of the outer peripheral wall 491.
[0041] The protection frame 496 includes a positioning ring 4961 and a baffle 4963. The baffle 4963 is located in the inner cavity of the positioning ring 4961 and is connected to the inner peripheral surface of the positioning ring 4961. The positioning ring 4961 can be clamped in the connecting ring groove 4924 of the cover plate 492. The baffle 4963 is provided with a plurality of ventilation holes 4965, and the plurality of ventilation holes 4965 are arranged at intervals around the circumferential direction of the positioning ring 4961. In this embodiment, the baffle 4963 is provided with four ventilation holes 4965, and the four ventilation holes 4965 are evenly arranged in a circle around the circumferential direction of the positioning ring 4961. The positioning ring 4961 is provided with card holes 4966. In this embodiment, the positioning ring 4961 is provided with a plurality of card holes 4966, and the plurality of card holes 4966 are arranged in a circle around the circumferential direction of the positioning ring 4961. The plurality of clamping posts 4921 can be respectively clamped in the plurality of card holes 4966. The protection frame 496 faces the fan main body 481 to play a role in protecting the fan main body 481.
[0042] Optionally, the heat insulator 62 completely covers the side of the magnetic attraction member 60 facing the heat conduction plate 40. In this embodiment, the magnetic attraction member 60 is an annular magnetic sheet that can be positioned in the positioning ring groove 202 of the heat insulation bracket 20, and the heat insulator 62 is an annular heat insulation sheet that can be positioned in the positioning ring groove 202. The outer diameter of the annular heat insulation sheet is equal to the outer diameter of the annular magnetic sheet, and the inner diameter of the annular heat insulation sheet is equal to the inner diameter of the annular magnetic sheet. In other embodiments, the positioning ring groove 202 of the heat insulation bracket 20 can be set as, but not limited to, a rectangular ring groove, a polygonal ring groove, an elliptical ring groove, etc. The magnetic attraction member 60 can be, but not limited to, a rectangular magnetic ring, a polygonal magnetic ring, an elliptical magnetic ring, etc. The heat insulator 62 can be, but not limited to, a rectangular annular heat insulation sheet, a polygonal annular heat insulation sheet, an elliptical annular heat insulation sheet, etc.
[0043] Optionally, the thermal conductivity of the heat insulator 62 is less than or equal to 0.1 W / mK. Specifically, the thermal conductivity of the heat insulator 62 can be, but not limited to, 0.1 W / mK, 0.09 W / mK, 0.094 W / mK, 0.095 W / mK, 0.098 W / mK, etc.; the thickness of the heat insulator 62 is greater than or equal to 50 μm. Specifically, the thickness of the heat insulator 62 can be, but not limited to, 50 μm, 52 μm, 55 μm, 56 μm, 58 μm, 59 μm, 60 μm, etc. The heat insulator 62 can be a heat-insulating aerogel ring sheet that can be attached to the magnetic attraction member 60 or the heat conduction plate 40; or the heat insulator 62 can be an aerogel coating that is directly coated on the outer surface of the magnetic attraction member 60 or coated on the surface of the heat conduction plate 40 facing the heat insulator 62. Specifically, the heat insulator 62 can be a flexible material such as PTFE fiber composite SiO2 aerogel, glass fiber composite SiO2 aerogel, etc., and the flexible material is die-cut and attached to the heat insulator 62.
[0044] When assembling the heat dissipation back clip 100, snap the positioning ring 4961 of the protection frame 496 onto the connection ring groove 4924 of the covering shell 490, so that the plurality of clamping posts 4921 of the covering shell 490 are respectively snapped into the plurality of clamping holes 4966 of the protection frame 496; connect the end of the supporting portion 4835 of the fan bracket 483 away from the positioning portion 4830 to the fan body 481, place the fan body 481 and the fan bracket 483 in the inner cavity 4901 of the covering shell 490, so that the fan body 481 is located between the two arc-shaped supporting pieces 4925, the fan bracket 483 is placed on the two arc-shaped supporting pieces 4925, and the plurality of second fixing holes 4837 are respectively aligned with the plurality of locking holes 4926. Fasteners such as screws pass through the second fixing holes 4837 and are connected to the locking holes 4926 to connect the fan assembly 48 to the inside of the covering shell 490; place the semiconductor refrigeration plate 50 in the first mounting hole 220 of the heat insulation bracket 20, place the circuit board 44 on the second side surface 205 of the heat insulation bracket 20, insert the positioning plate 223 into the avoidance opening 442 and the positioning plate 223 abuts against the inner peripheral surface of the avoidance opening 442. The four second mounting holes 443 of the circuit board 44 are respectively aligned with the positioning holes 225 of the four positioning cylinders 224 of the heat insulation bracket 20; place the radiator 47 on the side of the circuit board 44 away from the heat insulation bracket 20, so that the semiconductor refrigeration plate 50 is attached to the surface of the heat conduction substrate 470 away from the heat dissipation fins 472, so that the four first fixing holes 4702 of the radiator 47 are respectively aligned with the four second mounting holes 443 of the circuit board 44; pass four fasteners such as screws through the four connection holes 203 of the heat insulation bracket 20 and the four second mounting holes 443 of the circuit board 44 respectively and then lock them to the four first fixing holes 4702 of the radiator 47 to fixedly connect the circuit board 44 and the radiator 47 to the heat insulation bracket 20; position the magnetic part 60 in the positioning ring groove 202 of the heat insulation bracket 20, place the heat insulation part 62 in the positioning ring groove 202 and the heat insulation part 62 is connected to the magnetic part 60, position the heat conduction plate 40 in the clamping groove 204 of the heat insulation bracket 20, so that the heat insulation part 62 is clamped between the magnetic part 60 and the heat conduction plate 40, the cold end of the semiconductor refrigeration plate 50 contacts the heat conduction plate 40, and the hot end of the semiconductor refrigeration plate 50 contacts the heat conduction substrate 470 of the radiator 47; cover the covering assembly 49 on the radiator 47, so that the positioning flange 226 abuts against the inner peripheral surface of the outer peripheral wall 491 of the covering shell 490, so that the eight clamping blocks 4914 are respectively snapped into the eight clamping grooves 227 of the heat insulation bracket 20 to connect the fan assembly 48 and the covering assembly 49 to the heat insulation bracket 20, and the fan assembly 48 is accommodated in the accommodation space 471 of the radiator 47, and the air outlet 4912 is aligned with the ventilation groove 4720 of the radiator 47.
[0045] When using the heat dissipation back clip 100, connect the heat dissipation back clip 100 to the back of the electronic device. The heat dissipation back clip 100 and the electronic device can be connected by, but not limited to, magnetic connection, adhesive connection, snap connection or other means. The heat dissipation back clip 100 is electrically connected to an external power supply. The cold generated by the operation of the semiconductor refrigeration plate 50 controlled by the circuit board 44 is conducted to the back of the electronic device through the heat conduction plate 40, thereby cooling the electronic device; the heat generated by the operation of the semiconductor refrigeration plate 50 is conducted to the radiator 47. At the same time, the circuit board 44 controls the fan body 481 to operate to suck external air into the inner cavity 4901 of the covering shell 190 from the air inlet 4922, and then passes through the ventilation slots 4720 of the radiator 47. After the external air exchanges heat with the heat dissipation fins 472 of the radiator 47, it is discharged from the air outlet 4912.
[0046] The cold generated by the semiconductor refrigeration plate 50 of the heat dissipation back clip 100 of the present invention can quickly cool the back of the electronic device. At the same time, through the cooperation of the radiator 47 and the fan body 481, the heat generated by the semiconductor refrigeration plate 50 can be quickly and efficiently dissipated to the external environment, improving the heat dissipation efficiency. Since there is a heat insulation interval 42 between the heat conduction plate 40 and the magnetic attraction member 60, the heat transfer thermal resistance between the heat conduction plate 40 and the magnetic attraction member 60 is increased, the heat exchange amount between the magnetic attraction member 60 and the heat conduction plate 40 is reduced, and the cold on the heat conduction plate 40 is reduced from being conducted to the magnetic attraction member 60, thereby reducing the cold amount at the cold end of the heat conduction plate 40, increasing the refrigeration capacity of the heat dissipation back clip 100, and improving the heat dissipation efficiency of the electronic device.
[0047] Please refer to Figures 11-14 , this application also provides an electronic device 300, which includes a middle frame 310, a main board 320, a heat conduction back cover 330, a battery 340 and a heat dissipation back clip 100. The main board 320 and the battery 340 are respectively arranged in the inner cavity of the middle frame 310. The battery 340 is used to supply power to electronic components such as the main board 320 and the display screen. There is a heat source 322 on the main board 320. The heat conduction back cover 330 covers the back of the middle frame 310. The heat dissipation back clip 100 is magnetically connected to the heat conduction back cover 330 so that the heat dissipation back clip 100 is detachably positioned on the heat conduction back cover 330. The cold generated by the heat dissipation back clip 100 is conducted to the heat conduction back cover 330 to dissipate heat from the heat source 322 of the electronic device 300.
[0048] Specifically, a magnet 350 is provided inside the electronic device 300. When the heat dissipation back clip 100 is attached to the heat conduction back cover 330, the magnet 350 faces the magnetic attraction member 60 and magnetically attracts each other, so that the heat dissipation back clip 100 is detachably positioned on the back of the heat conduction back cover 330. In this embodiment, the magnet 350 is a magnetic ring plate, and the magnetic ring plate is positioned on the heat conduction back cover 330. In this embodiment, the outer diameter and the inner diameter of the magnet 350 are respectively equal to the outer diameter and the inner diameter of the magnetic attraction member 60. In other embodiments, the outer diameter of the magnet 350 is smaller than the outer diameter of the magnetic attraction member 60 and larger than the inner diameter of the magnetic attraction member 60, and the inner diameter of the magnet 350 is larger than the inner diameter of the magnetic attraction member 60 and smaller than the outer diameter of the magnetic attraction member 60.
[0049] The heat generated by the heat source 322 of the electronic device 300 in this application is conducted to the heat conduction back cover 330. The semiconductor refrigeration plate of the heat dissipation back clip 100 operates to generate cold at its cold end, which is conducted to the heat conduction back cover 330 through the heat conduction plate 40, so as to improve the heat dissipation efficiency of the electronic device and enhance the thermal experience of the user when using the electronic device.
[0050] The above are the implementation manners of the embodiments of the present invention. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the embodiments of the present invention, several improvements and retouches can be made, and these improvements and retouches are also regarded as the protection scope of the present invention.
Claims
1. A heat dissipation back clip, characterized in that: The heat dissipation back clip comprises: Thermal insulation bracket; A cooling plate, the cooling plate being arranged on one side of the heat insulation bracket; A semiconductor refrigeration plate, the semiconductor refrigeration plate is arranged on the thermal insulation bracket, and the cold end of the semiconductor refrigeration plate contacts the cold conduction plate; and A magnetic attraction component is arranged on the heat insulation bracket, the magnetic attraction component is close to the cold conduction plate, and a heat insulation space is provided between the magnetic attraction component and the cold conduction plate.
2. The heat dissipation back clip according to claim 1, characterized in that: A heat insulating component is arranged in the heat insulating space, and the heat insulating component is clamped by the magnetic attraction component and the cold conduction plate.
3. The heat dissipation back clip according to claim 2, characterized in that: A mounting hole is provided in the middle of the thermal insulation bracket, and the semiconductor refrigeration plate is accommodated in the mounting hole; a positioning ring groove is provided around the mounting hole on one side of the thermal insulation bracket, the magnetic attraction component is a magnetic attraction ring positioned in the positioning ring groove, the thermal insulation component is accommodated in the positioning ring groove, the cold conduction plate covers the positioning ring groove, and the thermal insulation component is located between the magnetic attraction ring and the cold conduction plate.
4. The heat dissipation back clip according to claim 3, characterized in that: The side of the heat insulation bracket provided with a positioning ring groove is provided with a clamping groove, the positioning ring groove is connected to the clamping groove, the heat insulation component is a heat insulation ring accommodated in the positioning ring groove, and the cold conduction plate is positioned in the clamping groove.
5. The heat dissipation back clip according to claim 3, characterized in that: A positioning plate is provided around the mounting hole on the side of the heat insulation bracket facing away from the magnetic attraction component, and the positioning plate is used to position the semiconductor refrigeration plate.
6. The heat dissipation back clip according to claim 2, characterized in that: The thermal conductivity of the thermal insulation member is less than or equal to 0.1 W / mK, and the thickness of the thermal insulation member is greater than or equal to 50 μm.
7. The heat dissipation back clip according to claim 2, characterized in that: The thermal insulation component is a thermal insulation aerogel ring sheet, which is attached to the magnetic attraction component or the cold conduction plate; or the thermal insulation component is an aerogel coating, which is directly coated on the outer surface of the magnetic attraction component.
8. The heat dissipation back clip according to any one of claims 1 to 7, characterized in that: The heat dissipation back clamp also includes a heat dissipation component, which includes a radiator and a fan. The radiator is arranged on a side of the heat insulation bracket away from the magnetic attraction component, and the radiator contacts the hot end of the semiconductor refrigeration plate. A accommodating space is provided on a side of the radiator away from the semiconductor refrigeration plate, and the fan is accommodated in the accommodating space.
9. The heat dissipation back clip according to claim 8, characterized in that: The heat dissipation back clamp also includes a circuit board, a middle portion of the circuit board is provided with an escape opening, the circuit board is clamped between the heat sink and the heat insulation bracket, and the semiconductor refrigeration plate is inserted through the escape opening.
10. An electronic device, characterized in that: The electronic device comprises a middle frame, a mainboard, a thermally conductive back cover, and a heat dissipation back clip as described in any one of claims 1 to 9; the mainboard is arranged in the inner cavity of the middle frame, the thermally conductive back cover covers the back of the middle frame, the heat dissipation back clip and the thermally conductive back cover are connected by magnetic attraction, and the cold generated by the heat dissipation back clip is conducted to the thermally conductive back cover.