Composite thermosyphon radiator for electronic equipment

Abstract

The invention relates to the technical field of radiators, in particular to a combined type thermosyphon radiator for electronic equipment, which comprises a mounting frame movably mounted on a base, an evaporation mechanism for promoting fluid evaporation is arranged on the mounting frame, and an air cooling adjusting mechanism for adjusting the flowing direction of airflow is arranged on the mounting frame. A two-phase liquid working medium heat dissipation technology is innovatively adopted, a working medium is in contact with a heating device to absorb heat and vaporize, vaporization latent heat is utilized to achieve efficient heat dissipation, and the efficiency is far higher than that of traditional sensible heat dissipation. A high-speed air cooling system accelerates liquefaction of a working medium to improve the heat dissipation efficiency; a special sealing process and a high-quality material are adopted to avoid the risk of leakage and prolong the service life of equipment; an air cooling adjusting mechanism dynamically adjusts the direction of a fan according to the temperature difference to optimize the heat dissipation performance; a protection structure resists the impact of external force to prolong the service life of the fan; the device is suitable for equipment such as high-performance computers, servers and communication base stations, and the application prospect is wide.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and in particular to a composite thermosyphon radiator for electronic equipment. Background Art

[0002] As the performance of electronic devices continues to improve, the heat generated during operation is also increasing. An efficient heat dissipation system has become the key to ensuring the stable operation of electronic devices and extending their service life.

[0003] In terms of heat dissipation efficiency, traditional air-cooled heat sinks are limited by the thermal conductivity of air and have low heat dissipation efficiency. In order to meet the heat dissipation requirements, multiple fans need to be installed, which causes serious noise problems. Even if liquid cooling is used in some high-power IGBT systems with high heat dissipation requirements, the improvement in heat dissipation efficiency is still unsatisfactory. In terms of cost, the complex structure of liquid-cooled heat sinks leads to high production and maintenance costs. Although the heat dissipation effect is relatively outstanding, it hinders large-scale application. From the perspective of system reliability, liquid-cooled heat dissipation systems are prone to coolant leakage due to the large number of pipes and joints. Once a leak occurs, it not only affects the heat dissipation performance, but may also cause equipment failure and reduce the overall reliability of the equipment. In addition, the heat dissipation performance of the thermosyphon heat sink on the market needs to be improved. It can only be used in some scenarios with low heat dissipation requirements and cannot meet the heat dissipation needs of complex working conditions. In view of this, we provide a composite thermosyphon heat sink for electronic equipment. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a composite thermal siphon radiator for electronic equipment, which solves the technical problems of insufficient heat dissipation efficiency and limited scope of application of the radiator in the prior art, thereby achieving the goal of improving heat dissipation performance, expanding the scope of application and reducing the risk of leakage, thereby improving the reliability of the equipment.

[0005] To solve the above technical problems, the present invention provides the following technical solutions: a composite thermosiphon radiator for electronic equipment, comprising a mounting frame movably mounted on a base, the mounting frame being provided with an evaporation mechanism for promoting fluid evaporation, and the mounting frame being provided with an air cooling adjustment mechanism for adjusting the direction of airflow.

[0006] The evaporation mechanism includes a plate body movably installed on one side of the installation frame, and a plurality of groups of grooves are provided on the plate body, a sealing cover is installed in the groove body on the plate body, a plurality of groups of porous capillary members 1 are installed in the groove body on the plate body, heat conducting sheets 1 and 2 are alternately distributed between the plurality of groups of porous capillary members 1, a plurality of groups of porous capillary members 2 are installed in the groove body on the plate body, a plurality of groups of heat conducting blocks are installed on the plate body, and a condensation component for reducing the temperature is arranged inside the installation frame.

[0007] Preferably, the condensing assembly includes a fixing frame installed on the plate body, connecting pipes are installed on both sides of the plate body, a transmission box is installed on the top of the connecting pipe, a guide pipe is installed between the connecting pipe and the plate body, multiple groups of partition boxes are installed on the guide pipe, and several groups of cooling fins are installed between two groups of the guide pipes, and the cooling fins and the partition boxes are staggered.

[0008] Preferably, the air cooling adjustment mechanism includes a machine frame installed on the other side of the mounting frame, a protective cover is installed on one side of the machine frame, a top frame is installed on the top of the machine frame, a driving motor is installed inside the top frame, the output end of the driving motor is connected to a rotating rod rotatably connected to the top frame, multiple groups of worm sleeves are installed on the rotating rod, multiple groups of mounting rods are rotatably connected inside the machine frame, multiple groups of fans are installed on the mounting rods, a worm gear meshing with the worm sleeve is installed on the top of the mounting rod, and a dustproof plate is slidably installed on the machine frame.

[0009] Preferably, the heat conducting block is distributed in the middle part of the groove body on the plate body, and the porous capillary member 1 and the porous capillary member 2 are distributed above and below the heat conducting block respectively.

[0010] Preferably, the plate body is connected to and provided with a refrigerant filling port for conveying fluid, and the refrigerant filling port is a valve structure.

[0011] Preferably, a plurality of groups of air outlets corresponding to the positions of fans are provided inside the frame, and the fans are distributed inside the protective cover.

[0012] Preferably, a plurality of heat dissipation slots are provided at the top of the top frame, and the fan is powered by a rechargeable battery.

[0013] Preferably, the area of ​​the dustproof plate is larger than the area formed by the multiple groups of fans, and the distance between the dustproof plate and the fans is larger than the width of the fans.

[0014] By means of the above technical solution, the present invention provides a composite thermosyphon heat sink for electronic equipment, which has at least the following beneficial effects:

[0015] 1. The present invention sets an evaporation mechanism and adopts an innovative two-phase liquid heat dissipation medium. When the medium contacts the IGBT heating device, it absorbs heat and vaporizes, and uses the latent heat of vaporization to efficiently take away a large amount of heat generated by the IGBT. Compared with traditional sensible heat dissipation, the heat dissipation efficiency is greatly improved. The capillary structure in the cold plate allows the gaseous medium to release heat and condense and then quickly flow back based on the capillary action, continuously replenishing the liquid medium for the heat dissipation cycle, thereby improving the heat dissipation efficiency. In addition, the device can be applied to various electronic devices, including high-performance computers, servers, communication base station equipment, etc., expanding the scope of application of the device.

[0016] 2. By setting up an evaporation mechanism, the present invention adopts a highly efficient air-cooling device with high-speed operation to quickly take away the heat of the gaseous working medium, accelerate its liquefaction, further speed up heat transfer and dissipation, and adopts a special sealing process and high-quality materials to effectively avoid the risk of leakage of the working fluid, reduce equipment damage and maintenance costs caused by leakage, and greatly improve the reliability and service life of the equipment.

[0017] 3. By setting up an air-cooling adjustment mechanism, during the heat dissipation process, the present invention can adjust the blowing direction of the fan according to the temperature inside and outside the radiator, thereby improving the heat dissipation performance. And by setting up a protection structure, the risk of damage to the fan due to external forces is reduced, and the service life of the fan is greatly extended, providing guarantee for the long-term stable operation of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments and descriptions thereof of the present application are used to explain the present application and do not constitute an improper limitation to the present application.

[0019] In the drawings:

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 is a schematic diagram of the bottom view structure of the present invention;

[0022] Figure 3 is a schematic diagram of the disassembled structure of the present invention;

[0023] Figure 4 is a schematic diagram of the disassembled structure of the evaporation mechanism of the present invention;

[0024] Figure 5 is a schematic diagram of the structure of the air-cooling adjustment mechanism of the present invention;

[0025] Figure 6 is a schematic diagram of a partial structure of the evaporation mechanism of the present invention.

[0026] In the figure: 1, base; 4, mounting frame;

[0027] 2, evaporation mechanism; 21, plate body; 22, sealing cover; 23, first porous capillary member; 24, first heat conduction sheet; 25, second heat conduction sheet; 26, second porous capillary member; 27, heat conduction block;

[0028] condensation assembly; 2011, fixing frame; 2012, heat dissipation fins; 2013, partition box; 2014, transmission box; 2015, diversion pipe; 2016, connecting pipe;

[0029] 3. Air-cooling adjustment mechanism; 31. Machine frame; 32. Protective cover; 33. Top frame; 34. Driving motor; 35. Rotating rod; 36. Worm gear sleeve; 37. Mounting rod; 38. Fan; 39. Worm gear; 310. Dust-proof plate. Detailed implementation manners

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] Embodiment 1

[0032] Figures 1 - 6 This is an embodiment of the present invention: Based on the problems of insufficient heat dissipation efficiency of radiators and certain limitations in the applicable range in the existing technologies, this embodiment provides a compound thermosyphon radiator for electronic devices, including a mounting frame 4 movably mounted on a base 1, an evaporation mechanism 2 for promoting fluid evaporation provided on the mounting frame 4, and an air-cooling adjustment mechanism 3 for adjusting the air flow direction provided on the mounting frame 4. The evaporation mechanism 2 can accelerate heat transfer and dissipation, has a wide applicable range, and thus improves the heat dissipation effect of the radiator. The air-cooling adjustment mechanism 3 can adjust the air flow direction according to the change of internal and external temperatures, further improving the heat dissipation efficiency.

[0033] The traditional air-cooled heat dissipation system is limited by the low thermal conductivity of the air medium and is prone to thermal saturation under continuous high-load conditions. Although the phase change liquid cooling solution significantly improves the heat dissipation efficiency through liquid working fluid, it has inherent defects such as increased system complexity brought about by the multi-stage pump and valve structure, increased costs caused by strict processing precision requirements, and leakage risks caused by aging of seals during long-term operation. In order to solve the above problems. The evaporation mechanism 2 includes a plate body 21 movably mounted on one side of the mounting frame 4, and a refrigerant filling port for conveying fluid is connected to the plate body 21, and the refrigerant filling port can quickly replenish the refrigerant, and the refrigerant filling port is a valve structure, which can provide good sealing performance, prevent refrigerant leakage, ensure the stability and safety of the system, and facilitate maintenance and maintenance. A plurality of groups of grooves are provided on the plate body 21, and a sealing cover 22 is installed in the groove body on the plate body 21. A plurality of groups of porous capillary members 23 are installed in the groove body on the plate body 21, and the porous capillary member 23 and the porous capillary member 26 are respectively distributed above and below the heat conductive block 27, and the porous capillary member 23 is located above the heat conductive block 27, and can quickly absorb heat and To promote the evaporation of the working fluid, the porous capillary member 26 is located below the heat conductive block 27, and can use the capillary force to promote the reflux of the liquid to ensure the smooth circulation of the working fluid. The heat conductive sheet 1 24 and the heat conductive sheet 2 25 are alternately distributed between the multiple groups of porous capillary members 23. The groove body on the plate body 21 is equipped with multiple groups of porous capillary members 26. The plate body 21 is equipped with multiple groups of heat conductive blocks 27. The heat conductive blocks 27 are distributed in the middle part of the groove body on the plate body 21. The heat conductive blocks 27 help to evenly distribute the heat inside the groove body, so that the porous capillary members 1 23 and the porous capillary members 2 26 can absorb and transfer heat more efficiently, thereby improving the overall heat dissipation efficiency. A condensation component for reducing the temperature is arranged inside the installation frame 4. When electronic devices (such as CPU, GPU or IGBT, etc.) are running, heat is generated, and this heat is transferred to the plate body 21 of the radiator. After the porous capillary member 1 23 and the porous capillary member 2 26 inside the plate body 21 absorb the heat, the working fluid evaporates rapidly and becomes gaseous. The dual design of the porous capillary member 23 and the porous capillary member 2 26 helps to further improve the heat dissipation area and heat exchange efficiency, ensuring that heat can be transferred quickly. The heat conductive sheet 1 24 and the heat conductive sheet 2 25 can increase the contact area with the air and can also speed up the heat transfer process from the working fluid to the air, which helps to optimize the heat flow path and improve the heat dissipation and heat exchange efficiency.

[0034] Embodiment 2

[0035] Based on the first embodiment, Figures 1 - 6As shown, due to the problem of insufficient heat dissipation efficiency of the radiator and certain limitations in the applicable range in the existing technologies currently available, there is still a problem that the condensation mechanism in the existing technology is not welded into an integral structure, and there may be air isolation between the heat dissipation fins 2012 and the partition box 2013, resulting in a reduction in the heat conduction efficiency and affecting the heat dissipation effect. Therefore, the device is also provided with a structure for eliminating air isolation.

[0036] If the heat dissipation fins 2012 and the partition box 2013 are not welded into an integral body, there will be air isolation between them. Since air has poor thermal conductivity, it will reduce the heat conduction efficiency and thus affect the heat dissipation effect. To solve the above problems, the condensation assembly includes a fixing frame 2011 installed on the plate body 21. Connecting pipes 2016 are installed on both sides of the plate body 21. A transmission box 2014 is installed at the top of the connecting pipes 2016. A diversion pipe 2015 is installed between the connecting pipes 2016 and the plate body 21. Multiple groups of partition boxes 2013 are installed on the diversion pipe 2015. A number of groups of heat dissipation fins 2012 are installed between two groups of diversion pipes 2015, and the heat dissipation fins 2012 and the partition boxes 2013 are arranged in an alternating manner. When an electronic device (such as a CPU, GPU, or IGBT, etc.) operates and generates heat, this heat is transferred to the plate body 21 of the radiator. After the porous capillary member one 23 and the porous capillary member two 26 inside the plate body 21 absorb the heat, the working fluid quickly evaporates and becomes gaseous. The gaseous working fluid rises to the connecting pipes 2016 through the diversion pipe 2015. There are large-area heat dissipation fins 2012 arranged outside the connecting pipes 2016, and a forced air cooling structure is also equipped. The steam liquefies into a liquid when it meets cold in the connecting pipes 2016. The liquefied working fluid flows back into the plate body 21 along the diversion pipe 2015 under the action of gravity and capillary force, completing a cycle, so that the heat generated by the electronic device can be efficiently dissipated, ensuring the stable operation of the device under high load. The transmission box 2014 ensures the normal operation and safety of the transmission components, helps to optimize the air duct structure, ensures that the cooling air can evenly cover all parts of the radiator, improves the heat dissipation effect, can also reduce noise, improves the overall use experience of the device, and ensures the stable operation of the electronic device under high load.

[0037] Embodiment Three

[0038] Based on Embodiment One and Embodiment Two, as Figures 1 - 6 shown, due to the problem of insufficient heat dissipation efficiency of the radiator and certain limitations in the applicable range in the existing technologies currently available, however, during the heat dissipation process, it is not easy for the radiator in the existing technology to adjust the flow direction of the air flow according to the internal and external temperatures, making the radiator have certain limitations and thus affecting the heat dissipation effect. Therefore, the device is also provided with a structure for adjusting the air flow direction.

[0039] During the heat dissipation process, since the existing radiators cannot flexibly adjust the air flow direction according to the ambient and their own temperatures, there are shortcomings in their adaptability to the heat dissipation scenarios, ultimately affecting the heat dissipation efficiency. To solve the above problems. The air-cooled adjustment mechanism 3 includes a frame 31 installed on the other side of the mounting frame 4. Multiple groups of air vents corresponding to the positions of the fans 38 are provided inside the frame 31, which helps to form a reasonable and efficient air duct structure, ensuring that the cooling air can evenly cover all parts of the radiator and improving the heat dissipation efficiency. A protective cover 32 is installed on one side of the frame 31, and a top frame 33 is installed at the top of the frame 31. Multiple groups of heat dissipation slots are provided at the top of the top frame 33, facilitating the discharge of the heat generated by the operation of the drive motor 34, playing a protective role for the drive motor 34. A drive motor 34 is installed inside the top frame 33. The output end of the drive motor 34 is connected to a rotating rod 35 that is rotatably connected to the top frame 33. Multiple groups of worm sleeves 36 are installed on the rotating rod 35. Multiple groups of mounting rods 37 are rotatably connected inside the frame 31. Multiple groups of fans 38 are installed on the mounting rods 37. The fans 38 are distributed inside the protective cover 32. The protective cover 32 can protect the fans 38 from external dust, foreign objects, etc., extend the service life of the fans 38, and also has a certain noise reduction effect, improving the overall use experience of the device. The fans 38 are powered by rechargeable batteries. The fans 38 powered by rechargeable batteries are not restricted by power sockets, can be flexibly moved and installed, improving the portability and flexibility of the heat dissipation system. And in the case of a main power failure or power outage, the rechargeable batteries can serve as backup power sources to ensure that the fans 38 continue to operate and maintain the normal operation of the heat dissipation system, improving the reliability of the device. A worm gear 39 meshing with the worm sleeve 36 is installed at the top of the mounting rod 37. A dust-proof plate 310 is slidably installed on the frame 31. The area of the dust-proof plate 310 is larger than the area formed by multiple groups of fans 38, preventing dust from entering the frame 31 and playing a role in blocking dust. And the distance between the dust-proof plate 310 and the fans 38 is greater than the width of the fans 38, so that the angle of the fans 38 can be adjusted smoothly, and the flow direction of the air flow can be adjusted according to the changes in the internal and external temperatures, thereby improving the heat dissipation efficiency. When the external temperature is lower than the internal temperature, the operation of the drive motor 34 drives the rotating rod 35 to rotate, which also makes the worm sleeve 36 rotate. Under the connection of the worm gear 39, the mounting rod 37 rotates under the support of the frame 31, so as to drive the fans 38 to rotate, adjust the angle of the fans 38, and facilitate the adjustment of the air flow direction according to the changes in the internal and external temperatures, thereby improving the heat dissipation effect.

[0040] It should be noted that in this article, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A composite thermosyphon heat sink for electronic equipment, comprising a mounting frame (4) movably mounted on a base (1), characterized in that: The installation frame (4) is provided with an evaporation mechanism (2) for promoting evaporation of the fluid, and the installation frame (4) is provided with an air cooling adjustment mechanism (3) for adjusting the flow direction of the airflow; The evaporation mechanism (2) comprises a plate body (21) movably mounted on one side of a mounting frame (4), and a plurality of groups of grooves are provided on the plate body (21), a sealing cover (22) is mounted in the grooves on the plate body (21), a plurality of groups of porous capillary members (1) (23) are mounted in the grooves on the plate body (21), heat conducting plates (1) (24) and heat conducting plates (25) are alternately distributed between the plurality of groups of porous capillary members (1) (23), a plurality of groups of porous capillary members (26) are mounted in the grooves on the plate body (21), a plurality of groups of heat conducting blocks (27) are mounted on the plate body (21), and a condensation component for lowering the temperature is arranged inside the mounting frame (4).

2. A composite thermosyphon heat sink for electronic equipment according to claim 1, characterized in that: The condensing assembly comprises a fixing frame (2011) mounted on a plate body (21); connecting pipes (2016) are mounted on both sides of the plate body (21); a transmission box (2014) is mounted on the top of the connecting pipe (2016); a guide pipe (2015) is mounted between the connecting pipe (2016) and the plate body (21); a plurality of groups of partition boxes (2013) are mounted on the guide pipe (2015); a plurality of groups of heat dissipation fins (2012) are mounted between two groups of the guide pipes (2015); and the heat dissipation fins (2012) and the partition boxes (2013) are arranged in a staggered manner.

3. A composite thermosyphon heat sink for electronic equipment according to claim 1, characterized in that: The air cooling adjustment mechanism (3) comprises a machine frame (31) installed on the other side of the installation frame (4), a protective cover (32) being installed on one side of the machine frame (31), a top frame (33) being installed on the top of the machine frame (31), a driving motor (34) being installed inside the top frame (33), an output end of the driving motor (34) being connected to a rotating rod (35) rotatably connected to the top frame (33), a plurality of groups of worm sleeves (36) being installed on the rotating rod (35), a plurality of groups of installation rods (37) being rotatably connected inside the machine frame (31), a plurality of groups of fans (38) being installed on the installation rods (37), a worm wheel (39) meshing with the worm sleeve (36) being installed on the top of the installation rod (37), and a dustproof plate (310) being slidably installed on the machine frame (31).

4. A composite thermosyphon heat sink for electronic equipment according to claim 1, characterized in that: The heat conducting block (27) is distributed in the middle part of the groove body on the plate body (21), and the porous capillary member 1 (23) and the porous capillary member 2 (26) are distributed above and below the heat conducting block (27), respectively.

5. The composite thermosyphon heat sink for electronic equipment according to claim 1, characterized in that: The plate body (21) is connected to a refrigerant filling port for conveying fluid, and the refrigerant filling port is a valve structure.

6. A composite thermosyphon heat sink for electronic equipment according to claim 3, characterized in that: The frame (31) has a plurality of groups of air outlets corresponding to the positions of fans (38) disposed inside the frame (31), and the fans (38) are distributed inside the protective cover (32).

7. A composite thermosyphon heat sink for electronic equipment according to claim 3, characterized in that: The top of the top frame (33) is provided with a plurality of heat dissipation slots, and the fan (38) is powered by a rechargeable battery.

8. The composite thermosyphon heat sink for electronic equipment according to claim 3, characterized in that: The area of ​​the dustproof plate (310) is larger than the area formed by the multiple sets of fans (38), and the distance between the dustproof plate (310) and the fans (38) is larger than the width of the fans (38).

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