Epoxy resin filling device for capacitor

By using a stirring tank, vacuum pump and ultrasonic defoaming device in the epoxy resin infusion device of the capacitor, the problem of bubble generation during the epoxy resin infusion process is solved, and a higher quality product and a more efficient infusion process are achieved.

CN120183931APending Publication Date: 2025-06-20AN HUI PU FEI TE XIN NENG YUAN KE JI YOU XIAN GONG SI +1
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Patent Information

Application Number
CN202510520601.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-24
Publication Date
2025-06-20

AI Technical Summary

Technical Problem

During the epoxy resin in the capacitor, bubbles are easily generated, resulting in cavity or holes after curing, affecting product quality.

Method used

An epoxy resin infusion device for capacitors is designed, including a stirring tank, a vacuum pump and an ultrasonic defoaming device. The bubbles in the raw material are reduced by stirring and vacuum defoaming, and the bubbles are further eliminated during the infusion process by using the defoaming mechanism.

Benefits of technology

It effectively reduces the number of bubbles in the epoxy resin, improves the quality of the product, reduces the appearance of defective products, and improves the infusion efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of capacitor production equipment, in particular to an epoxy resin filling device for a capacitor. The filling mechanism is used for filling the capacitor; the defoaming mechanism is used for defoaming the raw materials; the conveying mechanism is used for conveying the capacitor; the filling mechanism is arranged at one end of the rack, the defoaming mechanism is arranged on the side face of the filling mechanism, and the conveying mechanism is arranged below the filling mechanism and the defoaming mechanism. According to the epoxy resin pouring device, the arranged conveying mechanism can convey the poured shells, so that subsequent treatment operation is facilitated, meanwhile, the rotary supporting frame can rotate and switch the borne shells, and therefore the epoxy resin pouring efficiency is improved. And the defoaming mechanism can be connected with the conveying mechanism, so that the moving epoxy resin can be subjected to defoaming operation, the defoaming effect on the epoxy resin is further improved, and the product quality is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of capacitor production equipment, and particularly to an epoxy resin pouring device for capacitors. Background Art

[0002] Capacitors are electronic components widely used in electronic devices. According to different usage scenarios, capacitors are divided into various categories and sizes. For some larger-sized capacitors, they generally include a housing and a core encapsulated inside the housing. The core is wound by a metallized film. After it is placed inside the housing, resin is poured into the housing. When the resin hardens, the core and the housing can be well fixed. The hardened resin can also provide good protection for the core. The process of pouring resin is injection molding.

[0003] During the pouring process of epoxy resin raw materials, bubbles are likely to be generated for the following two reasons: on the one hand, the flowing raw material liquid will entrain external air; on the other hand, the air originally present in the gap between the core and the housing will be brought into the interior of the raw material liquid. These mixed-in airs will ultimately form bubbles in the liquid resin before curing. The bubbles will form cavities or holes inside or at the edges after the epoxy resin cures, affecting the overall quality. In view of this, we propose an epoxy resin pouring device for capacitors. Summary of the Invention

[0004] The purpose of the present invention is to provide an epoxy resin pouring device for capacitors, which solves the problems mentioned in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] An epoxy resin pouring device for capacitors, including a frame;

[0007] A pouring mechanism for pouring capacitors;

[0008] An anti-foaming mechanism for defoaming raw materials;

[0009] A conveying mechanism for conveying capacitors;

[0010] The pouring mechanism is arranged at one end of the frame, the anti-foaming mechanism is arranged on the side of the pouring mechanism, and the conveying mechanism is arranged below the pouring mechanism and the anti-foaming mechanism.

[0011] Preferably, the pouring mechanism includes a stirring kettle, the stirring kettle is fixedly connected to the top end of the side of the frame, and a feeding pipe is fixedly connected to the side of the stirring kettle.

[0012] Preferably, a vacuum pump is fixedly connected to the top end of the stirring kettle, and an ultrasonic anti-foaming device is sleeved outside the stirring kettle.

[0013] Preferably, the conveying mechanism includes a first conveyor belt, the first conveyor belt is rotatably connected to the frame, a support frame is rotatably connected to the top end of the first conveyor belt, and a storage tank is provided at the top end of the support frame.

[0014] Preferably, a rack is fixedly connected to the top end of the frame, and a toothed ring meshing with the rack is fixedly connected to the side surface of the support frame.

[0015] Preferably, the defoaming mechanism includes a sealing shell, the sealing shell is fixedly connected to the top end of the frame, both ends of the sealing shell are open structures, and the first conveyor belt is arranged through the sealing shell.

[0016] Preferably, the top end of the sealing shell is of an arc-shaped structure, an air pump is fixedly connected to the top end of the sealing shell, and the air pump is communicated with the inner side of the sealing shell through a pipeline.

[0017] Preferably, a sealing plate is fixedly connected to the first conveyor belt, the sealing plate is fixedly connected between the support frames, and a sealing block is fixedly connected to one side of the sealing plate.

[0018] Preferably, a second conveyor belt is sleeved outside the sealing shell, a sealing strip is fixedly connected to the second conveyor belt, and the sealing strip corresponds to the position of the sealing plate.

[0019] Preferably, a driving roller is connected inside the second conveyor belt, a linkage gear is fixedly connected to the end of the driving roller, and a driving device is fixedly connected to the end of the driving roller.

[0020] By means of the above technical solution, the epoxy resin pouring device for capacitors provided by the present invention has at least the following beneficial effects:

[0021] (1) The conveying mechanism provided by the present invention can convey the completed outer shell, so as to facilitate subsequent processing operations. At the same time, the rotatable support frame can rotate and switch the carried outer shell, thereby improving the efficiency of epoxy resin pouring. The defoaming mechanism can cooperate with the conveying mechanism to defoam the moving epoxy resin, further improving the defoaming effect of the epoxy resin and improving the product quality.

[0022] (2) The pouring mechanism provided by the present invention can stir and mix the raw materials, and cooperate with the ultrasonic device to process the large-volume bubbles in the raw materials, reduce the bubbles in the raw materials, and avoid the bubbles entering the inner part of the outer shell during the pouring of the raw materials.

[0023] (3) The defoaming mechanism of the present invention uses the fixed sealing cover and the moving sealing plate to cooperate with each other to form a relatively sealed structure on the frame, and cooperates with the air pump to extract the gas inside the sealing cover to form a low pressure, so as to defoam the bubbles inside the poured epoxy resin, thereby reducing the probability of defective products and improving the quality of the products. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present invention and form a part of this application:

[0025] Figure 1 is a schematic structural diagram of the present invention;

[0026] Figure 2 is a schematic internal structure diagram of the present invention Figure 1 ;

[0027] Figure 3 is an enlarged schematic diagram of part A of the present invention;

[0028] Figure 4 is a schematic internal structure diagram of the present invention Figure 2 ;

[0029] Figure 5 is an enlarged schematic diagram of part B of the present invention.

[0030] In the figure: 1, frame; 2, pouring mechanism; 21, stirring kettle; 22, feeding pipe; 23, vacuum pump; 24, ultrasonic defoaming device; 3, defoaming mechanism; 31, sealing shell; 32, air pump; 33, conveyor belt 2; 34, sealing strip; 35, driving roller; 36, linkage gear; 37, driving device; 4, conveying mechanism; 41, conveyor belt 1; 42, support frame; 43, storage tank; 44, rack; 45, gear ring; 46, sealing plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0032] Embodiment 1

[0033] An epoxy resin pouring device for capacitors, as Figure 1 - Figure 2 shown, includes a frame 1; a pouring mechanism 2 is provided at one end of the frame 1 for pouring capacitors, and the pouring mechanism 2 can stir and mix the raw materials and pour and cure the mixed epoxy resin.

[0034] Specifically, the perfusion mechanism 2 includes a stirring kettle 21, which is fixedly connected to the top end of the side of the frame 1. A blanking pipe 22 is fixedly connected to the side of the stirring kettle 21. The stirring kettle 21 can stir and mix raw materials, and the blanking pipe 22 on the side can introduce the mixed raw materials.

[0035] It should be noted that a vacuum pump 23 is fixedly connected to the top end of the stirring kettle 21. The structure of the vacuum pump 23 can evacuate the inside of the stirring kettle 21, thereby eliminating the air bubbles existing inside the raw materials. An ultrasonic defoaming device 24 is sleeved outside the stirring kettle 21. The ultrasonic defoaming device 24 can continuously generate ultrasonic waves into the stirring kettle 21, and use the ultrasonic waves to oscillate the raw materials inside the reaction kettle to improve the defoaming effect on the air bubbles inside the raw materials.

[0036] Embodiment 2

[0037] As Figure 1 - Figure 4 shown, on the basis of Embodiment 1, a conveying mechanism 4 is arranged below the perfusion mechanism 2 for conveying capacitors. The conveying mechanism 4 can support the perfusion housing and convey and switch the perfusion housing between different perfusion ports, so as to facilitate the movement of the perfusion housing.

[0038] In this embodiment, the conveying mechanism 4 includes a first conveyor belt 41, which is rotatably connected to the frame 1. A support frame 42 is rotatably connected to the top end of the first conveyor belt 41. A storage tank 43 is opened at the top end of the support frame 42. The structure of the storage tank 43 can place the perfusion housing. At the same time, the support frame 42 can rotate on the first conveyor belt 41, so as to rotate different housings to the blanking pipe 22, facilitating the perfusion operation of different housings.

[0039] Furthermore, a rack 44 is fixedly connected to the top end of the frame 1, and a gear ring 45 meshing with the rack 44 is fixedly connected to the side of the support frame 42. The rack 44 and the gear ring 45 can cooperate with each other. While the support frame 42 moves with the first conveyor belt 41, it can rotate under the transmission of the rack 44 and the gear ring 45. At the same time, the number of storage tanks 43 is the same as the number of blanking pipes 22. After the storage tank 43 rotates, it can facilitate the alignment of the position of the blanking pipe 22 and the storage tank 43, thus facilitating the perfusion operation of epoxy resin.

[0040] Embodiment 3

[0041] As Figure 1 、 Figure 3 、 Figure 5 shown, on the basis of Embodiment 2, a defoaming mechanism 3 is arranged on the side of the perfusion mechanism 2 for defoaming the raw materials. The defoaming mechanism 3 can defoam the epoxy resin after perfusion, thereby reducing the air bubbles mixed in the perfusion process. At the same time, it can also reduce the defects caused by air bubbles during the curing and forming process, reduce the operations in subsequent processes, and improve the processing efficiency.

[0042] In this embodiment, the defoaming mechanism 3 includes a sealing shell 31, which is fixedly connected to the top end of the frame 1. Both ends of the sealing shell 31 are open structures. The first conveyor belt 41 passes through the sealing shell 31, and the first conveyor belt 41 can move the epoxy resin that has been filled into the sealing shell 31.

[0043] It should be noted that the top end of the sealing shell 31 is an arc-shaped structure. An air pump 32 is fixedly connected to the top end of the sealing shell 31. The air pump 32 is interconnected with the inner side of the sealing shell 31 through a pipeline. The air pump 32 can extract the gas inside the sealing shell 31 outward. At the same time, the exhaust pipe of the air pump 32 is wound around the outside of the ultrasonic defoaming device 24, so that the continuously flowing air can be used for cooling.

[0044] In addition, a sealing plate 46 is fixedly connected to the first conveyor belt 41. The sealing plate 46 is fixedly connected between the support frames 42. A sealing block is fixedly connected to one side of the sealing plate 46. The sealing plate 46 can cooperate with the sealing cover to form a relatively sealed state inside the sealing cover. Thus, the air inside the sealing cover can be extracted by the air pump 32 to form a low-pressure state, accelerating the discharge of the air inside the epoxy resin. The sealing block is made of an elastic material.

[0045] On this basis, a second conveyor belt 33 is sleeved outside the sealing shell 31. There are three second conveyor belts 33, and the three conveyor belts are respectively connected to the top end and both sides of the sealing shell 31. A sealing strip 34 is fixedly connected to the second conveyor belt 33. The sealing strip 34 corresponds to the position of the sealing plate 46. The sealing strip 34 can block the gap between the sealing plate 46 and the sealing cover, reducing the air flow. At the same time, the elastic sealing block can fill the edge of the sealing strip 34.

[0046] It should be noted that a driving roller 35 is connected inside the second conveyor belt 33. The driving roller 35 can drive the second conveyor belt 33 to make the second conveyor belt 33 run continuously. A linkage gear 36 is fixedly connected to the end of the driving roller 35. A driving device 37 is fixedly connected to the end of the driving roller 35. The linkage gear 36 is a conical gear structure, and the linkage gears 36 are perpendicularly meshed with each other. In this embodiment, the driving device 37 is selected as a motor, and the motor can drive the driving roller 35 to rotate continuously.

[0047] When the epoxy resin perfusion device for a capacitor of the present invention is in use, first, the epoxy resin raw material is added to the stirring kettle 21, and then the raw material is continuously stirred by the stirring structure. During the stirring process, the vacuum pump 23 evacuates the inside of the stirring kettle 21 into a vacuum state, and at the same time, the ultrasonic defoaming device 24 generates ultrasonic waves and processes the raw material. The ultrasonic waves oscillate and break up the large air bubbles in the epoxy resin raw material into small air bubbles, and the small air bubbles float to the surface of the raw material through the vacuum, thereby performing a defoaming operation on the air bubbles in the raw material.

[0048] Subsequently, an operation of pouring the raw materials is carried out. A plurality of feeding pipes 22 are provided on the side of the stirring kettle 21, and the pipe orifices of each feeding pipe 22 correspond to the support frame 42. After the epoxy resin is poured into a single housing, the support frame 42 moves under the drive of the first conveyor belt 41, moving from the pipe orifice of one feeding pipe 22 to the pipe orifice of the subsequent feeding pipe 22. At the same time, when the toothed ring 45 moves along the rack 44, the toothed ring 45 is driven by the rack 44 to rotate, and drives the support frame 42 to rotate synchronously. The support frame 42 thus rotates the filled housing backward and rotates the empty housing to a position corresponding to the feeding pipe 22. In this way, the housings on the support frame 42 can be poured in sequence. During the pouring process, due to factors such as pouring impact, bubbles may still appear inside the epoxy resin in the housing. Therefore, the subsequent defoaming mechanism 3 performs a defoaming operation on the product.

[0049] During the defoaming operation, first, the motor starts and drives the second conveyor belt 33 to move through the driving roller 35. The second conveyor belt 33 pulls the sealing plate 46 and the first conveyor belt 41 through the sealing strip 34 on its surface. When the sealing plate 46 moves into the sealing cover, the sealing strip 34 cooperates with the sealing plate 46 to form multiple sealing structures to seal the sealing cover. Subsequently, the air pump 32 pumps out the air inside the sealing cover. Due to the restriction of the multiple sealing structures on the air flow, the speed of air flowing back into the sealing cover is slower, and the sealing cover can provide a long low-pressure environment to eliminate the bubbles inside the epoxy resin. After the defoaming treatment is completed, as the support frame 42 continues to move outwards, the number of sealing structures between the support frame 42 and the external environment gradually decreases. Therefore, the air volume continuously increases and the air pressure gradually recovers until the support frame 42 completely moves outside the sealing cover. After the defoaming treatment operation is completed, the subsequent curing treatment can be carried out.

[0050] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0051] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An epoxy resin potting device for capacitors, characterized in that: comprising a frame (1); A filling mechanism (2) for filling the capacitor; A defoaming mechanism (3), used for defoaming the raw material; A conveying mechanism (4) for conveying capacitors; The filling mechanism (2) is arranged at one end of the frame (1), the defoaming mechanism (3) is arranged on the side of the filling mechanism (2), and the conveying mechanism (4) is arranged below the filling mechanism (2) and the defoaming mechanism (3).

2. The epoxy resin pouring device for capacitors according to claim 1, characterized in that: The pouring mechanism (2) comprises a stirring kettle (21), the stirring kettle (21) is fixedly connected to the top end of the side of the frame (1), and a feeding pipe (22) is fixedly connected to the side of the stirring kettle (21).

3. The epoxy resin pouring device for capacitors according to claim 2, characterized in that: A vacuum pump (23) is fixedly connected to the top of the stirring kettle (21), and an ultrasonic defoaming device (24) is sleeved on the outside of the stirring kettle (21).

4. The epoxy resin potting device for capacitors according to claim 1, characterized in that: The conveying mechanism (4) comprises a conveyor belt (41), wherein the conveyor belt (41) is rotatably connected to the frame (1), and the top end of the conveyor belt (41) is rotatably connected to a support frame (42), and a storage groove (43) is provided at the top end of the support frame (42).

5. The epoxy resin pouring device for capacitors according to claim 4, characterized in that: A rack (44) is fixedly connected to the top of the frame (1), and a gear ring (45) meshing with the rack (44) is fixedly connected to the side of the support frame (42).

6. The epoxy resin pouring device for capacitors according to claim 4, characterized in that: The defoaming mechanism (3) comprises a sealing shell (31), the sealing shell (31) is fixedly connected to the top of the frame (1), both ends of the sealing shell (31) are open structures, and the conveyor belt (41) is arranged through the sealing shell (31).

7. The epoxy resin pouring device for capacitors according to claim 6, characterized in that: The top end of the sealing shell (31) is an arc-shaped structure, and an air pump (32) is fixedly connected to the top end of the sealing shell (31), and the air pump (32) is communicated with the inner side of the sealing shell (31) through a pipeline.

8. The epoxy resin potting device for capacitors according to claim 4, characterized in that: A sealing plate (46) is fixedly connected to the conveyor belt (41), the sealing plate (46) is fixedly connected between the support frames (42), and a sealing block is fixedly connected to one side of the sealing plate (46).

9. The epoxy resin potting device for capacitors according to claim 6, characterized in that: A second conveyor belt (33) is sleeved on the outer side of the sealing shell (31), a sealing strip (34) is fixedly connected to the second conveyor belt (33), and the sealing strip (34) and the sealing plate (46) are positioned corresponding to each other.

10. The epoxy resin potting device for capacitors according to claim 9, characterized in that: The second conveyor belt (33) is internally connected with a transmission roller (35), the end of which is fixedly connected with a linkage gear (36), and the end of which is fixedly connected with a driving device (37).