TSV electroplating bubble suppression system

Abstract

The invention discloses a TSV (Through Silicon Via) electroplating bubble suppression system, the system is designed into a self-circulation mode and a process circulation mode through a process tank circulation diaphragm valve and a liquid storage tank circulation diaphragm valve, in the self-circulation mode, main liquid flows back to a liquid storage tank from a self-circulation pipeline, and part of liquid flows back to the liquid storage tank from a process tank overflow tank through a lengthened coil pipe; in the process circulation mode, electroplating liquid flows through the magnetic drive pump, the filter element and the flow sensor from the liquid storage tank, all the electroplating liquid flows into the process tank, and overflowing electroplating liquid flows back to the liquid storage tank through the coil pipe buffering and liquid discharging control module. Through the design of the liquid discharge control module of the overflow tank and the coil pipe in the liquid discharge pipeline, the bubble generation phenomenon caused by backflow impact of the plating solution can be greatly weakened, accumulation of bubbles in the liquid storage tank is reduced, additive loss is reduced, the service life of the plating solution is prolonged, and the quality of the TSV electroplating process is guaranteed.

Description

Technical Field

[0001] The present invention belongs to the field of TSV electroplating, and particularly relates to a TSV electroplating bubble suppression system. Background Art

[0002] The electroplating process is mainly divided into two processes: the first is pretreatment, which uses physical methods to remove the air inside the cavity, such as ultrasonic, spraying, vacuum pumping, etc., to enable the electroplating solution to smoothly enter the holes, and the second is to start electroplating filling.

[0003] TSV copper electroplating generally uses a copper sulfate system. Under a high copper bottom acid system, the higher copper ions in the plating solution can timely replenish copper ions at the bottom of the holes, and then, with the action of additives, the hole filling is completed under appropriate direct current conditions.

[0004] For the three additives used in the existing TSV electroplating process, bubbles are extremely likely to be generated during operation. The accumulation of bubbles exacerbates the loss of additives and greatly reduces the service life of the electroplating solution. Most importantly, if a large number of bubbles appear in the equipment circulation pipeline, it will have a great impact on the TSV process, such as: too thick surface copper or hole wall, poor phenomena such as cracks and voids in the holes, different current density distributions on the wafer surface, and poor uniformity, etc.

[0005] Therefore, there is an urgent need for a preparation method to suppress bubbles in the TSV electroplating process, so as to ensure the stable operation of the TSV electroplating process. Summary of the Invention

[0006] Aiming at the above problems, the purpose of the present invention is to provide a TSV electroplating bubble suppression system.

[0007] The specific technical solution for achieving the purpose of the present invention is as follows:

[0008] A TSV electroplating bubble suppression system includes a liquid storage tank, a regulating valve, a frequency converter-driven magnetic pump, a filter element, a liquid flow sensor, a pneumatic diaphragm valve, a process tank, an overflow tank, a coil pipe, and a liquid discharge control module;

[0009] The liquid storage tank is connected to the frequency converter-driven magnetic pump through the regulating valve, the other end of the frequency converter-driven magnetic pump is connected to the filter element, the filter element is connected to the liquid flow sensor, and the liquid flow sensor is connected to the pneumatic diaphragm valve;

[0010] The filter element is also connected to the liquid storage tank through a filter element exhaust pipe;

[0011] The pneumatic diaphragm valve is respectively connected to the process tank and the coil pipe; the coil pipe is connected to the liquid discharge control module, and the liquid discharge control module and the liquid storage tank are connected through the regulating valve;

[0012] An overflow tank is arranged outside the process tank, and the overflow tank is connected to the coil pipe.

[0013] Further, the regulating valve includes a process tank circulation diaphragm valve and a liquid storage tank circulation diaphragm valve;

[0014] The process tank circulation diaphragm valve is connected to the process tank, and the liquid storage tank circulation diaphragm valve is connected to the overflow tank.

[0015] Further, the liquid discharge control module includes a liquid level sensor, a PLC controller, and a diaphragm valve;

[0016] The liquid level sensor is arranged on the overflow tank for detecting the liquid level of the overflow tank;

[0017] The PLC controller is connected to the liquid level sensor and the diaphragm valve, and controls the opening and closing of the diaphragm valve according to the detection result of the liquid level sensor;

[0018] The diaphragm valve is connected to the liquid storage tank through a pipeline, a regulating valve.

[0019] Further, the diaphragm valve includes a / pneumatic diaphragm valve, a / pneumatic diaphragm valve, and a / pneumatic diaphragm valve;

[0020] When the liquid level sensor detects that the liquid level of the overflow tank is at a high level, the PLC controller controls the / pneumatic diaphragm valve to open, and the / pneumatic diaphragm valve and the / pneumatic diaphragm valve to close;

[0021] When the liquid level sensor detects that the liquid level of the overflow tank is at a medium level, the PLC controller controls the / pneumatic diaphragm valve to close, the / pneumatic diaphragm valve to open, and the / pneumatic diaphragm valve to close;

[0022] When the liquid level sensor detects that the liquid level of the overflow tank is at a low level, the PLC controller controls the / pneumatic diaphragm valve to close, the / pneumatic diaphragm valve to close, and the / pneumatic diaphragm valve to open.

[0023] Further, the coil pipe is a spiral pipe for increasing the stroke of the circulating liquid.

[0024] Further, the installation heights of the process tank and the overflow tank are higher than the height of the liquid storage tank circulation diaphragm valve.

[0025] Further, the process circulation mode and the self - circulation mode of the system are controlled by the process tank circulation diaphragm valve and the liquid storage tank circulation diaphragm valve.

[0026] Further, in the self - circulation mode, the process tank circulation diaphragm valve and the liquid storage tank circulation diaphragm valve are opened simultaneously. At this time, due to the relatively high heights of the process tank and the overflow tank, most of the electroplating solution circulating in the system passes through the liquid storage tank circulation diaphragm valve, and a small part enters the process tank through the process tank circulation diaphragm valve. The electroplating solution in the process tank is used to protect the anode target, and the excess electroplating solution flows into the overflow tank. Thus, the electroplating solution that passes through the liquid storage tank circulation diaphragm valve and the electroplating solution in the overflow tank flow back to the liquid storage tank through the coiled pipe and the drain control module, forming a self - circulation loop for the entire system.

[0027] Further, in the process circulation mode, the process tank circulation diaphragm valve is opened, and the liquid storage tank circulation diaphragm valve is closed. All the electroplating solution flowing out of the liquid storage tank enters the process tank through the process tank circulation diaphragm valve for the electroplating process. At the same time, the drain control module controls the electroplating solution to flow out at different flow rates and finally returns to the liquid storage tank, forming a process circulation loop for the entire system.

[0028] Further, all the liquid pipelines in the system are made of PFA pipes.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0030] The solution of the present invention enables the system to have a self - circulation mode and a process circulation mode through the settings of the process tank circulation diaphragm valve and the liquid storage tank circulation diaphragm valve. During electroplating, the drain control module controls the flow rate of the electroplating solution, and in combination with the coiled pipe, it ensures that the electroplating solution in the process tank is always at a high level. Due to the existence of the judgment, the travel of the electroplating solution increases, enabling the system to suppress the bubbles generated during the standby and operation states of the machine tool, thus avoiding the influence of the bubble problem on the TSV electroplating process.

[0031] The following further describes the present invention in conjunction with specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the TSV electroplating bubble suppression system architecture in the embodiment of the present invention.

[0033] Figure 2 It is a schematic diagram of the drain control module architecture in the embodiment of the present invention.

[0034] Figure 3 It is a schematic diagram of the coiled pipe structure in the embodiment of the present invention.

[0035] Figure 4 It is a schematic diagram of the electroplating solution flow direction in the self - circulation mode of the system in the embodiment of the present invention.

[0036] Figure 5 It is a schematic diagram of the electroplating solution flow direction in the process circulation mode of the system in the embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] A TSV electroplating bubble suppression system, comprising a liquid storage tank 1, a regulating valve 2, a frequency converter-driven magnetic pump 3, a filter element 4, a liquid flow sensor 6, a pneumatic diaphragm valve, a process tank 9, an overflow tank 10, a coil pipe 11, and a liquid discharge control module 12;

[0038] The liquid storage tank 1 is connected to the frequency converter-driven magnetic pump 3 through the regulating valve 2. The other end of the frequency converter-driven magnetic pump 3 is connected to the filter element 4. The filter element 4 is connected to the liquid flow sensor 6, and the liquid flow sensor 6 is connected to the pneumatic diaphragm valve;

[0039] The filter element 4 is also connected to the liquid storage tank 1 through a filter element exhaust pipe 5;

[0040] The pneumatic diaphragm valve is respectively connected to the process tank 9 and the coil pipe 11. The coil pipe 11 is connected to the liquid discharge control module 12, and the liquid discharge control module 12 is connected to the liquid storage tank 1 through the regulating valve 2;

[0041] An overflow tank 10 is arranged outside the process tank 9, and the overflow tank 10 is connected to the coil pipe 11.

[0042] The regulating valve 2 includes a process tank circulation diaphragm valve 7 and a liquid storage tank circulation diaphragm valve 8;

[0043] The process tank circulation diaphragm valve 7 is connected to the process tank 9, and the liquid storage tank circulation diaphragm valve 8 is connected to the overflow tank 10.

[0044] The liquid discharge control module 12 includes a liquid level sensor 14, a PLC controller 15, and a diaphragm valve 16;

[0045] The liquid level sensor 14 is arranged on the overflow tank 10 for detecting the liquid level of the overflow tank 10;

[0046] The PLC controller 15 is connected to the liquid level sensor 14 and the diaphragm valve 16, and controls the opening and closing of the diaphragm valve 16 according to the detection result of the liquid level sensor 14;

[0047] The diaphragm valve 16 is connected to the liquid storage tank 1 through a pipeline and the regulating valve 2.

[0048] The diaphragm valve 16 includes a 3 / 4 pneumatic diaphragm valve, a 1 / 2 pneumatic diaphragm valve, and a 1 / 4 pneumatic diaphragm valve;

[0049] When the liquid level sensor 14 detects that the liquid level of the overflow tank 10 is at a high level, the PLC controller 15 controls the 3 / 4 pneumatic diaphragm valve to open, and the 1 / 2 pneumatic diaphragm valve and the 1 / 4 pneumatic diaphragm valve to close;

[0050] When the liquid level sensor 14 detects that the liquid level in the overflow tank 10 is at the medium level, the PLC controller 15 controls the 3 / 4 pneumatic diaphragm valve to close, the 1 / 2 pneumatic diaphragm valve to open, and the 1 / 4 pneumatic diaphragm valve to close;

[0051] When the liquid level sensor 14 detects that the liquid level in the overflow tank 10 is at the low level, the PLC controller 15 controls the 3 / 4 pneumatic diaphragm valve to close, the 1 / 2 pneumatic diaphragm valve to close, and the 1 / 4 pneumatic diaphragm valve to open.

[0052] The drainage control module 12 shown controls the liquid level in the overflow tank 10 to decrease steadily by controlling the drainage speed and amount, reducing the phenomenon of liquid impact and air entrainment, thereby suppressing the formation of bubbles inside the pipeline. In this way, it can ensure that the entire pipeline is immersed in the electroplating solution during the circulation process, alleviate the appearance of bubbles at the end section of the pipeline, ensure that the electroplating solution at the end section is discharged back to the storage tank 1 without bubbles, and ensure the normal operation of subsequent circulation.

[0053] The coil pipe 11 is a spiral-shaped pipe, which is used to increase the travel of the circulating liquid.

[0054] The installation heights of the process tank 9 and the overflow tank 10 are higher than the height of the storage tank circulation diaphragm valve 8.

[0055] This system controls the process circulation mode and self-circulation mode of the system through the process tank circulation diaphragm valve 7 and the storage tank circulation diaphragm valve 8; when the circulation pump is working, the plating solution and additives can be fully mixed. The pipeline coil pipe 11 device can effectively reduce the generation of bubbles caused by the impact of the plating solution inside the pipe, and the drainage control module 12 can effectively reduce the bubbles that have been generated inside the pipe.

[0056] When in the self-circulation mode, the process tank circulation diaphragm valve 7 and the storage tank circulation diaphragm valve 8 are opened simultaneously. At this time, due to the higher heights of the process tank 9 and the overflow tank 10, due to the existence of the liquid level difference, most of the electroplating solution circulating in the system passes through the storage tank circulation diaphragm valve 8, and a small part passes through the process tank circulation diaphragm valve 7 and enters the process tank 9; the electroplating solution in the process tank 9 is used to protect the anode target, and the excess electroplating solution flows into the overflow tank 10, and then returns to the storage tank 1 through the coil pipe 11 and the drainage control module 12 together with the electroplating solution passing through the storage tank circulation diaphragm valve 8, forming a self-circulation loop for the entire system;

[0057] The design of the self-circulation mode here can also effectively prevent the situation where the additives precipitate during the Idle standby state of the machine tool, resulting in insufficient mixing with the electroplating solution.

[0058] When in the process circulation mode, that is, when electroplating operation is required, the magnetic pump 3 works, the process tank circulation diaphragm valve 7 is opened, and the storage tank circulation diaphragm valve 8 is closed;

[0059] The electroplating solution passes through the inverted filter element 4, and the generated bubbles are initially filtered through the filter element exhaust pipe 5. The electroplating solution passes through the liquid flow sensor 6, the process tank circulation diaphragm valve 7, and all the electroplating solution flowing out of the liquid storage tank 1 sequentially enters the process tank 9 through the process tank circulation diaphragm valve 7 for the electroplating process to ensure sufficient TSV electroplating and full exchange. At the same time, the drain control module 11 controls the electroplating solution to flow out at different flow rates and finally returns to the liquid storage tank 1 to form the process circulation loop of the entire system.

[0060] At the same time, the design of the coiled pipe 11 at the tail of the overflow tank 10 and the drain control module 12 can increase the stroke, ensuring that the liquid level of the overflow tank 10 is in a medium-high liquid level state, avoiding the phenomenon of air bubbles inside the pipeline caused by the addition of air during the circulation process.

[0061] All the liquid pipelines in the system are made of PFA pipes. PFA pipes have high transparency and low refractive index, which can very intuitively show the flow of the electroplating solution inside the pipe. And the inside of the pipe is smooth, with a small friction coefficient and low precipitation of metal ions, meeting the use requirements of the clean room and ensuring the stable operation of the TSV electroplating process.

[0062] Embodiment

[0063] Combined with Figure 1 , a TSV electroplating bubble suppression system includes a liquid storage tank 1, a regulating valve 2, a frequency converter-driven magnetic pump 3, a filter element 4, a liquid flow sensor 6, a pneumatic diaphragm valve, a process tank 9, an overflow tank 10, a coiled pipe 11, and a drain control module 12;

[0064] The liquid storage tank 1 is connected to the frequency converter-driven magnetic pump 3 through the regulating valve 2. The other end of the frequency converter-driven magnetic pump 3 is connected to the filter element 4. The filter element 4 is connected to the liquid flow sensor 6, and the liquid flow sensor 6 is connected to the pneumatic diaphragm valve;

[0065] The filter element 4 is also connected to the liquid storage tank 1 through the filter element exhaust pipe 5;

[0066] The pneumatic diaphragm valve is respectively connected to the process tank 9 and the coiled pipe 11; the coiled pipe 11 is connected to the drain control module 12, and the drain control module 12 and the liquid storage tank 1 are connected through the regulating valve 2;

[0067] An overflow tank 10 is arranged outside the process tank 9, and the overflow tank 10 is connected to the coiled pipe 11.

[0068] The regulating valve 2 includes a process tank circulation diaphragm valve 7 and a liquid storage tank circulation diaphragm valve 8;

[0069] The process tank circulation diaphragm valve 7 is connected to the process tank 9, and the liquid storage tank circulation diaphragm valve 8 is connected to the overflow tank 10.

[0070] Combined with Figure 2, the liquid discharge control module 12 includes a liquid level sensor 14, a PLC controller 15, and a diaphragm valve 16;

[0071] The liquid level sensor 14 is arranged on the overflow tank 10 for detecting the liquid level of the overflow tank 10;

[0072] The PLC controller 15 is connected to the liquid level sensor 14 and the diaphragm valve 16, and controls the opening and closing of the diaphragm valve 16 according to the detection result of the liquid level sensor 14;

[0073] The diaphragm valve 16 is connected to the liquid storage tank 1 through a pipeline, a regulating valve 2.

[0074] The diaphragm valve 16 includes a 3 / 4 pneumatic diaphragm valve, a 1 / 2 pneumatic diaphragm valve, and a 1 / 4 pneumatic diaphragm valve;

[0075] When the liquid level sensor 14 detects that the liquid level of the overflow tank 10 is at a high level, the PLC controller 15 controls the 3 / 4 pneumatic diaphragm valve to open, and the 1 / 2 pneumatic diaphragm valve and the 1 / 4 pneumatic diaphragm valve to close;

[0076] When the liquid level sensor 14 detects that the liquid level of the overflow tank 10 is at a medium level, the PLC controller 15 controls the 3 / 4 pneumatic diaphragm valve to close, the 1 / 2 pneumatic diaphragm valve to open, and the 1 / 4 pneumatic diaphragm valve to close;

[0077] When the liquid level sensor 14 detects that the liquid level of the overflow tank 10 is at a low level, the PLC controller 15 controls the 3 / 4 pneumatic diaphragm valve to close, the 1 / 2 pneumatic diaphragm valve to close, and the 1 / 4 pneumatic diaphragm valve to open.

[0078] The shown liquid discharge control module 12 controls the liquid level of the overflow tank 10 to be stable by controlling the liquid discharge speed and the liquid discharge volume, reduces the phenomenon of liquid impact and air entrainment, and thus inhibits the formation of bubbles inside the pipeline. In this way, it can be ensured that the entire pipeline is immersed in the electroplating solution during the circulation process, alleviates the appearance of bubbles at the end section of the pipeline, ensures that the electroplating solution at the end section is discharged back to the liquid storage tank 1 without bubbles, and the subsequent circulation operates normally.

[0079] Combined with Figure 3 , the coiled pipe 11 is a spiral-shaped pipe for increasing the travel of the circulating liquid.

[0080] The installation heights of the process tank 9 and the overflow tank 10 are higher than the height of the liquid storage tank circulation diaphragm valve 8.

[0081] This system controls the process circulation mode and the self-circulation mode of the system through the process tank circulation diaphragm valve 7 and the liquid storage tank circulation diaphragm valve 8; when the circulation pump is working, the plating solution and the additive can be fully mixed, the pipeline coiled pipe 11 device can effectively reduce the generation of bubbles caused by the impact of the plating solution in the pipe, and the liquid discharge control module 12 can effectively reduce the bubbles already generated in the pipe.

[0082] Combined with Figure 4 , when in the self-circulation mode, the process tank circulation diaphragm valve 7 and the liquid storage tank circulation diaphragm valve 8 are opened simultaneously. At this time, due to the relatively high heights of the process tank 9 and the overflow tank 10, most of the electroplating solution circulating in the system enters the process tank 9 through the liquid storage tank circulation diaphragm valve 8, and a small part enters the process tank 9 through the process tank circulation diaphragm valve 7 due to the liquid level difference; the electroplating solution in the process tank 9 is used to protect the anode target, and the excess electroplating solution flows into the overflow tank 10, and then flows back to the liquid storage tank 1 through the coil 11 and the drain control module 12 together with the electroplating solution passing through the liquid storage tank circulation diaphragm valve 8, forming a self-circulation loop for the entire system;

[0083] The design of the self-circulation mode here can also effectively prevent the situation where the additives cannot be fully mixed with the electroplating solution during precipitation when the machine is in the Idle standby state.

[0084] Combined with Figure 5 , when in the process circulation mode, that is, when electroplating operation is required, the magnetic pump 3 works, the process tank circulation diaphragm valve 7 is opened, and the liquid storage tank circulation diaphragm valve 8 is closed;

[0085] The electroplating solution passing through the inverted filter element 4 will initially filter the generated bubbles through the filter element exhaust pipe 5. The electroplating solution passes through the liquid flow sensor 6 and the process tank circulation diaphragm valve 7, and all the electroplating solution flowing out of the liquid storage tank 1 sequentially enters the process tank 9 through the process tank circulation diaphragm valve 7 for electroplating process to ensure sufficient TSV electroplating and full exchange; at the same time, the drain control module 11 controls the electroplating solution to flow out at different flow rates and finally returns to the liquid storage tank 1, forming a process circulation loop for the entire system.

[0086] At the same time, the design of the coil 11 at the tail of the overflow tank 10 and the drain control module 12 can increase the stroke, ensuring that the liquid level in the overflow tank 10 is in a medium-high liquid level state, avoiding the phenomenon of air bubbles inside the pipeline caused by the addition of air during the circulation process.

[0087] All the liquid pipelines in the system adopt PFA pipes. PFA pipes have high transparency and low refractive index, which can clearly visually observe the flow of the electroplating solution inside the pipe. And the inside of the pipe is smooth, with a small friction coefficient and low precipitation of metal ions, meeting the use requirements of the clean room and ensuring the stable operation of the TSV electroplating process.

[0088] The above embodiments show and describe the basic principles and main features of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A TSV electroplating bubble suppression system, characterized in that, It includes a liquid storage tank (1), a regulating valve, a frequency converter-driven magnetic pump (3), a filter element (4), a liquid flow sensor (6), a pneumatic diaphragm valve, a process tank (9), an overflow tank (10), a coil pipe (11), and a liquid discharge control module (12); The liquid storage tank (1) is connected to the frequency converter-driven magnetic pump (3) through a regulating valve. The other end of the frequency converter-driven magnetic pump (3) is connected to the filter element (4). The filter element (4) is connected to the liquid flow sensor (6). The liquid flow sensor (6) is connected to the pneumatic diaphragm valve; The filter element (4) is also connected to the liquid storage tank (1) through a filter element exhaust pipe (5); The pneumatic diaphragm valve is respectively connected to the process tank (9) and the coil pipe (11). The coil pipe (11) is connected to the liquid discharge control module (12). There is a connection through a regulating valve between the liquid discharge control module (12) and the liquid storage tank (1); An overflow tank (10) is arranged outside the process tank (9). The overflow tank (10) is connected to the coil pipe (11).

2. The TSV electroplating bubble suppression system according to claim 1, characterized in that, The regulating valve includes a process tank circulation diaphragm valve (7) and a liquid storage tank circulation diaphragm valve (8); The process tank circulation diaphragm valve (7) is connected to the process tank (9). The liquid storage tank circulation diaphragm valve (8) is connected to the overflow tank (10).

3. The TSV electroplating bubble suppression system according to claim 1, characterized in that, The liquid discharge control module (12) includes a liquid level sensor (14), a PLC controller (15), and a diaphragm valve (16); The liquid level sensor (14) is arranged on the overflow tank (10) and is used to detect the liquid level of the overflow tank (10); The PLC controller (15) is connected to the liquid level sensor (14) and the diaphragm valve (16), and controls the opening and closing of the diaphragm valve (16) according to the detection result of the liquid level sensor (14); The diaphragm valve (16) is connected to the liquid storage tank (1) through a pipeline and a regulating valve.

4. The TSV electroplating bubble suppression system according to claim 3, characterized in that, The diaphragm valve (16) includes a 3 / 4 pneumatic diaphragm valve, a 1 / 2 pneumatic diaphragm valve, and a 1 / 4 pneumatic diaphragm valve; When the liquid level sensor (14) detects that the liquid level of the overflow tank (10) is at a high liquid level, the PLC controller (15) controls the 3 / 4 pneumatic diaphragm valve to open and the 1 / 2 pneumatic diaphragm valve and the 1 / 4 pneumatic diaphragm valve to close; When the liquid level sensor (14) detects that the liquid level of the overflow tank (10) is at a medium liquid level, the PLC controller (15) controls the 3 / 4 pneumatic diaphragm valve to close, the 1 / 2 pneumatic diaphragm valve to open, and the 1 / 4 pneumatic diaphragm valve to close; When the liquid level sensor (14) detects that the liquid level of the overflow tank (10) is at a low liquid level, the PLC controller (15) controls the 3 / 4 pneumatic diaphragm valve to close, the 1 / 2 pneumatic diaphragm valve to close, and the 1 / 4 pneumatic diaphragm valve to open.

5. The TSV electroplating bubble suppression system according to claim 1, characterized in that, The coil pipe (11) is a ring-shaped pipe and is used to increase the stroke of the circulating liquid.

6. The TSV electroplating bubble suppression system according to claim 4, characterized in that, The installation heights of the process tank (9) and the overflow tank (10) are higher than the height of the liquid storage tank circulation diaphragm valve (8).

7. The TSV electroplating bubble suppression system according to claim 6, characterized in that, The process circulation mode and the self-circulation mode of the system are controlled through the process tank circulation diaphragm valve (7) and the liquid storage tank circulation diaphragm valve (8).

8. The TSV electroplating bubble suppression system according to claim 7, characterized in that, When in the self - circulation mode, the process tank circulation diaphragm valve (7) and the liquid storage tank circulation diaphragm valve (8) are opened simultaneously. At this time, due to the relatively high heights of the process tank (9) and the overflow tank (10), most of the electroplating solution circulating in the system passes through the liquid storage tank circulation diaphragm valve (8), and a small part passes through the process tank circulation diaphragm valve (7) and enters the process tank (9); the electroplating solution in the process tank (9) is used to protect the anode target, and the excess electroplating solution flows into the overflow tank (10), and then, together with the electroplating solution passing through the liquid storage tank circulation diaphragm valve (8), flows back to the liquid storage tank (1) through the coiled pipe (11) and the liquid discharge control module (12), forming a self - circulation loop for the entire system.

9. The TSV electroplating bubble suppression system according to claim 7, characterized in that, When in the process - circulation mode, the process tank circulation diaphragm valve (7) is opened, and the liquid storage tank circulation diaphragm valve (8) is closed. All the electroplating solution flowing out of the liquid storage tank (1) enters the process tank (9) through the process tank circulation diaphragm valve (7) and is used for the electroplating process; at the same time, the liquid discharge control module (11) controls the electroplating solution to flow out at different flow rates and finally returns to the liquid storage tank (1), forming a process - circulation loop for the entire system.

10. The TSV electroplating bubble suppression system according to any one of claims 1-9, characterized in that, All the liquid pipelines in the system are made of PFA pipes.

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