Automatic die bonder based on electronic component production

Abstract

The invention belongs to the technical field of electronic component processing, and particularly relates to an automatic die bonder based on electronic component production. The invention provides the automatic die bonder based on electronic component production, which is convenient to adapt to different types of PCBs. Comprising a pasting module, a non-polar clamping module and the like, the pasting module for automatically pasting a PCB is arranged in a pasting area, and the non-polar clamping module for adaptively and accurately fixing different types of PCBs is arranged in the middle of an electric conveying belt. The chip bonding machine is high in overall automation degree, the angle position of an adsorbed chip can be automatically rotated and finely adjusted through the bonding module according to different types of PCBs, the different types of PCBs can be adaptively and accurately positioned, clamped and fixed through cooperation of the electrodeless clamping module, then the bonding precision of the chip is ensured, and the chip bonding efficiency is improved. The qualified rate of surface mounting can be improved; in addition, by means of the linear conveying mode, the PCB can be prevented from being directly pushed to be fed and discharged, the scratching risk is effectively reduced, and then the quality of the PCB is protected.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic component processing, and specifically relates to an automatic chip mounter based on electronic component production. Background Art

[0002] As an automated device, an automatic chip mounter achieves high-precision mounting through the cooperation of a robotic arm and a chip head. Its core working principle is to place the material to be pasted on the chip head, and then precisely paste the material to the target position through the movement of the robotic arm.

[0003] However, a Chinese patent on the invention of a PCB mounter and its chip mounting method was published on the Chinese Patent Network. Its authorization announcement number is CN116437655B, and the application date is June 13, 2023. The device includes an outer mounting frame and an inner mounting frame. The inner mounting frame is fixedly installed on the outer mounting frame. A lower mounting shaft is rotatably installed on the inner mounting frame. A driven member is fixedly installed at the upper end of the lower mounting shaft. A connecting column is fixedly installed on the upper surface of the driven member. A chip mounting plate is fixedly installed at the upper end of the connecting column. Multiple groups of positioning members are arranged on the upper surface of the chip mounting plate. The positioning members are evenly distributed on the surface of the chip mounting plate, and the included angle of each group of positioning members is 90 degrees. The positioning members can assist in the automatic loading and unloading of the PCB. A fixing plate is fixedly installed at the position corresponding to the connecting column on the outer mounting frame. The fixing plate is rotatably connected to the connecting column. A driving component is arranged on one side of the driven member. The device controls the movement position of the transport member itself by eliminating the relative displacement between the PCB and the transport member, reducing the position offset during each pasting by the pasting mechanism, and thus improving the accuracy of chip mounting. However, when loading and unloading the PCB each time, the device is prone to scratching the bottom of the PCB by directly pushing. Moreover, the intermittent mechanisms such as the driving component, feeding mechanism, and transmission component of the device operate relatively complexly, with certain limitations, making it difficult to ensure flexible detection and fine-tuning of the chip mounting angle for different types of PCBs, and the adaptability is relatively poor.

[0004] Therefore, an automatic chip mounter based on electronic component production that is convenient for adapting to different types of PCBs is specifically proposed. Summary of the Invention

[0005] In order to overcome the disadvantage that the existing device has relatively poor adaptability to different types of PCBs during actual use, the technical problem to be solved is to provide an automatic chip mounter based on electronic component production that is convenient for adapting to different types of PCBs.

[0006] The technical solution is as follows: An automatic chip mounter based on electronic component production, which includes a machine platform and an electric conveyor belt. The machine platform is sequentially distributed with a pasting area, a feeding area, a discharging area, and a collecting area from top to bottom. An electric conveyor belt for horizontally conveying the PCB board is arranged in the feeding area. It also includes a pasting module and a stepless clamping module. A pasting module for automatically pasting chips on the PCB board is arranged in the pasting area. A stepless clamping module for adaptively and precisely fixing PCB boards of different models is arranged in the middle of the electric conveyor belt. The stepless clamping module includes a positioning guide plate, clamping arms, a support plate, and a pulling drive member. The positioning guide plate is arranged in the middle of the side plate of the electric conveyor belt. The clamping arms are symmetrically and slidably connected to the positioning guide plate. Support plates for providing support force during chip pasting on the PCB board are respectively connected to the bottoms of the two clamping arms. A pulling drive member for controlling the opening and closing of the clamping arms is arranged in the middle of the positioning guide plate.

[0007] As a further improvement of the above technical solution, the pasting module includes an adjustment mechanism, a chip pasting mechanism, a fine adjustment and deviation correction component, and a feeding box. The adjustment mechanism is arranged in the pasting area for moving and controlling the position of chip pasting. The fine adjustment and deviation correction component is arranged on the adjustment mechanism. The chip pasting mechanism is arranged on the fine adjustment and deviation correction component. The fine adjustment and deviation correction component is used to control the rotation adjustment range of the chip pasting mechanism. A feeding box is arranged at the front side of the bottom in the pasting area.

[0008] As a further improvement of the above technical solution, the adjustment mechanism includes a horizontal guide rail, a first electric lead screw, a vertical guide rail, a second electric lead screw, and a connecting seat. The horizontal guide rails are symmetrically arranged on the inner side walls of the pasting area. First electric lead screws are respectively arranged in the two horizontal guide rails. A vertical guide rail is threadedly connected between the two first electric lead screws. A second electric lead screw is axially arranged in the vertical guide rail. A connecting seat that is horizontally slidably matched with the vertical guide rail is threadedly connected to the second electric lead screw.

[0009] As a further improvement of the above technical solution, the fine adjustment and deviation correction component includes a micro motor, an adjustment arm, a CCD camera, and a material identification camera. A micro motor-driven rotating adjustment arm is installed at the bottom of the connecting seat. The chip pasting mechanism is installed on the adjustment arm. A CCD camera for detecting the chip pasting position is arranged at the bottom of the adjustment arm. A material identification camera for identifying different types of chips is arranged at the front side of the bottom of the pasting area.

[0010] As a further improvement of the above technical solution, the pulling drive member includes a torque motor, a swing arm, and a pulling arm. A torque motor is installed in the middle of the bottom of the positioning guide plate. The output shaft end of the torque motor is connected to the swing arm. The two ends of the swing arm are respectively hinged to the pulling arms. The other ends of the two pulling arms are respectively hinged to the clamping arms.

[0011] As a further improvement of the above technical solution, it further includes an induction positioning member. The induction positioning member includes a rubber pad, a limiting strip and an ultrasonic sensor. Rubber pads are respectively arranged at intervals in the middle of the inner sides of the two clamping arms, and limiting strips are respectively arranged at the upper ends of the inner sides of the two clamping arms. Ultrasonic sensors for detecting the conveying position of the PCB board are respectively arranged at both ends of the inner side of one of the clamping arms, and avoidance grooves are respectively formed on the opposite sides of the two clamping arms and are distributed offset from the side of the electric conveyor belt.

[0012] As a further improvement of the above technical solution, it further includes a discharging detection module. The discharging detection module includes an electric conveyor belt, a vision scanner, a first electric slide rail, a first gripper and a receiving box. An electric conveyor belt is arranged at the bottom of the discharging area, a vision scanner for detecting the soldering quality of the PCB board is arranged in the middle at the top of the discharging area, a first electric slide rail is arranged on the right side at the top of the discharging area, a first gripper for sucking up the PCB board is installed on the slide seat of the first electric slide rail, a material discharging port communicating with the collection area is formed at the bottom of the discharging area near the first electric slide rail, a receiving box is placed in the collection area, and the receiving box is located below the material discharging port for collecting unqualified PCB boards detected.

[0013] As a further improvement of the above technical solution, it further includes a negative pressure adsorption gripper. The negative pressure adsorption gripper includes a second electric slide rail, a moving seat and a second gripper. A second electric slide rail is arranged at the upper part on the left side of the machine table, a moving seat is connected to the slider of the second electric slide rail, and a second gripper for gripping and releasing the PCB board is installed on the moving seat.

[0014] As a further improvement of the above technical solution, the machine table is integrated with a controller, and the electric conveyor belt, the first electric lead screw, the second electric lead screw, the chip bonding mechanism, the micro motor, the CCD camera, the material identification camera, the torque motor, the ultrasonic sensor, the electric conveyor belt, the vision scanner, the first electric slide rail, the first gripper, the second electric slide rail and the second gripper are respectively electrically connected to the controller.

[0015] The beneficial effects of the present invention are as follows: The overall automation degree of this chip bonder is high. Through the bonding module, it can automatically rotate and finely adjust the angular position of the adsorbed chip according to different types of PCB boards. And through the cooperation of the stepless clamping module, it can realize the adaptive and precise positioning and clamping of different types of PCB boards, thereby ensuring the bonding accuracy of the chip and being beneficial to improving the qualified rate of chip bonding. By means of the linear conveying method, this equipment can also avoid directly pushing and pulling the PCB board for loading and unloading, effectively reducing the risk of scratching, and thus being beneficial to protecting the quality of the PCB board. Description of the Drawings

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0017] Figure 2 This is a three-dimensional structure schematic diagram of the unfolded state of the machine platform of the present invention.

[0018] Figure 3 This is a three-dimensional structure schematic diagram of the electric conveyor belt, pasting module and negative pressure adsorption gripper of the present invention.

[0019] Figure 4 This is a three-dimensional structure schematic diagram of the pasting module of the present invention.

[0020] Figure 5 This is a three-dimensional structure schematic diagram of the electric conveyor belt and the stepless clamping module of the present invention.

[0021] Figure 6 This is a three-dimensional structure schematic diagram of the electric conveyor belt of the present invention.

[0022] Figure 7 This is a three-dimensional structure schematic diagram of the unloading detection module of the present invention.

[0023] Figure 8 This is a three-dimensional structure schematic diagram of the stepless clamping module of the present invention.

[0024] Figure 9 This is a structural separation diagram of the stepless clamping module of the present invention.

[0025] Reference numerals in the drawings: 1, machine platform; 2, electric conveyor belt; 3, pasting module; 4, stepless clamping module; 5, unloading detection module; 6, negative pressure adsorption gripper; 30, horizontal guide rail; 31, first electric lead screw; 32, vertical guide rail; 33, second electric lead screw; 34, connecting seat; 35, sheet sticking mechanism; 36, micro motor; 37, adjusting arm; 38, CCD camera; 39, material identification camera; 310, feeding box; 40, positioning and guiding plate; 41, clamping arm; 42, supporting plate; 43, avoidance groove; 44, torque motor; 45, swing arm; 46, pulling arm; 47, rubber pad; 48, limiting strip; 49, ultrasonic sensor; 50, electric conveyor belt; 51, vision scanner; 52, blanking port; 53, first electric slide rail; 54, first material grabbing hand; 55, material collecting box; 60, second electric slide rail; 61, moving seat; 62, second material grabbing hand; a, pasting area; b, feeding area; c, unloading area; d, collecting area; e, PCB board. Specific embodiments

[0026] The present invention will be specifically described below with reference to the accompanying drawings.

[0027] First embodiment: An automatic chip mounter provided by the present invention for electronic component production, as Figures 1-9As shown in the figure, it includes a machine table 1, an electric conveyor belt 2, a pasting module 3, and a non-polar clamping module 4. The machine table 1 adopts a four-zone vertical layout, with the pasting area a, the feeding area b, the discharging area c, and the collection area d from top to bottom in sequence. Each functional area realizes the continuous processing of the PCB board e through modular design, which is beneficial to improving the overall automation level. An electric conveyor belt 2 is arranged in the feeding area b, and the PCB board e is horizontally conveyed through a linear conveying method to avoid scratching when the PCB board e is pushed. A pasting module 3 is arranged in the pasting area a, and a non-polar clamping module 4 is arranged in the middle of the electric conveyor belt 2. The non-polar clamping module 4 includes a positioning and guiding plate 40, clamping arms 41, a supporting plate 42, and a pulling driving part. The positioning and guiding plate 40 is arranged in the middle of the side plate of the electric conveyor belt 2. The clamping arms 41 are symmetrically slidably connected to the positioning and guiding plate 40. The bottom parts of the two clamping arms 41 are respectively connected with a supporting plate 42 that provides a supporting force when pasting the PCB board e, which is beneficial to improving the stability when pasting the PCB board e. A pulling driving part for controlling the opening and closing of the clamping arms 41 is arranged in the middle of the positioning and guiding plate 40, which can realize the non-polar clamping and fixing of PCB boards e of different models and has a high adaptability.

[0028] Further, as Figures 2-4 shown, the pasting module 3 includes an adjusting mechanism, a chip pasting mechanism 35, a fine-tuning and deviation correction component, and a feeding box 310. The adjusting mechanism is arranged in the pasting area a, the fine-tuning and deviation correction component is arranged on the adjusting mechanism, and the chip pasting mechanism 35 is arranged on the fine-tuning and deviation correction component. The adjusting mechanism is used to move and control the position of chip pasting, and cooperate with the fine-tuning and deviation correction component to control the rotation adjustment range of the chip pasting mechanism 35, so as to realize precise chip pasting on the PCB board e. A feeding box 310 for storing chips is arranged at the front side of the bottom in the pasting area a, which is convenient for taking materials nearby and is beneficial to improving the chip pasting efficiency of the PCB board e.

[0029] Further, as Figures 2-4 shown, the adjusting mechanism includes a transverse guide rail 30, a first electric lead screw 31, a longitudinal guide rail 32, a second electric lead screw 33, and a connecting seat 34. The transverse guide rails 30 are symmetrically arranged on the inner side walls of the pasting area a. The first electric lead screws 31 are respectively arranged in the two transverse guide rails 30. A longitudinal guide rail 32 is threadedly connected between the two first electric lead screws 31. A second electric lead screw 33 is axially arranged in the longitudinal guide rail 32. A connecting seat 34 that is horizontally slidably matched with the longitudinal guide rail 32 is threadedly connected to the second electric lead screw 33, which can flexibly control and adjust the position and angle of chip pasting on the PCB board e to facilitate adapting to different types of PCB boards e.

[0030] Further, as Figure 3 and Figure 4As shown in the figure, the fine-tuning and deviation-correction component includes a micro motor 36, an adjustment arm 37, a CCD camera 38 and a material identification camera 39. An adjustment arm 37 driven by the micro motor 36 to rotate is installed at the bottom of the connecting seat 34. The chip bonding mechanism 35 is installed on the adjustment arm 37. A CCD camera 38 for detecting the chip bonding position is arranged at the bottom of the adjustment arm 37. A material identification camera 39 for identifying different types of chips is arranged at the front side of the bottom of the bonding area a. The cooperation of the CCD camera 38 and the material identification camera 39 is beneficial to further improve the accuracy of chip bonding to the PCB board e.

[0031] Furthermore, as Figures 4-9 shown in the figure, the pulling driving part includes a torque motor 44, a swing arm 45 and a pulling arm 46. A torque motor 44 is installed in the middle of the bottom of the positioning and guiding plate 40. The output shaft end of the torque motor 44 is connected with a swing arm 45. The two ends of the swing arm 45 are respectively hinged with a pulling arm 46. The other ends of the two pulling arms 46 are respectively hinged to the clamping arm 41, which can realize stepless clamping and fixing of different types of PCB boards e, with high adaptability and flexible and convenient use.

[0032] This chip mounter conveys the PCB board e to be chipped from right to left in sequence through the electric conveyor belt 2. Two groups of ultrasonic sensors 49 are respectively used to detect the conveying position of the PCB board e. When the PCB board e is just located between the two clamping arms 41, after the two groups of ultrasonic sensors 49 sense the PCB board e, they will feedback the signal to the controller, so as to control the torque motor 44 to rotate and drive the swing arm 45 to rotate. Then, the two pulling arms 46 respectively pull the clamping arms 41 thereon to close towards each other to clamp and fix the PCB board e adaptively; when the two clamping arms 41 close towards each other to clamp and fix the PCB board e, the rubber pad 47 can play a buffering and protective role for the PCB board e, and the limiting strip 48 can play the purpose of clamping and limiting the PCB board e; subsequently, the controller will control the first electric lead screw 31 and the second electric lead screw 33 to cooperate to adjust the moving position of the chip mounting mechanism 35, so that the chip mounting mechanism 35 moves above the feeding box 310. The controller will control the chip mounting mechanism 35 to move down to automatically suck up the chip to be pasted, and then move the sucked-up chip to stay above the material identification camera 39 for about 0.5 seconds. Through the scanning and detection of the material identification camera 39, the detected signal is feedback to the controller. Then, the controller can accurately control the chip mounting mechanism 35 to move the chip to the corresponding position of the PCB board e, and cooperate with the CCD camera 38 to automatically identify and adapt the position of the chip pasted on the PCB board e; when there is an angular deviation of the chip, the micro motor 36 can also be used to control the adjusting arm 37 and the chip mounting mechanism 35 thereon to perform fine adjustment rotation; thus, this chip mounter can automatically rotate and fine-tune the angular position of the adsorbed chip according to different models of PCB boards e, and paste it accurately on the corresponding position of the PCB board e; it can effectively improve the chip pasting accuracy of the PCB board e, and then is beneficial to improving the qualification rate of chip pasting on the PCB board e; at the same time, it can effectively avoid directly pushing the PCB board e, which is beneficial to protecting the PCB board e and preventing scratching from affecting the chip pasting quality of the PCB board e. Repeat the above operation steps. After the chip pasting of the PCB board e is completed, the controller controls the torque motor 44 to rotate in the reverse direction, so that the clamping arms 41 open towards each other to release the restriction on the PCB board e, and the controller will continue to control the electric conveyor belt 2 to convey the PCB board e with completed chip pasting to the left.

[0033] Second Embodiment: On the basis of the first embodiment, as Figure 7 and Figure 9As shown in the figure, it further includes an induction positioning member, which includes a rubber pad 47, a limiting strip 48 and an ultrasonic sensor 49. Rubber pads 47 are respectively arranged at intervals in the middle parts of the inner sides of the two clamping arms 41, limiting strips 48 are respectively arranged at the upper ends of the inner sides of the two clamping arms 41, and ultrasonic sensors 49 for detecting the conveying position of the PCB board e are respectively arranged at both ends of the inner side of one of the clamping arms 41. Avoidance grooves 43 that are offset from the side edges of the electric conveyor belt 2 are respectively formed on the opposite sides of the two clamping arms 41; this is beneficial to further improving the positioning accuracy of different types of PCB boards e.

[0034] Furthermore, as Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 shown in the figure, it further includes a discharging detection module 5, which includes an electric conveyor belt 50, a vision scanner 51, a first electric slide rail 53, a first gripper 54 and a receiving box 55. An electric conveyor belt 50 is arranged at the bottom inside the discharging area c, a vision scanner 51 for detecting the soldering quality of the PCB board e is arranged in the middle at the top inside the discharging area c, a first electric slide rail 53 is arranged on the right side at the top inside the discharging area c, and a first gripper 54 for sucking up the PCB board e is installed on the slide seat of the first electric slide rail 53. A material discharging port 52 communicating with the collecting area d is formed at the bottom inside the discharging area c near the first electric slide rail 53, a receiving box 55 is placed in the collecting area d, and the receiving box 55 is located below the material discharging port 52 for collecting the PCB boards e that fail the detection; it further includes a negative pressure adsorption gripper 6, which includes a second electric slide rail 60, a moving seat 61 and a second gripper 62. A second electric slide rail 60 is arranged at the upper left part of the machine table 1, a moving seat 61 is connected to the slider of the second electric slide rail 60, and a second gripper 62 for gripping and releasing the PCB board e is installed on the moving seat 61, which is convenient for grasping and moving the position of the PCB board e to avoid scratching.

[0035] In addition, as Figures 1-8 shown in the figure, the machine table 1 is integrated with a controller, and the electric conveyor belt 2, the first electric lead screw 31, the second electric lead screw 33, the chip bonding mechanism 35, the micro motor 36, the CCD camera 38, the material identification camera 39, the torque motor 44, the ultrasonic sensor 49, the electric conveyor belt 50, the vision scanner 51, the first electric slide rail 53, the first gripper 54, the second electric slide rail 60 and the second gripper 62 are respectively electrically connected to the controller, which is beneficial to improving the overall automation level of this chip bonder.

[0036] When the PCB board e after chip mounting is conveyed to the leftmost area, at this time, the PCB board e conveyed again from the right is just located between the two clamping arms 41. Then, during the intermittent pause of about 0.5 seconds of the electric conveyor belt 2, the controller will control the second electric slide rail and the second gripper 62 to move to pick up the PCB board e after chip mounting upward and transfer it to the lower electric conveyor belt 50. The controller controls the electric conveyor belt 50 to convey the PCB board e after chip mounting on it from left to right. When the PCB board e after chip mounting passes under the vision scanner 51, the controller controls the electric conveyor belt 50 to pause briefly for 0.5 seconds for scanning and detection. Then, through the vision scanner 51, the PCB board e after chip mounting can be automatically scanned and detected, and through data matching, it is completed to judge whether the PCB board e after chip mounting is qualified; if it is qualified, the controller will control the electric conveyor belt 50 to continue to be conveyed to the right to the next process; if it is unqualified, the controller will control the electric conveyor belt 50 to convey the unqualified PCB board e under the first gripper 54, and the controller controls the first gripper 54 to grab and transfer the unqualified PCB board e directly above the blanking port 52, so that the unqualified PCB board e falls into the receiving box 55 in the collection area d; thus, it is beneficial to further improve the quality requirements for precise chip mounting of the PCB board e.

[0037] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An automatic die bonding machine for electronic component production, comprising a machine platform (1) and an electric conveyor belt (2), wherein the machine platform (1) is provided with a bonding area (a), a feeding area (b), a discharge area (c) and a collection area (d) in order from top to bottom, and the feeding area (b) is provided with an electric conveyor belt (2) for horizontally conveying a PCB board (e), characterized in that: The invention also comprises a pasting module (3) and a stepless clamping module (4), wherein the pasting area (a) is provided with a pasting module (3) for automatically pasting a PCB board (e), and the middle part of the electric conveyor belt (2) is provided with a stepless clamping module (4) for adaptively and accurately fixing PCB boards (e) of different models. The stepless clamping module (4) comprises a positioning guide plate (40), a clamping arm (41), a support plate (42) and a pulling drive member, wherein the positioning guide plate (40) is provided in the middle part of a side plate of the electric conveyor belt (2), the clamping arm (41) is symmetrically slidably connected to the positioning guide plate (40), the bottoms of the two clamping arms (41) are respectively connected with support plates (42) for providing support force when pasting a PCB board (e), and the middle part of the positioning guide plate (40) is provided with a pulling drive member for controlling the opening and closing of the clamping arm (41).

2. The automatic die bonding machine based on electronic component production according to claim 1, characterized in that: The pasting module (3) comprises an adjustment mechanism, a pasting mechanism (35), a fine-tuning and correcting assembly and a material discharge box (310); the adjustment mechanism is arranged in the pasting area (a) for moving and controlling the position of the pasting; the fine-tuning and correcting assembly is arranged on the adjustment mechanism; the pasting mechanism (35) is arranged on the fine-tuning and correcting assembly; the fine-tuning and correcting assembly is used to control the rotation adjustment amplitude of the pasting mechanism (35); and the material discharge box (310) is arranged on the front side of the bottom of the pasting area (a).

3. The automatic die bonding machine based on electronic component production according to claim 2, characterized in that: The adjustment mechanism comprises a transverse guide rail (30), a first electric screw rod (31), a longitudinal guide rail (32), a second electric screw rod (33) and a connecting seat (34); the transverse guide rail (30) is symmetrically arranged on the inner side wall of the pasting area (a); the first electric screw rods (31) are respectively arranged in the two transverse guide rails (30); the longitudinal guide rail (32) is threadedly connected between the two first electric screw rods (31); the second electric screw rod (33) is axially arranged in the longitudinal guide rail (32); and the connecting seat (34) is threadedly connected to the second electric screw rod (33) and is horizontally slidably matched with the longitudinal guide rail (32).

4. The automatic die bonding machine based on electronic component production according to claim 2, characterized in that: The fine-tuning and deflection-correcting component comprises a micro motor (36), an adjusting arm (37), a CCD camera (38) and a material identification camera (39); an adjusting arm (37) driven to rotate by the micro motor (36) is installed at the bottom of the connecting seat (34); a patch sticking mechanism (35) is installed on the adjusting arm (37); a CCD camera (38) for detecting the position of the patch is arranged at the bottom of the adjusting arm (37); and a material identification camera (39) for identifying different types of patches is arranged at the front side of the bottom of the sticking area (a).

5. The automatic die bonding machine based on electronic component production according to claim 1, characterized in that: The pulling drive member comprises a torque motor (44), a swing arm (45) and a pulling arm (46); the torque motor (44) is mounted in the middle of the bottom of the positioning guide plate (40); the output shaft end of the torque motor (44) is connected to the swing arm (45); the two ends of the swing arm (45) are respectively hingedly connected to the pulling arms (46); the other ends of the two pulling arms (46) are respectively hingedly connected to the clamping arms (41).

6. The automatic die bonding machine based on electronic component production according to claim 1, characterized in that: The invention also comprises an inductive positioning member, which comprises a rubber pad (47), a limit strip (48) and an ultrasonic sensor (49). The rubber pad (47) is arranged at intervals in the middle of the inner sides of the two clamping arms (41), and the limit strip (48) is arranged at the upper ends of the inner sides of the two clamping arms (41). Ultrasonic sensors (49) for detecting the conveying position of the PCB board (e) are arranged at the two ends of the inner side of one of the clamping arms (41), and avoidance grooves (43) staggered with the side edges of the electric conveyor belt (2) are respectively provided on opposite sides of the two clamping arms (41).

7. The automatic die bonding machine based on electronic component production according to claim 1, characterized in that: The invention also comprises a material unloading detection module (5), the material unloading detection module (5) comprising an electric conveyor belt (50), a visual scanner (51), a first electric slide rail (53), a first material grabber (54) and a material receiving box (55); the electric conveyor belt (50) is arranged at the bottom of the material unloading area (c); the visual scanner (51) for detecting the quality of the patch of the PCB board (e) is arranged in the middle of the top of the material unloading area (c); the first electric slide rail (53) is arranged on the right side of the top of the material unloading area (c); the first material grabber (54) for sucking up the PCB board (e) is installed on the slide seat of the first electric slide rail (53); a material unloading port (52) connected to the collection area (d) is opened at the bottom of the material unloading area (c) near the first electric slide rail (53); a material receiving box (55) is placed in the collection area (d), and the material receiving box (55) is located below the material unloading port (52) for collecting PCB boards (e) that fail the inspection.

8. The automatic die bonding machine based on electronic component production according to claim 1, characterized in that: The machine also comprises a negative pressure adsorption gripper (6), which comprises a second electric slide rail (60), a movable seat (61) and a second material gripper (62). The second electric slide rail (60) is arranged on the upper left side of the machine platform (1), the movable seat (61) is connected to the slider of the second electric slide rail (60), and the second material gripper (62) for grasping and placing the PCB board (e) is installed on the movable seat (61).

9. An automatic die bonding machine based on electronic component production according to any one of claims 1 to 8, characterized in that: The machine (1) is integrated with a controller, and the electric conveyor belt (2), the first electric screw (31), the second electric screw (33), the film bonding mechanism (35), the micro motor (36), the CCD camera (38), the material identification camera (39), the torque motor (44), the ultrasonic sensor (49), the electric conveyor belt (50), the visual scanner (51), the first electric slide rail (53), the first material grabber (54), the second electric slide rail (60) and the second material grabber (62) are respectively electrically connected to the controller.

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