Compression molding device and compression molding method

Abstract

The present invention addresses the problem of providing a compression molding device and a compression molding method capable of preventing the occurrence of molding defects. As a solution, this compression molding device (1) is provided with: an upper die (204) having a cavity (208); a lower die (206) having a workpiece holding section (205); and a transport device (302) for placing a sealing resin (R) above the workpiece (W) held by the workpiece holding unit (205), or holding the workpiece (W) in a state in which the sealing resin (R) is placed above the workpiece holding unit (205), and using a solid / semi-solid resin having a predetermined shape, the overall shape of which corresponds to the shape of the workpiece (W), as the sealing resin (R).

Description

Technical Field

[0001] The present invention relates to a compression molding device and a compression molding method. Background Art

[0002] As an example of a resin sealing device and a resin sealing method for processing a workpiece in which electronic components are mounted on a substrate with a sealing resin into a molded product, an example using a compression molding method is known.

[0003] The compression molding method is a technique in which a predetermined amount of sealing resin is supplied to a sealing region (mold cavity) provided in a sealing mold including an upper mold and a lower mold, and a workpiece is disposed in the sealing region, and resin sealing is performed by an operation of clamping with the upper mold and the lower mold. As an example, a technique is known in which, when using a sealing mold having a mold cavity provided in the upper mold, the sealing resin is supplied to the central position on the workpiece for molding. On the other hand, a technique is known in which, when using a sealing mold having a mold cavity provided in the lower mold, a release film (hereinafter, sometimes simply referred to as "film") covering the mold surface including the mold cavity and sealing resin are supplied for molding (see Patent Document 1: Japanese Patent Laid-Open No. 2019-145550).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Laid-Open No. 2019-145550 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] For example, as a workpiece, in the case of resin-sealing a strip-shaped electronically connected electronic component (semiconductor chip), in the compression molding method in which a mold cavity is provided in the upper mold, the lead portion of the workpiece held on the lower mold comes into contact with the sealing resin previously supplied to the mold cavity or the sealing resin supplied to the workpiece and deforms, so there is a problem that resin sealing is difficult. Therefore, generally, a compression molding method is adopted in which the workpiece is held on the upper mold, a mold cavity is provided in the lower mold, and sealing resin (as an example, granular resin) is supplied into the mold cavity.

[0009] However, in a structure where the upper mold holds the workpiece and the lower mold is provided with a cavity, in the case of a thin or large workpiece, there is a problem that it is difficult to hold the workpiece in the upper mold and it is easy to cause dropping. In addition, it is usually a structure in which the sealing resin is supplied to the cavity of the lower mold through a diaphragm. However, if a thick molded product is to be formed to a thickness (here, the thickness of the resin part after molding) exceeding 1 mm, there is a problem that the molding stroke becomes large, the film bites into the molded product, and it is easy to cause molding defects. Furthermore, in the case of using granular resin as the sealing resin, the film biting is likely to occur. In addition, there are not only problems of generating dust or being difficult to handle, but also a problem that it is difficult to evenly supply (disperse) the sealing resin to the entire area of the cavity provided in the lower mold, and it is easy to cause uneven dispersion. In addition, there is a problem that when the sealing resin is dispersed, the air contained in the gaps between the particles cannot be discharged and remains in the molded product, resulting in easy occurrence of molding defects. Especially in the case of connecting a workpiece on which electronic components are mounted by a wire, there is also a possibility of wire flow (deformation or cutting of the wire) caused by the resin flow in the cavity during resin sealing.

[0010] Technical means for solving the problem

[0011] The present invention has been made in view of the above circumstances, and an object thereof is to provide a compression molding apparatus and a compression molding method as follows. By adopting a structure in which a cavity is provided in the upper mold, it is possible to solve the above problems in a structure in which a cavity is provided in the lower mold, prevent the occurrence of molding defects caused by the flow, uneven dispersion, and residual air of the sealing resin, and be able to form a molded product with a large thickness dimension. Furthermore, the treatment of the sealing resin is easy and the generation of dust can be prevented.

[0012] The present invention solves the above problems by means of the following solutions as an embodiment.

[0013] A compression molding device of one embodiment uses a sealing mold and utilizes a sealing resin to seal a workpiece and process it into a molded product. The sealing mold includes an upper mold having a mold cavity and a lower mold having a workpiece holding portion. The necessary condition of the compression molding device is to include a conveying device, which allows the sealing resin to be placed above the workpiece held on the workpiece holding portion, or allows the workpiece in a state where the sealing resin is placed above to be held on the workpiece holding portion. As the sealing resin, a solid / semi-solid resin having a prescribed shape whose overall shape corresponds to the shape of the workpiece is used. For example, as the workpiece, a workpiece having a structure in which an electronic component is mounted on a substrate is used. In addition, as the sealing resin, a solid / semi-solid resin formed into a shape that does not abut against the electronic component when placed on the substrate is used. In particular, as the sealing resin, it is preferred to have a plate-shaped or block-shaped main body and a foot portion erected on one of the faces of the main body.

[0014] According to the embodiment, by providing a cavity in the upper mold and holding the workpiece in the lower mold, the problem of the workpiece falling can be eliminated. In addition, the formation defects caused by the flow and uneven distribution of the sealing resin and the residual air can be prevented. In addition, when forming a molded product with a thickness exceeding 1 mm, the film can be prevented from biting. In addition, the handling of the sealing resin can be facilitated and the generation of dust can be prevented.

[0015] In addition, a compression molding method of one embodiment uses a sealing mold and a sealing resin to seal the workpiece and process it into a molded product. The sealing mold includes an upper mold having a mold cavity and a lower mold having a workpiece holding portion. The necessary conditions of the compression molding method are to include: a resin preparation process, as the sealing resin, preparing a solid / semi-solid resin having a prescribed shape corresponding to the shape of the workpiece as a whole; a workpiece holding process, holding the workpiece on the workpiece holding portion; and a resin loading process, after or before the workpiece holding process, loading the sealing resin on the top of the workpiece. For example, as the workpiece, a workpiece having a structure in which an electronic component is mounted on a substrate is used. In addition, as the sealing resin, a solid / semi-solid resin formed in a shape that does not abut against the electronic component when mounted on the substrate is used. In particular, as the sealing resin, it is preferred to have a plate-shaped or block-shaped main body and a foot portion erected on one of the surfaces of the main body.

[0016] Effects of the Invention

[0017] According to the present invention, by adopting a structure in which a cavity is provided in the upper mold, the problem in the structure in which a cavity is provided in the lower mold can be solved. In particular, it is possible to prevent the occurrence of molding defects caused by the flow, uneven dispersion, and residual air of the sealing resin. In addition, a thick molded product with a thickness dimension exceeding 1 mm can be formed. In addition, the handling of the sealing resin can be facilitated, and the generation of dust can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Figure 1 FIG. is a plan view (schematic diagram) showing an example of a compression molding apparatus according to an embodiment of the present invention. In addition, for ease of explanation, the left-right direction (X direction), front-rear direction (Y direction), and up-down direction (Z direction) of the compression molding apparatus 1 are indicated by arrows in the figure. In addition, in all the figures for explaining each embodiment, components having the same function are denoted by the same reference numerals, and repeated explanations thereof may be omitted.

[0019] Figure 2 Figure 2 FIG. is a side view showing an example of a pressing device of the compression molding apparatus Figure 1 FIG. is a side view showing an example of a pressing device of the compression molding apparatus.

[0020] Figure 3 Figure 3 FIG. is a front sectional view showing an example of a sealing die of the compression molding apparatus Figure 1 FIG. is a front sectional view showing an example of a sealing die of the compression molding apparatus.

[0021] Figure 4 Figure 4 FIG. is an explanatory view of a compression molding method according to an embodiment of the present invention.

[0022] Figure 5 Figure 5 A is an enlarged view of part V in Figure 4 FIG. Figure 5 B is an explanatory view following Figure 5 A.

[0023] Figure 6 Figure 6 FIG. is an explanatory view following Figure 5 B.

[0024] Figure 7 Figure 7 FIG. is an explanatory view following Figure 6 FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] (OVERALL STRUCTURE)

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Figure 1 FIG. is a plan view (schematic diagram) showing an example of a compression molding apparatus 1 according to the present embodiment. In addition, for ease of explanation, the left-right direction (X direction), front-rear direction (Y direction), and up-down direction (Z direction) of the compression molding apparatus 1 are indicated by arrows in the figure. In addition, in all the figures for explaining each embodiment, components having the same function are denoted by the same reference numerals, and repeated explanations thereof may be omitted.​​​​​​​​​​​​​​

[0027] The compression molding apparatus 1 of the present embodiment is an apparatus for resin-sealing (compression molding) a workpiece (product to be molded) W using a sealing die 202 including an upper die 204 and a lower die 206. One or more workpiece holding portions 205 for holding the workpiece W are provided on the lower die 206. One or more cavities 208 are provided on the upper die 204 according to the shape or number of the workpieces W. The film F is adsorbed and held in the cavity 208. However, the structure is not limited thereto.

[0028] First, the workpiece W to be molded has a structure in which electronic components Wb are mounted on a base material Wa. More specifically, as an example of the base material Wa, plate-like members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer can be cited. In addition, as an example of the electronic component Wb, a semiconductor chip, a micro electro mechanical system (MEMS) chip, a passive component, a heat sink, a conductive member, a gasket, etc. can be cited. In addition, the shape of the base material Wa is a rectangular shape (long strip shape), a square shape, a circular shape, etc. In addition, the number of electronic components Wb mounted on one base material Wa is set to one or more (for example, in a matrix shape, etc.).

[0029] As an example of a method of mounting the electronic component Wb on the base material Wa, methods such as wire bonding packaging and flip chip packaging can be cited. Alternatively, in the case of a structure in which the base material (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method of attaching the electronic component Wb using a thermally peelable adhesive tape or an ultraviolet curable resin that is cured by ultraviolet irradiation.

[0030] In the present embodiment, as the sealing resin R, a thermosetting resin (for example, a filled epoxy resin, etc., but not limited thereto) and a solid / semi-solid resin having a specified shape corresponding to the shape of the workpiece W as a whole are used. Usually, it is a "whole" that requires a sealing amount (the amount per workpiece W at a time), but it can also be configured to form a "whole" that requires a sealing amount in a divided state of several (for example, two or three). In addition, the so-called "semi-solid" means a state that is not completely solid but is melted to the so-called B stage.

[0031] In addition, as an example of the film F, a film material excellent in heat resistance, ease of peeling, flexibility, and stretchability is preferably used, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, and the like.

[0032] Next, the outline of the compression molding apparatus 1 of the present embodiment will be described. As Figure 1 shown, the compression molding apparatus 1 includes the following parts as main structures: a supply unit 100A that supplies the workpiece W and the like; a pressing unit 100B that resin-seals the workpiece W to process the molded product Wp and the like; and a storage unit 100C that stores the molded product Wp and the like. As an example, along Figure 1 the X direction in, the supply unit 100A, the pressing unit 100B, and the storage unit 100C are arranged in sequence. However, it is not limited to the above structure, and the equipment structure or the number of units (especially the number of pressing units) in the unit, the arrangement order of the units, and the like can be changed. In addition, it may be configured to include a structure of units other than the above (not shown).

[0033] In addition, the compression molding apparatus 1 includes a resin supply unit 120 that supplies the sealing resin R. As an example, the resin supply unit 120 is arranged in the supply unit 100A, but it may also be configured to be arranged in the storage unit 100C or the pressing unit 100B (not shown). Alternatively, as another example, the resin supply unit 120 may be arranged outside the compression molding apparatus 1, and a conveying device such as a belt conveyor or a robot may be used to convey it into the apparatus (not shown).

[0034] In addition, in the compression molding apparatus 1, guide rails 300 are linearly arranged across the units, and a conveying device (first loader) 302 that conveys the workpiece W and the sealing resin R, and a conveying device (second loader) 304 that conveys the molded product Wp are arranged so as to be able to move between the specified units along the guide rails 300. However, it is not limited to the above structure, and it may also be configured to include a structure of a common (one) conveying device (loader) that conveys the workpiece W, the sealing resin R, and the molded product Wp (not shown). In addition, the conveying device may be configured to include a robot or the like instead of a loader.

[0035] In addition, in the compression molding apparatus 1, a control unit 150 that controls the operation of each mechanism in each unit is disposed in the supply unit 100A (it may also be configured to be disposed in other units).

[0036] (Supply Unit)

[0037] Next, the supply unit 100A included in the compression molding apparatus 1 will be described in detail.

[0038] The supply unit 100A includes a supply cassette 102 for storing a plurality of workpieces W. Here, the supply cassette 102 uses a known stacked cassette, a slit cassette, or the like.

[0039] In addition, the supply unit 100A may also be configured to include a workpiece stage (not shown) for placing the workpiece W taken out from the supply cassette 102. Further, the supply unit 100A may also be configured to include a resin stage (not shown) for placing the sealing resin R supplied from the resin supply unit 120.

[0040] The workpiece W and the sealing resin R are held by the first loader 302 and transported to the pressing unit 100B, and are installed at a specified position of the sealing die 202. In the present embodiment, the workpiece W is held by the workpiece holding portion 205 of the lower die 206, and the sealing resin R is placed above the workpiece W held by the workpiece holding portion 205 (details of the process will be described later). In addition, the holding mechanism for the workpiece W and the sealing resin R in the first loader 302 uses a known holding mechanism (for example, a structure having holding claws and performing clamping, a structure having a suction hole communicating with a suction device and performing adsorption, etc.) (not shown).

[0041] As a modification example of the transfer device, it may also be configured as follows (not shown): Instead of the first loader 302 that moves in the X direction and the Y direction, a transfer device (loader) that moves in the X direction for inter-unit transfer and a transfer device (loader) that moves in the Y direction for loading and installing into the sealing die 202 are respectively included.

[0042] In addition, the supply unit 100A includes a preheating heater (not shown) for preheating the workpiece W or the sealing resin R. As an example, the preheating heater uses a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.). Thus, preheating can be performed in advance before the workpiece W or the sealing resin R is transferred into the sealing die 202. In addition, it may also be configured not to include a preheating heater. Further, it may also be configured as follows: Instead of the preheating heater, the first loader 302 includes a heater (not shown) for preheating, or the first loader 302 includes a heater (not shown) for preheating and a preheating heater.

[0043] (Pressing Unit)

[0044] Next, the pressing unit 100B included in the compression molding device 1 will be described in detail. Here, a side view (schematic view) of the pressing device 250 provided in the pressing unit 100B is shown in Figure 2 and a front sectional view (schematic view) of the sealing mold 202 is shown in Figure 3 .

[0045] The pressing unit 100B includes a sealing mold 202, and the sealing mold 202 has a pair of molds that open and close (for example, a mold composed of a plurality of mold blocks, mold plates, mold columns, etc. made of alloy tool steel or other members assembled). In addition, it includes a pressing device 250 that drives the sealing mold 202 to open and close to resin-seal the workpiece W. As an example, a structure including one pressing device 250 is provided, and a structure including multiple pressing devices (not shown) may also be provided.

[0046] Here, as shown in Figure 2 , the pressing device 250 includes a pair of platens 254 and 256, a plurality of tie rods 252 that support the pair of platens 254 and 256, and a driving device that moves the platen 256 (lifts and lowers). Specifically, the driving device includes a driving source (for example, an electric motor) 260 and a drive transmission mechanism (for example, a ball screw or a toggle mechanism) 262, etc. (however, it is not limited thereto). In the present embodiment, the platen 254 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie rod 252), and the platen 256 on the lower side is set as a movable platen (a platen that can slide on the tie rod 252 and move up and down). However, it is not limited thereto, and it may be reversed up and down, that is, the upper side is set as the movable platen and the lower side is set as the fixed platen, or both the upper side and the lower side may be set as movable platens (not shown).

[0047] On the other hand, as shown in Figure 3 , the sealing mold 202 includes one mold (upper mold 204) on the upper side in the vertical direction and another mold (lower mold 206) on the lower side as a pair of molds disposed between the pair of platens 254 and 256 in the pressing device 250. That is, the upper mold 204 is assembled to the upper side platen (the fixed platen 254 in the present embodiment), and the lower mold 206 is assembled to the lower side platen (the movable platen 256 in the present embodiment). The mold is closed / opened by the upper mold 204 and the lower mold 206 approaching / separating from each other (the vertical direction (up and down direction) becomes the mold opening and closing direction).

[0048] In addition, in the present embodiment, as an example, a film supply mechanism (not shown) for transporting (feeding) the roll-shaped film F into the inside of the sealing die 202 is provided. In addition, depending on the structure of the workpiece W, a long strip-shaped film may be used instead of the roll-shaped film for the film F.

[0049] Next, the upper die 204 of the sealing die 202 will be described in detail. As Figure 3 shown, the upper die 204 includes an upper die groove 210, a cavity module 226 held therein, a gripper 228, and the like. The upper die groove 210 is fixed to the lower surface of the support plate 214 via the support columns 212. A cavity 208 is provided on the lower surface (the surface on the lower die 206 side) of the upper die 204.

[0050] The gripper 228 is configured in a ring shape so as to surround the cavity module 226, and is assembled in such a manner that it can move up and down relative to the lower surface of the support plate 214 via the push pin 222 and the clamping spring (for example, a biasing member exemplified by a coil spring) 224 so as to be separable (floating) (however, it is not limited to the above assembly structure). The cavity module 226 constitutes the inside (bottom) of the cavity 208, and the gripper 228 constitutes the side portion of the cavity 208. In addition, the shape or number of the cavities 208 provided in one upper die 204 is appropriately set (one or more) according to the shape or number of the workpieces W.

[0051] In addition, a suction path (hole or groove, etc.) communicating with the suction device is provided at the boundary portion or the like of the gripper 228 or the cavity module 226 (not shown). Thereby, the film F supplied from the film supply mechanism can be adsorbed and held on the die surface 204a including the inner surface of the cavity 208. In addition, degassing in the cavity 208 can be performed when the die is closed for resin sealing.

[0052] In addition, in the present embodiment, an upper die heating mechanism (not shown) for heating the upper die 204 to a specified temperature is provided. The upper die heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 150. As an example, the heater is built into the upper die groove 210 and heats the entire upper die 204 and the sealing resin R accommodated in the cavity 208. Heating is performed by the heater so that the upper die 204 becomes a specified temperature (for example, 100°C to 300°C).

[0053] Next, the lower die 206 of the sealing die 202 will be described in detail. As Figure 3 shown, the lower die 206 includes a lower die groove 240 and a lower plate 242 held therein.

[0054] In addition, in the present embodiment, a workpiece holding portion 205 is provided for holding the workpiece W at a specified position on the upper surface of the lower plate 242. As an example, the workpiece holding portion 205 has a workpiece guide pin (not shown) and a suction path (such as a hole or a groove) (not shown) that penetrates the lower plate 242 and is connected to a suction device. Thereby, the workpiece W can be adsorbed and held on the die surface 206a. Specifically, one end of the suction path passes through the die surface 206a of the lower die 206, and the other end is connected to a suction device disposed outside the lower die 206. Thereby, the suction device can be driven to suck the workpiece W from the suction path, and the workpiece W can be adsorbed and held on the die surface 206a (here, the upper surface of the lower plate 242). It may also be configured as follows: including holding claws (not shown) that clamp the outer periphery of the workpiece W instead of the adsorption holding mechanism, or including holding claws (not shown) that clamp the outer periphery of the workpiece W and an adsorption holding mechanism. In addition, the shape or number of the workpiece holding portions 205 provided on one lower die 206 is appropriately set according to the shape or number of the workpiece W (one or more).

[0055] In addition, in the present embodiment, a lower die heating mechanism (not shown) is provided for heating the lower die 206 to a specified temperature. The lower die heating mechanism includes a heater (such as an electric wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 150. As an example, the heater is built into the lower die groove 240 and is configured to heat the entire lower die 206 and the workpiece W held by the workpiece holding portion 205. The lower die 206 is heated by the heater to a specified temperature (for example, 100°C to 300°C).

[0056] (Storage unit)

[0057] Next, the storage unit 100C included in the compression molding device 1 will be described in detail.

[0058] The molded product Wp is held by the second loader 304 and carried out from the sealing die 202, and then carried to the storage unit 100C. In addition, the holding mechanism of the molded product Wp in the second loader 304 uses a known holding mechanism (for example, a structure having holding claws and clamping, a structure having a suction hole connected to a suction device and adsorbing, etc.) (not shown).

[0059] As a modification of the transfer device, it may also be configured as follows (not shown): instead of the second loader 304 that moves in the X direction and the Y direction, a transfer device (loader) that moves in the X direction for inter-unit transfer and a transfer device (loader) that moves in the Y direction for carrying out from the sealing die 202 are respectively provided.

[0060] The storage unit 100C includes a storage cartridge 104 for storing a plurality of molded products Wp. Here, the storage cartridge 104 uses a well-known stacked cartridge, a slit cartridge, etc.

[0061] In addition, the storage unit 100C may also be configured to include a molded product stage (not shown) for placing the molded product Wp conveyed from the pressing unit 100B.

[0062] (Resin sealing operation)

[0063] Next, the operation of resin sealing (compression molding) using the compression molding apparatus 1 of the present embodiment (that is, the compression molding method of the present embodiment) will be described. Here, Figures 4 to 7 are explanatory diagrams of each process, and are shown as front sectional views in the same direction as Figure 3 and are illustrated.

[0064] First, as a preparation process, a heating process (upper mold heating process) of adjusting the upper mold 204 to a specified temperature (for example, 100°C to 300°C) and heating it is performed by the upper mold heating mechanism. In addition, a heating process (lower mold heating process) of adjusting the lower mold 206 to a specified temperature (for example, 100°C to 300°C) and heating it is performed by the lower mold heating mechanism. In addition, a film mounting process of operating the film supply mechanism and mounting a new film F in the sealing mold 202 is performed.

[0065] A resin preparation process is performed before, after, or in parallel with the preparation process. In the resin preparation process, a solid / semi-solid resin having a specified shape (described later) whose overall shape corresponds to the shape of the workpiece W is prepared as the sealing resin R for sealing.

[0066] Next, a workpiece holding process of holding the workpiece W in the workpiece holding portion 205 of the lower mold 206 is performed. Specifically, the workpiece W supplied from the supply cartridge 102 is held by the first loader 302 and is carried into the sealing mold 202 and held in the workpiece holding portion 205.

[0067] After the workpiece holding process, a resin placement process is performed. In the resin placement process, the sealing resin R prepared in the resin preparation process is placed above the workpiece W held in the workpiece holding portion 205 (see Figure 4 ). Specifically, the sealing resin R supplied from the resin supply unit 120 is held by the first loader 302 and is carried into the sealing mold 202 and placed above the workpiece W held in the workpiece holding portion 205.

[0068] Alternatively, as another example of the resin placement process, it can also be implemented as a process of placing the sealing resin R prepared in the resin preparation process above the workpiece W before the workpiece holding process. In this case, the workpiece holding process becomes a process of holding the workpiece W in a state where the sealing resin R is placed on the workpiece holding portion 205. That is, the first loader 302 holds the workpiece W in a state where the sealing resin R is placed thereon and transfers the workpiece W into the sealing mold 202 and holds it on the workpiece holding portion 205. It has the following advantages: The workpiece W and the sealing resin R are transferred into the sealing mold 202 at one time, rather than being transferred into the sealing mold 202 separately.

[0069] Next, a process of sealing the workpiece W with the sealing resin R to process it into a molded product Wp is performed. First, the sealing mold 202 is closed, and the cavity mold member 226 is relatively lowered in the cavity 208 to perform a closing mold process of heating and pressing the sealing resin R on the workpiece W. As a result, the sealing resin R is thermally hardened to complete resin sealing (compression molding) (refer to Figure 6 ).

[0070] As described above, for example, in an existing compression molding device with a cavity provided in the upper mold, for a workpiece W such as a workpiece W on which a belt-shaped electronically connected electronic component (semiconductor chip) Wb is mounted, when performing the closing mold process, the wire portion of the workpiece held on the lower mold comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied to the workpiece and is deformed, so there is a problem that resin sealing is difficult. Therefore, for such a workpiece W, a compression molding device with a cavity provided in the lower mold is generally used. However, even with a structure having a cavity provided in the lower mold, there are still the previous problems (described above).

[0071] To address the above problems, the compression molding device 1 of the present embodiment adopts a structure in which a cavity 208 is provided in the upper mold 204 and a solid / semi-solid resin formed in a specified shape corresponding to the shape of the workpiece W is used as the sealing resin R, thereby being able to solve the above problems.

[0072] Specifically, the "specified shape" is a shape that does not come into contact with the electronic component Wb (the electronic component Wb having wires includes the wires) when placed on the base material Wa of the workpiece W. As an example, as Figure 4As shown, it is preferred that the sealing resin R is provided with a plate-shaped or block-shaped main body Ra and a leg Rb intermittently (or continuously) erected on one surface of the main body Ra (the surface on the side facing the electronic component Wb of the workpiece W) (however, it is not limited to the above shape). The main body Ra is sized to enter the mold cavity 208 when viewed from above. If the resin flow is taken into consideration, it is preferably sized slightly smaller than the shape of the mold cavity 208 (especially the mold cavity module 226). In addition, the leg Rb needs to have a height H (refer to Figure 5 A), but does not exclude contact to the extent that the wire does not undergo plastic deformation. In addition, the leg portion Rb is arranged at a position where it does not abut against the electronic component Wb when the main body Ra is viewed from above and at a position where the main body Ra does not tilt when placed on the workpiece W. Furthermore, it is preferably arranged between the electronic components Wb or at the outer periphery of the electronic components Wb so as not to damage the wiring (especially the wire) of the workpiece W at all during molding. In addition, the total amount of resin of the plate-shaped or block-shaped main body Ra and the leg portion Rb may be a complete amount of resin to the extent that it is less than that required for one-time compression molding, or may be a large amount of resin.

[0073] Through the structure, during the implementation of the mold closing process, such as Figure 5 ATransfer to Figure 5 B, the softening and melting of the sealing resin R by heating progresses (in addition, Figure 5 A. Figure 5 B as Figure 4 At this time, the resin (specifically, the main body Ra) is in uniform contact with all the wires (see Figure 5 B) As a result, the effect of suppressing the flow of the conductor can be obtained.

[0074] The inventor of the present application actually conducted experiments using the compression molding device 1 of the present embodiment, and as a result, it was confirmed that the flow of the wire was suppressed and the molding quality was improved, compared with the existing compression molding device in which the workpiece was held in the upper mold, a cavity was provided in the lower mold, and a sealing resin (specifically, a granular resin) was supplied to the cavity.

[0075] Furthermore, by using a solid / semi-solid resin as the sealing resin R, it is possible to solve the problems of uneven distribution, residual air, dust, or difficulty in handling caused by the granular resin as before. In addition, even when a molded product having a thickness exceeding 1 mm is formed, the film F can be prevented from biting into the molded product Wp.

[0076] In addition, the process following the mold closing process is the same as the previous compression molding method. As a rough outline, the mold opening of the sealed mold 202 is performed to implement the mold opening process of separating the molded product Wp from the used film F (refer toFigure 7 )。Next, a molded product unloading process is carried out in which the molded product Wp is unloaded from the sealing die 202 by the second loader 304 and unloaded to the storage unit 100C. Further, after or in parallel with the molded product unloading process, a film mounting process is carried out in which the used film F is sent out from the sealing die 202 by operating the film supply mechanism, and a new film F is fed into the sealing die 202.

[0077] The above are the main processes of the compression molding method using the compression molding device 1. However, the order of the above processes is an example, and the order can be changed or carried out in parallel as long as it does not interfere.

[0078] As described above, according to the present invention, by adopting the structure in which the cavity is provided in the upper mold, the above problems in the structure in which the cavity is provided in the lower mold can be solved. In particular, it is possible to prevent the occurrence of molding defects caused by the flow, uneven dispersion, and residual air of the sealing resin. In addition, the treatment of the sealing resin can be facilitated, and the generation of dust can be prevented. In addition, not only thin molded products (thickness dimension less than 1 mm) but also thick molded products (thickness dimension of 1 mm or more) can be formed. In addition, although the upper limit of the thickness dimension depends on various setting conditions, it is considered that it can be sufficiently formed up to about 10 mm.

[0079] In addition, the present invention is not limited to the above-described embodiments, and various changes can be made without departing from the scope of the present invention.

Claims

1. A compression molding device, which uses a sealing mold and a sealing resin to seal a workpiece to form a molded product, wherein the sealing mold includes an upper mold having a mold cavity and a lower mold having a workpiece holding portion, and the compression molding device is characterized in that it includes a conveying device, The conveying device places the sealing resin on the workpiece held by the workpiece holding portion, or holds the workpiece with the sealing resin placed on the workpiece holding portion. As the sealing resin, a solid or semi-solid resin having a predetermined shape whose entire shape corresponds to the shape of the workpiece is used.

2. The compression molding device according to claim 1, It is characterized in that As the workpiece, a workpiece having a structure in which an electronic component is mounted on a substrate is used. As the sealing resin, a solid or semi-solid resin formed into a shape that does not come into contact with the electronic component when placed on the substrate is used.

3. The compression molding device according to claim 1 or 2, It is characterized in that As the sealing resin, a solid or semi-solid resin having a plate-shaped or block-shaped main body and a leg portion erected on one surface of the main body is used.

4. A compression molding method, wherein a workpiece is sealed with a sealing resin using a sealing mold to form a molded product, wherein the sealing mold comprises an upper mold having a mold cavity and a lower mold having a workpiece holding portion, wherein the compression molding method is characterized in that include: a resin preparation step of preparing, as the sealing resin, a solid / semi-solid resin having an overall shape corresponding to a predetermined shape of the workpiece; A workpiece holding step of holding the workpiece on the workpiece holding portion; as well as The resin placing step is to place the sealing resin on the workpiece after or before the workpiece holding step.

5. The compression molding method according to claim 4, It is characterized in that As the workpiece, a workpiece having a structure in which an electronic component is mounted on a substrate is used. As the sealing resin, a solid or semi-solid resin formed into a shape that does not come into contact with the electronic component when placed on the substrate is used.

6. The compression molding method according to claim 4 or 5, It is characterized in that As the sealing resin, a solid or semi-solid resin having a plate-shaped or block-shaped main body and a leg portion erected on one surface of the main body is used.

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