Socket board, socket board assembly, device testing apparatus, and method for manufacturing socket board

Abstract

The invention provides a socket board, a socket board assembly, a device testing apparatus and a method for manufacturing the socket board, which can realize easy design. A socket board (23) for testing a DUT (200) is provided with: a first wiring board (30) provided with a plurality of pads (33) provided on a lower surface (312); a second wiring board (40) provided with a plurality of pads (42) provided on an upper surface (411); and an interposer (50) interposed between the lower surface (312) of the first wiring board (30) and the upper surface (411) of the second wiring board (40), the interposer (50) being provided with a plurality of particle dispersion parts (51) that are in contact with the pads (33) and the pads (42) and connect the pads (33) and the pads (42).

Description

Technical Field

[0001] The present invention relates to a socket board for testing a DUT, a socket board assembly including the socket board, a device testing apparatus, and a method for manufacturing the socket board. Background Art

[0002] As an electronic component testing apparatus for testing a DUT such as a semiconductor integrated circuit element, there is known an apparatus including a DSA (Device Specific Adapter), a mother board, and a test head (for example, refer to Patent Document 1). The DSA includes a socket for pressing a DUT by a processor and a socket board on which the socket is mounted. The DSA is connected to the mother board, and the mother board is electrically connected to the test head. Prior Art Documents Patent Documents

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2021-117934 Summary of the Invention Technical Problem to be Solved by the Invention

[0004] The above-described DSA is designed according to the type of DUT and is detachably mounted on the mother board, and is replaced with a DSA corresponding to the type when switching the type of DUT. That is, while the DSA corresponds to each type of DUT, the mother board is common to multiple types of DUTs. In addition, the above-described socket board is composed of only one wiring board. Therefore, the design of the wiring board constituting the socket board needs to include both a separate design corresponding to each type of DUT and a common design corresponding to the specifications of the mother board. Thus, there is a problem that the design of the above-described socket board becomes complicated and the period required for the design of the socket board becomes long.

[0005] The technical problem to be solved by the present invention is to provide a socket board, a socket board assembly including the socket board, a device testing apparatus, and a method for manufacturing the socket board, which can simplify the design. Technical Solution for Solving the Technical Problem

[0006] [1] A mode 1 of the present invention is a socket board for testing a DUT, the socket board including: a first wiring board having a plurality of first pads provided on a first main surface; a second wiring board having a plurality of second pads provided on a second main surface; and a relay member interposed between the first main surface of the first wiring board and the second main surface of the second wiring board, the relay member having a plurality of first contacts that contact the first pads and contact the second pads to connect the first pads and the second pads.

[0007] [2]The second embodiment of the present invention can be a socket board as follows. In the socket board of the first embodiment, the socket board includes a spacer that defines the interval between the first wiring board and the second wiring board. The spacer contacts the first main surface of the first wiring board and the second main surface of the second wiring board.

[0008] [3]The third embodiment of the present invention can be a socket board as follows. In the socket board of the second embodiment, the first wiring board has a first area on the first main surface where the first pads are not arranged, and the second wiring board has a second area on the second main surface where the second pads are not arranged. The spacer contacts the first area and the second area.

[0009] [4]The fourth embodiment of the present invention can be a socket board as follows. In the socket board of the second or third embodiment, the spacer has an opening through which the first contact passes.

[0010] [5]The fifth embodiment of the present invention can be a socket board as follows. In the socket board of any one of the second to fourth embodiments, the spacer includes one or more plates that overlap between the first wiring board and the second wiring board.

[0011] [6]The sixth embodiment of the present invention can be a socket board as follows. In the socket board of the fifth embodiment, the one or more plates include a holding plate that holds the relay member.

[0012] [7]The seventh embodiment of the present invention can be a socket board as follows. In the socket board of any one of the first to sixth embodiments, the first contact can be elastically deformed in the thickness direction of the socket board and is sandwiched between the first pad and the second pad in an elastically deformed state.

[0013] [8]The eighth embodiment of the present invention can be a socket board as follows. In the socket board of any one of the first to seventh embodiments, the relay member is an intermediate board having the first contact, and the first contact is made of anisotropic conductive rubber that can conduct in the thickness direction of the socket board.

[0014] [9]The ninth embodiment of the present invention can be a socket board as follows. In the socket board of any one of the first to eighth embodiments, the first wiring board includes: a plurality of third pads provided on a third main surface opposite to the first main surface; and a plurality of first conductive paths that individually connect the plurality of first pads and the plurality of third pads.

[0015]

[10] The tenth embodiment of the present invention can be a socket board as follows. In the socket board of the ninth embodiment, the plurality of first pads and the plurality of third pads are individually connected via the plurality of first conductive paths in such a manner that one first pad corresponds to only one third pad.

[0016]

[11] Aspect 11 of the present invention may be a socket board as follows. Among the socket boards of any one of Aspects 1 to 10, the socket board includes: a plurality of the first wiring boards; and a plurality of the relay members. The plurality of first wiring boards are separately overlapped with a single second wiring board with the plurality of relay members therebetween.

[0017]

[12] Aspect 12 of the present invention may be a socket board as follows. Among the socket boards of any one of Aspects 1 to 11, the first wiring board has a third main surface on a side opposite to the first main surface, and the third main surface can mount a socket for the DUT to press when testing the DUT.

[0018]

[13] Aspect 13 of the present invention is a socket board assembly for testing a DUT, and includes: a socket board of any one of Aspects 1 to 12; and a socket mounted on the socket board for the DUT to press when testing the DUT.

[0019]

[14] Aspect 14 of the present invention may be a socket board assembly as follows. In the socket board assembly of Aspect 13, the first wiring board includes a plurality of third pads provided on the third main surface, the third main surface mounts the socket, the socket includes a second contact that contacts the terminals of the DUT when testing the DUT, and the second contact contacts the third pads.

[0020]

[15] Aspect 15 of the present invention may be a socket board assembly as follows. In the socket board assembly of Aspect 13 or 14, the socket board assembly includes a fixing mechanism that fixes the first wiring board and the second wiring board in a state where the relay member is interposed between the first wiring board and the second wiring board.

[0021]

[16] Aspect 16 of the present invention may be a socket board assembly as follows. In the socket board assembly of Aspect 15, the socket board includes a spacer that defines the interval between the first wiring board and the second wiring board, and the fixing mechanism fixes the first wiring board and the second wiring board in a state where the spacer is interposed between the first wiring board and the second wiring board.

[0022]

[17] Aspect 17 of the present invention may be a socket board assembly as follows. In the socket board assembly of Aspect 16, the spacer includes one or more plates overlapped between the first wiring board and the second wiring board, and the one or more plates include a holding plate for holding the relay member.

[0023]

[18] Embodiment 18 of the present invention may be a socket board assembly as follows. In the socket board assembly of any one of Embodiments 13 to 17, the socket board assembly includes: a frame on which the second wiring board is overlapped; and a fixing member that fixes the first wiring board and the second wiring board to the frame.

[0024]

[19] Embodiment 19 of the present invention may be a socket board assembly as follows. In the socket board assembly of any one of Embodiments 13 to 18, the socket board assembly is detachably mounted on a mounted body provided in a device test apparatus.

[0025]

[20] Solution 20 of the present invention may be a socket board assembly as follows. In the socket board assembly of any one of Embodiments 13 to 19, the socket board assembly includes a first connector that is mounted on a fourth main surface on the opposite side of the second main surface of the second wiring board.

[0026]

[21] Embodiment 21 of the present invention may be a socket board assembly as follows. In the socket board assembly of Embodiment 20, the socket board assembly includes a second conductive path that connects the second pad and the first connector.

[0027]

[22] Embodiment 22 of the present invention may be a socket board assembly as follows. In the socket board assembly of Embodiment 20 or 21, the plurality of first connectors can be engaged with a second connector provided in a mounted body provided in a device test apparatus.

[0028]

[23] Embodiment 23 of the present invention is a device test apparatus that tests a DUT and includes a tester that includes the socket board assembly of any one of Embodiments 13 to 22.

[0029]

[24] Embodiment 24 of the present invention may be a device test apparatus as follows. In the device test apparatus of Embodiment 23, the tester includes: a tester main body that performs the test of the DUT; and a relay device that is electrically connected to the tester main body, and the socket board assembly is detachably mounted on the relay device.

[0030]

[25] Embodiment 25 of the present invention may be a device test apparatus as follows. In the device test apparatus of Embodiment 24, the tester includes a test head that is electrically connected to the tester main body, and the relay device is a motherboard mounted on the test head.

[0031]

[26] Embodiment 26 of the present invention may be a device test apparatus as follows. In the device test apparatus of any one of Embodiments 23 to 25, the device test apparatus includes a processing device that moves the DUT and presses the DUT against the socket.

[0032]

[27] The method 27 of the present invention is a method for manufacturing a socket board, which is a method for manufacturing the socket board according to any one of methods 1 to 12, and includes: a first step of preparing the first wiring board, the second wiring board, and the relay member; and a second step of interposing the relay member between the first wiring board and the second wiring board.

[0033]

[28] The method 28 of the present invention may be a method for manufacturing a socket board. In the method for manufacturing the socket board according to method 27, the socket board includes a spacer that defines a gap between the first wiring board and the second wiring board. The method for manufacturing the socket board includes: a third step of measuring a first thickness of the first wiring board; and a fourth step of selecting, based on the first thickness, one or more boards forming the spacer from a set of boards composed of multiple boards. The second step includes a step of interposing the one or more boards selected in the fourth step between the first wiring board and the second wiring board.

[0034]

[29] The method 29 of the present invention may be a method for manufacturing a socket board. In the method for manufacturing the socket board according to method 28, the third step includes a step of measuring a second thickness of the second wiring board, and the fourth step includes a step of selecting the one or more boards from the set of boards based on the first thickness and the second thickness.

[0035]

[30] The method 30 of the present invention may be a method for manufacturing a socket board. In the method for manufacturing the socket board according to method 28 or 29, the method for manufacturing the socket board includes a fifth step of preparing the set of boards including boards of different thicknesses, and the fourth step includes a step of selecting the one or more boards forming the spacer from the set of boards prepared in the fifth step. Advantages of the Invention

[0036] According to the present invention, since the socket board includes the first wiring board and the second wiring board, it is possible to perform separate designs corresponding to various types of DUTs on the first wiring board and perform common designs corresponding to the specifications of the motherboard on the second wiring board, thereby facilitating the design of the socket board. Description of the Drawings

[0037] Figure 1 is a schematic cross-sectional view showing the overall structure of the device test apparatus in the embodiment of the present invention. Figure 2 is an exploded view of the DSA and the motherboard in the embodiment of the present invention, and is a view corresponding to part II of Figure 1 Figure 3 ​This is a cross-sectional view of the DSA in the embodiment of the present invention, and it is a cross-sectional view when the DSA is cut along the Figure 2 III-III line of Figure 2 . Figure 4 This is an exploded cross-sectional view of the DSA in the embodiment of the present invention. Figure 5 This is a bottom view of the first wiring board in the embodiment of the present invention. Figure 6 This is a top view of the second wiring board in the embodiment of the present invention. Figure 7 In Figure 7 (a) is a cross-sectional view of the socket board in the embodiment of the present invention, Figure 7 (b) and Figure 7 (c) are cross-sectional views showing modified examples of the spacer in the embodiment of the present invention. Figure 8 In Figure 8 (a) to Figure 8 (c) are cross-sectional views showing modified examples of the spacer in the embodiment of the present invention. Figure 9 This is a flowchart showing the manufacturing method of the socket board and the DSA in the embodiment of the present invention. Detailed Embodiments

[0038] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0039] Figure 1 This is a schematic cross-sectional view showing the overall structure of the device test apparatus 1 in the embodiment of the present invention, Figure 2 This is an exploded view of the DSA20 and the mother board 70 in the present embodiment, and it is a view corresponding to the II part of Figure 1 .

[0040] The device test apparatus 1 in the present embodiment is a device for testing a device under test (hereinafter also simply referred to as "DUT") 200. Although there is no particular limitation, as a specific example of the DUT200 which is the object of testing, for example, semiconductor devices such as memory devices, logic devices, or SoC (System on chip) can be exemplified. The device test apparatus 1 tests the electrical characteristics of the semiconductor device 200.

[0041] As shown in Figure 1As shown, the device test apparatus 1 includes: a tester 10 that performs tests on the DUT 200; and a processor 100 that processes the DUT 200 and presses the DUT 200 against the socket 21. Further, the tester 10 includes a DSA 20, a motherboard 70, a test head 80, and a main frame 90. It should be noted that the structure of the tester 10 only needs to include the socket board 23 described later, and is not particularly limited to the following structure. The DSA 20 corresponds to an example of the "socket board assembly" in the embodiment of the present invention. In addition, the motherboard 70 is an example of the "mounted body" in the embodiment of the present invention and is also an example of the "relay device" in the embodiment of the present invention.

[0042] As Figure 1 and Figure 2 shown, the DSA (Device Specific Adapter) 20 includes a socket 21 that is electrically connected to the DUT 200 when testing the DUT 200. The DSA 20 is electrically connected to the test head 80 via the motherboard 70. The DSA 20 is detachably mounted on the motherboard 70. The DSA 20 is designed according to the type of the DUT 200, and when switching the type of the DUT 200, the DSA 20 is replaced with a type corresponding to that type. It should be noted that the number of DSA 20s mounted on the motherboard 70 is not particularly limited, and multiple DSA 20s may be mounted on the motherboard 70. The structure of the DSA 20 will be described in detail later.

[0043] The motherboard 70 is a relay device that electrically connects the DSA 20 and the test head 80. The motherboard 70 includes a housing 71, a plurality of connectors 72, and a plurality of cables 73. The connector 72 is connected to one end of the cable 73 (the upper end in Figure 2 this case). The connector 72 is detachably fitted to the connector 24 (described later) of the DSA 20. The connector 72 is supported on the upper part of the housing 71 in a manner corresponding to the connector 24 of the DSA 20. When the DSA 20 is mounted on the motherboard 70, the connector 24 of the DSA 20 is fitted to the connector 72 of the motherboard 70.

[0044] As Figure 1 shown, the test head 80 internally houses a test module (pin circuit card) 81 that tests the DUT 200. The test module 81 is a wiring board on which electronic components such as test devices for testing the DUT 200 are mounted. As a specific example of such test electronic components, for example, a high-frequency circuit (e.g., an ASIC (Application Specific Integrated Circuit)) in which an LSI for processing test signals is assembled, a power supply circuit in which a switching regulator for supplying test power to the DUT 200 is assembled, etc. can be exemplified.

[0045] The test module 81 is electrically connected to the cable 73 through a connector (not shown) connected to the other end of the cable 73 of the motherboard 70. The test module 81 tests the DUT 200 by transmitting and receiving test signals between the DUT 200 via the DSA 20 and the motherboard 70. The test head 80 is connected to the main frame 90 via a cable 82.

[0046] The main frame (tester body) 90 is, for example, a computer that executes a program, communicates with each test module 81 in the test head 80 according to the program, and controls each test module 81. Each test module 81 generates a test signal according to an instruction from the main frame 90 and outputs the test signal to the DUT 200.

[0047] Although not particularly shown, the processor 100 includes, for example, a conveying device, a pressing device, and a sorting device. The conveying device conveys the test tray containing the DUT 200 above the DSA 20. Then, the pressing device presses the DUT 200 accommodated in the test tray against the socket 21 of the DSA 20. The sorting device sorts the tested DUT 200 according to the test results while taking out the tested DUT 200 from the test tray.

[0048] In addition, the processor 100 includes a chamber 101 as a temperature adjustment device for applying thermal stress of high temperature or low temperature to the DUT 200. The chamber 101 is composed of a thermostat capable of maintaining the temperature in the tank at a desired temperature. Therefore, the device test apparatus 1 can test the DUT 200 in a state where thermal stress is applied to the DUT 200, and can perform so-called high-temperature tests and low-temperature tests.

[0049] The above-mentioned DSA 20 enters the chamber 101 through an opening 102 formed in the processor 100, and the socket 21 of the DSA 20 is arranged in the chamber 101. By pressing the DUT 200 against the socket 21 of the DSA 20 by the pressing device of the processor 100, the DUT 200 is electrically connected to the socket 21.

[0050] It should be noted that the processor 100 may be a type that does not use a test tray but includes a contact arm that adsorbs, holds, and moves the DUT 200, and presses the DUT 200 by the contact arm. In this case, the processor 100 may include a heater and a radiator provided at the front end of the contact arm as a temperature adjustment device instead of the chamber 101. Alternatively, the processor 100 may include a heater and a radiator provided at the front end of the contact arm as a temperature adjustment device in addition to the chamber 101.

[0051] Next, with reference to Figures 3 to 6 The structure of the above-mentioned DSA 20 will be described in detail. Figure 3 is a cross-sectional view of the DSA 20 in the present embodiment, alongFigure 2 Cross-sectional view in the case where the DSA is cut along the III-III line. Figure 4 Exploded cross-sectional view of the DSA 20 in the present embodiment. Figure 5 Bottom view of the first wiring board 30 in the present embodiment, Figure 6 Top view of the second wiring board 40 in the present embodiment. Figure 7 (a) Cross-sectional view of the socket board in the present embodiment, Figure 7 (b) to Figure 8 (c) Cross-sectional view showing a modified example of the spacer in the present embodiment.

[0052] As Figure 3 and Figure 4 shown, the DSA 20 includes a socket 21, a socket guide 22, a socket board 23, a connector 24, and a support frame 25.

[0053] The socket 21 is made of an anisotropic conductive rubber sheet. Specifically, the socket 21 includes a plurality of particle dispersion portions 211 and an insulating portion 212 that holds the particle dispersion portions 211. The socket 21 is fixed to the socket board 23 by sandwiching the socket 21 between the socket guide 22 and the socket board 23. It should be noted that the socket 21 can also be fixed to the socket board 23 by bolts or the like.

[0054] Each particle dispersion portion 211 is formed by dispersing conductive particles in an insulator. The particle dispersion portion 211 has conductivity only in the thickness direction (the pressing direction of the DUT200 with respect to the socket 21) (the Z direction in the figure). Specifically, the particle dispersion portion 211 can conduct only in the thickness direction by the conductive particles adjacent to each other in the thickness direction coming into contact with each other. The plurality of particle dispersion portions 211 are arranged corresponding to the terminals 201 of the DUT200. When testing the DUT200, if the DUT200 is pressed against the socket 21 by the processor 100, the particle dispersion portion 211 conducts in the thickness direction, and the DUT200 is electrically connected to the socket 21. The particle dispersion portion 211 is an example of the "second contact" in the manner of the present invention.

[0055] The insulating portion 212 is made of only an insulator and has a sheet-like shape. The plurality of particle dispersion portions 211 are arranged corresponding to the terminals 201 of the DUT200. The insulating portion 212 holds the plurality of particle dispersion portions 211 arranged corresponding to the terminals 201 of the DUT200.

[0056] As a specific example of the conductive particles of the particle dispersion part 211, for example, iron, copper, zinc, chromium, nickel, silver, aluminum, or their alloys can be cited. In addition, as a specific example of the insulator of the particle dispersion part 211 and the insulating part 212, for example, elastic insulating materials such as silicone rubber, polyurethane rubber, and natural rubber can be cited.

[0057] It should be noted that the socket 21 is not limited to the above-mentioned anisotropic conductive rubber sheet. As a contact that contacts the terminal 201 of the DUT 200, for example, a contact having a spring pin, a vertical probe, a cantilever probe, bumps provided on a diaphragm, or a contact using MEMS technology can also be used as the socket 21.

[0058] The socket guide 22 is a member for positioning the DUT 200 relative to the socket 21. For example, when the pressing device of the processor 100 brings the DUT 200 accommodated in the test tray close to the socket 21, the guide pins provided in the pressing device are inserted into the guide holes provided in the test tray and the socket guide 22 respectively, so that the DUT 200 is positioned relative to the socket 21. The socket guide 22 is made of, for example, stainless steel and is fixed to the support frame 25 by bolts or the like inserted into the through holes of the socket board 23.

[0059] The socket board 23 includes a plurality of (two in this embodiment) first wiring boards 30, second wiring boards 40, a plurality of (two in this embodiment) intermediate boards 50, and a plurality of (two in this embodiment) spacers 60. The intermediate board 50 is an example of the "relay member" in the aspect of the present invention.

[0060] The first wiring board 30 is a part corresponding to each DUT type. In contrast, the second wiring board 40 is a part corresponding to the specifications of the common mother board common to multiple types of DUTs. That is, the first wiring board 30 is a type-corresponding part that varies according to the type of DUT, and the second wiring board 40 is a common part common to different types of DUTs.

[0061] The first wiring board 30 is a rigid wiring board on which the above-mentioned socket 21 and socket guide 22 are mounted on its upper surface 311. It should be noted that in Figure 3 and Figure 4 only one socket 21 is mounted on one first wiring board 30, but multiple sockets 21 can also be mounted on one first wiring board 30. The first wiring board 30 includes an insulating substrate 31, a plurality of pads 32, a plurality of pads 33, and a plurality of conductive paths 34.

[0062] The insulating substrate 31 is made of a material having electrical insulation properties, such as glass epoxy resin. A plurality of pads 32 are provided on the upper surface 311 of the insulating substrate 31 in a manner corresponding to the arrangement of the plurality of particle dispersion portions 211 of the socket 21. On the other hand, a plurality of pads 33 are provided on the lower surface 312 of the insulating substrate 31 in a manner corresponding to the arrangement of the plurality of particle dispersion portions 511 (described later) of the intermediate plate 50. The pitch between the lower pads 33 is wider than the pitch between the upper pads 32.

[0063] A plurality of conductive paths 34 electrically connect the upper pads 32 and the lower pads 33. The conductive path 34 is composed of a wiring pattern formed on the insulating substrate 31, vias, and the like. The above-mentioned pads 32, 33, and conductive paths 34 are made of a conductive material, specifically, a metal material such as copper.

[0064] In the present embodiment, the plurality of pads 32 and the plurality of pads 33 are individually connected via the plurality of conductive paths 34 in such a manner that one pad 32 corresponds to only one pad 33. Specifically, one pad 32 among the plurality of pads 32 is respectively connected to only one pad 33 among the plurality of pads 33. In other words, one upper pad 32 is not connected to the plurality of lower pads 33, and one lower pad 33 is not connected to the plurality of upper pads 32, and the conductive path 34 does not branch. That is, the connection relationship between the pad 32 and the pad 33 via the conductive path 34 becomes a "one-to-one" relationship in which one pad 32 is connected to one pad 33. Thus, in the present embodiment, since the circuit structure of the first wiring board 30 corresponding to each type of DUT is simplified, the design of the first wiring board 30 can be facilitated.

[0065] The lower pads 33 of the first wiring board 30 are an example of the "first pad" in the aspect of the present invention, and the upper pads 32 are an example of the "third pad" in the aspect of the present invention. In addition, the lower surface 312 of the insulating substrate 31 is an example of the "first main surface" in the aspect of the present invention, and the upper surface 311 of the insulating substrate 31 is an example of the "third main surface" in the aspect of the present invention. Further, the conductive path 34 is an example of the "first conductive path" in the aspect of the present invention.

[0066] The second wiring board 40 is a rigid wiring board on which the first wiring board 30 is overlapped with the intermediate plate 50 and the spacer 60 interposed therebetween. The second wiring board 40 includes an insulating substrate 41, a plurality of pads 42, and a plurality of conductive paths 44. In the present embodiment, two first wiring boards 30 are respectively overlapped on a single second wiring board 40 (the same second wiring board 40) with two intermediate plates 50 and two spacers 60 interposed therebetween. That is, each first wiring board 30 is individually overlapped with the second wiring board 40 with one intermediate plate 50 and one spacer 60 interposed therebetween. Thereby, the thickness t of the second wiring board 40 can be reduced.c (Refer to Figure 7 (a)) with respect to the total thickness t of the socket board 23 a (Refer to Figure 7 (a)) for the influence of the deviation.

[0067] It should be noted that the number of the first wiring boards 30 overlapping on a single second wiring board 40 is not particularly limited to the above number. In addition, the number of the intermediate boards 50 overlapping on a single second wiring board 40 is not particularly limited to the above number either, and can be set according to the number of the first wiring boards 30, for example. Similarly, the number of the spacers 60 overlapping on a single second wiring board 40 is not particularly limited to the above number, and can be set according to the number of the intermediate boards 50, for example.

[0068] The insulating substrate 41 is made of a material having electrical insulation properties such as glass epoxy resin, etc. The pads 42 are provided on the upper surface 411 of the insulating substrate 41 in a manner corresponding to the arrangement of a plurality of particle dispersion portions 511 (described later) of the intermediate board 50. On the other hand, a plurality of connectors 24 are mounted on the lower surface 412 of the insulating substrate 41 of the second wiring board 40. As described above, a connector 72 connected to one end (the upper end in Figure 2 ) of the cable 73 of the mother board 70 is fitted in each connector 24. The connector 24 is an example of the "first connector" in the embodiment of the present invention, and the connector 72 is an example of the "second connector" in the embodiment of the present invention.

[0069] A plurality of conductive paths 44 electrically connect the pads 42 and the connectors 24. The conductive paths 44 are composed of wiring patterns formed on the insulating substrate 41, vias, etc. The above-mentioned pads 42 and conductive paths 44 are made of a conductive material, specifically, a metal material such as copper.

[0070] In the present embodiment, the second wiring board 40 has a complex circuit structure, and the complex circuit structure has branches of the conductive paths 44, daisy chain connections, etc. Through the second wiring board 40, a common circuit corresponding to the specifications of the mother board common to different types of DUTs is constituted.

[0071] The pads 42 of the second wiring board 40 are an example of the "second pads" in the embodiment of the present invention. In addition, the upper surface 411 of the insulating substrate 41 is an example of the "second main surface" in the embodiment of the present invention, and the lower surface 412 of the insulating substrate 41 is an example of the "fourth main surface" in the embodiment of the present invention. In addition, the conductive paths 44 are an example of the "second conductive paths" in the embodiment of the present invention.

[0072] The interposer 50 is made of an anisotropic conductive rubber sheet. Specifically, the interposer 50 includes a plurality of particle dispersion portions 51 and an insulating portion 52 that holds the particle dispersion portions 51.

[0073] Each particle dispersion portion 51 is formed by dispersing and arranging conductive particles in an insulator. The particle dispersion portion 51 has conductivity only in the thickness direction (the Z direction in the figure) of the particle dispersion portion 51. Specifically, the particle dispersion portion 51 can conduct only in the thickness direction by the conductive particles adjacent to each other in the thickness direction coming into contact with each other. The particle dispersion portion 51 is an example of the "first contact" in the embodiment of the present invention.

[0074] The insulating portion 52 is made of only an insulator and has a sheet-like shape. The plurality of particle dispersion portions 51 are arranged in a manner corresponding to the pads 33 of the first wiring board 30 and the pads 42 of the second wiring board 40. The insulating portion 52 holds the particle dispersion portions 51, and the particle dispersion portions 51 are arranged in a manner corresponding to the pads 33 of the first wiring board 30 and the pads 42 of the second wiring board 40.

[0075] As a specific example of the conductive particles of the particle dispersion portion 51, the same conductive particles as those exemplified as the specific example of the conductive particles of the particle dispersion portion 211 can be cited. In addition, as a specific example of the insulator of the particle dispersion portion 51 and the insulating portion 52, the same insulator as that exemplified as the specific example of the insulator of the particle dispersion portion 211 and the insulating portion 212 can be cited.

[0076] The interposer 50 is interposed between the first wiring board 30 and the second wiring board 40. The interposer 50 is overlapped on the second wiring board 40, and the first wiring board 30 is overlapped on the interposer 50. Specifically, the interposer 50 is interposed between the lower surface 312 of the first wiring board 30 and the upper surface 411 of the second wiring board 40 in such a manner that the plurality of particle dispersion portions 51 are respectively in contact with the pads 33 and 42 of the first wiring board 30 and the second wiring board 40. Each particle dispersion portion 51 is sandwiched between the pads 33 and 42 in a compressed state in the thickness direction (the Z direction in the figure) of the socket board 23, and the pads 33 and 42 are electrically connected through the conduction in the thickness direction of the particle dispersion portion 51.

[0077] The interposer 50 is held by a holding plate 62 (described later) of the socket board 23. Specifically, the interposer 50 is held by the holding plate 62 and integrated with the holding plate 62 by the inner peripheral portion of the holding plate 62 being embedded in the outer peripheral portion of the insulating portion 52. As described later, the holding plate 62, together with the wiring boards 30 and 40 and the adjustment plate 61, is fixed to the support frame 25 by bolts 26. Therefore, by holding the interposer 50 by the holding plate 62, the interposer 50 can be positioned with high precision and fixed reliably.

[0078] It should be noted that the intermediate plate 50 is not limited to the above-mentioned anisotropic conductive rubber sheet as long as it has a member that can elastically deform in the thickness direction (Z direction in the figure) of the socket board 23 and serves as a contact for electrically connecting the pads 33 and 42 of the wiring boards 30 and 40. Although not particularly limited, an intermediate plate having, for example, spring pins, vertical probes, cantilever probes, or contacts fabricated using MEMS technology as the contact can also be used as the intermediate plate 50.

[0079] The spacer 60 of the present embodiment is interposed between the first wiring board 30 and the second wiring board 40. The upper surface 601 of the spacer 60 contacts the lower surface 312 of the first wiring board 30, and the lower surface 602 of the spacer 60 contacts the upper surface 411 of the second wiring board 40, defining the interval between the first wiring board 30 and the second wiring board 40.

[0080] As Figures 3 to 6 shown, the spacer 60 contacts the first region 312a of the first wiring board 30 and the second region 411a of the second wiring board 40. The intermediate plate 50 is disposed in the opening 603 of the spacer 60, and the particle dispersion portion 51 of the intermediate plate 50 passes through the opening 603 of the spacer 60. It should be noted that the above-mentioned first region 312a is a region where no pad 33 is disposed on the lower surface 312 of the first wiring board 30. In addition, the above-mentioned second region 411a is a region where no pad 42 is disposed on the upper surface 411 of the second wiring board 40.

[0081] The spacer 60 includes a plurality of plates 61 and 62. In the present embodiment, the spacer 60 includes two adjustment plates 61 and one holding plate 62. The adjustment plate 61 is a frame-shaped member having an opening 611 and is a so-called shim plate. In addition, the holding plate 62 is also a frame-shaped member having an opening 621. The adjustment plate 61 and the holding plate 62 are made of a metal material such as stainless steel, for example. The intermediate plate 50 is located in the openings 611 and 621 of the adjustment plate 61 and the holding plate 62, and the particle dispersion portion 51 of the intermediate plate 50 passes through the openings 611 and 621. As described above, the intermediate plate 50 is held by the holding plate 62.

[0082] The thickness of the spacer 60 is adjusted so that the thickness of the socket board 23 becomes a given value t a For example, as Figure 7 (a) shows, when the thickness of the first wiring board 30 is t b1 , by overlapping two adjustment plates 61 having a thickness of t e1 with one holding plate 62 having a thickness of t f , the thickness of the spacer 60 is set to t d1 (td1 = 2 × t e1 + t f ), the thickness of the socket board 23 is set to t a (t a = t b1 + t d1 + t c ). It should be noted that t c is the thickness of the second wiring board 40

[0083] In contrast, as shown in Figure 7 (b), when the thickness of the first wiring board 30 is t b1 thicker than the above-mentioned t b2 (t b2 > t b1 ), by using an adjustment plate 61B with a thickness t e2 thinner than the above-mentioned adjustment plate 61 (t e2 < t e1 ), the thickness of the spacer 60 is set to be thinner than t d1 by t d2 (t d2 = 2 × t e2 + t f < t d1 ), the thickness of the socket board 23 is set to t a (t a = t b2 + t d2 + t c ). It should be noted that the thickness t b2 of the above-mentioned first wiring board 30 is, for example, the thickness of the first wiring board 30 at the upper limit of the tolerance

[0084] On the other hand, as shown in Figure 7 (c), when the thickness of the first wiring board 30 is t b1 thinner than the above-mentioned t b3 (t b3 < t b1 ), by using an adjustment plate 61C with a thickness t e3 thicker than the above-mentioned adjustment plate 61 (t e3 > t e1 ), the thickness of the spacer 60 is set to be thicker than t d1 by t d3 (t d3 = 2 × t e3 + t f > td1), the thickness of the socket board 23 is set to t a (t a = t b3 + t d3 + t c) It should be noted that the thickness t of the above-mentioned first wiring board 30 b3 is, for example, the thickness of the first wiring board 30 at the lower limit of the tolerance. The intermediate board 50 has a thickness corresponding to the first wiring board 30 having the thinnest thickness t b3 and can correspond to the entire range of the tolerance of the thickness of the first wiring board 30 with only one kind of intermediate board 50.

[0085] Here, when the device test apparatus includes a plurality of socket boards, in order to press all DUTs against the sockets with the same pressing force, it is necessary to make the heights of the upper surfaces of the plurality of socket boards consistent. Therefore, it is required that the thickness of the socket board has high precision (i.e., narrow tolerance), and there is a case where the yield of the socket board is reduced. In view of this, in the present embodiment, as described above, by adjusting the thickness of the spacer 60, the total thickness of the socket board 23 can be set to a given value t a , and therefore, high precision is not required for the thickness of the first wiring board 30, and an increase in the yield of the first wiring board 30 can be achieved.

[0086] It should be noted that the number of plates constituting the spacer 60 is not particularly limited to the above. For example, as Figure 8 (a) shows, the spacer 60 may also be composed of four adjustment plates 61B and one holding plate 62. Among them, the adjustment plate 61B is the same as the adjustment plate 61B shown in Figure 7 (b), and the thickness t of the adjustment plate 61B e2 is Figure 7 half of the thickness t of the adjustment plate 61C shown in e3 (t e2 = 1 / 2 × t e3 ). Therefore, in the example shown in Figure 8 (a), the thickness t of the spacer 60 d4 is the same as t Figure 7 similar to that in d3 (c) (t d4 = 4 × t e2 + t f = t d3 ). Thus, commonization of the adjustment plates can be achieved.

[0087] Alternatively, as Figure 8 (b) shows, the spacer 60 may also be composed of only one adjustment plate 61D. In addition, as shown in this figure, the spacer 60 may not include the holding plate 62. It should be noted that when the spacer 60 includes the holding plate 62, it is preferable that the spacer 60 includes a plurality of plates. Alternatively, as Figure 8As shown in (c), the spacer 60 may also be composed of two adjustment plates 61E and 61F with different thicknesses. It should be noted that although not particularly shown, the spacer 60 including the holding plate 62 may also include a plurality of adjustment plates with different thicknesses from each other.

[0088] As Figure 3 and Figure 4 shown, the support frame 25 is a frame-shaped member on which the second wiring board 40 is overlapped. The connector 24 installed on the lower surface 412 of the second wiring board 40 projects downward from the opening 251 of the support frame 25. The support frame 25 corresponds to an example of the "frame" in the embodiment of the present invention.

[0089] In addition, the above-mentioned socket board 23 is fixed to the support frame 25 by bolts 26. Specifically, through holes 313, 413, 612, and 622 are respectively formed in the wiring boards 30, 40, and the plates 61, 62, and a fixing hole 252 with an internal thread is formed in the support frame 25. Moreover, by screwing the bolts 26 inserted through the through holes 313, 413, 612, and 622 into the fixing hole 252, the wiring boards 30, 40, the intermediate board 50, and the spacer 60 are fixed. The bolt 26 corresponds to an example of the "fixing member" in the embodiment of the present invention.

[0090] It should be noted that instead of the support frame 25, the wiring boards 30, 40, the intermediate board 50, and the spacer 60 may be fixed by screwing the bolts 26 into nuts arranged on the lower surface 412 side of the second wiring board 40. Alternatively, instead of the bolts 26, the wiring boards 30, 40, the intermediate board 50, and the spacer 60 may be fixed by mechanical means such as jigs.

[0091] Next, with reference to Figure 9 the manufacturing method of the socket board 23 and the DSA 20 described above will be described. Figure 9 is a flowchart showing the manufacturing method of the socket board 23 and the DSA 20 in the present embodiment.

[0092] First, the socket board 23 is manufactured in step S10 of Figure 9 . Specifically, in step S11 of Figure 9 , the first wiring board 30, the second wiring board 40, and the intermediate board 50 are prepared. Next, in step S12 of Figure 9 , the thickness of the first wiring board 30 is measured using a micrometer or the like.

[0093] Next, in step S13 of Figure 9 , based on the measurement result (the thickness of the first wiring board 30) in the above step S12, one or more plates having a thickness that makes the total thickness of the socket board 23 become t a are selected from the plate group PG.

[0094] The board group PG includes a variety of boards with different thicknesses, such as the above-mentioned adjustment boards 61, 61B to 61E. In addition, the above-mentioned holding board 62 is actually integrated with the intermediate board 50, but is conceptually included in the board group PG. All the boards included in the board group PG are held by the manufacturer as inventory before the start of manufacturing the socket board 23 and the DSA 20. That is, the board group PG is prepared in advance before the start of manufacturing the socket board 23 and the DSA 20.

[0095] For example, when the thickness of the first wiring board 30 is t b1 (in the case of Figure 7 (a)), as the boards constituting the spacer 60, two adjustment boards 61 and one holding board 62 are selected from the board group PG. In contrast, when the thickness of the first wiring board 30 is t b2 (in the case of Figure 7 (b)), as the boards constituting the spacer 60, two adjustment boards 61B and one holding board 62 are selected from the board group PG. In addition, when the thickness of the first wiring board 30 is t b3 (in the case of Figure 7 (c)), as the boards constituting the spacer 60, two adjustment boards 61C and one holding board 62 are selected from the board group PG.

[0096] It should be noted that in Figure 9 step S12, in addition to the thickness of the first wiring board 30, the thickness of the second wiring board 40 can also be measured. In this case, in Figure 9 step S13, based on the thickness of the first wiring board 30 and the thickness of the second wiring board 40, one or more boards with a thickness that makes the total thickness of the socket board 23 become t a are selected from the board group PG.

[0097] Next, in Figure 9 step S14, with the intermediate board 50 and the spacer 60 sandwiched between the first wiring board 30 and the second wiring board 40, the first wiring board 30 and the second wiring board 40 are overlapped. Thus, the socket board 23 is manufactured.

[0098] Next, in Figure 9 step S20, the above-mentioned socket board 23 is fixed to the support frame 25. Specifically, by inserting bolts 26 into the through holes 313, 413, 612, 622 of the wiring boards 30, 40 and the spacer 60 and screwing them into the fixing holes 252 of the support frame 25, the socket board 23 is fixed to the support frame 25. In addition, in this step S20, the connector 24 is mounted on the lower surface 412 of the second wiring board 40.

[0099] Next, in Figure 9 step S30 of Figure 9 , the socket 21 and the socket guide 22 are fixed to the support frame 25, thereby completing the DSA 20.

[0100] As described above, in the present embodiment, since the socket board 23 includes the first wiring board 30 and the second wiring board 40, it is possible to perform individual designs corresponding to various types of the DUT 200 on the first wiring board 30, and perform common designs corresponding to the specifications of the mother board 70 on the second wiring board 40, thereby facilitating the design of the socket board 23.

[0101] Here, the second wiring board 40 has a complex circuit structure in order to correspond to the specifications of the mother board 70, and its design and manufacturing may take a relatively long time. However, since the second wiring board 40 is a common part and there is only one type of the second wiring board 40, it is possible to keep the second wiring board 40 in stock. In addition, the intermediate board 50 can sufficiently absorb the entire range of tolerances of the first wiring board 30 through elastic deformation in the thickness direction of the socket board 23. Therefore, there is also only one type of the intermediate board 50, so it is possible to keep the intermediate board 50 in stock.

[0102] On the other hand, since the first wiring board 30 is a type-corresponding part corresponding to each type of DUT, it may be difficult to keep the first wiring board 30 in stock. In the present embodiment, since the circuit structure of the first wiring board 30 is simplified, the time required for the design and manufacturing of the first wiring board 30 can be shortened. Therefore, in the present embodiment, the DSA 20 can be provided with a short delivery time.

[0103] In addition, in the present embodiment, as described above, since the socket board 23 includes two wiring boards 30 and 40, the distance between the two wiring boards 30 and 40 can be adjusted by the thickness of the spacer 60. Therefore, since the total thickness of the socket board 23 can be set to the target value t by the thickness of the spacer 60 a , a high precision is not required for the thickness of the first wiring board 30. Therefore, the yield of the first wiring board 30 can be improved, the time required for the design and manufacturing of the first wiring board 30 can be further shortened, and the cost reduction of the socket board 23 can be achieved.

[0104] It should be noted that the embodiments described above are described for the purpose of making the present invention easy to understand, and are not described for the purpose of limiting the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design changes or equivalents belonging to the technical scope of the present invention. Description of Reference Numerals

[0105] 1... Device test apparatus 10... Tester 20…DSA 21…Socket 211…Particle dispersion part 212…Insulating part 23…Socket board 30…First wiring board 311…Upper surface 312…Lower surface 32, 33…Pad 34…Conductive path 40…Second wiring board 411…Upper surface 412…Lower surface 42…Pad 44…Conductive path 50…Interposer 51…Particle dispersion part 52…Insulating part 60…Spacer 61, 61B~61E…Adjusting plate 62…Holding plate 24…Connector 25…Supporting frame 26…Bolt 70…Mother board 72…Connector 80…Test head 90…Main frame 100…Processor 200…DUT

Claims

1. A socket board for testing a DUT, and having: A first wiring board including a plurality of first pads provided on a first main surface; A second wiring board including a plurality of second pads provided on the second main surface; and a relay member interposed between the first main surface of the first wiring board and the second main surface of the second wiring board, The relay member includes a plurality of first contacts that are in contact with the first pad and the second pad to connect the first pad and the second pad.

2. The socket board according to claim 1, wherein: The socket board includes a spacer that defines a distance between the first wiring board and the second wiring board. The spacer is in contact with the first main surface of the first wiring board, and is in contact with the second main surface of the second wiring board.

3. The socket board according to claim 2, wherein: The spacer includes one or more boards overlapped between the first wiring board and the second wiring board.

4. The socket board according to claim 3, wherein: The one or more plates include a holding plate that holds the relay member.

5. The socket board according to claim 1, wherein: The first contact is elastically deformable in a thickness direction of the socket plate, and is sandwiched between the first pad and the second pad in an elastically deformed state.

6. The socket board according to claim 1, wherein: The relay member is an interposer including the first contacts, and the first contacts are made of anisotropic conductive rubber that can conduct electricity in a thickness direction of the socket plate.

7. The socket board according to claim 1, wherein: The first wiring board comprises: a plurality of third pads provided on a third main surface opposite to the first main surface; and A plurality of first conductive paths individually connect the plurality of first pads with the plurality of third pads.

8. The socket board according to claim 1, wherein: The socket board has: a plurality of said first wiring boards; and a plurality of said relay components, The plurality of first wiring boards individually overlap with a single second wiring board via the plurality of relay members.

9. A socket board assembly for testing a DUT, comprising: The socket board according to any one of claims 1 to 8; and A socket is mounted on the socket board and is pressed by the DUT when testing the DUT.

10. The socket strip assembly according to claim 9, wherein: The first wiring board includes a plurality of third pads provided on a third main surface, and the socket is mounted on the third main surface. The socket has a second contact that contacts a terminal of the DUT when testing the DUT. The second contact contacts the third pad.

11. The socket strip assembly according to claim 9, wherein: The socket plate assembly includes a fixing mechanism that fixes the first wiring board and the second wiring board in a state where the relay member is interposed between the first wiring board and the second wiring board.

12. The socket strip assembly according to claim 11, wherein: The socket board includes a spacer that defines a distance between the first wiring board and the second wiring board. The fixing mechanism fixes the first wiring board and the second wiring board in a state where the spacer is interposed between the first wiring board and the second wiring board.

13. The socket strip assembly according to claim 9, wherein: The socket board assembly is detachably mounted on a mounted body provided in a device testing apparatus.

14. A device testing apparatus for testing a DUT. The device testing apparatus includes a tester including the socket board assembly according to claim 9 .

15. A method for manufacturing a socket plate, which is the method for manufacturing a socket plate according to any one of claims 1 to 8, and comprises: A first step is to prepare the first wiring board, the second wiring board, and the relay member; and In the second step, the relay member is interposed between the first wiring board and the second wiring board.

16. The method for manufacturing a socket board according to claim 15, wherein: The socket board includes a spacer that defines a distance between the first wiring board and the second wiring board. The manufacturing method of the socket board comprises: A third step is to measure a first thickness of the first wiring board; and a fourth step of selecting, based on the first thickness, one or more plates to form the spacer from a plate group consisting of a plurality of plates; The second step includes the step of interposing the one or more boards selected in the fourth step between the first wiring board and the second wiring board.

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