Electronic device comprising audio path for transmitting audio from speaker to outside

Abstract

An electronic device according to an embodiment includes: a support member including a first region and a second region; a speaker disposed in the first area; a first audio hole disposed at one surface of the speaker; a second audio hole disposed at the one surface of the speaker and separated from the first audio hole; a first audio path from the first audio aperture within the first region; and a second audio path extending from a second audio aperture in the first region to the second region and separated from the first audio path.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including an audio path for sending audio from a speaker to the outside. Background Art

[0002] An electronic device may include various electronic components to meet user needs. For example, an electronic device may include a speaker configured to emit audio to provide audible information to a user. The electronic device may include an audio path capable of guiding the movement of the audio output from the speaker to the outside of the electronic device. The audio output from the speaker may be sent from the speaker inside the electronic device to the outside of the electronic device by moving along the audio path. Summary of the Invention

[0003] Technical Solution

[0004] According to an embodiment, an electronic device may include a support member including a first region and a second region spaced apart from the first region. According to an embodiment, the electronic device may include a speaker disposed at least partially in the first region. According to an embodiment, the electronic device may include a first audio hole disposed on a surface of the speaker. According to an embodiment, the electronic device may include a second audio hole separated from the first audio hole and disposed on the surface of the speaker. According to an embodiment, the electronic device may include a first audio path extending from the first audio hole within the first region to send the audio output from the speaker to the outside of the electronic device through the first audio hole. According to an embodiment, the electronic device may include a second audio path extending from the second audio hole within the first region to the second region to send the audio output from the speaker to the outside of the electronic device through the second audio hole and separated from the first audio path.

[0005] According to an embodiment, an electronic device may include a support member including a first region and a second region spaced apart from the first region. According to an embodiment, the electronic device may include a sensor disposed between the first region and the second region. According to an embodiment, the electronic device may include a speaker disposed in the first region. According to an embodiment, the electronic device may include a housing including a first audio hole disposed on the speaker and a second audio hole separated from the first audio hole and surrounding the speaker. According to an embodiment, the electronic device may include a first audio duct member coupled to the housing and extending from the first audio hole within the first region to send the audio output from the speaker to the outside of the electronic device through the first audio hole. According to an embodiment, the electronic device may include a second audio duct member coupled to the housing and extending from the second audio hole within the first region to the second region to send the audio output from the speaker to the outside of the electronic device through the second audio hole and separated from the first audio duct member. According to an embodiment, the sensor may be disposed between the first audio path and the second audio path.

[0006] According to an embodiment, an electronic device may include a support member. According to an embodiment, the electronic device may include a speaker disposed in the support member. According to an embodiment, the electronic device may include a first audio hole disposed on a surface of the speaker. According to an embodiment, the electronic device may include a second audio hole disposed on the surface of the speaker and separated from the first audio hole. According to an embodiment, the electronic device may include a first audio path, wherein one end of the first audio path is connected to the first audio hole and the other end of the first audio path is connected to the outside of the electronic device such that audio output through the first audio hole is sent to the outside of the electronic device. According to an embodiment, the electronic device may include a second audio path separated from the first audio path, wherein one end of the second audio path is connected to the second audio hole and the other end of the second audio path is connected to the outside of the electronic device such that audio output through the second audio hole is sent to the outside of the electronic device. According to an embodiment, a straight-line distance from one end of the first audio path to the other end of the first audio path may be different from a straight-line distance from one end of the second audio path to the other end of the second audio path. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] Figure 2 is a diagram illustrating an exemplary electronic device according to an embodiment.

[0009] Figure 3 is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0010] Figure 4a is a perspective view of an exemplary electronic device according to an embodiment.

[0011] Figure 4b is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0012] Figure 4c is a top plan view of an exemplary electronic device according to an embodiment.

[0013] Figure 5 is a top plan view of an exemplary electronic device according to an embodiment.

[0014] Figure 6 is a diagram showing an example of a cross-sectional view of an exemplary electronic device taken along line A-A' Figure 4a according to an embodiment.

[0015] Figure 7 is a top plan view of an exemplary electronic device according to an embodiment.

[0016] Figure 8a is a top plan view of an exemplary electronic device according to an embodiment.

[0017] Figure 8b is a top plan view of an exemplary electronic device according to an embodiment.

[0018] Figure 8c is a top plan view of an exemplary electronic device according to an embodiment.

[0019] Figure 9 is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0020] Figure 10a is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0021] Figure 10b is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0022] Figure 11 is a graph showing an exemplary relationship between the frequency and sound pressure level of audio output from a speaker according to an embodiment. DETAILED DESCRIPTION

[0023] Figure 1 is a block diagram showing an electronic device 101 in a network environment 100 according to various embodiments.

[0024] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one component (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single component (e.g., the display module 160).

[0025] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled to the processor 120, and may perform various data processing or computations. According to an embodiment, as at least a part of the data processing or computation, the processor 120 may store commands or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently of or in combination with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or be specific to a specified function. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0026] The auxiliary processor 123 may replace the main processor 121 when the main processor 121 is in an inactive (e.g., sleep) state, or may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121 when the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) related to the function of the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure designated for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, by the electronic device 101 in which the artificial intelligence is executed or via a separate server (e.g., the server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of them, but is not limited thereto. The artificial intelligence model may additionally or alternatively include a software structure in addition to the hardware structure.

[0027] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, input data or output data of software (e.g., the program 140) and commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0028] The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0029] The input module 150 may receive commands or data to be used by another component of the electronic device 101 (e.g., the processor 120) from the outside of the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0030] The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing a recording. The receiver may be used for receiving an incoming call. According to an embodiment, the receiver may be implemented separately from the speaker or may be implemented as a part of the speaker.

[0031] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., to a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of a force caused by the touch.

[0032] The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain a sound via the input module 150, or may output a sound via the sound output module 155 or a headset of an external electronic device (e.g., the electronic device 102) directly (e.g., wired) or wirelessly coupled to the electronic device 101.

[0033] The sensor module 176 may detect an operating state of the electronic device 101 (e.g., power or temperature) or an environmental state outside the electronic device 101 (e.g., a state of a user), and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface 177 may support one or more specified protocols for the electronic device 101 to be directly (e.g., wired) or wirelessly coupled to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0035] The connection terminal 178 may include a connector via which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be recognized by the user via his tactile or kinesthetic senses. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0037] The camera module 180 may capture a still image or a moving image. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0038] The power management module 188 may manage the power provided to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[0039] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors that can operate independently of the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via a first network 198 (e.g., a short-distance communication network, such as Bluetooth TM , Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-distance communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may use the user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199).

[0041] The wireless communication module 192 may support 5G networks and next-generation communication technologies after 4G networks, such as New Radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable and low-latency communication (URLLC). The wireless communication module 192 may support high frequency bands (e.g., mmWave bands) to achieve, for example, high data transfer rates. The wireless communication module 192 may support various technologies for ensuring performance on high frequency bands, such as beamforming, massive multiple-input and multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for achieving eMBB (e.g., 20 Gbps or greater), a loss coverage for achieving mMTC (e.g., 164 dB or less), or a U-plane latency for achieving URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round-trip of 1 ms or less).

[0042] The antenna module 197 may transmit signals or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna that includes a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, signals or power may be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as part of the antenna module 197.

[0043] According to various embodiments, the antenna module 197 may form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the specified high-frequency band.

[0044] At least some of the above components may be coupled to each other and communicate signals (e.g., commands or data) therebetween via a peripheral device communication scheme (e.g., a bus, a general-purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

[0045] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 coupled to a second network 199. Each of the electronic devices 102 or 104 may be a device of the same type or a different type from the electronic device 101. According to an embodiment, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 is supposed to perform a function or service automatically or in response to a request from a user or another device, then instead of performing the function or service or in addition to performing the function or service, the electronic device 101 may request one or more external electronic devices to perform at least a part of the function or service. The one or more external electronic devices that receive the request may perform at least a part of the requested function or service, or an additional function or an additional service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a part of a reply to the request with or without further processing of the result. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide an ultra-low latency service. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

[0046] Figure 2FIG. is a diagram showing an exemplary electronic device according to an embodiment.

[0047] Referring Figure 2 , an electronic device 200 according to an embodiment may include a housing forming an appearance of the electronic device 200. For example, the housing may include a first surface (or front surface) 200A, a second surface (or rear surface) 200B, and a third surface (or side surface) 200C surrounding a space between the first surface 200A and the second surface 200B. In an embodiment, the housing may refer to a structure (e.g., Figure 2 a frame structure 240) forming at least a part of the first surface 200A, the second surface 200B, and / or the third surface 200C.

[0048] According to an embodiment, the electronic device 200 may include a substantially transparent front plate 202. In an embodiment, the front plate 202 may form at least a part of the first surface 200A. In an embodiment, the front plate 202 may include, for example, a glass plate or a polymer plate, including various coatings, but is not limited thereto.

[0049] According to an embodiment, the electronic device 200 may include a substantially opaque rear plate 211. In an embodiment, the rear plate 211 may form at least a part of the second surface 200B. In an embodiment, the rear plate 211 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0050] According to an embodiment, the electronic device 200 may include a side border structure (or side member) 218 (e.g., Figure 3 a side wall 241 of the frame structure 240). In an embodiment, the side border structure 218 may be coupled to the front plate 202 and / or the rear plate 211 to form at least a part of the third surface 200C of the electronic device 200. For example, the side border structure 218 may form the entire third surface 200C of the electronic device 200, and again, for example, the side border structure 218 may form the third surface 200C of the electronic device 200 together with the front plate 202 and / or the rear plate 211.

[0051] Different from the illustrated embodiment, when the third surface 200C of the electronic device 200 is partially formed by the front plate 202 and / or the rear plate 211, the front plate 202 and / or the rear plate 211 may include regions that are bent from their perimeters toward the rear plate 211 and / or the front plate 202 and seamlessly extend. For example, the extending regions of the front plate 202 and / or the rear plate 211 may be located at both ends of the long edges of the electronic device 200, but are not limited by the above example.

[0052] In an embodiment, the side bezel structure 218 may include metal and / or polymer. In an embodiment, the rear plate 211 and the side bezel structure 218 may be integrally formed and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the rear plate 211 and the side bezel structure 218 may be formed in a separate configuration and / or may include different materials.

[0053] In an embodiment, the electronic device 200 may include at least one of a display 201, audio modules 203, 204, and 207, a sensor module (not shown), camera modules 205, 212, 213, a key input device 217, a light-emitting element (not shown), and / or a connector hole 208. In an embodiment, the electronic device 200 may omit at least one of the above components (e.g., the key input device 217 or the light-emitting device (not shown)), or may further include another component.

[0054] In an embodiment, the display 201 (e.g., Figure 1 the display module 160) may be visually exposed through a substantial portion of the front plate 202. For example, at least a portion of the display 201 may be visible through the front plate 202 forming the first surface 200A. In an embodiment, the display 201 may be disposed on the rear surface of the front plate 202.

[0055] In an embodiment, the outer peripheral shape of the display 201 may be formed to be substantially the same as the outer peripheral shape of the front plate 202 adjacent to the display 201. In an embodiment, in order to expand the visually exposed area of the display 201, the distance between the outer periphery of the display 201 and the outer periphery of the front plate 202 may be formed to be substantially the same.

[0056] In an embodiment, the display 201 (or the first surface 200A of the electronic device 200) may include a screen display area 201A. In an embodiment, the display 201 may provide visual information to the user via the screen display area 201A. In the illustrated embodiment, when observing the front surface 200A from above, it is illustrated that the screen display area 201A is spaced apart from the outer periphery of the first surface 200A and is located inside the first surface 200A, but is not limited thereto. In an embodiment, when observing the front surface 200A from above, at least a portion of the periphery of the screen display area 201A may substantially coincide with the periphery of the first surface 200A (or the front plate 202).

[0057] In an embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of a user. Herein, the meaning of "the screen display area 201A includes the sensing area 201B" may be understood as at least a part of the sensing area 201B being able to overlap with the screen display area 201A. For example, the sensing area 201B may refer to an area that can display visual information through the display 201 like other areas of the screen display area 201A and additionally obtain biometric information (e.g., fingerprint) of the user. In an embodiment, the sensing area 201B may be formed in the key input device 217.

[0058] In an embodiment, the display 201 may include an area where the first camera module 205 (e.g., Figure 1 the camera module 180) is located. In an embodiment, an opening part may be formed in the area of the display 201, and the first camera module 205 (e.g., a perforated camera) may be at least partially disposed in the opening part to face the first surface 200A. For example, the screen display area 201A may surround at least a part of the periphery of the opening part. In an embodiment, the first camera module 205 (e.g., an under-display camera (UDC)) may be arranged below the display 201 to overlap with the area of the display 201. For example, the display 201 may provide visual information to the user via this area, and additionally, the first camera module 205 may obtain an image corresponding to the direction facing the first surface 200A via the area of the display 201.

[0059] In an embodiment, the display 201 may be combined with or arranged near a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digital converter for detecting a magnetic field type stylus.

[0060] In an embodiment, the audio modules 203, 204, and 207 (e.g., Figure 1 the audio module 170) may include microphone holes 203 and 204 and a speaker hole 207.

[0061] In an embodiment, the microphone holes 203 and 204 may include a first microphone hole 203 formed in a partial area of the third surface 200C and a second microphone hole 204 formed in a partial area of the second surface 200B. A microphone (not shown) for obtaining external sounds may be disposed within the microphone holes 203 and 204. The microphone may include a plurality of microphones to sense the direction of sounds.

[0062] In an embodiment, the second microphone hole 204 formed in a partial region of the second surface 200B may be arranged adjacent to the camera modules 205, 212, and 213. For example, the second microphone hole 204 may obtain sound according to the operations of the camera modules 205, 212, and 213. However, it is not limited thereto.

[0063] In an embodiment, the speaker hole 207 may include an external speaker hole 207 and a call receiver hole (not shown). The external speaker hole 207 may be formed on a part of the third surface 200C of the electronic device 200. In an embodiment, the external speaker hole 207 and the microphone hole 203 may be implemented as one hole. Although not shown, a call receiver hole (not shown) may be formed on another part of the third surface 200C. For example, the call receiver hole may be formed on the opposite side of the external speaker hole 207 on the third surface 200C. For example, based on Figure 2 the illustration, the external speaker hole 207 may be formed on the third surface 200C corresponding to the lower end of the electronic device 200, and the call receiver hole may be formed on the third surface 200C corresponding to the upper end of the electronic device 200. However, it is not limited thereto, and in an embodiment, the call receiver hole may be formed at a position other than the third surface 200C. For example, the call receiver hole may be formed by a separation space between the front plate 202 (or the display 201) and the side bezel structure 218.

[0064] In an embodiment, the electronic device 200 may include at least one speaker (not shown) configured to output sound to the outside of the housing via the external speaker hole 207 and / or the call receiver hole (not shown).

[0065] In an embodiment, a sensor module (not shown) (e.g., Figure 1 the sensor module 176) may generate an electrical signal or a data value corresponding to an operation state inside the electronic device 200 or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0066] In an embodiment, the camera modules 205, 212, and 213 (e.g., Figure 1 the camera module 180) may include a first camera module 205 set to face the first surface 200A of the electronic device 200, a second camera module 212 set to face the second surface 200B, and a flash 213.

[0067] In an embodiment, the second camera module 212 may include a plurality of cameras (e.g., dual cameras, triple cameras, or quadruple cameras). However, the second camera module 212 is not necessarily limited to including a plurality of cameras and may include one camera.

[0068] In an embodiment, the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor.

[0069] In an embodiment, the flash 213 may include, for example, a light-emitting diode or a xenon lamp. In an embodiment, two or more lenses (infrared camera, wide-angle, and telephoto lenses) and an image sensor may be disposed on one surface of the electronic device 200.

[0070] In an embodiment, the key input device 217 (e.g., Figure 1 the input module 150) may be disposed on the third surface 200C of the electronic device 200. In an embodiment, the electronic device 200 may not include some or all of the key input device 217, and the excluded key input device 217 may be implemented in another form such as soft keys on the display 201.

[0071] In an embodiment, the connector hole 208 may be formed on the third surface 200C of the electronic device 200 such that a connector of an external device can be accommodated. Connection terminals (e.g., Figure 1 the connection terminals 178) electrically connected to the connector of the external device may be disposed in the connector hole 208. According to an embodiment, the electronic device 200 may include an interface module (e.g., Figure 1 the interface 177) for processing electrical signals transmitted and received via the connection terminals.

[0072] In an embodiment, the electronic device 200 may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the first surface 200A of the housing. The light-emitting device (not shown) may provide state information of the electronic device 200 in an optical form. In an embodiment, the light-emitting device (not shown) may provide a light source associated with the operation of the first camera module 205. For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0073] Figure 3 is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0074] Hereinafter, a repeated description of configurations having the same reference numerals as those described above will be omitted.

[0075] Reference Figure 3, according to an embodiment, the electronic device 200 may include a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery 270.

[0076] In an embodiment, the frame structure 240 may include sidewalls 241 (e.g., Figure 2 a third surface 200C) that form an exterior of the electronic device 200 and support portions 243 that extend inwardly from the sidewalls 241. In an embodiment, the frame structure 240 may be disposed between the display 201 and the rear plate 211. In an embodiment, the sidewalls 241 of the frame structure 240 may surround a space between the rear plate 211 and the front plate 202 (and / or the display 201), and the support portions 243 of the frame structure 240 may extend from the sidewalls 241 within the space.

[0077] In an embodiment, the frame structure 240 may support or house other components included in the electronic device 200. For example, the display 201 may be disposed on a surface of the frame structure 240 facing a direction (e.g., the +z direction), and the display 201 may be supported by the support portions 243 of the frame structure 240. As another example, the first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 may be disposed on another surface of the frame structure 240 facing another direction opposite to this direction (e.g., the -z direction). The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 may be respectively placed in recesses defined by the sidewalls 241 and / or the support portions 243 of the frame structure 240.

[0078] In an embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may be respectively coupled to the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixedly disposed on the frame structure 240 via coupling members such as screws. For example, the battery 270 may be fixedly disposed on the frame structure 240 via an adhesive member (e.g., double-sided tape). However, it is not limited to the above examples.

[0079] In an embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the rear plate 211. In an embodiment, the cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a surface of the first printed circuit board 250 facing the -z direction.

[0080] In an embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 with respect to the z-axis. In an embodiment, the cover plate 260 may cover at least a portion of the first printed circuit board 250. Thus, the cover plate 260 may protect the first printed circuit board 250 from physical shock, or may prevent the connectors (e.g., Figure 3 connector 234) coupled to the first printed circuit board 250 from separating.

[0081] In an embodiment, the cover plate 260 may be fixedly disposed on the first printed circuit board 250 via a coupling member (e.g., a screw), or may be coupled to the frame structure 240 together with the first printed circuit board 250 via a coupling member.

[0082] In an embodiment, the display 201 may be disposed between the frame structure 240 and the front plate 202. For example, the front plate 202 may be disposed on one side of the display 201 (e.g., the +z direction), and the frame structure 240 may be disposed on the other side (e.g., the -z direction).

[0083] In an embodiment, the front plate 202 may be coupled to the display 201. For example, the front plate 202 and the display 201 may be adhered to each other via an optical bonding member (e.g., an optically clear adhesive (OCA) or an optically clear resin (OCR)) inserted therebetween.

[0084] In an embodiment, the front plate 202 may be coupled to the frame structure 240. For example, when viewed in the z-axis direction, the front plate 202 may include an outer portion extending outside the display 201, and may be attached to the frame structure 240 (e.g., the side wall 241) via an adhesive member (e.g., a double-sided tape) placed between the outer portion of the front plate 202 and the frame structure 240. However, it is not limited to the above examples.

[0085] In an embodiment, the first printed circuit board 250 and / or the second printed circuit board 252 may be equipped with a processor (e.g., Figure 1 processor 120), a memory (e.g., Figure 1 memory 130), and / or an interface (e.g., Figure 1interface 177). For example, the processor may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. For example, the memory may include volatile memory or non-volatile memory. For example, the interface may include a high-definition multimedia interface (HDMI), a universal serial bus (USB), an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In an embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operably or electrically connected to each other via a connection member (e.g., a flexible printed circuit board).

[0086] In an embodiment, the battery 270 (e.g., Figure 1 battery 189) may supply power to at least one component of the electronic device 200. For example, the battery 270 may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery 270 may be disposed in a plane substantially the same as the first printed circuit board 250 and / or the second printed circuit board 252.

[0087] According to an embodiment, the electronic device 200 may include an antenna module (not shown) (e.g., Figure 1 antenna module 197). In an embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270. For example, the antenna module may include a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the antenna module may communicate closely with an external device, or receive and transmit power wirelessly with an external device.

[0088] In an embodiment, the first camera module 205 (e.g., a front camera) may be disposed in at least a portion (e.g., the support portion 243) of the frame structure 240 such that the lens may receive external light through a partial area (e.g., the camera area 237) of the front surface 200A of the front plate 202 (e.g., Figure 2 the front surface 200A).

[0089] In an embodiment, the second camera module 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear plate 211. In an embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 via a connection member (e.g., a connector). In an embodiment, the second camera module 212 may be disposed such that the lens may receive external light through the camera area 284 of the rear plate 211 of the electronic device 200.

[0090] In an embodiment, the camera area 284 may be formed on the surface of the rear plate 211 (e.g., Figure 2On the rear surface 200B). In an embodiment, the camera area 284 may be formed to be at least partially transparent so that external light can be incident on the lens of the second camera module 212. In an embodiment, at least a part of the camera area 284 may protrude from the surface of the rear plate 211 by a predetermined height. However, it is not limited thereto, and in an embodiment, the camera area 284 may also be formed in a plane substantially the same as the surface of the rear plate 211.

[0091] In an embodiment, the housing of the electronic device 200 may refer to a configuration or structure that forms at least a part of the appearance of the electronic device 200. In this regard, at least a part of the front plate 202, the frame structure 240, and / or the rear plate 211 that forms the appearance of the electronic device 200 may be referred to as the housing of the electronic device 200.

[0092] Figure 4a is a perspective view of an exemplary electronic device according to an embodiment, Figure 4b is an exploded perspective view of an exemplary electronic device according to an embodiment, and Figure 4c is a top plan view of an exemplary electronic device according to an embodiment.

[0093] Referring to Figure 4a 、 Figure 4b and Figure 4c ,According to an embodiment, the electronic device 400 (e.g., Figure 1 the electronic device 101 and Figure 2 the electronic device 200) may include a support member 410, a display 420 (e.g., Figure 2 the display 201), a sensor 430, at least one waterproof member 440, and / or a speaker module 450 (e.g., Figure 1 the sound output module 155).

[0094] According to an embodiment, the support member 410 may support various components of the electronic device 400. For example, the surface 410a of the support member 410 may support the display 420. The support member 410 may accommodate various components of the electronic device 400. For example, another surface 410b of the support member 410 opposite to the surface 410a of the support member 410 may contact the internal space of the support member 410. For example, another surface 410b of the support member 410 may face the speaker module 450. The direction in which the other surface 410b of the support member 410 faces (e.g., the -z direction) may be opposite to the direction in which the surface 410a of the support member 410 faces (e.g., the +z direction). According to an embodiment, the support member 410 may include a first side 410c and / or a second side 410d. The first side 410c may be exposed to the outside of the support member 410. The first side surface 410c may face a first direction (e.g., the -x direction). The second side 410d may be exposed to the outside of the support member 410. The second side 410d may face a second direction opposite to the first direction (e.g., the +x direction). According to an embodiment, the second side 410d may be spaced apart from the first side 410c. For example, the second side 410d may be spaced apart from the first side 410c along the second direction (e.g., the +x direction). The second side 410d may be substantially parallel to the first side 410c. According to an embodiment, the support member 410 may include a first region 411, a second region 412, and / or a cover portion 413. According to an embodiment, the support member 410 may form Figure 2 at least a part of the housing. For example, the support member 410 may form Figure 2 the entire housing. When the support member 410 forms the entire housing, the support member 410 may define at least a part of the outer surface of the electronic device 400. However, it is not limited thereto. The support member 410 may only form Figure 2 a part of the housing.

[0095] According to an embodiment, the first region 411 and the second region 412 can be classified based on the sensor 430. The first region 411 can accommodate a part of the components disposed within the support member 410. The first region 411 can support some of the components disposed on the support member 410. The first region 411 can be disposed outside the sensor 430. For example, when the support member 410 is viewed from above, the first region 411 can mean a region of the support member 410 that is spaced apart from the sensor 430 along a first direction (e.g., the -x direction). The second region 412 can accommodate another part of the components disposed within the support member 410. The second region 412 can support another part of the components disposed on the support member 410. The second region 412 can be spaced apart from the first region 412. For example, the second region 412 can be spaced apart from the first region 411 along a second direction opposite to the first direction (e.g., the +x direction). The second region 412 can be disposed outside the sensor 430. For example, when the support member 410 is viewed from above, the second region 412 can mean another region of the support member 410 that is spaced apart from the sensor 430 along the second direction (e.g., the +x direction).

[0096] According to an embodiment, the cover portion 413 can expose at least a part of the sensor 430 to the outside of the support member 410 such that the sensor 430 can obtain information from the outside of the electronic device 400. The cover portion 413 can accommodate at least a part of the sensor 430. The cover portion 413 can cover at least a part of the sensor 430. The cover portion 413 can surround at least a part of the sensor 430. According to an embodiment, the cover portion 413 can protrude from the surface 410a of the support member 410. For example, the cover portion 413 can have a shape extending along a direction (e.g., the +z direction) facing the surface 410a of the support member 410 from the surface 410a of the support member 410. According to an embodiment, the cover portion 413 can have a shape corresponding to at least a part of the sensor 430. For example, the cover portion 413 can include an opening 413a such that at least a part of the sensor 430 is exposed to the outside of the support member 410. The opening 413a can penetrate the support member 410. For example, the opening 413a can penetrate the cover portion 413. For example, the opening 413a can extend from the surface 410a of the support member 410 to another surface 410b of the support member 410. For example, when the support member 410 is viewed from above, the opening 413a can overlap with the sensor 430.

[0097] According to an embodiment, the display 420 may be configured to provide visual information. For example, the display 420 may be disposed on the support member 410. For example, the display 420 may be disposed on the surface 410a of the support member 410. For example, the display 420 may be attached to the surface 410a of the support member 410. The display 420 may be disposed on the first area 411 and the second area 412. For example, a part of the display 420 may be disposed on the first area 411, and another part of the display 420 may be disposed on the second area 412. According to an embodiment, the display 420 may include a hole 421 corresponding to the sensor 430. The hole 421 may be disposed on the sensor 430. For example, the density of the pixels included in the hole 421 may be lower than the density of the pixels included in other areas of the display 420 surrounding the hole 421. Since the density of the pixels included in the hole 421 is lower than the density of the pixels included in other areas of the display 420, the sensor 430 may be visible from the outside of the electronic device 400. However, it is not limited thereto. For example, the hole 421 of the display 420 may not include pixels, or may include disabled pixels that do not emit light to the outside of the electronic device 300.

[0098] According to an embodiment, the display 420 may include a notch 422. The notch 422 may send the audio output from the speaker module 450 to the outside of the housing (e.g., Figure 2 the housing). The notch 422 may provide a passage through which the audio from the speaker module 450 may move to the outside of the housing. The notch 422 may be a part of the display 420, where a part of the display 420 is omitted in the display 420. The notch 422 may have the shape of an empty space.

[0099] According to an embodiment, the sensor 430 may be configured to obtain information from the outside of the electronic device 400. For example, the sensor 430 may include an image sensor configured to obtain an image based on light received from an object outside the electronic device 400. For example, the sensor 430 may include a camera. For example, the sensor 430 may be configured to obtain information for identifying a user of the electronic device 400. When the sensor 430 is configured to obtain information for identifying a user (e.g., fingerprint), the sensor 430 may include at least one of an optical sensor, an ultrasonic sensor, and / or a capacitive sensor. According to an embodiment, the sensor 430 may be disposed within the housing. The sensor 430 may be disposed below the display 420 (e.g., in the -z axis direction). For example, the sensor 430 may be disposed below another surface 410b of the support member 410 (e.g., in the -z axis direction). For example, the sensor 430 may face another surface 410b of the support member 410. According to an embodiment, at least a portion of the sensor 430 may be visible from the outside of the housing. For example, the sensor 430 disposed within the support member 410 may be visible from the outside of the housing via the opening 413a of the cover portion 413. According to an embodiment, the sensor 430 may be disposed between the first region 411 and the second region 412. The sensor 430 may define a boundary between the first region 411 and the second region 412. The sensor 430 may be disposed on the boundary between the first region 411 and the second region 412. According to an embodiment, the sensor 430 may be disposed between the first side 410c and the second side 410d. The sensor 430 may be disposed on an imaginary axis f1 passing through a midpoint between the first side 410c and the second side 410d. For example, the distance between the sensor 430 and the first side 410c may be substantially the same as the distance between the sensor 430 and the second side 410d. For example, the sensor 430 may be disposed on an imaginary axis f1 passing through the center of the support member 410. The imaginary axis f1 may be substantially parallel to the first side 410c and / or the second side 410d of the support member 410. For example, when the sensor 430 includes a camera, a user of the electronic device 400 may easily obtain an image via the sensor 430 disposed at the center of the support member 410.

[0100] According to an embodiment, at least one waterproof member 440 may reduce the inflow of foreign substances and / or moisture into the support member 410. At least one waterproof member 440 may fill the gap between the support member 410 and the display 420. According to an embodiment, at least one waterproof member 440 may be disposed between the support member 410 and the display 420. For example, at least one waterproof member 440 may be in contact with the support member 410 and the display 420. For example, at least one waterproof member 440 may be disposed on the surface 410a of the support member 410. For example, at least one waterproof member 440 may be disposed on the cover portion 413 of the support member 410. For example, the at least one waterproof member 440 may be in the form of a tape including an adhesive material, but is not limited thereto. According to an embodiment, at least one waterproof member 440 may be referred to as an example of a sealing member including an adhesive material, but is not limited thereto. For example, at least one waterproof member 440 may be referred to as an example of an adhesive member including an adhesive material.

[0101] According to an embodiment, the speaker module 450 may be configured to emit audio transmitted to the outside of the electronic device 400. The speaker module 450 may be disposed on the support member 410. For example, at least a part of the speaker module 450 may be disposed within the first region 411 of the support member 410. For example, the speaker module 450 may be disposed below (e.g., in the -z axis direction) the other surface 410b of the support member 410. According to an embodiment, the speaker module 450 may include a speaker 451 and / or at least one housing 452.

[0102] According to an embodiment, the speaker 451 may be configured to output audio to be transmitted to the outside of the electronic device 400. For example, the speaker 451 may be configured to output audio through the surface 451a of the speaker 451. For example, the speaker 451 may include a diaphragm, a coil, and / or a magnet for outputting audio. When an electric current is applied to the coil within the speaker 451, the coil and the magnet may interact with each other. When the diaphragm vibrates at a specified frequency through the interaction between the coil and the magnet, the air adjacent to the diaphragm may vibrate. Audio having the specified frequency may be emitted from the speaker 451 through the vibration of the air adjacent to the diaphragm. For example, the speaker 451 may output audio for a call with a user of an external electronic device to the outside of the electronic device 400. However, it is not limited thereto. According to an embodiment, the speaker 451 may be disposed on the support member 410. For example, the surface 451a of the speaker 451 may face the other surface 410b of the support member 410. For example, the direction in which the surface 451a of the speaker 451 faces (e.g., the +z direction) may be opposite to the direction in which the other surface 410b of the support member 410 faces (e.g., the -z direction). According to an embodiment, the speaker 451 may be disposed in one of the first region 411 and the second region 412 of the support member 410. For example, at least a part of the speaker 451 may be disposed in the first region 411.

[0103] According to an embodiment, at least one housing 452 may accommodate the speaker 451. For example, at least one housing 452 may cover the speaker 451. For example, at least one housing 452 may surround the speaker 451. According to an embodiment, at least one housing 452 may be configured to provide a resonance space. The amplitude of the audio emitted from the speaker 451 may be increased by resonating within the resonance space provided by at least one housing 452. According to an embodiment, at least one housing 452 may include a first housing 452a, a second housing 452b, and / or a through-hole 452c.

[0104] According to an embodiment, the first housing 452a may surround a part of the speaker 451. According to an embodiment, the first housing 452a may be disposed on the surface 451a of the speaker 451. For example, the first housing 452a may be spaced apart from the surface 451a of the speaker 451, but it is not limited thereto. For example, the first housing 452a may be in contact with the surface 451a of the speaker 451.

[0105] According to an embodiment, the second housing 452b may surround another part of the speaker 451. According to an embodiment, the second housing 452b may be coupled to the first housing 452a. When the second housing 452b and the first housing 452a are coupled to each other, a resonance space in the speaker 451 may be formed.

[0106] According to an embodiment, the through hole 452c may provide a passage through which audio emitted from the speaker 451 may move to the outside of the support member 410. According to an embodiment, the through hole 452c may be formed on the surface 451a of the speaker 451. For example, the through hole 452c may penetrate the first housing 452a. The audio emitted from the speaker 451 may be sent to the outside of the support member 410 by passing through the through hole 452c.

[0107] According to an embodiment, the support member 410 may include a first audio hole 414, a second audio hole 415, a first audio path 416, and / or a second audio path 417.

[0108] According to an embodiment, the first audio hole 414 may send a part of the audio emitted from the speaker 451 to the first audio path 416. For example, the first audio hole 414 may connect the internal space of the speaker module 450, in which the speaker 451 is disposed, and the first audio path 416. According to an embodiment, the first audio hole 414 may penetrate the support member 410. For example, the first audio hole 414 may penetrate the surface 410a of the support member 410. For example, the first audio hole 414 may extend from the surface 410a of the support member 410 to another surface 410b of the support member 410. According to an embodiment, the first audio hole 414 may be disposed on the speaker 451 (e.g., in the +z axis direction). For example, the first audio hole 414 may be disposed on the surface 451a of the speaker 451 (e.g., in the +z axis direction). For example, the first audio hole 414 may be formed in the first region 411 such that the position of the first audio hole 414 corresponds to the position of the speaker 451 disposed in the first region 411. For example, a part of the audio output through the surface 451a of the speaker 451 may be sent to the first audio path 416 through the first audio hole 414.

[0109] According to an embodiment, the second audio hole 415 may send another part of the audio emitted from the speaker 451 to the second audio path 417. For example, the second audio hole 415 may connect the second audio path 417 to the internal space of the speaker module 450 in which the speaker 451 is disposed. According to an embodiment, the second audio hole 415 may penetrate the support member 410. For example, the second audio hole 415 may extend from the surface 410a of the support member 410 to another surface 410b of the support member 410. According to an embodiment, the second audio hole 415 may be disposed on the speaker 451. For example, the second audio hole 415 may be disposed within the first region 411 of the support member 410 such that the position of the second audio hole 415 corresponds to the position of the speaker 451 disposed within the first region 411. For example, the second audio hole 415 may be disposed on the surface 451a of the speaker 451 (e.g., in the +z-axis direction). Another part of the audio output through the surface 451a of the speaker 451 may be sent to the second audio path 417 through the second audio hole 415. According to an embodiment, the second audio hole 415 may be separated from the first audio hole 414. The second audio hole 415 may be spaced apart from the first audio hole 414. For example, the second audio hole 415 may be spaced apart from the first audio hole 414 along the second direction (e.g., +x direction). However, it is not limited thereto. For example, the second audio hole 415 may be separated from the first audio hole 414 by a specified distance along the second direction (e.g., +x direction) and separated by a specified distance along a direction perpendicular to the second direction (e.g., -y direction or +y direction). According to an embodiment, the size of the second audio hole 415 may be different from the size of the first audio hole 414. For example, the area of the second audio hole 415 may be different from the area of the first audio hole 414, but it is not limited thereto. For example, the area of the first audio hole 414 may be substantially the same as the area of the second audio hole 415.

[0110] According to an embodiment, the first audio path 416 may send the audio output from the speaker 451 through the first audio hole 414 to the outside of the support member 410. The first audio path 416 may be connected to the first audio hole 414. For example, one end 416a of the first audio path 416 may be connected to the first audio hole 414. The first audio path 416 may extend from the first audio hole 414 to the outside of the support member 410. For example, the audio output from the speaker 451 through the first audio hole 414 may be sent to the outside of the support member 410 through the other end 416b of the first audio path 416. The other end 416b of the first audio path 416 may be opposite to one end 416a of the first audio path 416. According to an embodiment, the other end 416b of the first audio path 416 may be connected to the notch 422 of the display 420. For example, when the support member 410 is viewed from above, the other end 416b of the first audio path 416 may overlap with the notch 422 of the display 420. For example, the other end 416b of the first audio path 416 may be disposed below the notch 422 of the display 420. When the first audio path 416 and the notch 422 are connected, the audio sent to the first audio path 416 from the speaker 451 may be sent to the outside of the electronic device 400 along the notch 422. However, the present invention is not limited thereto, and the audio sent to the first audio path 416 may be sent to the outside of the electronic device 400 through components other than the notch 422. For example, although not shown in Figure 4a , Figure 4b and Figure 4c , the other end 416b of the first audio path 416 may be connected to a speaker hole exposed to the outside of the electronic device 400 (for example, Figure 2 's speaker hole 207). According to an embodiment, at least a part of the first audio path 416 may be disposed around at least a part of the sensor 430. For example, at least a part of the first audio path 416 may surround at least a part of the sensor 430. According to an embodiment, the first audio path 416 may be disposed within the first region 411. The first audio path 416 may extend within the first region 411. The first audio path 416 may extend within the first region 411 among the first region 411 and the second region 412.

[0111] According to an embodiment, the second audio path 417 may send the audio output from the speaker 451 through the second audio hole 415 to the outside of the support member 410. The second audio path 417 may be connected to the second audio hole 415. For example, one end 417a of the second audio path 417 may be connected to the second audio hole 415. The second audio path 417 may extend from the second audio hole 415 to the outside of the support member 410. For example, the audio output from the speaker 451 through the second audio hole 415 may be sent to the outside of the support member 410 through the other end 417b of the second audio path 417. The other end 417b of the second audio path 417 may be opposite to one end 417a of the second audio path 417. According to an embodiment, the other end 417b of the second audio path 417 may be connected to the notch 422 of the display 420. For example, when the support member 410 is viewed from above, the other end 417b of the second audio path 417 may overlap with the notch 422 of the display 420. For example, the other end 417b of the second audio path 417 may be disposed below the notch 422 of the display 420. When the second audio path 417 and the notch 422 are connected, the audio sent to the second audio path 417 from the speaker 451 may be sent to the outside of the electronic device 400 along the notch 422. However, this is not limited thereto, and the audio sent to the second audio path 417 may be sent to the outside of the electronic device 400 through components other than the notch 422. For example, although not shown in Figure 4a , Figure 4b and Figure 4c , the other end 417b of the second audio path 417 may be connected to a speaker hole exposed to the outside of the electronic device 400 (e.g., Figure 2of the speaker hole 207). According to an embodiment, at least a part of the second audio path 417 may be provided around at least a part of the sensor 430. For example, at least a part of the second audio path 417 may surround at least a part of the sensor 430. According to an embodiment, the second audio path 417 may extend from the first region 411 to the second region 412. A part of the second audio path 417 may be provided within the first region 411, and another part of the second audio path 417 may be provided within the second region 412. For example, one end 417a of the second audio path 417 may be connected to the second audio hole 415 provided within the first region 411. For example, the other end 417b of the second audio path 417 may be provided within the second region 412. For example, the other end 417b of the second audio path 417 may be connected to another part of the notch 422 provided within the second region 412. For example, when the first audio path 416 is omitted, the audio output from the speaker 451 may be sent to the outside of the support member 410 through the other end 417b of the second audio path 417 provided within the second region 412. When the audio output from the speaker 451 is sent to the outside of the support member 410 only through the second region 412, since the audio from the speaker 451 is output at a position spaced apart from the center of the support member 410, the magnitude of the audio sent to the user may vary with the change in the angle at which the user grasps the electronic device 400. Since the other end 416b of the first audio path 416 is provided within the first region 411, and the other end 417b of the second audio path 417 is provided within the second region 412, the electronic device 400 according to an embodiment may provide a structure capable of providing audio independently of the angle at which the user grasps the electronic device 400.

[0112] According to an embodiment, the straight-line distance between the other end 416b of the first audio path 416 and the speaker 451 may be different from the straight-line distance between the other end 417b of the second audio path 417 and the speaker 451. For example, when the support member 410 is viewed from above, the straight-line distance from the other end 416b of the first audio path 416 to the speaker 451 may be different from the straight-line distance from the other end 417b of the second audio path 417 to the speaker 451. For example, when the support member 410 is viewed from above, the straight-line distance from one end 416a of the first audio path 416 connected to the first audio hole 414 to the other end 417b of the first audio path 416 may be different from the straight-line distance from one end 417a of the second audio path 417 connected to the second audio hole 415 to the other end 417b of the second audio path 417. For example, the straight-line distance may mean the shortest distance between one end 416a and the other end 416b of the first audio path 416. For example, the straight-line distance may mean the shortest distance between one end 417a and the other end 417b of the second audio path 417.

[0113] According to an embodiment, the sensor 430 may be disposed between the first audio path 416 and the second audio path 417. For example, the sensor 430 may be surrounded by the first audio path 416 and the second audio path 417. According to an embodiment, the distance between the sensor 430 and the other end 417b of the second audio path 417 may be substantially the same as the distance between the sensor 430 and the other end 416b of the first audio path 416. For example, the distance between the other end 417b of the second audio path 417 and the sensor 430 in the second direction (e.g., +x direction) may be substantially the same as the distance between the other end 416b of the first audio path 416 and the sensor 430 in the first direction (e.g., -x direction). However, it is not limited thereto. For example, the distance between the sensor 430 and the other end 417b of the second audio path 417 may be different from the distance between the sensor 430 and the other end 416b of the first audio path 416.

[0114] According to an embodiment, the second audio path 417 may be separated from the first audio path 416. For example, the second audio path 417 may be spaced apart from the first audio path 416. For example, the second audio path 417 may be spaced apart from the first audio path 416 along a second direction (e.g., the +x direction). According to an embodiment, a first length l1, which is the length of the first audio path 416, may be defined as the length of an imaginary line connecting the centers of the cross-sectional areas on the first audio path 416 between one end 416a and the other end 416b of the first audio path 416. For example, the first length l1 may be defined as the length of an imaginary line connecting the center of the cross-sectional area of the first audio hole 414 connected to one end 416a of the first audio path 416 to the center of the cross-sectional area of the other end 416b of the first audio path 416. According to an embodiment, a second length l2, which is the length of the second audio path 417, may be defined as the length of an imaginary line connecting the centers of the cross-sectional areas on the second audio path 417 between one end 417a and the other end 417b of the second audio path 417. For example, the second length l2 may be defined as the length of an imaginary line connecting the center of the cross-sectional area of the second audio hole 415 connected to one end 417a of the second audio path 417 to the center of the cross-sectional area of the other end 417b of the second audio path 417. According to an embodiment, the first length l1 of the first audio path 416 may correspond to the second length l2 of the second audio path 417. For example, the first length l1 of the first audio path 416 may be substantially the same as the second length l2 of the second audio path 417. However, it is not limited thereto. For example, the first length l1 may be different from the second length l2 such that the destructive interference between the audio emitted from the other end 416b of the first audio path 416 and the audio emitted from the other end 417b of the second audio path 417 is reduced. For example, when the second audio hole 415 is omitted, both the first audio path 416 and the second audio path 417 may extend from the first audio hole 414. When the first audio path 416 and the second audio path 417 extend from the first audio hole 414, as the end 416a of the first audio path 416 and the end 417a of the second audio path 417 are connected to each other, the first length l1 may be different from the second length l2. When the first length l1 and the second length l2 become different, the sound pressure of the audio in a specific frequency band transmitted to the outside of the support member 410 may be reduced due to the destructive interference between the audio emitted from the other end 416b of the first audio path 416 and the audio emitted from the other end 417b of the second audio path 417. When one end 416a of the first audio path 416 and one end 417a of the second audio path 417 are connected to each other, the shape of one of the first audio path 416 and the second audio path 417 may become complex to change one of the first length l1 and the second length l2.When the shape of one of the first audio path 416 and the second audio path 417 becomes complex, the production of the support member 410 may become complex. Since the first audio path 416 and the second audio path 417 are separated from each other, the electronic device 400 according to an embodiment may provide a structure that easily changes one of the first length l1 and the second length l2 when manufacturing the electronic device 400. For example, since the first audio path 416 extends from the first audio hole 414 and the second audio path 417 extends from the second audio hole 415 separated from the first audio hole 414, when manufacturing the electronic device 400, the first length l1 and the second length l2 can be easily changed by changing the positions of the first audio hole 414 and the second audio hole 415.

[0115] According to an embodiment, the cover part 413 may cover the sensor 430. The cover part 413 may separate the first audio path 416 and the second audio path 417. The cover part 413 may be disposed between the first audio path 416 and the second audio path 417. For example, the cover part 413 may separate the first audio path 416 and the second audio path 417 by extending between the first audio hole 414 and the second audio hole 415 on the surface 410a of the support member 410.

[0116] According to an embodiment, the first audio path 416 may be disposed between the support member 410 and the display 420. The first audio path 416 may be disposed on the surface 410a of the support member 410. According to an embodiment, the first audio path 416 may be defined by the cover part 413 and at least one waterproof member 440. For example, when the first audio path 416 forms substantially a plane with the surface 410a of the support member 410, the first audio path 416 may be defined by the cover part 413 protruding from the surface 410a of the support member 410 and the waterproof member 440 disposed on the surface 410a of the support member 410. However, it is not limited thereto. For example, when the surface 410a of the support member 410 is recessed inward, the first audio path 416 may be formed. The first audio path 416 may be surrounded by the cover part 413 and at least one waterproof member 440. The first audio path 416 may be surrounded by the cover part 413 and at least one waterproof member 440. For example, the periphery of the first audio path 416 may be surrounded by at least one waterproof member 440, and the other periphery of the first audio path 416 may be surrounded by the cover part 413.

[0117] According to an embodiment, the second audio path 417 may be disposed between the support member 410 and the display 420. The second audio path 417 may be disposed on the surface 410a of the support member 410. According to an embodiment, the second audio path 417 may be defined by the cover portion 413 and at least one waterproof member 440. For example, when the second audio path 417 forms substantially a plane with the surface 410a of the support member 410, the second audio path 417 may be defined by the cover portion 413 protruding from the surface 410a of the support member 410 and the waterproof member 440 disposed on the surface 410a of the support member 410. However, it is not limited thereto. For example, when the surface 410a of the support member 410 is recessed inward, the first audio path 416 may be formed. The second audio path 417 may be covered by the cover portion 413 and at least one waterproof member 440. The second audio path 417 may be surrounded by the cover portion 413 and at least one waterproof member 440. For example, the outer periphery of the second audio path 417 may be surrounded by at least one waterproof member 440, and the other outer periphery of the second audio path 417 may be surrounded by the cover portion 413.

[0118] As described above, according to an embodiment, when manufacturing the electronic device 400 through the first audio hole 414 and the first audio path 416 extending from the second audio hole 415 and the second audio path 417, respectively, the electronic device 400 may provide a structure for easily changing the first length l1 of the first audio path 416 and the second length l2 of the second audio path 417.

[0119] Figure 5 is a top plan view of an exemplary electronic device according to an embodiment.

[0120] Reference Figure 5 , according to an embodiment, from a speaker (e.g., Figure 4a , Figure 4b and Figure 4cThe audio sent to the first audio hole 414 by the speaker 451 can be sent from one end 416a of the first audio path 416 to the other end 416b of the first audio path 416. The audio sent to the second audio hole 415 by the speaker 451 can be sent from one end 417a of the second audio path 417 to the other end 417b of the second audio path 417. According to an embodiment, the electronic device 400 may include at least one first partition wall 416c. The at least one first partition wall 416c may delay the movement of the audio from the speaker 451 in at least one of the first audio path 416 and the second audio path 417. According to an embodiment, the at least one first partition wall 416c may be disposed in at least one of the first audio path 416 and the second audio path 417. For example, the at least one first partition wall 416c may be disposed within the first audio path 416. For example, the at least one first partition wall 416c may be disposed within the second audio path 417. For example, the at least one first partition wall 416c may include a plurality of first partition walls spaced apart from each other, however, it is not limited thereto. According to an embodiment, the at least one first partition wall 416c may extend from the outside of the first audio path 416 in a direction facing the inside of the first audio path 416. The at least one first partition wall 416c may extend from the outside of the second audio path 417 in a direction facing the inside of the second audio path 417. For example, the at least one first partition wall 416c may extend from the surface 410a of the support member 410 in a direction facing the surface 410a of the support member 410 (e.g., the +z direction). For example, the at least one first partition wall 416c may be in contact with the display (e.g., Figure 4a and Figure 4b the display 420) of. However, it is not limited thereto, and the at least one first partition wall 416c may be spaced apart from the display 420, as described later in Figure 6 . According to an embodiment, the at least one first partition wall 416c may include a protruding member disposed on the support member 410.

[0121] According to an embodiment, when the at least one first partition wall 416c is disposed within the first audio path 416, the length of the first audio path 416 may increase from the first length l1 to the third length l3. For example, when the audio collides with the at least one first partition wall 416c within the first audio path 416, the time for the audio to be sent from the speaker 451 to the other end 416b of the first audio path 416 may increase compared to the case where the at least one first partition wall 416c is omitted. As the time for the audio to be sent from the speaker 451 to the other end 416b of the first audio path 416 increases, the length of the first audio path 416 may increase significantly.

[0122] As described above, according to an embodiment, when manufacturing the electronic device 400, the electronic device 400 may provide a structure in which the length of the first audio path 416 and the length of the second audio path 417 can be easily changed by at least one first partition wall 416c that significantly increases the length of the first audio path 416.

[0123] Figure 6 is a cross-sectional view showing an example of an exemplary electronic device according to an embodiment cut along line A-A'. Figure 4a

[0124] Referring Figure 6 , according to an embodiment, at least one first partition wall 416d may be spaced apart from the display 420. When at least one first partition wall 416d and the display 420 are spaced apart from each other, audio from a speaker (e.g., Figure 4a , Figure 4b and Figure 4c speaker 451) may move along the outer surface of at least one first partition wall 416d. When the audio from the speaker 451 moves along the outer surface of at least one first partition wall 416d, the time for the audio to be sent from the speaker 451 to the outside of the support member 410 may be increased.

[0125] The electronic device 400 according to an embodiment may include at least one second partition wall 423. At least one second partition wall 423 may delay the movement of audio from the speaker 451 in at least one of the first audio path 416 and the second audio path (e.g., Figure 4a , Figure 4b and Figure 4c second audio path 417). For example, at least one second partition wall 423 may be disposed within the first audio path 416. For example, at least one second partition wall 423 may be disposed within the second audio path 417. According to an embodiment, at least one second partition wall 423 may be disposed on the surface 420a of the display 420. At least one second partition wall 423 may be attached to the surface 420a of the display 420. The surface 420a of the display 420 may face the surface 410a of the support member 410. For example, at least one second partition wall 423 may be formed of a sealing member (e.g., a tape) for filling the gap between the display 420 and the support member 410. For example, the sealing member may include an adhesive material for attaching the display 420 to the support member 410. The sealing member may be referred to as an adhesive member.

[0126] According to an embodiment, the audio from the speaker 451 may move along the outer surface of at least one second partition wall 423. When the audio moves along at least one second partition wall 423, the time for the audio to be sent from the speaker 451 to the outside of the support member 410 may be increased. As the time for the audio to be sent from the speaker 451 to the outside of the support member 410 increases, the length of the first audio path 416 may be significantly increased.

[0127] As described above, according to an embodiment, when manufacturing the electronic device 400, the electronic device 400 may provide a structure in which the length of the first audio path 416 or the length of the second audio path 417 can be easily changed by at least one second partition wall 423 that increases the length of at least one of the first audio path 416 and the second audio path 417.

[0128] Figure 7 is a top plan view of an exemplary electronic device according to an embodiment.

[0129] Reference Figure 7 , according to an embodiment, the audio sent from a speaker (e.g., Figure 4a , Figure 4b and Figure 4c the speaker 451) to the first audio hole 414 may be sent from one end 416a of the first audio path 416 to the other end 416b of the first audio path 416. The audio sent from the speaker 451 to the second audio hole 415 may be sent from one end 417a of the second audio path 417 to the other end 417b of the second audio path 417.

[0130] According to an embodiment, the electronic device 400 may include an absorption member 417c. The absorption member 417c may reduce the sound pressure of the audio in a specific frequency band output from the speaker 451. For example, the absorption member 417c may absorb the audio within a specific frequency band in the audio from the speaker 451 and allow the audio outside the specific frequency band to pass through. For example, the audio within the specific frequency band may refer to the audio within the frequency band where destructive interference occurs due to the length difference between the first audio path 416 and the second audio path 417. For example, when the specific frequency band is a high frequency band, the absorption member 417c may be referred to as a low-pass filter (LPF).

[0131] According to an embodiment, the absorption member 417c may be disposed in at least one of the first audio path 416 and the second audio path 417. For example, the absorption member 417c may be disposed in the first audio path 416. For example, the absorption member 417c may be disposed in the second audio path 417.

[0132] As described above, according to an embodiment, the electronic device 400 may provide a structure capable of reducing the destructive interference of audio occurring outside the support member 410 by removing the absorption member 417c in a specific frequency band.

[0133] Figure 8a is a top plan view of an exemplary electronic device according to an embodiment, Figure 8b is a top plan view of an exemplary electronic device according to an embodiment, and Figure 8c is a top plan view of an exemplary electronic device according to an embodiment.

[0134] Referring to Figure 8a 、 Figure 8b and Figure 8c , according to an embodiment, audio sent from a speaker (e.g., Figure 4a 、 Figure 4b and Figure 4c 's speaker 451) to the first audio hole 414 may be sent from one end 416a of the first audio path 416 to the other end 416b of the first audio path 416. Audio sent from the speaker 451 to the second audio hole 415 may be sent from one end 417a of the second audio path 417 to the other end 417b of the second audio path 417.

[0135] According to an embodiment, the electronic device 400 may include an acoustic space 417d. The acoustic space 417d may reduce the sound pressure of a part of the audio output from the speaker 451. For example, the acoustic space 417d may reduce the sound pressure of a part of the audio within a specific frequency band through Helm Holtz resonance. The audio within the specific frequency band may mean the audio within the frequency band where destructive interference occurs due to the length difference between the first audio path 416 and the second audio path 417. For example, the acoustic space 417d may reduce the sound pressure of a part of the audio from the speaker 451 through the reflected wave reflected within the acoustic space 417d. According to an embodiment, when a part of at least one waterproof member 440 is penetrated, the acoustic space 417d may be formed. For example, as a part of at least one waterproof member 440 is cut, the acoustic space 417d may be formed. As a part of at least one waterproof member 440 is recessed inward, the acoustic space 417d may be formed. However, it is not limited thereto. For example, as the surface 410a of the support member 410 is recessed inward, the acoustic space 417d may be formed.

[0136] According to an embodiment, the acoustic space 417d may be connected to at least one of the first audio path 416 and the second audio path 417. For example, the acoustic space 417d may be connected to the first audio path 416. For example, the acoustic space 417d may be connected to the second audio path 417. Hereinafter, the case where the acoustic space 417d is connected to the second audio path 417 is described for ease of explanation. For example, the acoustic space 417d may be connected to the first audio path 416.

[0137] According to an embodiment, the acoustic space 417d may be disposed between one end 417a and the other end 417b of the second audio path 417. For example, referring to Figure 8a , the acoustic space 417d may have a shape extending in a second direction (e.g., +x direction) between one end 417a and the other end 417b of the second audio path 417. However, it is not limited thereto.

[0138] Referring to Figure 8b , according to an embodiment, the acoustic space 417d may extend in a direction inclined with respect to the second direction (e.g., +x direction). According to an embodiment, as the acoustic space 417d extends, the size of the acoustic space 417d may change. The size of the portion 417d-1 of the acoustic space 417d connected to the second audio path 417 may be different from the size of another portion 417d-2 of the acoustic space 417d connected to the portion 417d-1 of the acoustic space 417d. For example, the size of the portion 417d-1 of the acoustic space 417d connected to the second audio path 417d may be smaller than the size of another portion 417d-2 of the acoustic space 417d connected to the portion 417d-1 of the acoustic space 417d.

[0139] Referring to Figure 8c , according to an embodiment, the acoustic space 417d may include a plurality of slits. The plurality of slits may be spaced apart from each other. For example, the plurality of slits may also extend in a direction inclined with respect to the second direction (e.g., +x direction). According to an embodiment, the plurality of slits may have different lengths. For example, the lengths of the plurality of slits extending in a direction inclined with respect to the second direction (e.g., +x direction) may vary.

[0140] As described above, according to an embodiment, the electronic device 400 may provide a structure capable of reducing destructive interference of audio occurring outside the support member 410 by the acoustic space 417d that can reduce the sound pressure of a part of the audio output from the speaker 451.

[0141] Figure 9 is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0142] Referring toFigure 9 According to an embodiment, the speaker module 450 may include a first audio duct member 453 and / or a second audio duct member 454. The first audio duct member 453 may be coupled to at least one housing 452. For example, the first audio duct member 453 may be coupled to the first housing 452a. For example, the first audio duct member 453 may be disposed on the first housing 452a. According to an embodiment, the first audio duct member 453 may define a first audio path 416. For example, the first audio duct member 453 may cover the first audio path 416. For example, the first audio duct member 453 may surround the first audio path 416. According to an embodiment, the first audio duct member 453 may be disposed on the first audio hole 414 provided in the first housing 452a. The first audio duct member 453 may cover the first audio hole 414 provided in the first housing 452a. According to an embodiment, the first audio duct member 453 may be disposed below the support member 410. The first audio duct member 453 may be disposed on the other surface 410b of the support member 410. For example, the surface 453a of the first audio duct member 453 may face the other surface 410b of the support member 410. The direction (e.g., +z direction) in which the surface 453a of the first audio duct member 453 faces may be opposite to the direction (e.g., -z direction) in which the other surface 410b of the support member 410 faces. The direction (e.g., +z direction) in which the surface 453a of the first audio duct member 453 faces may be substantially the same as the direction (e.g., +z direction) in which the surface 451a of the speaker 451 faces.

[0143] According to an embodiment, the first audio duct member 453 may extend within the first region 411. For example, the first audio duct member 453 may extend from the speaker 451 provided in the first region 411. For example, the first audio duct member 453 may extend from the first audio hole 414 provided in the first region 411. The first audio duct member 453 may extend within the first region 411 among the first region 411 and the second region 412. According to an embodiment, the first audio duct member 453 may be disposed around at least a portion of the sensor 430. For example, at least a portion of the first audio duct member 453 may surround the sensor 430.

[0144] According to an embodiment, the first audio duct member 453 may include a first output hole 453b. The first output hole 453b may penetrate the surface 453a of the first audio duct member 453. The audio output from the speaker 451 may move along the first audio path 416 surrounded by the first audio duct member 453. The audio moving along the first audio path 416 may be sent to the outside of the speaker module 450 through the first output hole 453b.

[0145] According to an embodiment, the second audio pipeline member 454 may be coupled to at least one housing 452. For example, the second audio pipeline member 454 may be coupled to the first housing 452a. For example, the second audio pipeline member 454 may be disposed on the first housing 452a. According to an embodiment, the second audio pipeline member 454 may define a second audio path 417. For example, the second audio pipeline member 454 may cover the second audio path 417. For example, the second audio pipeline member 454 may surround the second audio path 417. According to an embodiment, the second audio pipeline member 454 may be disposed on the second audio hole 415, and the second audio hole 415 is disposed in the first housing 452a. The second audio pipeline member 454 may cover the second audio hole 415 disposed in the first housing 452a. According to an embodiment, the second audio pipeline member 454 may be disposed below the support member 410. The second audio pipeline member 454 may be disposed on the other surface 410b of the support member 410. For example, the surface 454a of the second audio pipeline member 454 may face the other surface 410b of the support member 410. The direction (e.g., +z direction) in which the surface 454a of the second audio pipeline member 454 faces may be opposite to the direction (e.g., -z direction) in which the other surface 410b of the support member 410 faces. The direction (e.g., +z direction) in which the surface 454a of the second audio pipeline member 454 faces may be substantially the same as the direction (e.g., +z direction) in which the surface 451a of the speaker 451 faces.

[0146] According to an embodiment, the second audio pipeline member 454 may extend from the first region 411 to the second region 412. A part of the second audio pipeline member 454 may be disposed within the first region 411, and another part of the second audio pipeline member 454 may be disposed within the second region 412. For example, a part of the second audio pipeline member 454 may extend from the second audio hole 415 disposed within the first region 411. For example, a part of the second audio pipeline member 454 may extend from the speaker 451 disposed within the first region 411. According to an embodiment, at least a part of the second audio pipeline member 454 may be disposed around the sensor 430. For example, at least a part of the second audio pipeline member 454 may surround the sensor 430.

[0147] According to an embodiment, the second audio pipeline member 454 may include a second output hole 454b. The second output hole 454b may penetrate the surface 454a of the second audio pipeline member 454. The audio output from the speaker 451 may move along the second audio path 417 surrounded by the second audio pipeline member 454. The audio moving along the second audio path 417 may be sent to the outside of the speaker module 450 through the second output hole 454b.

[0148] According to an embodiment, the support member 410 may include at least one emission hole 418. The at least one emission hole 418 may provide a passage through which audio from the speaker module 450 can move to the outside of the support member 410. According to an embodiment, the at least one emission hole 418 may include a first emission hole 418a and a second emission hole 418b. The first emission hole 418a may send audio from the first audio duct member 453 to the outside of the support member 410. For example, the first emission hole 418a may be set to correspond to the first output hole 453b of the first audio duct member 453. For example, the position of the first emission hole 418a may correspond to the position of the first output hole 453b. The first emission hole 418a may penetrate the support member 410. For example, the first emission hole 418a may extend from the surface 410a of the support member 410 to another surface 410b of the support member 410. For example, the audio from the first output hole 453b may move to the outside of the support member 410 through the notch 422 of the display 420 by passing through the first emission hole 418a. For example, the notch 422 may be provided on a portion of the first audio duct member 453 provided in the first area 411. For example, the notch 422 may be set to correspond to a portion of the first audio duct member 453 in which the first emission hole 418a is provided. The second emission hole 418b may send audio from the second audio duct member 454 to the outside of the support member 410. For example, the second emission hole 418a may be set to correspond to the second output hole 454b of the second audio duct member 454. For example, the position of the second emission hole 418b may correspond to the position of the second output hole 454b. The second emission hole 418b may penetrate the support member 410. For example, the second emission hole 418b may extend from the surface 410a of the support member 410 to another surface 410b of the support member 410. According to an embodiment, the second emission hole 418b may be separated from the first emission hole 418a. The second emission hole 418b may be spaced apart from the first emission hole 418a. For example, the second emission hole 418b may be spaced apart from the first emission hole 418a in the second direction (e.g., the +x direction). For example, the audio from the second output hole 454b may move to the outside of the support member 410 through the notch 422 of the display 420 by passing through the second emission hole 418b. For example, the notch 422 may be set to correspond to a portion of the second audio duct member 454 provided in the second area 412. For example, the notch 422 may be provided on a portion of the second audio duct member 454 in which the second emission hole 418b is provided.

[0149] According to an embodiment, at least one waterproof member 440 may include a first waterproof member 441, a second waterproof member 442, and / or a third waterproof member 443. The first waterproof member 441 may fill a gap between the first audio duct member 453 and the support member 410. According to an embodiment, the first waterproof member 441 may be disposed between the other surface 410b of the support member 410 and the first audio duct member 453. The first waterproof member 441 may be disposed on the surface 453a of the first audio duct member 453. According to an embodiment, the first waterproof member 441 may be spaced apart from the first output hole 453b. For example, the first waterproof member 441 may also surround the first output hole 453b in a state spaced apart from the first output hole 453b. For example, the first waterproof member 441 may also not cover the first output hole 453b.

[0150] According to an embodiment, the second waterproof member 442 may fill a gap between the second audio duct member 454 and the support member 410. According to an embodiment, the second waterproof member 442 may be disposed between the other surface 410b of the support member 410 and the second audio duct member 454. The second waterproof member 442 may be disposed on the surface 454a of the second audio duct member 454. According to an embodiment, the second waterproof member 442 may be spaced apart from the second output hole 454b. For example, the second waterproof member 442 may also surround the second output hole 454b in a state spaced apart from the second output hole 454b. For example, the second waterproof member 442 may also not cover the second output hole 454b.

[0151] According to an embodiment, the third waterproof member 443 may fill a gap between the display 420 and the support member 410. According to an embodiment, the third waterproof member 443 may be disposed between the display 420 and the support member 410. The third waterproof member 443 may be disposed on the surface 410a of the support member 410. According to an embodiment, the third waterproof member 443 may be spaced apart from the first emission hole 418a and the second emission hole 418b of the support member 410. For example, the third waterproof member 443 may also not cover the first emission hole 418a and the second emission hole 418b. For example, the third waterproof member 443 may include notches corresponding to the first emission hole 418a and the second emission hole 418b, but is not limited thereto. For example, the third waterproof member 443 may include holes corresponding to the first emission hole 418a and the second emission hole 418b.

[0152] As described above, according to an embodiment, when manufacturing the electronic device 400, the electronic device 400 may provide a structure in which the lengths of the first audio path 416 and the second audio path 417 can be easily changed by the speaker module 450, which includes a first audio duct member 453 surrounding the first audio path 416 and a second audio duct member 454 surrounding the second audio path 417.

[0153] Figure 10a is an exploded perspective view of an exemplary electronic device according to an embodiment, and Figure 10b is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0154] Reference Figure 10a and Figure 10b According to an embodiment, the support member 410 may include at least one receiving hole 419. The at least one receiving hole 419 may receive a plurality of audio duct members 453 and 454. According to an embodiment, the at least one receiving hole 419 may include a first receiving hole 419a and a second receiving hole 419b.

[0155] According to an embodiment, the first receiving hole 419a may receive the first audio duct member 453. For example, the first receiving hole 419a may surround the first audio duct member 453. The first receiving hole 419a may penetrate the support member 410. For example, the first receiving hole 419a may extend from a surface 410a of the support member 410 to another surface 410b of the support member 410. According to an embodiment, the first receiving hole 419a may have a shape corresponding to that of the first audio duct member 453.

[0156] According to an embodiment, the second receiving hole 419b may receive the second audio duct member 454. For example, the second receiving hole 419b may surround the second audio duct member 454. The second receiving hole 419b may penetrate the support member 410. For example, the second receiving hole 419b may extend from a surface 410a of the support member 410 to another surface 410b of the support member 410. According to an embodiment, the second receiving hole 419b may have a shape corresponding to that of the second audio duct member 454.

[0157] According to an embodiment, at least a portion of the speaker module 450 may be inserted into the support member 410. The first audio duct member 453 may be inserted into the support member 410. The second audio duct member 454 may be inserted into the support member 410. For example, a surface 453a of the first audio duct member 453 may form substantially a single plane with a surface 410a of the support member 410. For example, a surface 454a of the second audio duct member 454 may form substantially a single plane with a surface 410a of the support member 410.

[0158] According to an embodiment, the third waterproof member 443 may be disposed on the first audio duct member 453 and the second audio duct member 454. For example, the third waterproof member 443 may be disposed on the surface 453a of the first audio duct member 453 and the surface 454a of the second audio duct member 454. A part of the third waterproof member 443 may be disposed between the first audio duct member 453 and the display 420. Another part of the third waterproof member 443 may be disposed between the second audio duct member 454 and the display 420.

[0159] As described above, according to an embodiment, since the first audio duct member 453 and the second audio duct member 454 are inserted into the support member 410, the electronic device 400 may ensure a space in which components in the electronic device 400 can be disposed.

[0160] Figure 11 is a graph showing an exemplary relationship between the frequency of audio output from a speaker and the sound pressure level according to an embodiment.

[0161] In Figure 11 the graph, the horizontal axis may indicate the frequency of audio output from a speaker (e.g., Figure 4a , Figure 4b and Figure 4c the speaker 451), and the vertical axis may indicate the sound pressure level (SPL) of audio output from the speaker 451 and sent outside the support member (e.g., Figure 4a , Figure 4b and the support member 410 of FIG. 4v).

[0162] Figure 11 The first graph 1110 of Figure 4a , Figure 4b and Figure 4c may indicate the relationship between the frequency and the sound pressure level in a state where the first audio path (e.g., Figure 4a , Figure 4b and Figure 4c the first audio path 416) and the second audio path (e.g., Figure 4a , Figure 4b and Figure 4c the second audio path 417) are connected. Figure 11 The second graph 1120 of Figure 11 may indicate the relationship between the frequency and the sound pressure level in a state where the first audio path 416 and the second audio path 417 are separated from each other. For example, according to an embodiment, the second graph 1120 may indicate the relationship between the frequency and the sound pressure level when the path length difference between the first audio path 416 and the second audio path 417 decreases.

[0163] According to an embodiment, the first graph 1110 may have a dip at a first frequency 1130. For example, in the first graph 1110, the sound pressure level of the audio output from the speaker 451 may decrease at the first frequency 1130. For example, in the first graph 1110, the first frequency 1130 may be referred to as a dip frequency. Through the first graph 1110, it can be recognized that an electronic device (e.g., Figure 4a , Figure 4b and Figure 4c electronic device 400) may provide, through the speaker 451, only an audio having a frequency band narrower than the first frequency 1130 in a state where the first audio path 416 and the second audio path 417 are connected to each other.

[0164] According to an embodiment, the second graph 1120 may have a dip at a second frequency 1140 higher than the first frequency 1130. For example, in the second graph 1120, the sound pressure level of the audio output from the speaker 451 may decrease at the second frequency 1140. For example, in the second graph 1120, the second frequency 1140 may be referred to as a dip frequency. Through the second graph 1120, it can be recognized that the electronic device 400 may provide, through the speaker 451, only an audio in a frequency band less than the second frequency 1140 in a state where the first audio path 416 and the second audio path 417 are separated. Since the second frequency 1140 is relatively higher than the first frequency 1130, it can be recognized through the second graph 1120 that the electronic device 400 may provide an audio in a relatively wide frequency band through the speaker 451 in a state where the first audio path 416 and the second audio path 417 are separated.

[0165] As described above, according to an embodiment, since the first audio path 416 and the second audio path 417 are separated from each other, the electronic device 400 may provide a structure capable of providing an audio in a relatively wide frequency band.

[0166] When various components are installed in an electronic device, a speaker in the electronic device may be disposed at a position spaced apart from the center of the electronic device. Since the speaker is disposed at a position spaced apart from the center, when there is one audio path, the size of the audio sent to the user may vary according to the angle at which the user grasps the electronic device. When the electronic device includes a plurality of audio paths extending from the speaker to the outside of the electronic device, due to the length difference between the audio paths, destructive interference may occur between the audios emitted from the audio paths.

[0167] According to an embodiment, an electronic device (e.g., Figure 4a , Figure 4b and Figure 4c electronic device 400) may include a support member (e.g., Figure 4a , Figure 4b and Figure 4csupport member 410), the support member includes a first region (e.g., Figure 4a , Figure 4b and Figure 4c the first region 411) and a second region spaced apart from the first region (e.g., Figure 4a , Figure 4b and Figure 4c the second region 412). According to an embodiment, the electronic device may include a speaker disposed in the first region (e.g., Figure 4a , Figure 4b and Figure 4c the speaker 451). According to an embodiment, the electronic device may include a first audio hole disposed on the surface of the speaker (e.g., Figure 4a , Figure 4b and Figure 4c the first audio hole 414). According to an embodiment, the electronic device may include a second audio hole disposed on the surface of the speaker and separated from the first audio hole (e.g., Figure 4a , Figure 4b and Figure 4c the second audio hole 415). According to an embodiment, the electronic device may include a first audio path extending from the first audio hole in the first region (e.g., Figure 4a , Figure 4b and Figure 4c the first audio path 416) to send the audio output from the speaker to the outside of the electronic device through the first audio hole. According to an embodiment, the electronic device may include a second audio path extending from the second audio hole in the first region to the second region and separated from the first audio path (e.g., Figure 4a , Figure 4b and Figure 4c the second audio path 417) to send the audio output from the speaker to the outside of the electronic device through the second audio hole. According to an embodiment, a sensor may be disposed between the first audio path and the second audio path.

[0168] According to an embodiment, since the first audio path extends from the first audio hole and the second audio path extends from the second audio hole, the electronic device may provide a structure in which the length of the first audio path and the length of the second audio path can be easily changed when manufacturing the electronic device.

[0169] According to an embodiment, the audio output from the speaker through the second audio hole may be sent to the outside of the electronic device independently of the audio output from the speaker through the first audio hole.

[0170] According to an embodiment, since the first audio hole and the second audio hole are separated from each other, the electronic device may provide a structure in which the length of the first audio path and the length of the second audio path can be easily changed when manufacturing the electronic device.

[0171] According to an embodiment, the first audio hole and the second audio hole may penetrate a surface of a support member supporting a display (e.g., Figure 4a and Figure 4b the surface 410a of the support member of the display 420). According to an embodiment, the first audio path and the second audio path may be disposed between the display and the support member. Figure 4a 、 Figure 4b and Figure 4c According to an embodiment, the electronic device may provide audio having a wide frequency bandwidth to a user through the first audio path and the second audio path disposed between the display and the support member.

[0172] According to an embodiment, the electronic device may further include a display including a notch (e.g.,

[0173] the notch 422 of Figure 4a 、 Figure 4b and Figure 4c ), and the display may be disposed on a surface of the support member. According to an embodiment, the notch may be disposed at one end of the first audio path and one end of the second audio path.

[0174] According to an embodiment, the electronic device may provide audio from the first audio path and the second audio path to the outside of the support member through the notch provided in the display.

[0175] According to an embodiment, the electronic device may include a sensor disposed between a first region and a second region and surrounded by the first audio path and the second audio path (e.g., Figure 4a 、 Figure 4b and Figure 4c the sensor 430). According to an embodiment, the electronic device may include a display disposed on a surface of the support member (e.g., Figure 4a 、 Figure 4b and Figure 4c the display 420). According to an embodiment, the support member may include a cover portion protruding from a surface of the support member and covering the sensor (e.g., Figure 4b and Figure 4c the cover portion 413). According to an embodiment, the cover portion may separate the first audio path and the second audio path by extending between the first audio hole and the second audio hole on the surface of the support member.

[0176] According to an embodiment, since the first audio path and the second audio path are separated by the cover portion disposed on the sensor, the electronic device may provide a structure capable of ensuring a space in which components within the electronic device can be installed.

[0177] According to an embodiment, the electronic device may include a display disposed on a surface of a support member (e.g., Figure 4a , Figure 4b and Figure 4c display 420). According to an embodiment, the electronic device may include a waterproof member (e.g., Figure 4b and Figure 4c waterproof member 440), the waterproof member being disposed between the display and the support member and surrounding a first audio path and a second audio path. According to an embodiment, the second audio path may be defined by a cover portion and the waterproof member.

[0178] According to an embodiment, since the first audio path and the second audio path are separated by the waterproof member, the electronic device may provide a structure capable of ensuring a space in which components within the electronic device can be installed.

[0179] According to an embodiment, the electronic device may include a sensor 430, the sensor 430 being disposed between a first region 411 and a second region 412 and surrounded by a first audio path 416 and a second audio path 417. According to an embodiment, the support member may include an opening (e.g., Figure 4b and Figure 4c opening 431a), the opening penetrating the support member and overlapping with the sensor when the support member is viewed from above.

[0180] According to an embodiment, since the sensor is exposed through the opening formed in the support member, the electronic device may obtain information about the outside of the electronic device.

[0181] According to an embodiment, the electronic device may include a partition wall (e.g., Figure 5 at least one first partition wall 416c) disposed within at least one of the first audio path and the second audio path.

[0182] According to an embodiment, the electronic device may provide a structure in which, when manufacturing the electronic device, the first audio path and the second audio path can be easily changed by the partition wall disposed within one of the first audio path and the second audio path.

[0183] According to an embodiment, the electronic device may include an absorption member (e.g., Figure 7 absorption member 417c) disposed within at least one of the first audio path and the second audio path.

[0184] According to an embodiment, the electronic device may provide a structure capable of reducing destructive interference of audio occurring outside the support member by the absorption member that removes audio signals having a specific frequency.

[0185] According to an embodiment, the second audio path may include an acoustic space (e.g.,Figure 8a , Figure 8b and Figure 8c The acoustic space 417d) is provided between one end of the second audio path connected to the second audio hole and the other end of the second audio path opposite to the one end of the second audio path.

[0186] According to an embodiment, the electronic device may provide a structure capable of reducing destructive interference of audio occurring outside the support member by reducing a part of the acoustic space that reduces the sound pressure of an audio signal having a specific frequency.

[0187] According to an embodiment, the electronic device may include a housing (e.g., Figure 9 at least one housing 452) that houses a speaker and includes a first audio hole and a second audio hole. According to an embodiment, the electronic device may include a first audio duct member (e.g., Figure 9 the first audio duct member 453) coupled to the housing and surrounding the first audio path. According to an embodiment, the electronic device may include a second audio duct member (e.g., Figure 9 the second audio duct member 454) coupled to the housing and surrounding the second audio path.

[0188] According to an embodiment, the electronic device may provide a structure in which when manufacturing the electronic device, the length of the first audio path and the length of the second audio path can be easily changed by the first audio duct member surrounding the first audio path and the second audio duct member surrounding the second audio path.

[0189] According to an embodiment, the first audio duct member may include a first output hole (e.g., Figure 9 the first output hole 453b) of, the first output hole penetrates the surface of the first audio duct member that faces the direction in which the surface of the speaker faces. According to an embodiment, the second audio duct member may include a second output hole (e.g., Figure 9 the second output hole 454b) of, the second output hole penetrates the surface of the second audio duct member that faces the direction in which the surface of the speaker faces.

[0190] According to an embodiment, the electronic device may provide a structure capable of sending audio from the speaker to the outside through the first output hole and the second output hole.

[0191] According to an embodiment, the support member may include a surface supporting the display and another surface opposite to the surface, a first emission hole (e.g., Figure 9 the first emission hole 418a) extending from the surface to the other surface, and a second emission hole (e.g., Figure 9the second emission hole 418b). According to an embodiment, the first audio pipe member and the second audio pipe member may be disposed on another surface of the support member.

[0192] According to an embodiment, the electronic device may provide a structure capable of transmitting audio from a speaker to the outside through a first emission hole and a second emission hole formed in a support member.

[0193] According to an embodiment, the electronic device may include a first waterproof member (e.g., Figure 9 the first waterproof member 441) disposed between another surface of the support member and the first audio pipe member. According to an embodiment, the electronic device may include a second waterproof member (e.g., Figure 9 the second waterproof member 442) disposed between another surface of the support member and the second audio pipe member.

[0194] According to an embodiment, the electronic device may provide a structure capable of filling gaps between the first audio pipe member and the support member and between the second audio pipe member and the support member through the first waterproof member and the second waterproof member.

[0195] According to an embodiment, the support member may include a first receiving hole (e.g., Figure 10a and Figure 10b the first receiving hole 419a) that extends from a surface of the support member supporting a display to another surface of the support member opposite to the surface of the support member and receives the first audio pipe member. According to an embodiment, the support member may include a second receiving hole (e.g., Figure 10a and Figure 10b the second receiving hole 419b) that extends from one surface of the support member to another surface of the support member, is separated from the first receiving hole, and receives the second audio pipe member.

[0196] According to an embodiment, the electronic device may provide a structure in which the first audio pipe member and the second audio pipe member may be inserted into the support member through a first receiving hole and a second receiving hole formed in the support member.

[0197] According to an embodiment, an electronic device (e.g., Figure 4a , Figure 4b and Figure 4c the electronic device 400) may include a support member (e.g., Figure 4a , Figure 4b and Figure 4c the support member 410), the support member including a first region (e.g., Figure 4a , Figure 4b and Figure 4c the first region 411) and a second region spaced apart from the first region (e.g.,Figure 4a , Figure 4b and Figure 4c in the second region 412). According to an embodiment, the electronic device may include a sensor disposed between the first region and the second region (e.g., Figure 4a , Figure 4b and Figure 4c sensor 430). According to an embodiment, the electronic device may include a speaker disposed within the first region (e.g., Figure 4a , Figure 4b and Figure 4c speaker 451). According to an embodiment, the electronic device may include a housing (e.g., Figure 9 housing 452), the housing including a first audio hole disposed on the speaker (e.g., Figure 4a , Figure 4b and Figure 4c first audio hole 414), a second audio hole separated from the first audio hole and surrounding the speaker (e.g., Figure 4a , Figure 4b and Figure 4c second audio hole 415). According to an embodiment, the electronic device may include a first audio duct member (e.g., Figure 9 first audio duct member 453), the first audio duct member being coupled to the housing and extending from the first audio hole within the first region to transmit audio output from the speaker through the first audio hole to the outside of the electronic device. According to an embodiment, the electronic device may include a second audio duct member (e.g., Figure 9 second audio duct member 454), the second audio duct member being coupled to the housing and extending from the second audio hole within the first region to the second region to transmit audio output from the speaker through the second audio hole to the outside of the electronic device and being separated from the first audio duct member. According to an embodiment, the sensor may be disposed between the first audio duct member and the second audio duct member.

[0198] According to an embodiment, since the first audio duct member extends from the first audio hole and the second audio duct member extends from the second audio hole, the electronic device may provide a structure in which the length of the first audio path and the length of the second audio path can be easily changed during manufacture of the electronic device.

[0199] According to an embodiment, the audio output from the speaker through the second audio hole may be transmitted to the outside of the electronic device independently of the audio output from the speaker through the first audio hole.

[0200] According to an embodiment, since the first audio hole and the second audio hole are separated from each other, the electronic device may provide a structure in which the length of the first audio path and the length of the second audio path can be easily changed during manufacture of the electronic device.

[0201] According to an embodiment, the electronic device may further include a display including a notch (e.g., Figure 4a , Figure 4b and Figure 4c notch 422), and is disposed on a surface of the support member. According to an embodiment, the notch may be disposed on a part of the first audio duct member and a part of the second audio duct member.

[0202] According to an embodiment, the electronic device may provide audio to the outside of the electronic device from a first audio path and a second audio path through the notch provided in the display.

[0203] According to an embodiment, the first audio duct member may include a first output hole (e.g., Figure 9 first output hole 453b), which penetrates a surface of the first audio duct member facing the direction in which the surface of the speaker faces. According to an embodiment, the second audio duct member may include a second output hole (e.g., Figure 9 second output hole 454b), which penetrates a surface of the second audio duct member facing the direction in which the surface of the speaker faces.

[0204] According to an embodiment, the electronic device may provide a structure capable of sending audio from the speaker to the outside through the first output hole and the second output hole.

[0205] According to an embodiment, the support member may include a surface supporting the display and another surface opposite to the surface, a first emission hole extending from the surface to the other surface (e.g., Figure 9 first emission hole 418a), and a second emission hole extending from the surface to the other surface and separated from the first emission hole (e.g., Figure 9 second emission hole 418b). According to an embodiment, the first audio duct member and the second audio duct member may be disposed on the other surface of the support member.

[0206] According to an embodiment, the electronic device may provide a structure capable of transmitting audio from the speaker to the outside through the first emission hole and the second emission hole formed in the support member.

[0207] According to an embodiment, an electronic device may include a support member 410. According to an embodiment, the electronic device may include a speaker 451 disposed within the support member 410. According to an embodiment, the electronic device may include a first audio hole 414 disposed on a surface 451a of the speaker 451. According to an embodiment, the electronic device may include a second audio hole 415 disposed on the surface 451a of the speaker 451 and separated from the first audio hole 414. According to an embodiment, the electronic device may include a first audio path 416, one end 416a of which is connected to the first audio hole 414 and the other end 416b of which is connected to the outside of the electronic device, such that audio output through the first audio hole 414 is sent to the outside of the electronic device. According to an embodiment, the electronic device may include a second audio path 417 separated from the first audio path 416, one end 417a of which is connected to the second audio hole 415 and the other end 417b of which is connected to the outside of the electronic device, such that audio output through the second audio hole 415 is sent to the outside of the electronic device. According to an embodiment, a straight-line distance from one end 416a of the first audio path 416 to the other end 416b of the first audio path 416 may be different from a straight-line distance from one end 417a of the second audio path 417 to the other end 417b of the second audio path 417.

[0208] An electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the above-described electronic devices.

[0209] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described herein to specific embodiments, and include various changes, equivalents or substitutions of the corresponding embodiments. Regarding the description of the drawings, like reference numerals may be used to refer to like or related elements. It should be understood that unless the relevant context clearly indicates otherwise, the singular form of a noun corresponding to an item may include one or more things. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in the corresponding one of the phrases. As used herein, terms such as "first" and "second" or "primary" and "secondary" may be used simply to distinguish the corresponding components from another component, and do not limit the components in other respects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as being "coupled" or "connected" to another element (e.g., a second element), with or without the terms "operably" or "communicatively", it means that the element can be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0210] As used in connection with the various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic", "logic block", "component", or "circuit"). A module may be a single integrated component or its smallest unit or part suitable for performing one or more functions. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0211] The various embodiments described herein may be implemented as software (e.g., a program 140) including one or more instructions stored in a storage medium (e.g., an internal memory 136 or an external memory 138) readable by a machine (e.g., an electronic device 101). For example, a processor (e.g., a processor 120) of a machine (e.g., an electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute it under the control of the processor, with or without using one or more other components. This allows the machine to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Herein, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between the case where data is stored semi-permanently in the storage medium and the case where data is stored temporarily in the storage medium.

[0212] According to an embodiment, a method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or distributed online (e.g., downloaded or uploaded) via an app store (e.g., PlayStore™), or directly between two user devices (e.g., a smart phone). If distributed online, at least a part of the computer program product may be generated temporarily or stored at least temporarily in a machine-readable storage medium, such as the memory of a manufacturer's server, an app store's server, or a relay server.

[0213] According to various embodiments, each of the above components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as performed by a corresponding one of the multiple components before integration. According to various embodiments, operations performed by a module, a program, or another component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (101; 200 ； 400), comprising: A support member (410), including a first region (411) and a second region (412) spaced apart from the first region (411); A speaker (451), at least partially disposed in the first region (411); A first audio hole (414), disposed on the surface (451a) of the speaker (451); A second audio hole (415), disposed on the surface (451a) of the speaker (451), separated from the first audio hole (414); A first audio path (416), extending within the first region (411) from the first audio hole (415) to transmit audio output from the speaker (451) to the outside of the electronic device (101; 200; 400) through the first audio hole (414); and A second audio path (417), extending from the second audio hole (415) within the first region (411) to the second region (412) to transmit audio output from the speaker (451) to the outside of the electronic device (101; 200; 400) through the second audio hole (415), the second audio path (417) being separated from the first audio path (416).

2. The electronic device (101; 200; 400) according to claim 1, wherein, The audio output from the speaker (451) through the second audio hole (415) is transmitted to the outside of the electronic device (101; 200; 400) independently of the audio output from the speaker (451) through the first audio hole (414).

3. The electronic device (101; 200; 400) according to any one of claims 1 and 2, wherein, The first audio hole (414) and the second audio hole (415) penetrate the surface (410a) of the support member (410) that supports the display (420), and wherein the first audio path (416) and the second audio path (417) are disposed between the display (420) and the support member (410).

4. The electronic device (101; 200; 400) according to any one of claims 1 to 3, further comprising a display (420), including a notch (422) and disposed on the surface (410a) of the support member (410), and wherein, The notch (422) is disposed at one end of the first audio path (416) and one end of the second audio path (417).

5. The electronic device (101; 200; 400) according to any one of claims 1 to 4, further comprising: A sensor (430), disposed between the first region (411) and the second region (412), surrounded by the first audio path (416) and the second audio path (417); and A display (420), disposed on the surface (410a) of the support member (410), and wherein the support member (410) further includes a cover portion (413) surrounding the sensor (430), Among them, the cover part (413) separates the first audio path (416) and the second audio path (417) by extending between the first audio hole (414) and the second audio hole (415) on the surface (410a) of the support member (410).

6. The electronic device (101; 200 ； 400) according to any one of claims 1 to 5, further comprising: A display (420) provided on the surface (410a) of the support member (410); and A waterproof member (440) provided between the display (420) and the support member (410), surrounding the first audio path (416) and the second audio path (417), and wherein, the second audio path (417) is defined by the cover part (413) and the waterproof member (440).

7. The electronic device (101; 200; 400) according to any one of claims 1 to 6, further comprising a sensor provided between the first area (411) and the second area (412), surrounded by the first audio path (416) and the second audio path (417), and wherein, The support member (410) includes an opening (413a) penetrating the support member (410), which overlaps with the sensor (430) when the support member (410) is viewed from above.

8. The electronic device (101; 200; 400) according to any one of claims 1 to 7, further comprising a partition wall provided in at least one of the first audio path (416) or the second audio path (417).

9. The electronic device (101; 200; 400) according to any one of claims 1 to 8, further comprising an absorption member (417c) provided in at least one of the first audio path (416) or the second audio path (417).

10. The electronic device (101; 200; 400) according to any one of claims 1 to 9, wherein, The second audio path (417) includes an acoustic space (417d) provided between one end of the second audio path (417) connected to the second audio hole (415) and the other end of the second audio path (417) opposite to the said one end of the second audio path (417).

11. The electronic device (101; 200; 400) according to any one of claims 1 to 10, comprising: A housing (452) that houses a speaker (451) and includes a first audio hole (414) and a second audio hole (415); and A first audio duct member (453) coupled to the housing (452) and surrounding the first audio path (416); and A second audio duct member (454) coupled to the housing (452) and surrounding the second audio path (417).

12. The electronic device (101; 200; 400) according to any one of claims 1 to 11, wherein, The first audio pipeline member (453) includes a first output hole (453a) that penetrates the surface (453a) of the first audio pipeline member (453), and the surface (453a) faces the direction in which the surface (451a) of the speaker (451) faces, and wherein the second audio pipeline member (454) includes a second output hole (453b) that penetrates the surface of the second audio pipeline member (454), and the surface faces the direction in which the surface (451a) of the speaker (451) faces.

13. The electronic device (101; 200; 400) according to any one of claims 1 to 12, wherein, the support member (410) includes: a surface (410a) that supports the display (420); another surface (410b) that is opposite to the surface (410a); a first emission hole (418a) that extends from the surface (410a) to the another surface (410b); and a second emission hole (418b) that extends from the surface (410a) to the another surface (410b) and is separated from the first emission hole (418a), and wherein the first audio pipeline member (453) and the second audio pipeline member (454) are provided on the another surface (410b) of the support member (410).

14. The electronic device (101; 200; 400) according to any one of claims 1 to 13, further comprising: a first waterproof member (441) provided between the another surface (410b) of the support member (410) and the first audio pipeline member (453); and a second waterproof member (442) provided between the another surface (410b) of the support member (410) and the second audio pipeline member (454).

15. The electronic device (101; 200; 400) according to any one of claims 1 to 14, wherein, the support member (410) includes: a first receiving hole (419a) that extends from the surface (410a) of the support member (410) that supports the display (420) to the another surface (410b) of the support member (410) that is opposite to the surface (410a) of the support member (410), and houses the first audio pipeline member (453); and a second receiving hole (419b) that extends from the surface (410a) of the support member (410) to the another surface (410b) of the support member (410), houses the second audio pipeline member (454), and is separated from the first receiving hole (419a).

Images