Polishing equipment for semiconductor surface

Abstract

The invention discloses polishing equipment for the surface of a semiconductor, and relates to the technical field of semiconductor polishing, the polishing equipment comprises a device body and further comprises an adjusting device and a cooling device, the top of the device body is provided with a machining groove, and the top of the device body is fixedly provided with a lifting device; a mounting plate is fixedly mounted at the output end of the lifting device, a driving device is fixedly mounted at the top of the mounting plate, a grinding plate is fixedly mounted at the output end of the driving device, and a polishing plate is fixedly mounted at the output end of the rotating device; wherein the adjusting device comprises a storage frame and a control assembly, the control assembly comprises a baffle, a partition plate, a limiting plate, a sliding plate, a discharging pipe, a contact plate, a trapezoidal block, a sealing frame, a sealing plate, a bent rod, a cover plate and a rotating plate, and the storage frame is fixedly mounted at the top of the mounting plate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor polishing, and specifically to a polishing device for the surface of a semiconductor. Background Art

[0002] Semiconductor polishing is an important process step in semiconductor manufacturing, used to planarize and smooth the surface of semiconductor materials. Its main purpose is to remove surface defects, roughness, and contaminants of the material to improve the performance and reliability of the device.

[0003] The patent with the patent announcement number CN211220177U relates to a polishing device for semiconductor wafer production, specifically to the technical field of polishing devices, including a device body. A movable rod is fixedly installed on the top surface of the device body. A grinding head is integrally formed at the bottom end of the movable rod. A grinding sheet is fixedly installed at the top end of the grinding head. A support device is fixedly installed at the bottom end of the device body. A workbench is fixedly installed at the top end of the support device. A connecting plate is adhesively bonded to the surface of the support device. A support rod is integrally formed on the surface of the connecting plate. By setting an automatic liquid adding device, when an operator polishes a semiconductor crystal, the automatic liquid adding device drips the polishing liquid at regular intervals onto the surface of the semiconductor crystal, so that the operator does not need to be distracted to add the polishing liquid, and the operator can focus on grinding the semiconductor crystal wholeheartedly, which improves the processing quality of the device for producing semiconductor crystals and increases the practicability of the device.

[0004] In the above patent, by setting an automatic liquid adding device, when an operator polishes a semiconductor crystal, the automatic liquid adding device drips the polishing liquid at regular intervals onto the surface of the semiconductor crystal, so that the operator does not need to be distracted to add the polishing liquid, and the operator can focus on grinding the semiconductor crystal wholeheartedly, which improves the processing quality of the device for producing semiconductor crystals. However, when polishing the semiconductor, it is necessary to spray the polishing liquid, and after polishing, it is necessary to timely remove the excess polishing liquid and waste residues on the surface of the semiconductor. Since it is difficult to timely remove the excess polishing liquid and waste residues on the surface of the semiconductor, the polishing efficiency of the semiconductor will be affected.

[0005] Therefore, it is necessary to design a polishing device for the surface of a semiconductor that can improve the polishing efficiency of the semiconductor. Summary of the Invention

[0006] The purpose of the present invention is to provide a polishing device for the surface of a semiconductor to solve the problems raised in the above background art.

[0007] To solve the above technical problems, the present invention provides the following technical solutions: A polishing device for the surface of a semiconductor, including a device body, further including an adjusting device and a cooling device. Among them, a processing tank is provided at the top of the device body, a lifting device is fixedly installed at the top of the device body, an installation plate is fixedly installed at the output end of the lifting device, a driving device is fixedly installed at the top of the installation plate, a grinding plate is fixedly installed at the output end of the driving device, and a polishing plate is fixedly installed at the output end of the rotating device; Among them, the adjusting device includes a storage frame and a control component. The control component includes a baffle plate, a partition plate, a limiting plate, a sliding plate, a discharge pipe, a contact plate, a trapezoidal block, a sealing frame, a sealing plate, a bending rod, a cover plate and a rotating plate. The storage frame is fixedly installed at the top of the installation plate, the baffle plate is fixedly installed inside the storage frame, the partition plate is fixedly installed at the top of the baffle plate, the limiting plate is slidably installed at the bottom of the baffle plate, the sliding plate is fixedly installed on the surface of the limiting plate, the discharge pipe is fixedly installed at the bottom of the storage frame, the contact plate is fixedly installed at the top of the device body, through holes and notches are provided on the surface of the contact plate, the trapezoidal block is rotatably installed at the top of the through hole, the sealing frame is fixedly installed on the surface of the contact plate, the sealing plate is slidably installed on the inner wall of the sealing frame, the bending rod is fixedly installed at the top of the sealing plate, a ventilation port is provided on the surface of the sealing frame, the cover plate is rotatably installed on the outer wall of the sealing frame, and an exhaust port is provided on the surface of the cover plate. Among them, the cooling device includes an elastic telescopic rod and a heat exchange component. The heat exchange component is arranged inside the device body. Water is stored on the right side of the partition plate, and polishing liquid is stored on the left side of the partition plate, so that the polishing liquid and water can be added in time, and foreign matters and polishing liquid on the surface of the semiconductor can be removed in time.

[0008] According to the above technical solution, a rotating plate is rotatably installed at the top of the grinding plate, the discharge pipe fixedly penetrates through the rotating plate, and a discharge port is provided at the bottom of the grinding plate. Through the rotating plate, the polishing liquid and water can be directly sprayed out from the bottom of the grinding plate, so that the use effect of the polishing liquid can be improved.

[0009] According to the above technical solution, a first spring is arranged between the limiting plate and the baffle plate, a first volute spring is arranged between the trapezoidal block and the through hole, a second spring is arranged between the sealing plate and the sealing frame, and a second volute spring is arranged between the cover plate and the sealing frame. The first spring can drive the limiting plate to reset.

[0010] According to the above technical solution, the elastic telescopic rod is fixedly installed at the bottom of the mounting plate, and an inclined plate is fixedly installed on the inner wall of the device body. The heat exchange component includes a sliding rod, a triangular block, a heat preservation frame, a heat conduction plate, a piston plate, a contact rod and a jet plate. The sliding rod slidably penetrates the device body, the triangular block is fixedly installed at the top of the sliding rod, the heat preservation frame is fixedly installed at the bottom of the inclined plate, the heat conduction plate fixedly penetrates the top of the heat preservation frame, the piston plate is slidably installed inside the heat preservation frame, the contact rod is fixedly installed at the bottom of the piston plate, and the jet plate is fixedly installed on the surface of the heat conduction plate. When the triangular block moves to the right, it will contact the contact rod, so that the inclined surface of the triangular block will push the contact rod and the piston plate to move in a limited way. When the piston plate moves upward, it will squeeze the gas inside the heat preservation frame and spray it out from the jet plate. The piston plate will squeeze the high-temperature gas inside the heat preservation frame and spray it out from the jet plate. The gas of the jet plate can dry the polishing plate, avoiding the effect that the liquid on the surface of the polishing plate affects the detachment of foreign matters.

[0011] According to the above technical solution, a fixed rod is fixedly installed at the free end of the elastic telescopic rod, and a convex block is fixedly installed on the surface of the grinding plate. When the contact rod vibrates, it will drive the piston plate to vibrate. The vibration of the piston plate can pass through the air flow effect inside the heat preservation frame and the heat conduction plate, so as to cool the polishing plate through the heat conduction plate.

[0012] According to the above technical solution, a third spring is arranged between the piston plate and the heat preservation frame, and the heat conduction plate contacts the polishing plate. The heat conduction plate can play a role in dissipating heat from the polishing plate.

[0013] According to the above technical solution, it further includes a switching device and a lifting device; the lifting device includes a circular block and a releasing component, and the releasing component is arranged at the top of the device body. A switching device is arranged inside the device body. The switching device includes a diversion plate and a collecting component. The diversion plate is fixedly installed inside the device body. The collecting component includes a collecting frame and a turning plate. The collecting frame is fixedly installed at the top of the device body. The turning plate is rotatably installed inside the device body through a rotating shaft. When the turning plate rotates, it can switch the collecting frame, so that the collecting frame on the right can collect the polishing liquid, avoiding the influence of the mixed collection of water and polishing liquid on the recovery of the polishing liquid, thereby increasing the cost of semiconductor polishing.

[0014] According to the above technical solution, a third scroll spring is arranged between the rotating shaft and the device body. An elastic plate is fixedly installed on the right side of the sliding rod. The elastic plate contacts the turning plate. The elastic force of the elastic plate will push the turning plate to rotate, so that the elastic plate will not be affected by the sliding rod reaching, and the vibration of the sliding rod will not affect the turning plate.

[0015] According to the above technical solution, the circular block is slidably installed on the top of the polishing plate. The releasing assembly includes an inclined block, a pressing rod and an arc-shaped scraping plate. A groove is formed on the surface of the circular block. The inclined block is fixedly installed inside the groove. The pressing rod is fixedly installed inside the processing groove. A sliding groove is formed at the bottom of the polishing plate. The arc-shaped scraping plate is rotatably installed inside the sliding groove. When the circular block moves, it will intermittently release the contact with the semiconductor. At the same time, the circular block cannot restrict the arc-shaped scraping plate, avoiding the situation that the position where the semiconductor contacts the circular block cannot be polished, which will affect the overall polishing effect of the semiconductor.

[0016] According to the above technical solution, a fourth spring is arranged between the circular block and the polishing plate, and a torsion spring is arranged between the arc-shaped scraping plate and the sliding groove. The fourth spring can drive the circular block to reset.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: (1) For the polishing equipment for the semiconductor surface, when the sliding plate moves on the surface of the contact plate, the trapezoidal block and the contact plate can drive the limiting plate to move. When the limiting plate moves, it can adjust the sprayed polishing liquid and water, so that when the polishing plate moves downward, the polishing liquid can be automatically sprayed, and when the polishing plate moves upward, water can be automatically sprayed, thereby timely removing foreign matters and polishing liquid on the semiconductor surface, facilitating the polishing of the semiconductor, improving the polishing efficiency of the semiconductor, and at the same time, improving the use effect of the polishing liquid by discharging the polishing liquid from the bottom of the polishing plate.

[0018] (2) For the polishing equipment for the semiconductor surface, when the mounting plate moves downward, it will drive the elastic telescopic rod to move. When the elastic telescopic rod moves downward, it will push the sliding rod to move through the triangular block. When the triangular block moves, it will push the contact rod and the piston plate upward, so that the piston plate will squeeze the high-temperature gas inside the heat preservation box to be ejected from the air jet plate. The gas of the air jet plate can dry the polishing plate, avoiding the situation that the liquid on the surface of the polishing plate affects the effect of foreign matter detachment. At the same time, the convex block will push the free end of the elastic telescopic rod to vibrate up and down, so that the triangular block will push the piston plate to vibrate up and down, thereby enabling the gas to flow inside the heat conducting plate, and improving the cooling effect of the heat conducting plate.

[0019] (3) For the polishing equipment for the semiconductor surface, when the sliding rod moves, it will push the turning plate to rotate. When the turning plate rotates, it will adjust the direction of the turning plate for drainage, so that the collecting box can separately collect the polishing liquid and water, avoiding the situation that the water and the polishing liquid are mixed and collected, which will affect the recycling of the polishing liquid and increase the cost of polishing the semiconductor.

[0020] (4) When the rotating device drives the polishing plate to rotate, the extrusion rod will contact the inclined block, causing the extrusion rod to push the extrusion rod and the circular block to move, so that the circular block will intermittently release the clamping of the semiconductor, and the arc-shaped scraping plate will rotate outward to the polishing plate under the action of the torsion spring, so that the arc-shaped scraping plate can polish the edge of the semiconductor, avoiding the position where the semiconductor contacts the circular block cannot be polished, which will affect the overall polishing effect of the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the drawings: Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic diagram of the inside of the storage box of the present invention; Figure 3 is a schematic diagram of the inside of the sealing box of the present invention; Figure 4 is a schematic cross-sectional view of the polishing plate of the present invention; Figure 5 is a schematic cross-sectional view of the device body of the present invention; Figure 6 is a schematic cross-sectional view of the heat preservation box of the present invention; Figure 7 is a schematic diagram of the position of the circular block and the inclined block of the present invention.

[0022] In the figure: 1, device body; 2, lifting device; 31, mounting plate; 32, driving device; 33, polishing plate; 34, rotating device; 35, polishing plate; 4, control component; 41, storage box; 42, baffle; 43, partition plate; 44, limiting plate; 45, sliding plate; 46, discharge pipe; 47, contact plate; 48, trapezoidal block; 49, sealing box; 410, sealing plate; 411, bending rod; 412, cover plate; 413, rotating plate; 5, heat exchange component; 51, convex block; 52, elastic telescopic rod; 53, sliding rod; 54, triangular block; 55, heat preservation box; 56, heat conducting plate; 57, piston plate; 58, contact rod; 59, air jet plate; 510, fixed rod; 6, collection component; 61, inclined plate; 62, diversion plate; 63, collection box; 64, turning plate; 7, release component; 71, circular block; 72, inclined block; 73, extrusion rod; 74, arc-shaped scraping plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0024] Please refer to Figures 1-6 , this embodiment provides: a polishing device for the semiconductor surface, including a device body 1, and further including an adjusting device and a cooling device. Among them, a processing tank is provided at the top of the device body 1, a lifting device 2 is fixedly installed at the top of the device body 1, a mounting plate 31 is fixedly installed at the output end of the lifting device 2, a driving device 32 is fixedly installed at the top of the mounting plate 31, a polishing plate 33 is fixedly installed at the output end of the driving device 32, and a polishing plate 35 is fixedly installed at the output end of the rotating device 34; among them, the adjusting device includes a storage frame 41 and a control component 4. The control component 4 includes a baffle 42, a partition plate 43, a limiting plate 44, a sliding plate 45, a discharge pipe 46, a contact plate 47, a trapezoidal block 48, a sealing frame 49, a sealing plate 410, a bending rod 411, a cover plate 412 and a rotating plate 413. The storage frame 41 is fixedly installed at the top of the mounting plate 31, the baffle 42 is fixedly installed inside the storage frame 41, the partition plate 43 is fixedly installed on the top of the baffle 42, the limiting plate 44 is slidably installed at the bottom of the baffle 42, the sliding plate 45 is fixedly installed on the surface of the limiting plate 44, the discharge pipe 46 is fixedly installed at the bottom of the storage frame 41, the contact plate 47 is fixedly installed at the top of the device body 1, through holes and notches are provided on the surface of the contact plate 47, the trapezoidal block 48 is rotatably installed at the top of the through hole, the sealing frame 49 is fixedly installed on the surface of the contact plate 47, the sealing plate 410 is slidably installed on the inner wall of the sealing frame 49, the bending rod 411 is fixedly installed on the top of the sealing plate 410, a ventilation opening is provided on the surface of the sealing frame 49, the cover plate 412 is rotatably installed on the outer wall of the sealing frame 49, and an exhaust port is provided on the surface of the cover plate 412. Among them, the cooling device includes an elastic telescopic rod 52 and a heat exchange component 5. The heat exchange component 5 is arranged inside the device body 1. Water is stored on the right side of the partition plate 43, and polishing liquid is stored on the left side of the partition plate 43, so that the polishing liquid and water can be added in time, and foreign matters and polishing liquid on the semiconductor surface can be removed in time.

[0025] A rotating plate 413 is rotatably installed at the top of the polishing plate 33, the discharge pipe 46 fixedly penetrates through the rotating plate 413, and a discharge port is provided at the bottom of the polishing plate 33. Through the rotating plate 413, the polishing liquid and water can be directly sprayed out from the bottom of the polishing plate 33, so that the use effect of the polishing liquid can be improved.

[0026] A first spring is arranged between the limiting plate 44 and the baffle 42, a first scroll spring is arranged between the trapezoidal block 48 and the through hole, a second spring is arranged between the sealing plate 410 and the sealing frame 49, and a second scroll spring is arranged between the cover plate 412 and the sealing frame 49. The first spring can drive the limiting plate 44 to reset.

[0027] The elastic telescopic rod 52 is fixedly installed at the bottom of the mounting plate 31. An inclined plate 61 is fixedly installed on the inner wall of the device body 1. The heat exchange assembly 5 includes a sliding rod 53, a triangular block 54, a heat preservation frame 55, a heat conduction plate 56, a piston plate 57, a contact rod 58 and a jet plate 59. The sliding rod 53 slidably penetrates through the device body 1. The triangular block 54 is fixedly installed at the top of the sliding rod 53. The heat preservation frame 55 is fixedly installed at the bottom of the inclined plate 61. The heat conduction plate 56 is fixedly penetrated through the top of the heat preservation frame 55. The piston plate 57 is slidably installed inside the heat preservation frame 55. The contact rod 58 is fixedly installed at the bottom of the piston plate 57. The jet plate 59 is fixedly installed on the surface of the heat conduction plate 56. When the elastic telescopic rod 52 moves downward, the bottom of the elastic telescopic rod 52 will contact the inclined surface of the triangular block 54, so that when the elastic telescopic rod 52 moves downward, it will push the triangular block 54 and the sliding rod 53 to move to the right. When the triangular block 54 moves to the right, it will contact the contact rod 58, so that the inclined surface of the triangular block 54 will push the contact rod 58 and the piston plate 57 to move in a limited way. When the piston plate 57 moves upward, it will squeeze the gas inside the heat preservation frame 55 to be ejected from the jet plate 59. The piston plate 57 will squeeze the high-temperature gas inside the heat preservation frame 55 to be ejected from the jet plate 59. The gas of the jet plate 59 can dry the polishing plate 35, avoiding the effect that the liquid on the surface of the polishing plate 35 affects the removal of foreign objects.

[0028] A fixed rod 510 is fixedly installed at the free end of the elastic telescopic rod 52. A convex block 51 is fixedly installed on the surface of the polishing plate 33. The convex block 51 will push the free end of the fixed rod 510 and the elastic telescopic rod 52 to intermittently move downward. When the elastic telescopic rod 52 moves up and down, it will push the triangular block 54 and the contact rod 58 to move. When the contact rod 58 moves, it will drive the piston plate 57 to move. The movement of the piston plate 57 can pass the air flow effect inside the heat preservation frame 55 and the heat conduction plate 56, so as to cool the polishing plate 35 through the heat conduction plate 56.

[0029] A third spring is arranged between the piston plate 57 and the heat preservation frame 55. The heat conduction plate 56 contacts the polishing plate 35. The heat conduction plate 56 can play a role in dissipating heat from the polishing plate 35.

[0030] During the operation of the first embodiment, the lifting device 2 drives the mounting plate 31 to move downward. When the mounting plate 31 moves downward, it drives the storage frame 41 and the baffle 42 to move downward. When the baffle 42 moves downward, it drives the limiting plate 44 and the sliding plate 45 to move downward. When the sliding plate 45 moves downward, it rotates into the through hole with the trapezoidal block 48. When the sliding plate 45 continues to move downward, it moves to the notch position of the contact plate 47. Under the action of the first spring, it pushes the limiting plate 44 and the sliding plate 45 to move towards the contact plate 47. When the limiting plate 44 moves to the right, the limiting plate 44 contacts and seals the left side of the partition plate 43, so that the polishing liquid on the left side of the partition plate 43 is discharged from the left side of the partition plate 43. The discharged polishing liquid enters the bottom of the rotating plate 413 through the discharge pipe 46. The polishing liquid entering the bottom of the rotating plate 413 is discharged through the discharge port at the bottom of the grinding plate 33. When the lifting device 2 drives the mounting plate 31 to move upward, the mounting plate 31 drives the storage frame 41 and the baffle 42 to move upward. When the baffle 42 moves downward, it drives the limiting plate 44 and the sliding plate 45 to move upward. When the sliding plate 45 moves upward, it contacts the curved rod 411, so that the sliding plate 45 pushes the curved rod 411 to move upward. When the curved rod 411 moves upward, it drives the sealing plate 410 to move upward. When the sealing plate 410 moves upward, it squeezes the gas inside the sealing frame 49 to spray out from the air exchange port. The gas sprayed out from the air jet port blows the cover plate 412 to rotate upward, so that the cover plate 412 does not affect the exhaust of the air exchange port. After the sliding plate 45 is separated from the curved rod 411, the second spring drives the curved rod 411 and the sealing plate 410 to move downward. Under the action of gravity, the cover plate 412 fits on the surfaces of the sealing frame 49 and the air exchange port, so that the exhaust port on the cover plate 412 limits the speed of air intake into the sealing frame 49, so that the sealing plate 410 and the curved rod 411 can only move downward slowly. When the curved rod 411 moves upward, it limits the movement of the trapezoidal block 48 into the through hole. When the sliding plate 45 moves upward, the inclined surface of the trapezoidal block 48 pushes the sliding plate 45 and the limiting plate 44 to move to the left. When the limiting plate 44 moves to the left, it seals the left side of the partition plate 43 and at the same time the limiting plate 44 opens the right side of the partition plate 43, so that the right side of the partition plate 43 discharges water. When the lifting device 2 drives the driving device 32 and the grinding plate 33 to move upward, it can timely remove the polishing liquid and foreign matters on the semiconductor surface of the polishing plate 35; When the mounting plate 31 moves downward, it will drive the elastic telescopic rod 52 to move downward. When the elastic telescopic rod 52 moves downward, the bottom of the elastic telescopic rod 52 will contact the inclined surface of the triangular block 54, so that when the elastic telescopic rod 52 moves downward, it will push the triangular block 54 and the slide rod 53 to move to the right. When the triangular block 54 moves to the right, it will contact the contact rod 58, so that the inclined surface of the triangular block 54 will push the contact rod 58 and the piston plate 57 to move in a limited way. When the piston plate 57 moves upward, it will squeeze the gas inside the heat preservation frame 55 out from the jet plate 59. When the driving device 32 drives the grinding plate 33 to rotate, the grinding plate 33 will drive the convex block 51 to rotate. When the convex block 51 rotates, it will intermittently contact the fixed rod 510, so that the convex block 51 will push the fixed rod 510 and the free end of the elastic telescopic rod 52 to intermittently shake downward. When the elastic telescopic rod 52 shakes up and down, it will push the triangular block 54 and the contact rod 58 to shake. When the contact rod 58 shakes, it will drive the piston plate 57 to shake. The shaking of the piston plate 57 can pass through the air flow effect inside the heat preservation frame 55 and the heat conducting plate 56. Embodiment

[0031] Please refer to Figures 1-7 On the basis of Embodiment 1, in this embodiment, a switching device and a lifting device are further included; the lifting device includes a circular block 71 and a releasing component 7. The releasing component 7 is arranged on the top of the device body 1. A switching device is arranged inside the device body 1. The switching device includes a diversion plate 62 and a collecting component 6. The diversion plate 62 is fixedly installed inside the device body 1. The collecting component 6 includes a collecting frame 63 and a turning plate 64. The collecting frame 63 is fixedly installed on the top of the device body 1. The turning plate 64 is rotatably installed inside the device body 1 through a rotating shaft. When the turning plate 64 rotates, it can switch the collecting frame 63, so that the collecting frame 63 on the right can collect the polishing liquid, which can avoid the influence on the polishing liquid recovery caused by the mixed collection of water and polishing liquid, thus increasing the cost of semiconductor polishing.

[0032] A third scroll spring is arranged between the rotating shaft and the device body 1. An elastic plate is fixedly installed on the right side of the slide rod 53. The elastic plate contacts the turning plate 64. The elastic force of the elastic plate will push the turning plate 64 to rotate, so that the elastic plate will not be affected by the effect of the slide rod 53, and the shaking of the slide rod 53 will not affect the turning plate 64.

[0033] The circular block 71 is slidably mounted on the top of the polishing plate 35. The loosening assembly 7 includes an inclined block 72, a pressing rod 73 and an arc-shaped scraping plate 74. A groove is formed on the surface of the circular block 71, and the inclined block 72 is fixedly mounted inside the groove. The pressing rod 73 is fixedly mounted inside the processing groove. A chute is formed at the bottom of the polishing plate 33, and the arc-shaped scraping plate 74 is rotatably mounted inside the chute. The pressing rod 73 will push the inclined block 72 and the pressing rod 73 to move. When the circular block 71 moves, it will intermittently loosen the contact with the semiconductor. At the same time, the circular block 71 cannot restrict the arc-shaped scraping plate 74, preventing the position where the semiconductor contacts the circular block 71 from not being polished, which will affect the overall polishing effect of the semiconductor.

[0034] A fourth spring is arranged between the circular block 71 and the polishing plate 35, and a torsion spring is arranged between the arc-shaped scraping plate 74 and the chute. The fourth spring can drive the circular block 71 to reset.

[0035] During the operation of the second embodiment, when the sliding rod 53 moves to the right, it will drive the elastic plate to move to the right. When the elastic plate moves to the right, it will push the turning plate 64 to rotate. The liquid discharged from the inside of the processing groove can be collected through the inclined plate 61 and the diversion plate 62. When the turning plate 64 rotates, the collection frame 63 can be switched, so that the collection frame 63 on the right can collect the polishing liquid. When the rotating device 34 drives the polishing plate 35 to rotate, the rotation of the polishing plate 35 will drive the circular block 71 to rotate. When the circular block 71 rotates, it will drive the inclined block 72 to rotate. When the inclined block 72 rotates, the pressing rod 73 will contact the inclined surface of the inclined block 72, causing the pressing rod 73 to push the inclined block 72 and the pressing rod 73 to move. When the circular block 71 moves, it will intermittently loosen the contact with the semiconductor. At the same time, the circular block 71 cannot restrict the arc-shaped scraping plate 74, and under the action of the torsion spring, it will drive the arc-shaped scraping plate 74 to intermittently move towards the outside of the chute.

[0036] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0037] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A polishing device for a semiconductor surface, comprising a device body (1), characterized in that: It also includes a regulating device, a cooling device and a lifting device; The top of the device body (1) is provided with a processing groove, the top of the device body (1) is fixedly mounted with a lifting device (2), the output end of the lifting device (2) is fixedly mounted with a mounting plate (31), the top of the mounting plate (31) is fixedly mounted with a driving device (32), the output end of the driving device (32) is fixedly mounted with a grinding plate (33), and the output end of the rotating device (34) is fixedly mounted with a polishing plate (35); The regulating device comprises a storage frame (41) and a control assembly (4); the control assembly (4) comprises a baffle (42), a partition plate (43), a limiting plate (44), a slide plate (45), a discharge pipe (46), a contact plate (47), a trapezoidal block (48), a sealing frame (49), a sealing plate (410), a bending rod (411), a cover plate (412) and a rotating plate (413); the storage frame (41) is fixedly mounted on the top of the mounting plate (31); the baffle (42) is fixedly mounted inside the storage frame (41); the partition plate (43) is fixedly mounted on the top of the baffle (42); the limiting plate (44) is slidably mounted on the bottom of the baffle (42); and the slide plate (45) is fixedly mounted On the surface of the limiting plate (44), the discharge pipe (46) is fixedly mounted on the bottom of the storage frame (41), the contact plate (47) is fixedly mounted on the top of the device body (1), a through hole and a notch are provided on the surface of the contact plate (47), the trapezoidal block (48) is rotatably mounted on the top of the through hole, the sealing frame (49) is fixedly mounted on the surface of the contact plate (47), the sealing plate (410) is slidably mounted on the inner wall of the sealing frame (49), the bending rod (411) is fixedly mounted on the top of the sealing plate (410), a ventilation port is provided on the surface of the sealing frame (49), and the cover plate (412) is rotatably mounted on the outer wall of the sealing frame (49), and an exhaust port is provided on the surface of the cover plate (412); The cooling device comprises an elastic telescopic rod (52) and a heat exchange component (5), the heat exchange component (5) being arranged inside the device body (1), and the lifting device comprises a circular block (71) and a loosening component (7), the loosening component (7) being arranged on the top of the device body (1).

2. A polishing device for a semiconductor surface according to claim 1, characterized in that: A rotating plate (413) is rotatably mounted on the top of the grinding plate (33), the discharge pipe (46) is fixedly passed through the rotating plate (413), and a discharge port is provided at the bottom of the grinding plate (33).

3. A polishing device for a semiconductor surface according to claim 2, characterized in that: A No. 1 spring is provided between the limiting plate (44) and the baffle plate (42), a No. 1 volute spring is provided between the trapezoidal block (48) and the through hole, a No. 2 spring is provided between the sealing plate (410) and the sealing frame (49), and a No. 2 volute spring is provided between the cover plate (412) and the sealing frame (49).

4. A polishing device for a semiconductor surface according to claim 3, characterized in that: The elastic telescopic rod (52) is fixedly mounted on the bottom of the mounting plate (31); an inclined plate (61) is fixedly mounted on the inner wall of the device body (1); the heat exchange assembly (5) comprises a slide rod (53), a triangular block (54), a heat insulation frame (55), a heat conduction plate (56), a piston plate (57), a contact rod (58) and an air injection plate (59); the slide rod (53) slides through the device body (1); the triangular block (54) is fixedly mounted on the top of the slide rod (53); the heat insulation frame (55) is fixedly mounted on the bottom of the inclined plate (61); the heat conduction plate (56) is fixedly mounted on the top of the heat insulation frame (55); the piston plate (57) is slidably mounted inside the heat insulation frame (55); the contact rod (58) is fixedly mounted on the bottom of the piston plate (57); and the air injection plate (59) is fixedly mounted on the surface of the heat conduction plate (56).

5. A polishing device for semiconductor surface according to claim 4, characterized in that: A fixing rod (510) is fixedly mounted on the free end of the elastic telescopic rod (52), and a protrusion (51) is fixedly mounted on the surface of the polishing plate (33).

6. A polishing device for semiconductor surface according to claim 5, characterized in that: A No. 3 spring is provided between the piston plate (57) and the heat-insulating frame (55), and the heat-conducting plate (56) is in contact with the polishing plate (35).

7. A polishing device for a semiconductor surface according to claim 6, characterized in that: A switching device is arranged inside the device body (1), the switching device comprising a guide plate (62) and a collection assembly (6), the guide plate (62) being fixedly mounted inside the device body (1), a collection frame (63) and a flip plate (64) being provided on the surface of the collection assembly (6), the collection frame (63) being fixedly mounted on the top of the device body (1), and the flip plate (64) being rotatably mounted inside the device body (1) via a rotating shaft.

8. A polishing device for a semiconductor surface according to claim 7, characterized in that: A No. 3 spiral spring is provided between the rotating shaft and the device body (1), and an elastic plate is fixedly mounted on the right side of the sliding rod (53), and the elastic plate is in contact with the flip plate (64).

9. A polishing device for a semiconductor surface according to claim 8, characterized in that: The circular block (71) is slidably mounted on the top of the polishing plate (35); the loosening assembly (7) comprises a tilting block (72), an extrusion rod (73) and an arc-shaped scraper (74); a groove is provided on the surface of the circular block (71); the tilting block (72) is fixedly mounted inside the groove; the extrusion rod (73) is fixedly mounted inside the processing groove; a slide groove is provided at the bottom of the polishing plate (33); and the arc-shaped scraper (74) is rotatably mounted inside the slide groove.

10. A polishing device for a semiconductor surface according to claim 9, characterized in that: A No. 4 spring is provided between the circular block (71) and the polishing plate (35), and a torsion spring is provided between the arc-shaped scraper (74) and the slide groove.

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