Detection substrate and screening device and method for light-emitting chips

Abstract

The invention discloses a detection substrate and a screening device and method for light-emitting chips, the detection substrate is used for detecting the light-emitting chips, and the detection substrate comprises: a substrate; the detection units are arranged on the substrate, each detection unit corresponds to one light-emitting device and comprises a first detection electrode and a second detection electrode, the first detection electrode is used for being electrically connected with the first electrode of the light-emitting chip, and the second detection electrode is used for being electrically connected with the second electrode of the light-emitting chip; and the detection circuit layer is arranged on the substrate, is electrically connected with the detection unit, and is used for providing a first detection signal for the first detection electrode and providing a second detection signal for the second detection electrode.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and particularly to a detection substrate, a screening device for light-emitting chips, and a screening method for light-emitting chips. Background Art

[0002] Micro-inorganic light-emitting diodes include MiniLED and MicroLED. MiniLED refers to a light-emitting diode (LED) chip with a grain size of about 100-300 micrometers. MicroLED refers to a light-emitting diode chip with a grain size of less than 100 micrometers. The MiniLED / MicroLED display device has the advantages of low power consumption, high brightness, high resolution, high color saturation, fast response speed, long lifespan, and high efficiency.

[0003] The size of micro-inorganic light-emitting diodes is extremely small, and the number of them distributed on the entire substrate is large. There is currently no mature mass electrical detection technology. Summary of the Invention

[0004] The present disclosure provides a detection substrate for detecting light-emitting chips, and the detection substrate includes:

[0005] A substrate;

[0006] A plurality of detection units disposed on the substrate, each detection unit corresponding to one of the light-emitting devices and including a first detection electrode and a second detection electrode. The first detection electrode is used to electrically connect to the first electrode of the light-emitting chip, and the second detection electrode is used to electrically connect to the second electrode of the light-emitting chip;

[0007] A detection circuit layer disposed on the substrate, the detection circuit layer being electrically connected to the detection unit and used to provide a first detection signal to the first detection electrode and a second detection signal to the second detection electrode.

[0008] In some embodiments, a conductive layer is disposed on the side of the first detection electrode away from the detection substrate and on the side of the second detection electrode away from the detection substrate, and at least a part of the conductive layer away from the substrate can be transformed from a solid state to a molten state under preset conditions.

[0009] In some embodiments, the detection substrate further includes: a functional layer disposed on the substrate, wherein the distance between the surface of the first detection electrode away from the substrate and the substrate, and the distance between the surface of the second detection electrode away from the substrate and the substrate are both less than the distance between the surface of the functional layer away from the substrate and the substrate.

[0010] In some embodiments, the functional layer is an integral membrane layer and has a first accommodating portion and a second accommodating portion;

[0011] The first detection electrode is located in the first accommodating portion, and the second detection electrode is located in the second accommodating portion.

[0012] In some embodiments, the functional layer includes a plurality of support columns arranged at intervals from each other.

[0013] In some embodiments, the detection substrate includes a detection area, and at least one detection group is provided in the detection area. The detection group includes a plurality of the detection units arranged in an array;

[0014] The detection circuit layer includes a plurality of first detection lines and a plurality of second detection lines. The first detection electrodes of the detection units in the same column in the same detection group are electrically connected to one of the first detection lines, and the second detection electrodes of the detection units in the same column in the same detection group are electrically connected to one of the second detection lines.

[0015] In some embodiments, the detection circuit layer further includes at least one first power supply line and at least one second power supply line. The plurality of first detection lines connected to the same detection group are electrically connected to one of the first power supply lines, and the plurality of second detection lines connected to the same detection group are electrically connected to one of the second power supply lines.

[0016] In some embodiments, the first detection electrode and the second detection electrode in the detection unit are arranged along the row direction;

[0017] The first power supply line and the second power supply line are respectively located on opposite sides of the detection group and extend along the row direction, and the first detection line and the second detection line extend along the column direction.

[0018] In some embodiments, at least two detection groups are provided in the detection area, and each detection unit is adjacent to the detection units of at least one other detection group; the first detection electrodes in different detection groups are connected to different first detection lines, and the second detection electrodes in different detection groups are connected to different second detection lines.

[0019] In some embodiments, at least two of the detection groups in the detection area include a first detection group and a second detection group. The detection units located in the same row belong to the same detection group; among the plurality of detection units located in the same column, the detection units of the first detection group and the detection units of the second detection group are arranged alternately;

[0020] Among them, the first detection line corresponding to the first detection group and the first detection line corresponding to the second detection group are located in different conductive layers, and the second detection line corresponding to the first detection group and the second detection line corresponding to the second detection group are located in different conductive layers.

[0021] In some embodiments, the detection substrate further includes an insulating layer, and the insulating layer is located on the side of the detection circuit layer away from the substrate; the detection unit is located on the side of the insulating layer away from the substrate, the first detection electrode is electrically connected to the corresponding first detection line through a first via hole penetrating the insulating layer, and the second detection electrode is electrically connected to the corresponding second detection line through a second via hole penetrating the insulating layer;

[0022] Among them, the first detection line corresponding to the first detection group includes a connected first extension part and a first avoidance part, the first extension part extends along the column direction and is electrically connected to the first detection electrode in the first detection group; the first avoidance part is used to avoid the first via hole corresponding to the first detection electrode in the second detection group;

[0023] The second detection line corresponding to the first detection group includes a connected second extension part and a second avoidance part, the second extension part extends along the column direction and is electrically connected to the second detection electrode in the first detection group; the second avoidance part is used to avoid the second via hole corresponding to the second detection electrode in the second detection group.

[0024] In some embodiments, the detection circuit layer further includes a first connection line and a second connection line, the first connection line intersects with the extending direction of the first detection line, and the second connection line intersects with the extending direction of the second connection line;

[0025] The first detection electrode in the first detection group is electrically connected to the corresponding first detection line through the first connection line, and the second detection electrode in the first detection group is electrically connected to the corresponding second detection line through the second connection line.

[0026] The present disclosure also provides a screening device for light-emitting chips, including:

[0027] A first carrier table;

[0028] A temporary substrate, disposed on the first carrier table, and the temporary substrate is configured to carry the light-emitting chips to be detected;

[0029] A second carrier table, configured to carry the detection substrate as described above;

[0030] A driving unit configured to drive at least one of the first carrier and the second carrier to move, so that the first detection electrode is electrically connected to the first electrode of the corresponding light-emitting chip, and the second detection electrode is electrically connected to the second electrode of the corresponding light-emitting chip;

[0031] A power supply unit configured to be electrically connected to the detection circuit layer to provide a first detection signal for the first detection electrode and a second detection signal for the second detection electrode through the detection circuit layer;

[0032] A light-emitting state acquisition unit configured to detect the light-emitting state of the light-emitting chip.

[0033] In some embodiments, the screening device further includes: a marking unit configured to mark the faulty light-emitting chips;

[0034] Alternatively, a conductive layer is provided on a side of the first detection electrode away from the detection substrate and on a side of the second detection electrode away from the detection substrate; there is an adhesive layer between the light-emitting chip and the temporary substrate;

[0035] The detection device further includes: a removal unit, a light source, and a separation unit. The removal unit is configured to provide a preset condition to the conductive layer corresponding to the faulty light-emitting chip, so that the conductive layer is converted from a solid state to a molten state, and bond the light-emitting chip to the detection unit;

[0036] The light source is configured to emit a target light to the adhesive layer between the faulty light-emitting chip and the temporary substrate, and the adhesive layer can be de-bonded or dissociated under the irradiation of the target light;

[0037] The separation unit is configured to drive the first carrier plate and the second carrier plate to move away from each other.

[0038] In some embodiments, the detection device further includes a removal unit, and the removal unit is specifically configured to emit infrared light to the conductive layer corresponding to the faulty light-emitting chip, so that the conductive layer is heated and melted.

[0039] In some embodiments, the temporary substrate includes a to-be-detected area, and a plurality of the light-emitting chips are arranged in the to-be-detected area. Each of the light-emitting chips in the to-be-detected area corresponds to a detection unit, and different light-emitting chips correspond to different detection units; moreover, the plurality of light-emitting chips in the to-be-detected area can be electrically connected to their respective corresponding detection units simultaneously.

[0040] In some embodiments, the temporary substrate includes a to-be-detected area, and a plurality of the light-emitting chips arranged in an array are provided in the to-be-detected area;

[0041] The detection substrate includes at least one detection area, and at least one detection group is arranged in the detection area; each detection group includes a plurality of the detection units arranged in an array; the light-emitting chips in the area to be detected are used to connect the detection units in the detection group;

[0042] Wherein, the distance between two adjacent detection units arranged in the row direction in the same detection group is N times the distance between two adjacent light-emitting units arranged in the row direction in the area to be detected; and / or,

[0043] The distance between two adjacent detection units arranged in the column direction in the same detection group is M times the distance between two adjacent light-emitting units arranged in the column direction in the area to be detected;

[0044] Wherein, both N and M are integers greater than 1.

[0045] In some embodiments, the light-emitting chip is configured to emit light towards the temporary substrate, and the temporary substrate is made of a transparent material;

[0046] The light-emitting state acquisition unit includes a light-collecting sub-unit, which is configured to collect the light of the light-emitting chip from the side of the substrate away from the light-emitting chip.

[0047] In some embodiments, the detection substrate further includes a plurality of first alignment marks arranged on the substrate;

[0048] The temporary substrate is further provided with second alignment marks;

[0049] At least one of the temporary substrate and the substrate is light-transmissive;

[0050] The detection device further includes: an alignment unit, which is configured to determine a target position according to the positions of the plurality of first alignment marks and detect whether the second alignment marks are in the target position.

[0051] The present disclosure also provides a screening method for light-emitting chips, and the light-emitting chips include a first electrode and a second electrode; the screening method includes:

[0052] Providing a temporary substrate carrying a plurality of the light-emitting chips and the above-mentioned detection substrate;

[0053] Performing a screening step, and the screening step includes:

[0054] Oppositely arranging the temporary substrate and the detection substrate, and electrically connecting the first electrode of the light-emitting chip to the first detection electrode of the detection unit, and the second electrode of the light-emitting chip to the second detection electrode of the detection unit;

[0055] Provide a first detection signal to the first detection electrode and a second detection signal to the second detection electrode through the detection circuit layer;

[0056] Detect the light-emitting state of the light-emitting chip, and determine whether the light-emitting chip is faulty according to the light-emitting state of the light-emitting chip.

[0057] In some embodiments, the screening method further includes:

[0058] When a faulty light-emitting chip is detected, mark the faulty light-emitting chip; or,

[0059] When a faulty light-emitting chip is detected, emit a target light beam to the glue layer between the faulty light-emitting chip and the substrate, so that the glue layer becomes less sticky or dissociates, and the faulty light-emitting chip is connected to the detection substrate;

[0060] Control the detection substrate and the light-emitting substrate to move away from each other, so that the faulty light-emitting chip detaches from the substrate.

[0061] In some embodiments, a conductive layer is provided on the side of the first detection electrode away from the detection substrate and on the side of the second detection electrode away from the detection substrate;

[0062] Wherein, when a faulty light-emitting chip is detected, the faulty light-emitting chip is welded or bonded to its corresponding conductive layer.

[0063] In some embodiments, the screening method includes at least one screening step;

[0064] In each screening step, the step of providing a first detection signal to the first detection electrode and a second detection signal to the second detection electrode through the detection circuit layer includes: providing a first detection signal to a plurality of first detection electrodes in a detection group through a plurality of first detection lines, and simultaneously providing a second detection signal to a plurality of second detection electrodes in a detection group through a plurality of second detection lines;

[0065] When there are multiple screening steps, in different screening steps, provide a first detection signal and a second detection signal to the detection units in different detection groups.

[0066] In some embodiments, the temporary substrate includes a to-be-detected area in which a plurality of the light-emitting chips are arranged in an array; the detection substrate includes at least one detection area in which at least one detection group is arranged; each detection group includes a plurality of the detection units arranged in an array; the light-emitting chips in the to-be-detected area are used to connect to the detection units in the detection group;

[0067] Among them, the distance between two adjacent detection units arranged in the row direction in the same detection group is N times the distance between two adjacent light-emitting units arranged in the row direction in the area to be detected; and / or,

[0068] the distance between two adjacent detection units arranged in the column direction in the same detection group is M times the distance between two adjacent light-emitting units arranged in the column direction in the area to be detected;

[0069] wherein both N and M are integers greater than 1;

[0070] Among them, the screening method includes multiple screening steps; in each screening step, during the process of relatively disposing the temporary substrate and the detection substrate, each first detection electrode in the detection area is electrically connected to a first electrode of one of the light-emitting chips, and each second detection electrode is electrically connected to a second electrode of one of the light-emitting chips; and, the first detection electrode is connected to different first electrodes in different screening steps, and the second detection electrode is connected to different second electrodes in different screening steps. Description of the Drawings

[0071] The drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification, and are used to explain the present disclosure together with the following specific embodiments, but do not constitute a limitation to the present disclosure. In the drawings:

[0072] Figure 1 is a plan view of a detection circuit layer in a detection substrate provided in some embodiments of the present disclosure.

[0073] Figure 2 is Figure 1 a plan view of the detection circuit layer and vias in

[0074] Figure 3 is a plan view of the overall detection substrate provided in some embodiments of the present disclosure.

[0075] Figure 4 is a cross-sectional view along the Figure 3 A-A' line in

[0076] Figure 5 is a schematic diagram of detecting a light-emitting chip by using the detection substrate shown in Figure 4

[0077] Figure 6 is a cross-sectional view of a detection substrate provided in some other embodiments of the present disclosure.

[0078] Figure 7 is a cross-sectional view of a detection substrate provided in some other embodiments of the present disclosure.

[0079] ​Figure 8 A cross-sectional view of a detection substrate provided in some other embodiments of the present disclosure.

[0080] Figure 9 A plan view of a detection circuit layer in a detection substrate provided in some other embodiments of the present disclosure.

[0081] Figure 10 is Figure 9 A plan view of the detection circuit layer and vias in

[0082] Figure 11 A plan view of the overall detection substrate provided in some other embodiments of the present disclosure.

[0083] Figure 12 is a cross-sectional view along the Figure 11 B-B' line in

[0084] Figure 13 is a cross-sectional view along the Figure 11 C-C' line in

[0085] Figure 14 A plan view of a detection circuit layer in a detection substrate provided in some other embodiments of the present disclosure.

[0086] Figure 15 is Figure 14 A plan view of the detection circuit layer and vias in

[0087] Figure 16 A plan view of the overall detection substrate provided in some other embodiments of the present disclosure.

[0088] Figure 17 A plan view of a detection circuit layer in a detection substrate provided in some other embodiments of the present disclosure.

[0089] Figure 18 A plan view of the overall detection substrate provided in some other embodiments of the present disclosure.

[0090] Figure 19 A schematic diagram of screening by a screening device for light-emitting chips provided in some embodiments of the present disclosure.

[0091] Figure 20 A schematic diagram of detecting a light-emitting device by a detection substrate provided in some other embodiments of the present disclosure.

[0092] Figure 21 A schematic diagram of a screening method for light-emitting chips provided in some embodiments of the present disclosure. Detailed implementation manners

[0093] The following will describe in detail the specific embodiments of the present disclosure with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for explaining and understanding the present disclosure, and are not used to limit the present disclosure.

[0094] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0095] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure shall have the ordinary meaning as understood by those of ordinary skill in the art belonging to the field of the present disclosure. The "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are only used to distinguish different components. Similarly, words such as "include" or "comprise" mean that the elements or items appearing before the word cover the elements or items listed after the word and their equivalents, without excluding other elements or items. "Connection" or "coupling" and similar terms are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0096] As used herein, "parallel" and "perpendicular" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, and the acceptable deviation range for approximate parallelism can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, and the acceptable deviation range for approximate perpendicularity can also be, for example, within 5° deviation.

[0097] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can be that the layer or element is directly on the other layer or substrate, or there may be an intermediate layer between the layer or element and the other layer or substrate.

[0098] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions is exaggerated for clarity. Thus, variations in the shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Accordingly, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but include shape deviations resulting from, for example, manufacturing. For example, an etched region shown as rectangular will generally have curved features. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to depict the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0099] Figure 1 This is a plan view of a detection circuit layer in a detection substrate provided in some embodiments of the present disclosure. Figure 2 is Figure 1 a plan view of the detection circuit layer and vias in Figure 3 This is an overall plan view of a detection substrate provided in some embodiments of the present disclosure. Figure 4 is a cross-sectional view along the Figure 3 A-A' line in Figure 5 This is a schematic diagram of using the Figure 4 detection substrate shown to detect a light-emitting chip. As shown in Figures 1 to 5 , the detection substrate includes: a substrate 10, and a plurality of detection units 30 and a detection circuit layer 20 disposed on the substrate 10. Among them, each detection unit 30 corresponds to a light-emitting device, and includes a first detection electrode 31 and a second detection electrode 32. The first detection electrode 31 is used to electrically connect to the first electrode 721 of the light-emitting chip 72, and the second detection electrode 32 is used to electrically connect to the second electrode 722 of the light-emitting chip 72.

[0100] The detection circuit layer 20 is electrically connected to the detection unit 30, and is used to provide a first detection signal for the first detection electrode 31 and a second detection signal for the second detection electrode 32.

[0101] The detection substrate in the embodiments of the present disclosure can be used in the screening process of the light-emitting chip 72. Through this screening process, it is at least possible to determine whether the light-emitting chip 72 is faulty. When using the detection substrate for the screening process of the light-emitting chip 72, the temporary substrate 71 provided with a plurality of light-emitting chips 72 can be disposed opposite to the detection substrate, and the first electrode 721 of the light-emitting chip 72 is brought into contact with the first detection electrode 31, and the second electrode 722 of the light-emitting chip 72 is brought into contact with the second detection electrode 32. A first detection signal is provided to the first detection electrode 31 through the detection circuit layer 20, a second detection signal is provided to the second detection electrode 32 through the detection circuit layer 20, and it is detected whether the light-emitting chip 72 emits light normally. If it emits light normally, it indicates that the light-emitting chip 72 is normal. If it cannot emit light normally, it indicates that the light-emitting chip 72 is faulty. By using the detection substrate in the embodiments of the present disclosure, a large amount of detection of the light-emitting chip 72 can be achieved, thereby providing a guarantee for the mass production of the LED display substrate.

[0102] Figure 6 The cross-sectional view of the detection substrate provided in some other embodiments of the present disclosure is as Figure 6 shown. In some embodiments, a conductive layer 40 is provided on the side of the first detection electrode 31 away from the detection substrate and on the side of the second detection electrode 32 away from the detection substrate. At least a part of the conductive layer 40 away from the substrate 10 can be transformed from a solid state to a molten state under a preset condition. For example, the entire conductive layer 40 can be transformed from a solid state to a molten state under a preset condition, or a part of the conductive layer 40 away from the substrate 10 can be transformed from a solid state to a molten state under a preset condition.

[0103] After the faulty light-emitting chip 72 is screened out, a preset condition can be provided to the conductive layer 40 corresponding to the faulty light-emitting chip 72 to transform it into a molten state, so that the faulty light-emitting chip 72 is connected to the detection unit 30. At the same time, the connection between the light-emitting chip 72 and the temporary substrate 71 is controlled to be separated. After that, the temporary substrate 71 and the detection substrate are moved away from each other, so that the faulty light-emitting chip 72 can be removed from the temporary substrate 71.

[0104] In some examples, the preset condition is heating, for example, heating is performed by means of infrared light irradiation. The conductive layer 40 can be a low melting point material, such as tin (Sn), indium (In), etc., to facilitate the transformation of the conductive layer 40 from a solid state to a molten state.

[0105] Figure 7 The cross-sectional view of the detection substrate provided in some other embodiments of the present disclosure is as Figure 7As shown in the figure, the detection substrate further includes: a functional layer 50 disposed on the substrate 10, wherein the distance between the surface of the first detection electrode 31 away from the substrate 10 and the substrate 10, and the distance between the surface of the second detection electrode 32 away from the substrate 10 and the substrate 10 are both smaller than the distance between the surface of the functional layer 50 away from the substrate 10 and the substrate 10.

[0106] During the screening process of the light-emitting chip 72, when the temporary substrate 71 is disposed opposite to the detection substrate, the functional layer 50 can play a supporting role for the temporary substrate 71 to ensure the uniformity of the gap between the temporary substrate 71 and the substrate 10.

[0107] Among them, in some embodiments, the functional layer 50 includes a plurality of support columns 51 arranged at intervals. The plurality of support columns 51 are evenly distributed on the substrate 10, thereby improving the support stability for the temporary substrate 71.

[0108] Figure 8 The cross-sectional view of the detection substrate provided in other embodiments of the present disclosure is as follows. Figure 8 As shown in the figure, the detection substrate also includes a functional layer 50. Different from Figure 7 the above, in Figure 8 this embodiment, the functional layer 50 is an integral film layer and has a first accommodation portion SP1 and a second accommodation portion SP2; the first detection electrode 31 is located in the first accommodation portion SP1, and the second detection electrode 32 is located in the second accommodation portion SP2. In this case, when a conductive layer 40 is provided on the first detection electrode 31 and the second detection electrode 32 and the conductive layer 40 melts, the design of the first accommodation portion SP1 and the second accommodation portion SP2 can prevent the molten metal from overflowing. Among them, the first accommodation portion SP1 can have the same shape as the positive projection of the first detection electrode 31 on the substrate 10, and the positive projection area of the first accommodation portion SP1 can be slightly larger than the positive projection area of the first detection electrode 31; the second accommodation portion SP2 can have the same shape as the positive projection of the second detection electrode 32 on the substrate 10, and the positive projection area of the second accommodation portion SP2 can be slightly larger than the positive projection area of the second detection electrode 32.

[0109] As Figures 4 to 5 shown in the figure, the detection substrate further includes an insulating layer 61, and the insulating layer 61 is located on the side of the detection circuit layer 20 away from the substrate 10; the detection unit 30 is located on the side of the insulating layer 61 away from the substrate 10. The first detection electrode 31 is electrically connected to the corresponding detection circuit layer 20 through a first via V1 penetrating the insulating layer 61, and the second detection electrode 32 is electrically connected to the detection circuit layer 20 through a second via V2 penetrating the insulating layer 61. Among them, the insulating layer 61 can be made of materials such as silicon oxide, silicon nitride, and silicon oxynitride.

[0110] As Figure 3As shown, the detection substrate includes a detection area TA, and at least one detection group is provided in the detection area TA. The detection group includes a plurality of detection units 30 arranged in an array. The detection circuit layer 20 includes a plurality of first detection lines 21 and a plurality of second detection lines 22. The first detection electrodes 31 of the same column of detection units 30 in the same detection group are electrically connected to one first detection line 21, and the second detection electrodes 32 of the same column of detection units 30 in the same detection group are electrically connected to one second detection line 22, which is convenient for circuit connection and for providing detection signals to each detection unit 30.

[0111] Among them, Figure 3 Taking the detection area TA as an example for illustration. In practical applications, the number of detection areas TA can also be multiple. When the size of the detection substrate is large and the size of the temporary substrate 71 is small, only a partial number of detection areas TA can be used for detection. When the size of the temporary substrate 71 is large, all the detection areas TA can be used for detection.

[0112] Furthermore, the detection circuit layer 20 further includes at least one first power supply line 23 and at least one second power supply line 24. The plurality of first detection lines 21 connected to the same detection group are electrically connected to one first power supply line 23, and the plurality of second detection lines 22 connected to the same detection group are electrically connected to one second power supply line 24. When screening the light-emitting chips 72, a first detection signal and a second detection signal can be respectively provided to the first power supply line 23 and the second power supply line 24 corresponding to the same detection group, so that the detection units 30 in the same detection group can receive the first detection signal and the second detection signal simultaneously.

[0113] In one example, the first detection electrode 31 and the second detection electrode 32 in the same detection unit 30 are arranged along the row direction. The first power supply line 23 and the second power supply line 24 are respectively located on the opposite sides of the plurality of detection units 30 in the detection group and extend along the row direction, and the first detection lines 21 and the second detection lines 22 extend along the column direction. It should be noted that the first detection lines 21 and the second detection lines 22 extending along the column direction do not necessarily mean that the first detection lines 21 and the second detection lines 22 are straight lines, as long as the first detection lines 21 and the second detection lines 22 generally have a trend of extending along the column direction.

[0114] As Figure 3 As shown in, the detection area includes one detection group. The first power supply line 23 and the second power supply line 24 are located on the opposite sides of the detection group and extend along the row direction; the plurality of first detection lines 21 and the plurality of second detection lines 22 are alternately arranged along the row direction, and each first detection line 21 and second detection line 22 extends along the column direction.

[0115] Figure 9is a plan view of a detection circuit layer in a detection substrate provided in some other embodiments of the present disclosure, Figure 10 for Figure 9 The plan view of the detection circuit layer and vias in Figure 11 is an overall plan view of a detection substrate provided in some other embodiments of the present disclosure, Figure 12 For along Figure 11 The cross-sectional view of the line B-B', Figure 13 For along Figure 11 The cross-sectional view of the C-C' line is as follows: Figures 9 to 13 As shown, at least two detection groups are arranged in the detection area (such as Figure 11 In the embodiment of the present invention, the first detection group 301 and the second detection group 302 are connected to each other, each detection unit 30 is adjacent to the detection unit 30 of at least one other detection group; the first detection electrodes 31 in different detection groups are connected to different first detection lines 21, and the second detection electrodes 32 in different detection groups are connected to different second detection lines 22. In addition, the first detection electrodes 31 in different detection groups are electrically connected to different first power supply lines 23, and the second detection electrodes 32 in different detection groups are electrically connected to different second power supply lines 24.

[0116] use Figure 11 When the detection substrate is screening the light-emitting chips 72, it can provide driving signals for the detection units 30 of different detection groups in different screening steps, so that the light-emitting chips 72 corresponding to different detection groups are lit up in time. In this way, in each screening step, the distance between the illuminated light-emitting chips 72 is increased, which is conducive to identifying the lighting status and position of the light-emitting chips 72 and improving the accuracy of screening.

[0117] In one example, at least two detection groups in the detection area include a first detection group 301 and a second detection group 302, and the detection units 30 located in the same row belong to the same detection group; among the multiple detection units 30 located in the same column, the detection units 30 of the first detection group 301 and the detection units 30 of the second detection group 302 are arranged alternately. Among them, the first detection line 21 corresponding to the first detection group 301 and the first detection line 21 corresponding to the second detection group 302 are located in different routing layers, and the second detection line 22 corresponding to the first detection group 301 and the second detection line 22 corresponding to the second detection group 302 are located in different routing layers. Through this layered setting, the routing lines connected to the first detection group 301 can be spaced apart from the routing lines connected to the second detection group 302, so that the first detection group 301 and the second detection group 302 can be used to provide detection signals for different light-emitting chips 72 in a time-sharing manner. For example, Figure 12 and Figure 13As shown, the first detection lines 21 and the second detection lines 22 corresponding to the first detection group 301 are arranged on the same layer, and the first detection lines 21 and the second detection lines 22 corresponding to the second detection group 302 are arranged on the same layer. An interval layer 62 is provided between the layer where the first detection lines 21 and the second detection lines 22 corresponding to the first detection group 301 are located and the layer where the first detection lines 21 and the second detection lines 22 corresponding to the second detection group 302 are located.

[0118] As Figure 9 As shown, the first detection line 21 corresponding to the first detection group 301 includes a connected first extension portion 211 and a first avoidance portion 212. The first extension portion 211 extends along the column direction and is electrically connected to the first detection electrode 31 in the first detection group 301. The first avoidance portion 212 is used to avoid the first via V1 corresponding to the first detection electrode 31 in the second detection group 302, so as to prevent the first detection line 21 connected to the first detection group 301 from being short-circuited with the first detection electrode 31 in the second detection group 302. Similarly, the second detection line 22 corresponding to the first detection group 301 includes a connected second extension portion 221 and a second avoidance portion 222. The second extension portion 221 extends along the column direction and is electrically connected to the second detection electrode 32 in the first detection group 301. The second avoidance portion 222 is used to avoid the second via V2 corresponding to the second detection electrode 32 in the second detection group 302, so as to prevent the second detection line 22 connected to the first detection group 301 from being short-circuited with the second detection electrode 32 in the second detection group 302.

[0119] Among them, the present disclosure embodiment does not limit the shapes of the first avoidance portion 212 and the second avoidance portion 222. For example, the first avoidance portion 212 and the second avoidance portion 222 can be arc-shaped or polyline-shaped.

[0120] In some examples, the layer where the first detection line 21 and the second detection line 22 corresponding to the first detection group 301 are located is on the side of the layer where the first detection line 21 and the second detection line 22 corresponding to the second detection group 302 are located away from the substrate 10. The first detection line 21 and the second detection line 22 corresponding to the second detection group 302 are both straight lines extending along the column direction. In other examples, when there are other groups of detection lines on the side of the layer where the first detection line 21 and the second detection line 22 corresponding to the second detection group 302 are located close to the substrate 10, the first detection line 21 connected to the second detection group 302 can also be set to include a third extension portion and a third avoidance portion, and the second detection line 22 connected to the second detection group 302 can be set to include a fourth extension portion and a fourth avoidance portion.

[0121] Figure 14 This is a plan view of the detection line layer in the detection substrate provided in some other embodiments of the present disclosure. Figure 15 For Figure 14The plan view of the detection circuit layer and vias therein Figure 16 This is the overall plan view of the detection substrate provided in some other embodiments of the present disclosure. As Figures 14 to 16 shown, in some other embodiments, the detection circuit layer 20 further includes a first connection line 25 and a second connection line 26. The first connection line 25 intersects with the extending direction of the first detection line 21, and the second connection line 26 intersects with the extending direction of the second connection line 26. For example, both the first detection line 21 and the second detection line 22 extend along the column direction, and both the first connection line 25 and the second connection line 26 extend along the row direction.

[0122] The first detection electrode 31 in the first detection group 301 is electrically connected to the corresponding first detection line 21 through the first connection line 25, and the second detection electrode 32 in the first detection group 301 is electrically connected to the corresponding second detection line 22 through the second connection line 26. The orthographic projection of the first detection line 21 corresponding to the first detection group 301 on the substrate 10 has no overlap with the orthographic projections of the first via V1 and the second via V2 corresponding to the second detection group 302 on the substrate 10; the orthographic projection of the second detection line 22 corresponding to the first detection group 301 on the substrate 10 has no overlap with the orthographic projections of the first via V1 and the second via V2 corresponding to the second detection group 302 on the substrate 10.

[0123] By providing the first connection line 25 and the second connection line 26, it is possible to prevent the first detection line 21 and the second detection line 22 corresponding to the first detection group 301 from being short-circuited with the second detection group 302.

[0124] Among them, the first detection line 21 and the second detection line 22 corresponding to the second detection group 302 can be Figure 14 the straight lines shown in, and the orthographic projection of the first detection electrode 31 in the second detection group 302 on the substrate 10 overlaps with the first detection line 21, and the orthographic projection of the second detection electrode 32 in the second detection group 302 on the substrate 10 overlaps with the second detection line 22. Of course, multiple third connection lines and multiple fourth connection lines can also be provided, and the first detection electrode 31 in the second detection group 302 is electrically connected to the corresponding first detection line 21 through the third connection line, and the second detection electrode 32 in the second detection group 302 is electrically connected to the corresponding second detection line 22 through the fourth connection line.

[0125] Figure 17 This is the plan view of the detection circuit layer in the detection substrate provided in some other embodiments of the present disclosure. Figure 18 This is the overall plan view of the detection substrate provided in some other embodiments of the present disclosure. As Figure 17 and Figure 18 shown, in Figures 17 to 18In it, a first detection group 301 and a second detection group 302 are also arranged in the detection area, and the detection units 30 in the same column are in the same detection group. Among the multiple detection units 30 in the same row, the detection units 30 in the first detection group 301 and the detection units 30 in the second detection group 302 are arranged alternately. For example, the detection units 30 in the first detection group 301 and the detection units 30 in the second detection group 302 can be alternately arranged one by one, or alternately arranged two by two, etc. Among them, the first detection line 21 corresponding to the first detection group 301 and the first detection line 21 corresponding to the second detection group 302 are in different conductive layers, and the second detection line 22 corresponding to the first detection group 301 and the second detection line 22 corresponding to the second detection group 302 are in different conductive layers. In this case, both the first detection line 21 and the second detection line 22 can be set as straight lines extending along the column direction without designing Figure 9 the avoidance structures (i.e., the first avoidance portion 211 and the second avoidance portion 212) in

[0126] Figure 19 is a schematic diagram of screening by the screening device for light-emitting chips provided in some embodiments of the present disclosure. As Figure 19 shown, the screening device includes: a first carrier 91, a temporary substrate 71, a second carrier 92, a driving unit 93, a power supply unit 94, and a light-emitting state acquisition unit 95.

[0127] Among them, the temporary substrate 71 is arranged on the first carrier 91, and the temporary substrate 71 is configured to carry the light-emitting chips 72 to be detected. Among them, the temporary substrate 71 can be detachably connected to the first carrier 91 through fasteners.

[0128] The second carrier 92 is arranged opposite to the first carrier 91, and the second carrier 92 is configured to carry the detection substrate in the above embodiments.

[0129] The driving unit 93 is configured to drive at least one of the first carrier 91 and the second carrier 92 to move, so that the first detection electrode 31 is electrically connected to the first electrode 721 of the corresponding light-emitting chip 72, and the second detection electrode 32 is electrically connected to the second electrode 722 of the corresponding light-emitting chip 72.

[0130] The power supply unit 94 is configured to be electrically connected to the detection circuit layer 20 to provide a first detection signal for the first detection electrode 31 and a second detection signal for the second detection electrode 32 through the detection circuit layer 20.

[0131] The light-emitting state acquisition unit 95 is configured to detect the light-emitting state of the light-emitting chip 72.

[0132] The screening device in the embodiments of the present disclosure can be used for the screening process of a large number of light-emitting chips 72 to at least determine whether the light-emitting chips 72 are faulty. During the screening process, the light-emitting chips 72 to be detected are arranged on a temporary substrate 71, and the temporary substrate 71 is fixed on a first carrier 91; the driving unit 93 drives the first carrier 91 and the second carrier 92 to approach each other, so that the first detection electrode 31 is electrically connected to the first electrode 721 of the corresponding light-emitting chip 72, and the second detection electrode 32 is electrically connected to the second electrode 722 of the corresponding light-emitting chip 72. Then, the power supply unit 94 is used to provide a first detection signal for the first detection electrode 31 and a second detection signal for the second detection electrode 32 through the detection circuit layer 20, so as to drive the light-emitting chip 72 to emit light; the light-emitting state acquisition unit 95 detects the light-emitting state of the light-emitting chip 72, so as to determine whether the light-emitting chip 72 is faulty.

[0133] In some embodiments, the light-emitting chip 72 is configured to emit light toward the temporary substrate 71, and the temporary substrate 71 is made of a transparent material; the light-emitting state acquisition unit 95 includes a light-gathering sub-unit, which is configured to collect the light of the light-emitting chip 72 from the side of the substrate 10 away from the light-emitting chip 72, so as to detect the light-emitting state of the light-emitting chip 72.

[0134] In some embodiments, the screening device may further include: a marking unit (not shown), and the marking unit is configured to mark the faulty light-emitting chips 72. Among them, marking the faulty light-emitting chips 72 specifically may refer to recording the positions of the faulty light-emitting chips 72.

[0135] In some embodiments, as described above, a conductive layer 40 is provided on the side of the first detection electrode 31 away from the detection substrate and on the side of the second detection electrode 32 away from the detection substrate. There is an adhesive layer between the light-emitting chip 72 and the temporary substrate 71. In this case, the detection device may further include: a removing unit (not shown), a light source (not shown), and a separating unit (not shown), wherein the removing unit is configured to provide preset conditions to the conductive layer corresponding to the faulty light-emitting chip 72, so that the conductive layer 40 is converted from a solid state to a molten state, and the light-emitting chip 72 is bonded to the detection unit 30. The light source is configured to emit target light to the adhesive layer between the faulty light-emitting chip 72 and the temporary substrate 71, and the adhesive layer can be de-bonded or dissociated under the irradiation of the target light. The separating unit is configured to drive the first carrier plate and the second carrier plate to move away from each other. Among them, the separating unit and the driving unit 93 can be integrated into one body.

[0136] In one example, the removal unit is specifically configured to emit infrared light toward the faulty light-emitting chip 72 to heat and melt the conductive layer 40. For example, the first carrier 91 is a transparent structure, and the removal unit emits infrared light toward the faulty light-emitting chip 72 from the side of the first carrier 91 away from the second carrier 92, so that the first electrode 721 and the second electrode 722 of the faulty light-emitting chip 72 are heated, and the heat is conducted to the conductive layer 40 to heat and melt the conductive layer 40. For another example, the removal unit may emit infrared light toward the conductive layer 40 corresponding to the faulty light-emitting chip 72 from the gap between the first carrier 91 and the second carrier 92.

[0137] When it is detected that there is a faulty light-emitting chip 72, the conductive layer 40 corresponding to the faulty light-emitting chip 72 can be melted, so that the faulty light-emitting chip 72 is connected to the detection substrate, and a target light is emitted to the adhesive layer between the faulty light-emitting chip 72 and the temporary substrate 71 by using a light source to reduce the adhesion or dissociate the adhesive layer. Then, the separation unit is used to drive the first carrier 91 and the second carrier 92 to move away from each other, so as to remove the faulty light-emitting chip 72 from the temporary substrate 71.

[0138] It should be noted that, in the embodiments of the present disclosure, the screening device may include the above-mentioned marking unit without including the removal unit and the light source; it may also include the removal unit and the light source without including the marking unit; or it may include the removal unit, the light source and the marking unit at the same time.

[0139] In some embodiments, the temporary substrate 71 includes a to-be-detected area, in which a plurality of light-emitting chips 72 are arranged. Each light-emitting chip 72 in the to-be-detected area corresponds to a detection unit 30, and different light-emitting chips 72 correspond to different detection units 30; moreover, the plurality of light-emitting chips 72 in the to-be-detected area can be electrically connected to their respective corresponding detection units 30 at the same time.

[0140] In this case, when a detection group is arranged in the detection area TA of the detection substrate, detection signals can be provided for the detection units 30 in the detection group at the same time, so as to drive the plurality of light-emitting chips 72 in the to-be-detected area to emit light at the same time. When the detection substrate includes a plurality of detection groups, detection signals can be provided for the detection units 30 of the plurality of detection groups in a time-sharing manner, so as to drive the light-emitting chips 72 corresponding to different detection groups to emit light in a time-sharing manner.

[0141] Among them, the temporary substrate 71 may include one or more to-be-detected areas. When the size of the temporary substrate 71 is large while the size of the detection substrate is small, the temporary substrate 71 can be divided into a plurality of to-be-detected areas, and the detection substrate is used to detect the plurality of to-be-detected areas separately.

[0142] In some other embodiments, a plurality of light-emitting chips 72 arranged in an array are provided in the area to be detected of the temporary substrate 71, at least one detection group is provided in the detection area of the detection substrate, and each detection group includes a plurality of detection units 30 arranged in an array; the light-emitting chips 72 in the area to be detected are used to connect the detection units 30 in the detection group.

[0143] Figure 20 FIG. is a schematic diagram of detecting a light-emitting device by a detection substrate provided in some other embodiments of the present disclosure. As Figure 20 shown, the distance between two adjacent detection units 30 arranged in the row direction in the same detection group is N times the distance between two adjacent light-emitting units arranged in the row direction in the area to be detected; and / or, the distance between two adjacent detection units 30 arranged in the column direction in the same detection group is M times the distance between two adjacent light-emitting units arranged in the column direction in the area to be detected; where N and M are both integers greater than 1.

[0144] In this case, the screening process of the light-emitting chips 72 may include multiple screening steps. In the i-th screening step, each first detection electrode 31 in the detection area is electrically connected to a first electrode 721 of a light-emitting chip 72, and each second detection electrode 32 is electrically connected to a second electrode 722 of a light-emitting chip 72. Then, a first detection signal and a second detection signal are respectively provided to the first detection electrode 31 and the second detection electrode 32 in the detection area, and the light-emitting state of the light-emitting chip 72 is detected. Then, the (i + 1)-th screening step is performed, and the first detection electrode 31 is connected to different first electrodes 721 in different screening steps, and the second detection electrode 32 is connected to different second electrodes 722 in different screening steps. i is an integer greater than 0.

[0145] In other words, the multiple light-emitting chips 72 in the area to be detected can be divided into multiple light-emitting groups, and in each screening step, the light-emitting chips 72 in one light-emitting group are connected to the detection units 30 in the detection area in one-to-one correspondence, and the light-emitting state of the light-emitting chips 72 in the light-emitting group is detected; in different screening steps, the light-emitting chips 72 in different light-emitting groups are connected to the detection units 30 in correspondence.

[0146] In this case, in each screening step, the distance between the light-emitting chips 72 receiving the detection signals is relatively large, so that the recognition accuracy of the light-emitting state of the light-emitting chips 72 can be improved.

[0147] In some embodiments, such as Figures 1 to 3 , Figures 9 to 11As shown, the detection substrate further includes a plurality of first alignment marks M1 disposed on the substrate 10. The temporary substrate 71 is also provided with second alignment marks (not shown). At least one of the temporary substrate 71 and the substrate 10 is light-transmissive; the detection device further includes: an alignment unit configured to determine a target position according to the positions of the plurality of first alignment marks M1 and detect whether the second alignment marks are in the target position, so that it is possible to judge whether the temporary substrate 71 and the detection substrate are successfully aligned according to the alignment situation between the second alignment marks and the target position.

[0148] For example, the substrate 10 is rectangular, and first alignment marks M1 are provided at each corner of the rectangle. The first alignment marks M1 can be in the shapes of a cross, a star, a circle, a square, etc.

[0149] Figure 21 Schematic diagram of the screening method of the light-emitting chip provided in some embodiments of the present disclosure, see Figure 5 、 Figure 21 As shown, the light-emitting chip 72 includes a first electrode 721 and a second electrode 722. The screening method of the light-emitting chip 72 includes:

[0150] S10. Provide a temporary substrate 71 carrying a plurality of light-emitting chips 72 and the detection substrate in the above embodiments.

[0151] S20. Perform a screening step, and the screening step includes the following steps S21 to S23:

[0152] S21. Oppositely arrange the temporary substrate 71 and the detection substrate, and electrically connect the first electrode 721 of the light-emitting chip 72 to the first detection electrode 31 of the detection unit 30, and electrically connect the second electrode 722 of the light-emitting chip 72 to the second detection electrode 32 of the detection unit 30.

[0153] S22. Provide a first detection signal for the first detection electrode 31 and a second detection signal for the second detection electrode 32 through the detection circuit layer 20.

[0154] S23. Detect the light-emitting state of the light-emitting chip 72 and judge whether the light-emitting chip 72 is faulty according to the light-emitting state of the light-emitting chip 72.

[0155] In some embodiments, when a faulty light-emitting chip 72 is detected, the screening method of the light-emitting chip 72 further includes step S30 or further includes steps S41 to S42:

[0156] S30. Mark the light-emitting chip 72 with a light-emitting fault.

[0157] S41. Emit target light rays to the glue layer between the malfunctioning light-emitting chip 72 and the substrate 10, so as to reduce the adhesion or dissociate the glue layer, and connect the malfunctioning light-emitting chip 72 to the detection substrate.

[0158] In some examples, conductive layers are provided on the side of the first detection electrode 31 away from the detection substrate and the side of the second detection electrode 32 away from the detection substrate. Among them, when a malfunctioning light-emitting chip 72 is detected, the malfunctioning light-emitting chip 72 is welded or bonded to the corresponding conductive layer. For example, infrared light is emitted to the conductive layer corresponding to the malfunctioning light-emitting chip 72 to melt the conductive layer.

[0159] S42. Control the detection substrate and the light-emitting substrate 10 to move away from each other, so that the malfunctioning light-emitting chip 72 is separated from the substrate 10.

[0160] In some embodiments, at least one detection group is provided in the detection area of the detection substrate. Among them, the screening method includes at least one screening step. In each screening step, the steps of providing a first detection signal to the first detection electrode 31 and a second detection signal to the second detection electrode 32 through the detection circuit layer 20 include: providing a first detection signal to multiple first detection electrodes 31 in a detection group through multiple first detection lines 21, and simultaneously providing a second detection signal to multiple second detection electrodes 32 in a detection group through multiple second detection lines 22.

[0161] When multiple detection groups are provided in the detection area of the detection substrate (as shown in Figure 11 and Figure 16 ), there are multiple screening steps. In different screening steps, a first detection signal and a second detection signal are provided to the detection units 30 in different detection groups. Thus, in each screening step, detection signals are provided to some of the light-emitting chips 72, and further, the distance between the illuminated light-emitting chips 72 can be increased, which is beneficial to identifying the illumination status and position of the light-emitting chips 72 and improving the accuracy of screening.

[0162] In some other embodiments, the detection substrate adopts Figure 20The detection substrate shown in [description], wherein the screening method includes multiple screening steps; in each screening step, during the process of relatively disposing the temporary substrate 71 and the detection substrate, each first detection electrode 31 in the detection area is electrically connected to a first electrode 721 of a light-emitting chip 72, and each second detection electrode 32 is electrically connected to a second electrode 722 of a light-emitting chip 72; and, the first detection electrode 31 is connected to different first electrodes 721 in different screening steps, and the second detection electrode 32 is connected to different second electrodes 722 in different screening steps. In this case, in each screening step, a detection signal is provided for some of the light-emitting chips 72, so as to increase the distance between the lit light-emitting chips 72, which is beneficial to identifying the lighting condition and position of the light-emitting chips 72 and improving the accuracy of screening.

[0163] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the present disclosure.

Claims

1. A detection substrate for detecting a light-emitting chip, characterized in that, The detection substrate includes: a substrate; a plurality of detection units disposed on the substrate, each detection unit corresponding to one of the light-emitting devices and including a first detection electrode and a second detection electrode, the first detection electrode being used for electrically connecting to the first electrode of the light-emitting chip, and the second detection electrode being used for electrically connecting to the second electrode of the light-emitting chip; a detection circuit layer disposed on the substrate, the detection circuit layer being electrically connected to the detection units and used for providing a first detection signal to the first detection electrode and a second detection signal to the second detection electrode.

2. The detection substrate according to claim 1, characterized in that, A conductive layer is provided on a side of the first detection electrode away from the detection substrate and on a side of the second detection electrode away from the detection substrate, and at least a part of the conductive layer away from the substrate can be transformed from a solid state to a molten state under a preset condition.

3. The detection substrate according to claim 1, characterized in that, The detection substrate further includes: a functional layer disposed on the substrate, wherein the distance between the surface of the first detection electrode away from the substrate and the substrate, and the distance between the surface of the second detection electrode away from the substrate and the substrate are both smaller than the distance between the surface of the functional layer away from the substrate and the substrate.

4. The detection substrate according to claim 3, characterized in that, The functional layer is an integral film layer and has a first accommodation part and a second accommodation part; The first detection electrode is located in the first accommodation part, and the second detection electrode is located in the second accommodation part.

5. The detection substrate according to claim 3, characterized in that, The functional layer includes a plurality of support columns arranged at intervals.

6. The detection substrate according to any one of claims 1 to 5, characterized in that, The detection substrate includes a detection area, and at least one detection group is provided in the detection area, and the detection group includes a plurality of the detection units arranged in an array; The detection circuit layer includes a plurality of first detection lines and a plurality of second detection lines, and the first detection electrodes of the detection units in the same column of the same detection group are electrically connected to one of the first detection lines, and the second detection electrodes of the detection units in the same column of the same detection group are electrically connected to one of the second detection lines.

7. The detection substrate according to claim 6, characterized in that, The detection circuit layer further includes at least one first power supply line and at least one second power supply line, and the plurality of first detection lines connected to the same detection group are electrically connected to one of the first power supply lines, and the plurality of second detection lines connected to the same detection group are electrically connected to one of the second power supply lines.

8. The detection substrate according to claim 7, characterized in that, The first detection electrode and the second detection electrode in the detection unit are arranged in a row direction; The first power supply line and the second power supply line are respectively located on opposite sides of the detection group and extend in the row direction, and the first detection line and the second detection line extend in the column direction.

9. The detection substrate according to claim 6, characterized in that, At least two detection groups are provided in the detection area, and each detection unit is adjacent to the detection units of at least one other detection group; the first detection electrodes in different detection groups are connected to different first detection lines, and the second detection electrodes in different detection groups are connected to different second detection lines.

10. The detection substrate according to claim 9, characterized in that, At least two of the detection groups in the detection area include a first detection group and a second detection group, and the detection units located in the same row belong to the same detection group; among the multiple detection units located in the same column, the detection units of the first detection group and the detection units of the second detection group are arranged alternately; Wherein, the first detection line corresponding to the first detection group and the first detection line corresponding to the second detection group are located in different conductive layers, and the second detection line corresponding to the first detection group and the second detection line corresponding to the second detection group are located in different conductive layers.

11. The detection substrate according to claim 10, characterized in that, The detection substrate further includes an insulating layer, and the insulating layer is located on the side of the detection circuit layer away from the substrate; the detection unit is located on the side of the insulating layer away from the substrate, the first detection electrode is electrically connected to the corresponding first detection line through a first via hole penetrating the insulating layer, and the second detection electrode is electrically connected to the corresponding second detection line through a second via hole penetrating the insulating layer; Wherein, the first detection line corresponding to the first detection group includes a connected first extension part and a first avoidance part, the first extension part extends along the column direction and is electrically connected to the first detection electrode in the first detection group; the first avoidance part is used to avoid the first via hole corresponding to the first detection electrode in the second detection group; The second detection line corresponding to the first detection group includes a connected second extension part and a second avoidance part, the second extension part extends along the column direction and is electrically connected to the second detection electrode in the first detection group; the second avoidance part is used to avoid the second via hole corresponding to the second detection electrode in the second detection group.

12. The detection substrate according to claim 10, characterized in that, The detection circuit layer further includes a first connection line and a second connection line, the first connection line intersects with the extending direction of the first detection line, and the second connection line intersects with the extending direction of the second connection line; The first detection electrode in the first detection group is electrically connected to the corresponding first detection line through the first connection line, and the second detection electrode in the first detection group is electrically connected to the corresponding second detection line through the second connection line.

13. The detection substrate according to claim 9, characterized in that, At least two of the detection groups in the detection area include a first detection group and a second detection group, and the detection units located in the same column belong to the same detection group; among the multiple detection units located in the same row, the detection units of the first detection group and the detection units of the second detection group are arranged alternately; Wherein, the first detection line corresponding to the first detection group and the first detection line corresponding to the second detection group are located in different conductive layers, and the second detection line corresponding to the first detection group and the second detection line corresponding to the second detection group are located in different conductive layers.

14. A screening device for a light-emitting chip, characterized in that, Including: A first carrier; A temporary substrate disposed on the first carrier, the temporary substrate being configured to carry a light-emitting chip to be detected; A second carrier configured to carry the detection substrate according to any one of claims 1 to 13; A driving unit, configured to drive at least one of the first carrier stage and the second carrier stage to move, so that the first detection electrode is electrically connected to the first electrode of the corresponding light-emitting chip, and the second detection electrode is electrically connected to the second electrode of the corresponding light-emitting chip; A power supply unit, configured to be electrically connected to the detection circuit layer, so as to provide a first detection signal for the first detection electrode and a second detection signal for the second detection electrode through the detection circuit layer; A light-emitting state acquisition unit, configured to detect the light-emitting state of the light-emitting chip.

15. The screening device according to claim 14, wherein, The screening device further includes: a marking unit, configured to mark the light-emitting chips with faults; Alternatively, a conductive layer is provided on a side of the first detection electrode away from the detection substrate and on a side of the second detection electrode away from the detection substrate; there is an adhesive layer between the light-emitting chip and the temporary substrate; The detection device further includes: a removing unit, a light source, and a separating unit. The removing unit is configured to provide a preset condition to the conductive layer corresponding to the light-emitting chip with a fault, so that the conductive layer is converted from a solid state to a molten state, and the light-emitting chip is bonded to the detection unit; The light source is configured to emit target light to the adhesive layer between the light-emitting chip with a fault and the temporary substrate, and the adhesive layer can be de-bonded or dissociated under the irradiation of the target light; The separating unit is configured to drive the first carrier plate and the second carrier plate to move away from each other.

16. The screening device according to claim 15, wherein, The detection device further includes a removing unit, and the removing unit is specifically configured to emit infrared light to the conductive layer corresponding to the light-emitting chip with a fault, so that the conductive layer is heated and melted.

17. The screening device according to claim 14, wherein, The temporary substrate includes a to-be-detected area, and a plurality of the light-emitting chips are arranged in the to-be-detected area. Each of the light-emitting chips in the to-be-detected area corresponds to a detection unit, and different light-emitting chips correspond to different detection units; moreover, the plurality of light-emitting chips in the to-be-detected area can be electrically connected to their corresponding detection units simultaneously.

18. The screening device according to claim 14, wherein, The temporary substrate includes a to-be-detected area, and a plurality of the light-emitting chips arranged in an array are provided in the to-be-detected area; The detection substrate includes at least one detection area, and at least one detection group is provided in the detection area; each detection group includes a plurality of detection units arranged in an array; the light-emitting chips in the to-be-detected area are used to connect the detection units in the detection group; wherein, the distance between two adjacent detection units arranged in the row direction in the same detection group is N times the distance between two adjacent light-emitting units arranged in the row direction in the to-be-detected area; and / or, the distance between two adjacent detection units arranged in the column direction in the same detection group is M times the distance between two adjacent light-emitting units arranged in the column direction in the to-be-detected area; wherein, both N and M are integers greater than 1.

19. The screening device according to any one of claims 14 to 18, wherein, The light-emitting chip is configured to emit light toward the temporary substrate, and the temporary substrate is made of a transparent material; The light-emitting state acquisition unit includes a light collection sub-unit configured to collect light from the light-emitting chip on the side of the substrate away from the light-emitting chip.

20. The screening device according to any one of claims 14 to 18, wherein, The detection substrate further includes a plurality of first alignment marks provided on the substrate; The temporary substrate is further provided with second alignment marks; At least one of the temporary substrate and the substrate is light-transmissive; The detection device further includes: an alignment unit configured to determine a target position according to the positions of the plurality of first alignment marks and detect whether the second alignment marks are in the target position.

21. A screening method for a light-emitting chip, the light-emitting chip comprising a first electrode and a second electrode; wherein, The screening method includes: Providing a temporary substrate carrying a plurality of the light-emitting chips and the detection substrate according to any one of claims 1 to 13; Performing a screening step, the screening step including: Oppositely disposing the temporary substrate and the detection substrate, and electrically connecting the first electrode of the light-emitting chip to the first detection electrode of the detection unit and the second electrode of the light-emitting chip to the second detection electrode of the detection unit; Providing a first detection signal to the first detection electrode and a second detection signal to the second detection electrode through the detection circuit layer; Detecting the light-emitting state of the light-emitting chip and determining whether the light-emitting chip is faulty according to the light-emitting state of the light-emitting chip.

22. The screening method according to claim 21, wherein,The screening method further includes: When a faulty light-emitting chip is detected, marking the faulty light-emitting chip; or, When a faulty light-emitting chip is detected, emitting a target light to the adhesive layer between the faulty light-emitting chip and the substrate to reduce the adhesion or dissociation of the adhesive layer, and connecting the faulty light-emitting chip to the detection substrate; Controlling the detection substrate and the light-emitting substrate to move away from each other so that the faulty light-emitting chip detaches from the substrate.

23. The screening method according to claim 22, wherein, Conductive layers are provided on the sides of the first detection electrode and the second detection electrode away from the detection substrate; Wherein, when a faulty light-emitting chip is detected, the faulty light-emitting chip is welded or bonded to the corresponding conductive layer.

24. The screening method according to claim 21, wherein, When the detection substrate is the detection substrate according to any one of claims 6 to 13, the screening method includes at least one of the screening steps; In each of the screening steps, the step of providing a first detection signal to the first detection electrode and a second detection signal to the second detection electrode through the detection circuit layer includes: providing a first detection signal to a plurality of first detection electrodes in one detection group through a plurality of first detection lines, and simultaneously providing a second detection signal to a plurality of second detection electrodes in one detection group through a plurality of second detection lines; When there are multiple screening steps, in different screening steps, a first detection signal and a second detection signal are provided to the detection units in different detection groups.

25. The screening method according to claim 21, wherein, The temporary substrate includes a region to be detected, in which a plurality of the light-emitting chips are arranged in an array; the detection substrate includes at least one detection region, in which at least one detection group is arranged; each detection group includes a plurality of the detection units arranged in an array; the light-emitting chips in the region to be detected are used to connect the detection units in the detection group; wherein, the distance between two adjacent detection units arranged in the row direction in the same detection group is N times the distance between two adjacent light-emitting units arranged in the row direction in the region to be detected; and / or, the distance between two adjacent detection units arranged in the column direction in the same detection group is M times the distance between two adjacent light-emitting units arranged in the column direction in the region to be detected; wherein, both N and M are integers greater than 1; wherein, the screening method includes multiple screening steps; in each screening step, during the process of relatively arranging the temporary substrate and the detection substrate, each first detection electrode in the detection region is electrically connected to a first electrode of one of the light-emitting chips, and each second detection electrode is electrically connected to a second electrode of one of the light-emitting chips; and, the first detection electrode is connected to different first electrodes in different screening steps, and the second detection electrode is connected to different second electrodes in different screening steps.

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