A semiconductor chip packaging device and a packaging process

Abstract

The application provides a semiconductor chip packaging device and a packaging process, and belongs to the technical field of semiconductor chip packaging. The semiconductor chip packaging device comprises a support frame, an upper mold and a lower mold are arranged on the support frame, a packaging mechanism is arranged on the support frame, the packaging mechanism comprises a fixing seat, a reversing valve and a first air pipe, the fixing seat is provided with two, and the two fixing seats are fixedly installed on opposite sides of the upper mold and the lower mold respectively. By arranging the packaging mechanism, the first air pipe is used for simultaneously injecting gas into the interiors of the upper mold and the lower mold, the two first piston plates are relatively moved, the epoxy resin in the interiors of the upper mold and the lower mold is compacted, the wrapping of the epoxy resin is more uniform, the protection effect after the epoxy resin is solidified is stronger, compared with the prior art, the packaging effect is better, and a large amount of epoxy resin does not need to be added and then compressed, so that the cost is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and in particular to a semiconductor chip packaging device and a packaging process. Background Art

[0002] Semiconductor chip packaging refers to the process of encapsulating a manufactured semiconductor chip in a protective shell to provide physical protection, electrical connection, thermal management, mechanical support and other functions, and to facilitate connection with other circuits or systems.

[0003] Existing semiconductor chip packaging is usually performed by wrapping the semiconductor chip with epoxy resin. However, simply wrapping the semiconductor chip can easily lead to uneven epoxy resin wrapping after the epoxy resin solidifies, and because the unsolidified epoxy resin has a certain fluidity, it can easily lead to a large number of bubbles inside. Summary of the Invention

[0004] In order to overcome the above deficiencies, the present invention provides a semiconductor chip packaging device and packaging process that overcome the above technical problems or at least partially solve the above problems.

[0005] The present invention is achieved in that:

[0006] The present invention provides a semiconductor chip packaging device, comprising a support frame, an upper mold and a lower mold are provided on the support frame, and a packaging mechanism is provided on the support frame, and the packaging mechanism includes:

[0007] A fixing seat, wherein two fixing seats are provided, and the two fixing seats are fixedly mounted on opposite sides of the upper die and the lower die respectively, and a fixing rod is fixedly mounted on the opposite sides of the two fixing seats, and a fixing plate is fixedly mounted on the side of the fixing rod away from the fixing seat, and a first piston plate is slidably sleeved in the inner cavity of the upper die and the lower die;

[0008] A reversing valve, the reversing valve is fixedly mounted on the top of the fixing plate on the lower side, an air pump is provided at the bottom of the support frame, the output end of the air pump is connected to the input end of the reversing valve, and the reversing valve is provided with a first output end and a second output end;

[0009] A first air pipe is installed on the first output end of the reversing valve, and the inner cavity of the upper mold and the inner cavity of the lower mold are both connected to the other end of the first air pipe.

[0010] In a preferred embodiment, the top of the support frame is integrally formed with a support wall, a hydraulic rod and a glue injection machine are installed on the top of the support wall, the output end of the hydraulic rod is fixedly connected to the top of the upper fixed plate, the output end of the glue injection machine is installed with a glue injection tube, the inner cavity of the lower mold is connected to the glue injection tube, and a chip body is provided between the upper mold and the lower mold.

[0011] In a preferred embodiment, a knocking mechanism is provided between the fixed seat and the fixed plate, and the knocking mechanism includes a first piston rod, which is fixedly mounted on the bottom of the first piston plate on the lower side, and the other end of the first piston rod passes through the bottom of the fixed seat, and a fixed block is fixedly mounted on the side of the fixed seat close to the fixed plate, and a reciprocating rod is provided on the internal sliding sleeve of the fixed block, and a reciprocating plate is fixedly mounted on the end of the reciprocating rod close to the first piston rod.

[0012] In a preferred solution, a support plate is fixedly installed on the side wall of the fixed rod, an air cylinder is fixedly installed on the top of the support plate, a second air pipe is installed on the second output end, the inner cavity of the air cylinder is connected to the second air pipe, a limiting shell is fixedly installed on the top of the air cylinder, a second piston plate is provided on the internal sliding sleeve of the air cylinder, a second piston rod is fixedly installed on the top of the second piston plate, and the second piston rod sliding sleeve is arranged inside the limiting shell.

[0013] In a preferred embodiment, a slide is provided on the surface of the second piston rod, a cavity is provided inside the slide, a slot is provided on the top of the cavity, a clamping plate is fixedly provided on the surface of the second piston rod, and the cross-section of the second piston rod is rectangular.

[0014] In a preferred solution, the surface of the slide cylinder is fixedly sleeved with a threaded sleeve, the surface of the threaded sleeve is threadedly sleeved with a driving cylinder, the bottom of the lower side fixed seat is rotatably mounted with a first rotating plate, the top of the driving cylinder is fixedly mounted with a second rotating plate, a rotating shaft is fixedly mounted between the first rotating plate and the second rotating plate, a rotating rod is fixedly mounted between the two rotating shafts, a driving rod is fixedly mounted between the two rotating rods, a connecting rod is rotatably sleeved on the surface of the driving rod, and the other end of the connecting rod is rotatably sleeved on the surface of the reciprocating rod.

[0015] In a preferred embodiment, a reversing mechanism is provided on the top of the fixed plate on the lower side, and the reversing mechanism includes a first gear, which is rotatably mounted on the top of the support plate, and a connecting rod is fixedly mounted on the top of the reversing valve, and the top of the connecting rod is fixedly connected to the bottom of the first gear.

[0016] In a preferred solution, a screw rod is rotatably installed at the bottom of the lower fixing seat, a second gear is fixedly installed at the bottom of the screw rod, the first gear and the second gear are meshed and connected, and a sliding rod is fixedly installed between the support plate and the fixing seat.

[0017] In a preferred solution, a first power plate is sleeved between the sliding rod and the screw rod, the first power plate and the screw rod are threadedly connected, a second power plate is fixedly installed on the bottom of the first piston rod, a third power plate is fixedly sleeved on the surface of the second piston rod, and the first power plate is located between the second power plate and the third power plate.

[0018] A packaging process using the semiconductor chip packaging device includes the following packaging steps:

[0019] S1. Place the chip body in the lower mold and the pins of the chip body in the placement grooves provided on the lower mold. Start the hydraulic rod to move the upper mold downward so that the upper and lower molds are closed. Start the glue injection machine to inject epoxy resin into the upper and lower molds. Start the air pump to allow high-pressure gas to enter the upper and lower molds through the reversing valve and the first air pipe, squeezing the two first piston plates so that the two first piston plates move in opposite directions to compact the epoxy resin.

[0020] S2. The upward movement of the second piston plate causes the slide cylinder to drive the threaded sleeve to move upward. The threaded connection between the threaded sleeve and the drive cylinder causes the drive cylinder to rotate, driving the second rotating plate, the rotating shaft, the rotating rod and the drive rod to rotate. Under the limiting action of the fixed block, the connecting rod drives the reciprocating rod to reciprocate, so that the reciprocating plate slightly knocks the first piston rod to eliminate bubbles inside the epoxy resin;

[0021] S3. When the first piston plate moves to the preset position, the second power plate squeezes the first power plate, causing the first power plate to move upward. The first power plate squeezes the third power plate, causing the third power plate to move upward synchronously. The threaded connection between the first power plate and the screw rod drives the second gear to rotate, thereby causing the first gear to drive the reversing valve to rotate, changing the direction of the airflow, closing the first air pipe, and opening the second air pipe.

[0022] The present invention provides a semiconductor chip packaging device and packaging process, the beneficial effects of which include:

[0023] 1. By setting up a packaging mechanism, gas is injected into the interior of the upper mold and the lower mold at the same time through the first air pipe, and the two first piston plates move relative to each other, so that the epoxy resin inside the upper mold and the lower mold is compacted, thereby making the epoxy resin wrapping more uniform. After the epoxy resin solidifies, the protective effect is stronger. Compared with the existing technology, the packaging effect is better, and there is no need to add a large amount of epoxy resin before compression, which saves costs.

[0024] 2. By setting up a knocking mechanism, when the reciprocating rod slides back and forth inside the fixed block, it drives the reciprocating plate to move back and forth, slightly knocking the first piston rod. The bubbles inside the epoxy resin are burst by the slight knocking force, thereby solving the problem in the prior art that a large number of bubbles are easily retained inside the epoxy resin after molding, affecting the packaging effect.

[0025] 3. By setting a reversing mechanism, when the first piston plate moves to the preset position, the first air pipe is closed and the second air pipe is opened. The high-pressure gas output by the air pump drives the second piston plate to move through the second air pipe. As a result, the high-pressure gas used to drive the first piston plate to move in the initial state can automatically change the driving object after the epoxy resin is compacted, and start driving the second piston plate to complete the bubble elimination work, with a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 It is a schematic diagram of the overall three-dimensional structure provided by an embodiment of the present invention;

[0028] Figure 2 Provides a schematic diagram of the overall structure of the upper mold and the lower mold for an embodiment of the present invention;

[0029] Figure 3 A schematic structural diagram of a reversing valve and a support plate is provided for an embodiment of the present invention;

[0030] Figure 4 A partial cross-sectional view of a lower mold is provided for an embodiment of the present invention;

[0031] Figure 5 A schematic structural diagram of a first gear and a second gear is provided for an embodiment of the present invention;

[0032] Figure 6 A schematic structural diagram of a striking mechanism is provided for an embodiment of the present invention;

[0033] Figure 7 A partial cross-sectional view of a drive cylinder and an air cylinder is provided for an embodiment of the present invention;

[0034] Figure 8 An exploded view of a threaded sleeve and a slide cylinder is provided for an embodiment of the present invention.

[0035] In the figure: 1, support frame; 2, upper mold; 3, lower mold; 401, fixed seat; 402, fixed rod; 403, fixed plate; 404, first piston plate; 405, reversing valve; 406, air pump; 407, first output end; 408, second output end; 409, first air pipe; 410, supporting wall; 411, hydraulic rod; 412, glue injection machine; 413, glue injection tube; 414, chip body; 501, first piston rod; 502, fixed block; 503, reciprocating rod; 504, reciprocating plate; 505, support plate; 506, air cylinder; 507, second Air pipe; 508, limit shell; 509, second piston plate; 510, second piston rod; 511, slide cylinder; 512, cavity; 513, slot; 514, clamping plate; 515, threaded sleeve; 516, drive cylinder; 517, first rotating plate; 518, second rotating plate; 519, rotating shaft; 520, rotating rod; 521, drive rod; 522, connecting rod; 601, first gear; 602, connecting rod; 603, screw rod; 604, second gear; 605, slide rod; 606, first power plate; 607, second power plate; 608, third power plate. DETAILED DESCRIPTION

[0036] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0037] Reference Figure 1-8The present invention provides a technical solution: a semiconductor chip packaging device, including a support frame 1, an upper mold 2 and a lower mold 3 are provided on the support frame 1, and a placement groove for placing the pins of the chip body 414 is opened on the upper mold 2 and the lower mold 3. A packaging mechanism is provided on the support frame 1, and the packaging mechanism includes a fixing seat 401, a reversing valve 405 and a first air pipe 409. There are two fixing seats 401, and the two fixing seats 401 are fixedly installed on the opposite sides of the upper mold 2 and the lower mold 3 respectively. The upper mold 2 and the lower mold 3 are fixedly connected to the two fixing seats 401 by bolts, which is convenient for subsequent replacement and maintenance. A fixing rod 402 is fixedly installed on the opposite side of the two fixing seats 401, and a fixing plate is fixedly installed on the side of the fixing rod 402 away from the fixing seat 401. 403, a first piston plate 404 is slidably provided in the inner cavity of the upper mold 2 and the lower mold 3, and the reversing valve 405 is fixed to the top of the lower fixed plate 403 by a mounting seat and bolts. An air pump 406 is provided at the bottom of the support frame 1, and the output end of the air pump 406 is connected to the input end of the reversing valve 405. The reversing valve 405 is provided with a first output end 407 and a second output end 408. The first air pipe 409 is installed on the first output end 407 of the reversing valve 405. The inner cavity of the upper mold 2 and the inner cavity of the lower mold 3 are both connected to the other end of the first air pipe 409, and the connection points of the upper mold 2 and the lower mold 3 with the first air pipe 409 are both located on the side of the first piston plate 404 away from the chip body 414. The top of the support frame 1 is integrally formed with a support Wall 410, the top of the supporting wall 410 is equipped with a hydraulic rod 411 and a glue injection machine 412, the output end of the hydraulic rod 411 is fixedly connected to the top of the upper fixed plate 403, the output end of the glue injection machine 412 is equipped with a glue injection tube 413, the inner cavity of the lower mold 3 is communicated with the glue injection tube 413, and a chip body 414 is provided between the upper mold 2 and the lower mold 3. By setting a packaging mechanism, the user places the chip body 414 in the lower mold 3, and matches the pins of the chip body 414 with the placement grooves on the lower mold 3 one by one, starts the hydraulic rod 411, drives the upper mold 2 to move downward, so that the upper mold 2 and the lower mold 3 are engaged with each other, and then starts the glue injection machine 412 to inject the epoxy resin inside the glue injection machine 412 into the interior of the upper mold 2 and the lower mold 3. When the epoxy resin is injected When the injection reaches the preset amount, the glue injection machine 412 is turned off. At this time, the epoxy resin wraps the chip body 414. The user starts the air pump 406 and injects gas into the upper mold 2 and the lower mold 3 at the same time through the first air pipe 409. The connection between the first air pipe 409 and the upper mold 2 is located on the side of the first piston plate 404 away from the chip body 414. Similarly, the connection between the first air pipe 409 and the lower mold 3 is located on the side of the other first piston plate 404 away from the chip body 414, so that the two first piston plates 404 are squeezed by the high-pressure gas and move to the side close to the chip body 414. That is, the two first piston plates 404 move relative to each other, so that the epoxy resin inside the upper mold 2 and the lower mold 3 is compacted, so that the epoxy resin wrapping is more uniform.After the epoxy resin solidifies, the protective effect is stronger. Compared with the existing technology, the encapsulation effect is better, and there is no need to add a large amount of epoxy resin before compression, which saves costs. In addition, the injection and compaction of the epoxy resin are both in a closed space, which reduces the generation of bubbles.

[0038] Reference Figure 1-8 , a knocking mechanism is provided between the fixed seat 401 and the fixed plate 403, the knocking mechanism includes a first piston rod 501, the first piston rod 501 is fixedly mounted on the bottom of the first piston plate 404 on the lower side, and the other end of the first piston rod 501 passes through the bottom of the fixed seat 401, and a fixed block 502 is fixedly mounted on one side of the fixed seat 401 near the fixed plate 403, and a reciprocating rod 503 is provided inside the fixed block 502 for sliding, and a reciprocating plate 504 is fixedly mounted on one end of the reciprocating rod 503 near the first piston rod 501, and the reciprocating plate 504 is in the shape of an arc, and soft pads with different vibration conductivity can be installed as needed. By setting the knocking mechanism, when the reciprocating rod 503 slides back and forth inside the fixed block 502, the reciprocating plate 504 is driven to move back and forth, and the first piston rod 501 is lightly knocked. The bubbles inside the epoxy resin are broken by the slight knocking force, thereby solving the problem in the prior art that a large number of bubbles are easily retained inside the epoxy resin after molding, affecting the packaging effect;

[0039] Reference Figure 1-8, a support plate 505 is fixedly installed on the side wall of the fixed rod 402, a gas cylinder 506 is fixedly installed on the top of the support plate 505, a second gas pipe 507 is installed on the second output end 408, the inner cavity of the gas cylinder 506 is connected to the second gas pipe 507, a limiting shell 508 is fixedly installed on the top of the gas cylinder 506, a second piston plate 509 is provided on the inner sliding sleeve of the gas cylinder 506, a second piston rod 510 is fixedly installed on the top of the second piston plate 509, the second piston rod 510 is slidably sleeved inside the limiting shell 508, a slide cylinder 511 is provided on the surface of the second piston rod 510, a cavity 512 is provided inside the slide cylinder 511, and a cavity 512 is provided inside the cavity 512. A card slot 513 is provided on the top of 12, a card plate 514 is fixedly provided on the surface of the second piston rod 510, the cross-section of the second piston rod 510 is set to a rectangular shape, a threaded sleeve 515 is fixedly provided on the surface of the slide 511, a driving cylinder 516 is threadedly provided on the surface of the threaded sleeve 515, a first rotating plate 517 is rotatably installed on the bottom of the lower fixed seat 401, a second rotating plate 518 is fixedly installed on the top of the driving cylinder 516, a rotating shaft 519 is fixedly installed between the first rotating plate 517 and the second rotating plate 518, a rotating rod 520 is fixedly installed between the two rotating shafts 519, and a driving rod is fixedly installed between the two rotating rods 520 521, the surface of the driving rod 521 is rotatably sleeved with a connecting rod 522, and the other end of the connecting rod 522 is rotatably sleeved on the surface of the reciprocating rod 503. By setting a second piston plate 509, when the second output end 408 of the reversing valve 405 outputs high-pressure gas, the high-pressure gas enters the interior of the gas cylinder 506 through the connection of the second air pipe 507, and squeezes the second piston plate 509 so that the second piston plate 509 drives the second piston rod 510 to move upward. When the second piston rod 510 moves upward, the top of the second piston rod 510 is inserted into the interior of the card slot 513, and the second piston rod 510 continues to move upward, driving the slide cylinder 511 and the screw The threaded sleeve 515 moves upward. Since the driving cylinder 516 has a threaded groove inside, the threaded connection between the threaded sleeve 515 and the driving cylinder 516 causes the driving cylinder 516 to rotate, thereby driving the second rotating plate 518 to rotate. The second rotating plate 518 drives the driving rod 521 to rotate through the cooperation of the rotating shaft 519 and the rotating rod 520. Since the driving rod 521 is eccentrically arranged relative to the rotating rod 520, the driving rod 521 revolves around the center of the second rotating plate 518, driving the connecting rod 522 to move. Through the cooperation of the fixed block 502, the reciprocating rod 503 drives the reciprocating plate 504 to reciprocate.

[0040] Reference Figure 1-8, a reversing mechanism is provided on the top of the lower fixed plate 403, and the reversing mechanism includes a first gear 601, which is rotatably mounted on the top of the support plate 505, and a connecting rod 602 is fixedly mounted on the top of the reversing valve 405, and the connecting rod 602 is mounted on the handle of the reversing valve 405, and is used to drive the handle of the reversing valve 405 to rotate. The top of the connecting rod 602 is fixedly connected to the bottom of the first gear 601. By setting the reversing mechanism, when the first piston plate 404 moves to the preset position, the first gear 601 rotates, and the connecting rod 602 cooperates with the first gear 601 to rotate. The handle of the reversing valve 405 is rotated, thereby changing the flow direction of the reversing valve 405, closing the first output end 407 and opening the second output end 408, thereby closing the first air pipe 409 and opening the second air pipe 507. The high-pressure gas output by the air pump 406 drives the second piston plate 509 to operate through the second air pipe 507. As a result, the high-pressure gas used to drive the first piston plate 404 in the initial state can automatically change the driving object after the epoxy resin is compacted, and start to drive the second piston plate 509 to complete the bubble elimination work, which has a high degree of automation.

[0041] Reference Figure 1-8, a screw rod 603 is rotatably installed at the bottom of the lower fixed seat 401, and a second gear 604 is fixedly installed at the bottom of the screw rod 603. The first gear 601 and the second gear 604 are meshed and connected. A sliding rod 605 is fixedly installed between the support plate 505 and the fixed seat 401. A first power plate 606 is sleeved between the sliding rod 605 and the screw rod 603. The first power plate 606 and the screw rod 603 are threadedly connected. A second power plate 607 is fixedly installed at the bottom of the first piston rod 501, and a third power plate 608 is fixedly sleeved on the surface of the second piston rod 510. The first power plate 606 is located between the second power plate 607 and the third power plate 608. Specifically, the second power plate 607 is located between the first power plate 607 and the third power plate 608. The third power plate 608 is located below the power plate 606, and the third power plate 608 is located above the first power plate 606, and the first power plate 606, the second power plate 607 and the third power plate 608 are partially overlapped in the vertical direction. By setting the first power plate 606, the second power plate 607 and the third power plate 608, when the first piston plate 404 moves toward the side close to the chip body 414 to extrude the epoxy resin, it drives the first piston rod 501 and the second power plate 607 to move until it reaches the preset position. The second power plate 607 squeezes the first power plate 606, causing the first power plate 606 to move upward, and at the same time, the first power plate 606 squeezes the third power plate 608. The second piston rod 510 is squeezed and moved upward until the top of the second piston rod 510 is stuck in the inner part of the card slot 513. Through the threaded connection between the first power plate 606 and the screw rod 603 and the limiting action of the slide bar 605, the screw rod 603 drives the second gear 604 to rotate. Through the meshing connection between the second gear 604 and the first gear 601, the first gear 601 drives the handle of the reversing valve 405 to rotate through the connecting rod 602, thereby changing the flow direction of the reversing valve 405, so that the first air pipe 409 is closed and the second air pipe 507 is opened. The gas of the first air pump 406 enters the interior of the air cylinder 506 through the second air pipe 507, thereby 509 moves upward to provide driving force, so that the compaction of epoxy resin and the elimination of bubbles are driven by the same power source, and the power source can be automatically switched without manual intervention during the processing, thereby improving the degree of automation. When the processing is completed, it is only necessary to reversely start the air pump 406 to generate suction inside the air cylinder 506, and the second piston plate 509 moves downward until it returns to its original position. During this process, the third power plate 608 squeezes the first power plate 606, and the first power plate 606 squeezes the second power plate 607, so that the first air pipe 409 is connected to the air pump 406 again, and suction is generated inside the first air pipe 409, so that the first piston plate 404 returns to its original position;

[0042] A packaging process for a semiconductor chip packaging device includes the following packaging steps:

[0043] S1. Place the chip body 414 in the lower mold 3, and place the pins of the chip body 414 in the placement grooves provided on the lower mold 3. Start the hydraulic rod 411 to move the upper mold 2 downward, so that the upper mold 2 and the lower mold 3 are completely closed. Start the glue injection machine 412 to inject epoxy resin into the upper mold 2 and the lower mold 3. Start the air pump 406 to allow high-pressure gas to enter the upper mold 2 and the lower mold 3 through the reversing valve 405 and the first air pipe 409, squeezing the two first piston plates 404 so that the two first piston plates 404 move in opposite directions to compact the epoxy resin.

[0044] S2. The upward movement of the second piston plate 509 causes the slide 511 to drive the threaded sleeve 515 to move upward. The threaded connection between the threaded sleeve 515 and the drive cylinder 516 causes the drive cylinder 516 to rotate, driving the second rotating plate 518, the rotating shaft 519, the rotating rod 520, and the drive rod 521 to rotate. Under the limiting action of the fixed block 502, the connecting rod 522 drives the reciprocating rod 503 to reciprocate, causing the reciprocating plate 504 to slightly tap the first piston rod 501, eliminating bubbles inside the epoxy resin.

[0045] S3. When the first piston plate 404 moves to the preset position, the second power plate 607 squeezes the first power plate 606, causing the first power plate 606 to move upward. The first power plate 606 squeezes the third power plate 608, causing the third power plate 608 to move upward synchronously. Through the threaded connection between the first power plate 606 and the screw rod 603, the screw rod 603 drives the second gear 604 to rotate, thereby causing the first gear 601 to drive the reversing valve 405 to rotate, causing the direction of the airflow to change, the first air pipe 409 to be closed, and the second air pipe 507 to be opened.

[0046] Specifically, the working process or working principle of the semiconductor chip packaging device and packaging process is as follows: when in use, the user places the chip body 414 in the lower mold 3, starts the hydraulic rod 411, drives the upper mold 2 to move downward, so that the upper mold 2 and the lower mold 3 are engaged with each other, and then starts the glue injection machine 412 to inject the epoxy resin inside the glue injection machine 412 into the interior of the upper mold 2 and the lower mold 3. When the injection of the epoxy resin reaches a preset amount, the glue injection machine 412 is turned off. At this time, the epoxy resin wraps the chip body 414, and the user starts the air pump 406 to inject gas into the interior of the upper mold 2 and the lower mold 3 at the same time through the first air pipe 409. The connection between the first air pipe 409 and the upper mold 2 is located on the side of the first piston plate 404 away from the chip body 414. Similarly, The connection point between an air pipe 409 and the lower mold 3 is located on the side of the other first piston plate 404 away from the chip body 414, so that after the two first piston plates 404 are squeezed by the high-pressure gas, they move toward the side close to the chip body 414, that is, the two first piston plates 404 move relative to each other, so that the epoxy resin inside the upper mold 2 and the lower mold 3 is squeezed. Until reaching the preset position, the second power plate 607 squeezes the first power plate 606, so that the first power plate 606 moves upward, and at the same time, the first power plate 606 squeezes the third power plate 608, so that the second piston rod 510 moves upward until the top of the second piston rod 510 is stuck in the inside of the slot 513, through the threads of the first power plate 606 and the screw rod 603. The screw rod 603 drives the second gear 604 to rotate through the meshing connection of the second gear 604 and the first gear 601, so that the first gear 601 drives the handle of the reversing valve 405 to rotate through the connecting rod 602, thereby changing the flow direction of the reversing valve 405, so that the first air pipe 409 is closed and the second air pipe 507 is opened. The gas of the first air pump 406 enters the interior of the air cylinder 506 through the second air pipe 507, so that the second piston plate 509 drives the second piston rod 510 to move upward, and the top of the second piston rod 510 is inserted into the interior of the card slot 513. The second piston rod 510 continues to move upward, driving the slide cylinder 511 and the threaded sleeve 515 to move upward. A threaded groove is provided inside 516. The threaded connection between the threaded sleeve 515 and the driving cylinder 516 causes the driving cylinder 516 to rotate, thereby driving the second rotating plate 518 to rotate. The second rotating plate 518 drives the driving rod 521 to rotate through the cooperation of the rotating shaft 519 and the rotating rod 520. Since the driving rod 521 is eccentrically arranged relative to the rotating rod 520, the driving rod 521 revolves around the center of the second rotating plate 518, driving the connecting rod 522 to move. Through the cooperation of the fixed block 502, the reciprocating rod 503 drives the reciprocating plate 504 to reciprocate, thereby intermittently knocking the first piston rod 501. When the processing is completed, it is only necessary to reversely start the air pump 406 to generate suction inside the air cylinder 506.The second piston plate 509 moves downward until it returns to its original position. During this process, the third power plate 608 squeezes the first power plate 606, and the first power plate 606 squeezes the second power plate 607, thereby connecting the first air pipe 409 to the air pump 406 again. Suction is generated inside the first air pipe 409, causing the first piston plate 404 to return to its original position.

Claims

1. A semiconductor chip packaging device, comprising a support frame (1), wherein an upper mold (2) and a lower mold (3) are provided on the support frame (1), characterized in that: The support frame (1) is provided with a packaging mechanism, which comprises: A fixed seat (401), wherein two fixed seats (401) are provided, and the two fixed seats (401) are fixedly mounted on opposite sides of the upper die (2) and the lower die (3), respectively; a fixed rod (402) is fixedly mounted on opposite sides of the two fixed seats (401); a fixed plate (403) is fixedly mounted on a side of the fixed rod (402) away from the fixed seat (401); and a first piston plate (404) is slidably sleeved in the inner cavity of the upper die (2) and the lower die (3); A reversing valve (405), the reversing valve (405) is fixedly mounted on the top of the fixing plate (403) at the lower side, an air pump (406) is provided at the bottom of the support frame (1), the output end of the air pump (406) is connected to the input end of the reversing valve (405), and the reversing valve (405) is provided with a first output end (407) and a second output end (408); The first air pipe (409) is installed on the first output end (407) of the reversing valve (405), the inner cavity of the upper mold (2) and the inner cavity of the lower mold (3) are both connected to the other end of the first air pipe (409), a knocking mechanism is provided between the fixed seat (401) and the fixed plate (403), and the knocking mechanism includes a first piston rod (501), the first piston rod (501) is fixedly installed on the bottom of the first piston plate (404) on the lower side, and the other end of the first piston rod (501) passes through the bottom of the fixed seat (401), and a fixed block (502) is fixedly installed on the side of the fixed seat (401) close to the fixed plate (403), and the internal sliding sleeve of the fixed block (502) is provided with a reciprocating rod (50 3), a reciprocating plate (504) is fixedly installed on one end of the reciprocating rod (503) close to the first piston rod (501), a support plate (505) is fixedly installed on the side wall of the fixed rod (402), an air cylinder (506) is fixedly installed on the top of the support plate (505), a second air pipe (507) is installed on the second output end (408), the inner cavity of the air cylinder (506) is connected to the second air pipe (507), a limiting shell (508) is fixedly installed on the top of the air cylinder (506), the inner sliding sleeve of the air cylinder (506) is provided with a second piston plate (509), a second piston rod (510) is fixedly installed on the top of the second piston plate (509), and the second piston rod (510) is slidably sleeved inside the limiting shell (508).

2. The semiconductor chip packaging device according to claim 1, wherein: The top of the support frame (1) is integrally formed with a support wall (410), the top of the support wall (410) is installed with a hydraulic rod (411) and a glue injection machine (412), the output end of the hydraulic rod (411) is fixedly connected to the top of the upper fixed plate (403), the output end of the glue injection machine (412) is installed with a glue injection tube (413), the inner cavity of the lower mold (3) is connected to the glue injection tube (413), and a chip body (414) is provided between the upper mold (2) and the lower mold (3).

3. The semiconductor chip packaging device according to claim 2, wherein: The surface of the second piston rod (510) is sleeved with a slide cylinder (511), a cavity (512) is provided inside the slide cylinder (511), a clamping groove (513) is provided on the top of the cavity (512), and a clamping plate (514) is fixedly sleeved on the surface of the second piston rod (510). The cross-section of the second piston rod (510) is set to be rectangular.

4. The semiconductor chip packaging device according to claim 3, wherein: A threaded sleeve (515) is fixedly mounted on the surface of the slide (511), and a driving cylinder (516) is threadedly mounted on the surface of the threaded sleeve (515). A first rotating plate (517) is rotatably mounted on the bottom of the lower fixed seat (401), and a second rotating plate (518) is fixedly mounted on the top of the driving cylinder (516). A rotating shaft (519) is fixedly mounted between the first rotating plate (517) and the second rotating plate (518), and a rotating rod (520) is fixedly mounted between the two rotating shafts (519). A driving rod (521) is fixedly mounted between the two rotating rods (520). A connecting rod (522) is rotatably mounted on the surface of the driving rod (521), and the other end of the connecting rod (522) is rotatably mounted on the surface of the reciprocating rod (503).

5. The semiconductor chip packaging device according to claim 4, wherein: A reversing mechanism is provided on the top of the lower fixed plate (403), and the reversing mechanism includes a first gear (601). The first gear (601) is rotatably mounted on the top of the support plate (505). A connecting rod (602) is fixedly mounted on the top of the reversing valve (405), and the top of the connecting rod (602) is fixedly connected to the bottom of the first gear (601).

6. The semiconductor chip packaging device according to claim 5, characterized in that: A screw rod (603) is rotatably mounted on the bottom of the fixing seat (401) on the lower side, a second gear (604) is fixedly mounted on the bottom of the screw rod (603), the first gear (601) and the second gear (604) are meshed and connected, and a sliding rod (605) is fixedly mounted between the support plate (505) and the fixing seat (401).

7. The semiconductor chip packaging device according to claim 6, wherein: A first power plate (606) is sleeved between the sliding rod (605) and the screw rod (603), and the first power plate (606) and the screw rod (603) are threadedly connected. A second power plate (607) is fixedly installed on the bottom of the first piston rod (501), and a third power plate (608) is fixedly sleeved on the surface of the second piston rod (510). The first power plate (606) is located between the second power plate (607) and the third power plate (608).

8. A packaging process using the semiconductor chip packaging device according to claim 7, characterized in that: The packaging steps include: S1. Place the chip body (414) in the lower mold (3), and place the pins of the chip body (414) in the placement grooves provided on the lower mold (3), start the hydraulic rod (411), move the upper mold (2) downward, so that the upper mold (2) and the lower mold (3) are closed, start the glue injection machine (412) to inject epoxy resin into the interior of the upper mold (2) and the lower mold (3), start the air pump (406), so that high-pressure gas enters the upper mold (2) and the lower mold (3) through the reversing valve (405) and the first air pipe (409), and squeezes the two first piston plates (404), so that the two first piston plates (404) move in opposite directions, thereby compacting the epoxy resin; S2. The second piston plate (509) moves upward, causing the slide cylinder (511) to drive the threaded sleeve (515) to move upward. The threaded connection between the threaded sleeve (515) and the drive cylinder (516) causes the drive cylinder (516) to rotate, driving the second rotating plate (518), the rotating shaft (519), the rotating rod (520) and the drive rod (521) to rotate. Under the limiting action of the fixed block (502), the connecting rod (522) drives the reciprocating rod (503) to reciprocate, thereby causing the reciprocating plate (504) to slightly knock on the first piston rod (501), thereby eliminating bubbles inside the epoxy resin. S3. When the first piston plate (404) moves to the preset position, the second power plate (607) squeezes the first power plate (606), causing the first power plate (606) to move upward. The first power plate (606) squeezes the third power plate (608), causing the third power plate (608) to move upward synchronously. The first power plate (606) and the screw rod (603) are threadedly connected, causing the screw rod (603) to drive the second gear (604) to rotate, thereby causing the first gear (601) to drive the reversing valve (405) to rotate, causing the flow direction of the airflow to change, the first air pipe (409) to be closed, and the second air pipe (507) to be opened.

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