Preparation method of printed circuit board and printed circuit board

Abstract

The invention discloses a preparation method of a printed circuit board and the printed circuit board. The method comprises the following steps: acquiring a base material; grooving the base material to form a groove corresponding to the circuit pattern; filling metal into the groove to form an embedded circuit layer of the circuit pattern in the substrate; and based on the embedded circuit layer, stacking at least two stacked circuit layers on the embedded circuit layer in a flash plating and electroplating mode to form the printed circuit board. The embedded circuit layer is formed in the base material by slotting the base material, and then the printed circuit board containing the fine circuit and the thick copper can be formed by superposing at least two superposed circuit layers on the embedded circuit layer in a flash plating and electroplating manner, so that the limitation of etching capability and the production cost of the printed circuit board can be effectively solved. The technical problem that printed circuit boards with fine lines and thick copper are difficult to realize due to limitation of the thickness and resolution of an anti-plating agent in pattern electroplating is solved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and in particular, to a method for manufacturing a printed circuit board and a printed circuit board. Background Art

[0002] With the increasing miniaturization and multi-functionality of electronic products, high-density integrated circuits (ICs) with ultra-high speed, high heat dissipation, and multiple terminals have emerged. In order to enable the IC chip to achieve fast signal transmission on the printed circuit board and meet the requirements of high-power chips for high current density, fine lines and thick copper layers are required. These designs are key factors to ensure good matching and packaging between high-power chips and printed circuit boards.

[0003] In traditional technologies, the general subtractive method for preparing graphic lines can complete the production of thick copper through multiple electroplating processes. However, due to the limitations of etching capabilities, it is difficult to meet the production of fine lines. The semi-additive method and the full-additive method can complete the production of fine lines. However, in graphic electroplating, due to the limitations of the thickness and resolution of the plating resist, it is difficult to complete the production of thick copper. Summary of the Invention

[0004] The main technical problem to be solved by the present application is to provide a method for manufacturing a printed circuit board and a printed circuit board, which can solve the technical problem that it is difficult to realize a printed circuit board with fine lines and thick copper due to the limitations of etching capabilities and the limitations of the thickness and resolution of the plating resist in graphic electroplating.

[0005] To solve the above technical problem, a technical solution adopted by the present application is that the manufacturing method includes:

[0006] Obtain a substrate;

[0007] Groove the substrate to form grooves corresponding to the circuit pattern;

[0008] Fill the grooves with metal to form an embedded circuit layer of the circuit pattern in the substrate;

[0009] Based on the embedded circuit layer, use flash plating and electroplating methods to stack at least two stacked circuit layers on the embedded circuit layer to form a printed circuit board.

[0010] Optionally, the filling the grooves with metal to form an embedded circuit layer of the circuit pattern in the substrate includes:

[0011] Fill the grooves with a metal conductive liquid;

[0012] By adjusting the temperature and pressure parameters of the metal conductive liquid, the metal conductive liquid is cured in the groove to form an embedded circuit layer of the circuit pattern in the substrate.

[0013] Optionally, filling the metal conductive liquid into the groove includes:

[0014] Filling the metal conductive liquid into the groove according to preset filling parameters; wherein, the filling parameters include at least one of pressure, temperature, slurry viscosity, flow rate, and time.

[0015] Optionally, based on the embedded circuit layer, using the method of flash plating and electroplating to stack at least two stacked circuit layers on the embedded circuit layer to form a printed circuit board, includes:

[0016] Sputtering the substrate including the embedded circuit layer to form a first sputtering seed layer;

[0017] Performing pattern electroplating on the first sputtering seed layer according to the circuit pattern to form a first stacked circuit layer;

[0018] For each stacked circuit layer after the first stacked circuit layer, sputtering the current stacked circuit layer to form the next sputtering seed layer, and performing pattern electroplating on the next sputtering seed layer according to the circuit pattern to form the next stacked circuit layer; and so on, stacking at least two stacked circuit layers to form the printed circuit board.

[0019] Optionally, grooving the substrate to form a groove corresponding to the circuit pattern includes:

[0020] Grooving the substrate by chemical means and / or physical means to form a groove corresponding to the circuit pattern.

[0021] Optionally, obtaining the substrate includes:

[0022] Obtaining a substrate including a metal layer;

[0023] Micro-etching the metal layer on the substrate to form the substrate.

[0024] To solve the above technical problems, another technical solution adopted by this application is: a printed circuit board, the printed circuit board includes:

[0025] A substrate, including a groove corresponding to the circuit pattern;

[0026] An embedded circuit layer, used to fill in the groove;

[0027] At least two stacked circuit layers, used to stack on the embedded circuit layer by the method of flash plating and electroplating.

[0028] Optionally, the printed circuit board further comprises at least two sputtering seed layers;

[0029] The stacked circuit layer is stacked on the embedded circuit layer based on the sputtered seed layer, and adjacent stacked circuit layers are stacked based on the sputtered seed layer.

[0030] Optionally, a surface of the embedded circuit layer is coplanar with a surface of the substrate.

[0031] Optionally, the groove has a width of 20 to 50 um and a depth of 10 to 20 um.

[0032] In order to solve the above technical problems, another technical solution adopted by the present application is: an electronic device, the electronic device comprising:

[0033] A memory for storing executable program codes;

[0034] A processor is used to call and run the executable program code from the memory, so that the electronic device executes the method for preparing a printed circuit board as described in any one of the above.

[0035] To solve the above technical problems, another technical solution adopted in the present application is: a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for preparing a printed circuit board as described in any one of the above items is implemented.

[0036] Different from the prior art, the embodiment of the present application provides a method for preparing a printed circuit board, the method comprising: obtaining a substrate; slotting the substrate to form a groove corresponding to a circuit pattern; filling the groove with metal to form an embedded circuit layer of the circuit pattern in the substrate; based on the embedded circuit layer, at least two superimposed circuit layers are superimposed on the embedded circuit layer by flash plating and electroplating to form a printed circuit board. By slotting the substrate to form an embedded circuit layer inside the substrate, and then by flash plating and electroplating, at least two superimposed circuit layers are superimposed on the embedded circuit layer, a printed circuit board containing fine circuits and thick copper can be formed, which can effectively solve the technical problem of difficulty in realizing a printed circuit board with fine circuits and thick copper due to the limitations of etching ability, as well as the thickness and resolution of the plating resist in graphic electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic flow chart of the first embodiment of the method for preparing a printed circuit board of the present application;

[0038] Figure 2It is a schematic flowchart of the second embodiment of the method for manufacturing a printed circuit board according to the present application;

[0039] Figures 3a to 3n It is a schematic diagram of an exemplary process step of the method for manufacturing a printed circuit board according to the present application;

[0040] Figure 4 It is an exemplary structural block diagram of an electronic device of the method for manufacturing a printed circuit board according to the present application;

[0041] Figure 5 It is an exemplary structural block diagram of a computer-readable storage medium of the method for manufacturing a printed circuit board according to the present application.

[0042] Reference numerals in the drawings: substrate 1; metal layer 2; groove 3; embedded circuit layer 4; first sputtering seed layer 5; plating resist 6; area to be electroplated 7; first stacked circuit layer 8; second sputtering seed layer 9; second stacked circuit layer 10. Detailed implementation manners

[0043] The present application will be described in detail below with reference to the drawings and embodiments.

[0044] In this embodiment, it is considered that with the increasing miniaturization and multifunctionality of electronic products, high-density integrated circuits (ICs) with ultra-high speed, high heat dissipation, and multiple terminals have emerged. In order to enable the IC chip to achieve fast signal transmission on the printed circuit board and meet the requirements of high-power chips for high current density, fine lines and thick copper layers are required. These designs are key factors to ensure a good matching package between high-power chips and printed circuit boards.

[0045] In the traditional technology, the general subtractive method for manufacturing graphic circuits can complete the production of thick copper through multiple electroplating processes. However, due to the limitations of etching ability, it is difficult to meet the production of fine lines; while the semi-additive method and the full-additive method can complete the production of fine lines, but due to the limitations of the thickness and resolution of the plating resist in graphic electroplating, it is difficult to complete the production of thick copper.

[0046] Therefore, in this embodiment, based on the additive method, the substrate is grooved by chemical or physical methods, metal is filled in the grooves, and then the circuit is added multiple times through flash plating - pattern transfer - pattern electroplating, so as to manufacture fine lines with the characteristics of thick copper.

[0047] Please refer to Figure 1 , Figure 1 It is a schematic flowchart of the first embodiment of the method for manufacturing a printed circuit board according to the present application. It should be noted that if there are substantially the same results, the method of the present application is not limited to Figure 1 the process sequence shown. For example, Figure 1As shown, the preparation method includes:

[0048] Step S110, obtaining a substrate;

[0049] Among them, the substrate can be an insulating material without a metal layer covered, such as fiberglass-reinforced resin or polymer, which serves as the basis for the entire circuit structure and is used to support the embedded circuit layer and the stacked circuit layer.

[0050] Step S120, grooving the substrate to form grooves corresponding to the circuit pattern;

[0051] Among them, grooving can form a groove structure on at least one side of the substrate by chemical or physical methods. The size and shape of the grooves can be made according to the circuit pattern to ensure the accuracy of the width and direction of the circuit filled in the grooves. These grooves can make the circuit pattern more delicate after filling with metal, meeting the requirements of high-density packaging.

[0052] Specifically, although traditional semi-additive and full-additive methods can produce fine circuits, it is difficult to achieve a copper layer with sufficient thickness and cannot well meet the requirements of high-current transmission. In this embodiment, by filling metal into the grooves corresponding to the circuit pattern, a thick copper path is formed inside the printed circuit board for the circuit structure. Thus, thick copper production can be achieved without relying on the thickness and resolution of the plating resist. This thick copper structure can effectively improve the current-carrying capacity and meet the requirements of high-current density for high-power chips.

[0053] At the same time, a large amount of heat is generated when the high-power IC chip is operating. The thick copper layer can help the heat dissipate effectively. However, the traditional surface electroplated copper layer may have insufficient heat dissipation efficiency due to limited surface area. The embedded circuit can make the circuit part closely combined with the substrate, providing a larger heat conduction path. The thick copper layer formed after the embedded circuit is combined with the substrate can help conduct the chip heat more effectively to the printed circuit board, thereby achieving better heat dissipation management and ensuring the stability of the chip in the high-speed and high-current working state.

[0054] Step S130, filling the metal into the grooves to form an embedded circuit layer of the circuit pattern in the substrate;

[0055] Among them, the metal can be solid metal, liquid metal, or metal slurry.

[0056] Specifically, since the traditional subtractive method is limited by the etching ability when increasing the copper thickness through multiple electroplating and etching processes, it is difficult to fabricate fine circuits. Therefore, in this embodiment, the circuits are filled into the substrate interior to form an embedded circuit layer, which can reduce the etching requirements for fine circuits and make the process control more stable. At the same time, after the metal is embedded in the substrate, the embedded circuit layer is protected by the substrate, that is, it has higher structural strength compared to the circuits electroplated on the surface, and can avoid circuit deformation or cracking caused by external stress or thermal expansion and contraction.

[0057] Step S140: Based on the embedded circuit layer, at least two stacked circuit layers are stacked on the embedded circuit layer by flash plating and electroplating to form a printed circuit board.

[0058] Specifically, on the basis of the embedded circuit layer, more stacked circuit layers are stacked by sputtering and electroplating technologies to form a printed circuit board with a multi-layer structure. Among them, sputtering is used to generate a uniform metal thin film on the surface of the embedded circuit layer to provide adhesion for the stacked circuit layers. Then, multiple layers of conductive metal are deposited through the electroplating process to further increase the conduction path, and a multi-order high-density interconnect (HDI) fine-pitch printed circuit board or multi-level optimization (MO) including fine circuits and thick copper can be formed.

[0059] In this embodiment, by grooving the substrate and filling the grooves with metal, the substrate is grooved to form an embedded circuit layer inside the substrate. Then, at least two stacked circuit layers are stacked on the embedded circuit layer by flash plating and electroplating, and a printed circuit board including fine circuits and thick copper can be formed, which can effectively solve the technical problems that it is difficult to realize a printed circuit board with fine circuits and thick copper due to the limitations of etching ability and the limitations of the thickness and resolution of the plating resist in graphic electroplating.

[0060] Please refer to Figure 2 , Figure 2 which is a schematic flowchart of the second embodiment of the method for preparing a printed circuit board according to the present application. In this embodiment, the method includes the following steps:

[0061] Step S210: Obtain a substrate including a metal layer;

[0062] Specifically, the substrate may be an insulating material, such as glass or resin, and a metal layer is deposited on the surface of the insulating material of the substrate. In the prior art, the metal layer is used for processing to form a circuit pattern.

[0063] Step S220: Micro-etch the metal layer on the substrate to form the substrate.

[0064] Specifically, by chemically etching away all the metal layers on the substrate to expose the surface of the substrate, full-panel grooving can be achieved without affecting the substrate. This ensures that conductive paths can be formed inside the substrate.

[0065] Step S230: Groove the substrate by chemical means and / or physical means to form grooves corresponding to the circuit pattern.

[0066] Specifically, to preset the path of the circuit pattern in the substrate, groove structures are formed on the substrate by chemical or physical methods. These methods include, but are not limited to, controlling the depth of mechanical grooving, laser milling the outer shape, and plasma etching. Using chemical or physical methods for grooving can ensure the formation of reliable conductive paths in a narrow space. Among them, the depth and width of the grooves can be adjusted according to the specific requirements of the product. For example, the width can be controlled within 20 - 50 microns, and the depth can be controlled within 10 - 20 microns.

[0067] Step S240: Fill the grooves with the metal conductive liquid according to the preset filling parameters; wherein, the filling parameters include at least one of pressure, temperature, slurry viscosity, flow rate, and time.

[0068] Specifically, filling the metal conductive slurry into the grooves through parameter control can ensure the uniform filling, stable flow, and good adhesion of the slurry.

[0069] Among them, pressure is one of the most critical parameters during the process of filling the slurry. Appropriate pressure can push the slurry into the grooves to ensure the uniform distribution and complete filling of the material. For example, the injection pressure can be adjusted so that the slurry can overcome the surface tension and the resistance of the substrate.

[0070] Temperature affects the viscosity of the slurry. A higher temperature can reduce the viscosity, making it easier for the slurry to flow into the grooves; while a lower temperature may increase the stability of the slurry and prevent it from curing prematurely. For example, the slurry can be heated or cooled through a temperature control system to achieve the best fluidity.

[0071] The viscosity of the slurry determines its fluidity and filling property. A lower viscosity is convenient for filling but may cause uneven flow, while a higher viscosity may result in insufficient filling. For example, the formulation components can be adjusted or solvents can be added to control the viscosity to make it suitable for the current temperature and pressure conditions and ensure the balance between flow and filling.

[0072] The flow rate directly affects the uniformity and controllability of the slurry filling. Appropriate flow rate can prevent the generation of bubbles and intermittent phenomena during the filling process. For example, the flow rate can be adjusted through the flow control device of the pump to make the slurry inject into the grooves smoothly and evenly. An excessively high flow rate will bring in air and form bubbles; while an excessively low flow rate may lead to slow or incomplete filling.

[0073] Time control can ensure that the slurry is fully filled and leveled in the groove, avoiding uneven thickness or voids. For example, the filling time can be set according to the size and depth of the groove and the flow characteristics of the slurry to ensure that the slurry has sufficient flow and stabilization time in the groove.

[0074] Step S250: By adjusting the temperature and pressure parameters of the metal conductive liquid, the metal conductive liquid is cured in the groove to form an embedded circuit layer of the circuit pattern in the substrate.

[0075] Specifically, in order to firmly attach the conductive slurry in the groove within the substrate, the temperature and pressure of the metal conductive slurry can be controlled to cure the conductive slurry in the groove of the substrate, ensuring that the conductive slurry is fully cured in the groove and has good bonding with the substrate.

[0076] Step S260: The substrate containing the embedded circuit layer is sputtered to form a first sputtering seed layer;

[0077] Specifically, sputtering can be a physical vapor deposition technique that uses high-energy particles to bombard a metal target, depositing metal atoms on the surface of the substrate to form a sputtering seed layer. The sputtering seed layer can provide the conductivity and attachment surface required in the subsequent electroplating process, ensuring the uniformity and quality of electroplating.

[0078] Step S270: On the first sputtering seed layer, pattern electroplating is performed according to the circuit pattern to form a first stacked circuit layer;

[0079] Among them, the first sputtering seed layer can be a sputtered layer sputtered on the embedded circuit layer. For the first stacked circuit layer, electroplating can deposit a thicker copper layer on the sputtering seed layer to form a fine thick copper circuit. By sputtering to generate the sputtering seed layer to provide a substrate for the stacked circuit layer to adhere to, and then thickening layer by layer through the electroplating process, a high-precision and stable thick copper circuit can be obtained, effectively improving the conductivity and thermal stability of the printed circuit board.

[0080] Specifically, the specific steps of pattern electroplating according to the circuit pattern can include: covering a layer of plating resist on the surface of the first construction seed layer. Then, a mask plate of the circuit pattern is covered on the plating resist and exposed. After exposure, the photoresist is developed, and the areas to be electroplated corresponding to the circuit pattern will be removed by the developer, while the non-electroplated areas will be retained. Metal electroplating is performed in the areas to be electroplated to form a first stacked circuit layer; after electroplating is completed, the photoresist is removed, and the excess metal outside the electroplated area is removed, retaining the circuit pattern part formed by electroplating.

[0081] Step S280: For each stacked circuit layer after the first stacked circuit layer, sputter the current stacked circuit layer to form the next sputtering seed layer; on the next sputtering seed layer, perform pattern plating according to the circuit pattern to form the next stacked circuit layer.

[0082] Specifically, the stacked circuit layers are constructed layer by layer through continuous sputtering and plating. The plating for each layer is performed on a new sputtering seed layer to ensure the stability and continuity of the circuits.

[0083] Step S290: And so on, stack at least two stacked circuit layers to form the printed circuit board.

[0084] Specifically, by repeating the sputtering and plating steps in Step S280, multiple stacked circuit layers are formed, thereby constructing a complete printed circuit board.

[0085] In an exemplary embodiment, a printed circuit board including one embedded circuit layer and two stacked circuit layers is taken as an example. In other embodiments, there may also be more than two stacked circuit layers. Please refer to Figures 3a to 3n . Figure 3a showing the substrate 1 and the metal layer 2 on the surface of the substrate; first, by micro-etching the metal layer 2, a substrate 1 without a metal layer covering as shown in Figure 3b is formed; then, grooves are formed on both surfaces of the substrate 1 to form grooves 3 corresponding to the circuit pattern as shown in Figure 3c ; then, a metal conductive slurry is filled into the grooves 3, and the metal conductive slurry in the grooves 3 is cured to form an embedded circuit layer 4 as shown in Figure 3d ; wherein, if the surface of the cured embedded circuit layer 4 is not coplanar with the surface of the substrate 1, the embedded circuit layer 4 can be leveled so that the surface of the embedded circuit layer 4 is coplanar with the surface of the substrate 1; then, sputtering is respectively performed on both surfaces of the substrate 1 to form Figure 3e the first sputtering seed layer 5 as shown; then, an anti-plating agent 6 as shown in Figure 3f is covered on the surface of the first sputtering seed layer 5; then, the anti-plating agent 6 is exposed and developed to form a plating area 7 as shown in Figure 3g ; then, plating is performed on the Figure 3g plating area 7 to form Figure 3h the first stacked circuit layer 8 as shown; then, referring to Figure 3i , the non-plated area is etched to remove the anti-plating agent 6 and the first sputtering seed layer 5 outside the plating area 7; then, sputtering is performed on the first stacked circuit layer to form a second sputtering seed layer 9 as shown in Figure 3j ; then, the anti-plating agent 6 as shown in Figure 3k is continuously covered on the second sputtering seed layer 9; then, the anti-plating agent 6 is exposed and developed to formFigure 3l The shown electroplating area 7; then, Figure 3l electroplate the shown electroplating area 7 to form a second stacked circuit layer 10 as shown in Figure 3m ; finally, etch the non-electroplating area to remove the plating resist and the second sputtering seed layer 9 outside the electroplating area 7 to form a printed circuit board with fine lines and thick copper as shown in Figure 3n Figure.

[0086] Compared with the prior art, through the process steps of substrate, electroplating, laminating, exposure, etching, and printed circuit board, in this embodiment, through the process steps of base material, micro-etching, grooving, curing, sputtering, laminating, exposure and development, electroplating, etching, sputtering, laminating, exposure and development, electroplating, etching, and printed circuit board, that is, by filling the groove with a metal conductive liquid, adjusting the curing temperature and pressure parameters, and multi-layer stacked electroplating, a stable embedded circuit layer and stacked circuit layer can be formed; the combination of sputtering and electroplating processes enables the circuit layers to be stacked layer by layer, adapting to different circuit layer numbers and structural requirements, suitable for the design and manufacture of multi-layer circuit boards, and then used for different types of electronic packages; in addition, the stacked structure of the stacked circuit layer has good thermal conductivity, can better dissipate heat in high-temperature applications, and thus improves the heat dissipation efficiency of the printed circuit board.

[0087] To solve the above technical problems, another technical solution adopted by this application is: a printed circuit board, the printed circuit board includes:

[0088] A base material, including grooves corresponding to circuit patterns;

[0089] An embedded circuit layer for filling in the grooves;

[0090] At least two stacked circuit layers for stacking on the embedded circuit layer by means of flash plating and electroplating.

[0091] Optionally, the printed circuit board further includes at least two sputtering seed layers;

[0092] The stacked circuit layer is stacked on the embedded circuit layer based on the sputtering seed layer, and between adjacent stacked circuit layers, stacking is performed based on the sputtering seed layer.

[0093] Optionally, the surface of the embedded circuit layer is coplanar with the surface of the base material.

[0094] Optionally, the width of the groove is 20-50 um, and the depth is 10-20 um.

[0095] Please refer to Figure 4 , Figure 4 which is an exemplary structural block diagram of an electronic device for the preparation method of the printed circuit board of this application. AsFigure 4 As shown, the electronic device 400 of the present application may include a processor 401 and a memory 402, where the processor 401 and the memory 402 communicate with each other through a bus. The memory 402 stores program instructions for the preparation of a printed circuit board. When the program instructions are executed by the processor 401, the processor is caused to execute the above-mentioned related method steps to implement a method for preparing a printed circuit board in the above-mentioned embodiments.

[0096] Please refer to Figure 5 , Figure 5 which is an exemplary structural block diagram of a computer-readable storage medium for the method for preparing a printed circuit board of the present application. As Figure 5 shown, a computer program 501 is stored in the computer-readable storage medium 500. When the computer program 501 runs on a computer by a processor, the computer is caused to execute the above-mentioned related method steps to implement a method for preparing a printed circuit board in the above-mentioned embodiments.

[0097] In the above solution, by obtaining a substrate; grooving the substrate to form grooves corresponding to a circuit pattern; filling the grooves with metal to form an embedded circuit layer of the circuit pattern in the substrate; and based on the embedded circuit layer, using flash plating and electroplating methods to stack at least two stacked circuit layers on the embedded circuit layer to form a printed circuit board. By grooving the substrate to form an embedded circuit layer inside the substrate, and then using flash plating and electroplating methods to stack at least two stacked circuit layers based on the embedded circuit layer, a printed circuit board including fine circuits and thick copper can be formed, which can effectively solve the technical problem that it is difficult to realize a printed circuit board with fine circuits and thick copper due to the limitations of etching ability and the thickness and resolution of the plating resist in graphic electroplating.

[0098] In several embodiments provided by the present application, it should be understood that the disclosed methods, electronic devices, and storage media can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or units can be in electrical, mechanical, or other forms.

[0099] The unit described as a separation component may or may not be physically separated. The component shown as a unit may or may not be a physical unit, that is, it may be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0100] In addition, each functional unit in various embodiments of the present application may be integrated in a processing unit, may exist separately as individual physical units, or two or more units may be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0101] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the preparation method described in various embodiments of the present application. The aforementioned storage medium includes: USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks, or optical discs and other various media that can store program codes.

[0102] The above description is only for the embodiments of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A method for preparing a printed circuit board, characterized in that: The preparation method comprises: Obtaining a substrate; Grooving the substrate to form grooves corresponding to the circuit pattern; Filling the groove with metal to form an embedded circuit layer of the circuit pattern in the substrate; Based on the embedded circuit layer, at least two superimposed circuit layers are superimposed on the embedded circuit layer by flash plating and electroplating to form a printed circuit board.

2. The preparation method according to claim 1, characterized in that: The step of filling the groove with metal to form an embedded circuit layer of the circuit pattern in the substrate includes: Filling the groove with a metal conductive liquid; By adjusting the temperature and pressure parameters of the metal conductive liquid, the metal conductive liquid is solidified in the groove to form an embedded circuit layer of the circuit pattern in the substrate.

3. The preparation method according to claim 2, characterized in that: The step of filling the groove with the metal conductive liquid comprises: The metal conductive liquid is filled into the groove according to preset filling parameters; wherein the filling parameters include at least one of pressure, temperature, slurry viscosity, flow rate, and time.

4. The preparation method according to claim 1, characterized in that: Based on the embedded circuit layer, at least two superimposed circuit layers are superimposed on the embedded circuit layer by flash plating and electroplating to form a printed circuit board, including: Sputtering the substrate including the embedded circuit layer to form a first sputtering seed layer; Performing pattern electroplating on the first sputtering seed layer according to the circuit pattern to form a first superimposed circuit layer; For each stacked circuit layer after the first stacked circuit layer, the current stacked circuit layer is sputtered to form the next sputtered seed layer, and pattern electroplating is performed on the next sputtered seed layer according to the circuit pattern to form the next stacked circuit layer; and so on, at least two stacked circuit layers are stacked to form the printed circuit board.

5. The preparation method according to claim 1, characterized in that: The step of slotting the substrate to form grooves corresponding to the circuit pattern includes: The substrate is grooved by chemical and / or physical means to form grooves corresponding to the circuit pattern.

6. The preparation method according to claim 1, characterized in that: The step of obtaining a substrate comprises: obtaining a substrate including a metal layer; The metal layer on the substrate is micro-etched to form the base material.

7. A printed circuit board, characterized in that: The printed circuit board comprises: A substrate including grooves corresponding to the circuit pattern; An embedded circuit layer, used to fill the groove; At least two superimposed circuit layers are used to be superimposed on the embedded circuit layer by flash plating and electroplating.

8. The printed circuit board according to claim 7, characterized in that: The printed circuit board also includes at least two sputtering seed layers; The stacked circuit layer is stacked on the embedded circuit layer based on the sputtered seed layer, and adjacent stacked circuit layers are stacked based on the sputtered seed layer.

9. The printed circuit board according to claim 7, characterized in that: The surface of the embedded circuit layer is coplanar with the surface of the substrate.

10. The printed circuit board according to claim 7, characterized in that: The width of the groove is 20-50 um, and the depth is 10-20 um.

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