Wafer detection device for semiconductor production

Abstract

The invention discloses a wafer detection device for semiconductor production, which relates to the technical field of wafer production detection and comprises a transfer assembly for transferring semi-finished wafers, the transfer assembly drives the wafers to transfer and automatically classifies the wafers when defective products appear, a front detection assembly is arranged on the side edge of the transfer assembly, and a rear detection assembly is arranged on the side edge of the transfer assembly. The front detection assembly detects the wafer through the optical system, the front detection assembly automatically cleans the optical system, the front detection assembly detects the defect of the wafer in time, the wafer with the defect is prevented from continuing to be processed, and larger loss is avoided. The lower end of the front side detection assembly is provided with a back side detection assembly for analyzing wafer back side metallization, the back side detection assembly is provided with a detection head capable of performing multi-angle adjustment, the upper side and the lower side of the wafer are detected at the same time, and the detection precision of the wafer is improved at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production detection, and particularly relates to a wafer detection device for semiconductor production. Background Art

[0002] The detection of wafers during the production process is crucial. Its core lies in ensuring product quality, improving the yield rate, and optimizing the process. By real-time monitoring of microscopic defects such as line width deviation, particle contamination, and metal layer detachment in key processes such as lithography, etching, and deposition, the detection technology can intercept defective products from flowing into subsequent processes, avoiding waste of resources and sharp increase in costs. At the same time, the detection data can be accurately fed back to process control to optimize parameter settings and improve the stability of the manufacturing process. In advanced manufacturing processes, the early identification of nanoscale defects is the core to ensure the performance and reliability of chips. The detection sensitivity needs to reach the sub-micron level, so as to support the high-precision manufacturing requirements of the semiconductor industry, reduce the overall production cost, and accelerate the product launch cycle. Summary of the Invention

[0003] In view of the above technical problems, the present invention discloses a wafer detection device for semiconductor production.

[0004] The technical solution adopted by the present invention to solve the above technical problems is as follows: A wafer detection device for semiconductor production includes a transfer assembly. The transfer assembly includes a detachable recovery rack and a placement rack. The recovery rack is used to place wafers during production, and the placement rack is used to place wafers with defects. A pick-up mechanism for transferring wafers is provided on the outer shell. A front detection assembly is provided inside the transfer assembly. The front detection assembly includes a first camera and a second camera, and a first detection rack, a second detection rack, a support plate, a locking rack, a locking plate, and a first cleaning rack that are slidably mounted on the outer shell. The support plate drives the wafer to move. An opening is provided at the lower end of the support plate. The first camera is provided on the first detection rack, and the second camera is provided on the second detection rack. A swing block is also rotatably provided on the outer shell. A group of second limit blocks are slidably provided at both ends of the swing block. One group of second limit blocks is rotatably connected to the locking plate, and the other group of second limit blocks is rotatably connected to the locking rack. Two groups of limit plates are slidably provided inside the locking rack. The first cleaning rack is in contact with the locking plate. A back detection assembly is provided at the lower end of the front detection assembly. The back detection assembly includes a mounting disk that is slidably mounted on the outer shell. An adjusting mechanism and a detection head are provided on the mounting disk.

[0005] Further, the pick-up mechanism includes a first adjusting plate that is slidably mounted inside the outer shell. A first adjusting column is slidably provided on the first adjusting plate. A pick-up and placement plate one is rotatably provided at the lower end of the first adjusting column. A pick-up and placement plate two is slidably provided on the pick-up and placement plate one.

[0006] Further, an adjusting disc I is slidably arranged on the support plate, a placing disc is rotatably arranged on the adjusting disc I, a plurality of adsorption blocks are arranged on the placing disc, and openings are arranged at the lower ends of both the placing disc and the adjusting disc I.

[0007] Further, a cleaning ring and a cleaning plate are slidably arranged on the cleaning frame I, a wiping disc is slidably arranged in the cleaning ring, and a blowing frame is slidably arranged on the side of the cleaning ring.

[0008] Further, a mounting block is rotatably arranged on the cleaning plate, and a plurality of blowing heads are arranged on the mounting block.

[0009] Further, a torsion spring is arranged at the position of the rotating shaft of the swinging block and the outer shell, and an electromagnet block is arranged on the limiting plate.

[0010] Further, the adjusting mechanism includes a support disc slidably mounted on the mounting disc, an adjusting disc II is slidably arranged on the support disc, a mounting column is rotatably arranged on the support disc, a limiting ball is rotatably arranged in the mounting column, the limiting ball slides in a limiting groove, and a detection head is arranged at the other end of the limiting ball.

[0011] Further, a cleaning frame II is slidably arranged on the side of the adjusting disc II, and a plurality of air blowing openings are arranged on the cleaning frame II.

[0012] Advantages compared with the prior art: The transfer component set in the present invention automatically transfers the wafers in production, and will recycle the wafers with defects, and ensure the stability of the wafers during the movement. The front detection component set in the present invention detects the wafers through an optical system, improves the detection accuracy of the wafers, and the front detection component automatically cleans the camera I and the camera II, improves the cleanliness of the camera I and the camera II, and fixes the position of the detection component on the back of the limiting block II while detecting the camera I and the camera II, avoiding the deviation of the wafers during the wiping process of the camera I and the camera II, improving the detection coherence and the accuracy of the wafer position. The back detection component set in the present invention detects the metallization condition on the back of the limiting ball through an infrared camera, and by changing the angle of the detection head, enhances the shadow effect of the surface microstructure and magnifies the visibility of the defects through the gray difference. Description of the Drawings

[0013] Figure 1 It is a right view of the overall structure of the present invention.

[0014] Figure 2 For the present invention Figure 1 A sectional view of the structure in the A-A direction in the present invention.

[0015] Figure 3Schematic diagram of the transfer component structure of the present invention.

[0016] Figure 4 Schematic diagram of the first adjusting plate structure of the present invention.

[0017] Figure 5 Right view of the front detection component structure of the present invention.

[0018] Figure 6 Schematic diagram of the front detection component structure of the present invention.

[0019] Figure 7 Schematic diagram of the cleaning rack structure of the present invention.

[0020] Figure 8 Schematic diagram of the back detection component structure of the present invention.

[0021] Figure 9 Partial structure schematic diagram of the back detection component of the present invention.

[0022] Figure 10 Cross-sectional view of the back detection component structure of the present invention.

[0023] Reference numerals: 1 - transfer component; 2 - front detection component; 3 - back detection component; 101 - outer shell; 102 - baffle; 103 - ventilation port; 104 - recovery rack; 105 - placement rack; 106 - mounting rack; 107 - first adjustment column; 108 - first adjustment plate; 109 - pick-and-place plate one; 110 - pick-and-place plate two; 201 - first detection rack; 202 - second detection rack; 203 - support plate; 204 - first adjustment disc; 205 - placement disc; 206 - wafer; 207 - locking rack; 208 - swing block; 209 - first limit block; 210 - second limit block; 211 - locking plate; 212 - first cleaning rack; 213 - first camera; 214 - second camera; 215 - adsorption block; 216 - cleaning ring; 217 - cleaning plate; 218 - limit plate; 219 - wiping disc; 220 - blowing rack; 221 - mounting block; 222 - blowing head; 223 - limit rod; 301 - mounting disc; 302 - support disc; 303 - second adjustment disc; 304 - limit groove; 305 - mounting column; 306 - limit ball; 307 - detection head; 308 - second cleaning rack; 309 - air outlet. Detailed implementation manners

[0024] Reference Figures 1 to 10A wafer detection device for semiconductor production as shown, including a transfer component 1 for placing the wafer 206. The transfer component 1 can drive the wafer 206 to move and place the wafer 206 at the working position. On the side of the transfer component 1, there is a front detection component 2 for detecting the wafer. The front detection component 2 detects the wafer 206 through an optical detection system, and drives the wafer 206 to move while detecting to improve the detection range and efficiency of the wafer 206. The front detection component 2 can automatically clean the optical system, and fix the position of the support plate 203 while cleaning, avoiding the inability to accurately locate the detection position of the wafer 206 after cleaning. At the lower end of the front detection component 2, there is a back detection component 3 for detecting the back of the wafer 206. On the back detection component 3, there is a detection head 307 with adjustable angles to improve the detection accuracy of the back of the wafer 206.

[0025] The transfer component 1 includes a housing 101. On both sides of the housing 101, a group of baffles 102 are slidably arranged. The baffles 102 enclose the inside of the housing 101. Inside the housing 101, a group of recovery racks 104 and placement racks 105 are detachably arranged. The two groups of baffles 102 are respectively aligned with the recovery rack 104 and the placement rack 105. The placement rack 105 holds the wafer 206 under processing. The recovery rack 104 is used to place the wafers with defects after detection. At the upper end of the housing 101, there are two groups of ventilation openings 103. Inside the housing 101, there is a mounting rack 106. On the mounting rack 106, a first adjusting plate 108 is slidably arranged. On the first adjusting plate 108, a first adjusting column 107 is slidably arranged. Inside the first adjusting column 107, a picking and placing plate 109 is rotatably arranged. On the picking and placing plate 109, a picking and placing plate 110 is slidably arranged. The picking and placing plate 110 is provided with a vacuum suction head. The picking and placing plate 110 fixes the wafer 206 through vacuum suction to prevent the wafer 206 from falling during the movement. After placing the recovery rack 104 and the placement rack 105 inside the housing 101, drive the first adjusting plate 108 to slide on the mounting rack 106, adjust the position of the first adjusting column 107. According to the height of the wafer to be picked, drive the first adjusting column 107 to slide on the first adjusting plate 108. The first adjusting column 107 drives the picking and placing plate 109 to move. After the picking and placing plate 109 and the picking and placing plate 110 are aligned with the height of the wafer to be picked, drive the picking and placing plate 110 to slide on the picking and placing plate 109. The picking and placing plate 110 is inserted into the bottom of the wafer 206. Start the vacuum suction head on the picking and placing plate 110 to complete the fixation of the picking and placing plate 110 and the wafer 206, preventing the wafer 206 from falling during the movement of the picking and placing plate 110. Drive the picking and placing plate 110 to reset. Drive the picking and placing plate 109 to rotate on the first adjusting column 107. The picking and placing plate 109 drives the picking and placing plate 110 to rotate. The picking and placing plate 110 drives the wafer 206 to move and place the wafer 206 at the working position.

[0026] The front detection component 2 includes a support plate 203 slidably mounted on the housing 101. An adjustment disk 204 is slidably arranged on the support plate 203. A placement disk 205 is rotatably arranged on the adjustment disk 204. A plurality of adsorption blocks 215 are arranged on the placement disk 205. Openings are provided at the lower ends of the support plate 203, the adjustment disk 204, and the placement disk 205. After placing the wafer 206 on the placement disk 205, the adsorption blocks 215 are started, and the adsorption blocks 215 adsorb the wafer 206 to complete the fixation of the placement disk 205 and the wafer 206. The moving direction of the support plate 203 on the housing 101 and the moving direction of the adjustment disk 204 on the support plate 203 are perpendicular. The support plate 203 is driven to approach the second pick-and-place plate 110. The second pick-and-place plate 110 places the wafer 206 on the placement disk 205. The adsorption blocks 215 are started to work, and the adsorption blocks 215 adsorb the wafer 206. The support plate 203 is driven to reset. The support plate 203 drives the wafer 206 to reach below the first camera 213 and the second camera 214. The support plate 203 and the adjustment disk 204 are driven to move to complete the adjustment of the position of the wafer 206, ensuring the detection range of the first camera 213 and the second camera 214 for the wafer 206 and avoiding missing positions. A first cleaning frame 212 is slidably arranged in the housing 101. A cleaning plate 217 is slidably arranged on one side of the first cleaning frame 212. A mounting block 221 is rotatably arranged on the cleaning plate 217. A plurality of air blowing heads 222 are arranged on the mounting block 221. The cleaning plate 217 is driven to slide on the first cleaning frame 212. The cleaning plate 217 drives the mounting block 221 to move to below the second camera 214. The mounting block 221 is driven to rotate on the cleaning plate 217. The mounting block 221 drives the air blowing heads 222 to rotate. After the air blowing heads 222 are aligned with the second camera 214, the second detection frame 202 is driven to move. The second detection frame 202 drives the second camera 214 to fit with the first cleaning frame 212. The air blowing heads 222 wipe the second camera 214. A cleaning ring 216 is slidably arranged on the first cleaning frame 212. A wiping disk 219 is slidably arranged in the cleaning ring 216. A blowing frame 220 is slidably arranged on the side of the cleaning ring 216. The blowing frame 220 blows and cleans the upper end of the first camera 213. The cleaning ring 216 wipes the lower end of the first camera 213. The wiping disk 219 wipes the inside of the first camera 213 to complete the cleaning of the first camera 213. The front detection component 2 further includes a first detection frame 201 and a second detection frame 202 slidably mounted on the housing 101. The second camera 214 is rotatably mounted at the lower end of the second detection frame 202. The first camera 213 is mounted at the lower end of the first detection frame 201. Both the first camera 213 and the second camera 214 detect defects in the production process of the wafer 206 through an optical vision system. A plurality of limiting rods 223 are arranged at one end of the first cleaning frame 212 close to the locking plate 211. The limiting rods 223 are in contact with the locking plate 211. The first cleaning frame 212 pushes the locking plate 211 to move. The front detection component 2 further includes a locking frame 207 slidably mounted at the bottom of the housing 101.Two groups of limiting plates 218 are slidably arranged inside the locking frame 207. Springs are arranged between the two groups of limiting plates 218 and the locking frame 207, and electromagnet blocks are arranged on the limiting plates 218. A swinging block 208 is rotatably arranged on the inner wall of the housing 101. One group of limiting block one 209 and one group of limiting block two 210 are respectively slidably arranged at both ends of the swinging block 208. The limiting block one 209 is rotatably connected to the locking frame 207, and the limiting block two 210 is rotatably connected to the locking plate 211. The locking plate 211 is slidably installed in the housing 101. A torsion spring is arranged at the position of the rotating shaft of the swinging block 208 and the housing 101. When the locking plate 211 moves, the locking plate 211 drives the limiting block two 210 to move. The limiting block two 210 drives the swinging block 208 to rotate on the housing 101. When the swinging block 208 rotates, it drives the limiting block one 209 to rotate. The limiting block one 209 drives the locking frame 207 to move. When the locking frame 207 approaches the support plate 203, the support plate 203 is inserted between the two groups of limiting plates 218. The two groups of limiting plates 218 are tightly attached to the support plate 203 through the deformation restoring force of the spring. When the electromagnet block on the limiting plate 218 is started, the limiting plate 218 and the support plate 203 are fixed to prevent the support plate 203 from shifting.,

[0027] The back detection component 3 includes a mounting disk 301 slidably mounted on the housing 101. A support disk 302 is slidably arranged on the mounting disk 301. An adjustment disk II 303 is slidably arranged on the support disk 302. A limiting groove 304 is arranged inside the adjustment disk II 303. A mounting post 305 is rotatably arranged on the support disk 302. A limiting ball 306 is rotatably arranged on the mounting post 305. The limiting ball 306 slides in the limiting groove 304. The other end of the limiting ball 306 is provided with a detection head 307. The detection head 307 performs metallization analysis on the back of the wafer 206 during processing through infrared rays. A cleaning frame II 308 is slidably arranged on the side of the adjustment disk II 303. Multiple air blowing openings 309 are arranged on the cleaning frame II 308. The air blowing openings 309 blow and clean the back of the wafer 206 to prevent dust on the back of the wafer 206 from affecting the detection accuracy. When detecting the back of the wafer 206, drive the mounting disk 301 to slide on the housing 101. The mounting disk 301 drives the back detection component 3 to move. When the back detection component 3 reaches the working position, drive the support disk 302 to slide on the mounting disk 301. The support disk 302 drives the adjustment disk II 303 and the detection head 307 to approach the wafer 206. When it is necessary to adjust the position of the detection head 307, drive the adjustment disk II 303 to slide on the support disk 302. The adjustment disk II 303 drives the limiting groove 304 to move. The limiting groove 304 drives the limiting ball 306 to rotate along the axis of the limiting ball 306 on the mounting post 305. At the same time, the limiting ball 306 drives the detection head 307 to rotate to adjust the deflection angle of the detection head 307. When it is necessary to adjust the orientation of the detection head 307, drive the mounting post 305 to rotate on the adjustment disk II 303. The mounting post 305 drives the limiting ball 306 to rotate along the axis of the mounting post 305. The limiting ball 306 drives the detection head 307 to rotate to change the orientation of the detection head 307 and complete the adjustment of the angle of the detection head 307. The multi-angle incident light combined with the infrared reflection spectrum analysis can eliminate the measurement errors caused by the surface roughness of the metal on the back of the wafer or the interface reflection, and improve the detection accuracy.

[0028] Working principle: During operation, two groups of baffles 102 on the driving housing 101 are opened, and the wafers to be produced are placed on the placement rack 105. Both the recycling rack 104 and the placement rack 105 are placed inside the housing 101. The driving baffles 102 are moved to enclose the housing 101 to prevent the detection environment from being contaminated. The driving adjusting plate 108 slides on the mounting rack 106, and the driving adjusting column 107 slides on the adjusting plate 108 to adjust the position of the pick-and-place plate 109. The driving pick-and-place plate 109 rotates on the adjusting column 107 so that the pick-and-place plate 109 is aligned with a group of wafers 206 to be removed. The driving pick-and-place plate 110 slides on the pick-and-place plate 109, and the pick-and-place plate 110 moves to the lower end of the wafer 206. The driving adjusting column 107 slides on the adjusting plate 108, and the adjusting column 107 drives the pick-and-place plate 109 and the pick-and-place plate 110 to fit with the wafer 206. The vacuum suction head on the pick-and-place plate 110 is started, and the pick-and-place plate 110 completes the adsorption of the wafer 206. At this time, the driving support plate 203 and the adjusting disk 204 are moved, and the adjusting disk 204 drives the placement disk 205 to approach the pick-and-place plate 110. The driving adjusting plate 108, the adjusting column 107 and the pick-and-place plate 109 are moved, and the pick-and-place plate 110 places the wafer 206 on the placement disk 205. The adsorption block 215 is started to work, and the adsorption block 215 adsorbs the wafer 206 on the placement disk 205 to complete the fixation of the wafer 206.

[0029] The driving support plate 203 and the adjusting disk 204 are moved, the adjusting disk 204 drives the placement disk 205 to move, the placement disk 205 drives the wafer 206 to move, the driving placement disk 205 rotates, the placement disk 205 drives the wafer 206 to rotate, the position of the wafer 206 is adjusted, and the wafer 206 is driven to reach below the camera 213 and the camera 214. The driving detection rack 201 and the detection rack 202 are moved, the detection rack 201 drives the camera 213 to approach the wafer 206, the detection rack 202 drives the camera 214 to approach the wafer 206, and the wafer 206 is detected. The position of the wafer 206 is changed through the support plate 203, the adjusting disk 204 and the placement disk 205, and the detection of the surface defects of the wafer 206 is completed through the camera 213 and the camera 214. If there are no defects in the detected wafer 206, the driving adjusting plate 108, the adjusting column 107 and the pick-and-place plate 109 are moved to place the detected wafer 206 on the placement rack 105. If defects are detected on the surface of the wafer 206, the wafer 206 is placed on the recycling rack 104.

[0030] Meanwhile, start the detection head 307 to detect the back of the wafer 206. When the position of the detection head 307 needs to be adjusted, drive the adjustment disk two 303 to slide on the support disk 302. The adjustment disk two 303 drives the limit groove 304 to move. The limit groove 304 drives the limit ball 306 to rotate along the axis of the limit ball 306 on the mounting post 305. At the same time, the limit ball 306 drives the detection head 307 to rotate to adjust the deflection angle of the detection head 307. When the orientation of the detection head 307 needs to be adjusted, drive the mounting post 305 to rotate on the adjustment disk two 303. The mounting post 305 drives the limit ball 306 to rotate along the axis of the mounting post 305. The limit ball 306 drives the detection head 307 to rotate to change the orientation of the detection head 307, complete the adjustment of the angle of the detection head 307, improve the detection accuracy of the back of the wafer, and at the same time drive the cleaning frame two 308 to slide on the adjustment disk two 303. The cleaning frame two 308 drives the air blowing port 309 to move. When the air blowing port 309 is started, the air blowing port 309 cleans the back of the wafer 206.

[0031] During the detection process, when the camera one 213 or the camera two 214 is contaminated, drive the detection frame one 201 and the detection frame two 202 to reset. At the same time, drive the cleaning frame one 212 to slide on the housing 101. The cleaning frame one 212 drives the limit rod 223 to move. The limit rod 223 pushes the locking plate 211 to move. The locking plate 211 drives the second limit block 210 to move. The second limit block 210 drives the swing block 208 to rotate on the housing 101. When the swing block 208 rotates, it drives the first limit block 209 to rotate. The first limit block 209 drives the locking frame 207 to move. When the locking frame 207 approaches the support plate 203, the support plate 203 is inserted between the two sets of limit plates 218. The two sets of limit plates 218 are in close contact with the support plate 203 through the deformation restoring force of the spring. At the same time, when the electromagnet block on the limit plate 218 is started, the limit plate 218 and the support plate 203 are fixed to prevent the support plate 203 from shifting. When the cleaning of the camera one 213 and the camera two 214 is completed, drive the cleaning frame one 212 to reset and turn off the electromagnet block on the limit plate 218. At this time, the support of the cleaning frame one 212 for the locking plate 211 is released. At this time, the swing block 208 drives the locking frame 207 to reset through the deformation restoring force of the torsion spring, releasing the limit on the support plate 203, and driving the support plate 203, the adjustment disk one 204 and the placement disk 205 to move, so that the camera one 213 and the camera two 214 continue to detect the wafer 206.

Claims

1. A wafer inspection device for semiconductor production, comprising a transfer assembly (1), characterized in that: The transfer component (1) comprises a detachable recovery rack (104) and a placement rack (105), wherein the recovery rack (104) is used to place wafers (206) in production, and the placement rack (105) is used to place wafers (206) with defects. A picking mechanism for transferring the wafers (206) is provided on the housing (101). A front detection component (2) is provided inside the transfer component (1), wherein the front detection component (2) comprises a camera 1 (213) and a camera 2 (214), and a detection rack 1 (201), a detection rack 2 (202), a support plate (203), a locking rack (207), a locking plate (211) and a cleaning rack 1 (212) slidably mounted on the housing (101). The support plate (203) drives the wafers (206) to move, and an opening is provided at the lower end of the support plate (203). The detection rack 1 (201) is provided with a plurality of locking plates, wherein the plurality of locking plates are ... 1) is provided with a camera 1 (213), the detection frame 2 (202) is provided with a camera 2 (214), the housing (101) is also provided with a swing block (208) rotatably, a group of limit blocks 2 (210) are slidably provided at both ends of the swing block (208), one group of limit blocks 2 (210) is rotatably connected to the locking plate (211), and the other group of limit blocks 2 (210) is rotatably connected to the locking frame (207), two groups of limit plates (218) are slidably provided in the locking frame (207), the cleaning frame 1 (212) is fitted with the locking plate (211), and a back detection component (3) is provided at the lower end of the front detection component (2), the back detection component (3) comprises a mounting plate (301) slidably mounted on the housing (101), and an adjustment mechanism and a detection head (307) are provided on the mounting plate (301).

2. A semiconductor production wafer inspection device according to claim 1, characterized in that: The picking mechanism comprises an adjusting plate 1 (108) slidably mounted in the housing (101), an adjusting column 1 (107) slidably mounted on the adjusting plate 1 (108), a pick-up and place plate 1 (109) rotatably mounted at the lower end of the adjusting column 1 (107), and a pick-up and place plate 2 (110) slidably mounted on the pick-up and place plate 1 (109).

3. A semiconductor production wafer inspection device according to claim 2, characterized in that: An adjustment disk (204) is slidably disposed on the support plate (203), a placement disk (205) is rotatably disposed on the adjustment disk (204), a plurality of groups of adsorption blocks (215) are disposed on the placement disk (205), and openings are disposed at the lower ends of the placement disk (205) and the adjustment disk (204).

4. A semiconductor production wafer inspection device according to claim 3, characterized in that: A cleaning ring (216) and a cleaning plate (217) are slidably disposed on the cleaning frame 1 (212), a wiping plate (219) is slidably disposed inside the cleaning ring (216), and a blowing frame (220) is slidably disposed on the side of the cleaning ring (216).

5. A semiconductor production wafer inspection device according to claim 4, characterized in that: A mounting block (221) is rotatably disposed on the cleaning plate (217), and a plurality of groups of air blowing heads (222) are disposed on the mounting block (221).

6. A semiconductor production wafer inspection device according to claim 5, characterized in that: A torsion spring is provided between the swing block (208) and the rotation axis of the housing (101), and an electromagnet block is provided on the limit plate (218).

7. The semiconductor production wafer inspection device according to claim 1, characterized in that: The adjustment mechanism comprises a support plate (302) slidably mounted on a mounting plate (301); an adjustment plate 2 (303) is slidably mounted on the support plate (302); a mounting column (305) is rotatably mounted on the support plate (302); a limit ball (306) is rotatably mounted in the mounting column (305); the limit ball (306) slides in a limit groove (304); and a detection head (307) is disposed at the other end of the limit ball (306).

8. The semiconductor production wafer inspection device according to claim 7, characterized in that: A second cleaning rack (308) is slidably disposed on the side of the second regulating disk (303), and a plurality of groups of air blowing ports (309) are disposed on the second cleaning rack (308).

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