Conveying device of gluing and developing equipment

Abstract

The invention provides a conveying device of gluing and developing equipment, and relates to the technical field of gluing and developing equipment. The base is fixed on the gluing developing equipment, two first electric cylinders are fixed on the top end surface of the base, and the extending ends of the two first electric cylinders are fixed on the bottom end surface of the first mounting block. An emergency adjustment function: when the first electric cylinder breaks down, the two third electric cylinders can be used as standby devices, and the height of the wafer is adjusted emergently through extension, so that the production is not affected, and the reliability and the stability of the equipment are improved; automatic alignment and cleaning functions: a mounting rack in the auxiliary assembly can automatically stir the wafer into a placement groove to ensure that the position of the wafer is correct; meanwhile, the cleaning block can remove dust on the surface of the wafer in the moving process of the wafer, so that the gluing or developing quality is improved; and the cleaning assembly realizes the airflow dust removal of the top end surface of the wafer through continuous air injection of a telescopic bottle and an air injection pipe, so that the gluing or developing precision and effect are further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of spin coating and developing equipment, and particularly relates to a transfer device for spin coating and developing equipment. Background Art

[0002] Spin coating and developing equipment is a key equipment used in conjunction with a lithography machine in the lithography process; spin coating and developing equipment generally includes multiple parts such as a spin coater, a spray coater, and a developer; these parts play a crucial role in the lithography process, operate in conjunction with the lithography machine, and jointly form a wafer processing and lithography production line. The spin coating equipment is mainly used for steps such as spin coating, baking, and developing. When spin coating, the transfer device is required to convey the wafer.

[0003] The existing transfer device on spin coating and developing equipment currently has the following deficiencies: The existing device only realizes conveyance, and cannot automatically achieve the homing and cleaning of the wafer during conveyance; although the existing device can adjust the lifting, when the electric cylinder for lifting is damaged, it cannot be adjusted emergently, and the practicality is relatively low.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a transfer device for spin coating and developing equipment is provided, in order to achieve a more practical purpose. Summary of the Invention

[0005] In order to solve the above technical problems, the present invention provides a transfer device for spin coating and developing equipment to solve the problems that the existing device only realizes conveyance and cannot automatically achieve the homing and cleaning of the wafer during conveyance; although the existing device can adjust the lifting, when the electric cylinder for lifting is damaged, it cannot be adjusted emergently, and the practicality is relatively low.

[0006] The present invention provides a transfer device for spin coating and developing equipment, which specifically includes: a base; the base is fixed on the spin coating and developing equipment, two first electric cylinders are fixed on the top surface of the base, the extending ends of the two first electric cylinders are both fixed on the bottom surface of the first mounting block, and a transfer assembly is installed on the first mounting block.

[0007] Furthermore, the transfer assembly is composed of a guide rail seat, guide rails, sliding blocks, a seat body, a second mounting block, a second electric cylinder, a third electric cylinder, and a placement seat. Two guide rail seats are fixed on the top surface of the first mounting block, two guide rails are fixed in each guide rail seat, a sliding block slides on each guide rail, and two are fixed on the sliding blocks; a second mounting block is fixed on the two guide rail seats, a second electric cylinder is fixed on the second mounting block, and the extending end of the second electric cylinder is fixed on the seat body.

[0008] Further, two third electric cylinders are fixed on the seat body, and the extending ends of the two third electric cylinders are both fixed on the bottom end surface of the placement seat. A wafer is placed in the placement groove on the placement seat.

[0009] Further, a auxiliary seat is fixed on the top end surface of the base. The auxiliary seat is of a concave structure. Two guide rods slide on the auxiliary seat, and the upper ends of the two guide rods are welded to the bottom end surface of the first mounting block.

[0010] Further, an auxiliary component is installed on the two rail seats. The auxiliary component is composed of a mounting frame and a cleaning block. A mounting frame is fixed on the two rail seats. The left opening end of the mounting frame is of a V-shaped structure, and the bottom end surface of the mounting frame is 0.1 cm higher than the top end surface of the wafer.

[0011] Further, a cleaning block is fixed on the bottom end surface of the mounting frame. The cleaning block is located on the right side of the wafer, and the bottom end surface of the cleaning block is flush with the top end surface of the wafer.

[0012] Further, a cleaning component is installed on the seat body. The cleaning component is composed of a telescopic bottle, a contact rod, a mounting arm, a jet pipe and a protrusion. A telescopic bottle is fixed on the bottom end surface of the seat body. A spiral spring for self-elastic reset is installed in the telescopic bottle. The telescopic bottle is connected to the jet pipe through a pipeline. When the telescopic bottle is squeezed, the jet pipe is in a jet state. The jet pipe is fixed on the front rail seat through two mounting arms.

[0013] Further, protrusions are welded on the rear end surface of the front rail seat in a linear array. The protrusions are of a semi-cylindrical structure; a contact rod is fixed at the front end of the telescopic bottle, and the front end of the contact rod contacts the rear end surface of the front rail seat. When the seat body moves to the right, the contact rod elastically contacts the protrusions in turn.

[0014] Further, a rotating component is installed on the placement seat. The rotating component is composed of a rotating shaft, a rotating wheel and a driving wheel. Two rotating shafts rotate on the seat body. A rotating wheel is fixed at the lower end of each rotating shaft, and the outer walls of the two rotating wheels are respectively in contact with the inner walls of the two rail seats; a driving wheel is fixed at the upper end of each rotating shaft, and the outer walls of the two driving wheels are both in contact with the outer wall of the wafer.

[0015] Compared with the prior art, the present invention has the following beneficial effects: Air flow dust removal effect: The cleaning component realizes the air flow dust removal of the top end surface of the wafer through the continuous jetting of the telescopic bottle and the jet pipe, further improving the accuracy and effect of glue coating or development. Moreover, the telescopic bottle does not need to be driven separately. During the process of the wafer moving to the right, under the action of the protrusions, the telescopic bottle can be automatically squeezed, saving equipment costs and having better structural performance.

[0016] Flexible adjustment of height and position: By extending and retracting two first electric cylinders, the equipment can easily adjust the height of the wafer to reach the ideal processing position. At the same time, the extension and retraction of the second electric cylinder can move the wafer left and right to ensure precise positioning of the wafer, meeting the precise requirements of glue coating or development.

[0017] Cost savings and convenient maintenance: Wearable parts such as the guide rail base, guide rail, and sliding block in the equipment are designed to be replaceable individually, eliminating the need to replace the entire transfer component, greatly reducing maintenance costs and downtime.

[0018] Emergency adjustment function: When a first electric cylinder fails, two third electric cylinders can be used as backups. By extending, they can emergently adjust the height of the wafer to ensure that production is not affected, improving the reliability and stability of the equipment.

[0019] Balanced force and extended lifespan: The design of the auxiliary seat and guide rod helps to disperse the force at the connection between the first electric cylinder and the first mounting block, avoiding damage caused by long-term stress and extending the service life of the equipment.

[0020] Automatic alignment and cleaning function: The mounting frame in the auxiliary component can automatically move the wafer into the placement groove to ensure the correct position of the wafer. At the same time, the cleaning block can remove the dust on the surface of the wafer during the movement of the wafer, improving the quality of glue coating or development.

[0021] Wafer rotation function: In the second embodiment, the addition of the rotation component enables the wafer to rotate while moving to the right. This not only enhances the effect of air flow dust removal but also ensures uniform processing of the wafer surface, improving production efficiency and product quality. Brief Description of the Drawings

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below.

[0023] In the drawings: Figure 1 Shows an axonometric structural schematic diagram of the transfer device of the glue coating and developing equipment according to the present invention; Figure 2 Shows a front view structural schematic diagram of the transfer device of the glue coating and developing equipment according to the present invention; Figure 3 Shows a left view structural schematic diagram of the transfer device of the glue coating and developing equipment according to the present invention; Figure 4 Shows according to the present invention Figure 3 An enlarged structural schematic diagram of part A; Figure 5 Shows according to the present invention Figure 3 An enlarged structural schematic diagram of part B; Figure 6shows according to the present invention Figure 1 Schematic diagram of the axonometric structure after rotation; Figure 7 Schematic diagram of the axonometric split structure of the transfer device of the spin coating and developing equipment according to the present invention; Figure 8 Schematic diagram of the axonometric split structure of the mounting bracket and the cleaning block according to the present invention.

[0024] List of reference numerals 1. Base; 2. First electric cylinder; 3. First mounting block; 301. Auxiliary seat; 302. Guide rod; 4. Transfer assembly; 401. Guide rail seat; 402. Guide rail; 403. Sliding block; 404. Seat body; 405. Second mounting block; 406. Second electric cylinder; 407. Third electric cylinder; 408. Placing seat; 5. Wafer; 6. Rotating assembly; 601. Rotating shaft; 602. Rotating wheel; 603. Driving wheel; 7. Auxiliary assembly; 701. Mounting bracket; 702. Cleaning block; 8. Cleaning assembly; 801. Telescopic bottle; 802. Contact rod; 803. Mounting arm; 804. Jet pipe; 805. Protrusion. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0026] Unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of the present invention have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms such as those defined in a general dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless clearly defined in the embodiments of the present invention.

[0027] In the embodiments of the present invention, the use of terms such as "first", "second" and similar words does not indicate any order, quantity or importance, but is only used to distinguish different components. Words such as "a", "an" or "the" do not indicate a quantity limitation either, but indicate that there is at least one. Similarly, words such as "comprising" or "including" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. In the following description, spatial and orientation terms such as "upper", "lower", "front", "rear", "top", "bottom", "vertical" and "horizontal" may be used to describe the embodiments of the present invention, but it should be understood that these terms are only for the convenience of describing the embodiments shown in the drawings, and do not require the actual device to be constructed or operated in a specific orientation. In the following description, the use of terms such as "connected", "coupled", "fixed" and "attached" may mean that two elements or structures are directly connected without other elements or structures therebetween, or may mean that two elements or structures are indirectly connected through intermediate elements or structures, unless otherwise clearly stated herein. Embodiment 1:

[0028] As shown in the attached Figure 1 to the attached Figure 8 figure: The present invention provides a transfer device for a spin coating and developing equipment, comprising: a base 1; the base 1 is fixed on the spin coating and developing equipment, two first electric cylinders 2 are fixed on the top end surface of the base 1, the extending ends of the two first electric cylinders 2 are both fixed on the bottom end surface of a first mounting block 3, a transfer assembly 4 is mounted on the first mounting block 3. When adjusting the height of a wafer 5, it is only necessary to drive the two first electric cylinders 2 to extend. When the two first electric cylinders 2 extend, they can drive the first mounting block 3 and the transfer assembly 4 to move upward, and at this time, the height adjustment of the wafer 5 is realized.

[0029] Among them, the transfer component 4 is composed of a guide rail base 401, guide rails 402, sliding blocks 403, a seat body 404, a second mounting block 405, a second electric cylinder 406, a third electric cylinder 407, and a placement seat 408. Two guide rail bases 401 are fixed on the top surface of the first mounting block 3. Two guide rails 402 are fixed in each guide rail base 401. A sliding block 403 slides on each guide rail 402, and two are fixed on the sliding block 403. A second mounting block 405 is fixed on the two guide rail bases 401. A second electric cylinder 406 is fixed on the second mounting block 405. The extending end of the second electric cylinder 406 is fixed on the seat body 404. When adjusting the left and right positions of the wafer 5, controlling the telescopic movement of the second electric cylinder 406 can achieve the left and right movement of the seat body 404 driven by the second electric cylinder 406, thus realizing the left and right movement of the wafer 5. And through the setting of the guide rail base 401 and the sliding block 403, when the guide rail base 401 and the sliding block 403 are damaged, they can be replaced separately, saving costs.

[0030] Among them, two third electric cylinders 407 are fixed on the seat body 404. The extending ends of the two third electric cylinders 407 are both fixed on the bottom end surface of the placement seat 408. The wafer 5 is placed in the placement groove on the placement seat 408. When the first electric cylinder 2 is damaged, driving the two third electric cylinders 407 to extend can achieve the emergency adjustment of the height of the wafer 5.

[0031] Among them, an auxiliary seat 301 is fixed on the top surface of the base 1. The auxiliary seat 301 is of a concave structure. Two guide rods 302 slide on the auxiliary seat 301. The upper ends of the two guide rods 302 are both welded to the bottom end surface of the first mounting block 3. During use, through the sliding of the two guide rods 302 and the first mounting block 3, the force at the connection between the first electric cylinder 2 and the first mounting block 3 can be relieved, avoiding damage caused by the long-term force at the connection between the first electric cylinder 2 and the first mounting block 3.

[0032] Among them, an auxiliary component 7 is installed on the two guide rail bases 401. The auxiliary component 7 is composed of a mounting frame 701 and a cleaning block 702. A mounting frame 701 is fixed on the two guide rail bases 401. The left opening end of the mounting frame 701 is of a V-shaped structure. The bottom end surface of the mounting frame 701 is 0.1 cm higher than the top surface of the wafer 5. When the placement seat 408 drives the wafer 5 to move to the right, through the left V-shaped opening of the mounting frame 701, the wafer 5 can be dialed into the placement groove in the seat body 404. Then, even if the wafer 5 is not initially placed in the placement groove, it does not affect subsequent glue application.

[0033] Among them, a cleaning block 702 is fixed to the bottom end surface of the mounting bracket 701. The cleaning block 702 is located on the right side of the wafer 5, and the bottom end surface of the cleaning block 702 is flush with the top end surface of the wafer 5. When the wafer 5 moves to the cleaning block 702 to the right, the top end surface of the wafer 5 can be cleaned by the cleaning block 702, avoiding dust on the top end surface of the wafer 5 and thus affecting the subsequent glue coating effect.

[0034] Among them, a cleaning assembly 8 is installed on the seat body 404. The cleaning assembly 8 is composed of a telescopic bottle 801, a contact rod 802, a mounting arm 803, a jet pipe 804 and a protrusion 805. A telescopic bottle 801 is fixed to the bottom end surface of the seat body 404. A spiral spring for elastic reset of itself is installed in the telescopic bottle 801. The telescopic bottle 801 is connected to the jet pipe 804 through a pipeline. When the telescopic bottle 801 is squeezed, the jet pipe 804 is in a jet state. The jet pipe 804 is fixed to the front guide rail seat 401 through two mounting arms 803.

[0035] Among them, protrusions 805 are welded to the rear end surface of the front guide rail seat 401 in a linear array. The protrusions 805 are semi-cylindrical structures; a contact rod 802 is fixed to the front end of the telescopic bottle 801. The front end of the contact rod 802 contacts the rear end surface of the front guide rail seat 401. When the seat body 404 moves to the right, the contact rod 802 and the protrusions 805 are elastically contacted in sequence. During use, through the continuous extrusion of the protrusions 805 on the contact rod 802, the continuous extrusion of the telescopic bottle 801 is realized, and finally the continuous jet of the jet pipe 804 is realized. When the gas is ejected from the jet pipe 804, the air flow dust removal of the top end surface of the wafer 5 can be realized. Embodiment 2:

[0036] On the basis of Embodiment 1, it further includes: a rotating assembly 6 is installed on the placing seat 408. The rotating assembly 6 is composed of a rotating shaft 601, a rotating wheel 602 and a driving wheel 603. Two rotating shafts 601 are rotated on the seat body 404. A rotating wheel 602 is fixed to the lower end of each rotating shaft 601. The outer walls of the two rotating wheels 602 are respectively in contact with the inner walls of the two guide rail seats 401; a driving wheel 603 is fixed to the upper end of each rotating shaft 601. The outer walls of the two driving wheels 603 are both in contact with the outer wall of the wafer 5. When the seat body 404 drives the wafer 5 to move to the right, the rotation of the wafer 5 can be realized under the action of the rotating wheel 602 and the driving wheel 603. At this time, the air flow dust removal effect of the jet pipe 804 on the wafer 5 is ensured.

[0037] The specific usage method and function of this embodiment: First, the device is installed on the coating and developing equipment. The base 1 serves as the support structure of the entire device, ensuring the stability of the device. When processing the wafer 5, the wafer 5 is first placed in the placement groove of the placement seat 408. The device drives the first mounting block 3 and the transfer assembly 4 mounted on the first mounting block 3 to move up and down by the extension or contraction of two first electric cylinders 2, so as to realize the adjustment of the height of the wafer 5. If the first electric cylinder 2 fails, the emergency adjustment of the height of the wafer 5 can also be realized by driving two third electric cylinders 407 to extend or contract. The second electric cylinder 406 in the transfer assembly 4 drives the seat body 404 and the wafer 5 placed on the seat body 404 to move to the right by extension, moving the wafer 5 to the coating position. During the process of the wafer 5 moving to the right, it will first be toggled into the placement groove in the seat body 404 through the V-shaped opening on the left side of the mounting frame 701 in the auxiliary assembly 7 to ensure the correct placement of the wafer 5. Then, the wafer 5 will move to the cleaning block 702, and the cleaning block 702 physically cleans the top surface of the wafer 5 to remove dust. When the wafer 5 continues to move to the right, it will trigger the cleaning assembly 8 to work. When the seat body 404 moves to the right, the contact rod 802 elastically contacts the protrusion 805 on the rear end surface of the guide rail seat 401 in sequence, continuously squeezing the telescopic bottle 801, resulting in continuous air injection from the air injection pipe 804 to clean the wafer 5. At the same time, during the process of the wafer 5 moving to the right, the rotating wheel 602 and the driving wheel 603 in the rotating assembly 6 start to work. Under the rolling action of the rotating wheel 602 on the inner wall of the guide rail seat 401, the rotating shaft 601 and the driving wheel 603 above are driven to rotate.

[0038] The above is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A conveying device for a coating and developing device, characterized in that: include: A base (1); the base (1) is fixed on the glue coating and developing device; two first electric cylinders (2) are fixed on the top surface of the base (1); the extended ends of the two first electric cylinders (2) are fixed on the bottom surface of the first mounting block (3); a transmission assembly (4) is installed on the first mounting block (3); the transmission assembly (4) comprises a guide rail seat (401), a guide rail (402), a sliding block (403), a seat body (404), a second mounting block (405), a second electric cylinder (406), a third electric cylinder (407) and a placement seat (4 08), two guide rail seats (401) are fixed on the top surface of the first mounting block (3), two guide rails (402) are fixed in each guide rail seat (401), a sliding block (403) slides on each guide rail (402), and two are fixed on the sliding block (403); a second mounting block (405) is fixed on the two guide rail seats (401), a second electric cylinder (406) is fixed on the second mounting block (405), and the protruding end of the second electric cylinder (406) is fixed on the seat body (404).

2. A conveying device for a coating and developing device as claimed in claim 1, characterized in that: Two third electric cylinders (407) are fixed on the seat body (404), and the extended ends of the two third electric cylinders (407) are fixed on the bottom end surface of the placement seat (408), and a wafer (5) is placed in the placement groove on the placement seat (408).

3. A conveying device for a coating and developing device as claimed in claim 2, characterized in that: An auxiliary seat (301) is fixed on the top surface of the base (1); the auxiliary seat (301) is a concave structure; two guide rods (302) slide on the auxiliary seat (301); the upper ends of the two guide rods (302) are welded to the bottom surface of the first mounting block (3).

4. A conveying device for a coating and developing device as claimed in claim 3, characterized in that: An auxiliary component (7) is installed on the two guide rail seats (401), and the auxiliary component (7) is composed of a mounting frame (701) and a cleaning block (702). A mounting frame (701) is fixed on the two guide rail seats (401), and the left open end of the mounting frame (701) is a V-shaped structure, and the bottom end surface of the mounting frame (701) is 0.1 cm higher than the top end surface of the wafer (5).

5. A conveying device for a coating and developing device as claimed in claim 4, characterized in that: A cleaning block (702) is fixed to the bottom end surface of the mounting frame (701); the cleaning block (702) is located on the right side of the wafer (5); and the bottom end surface of the cleaning block (702) is flush with the top end surface of the wafer (5).

6. A conveying device for a coating and developing device as claimed in claim 5, characterized in that: The base body (404) is provided with a cleaning assembly (8), the cleaning assembly (8) comprising a telescopic bottle (801), a contact rod (802), a mounting arm (803), an air jet pipe (804) and a protrusion (805). A telescopic bottle (801) is fixed to the bottom end surface of the base body (404), a coil spring for elastic reset is mounted in the telescopic bottle (801), the telescopic bottle (801) is connected to the air jet pipe (804) via a pipeline, and when the telescopic bottle (801) is squeezed, the air jet pipe (804) is in an air jetting state, and the air jet pipe (804) is fixed to a guide rail base (401) at the front side via two mounting arms (803).

7. A conveying device for a coating and developing device as claimed in claim 6, characterized in that: A rear end surface of a front guide rail seat (401) is welded with a protrusion (805) in a linear array shape, and the protrusion (805) is a semi-cylindrical structure; a contact rod (802) is fixed to one end of the front side of the telescopic bottle (801), and the front end of the contact rod (802) contacts the rear end surface of a front guide rail seat (401), and when the seat body (404) moves to the right, the contact rod (802) and the protrusion (805) are elastically contacted in sequence.

8. A conveying device for a coating and developing device as claimed in claim 7, characterized in that: The placement seat (408) is provided with a rotating assembly (6), which is composed of a rotating shaft (601), a rotating wheel (602) and a driving wheel (603). Two rotating shafts (601) are rotated on the seat body (404), a rotating wheel (602) is fixed to the lower end of each rotating shaft (601), and the outer walls of the two rotating wheels (602) are in contact with the inner walls of the two guide rail seats (401) respectively; a driving wheel (603) is fixed to the upper end of each rotating shaft (601), and the outer walls of the two driving wheels (603) are in contact with the outer wall of the wafer (5).

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