Sealing resin for compression molding and method of forming same

Abstract

The present invention addresses the problem of providing: a sealing resin capable of realizing a compression molding device and a compression molding method capable of preventing the occurrence of molding defects; and a method for forming the sealing resin. As a solution, the sealing resin (R) of the present invention is used for compression molding of a workpiece (W) having a structure in which an electronic component (Wb) is mounted on a substrate (Wa), the sealing resin having a plate-shaped or block-shaped body part (Ra) and a leg part (Rb) vertically provided on one surface of the body part (Ra), and a shape that does not come into contact with the electronic component (Wb) when placed on the substrate (Wa).

Description

Technical Field

[0001] The present invention relates to a sealing resin for compression molding and a method for forming the same. Background Art

[0002] As an example of a resin sealing device and a resin sealing method for processing a workpiece having electronic components mounted on a substrate into a molded product by sealing with a sealing resin, an example using a compression molding method is known.

[0003] The compression molding method is a technique in which a predetermined amount of sealing resin is supplied to a sealing area (mold cavity) provided in a sealing mold including an upper mold and a lower mold, and a workpiece is disposed in the sealing area, and resin sealing is performed by an operation of clamping with the upper mold and the lower mold. As an example, a technique is known in which, when using a sealing mold having a mold cavity provided in the upper mold, the sealing resin is supplied to the central position on the workpiece all at once for molding. On the other hand, a technique is known in which, when using a sealing mold having a mold cavity provided in the lower mold, a release film (hereinafter, sometimes simply referred to as "film") covering the mold surface including the mold cavity and the sealing resin are supplied for molding (Patent Document 1: see Japanese Patent Laid-Open No. 2019-145550).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Laid-Open No. 2019-145550 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] For example, as a workpiece, in the case of resin-sealing a strip-shaped electronically connected electronic component (semiconductor chip), in the compression molding method in which a mold cavity is provided in the upper mold, the wire portion of the workpiece held by the lower mold comes into contact with the sealing resin previously supplied to the mold cavity or the sealing resin supplied to the workpiece and is deformed, so there is a problem that resin sealing is difficult. Therefore, generally, a compression molding method is adopted in which the workpiece is held by the upper mold, a mold cavity is provided in the lower mold, and the sealing resin (as an example, granular resin) is supplied into the mold cavity.

[0009] However, in a structure where the upper mold holds the workpiece and the lower mold is provided with a cavity, in the case of a thin or large workpiece, there is a problem that it is difficult to hold the workpiece in the upper mold and it is easy to cause dropping. In addition, it is usually a structure in which a sealing resin is supplied to the cavity of the lower mold through a diaphragm, but if a thick molded product is to be formed to a thickness (here, the thickness of the resin part after molding) exceeding 1 mm, there is a problem that the molding stroke becomes large and the film bites into the molded product, easily causing molding defects. Furthermore, when using granular resin as the sealing resin, the film biting is likely to occur. In addition, there are not only problems of generating dust or being difficult to handle, but also problems of being difficult to evenly supply (disperse) the sealing resin to the entire area of the cavity provided in the lower mold, easily causing uneven dispersion. In addition, when dispersing the sealing resin, the air contained in the gaps between the particles cannot be discharged and remains in the molded product, easily causing molding defects. Especially in the case of a workpiece having an electronic component mounted by wire connection, there may also be wire flow (deformation or cutting of the wire) caused by the resin flow in the cavity during resin sealing.

[0010] Technical means for solving the problem

[0011] The present invention is made in view of the above situation, and its object is to provide a sealing resin that is easy to handle and can realize a compression molding device and a compression molding method, and the compression molding device and the compression molding method can solve the above problems in a structure where a cavity is provided in the upper mold and a cavity is provided in the lower mold, prevent molding defects caused by resin flow, uneven dispersion, residual air, and dust generation, and form a molded product with a large thickness dimension.

[0012] The present invention solves the above problems by means of the following solutions as an embodiment.

[0013] A sealing resin according to an embodiment is a sealing resin for compression molding of a workpiece, and the sealing resin has a structure in which an electronic component is mounted on a substrate. The essential condition of the sealing resin is that it is formed into a shape that does not contact the electronic component when placed on the substrate. As an example, the sealing resin has a plate-shaped or block-shaped main body portion and a leg portion erected on one surface of the main body portion. Therefore, for example, for a workpiece having a belt-shaped electronic component (semiconductor chip) connected by wire, resin sealing can also be performed by a compression molding method in which a cavity is provided in the upper mold.

[0014] In addition, the feet are vertically provided at positions where they do not contact the electronic components when placed on the base material, and are formed to have a height that can ensure a distance where the main body portion does not contact the electronic components. Specifically, the feet are formed as convex bodies arranged in a dot shape in whole or in part. Alternatively, the feet are formed as convex bodies arranged in a line shape in whole or in part. Alternatively, the feet are formed as convex bodies arranged in a manner that continuously or intermittently surrounds the entire outer peripheral region.

[0015] In addition, there is a linear groove portion that is provided through the other surface of the main body portion and serves as a cutting position.

[0016] In addition, a method for forming a sealing resin according to an embodiment forms a sealing resin for compression molding of a workpiece having a structure in which electronic components are mounted on a base material. A prerequisite for the method for forming the sealing resin is that it includes a forming process. In the forming process, it is formed into a shape having a plate-shaped or block-shaped main body portion and feet vertically provided on the main body portion. The forming process has the following process: The position and height of the feet are set so that neither the feet nor the main body portion contacts the electronic components when the sealing resin is placed on the base material.

[0017] Effects of the Invention

[0018] With the sealing resin of the present invention, a compression molding device and a compression molding method can be realized. The compression molding device and the compression molding method can solve the above problems in a structure having a cavity provided in the upper mold and a cavity provided in the lower mold, prevent the occurrence of molding defects caused by resin flow, uneven dispersion, residual air, and dust generation, and form a molded product with a large thickness dimension. In addition, compared with granular resin, etc., the handling during supply or installation becomes easier. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Figure 1 is a plan view showing an example of a compression molding device using the sealing resin of the embodiment of the present invention.

[0020] Figure 2 Figure 2 is a side view showing an example of a pressing device of the compression molding device of Figure 1 .

[0021] Figure 3 Figure 3 is a front sectional view showing an example of a sealing mold of the compression molding device of Figure 1 .

[0022] Figure 4 Figure 4 ​​​​​​​​This is an explanatory diagram of a compression molding method using a Figure 1 compression molding device.

[0023] Figure 5 Figure 5 A is an enlarged view of part V in Figure 4 . Figure 5 B is an explanatory diagram following Figure 5 A.

[0024] Figure 6 Figure 6 This is an explanatory diagram following Figure 5 B.

[0025] Figure 7 Figure 7 This is an explanatory diagram following Figure 6 .

[0026] Figure 8 Figure 8 This is a perspective view showing an example of the sealing resin according to the embodiment of the present invention.

[0027] Figure 9 Figure 9 This is a perspective view showing another example of the sealing resin according to the embodiment of the present invention.

[0028] Figure 10 Figure 10 This is a perspective view showing another example of the sealing resin according to the embodiment of the present invention.

[0029] Figure 11 Figure 11 This is a perspective view showing another example of the sealing resin according to the embodiment of the present invention. Detailed Embodiment

[0030] (Overall Structure)

[0031] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 This is a plan view (schematic diagram) showing an example of the compression molding device 1 using the sealing resin R of this embodiment. In addition, for ease of explanation, the left - right direction (X - direction), front - rear direction (Y - direction), and up - down direction (Z - direction) of the compression molding device 1 are indicated by arrows in the figure. Also, in all the figures used to explain each embodiment, components having the same function are labeled with the same reference numerals, and repeated explanations thereof may be omitted.

[0032] ​​​​​​​​​​​​​​The compression molding device 1 is a device for resin-sealing (compression molding) a workpiece (product to be molded) W using a sealing mold 202 including an upper mold 204 and a lower mold 206. One or more workpiece holding parts 205 for holding the workpiece W are provided on the lower mold 206. On the upper mold 204, one or more mold cavities 208 are provided according to the shape or number of the workpiece W. The film F is adsorbed and held in the mold cavity 208. However, the structure is not limited to the above.

[0033] First, the workpiece W to be molded has a structure in which electronic components Wb are mounted on a base material Wa. More specifically, as an example of the base material Wa, plate-like members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers can be cited. In addition, as an example of the electronic component Wb, semiconductor chips, micro-electromechanical system (MEMS) chips, passive components, heat sinks, conductive members, gaskets, etc. can be cited. In addition, the shape of the base material Wa is a rectangular shape (long strip shape), a square shape, a circular shape, etc. In addition, the number of electronic components Wb mounted on one base material Wa is set to one or more (for example, in a matrix shape, etc.).

[0034] As an example of a method for mounting the electronic component Wb on the base material Wa, methods such as wire bonding packaging and flip chip packaging can be cited. Alternatively, in the case of a structure in which the base material (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method of attaching the electronic component Wb using a thermally peelable adhesive tape or an ultraviolet curable resin that cures by ultraviolet irradiation.

[0035] In the present embodiment, as the sealing resin R, a thermosetting resin (for example, a filler-containing epoxy resin, etc., but not limited thereto) and a solid / semi-solid resin having a specified shape corresponding to the shape of the workpiece W as a whole (details will be described later) are used. Usually, a "whole" corresponding to the amount required for forming a seal once (the amount per workpiece W) is used, but it can also be configured to form a "whole" corresponding to the amount required for forming a seal in a divided state of several (for example, two or three). In addition, the so-called "semi-solid" means a state that is not in a completely solid state but is melted to the so-called B stage.

[0036] In addition, as an example of the film F, a film material excellent in heat resistance, ease of peeling, flexibility, and stretchability is preferably used, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, and the like.

[0037] Next, an outline of the compression molding apparatus 1 using the sealing resin R of the present embodiment will be described. As Figure 1 shown, the compression molding apparatus 1 includes the following parts as main structures: a supply unit 100A that supplies the workpiece W and the like; a pressing unit 100B that performs resin sealing on the workpiece W to process the molded product Wp and the like; and a storage unit 100C that stores the molded product Wp and the like. As an example, along Figure 1 the X direction in, the supply unit 100A, the pressing unit 100B, and the storage unit 100C are arranged in sequence. However, it is not limited to the above structure, and the equipment structure or the number of units (especially the number of pressing units) in the unit, the arrangement order of the units, etc. can be changed. In addition, it can also be set to a structure including units other than the above (not shown in all cases).

[0038] In addition, the compression molding apparatus 1 includes a resin supply unit 120 that supplies the sealing resin R. As an example, the resin supply unit 120 is arranged in the supply unit 100A, but it can also be set to a structure arranged in the storage unit 100C or the pressing unit 100B (not shown). Alternatively, as another example, it can also be set to a structure in which the resin supply unit 120 is arranged outside the compression molding apparatus 1 and is transported into the apparatus using a transport device such as a belt conveyor or a robot (not shown).

[0039] In addition, in the compression molding apparatus 1, a guide rail 300 is linearly provided across the respective units, and a transport device (first loader) 302 that transports the workpiece W and the sealing resin R, and a transport device (second loader) 304 that transports the molded product Wp are provided so as to be able to move between the specified units along the guide rail 300. However, it is not limited to the above structure, and it can also be set to a structure including a common (one) transport device (loader) that transports the workpiece W, the sealing resin R, and the molded product Wp (not shown). In addition, the transport device can also be set to a structure including a robot or the like instead of a loader.

[0040] In addition, in the compression molding apparatus 1, a control unit 150 that controls the operation of each mechanism in each unit is disposed in the supply unit 100A (it may also be configured to be disposed in other units).

[0041] (Supply Unit)

[0042] Next, the supply unit 100A included in the compression molding apparatus 1 will be described in detail.

[0043] The supply unit 100A includes a supply cassette 102 for storing a plurality of workpieces W. Here, as the supply cassette 102, a known stacked cassette, a slit cassette, or the like is used.

[0044] In addition, the supply unit 100A may also be configured to include a workpiece stage (not shown) for placing the workpiece W taken out from the supply cassette 102. Further, the supply unit 100A may also be configured to include a resin stage (not shown) for placing the sealing resin R supplied from the resin supply unit 120.

[0045] The workpiece W and the sealing resin R are held by the first loader 302 and transported to the pressing unit 100B, and are installed at a specified position of the sealing die 202. In the present embodiment, the workpiece W is held by the workpiece holding portion 205 of the lower die 206, and the sealing resin R is placed above the workpiece W held by the workpiece holding portion 205 (details of the process will be described later). In addition, the holding mechanism for the workpiece W and the sealing resin R in the first loader 302 uses a known holding mechanism (for example, a structure having holding claws for clamping, a structure having suction holes communicating with a suction device for adsorption, etc.) (not shown).

[0046] As a modification example of the transfer device, the following structure (not shown) may also be adopted: instead of the first loader 302 that moves in the X direction and the Y direction, a transfer device (loader) that moves in the X direction for inter-unit transfer and a transfer device (loader) that moves in the Y direction for loading and installing into the sealing die 202 are respectively included.

[0047] In addition, the supply unit 100A includes a preheating heater (not shown) for preheating the workpiece W or the sealing resin R. As an example, the preheating heater uses a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.). Thus, preheating can be performed in advance before the workpiece W or the sealing resin R is transferred into the sealing die 202. In addition, a structure not including a preheating heater may also be adopted. Further, the following structure may also be adopted: instead of the preheating heater, a heater for preheating (not shown) is included in the first loader 302, or a heater for preheating (not shown) and a preheating heater are included in the first loader 302.

[0048] (Pressing Unit)

[0049] Next, the pressing unit 100B included in the compression molding device 1 will be described in detail. Here, a side view (schematic view) of the pressing device 250 provided in the pressing unit 100B is shown in Figure 2 and a front sectional view (schematic view) of the sealing die 202 is shown in Figure 3 .

[0050] The pressing unit 100B includes a sealing die 202 having a pair of molds that open and close (for example, a mold composed of a plurality of mold blocks, a mold plate, a mold column, etc. made of alloy tool steel or other members). In addition, it includes a pressing device 250 that drives the sealing die 202 to open and close to resin-seal the workpiece W. As an example, a structure including one pressing device 250 is provided, and a structure including multiple pressing devices (not shown) may also be provided.

[0051] Here, as shown in Figure 2 , the pressing device 250 includes a pair of platens 254 and 256, a plurality of tie rods 252 that support the pair of platens 254 and 256, and a driving device that moves the platen 256 (lifts and lowers). Specifically, the driving device includes a driving source (for example, an electric motor) 260 and a drive transmission mechanism (for example, a ball screw or a toggle mechanism) 262, etc. (however, it is not limited thereto). In the present embodiment, the platen 254 on the upper side in the vertical direction is set as the fixed platen (the platen fixed to the tie rod 252), and the platen 256 on the lower side is set as the movable platen (the platen that can slide on the tie rod 252 and move up and down). However, it is not limited thereto, and it may be reversed up and down, that is, the upper side is set as the movable platen and the lower side is set as the fixed platen, or both the upper side and the lower side may be set as movable platens (not shown).

[0052] On the other hand, as shown in Figure 3 , the sealing die 202 includes one of the upper molds (upper die 204) on the upper side in the vertical direction and the other lower mold (lower die 206) on the lower side as a pair of molds disposed between the pair of platens 254 and 256 in the pressing device 250. That is, the upper die 204 is assembled to the upper platen (the fixed platen 254 in the present embodiment), and the lower die 206 is assembled to the lower platen (the movable platen 256 in the present embodiment). The mold is closed / opened by the upper die 204 and the lower die 206 approaching / separating from each other (the vertical direction (up and down direction) becomes the mold opening / closing direction).

[0053] In addition, in the present embodiment, as an example, a film supply mechanism (not shown) for transporting (feeding) the roll-shaped film F into the inside of the sealing die 202 is provided. In addition, depending on the structure of the workpiece W, a long strip-shaped film may sometimes be used instead of the roll-shaped film F.

[0054] Next, the upper die 204 of the sealing die 202 will be described in detail. As Figure 3 shown, the upper die 204 includes an upper die groove 210, a cavity mold member 226 held therein, a clamp 228, and the like. The upper die groove 210 is fixed to the lower surface of the support plate 214 via the support columns 212. A cavity 208 is provided on the lower surface (the surface on the lower die 206 side) of the upper die 204.

[0055] The clamp 228 is configured in a ring shape so as to surround the cavity mold member 226, and is assembled in such a manner that it can move up and down relative to the lower surface of the support plate 214 via the push pin 222 and the clamping spring (for example, a biasing member exemplified by a coil spring) 224 so as to be separable (floating) (however, it is not limited to the described assembly structure). The cavity mold member 226 constitutes the inside (bottom) of the cavity 208, and the clamp 228 constitutes the side portion of the cavity 208. In addition, the shape or number of the cavities 208 provided in one upper die 204 is appropriately set (one or more) according to the shape or number of the workpieces W.

[0056] In addition, a suction path (holes or grooves, etc.) communicating with the suction device is provided at the boundary portion or the like of the clamp 228 or the cavity mold member 226 (not shown). Thereby, the film F supplied from the film supply mechanism can be adsorbed and held on the mold surface 204a including the inner surface of the cavity 208. In addition, degassing in the cavity 208 can be performed when the mold is closed for resin sealing.

[0057] In addition, in the present embodiment, an upper die heating mechanism (not shown) for heating the upper die 204 to a predetermined temperature is provided. The upper die heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 150. As an example, the heater is built into the upper die groove 210 and heats the entire upper die 204 and the sealing resin R accommodated in the cavity 208. Heating is performed by the heater so that the upper die 204 becomes a predetermined temperature (for example, 100°C to 300°C).

[0058] Next, the lower die 206 of the sealing die 202 will be described in detail. As Figure 3 shown, the lower die 206 includes a lower die groove 240, a lower plate 242 held therein, and the like.

[0059] In addition, in the present embodiment, a workpiece holding portion 205 is provided for holding the workpiece W at a specified position on the upper surface of the lower plate 242. As an example, the workpiece holding portion 205 has a workpiece guide pin (not shown) and a suction path (such as a hole or a groove) (not shown) that penetrates the lower plate 242 and is connected to a suction device. Specifically, one end of the suction path passes through the die surface 206a of the lower die 206, and the other end is connected to a suction device disposed outside the lower die 206. Thus, the suction device can be driven to suck the workpiece W from the suction path, and the workpiece W can be adsorbed and held on the die surface 206a (here, the upper surface of the lower plate 242). It may also be configured as follows: including holding claws (not shown) that clamp the outer periphery of the workpiece W instead of the adsorption holding mechanism, or including holding claws (not shown) that clamp the outer periphery of the workpiece W and an adsorption holding mechanism. In addition, the shape or number of the workpiece holding portions 205 provided on one lower die 206 is appropriately set according to the shape or number of the workpieces W (one or more).

[0060] In addition, in the present embodiment, a lower die heating mechanism (not shown) is provided for heating the lower die 206 to a specified temperature. The lower die heating mechanism includes a heater (such as an electric wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control unit 150. As an example, the heater is built into the lower die groove 240 and is configured to heat the entire lower die 206 and the workpiece W held by the workpiece holding portion 205. The heater is used for heating so that the lower die 206 reaches a specified temperature (for example, 100°C to 300°C).

[0061] (Storage unit)

[0062] Next, the storage unit 100C included in the compression molding device 1 will be described in detail.

[0063] The molded product Wp is held by the second loader 304 and carried out from the sealing die 202, and then carried to the storage unit 100C. In addition, the holding mechanism of the molded product Wp in the second loader 304 uses a known holding mechanism (for example, a structure having holding claws for clamping, a structure having a suction hole connected to a suction device for adsorption, etc.) (not shown).

[0064] As a modification of the transfer device, it may also be configured as follows (not shown): instead of the second loader 304 that moves in the X direction and the Y direction, a transfer device (loader) that moves in the X direction for inter-unit transfer and a transfer device (loader) that moves in the Y direction for carrying out from the sealing die 202 are respectively included.

[0065] The storage unit 100C includes a storage cartridge 104 for storing a plurality of molded products Wp. Here, the storage cartridge 104 uses a known stacked cartridge, slit cartridge, etc.

[0066] In addition, the storage unit 100C may also be configured to include a molded product stage (not shown) for placing the molded product Wp conveyed from the compression unit 100B, etc.

[0067] (Resin sealing operation)

[0068] Next, the operation (i.e., the compression molding method) of resin sealing (compression molding) using the compression molding device 1 will be described. Here, Figures 4 - 7 are explanatory diagrams of each process, and are shown as front sectional views in the same direction as Figure 3 and are shown as front sectional views in the same direction.

[0069] First, as a preparation process, a heating process (upper mold heating process) of adjusting the upper mold 204 to a specified temperature (e.g., 100°C to 300°C) and heating it is performed by the upper mold heating mechanism. In addition, a heating process (lower mold heating process) of adjusting the lower mold 206 to a specified temperature (e.g., 100°C to 300°C) and heating it is performed by the lower mold heating mechanism. In addition, a film installation process of operating the film supply mechanism to install a new film F in the sealing mold 202 is performed.

[0070] A resin preparation process is performed before, after, or in parallel with the preparation process. In the resin preparation process, a solid / semi-solid resin having a specified shape (described later) whose overall shape corresponds to the shape of the workpiece W is prepared as the sealing resin R for sealing.

[0071] Next, a workpiece holding process of holding the workpiece W in the workpiece holding portion 205 of the lower mold 206 is performed. Specifically, the workpiece W supplied from the supply cassette 102 is held by the first loader 302 and the workpiece W is carried into the sealing mold 202 and held in the workpiece holding portion 205.

[0072] After the workpiece holding process, a resin placement process is performed. In the resin placement process, the sealing resin R prepared in the resin preparation process is placed above the workpiece W held in the workpiece holding portion 205 (refer to Figure 4 ). Specifically, the sealing resin R supplied from the resin supply unit 120 is held by the first loader 302 and carried into the sealing mold 202 and placed above the workpiece W held in the workpiece holding portion 205.

[0073] Alternatively, as another example of the resin placement process, it can also be implemented as a process of placing the sealing resin R prepared in the resin preparation process above the workpiece W before the workpiece holding process. In this case, the workpiece holding process becomes a process of holding the workpiece W in a state where the sealing resin R is placed on the workpiece holding portion 205. That is, the first loader 302 holds the workpiece W in a state where the sealing resin R is placed thereon and transfers the workpiece W into the sealing mold 202 and holds it on the workpiece holding portion 205. It has the following advantages: The workpiece W and the sealing resin R are transferred into the sealing mold 202 at one time, rather than being transferred into the sealing mold 202 separately.

[0074] Next, a process of sealing the workpiece W with the sealing resin R to process it into a molded product Wp is implemented. First, the sealing mold 202 is closed, and the cavity mold member 226 is relatively lowered in the cavity 208 to perform a mold closing process of heating and pressing the sealing resin R on the workpiece W. As a result, the sealing resin R is thermoset to complete resin sealing (compression molding) (refer to Figure 6 ).

[0075] As described above, for example, in an existing compression molding device with a cavity provided in the upper mold, when performing the mold closing process on a workpiece W such as a workpiece W carrying a belt-shaped electronically connected electronic component (semiconductor chip) Wb, the wire portion of the workpiece held on the lower mold comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied to the workpiece and is deformed, so there is a problem that resin sealing is difficult. Therefore, for such a workpiece W, a compression molding device with a cavity provided in the lower mold is generally used. However, even with a structure having a cavity provided in the lower mold, there are still the previous problems (described above).

[0076] To address the above problems, the compression molding device 1 adopts a structure with a cavity 208 provided in the upper mold 204, and a structure using a solid / semi-solid resin formed into a specified shape corresponding to the shape of the workpiece W as the sealing resin R, thereby being able to solve the above problems.

[0077] The so-called "specified shape" of the sealing resin R is a shape that does not come into contact with the electronic component Wb (the electronic component Wb with wires includes the wires) when placed on the base material Wa of the workpiece W. As an example, as Figure 4As shown, a main body Ra having a plate or block shape and a leg Rb intermittently (or continuously) erected on one of the faces of the main body Ra (the face facing the electronic component Wb of the workpiece W) are provided (however, the shape is not limited to the above shape). The main body Ra is sized to fit into the cavity 208 when viewed from above, and if the resin flow is taken into consideration, it is preferably sized slightly smaller than the shape of the cavity 208 (particularly the cavity mold 226). In addition, the leg Rb needs to have a height H (refer to FIG. 1 ) that does not abut against the electronic component Wb. Figure 5 A), but does not exclude contact to the extent that the wire does not undergo plastic deformation. In addition, the leg portion Rb is arranged at a position where it does not abut against the electronic component Wb when the main body Ra is viewed from above and at a position where the main body Ra does not tilt when placed on the workpiece W. Furthermore, it is preferably arranged between the electronic components Wb or at the outer periphery of the electronic components Wb so as not to damage the wiring (especially the wires) of the workpiece W during molding. In addition, the total amount of resin of the plate-shaped or block-shaped main body Ra and the leg portion Rb may be a complete amount of resin to the extent that it is less than that required for one-time compression molding, or may be a larger amount of resin. Regarding a specific structural example of the sealing resin R ( Figures 8 - 11 ) will be described in detail later.

[0078] Through the structure, during the implementation of the mold closing process, such as Figure 5 ATransfer to Figure 5 B, the softening and melting of the sealing resin R by heating progresses (in addition, Figure 5 A. Figure 5 B as Figure 4 At this time, the resin (specifically, the main body Ra) is in uniform contact with all the wires (see Figure 5 B) As a result, the effect of suppressing the flow of the conductor can be obtained.

[0079] In fact, the inventor of the present application conducted an experiment using the sealing resin R of the present embodiment in the compression molding device 1. As a result, it was confirmed that the flow of the wire was suppressed and the molding quality was improved, compared with the existing compression molding device in which the workpiece was held in the upper mold, a cavity was provided in the lower mold, and a sealing resin (specifically, a granular resin) was supplied to the cavity.

[0080] Furthermore, by using a solid / semi-solid resin as the sealing resin R, it is possible to solve the problems of uneven distribution, residual air, dust, or difficulty in handling caused by the granular resin as before. In addition, even when a molded product having a thickness exceeding 1 mm is formed, the film F can be prevented from biting into the molded product Wp.

[0081] In addition, the process following the mold closing process is the same as the previous compression molding method. As a rough outline, the mold opening of the sealed mold 202 is performed to implement the mold opening process of separating the molded product Wp from the used film F (refer to Figure 7 ). Next, a molded product unloading process is performed in which the molded product Wp is unloaded from the sealing mold 202 and unloaded to the storage unit 100C by the second loader 304. Furthermore, after the molded product unloading process or in parallel, a film installation process is performed in which the film supply mechanism is operated to deliver the used film F from the sealing mold 202 and a new film F is delivered into the sealing mold 202.

[0082] The above are the main steps of the compression molding method using the compression molding apparatus 1. However, the above-mentioned order of steps is an example, and the order can be changed or carried out in parallel as long as there is no problem.

[0083] Next, a specific structure of the sealing resin R used in the compression molding method using the compression molding device 1 is shown in FIG. Figures 8 - 11 and explain their respective characteristics.

[0084] First, as a Figures 8 - 11 The structure common to each of the examples shown is that the main body Ra is formed into a plate shape (in addition, it can also be made into a shape other than a plate shape, such as a block shape with a concave portion or a convex portion, etc.). In addition, the leg portion Rb is erected on the main body Ra in a manner such that it is located at a position that does not abut against the electronic component Wb of the workpiece W when the sealing resin R is placed at a predetermined position (designed setting position) on the substrate Wa of the workpiece W, and is formed to a height H (refer to Figure 5 A).

[0085] exist Figure 8 In the example of the sealing resin R shown, the foot Rb is formed as a convex body Rb1 that is arranged in a dotted manner in its entirety (or may be a part thereof). As an example of the convex body Rb1, it is arranged at multiple positions and is formed into a shape in which the ratio t of the length L1 to the width W1 is, as an example, 0.5≦t≦2 when viewed from above. Accordingly, by forming the foot Rb into a columnar structure that is arranged in a dotted manner, the sealing resin R placed on the workpiece W can be suppressed from flowing during compression molding. Therefore, the flow of the wire can be suppressed, and the molding quality can be improved.

[0086] exist Figure 9In the example of the sealing resin R shown, the leg portion Rb is formed as a convex body Rb2 that is partially (or entirely) arranged in a linear shape. As an example of the convex body Rb2, it is disposed at one position (or multiple positions), and is formed into a shape where the ratio t of the length L2 to the width W2 is, for example, t < 0.5 or 2 < t when viewed from above. Thus, resin flow can be intentionally generated from the leg portion Rb having a dike-like structure with a specified length (in this case, the convex body Rb2), thereby promoting the filling of the sealing resin R into the narrow portion of the workpiece W (such as between the substrate Wa and the electronic component Wb connected by flip chip bonding, etc.). Therefore, air can be prevented from remaining in the molded product Wp, and the molding quality can be improved.

[0087] In Figure 10 In the example of the sealing resin R shown, the leg portion Rb is formed as a convex body Rb3 that is arranged to intermittently (or continuously) surround the entire outer periphery (referring to the outer edge region) of the main body portion Ra. As an example of the convex body Rb3, convex bodies having the same structure as the Rb2 are provided with a gap L3 at a specified interval and are connected in a circumferential shape. Generally, the outer peripheral position of the sealing resin R in the molded product Wp is the position cut by a slicing machine or the like during singulation, and there is no electronic component Wb. Therefore, more resin for sealing is required compared to the central position. Thus, as described above, by pre-providing the leg portion Rb (in this case, the convex body Rb3) arranged to surround the entire outer periphery, resin flow during compression molding can be suppressed, and more resin can be supplied to the outer peripheral position. Furthermore, by providing the gap L3, the discharge of gas components such as air from the inside (central portion) to the outside is promoted.

[0088] On the other hand, Figure 11 The example of the sealing resin R shown is a structural example related to the other surface of the main body portion Ra (the surface on the side where the leg portion Rb is not provided, that is, the side not facing the electronic component Wb of the workpiece W). Specifically, the main body portion Ra has a linear groove Rg formed at the position where cutting for singulation is performed on the other surface. Thus, reduction of wear of the cutting edge and reduction of dust generated during cutting can be achieved. In addition, as an example of the groove portion Rg, it is provided in a grid shape in accordance with the cutting position, but is not limited thereto.

[0089] In addition, regarding the formation of the above-mentioned Figures 8 - 11The method of sealing resin R illustrated in the example (i.e., the "method for forming sealing resin R" of the present embodiment) is constituted by including the following common steps. Specifically, it includes a forming step, in which a main body Ra having a plate-like or block-like shape and a leg Rb vertically arranged on the main body Ra are formed, and in the forming step, when the sealing resin R is placed at a predetermined position (designed setting position) on the substrate Wa of the workpiece W, the position and height of the leg Rb are set in such a way that the leg Rb and the main body Ra do not abut against the electronic component Wb of the workpiece W, thereby forming the sealing resin R.

[0090] As described above, if the sealing resin R of this embodiment is used, a compression molding device and a compression molding method can be realized, which can solve the above-mentioned problems in the structure in which the upper mold is provided with a cavity and the lower mold is provided with a cavity, prevent the occurrence of poor molding caused by resin flow, uneven distribution, residual air, and dust generation, and form a molded product with a large thickness. In addition, compared with granular resins, etc., it becomes easy to handle, especially when supplying or installing.

[0091] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

Claims

1. A sealing resin for compression molding of a workpiece, characterized in that the sealing resin has: A plate-shaped or block-shaped body portion; and A leg portion erected on one surface of the body portion.

2. A sealing resin for compression molding of a workpiece having a structure in which electronic components are mounted on a substrate, characterized in that It is formed into a shape that does not contact the electronic components when placed on the substrate.

3. The sealing resin according to claim 2, Characterized in that It has: a plate-shaped or block-shaped body portion; and A leg portion erected on one surface of the body portion and contacting the substrate, The leg portion is erected at a position that does not contact the electronic components when placed on the substrate, and is formed to have a height that can ensure a distance at which the body portion does not contact the electronic components.

4. The sealing resin according to claim 1 or 3, Characterized in that The leg portion is formed into a convex body arranged in a dot shape in whole or in part.

5. The sealing resin according to claim 1 or 3, Characterized in that The leg portion is formed into a convex body arranged in a line shape in whole or in part.

6. The sealing resin according to claim 1 or 3, Characterized in that The leg portion is formed into a convex body arranged in a manner that continuously or intermittently surrounds the entire outer peripheral region.

7. The sealing resin according to claim 1 or 3, Characterized in that It has a linear groove portion that penetrates through the other surface of the body portion and serves as a cutting position.

8. A method for forming a sealing resin, for forming a sealing resin for compression molding of a workpiece having a structure in which electronic components are mounted on a substrate, characterized in that the method for forming the sealing resin includes a forming process, In the forming process, it is formed into a shape having a plate-shaped or block-shaped body portion and a leg portion erected on the body portion, The forming process has the following process: setting the position and height of the leg portion so that neither the leg portion nor the body portion contacts the electronic components when the sealing resin is placed on the substrate, and then forming.

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