CVD (Chemical Vapor Deposition) wafer coating equipment

Abstract

The invention relates to the technical field of CVD (chemical vapor deposition) wafer coating, and discloses CVD wafer coating equipment which comprises a mounting unit, a transmission unit and a locking unit, the mounting unit comprises a working box, supporting legs are fixedly mounted on the periphery of the bottom of the working box, every two supporting legs are symmetrical, sliding doors are arranged on two opposite side walls of the working box, and the locking unit is connected with the transmission unit. A first sliding mechanism is arranged in an inner cavity of the working box, a protective shell is arranged above the working box, and two symmetrical wafer bodies are arranged in the inner cavity of the working box. According to the wafer coating device, when coating of a wafer body is finished, an upper mounting plate and a lower mounting plate can drive an upper coating barrel and a lower coating barrel to reset, and the wafer body can be located in an inner cavity of the lower coating barrel at the moment, so that when the lower coating barrel moves to the bottommost part, a worker can conveniently take out the coated wafer body; therefore, the condition that the coated wafer body is scratched can be avoided to a certain extent.

Description

Technical Field

[0001] The present invention belongs to the technical field of CVD wafer coating, and specifically relates to a CVD wafer coating device. Background Art

[0002] The process of preparing a thin film by CVD method is as follows: the reaction gas diffuses towards the substrate surface and adsorbs on the substrate surface, the reaction gas undergoes a chemical reaction on the substrate surface, the gaseous by-products generated on the substrate surface detach, diffuse into the space or are evacuated by the pumping system, and the non-volatile solid reaction products left on the substrate surface become the oxide film of the substrate.

[0003] However, during the coating of existing CVD wafers, due to impurities on the wafer body, etc., it is often easy to have defects during coating, resulting in the failure of coating the wafer body. And sometimes, when taking out the coated wafer body, it is easy to be scratched, which is rather troublesome.

[0004] In view of this, the present invention is specifically proposed. Summary of the Invention

[0005] To solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:

[0006] A CVD wafer coating device includes a mounting unit, a transmission unit, and a locking unit. The mounting unit includes a working box. Support legs are fixedly installed around the bottom of the working box, and the four support legs are symmetric with each other in pairs. Sliding doors are provided on both opposite side walls of the working box. A first sliding mechanism is arranged in the inner cavity of the working box. A protective shell is arranged above the working box. Two symmetrically arranged wafer bodies are arranged in the inner cavity of the working box;

[0007] The transmission unit includes a servo motor, which is arranged in the inner cavity of the protective shell. A first threaded rod is fixedly installed at the output end of the servo motor. The first threaded rod movably penetrates through the working box. A second threaded rod is fixedly installed at the end of the first threaded rod away from the servo motor. A first bearing is arranged at the end of the second threaded rod away from the first threaded rod. The first bearing is installed at the bottom of the working box. The thread directions of the first threaded rod and the second threaded rod are opposite. A first threaded sleeve and a second threaded sleeve are respectively meshed and installed on the first threaded rod and the second threaded rod. Two symmetrically arranged guide rods movably penetrate through the first threaded sleeve and the second threaded sleeve. Both ends of the two guide rods are respectively fixedly connected to the opposite inner side walls of the inner cavity of the working box. Fixing rods are respectively fixedly installed on the first threaded sleeve and the second threaded sleeve. The four fixing rods are symmetrically arranged in pairs. The ends of the four fixing rods away from the first threaded sleeve and the second threaded sleeve are respectively fixedly connected to an upper mounting plate and a lower mounting plate. The two upper mounting plates and the lower mounting plate are symmetrically arranged. An upper coating cylinder and a lower coating cylinder are respectively penetrated and installed on the two upper mounting plates and the lower mounting plate. The two upper coating cylinders and the lower coating cylinder are symmetrically arranged. Two placing plates are arranged on the opposite side walls of the two upper coating cylinders and the lower coating cylinder. The four placing plates are symmetrically arranged in pairs. Connecting plates are arranged on the opposite side walls of the four placing plates in pairs. The four connecting plates are symmetrically arranged in pairs. An actuating mechanism is arranged on each of the four connecting plates;

[0008] The locking unit includes two first clamping plates and a second clamping plate. The two first clamping plates and the second clamping plate are symmetrically arranged in pairs. Two inserting rods and two inserting cylinders are respectively arranged on the opposite sides of the two first clamping plates and the second clamping plate. Each inserting rod and the inserting cylinder are mutually fitted. Each inserting rod is provided with an inserting groove opening. A second sliding mechanism is arranged in the inner cavity of each inserting cylinder. A placing cylinder is fixedly installed above the inner cavity of each inserting cylinder. A third sliding mechanism is arranged in the inner cavity of each placing cylinder. A moving plate is installed on the third sliding mechanism. A second return spring is fixedly installed above each moving plate, and the other end of the second return spring is fixedly connected to the upper part of the inner cavity of the placing cylinder. A limiting rod is fixedly installed at the bottom of each moving plate. Each limiting rod is respectively fitted and inserted into the inner cavity of the inserting groove opening. A moving mechanism is arranged on the outer side wall of each placing cylinder. An installation bracket is fixedly installed on one side wall of the two second clamping plates. The two installation brackets are symmetrically arranged. The other ends of the two installation brackets are fixedly connected to the inner wall of the working box.

[0009] As a preferred embodiment of the present invention, the first sliding mechanism includes a plurality of first sliding grooves, each of the first sliding grooves is respectively opened on opposite side walls of the inner cavity of the working box, and two symmetrically arranged sliding rods are slidably installed in each inner cavity of the first sliding groove. One ends of each pair of the sliding rods away from the first sliding groove are respectively fixedly connected with a connecting plate.

[0010] As a preferred embodiment of the present invention, rectangular notches are respectively opened on opposite side walls between each pair of the placing plates. A rotating rod is arranged in each inner cavity of the rectangular notches. Second bearings are respectively arranged at both ends of each rotating rod, and the second bearings are respectively installed on opposite side walls of the inner cavity of the rectangular notches. A cleaning roller is sleeved on each rotating rod.

[0011] As a preferred embodiment of the present invention, the moving mechanism includes a plurality of moving rods. One end of each moving rod is movably installed between opposite ends of each pair of the connecting plates, and the other end of each moving rod is respectively movably connected to the upper mounting plate and the lower mounting plate.

[0012] As a preferred embodiment of the present invention, the second sliding mechanism includes a plurality of second sliding grooves. Each of the second sliding grooves is respectively opened on one side wall of the inner cavity of the insertion cylinder between each pair. The second sliding grooves are symmetric with each other between each pair. A second slider is slidably installed in each inner cavity of the second sliding groove. The second sliders are symmetric with each other between each pair. One end of each second slider away from the second sliding groove is fixedly connected with an inclined block. The inclined blocks are symmetric with each other between each pair. One end of each pair of the second sliders opposite to each other is fixedly connected with a first return spring. The first return springs are symmetric with each other between each pair, and the other end of the first return spring is fixedly connected to the inner wall of the second sliding groove.

[0013] As a preferred embodiment of the present invention, a connecting plate is fixedly installed on one side wall between each pair of the inclined blocks. The connecting plates are symmetric with each other between each pair. A sealing plate is fixedly installed on the opposite side wall of each connecting plate. The sealing plates are symmetric with each other between each pair. Each sealing plate is respectively located at the bottom of the placing cylinder.

[0014] As a preferred embodiment of the present invention, the third sliding mechanism includes a plurality of third sliding grooves. The third sliding grooves are symmetric with each other between each pair. A third slider is slidably installed in each inner cavity of the third sliding groove. The third sliders are symmetric with each other between each pair. A moving plate is fixedly installed between each pair of the third sliders.

[0015] As a preferred embodiment of the present invention, a rectangular groove is opened in the inner cavity of one of each pair of the third sliding grooves. A moving rod is arranged in each inner cavity of the rectangular groove. One end of each moving rod is fixedly connected to the third slider.

[0016] As a preferred embodiment of the present invention, an installation rod is fixedly installed above each end of each of the moving rods away from the placing cylinder. Each of the installation rods movably penetrates through the insertion cylinder, and a top plate is fixedly connected above each of the installation rods.

[0017] As a preferred embodiment of the present invention, two symmetrically arranged push rods are fixedly installed above the two lower mounting plates, and each of the push rods is higher than the lower coating cylinder.

[0018] The present invention has the following beneficial effects compared with the prior art:

[0019] In the present invention, when the upper mounting plate and the lower mounting plate move relative to each other, they can drive the upper coating cylinder and the lower coating cylinder to move relative to each other. When both ends of the wafer body are respectively inside the cavities of the upper coating cylinder and the lower coating cylinder, the push rods fixedly installed on the lower mounting plate at this time will be able to push the top plate upward. Thus, the installation rod can be driven to move upward by the top plate, and the moving rod can be driven to move upward by the installation rod, thereby driving the moving plate to move upward, so that the limiting rod can leave the insertion slot opening. Therefore, under the elastic force of the first return spring arranged inside the second sliding mechanism, the insertion rod can be squeezed to reset, so that the first clamping plate loses the positioning of the wafer body; Therefore, when the coating of the wafer body is completed, when the upper mounting plate and the lower mounting plate are reset at this time, they can drive the upper coating cylinder and the lower coating cylinder to be reset. And at this time, the wafer body will be able to be located inside the lower coating cylinder. Thus, when the lower coating cylinder moves to the bottommost position, it is convenient for the staff to take out the coated wafer body. Therefore, to a certain extent, it can avoid the situation that the coated wafer body is scratched.

[0020] The following further describes in detail the specific embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In the drawings:

[0022] Figure 1 is a three-dimensional structural schematic diagram of a CVD wafer coating device;

[0023] Figure 2 is a sectional structural schematic diagram of the working box of a CVD wafer coating device;

[0024] Figure 3 is a structural schematic diagram of the inner cavity of the working box of a CVD wafer coating device;

[0025] Figure 4 is a CVD wafer coating device Figure 3 magnified structural schematic diagram at position A;

[0026] Figure 5Schematic diagram of the first clamping plate and the second clamping plate of a CVD wafer coating device;

[0027] Figure 6 Schematic cross-sectional view of the insertion cylinder of a CVD wafer coating device;

[0028] Figure 7 Schematic bottom view of the insertion cylinder of a CVD wafer coating device;

[0029] Figure 8 Schematic cross-sectional view of the placement cylinder of a CVD wafer coating device.

[0030] In the figure:

[0031] 100, installation unit; 101, working box; 1011, sliding door; 1012, support leg; 102, protective shell; 103, first sliding groove; 1031, sliding rod; 104, installation bracket; 105, wafer body;

[0032] 200, transmission unit; 201, servo motor; 2011, first threaded rod; 2012, first threaded sleeve; 2013, second threaded rod; 2014, second threaded sleeve; 2015, first bearing; 2016, guide rod; 202, fixed rod; 2021, upper mounting plate; 2022, upper coating cylinder; 2023, lower mounting plate; 2024, lower coating cylinder; 203, placement plate; 2031, connecting plate; 2032, movable rod; 2033, rectangular notch; 2034, second bearing; 2035, rotating rod; 2036, cleaning roller; 204, push rod;

[0033] 300, locking unit; 301, first clamping plate; 3011, second clamping plate; 302, insertion rod; 3021, insertion cylinder; 3022, insertion slot; 303, second sliding groove; 3031, first return spring; 3032, second slider; 3033, inclined block; 3034, connecting plate; 3035, sealing plate; 304, placement cylinder; 3041, third sliding groove; 3042, third slider; 3043, moving plate; 3044, second return spring; 3045, limiting rod; 305, rectangular slot; 3051, moving rod; 3052, mounting rod; 3053, top plate. Detailed implementation manners

[0034] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0035] Embodiment 1:

[0036] As Figures 1 to 8As shown in the figure, a CVD wafer coating device includes an installation unit 100, a transmission unit 200, and a locking unit 300. The installation unit 100 includes a working box 101. Support legs 1012 are fixedly installed around the bottom of the working box 101. The four support legs 1012 are symmetric with each other in pairs. Sliding doors 1011 are provided on both opposite side walls of the working box 101. A first sliding mechanism is arranged in the inner cavity of the working box 101. A protective shell 102 is arranged above the working box 101. Two symmetric wafer bodies 105 are arranged in the inner cavity of the working box 101; The transmission unit 200 includes a servo motor 201. The servo motor 201 is arranged in the inner cavity of the protective shell 102. A first threaded rod 2011 is fixedly installed at the output end of the servo motor 201. The first threaded rod 2011 movably penetrates through the working box 101. A second threaded rod 2013 is fixedly installed at the end of the first threaded rod 2011 away from the servo motor 201. A first bearing 2015 is arranged at the end of the second threaded rod 2013 away from the first threaded rod 2011. The first bearing 2015 is installed at the bottom of the working box 101. The thread directions of the first threaded rod 2011 and the second threaded rod 2013 are opposite. A first thread sleeve 2012 and a second thread sleeve 2014 are respectively meshed and installed on the first threaded rod 2011 and the second threaded rod 2013. Two symmetric guide rods 2016 movably penetrate through the first thread sleeve 2012 and the second thread sleeve 2014. Both ends of the two guide rods 2016 are respectively fixedly connected to the opposite side walls in the inner cavity of the working box 101. Fixing rods 202 are respectively fixedly installed on the first thread sleeve 2012 and the second thread sleeve 2014. The four fixing rods 202 are symmetric with each other in pairs. The ends of the four fixing rods 202 away from the first thread sleeve 2012 and the second thread sleeve 2014 are respectively fixedly connected to an upper mounting plate 2021 and a lower mounting plate 2023. The two upper mounting plates 2021 and the lower mounting plate 2023 are symmetric with each other. An upper coating cylinder 2022 and a lower coating cylinder 2024 are respectively penetrated and installed on the two upper mounting plates 2021 and the lower mounting plate 2023. The two upper coating cylinders 2022 and the lower coating cylinder 2024 are symmetric with each other. Two placing plates 203 are provided on both opposite side walls of the two upper coating cylinders 2022 and the lower coating cylinder 2024. The four placing plates 203 are symmetric with each other in pairs. Connecting plates 2031 are provided on the opposite side walls of the four placing plates 203 in pairs. The four connecting plates 2031 are symmetric with each other in pairs. Moving mechanisms are arranged on the four connecting plates 2031;The locking unit 300 includes two first clamping plates 301 and a second clamping plate 3011. The two first clamping plates 301 and the second clamping plate 3011 are symmetric with each other. On the opposite sides of the two first clamping plates 301 and the second clamping plate 3011, two inserting rods 302 and two inserting cylinders 3021 are respectively arranged. Each inserting rod 302 fits with the inserting cylinder 3021. Each inserting rod 302 is provided with an inserting slot 3022. A second sliding mechanism is arranged in the inner cavity of each inserting cylinder 3021. A placing cylinder 304 is fixedly installed above the inner cavity of each inserting cylinder 3021. A third sliding mechanism is arranged in the inner cavity of each placing cylinder 304. A moving plate 3043 is installed on the third sliding mechanism. A second return spring 3044 is fixedly installed above each moving plate 3043, and the other end of the second return spring 3044 is fixedly connected to the upper part of the inner cavity of the placing cylinder 304. A limiting rod 3045 is fixedly installed at the bottom of each moving plate 3043. Each limiting rod 3045 is respectively fitted and inserted into the inner cavity of the inserting slot 3022. A moving mechanism is arranged on the outer side wall of each placing cylinder 304. On one side wall of the two second clamping plates 3011, a mounting bracket 104 is fixedly installed. The two mounting brackets 104 are symmetric with each other. The other ends of the two mounting brackets 104 are fixedly connected to the inner wall of the working box 101. When the upper mounting plate 2021 and the lower mounting plate 2023 move relative to each other, they can drive the upper coating cylinder 2022 and the lower coating cylinder 2024 to move relative to each other. Until both ends of the wafer body 105 are respectively in the inner cavities of the upper coating cylinder 2022 and the lower coating cylinder 2024, at this time, the push rod 204 fixedly installed on the lower mounting plate 2023 will be able to push the top plate 3053 upward, so that the mounting rod 3052 can be driven to move upward through the top plate 3053, and the moving rod 3051 can be driven to move upward through the mounting rod 3052, thereby driving the moving plate 3043 to move upward, so that the limiting rod 3045 can leave the inserting slot 3022. Therefore, under the elastic force of the first return spring 3031 arranged in the inner cavity of the second sliding mechanism, the inserting rod 302 can be squeezed to reset, so that the first clamping plate 301 loses the positioning of the wafer body 105. Therefore, when the coating of the wafer body 105 is completed, when the upper mounting plate 2021 and the lower mounting plate 2023 are reset at this time, they can drive the upper coating cylinder 2022 and the lower coating cylinder 2024 to reset. And at this time, the wafer body 105 will be able to be located in the inner cavity of the lower coating cylinder 2024. Thus, when the lower coating cylinder 2024 moves to the bottommost position, it is convenient for the staff to take out the coated wafer body 105. Therefore, to a certain extent, it can avoid the situation that the coated wafer body 105 is scratched.;

[0037] As Figures 2 to 3As shown, in the specific implementation manner, the first sliding mechanism includes a plurality of first sliding grooves 103, each of which is respectively formed on the opposite side walls of the inner cavity of the working box 101. Two symmetrically arranged sliding rods 1031 are slidably installed in the inner cavity of each first sliding groove 103. One end of each pair of sliding rods 1031 away from the first sliding groove 103 is fixedly connected to a connecting plate 2031. In this setting, the installation position and components of the first sliding mechanism are determined.

[0038] As Figures 2 to 4 shown, further, rectangular notches 2033 are formed on the opposite side walls of each pair of placing plates 203. A rotating rod 2035 is arranged in the inner cavity of each rectangular notch 2033. Second bearings 2034 are respectively arranged at both ends of each rotating rod 2035, and the second bearings 2034 are respectively installed on the opposite side walls of the inner cavity of the rectangular notch 2033. A cleaning roller 2036 is sleeved on each rotating rod 2035. In this setting, the components in the inner cavity of the placing plate 203 are determined.

[0039] As Figures 2 to 3 shown, further, the moving mechanism includes a plurality of moving rods 2032. One end of each moving rod 2032 is movably installed at the opposite ends between the connecting plates 2031, and the other end of each moving rod 2032 is movably connected to the upper mounting plate 2021 and the lower mounting plate 2023 respectively. In this setting, the installation position and components of the moving mechanism are determined.

[0040] Example 2:

[0041] Based on the above example, the difference from this example is that: as Figures 5 to 6 shown, a CVD wafer coating device, the second sliding mechanism includes a plurality of second sliding grooves 303. Each pair of second sliding grooves 303 are respectively formed on one side wall of the inner cavity of the plug-in cylinder 3021. Each pair of second sliding grooves 303 are symmetric to each other. A second slider 3032 is slidably installed in the inner cavity of each second sliding groove 303. Each pair of second sliders 3032 are symmetric to each other. One end of each second slider 3032 away from the second sliding groove 303 is fixedly connected to an inclined block 3033. Each pair of inclined blocks 3033 are symmetric to each other. One end of each pair of second sliders 3032 opposite to each other is fixedly connected to a first return spring 3031. Each pair of first return springs 3031 are symmetric to each other, and the other end of the first return spring 3031 is fixedly connected to the inner wall of the second sliding groove 303. In this setting, the installation position and components of the second sliding mechanism are determined.

[0042] As Figures 5 to 6As shown in the figure, in the specific implementation, one side wall between every two inclined blocks 3033 is fixedly installed with an adapter plate 3034. Every two adapter plates 3034 are symmetrical to each other. One side wall of each pair of opposite adapter plates 3034 is fixedly installed with a sealing plate 3035. Every two sealing plates 3035 are symmetrical to each other. Each sealing plate 3035 is respectively located at the bottom of the placing cylinder 304. In this setting, the installation position and connection relationship of the sealing plate 3035 are determined.

[0043] As Figure 8 shown, further, the third sliding mechanism includes a plurality of third sliding grooves 3041. Every two third sliding grooves 3041 are symmetrical to each other. A third slider 3042 is slidably installed in the inner cavity of each third sliding groove 3041. Every two third sliders 3042 are symmetrical to each other. A moving plate 3043 is fixedly installed between every two third sliders 3042. In this setting, the installation position and components of the third sliding mechanism are determined.

[0044] As Figures 6 to 8 shown, further, a rectangular groove 305 is opened in the inner cavity of one of the third sliding grooves 3041 of each third sliding groove 3041. A moving rod 3051 is arranged in the inner cavity of each rectangular groove 305. One end of each moving rod 3051 is fixedly connected to the third slider 3042. In this setting, the installation position of the moving rod 3051 is determined.

[0045] As Figures 6 to 8 shown, further, an installation rod 3052 is fixedly installed above one end of each moving rod 3051 away from the placing cylinder 304. Each installation rod 3052 movably penetrates through the insertion cylinder 3021. A top plate 3053 is fixedly connected above each installation rod 3052. In this setting, the installation position and connection relationship of the top plate 3053 are determined, ensuring that when the top plate 3053 moves, it can drive the installation rod 3052 to move, thereby driving the moving rod 3051 to move.

[0046] As Figures 2 to 3 shown, further, two symmetrical push rods 204 are fixedly installed above the two lower mounting plates 2023. Each push rod 204 is respectively higher than the lower coating cylinder 2024. In this setting, the installation position of the push rod 204 is determined.

[0047] The implementation principle of a CVD wafer coating device in this embodiment is as follows:

[0048] First, the staff opens the sliding doors 1011 on both sides. At this time, the staff places the wafer body 105 between the first clamping plate 301 and the second clamping plate 3011. When the placement is completed, the staff moves the first clamping plate 301, so that the first clamping plate 301 can drive the insertion rod 302 to move into the insertion cylinder 3021. When the insertion rod 302 moves, it will be able to squeeze the two inclined blocks 3033 to move to both sides with the assistance of the second sliding groove 303 and the second slider 3032 in the second sliding mechanism. When the inclined block 3033 moves, it will be able to drive the connecting plate 3034 to drive the sealing plate 3035 away from the bottom of the placement cylinder 304;

[0049] When the sealing plate 3035 leaves the bottom of the placement cylinder 304, the second return spring 3044 arranged in the inner cavity of the placement cylinder 304 will be able to squeeze the moving plate 3043 to move horizontally downward under the assistance of the third sliding groove 3041 and the third slider 3042 in the third sliding mechanism. When the moving plate 3043 moves downward, it will be able to drive the limiting rod 3045 to move downward. Therefore, the limiting rod 3045 can be inserted into the inner cavity of the insertion slot 3022 opened in the insertion rod 302, so as to limit the insertion rod 302, so that the first clamping plate 301 and the second clamping plate 3011 at this time can clamp the placed wafer body 105;

[0050] At this time, the staff controls the servo motor 201 to run through the controller. The servo motor 201 will be able to drive the first threaded rod 2011 to rotate. Through the first threaded rod 2011, the second threaded rod 2013 can be driven to rotate. When the first threaded rod 2011 and the second threaded rod 2013 rotate, they can drive the first threaded sleeve 2012 and the second threaded sleeve 2014 to move relatively with the assistance of the guide rod 2016 (because the thread directions of the first threaded rod 2011 and the second threaded rod 2013 are opposite);

[0051] When the first threaded sleeve 2012 and the second threaded sleeve 2014 move relatively, they will be able to drive the upper mounting plate 2021 and the lower mounting plate 2023 to move relatively through the fixing rod 202. When the upper mounting plate 2021 and the lower mounting plate 2023 move, they can drive the connecting plate 2031 to move horizontally through the movable rod 2032 with the assistance of the first sliding groove 103 and the slide rod 1031 in the first sliding mechanism. When the connecting plate 2031 moves, it can drive the placement plate 203 to move, so that the cleaning roller 2036 arranged in the inner cavity of the placement plate 203 can clean the surface of the wafer body 105 when it is attached to the wafer body 105, thus ensuring that there will be no defects to a certain extent during coating;

[0052] When the upper mounting plate 2021 and the lower mounting plate 2023 move relative to each other, they can drive the upper coating cylinder 2022 and the lower coating cylinder 2024 to move relative to each other. Until both ends of the wafer body 105 are inside the inner cavities of the upper coating cylinder 2022 and the lower coating cylinder 2024 respectively, at this time, the push rod 204 fixedly installed on the lower mounting plate 2023 will be able to push the top plate 3053 upward, so that the mounting rod 3052 can be driven upward by the top plate 3053. Then, the moving rod 3051 can be driven upward by the mounting rod 3052, thereby driving the moving plate 3043 upward, so that the limiting rod 3045 can leave the insertion slot 3022. Therefore, under the elastic force of the first return spring 3031 arranged inside the second sliding mechanism, the insertion rod 302 can be squeezed to reset, so that the first clamping plate 301 loses the positioning of the wafer body 105;

[0053] Therefore, when the coating of the wafer body 105 is completed, when the upper mounting plate 2021 and the lower mounting plate 2023 are reset, they can drive the upper coating cylinder 2022 and the lower coating cylinder 2024 to reset. And at this time, the wafer body 105 will be able to be located inside the inner cavity of the lower coating cylinder 2024. Thus, when the lower coating cylinder 2024 moves to the bottommost position, it is convenient for the staff to take out the wafer body 105 that has been coated. Therefore, to a certain extent, it can avoid the situation that the wafer body 105 after coating is scratched.

Claims

1. A CVD wafer coating device, comprising a mounting unit (100), a transmission unit (200) and a locking unit (300), characterized in that: The installation unit (100) comprises a working box (101), support legs (1012) are fixedly installed around the bottom of the working box (101), sliding doors (1011) are arranged on two opposite side walls of the working box (101), a first sliding mechanism is arranged in the inner cavity of the working box (101), and two mutually symmetrical wafer bodies (105) are arranged in the inner cavity of the working box (101); The transmission unit (200) comprises a servo motor (201), the servo motor 201 is used to drive the upper coating cylinder (2022) and the lower coating cylinder (2024) to close, the servo motor (201) is arranged in the inner cavity of the protective shell (102), the output end of the servo motor (201) is fixedly mounted with a first threaded rod (2011), the upper coating cylinder (2022) and the lower coating cylinder (2024) are arranged on one side of the first threaded rod 2011, two placement plates (203) are arranged on opposite side walls of the two upper coating cylinders (2022) and the lower coating cylinder (2024), and connecting plates (2031) are arranged on opposite side walls of the four placement plates (203), and movable mechanisms are arranged on the four connecting plates (2031); The locking unit (300) comprises two first clamping plates (301) and a second clamping plate (3011), and two plug-in rods (302) and two plug-in cylinders (3021) are respectively arranged on opposite sides of the two first clamping plates (301) and the second clamping plates (3011), and each plug-in rod (302) is respectively fitted with the plug-in cylinder (3021).

2. The CVD wafer coating equipment according to claim 1, characterized in that: The first threaded rod (2011) is movable and penetrates the working box (101); a second threaded rod (2013) is fixedly mounted on one end of the first threaded rod (2011) away from the servo motor (201); a first bearing (2015) is arranged on one end of the second threaded rod (2013) away from the first threaded rod (2011); the first bearing (2015) is mounted on the bottom of the working box (101); the first threaded rod (2011) and the second threaded rod (2013) have opposite thread directions; a first threaded sleeve (2012) and a second threaded sleeve (2014) are respectively meshed and mounted on the first threaded rod (2011) and the second threaded rod (2013); the first threaded sleeve (2012) and the second threaded sleeve (2014) are respectively meshed and mounted on the first threaded rod (2011) and the second threaded rod (2013); 2) and the second threaded sleeve (2014) are movably penetrated by two mutually symmetrical guide rods (2016), the two ends of the two guide rods (2016) are respectively fixedly connected to the two opposite side walls of the inner cavity of the working box (101), the first threaded sleeve (2012) and the second threaded sleeve (2014) are respectively fixedly installed with a fixing rod (202), one end of the four fixing rods (202) away from the first threaded sleeve (2012) and the second threaded sleeve (2014) is respectively fixedly connected to an upper mounting plate (2021) and a lower mounting plate (2023), and the upper coating cylinder (2022) and the lower coating cylinder (2024) are respectively penetrated and installed on the mounting plate (2021) and the lower mounting plate (2023).

3. A CVD wafer coating device according to claim 2, characterized in that: The first sliding mechanism comprises a plurality of first sliding grooves (103), each of the first sliding grooves (103) being respectively arranged on opposite side walls of the inner cavity of the working box (101), and the inner cavity of each of the first sliding grooves (103) being slidably mounted with two mutually symmetrical sliding rods (1031), and one end of each of the sliding rods (1031) being away from the first sliding groove (103) being respectively fixedly connected with a connecting plate (2031); a rectangular notch (2033) being respectively arranged on one side wall of each of the placing plates (203) being opposite to each other, and a rotating rod (2035) being arranged in the inner cavity of each of the rectangular notches (2033), and second bearings (2034) being respectively arranged at both ends of each of the rotating rods (2035), and the second bearings (2034) being respectively mounted on opposite side walls of the inner cavity of the rectangular notch (2033), and a cleaning roller (2036) being sleeved and mounted on each of the rotating rods (2035).

4. The CVD wafer coating equipment according to claim 3, characterized in that: The movable mechanism comprises a plurality of movable rods (2032), one end of each movable rod (2032) being movably mounted on opposite ends of the connecting plates (2031), and the other end of each movable rod (2032) being movably connected to the upper mounting plate (2021) and the lower mounting plate (2023); a protective shell (102) is arranged above the working box (101).

5. The CVD wafer coating equipment according to claim 4, characterized in that: Each plug rod (302) is provided with a plug slot (3022), each plug cylinder (3021) is provided with a second sliding mechanism in its inner cavity, a placement cylinder (304) is fixedly installed above the inner cavity of each plug cylinder (3021), a third sliding mechanism is provided in the inner cavity of each placement cylinder (304), a moving plate (3043) is installed on the third sliding mechanism, a second return spring (3044) is fixedly installed above each moving plate (3043), and the other end of the second return spring (3044) is fixedly connected to the Connected to the top of the inner cavity of the placement cylinder (304), a limiting rod (3045) is fixedly installed at the bottom of each movable plate (3043), and each limiting rod (3045) is respectively fitted and plugged into the inner cavity of the plug-in slot (3022). A moving mechanism is provided on the outer wall of each placement cylinder (304), and a mounting bracket (104) is fixedly installed on one side wall of the two second clamping plates (3011). The two mounting brackets (104) are symmetrical to each other, and the other ends of the two mounting brackets (104) are fixedly connected to the inner wall of the working box (101).

6. The CVD wafer coating equipment according to claim 5, characterized in that: The second sliding mechanism comprises a plurality of second slide grooves (303), each of which is respectively arranged on a side wall of the inner cavity of the plug-in cylinder (3021), each of which is symmetrical with each other, and a second slider (3032) is slidably installed in the inner cavity of each second slide groove (303), each of which is symmetrical with each other, and each of which is respectively fixedly connected with an inclined block (3033) at one end away from the second slide groove (303), each of which is symmetrical with each other, and each of which is opposite to each other. One end of each of the tilting blocks (3033) is fixedly connected to a first return spring (3031), each of the first return springs (3031) are symmetrical with each other, and the other end of the first return spring (3031) is fixedly connected to the inner wall of the second slide groove (303); a connecting plate (3034) is fixedly installed on one side wall between each of the tilting blocks (3033), each of the connecting plates (3034) are symmetrical with each other, and a sealing plate (3035) is fixedly installed on the side wall opposite to each of the connecting plates (3034), each of the sealing plates (3035) are symmetrical with each other, and each of the sealing plates (3035) is respectively located at the bottom of the placement tube (304).

7. The CVD wafer coating equipment according to claim 6, characterized in that: The third sliding mechanism comprises a plurality of third sliding grooves (3041), each of the third sliding grooves (3041) is symmetrical with each other, a third sliding block (3042) is slidably installed in the inner cavity of each third sliding groove (3041), each of the third sliding blocks (3042) is symmetrical with each other, and a movable plate (3043) is fixedly installed between each of the third sliding blocks (3042).

8. The CVD wafer coating equipment according to claim 7, characterized in that: A rectangular groove (305) is provided in the inner cavity of each of the third sliding grooves (3041), and a moving rod (3051) is provided in the inner cavity of each of the rectangular grooves (305). One end of each of the moving rods (3051) is fixedly connected to the third sliding block (3042).

9. The CVD wafer coating equipment according to claim 8, characterized in that: A mounting rod (3052) is fixedly mounted above one end of each movable rod (3051) away from the placement tube (304), each mounting rod (3052) is movably inserted into the plug-in tube (3021), and a top plate (3053) is fixedly connected above each mounting rod (3052).

10. The CVD wafer coating equipment according to claim 9, characterized in that: Two mutually symmetrical push rods (204) are fixedly mounted above the two lower mounting plates (2023), and each push rod (204) is higher than the lower coating cylinder (2024).

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