High-precision wafer pre-alignment mechanism

Abstract

The invention belongs to the technical field of semiconductor packaging, and provides a high-precision wafer pre-alignment mechanism which comprises a bottom plate, a top plate is fixedly installed at the top end of the bottom plate, supporting rods are fixedly connected between the four corners of the side, close to the top plate, of the bottom plate and the top plate, mechanical fingers are movably arranged at the top end of the top plate, and a wafer is adsorbed to one side of each mechanical finger. A wafer NOTCH notch is formed in one side of the wafer; due to the compatibility, the design time is saved to a great extent, and meanwhile, the equipment cost is also saved; according to the invention, precise pre-alignment of wafers with different sizes of 6-12 inches in the same mechanism is realized, the compatibility of equipment is improved, the equipment cost is reduced, high-precision centering alignment of the wafers and high-precision alignment of NOTCH are realized, the problem of deflection easily occurring in a traditional conical surface sliding positioning mode is solved, and the positioning precision is improved. And a powerful guarantee is provided for a subsequent process in a semiconductor chip manufacturing process.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and particularly relates to a high-precision wafer pre-alignment mechanism. Background Art

[0002] In the highly precise and complex industrial field of semiconductor chip manufacturing, wafer pre-alignment, as a key link connecting front-end wafer preparation and back-end packaging and testing, is of great importance. With the development of semiconductor packaging technology, the wafer size is gradually moving towards the ultra-large size direction. 6-inch to 12-inch wafers are the mainstream sizes in current market applications. The first process of the bonding process of the large-size wafer temporary bonding equipment is the glue coating process. The uniformity of the glue film thickness after glue coating has a great impact on the yield of the subsequent bonding process; the offset of the wafer center relative to the center of the glue coating plate during glue coating will cause the high-speed rotating glue coating plate to vibrate, and this vibration will deteriorate the uniformity (TTV value) of the glue film after glue coating. In practical applications, the offset accuracy between the wafer center and the center of the glue leveling plate is determined by the pre-alignment mechanism; therefore, achieving fast and precise wafer pre-alignment is the guarantee for improving the product yield of temporary bonding.

[0003] However, the currently widely used wafer pre-alignment technology in the market is a traditional solution based on conical surface sliding positioning, which has gradually exposed many drawbacks and is difficult to meet the requirements of advanced manufacturing processes. For example, long-term physical contact and sliding will cause wear on the conical surface and the wafer surface, which not only reduces the positioning accuracy but also may introduce contaminants and affect the wafer quality; conical surface sliding positioning is prone to fluctuations and deviations during wafer transfer, resulting in unstable wafer positions and affecting the quality of subsequent processing, and this accuracy level often cannot meet the requirements. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-precision wafer pre-alignment mechanism to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A high-precision wafer pre-alignment mechanism, comprising:

[0007] A bottom plate, on the top end of which a top plate is fixedly installed. Between the four corners of the bottom plate near the top plate and the top plate, support rods are fixedly connected. On the top end of the top plate, a mechanical finger is movably arranged. A wafer is adsorbed on one side of the mechanical finger, and a wafer NOTCH notch is opened on one side of the wafer;

[0008] A positioning component, which is arranged on one side of the top end of the top plate. The positioning component includes a positioning slide table movably installed on one side of the top plate. A positioning pin seat is connected to the top end of the positioning slide table, and a plurality of positioning pins are fixedly installed on one side of the positioning pin seat;

[0009] A pressing assembly, the pressing assembly is arranged on the top end of the top plate away from one side of the positioning slide table. The pressing assembly includes a pressing slide table movably installed on one side of the top plate. A pressing guide rail mounting plate is fixedly installed at the top end of the pressing slide table. A pressing guide rail is fixedly installed on one side of the pressing guide rail mounting plate. A guide rail connecting plate is movably installed on one side of the pressing guide rail. A pressing block is fixedly connected to one side of the guide rail connecting plate.

[0010] An adjusting assembly, the adjusting assembly is arranged on one side of the bottom plate. The adjusting assembly includes a thimble mounting plate movably installed inside the top plate. Four corners on one side of the thimble mounting plate are fixedly installed with thimbles. The top plate is movably connected to the thimble mounting plate through a slot. A suction cup connecting shaft is movably installed inside the thimble mounting plate through an opening. One end of the suction cup connecting shaft is fixedly connected to a suction cup, and the suction cup faces the wafer.

[0011] Preferably, a positioning slide table is movably installed on one side of the top plate. A positioning limiting block is fixedly installed on one side of the positioning slide table. A positioning pin bottom plate is fixedly installed on the side of the positioning slide table away from the top plate. A positioning pin seat is fixedly installed on one side of the positioning pin bottom plate. A number of positioning pins are movably installed at the top end of the positioning pin seat.

[0012] Preferably, a NOTCH detection sensor bracket is fixedly installed on the top end of the top plate near one side of the positioning slide table. A NOTCH detection sensor is fixedly installed on the side of the NOTCH detection sensor bracket close to the wafer.

[0013] Preferably, a pressing slide table is movably installed on the top end of the top plate away from one side of the positioning slide table. A pressing guide rail mounting plate is fixedly installed on the side of the pressing slide table away from the top plate. A pressing guide rail is fixedly installed on the side of the pressing guide rail mounting plate away from the pressing slide table. A guide rail slider is movably installed outside the pressing guide rail.

[0014] Preferably, a guide rail connecting plate is fixedly installed on the side of the guide rail slider away from the pressing guide rail. A pressing block is fixedly installed on the side of the guide rail connecting plate away from the guide rail slider. The pressing block is made of polyoxymethylene.

[0015] Preferably, a spring rear plate is movably installed outside the pressing guide rail. A spring pre-tightening screw is movably installed between the spring rear plate and the guide rail connecting plate through an opening. One end of the spring pre-tightening screw is screwed with the spring rear plate through a thread, and an opening pin is installed at the other end.

[0016] Preferably, the opening pin is arranged on the side of the guide rail connecting plate away from the spring rear plate. A pressing spring is connected between the spring rear plate and the guide rail connecting plate, and the pressing spring is arranged outside the spring pre-tightening screw.

[0017] Preferably, a thimble mounting plate is movably installed inside the top plate through grooving. Four corners of the thimble mounting plate close to the wafer are fixedly installed with thimbles. One side of the bottom plate is fixedly installed with a thimble lifting seat. A thimble lifting screw rod is movably installed inside the thimble lifting seat through a bearing. A thimble screw rod block is screwed on the outer side of the thimble lifting screw rod through a thread. One side of the thimble screw rod block is fixedly connected with a thimble limiting plate. One side of the thimble limiting plate is fixedly connected with a thimble lifting connecting plate. The side of the thimble lifting connecting plate close to the thimble mounting plate is fixedly connected with the thimble mounting plate. The top of the thimble lifting seat is installed with a thimble lifting motor through a fixed seat. The output end of the thimble lifting motor is in transmission connection with the shaft of the thimble lifting screw rod through a coupling.

[0018] Preferably, a suction cup connecting shaft is movably installed inside the thimble mounting plate through an opening. One end of the suction cup connecting shaft close to the wafer is interconnected with a suction cup. One side of the bottom plate close to the top plate is movably installed with a suction cup rotating motor connecting plate. One side of the suction cup rotating motor connecting plate is installed with a suction cup rotating motor through a fixed seat. The output end of the suction cup rotating motor is in transmission connection with the shaft of the suction cup connecting shaft through a coupling. One side of the suction cup rotating motor away from the suction cup connecting shaft is fixedly installed with a vacuum nozzle. The vacuum nozzle is interconnected with the inside of the suction cup connecting shaft.

[0019] Preferably, a suction cup lifting seat is fixedly installed on the top of the bottom plate close to the suction cup rotating motor connecting plate. A suction cup lifting screw rod is movably installed inside the suction cup lifting seat through a bearing. A suction cup screw rod block is screwed on the outer side of the suction cup lifting screw rod through a thread. One side of the suction cup screw rod block is fixedly connected with a suction cup limiting plate. The side of the suction cup limiting plate close to the suction cup rotating motor connecting plate is fixedly connected with the suction cup rotating motor connecting plate. The top of the suction cup lifting seat is installed with a suction cup lifting motor through a fixed seat. The output end of the suction cup lifting motor is in transmission connection with the shaft of the suction cup lifting screw rod through a coupling.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] (1) By setting a positioning pin seat and positioning pins on one side of the top plate, the present invention realizes the positioning effect of the wafer, and different heights of positioning pins can be installed according to different wafer sizes. For a 6-inch wafer, the height of the positioning pin is 10 mm; for an 8-inch wafer, the height of the positioning pin is 15 mm; for a 10-inch wafer, the height of the positioning pin is 20 mm; for a 12-inch wafer, the height of the positioning pin is 25 mm. The positioning pins can move back and forth with the positioning slide, avoiding the movement of the mechanical fingers so as not to damage the mechanical fingers. At the same time, a NOTCH detection sensor is set at the top, which can accurately detect the direction of the wafer NOTCH notch, realizing the high-precision alignment of the wafer notch direction, effectively improving the detection ability and alignment accuracy.

[0022] (2) In the present invention, a movable pressing slide is provided on one side of the top plate, and a pressing block capable of adjusting the pre-tightening force is provided at the top of the pressing slide. The pressing block is used to clamp the wafer to achieve centering alignment. Moreover, the position of the spring rear plate on the pressing guide rail mounting plate can be changed according to the size of the wafer. There are pre-installed holes corresponding to the wafer size on the pressing guide rail mounting plate. Before use, first rotate the spring pre-tightening screw to adjust the pre-tightening force of the pressing block, and then use the air cylinder to push the pressing slide to move, which provides additional stability guarantee for the wafer, thereby improving the stability of the entire pre-alignment mechanism.

[0023] (3) In the present invention, a thimble is provided on one side of the thimble mounting plate to support the wafer. The thimble mounting plate can move up and down, which facilitates the picking and placing of the wafer in cooperation with the mechanical fingers to achieve automated operation. The suction cup can move up and down driven by the suction cup connecting shaft. The vacuum nozzle provides vacuum for the suction cup to adsorb the wafer. After the suction cup adsorbs the wafer, it can synchronously drive the wafer to perform lifting motion, and can generate a rotating action under the action of the suction cup rotating motor to cooperate with the NOTCH detection sensor to calibrate the NOTCH notch of the wafer. Compared with the traditional method, this structure has better precision, more stable wafer position, and more flexible operation.

[0024] (4) The compatibility of the present invention greatly saves the design time and also saves the equipment cost; the present invention realizes the precise pre-alignment of wafers with different sizes from 6 inches to 12 inches in the same mechanism, improves the compatibility of the equipment, reduces the equipment cost, realizes the high-precision centering alignment of the wafer and the high-precision alignment of NOTCH, solves the skewing phenomenon that is likely to occur in the traditional conical surface sliding positioning method, and provides a strong guarantee for the subsequent processes in the semiconductor chip manufacturing process. Description of the Drawings

[0025] Figure 1 is the overall structure schematic diagram of the present invention;

[0026] Figure 2 is the wafer structure schematic diagram of the present invention;

[0027] Figure 3 is the positioning pin installation position structure schematic diagram of the present invention;

[0028] Figure 4 is the pressing block installation structure schematic diagram of the present invention;

[0029] Figure 5 is the split pin installation position structure schematic diagram of the present invention;

[0030] Figure 6 is the suction cup installation structure schematic diagram of the present invention;

[0031] Figure 7 is the thimble mounting plate structure schematic diagram of the present invention;

[0032] Figure 8 This is a schematic diagram of the suction cup connecting shaft structure of the present invention.

[0033] In the figure: 1. Bottom plate; 11. Top plate; 12. Support rod; 13. Mechanical finger; 14. Wafer; 15. Wafer NOTCH notch; 2. Positioning component; 21. Positioning slide; 22. Positioning limiting block; 23. Positioning pin bottom plate; 24. Positioning pin seat; 25. Positioning pin; 26. NOTCH detection sensor bracket; 27. NOTCH detection sensor; 3. Pressing component; 31. Pressing slide; 32. Pressing guide rail mounting plate; 33. Pressing guide rail; 34. Guide rail slider; 35. Guide rail connecting plate; 36. Pressing block; 37. Spring rear plate; 38. Spring pre-tightening screw; 39. Split pin; 310. Pressing spring; 4. Adjusting component; 41. Thimble mounting plate; 42. Thimble; 43. Thimble lifting seat; 44. Thimble lifting lead screw; 45. Thimble lead screw block; 46. Thimble limiting plate; 47. Thimble lifting connecting plate; 48. Thimble lifting motor; 49. Suction cup connecting shaft; 410. Suction cup; 411. Suction cup rotating motor connecting plate; 412. Suction cup rotating motor; 413. Vacuum nozzle; 414. Suction cup lifting seat; 415. Suction cup lifting lead screw; 416. Suction cup lead screw block; 417. Suction cup limiting plate; 418. Suction cup lifting motor. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Embodiment 1:

[0036] Please refer to Figure 1 - Figure 3 As shown, a high-precision wafer pre-alignment mechanism includes:

[0037] A bottom plate 1, on the top end of the bottom plate 1, a top plate 11 is fixedly installed. Between the four corners of the bottom plate 1 close to the top plate 11 and the top plate 11, support rods 12 are fixedly connected. On the top end of the top plate 11, a mechanical finger 13 is movably arranged. On one side of the mechanical finger 13, a wafer 14 is adsorbed. On one side of the wafer 14, a wafer NOTCH notch 15 is opened.

[0038] The positioning component 2 is arranged on one side of the top of the top plate 11. The positioning component 2 includes a positioning slide table 21 movably installed on one side of the top plate 11. A positioning pin seat 24 is connected to the top of the positioning slide table 21. A plurality of positioning pins 25 are fixedly installed on one side of the positioning pin seat 24;

[0039] The pressing component 3 is arranged on the side of the top plate 11 away from the positioning slide table 21. The pressing component 3 includes a pressing slide table 31 movably installed on one side of the top plate 11. A pressing guide rail mounting plate 32 is fixedly installed on the top of the pressing slide table 31. A pressing guide rail 33 is fixedly installed on one side of the pressing guide rail mounting plate 32. A guide rail connecting plate 35 is movably installed on one side of the pressing guide rail 33. A pressing block 36 is fixedly connected to one side of the guide rail connecting plate 35;

[0040] The adjusting component 4 is arranged on one side of the bottom plate 1. The adjusting component 4 includes a thimble mounting plate 41 movably installed inside the top plate 11. Four corners on one side of the thimble mounting plate 41 are fixedly installed with thimbles 42. The top plate 11 is movably connected to the thimble mounting plate 41 through a slot. A suction cup connecting shaft 49 is movably installed inside the thimble mounting plate 41 through an opening. One end of the suction cup connecting shaft 49 is fixedly connected to a suction cup 410, and the suction cup 410 faces the wafer 14.

[0041] Specifically, a positioning slide table 21 is movably installed on one side of the top plate 11. A positioning limit block 22 is fixedly installed on one side of the positioning slide table 21. A positioning pin bottom plate 23 is fixedly installed on the side of the positioning slide table 21 away from the top plate 11. A positioning pin seat 24 is fixedly installed on one side of the positioning pin bottom plate 23. A plurality of positioning pins 25 are movably installed on the top of the positioning pin seat 24. A NOTCH detection sensor bracket 26 is fixedly installed on the top of the top plate 11 near the positioning slide table 21. A NOTCH detection sensor 27 is fixedly installed on the side of the NOTCH detection sensor bracket 26 close to the wafer 14.

[0042] As can be seen from the above, a positioning pin seat 24 and positioning pins 25 (resin pin sleeves are arranged outside the positioning pins 25) are arranged on one side of the top plate 11 to achieve the positioning effect of the wafer 14. Different heights of positioning pins 25 can be installed according to different sizes of the wafer 14. For a 6-inch wafer 14, the height of the positioning pin 25 is 10 mm; for an 8-inch wafer 14, the height of the positioning pin 25 is 15 mm; for a 10-inch wafer 14, the height of the positioning pin 25 is 20 mm; for a 12-inch wafer 14, the height of the positioning pin 25 is 25 mm. The positioning pins 25 can move back and forth with the positioning slide table 21, avoiding the movement of the mechanical finger 13 so as not to damage the mechanical finger 13. At the same time, a NOTCH detection sensor 27 is arranged at the top, which can accurately detect the direction of the NOTCH notch 15 of the wafer, achieving high-precision alignment of the direction of the wafer 14, effectively improving the detection ability and alignment accuracy.

[0043] Embodiment 2:

[0044] Please refer to Figure 1 and Figure 4 - Figure 5 As shown, on the side of the top plate 11 away from the positioning slide 21 at the top, a pressing slide 31 is movably installed. On the side of the pressing slide 31 away from the top plate 11, a pressing guide rail mounting plate 32 is fixedly installed. On the side of the pressing guide rail mounting plate 32 away from the pressing slide 31, a pressing guide rail 33 is fixedly installed. On the outside of the pressing guide rail 33, a guide rail slider 34 is movably installed. On the side of the guide rail slider 34 away from the pressing guide rail 33, a guide rail connecting plate 35 is fixedly installed. On the side of the guide rail connecting plate 35 away from the guide rail slider 34, a pressing block 36 is fixedly installed. The pressing block 36 is made of polyoxymethylene material.

[0045] Specifically, a spring rear plate 37 is movably installed on the outside of the pressing guide rail 33. A spring pre-tightening screw 38 is movably installed between the spring rear plate 37 and the guide rail connecting plate 35 through an opening. One end of the spring pre-tightening screw 38 is screwed with the spring rear plate 37 through a thread, and the other end is installed with an opening pin 39. The opening pin 39 is arranged on the side of the guide rail connecting plate 35 away from the spring rear plate 37. A pressing spring 310 is connected between the spring rear plate 37 and the guide rail connecting plate 35. The pressing spring 310 is arranged outside the spring pre-tightening screw 38.

[0046] As can be seen from the above, a movable pressing slide 31 is arranged on one side of the top plate 11, and a pressing block 36 with adjustable pre-tightening force is arranged at the top of the pressing slide 31. The wafer 14 is clamped by the pressing block 36 to achieve centering and alignment. And the position of the spring rear plate 37 on the pressing guide rail mounting plate 32 can be changed according to the size of the wafer 14. There are pre-installed holes corresponding to the size of the wafer 14 on the pressing guide rail mounting plate 32. Before use, first rotate the spring pre-tightening screw 38 to adjust the pre-tightening force of the pressing block 36, and then use the air cylinder to push the pressing slide 31 to move. This provides additional stability guarantee for the wafer 14, thereby improving the stability of the entire pre-alignment mechanism.

[0047] Embodiment 3:

[0048] Please refer to Figure 1 and Figure 6 - Figure 8As shown in the figure, a thimble mounting plate 41 is movably installed inside the top plate 11 through grooving. Four corners of the thimble mounting plate 41 close to one side of the wafer 14 are fixedly installed with thimbles 42. One side of the bottom plate 1 is fixedly installed with a thimble lifting seat 43. Inside the thimble lifting seat 43, a thimble lifting lead screw 44 is movably installed through a bearing. A thimble lead screw block 45 is screwed onto the outside of the thimble lifting lead screw 44 through threads. One side of the thimble lead screw block 45 is fixedly connected to a thimble limiting plate 46. One side of the thimble limiting plate 46 is fixedly connected to a thimble lifting connecting plate 47. The side of the thimble lifting connecting plate 47 close to the thimble mounting plate 41 is fixedly connected to the thimble mounting plate 41. The top of the thimble lifting seat 43 is installed with a thimble lifting motor 48 through a fixed seat. The output end of the thimble lifting motor 48 is connected to the shaft of the thimble lifting lead screw 44 through a coupling for shaft transmission.

[0049] As can be seen from the above, thimbles 42 are arranged on one side of the thimble mounting plate 41 to support the wafer 14 with the thimbles 42. And the thimble mounting plate 41 can move up and down, which facilitates the picking and placing of the wafer 14 in cooperation with the mechanical fingers 13 to achieve automated operation. The thimble lifting lead screw 44 can drive the thimble lead screw block 45 to move up and down, and then drive the thimble limiting plate 46 to move up and down, so as to drive the thimble mounting plate 41 to move up and down through the thimble lifting connecting plate 47, realizing the change of the height of the wafer 14.

[0050] Specifically, a suction cup connecting shaft 49 is movably installed inside the thimble mounting plate 41 through an opening. One end of the suction cup connecting shaft 49 close to the wafer 14 is interconnected with a suction cup 410. One side of the bottom plate 1 close to the top plate 11 is movably installed with a suction cup rotating motor connecting plate 411. One side of the suction cup rotating motor connecting plate 411 is installed with a suction cup rotating motor 412 through a fixed seat. The output end of the suction cup rotating motor 412 is connected to the shaft of the suction cup connecting shaft 49 through a coupling for shaft transmission. One side of the suction cup rotating motor 412 away from the suction cup connecting shaft 49 is fixedly installed with a vacuum nozzle 413. The vacuum nozzle 413 is interconnected with the inside of the suction cup connecting shaft 49. One side of the top of the bottom plate 1 close to the suction cup rotating motor connecting plate 411 is fixedly installed with a suction cup lifting seat 414. Inside the suction cup lifting seat 414, a suction cup lifting lead screw 415 is movably installed through a bearing. A suction cup lead screw block 416 is screwed onto the outside of the suction cup lifting lead screw 415 through threads. One side of the suction cup lead screw block 416 is fixedly connected to a suction cup limiting plate 417. The side of the suction cup limiting plate 417 close to the suction cup rotating motor connecting plate 411 is fixedly connected to the suction cup rotating motor connecting plate 411. The top of the suction cup lifting seat 414 is installed with a suction cup lifting motor 418 through a fixed seat. The output end of the suction cup lifting motor 418 is connected to the shaft of the suction cup lifting lead screw 415 through a coupling for shaft transmission.

[0051] As can be seen from the above, the suction cup 410 can move up and down driven by the suction cup connecting shaft 49. The vacuum nozzle 413 provides vacuum for the suction cup 410 to adsorb the wafer 14. After the suction cup 410 adsorbs the wafer 14, it can drive the wafer 14 to move up and down synchronously, and can generate a rotation action under the action of the suction cup rotation motor 412 to cooperate with the NOTCH detection sensor 27 to calibrate the NOTCH notch 15 of the wafer. The lifting of the suction cup 410 can also be achieved through the cooperation of the suction cup lifting lead screw 415, the suction cup lead screw block 416 and the suction cup limit plate 417.

[0052] Working principle: First, a wafer 14 is adsorbed by the mechanical finger 13 and transported to a predetermined position. The ejector pin 42 rises to support the wafer 14, and the mechanical finger 13 is withdrawn. Then, the suction cup 410 is operated to rise and adsorb the wafer 14. The NOTCH detection sensor 27 performs detection, and at the same time, the suction cup rotation motor 412 is started to drive the wafer 14 to rotate until the position of the wafer NOTCH notch 15 is aligned. Then, the suction cup 410 is controlled to descend, and the wafer 14 falls above the ejector pin 42. The suction force of the suction cup 410 is removed. Then, the positioning slide 21 moves forward to a predetermined position, and the pressing slide 31 moves forward to clamp the wafer 14 to achieve centering alignment. Then, the mechanical finger 13 is operated to adsorb the wafer 14, and the positioning slide 21 and the pressing slide 31 are withdrawn synchronously, and the mechanical finger 13 takes away the wafer 14.

[0053] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision wafer pre-alignment mechanism, characterized in that: include: A bottom plate (1), a top plate (11) is fixedly mounted on the top of the bottom plate (1), support rods (12) are fixedly connected between the top plate (11) and the four corners of the bottom plate (1) on one side close to the top plate (11), a mechanical finger (13) is movably arranged on the top of the top plate (11), a wafer (14) is adsorbed on one side of the mechanical finger (13), and a wafer NOTCH notch (15) is opened on one side of the wafer (14); A positioning assembly (2), the positioning assembly (2) being arranged on one side of the top end of the top plate (11), the positioning assembly (2) comprising a positioning slide (21) movably installed on one side of the top plate (11), the top end of the positioning slide (21) being connected to a positioning pin seat (24), and one side of the positioning pin seat (24) being fixedly installed with a plurality of positioning pins (25); A clamping assembly (3), the clamping assembly (3) being arranged at the top of the top plate (11) and away from the side of the positioning slide (21), the clamping assembly (3) comprising a clamping slide (31) movably mounted on one side of the top plate (11), a clamping guide rail mounting plate (32) being fixedly mounted on the top of the clamping slide (31), a clamping guide rail (33) being fixedly mounted on one side of the clamping guide rail mounting plate (32), a guide rail connecting plate (35) being movably mounted on one side of the clamping guide rail (33), and a clamping block (36) being fixedly connected to one side of the guide rail connecting plate (35); An adjustment component (4), the adjustment component (4) being arranged on one side of the bottom plate (1), the adjustment component (4) comprising a pin mounting plate (41) movably mounted inside the top plate (11), pins (42) being fixedly mounted at four corners of one side of the pin mounting plate (41), the top plate (11) being movably connected to the pin mounting plate (41) via a slot, a suction cup connecting shaft (49) being movably mounted inside the pin mounting plate (41) via an opening, a suction cup (410) being fixedly connected to one end of the suction cup connecting shaft (49), and the suction cup (410) facing the wafer (14).

2. A high-precision wafer pre-alignment mechanism according to claim 1, characterized in that: A positioning slide (21) is movably mounted on one side of the top plate (11), a positioning limiting block (22) is fixedly mounted on one side of the positioning slide (21), a positioning pin base plate (23) is fixedly mounted on the side of the positioning slide (21) away from the top plate (11), a positioning pin seat (24) is fixedly mounted on one side of the positioning pin base plate (23), and a plurality of positioning pins (25) are movably mounted on the top end of the positioning pin seat (24).

3. A high-precision wafer pre-alignment mechanism according to claim 2, characterized in that: A NOTCH detection sensor frame (26) is fixedly mounted on the top of the top plate (11) near the positioning slide (21), and a NOTCH detection sensor (27) is fixedly mounted on the side of the NOTCH detection sensor frame (26) near the wafer (14).

4. The high-precision wafer pre-alignment mechanism according to claim 1, characterized in that: A clamping slide (31) is movably mounted on the top end of the top plate (11) at a side away from the positioning slide (21); a clamping guide rail mounting plate (32) is fixedly mounted on the side away from the top plate (11); a clamping guide rail (33) is fixedly mounted on the side away from the clamping guide rail mounting plate (32) at a side away from the clamping slide (31); and a guide rail slider (34) is movably mounted on the outer side of the clamping guide rail (33).

5. A high-precision wafer pre-alignment mechanism according to claim 4, characterized in that: A guide rail connecting plate (35) is fixedly installed on the side of the guide rail slider (34) away from the clamping guide rail (33), and a clamping block (36) is fixedly installed on the side of the guide rail connecting plate (35) away from the guide rail slider (34), and the clamping block (36) is made of polyoxymethylene material.

6. A high-precision wafer pre-alignment mechanism according to claim 5, characterized in that: A spring rear plate (37) is movably mounted on the outer side of the clamping guide rail (33); a spring pre-tightening screw (38) is movably mounted between the spring rear plate (37) and the guide rail connecting plate (35) through an opening; one end of the spring pre-tightening screw (38) is screwed with the spring rear plate (37) through a thread, and a cotter pin (39) is mounted on the other end.

7. The high-precision wafer pre-alignment mechanism according to claim 6, characterized in that: The cotter pin (39) is arranged on a side of the guide rail connecting plate (35) away from the spring rear plate (37), a compression spring (310) is connected between the spring rear plate (37) and the guide rail connecting plate (35), and the compression spring (310) is arranged outside the spring pre-tightening screw (38).

8. The high-precision wafer pre-alignment mechanism according to claim 1, characterized in that: A pin mounting plate (41) is movably mounted inside the top plate (11) through a slot, and pins (42) are fixedly mounted at four corners of the pin mounting plate (41) close to the wafer (14). A pin lifting seat (43) is fixedly mounted on one side of the bottom plate (1), and a pin lifting screw (44) is movably mounted inside the pin lifting seat (43) through a bearing, and a pin lifting screw block (45) is mounted on the outside of the pin lifting screw (44) through a threaded engagement, and the pin lifting screw block One side of the ejector (45) is fixedly connected to a pin limit plate (46), one side of the ejector limit plate (46) is fixedly connected to a pin lift connection plate (47), the pin lift connection plate (47) is fixedly connected to the ejector mounting plate (41) on one side close to the ejector mounting plate (41), a pin lift motor (48) is installed at the top of the ejector lift seat (43) through a fixed seat, and the output end of the ejector lift motor (48) is connected to the shaft of the ejector lift screw rod (44) through a coupling.

9. The high-precision wafer pre-alignment mechanism according to claim 8, characterized in that: A suction cup connecting shaft (49) is movably mounted inside the ejector pin mounting plate (41) through an opening, and a suction cup (410) is interconnected at one end of the suction cup connecting shaft (49) close to the wafer (14), and a suction cup rotating motor connecting plate (411) is movably mounted on the side of the bottom plate (1) close to the top plate (11), and a suction cup rotating motor (412) is mounted on one side of the suction cup rotating motor connecting plate (411) through a fixing seat, and an output end of the suction cup rotating motor (412) is connected to the shaft of the suction cup connecting shaft (49) through a coupling, and a vacuum air nozzle (413) is fixedly mounted on the side of the suction cup rotating motor (412) away from the suction cup connecting shaft (49), and the vacuum air nozzle (413) is interconnected with the inside of the suction cup connecting shaft (49).

10. The high-precision wafer pre-alignment mechanism according to claim 9, characterized in that: A suction cup lifting seat (414) is fixedly mounted on the top of the bottom plate (1) near the suction cup rotating motor connecting plate (411); a suction cup lifting screw rod (415) is movably mounted inside the suction cup lifting seat (414) via a bearing; a suction cup lifting screw rod block (416) is mounted on the outside of the suction cup lifting screw rod (415) via a threaded engagement; a suction cup limiting plate (417) is fixedly connected to one side of the suction cup limiting plate (417); a side of the suction cup rotating motor connecting plate (411) near the suction cup rotating motor connecting plate (411) is fixedly connected to the suction cup rotating motor connecting plate (411); a suction cup lifting motor (418) is mounted on the top of the suction cup lifting seat (414) via a fixed seat; an output end of the suction cup lifting motor (418) is connected to the shaft of the suction cup lifting screw rod (415) via a coupling.

Images