DC-DC converter with high voltage input and large current output

Abstract

The invention relates to a DC-DC converter with high voltage input and large current output, which supports 540V DC input and two paths of DC 24V and DC 32V respectively 160A DC output, and the design difficulty of the DC-DC converter is the design of a heat dissipation structure of a topological space. Accordingly, the integrated supporting beam frame for connecting the upper layer plate and the lower bottom plate is designed, a main body heat dissipation component of the DC-DC converter is formed, MOS tube heat dissipation fixing holes are formed in the two sides of the supporting beam frame, two circular hollow cavities are formed in the middle of the supporting beam frame, a rectangular communication groove is connected with the circular hollow cavities, and the metal oxide semiconductor (MOS) tube heat dissipation fixing holes are formed in the middle of the supporting beam frame. The two ends of the two circular hollow cavities are communicated through the heat dissipation elbows, cooling liquid is contained in the two circular hollow cavities, the pressurizing pipeline pump is further installed in the center of one heat dissipation elbow, the cooling liquid in the two circular cavities rapidly and circularly flows through the push-pull effect of the pressurizing pipeline pump, and the heat dissipation structure is simple in design scheme and high in cost performance and has quite demonstration significance.

Description

Technical Field

[0001] The present invention relates to a DC-DC converter with high voltage input and large current output, which supports a DC input voltage of 540V and two DC outputs of 160A each for DC24V and DC32V, and the continuous working time can exceed 60 minutes; therefore, the design of the heat dissipation space for such a DC-DC conversion device with high voltage input and large current output is itself a huge challenge, especially the design scheme of its low-cost heat conduction structure is more iconic and exemplary. Background Art

[0002] The DC-DC converter with high voltage input and large current output described in the present invention refers to a DC-DC conversion device operating under high voltage and large current conditions. According to the user's requirements, the DC input voltage of this device is DC540V, and the output of each of the two DC (24V and 32V) is not less than 160A, and the reliable continuous working time should exceed 60 minutes. Therefore, there are still great differences between such a DC-DC converter under high power conditions and a low-power DC-DC converter. The biggest difficulty in its design is not how to implement the circuit, because the DC-DC converter is quite mature in terms of circuit implementation. On the contrary, the biggest difficulty in the design is how to achieve heat dissipation of high-power MOS devices in an effective space at a low cost, and at the same time, solve the electromagnetic interference and leakage problems caused by multi-point grounding.

[0003] Obviously, the high-voltage input and high-current output DC-DC converter involved in the present invention is designed to solve the heat dissipation and leakage problems under the condition of high-current output. Some people think that the emergence of silicon nitride MOSFETs seems to solve the heat dissipation problem of DC-DC converters under low-power output conditions, but for the heat wave surges brought by DC-DC converters under high-power output conditions, silicon nitride MOSFETs still seem to be powerless. Accordingly, the present invention proposes an overall most economical and system-optimal design scheme according to the theory of systems engineering. Its main framework adopts a support beam structure connecting the upper board and the lower bottom board, that is, the support beam is an I-shaped aluminum profile heat sink with upper board ribs and lower bottom board ribs. Therefore, the whole machine only needs the front, rear, left, and right aluminum alloy side plates and the support beam structure connecting the upper board and the lower bottom board to enclose a closed body together. Push-pull slots for inserting PCB boards are opened at both the upper and lower ends of the I-shaped aluminum profile, and circular slots with rectangular openings are opened on the outermost side to insert and install the left and right aluminum alloy side plates with heat dissipation ribs respectively; multiple MOSFET heat dissipation fixing holes are opened on both sides of the aluminum profile. The middle part of the aluminum profile is two circular hollow cavities, and a rectangular connecting groove connects the circular hollow cavities. One end of the two circular hollow cavities is connected by a heat dissipation elbow respectively, and the other end of the two circular hollow cavities is connected by a heat dissipation elbow with a booster pipeline pump installed in the middle part. Through the push-pull action of the booster pipeline pump, the coolant in the two circular cavities starts to circulate to achieve the purpose of heat dissipation. Obviously, the connecting groove in the middle part of the circular cavity ensures that the coolant can flow up and down quickly, improving the heat dissipation efficiency. Its low-cost heat dissipation structure is quite exemplary.

[0004] To supplement the coolant, a coolant replenishment injection hole is opened at the top of the main framework aluminum profile; for the needs of reliability and expansion, a four-core CAN FD local bus socket and an equipotential connection screw are installed on the rear panel of the DC-DC converter, and the equipotential connection screw is directly connected to the main framework.

[0005] Conventional DC-DC converters only exist as an ordinary information island of electronic devices. In order to keep up with the development background of the Internet of Things and artificial intelligence trends, the high-voltage input and high-current output DC-DC converter adds an extended CAN FD socket, thus ensuring that this DC-DC converter not only becomes a node of the CAN local bus but also can communicate with the upper computer through networking, strengthening the technological upgrade of the Internet of Things or DeepSeek for high-voltage input and high-current output DC-DC converters; obviously, if combined with a high-power three-phase rectifier device, this kind of DC-DC converter can also be directly applied to the charging pile service station in the community. The high-voltage input and high-current output DC-DC converter based on the CAN FD local bus interface fortunately becomes a standard configuration of an electric vehicle charging pile with extended intelligence. Summary of the Invention

[0006] In view of this, the present invention provides a DC-DC converter with high voltage input and large current output. Its simple heat dissipation topology structure combines the characteristics of cost performance. The specific content is as follows: A DC-DC converter with high voltage input and large current output includes a front panel, a rear panel, an upper panel, a right panel, a left panel, a lower bottom plate, a support beam frame connecting the upper panel and the lower bottom plate, a heat dissipation elbow A, a heat dissipation elbow B, and a pipeline micro-booster pump located at the central position of the heat dissipation elbow B. The key points are as follows: The support beam frame connecting the upper panel and the lower bottom plate is the core component of the DC-DC converter with high voltage input and large current output. It is made of aluminum. The upper panel and the lower bottom plate and the support beam frame connecting the upper panel and the lower bottom plate are of an integrated structure, forming the main body skeleton of the DC-DC converter, and also the main heat dissipation support component of the MOS tube in the DC-DC converter with high voltage input and large current output; A push-pull slot M is opened on the upper panel, and a push-pull slot N is opened on the lower bottom plate. During installation, the right panel and the left panel sequentially pass through the push-pull slot M and the push-pull slot N and then are inserted into the support beam frame; The upper panel, the right panel, the left panel, and the lower bottom plate are all provided with heat dissipation ribs. Among them, fixed installation holes P are opened at both ends of the upper panel, and fixed installation holes Q are opened at both ends of the lower bottom plate. During installation, screws pass through the front panel installation holes on the front panel and then are connected to the fixed installation holes P and the fixed installation holes Q; similarly, screws pass through the rear panel installation holes on the rear panel and then are connected to the fixed installation holes P and the fixed installation holes Q. Since the front panel and the rear panel respectively block the stretching displacement paths of the right panel and the left panel, an integral body is formed after assembly; Circular hollow cavities C and D are respectively opened on the support beam frame connecting the upper panel and the lower bottom plate. A communication groove is opened between the circular hollow cavity C and the circular hollow cavity D. One end of the circular hollow cavity C and the circular hollow cavity D is connected through the heat dissipation elbow A, and the other end of the circular hollow cavity C and the hollow cavity D is also connected through the heat dissipation elbow A. The pipeline micro-booster pump is located in the middle of the heat dissipation elbow A. During operation, the circular hollow cavity C and the circular hollow cavity D are filled with coolant. Driven by the pipeline micro-booster pump, the coolant in the circular hollow cavity C, the circular hollow cavity D, and the communication groove starts to flow, forming an up-and-down through coolant flow loop between the circular hollow cavity C, the circular hollow cavity D, and the communication groove to complete the circulation of the coolant; A coolant filling hole is opened at the central position of the upper panel, and the coolant filling hole is aligned with the circular hollow cavity C. After the coolant is filled, the coolant filling hole is tightly plugged with an injection hole sealing plug to prevent coolant overflow; The support beam frame connecting the upper layer board and the lower bottom board is also provided with screw fixing holes for MOS tubes. First, push and pull PCB board E and PCB board F into the PCB board installation slots X and Y, then bend the MOS tube legs and weld them to PCB board E and PCB board F. Then, use a screwdriver to pass the fixing screws through the installation holes for installing the MOS tube on PCB board E and PCB board F respectively, and fix the heat dissipation surface of the MOS tube on the support beam frame connecting the upper layer board and the lower bottom board; A four-core CAN FD socket and an equipotential terminal are installed on the rear panel. For reliable wiring, the screw of the equipotential terminal is directly connected to the support beam frame connecting the upper layer board and the lower bottom board; Upper layer board installation circular fixing holes are provided on the upper layer board, and lower bottom board installation circular fixing holes are provided on the lower bottom board. According to needs, the DC-DC converter with high voltage input and large current output can be fixed on the installation platform with nuts.

[0007] Furthermore, the support beam frame connecting the upper layer board and the lower bottom board is made of aluminum alloy with excellent heat conduction characteristics, formed by one-time stretching, and undergoes post-treatment of metal anodic oxidation. However, both ends of the support beam frame connecting the upper layer board and the lower bottom board are subjected to wire cutting and shaping treatment.

[0008] Furthermore, the coolant filled through the coolant filling hole is an ethylene glycol antifreeze with strong water absorption, colorless and slightly sweet, and can significantly reduce the freezing point.

[0009] Furthermore, a CAN FD socket is installed on the rear panel. This is an extended CAN interface that supports 64-bit data byte communication. Therefore, it allows the DC-DC converter with high voltage input and large current output to be connected to the upper computer to meet the development needs of artificial intelligence, and enables the DC-DC converter to become an information node of the CAN FD local area network system.

[0010] Furthermore, there is a DC two-core input socket, a DC32V output socket area, and a DC24V output socket area on the front panel. The output sockets are all large single-core structures with separated positive and negative electrodes to support large current output.

[0011] Furthermore, the equipotential terminal provided on the rear panel allows multiple DC power supply devices to be connected in parallel through the equipotential terminal and then grounded at a single point, thus completely eliminating the influence of circulating leakage current caused by potential difference brought by multi-point grounding. Brief Description of the Drawings

[0012] To clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, without creative efforts, other similar accompanying drawings can be obtained by analogy based on these drawings.

[0013] Figure 1 Front external shape of a DC-DC converter with high voltage input and large current output Figure 1 ; Figure 2 Back external shape of a DC-DC converter with high voltage input and large current output Figure 2 ; Figure 3 Front external shape of a DC-DC converter with high voltage input and large current output Figure 3 ; Figure 4 Back external shape of a DC-DC converter with high voltage input and large current output Figure 4 ; Figure 5 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 1 ; Figure 6 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 2 ; Figure 7 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 3 ; Figure 8 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 4 ; Figure 9 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 5 ; Figure 10 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 6 ; Figure 11 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 7 ; Figure 12 Internal view of the aluminum alloy main body framework after removing the PCB board Figure 8 ; Figure 13 Internal view of the aluminum alloy main body framework after adding a double PCB board Figure 1 ; Figure 14 Internal view of the aluminum alloy main body framework after adding a double PCB board Figure 2 ; Figure 15Internal view of the aluminum alloy main body frame after adding a double PCB board Figure 3 ; Figure 16 Internal view of the aluminum alloy main body frame after adding a double PCB board Figure 4 ; Figure 17 Internal view and sectional view of the aluminum alloy main body frame. 1 Front panel

[0015] 1-1 Front panel mounting hole 1-2 DC two-core input socket 1-3 32VDC output socket area 1-4 24VDC output socket area 2 Rear panel 2-1 Rear panel mounting hole 2-2 CAN FD socket 2-3 Equipotential terminal 3 Upper board 3-1 Upper board mounting annular fixing hole 3-2 Coolant filling hole 3-3 PCB board mounting slot X 3-4 Push-pull slot M 3-5 Fixed mounting hole P 4 Right side panel 5 Left side panel 6 Bottom board 6-1 Bottom board mounting annular fixing hole 6-3 PCB board mounting slot Y 6-4 Push-pull slot N 6-5 Fixed mounting hole Q 7 Support beam frame connecting the upper board and the bottom board 7-1 Heat dissipation elbow A 7-2 Heat dissipation elbow B 7-3 Pipeline micro booster pump 7-5 Circular hollow cavity C 7-6 Circular hollow cavity D 7-7 Connecting slot 8-1 PCB board E 8-2 PCB board F 8-3 MOS tube 8-4 Mounting hole for installing MOS tube on the PCB board 9 Injection hole sealing plug Specific implementation method

[0016] The specific implementation manners of the present invention will be described below in conjunction with the accompanying drawings. It should be noted that for simplicity, all mounting screws are omitted in the views.

[0017] A DC-DC converter with high voltage input and large current output includes: a front panel (1), a rear panel (2), an upper layer board (3), a right side board (4), a left side board (5), a lower bottom board (6), a support beam frame (7) connecting the upper layer board and the lower bottom board, a heat dissipation elbow A (7-1), a heat dissipation elbow B (7-2), and a pipeline micro booster pump (7-3) located at the central position of the heat dissipation elbow B (7-2). The key points are as follows: The support beam frame (7) connecting the upper layer board and the lower bottom board is the core component of the DC-DC converter with high voltage input and large current output. It is made of aluminum profile. The upper layer board (3) and the lower bottom board (6) and the support beam frame (7) connecting the upper layer board and the lower bottom board are of an integrated structure, forming the main body framework of the DC-DC converter and also being the main heat dissipation support component for the MOS transistors in the DC-DC converter with high voltage input and large current output; A push-pull type slot M (3-4) is opened on the upper layer board (3), and a push-pull type slot N (6-4) is opened on the lower bottom board (6). During installation, the right side board (4) and the left side board (5) sequentially pass through the push-pull type slot M (3-4) and the push-pull type slot N (6-4) and then are inserted into the support beam frame (7); The upper layer board (3), the right side board (4), the left side board (5), and the lower bottom board (6) are all provided with heat dissipation ribs. Among them, fixed mounting holes P (3-5) are opened at both ends of the upper layer board (3), and fixed mounting holes Q (6-5) are opened at both ends of the lower bottom board (6). During installation, screws pass through the front panel mounting holes (1-1) on the front panel (1) and then are connected to the fixed mounting holes P (3-5) and the fixed mounting holes Q (6-5); similarly, screws pass through the rear panel mounting holes (2-1) on the rear panel (2) and then are connected to the fixed mounting holes P (3-5) and the fixed mounting holes Q (6-5). Since the front panel (1) and the rear panel (2) respectively block the stretching displacement paths of the right side board (4) and the left side board (5), an integral body is formed after assembly; On the support beam frame (7) connecting the upper layer board and the lower bottom board, a circular hollow cavity C (7-5) and a circular hollow cavity D (7-6) are respectively opened. A communication groove (7-7) is opened between the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6). One end of the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) is connected through a heat dissipation elbow A (7-1), and the other end of the circular hollow cavity C (7-5) and the hollow cavity D (7-6) is connected through a heat dissipation elbow A (7-2). The pipeline micro-booster pump (7-3) is located in the middle of the heat dissipation elbow A (7-2). During operation, the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) are filled with coolant. Driven by the pipeline micro-booster pump (7-3), the coolant in the circular hollow cavity C (7-5), the circular hollow cavity D (7-6), and the communication groove (7-7) starts to flow, thus completing the circulation of the coolant, and forming a vertically penetrating loop for the coolant to flow between the circular hollow cavity C (7-5), the circular hollow cavity D (7-6), and the communication groove (7-7). A coolant filling hole (3-2) is opened at the central position of the upper layer board (3), and the coolant filling hole (3-2) is aligned with the circular hollow cavity C (7-5). After the coolant is filled, the coolant filling hole (3-2) is tightly plugged with an injection hole sealing plug (9) to prevent the coolant from overflowing. On the support beam frame (7) connecting the upper layer board and the lower bottom board, screw fixing holes for MOS transistors are also opened. First, the PCB board E (8-1) and the PCB board F (8-2) are pushed and pulled into the PCB board installation slots X (3-3) and the installation slot Y (6-3). Then, the MOS transistor legs are bent and welded to the PCB board E (8-1) and the PCB board F (8-2). Then, a screwdriver is used to pass the fixing screws through the PCB board installation holes (8-4) for installing the MOS transistor on the PCB board E (8-1) and the PCB board F (8-2), and the heat dissipation surface of the MOS transistor is fixed on the support beam frame (7) connecting the upper layer board and the lower bottom board. A four-core CAN FD socket (2-2) and an equipotential wiring terminal (2-3) are installed on the rear panel (2). For reliable wiring, the screw of the equipotential wiring terminal (2-3) is directly connected to the support beam frame (7) connecting the upper layer board and the lower bottom board. Upper layer board installation circular fixing holes (3-1) are opened on the upper layer board (3), and lower bottom board installation circular fixing holes (6-1) are opened on the lower bottom board (6). According to needs, the DC-DC converter with high voltage input and large current output can be fixed on the installation platform with nuts.

[0018] Furthermore, the support beam frame (7) connecting the upper panel and the lower bottom plate is made of aluminum alloy with excellent heat conduction characteristics, formed by one-time stretching, and post-treated by metal anodization. However, wire cutting and shaping treatments are performed at both ends of the support beam frame (7) connecting the upper panel and the lower bottom plate.

[0019] Furthermore, the coolant filled through the coolant filling hole (3-2) is an ethylene glycol antifreeze with strong water absorption, colorless and slightly sweet, and can significantly reduce the freezing point.

[0020] Furthermore, a CAN FD socket (2-2) is installed on the rear panel (2). This is an extended CAN interface that supports 64-bit data byte communication. Therefore, it allows the DC-DC converter with high voltage input and large current output to be connected to the upper computer to meet the development needs of artificial intelligence, and makes the DC-DC converter also become an information node in the CAN FD local area network system.

[0021] Furthermore, there is a DC two-core input socket (1-2), a DC32V output socket area (1-3), and a DC24V output socket area (1-4) on the front panel (1). The output sockets are all large single-core structures with separated positive and negative electrodes to support large current output.

[0022] Furthermore, the equipotential connection terminal (2-3) provided on the rear panel (2) allows multiple DC power supply devices to be connected in parallel through the equipotential connection terminal (2-3) and then grounded at a single point, thus completely eliminating the influence of circulating current leakage caused by potential differences brought by multi-point grounding. Beneficial Effects

[0023] In summary, the DC-DC converter with high voltage input and large current output proposed by the present invention has the following remarkable beneficial effects: First of all, the applicant and the inventor of the present invention unanimously believe that the DC-DC converter has approached maturity in terms of circuit form and there is not much room for innovation. Therefore, in the implementation example, the distribution diagrams of other devices except MOS transistors are not drawn on the PCB board. However, there is a large space for innovation in the heat dissipation structure of this converter. Especially for the DC-DC converter under high-current working conditions, there is a very good three-dimensional topology design scheme in the heat dissipation structure. Therefore, the applicant and the inventor of the present invention proactively introduce the concept of an I-shaped aluminum profile main skeleton into the topology space of the DC-DC converter with high-voltage input and large-current output. The support beam connecting the upper board and the lower bottom board appears in the form of an I-shaped main skeleton. The whole machine only needs the front, rear, left, and right aluminum alloy side plates and the support beam structure connecting the upper board and the lower bottom board to enclose a closed body, and successfully solves four problems with low cost and high reliability: First, a plurality of MOS transistor heat dissipation fixing holes are respectively opened on both sides of the support beam of the aluminum profile, thus solving the uniform design of the heat dissipation structure of high-power MOS devices under high-current conditions; Second, through the design of the circular hollow cavity and the communication groove on the main skeleton and the pipeline micro-booster pump, the heat dissipation efficiency of the DC-DC converter is rapidly improved; Third, through the two circular hollow cavities and the communication groove on the main skeleton as the main structure for storing the coolant, the trouble of usually having to externally hang an additional storage box for the coolant is successfully solved; Fourth, since the support beam connecting the upper board and the lower bottom board directly replaces the upper board and the lower bottom board, the cost performance of the whole machine is better.

[0024] Obviously, the traditional DC-DC converter does not arrange a CAN node, that is, the conventional DC-DC converter usually exists only as an ordinary information island of an electronic device. Without the support of hardware, it can never become an information node of the CAN local bus. In the present invention, an extended CAN FD socket is adopted, thus strengthening the technical upgrade of the Internet of Things or DeepSeek for the DC-DC converter with high-voltage input and large-current output. Obviously, if it is combined with a high-power three-phase rectification device, this DC-DC converter can be directly applied to the charging pile service station in the community. The DC-DC converter with high-voltage input and large-current output based on the CAN FD local bus interface may be upgraded to the standard configuration of an electric vehicle charging pile with extended intelligence.

[0025] In this embodiment, the DC-DC converter with high voltage input and large current output utilizes the groove structure of the I-shaped aluminum profile main body frame, and the PCB circuit board expansion solution is also remarkable because it provides a broad expansion structure mode for the PCB circuit board, making it have the physical significance of being compact, dense, and interconnected. For example, the MOS transistor soldered on the PCB circuit board on the DC output side leans against the main body frame of the aluminum profile, which successfully solves the heat dissipation problem under large current. It can be seen that this heat dissipation mode has strong generalization and coverage capabilities, and the demonstration effect is significant.

[0026] In this embodiment, the equipotential wiring scheme of the DC-DC converter with high voltage input and large current output completely eliminates the possibility of multi-point grounding in the system and the leakage current influence caused by different potential differences after multi-point grounding. Significantly, the equipotential wiring method allows multiple electrical devices to be connected in parallel through the equipotential wiring terminals and then grounded at a single point. Since the equipotential wiring screws are directly connected to the main body frame of the I-shaped aluminum profile and there is only one single path to the ground, it effectively eliminates the multi-point circuits of different electrical devices to the ground and eliminates the hidden danger of circulating current leakage caused by multi-point grounding.

[0027] The above is the preferred implementation scheme of the present invention. In this specification, specific embodiments are used to elaborate the principle and implementation manner of the present invention, which are only used to help those skilled in the art understand the core idea of the present invention and should not be misinterpreted as a limitation of the present invention. Those skilled in the art understand that all changes made to the present invention in form and detail without departing from the spirit and scope of the present invention defined by the appended claims belong to the protection scope of the present invention.

Claims

1. A DC-DC converter with high voltage input and high current output, comprising: The invention is composed of a front panel (1), a rear panel (2), an upper panel (3), a right side panel (4), a left side panel (5), a lower bottom panel (6), a support beam (7) connecting the upper panel and the lower bottom panel, a heat dissipation elbow A (7-1), a heat dissipation elbow B (7-2), and a pipeline micro-boosting pump (7-3) located at the center of the heat dissipation elbow B (7-2), and is characterized in that: The supporting beam (7) connecting the upper plate and the lower base plate is a core component of a DC-DC converter with high voltage input and high current output. It is made of aluminum material. The upper plate (3) and the lower base plate (6) and the supporting beam (7) connecting the upper plate and the lower base plate are an integrated structure and constitute the main skeleton of the DC-DC converter. It is also the main heat dissipation support component of the MOS tube in the DC-DC converter with high voltage input and high current output. The upper plate (3) is provided with a push-pull type embedding groove M (3-4), and the lower plate (6) is provided with a push-pull type embedding groove N (6-4). During installation, the right plate (4) and the left plate (5) are sequentially passed through the push-pull type embedding groove M (3-4) and the push-pull type embedding groove N (6-4) and then inserted into the supporting beam frame (7); The upper plate (3), right side plate (4), left side plate (5) and lower bottom plate (6) are all provided with heat dissipation ribs, wherein the upper plate (3) is provided with fixing installation holes P (3-5) at both ends, and the lower bottom plate (6) is provided with fixing installation holes Q (6-5) at both ends. During installation, the screws are passed through the front panel installation holes (1-1) on the front panel (1) and then connected with the fixing installation holes P (3-5) and the fixing installation holes Q (6-5); similarly, the screws are passed through the rear panel installation holes (2-1) on the rear panel (2) and then connected with the fixing installation holes P (3-5) and the fixing installation holes Q (6-5). Since the front panel (1) and the rear panel (2) respectively block the stretching displacement paths of the right side plate (4) and the left side plate (5), they form a whole after assembly; The supporting beam frame (7) connecting the upper plate and the lower plate is provided with a circular hollow cavity C (7-5) and a circular hollow cavity D (7-6), a connecting groove (7-7) is provided between the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6), one end of the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) are connected via a heat dissipation elbow A (7-1), and the other end of the circular hollow cavity C (7-5) and the hollow cavity D (7-6) are connected via a heat dissipation elbow A (7-2), the pipeline micro booster pump ( 7-3) is located in the middle of the heat dissipation elbow A (7-2). When working, the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) are filled with coolant. Under the push of the pipeline micro-boosting pump (7-3), the coolant in the circular hollow cavity C (7-5), the circular hollow cavity D (7-6) and the connecting groove (7-7) begins to flow, thereby completing the circulation of the coolant, and forming a coolant flow loop that runs vertically between the circular hollow cavity C (7-5), the circular hollow cavity D (7-6) and the connecting groove (7-7); A coolant filling hole (3-2) is opened at the central position of the upper plate (3), and the coolant filling hole (3-2) is aligned with the circular hollow cavity C (7-5). After the coolant is filled, the coolant filling hole (3-2) is tightly plugged with an injection hole sealing plug (9) to prevent the coolant from overflowing. The support beam (7) connecting the upper plate and the lower base plate is also provided with screw fixing holes for the MOS tube. The PCB board E (8-1) and the PCB board F (8-2) are first pushed and pulled into the PCB board mounting groove X (3-3) and the mounting groove Y (6-3). The legs of the MOS tube are then bent and welded to the PCB board E (8-1) and the PCB board F (8-2). Then, fixing screws are respectively passed through the PCB board mounting MOS tube mounting holes (8-4) on the PCB board E (8-1) and the PCB board F (8-2) to fix the heat dissipation surface of the MOS tube to the support beam (7) connecting the upper plate and the lower base plate. A four-core CAN FD socket (2-2) and an equipotential terminal (2-3) are installed on the rear panel (2). To ensure reliable wiring, the screws of the equipotential terminal (2-3) are directly connected to the support beam (7) connecting the upper plate and the lower base plate; The upper plate (3) is provided with an upper plate mounting annular fixing hole (3-1), and the lower plate (6) is provided with a lower plate mounting annular fixing hole (6-1). A DC-DC converter with high voltage input and high current output can be fixed on the mounting platform with nuts as required.

2. The high voltage input, high current output DC-DC converter according to claim 1, characterized in that: The support beam (7) connecting the upper plate and the lower plate is made of an aluminum alloy having excellent heat conduction properties, is formed by one-step stretching, and is post-treated by metal anodizing. However, both ends of the support beam (7) connecting the upper plate and the lower plate are subjected to wire cutting shaping.

3. The high voltage input, high current output DC-DC converter according to claim 1, characterized in that: The coolant added through the coolant filling hole (3-2) is a highly water-absorbent, colorless, slightly sweet ethylene glycol antifreeze liquid that can significantly lower the freezing point.

4. The high voltage input, high current output DC-DC converter according to claim 1, characterized in that: A CAN FD socket (2-2) is installed on the rear panel (2), which is an extended CAN interface supporting 64-bit data byte communication, thereby allowing the high-voltage input, high-current output DC-DC converter to be connected to a host computer to meet the development needs of artificial intelligence and enable the DC-DC converter to become an information node based on the CAN FD local area network system.

5. The high voltage input, high current output DC-DC converter according to claim 1, characterized in that: The front panel (1) has a DC two-core input socket (1-2), a DC32V output socket area (1-3), and a DC24V output socket area (1-4). The output sockets are all large single-core structures with separated positive and negative poles to support large current output.

6. The high voltage input, high current output DC-DC converter according to claim 1, characterized in that: The equipotential terminal (2-3) provided on the rear panel (2) allows multiple DC power supply devices to be connected in parallel through the equipotential terminal (2-3) and then grounded at a unified single point, thereby completely eliminating the influence of circulating current leakage caused by the potential difference brought about by multi-point grounding.

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