Diamond film elastic heat conduction structure

Abstract

The invention discloses a diamond film elastic heat conduction structure which comprises a diamond film and elastic heat conduction glue. The multiple diamond films are obliquely arranged in the horizontal direction according to preset intervals, the elastic heat-conducting glue is filled between every two adjacent diamond films, and every two adjacent diamond films are connected through the elastic heat-conducting glue to form a heat-conducting structure. In the design, the high heat conduction characteristic of the diamond film and the elasticity of the elastic heat conduction glue are combined, so that the heat conduction structure has adjustable heat conduction performance and elastic performance, and can meet occasions needing high heat conduction, shock absorption and temperature difference deformation compensation.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal conduction structure design, and particularly to a diamond film elastic thermal conduction structure. Background Art

[0002] With the rapid development of modern technology, the power and integration degree of electronic devices are getting higher and higher. Therefore, the concentration of heat generation is also getting higher and higher, and the heat generation of electronic devices cannot be ignored for the stability of work. Therefore, how to efficiently and quickly export heat has become the focus of research in the industry.

[0003] In many application scenarios such as the ECU of new energy vehicles, headlamps, medical equipment, aerospace, and wind energy converters, not only fast heat dissipation is required, but also shock absorption is needed to ensure the stable operation of the devices. This requires a structure with both high thermal conductivity and high deformation ability. However, the existing thermal conduction structures generally cannot take into account both high thermal conductivity and high deformation ability.

[0004] Therefore, finding a technical solution that can solve the above technical problems has become an important topic for those skilled in the art to study. Summary of the Invention

[0005] A diamond film elastic thermal conduction structure provided by the present invention includes a diamond film and an elastic thermal conductive adhesive;

[0006] A plurality of the diamond films are arranged obliquely in the horizontal direction at a preset interval, and the elastic thermal conductive adhesive is filled between adjacent two of the diamond films, and adjacent two of the diamond films are connected by the elastic thermal conductive adhesive to form a thermal conduction structure.

[0007] Optionally, it further includes a diamond film surface layer;

[0008] The diamond film surface layer is provided on both the top surface and the bottom surface of the thermal conduction structure.

[0009] Optionally, each of the diamond films forms a preset inclination angle with the horizontal direction, and the angle range of the inclination angle is 10° - 80°.

[0010] Optionally, the diamond film is a polycrystalline diamond film or a polycrystalline diamond film.

[0011] Optionally, the thickness range of the diamond film is 0 - 100 microns.

[0012] Optionally, the thickness range of the diamond film surface layer is 0 - 300 microns.

[0013] Optionally, the elastic thermal conductive adhesive is a thermal conductive silica gel, a thermal conductive rubber or a thermoplastic elastomer.

[0014] Optionally, one or more of diamond, silicon carbide, and metal particles are doped in the elastic thermal conductive adhesive.

[0015] Optionally, a tackifier or a primer is further provided between the elastic thermal conductive adhesive and the diamond film.

[0016] Optionally, the compression amplitude of the elastic thermal conductive adhesive is 30% - 70%, and the stretching amplitude is 100% - 600%.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The diamond film elastic thermal conductive structure of this embodiment includes a diamond film and an elastic thermal conductive adhesive; a plurality of the diamond films are arranged obliquely along the horizontal direction at a preset interval, and the elastic thermal conductive adhesive is filled between adjacent two of the diamond films, and adjacent two of the diamond films are connected by the elastic thermal conductive adhesive to form a thermal conductive structure.

[0019] In the above design, the thermal conductive structure combines the high thermal conductivity characteristics of the diamond film and the elasticity of the elastic thermal conductive adhesive, so that the thermal conductive structure not only has a highly adjustable thermal conductivity performance but also has an elastic function, and can meet the occasions that require high thermal conductivity, shock absorption, and compensation for temperature difference deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic structural diagram of a diamond film elastic thermal conductive structure provided by the present invention;

[0022] Figure 2 It is a schematic structural diagram of a diamond film elastic thermal conductive structure provided by the present invention after adding a diamond film surface layer;

[0023] Illustration: Diamond film 1; Elastic thermal conductive adhesive 2; Diamond film surface layer 3; Inclination angle a; Horizontal direction X. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] To enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0025] Please refer to Figure 1 , a diamond thin film elastic heat conduction structure provided by an embodiment of the present invention includes a diamond thin film 1 and an elastic heat-conducting adhesive 2;

[0026] A plurality of the diamond thin films 1 are arranged obliquely in the horizontal direction at a preset interval, and the elastic heat-conducting adhesive 2 is filled between two adjacent diamond thin films 1, and two adjacent diamond thin films 1 are connected by the elastic heat-conducting adhesive 2 to form a heat conduction structure.

[0027] Specifically, each diamond thin film 1 forms a preset inclination angle with the horizontal direction, and the angle range of the inclination angle is 10° - 80°. Among them, in this embodiment, the above inclination angle is specifically formed by the diamond thin film 1 and the diamond thin film surface layer 3. In the specific implementation manner, the above inclination angle can be 10°, 20°, 40°, 80°, etc. This embodiment does not limit this.

[0028] In the above design, the heat conduction structure combines the high heat conduction characteristics of the diamond thin film 1 and the elasticity of the elastic heat-conducting adhesive 2, so that the heat conduction structure not only has a highly adjustable heat conduction performance but also has an elastic function, and can meet the occasions that require high heat conduction, shock absorption and compensation for temperature difference deformation.

[0029] In addition, it should be noted that the thermal conductivity of the heat conduction structure in the thickness direction in this embodiment can be adjusted between 1 - 1500 W / (m·K), which is achieved by adjusting the thickness of the diamond thin film 1 and / or adjusting the spacing of the diamond thin films 1 and / or the inclination angle with the horizontal direction. Specifically, the thermal conductivity of the heat conduction structure in its thickness direction can be increased by increasing the thickness of the diamond thin film 1 or the inclination angle with the horizontal direction or decreasing the spacing between the diamond thin films 1.

[0030] The above situation will be described below with a specific scenario:

[0031] When the pressure on the heat conduction structure in its thickness direction increases, the inclination amplitude of the diamond thin film 1 becomes smaller, that is, the inclination angle becomes smaller, and the elastic heat-conducting adhesive 2 is compressed. At this time, the thermal conductivity of the heat conduction structure in its thickness direction decreases.

[0032] When the pressure on the heat-conducting structure decreases in the direction of its thickness as compared with the case of increasing pressure, the inclination amplitude of the diamond film 1 becomes larger, that is, the inclination angle becomes larger, and the elastic heat-conducting adhesive 2 returns to its shape before being compressed. At this time, the thermal conductivity of the heat-conducting structure in the direction of its thickness is greater than that in the above-mentioned case.

[0033] Thus, when the heat-conducting structure in this embodiment is applied to electronic components, the thermal conductivity of the heat-conducting structure can be changed by changing the elastic deformation of the heat-conducting structure.

[0034] Furthermore, the diamond film elastic heat-conducting structure in this embodiment further includes a diamond film surface layer 3;

[0035] The diamond film surface layer 3 is provided on both the top surface and the bottom surface of the heat-conducting structure.

[0036] Specifically, the thickness range of the above-mentioned diamond film surface layer 3 is 0 - 300 microns. In a specific implementation manner, the above thickness can be 100 microns, 110 microns, 165 microns, 280 microns, etc. This embodiment does not limit this.

[0037] It should be noted that through the above design, the diamond film surface layer 3 can increase the surface strength of the heat-conducting structure and can effectively improve the heat-conducting uniformity of the heat-conducting structure.

[0038] Furthermore, the diamond film 1 in this embodiment can be a polycrystalline diamond film 1 or a polycrystalline diamond film 1.

[0039] It should be noted that this embodiment does not limit the type of the diamond film 1, and the designer can select a suitable type of diamond film 1 according to the actual situation.

[0040] Specifically, the thickness range of the diamond film 1 is 0 - 100 microns. In a specific implementation manner, the above thickness can be 70 microns, 85 microns, 89 microns, 99 microns, etc. This embodiment does not limit this.

[0041] When the diamond film 1 in this embodiment adopts a polycrystalline diamond film, its longitudinal thermal conductivity reference value is 1000 - 2000 W / (m·k), and the transverse thermal conductivity reference value is 700 - 1500 W / (m·k). The above-mentioned longitudinal specifically refers to the length direction of the diamond film 1, and the transverse specifically refers to the width direction of the diamond film 1.

[0042] Furthermore, the elastic heat-conducting adhesive 2 in this embodiment is a heat-conducting silica gel or a heat-conducting rubber or a thermoplastic elastomer.

[0043] It should be noted that the elastic thermal conductive adhesive 2 can specifically be selected from common materials in the prior art such as thermal conductive silicone, thermal conductive rubber, and thermoplastic elastomer. Designers can make selections according to actual situations, and this embodiment does not limit this.

[0044] Furthermore, one or more of diamond, silicon carbide, and metal particles are doped in the elastic thermal conductive adhesive 2 in this embodiment.

[0045] It should be noted that through the above design, the thermal conductivity and elastic deformation amount of the elastic thermal conductive adhesive 2 can be effectively adjusted.

[0046] Furthermore, a tackifier or a primer is also provided between the elastic thermal conductive adhesive 2 and the diamond thin film 1 in this embodiment.

[0047] It should be noted that the tackifier and the primer in this embodiment are both in the prior art. The above-mentioned primer and tackifier can effectively improve the bonding effect between the elastic thermal conductive adhesive 2 and the diamond thin film 1, making the connection between the two more tight and firm.

[0048] Furthermore, the compression amplitude of the elastic thermal conductive adhesive 2 in this embodiment is 30% - 70%, and the tensile amplitude is 100% - 600%.

[0049] The above content describes in detail the specific structure of a diamond thin film elastic thermal conductive structure provided by this embodiment. Next, two comparative examples will be used to further describe the diamond thin film elastic thermal conductive structure.

[0050] Comparative Example 1:

[0051] A polycrystalline diamond film with a diameter of 150 mm, a thickness of 0.1 mm, and a transverse thermal conductivity of 1200 W / (m·K) is selected. It is cut into long strip diamond thin films 1 with a length of 40 mm and a width of 1.41 mm using a laser cutting machine. 400 of the aforementioned diamond thin films 1 are arranged parallel at an inclination of 45 degrees to the horizontal direction with a spacing of 0.3 mm. Then, a thin layer of epoxy resin adhesive is sprayed on the diamond surface, and silicone rubber (compressive elastic deformation amount of 50%, tensile elastic deformation amount of 200%) is filled in the gaps. After smoothing and cross-linking and curing, a diamond thin film elastic thermal conductive structure with dimensions of 40x40x1 mm in length, width, and thickness can be obtained, and the thermal conductivity in the thickness direction can reach up to 300 W / (m·K).

[0052] Comparative Example 2:

[0053] Select a polycrystalline diamond film with a diameter of 150 mm and a thickness of 0.2 mm. Use a laser cutting machine to cut it into a square polycrystalline diamond thin film surface layer 3 with a length and width of 40X40 mm. Paste two diamond thin film surface layers 3 onto the upper and lower surfaces of the diamond thin film elastic heat conduction structure prepared in the comparative example, and a diamond thin film elastic heat conduction structure with dimensions of 40x40x1.4 mm in length, width, and thickness can be obtained.

[0054] For the diamond thin film elastic heat conduction structure prepared in Comparative Example 1, the surface strength of the diamond thin film elastic heat conduction structure in Comparative Example 2 is higher, and the in-plane thermal conductivity is more uniform.

[0055] The above has introduced in detail a diamond thin film elastic heat conduction structure provided by the present invention. For those of ordinary skill in the art, according to the idea of the embodiments of the present invention, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A diamond film elastic heat conductive structure, characterized in that: It comprises a diamond film (1) and an elastic thermal conductive adhesive (2); The plurality of diamond films (1) are arranged obliquely in a horizontal direction at a preset interval, the elastic thermal conductive adhesive (2) is filled between two adjacent diamond films (1), and the two adjacent diamond films (1) are connected via the elastic thermal conductive adhesive (2) to form a thermal conductive structure.

2. The diamond film elastic heat conductive structure according to claim 1, characterized in that: Also includes a diamond film surface layer (3); The diamond thin film surface layer (3) is provided on both the top surface and the bottom surface of the heat conducting structure.

3. The diamond film elastic heat conductive structure according to claim 1, characterized in that: Each of the diamond films (1) forms a preset tilt angle with the horizontal direction, and the tilt angle ranges from 10° to 80°.

4. The diamond film elastic heat conductive structure according to claim 1, characterized in that: The diamond film (1) is a polycrystalline diamond film or a polycrystalline diamond film.

5. The diamond film elastic heat conductive structure according to claim 1, characterized in that: The thickness of the diamond film (1) ranges from 0 to 100 micrometers.

6. The diamond film elastic heat-conducting structure according to claim 2, characterized in that: The thickness of the diamond film surface layer (3) ranges from 0 to 300 micrometers.

7. The diamond film elastic heat-conducting structure according to claim 1, characterized in that: The elastic thermally conductive adhesive (2) is thermally conductive silica gel or thermally conductive rubber or thermoplastic elastomer.

8. The diamond film elastic heat conductive structure according to claim 1, characterized in that: The elastic thermally conductive adhesive (2) is doped with one or more of diamond, silicon carbide, and metal particles.

9. The diamond film elastic heat conductive structure according to claim 1, characterized in that: A tackifier or a primer is also provided between the elastic thermally conductive adhesive (2) and the diamond film (1).

10. The diamond film elastic heat conductive structure according to claim 1, characterized in that: The elastic thermally conductive adhesive (2) has a compression range of 30%-70% and a stretch range of 100%-600%.

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