Dual-track die bonding equipment and die bonding method

Abstract

The present invention relates to the technical field of semiconductor mounting equipment, and in particular to a dual-track die-bonding device and a die-bonding method; wherein the dual-track die-bonding device comprises a carrier platform, on which a mounting area, a glue dipping area, and a material loading area are provided, the glue dipping area and the material loading area being adjacent to each other and adjacent to the same side of the mounting area; and further comprises a movable die-bonding table assembly and a movable transfer table assembly provided on the carrier platform, the movable die-bonding table assembly comprising a first track, a second track, a first die-bonding table, and a second die-bonding table, the first die-bonding table being slidably connected to the first track, the second die-bonding table being slidably connected to the second track, the first track and the second track respectively extending from the glue dipping area to the mounting area. By introducing a dual die-bonding table design that works alternately, only a portion of a substrate is dipped in glue each time, and chip mounting is immediately performed on this portion of the substrate, thereby ensuring the quality and efficiency of mounting.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor mounting equipment, and in particular to a dual-track die bonding device and a die bonding method. Background Art

[0002] In the field of semiconductor placement equipment, die bonding is the process of attaching chips to specific locations on a substrate. Traditionally, this approach involves dipping the entire substrate in glue at once before proceeding to die placement. However, for substrates requiring large numbers of chips, this traditional approach presents significant drawbacks: the time between dipping and completion of all die placement can be long, causing some of the glue to solidify during this waiting period, impacting placement quality and efficiency. Summary of the Invention

[0003] In order to solve the problem that existing die bonding equipment cannot meet the demand of mounting a large number of chips on the same substrate, the present invention provides a dual-track die bonding equipment and a die bonding method.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: a dual-track crystal bonding equipment, including a carrying platform, wherein a mounting area, a dipping area and a loading area are provided on the carrying platform, and the dipping area and the loading area are adjacent to each other and adjacent to the same side of the mounting area; the equipment also includes a movable crystal bonding platform assembly and a movable turntable assembly arranged on the carrying platform, wherein the movable crystal bonding platform assembly includes a first track, a second track, a first crystal bonding platform and a second crystal bonding platform, the first crystal bonding platform is slidably connected to the first track, and the second crystal bonding platform is slidably connected to the second track, and the first track and the second track extend from the dipping area to the mounting area respectively; in a working state, the first crystal bonding platform and the second crystal bonding platform work alternately in the mounting area and the dipping area; the movable turntable assembly includes a third track and a first turntable which are slidably connected, the third track extends from the loading area to the mounting area, and the first turntable moves back and forth between the loading area and the mounting area via the third track.

[0005] Preferably, a first robotic arm assembly, a first material table assembly and a glue dipping table assembly are further provided in the glue dipping area, and the first robotic arm assembly can move in the glue dipping area; the first robotic arm assembly transports materials between the first material table assembly and the mobile crystal bonding table assembly, or performs glue dipping operations between the glue dipping table assembly and the mobile crystal bonding table assembly; a second robotic arm assembly and a second material table assembly are provided in the loading area, and when the first transfer table is located in the loading area, the second robotic arm assembly transports materials between the second material table assembly and the first transfer table.

[0006] Preferably, the first track, the second track and the third track are spaced apart and arranged in parallel, and the first track and the second track are located on the side of the dipping area close to the loading area, and the third track is located on the side of the loading area close to the dipping area.

[0007] Preferably, a first upward-view module is provided in the loading area, and a second upward-view module is provided in the mounting area. The first upward-view module is located between the second material table assembly and the third track, and the second upward-view module is located between the third track and the movable crystal fixing table assembly. The shooting accuracy of the second upward-view module is higher than that of the first upward-view module.

[0008] Preferably, a first nozzle rack assembly is further provided in the mounting area. The first nozzle rack assembly is located at the end of the third track and straddles the third track.

[0009] Preferably, a third material table assembly and a second turntable are further provided in the mounting area, and the third material table assembly and the second turntable are respectively arranged on both sides of the third track, and the second turntable is located between the third track and the movable crystal fixing table assembly, and the second turntable is arranged close to the second upward viewing module.

[0010] Preferably, a standard positioning member is further provided in the mounting area, a top surface of the standard positioning member is provided with a positioning point, and the standard positioning member is provided between the third track and the movable crystal bonding table assembly.

[0011] Preferably, a gantry assembly is provided in the mounting area, and the gantry assembly includes support columns located on two opposite sides of the mounting area and a beam guide slidably provided between the two support columns, and a main binding head assembly is provided on the beam guide, and the main binding head assembly is provided with a first suction nozzle and a first downward viewing module.

[0012] Preferably, the main binding head is further provided with an expansion component, and the expansion component is provided with at least one expansion module; the expansion module includes an auxiliary binding head or a glue dispensing component.

[0013] In order to solve the above technical problems, the present invention provides another technical solution as follows: a crystal bonding method, applied to the dual-track crystal bonding equipment as described above, the method comprising: in the dipping area, dipping the substrate placed on the first crystal bonding table / the second crystal bonding table with glue, dipping only part of the substrate each time, and transporting the dipped substrate to the mounting area; in the loading area, transporting the chip to the first transfer table, and moving the first transfer table to the mounting area through the third track; in the mounting area, mounting the chip on the first transfer table to the substrate at the first crystal bonding table / the second crystal bonding table to complete the chip mounting; when one of the first crystal bonding table and the second crystal bonding table is located in the mounting area / dipping area, the other is correspondingly located in the dipping area / the mounting area, and the dipping operation and the chip mounting operation are respectively performed simultaneously on the first crystal bonding table and the second crystal bonding table; each substrate moves back and forth in the mounting area and the dipping area by moving the crystal bonding table assembly to complete at least two rounds of dipping and chip mounting.

[0014] Compared with the prior art, the dual-track die bonding equipment and die bonding method provided by the present invention have the following beneficial effects:

[0015] 1. A dual-track die bonding equipment provided by an embodiment of the present invention aims to solve the problem of glue solidification in the traditional die bonding process. By introducing a dual die bonding table design that works alternately, only a part of the substrate is dipped in glue each time, and the chip is immediately mounted on this part of the area, thereby ensuring the quality and efficiency of the mounting. Specifically, the carrier table is used as the main body for the module or component of the carrier table. Three major areas of mounting, dipping and loading are set on the carrier table. The close arrangement between the functional areas simplifies the material transmission path, and the three areas are arranged adjacent to each other, that is, the three areas do not overlap. While each independently completes the corresponding mounting, dipping and loading operations, by moving The crystal bonding table assembly and the mobile transfer table assembly complete the material transportation. Each area focuses on a single task, avoiding mutual interference between different processes. By allowing the two crystal bonding tables to slide alternately on two tracks, they can work alternately between the dipping area and the placement area, that is, when one crystal bonding table is working in the dipping area, the other crystal bonding table is working in the placement area. After the work is completed, the working area is exchanged through the corresponding track. This design allows placement to be carried out immediately after only partial dipping is completed each time, shortening the time interval from dipping to placement. The alternating operation design also ensures that the dipping area and the placement area can operate at the same time, and there will be no idle waiting and waste of productivity.

[0016] 2. In an embodiment of the present invention, a first robotic arm assembly and a second robotic arm assembly that can operate independently are respectively provided in the dipping area and the loading area. The two are separated in terms of area and execution module, so that the dipping and loading operations can be carried out simultaneously without interfering with each other; potential problems caused by the intersection between different processes, such as material confusion or operation conflicts, are avoided; the first robotic arm assembly and the second robotic arm assembly are respectively responsible for the dipping and loading operations, and they can move freely in their respective areas without being affected by each other. This independent control design allows each robotic arm to focus on its own task, improving operational accuracy and response speed; since the dipping and loading operations can be carried out simultaneously, the entire die bonding process is parallelized, and the loading operation will not be delayed due to the dipping operation, and vice versa; this means that the chip can be ready to enter the placement link at any time, and the substrate can also be dipped in time, thereby reducing unnecessary waiting time; this not only speeds up production speed, but also enables the equipment to complete more tasks in a shorter time.

[0017] 3. In the embodiments of the present invention, a certain distance is maintained between each track, avoiding mutual interference between moving components on different tracks and ensuring the independence and efficiency of each process. The parallel arrangement of the tracks simplifies path planning for the robot arm and other transport vehicles, reducing complexity and improving operational efficiency. Furthermore, the three guide rails are arranged in parallel and close to corresponding areas, which shortens the distance the chip is moved to the chip during the placement process. This shorter movement distance means that the robot arm or transport vehicle can respond to operational instructions more quickly, reducing waiting time and periodic delays. Furthermore, the shorter movement distance reduces positional deviations that may occur due to long-distance transportation, thereby improving placement accuracy. This is particularly important in the high-precision semiconductor manufacturing process.

[0018] 4. In an embodiment of the present invention, a first upward-looking module and a second upward-looking module are provided to calibrate the chip twice during the chip loading and mounting process, thereby ensuring that each chip can be accurately bonded to the substrate with high precision; specifically, the first upward-looking module is mainly used to take pictures when the chip is transferred from the second material table assembly to the first transfer table on the third track, ensuring that the basic orientation of the chip is correct, and is suitable for preliminary adjustment of the chip position; the second upward-looking module is used to take high-precision pictures before the chip is about to be mounted on the substrate, ensuring that the final position of the chip is accurate; due to its higher shooting accuracy, it can capture more subtle position deviations, thereby achieving more precise adjustments; by first using the low-precision first upward-looking module for coarse calibration, and then using the high-precision second upward-looking module for fine calibration, a process of gradually optimizing the chip position is achieved. This step-by-step calibration method not only improves the accuracy of calibration, but also saves time and avoids the complexity and cost increase brought about by a one-time high-precision calibration.

[0019] 5. In the embodiment of the present invention, the first suction nozzle holder assembly can be equipped with different types of suction nozzles, which is convenient for replacing the suction nozzles to adapt to chips of various sizes and shapes, thereby enhancing the versatility and flexibility of the equipment; placing the first suction nozzle holder assembly at the end of the third track and spanning above it fully utilizes the vertical space, avoids occupying additional horizontal area, and makes the entire equipment layout more compact; when the suction nozzle model needs to be replaced, since the first suction nozzle holder assembly itself is already located at the end of the third track, it can be immediately moved to the position of the first transfer table after the replacement is completed, without the need for additional long-distance movement, thereby greatly shortening the preparation time; even in the case of frequent changes in the suction nozzle model, due to the short distance between the first suction nozzle holder assembly and the first transfer table, it can still be ensured that the first suction operation after each replacement can be completed quickly and accurately, thereby ensuring the accuracy of chip mounting.

[0020] 6. In the embodiment of the present invention, the third material table assembly serves as a storage and supply point for various types of chips, providing a stable and sufficient supply of raw materials for the entire mounting process. It can support chips of different specifications and quantities, and adapt to diverse production needs. It is located on both sides of the third track with the second turntable, avoiding the intersection of material transmission paths, and minimizing the distance between the first turntable and the second turntable and the mobile die-bonding table assembly; because it is located close to the second upward viewing module, the second turntable can be finely calibrated under high-precision shooting to ensure that the chip is in the best position before entering the mounting step, thereby improving the success rate and quality of the mounting.

[0021] 7. In the embodiment of the present invention, the positioning points serve as calibration points for the main binding head, providing precise reference positions. The positioning points on the standard positioning parts enable high-precision calibration of the main binding head and other related components, ensuring that each chip can be accurately bonded to the designated position on the substrate, greatly improving the quality and reliability of the mounting. The standard positioning parts are located between two key components, making full use of the space in the mounting area, avoiding the additional occupation of other positions, and making the entire equipment layout more compact and reasonable.

[0022] 8. In the embodiment of the present invention, the support column provides a solid foundation for the entire gantry assembly, ensuring its stability during operation and reducing vibrations caused by mechanical movement or external factors; the crossbeam guide rail can slide along the support column, so that the main binding head assembly can move freely in the mounting area, covering a larger working area, and adapting to the mounting requirements of substrates and chips of different specifications and positions; the main binding head assembly can slide on the crossbeam guide rail, achieving flexible movement in the mounting area, and can quickly reach any required position for mounting operations. The first suction nozzle is used to accurately grasp and place the chip, ensuring that each chip can be accurately bonded to the designated position on the substrate. The first downward-looking module can capture the position of the chip and substrate in real time during the mounting process, ensuring that the chip is in the optimal position before each mounting to prevent dislocation or offset; the stable support provided by the gantry assembly and the high-precision visual inspection of the first downward-looking module ensure the accuracy and consistency of each mounting operation, greatly improving the quality and reliability of the mounting.

[0023] 9. In the embodiment of the present invention, the expansion component provides physical space and interfaces for adding additional components, allowing the equipment to be flexibly configured according to actual production needs, thereby enhancing the versatility and adaptability of the system; the expansion module is mainly used to implement multi-chip placement, and can grab multiple chips at one time and accurately place them in designated positions on the substrate, significantly improving placement efficiency; since multiple suction nozzle modules can be used at the same time, the need for frequent nozzle replacement is reduced, saving time and costs, and improving overall work efficiency.

[0024] 10. An embodiment of the present invention further provides a die bonding method, which is applied to the above-mentioned die bonding equipment, and therefore also has the same beneficial effects as the above-mentioned die bonding equipment, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the layout of the dual-track die-bonding equipment provided by the first embodiment of the present invention.

[0026] Figure 2 This is a schematic diagram of the movable turntable assembly in the dual-track die bonding equipment provided by the first embodiment of the present invention. Figure 1 .

[0027] Figure 3 This is a schematic diagram of the movable turntable assembly in the dual-track die bonding equipment provided by the first embodiment of the present invention. Figure 2 .

[0028] Figure 4 It is a structural diagram of a partial structure of a movable crystal bonding table assembly in a dual-track crystal bonding device provided by the first embodiment of the present invention.

[0029] Figure 5 1 is a schematic diagram of the layout of the glue dipping area in the dual-track die bonding equipment provided by the first embodiment of the present invention.

[0030] Figure 6 It is a schematic diagram of the layout of the loading area in the dual-track die bonding equipment provided by the first embodiment of the present invention.

[0031] Figure 7 It is a schematic diagram of the layout of the mounting area in the dual-track die bonding equipment provided by the first embodiment of the present invention.

[0032] Figure 8 It is a schematic diagram of the gantry assembly in the dual-track die bonding equipment provided by the first embodiment of the present invention.

[0033] Description of the accompanying drawings:

[0034] 100. Double-track die bonding equipment; 1. Carrying platform;

[0035] 11. Mounting area; 111. Gantry assembly; 1111. Support column; 1112. Crossbeam guide; 1113. Main binding head assembly; 1114. First suction nozzle; 1115. First downward viewing module; 1116. Expansion component; 1117. Expansion module; 112. Second upward viewing module; 113. First suction nozzle frame assembly; 114. Third material table assembly; 115. Second transfer table; 116. Standard positioning parts;

[0036] 12. Glue dipping area; 121. First robotic arm assembly; 122. First material table assembly; 123. Glue dipping table assembly;

[0037] 13. Loading area; 131. Second robotic arm assembly; 132. Second material table assembly; 133. First upward viewing module;

[0038] 2. Mobile crystal bonding platform assembly; 21. First track; 211. Linear motor; 212. Drag chain; 22. Second track; 23. First crystal bonding platform; 24. Second crystal bonding platform;

[0039] 3. Mobile transfer platform assembly; 31. Third track; 32. First transfer platform. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0041] In the embodiments provided herein, it should be understood that "B corresponding to A" means that B is associated with A and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B based solely on A; B can also be determined based on A and / or other information.

[0042] It should be understood that references to "one embodiment" or "an embodiment" throughout this specification mean that specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the appearance of "in one embodiment" or "in an embodiment" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also be aware that the embodiments described in this specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0043] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the above-mentioned processes does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0044] The flow charts and block diagrams in the accompanying drawings of the present invention illustrate the possible implementation architecture, functions and operations of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementation schemes, the functions marked in the box can also occur in a different order than those marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0045] In semiconductor packaging and assembly processes, die bonding is a widely used die attach method, which generally refers to the process of fixing a bare die to a carrier using an adhesive.

[0046] Please combine Figures 1 to 3 The first embodiment of the present invention provides a dual-track die bonding device 100, comprising a carrier 1, on which a mounting area 11, a glue dipping area 12, and a material loading area 13 are provided. The glue dipping area 12 and the material loading area 13 are adjacent to each other and are located on the same side of the mounting area 11.

[0047] The dual-track die-bonding equipment 100 further includes a mobile die-bonding stage assembly 2 and a mobile transfer stage assembly 3 provided on the carrier platform 1. The mobile die-bonding stage assembly 2 includes a first track 21, a second track 22, a first die-bonding stage 23, and a second die-bonding stage 24. The first die-bonding stage 23 is slidably connected to the first track 21, and the second die-bonding stage 24 is slidably connected to the second track 22. The first track 21 and the second track 22 extend from the dipping area 12 to the mounting area 11. In the working state, the first die-bonding stage 23 and the second die-bonding stage 24 alternately operate in the mounting area 11 and the dipping area 12.

[0048] The mobile turntable assembly 3 includes a slidingly connected third rail 31 and a first turntable 32 . The third rail 31 extends from the loading area 13 to the mounting area 11 . The first turntable 32 moves back and forth between the loading area 13 and the mounting area 11 via the third rail 31 .

[0049] It can be understood that the dual-track die bonding equipment 100 provided in the embodiment of the present invention is intended to solve the problem of glue solidification in the traditional die bonding process. By introducing a dual die bonding table design that works alternately, only a part of the substrate is dipped in glue each time, and the chip is immediately mounted on this part of the area, thereby ensuring the quality and efficiency of the mounting. Specifically, the carrier 1 is used as the main body to carry other modules or components. Three major areas of mounting, dipping and loading are set on the carrier 1. The close arrangement between the functional areas simplifies the material transmission path, and the three areas are adjacent to each other, that is, the three do not overlap. While each independently completes the corresponding mounting, dipping and loading operations, the three areas are moved by moving the die bonding table. Component 2 and mobile transfer table component 3 complete the transportation of materials. Each area focuses on a single task, avoiding mutual interference between different processes. By allowing the two crystal bonding tables to slide alternately on the two tracks, they can work alternately between the dipping area 12 and the mounting area 11, that is, when one crystal bonding table is working in the dipping area 12, the other crystal bonding table is working in the mounting area 11. After the work is completed, the working area is exchanged through the corresponding track. This design allows mounting to be performed immediately after only partial dipping is completed each time, shortening the time interval from dipping to mounting, and the alternating operation design also ensures that the dipping area 12 and the mounting area 11 can operate at the same time, and there will be no idle waiting and waste of productivity.

[0050] Please continue reading Figure 1As an embodiment, the overall layout of the mounting area 11, the gluing area 12, and the loading area 13 is roughly rectangular. From a top-down perspective, the mounting area 11 is located in the middle and upper areas of the carrier platform 1, the gluing area 12 is located in the lower left area of the carrier platform 1, and the loading area 13 is located in the lower right area of the carrier platform 1. The three areas are arranged in a roughly rectangular shape; that is, the positions of the three areas are arranged in a herringbone shape, and the outer frame of the overall arrangement is rectangular. As can be understood, the rectangular arrangement fully utilizes the available area of the carrier platform 1, ensuring that the various functional areas can be arranged compactly and orderly, making the overall layout more concise and orderly.

[0051] Please combine Figure 2 and Figure 3 The first die-bonding stage 23 can slide on the first track 21, and the second die-bonding stage 24 can slide on the second track 22. The sliding of the first and second die-bonding stages 23 and 24 are independently controlled. When in operation, if the first die-bonding stage 23 is located on the end of the first track 21 near the dipping area 12, the second die-bonding stage 24 is located on the end of the second track 22 near the mounting area 11, and vice versa.

[0052] See also Figure 4 The mobile crystal bonding table assembly 2 also includes a linear motor 211 provided on the first track 21, which is used to drive the first crystal bonding table 23 to move on the first track 21; the mobile crystal bonding table assembly 2 also includes a drag chain 212 provided near the first track 21, which is used to accommodate the working cable of the first crystal bonding table 23, and the drag chain 212 is parallel to the first track 21.

[0053] It can be understood that the linear motor 211 provides high-precision position control capability, which can accurately move the first crystal bonding table 23 to the specified position, ensuring the consistency and accuracy of each operation; the drag chain 212 provides physical protection for the working cable of the first crystal bonding table 23, preventing the cable from being damaged due to frequent movement, thereby extending the service life of the cable; the drag chain 212 is arranged parallel to the first track 21, ensuring that the cable moves synchronously with the crystal bonding table, reducing potential conflicts between the cable and other components, and avoiding interference during operation; the smooth movement driven by the linear motor 211 and the protection of the cable by the drag chain 212 reduce the influence of mechanical vibration and other external factors, further ensuring the stability of the system and the mounting quality.

[0054] Please combine Figure 5 and Figure 6As an embodiment, the dipping area 12 is further provided with a first robotic arm assembly 121, a first material table assembly 122 and a dipping table assembly 123, and the first robotic arm assembly 121 can move in the dipping area 12; the first robotic arm assembly 121 transports materials between the first material table assembly 122 and the mobile crystal bonding table assembly 2, or performs dipping operations between the dipping table assembly 123 and the mobile crystal bonding table assembly 2; the loading area 13 is provided with a second robotic arm assembly 131 and a second material table assembly 132, and when the first transfer table 32 is located in the loading area 13, the second robotic arm assembly 131 transports materials between the second material table assembly 132 and the first transfer table 32.

[0055] It can be understood that in the embodiment of the present invention, the first robotic arm assembly 121 and the second robotic arm assembly 131 that can operate independently are respectively provided in the dipping area 12 and the loading area 13. The two are separated in terms of area and execution module, so that the dipping and loading operations can be carried out synchronously without interfering with each other; potential problems caused by the intersection between different processes, such as material confusion or operation conflicts, are avoided; the first robotic arm assembly 121 and the second robotic arm assembly 131 are respectively responsible for the dipping and loading operations, and they can move freely in their respective areas without being affected by each other. This independent control design allows each robotic arm to focus on its own task, improving operational accuracy and response speed; since the dipping and loading operations can be carried out simultaneously, the entire die bonding process is parallelized, and the loading operation will not be delayed due to the dipping operation, and vice versa; this means that the chip can be ready to enter the placement link at any time, and the substrate can also be dipped in time, thereby reducing unnecessary waiting time; this not only speeds up production speed, but also enables the equipment to complete more tasks in a shorter time.

[0056] Please continue reading Figure 5 As an embodiment, the first material stage assembly 122 and the adhesive dip stage assembly 123 are located on opposite sides of the mobile die-bonding stage assembly 2. Specifically, the portions of the first track 21 and the second track 22 within the adhesive dip area 12 are located between the first material stage assembly 122 and the adhesive dip stage assembly 123. This design allows both the first material stage assembly 122 and the adhesive dip stage assembly 123 to be as close as possible to the mobile die-bonding stage assembly 2, reducing response time for material preparation and adhesive dip operations and improving overall work efficiency.

[0057] Please combine Figure 1 、 Figure 5 and Figure 6As an embodiment, the first track 21, the second track 22 and the third track 31 are spaced apart and arranged in parallel, and the first track 21 and the second track 22 are located on the side of the dipping area 12 close to the loading area 13, and the third track 31 is located on the side of the loading area 13 close to the dipping area 12.

[0058] It is understandable that in the embodiment of the present invention, a certain distance is maintained between each track, avoiding mutual interference between moving components on different tracks and ensuring the independence and efficiency of each process; the parallel arrangement of the tracks makes path planning for the robot arm and other transport vehicles simpler, reduces complexity, and improves operational efficiency; at the same time, the three guide rails are arranged in parallel and close to the corresponding areas, so that during the placement process, the distance to move the chip to the chip can be shortened. The shorter movement distance means that the robot arm or transport vehicle can respond to operating instructions more quickly, reducing waiting time and periodic delays; at the same time, the shorter movement distance reduces the position deviation caused by long-distance transportation, thereby improving the accuracy of placement. This is particularly important in the semiconductor manufacturing process with high precision requirements.

[0059] Please combine Figure 6 and Figure 7 As an embodiment, a first upward viewing module 133 is provided in the loading area 13, and a second upward viewing module 112 is provided in the mounting area 11. The first upward viewing module 133 is located between the second material table assembly 132 and the third track 31, and the second upward viewing module 112 is located between the third track 31 and the movable crystal bonding table assembly 2. The shooting accuracy of the second upward viewing module 112 is higher than that of the first upward viewing module 133.

[0060] It can be understood that in the embodiment of the present invention, by setting the first upward viewing module 133 and the second upward viewing module 112 to calibrate the chip twice during the chip loading and mounting process, it is ensured that each chip can be accurately bonded to the substrate with high precision; specifically, the first upward viewing module 133 is mainly used to shoot the chip when it is transferred from the second material table assembly 132 to the first transfer table 32 on the third track 31, to ensure that the basic orientation of the chip is correct, and is suitable for preliminary adjustment of the position of the chip, and the second upward viewing module 112 is used to shoot the chip with high precision before it is about to be mounted on the substrate, to ensure that the final position of the chip is accurate; due to its higher shooting accuracy, it can capture more subtle position deviations, thereby achieving more precise adjustments; by first using the low-precision first upward viewing module 133 for coarse calibration, and then using the high-precision second upward viewing module 112 for fine calibration, a process of gradually optimizing the chip position is achieved. This step-by-step calibration method not only improves the accuracy of calibration, but also saves time and avoids the complexity and cost increase brought about by a one-time high-precision calibration.

[0061] As an embodiment, the first upward viewing module 133 and the second upward viewing module 112 are both upward viewing CCD (Charge Coupled Device) modules; CCD is a semiconductor device that can convert optical images into digital signals to achieve image acquisition, storage, transmission and processing operations.

[0062] Please continue to see Figure 7 As an embodiment, a first nozzle rack assembly 113 is further provided in the mounting area 11 . The first nozzle rack assembly 113 is located at the end of the third track 31 and straddles the top of the third track 31 .

[0063] It can be understood that in the embodiment of the present invention, the first suction nozzle holder assembly 113 can be equipped with different types of suction nozzles, which is convenient for replacing the suction nozzles to adapt to chips of various sizes and shapes, thereby enhancing the versatility and flexibility of the equipment; placing the first suction nozzle holder assembly 113 at the end of the third rail 31 and spanning above it makes full use of the vertical space, avoids occupying additional horizontal area, and makes the entire equipment layout more compact; when the suction nozzle model needs to be replaced, since the first suction nozzle holder assembly 113 itself is already located at the end of the third rail 31, it can be immediately moved to the position of the first transfer table 32 after the replacement is completed, without the need for additional long-distance movement, thereby greatly shortening the preparation time; even in the case of frequent changes in the suction nozzle model, due to the short distance between the first suction nozzle holder assembly 113 and the first transfer table 32, it can still be ensured that the first suction operation after each replacement can be completed quickly and accurately, thereby ensuring the accuracy of chip mounting.

[0064] As an embodiment, the horizontal height of the first nozzle rack assembly 113 is higher than the horizontal height of the first transfer table 32. It can be understood that the higher nozzle rack assembly ensures that it will not physically contact or collide with the first transfer table 32 during operation, especially when the nozzle rack assembly moves, grabs and places chips, it provides sufficient vertical space to avoid potential operational interference.

[0065] As an embodiment, a third material table assembly 114 and a second transfer table 115 are also provided in the mounting area 11. The third material table assembly 114 and the second transfer table 115 are respectively arranged on both sides of the third track 31. The second transfer table 115 is located between the third track 31 and the movable crystal bonding table assembly 2, and the second transfer table 115 is arranged close to the second upper viewing module 112.

[0066] It can be understood that in the embodiment of the present invention, the third material table assembly 114 serves as a storage and supply point for various types of chips, providing a stable and sufficient supply of raw materials for the entire mounting process. It can support chips of different specifications and quantities to meet diverse production needs. The second turntable 115 is located on both sides of the third track 31, avoiding the intersection of material transmission paths and minimizing the distance between the first turntable 32 and the second turntable 115 and the mobile solid crystal table assembly 2; because it is set close to the second upper viewing module 112, the second turntable 115 can be precisely calibrated under high-precision shooting to ensure that the chip is in the best position before entering the mounting step, thereby improving the success rate and quality of the mounting.

[0067] As an embodiment, a standard positioning member 116 is further provided in the mounting area 11 , a top surface of the standard positioning member 116 is provided with a positioning point, and the standard positioning member 116 is provided between the third track 31 and the movable die bonding table assembly 2 .

[0068] It can be understood that in the embodiment of the present invention, the positioning point serves as the calibration positioning point of the main binding head, providing an accurate reference position. Through the positioning point on the standard positioning part 116, high-precision calibration of the main binding head and other related components can be achieved, ensuring that each chip can be accurately bonded to the designated position on the substrate, greatly improving the quality and reliability of the mounting; the standard positioning part 116 is located between the two key components, making full use of the space of the mounting area 11, avoiding additional occupation of other positions, and making the entire equipment layout more compact and reasonable.

[0069] Please combine Figure 7 and Figure 8 As an embodiment, a gantry assembly 111 is provided in the mounting area 11, and the gantry assembly 111 includes support columns 1111 located on two opposite sides of the mounting area 11 and a beam guide rail 1112 slidably provided between the two support columns 1111, and a main binding head assembly 1113 is provided on the beam guide rail 1112, and the main binding head assembly 1113 is provided with a first suction nozzle 1114 and a first downward viewing module 1115.

[0070] It can be understood that in the embodiment of the present invention, the support column 1111 provides a solid foundation for the entire gantry assembly 111, ensuring its stability during operation and reducing vibrations caused by mechanical movement or external factors; the beam guide rail 1112 can slide along the support column 1111, so that the main binding head assembly 1113 can move freely in the mounting area 11, covering a larger working area, and adapting to the mounting requirements of substrates and chips of different specifications and positions; the main binding head assembly 1113 can slide on the beam guide rail 1112, realizing flexible movement in the mounting area 11, and can quickly reach any required position for mounting operations. The first suction nozzle 1114 is used to accurately grasp and place the chip, ensuring that each chip can be accurately bonded to the designated position on the substrate. The first downward viewing module 1115 can capture the position of the chip and substrate in real time during the mounting process, ensuring that the chip is in the optimal position before each mounting to prevent dislocation or offset. The stable support provided by the gantry assembly 111 and the high-precision visual inspection of the first downward viewing module 1115 ensure the accuracy and consistency of each mounting operation, greatly improving the quality and reliability of the mounting.

[0071] As an embodiment, an expansion component 1116 is further provided on the main binding head, and at least one expansion module 1117 is provided on the expansion component 1116.

[0072] It can be understood that in the embodiment of the present invention, the expansion component 1116 provides physical space and interfaces for adding additional components, so that the equipment can be flexibly configured according to actual production needs, thereby enhancing the versatility and adaptability of the system; the expansion module 1117 is mainly used to realize multi-chip mounting, which can grab multiple chips at one time and accurately place them in the specified position on the substrate, significantly improving the mounting efficiency; since multiple suction nozzle modules can be used at the same time, the need for frequent replacement of suction nozzles is reduced, saving time and cost, and improving overall work efficiency.

[0073] As an embodiment, the expansion module 1117 includes a sub-binding head or a glue dispensing component. It can be understood that the sub-binding head is mainly used to realize the synchronous mounting of multiple chips, and can grab multiple chips at one time and accurately place them in the specified position on the substrate, which significantly improves the mounting efficiency; different types of sub-binding heads can be equipped according to the requirements of chips of different specifications and shapes, which enhances the equipment's support for multiple chip processing tasks; since multiple binding heads can be used at the same time, the need for frequent replacement of suction nozzles is reduced, saving time and cost, and improving overall work efficiency. The glue dispensing component can accurately control the amount of glue dipped each time, ensuring the appropriate amount of glue required for each mounting, avoiding the problems caused by too much or too little glue; the existence of the glue dispensing component makes the glue dipping operation more centralized and efficient, reduces the time interval from dipping to mounting, and further improves production efficiency.

[0074] As an embodiment, the expansion module 1117 can transfer multiple chips from the first transfer table 32 to the second transfer table 115 at one time by setting up multiple auxiliary binding heads, and then let the main binding head assembly 1113 perform the mounting work between the second transfer table 115 and the eutectic table. At this time, the unloaded first transfer table 32 can return to the loading area 13 in advance for the next round of loading.

[0075] A second embodiment of the present invention provides a die bonding method, which is applied to the dual-track die bonding apparatus 100 described above. The method includes:

[0076] In the dipping area 12, the substrate placed on the first die bonding table 23 / the second die bonding table 24 is dipped in glue, and only a part of the substrate is dipped in glue each time. The substrate after dipping in glue is transported to the mounting area 11;

[0077] In the loading area 13 , the chip is transported to the first transfer table 32 , and the first transfer table 32 is moved to the mounting area 11 via the third track 31 ;

[0078] In the mounting area 11 , the chip on the first transfer station 32 is mounted on the substrate at the first die-bonding station 23 / the second die-bonding station 24 to complete the chip mounting;

[0079] When one of the first die bonding station 23 and the second die bonding station 24 is located in the mounting area 11 / dipping area 12, the other is correspondingly located in the dipping area 12 / mounting area 11. The dipping operation and the chip mounting operation are performed simultaneously on the first die bonding station 23 and the second die bonding station 24.

[0080] Each substrate is reciprocated in the mounting area 11 and the dipping area 12 by moving the die bonding stage assembly 2, completing at least two rounds of dipping and chip mounting.

[0081] It can be understood that the die bonding method provided in the method embodiment is applied to the above-mentioned die bonding equipment, and therefore also has the same beneficial effects as the above-mentioned die bonding equipment, which will not be described in detail here.

[0082] As an implementation method, the chips on the first transfer table 32 may be transferred to the second transfer table 115 in the mounting area 11 , and then the chips on the second transfer table 115 may be placed in the mounting area 11 .

[0083] Please combine Figures 1 to 8 The working process / principle of the dual-track die bonding equipment 100 provided in the embodiment of the present invention is briefly described as follows:

[0084] The dual-track die bonding equipment 100 mainly consists of the following key parts:

[0085] Carrier platform 1: As the basic platform of the entire equipment, carrier platform 1 is equipped with a mounting area 11, a glue dipping area 12 and a loading area 13;

[0086] The mobile crystal bonding stage assembly 2 includes a first track 21, a second track 22, a first crystal bonding stage 23 and a second crystal bonding stage 24, and is used to work alternately between the dipping area 12 and the mounting area 11;

[0087] The mobile transfer platform assembly 3 includes a third track 31 and a first transfer platform 32, and is used to transport chips between the loading area 13 and the mounting area 11;

[0088] Robotic arm assembly: A first robotic arm assembly 121 is provided in the glue dipping area 12, responsible for material transportation and glue dipping operations; a second robotic arm assembly 131 is provided in the loading area 13, responsible for transporting chips from the second material table assembly 132 to the first transfer table 32;

[0089] Vision module: A first upward viewing module 133 is provided in the loading area 13, and a high-precision second upward viewing module 112 is provided in the mounting area 11, for calibrating the chip position;

[0090] Nozzle rack assembly: located above the end of the third track 31, equipped with different types of nozzles for grabbing and placing chips;

[0091] Gantry assembly 111: includes support columns 1111, beam guide rails 1112 and main binding head assembly 1113, used to achieve high-precision chip mounting operations.

[0092] Mounting process:

[0093] In the loading area 13, the second robotic arm assembly 131 grabs the chip to be mounted from the second material table assembly 132 and places it on the first transfer table 32. During this process, the first upward viewing module 133 performs preliminary calibration on the chip. The first transfer table 32 slides to the mounting area 11 via the third track 31.

[0094] In the glue dipping area 12, the first robot arm assembly 121 obtains glue from the glue dipping table assembly 123 and dips it into the substrate on the first crystal bonding table 23 or the second crystal bonding table 24. Only part of the area of the substrate is dipped in glue each time, and then the substrate is transported to the mounting area 11 to prevent the glue from solidifying during the long waiting process.

[0095] In the mounting area 11, the first suction nozzle 1114 on the main binding head assembly 1113 sucks the chip from the first transfer table 32 and / or the third material table assembly 114, and places it accurately on the corresponding position of the substrate on the first crystal bonding table 23 or the second crystal bonding table 24. During this process, the second upward viewing module 112 takes high-precision photos of the chip to ensure that its final position is accurate.

[0096] The first die bonding table 23 and the second die bonding table 24 work alternately between the dipping area 12 and the mounting area 11. Each time after completing partial dipping, mounting is performed immediately, shortening the time interval from dipping to mounting. Each substrate moves back and forth between the dipping area 11 and the dipping area 12 by moving the die bonding table assembly 2, completing at least two rounds of dipping and chip mounting to ensure that all chips are accurately bonded to the substrate.

[0097] The above is a detailed introduction to a dual-track die bonding device and a die bonding method disclosed in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A dual-track die bonding device, characterized by: The device comprises a carrying platform, wherein a mounting area, a glue dipping area and a material loading area are provided on the carrying platform, wherein the glue dipping area and the material loading area are adjacent to each other and are adjacent to the same side of the mounting area; The mobile crystal bonding platform assembly and the mobile transfer platform assembly are provided on the carrier platform, wherein the mobile crystal bonding platform assembly includes a first track, a second track, a first crystal bonding platform and a second crystal bonding platform, wherein the first crystal bonding platform is slidably connected to the first track, and the second crystal bonding platform is slidably connected to the second track, and the first track and the second track extend from the dipping area to the mounting area respectively; in a working state, the first crystal bonding platform and the second crystal bonding platform alternately operate in the mounting area and the dipping area; The mobile turntable assembly includes a third track and a first turntable in sliding connection, the third track extending from the loading area to the placement area, and the first turntable moving back and forth between the loading area and the placement area via the third track; A first robotic arm assembly is further provided in the glue dipping area, and the first robotic arm assembly moves in the glue dipping area; A second robotic arm assembly is provided in the loading area, and the second robotic arm assembly moves in the loading area; The mounting area is provided with a main binding head assembly for performing mounting operations in the mounting area; The first robotic arm assembly, the second robotic arm assembly and the main binding head assembly independently complete corresponding glue dipping, material loading and mounting operations in the glue dipping area, the material loading area and the mounting area respectively.

2. The dual-track die bonding equipment according to claim 1, wherein: The dipping area is further provided with a first material table assembly and a dipping table assembly; the first robotic arm assembly transports materials between the first material table assembly and the mobile crystal bonding table assembly, or performs a dipping operation between the dipping table assembly and the mobile crystal bonding table assembly; A second material table assembly is further provided in the loading area. When the first transfer table is located in the loading area, the second robotic arm assembly transports materials between the second material table assembly and the first transfer table.

3. The dual-track die bonding equipment according to claim 2, wherein: The first track, the second track and the third track are spaced apart and arranged in parallel, and the first track and the second track are located on a side of the dipping area close to the loading area, and the third track is located on a side of the loading area close to the dipping area.

4. The dual-track die bonding equipment according to claim 3, wherein: A first upward viewing module is provided in the loading area, and a second upward viewing module is provided in the mounting area. The first upward viewing module is located between the second material table assembly and the third track, and the second upward viewing module is located between the third track and the movable crystal bonding table assembly. The shooting accuracy of the second upward viewing module is higher than that of the first upward viewing module.

5. The dual-track die bonding equipment according to claim 1, wherein: A first nozzle rack assembly is further provided in the mounting area. The first nozzle rack assembly is located at the end of the third track and straddles the third track. The horizontal height of the first nozzle rack assembly is higher than the horizontal height of the first transfer table.

6. The dual-track die bonding equipment according to claim 4, wherein: A third material table assembly and a second turntable are also provided in the mounting area. The third material table assembly and the second turntable are respectively arranged on both sides of the third track. The second turntable is located between the third track and the movable crystal bonding table assembly, and the second turntable is arranged close to the second upward viewing module.

7. The dual-track die bonding equipment according to claim 1, wherein: A standard positioning member is further provided in the mounting area, a top surface of the standard positioning member is provided with a positioning point, and the standard positioning member is provided between the third track and the movable crystal bonding table assembly.

8. The dual-track die bonding equipment according to claim 1, wherein: A gantry assembly is provided in the mounting area, and the gantry assembly includes support columns located on two opposite sides of the mounting area and a beam guide slidably provided between the two support columns, the main binding head assembly is provided on the beam guide, and the main binding head assembly is provided with a first suction nozzle and a first downward viewing module.

9. The dual-track die bonding equipment according to claim 8, wherein: The main binding head is further provided with an expansion component, and the expansion component is provided with at least one expansion module; the expansion module includes an auxiliary binding head or a glue dispensing component.

10. A die bonding method, characterized in that: Applied to the dual-track die bonding equipment according to any one of claims 1 to 9, the method comprises: In the dipping area, the first robotic arm dips the substrate placed on the first die bonding table / second die bonding table into glue, dipping only part of the substrate into glue each time, and then transporting the dipped substrate to the placement area; In the loading area, the chip is transported to the first transfer table by the second robot arm, and the first transfer table is moved to the placement area by the third track; In the mounting area, the chip on the first transfer table is mounted to the substrate on the first die bonding table / second die bonding table through the main bonding head assembly to complete the chip mounting; When one of the first die bonding station and the second die bonding station is located in the mounting area / dipping area, the other is correspondingly located in the dipping area / mounting area, and the dipping operation and the chip mounting operation are performed simultaneously on the first die bonding station and the second die bonding station respectively; Each substrate moves back and forth between the mounting area and the dipping area by moving the crystal bonding table assembly, completing at least two rounds of dipping and chip mounting.

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