Integrated wafer transfer platform and control method

Abstract

The invention relates to the technical field of semiconductors, in particular to an integrated wafer transfer platform and a control method, and the integrated wafer transfer platform is composed of a mounting structure, a supporting structure, a wafer conveying robot structure, a wafer extension detection structure and a wafer positioning detection structure. The integration degree is high, the occupied space can be effectively reduced, wafers can be circulated and conveyed in the wafer storage and transportation device with the limited space, and under the synergistic effect of the wafer conveying robot structure, the wafer stretching-out detection structure and the wafer positioning detection structure, the wafer can be conveyed to the wafer storage and transportation device. The time of wafer transmission between wafer extension detection and wafer positioning by the wafer transmission robot structure is effectively reduced, and the working efficiency and the generation efficiency are further improved. The driving structure is used for driving the wafer conveying robot structure, the wafer extension detection structure and the wafer positioning detection structure to vertically lift and move together through the supporting structure, so that the wafers can be conveniently conveyed in the wafer storage and transportation device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular, to an integrated wafer transfer platform and a control method therefor. Background Art

[0002] With the continuous development of semiconductor manufacturing technology, the requirements for wafer transfer equipment are also constantly increasing. As an important substrate for carrying semiconductor circuits, wafers need to be positioned and transferred efficiently and precisely throughout the manufacturing process.

[0003] Wafer transfer robots are mainly responsible for quickly and smoothly transporting wafers between different process equipment to ensure the precise positioning and transfer of wafers during the manufacturing process.

[0004] After traditional wafer transfer robots transfer wafers between various process equipment, they transfer the wafers into a wafer cassette, and then transfer the wafer cassette into a susceptor through a transfer system. During this process, it is necessary to ensure that the wafer transfer robot can operate in a high cleanliness environment, reduce the frequent contact of the wafers with the outside world before entering the susceptor in the furnace, and save space and shorten the transfer time. Therefore, wafer transfer robots are usually used for wafer transfer, transportation and other operations in a wafer storage and transportation device with limited space. Due to the simple structure of traditional wafer transfer robots, they do not have the functions of detecting wafer protrusion and wafer positioning detection, and the degree of integration is relatively low, resulting in low production efficiency. For this reason, the present invention proposes an integrated wafer transfer platform and a control method therefor, and the integrated wafer transfer platform is suitable for internal use in a wafer storage and transportation device. Summary of the Invention

[0005] Based on this, it is necessary to provide an integrated wafer transfer platform and a control method therefor in view of the above technical problems to solve the problems raised in the above background art.

[0006] According to a first aspect of the present invention, there is provided an integrated wafer transfer platform, which is applied to a wafer storage and transportation device, and includes: a support structure, a wafer transfer robot structure fixedly installed on the support structure and having the functions of wafer cassette and wafer synchronous transfer, a wafer protrusion detection structure fixedly installed on the support structure, and a wafer positioning detection structure fixedly installed on the support structure. During the vertical upward movement of the support structure from the origin position, the wafer transfer robot structure is used to synchronously transfer the wafer cassette and the wafer, and after transferring the wafer cassette to the wafer protrusion detection structure to complete the wafer protrusion detection operation, quickly transfer the wafer to the wafer positioning detection structure for wafer positioning operation. The placement areas of the wafer protrusion detection structure and the wafer positioning detection structure are at the same height to ensure the stability and transfer efficiency of the wafer during the transfer process. The wafer protrusion detection structure includes a pair of initial position protrusion induction structures and a pair of arrival position protrusion induction structures. During the wafer protrusion detection process, as the wafer in the wafer cassette protrudes outward through the wafer transfer robot structure, the initial position protrusion induction structure and the arrival position protrusion induction structure are respectively used to detect whether the edge of the wafer in the wafer cassette passes through the initial detection position and the arrival detection position in sequence.

[0007] Optionally, it further includes an installation structure and a driving structure. The driving structure is arranged at the lower end of the installation structure, and the output end of the driving structure is connected to the support structure. The installation structure includes a slide table back plate, a vertical slide table, and a slide table upper cover. The vertical slide table is fixedly installed at the front end of the slide table back plate, and the slide table upper cover is fixedly installed at the front end of the vertical slide table. A vertical installation gap is formed between the slide table upper cover and the vertical slide table. The support structure is slidably connected to the vertical installation gap. Driven by the driving structure, the support structure is used to perform vertical lifting movement along the vertical installation gap.

[0008] Optionally, the support structure includes a slider and a hanging basket. The slider is slidably connected to the vertical installation gap, and the hanging basket is fixedly installed on the slider. The output end of the driving structure is connected to the slider.

[0009] Optionally, the support structure further includes an electrical pipeline protection structure, which is used to protect the cables or air pipes of the driving structure that move with the slider.

[0010] Optionally, the wafer transfer robot structure includes a body fixedly mounted on the hanging basket, a multi-joint motion structure arranged on the body, and a wafer transfer manipulator arranged on the multi-joint motion structure. The body is a body with self-vertical direction transmission. The multi-joint motion structure includes N robotic arms controlled by the rotation of N + 1 joint axes on a horizontal plane, where N is an integer greater than 0. The wafer transfer manipulator includes a mounting base, a wafer gripper structure, and a wafer cassette gripper structure. The wafer gripper structure and the wafer cassette gripper structure are symmetrically arranged on both sides of the mounting base. The mounting base is arranged on the joint axis at the uppermost end of the multi-joint motion structure. Driven by the multi-joint motion structure, it drives the mounting base, the wafer gripper structure, and the wafer cassette gripper structure to perform rotational motion in the horizontal direction to realize the synchronous transfer of the wafer cassette and the wafer. The wafer cassette gripper structure is also provided with a first sensing structure for detecting the position and quantity of the wafers in the wafer cassette.

[0011] Optionally, the wafer protrusion detection structure further includes a wafer protrusion detection platform and a support and storage component. The wafer protrusion detection platform is fixedly mounted on the hanging basket, and the support and storage component is fixedly mounted on the wafer protrusion detection platform for limiting and storing the wafer cassette. Each pair of the initial position protrusion sensing structure and the arrival position protrusion sensing structure are symmetrically arranged on the wafer protrusion detection platform and the support and storage component respectively.

[0012] Optionally, the support and storage component includes a support column, a support bracket, and a limit block bottom plate. The support column is fixedly mounted on the wafer protrusion detection platform, the limit block bottom plate is fixedly mounted on the upper end of the support column, one end of the support bracket is fixedly connected to the side surface of the support column, and an initial position protrusion sensing structure and an arrival position protrusion sensing structure are arranged at the other end of the support bracket, and the arrival position protrusion sensing structure is arranged close to the edge of the support bracket end. The limit block bottom plate is provided with limit blocks and bosses for limiting and storing the wafer cassette. The limit blocks are arranged on the side away from the wafer transfer robot structure, and the bosses are arranged beside the limit blocks. The limit block bottom plate is provided with an avoidance groove for facilitating wafer protrusion detection on the side close to the initial position protrusion sensing structure and the arrival position protrusion sensing structure.

[0013] Optionally, the wafer positioning detection structure includes a locator placement platform fixedly mounted on the hanging basket and a wafer locator fixedly mounted on the locator placement platform for positioning the wafer. The wafer positioning table of the wafer locator and the placement area of the limit block bottom plate are at the same height.

[0014] According to a second aspect of the present invention, a control method for an integrated wafer transfer platform is provided, including the following steps: Step 1: First, firmly install the slide table backplane between the wafer transfer machine working position and the window working position inside the wafer storage and transportation device, for circulating between the wafer transfer machine working position and the window working position where the wafer storage and transportation device is docked with the furnace boat, and power on the integrated wafer transfer platform; Step 2: Clamp the wafer cassette on the wafer transfer machine working position through the wafer cassette gripper structure, and detect the position and quantity of the wafers in the wafer cassette during the clamping process. Subsequently, transfer the wafer cassette to the limit block bottom plate, and limit and store the wafer cassette through the limit block and the boss; Step 3: When the wafers in the wafer cassette move outwards through the wafer transfer robot structure, detect whether the edges of the wafers in the wafer cassette pass through the initial detection position and the arrival detection position in sequence through the initial position protrusion induction structure and the arrival position protrusion induction structure. If there is a problem with the edge protrusion of the wafers in the wafer cassette, correct the wafers with edge protrusion problems through the wafer gripper structure. If there is no problem with the edge protrusion of the wafers in the wafer cassette, proceed to Step 4; Step 4: Transfer the wafers in the wafer cassette to the wafer positioning table of the wafer positioner through the wafer gripper structure; Step 5: Position the wafers through the wafer positioner, and then put the positioned wafers back into the wafer cassette through the wafer gripper structure; Step 6: Repeat Step 4 and Step 5 until all the wafers have been positioned and put back into the wafer cassette. Then, under the drive of the drive structure, the support structure drives the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer position detection structure to move vertically upwards until it moves to the window working position where the wafer storage and transportation device is docked with the furnace boat, and transfer the wafers in the wafer through the window working position to the furnace boat through the wafer gripper structure.

[0015] Optionally, in Step 2, before the wafer cassette gripper structure transfers the wafer cassette, it further includes: resetting the origin of the wafer transfer robot structure.

[0016] The advantages and beneficial effects of the present invention are as follows: An integrated wafer transfer platform and control method provided by the present invention. This integrated wafer transfer platform has a high degree of integration through an integrated installation structure, a support structure, a wafer transfer robot structure, a wafer protrusion detection structure, and a wafer positioning detection structure. It can not only effectively reduce the occupied space and enable the transfer and conveyance of wafers in a wafer storage and transportation device with limited space, but also, under the synergistic action of the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer positioning detection structure, effectively reduce the time for the wafer transfer robot structure to transfer wafers between wafer protrusion detection and wafer positioning, thereby improving work efficiency and production efficiency. At the same time, the driving structure drives the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer positioning detection structure to perform vertical lifting and moving together through the support structure, facilitating the transfer of wafers inside the wafer storage and transportation device. By setting an initial position protrusion induction structure and an arrival position protrusion induction structure, it can not only detect whether the edges of the wafers in the wafer cassette sequentially pass through the initial detection position and the arrival detection position, but also detect defects or features on the wafers, so as to improve the performance and reliability of the final product, thereby reducing production losses and ensuring the smooth progress of production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 It is a left view of the integrated wafer transfer platform of the present invention.

[0019] Figure 3 It is a schematic diagram of the structure of the hanging basket of the present invention.

[0020] Figure 4 It is a schematic diagram of the structure of the aluminum hollow rod of the present invention.

[0021] Figure 5 It is a partial enlarged view of the integrated wafer transfer platform of the present invention.

[0022] Figure 6 It is a schematic diagram of the installation position of the slider of the present invention.

[0023] Figure 7 It is a schematic diagram of the structure of the electrical pipeline protection structure of the present invention.

[0024] Figure 8 It is a schematic diagram of the structure of the wafer transfer manipulator of the present invention.

[0025] Figure 9 It is a top view of the wafer transfer manipulator of the present invention.

[0026] Figure 10 It is a schematic diagram of the structure of the transmission structure of the present invention.

[0027] Figure 11 Schematic diagram of the installation position of the first sensing structure of the present invention.

[0028] Figure 12 Schematic diagram of the structure of the probing detection platform of the present invention.

[0029] Reference numerals: body 1, wafer probing detection platform 2, wafer locator 3, first photoelectric sensor 4, bracket 5, limit block base plate 6, limit block 7, boss 8, hanging basket 9, drag chain 10, vertical slide 11, slider 12, locator placement platform 13, wafer positioning table 14, slide upper cover 15, slide back plate 16, drag chain plate 17, aluminum hollow rod 18, multi-joint motion structure 19, wafer transfer manipulator 20, vertical installation gap 21, second photoelectric sensor 22, avoidance groove 23, ceramic chuck 24, mounting seat 25, back plate 26, wafer gripper housing 27, joint shaft 28, gripper bracket 29, second clamping block 30, first clamping block 31, second support block 32, first support block 33, cylinder block 34, solenoid valve 35, main transmission rod 36, driven rotating rod 37, solenoid valve mounting bracket 38, retaining plate 39, pneumatic cylinder 40, speed control valve 41, adsorption port 42, air duct 43, horizontal guide 44, vertical guide 45, first sensing structure 46, first fixing plate 47, second fixing plate 48, support column 49. Detailed implementation manners

[0030] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application. And without conflict, the features in the following embodiments and the embodiments can be combined with each other. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0031] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0032] Refer to the attached Figure 1-11, An integrated wafer transfer platform is applied to a wafer storage and transportation device, including: a mounting structure, a support structure, a wafer transfer robot structure, a wafer protrusion detection structure, and a wafer positioning detection structure.

[0033] In this embodiment, a driving structure is provided at the lower end of the mounting structure. The output end of the driving structure is connected to the support structure. The support structure is slidably connected to the mounting structure. The driving structure can be a motor or a pneumatic cylinder, which is used to drive the support structure to drive the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer positioning detection structure thereon to perform vertical lifting movement together, so as to complete the transfer of the wafer and perform the origin reset of the wafer transfer robot structure.

[0034] In this embodiment, refer to Appendix Figure 1 and Appendix Figure 6 , The mounting structure includes a slide table backplane 16, a vertical slide table 11, and a slide table upper cover 15. The vertical slide table 11 is fixedly installed at the front end of the slide table backplane 16. The slide table upper cover 15 is fixedly installed at the front end of the vertical slide table 11. A vertical installation gap 21 is formed between the slide table upper cover 15 and the vertical slide table 11. The support structure is slidably connected to the vertical installation gap 21 and is used to perform vertical lifting movement along the vertical installation gap 21 under the drive of the driving structure.

[0035] Furthermore, the support structure is slidably connected to the vertical installation gap 21 formed between the slide table upper cover 15 and the vertical slide table 11, so as to effectively improve the stability and reliability of the support structure during the vertical lifting movement.

[0036] It should be noted that when the integrated wafer transfer platform is fixedly installed inside the wafer storage and transportation device, the slide table backplane 16 can be fixedly installed on the inner wall of the wafer storage and transportation device through fixing parts such as bolts, and the installation of the integrated wafer transfer platform can be realized.

[0037] In this embodiment, refer to Appendix Figure 1-2 and Appendix Figure 6, the support structure includes a slider 12 and a hanging basket 9. The slider 12 is slidably connected to the vertically installed gap 21. The hanging basket 9 is fixedly installed on the slider 12. The output end of the driving structure is connected to the slider 12. The hanging basket 9 is used to integrally install a wafer transfer robot structure, a wafer protrusion detection structure, and a wafer positioning detection structure, and is slidably connected at the vertically installed gap 21 through the slider 12, with a high degree of integration. It can not only effectively reduce the occupancy rate of the space volume of the integrated wafer transfer platform, enable the transfer and conveyance of wafers in a wafer storage and transportation device with limited space, but also, under the driving action of the driving structure, realize the common vertical lifting movement of the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer positioning detection structure, facilitating the transfer of wafers inside the wafer storage and transportation device.

[0038] Further, referring to the attached Figure 4 , the hanging basket 9 involved in the present application is made of an aluminum hollow rod 18. Among them, the aluminum hollow rod 18 is an X-shaped hollow structure, and its longitudinal section is an axisymmetric structure. Moreover, in the X-axis and Y-axis directions of the longitudinal section, their moment of inertia, radius of gyration, section modulus, etc. are all the same, having the advantages of convenient design and connection. At the same time, the aluminum hollow rod 18 also has significant characteristics such as high strength, light weight, and corrosion resistance, so as to effectively reduce the weight of the entire integrated wafer transfer platform, thereby improving the operating performance of the integrated wafer transfer platform.

[0039] In this embodiment, in order to further protect the cables or air pipes of the driving structure and ensure that they are not damaged during movement, the present application also designs an electrical pipeline protection structure. Referring to the attached Figure 1 and the attached Figure 7 , the electrical pipeline protection structure includes a drag chain plate 17 and a drag chain 10. The drag chain plate 17 is fixedly installed on the slider 12. One end of the drag chain 10 is fixedly connected to the drag chain plate 17, and the other end is fixedly connected to the vertical slide 11. It should be noted that the cables such as the cables or air pipes of the driving structure need to be centrally installed in the drag chain 10. On the one hand, the wiring is more tidy, and on the other hand, the cables can be well protected to prevent the cables from being worn and pulled.

[0040] In this embodiment, the wafer protrusion detection structure and the wafer positioning detection structure are arranged on both sides of the wafer transfer robot structure. During the process of the driving structure driving the support structure to move vertically upward from the origin position, the wafer transfer robot structure is used to synchronously transfer the wafer cassette and the wafer, and after transferring the wafer cassette to the wafer protrusion detection structure to complete the wafer protrusion detection operation, quickly transfer the wafer to the wafer positioning detection structure for wafer positioning operation.

[0041] In this embodiment, referring to the attached Figure 1 and the attached Figure 5, the structure of the wafer transfer robot includes a body 1 fixedly installed on the hanging basket 9, a multi-joint motion structure 19 arranged on the body 1, and a wafer transfer manipulator 20 arranged on the multi-joint motion structure 19. The body 1 is a body with its own vertical direction transmission. The multi-joint motion structure 19 includes N robotic arms controlled by the rotation of N + 1 joint axes on a horizontal plane, where N is an integer greater than 0. The wafer transfer manipulator 20 includes a mounting base, a wafer gripper structure, and a wafer cassette gripper structure. The wafer gripper structure and the wafer cassette gripper structure are symmetrically arranged on both sides of the mounting base. The mounting base is arranged on the joint axis 28 at the uppermost end of the multi-joint motion structure 19. Driven by the multi-joint motion structure 19, it drives the mounting base, the wafer gripper structure, and the wafer cassette gripper structure to perform rotational motion in the horizontal direction to realize the synchronous transfer of the wafer cassette and the wafer. The wafer cassette gripper structure is also provided with a first sensing structure 46 for detecting the position and quantity of the wafers in the wafer cassette. The structure of the wafer transfer robot in this application, through precise positioning and transmission technologies, can not only ensure the high-precision transfer effect and stability of the wafers during the transfer process, but also realize the automatic execution of the wafer transfer and transmission tasks, effectively reducing manual intervention, thereby improving production efficiency.

[0042] Further, the body 1 involved in this application is a body capable of realizing its own vertical direction transmission. This body 1 is a commercially available product, and its models include but are not limited to the UTX-FS6000 ASYST wafer semiconductor robot body, etc. It can be flexibly selected according to actual production needs as long as it can realize its own lifting and moving, and will not be limited here.

[0043] Further, the multi-joint motion structure 19 involved in this application is composed of N robotic arms controlled by the rotation of N + 1 joint axes on a horizontal plane, where N is an integer greater than 0. Among them, the quantity setting of N can be flexibly selected according to actual production needs as long as it can realize horizontal rotational movement, and will not be limited here. Refer to the attached Figure 1 It can be seen that the multi-joint motion structure 19 in this embodiment includes two robotic arms controlled by the rotation of three joint axes on a horizontal plane. By setting two robotic arms, the horizontal handling of the wafers can be realized.

[0044] Further, in order to avoid the wafer gripper structure and the wafer cassette gripper structure affecting or interfering with each other in a limited space, this application arranges the wafer gripper structure and the wafer cassette gripper structure on both sides of the mounting base 25, which can not only realize the synchronous transfer of the wafers and the wafer cassette, but also avoid the situation of mutual influence or interference between the wafer gripper module and the wafer cassette gripper module inside the wafer storage and transportation device with limited space, optimizing the spatial layout between the two and improving the rationality of the spatial arrangement.

[0045] Further, referring to the attached Figure 8 , the wafer chuck structure includes a wafer chuck control module disposed inside the mounting base 25 and a wafer chuck module fixedly mounted on the side of the mounting base 25. The wafer chuck control module and the wafer chuck module are connected and communicated through an air duct 43, which is used for the wafer chuck module to adsorptively grip or release the wafer, and by controlling the gas flow rate, the adsorption force of the wafer chuck module can be controlled.

[0046] Further, referring to the attached Figure 9 , the wafer chuck control module may include a solenoid valve mounting bracket 38, a solenoid valve 35 fixedly connected to the solenoid valve mounting bracket 38 and communicated with the air duct 43, and a speed regulating valve 41 mounted on the air duct 43. During the process of the solenoid valve 35 controlling the wafer chuck module to adsorb the wafer, the gas flow rate can be regulated through the speed regulating valve 41 to adjust the adsorption force of the wafer chuck module; in addition, the solenoid valve 35 also needs to be externally connected to an air pump to achieve the purpose of adsorptively gripping the wafer.

[0047] Further, referring to the attached Figure 8-9 , the wafer chuck module may include a wafer chuck housing 27 fixedly connected to the side of the mounting base 25 and a ceramic chuck 24 fixedly connected to the wafer chuck housing 27. The wafer chuck housing 27 and the ceramic chuck 24 are respectively provided with air ducts that are connected and communicated. The air duct inside the wafer chuck housing 27 is connected and communicated with the air duct 43. A plurality of adsorption ports 42 communicated with the internal air duct are opened on the surface of the ceramic chuck 24 to achieve the adsorptive clamping or release of the wafer.

[0048] Further, the wafer cassette chuck structure includes a wafer cassette chuck control module fixedly connected to one side and a wafer cassette chuck module slidably connected to the wafer cassette chuck control module. Among them, a first sensing structure 46 for detecting the position and quantity of the wafers in the wafer cassette is provided on the wafer cassette chuck module.

[0049] Further, referring to the attached Figure 8-9, the wafer cassette gripper control module includes a back plate 26 fixedly connected to the side of the mounting base 25, a pneumatic cylinder 40 fixedly connected inside the back plate 26, a cylinder block 34 disposed at the output shaft end of the pneumatic cylinder 40, and a transmission structure rotatably connected to the cylinder block 34 and used to drive the wafer cassette gripper module to clamp or release the wafer cassette. Among them, both the pneumatic cylinder 40 and the cylinder block 34 are disposed on the vertical center line of the back plate 26. And, in order to improve the stability of the cylinder block 34 driving the transmission structure to move, a vertical guide 45 is also disposed inside the back plate 26. The vertical guide 45 is slidably connected to the cylinder block 34 to guide the moving direction of the cylinder block 34, so as to improve the stability of the cylinder block 34 driving the transmission structure to move. At the same time, in order to further improve the stability of the transmission structure driving the wafer cassette gripper module to move, a horizontal guide 44 is also disposed inside the back plate 26. The horizontal guide 44 is slidably connected to the wafer cassette gripper module to guide the moving direction of the wafer cassette gripper module, so as to improve the stability of the transmission structure driving the wafer cassette gripper module to move.

[0050] Further, referring to the attached Figure 8-9 , the wafer cassette gripper module includes a pair of gripper brackets 29, a pair of first clamping blocks 31, a pair of first support blocks 33, a pair of second clamping blocks 30 and a pair of second support blocks 32. The pair of gripper brackets 29 are symmetrically arranged on both sides of the back plate 26. And one end of the gripper bracket 29 close to the back plate 26 penetrates through the back plate 26 and is slidably connected to the back plate 26. At the same time, one end of the gripper bracket 29 penetrating through the back plate 26 is slidably connected to the horizontal guide 44, thereby improving the stability of the gripper bracket 29 during the reciprocating translation movement; the first clamping block 31 and the second clamping block 30 are respectively arranged on the side of the gripper bracket 29 away from the back plate 26 from the inside to the outside in sequence. The first support block 33 and the second support block 32 are both fixedly connected to the gripper bracket 29, and the first support block 33 and the second support block 32 are respectively arranged corresponding to the lower sides of the first clamping block 31 and the second clamping block 30 to respectively perform the clamping operation on the wafer cassettes of corresponding sizes, and respectively under the cooperation of the first support block 33 and the second support block 32, it can effectively prevent the wafer cassettes of corresponding sizes from falling off during the clamping process, thereby improving the safety of wafer cassette transfer.

[0051] It should be noted that by setting the first clamping block 31 and the first support block 33, the second clamping block 30 and the second support block 32, it is possible to clamp two sizes of wafer cassettes, such as 6-inch and 8-inch wafer cassettes. In addition, the number of clamping blocks and support blocks set can be flexibly set according to actual production needs. For example, if it is necessary to clamp other or more sizes of wafer cassettes, such as 12-inch wafer cassettes, corresponding clamping blocks and support blocks can be arranged at the corresponding positions of the gripper bracket 29, and no further limitation will be made here.

[0052] For further information, see Attachment Figure 10 The transmission structure includes a pair of connecting rod transmission modules arranged on both sides of the pneumatic cylinder 40, wherein the connecting rod transmission module includes a main transmission rod 36 and a driven rotating rod 37, one end of the main transmission rod 36 is rotationally connected to the cylinder block 34, and the other end is rotationally connected to the middle part of the driven rotating rod 37, and the two ends of the driven rotating rod 37 are respectively fixed to the clamping jaw bracket 29 to drive the clamping jaw bracket 29 to perform reciprocating translational motion.

[0053] For further information, see Attachment Figure 11 In order to protect the wafers in the wafer box, a baffle 39 can be provided on the side of the back plate 26 facing the wafer box. At the same time, a first sensing structure 46 is fixedly connected to the baffle 39. The layout position of the first sensing structure 46 corresponds to the position of the wafers in the wafer box, so as to improve the detection accuracy of the position and quantity of the wafers in the wafer box.

[0054] Furthermore, the first sensing structure 46 may adopt FU18M optical fiber sensors, and 25 FU18M optical fiber sensors may be installed in a stepped manner on both sides of the center line of the baffle 39 in the vertical direction. It should be noted that the number of FU18M optical fiber sensors corresponds to the maximum carrying capacity of the wafers in the wafer box, that is, the maximum carrying capacity of wafers in wafer boxes of different sizes is 25 pieces, and the distance between two adjacent wafers in the wafer box is the same. Therefore, after completing the arrangement of 25 FU18M optical fiber sensors at the corresponding positions of the wafers in the wafer box, it can be used to detect the position and quantity of wafers in wafer boxes of different sizes, and the detection range is wider.

[0055] Furthermore, the diameter of the optical fiber in the FU18M optical fiber sensor is 1mm, and the cross-section of the sensor detection end is a rectangular structure with a length of 2mm and a width of 1.5mm. The working principle of the FU18M optical fiber sensor for detecting the position and number of wafers in the wafer box includes: when the wafer box clamping claw module clamps the wafer box, the light source of the FU18M optical fiber sensor will emit a light beam, and the light beam is transmitted to the sensor detection end through the optical fiber. When a wafer blocks the light beam, the light beam will form a total reflection on the edge of the wafer, thereby forming a transmission path for the optical signal. It can be determined that there is a wafer at the groove position of the wafer box corresponding to the FU18M optical fiber sensor. Otherwise, it is determined that there is no wafer at the groove position of the wafer box corresponding to the FU18M optical fiber sensor. This total reflection phenomenon enables the optical signal to be transmitted in the optical fiber without being scattered or absorbed, thereby realizing long-distance, high-sensitivity signal transmission. At the same time, by counting the number of wafers, the number of wafers can be obtained, so as to complete the detection process of the position and number of wafers in the wafer box.

[0056] In this embodiment, refer to the attached Figure 1, the wafer probing detection structure includes a wafer probing detection platform 2, a support and storage component, a pair of initial position probing induction structures, and a pair of arrival position probing induction structures. The wafer probing detection platform 2 is fixedly installed on the hanging basket 9. The support and storage component is fixedly installed on the wafer probing detection platform 2 for limiting and storing the wafer cassette. Each pair of the initial position probing induction structures and the arrival position probing induction structures are symmetrically arranged on the wafer probing detection platform and the support and storage component respectively. During the wafer probing detection process, when the wafer cassette is placed on the wafer probing detection structure, the initial position probing induction structure and the arrival position probing induction structure are respectively used to detect whether the edge of the wafer in the wafer cassette passes through the initial detection position and the arrival detection position in sequence.

[0057] In this embodiment, referring to Appendix Figure 1 , Appendix Figure 6 and Appendix Figure 12 , the support and storage component includes a support column 49, a bracket 5, and a limit block bottom plate 6. The support column 49 is fixedly installed on the wafer probing detection platform 2. The limit block bottom plate 6 is fixedly installed at the upper end of the support column 49. One end of the bracket 5 is fixedly connected to the side surface of the support column 49. An initial position probing induction structure and an arrival position probing induction structure are arranged at the other end of the bracket 5, and the arrival position probing induction structure is arranged close to the edge of the bracket end. Limit blocks 7 and bosses 8 are arranged on the limit block bottom plate 6 for limiting and storing the wafer cassette. The limit blocks 7 are arranged on the side away from the wafer transfer robot structure, and the bosses 8 are arranged beside the limit blocks 7. An avoidance groove 23 for facilitating wafer probing detection is opened on one side of the limit block bottom plate 6 close to the initial position probing induction structure and the arrival position probing induction structure.

[0058] Furthermore, the support column 49 is fixedly installed on the wafer probing detection platform 2, and the bracket 5 and the limit block bottom plate 6 are fixedly installed on the support column 49. Among them, both the support column 49 and the bracket 5 can be made of the aforementioned aluminum hollow rod 18 to improve the stability of the overall structure. And, limit blocks 7 and bosses 8 are arranged on the limit block bottom plate 6. Under their combined action, the wafer cassette can be limited and stored. At the same time, each pair of the initial position probing induction structures and the arrival position probing induction structures are symmetrically arranged at the relative positions of the wafer probing detection platform 2 and the bracket 5 respectively, which can realize the probing detection of the wafer edge, that is, used to detect the protruding wafer to avoid its breakage or damage, thereby reducing production losses and ensuring the smooth progress of production.

[0059] Furthermore, referring to Appendix Figure 12, the initial position detection induction structure includes a pair of first fixing plates 47 and a pair of first photoelectric sensors 4, and the arrival position detection induction structure includes a pair of second fixing plates 48 and a pair of second photoelectric sensors 22. Among them, each pair of first fixing plates 47 and each pair of second fixing plates 48 are symmetrically arranged at the relative positions of the wafer detection platform 2 and the bracket 5 respectively. The first photoelectric sensor 4 is fixedly installed on the first fixing plate 47, and the second photoelectric sensor 22 is fixedly installed on the second fixing plate 48. The first photoelectric sensor 4 and the second photoelectric sensor 22 can adopt the EX-13A photoelectric sensor. The EX-13A photoelectric sensor uses NPN output, with two output modes of open collector / bright light, uses a red light LED as the light source, has an IP67 protection level, can effectively prevent the intrusion of dust and water, and its working principle is based on the photoelectric effect. The EX-13A photoelectric sensor is specifically composed of a transmitter, a receiver, and a detection circuit. Among them, the transmitter emits a light beam, the receiver receives the reflected or transmitted light signal, and the detection circuit converts the change in light intensity into an electrical signal. During the process of detecting the edge of the wafer, the EX-13A photoelectric sensor can not only accurately locate the edge of the wafer to realize the detection of the edge of the wafer, but also detect the defects or features on the wafer. The defects can be detected by comparing the image of the chip to be detected with the image of the adjacent chip. If there are no defects on the wafer, it can be determined through digital signals, thereby improving the performance and reliability of the final product.

[0060] Further, referring to the appendix Figure 12, during the process of placing the wafer cassette on the bottom plate of the limit block, the working principle of detecting whether the edge of the wafer in the wafer cassette passes through the initial detection position and the arrival detection position in sequence by the initial position detecting structure and the arrival position detecting structure is as follows: When the wafer cassette is placed on the bottom plate of the limit block and the wafer in the wafer cassette extends outwards through the wafer transfer robot structure, the edge part of the wafer will enter the detection range formed by two pairs of EX-13A photoelectric sensors. The edge of the wafer will pass through the detection ranges of the first photoelectric sensor 4 on the inner side and the second photoelectric sensor 22 on the outer side in sequence. When the edge of the wafer first reaches the detection range of the first photoelectric sensor 4 on the inner side, the first photoelectric sensor 4 on the inner side will detect the presence of the wafer and send an output signal of the initial detection position, which indicates that the inner edge of the wafer has reached the initial detection position. Subsequently, the wafer transfer robot structure drives the wafer to continue to extend outwards and move, and the edge of the wafer continues to move accordingly and reaches the detection range of the second photoelectric sensor 22 on the outer side. The second photoelectric sensor 22 on the outer side will detect the presence of the wafer and send an output signal of the arrival detection position, which indicates that the inner edge of the wafer has reached the detection position. By transmitting the two output signals to an external control system, the control system will process the two output signals and calculate the extension amount of the wafer. If the extension amount of the wafer is within the preset range, it is considered that the position of the wafer is correct; if the extension amount exceeds the preset range, it is considered that the position of the wafer is incorrect and adjustment or alarm is required.

[0061] In this embodiment, referring to Appendix Figure 1 , Appendix Figure 3 and Appendix Figure 5 , the wafer positioning and detecting structure includes a locator placing platform 13 fixedly installed on the hanging basket 9 and a wafer locator 3 fixedly installed on the locator placing platform 13 for positioning the wafer. The wafer positioning table 14 of the wafer locator 3 and the placing area of the bottom plate 6 of the limit block are at the same height.

[0062] Furthermore, in order to achieve precise positioning of the wafer to ensure the accuracy and consistency of subsequent processing steps, the present application also provides a wafer locator 3. Specifically, each wafer has a notch, and the wafer can be positioned through this notch. During the process of positioning the wafer, first, the wafer is placed at the wafer positioning table 14 of the wafer locator 3 through the wafer transfer robot structure. Subsequently, the wafer locator 3 drives the wafer to rotate, and by detecting the position of this notch, the wafer is adjusted to the preset position, specifically, the notch position of the wafer corresponds to the preset position, thereby ensuring the accuracy and consistency of the wafer in subsequent processing steps.

[0063] Further, the wafer locator 3 involved in the present application is a commercially available product, and its models include but are not limited to HAL200V-0408S_Aligner calibrator, etc., which can be flexibly selected according to actual production needs, as long as wafer positioning can be achieved, and no further limitation is made here.

[0064] In this embodiment, the present application also provides a control method for an integrated wafer transfer platform, including the following steps.

[0065] Step 1: First, firmly install the slide table backplane 16 between the wafer transfer machine working position and the window working position inside the wafer storage and transportation device, for flowing between the wafer transfer machine working position and the window working position where the wafer storage and transportation device docks with the furnace boat, and power on the integrated wafer transfer platform.

[0066] Further, in order to enable the process of wafer transfer between the wafer transfer machine working position and the window working position, the length of the vertical slide table 11 involved in the present application needs to be the same as the distance between the wafer transfer machine working position and the window working position.

[0067] Step 2: Clamp the wafer cassette on the wafer transfer machine working position through the wafer cassette clamping jaw structure, and detect the position and quantity of the wafers in the wafer cassette during the clamping process. Subsequently, transfer the wafer cassette to the limit block bottom plate 6, and limit and store the wafer cassette through the limit block 7 and the boss 8.

[0068] Further, before the wafer cassette clamping jaw structure transfers the wafer cassette, it also includes: performing an origin reset on the wafer transfer robot structure, specifically including the following steps: First, the wafer transfer robot structure receives the signal transported by the overhead crane to the wafer transfer machine working position; Subsequently, the wafer transfer robot structure needs to determine whether it is in the origin position. The determination method can be to set a position sensor at the origin position, such as an optical position sensor, so as to monitor whether the wafer transfer robot structure is in the origin position, with the characteristics of high precision and fast response; If the wafer transfer robot structure is not in the origin position, the wafer transfer robot structure can be driven to move vertically downward through the driving structure until it returns to the origin position, and then the wafer cassette clamping operation is performed.

[0069] Step 3: When the wafers in the wafer cassette move outwards through the wafer transfer robot structure, detect whether the edges of the wafers in the wafer cassette pass through the initial detection position and the arrival detection position in sequence through the initial position protrusion induction structure and the arrival position protrusion induction structure. If there is an edge protrusion problem with the wafers in the wafer cassette, correct the wafers with the edge protrusion problem through the wafer clamping jaw structure. If there is no edge protrusion problem with the wafers in the wafer cassette, proceed to Step 4.

[0070] Step 4: Transfer the wafers in the wafer cassette to the wafer positioning table 14 of the wafer positioner 3 through the wafer gripper structure.

[0071] Further, through the coordinated action of the body 1 with vertical drive in its own direction, the multi-joint motion structure 19, and the wafer gripper structure, the operation of transferring the wafers in the wafer cassette to the wafer positioning table 14 of the wafer positioner 3 can be achieved.

[0072] Step 5: Position the wafers through the wafer positioner 3, and then put the positioned wafers back into the wafer cassette through the wafer gripper structure.

[0073] Further, when putting the positioned wafers back into the wafer cassette, it is also necessary to utilize the coordinated action of the body 1, the multi-joint motion structure 19, and the wafer gripper structure to achieve this.

[0074] Step 6: Repeat Step 4 and Step 5 until all the wafers are positioned and put back into the wafer cassette. Then, driven by the drive structure, the support structure drives the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer position detection structure to move vertically upward together until it moves to the window working position where the wafer storage and transportation device is docked with the furnace boat. Transfer the wafers in the wafer through the window working position to the furnace boat through the wafer gripper structure.

[0075] Further, after completing all wafer positioning processes, through the driving action of the drive structure, drive the slider 12 and the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer position detection structure integrated thereon to move vertically upward together. After reaching the window working position where the transportation device is docked with the furnace boat, utilize the coordinated action of the body 1, the multi-joint motion structure 19, and the wafer gripper structure to send the positioned wafers into the window where the wafer storage and transportation device is docked with the furnace boat, and the transfer process of the wafers inside the wafer storage and transportation device can be completed.

[0076] Further, in order to improve the transfer efficiency of the wafers inside the wafer storage and transportation device, during the process of the drive structure driving the slider 12 and the wafer transfer robot structure, the wafer protrusion detection structure, and the wafer position detection structure integrated thereon to move vertically upward together, the operations of wafer protrusion detection and wafer positioning can be completed, so as to effectively improve the transfer efficiency of the wafers inside the wafer storage and transportation device.

[0077] The above content is a further detailed description of the present invention in combination with specific implementation manners. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention belongs, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope of the present invention.

Claims

1. An integrated wafer transfer platform, applied to wafer storage and transportation device, characterized in that: include: A support structure, a wafer transfer robot structure fixedly mounted on the support structure and having a wafer box and wafer synchronous transfer function, a wafer probing detection structure fixedly mounted on the support structure, and a wafer positioning detection structure fixedly mounted on the support structure. In the process of vertically ascending and moving from an origin position with the support structure, the wafer transfer robot structure is used to synchronously transfer the wafer box and the wafer, and after transferring the wafer box to the wafer probing detection structure to complete the wafer probing detection operation, the wafer is quickly transferred to the wafer positioning detection structure for wafer positioning operation. The placement area of ​​the probe detection structure and the placement area of ​​the wafer positioning detection structure are located at the same height to ensure the stability and transmission efficiency of the wafer during the transmission process. The wafer probe detection structure includes a pair of initial position probe sensing structures and a pair of arrival position probe sensing structures. During the wafer probe detection process, as the wafer in the wafer box moves outward through the wafer transfer robot structure, the initial position probe sensing structure and the arrival position probe sensing structure are respectively used to perform probe detection on whether the edge of the wafer in the wafer box passes through the initial detection position and the arrival detection position in sequence.

2. The integrated wafer transfer platform according to claim 1, characterized in that: It also includes a mounting structure and a driving structure, wherein the driving structure is arranged at the lower end of the mounting structure, and the output end of the driving structure is connected to the supporting structure, and the mounting structure includes a slide back plate, a vertical slide and a slide cover, wherein the vertical slide is fixedly mounted on the front end of the slide back plate, and the slide cover is fixedly mounted on the front end of the vertical slide, and a vertical mounting gap is formed between the slide cover and the vertical slide, and the supporting structure is slidably connected to the vertical mounting gap, and under the drive of the driving structure, the supporting structure is used to perform vertical lifting and lowering movements along the vertical mounting gap.

3. The integrated wafer transfer platform according to claim 2, characterized in that: The supporting structure comprises a sliding block and a hanging basket, the sliding block is slidably connected to a vertical installation gap, the hanging basket is fixedly installed on the sliding block, and the output end of the driving structure is connected to the sliding block.

4. The integrated wafer transfer platform according to claim 3, characterized in that: The support structure further comprises an electrical pipeline protection structure, and the electrical pipeline protection structure is used to protect the cables or air pipes of the driving structure that move with the slider.

5. The integrated wafer transfer platform according to claim 3, characterized in that: The wafer transfer robot structure includes a body fixedly mounted on a hanging basket, a multi-joint motion structure arranged on the body, and a wafer transfer robot arranged on the multi-joint motion structure. The body is a body with its own vertical transmission. The multi-joint motion structure includes N mechanical arms controlled by rotation of N+1 joint axes on a horizontal plane, where N is an integer greater than 0; the wafer transfer robot includes a mounting seat, a wafer clamping structure and a wafer box clamping structure, the wafer clamping structure and the wafer box clamping structure are symmetrically arranged on both sides of the mounting seat, the mounting seat is arranged on the joint axis at the uppermost end of the multi-joint motion structure, and driven by the multi-joint motion structure, the mounting seat, the wafer clamping structure and the wafer box clamping structure are driven to perform horizontal rotational motion to realize the synchronous transportation of the wafer box and the wafer, and a first sensing structure is also provided on the wafer box clamping structure to detect the position and quantity of the wafers in the wafer box.

6. The integrated wafer transfer platform according to claim 3, characterized in that: The wafer probe detection structure also includes a wafer probe detection platform and a support and storage component. The wafer probe detection platform is fixedly installed on the hanging basket, and the support and storage component is fixedly installed on the wafer probe detection platform to limit and store the wafer box. Each pair of the initial position probe sensing structure and the arrival position probe sensing structure are symmetrically arranged on the wafer probe detection platform and the support and storage component.

7. The integrated wafer transfer platform according to claim 6, characterized in that: The support and storage assembly includes a pillar, a bracket and a limit block base plate, the pillar is fixedly installed on the wafer probe detection platform, the limit block base plate is fixedly installed on the upper end of the pillar, one end of the bracket is fixedly connected to the side of the pillar, and the other end of the bracket is provided with an initial position probe sensing structure and an arrival position probe sensing structure, and the arrival position probe sensing structure is arranged near the edge of the bracket end, a limit block and a boss are arranged on the limit block base plate for limiting and storing the wafer box, the limit block is arranged on the side away from the wafer transfer robot structure, the boss is arranged on the side of the limit block, and an avoidance groove for facilitating wafer probe detection is provided on the side of the limit block base plate close to the initial position probe sensing structure and the arrival position probe sensing structure.

8. The integrated wafer transfer platform according to claim 7, characterized in that: The wafer positioning detection structure includes a positioner placement platform fixedly mounted on a hanging basket and a wafer positioner fixedly mounted on the positioner placement platform and used to position the wafer. The wafer positioning table of the wafer positioner and the placement area of ​​the limit block bottom plate are located at the same height.

9. A control method for an integrated wafer transfer platform according to any one of claims 1 to 8, characterized in that: The steps include: Step 1: First, firmly install the slide back plate between the wafer transfer machine work station and the window work station inside the wafer storage and transportation device, so as to transfer between the wafer transfer machine work station and the window work station where the wafer storage and transportation device is docked with the furnace body wafer boat, and power on the integrated wafer transfer platform; Step 2: The wafer box on the working position of the wafer conveyor is clamped by the wafer box clamping claw structure, and the position and quantity of the wafers in the wafer box are detected during the clamping process, and then the wafer box is transferred to the bottom plate of the limit block, and the wafer box is limited and stored by the limit block and the boss; Step 3: As the wafers in the wafer box are moved outward through the wafer transfer robot structure, the initial position detection sensing structure and the arrival position detection sensing structure are used to detect whether the edge of the wafer in the wafer box has passed through the initial detection position and the arrival detection position in turn. If the wafer in the wafer box has an edge detection problem, the wafer with the edge detection problem is corrected by the wafer clamping structure. If the wafer in the wafer box does not have an edge detection problem, step 4 is performed; Step 4: Transfer the wafer in the wafer box to the wafer positioning table of the wafer positioner through the wafer clamping structure; Step 5: Position the wafer using a wafer positioner, and then put the positioned wafer back into the wafer box using a wafer clamping structure; Step six: Repeat steps four and five until all wafers have been positioned and put back into the wafer box. Driven by the driving structure, the supporting structure drives the wafer transfer robot structure, the wafer probe detection structure and the wafer positioning detection structure to move vertically upward until they move to the window working position where the wafer storage and transportation device is docked with the furnace body wafer boat, and the wafer in the wafer box is transferred to the furnace body wafer boat through the window working position by the wafer clamping structure.

10. The control method of the integrated wafer transfer platform according to claim 9, characterized in that: In the step 2, before the wafer box clamping structure transfers the wafer box, it also includes: resetting the origin of the wafer transfer robot structure.

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