Packaging process of electronic semiconductor element

Abstract

The invention provides a packaging process of an electronic semiconductor element, which comprises a packaging box internally provided with a workbench, symmetrical element adsorption arms are arranged at two sides of the workbench in the packaging box, the top surface of the workbench is provided with element combination grooves which are arranged at equal intervals, a dispensing mechanism is arranged above the element combination grooves, and the dispensing mechanism is arranged above the workbench. An element protection shell fixed through vacuum adsorption is embedded in the element combination groove, symmetrical vacuum air channel shells are arranged at the two ends of the element protection shell, and the vacuum air channel shells communicate with the interior of the element protection shell; according to the invention, the element protection shell can be fixed, air in the element protection shell is extracted after the electronic semiconductor element is combined and packaged, so that vacuum is formed in the element protection shell, and the protection performance of the electronic semiconductor element is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor component packaging, and more specifically, to a packaging process for electronic semiconductor components. Background Art

[0002] The packaging of electronic semiconductor components refers to the process of processing a tested wafer into independent chips according to product models and functional requirements, and protecting, connecting, and fixing them. The protection of the chips can prevent impurities in the air from corroding the chip circuits, avoid damage to the chips by external forces, and ensure the stable operation of the chips in various environments.

[0003] The packaging of electronic semiconductor components generally seals the semiconductor components after chip engraving and places them inside a copper shell for protection. However, the ordinary packaging method only seals the top of the copper shell and the circuit board with resin. There will still be some air remaining inside the copper shell where the semiconductor components are installed, making it difficult to ensure that the internal circuits of the copper shell are not oxidized and corroded.

[0004] Therefore, we have made improvements in this regard and proposed a packaging process for electronic semiconductor components. Summary of the Invention

[0005] The purpose of the present invention is to address the problem that after the electronic semiconductor is packaged, it is still exposed to air, resulting in oxidation and corrosion of the circuit by the air.

[0006] To achieve the above-mentioned invention purpose, the present invention provides a packaging process for electronic semiconductor components to improve the above problems.

[0007] Specifically, this application is as follows:

[0008] A packaging process for electronic semiconductor components includes:

[0009] A packaging box with a workbench inside. On both sides of the workbench inside the packaging box, there are symmetric component adsorption arms. On the top surface of the workbench, there are equally spaced component combination grooves. Above the component combination grooves, there is a dispensing mechanism. Inside the component combination grooves, there are component protection shells fixed by vacuum adsorption. At both ends of the component protection shells, there are symmetric vacuum airway shells. The vacuum airway shells are internally connected to the component protection shells. Inside the vacuum airway shells, there is a sliding-connected extraction seal elastically sealed. Inside the extraction seal, there are annularly and equally distributed elastic return members. The elastic return members elastically drive the extraction seal to self-seal. The bottom end of the extraction seal is inserted and adsorbed to communicate with the component combination grooves;

[0010] The specific packaging process of the packaging process for electronic semiconductor components includes the following steps:

[0011] Step 1: Place the leads of the cut wafer, component protective case, and frame gasket above the workbench;

[0012] Step 2: The component adsorption arm adsorbs the component protective case and places it in the component combination groove. Subsequently, gradually place the leads of the cut wafer and frame gasket inside the component protective case. Take the dispensing mechanism to bond and seal the wafer, component protective case, and frame gasket leads, and let it stand and solidify;

[0013] Step 3: The packaging box is connected to the air extraction seal through the component combination groove. Pull the extraction seal to open the double seal inside the vacuum airway shell. The packaging box activates the vacuum adsorption function, enabling the component combination groove to extract air into the vacuum airway shell through the extraction seal. The vacuum airway shell extracts the air inside the component protective case until the air inside the component protective case is completely extracted to form a vacuum seal;

[0014] Step 4: The packaging box is separated from the extraction seal through the component combination groove. The extraction seal instantaneously completes self-sealing and contracts into the vacuum airway shell due to the suction force inside the component protective case, completing the vacuum packaging of the electronic semiconductor component.

[0015] As a preferred technical solution of this application, workpiece placement areas are provided on both sides of the component combination groove on the top surface of the workbench. The component protective case is located inside the workpiece placement area. One side of the outer wall of the packaging box is connected with a control console, and the control console is electrically connected to the packaging box, component adsorption arm, and component combination groove.

[0016] As a preferred technical solution of this application, the component adsorption arm includes two hinge seats fixedly connected to both sides of the inner wall of the packaging box. An electric telescopic arm is hinged between the hinge seats. The output end of the electric telescopic arm is vertically connected with an electric lifting arm. The output end of the electric lifting arm is connected with a vacuum suction cup. A rotating gear is provided in the middle of the end of the electric telescopic arm hinged with the hinge seat. The top surface of the bottom hinge seat is connected with a driving motor, and the output end of the driving motor is connected with a driving gear, and the driving gear meshes with the driving motor for transmission.

[0017] As a preferred technical solution of this application, the dispensing mechanism includes a driving motor fixedly connected to the center of the inner top surface of the packaging box. The output end of the driving motor is connected with an installation cross plate. The bottom surface of the installation cross plate is provided with equally spaced packaging liquid pipes. The bottom end of the packaging liquid pipe is connected with a corrugated telescopic pipe with internal communication. The bottom surface of the corrugated telescopic pipe is connected with a dispensing head, and the dispensing head is located directly above the component combination groove.

[0018] As a preferred technical solution of the present application, symmetrical positioning grooves are provided on both inner sides of the element combination groove. At the center of the inner bottom surface of the element combination groove, a vertical support rod is provided. The top end of the support rod is connected to a second suction cup. At the center of the inner bottom surface of the support rod, a vertical combined telescopic rod is fixedly connected. The output end of the combined telescopic rod is connected to a buckle cover. On the top surface of the combined telescopic rod, a sealing cylinder is provided. The top end of the sealing cylinder is hermetically fixed with a rubber sleeve. A sealing ring is embedded in the inner wall of the sealing cylinder. Vacuum tubes are connected inside both the combined telescopic rod and the second suction cup. The other ends of the vacuum tubes are communicated with the inside of the sealed box.

[0019] As a preferred technical solution of the present application, a semiconductor element is bonded to the inner side of the element protective shell. The top of the semiconductor element is electrically connected to a circuit board body. The outer wall of the bottom surface of the circuit board body is adhesively sealed to the top end of the element protective shell. Equally spaced pins are electrically connected to the top surface of the circuit board body.

[0020] As a preferred technical solution of the present application, a storage chamber is provided inside the vacuum airway shell. At the center of the storage chamber, a micro spring is provided. A barrier area is provided above the storage chamber inside the vacuum airway shell. A sealing baffle is provided between the barrier area and the storage chamber. The top end of the micro spring abuts against the center of the bottom surface of the sealing baffle. Annularly equally spaced through holes are provided on the outer side of the sealing baffle. A return airway is provided on one side of the top of the barrier area. The other end of the return airway is communicated with both sides of the inner bottom surface of the element protective shell. A bottom suction port is provided at the position where the return airway is communicated with the element protective shell.

[0021] As a preferred technical solution of the present application, the extraction seal includes a sealing collar and a pull column. An exhaust port is provided on the bottom surface of the sealing collar. The pull column is hermetically slid on the inner wall of the exhaust port. A fitting connection is provided on the top surface of the sealing collar. The sealing collar is hermetically sealed outside the through hole by fitting. An air vent groove is provided at the center of the top surface of the sealing collar. The bottom end of the micro spring abuts against the inner wall of the air vent groove. A vacuum extraction port is provided on the outer side of the inner bottom surface of the air vent groove. A return airway is provided inside the sealing collar on the inner side of the vacuum extraction port. The return airway is communicated with the exhaust port.

[0022] The cam is provided with a rubber sealing member, the outer wall of the rubber sealing member is provided with a rubber ball, the top of the rubber sealing member is provided with a rubber ball, the top of the rubber ball is fixed on the bottom surface of the rubber ball, and an airway connecting hole is provided inside the sealing ring, one end of the airway connecting hole is connected to the top surface of the sealing ring, and the other end of the airway connecting hole is connected to the inside of the vacuum pumping chamber.

[0023] As a preferred technical solution of the present application, the elastic return piece is located inside the bottom surface of the sealing ring, a push rod receiving groove is provided at the position where the sealing ring is connected to the elastic return piece, a T-shaped push rod is provided inside the push rod receiving groove for limited sliding, a sealing spring is provided at the top of the inner side of the push rod receiving groove, the bottom end of the sealing spring abuts against the outer wall of the T-shaped push rod, and the end of the T-shaped push rod facing away from the sealing spring abuts against the inner bottom surface of the circular airway.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] In the scheme of the present application: the component protective shell can be fixed by means of a combined telescopic rod designed in cooperation with the vacuum seal inside the component combination groove, and after the electronic semiconductor component combination packaging is completed, the air inside the component protective shell is extracted by sealingly cooperating with the vacuum seal through the combined telescopic rod and installed, so as to form a vacuum inside the shell, thereby improving the protective performance of the electronic semiconductor component. At the same time, after the vacuum extraction is completed, automatic sealing can be achieved, and after sealing, the function of detecting the vacuum degree inside the electronic semiconductor component can be achieved.

[0026] 1. The present invention is provided with vacuum air duct shells at both ends of the component protection shell, and a curved return air duct is opened inside the vacuum air duct shell, which can ensure that the vacuum extracted air has a stable flow path when the packaging box extracts the air inside the component protection shell through the component combination groove, and can accurately extract the air deep inside the component protection shell, so that a vacuum seal is formed inside, thereby improving the service life of the electronic semiconductor components.

[0027] 2. The extraction seal of the present invention is divided into a sealing collar and a pull column. After the air extraction inside the component protective shell is completed during the packaging process, the air flow path inside the sealing collar and the sealing ring at the top of the pull column can form a reflux closed seal, thereby improving the sealing effect inside the vacuum airway shell. The micro-spring provided inside the storage bin cooperates with the sealing collar to achieve the detection of the vacuum degree inside the component protective shell.

[0028] 3. The elastic return member provided inside the sealing ring can provide a closing driving force for the connection between the pull column and the sealing collar. When extracting vacuum inside the component protective shell, the pull of the pull column can be used to open the double-sealed vacuum airway shell to achieve the connection between the inside and outside of the component protective shell. After the vacuum extraction is completed, the sealing spring applies a thrust, which can then apply a thrust to the sealing ring to automatically complete the sealing of the extraction seal. When the inside of the component protective shell is in a vacuum state, the suction of the vacuum adsorbs the extraction seal and automatically compresses the micro-spring to contract inside the storage bin, completing the double-sealing inside the vacuum airway shell. Moreover, the double-sealing has a linkage effect, which can further improve the sealing effect and the accuracy of vacuum degree detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of an encapsulation process for an electronic semiconductor component provided by the present invention;

[0030] Figure 2 For Figure 1 a schematic diagram of the top cross-section structure of the shown packaging box;

[0031] Figure 3 For Figure 2 a schematic diagram of the internal structure of the shown packaging box;

[0032] Figure 4 For Figure 3 a schematic diagram of the enlarged decomposed structure of the shown component adsorption arm;

[0033] Figure 5 For Figure 3 a schematic diagram of the enlarged structure of the position of the shown component combination groove;

[0034] Figure 6 For Figure 5 a schematic diagram of the enlarged decomposed cross-sectional structure in the middle of the shown component combination groove;

[0035] Figure 7 For Figure 6 a schematic diagram of the enlarged decomposed structure of the position of the shown component protective shell;

[0036] Figure 8 For Figure 7 a schematic diagram of the enlarged cross-sectional structure in the middle of the shown vacuum airway shell;

[0037] Figure 9 is Figure 8 a schematic structural decomposition diagram of the top cross-section of the vacuum airway housing shown;

[0038] Figure 10 is Figure 9 a schematic structural decomposition diagram of the cross-section of the position of the air extraction seal shown;

[0039] Figure 11 is Figure 10 a schematic structural decomposition diagram of the cross-section of the pull column shown;

[0040] Figure 12 is Figure 10 a magnified schematic structural decomposition diagram of the middle cross-section of the sealing ring shown.

[0041] Labels in the figure:

[0042] 1. Sealing box; 11. Workbench; 111. Workpiece placement area; 12. Control console;

[0043] 2. Component adsorption arm; 21. Hinge seat; 22. Electric telescopic arm; 23. Electric lifting arm; 24. Vacuum suction cup; 25. Rotating gear; 26. Driving motor; 27. Driving gear;

[0044] 3. Glue dispensing mechanism; 31. Driving motor; 32. Installation cross plate; 33. Encapsulation liquid pipe; 34. Corrugated telescopic pipe; 35. Glue dispensing head;

[0045] 4. Component combination groove; 41. Positioning groove; 42. Support rod; 43. Second suction cup; 44. Combination telescopic rod; 45. Cover; 46. Sealing cylinder; 47. Rubber sleeve; 48. Sealing ring; 49. Vacuum pipe;

[0046] 5. Component protective shell; 51. Semiconductor component; 52. Circuit board body; 53. Pin;

[0047] 6. Vacuum airway housing; 61. Storage bin; 611. Micro spring; 62. Blocking area; 63. Sealing baffle; 64. Through hole; 65. Return air duct; 66. Bottom air suction port;

[0048] 7. Extraction seal; 71. Sealing sleeve ring; 711. Ventilation groove; 712. Vacuum extraction port; 713. Return-shaped air duct; 714. Exhaust port; 72. Pull column; 721. Sealing ring; 722. Avoidance sliding groove; 723. Vacuum extraction chamber; 724. Shrinkage sleeve; 725. Limit sliding area; 726. Air duct connection hole; 727. Limit sliding rod; 728. Rubber plugging piece; 729. Rubber ball; 73. Closing gasket;

[0049] 8. Elastic return member; 81. Thumb rod storage groove; 82. T-shaped thumb rod; 83. Sealing spring. Detailed implementation mode

[0050] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0051] As described in the background art, after the electronic semiconductor is packaged, it will still be in the air, and the circuit will be oxidized and corroded by the air.

[0052] To solve this technical problem, the present invention provides a packaging process for electronic semiconductor components, which is applied to the sealing in the chip packaging process of electronic semiconductor processing, and has the function of extracting the air between the electronic semiconductor and the copper protection shell after the sealing is completed, ensuring that the storage space of the electronic semiconductor is completely in a safe and sealed state, thereby ensuring the service life of the electronic semiconductor chip and its own heat dissipation effect.

[0053] Specifically, please refer to Figures 1 - 12 , the packaging process of the electronic semiconductor component specifically includes:

[0054] A packaging box 1 with a workbench 11 opened inside. On both sides of the workbench 11 inside the packaging box 1, there are symmetric component adsorption arms 2. On the top surface of the workbench 11, there are equidistantly arranged component combination grooves 4. Above the component combination grooves 4, there is a dispensing mechanism 3. Inside the component combination grooves 4, there is a component protection shell 5 fixed by vacuum adsorption. At both ends of the component protection shell 5, there are symmetric vacuum airway shells 6. The vacuum airway shells 6 are internally connected to the inside of the component protection shell 5. Inside the vacuum airway shells 6, there is a sliding-connected extraction seal 7 elastically sealed. Inside the extraction seal 7, there are annularly and equidistantly distributed elastic return members 8. The elastic return members 8 elastically drive the extraction seal 7 to self-seal, and the bottom end of the extraction seal 7 is inserted and adsorbed and communicated with the component combination groove 4;

[0055] The specific packaging process of the electronic semiconductor component packaging process includes the following steps:

[0056] Step 1: Place the cut wafers, component protection shells 5, and the leads of the frame gaskets above the workbench 11;

[0057] Step 2: The component adsorption arm 2 adsorbs the component protective shell 5 and places it in the component combination groove 4. Subsequently, the cut wafers and frame gasket leads are gradually taken and placed inside the component protective shell 5. Then, the dispensing mechanism 3 is taken to bond and seal the wafers, the component protective shell 5, and the frame gasket leads, and left to stand and solidify.

[0058] Step 3: The sealing box 1 is connected to the air extraction seal through the component combination groove 4. The extraction seal 7 is pulled to open the double seal inside the vacuum airway shell 6. The sealing box 1 activates the vacuum adsorption function, enabling the component combination groove 4 to extract air from the inside of the vacuum airway shell 6 through the extraction seal 7. The vacuum airway shell 6 extracts the air inside the component protective shell 5 until the air inside the component protective shell 5 is completely extracted to form a vacuum seal.

[0059] Step 4: The sealing box 1 is separated from the extraction seal 7 through the component combination groove 4. The extraction seal 7 instantaneously completes self-sealing and contracts into the vacuum airway shell 6 under the suction force inside the component protective shell 5, completing the vacuum packaging of the electronic semiconductor component 51.

[0060] A packaging process for an electronic semiconductor component provided by the present invention, through the combined telescopic rod 44 designed in cooperation with the inside of the component combination groove 4 and the air extraction seal, can fix the component protective shell 5. After the combined packaging of the electronic semiconductor component 51 is completed, through the sealed cooperation installation of the combined telescopic rod 44 and the air extraction seal, the air inside the component protective shell 5 is extracted to form a vacuum inside it, improving the protection performance of the electronic semiconductor component 51. At the same time, after the vacuum extraction is completed, automatic sealing can be achieved, and it has the function of detecting the vacuum degree inside the electronic semiconductor component 51 after sealing.

[0061] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0062] It should be noted that, without conflict, the embodiments in the present invention and the features and technical solutions in the embodiments can be combined with each other.

[0063] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0064] Embodiment 1

[0065] Please refer to Figures 1 - 12, a packaging process for an electronic semiconductor component. On the top surface of the workbench 11, workpiece placement areas 111 are provided on both sides of the component combination groove 4. The component protective shell 5 is located inside the workpiece placement area 111. One side of the outer wall of the packaging box 1 is connected to a control console 12, and the control console 12 is electrically connected to the packaging box 1, the component suction arm 2, and the component combination groove 4.

[0066] The component suction arm 2 includes two hinge seats 21 fixedly connected to both sides of the inner wall of the packaging box 1. An electric telescopic arm 22 is hinged between the hinge seats 21. The output end of the electric telescopic arm 22 is vertically connected to an electric lifting arm 23. The output end of the electric lifting arm 23 is connected to a vacuum suction cup 24. In the middle of the end of the electric telescopic arm 22 hinged to the hinge seat 21, there is a rotating gear 25. On the top surface of the bottom hinge seat 21, a driving motor 26 is connected. The output end of the driving motor 26 is connected to a driving gear 27, and the driving gear 27 meshes and drives with the driving motor 26.

[0067] The dispensing mechanism 3 includes a driving motor 31 fixedly connected to the center of the inner top surface of the packaging box 1. The output end of the driving motor 31 is connected to a mounting cross plate 32. On the bottom surface of the mounting cross plate 32, there are evenly arranged packaging liquid tubes 33. The bottom end of the packaging liquid tube 33 is connected to a corrugated telescopic tube 34 with internal communication. The bottom surface of the corrugated telescopic tube 34 is connected to a dispensing head 35, and the dispensing head 35 is located directly above the component combination groove 4.

[0068] On both sides inside the component combination groove 4, symmetric positioning grooves 41 are provided. At the center of the inner bottom surface of the component combination groove 4, there is a vertical support rod 42. The top end of the support rod 42 is connected to a second suction cup 43. At the center of the inner bottom surface of the support rod 42, a vertical combined telescopic rod 44 is fixedly connected. The output end of the combined telescopic rod 44 is connected to a cover 45. On the top surface of the combined telescopic rod 44, there is a sealing cylinder 46. The top end of the sealing cylinder 46 is hermetically fixed to a rubber sleeve 47. A sealing ring 48 is embedded in the inner wall of the sealing cylinder 46. Both the combined telescopic rod 44 and the second suction cup 43 are internally connected to a vacuum tube 49, and the other end of the vacuum tube 49 is connected to the inside of the packaging box 1.

[0069] Inside the component protective shell 5, a semiconductor component 51 is bonded. The top of the semiconductor component 51 is electrically connected to a circuit board body 52. The outer wall of the bottom surface of the circuit board body 52 is bonded and sealed to the top end of the component protective shell 5. On the top surface of the circuit board body 52, evenly arranged pins 53 are electrically connected.

[0070] The internal of the vacuum airway housing 6 is provided with a storage bin 61. At the center of the internal of the storage bin 61, there is a micro-spring 611. Above the storage bin 61 inside the vacuum airway housing 6, there is a barrier zone 62. Between the barrier zone 62 and the storage bin 61, there is a sealing baffle 63. The top end of the micro-spring 611 abuts against the center of the bottom surface of the sealing baffle 63. The outer side of the internal of the sealing baffle 63 is provided with through holes 64 arranged in an annular and equally spaced manner. On one side of the top of the barrier zone 62, there is a return airway 65. The other end of the return airway 65 communicates with both sides of the inner bottom surface of the component protection housing 5. At the position where the return airway 65 communicates with the component protection housing 5, there is a bottom air suction port 66.

[0071] Both ends of the component protection housing 5 are provided with vacuum airway housings 6, and a curved return airway 65 is provided inside the vacuum airway housing 6. When the sealed box 1 extracts the air inside the component protection housing 5 through the component combination groove 4, it can ensure that the vacuum extraction air has a stable flow path, and at the same time, it can accurately extract the air deep inside the component protection housing 5 to form a vacuum seal inside, improving the service life of the electronic semiconductor component 51.

[0072] Embodiment 2

[0073] The packaging process of an electronic semiconductor component provided in Embodiment 1 is further optimized. Specifically, as Figures 1 - 12 , the extraction seal 7 includes a sealing collar 71 and a pull column 72. An exhaust port 714 is provided on the bottom surface of the sealing collar 71. The pull column 72 is hermetically slid on the inner wall of the exhaust port 714. A closed sealing pad 73 is provided on the top surface of the sealing collar 71 in a fitting connection manner. The sealing collar 71 is hermetically sealed outside the through hole 64 through the closed sealing pad 73. A ventilation groove 711 is provided at the center of the top surface of the sealing collar 71. The bottom end of the micro-spring 611 abuts against the inner wall of the ventilation groove 711. A vacuum air extraction port 712 is provided on the outer side of the inner bottom surface of the ventilation groove 711. Inside the sealing collar 71 on the inner side of the vacuum air extraction port 712, there is a return airway 713, and the return airway 713 communicates with the exhaust port 714.

[0074] The top of the pull-out column 72 is connected to a sealing ring 721, and a position-avoiding sliding groove 722 matching the exhaust port 714 is provided between the sealing ring 721 and the position-avoiding sliding groove 722. The sealing ring 721 slides in close contact with the inner wall of the circular airway 713, and the position-avoiding sliding groove 722 slides in close contact with the inner wall of the exhaust port 714. A vacuum pumping chamber 723 is provided on the inner side of the pull-out column 72, and a shrink sleeve 724 is connected to the center of the vacuum pumping chamber 723. A limited sliding area 725 is provided inside the shrink sleeve 724. The limited sliding area 725 The inner limiting slide has a limiting slide rod 727, and the bottom end of the limiting slide rod 727 is connected to a rubber sealing piece 728. The outer wall of the rubber sealing piece 728 is fitted and embedded in the bottom of the inner wall of the vacuum pumping chamber 723. A rubber ball 729 is provided on the inner side of the rubber sealing piece 728, and the top of the rubber ball 729 is fixed on the bottom surface of the limiting slide rod 727. An airway connecting hole 726 is opened inside the sealing ring 721, and one end of the airway connecting hole 726 is connected to the top surface of the sealing ring 721, and the other end of the airway connecting hole 726 is connected to the inside of the vacuum pumping chamber 723.

[0075] The extraction seal 7 is divided into a sealing ring 71 and a pull-out column 72. After the packaging box 1 completes the extraction of air from the component protective shell 5, the air flow path inside the sealing ring 71 and the sealing ring 721 at the top of the pull-out column 72 can be used to form a reflux closed seal, thereby improving the sealing effect inside the vacuum air duct shell 6. The micro-spring 611 arranged inside the storage bin 61 cooperates with the sealing ring 71 to realize the vacuum degree detection inside the component protective shell 5.

[0076] Example 3

[0077] The packaging process of an electronic semiconductor element provided in Example 1 or 2 is further optimized. Specifically, Figures 1 - 12 As shown, the elastic return member 8 is located inside the bottom surface of the sealing ring 71, and a push rod receiving groove 81 is provided at the position where the sealing ring 71 is connected to the elastic return member 8. A T-shaped push rod 82 is slidingly limited inside the push rod receiving groove 81, and a sealing spring 83 is provided on the top of the inner side of the push rod receiving groove 81. The bottom end of the sealing spring 83 abuts against the outer wall of the T-shaped push rod 82, and the end of the T-shaped push rod 82 facing away from the sealing spring 83 abuts against the inner bottom surface of the circular airway 713.

[0078] The setting of the internal elastic return member 8 in the sealing ring 721 can provide a closing driving force for the connection between the draw column 72 and the sealing sleeve ring 71. When evacuating the inside of the component protective shell 5, the tensile force of the draw column 72 can be used to open the double-sealed vacuum airway shell 6, realizing the connection between the inside and the outside of the component protective shell 5. After the vacuum extraction is completed, the sealing spring 83 applies a thrust, which can then apply a thrust to the sealing ring 721 to automatically complete the sealing of the extraction seal 7. When the inside of the component protective shell 5 is in a vacuum state, the suction of the vacuum adsorbs the extraction seal 7 and automatically squeezes the micro-spring 611 to contract inside the storage bin 61, completing the double sealing inside the vacuum airway shell 6. Moreover, the double sealing has linkage, which can further improve the sealing effect and the accuracy of vacuum degree detection.

[0079] The usage process of a packaging process for electronic semiconductor components provided by the present invention is as follows:

[0080] Place the electronic semiconductor component 51 to be packaged in the workpiece placement area 111, then close the door of the packaging box 1, and then send a control command to the packaging box 1 through the console 12.

[0081] It should be noted that: The packaging box 1 of the present invention is equipped with a complete program drive system and a vacuum pump. The console 12 can input commands to the packaging box 1 through a computer to directly drive the component suction arm 2 and the combined telescopic rod 44 inside the packaging box 1 to work.

[0082] When the packaging box 1 receives the command, the drive motor 26 of the component suction arm 2 starts, driving the electric telescopic arm 22 to rotate. The electric lifting arm 23 at the output end of the electric telescopic arm 22 will move into the workpiece placement area 111. Then the electric telescopic arm 22 will start to drive the electric lifting arm 23 to move. Through the rotation and telescopic cooperation of the electric telescopic arm 22, the electric lifting arm 23 can be accurately moved directly above the workpiece. Then the electric lifting arm 23 starts to drive the vacuum suction cup 24 to move down to adsorb the workpiece, and the electric telescopic arm 22 rotates to move the adsorbed workpiece into the component combination slot 4.

[0083] When the component protective shell 5 moves into the component combination slot 4, the packaging box 1 will start the vacuum pump through the vacuum tube 49, so that the second suction cup 43 adsorbs and fixes the component protective shell 5.

[0084] It should be noted that: When the component protective shell 5 falls into the component combination slot 4, since the component combination slot 4 is trapezoidal in reverse, the far-sighted protective shell will slide to the center. And because both ends of the component protective shell 5 are provided with vacuum airway shells 6, the component protective shell 5 will be accurately embedded inside the component combination slot 4.

[0085] After the component protective shell 5 is placed inside the component combination groove 4, glue can be added to the inside of the component protective shell 5 by pulling the dispensing head 35. After that, the component adsorption arm 2 continues to adsorb and hold the semiconductor component 51, the circuit board body 52, and the pins 53 for combined packaging with the component protective shell 5. After sealing, the combined telescopic rod 44 inside the component combination groove 4 can be activated to extract the air inside the component protective shell 5.

[0086] After the combined telescopic rod 44 is activated, the cover 45 connected to its output end will move upward and gradually contact the rubber plugging member 728 and the rubber ball 729. When the cover 45 abuts against the rubber ball 729, with the push of the combined telescopic rod 44, the cover 45 will be buckled outside the rubber ball 729 to complete the clamping of the cover 45 and the rubber ball 729. At this time, when the combined telescopic rod 44 moves downward, it can pull the rubber ball 729 downward, and at the same time drive the rubber plugging member 728 and the limit sliding rod 727 downward. When the limit sliding rod 727 moves downward to the inner bottom of the limit sliding area 725.

[0087] When the combined telescopic rod 44 continues to move downward, it will pull the pull column 72 downward. When the pull column 72 moves downward, it will drive the sealing ring 721 downward at the same time, causing the sealing ring 721 to press the T-shaped ejector rod 82 to contract, so that the sealing ring 721 moves to the bottom of the return air duct 713 to open the first layer of seal. With the continuous downward movement of the pull column 72, the pull column 72 will pull the sealing sleeve ring 71 downward at the same time. When the sealing sleeve ring 71 moves downward, the annular sealing gasket will be separated from the through hole 64 to open the second layer of seal. At this time, as the pull column 72 drives the sealing sleeve ring 71 downward to the bottom of the storage bin 61.

[0088] The bottom end of the pull column 72 will be inserted and embedded inside the rubber sleeve 47 and the sealing cylinder 46. Through the fitting of the sealing ring 48 on the inner wall of the sealing cylinder 46 and the rubber sleeve 47, the vacuum pumping chamber 723 at the bottom of the pull column 72 can be connected to the return air duct 65.

[0089] At this time, start the vacuum pump inside the packaging box 1 to suck the air inside the sealing cylinder 46 inside the combined telescopic rod 44, so that the air inside the component protective shell 5 can enter the return air duct 65 through the bottom air suction port 66. The air passes through the return air duct 65 and enters the blocking area 62 and flows towards the through hole 64. The air passing through the through hole 64 enters the storage bin 61 and flows towards the ventilation groove 711. The air entering the ventilation groove 711 enters the return air duct 713 through the vacuum pumping port 712. The air above the return air duct 713 will be blocked by the sealing ring 721, so it enters the air duct communication hole 726 inside the sealing ring 721. The air passes through the air duct communication hole 726 and enters the vacuum pumping chamber 723 inside, so that the air passes through the vacuum pumping chamber 723 and enters the sealing cylinder 46 and is pumped away by the vacuum equipment inside the packaging box 1.

[0090] When the air inside the component protective shell 5 is completely extracted or reaches the vacuum degree required for component protection, start the combined telescopic rod 44 to move upward, and push the limit sliding rod 727 connected to the rubber ball 729 upward.

[0091] During this process, since the sealing ring 721 loses the pulling force, the elastic return member 8 connected to the bottom surface of the sealing ring 721 will lose the pressure. At this time, the sealing spring 83 will instantly bounce up, causing the sealing ring 721 to move upward to the inner top surface of the return air duct 713 under the push of the T-shaped ejector rod 82, completing the sealing between the sealing ring 721 and the inner wall of the return air duct 713. At the same time, the access hole 64 will fit on the inner top surface of the return air duct 713, completing the closed sealing inside the sealing sleeve ring 71.

[0092] At this time, with the continuous upward movement of the combined telescopic rod 44, the sealing sleeve ring 71 and the pull-out column 72 will be subjected to the vacuum suction force inside the component protective shell 5 in the storage bin 61 and contract to the inner wall of the storage bin 61. When the closing gasket 73 on the top surface of the sealing sleeve ring 71 is completely closed with the through hole 64 inside the sealing baffle 63, the double-layer closing seal is completed.

[0093] It should be noted that: in the present invention, the vacuum suction force inside the component protective shell 5 will not be filled with air due to the upward movement of the extraction seal 7. Since the inside of the storage bin 61 is in a vacuum state during vacuum extraction, after the extraction seal 7 moves upward, no air will be generated inside the storage bin 61 and flow into the component protective shell 5.

[0094] After the extraction seal 7 is completely stored inside the storage bin 61, the combined telescopic rod 44 moves upward, pushing the rubber plugging member 728 into the vacuum pumping chamber 723. Through the friction between the rubber plugging member 728 and the inner wall of the vacuum pumping chamber 723, and the suction force of the vacuum state inside the vacuum pumping chamber 723 at this time, the combined telescopic rod 44 can be started to move downward to complete the separation of the cover 45 from the rubber ball 729, completing the entire packaging process of the semiconductor component 51.

[0095] It should be noted that: when the combined telescopic rod 44 moves downward to bring out the rubber plugging piece, the rubber plugging member 728 can be embedded inside the vacuum pumping chamber 723 by pressing it, completing the storage of all the structures of the component protective shell 5.

[0096] During the use of the present invention, if the vacuum degree inside the component protective shell 5 is insufficient, the extraction seal 7 will extend and pop out to the outside of the storage bin 61 under the elastic force of the micro spring 611. By observing above the vacuum air duct shell 6, the pull-out column 72 can accurately determine whether the component protective shell 5 is in a vacuum state, realizing the vacuum degree detection function.

[0097] In the present invention, unless otherwise clearly specified or limited, the terms "installed", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection, an electrical connection, or communication with each other; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0098] Obviously, the embodiments described above are only a part of the embodiments of the present invention, rather than all of the embodiments. The preferred embodiments of the present invention are given in the drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present invention in other related technical fields shall be similarly within the scope of the patent protection of the present invention.

Claims

1. A packaging process for electronic semiconductor components, characterized in that: include: A packaging box (1) is provided with a workbench (11) inside, wherein symmetrical component adsorption arms (2) are provided inside the packaging box (1) on both sides of the workbench (11), the top surface of the workbench (11) is provided with component assembly grooves (4) arranged at equal distances, a dispensing mechanism (3) is provided above the component assembly grooves (4), a component protection shell (5) fixed by vacuum adsorption is embedded inside the component assembly grooves (4), symmetrical vacuum airway shells (6) are provided at both ends of the component protection shell (5), the vacuum airway shell (6) is connected to the inside of the component protection shell (5), the vacuum airway shell (6) is elastically sealed with a slidingly connected extraction seal (7), the extraction seal (7) is provided with annular equidistantly distributed elastic return parts (8), the elastic return parts (8) elastically drive the extraction seal (7) to self-seal, and the bottom end of the extraction seal (7) is connected to the component assembly groove (4) by insertion and adsorption; The packaging process of the electronic semiconductor element comprises the following steps: Step 1: Place the cut wafer, the component protection shell (5), and the lead corner of the frame gasket on the workbench (11); Step 2: The component adsorption arm (2) adsorbs the component protection shell (5) and places it in the component assembly groove (4), then gradually takes the cut wafer and the frame gasket lead angle and places them inside the component protection shell (5), takes the glue dispensing mechanism (3), and seals the wafer, the component protection shell (5), and the frame gasket lead angle, and leaves them to solidify; Step 3: The packaging box (1) is connected to the air extraction seal through the component assembly groove (4), and the extraction seal (7) is pulled to open the double seal in the vacuum airway shell (6). The packaging box (1) starts the vacuum adsorption function, so that the component assembly groove (4) uses the extraction seal (7) to extract air from the inside of the vacuum airway shell (6), and the vacuum airway shell (6) extracts the air inside the component protection shell (5) until the air inside the component protection shell (5) is completely extracted to form a vacuum seal; Step 4: The packaging box (1) is separated from the extraction seal (7) through the component assembly groove (4), and the extraction seal (7) instantly completes self-sealing. The extraction seal (7) is then contracted into the vacuum airway shell (6) by the suction force inside the component protection shell (5), completing the vacuum packaging of the electronic semiconductor component (51).

2. The packaging process of an electronic semiconductor element according to claim 1, characterized in that: The top surface of the workbench (11) is provided with a workpiece placement area (111) on both sides of the component combination slot (4); the component protection shell (5) is located inside the workpiece placement area (111); one side of the outer wall of the packaging box (1) is connected to a control console (12); the control console (12) is electrically connected to the packaging box (1), the component adsorption arm (2) and the component combination slot (4).

3. The packaging process of an electronic semiconductor element according to claim 2, characterized in that: The component adsorption arm (2) comprises two groups of hinge seats (21) fixedly connected to the inner walls of the packaging box (1), an electric telescopic arm (22) is hinged between the hinge seats (21), the output end of the electric telescopic arm (22) is vertically connected to an electric lifting arm (23), the output end of the electric lifting arm (23) is connected to a vacuum suction cup (24), a rotating gear (25) is provided in the middle of one end of the electric telescopic arm (22) hinged to the hinge seat (21), a driving motor (26) is connected to the top surface of the hinge seat (21) at the bottom, the output end of the driving motor (26) is connected to a driving gear (27), and the driving gear (27) is meshed with the driving motor (26) for transmission.

4. The packaging process of an electronic semiconductor element according to claim 3, characterized in that: The glue dispensing mechanism (3) comprises a driving motor (31) fixedly connected to the center of the top surface of the packaging box (1); the output end of the driving motor (31) is connected to a mounting horizontal plate (32); the bottom surface of the mounting horizontal plate (32) is provided with packaging liquid pipes (33) arranged at equal intervals; the bottom end of the packaging liquid pipe (33) is connected to an internally connected corrugated telescopic pipe (34); the bottom surface of the corrugated telescopic pipe (34) is connected to a glue dispensing head (35); the glue dispensing head (35) is located directly above the component assembly slot (4).

5. The packaging process of an electronic semiconductor element according to claim 4, characterized in that: Symmetrical positioning grooves (41) are provided on both sides of the component combination groove (4); a vertical support rod (42) is provided at the center of the inner bottom surface of the component combination groove (4); the top end of the support rod (42) is connected to a second suction cup (43); a vertical combination telescopic rod (44) is fixedly connected to the center of the inner bottom surface of the support rod (42); a buckle cover (45) is connected to the output end of the combination telescopic rod (44); a sealing cylinder (46) is provided on the top surface of the combination telescopic rod (44); a rubber sleeve (47) is sealingly fixedly connected to the top end of the sealing cylinder (46); a sealing ring (48) is embedded in the inner wall of the sealing cylinder (46); a vacuum tube (49) is connected to the inside of the combination telescopic rod (44) and the second suction cup (43); the other end of the vacuum tube (49) is connected to the inside of the packaging box (1).

6. The packaging process of an electronic semiconductor element according to claim 5, characterized in that: A semiconductor element (51) is bonded to the inner side of the element protection shell (5), the top of the semiconductor element (51) is electrically connected to a circuit board body (52), the outer wall of the bottom surface of the circuit board body (52) is bonded and sealed to the top of the element protection shell (5), and the top surface of the circuit board body (52) is electrically connected to equidistantly arranged pins (53).

7. The packaging process of an electronic semiconductor element according to claim 1, characterized in that: The vacuum air duct shell (6) is provided with a storage bin (61) at the center of the storage bin (61). The vacuum air duct shell (6) is provided with a barrier zone (62) above the storage bin (61). A sealing baffle (63) is provided between the barrier zone (62) and the storage bin (61). The top end of the microspring (611) abuts against the center of the bottom surface of the sealing baffle (63). The inside and outside of the sealing baffle (63) are provided with annular through holes (64) arranged equidistantly. A return air duct (65) is provided on one side of the top of the barrier zone (62). The other end of the return air duct (65) is connected to the two sides of the inner bottom surface of the component protection shell (5). A bottom air intake port (66) is provided at the position where the return air duct (65) is connected to the component protection shell (5).

8. The packaging process of an electronic semiconductor element according to claim 7, characterized in that: The extraction seal (7) comprises a sealing ring (71) and a pulling column (72); an exhaust port (714) is provided on the bottom surface of the sealing ring (71); the pulling column (72) slides sealingly on the inner wall of the exhaust port (714); a closed sealing gasket (73) is provided on the top surface of the sealing ring (71); the sealing ring (71) is sealed on the outside of the through hole (64) by the closed sealing gasket (73); a ventilation groove (711) is provided at the center of the top surface of the sealing ring (71); the bottom end of the micro spring (611) abuts against the inner wall of the ventilation groove (711); a vacuum suction port (712) is provided on the outer side of the inner bottom surface of the ventilation groove (711); a circular air passage (713) is provided inside the sealing ring (71) on the inner side of the vacuum suction port (712); and the circular air passage (713) is communicated with the exhaust port (714) in the sealing ring (71) inside.

9. The packaging process of an electronic semiconductor element according to claim 8, characterized in that: The top of the pull-out column (72) is connected to a sealing ring (721), a position-avoiding sliding groove (722) cooperating with the exhaust port (714) is provided between the sealing ring (721) and the position-avoiding sliding groove (722), the sealing ring (721) slides in close contact with the inner wall of the circular airway (713), the position-avoiding sliding groove (722) slides in close contact with the inner wall of the exhaust port (714), a vacuum pumping chamber (723) is provided on the inner side of the pull-out column (72), a shrink sleeve (724) is connected to the center of the vacuum pumping chamber (723), a limited sliding area (725) is provided inside the shrink sleeve (724), and the limited sliding area (725) is provided inside the limited sliding area (72 5) The inner limit sliding has a limit sliding rod (727), the bottom end of the limit sliding rod (727) is connected to a rubber sealing piece (728), the outer wall of the rubber sealing piece (728) is fitted and embedded in the bottom of the inner wall of the vacuum pumping chamber (723), a rubber ball (729) is provided on the inner side of the rubber sealing piece (728), the top end of the rubber ball (729) is fixed on the bottom surface of the limit sliding rod (727), an airway connecting hole (726) is opened inside the sealing ring (721), one end of the airway connecting hole (726) is connected to the top surface of the sealing ring (721), and the other end of the airway connecting hole (726) is connected to the inside of the vacuum pumping chamber (723).

10. The packaging process of an electronic semiconductor element according to claim 9, characterized in that: The elastic return member (8) is located inside the bottom surface of the sealing ring (71); a push rod receiving groove (81) is provided at the position where the sealing ring (71) is connected to the elastic return member (8); a T-shaped push rod (82) is limitedly slid inside the push rod receiving groove (81); a sealing spring (83) is provided at the top of the inner side of the push rod receiving groove (81); the bottom end of the sealing spring (83) abuts against the outer wall of the T-shaped push rod (82); and the end of the T-shaped push rod (82) facing away from the sealing spring (83) abuts against the inner bottom surface of the circular airway (713).

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