Buffering heat dissipation film, display screen assembly and electronic equipment

Abstract

The invention provides a buffer heat dissipation film, a display screen assembly and electronic equipment. The buffer heat dissipation film provided by the embodiment of the invention comprises a heat dissipation layer; the heat dissipation layer is arranged on the substrate, the buffer adhesive film is arranged on one side of the heat dissipation layer, the buffer adhesive film comprises a cementing layer, the cementing layer comprises glue and anti-impact particles, and the anti-impact particles are dispersed in the glue. The buffer heat dissipation film provided by the embodiment of the invention has good impact resistance.

Description

Technical Field

[0001] The present application relates to the field of electronics, and particularly to a buffer heat dissipation film, a display screen assembly, and an electronic device. Background Art

[0002] In the related art, a buffer heat dissipation film is usually disposed on the back surface of the display layer of a display screen to dissipate heat from the display layer. However, the buffer heat dissipation film in the related art has poor impact resistance. Summary of the Invention

[0003] An embodiment of the present application provides a buffer heat dissipation film, which has good impact resistance.

[0004] In a first aspect, an embodiment of the present application provides a buffer heat dissipation film, which includes:

[0005] A heat dissipation layer; and

[0006] A buffer adhesive film, the buffer adhesive film is disposed on one side of the heat dissipation layer, the buffer adhesive film includes an adhesive layer, and the adhesive layer includes glue and impact-resistant particles, and the impact-resistant particles are dispersed in the glue.

[0007] In a second aspect, an embodiment of the present application provides a display screen assembly, which includes:

[0008] A display layer; and

[0009] The buffer heat dissipation film described in the first aspect embodiment of the present application, the buffer adhesive film is located between the heat dissipation layer and the display layer, and the buffer heat dissipation film is disposed on one side of the display layer

[0010] In a third aspect, an embodiment of the present application provides an electronic device, which includes:

[0011] The display screen assembly described in the second aspect embodiment of the present application; and

[0012] A processor, the processor is electrically connected to the display screen assembly and is used to control the display screen assembly to perform display.

[0013] The buffer heat dissipation film of the embodiment of the present application includes a heat dissipation layer and a buffer adhesive film. The buffer adhesive film is disposed on one side of the heat dissipation layer. The buffer adhesive film includes a gluing layer, and the gluing layer includes glue and impact-resistant particles, and the impact-resistant particles are dispersed in the glue. The heat dissipation layer has conductivity, so that when the buffer heat dissipation film is applied to the display screen assembly of an electronic device, it can well shield the signal interference between the display screen assembly and the chip of the electronic device; the heat dissipation layer also has a relatively high thermal conductivity and good heat conductivity, and can better dissipate heat for the display screen assembly, improving the stability of the performance of the display screen assembly. Moreover, the gluing layer includes glue and impact-resistant particles, and the impact-resistant particles can improve the buffering performance of the gluing layer, so that the buffer adhesive film has good impact resistance. When applied to the display screen assembly, it can better protect the display screen assembly and improve the impact resistance of the display screen assembly. In addition, the buffer heat dissipation film of the embodiment of the present application has a relatively thin thickness. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0015] Figure 1 It is a schematic plan view of the buffer heat dissipation film according to an embodiment of the present application.

[0016] Figure 2 It is the buffer heat dissipation film according to an embodiment of the present application along Figure 1 The schematic cross-sectional view in the A-A direction.

[0017] Figure 3 It is the buffer heat dissipation film according to another embodiment of the present application along Figure 1 The schematic cross-sectional view in the A-A direction.

[0018] Figure 4 It is a schematic plan view of the display screen assembly according to an embodiment of the present application.

[0019] Figure 5 It is the display screen assembly according to an embodiment of the present application along Figure 4 The schematic cross-sectional view in the B-B direction.

[0020] Figure 6 It is the display screen assembly according to another embodiment of the present application along Figure 4 The schematic cross-sectional view in the B-B direction.

[0021] Figure 7 It is the display screen assembly according to another embodiment of the present application along Figure 4Schematic cross-sectional structure diagram in the B-B direction.

[0022] Figure 8 It is a schematic cross-sectional structure diagram of a display screen assembly of another embodiment of the present application along Figure 4 the B-B direction in the figure.

[0023] Figure 9 It is a schematic structural diagram of an electronic device according to an embodiment of the present application, wherein the electronic device is in a flattened state.

[0024] Figure 10 It is a schematic structural diagram of an electronic device according to an embodiment of the present application, wherein the electronic device is in a folded state.

[0025] Figure 11 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0026] Explanation of reference numerals:

[0027] 100 - buffer heat dissipation film, 10 - heat dissipation layer, 30 - buffer adhesive film, 31 - bonding layer, 311 - glue, 312 - impact-resistant particles, 32 - impact-resistant layer, 200 - display screen assembly, 210 - display layer, 220 - support film, 230 - polarizer, 240 - adhesive layer, 250 - protective cover plate, 300 - electronic device, 320 - foldable mechanism, 321 - first middle frame, 322 - rotating shaft, 323 - second middle frame, 330 - processor, 350 - memory, 370 - camera module. Detailed implementation manners

[0028] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0029] The terms "first", "second", etc. in the specification and claims of the present application and the above accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0030] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0031] It should be noted that, for the sake of convenience in description, in the embodiments of the present application, the same reference numerals denote the same components, and for the sake of brevity, in different embodiments, the detailed description of the same components is omitted.

[0032] In the related art, a buffer heat dissipation film is usually provided on the back of the display layer of a display screen to dissipate heat from the display layer. However, the buffer heat dissipation film in the related art has poor impact resistance. In view of this, the embodiments of the present application provide a buffer heat dissipation film with good impact resistance.

[0033] Figure 1 is a schematic plan view of a buffer heat dissipation film 100 according to an embodiment of the present application. Figure 2 is a buffer heat dissipation film 100 according to an embodiment of the present application along Figure 1 the cross-sectional structure schematic view in the A-A direction in.

[0034] Please refer to Figure 1 and Figure 2 The embodiments of the present application provide a buffer heat dissipation film 100, which includes a heat dissipation layer 10 and a buffer adhesive film 30. The buffer adhesive film 30 is disposed on one side of the heat dissipation layer 10. The buffer adhesive film 30 includes an adhesive layer 31, and the adhesive layer 31 includes glue 311 and impact-resistant particles 312. The impact-resistant particles 312 are dispersed in the glue 311.

[0035] The buffer heat dissipation film 100 (Screen Cushion Foam, also known as the under-screen heat dissipation buffer adhesive film 30) in the embodiments of the present application can be applied to the display screen assembly of an electronic device to improve the impact resistance and buffering ability of the display screen assembly. The buffer heat dissipation film 100 is also used to dissipate heat from the display layer and to shield signal interference between the display screen assembly and the chip of the electronic device.

[0036] It can be understood that the heat dissipation layer 10 and the buffer adhesive film 30 are stacked. Optionally, the buffer adhesive film 30 is disposed on the surface of the heat dissipation layer 10.

[0037] Optionally, the impact-resistant particles 312 are uniformly dispersed in the glue 311 to improve the impact resistance of the adhesive layer 31.

[0038] It should be noted that when the buffer heat dissipation film 100 is applied to the display screen assembly, the buffer heat dissipation film 100 is located on the side of the display layer of the display screen assembly facing away from the display surface, that is, the buffer heat dissipation film 100 is located on the back of the display layer. The buffer adhesive film 30 is located between the heat dissipation layer 10 and the display layer.

[0039] Optionally, the heat dissipation layer 10 can be grounded to improve the shielding performance of the buffer heat dissipation film 100, better shield the display screen assembly and the chip of the electronic device, and avoid signal interference between the display screen assembly and the chip of the electronic device.

[0040] The buffer heat dissipation film 100 of the embodiment of the present application includes a heat dissipation layer 10 and a buffer adhesive film 30. The buffer adhesive film 30 is disposed on one side of the heat dissipation layer 10. The buffer adhesive film 30 includes a gluing layer 31. The gluing layer 31 includes glue 311 and impact-resistant particles 312. The impact-resistant particles 312 are dispersed in the glue 311. The heat dissipation layer 10 has electrical conductivity, so that when the buffer heat dissipation film 100 is applied to the display screen assembly of the electronic device, it can well shield the signal interference between the display screen assembly and the chip of the electronic device; the heat dissipation layer 10 also has a high thermal conductivity coefficient and good thermal conductivity, and can better dissipate heat for the display screen assembly, improving the performance stability of the display screen assembly. Moreover, the gluing layer 31 includes glue 311 and impact-resistant particles 312. The impact-resistant particles 312 can improve the buffering performance of the gluing layer 31, so that the buffer adhesive film 30 has good impact resistance. When applied to the display screen assembly, it can better protect the display screen assembly and improve the impact resistance of the display screen assembly. In addition, the buffer heat dissipation film 100 of the embodiment of the present application has a relatively thin thickness.

[0041] In some embodiments, the heat dissipation layer 10 includes at least one of copper foil, stainless steel, aluminum foil, and titanium foil. These materials have good electrical conductivity and high thermal conductivity coefficients. When applied to the display screen assembly of the electronic device, they can better shield the signal interference between the display screen assembly and the chip of the electronic device; they can also better dissipate heat for the display screen assembly, improving the performance stability of the display screen assembly.

[0042] In a specific example, the heat dissipation layer 10 is a copper foil. The copper foil has good electrical conductivity and thermal conductivity, and has a low density. When applied to the display screen assembly, it can make the buffer heat dissipation film 100 have a small weight while ensuring the heat dissipation and shielding properties of the buffer heat dissipation film 100, and can well reduce the weight of the display screen assembly. That is, the buffer heat dissipation film 100 has good electrical conductivity, thermal conductivity and low weight.

[0043] Optionally, the thickness of the heat dissipation layer 10 ranges from 18 μm to 35 μm. Specifically, the thickness of the heat dissipation layer 10 can be, but is not limited to, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm, 32 μm, 34 μm, 35 μm, etc. In this embodiment, if the thickness of the heat dissipation layer 10 is too thin, the manufacturing cost of the heat dissipation layer 10 will increase; in addition, the anti-extrusion ability of the heat dissipation layer 10 will be reduced, and the anti-extrusion ability of the buffer heat dissipation film 100 will be reduced; furthermore, the shielding property of the electrical conductivity will be reduced. If the thickness of the heat dissipation layer 10 is too thick, the thickness and weight of the buffer heat dissipation film 100 will increase, which is not conducive to the thinness and lightness of the buffer heat dissipation film 100.

[0044] In the embodiments of the present application, when it comes to the numerical range from a to b, unless otherwise specified, it means that the numerical value can be any value between a and b, including the endpoint values a and b.

[0045] In some embodiments, the 25% Compression Force Deflection (CFD) of the buffer adhesive film 30 is less than or equal to 95 KPa.

[0046] It can be understood that 25% CFD ≤ 95 KPa.

[0047] It should be noted that "25% CFD" refers to the force required when the buffer adhesive film 30 is compressed to 25% of its original thickness. 25% CFD is measured according to GB / T 20467-2006.

[0048] Specifically, the 25% CFD of the buffer adhesive film 30 can be, but is not limited to, less than or equal to 95 KPa, less than or equal to 90 KPa, less than or equal to 85 KPa, less than or equal to 80 KPa, less than or equal to 75 KPa, less than or equal to 70 KPa, less than or equal to 65 KPa, less than or equal to 60 KPa, less than or equal to 55 KPa, less than or equal to 50 KPa, less than or equal to 45 KPa, less than or equal to 40 KPa, less than or equal to 35 KPa, less than or equal to 30 KPa, less than or equal to 25 KPa, less than or equal to 20 KPa, etc.

[0049] In this embodiment, if the 25% CFD of the buffer film 30 is too large, the anti-deformation ability of the buffer film 30 is weak. When the buffer heat dissipation film 100 is applied to the display screen assembly, film printing is likely to occur on the display screen assembly, reducing the appearance effect of the display screen assembly. The smaller the 25% CFD of the buffer film 30, the less likely film printing occurs on the display screen assembly when the buffer heat dissipation film 100 is applied to the display screen assembly. However, if the 25% CFD of the buffer film 30 is too small, it may be difficult to achieve in terms of materials or the cost of the buffer film 30 will increase. The buffer film 30 of the present application has a lower 25% CFD. When applied to the display screen assembly, it can better prevent film printing on the display screen assembly and improve the appearance effect of the display screen assembly.

[0050] Further, the range of the 25% CFD of the buffer film 30 is 20 KPa to 95 KPa. This can make the buffer film 30 easier to achieve and have good anti-deformation ability. Thus, when the buffer film 30 is applied to the display screen assembly, it can better prevent film printing on the display screen assembly and improve the appearance effect of the display screen assembly.

[0051] Still further, the range of the 25% CFD of the buffer film 30 is 25 KPa to 75 KPa. This can make the buffer film 30 easier to achieve and have good anti-deformation ability. Thus, when the buffer film 30 is applied to the display screen assembly, it can better prevent film printing on the display screen assembly and improve the appearance effect of the display screen assembly.

[0052] In some embodiments, when the display screen assembly is at 70 °C, the peel strength between the heat dissipation layer 10 and the buffer film 30 is greater than or equal to 1550 gf / inch.

[0053] It should be noted that the peel strength between the heat dissipation layer 10 and the buffer film 30 is measured according to GB / T 2792-2014. After placing the buffer heat dissipation film 100 at 70 °C for 5 minutes, the peel strength between the heat dissipation layer 10 and the buffer film 30 is measured.

[0054] Specifically, when the buffer heat dissipation film 100 is placed at 70°C, the peel strength between the heat dissipation layer 10 and the buffer adhesive film 30 may be, but is not limited to, greater than or equal to 1550gf / inch, greater than or equal to 1600gf / inch, greater than or equal to 1650gf / inch, greater than or equal to 1700gf / inch, greater than or equal to 1750gf / inch, greater than or equal to 1800gf / inch, greater than or equal to 1850gf / inch, greater than or equal to 1900gf / inch, greater than or equal to 1950gf / inch, greater than or equal to 2000gf / inch, greater than or equal to 2050gf / inch, greater than or equal to 2100gf / inch, greater than or equal to 2150gf / inch, greater than or equal to 2200gf / inch, etc.

[0055] In this embodiment, when the buffer heat dissipation film 100 is placed at 70°C, the smaller the peel strength between the heat dissipation layer 10 and the buffer adhesive film 30, the easier it is for the buffer heat dissipation film 100 to be delaminated when applied to the display screen assembly, and it will also reduce the adhesion between the buffer adhesive film 30 and other film layers of the display screen assembly, making the display screen assembly prone to delamination, which is not conducive to the reuse of the display screen assembly. When the buffer heat dissipation film 100 of the present application is placed at 70°C, the peel strength between the heat dissipation layer 10 and the buffer adhesive film 30 is greater than or equal to 1550gf / inch, so that the heat dissipation layer 10 and the buffer adhesive film 30 are not prone to delamination, and have good resistance to thermal disassembly. When the buffer heat dissipation film 100 is applied to the display screen assembly, delamination is not easy to occur in the buffer heat dissipation film 100 and between the buffer heat dissipation film 100 and other film layers of the display screen assembly, which is conducive to the reuse of the display screen assembly.

[0056] It should be noted that after the display screen assembly is assembled, when it is used in electronic devices, the display screen assembly is usually assembled with the middle frame first, and then the motherboard, battery and battery back cover are assembled. During the assembly process of the middle frame, motherboard, battery and battery back cover, the middle frame or battery back cover may be scratched or damaged. At this time, it is necessary to thermally disassemble the middle frame or battery back cover and the display screen assembly, and reassemble the display screen assembly with the new middle frame or battery back cover. When the layers of the display screen assembly are prone to delamination, they are prone to delamination during the disassembly process, which makes the display screen assembly lose its reusability and increases the preparation cost of the electronic device.

[0057] Further, when the buffer heat dissipation film 100 is placed at 70 °C, the peel strength between the heat dissipation layer 10 and the buffer adhesive film 30 ranges from 1700 gf / inch to 2200 gf / inch. This can prevent the buffer heat dissipation film 100 from delaminating easily when applied to the display screen assembly, and also prevent the buffer adhesive film 30 from delaminating easily from other film layers of the display screen assembly, which is beneficial to the reuse of the display screen assembly.

[0058] Still further, when the buffer heat dissipation film 100 is placed at 70 °C, the peel strength between the heat dissipation layer 10 and the buffer adhesive film 30 ranges from 1800 gf / inch to 2200 gf / inch. This can prevent the buffer heat dissipation film 100 from delaminating easily when applied to the display screen assembly, and also prevent the buffer adhesive film 30 from delaminating easily from other film layers of the display screen assembly, which is beneficial to the reuse of the display screen assembly.

[0059] Still further, when the buffer heat dissipation film 100 is placed at 70 °C, the peel strength between the heat dissipation layer 10 and the buffer adhesive film 30 ranges from 2000 gf / inch to 2200 gf / inch. This can prevent the buffer heat dissipation film 100 from delaminating easily when applied to the display screen assembly, and also prevent the buffer adhesive film 30 from delaminating easily from other film layers of the display screen assembly, which is beneficial to the reuse of the display screen assembly.

[0060] In some embodiments, the glue 311 includes at least one of acrylate glue 311, silicone glue 311, and polyurethane glue 311. Compared with silicone glue 311 and polyurethane glue 311, acrylate glue 311 has better adhesion, which can result in a higher peel strength between the heat dissipation layer 10 and the buffer adhesive film 30. When the buffer heat dissipation film 100 is applied to the display screen assembly, there is a higher peel strength between the buffer adhesive film 30 and other film layers of the display screen assembly, making the display screen assembly less likely to delaminate and having better reusability. In addition, acrylate glue 311 can also make the buffer adhesive film 30 have a lower 25% compression force deflection, thereby improving the anti-deformation ability of the buffer adhesive film 30. When the buffer heat dissipation film 100 is applied to the display screen assembly, the display screen assembly is likely to have film prints, reducing the appearance effect of the display screen assembly.

[0061] Optionally, the elastic modulus of the impact-resistant particles 312 is greater than the elastic modulus of the glue 311. This can make the adhesive layer 31 have better buffering performance and impact resistance, so that when the buffer heat dissipation film 100 is applied to the display screen assembly, it can better protect the display screen assembly and improve the impact resistance of the display screen assembly.

[0062] In some embodiments, the elastic modulus of the impact-resistant particles 312 ranges from 2 MPa to 5 MPa. Specifically, the elastic modulus of the impact-resistant particles 312 can be, but is not limited to, 2 MPa, 2.5 MPa, 3 MPa, 3.5 MPa, 4 MPa, 4.5 MPa, 5 MPa, etc. If the elastic modulus of the impact-resistant particles 312 is too small or too large, it is not conducive to improving the impact resistance of the adhesive layer 31.

[0063] Specifically, the elastic modulus of the glue 311 ranges from 30 KPa to 200 KPa. Specifically, the elastic modulus of the glue 311 can be, but is not limited to, 30 KPa, 40 KPa, 60 KPa, 80 KPa, 100 KPa, 120 KPa, 140 KPa, 160 KPa, 180 KPa, 200 KPa, etc.

[0064] In some embodiments, the average particle size (i.e., average diameter) of the impact-resistant particles 312 ranges from 10 μm to 30 μm.

[0065] Specifically, the average particle size of the impact-resistant particles 312 can be, but is not limited to, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm, etc.

[0066] In this embodiment, if the average particle size of the impact-resistant particles 312 is too small, the impact-resistant particles 312 are prone to agglomeration in the glue 311, resulting in poor dispersion and reducing the uniformity of the impact resistance of the adhesive layer 31. If the average particle size of the impact-resistant particles 312 is too large, the impact-resistant particles 312 are prone to float to the surface of the adhesive layer 31, reducing the flatness of the surfaces of the adhesive layer 31 and the buffer adhesive film 30, and reducing the appearance effect of the buffer adhesive film 30. When the buffer heat dissipation film 100 is applied to the display screen assembly, the appearance effect of the display screen assembly is reduced (the particles on the surface of the buffer adhesive film 30 are easily seen on the display screen assembly); in addition, after the impact-resistant particles 312 float to the surface, the adhesion of the buffer adhesive film 30 is reduced. When the buffer heat dissipation film 100 is applied to the display screen assembly, the adhesion between the buffer heat dissipation film 100 and other film layers of the display screen assembly is reduced, making it easy for the buffer adhesive film 30 to delaminate from other film layers of the display screen assembly, which is not conducive to the reuse of the display screen assembly.

[0067] In some embodiments, the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 ranges from 1% to 10%.

[0068] Specifically, the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 can be, but is not limited to, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9%, 9.5%, 10%, etc.

[0069] In this embodiment, if the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 is too low, the buffering performance of the adhesive layer 31 is reduced, and the impact resistance of the buffer heat dissipation film 100 is reduced; if the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 is too high, there are too many impact-resistant particles 312 and they cannot be accommodated in the glue 311, reducing the adhesion of the adhesive layer 31. As a result, delamination easily occurs between the heat dissipation layer 10 and the buffer adhesive film 30. When the buffer heat dissipation film 100 is applied to a display screen assembly, delamination also easily occurs between the buffer adhesive film 30 and other film layers of the display screen assembly, reducing the reusability of the display screen assembly.

[0070] In some embodiments, the impact-resistant particles 312 can include, but are not limited to, at least one of hollow silicon spheres, solid silicon spheres, solid rubber spheres, hollow rubber spheres, hollow polyacrylonitrile spheres, and solid polyacrylonitrile spheres. Using these impact-resistant particles 312 can well improve the buffering ability of the buffer adhesive film 30, so that when the buffer heat dissipation film 100 is applied to a display screen assembly, the impact resistance of the display screen assembly can be better improved. Compared with solid spheres, hollow spheres can better improve the impact resistance of the adhesive layer 31 and the buffer adhesive film 30.

[0071] In some embodiments, the thickness of the buffer adhesive film 30 ranges from 80 μm to 130 μm.

[0072] Specifically, the thickness of the buffer adhesive film 30 can be, but is not limited to, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, etc.

[0073] In this embodiment, if the thickness of the buffer adhesive film 30 is too thin, the impact resistance of the buffer heat dissipation film 100 is reduced. When applied to the display screen assembly, the impact resistance of the display screen assembly is reduced. In addition, the adhesiveness of the buffer adhesive film 30 is also reduced, and the adhesive force between the buffer adhesive film 30 and the heat dissipation layer 10 is reduced, making it easy for the buffer adhesive film 30 and the heat dissipation layer 10 to delaminate. When the buffer heat dissipation film 100 is applied to the display screen assembly, the adhesive force between the buffer adhesive film 30 and other film layers of the flexible display screen assembly is reduced, making the display screen assembly prone to delamination and reducing the reusability of the display screen assembly. If the thickness of the buffer adhesive film 30 is too thick, the cost of the buffer heat dissipation film 100 is increased, and it is not conducive to the thinness and lightness of the buffer heat dissipation film 100. When applied to the display screen assembly of an electronic device, it is not conducive to the thinness and lightness of the electronic device.

[0074] In summary, the buffer heat dissipation film 100 of the embodiment of the present application is designed in terms of the film layer structure of the buffer heat dissipation film 100, the composition of the buffer adhesive film 30, the material of the glue 311, the addition amount and material of the impact-resistant particles 312, etc., so that the buffer heat dissipation film 100 has a low 25% CFD, high impact resistance and high extrusion resistance. The heat dissipation layer 10 and the buffer adhesive film 30 have a high peel strength. When the buffer heat dissipation film 100 is applied to the display screen assembly, the buffer adhesive film 30 and other film layers of the display screen assembly have a high peel strength. In addition, the buffer heat dissipation film 100 also has a relatively thin thickness.

[0075] As Figure 2 shown, in some embodiments, the buffer adhesive film 30 only includes a gluing layer 31, and the thickness range of the gluing layer 31 is 80 μm to 130 μm.

[0076] Figure 3 is a schematic cross-sectional structure diagram of the buffer heat dissipation film 100 of another embodiment of the present application along the Figure 1 A-A direction in

[0077] Please refer to Figure 3 , in some other embodiments, the number of the gluing layers 31 is two, and the buffer adhesive film 30 further includes an impact-resistant layer 32, and the impact-resistant layer 32 is disposed between the two gluing layers 31. It can be understood that in this embodiment, the buffer adhesive film 30 includes two gluing layers 31 and one impact-resistant layer 32.

[0078] It should be noted that when the buffer adhesive film 30 includes two gluing layers 31 and an impact-resistant layer 32 (gluing layer 31 / impact-resistant layer 32 / gluing layer 31), the total thickness range of the two gluing layers 31 and the impact-resistant layer 32 is 80 μm to 130 μm.

[0079] In this embodiment, by sandwiching an impact-resistant layer 32 between two adhesive layers 31, the extrusion resistance of the buffer heat dissipation film 100 can be improved, preventing glue overflow during die-cutting of the buffer heat dissipation film 100 and improving the die-cutting performance of the buffer heat dissipation film 100; in addition, the forming efficiency of the buffer adhesive film 30 can also be improved.

[0080] In some embodiments, the material of the impact-resistant layer 32 includes at least one of thermoplastic polyurethane (abbreviated as TPU) and polyethylene terephthalate (abbreviated as PET). Using these materials as the impact-resistant layer 32 can better improve the extrusion resistance of the buffer heat dissipation film 100 and better improve the die-cutting performance of the buffer heat dissipation film 100. Compared with polyethylene terephthalate, using thermoplastic polyurethane as the impact-resistant layer 32 can make the buffer adhesive film 30 have better buffering performance and better improve the impact resistance of the buffer heat dissipation film 100.

[0081] Optionally, the thickness of the impact-resistant layer 32 ranges from 3 μm to 10 μm.

[0082] Specifically, the thickness of the impact-resistant layer 32 can be, but is not limited to, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm, 10 μm, etc.

[0083] In this embodiment, if the thickness of the impact-resistant layer 32 is too thin, the impact-resistant layer 32 is not easily formed, increasing the preparation difficulty and cost of the impact-resistant layer 32; if the thickness of the impact-resistant layer 32 is too thick, the buffering ability of the buffer adhesive film 30 is reduced.

[0084] Optionally, the elastic modulus of the impact-resistant layer 32 is greater than the elastic modulus of the impact-resistant particles 312. This can better improve the buffering ability of the buffer adhesive film 30 and make the buffer heat dissipation film 100 have better extrusion resistance and die-cutting performance.

[0085] Specifically, the elastic modulus of the impact-resistant layer 32 ranges from 10 MPa to 500 MPa. Specifically, the elastic modulus of the impact-resistant layer 32 can be, but is not limited to, 10 MPa, 30 MPa, 50 MPa, 80 MPa, 100 MPa, 130 MPa, 150 MPa, 180 MPa, 200 MPa, 230 MPa, 250 MPa, 280 MPa, 300 MPa, 330 MPa, 350 MPa, 380 MPa, 400 MPa, 430 MPa, 450 MPa, 480 MPa, 500 MPa, etc. If the elastic modulus of the impact-resistant layer 32 is too small, the impact resistance of the buffer adhesive film 30 is reduced.

[0086] Optionally, the thickness of the buffer heat dissipation film 100 ranges from 88 μm to 165 μm. Specifically, the thickness of the buffer heat dissipation film 100 can be, but is not limited to, 88 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, 155 μm, 160 μm, 165 μm, etc. The buffer heat dissipation film 100 in the embodiment of the present application has a relatively thin thickness.

[0087] Figure 4 is a schematic plan view of a display screen assembly according to an embodiment of the present application. Figure 5 is a cross-sectional schematic view of a display screen assembly according to an embodiment of the present application along Figure 4 the B-B direction in Figure 6 is a cross-sectional schematic view of a display screen assembly according to another embodiment of the present application along Figure 4 the B-B direction in

[0088] Please refer to Figures 4 to 6 , the embodiment of the present application further provides a display screen assembly 200, which includes a display layer 210 and the buffer heat dissipation film 100 described in the embodiment of the present application. The buffer adhesive film 30 is located between the heat dissipation layer 10 and the display layer 210, and the buffer heat dissipation film 100 is disposed on one side of the display layer 210.

[0089] It should be noted that the buffer heat dissipation film 100 is disposed on the side of the display layer 210 facing away from the display surface. That is, the display surface is disposed away from the buffer heat dissipation film 100.

[0090] It should be noted that the phrase "disposed on one side of a certain film layer" in the present application can be disposed on the surface of the film layer; it can also be disposed opposite to and spaced apart from the film layer, and other film layers are also disposed between it and the film layer.

[0091] It can be understood that the buffer heat dissipation film 100 and the display layer 210 are stacked.

[0092] Optionally, the display screen assembly 200 can be a flexible display screen assembly 200 or a rigid display screen assembly 200 (i.e., a straight display screen assembly 200).

[0093] Optionally, the display layer may include, but is not limited to, one or more of a liquid crystal display layer, a light-emitting diode display layer (LED display layer), a micro light-emitting diode display layer (Micro LED display layer), a submillimeter light-emitting diode display layer (Mini LED display layer), an organic light-emitting diode display layer (OLED display layer), etc. The display layer 210 is used to provide input and / or output functions for the user. Optionally, the display layer 210 may only have a display function, or may be a display layer 210 that integrates touch and display functions, etc., which is not limited herein.

[0094] For a detailed description of other aspects of the buffer heat dissipation film 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0095] It can be understood that the display screen assembly 200 described in this embodiment is only one form of the display screen assembly 200 to which the buffer heat dissipation film 100 is applied, and should not be construed as a limitation on the display screen assembly 200 provided in this application, nor should it be construed as a limitation on the buffer heat dissipation film 100 provided in each embodiment of this application.

[0096] The display screen assembly 200 of the embodiment of the present application includes a display layer 210 and a buffer heat dissipation film 100. The buffer heat dissipation film 100 includes a heat dissipation layer 10 and a buffer adhesive film 30. The buffer adhesive film 30 is disposed on one side of the heat dissipation layer 10. The buffer adhesive film 30 includes an adhesive layer 31. The adhesive layer 31 includes glue 311 and impact-resistant particles 312. The impact-resistant particles 312 are dispersed in the glue 311. The heat dissipation layer 10 has electrical conductivity, so that when the buffer heat dissipation film 100 is applied to the display screen assembly 200 of an electronic device, signal interference between the display screen assembly 200 and the chip of the electronic device can be well shielded; the heat dissipation layer 10 also has a high thermal conductivity and good heat dissipation performance, and can better dissipate heat for the display screen assembly 200, improving the performance stability of the display screen assembly 200. Furthermore, the adhesive layer 31 includes glue 311 and impact-resistant particles 312. The impact-resistant particles 312 can improve the buffering performance of the adhesive layer 31, so that the buffer adhesive film 30 has good impact resistance. When applied to the display screen assembly 200, it can better protect the display screen assembly 200 and improve the impact resistance of the display screen assembly 200.

[0097] Figure 7 is a schematic cross-sectional structure diagram of the display screen assembly 200 of another embodiment of the present application along Figure 4 the B-B direction in

[0098] Please refer to Figure 7, in some embodiments, the display screen assembly 200 further includes a support film 220 (U-Film), and the support film 220 is disposed between the heat dissipation buffer film and the display layer 210 for supporting the display layer 210.

[0099] Understandably, the support film 220 is disposed between the display layer 210 and the buffer adhesive film 30.

[0100] Understandably, the buffer heat dissipation film 100, the support film 220, and the display layer 210 are sequentially stacked. In a specific example, the buffer heat dissipation film 100, the support film 220, and the display layer 210 are sequentially attached and connected.

[0101] In some embodiments, when the display screen assembly 200 is at 70 °C, the peel strength between the support film 220 and the buffer adhesive film 30 is greater than or equal to 1550 gf / inch.

[0102] It should be noted that the peel strength between the heat dissipation layer 10 and the buffer adhesive film 30 is measured according to GB / T 2792-2014. After placing the display screen assembly 200 film at 70 °C for 5 min, the peel strength between the support film 220 and the buffer adhesive film 30 is measured.

[0103] Specifically, when the display screen assembly 200 is at 70 °C, the peel strength between the support film 220 and the buffer adhesive film 30 can be, but is not limited to, greater than or equal to 1550 gf / inch, greater than or equal to 1600 gf / inch, greater than or equal to 1650 gf / inch, greater than or equal to 1700 gf / inch, greater than or equal to 1750 gf / inch, greater than or equal to 1800 gf / inch, greater than or equal to 1850 gf / inch, greater than or equal to 1900 gf / inch, greater than or equal to 1950 gf / inch, greater than or equal to 2000 gf / inch, greater than or equal to 2050 gf / inch, greater than or equal to 2100 gf / inch, greater than or equal to 2150 gf / inch, greater than or equal to 2200 gf / inch, etc.

[0104] In this embodiment, when the display screen assembly 200 is placed at 70°C, the smaller the peel strength between the support film 220 and the buffer adhesive film 30, the lower the adhesion between the buffer adhesive film 30 and the support film 220, making it easy for the display screen assembly 200 to delaminate, which is not conducive to the reuse of the display screen assembly 200. When the display screen assembly 200 of the present application is placed at 70°C, the peel strength between the support film 220 and the buffer adhesive film 30 is greater than or equal to 1550 gf / inch, so that delamination between the support film 220 and the buffer adhesive film 30 is not likely to occur, and it has good thermal disassembly resistance. Delamination between the buffer heat dissipation film 100 and the support film 220 is not likely to occur, which is conducive to the reuse of the display screen assembly 200.

[0105] Further, when the display screen assembly 200 is placed at 70°C, the peel strength between the support film 220 and the buffer adhesive film 30 ranges from 1700 gf / inch to 2200 gf / inch. This can make the support film 220 and the buffer adhesive film 30 have better adhesion, and delamination is not likely to occur when the display screen assembly 200 is in use, which is conducive to the reuse of the display screen assembly 200.

[0106] Still further, when the display screen assembly 200 is placed at 70°C, the peel strength between the support film 220 and the buffer adhesive film 30 ranges from 1800 gf / inch to 2200 gf / inch. This can make the support film 220 and the buffer adhesive film 30 have better adhesion, and delamination is not likely to occur when the display screen assembly 200 is in use, which is conducive to the reuse of the display screen assembly 200.

[0107] Still further, when the display screen assembly 200 is placed at 70°C, the peel strength between the support film 220 and the buffer adhesive film 30 ranges from 2000 gf / inch to 2200 gf / inch. This can make the support film 220 and the buffer adhesive film 30 have better adhesion, and delamination is not likely to occur when the display screen assembly 200 is in use, which is conducive to the reuse of the display screen assembly 200.

[0108] Optionally, the support film 220 may include a PET layer and an adhesive layer arranged in a stacked manner.

[0109] Figure 8 It is a schematic cross-sectional structure view of the display screen assembly 200 along the Figure 4 B-B direction in another embodiment of the present application.

[0110] Please refer to Figure 8, in some embodiments, the display screen assembly 200 further includes a polarizer 230, an adhesive layer 240, and a protective cover plate 250. The polarizer 230 is disposed on a side of the display layer 210 facing away from the support film 220, and is configured to control the polarization direction of the light emitted from the display layer 210, thereby improving the display effect and image quality of the display layer 210; the adhesive layer 240 is disposed on a side of the polarizer 230 facing away from the display layer 210, and the protective cover plate 250 is disposed on a side of the adhesive layer 240 facing away from the polarizer 230.

[0111] It can be understood that, in this embodiment, the buffer heat dissipation film 100, the support film 220, the display layer 210, the polarizer 230, the adhesive layer 240, and the protective cover plate 250 are stacked in sequence.

[0112] Optionally, the adhesive layer 240 can be, but is not limited to, an optical adhesive layer.

[0113] Optionally, the protective cover plate 250 can be, but is not limited to, a glass layer or a resin layer. The resin layer can be, but is not limited to, at least one of polyethylene terephthalate, polycarbonate, polymethyl methacrylate, etc.

[0114] On the side of the buffer heat dissipation film 100 of the display screen assembly 200 according to the embodiment of the present application, when a 4g stainless steel ball freely falls from a certain height onto the surface of the buffer heat dissipation film 100, it can withstand a ball drop height greater than or equal to 60 mm, and the display screen assembly 200 is not damaged and the functions of the display screen assembly 200 are not affected. It can be understood that on the side of the buffer heat dissipation film 100 of the display screen assembly 200, the maximum ball drop height that can withstand the fall of a 4g stainless steel ball is greater than or equal to 60 mm. Specifically, the maximum ball drop height that the display screen assembly 200 can withstand the fall of a 4g stainless steel ball can be, but is not limited to, 60 mm, 61 mm, 62 mm, 63 mm, 64 mm, 65 mm, 66 mm, 67 mm, 68 mm, 69 mm, 70 mm, 71 mm, 72 mm, 73 mm, 74 mm, 75 mm, etc. The display screen assembly 200 according to the embodiment of the present application has a high impact resistance.

[0115] On the side of the buffer heat dissipation film 100 of the display screen assembly 200 according to the embodiment of the present application, when extruded with a ball head with a diameter of 4 mm and kept for 5 s and then released, the maximum extrusion force that can be borne is greater than or equal to 110 N. That is, the maximum extrusion force refers to the maximum extrusion force that the display screen assembly 200 can withstand. Under the action of an extrusion force less than this value, the display screen assembly 200 will not be damaged and the display function will not be affected, etc. On the side of the buffer heat dissipation film 100 of the display screen assembly 200, when extruded with a ball head with a diameter of 4 mm, the maximum extrusion force that can be borne can be, but is not limited to, 110 N, 111 N, 112 N, 113 N, 114 N, 115 N, 116 N, 117 N, 118 N, 119 N, 120 N, 121 N, 122 N, 123 N, 124 N, 125 N, etc. The display screen assembly 200 according to the embodiment of the present application has a high anti-extrusion ability.

[0116] The buffer heat dissipation film 100 and the display screen assembly 200 of the present application will be further introduced through specific embodiments below.

[0117] Examples 1 to 7, Comparative Examples 1 to 4

[0118] The buffer heat dissipation film 100 of each example and comparative example includes a copper foil (heat dissipation layer 10) and a buffer adhesive film 30 which are stacked.

[0119] The thickness of the copper foil is 25 μm.

[0120] The buffer adhesive film 30 includes an adhesive layer 31. The adhesive layer 31 includes glue 311 and impact-resistant particles 312. The impact-resistant particles 312 are dispersed in the glue 311. The glue 311 is acrylate glue 311, and the impact-resistant particles 312 are hollow silicon balls; the average particle size of the impact-resistant particles 312 is 20 μm.

[0121] The thickness of the adhesive layer 31 and the content of the impact-resistant particles 312 in the adhesive layer 31 are shown in Table 1 below.

[0122] Table 1 Parameter information of the buffer heat dissipation film 100 of each example

[0123]

[0124]

[0125] Example 8

[0126] The buffer heat dissipation film 100 of this example includes a copper foil (heat dissipation layer 10) and a buffer adhesive film 30 which are stacked.

[0127] The thickness of the copper foil is 25 μm.

[0128] The buffer adhesive film 30 includes adhesive layers 31, impact-resistant layers 32 and adhesive layers 31 which are stacked in sequence. The adhesive layer 31 includes 95% glue 311 and 5% impact-resistant particles 312 by mass fraction. The impact-resistant particles 312 are dispersed in the glue 311. The glue 311 is acrylate glue 311. The impact-resistant particles 312 are hollow silica spheres. The average particle size of the impact-resistant particles 312 is 20 μm. The thickness of each adhesive layer 31 is 50 μm. The impact-resistant layer 32 is a thermoplastic resin layer, and the thickness of the impact-resistant layer 32 is 5 μm. That is, the thickness of the buffer adhesive film 30 is 105 μm.

[0129] Comparative Example 5

[0130] The buffer heat dissipation film 100 of this comparative example includes a copper foil tape (i.e., a pressure-sensitive adhesive is coated on the copper foil), a PET tape and a foam grid adhesive which are stacked in sequence; the foam grid adhesive is integrally formed by foam (FOAM) and grid adhesive (EMBO), that is, it includes a stacked foam and grid adhesive.

[0131] The thickness of the copper foil tape is 30 μm, the thickness of the PET tape is 40 μm, and the thickness of the foam grid adhesive is 140 μm.

[0132] Comparative Example 6

[0133] The buffer heat dissipation film 100 of this comparative example includes a copper foil tape (i.e., a pressure-sensitive adhesive is coated on the copper foil) and a foam grid adhesive which are stacked in sequence; the foam grid adhesive is integrally formed by foam (FOAM) and grid adhesive (EMBO), that is, it includes a stacked foam and grid adhesive.

[0134] The thickness of the copper foil tape is 50 μm, and the thickness of the foam grid adhesive is 160 μm.

[0135] Comparative Example 7

[0136] The buffer heat dissipation film 100 of this comparative example includes a copper foil and a silicone gel which are stacked in sequence. The thickness of the copper foil is 35 μm, and the thickness of the silicone gel is 125 μm.

[0137] Comparative Example 8

[0138] The buffer heat dissipation film 100 of this comparative example includes a graphite tape, a stainless steel layer (SUS) and a pressure-sensitive adhesive layer (PSA) which are stacked in sequence. The thickness of the graphite tape is 50 μm, the thickness of the stainless steel layer is 100 μm, and the thickness of the pressure-sensitive adhesive is 30 μm.

[0139] The buffer heat dissipation films 100 of each example and comparative example were assembled into a display screen assembly 200, and relevant performance tests were carried out. The assembled display screen assembly 200 includes a buffer heat dissipation film 100, a support film 220, an OLED display layer 210, a polarizer 230, an optical adhesive (i.e., an adhesive layer 240), and a glass protection cover plate 250 that are sequentially stacked. The support film 220 is a PET / adhesive layer with a thickness of 88 μm; the OLED display layer 210 has a thickness of 38 μm; the polarizer 230 has a thickness of 106 μm; the optical adhesive has a thickness of 100 μm; and the glass protection cover plate 250 has a thickness of 580 μm.

[0140] The following performance tests were carried out on the buffer heat dissipation films 100 of the above examples and comparative examples.

[0141] (1) Anti-film printing ability (25% CFD) test: Measure the 25% CFD of the film layer that plays a buffering role in the buffer heat dissipation films 100 of each example and comparative example according to GB / T 20467-2006. The smaller the 25% CFD, the less likely the display screen assembly 200 is to have film printing.

[0142] (2) Anti-thermal disassembly ability test: Measure the peel strength between the heat dissipation layer 10 and the buffer adhesive layer of the buffer heat dissipation film 100 after the buffer heat dissipation film 100 is placed at 70 °C for 5 min according to GB / T 2792-2014; and measure the peel strength between the buffer heat dissipation film 100 and the support film 220 after the display screen assembly 200 is placed at 70 °C for 5 min according to GB / T 2792-2014. The greater the peel strength, the less likely the buffer heat dissipation film 100 and the display screen assembly 200 are to delaminate.

[0143] (3) Anti-impact ability test: Test the back surface of the display screen assembly 200 (i.e., the side of the buffer heat dissipation film 100). A 4 g stainless steel ball was freely dropped from a certain height onto the surface of the buffer heat dissipation film 100, and the maximum drop height that the display screen assembly 200 could withstand was measured. The greater the maximum drop height, the better the anti-impact performance of the display screen assembly 200.

[0144] (4) Anti-extrusion ability test: Test the back surface of the display screen assembly 200 (i.e., the side of the buffer heat dissipation film 100). A ball head with a diameter of 4 mm was used to extrude the surface of the buffer heat dissipation film 100 of the display screen assembly 200 and kept for 5 seconds and then released, and the maximum extrusion force that the display screen assembly 200 could withstand was measured. The greater the maximum extrusion force, the better the anti-extrusion performance of the display screen assembly 200.

[0145] The test results of each example and comparative example are shown in Table 2 below.

[0146] Table 2 Performance parameter information of the buffer heat dissipation films 100 of each example

[0147]

[0148] From the test results of Examples 1 to 5, Comparative Example 1 and Comparative Example 2, it can be seen that as the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 increases, the 25% CFD of the buffer film 30 gradually increases. This indicates that the smaller the mass fraction of the impact-resistant particles 312 in the adhesive layer 31, the less likely the display screen assembly 200 is to have film printing when the buffer heat dissipation film 100 is applied to the display screen assembly 200. In addition, as the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 increases, the peel strength between the heat dissipation layer 10 of the buffer heat dissipation film 100 and the buffer adhesive layer gradually decreases, and the peel strength between the buffer heat dissipation film 100 and the support film 220 also gradually decreases. Furthermore, as the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 increases, the drop ball height of the display screen assembly 200 using the buffer heat dissipation film 100 gradually increases, and the anti-extrusion ability of the display screen assembly 200 using the buffer heat dissipation film 100 also gradually increases. Therefore, when the mass fraction of the impact-resistant particles 312 in the adhesive layer 31 is 1% to 10%, the buffer heat dissipation film 100 can have a lower 25% CFD, the heat dissipation layer 10 of the buffer heat dissipation film 100 and the buffer adhesive layer can have a higher peel strength, the buffer heat dissipation film 100 and the support film 220 can have a higher peel strength, and the display screen assembly 200 using the buffer heat dissipation film 100 can have better impact resistance and anti-extrusion ability.

[0149] From the test results of Example 3, Example 6, Example 7, Comparative Example 3 and Comparative Example 4, it can be seen that as the thickness of the adhesive layer 31 increases, both the 25% CFD and the anti-extrusion force of the buffer film 30 remain almost unchanged. As the thickness of the adhesive layer 31 increases, the peel strength between the heat dissipation layer 10 of the buffer heat dissipation film 100 and the buffer adhesive layer gradually increases, and the peel strength between the buffer heat dissipation film 100 and the support film 220 also gradually increases. In addition, as the thickness of the adhesive layer 31 increases, the drop ball height of the display screen assembly 200 using the buffer heat dissipation film 100 gradually increases, indicating that the impact resistance of the buffer heat dissipation film 100 gradually increases. This shows that the larger the thickness of the adhesive layer 31, the less likely it is to delaminate, which is more conducive to improving the impact resistance of the buffer heat dissipation film 100 and the display screen assembly 200. However, it increases the cost of the buffer heat dissipation film 100 and the display screen assembly 200, and is not conducive to the thinning and lightening of the buffer heat dissipation film 100 and the display screen assembly 200.

[0150] As can be seen from the test results of Example 3 and Example 8, after adding the impact-resistant layer 32 to the buffer film 30, the extrusion resistance of the buffer heat dissipation film 100 can be improved, and there is almost no impact on the impact resistance of the buffer heat dissipation film 100. However, after adding the impact-resistant layer 32 to the buffer film 30, the peel strength between the heat dissipation layer 10 and the buffer adhesive layer of the buffer heat dissipation film 100 and the peel strength between the buffer heat dissipation film 100 and the support film 220 will be reduced, and the 25% CFD of the buffer film 30 will increase.

[0151] As can be seen from the test results of Examples 1 to 8, Comparative Example 5 and Comparative Example 6, compared with the solutions of Comparative Example 5 and Comparative Example 6, the buffer heat dissipation film 100 of the embodiments of the present application has a thinner thickness. In addition, the buffer heat dissipation film 100 of the embodiments of the present application has a lower 25% CFD, so that when the buffer heat dissipation film 100 is applied to the display screen assembly 200, it is less likely for the display screen assembly 200 to have film printing. In addition, although the peel strength between the heat dissipation layer 10 and the buffer adhesive layer, the peel strength between the buffer heat dissipation film 100 and the support film 220, the drop ball height of the display screen assembly 200 using the buffer heat dissipation film 100, and the extrusion resistance of the display screen assembly 200 using the buffer heat dissipation film 100 are all reduced to some extent, they still remain at a relatively high level.

[0152] As can be seen from the test results of Examples 1 to 8 and Comparative Example 7, compared with the solution of Comparative Example 7, the buffer heat dissipation film 100 of the embodiments of the present application has a lower 25% CFD, so that when the buffer heat dissipation film 100 is applied to the display screen assembly 200, it is less likely for the display screen assembly 200 to have film printing. In addition, compared with the solution of Comparative Example 7, the peel strength between the heat dissipation layer 10 and the buffer adhesive layer of the buffer heat dissipation film 100 of the embodiments of the present application and the peel strength between the buffer heat dissipation film 100 and the support film 220 are also higher. Although the drop ball height of the display screen assembly 200 using the buffer heat dissipation film 100 and the extrusion resistance of the display screen assembly 200 using the buffer heat dissipation film 100 are both reduced to some extent, they still remain at a relatively high level.

[0153] As can be seen from the test results of Examples 1 to 8 and Comparative Example 8, the 25% CFD of the buffer heat dissipation film 100 and the peel strength between the buffer heat dissipation film 100 and the support film 220 of the embodiments of the present application are equivalent to those of the solution of Comparative Example 8. However, compared with the solution of Comparative Example 8, the peel strength between the heat dissipation layer 10 and the buffer adhesive layer of the buffer heat dissipation film 100 of the embodiments of the present application is higher, and the display screen assembly 200 using the buffer heat dissipation film 100 has a higher drop ball height. Although the extrusion resistance of the display screen assembly 200 using the buffer heat dissipation film 100 is reduced to some extent, it still remains at a relatively high level.

[0154] Figure 9It is a schematic structural diagram of an electronic device 300 according to an embodiment of the present application, where the electronic device 300 is in a flattened state. Figure 10 It is a schematic structural diagram of an electronic device 300 according to an embodiment of the present application, where the electronic device 300 is in a folded state. Figure 11 It is a circuit block diagram of an electronic device 300 according to an embodiment of the present application.

[0155] Please refer to Figures 9 to 11 , an embodiment of the present application further provides an electronic device 300, which includes a display screen assembly 200 and a processor 330. The processor 330 is electrically connected to the display screen assembly 200 and is used to control the display screen assembly 200 to perform display.

[0156] The electronic device 300 according to the embodiment of the present application may be, but is not limited to, portable electronic devices 300 such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc.

[0157] The electronic device 300 according to the embodiment of the present application may be a foldable electronic device or a straight-board electronic device. In the schematic diagrams and the following introductions of the present application, the electronic device 300 is taken as an example of a foldable electronic device for illustration and description, and should not be construed as a limitation on the buffer heat dissipation film 100, the display screen assembly 200 and the electronic device 300 of the embodiment of the present application. It can be understood that the electronic device 300 described in this embodiment is only one form of the electronic device 300 to which the display screen assembly 200 is applied, and should not be construed as a limitation on the electronic device 300 provided by the present application, nor should it be construed as a limitation on the display screen assemblies 200 provided by various embodiments of the present application.

[0158] For a detailed description of the display screen assembly 200, please refer to the description of the corresponding part of the above embodiment, and details will not be repeated here.

[0159] Optionally, the processor 330 includes one or more general-purpose processors. Among them, the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 330 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory, and it can enable the computing device to provide a wide variety of services.

[0160] Optionally, the electronic device 300 of the present application further includes a memory 350. The memory 350 is electrically connected to the processor 330 and is used to store the program code required for the operation of the processor 330, the program code required for controlling the display screen assembly 200, the display content of the display screen assembly 200, etc.

[0161] Optionally, the memory 350 may include volatile memory, such as random access memory (RAM); the memory 350 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). The memory 350 may also include a combination of the above types of memory.

[0162] Optionally, the electronic device 300 further includes a camera module 370, which is electrically connected to the processor 330 and is configured to perform shooting under the control of the processor 330.

[0163] Optionally, the camera module 370 may be a rear camera module 370; the camera module 370 may also be a front camera module 370. In the drawings of the present application, a rear camera module 370 is taken as an example for illustration, and it should not be construed as a limitation on the camera module 370 and the electronic device 300.

[0164] Optionally, the electronic device 300 is a foldable electronic device 300, the display screen assembly 200 is a flexible display screen assembly 200, and the electronic device 300 further includes a folding mechanism 310, which is configured to carry the display screen assembly 200, the processor 330, the memory 350, and the camera module 370, and the folding mechanism 310 is further configured to drive the display screen assembly 200 to fold and flatten.

[0165] Optionally, the folding mechanism 320 includes a first middle frame 321, a rotating shaft 322, and a second middle frame 323. The first middle frame 321 and the second middle frame 323 are respectively rotatably connected to the rotating shaft 322. The first middle frame 321, the rotating shaft 322, and the second middle frame 323 cooperate with each other to carry the display screen assembly 200. The electronic device 300 has a flattened state and a folded state. When the electronic device 300 is in the flattened state, the first middle frame 321, the rotating shaft 322, and the second middle frame 323 form a planar structure; when the electronic device 300 is in the folded state, the first middle frame 321 and the second middle frame 323 are stacked.

[0166] Optionally, a light-transmitting portion (not shown in the figure) is further provided at a position corresponding to the camera module 370 on the folding mechanism 320, and the camera module 370 performs shooting through the light-transmitting portion.

[0167] In this application, the mention of "embodiment" or "implementation manner" means that the specific features, structures or characteristics described in connection with the embodiment may be included in at least one embodiment of this application. The appearance of the phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in each embodiment of this application can be combined arbitrarily with each other without contradiction to form another embodiment that does not depart from the spirit and scope of the technical solution of this application.

[0168] Finally, it should be noted that the above implementation manners are only used to illustrate the technical solutions of this application and not to limit them. Although the technical solutions of this application have been described in detail with reference to the above preferred implementation manners, those of ordinary skill in the art should understand that modifications or equivalent replacements can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A buffer heat dissipation film, characterized in that: include: Heat dissipation layer; as well as The buffer film is arranged on one side of the heat dissipation layer, the buffer film comprises a bonding layer, the bonding layer comprises glue and impact-resistant particles, and the impact-resistant particles are dispersed in the glue.

2. The buffer heat dissipation film according to claim 1, characterized in that: The 25% compression force deflection of the buffer film is less than or equal to 95 KPa.

3. The buffer heat dissipation film according to claim 1, characterized in that: The glue includes at least one of acrylic glue, silicone glue and polyurethane glue.

4. The buffer heat dissipation film according to claim 1, characterized in that: The average particle size of the impact-resistant particles ranges from 10 μm to 30 μm.

5. The buffer heat dissipation film according to claim 1, characterized in that: The mass fraction of the impact-resistant particles in the adhesive layer ranges from 1% to 10%.

6. The buffer heat dissipation film according to claim 1, characterized in that: The impact-resistant particles include at least one of hollow silicon balls, solid silicon balls, solid rubber balls, hollow rubber balls, hollow polyacrylonitrile balls, and solid polyacrylonitrile balls.

7. The buffer heat dissipation film according to claim 1, characterized in that: The thickness of the buffer film ranges from 80 μm to 130 μm.

8. The buffer heat dissipation film according to claim 1, characterized in that: The number of the adhesive layers is two, and the buffer adhesive film further includes an impact-resistant layer, which is arranged between the two adhesive layers.

9. The buffer heat dissipation film according to claim 8, characterized in that: The material of the impact-resistant layer includes at least one of thermoplastic polyurethane and polyethylene terephthalate, and the thickness of the impact-resistant layer ranges from 3 μm to 10 μm.

10. The buffer heat dissipation film according to claim 1, characterized in that: The heat dissipation layer includes at least one of copper foil, stainless steel, aluminum foil, and titanium foil, and the thickness of the heat dissipation layer ranges from 18 μm to 35 μm.

11. A display screen assembly, characterized in that: include: Display layer; as well as The buffer heat dissipation film according to any one of claims 1 to 10, wherein the buffer adhesive film is located between the heat dissipation layer and the display layer, and the buffer heat dissipation film is arranged on one side of the display layer.

12. An electronic device, characterized in that: include: The display screen assembly according to claim 11; as well as A processor is electrically connected to the display screen assembly and is used to control the display screen assembly to display.

Images