Heat conduction and airflow coupling heat dissipation system and method for medium-voltage switch cabinet

Abstract

The invention provides a heat conduction and airflow coupling heat dissipation system and method for a medium-voltage switch cabinet, and relates to the technical field of heat dissipation of medium-voltage switch cabinets, and the method comprises the steps: carrying out the heat dissipation demand evaluation of heat source data obtained through the recognition of a heat source in the medium-voltage switch cabinet, and determining a temperature rise threshold value; performing heat conduction path optimization through the heat source data and the temperature rise threshold value to obtain heat dissipation structure data; carrying out airflow organization design and flow optimization based on the heat dissipation structure data to obtain a flow optimization scheme; performing heat-flow coupling simulation according to the heat dissipation structure data and the flow optimization scheme to obtain a heat-flow simulation result; and carrying out structure optimization and heat dissipation enhancement on a heat-flow simulation result, and carrying out engineering implementation through an obtained heat dissipation optimization structure. According to the invention, the technical target of design-manufacturing-operation and maintenance full-link collaborative optimization can be realized, and the technical effects of improving the energy efficiency consistency of the heat dissipation system, reducing the dispersion of product performance and enhancing the adaptability to complex working conditions are achieved.

Description

Technical Field

[0001] The present application relates to the technical field of medium-voltage switchgear heat dissipation, and particularly to a heat conduction and air flow coupling heat dissipation system and method for a medium-voltage switchgear. Background Art

[0002] In the fields of electronic equipment and industrial equipment, thermal management technology has always been a core element to ensure system reliability. With the continuous increase in power density, traditional heat dissipation solutions are facing severe challenges.

[0003] Currently, the existing technologies mainly rely on experience-driven structural design and passive heat dissipation strategies, and their limitations are reflected in three dimensions: First, the heat dissipation structure design lacks systematic optimization. Most solutions are based on the trial-and-error method for local improvement. For example, the radiator of a certain type of inverter only increases the fin height to deal with the temperature rise problem. Although the surface temperature is reduced, it leads to volume expansion and air flow disorder, and the measured results show that the temperature of adjacent components actually rises; Second, the standardization degree of production processes is insufficient, and the high dispersion of the heat dissipation performance of similar products leads to a high difference in the failure rate of the whole machine; Third, the intelligence level of operation and maintenance strategies is low. The traditional regular maintenance mode is difficult to adapt to dynamic working conditions. For example, the air filter of an air conditioning system in a data center is cleaned according to a fixed cycle (every quarter), but it fails to respond in time when the dust concentration suddenly increases, resulting in a sharp increase in the blockage rate of the radiator and causing local overheating shutdown. Therefore, developing an integrated heat dissipation enhancement system that combines simulation optimization, intelligent production, and dynamic regulation has become an inevitable choice to break through the bottleneck of existing technologies and achieve the coordinated improvement of energy efficiency and reliability.

[0004] In summary, there are technical problems in the existing technologies that due to the rough design method, lack of production standards, and lagging operation and maintenance mechanism, the heat dissipation efficiency is unstable and the quality fluctuates, further affecting the reliability and energy efficiency performance of the equipment. Summary of the Invention

[0005] The purpose of the present application is to provide a heat conduction and air flow coupling heat dissipation system and method for a medium-voltage switchgear, so as to solve the technical problems in the existing technologies that due to the rough design method, lack of production standards, and lagging operation and maintenance mechanism, the heat dissipation efficiency is unstable and the quality fluctuates, further affecting the reliability and energy efficiency performance of the equipment.

[0006] In view of the above problems, the present application provides a heat conduction and air flow coupling heat dissipation system and method for a medium-voltage switchgear.

[0007] In a first aspect, the present application provides a heat conduction and air flow coupling heat dissipation system for a medium-voltage switchgear cabinet, which is realized by a heat conduction and air flow coupling heat dissipation method for a medium-voltage switchgear cabinet, and includes: a heat dissipation demand assessment module for assessing the heat dissipation demand of the heat source data obtained by identifying the heat sources in the medium-voltage switchgear cabinet to determine the temperature rise threshold; a heat conduction path optimization module for optimizing the heat conduction path through the heat source data and the temperature rise threshold to obtain heat dissipation structure data; a flow optimization module for performing air flow organization design and flow optimization based on the heat dissipation structure data to obtain a flow optimization scheme; a coupling simulation module for performing heat-fluid coupling simulation according to the heat dissipation structure data and the flow optimization scheme to obtain a heat-fluid simulation result; a heat dissipation enhancement module for performing structure optimization and heat dissipation enhancement on the heat-fluid simulation result and implementing engineering through the obtained heat dissipation optimized structure.

[0008] In a second aspect, the present application also provides a heat conduction and air flow coupling heat dissipation method for a medium-voltage switchgear cabinet, which is used to execute a heat conduction and air flow coupling heat dissipation system for a medium-voltage switchgear cabinet as described in the first aspect, and includes: assessing the heat dissipation demand of the heat source data obtained by identifying the heat sources in the medium-voltage switchgear cabinet to determine the temperature rise threshold; optimizing the heat conduction path through the heat source data and the temperature rise threshold to obtain heat dissipation structure data; performing air flow organization design and flow optimization based on the heat dissipation structure data to obtain a flow optimization scheme; performing heat-fluid coupling simulation according to the heat dissipation structure data and the flow optimization scheme to obtain a heat-fluid simulation result; performing structure optimization and heat dissipation enhancement on the heat-fluid simulation result and implementing engineering through the obtained heat dissipation optimized structure.

[0009] The technical solution provided in the present application has at least the following technical effects or advantages: by assessing the heat dissipation demand of the heat source data obtained by identifying the heat sources in the medium-voltage switchgear cabinet to determine the temperature rise threshold; optimizing the heat conduction path through the heat source data and the temperature rise threshold to obtain heat dissipation structure data; performing air flow organization design and flow optimization based on the heat dissipation structure data to obtain a flow optimization scheme; performing heat-fluid coupling simulation according to the heat dissipation structure data and the flow optimization scheme to obtain a heat-fluid simulation result; performing structure optimization and heat dissipation enhancement on the heat-fluid simulation result and implementing engineering through the obtained heat dissipation optimized structure, that is to say, by achieving the technical goal of collaborative optimization of the entire design-manufacturing-operation and maintenance link, the technical effects of improving the energy efficiency consistency of the heat dissipation system, reducing the product performance dispersion, and enhancing the adaptability to complex working conditions are achieved.

[0010] The above description is only an overview of the technical solution of this application. In order to understand the technical means of this application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of this application more obvious and understandable, the following specific embodiments of this application are specifically given. It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of this application, nor is it used to limit the scope of this application. Other features of this application will become easily understandable through the following specification. Brief Description of the Drawings

[0011] In order to more clearly illustrate the technical solutions in this application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only exemplary. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0012] Figure 1 It is a schematic structural diagram of a heat conduction and air flow coupling heat dissipation system for a medium-voltage switchgear cabinet of this application;

[0013] Figure 2 It is a schematic flow diagram of a heat conduction and air flow coupling heat dissipation method for a medium-voltage switchgear cabinet of this application.

[0014] Description of the reference numerals: heat dissipation demand assessment module 11, heat conduction path optimization module 12, flow optimization module 13, coupling simulation module 14, heat dissipation enhancement module 15. Detailed Embodiments

[0015] By providing a heat conduction and air flow coupling heat dissipation system and method for a medium-voltage switchgear cabinet, this application solves the technical problems in the prior art that due to the rough design method, lack of production standards, and lagging operation and maintenance mechanism, the heat dissipation efficiency is unstable and the quality fluctuates, further affecting the reliability and energy efficiency performance of the equipment. It realizes the technical goal of collaborative optimization of the entire design-manufacturing-operation and maintenance link, and achieves the technical effects of improving the energy efficiency consistency of the heat dissipation system, reducing the product performance dispersion, and enhancing the adaptability to complex working conditions.

[0016] Next, the technical solutions in this application will be clearly and completely described with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments of this application. It should be understood that this application is not limited by the exemplary embodiments described here. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application. Additionally, it should be noted that for the sake of convenience of description, only the parts related to this application are shown in the drawings rather than all of them.

[0017] Example 1, please refer to the appendix Figure 1 , this application provides a heat conduction and air flow coupling heat dissipation system for medium voltage switchgear, specifically including:

[0018] A heat dissipation demand evaluation module 11, which is used to evaluate the heat dissipation demand of the heat source data obtained by identifying the heat sources in the medium voltage switchgear and determine the temperature rise threshold.

[0019] Specifically, the heat dissipation demand evaluation module is a subsystem dedicated to quantifying the heat dissipation capacity requirements of medium voltage switchgear. The heat dissipation demand refers to the minimum heat dissipation power required to effectively discharge the heat generated inside the equipment, and its evaluation process needs to combine the heat source data and heat dissipation conditions. For example, when the heat source identification module detects that the circuit breaker is operating at a rated current of 2000 amperes and its contact resistance is 0.05 milliohms, the heating power can be calculated by the formula current squared multiplied by resistance, which is the square of 2000 amperes multiplied by 0.0005 ohms, that is, 2000 watts. This data will be used as the basic input for heat dissipation demand evaluation.

[0020] On this basis, the module analyzes the relationship between the heat source data (such as heating power, position distribution) and external environment parameters (such as ambient temperature, altitude), and establishes a heat dissipation demand model. For example, when the ambient temperature rises from 25 degrees Celsius to 40 degrees Celsius, the temperature difference between the inside and outside of the equipment decreases, and the natural convection efficiency decreases. At this time, the heat dissipation power demand needs to be increased from the original 1500 watts to 2300 watts to maintain the same temperature rise threshold. This process may involve thermal resistance network calculation or computational fluid dynamics simulation, such as verifying whether the heat dissipation capacity meets the standard by simulating the temperature field distribution under different heat dissipation schemes.

[0021] Furthermore, determining the temperature rise threshold is one of the core objectives of this module. The temperature rise threshold refers to the difference between the maximum allowable temperature inside the equipment and the ambient temperature, and its setting needs to comprehensively consider the material temperature resistance, safety redundancy and service life. For example, the epoxy resin insulation layer of a certain type of busbar can withstand a long-term temperature of 105 degrees Celsius. If the highest ambient temperature in the local area in summer is 45 degrees Celsius, the temperature rise threshold should be set to 60 degrees Celsius, and a safety margin of 5 degrees Celsius is reserved, and finally determined to be 55 degrees Celsius. This threshold will directly affect the design strength of the heat dissipation scheme. For example, when the measured temperature rise reaches 50 degrees Celsius, it is necessary to ensure that the heat dissipation system can still control the temperature within the threshold under extreme working conditions.

[0022] In addition, the evaluation results of the module will form a closed loop with the subsequent heat dissipation design. For example, if it is evaluated that the heat dissipation requirement in a certain cable joint area is 800 watts per square meter, but the existing natural convection can only provide a heat dissipation capacity of 500 watts per square meter, then forced air cooling needs to be added or the heat sink structure needs to be optimized. At this time, the temperature rise threshold output by the module (such as 55 degrees Celsius) will become the core parameter for heat sink selection and fan air volume calculation. For example, an axial flow fan with an air volume of 0.6 cubic meters per second is selected to make the wind speed in this area reach 1.5 meters per second, so as to suppress the temperature rise below 52 degrees Celsius.

[0023] The heat conduction path optimization module 12 is used to optimize the heat conduction path through the heat source data and the temperature rise threshold to obtain the heat dissipation structure data.

[0024] Specifically, the function of the heat conduction path optimization module is to improve the heat dissipation efficiency of the medium-voltage switchgear by systematically adjusting the physical channels of heat transfer. The heat conduction path refers to the transfer route of heat from the heat source to the heat dissipation terminal. For example, the entire link from the breaker contact through the copper busbar to the surface of the heat sink and then exchanging heat with the air through the heat dissipation fins. The optimization process needs to combine the heat generation power distribution in the heat source data (such as the local heat generation of the busbar reaching 800 watts per square meter) and the temperature rise threshold (such as the allowable temperature not exceeding 90 degrees Celsius), and shorten the heat conduction distance and reduce the path thermal resistance by adjusting the material selection and structural layout. For example, changing the original straight thermal bridge with a distance of 30 millimeters to a wavy path. Although the geometric length increases to 45 millimeters, the effective thermal resistance is reduced by 20% by increasing the heat conduction cross-section of the copper-aluminum composite layer.

[0025] On this basis, the module iteratively optimizes the path design parameters through a combination of thermodynamic simulation and experimental verification. For example, when a temperature difference of five degrees Celsius is identified between a certain cable joint and the heat sink, the module will recommend using a stepped thermal conductive gasket to fill the gap, increasing the contact pressure from 5 N per square centimeter to 8 N, and replacing the interface material with a nano-silicone grease with a thermal conductivity of 8 watts per meter per degree Celsius, reducing the thermal resistance of this node from 0.15 degrees Celsius per watt to 0.05 degrees Celsius per watt. This optimization directly reduces the loss of heat during the transfer process. For example, the structure that originally took 12 minutes to conduct heat from the heat source to the heat dissipation end is shortened to 8 minutes after optimization.

[0026] Furthermore, the heat dissipation structure data output by the module includes optimized material parameters, geometric dimensions, and assembly process requirements. For example, the optimized solution for a certain type of circuit breaker shows that the thickness of the copper busbar needs to be increased from 3 mm to 5 mm to expand the heat conduction cross-section, the radiator substrate needs to be replaced with an aluminum silicon carbide composite material with a thermal diffusivity of 80 square millimeters per second, and the torque of the installation bolts needs to be controlled between 8 N·m and 10 N·m to ensure uniform contact surface pressure. These data will guide the specific implementation at the production end. For example, an automatic thermal conductive adhesive coating process is added to the production line to ensure that the thickness of the filling layer is controlled within a tolerance range of 0.2 mm.

[0027] Meanwhile, the optimization process needs to balance technical indicators and cost constraints. For example, when evaluating the option of using a pure copper heat sink (thermal conductivity of 400 W / (m·°C)) to replace an aluminum alloy (thermal conductivity of 230 W / (m·°C)), although the temperature rise can be reduced by 10 °C, the material cost triples. In this case, the module may recommend a compromise solution: using a 5-mm-thick copper plating only in the key heat-generating areas, combined with the main aluminum alloy structure, to achieve a 7 °C reduction in temperature rise while the cost only increases by 40%. This trade-off analysis ensures the engineering feasibility of the solution.

[0028] The flow optimization module 13 is used to perform air flow organization design and flow optimization based on the heat dissipation structure data to obtain a flow optimization solution.

[0029] Specifically, the core function of the flow optimization module is to improve the overall efficiency of the heat dissipation system by systematically planning and improving the gas flow pattern inside the equipment. The heat dissipation structure data includes key parameters such as the layout of heat-generating components, material thermal conductivity, and geometric dimensions. For example, specific values such as the busbar spacing in a switchgear cabinet is 30 mm, the surface temperature of the circuit breaker contact is 85 °C, and the effective internal space volume of the cabinet is 2 cubic meters. These data constitute the basic input for air flow optimization. Just as a building blueprint guides the construction of a house, the heat dissipation structure data provides spatial constraints and heat source distribution information for the flow path design.

[0030] On this basis, the air flow organization design focuses on constructing an efficient heat transport channel, which essentially optimizes the air flow direction and velocity distribution. For example, considering the characteristics of concentrated heat generation at the top of the cabinet, a vertical air duct layout with bottom-in and top-out is adopted. A honeycomb-shaped air intake grille with a total area of 0.3 square meters is set at the bottom, and a deflector inclined at 15 degrees is arranged at the top to guide the hot air to rise naturally and be discharged. When the ambient temperature is 35 °C, this design can form a stable upward air flow of 0.5 m / s inside the cabinet, and the air replacement efficiency in the key area is increased by 40% compared with the disordered ventilation state.

[0031] Meanwhile, the flow optimization process iteratively adjusts the structural parameters through a combination of computational fluid dynamics (CFD) simulations and experimental tests. For example, in the initial design, the diameter of the sidewall auxiliary ventilation holes was 50 mm, and simulations showed that local eddy currents caused a 15% airflow loss. After three iterations of optimization, the holes were changed to slit-shaped openings 100 mm long and 20 mm wide, and the arrangement angle was adjusted to a 30-degree staggered distribution, increasing the airflow uniformity coefficient from 0.6 to 0.85 and reducing the standard deviation of the surface wind speed of the radiator from 0.3 m / s to 0.1 m / s.

[0032] Furthermore, the flow optimization plan needs to quantitatively output executable engineering parameters. This includes but is not limited to specific indicators such as the fan installation position (e.g., 200 mm from the heat source), the inclination angle of the deflector (e.g., 45 degrees towards the heat sink), and the ventilation hole density (e.g., 8 openings per square meter). For example, an optimization plan requires installing two axial fans with a diameter of 200 mm on the rear wall, with the rotational speed controlled at 1200 revolutions per minute, forming a through-flow air current in cooperation with the front deflector grid. Measured results show that this can reduce the temperature of the busbar from 92 °C to 78 °C and simultaneously reduce the temperature gradient inside the cabinet from 15 °C per meter to 6 °C per meter.

[0033] The coupled simulation module 14 is used to perform a thermal-fluid coupled simulation based on the heat dissipation structure data and the flow optimization plan to obtain thermal-fluid simulation results.

[0034] Specifically, the core function of the coupled simulation module is to integrate the interactions of different physical fields to evaluate the overall performance of the heat dissipation system. The heat dissipation structure data includes key parameters such as the geometric dimensions of the equipment, material properties, and heat source distribution. For example, the specific values of the copper bar spacing inside a certain type of switch cabinet are 20 mm, the thermal conductivity of the insulating material is 0.5 W / (m·°C), and the heat generation power of the breaker contacts is 300 W. These data provide the basis for the spatial configuration and thermal characteristics of the simulation. Just as building structure drawings provide a support framework for mechanical analysis, the heat dissipation structure data defines the physical carrier for heat generation and transfer.

[0035] On this basis, the flow optimization plan provides airflow organization strategies verified by engineering. For example, installing louvered air inlets with a total area of 0.25 square meters at the bottom of the cabinet, arranging deflectors inclined at 30 degrees at the top, and installing two axial fans with a diameter of 150 mm to form forced convection. These optimized flow parameters are like traffic control plans, ensuring that heat can be effectively carried away from the heat-generating area by specifying elements such as the air flow path (e.g., a Z-shaped flow channel from bottom to top) and the flow velocity range (e.g., the wind speed in key areas is not less than 0.8 m / s).

[0036] When performing thermal-fluid coupling simulation, the module simultaneously solves the heat conduction equation and the fluid dynamics equation. For example, when calculating the temperature field of a bus bar, not only the heat conduction process of the copper material itself (generating a temperature rise of 3 degrees Celsius per meter along the length direction) is considered, but also the convective heat transfer on the surface is calculated synchronously (when the flow velocity increases from 0.5 meters per second to 1.2 meters per second, the convective heat transfer coefficient increases from 15 watts per square meter per degree Celsius to 45 watts per square meter per degree Celsius). This two-way coupling is like the meshing drive of a gear set, ensuring that the change in air physical properties caused by temperature changes (such as the air density at 60 degrees Celsius being about 10% lower than that at 20 degrees Celsius) can be real-time fed back into the flow field calculation.

[0037] The thermal-fluid simulation results obtained through iterative calculation include visualization data such as temperature distribution contour maps and velocity vector diagrams. For example, a certain simulation shows that when the fin gap of the radiator in the original design is 3 millimeters, a stagnant area is formed at the rear, resulting in a local temperature reaching 98 degrees Celsius; after optimizing to a 5-millimeter gap, the air flow penetration depth increases by 40 percentage points, and the maximum temperature drops to 86 degrees Celsius. These quantitative results are like medical imaging scans, accurately locating the heat dissipation bottleneck and guiding structural improvement.

[0038] The heat dissipation enhancement module 15 is used to optimize the structure and enhance the heat dissipation of the thermal-fluid simulation results, and implement the engineering through the obtained heat dissipation optimized structure.

[0039] Specifically, the core function of the heat dissipation enhancement module is to improve the heat dissipation efficiency of the device through systematic improvement. The thermal-fluid simulation results include quantitative data such as temperature field distribution and air flow velocity vector. For example, a simulation of a certain power module shows that there is a temperature gradient of 12 degrees Celsius at the end of its heat sink, and a reverse eddy current of 0.2 meters per second is formed on the side wall. These data are like the road condition information on a navigator, accurately identifying the weak links and optimization directions in the heat dissipation system, providing a scientific basis for subsequent improvement.

[0040] When performing structural optimization, it is necessary to adjust the physical configuration according to the problems revealed by the simulation. For example, the radiator of a certain photovoltaic inverter was originally a straight fin structure, and the simulation found that there was an overheating area of seven degrees Celsius in the middle area. By changing the fins to a wavy arrangement (amplitude 5 millimeters, wavelength 15 millimeters) and adding eight ventilation holes with a diameter of 3 millimeters at the bottom, the air flow disturbance increased by 40%. The actual measurement shows that the temperature in this area dropped by 20 degrees Celsius. This optimization is like dredging the silted section of a river, improving the heat dissipation efficiency by changing the geometric shape.

[0041] In the heat dissipation enhancement stage, active or passive strengthening measures need to be introduced. For example, the surface temperature of the power module of a certain charging pile reaches 95 degrees Celsius under full load. After using a phase change material (melting point 45 degrees Celsius, latent heat 220 kJ / kg) to fill the gaps of the heat sink, the temperature fluctuation range is reduced from ±8 degrees Celsius to ±2 degrees Celsius, and the peak temperature drops to 83 degrees Celsius. This enhancement method is like adding a temperature buffer layer to the heat-generating body, stabilizing the thermal environment through phase change heat absorption.

[0042] When transforming the optimization plan into a physical object through engineering implementation, it is necessary to consider both process feasibility and cost control. For example, in an improvement plan for an industrial control cabinet, the original integral top cover is changed to a double-layer sandwich structure. While maintaining the structural strength, the heat transfer coefficient of the shell is reduced from 12 watts per square meter per degree Celsius to 3 watts. During the implementation process, it is necessary to adjust the opening angle of the stamping die (from 90 degrees to 120 degrees) to ensure that the aerogel filling density reaches more than 98%, which directly affects the final heat dissipation effect.

[0043] The described medium-voltage switchgear heat conduction and air flow coupling heat dissipation system can achieve the technical goal of collaborative optimization of the entire design-manufacturing-operation and maintenance link, and achieve the technical effects of improving the energy efficiency consistency of the heat dissipation system, reducing the product performance dispersion, and enhancing the adaptability to complex working conditions.

[0044] Furthermore, the heat dissipation demand assessment module includes: a heat source identification unit for identifying the heat sources of the medium-voltage switchgear to obtain heat sources, where the heat sources include circuit breakers, busbars, and cable joints; a temperature rise threshold determination unit for determining the temperature rise threshold according to the temperature resistance state of the insulating materials of the circuit breakers, busbars, and cable joints, in combination with the ambient temperature.

[0045] Specifically, the role of the heat source identification unit is to locate and analyze the key components inside the medium-voltage switchgear that may generate heat. The heat source refers to the components that generate heat due to current passing through conductors or contact resistance during equipment operation. For example, the heat generated by the arc during the opening and closing of the circuit breaker, the Joule heat generated by the large current passing through the busbar conductor material, and the temperature rise caused by the local resistance increase due to poor contact of the cable joint. The identification of heat sources is usually achieved through infrared thermal imaging technology or current-resistance relationship calculation. For example, when a current of 630 amperes flows through a copper busbar with a cross-sectional area of 100 square millimeters, its heating power can be estimated by the formula of current squared multiplied by the resistance value, and then its heat load intensity can be determined.

[0046] The function of the temperature rise threshold determination unit is to set the allowable temperature rise range by combining the equipment material characteristics and environmental conditions. Specifically, there is an upper temperature limit for the insulating materials (such as epoxy resin or silicone rubber) of components such as circuit breakers, busbars, and cable joints. For example, the maximum withstand temperature of the insulating sleeve of a certain type of circuit breaker is 105 degrees Celsius. When the ambient temperature is 40 degrees Celsius, the allowable temperature rise threshold of the equipment is the difference of 65 degrees Celsius between the two. This process needs to comprehensively consider the material aging curve and safety redundancy. For example, the insulation layer of a certain cable joint will accelerate aging when it is continuously above 90 degrees Celsius for a long time. Therefore, the threshold needs to be set at 85 degrees Celsius to reserve a safety margin of 10 degrees Celsius.

[0047] Meanwhile, the collaborative work of these two units constitutes the basic logic of the heat dissipation design. For example, when the heat source identification unit detects that the heat generation power of a certain busbar reaches 800 watts per square meter at a full load current of 1250 amperes, the temperature rise threshold determination unit will calculate the maximum allowable temperature rise of 65 degrees Celsius based on the heat resistance of the insulating material in this area being 110 degrees Celsius and the highest ambient temperature in summer being 45 degrees Celsius. If the simulation or actual measurement shows that the temperature in this area reaches 70 degrees Celsius, it will trigger the optimization requirement of the heat dissipation system, such as increasing the area of the heat sink or increasing the forced air cooling wind speed to 2 meters per second. This progressive relationship reflects the closed-loop logic from problem identification to solution. For example, inaccurate identification of the heat source of the cable joint may lead to deviation in threshold calculation, and too high threshold setting may cause insulation failure accidents. Through the precise cooperation of these two units, the stable operation of the equipment within the safe temperature range is ultimately achieved.

[0048] Furthermore, the heat conduction path optimization module includes: a filling unit for filling the gap between the heat generating element and the heat dissipation substrate with a high thermal conductivity material by using the heat source data and the temperature rise threshold to obtain a result of reduced contact thermal resistance; an increasing unit for increasing the area of the heat dissipation fins to obtain a result of enlarged heat dissipation area; a thermal simulation verification unit for performing thermal simulation verification on the result of reduced contact thermal resistance and the result of enlarged heat dissipation area to obtain heat dissipation structure data.

[0049] Specifically, the role of the filling unit is to inject a substance with excellent thermal conductivity into the gap between the heat generating component and the heat dissipation component, thereby improving the heat transfer efficiency between the two. High thermal conductivity materials refer to thermal grease, thermal pads, or metal matrix composites. For example, the thermal conductivity of a certain type of thermal grease is 5 watts per meter per degree Celsius, which can form a continuous heat conduction path on the contact surface. When there is an assembly gap of 0.1 mm between the circuit breaker contact and the aluminum heat dissipation substrate, filling this thermal grease can reduce the contact thermal resistance from the original 0.5 degrees Celsius per square centimeter per watt to 0.1 degrees Celsius. This process is called reduction of contact thermal resistance. For example, after filling a phase change material between a certain busbar and the radiator, the temperature difference between the contact surfaces drops from 8 degrees Celsius to 3 degrees Celsius, significantly improving the heat flux density.

[0050] On this basis, the function of the unit is to expand the surface area of the heat dissipation structure, and enhance the heat dissipation capacity of natural convection or forced air cooling by designing more or larger heat dissipation fins. The heat dissipation fins are usually manufactured by aluminum extrusion process, and their height, spacing and thickness parameters directly affect the heat dissipation efficiency. For example, increasing the fin height of the original heat sink from 20 mm to 35 mm and reducing the fin spacing from 10 mm to 6 mm can expand the effective heat dissipation area by about 60%. When the heat dissipation area of a certain cable joint radiator increases from 0.2 square meters to 0.32 square meters, its surface temperature can drop from 95 degrees Celsius to 82 degrees Celsius at the same ambient temperature, which is the direct benefit brought by expanding the heat dissipation area.

[0051] At the same time, the thermal simulation verification unit quantitatively evaluates the above improvement measures through computer simulation means. This unit uses finite element analysis software (such as ANSYS Icepak) to establish a three-dimensional thermal model, inputs data such as the thermal conductivity of the filling material and the geometric parameters of the heat dissipation fins, and simulates the temperature distribution of the equipment under rated working conditions. For example, simulating the heat dissipation structure of an improved circuit breaker shows that its highest temperature drops from 105 degrees Celsius before transformation to 89 degrees Celsius, and the temperature difference at the contact surface is controlled within 5 degrees Celsius, verifying the synergistic effect of reducing contact thermal resistance and expanding the heat dissipation area. The heat dissipation structure data output in this process includes temperature field cloud maps, heat flux density distributions, and key point temperature rise curves, providing a basis for subsequent engineering implementation.

[0052] Furthermore, the flow optimization module includes: a convection design unit for performing natural convection design and calculating the ventilation hole area; a duct optimization unit for identifying key heat generation areas based on the heat dissipation structure data, installing axial fans in the key heat generation areas for duct optimization, and obtaining the flow optimization plan.

[0053] Specifically, the core function of the convection design unit is to plan the internal air flow path of the equipment according to the principles of thermodynamics, and achieve passive heat dissipation by reasonably setting the opening size and position. Natural convection refers to the air flow cycle formed by the change in air density caused by temperature difference without relying on mechanical devices. For example, the hot air in the high-temperature area rises and is discharged from the top ventilation hole, while the cold air at the bottom enters to form a cycle. When the total heat generation power of a certain switchgear is 1500 watts, the total required ventilation hole area is calculated according to the heat balance equation: assuming an ambient temperature of 30 degrees Celsius, an allowable internal temperature rise of 40 degrees Celsius, the specific heat capacity of air is 1000 joules per kilogram per degree Celsius, the air density is 1.165 kilograms per cubic meter, and the air volume that needs to be exchanged per hour is about 60 cubic meters, corresponding to an effective ventilation hole area of 0.2 square meters. Factors such as the pressure drop of the dust filter and the hole shape factor need to be considered in this process. For example, when changing the circular ventilation hole to a louver structure, the actual opening area needs to be increased by 20% to compensate for the air flow resistance.

[0054] On this basis, the air duct optimization unit actively strengthens heat dissipation for the locally high-temperature areas identified in the heat dissipation structure data. The determination of the key heat-generating areas is usually based on temperature field analysis. For example, when it is detected by an infrared thermal imager that the temperature of a certain circuit breaker contact area reaches 95 degrees Celsius, exceeding the adjacent area by 15 degrees Celsius, it is marked as the key area for optimization. The selection and layout of the axial fans need to match the air duct structure. For example, two low-noise fans with a diameter of 200 mm and an air volume of 0.8 cubic meters per second are installed on the side wall of the cabinet to form a directional air flow that enters from the bottom and exhausts from the top. When the fans are tilted at an angle of 30 degrees towards the heat-generating element, the wind speed in this area can be increased from 0.3 m per second in natural convection to 2.5 m per second, and the corresponding convective heat transfer coefficient can be increased from 10 W per square meter per degree Celsius to 55 W, thereby reducing the contact temperature to 82 degrees Celsius.

[0055] At the same time, when formulating the flow optimization plan, it is necessary to balance the heat dissipation efficiency and the equipment protection level. For example, while increasing the forced convection of the fans, it is necessary to set a dust-proof filter with an IP54 protection level at the air inlet, and its pore size of 0.5 mm can block most suspended particles. At this time, it is necessary to recalculate the ventilation resistance: when the pressure drop caused by the filter increases by 15 Pa, the static pressure of the fan needs to be increased from the initial design value of 30 Pa to 45 Pa to ensure that the air volume maintains the design value. This adjustment may involve replacing the fan model. For example, a model with a rotation speed of 2500 revolutions per minute is selected to replace the original 2000-revolution model. Although the power consumption increases from 40 W to 55 W, it ensures that the heat dissipation performance meets the standard.

[0056] Furthermore, the coupled simulation module includes: a coupling unit for obtaining multi-physical field modeling data by coupling the heat conduction equation of the coupled heat dissipation structure data and the fluid dynamics equation of the flow optimization plan; a boundary condition setting unit for setting boundary conditions for the multi-physical field modeling data to obtain the heat-fluid simulation results.

[0057] Specifically, the core role of the coupling unit is to integrate the mathematical models of different physical fields to achieve system-level simulation analysis. The heat conduction equation describes the law of heat transfer inside a solid. For example, according to Fourier's law, the temperature drop gradient of a copper busbar from 80 degrees Celsius to 50 degrees Celsius of the radiator is calculated, involving a key parameter of the material thermal conductivity of 380 W per meter per degree Celsius. The fluid dynamics equation describes the gas flow behavior, such as using the Navier-Stokes equation to simulate the pressure distribution change when air flows through the heat sink at a speed of 2 m per second. When these two equations are correlated through the coupling unit, for example, the surface temperature of the radiator is used as the thermal boundary condition of the fluid domain, and at the same time, the air flow velocity is input as the convective heat transfer coefficient of the solid domain, a closed-loop solution system is formed. This two-way coupling is like gear meshing, ensuring that the physical reality of the mutual influence between heat transfer and air flow movement is fully modeled.

[0058] Next, the boundary condition setting unit defines the constraint parameters of the computational environment for the multi-physics model. For example, in the heat dissipation simulation of a switchgear cabinet, the heat flux density of the busbar contact surface is set to 800 watts per square meter to simulate the actual load. The ventilation opening at the bottom of the cabinet is set as a pressure inlet condition and assigned the value of standard atmospheric pressure. At the same time, the top exhaust port is defined as a free outflow boundary. These settings are like adding problem-solving conditions to a system of mathematical equations, ensuring the physical rationality and uniqueness of the solution. In particular, when the axial flow fan is running, a moving reference frame needs to be set in the rotating area, specifying its rotational speed as 1500 revolutions per minute, and the no-slip wall condition is applied on the fan blade surface to accurately simulate the airflow characteristics generated by the fan.

[0059] In addition, the accuracy of the heat-fluid simulation results highly depends on the precise characterization of the boundary conditions. For example, in the case of natural convection, the environmental heat dissipation condition with a combined heat transfer coefficient of 10 watts per square meter per degree Celsius needs to be set on the outer wall surface of the cabinet. This value combines the effects of radiative heat dissipation and natural convection. If this coefficient is mis-set to 5 watts, the simulated temperature may be about 15 degrees Celsius higher than the measured value. Such an error will directly affect the feasibility assessment of the heat dissipation solution. Therefore, the boundary condition setting unit usually has an empirical database built-in, such as a library of emissivity parameters corresponding to different surface treatment processes, to ensure that the set values are close to the engineering reality.

[0060] Furthermore, the interactive verification of multi-physics modeling data is a crucial step to ensure the coupling effectiveness. When the heat conduction equation calculates the base temperature of the radiator to be 65 degrees Celsius, the fluid dynamics module needs to verify the rationality of the values of air physical properties (such as density, viscosity) at this temperature. For example, at an air temperature of 60 degrees Celsius, the dynamic viscosity is approximately 2.01 times 10 to the power of -5 square meters per second. If the physical properties are not updated with the temperature, it will cause an error in the flow velocity calculation exceeding 20%. This cross-equation variable transfer requires the establishment of a strict data interface, such as realizing the real-time interaction of the temperature fields in the solid and fluid domains through the conjugate heat transfer algorithm.

[0061] Furthermore, the heat dissipation enhancement module includes: a heat dissipation structure improvement unit for improving the heat dissipation structure according to the heat-fluid simulation results to obtain an optimized component layout; a cooling enhancement unit for actively enhancing the cooling of key components and obtaining the heat dissipation optimized structure in combination with the optimized component layout.

[0062] Specifically, the core function of the heat dissipation structure improvement unit is to iteratively optimize the thermal management architecture of the equipment based on the simulation analysis results. The thermal-flow simulation results include quantitative data such as temperature field distribution and velocity vector diagram. For example, the simulation of a power module shows that there is a temperature gradient of 15 degrees Celsius on its side, and a reflow zone of 0.3 meters per second appears at the end of the heat sink. These results are like diagnostic reports, accurately revealing the location and cause of the heat dissipation bottleneck, and providing direction for structural improvement. The improvement of the heat dissipation structure refers to improving the heat dissipation efficiency by adjusting the physical configuration. For example, the originally parallel arranged power devices are changed to a staggered layout, and the distance between adjacent components is increased from 10 mm to 25 mm. This can expand the air circulation cross-sectional area by 60%, and actual measurements show that the surface temperature of the components has dropped by 18 degrees Celsius.

[0063] When optimizing the structure, it is necessary to comprehensively consider the adjustment of multi-dimensional parameters. For example, the busbar bracket of a switch cabinet originally used a 5 mm thick steel structure. Thermal simulation showed that it became a thermal bridge, resulting in abnormal temperature rise. The improved unit replaced it with a 3 mm thick aluminum alloy bracket and added six 8 mm diameter ventilation holes. The thermal conductivity of the material dropped from 45 watts per meter per degree Celsius to 205 watts, and the ventilation hole area accounted for 15%. This improvement not only cuts off the heat conduction path (the bracket temperature rise is reduced by 20 degrees Celsius), but also improves the local airflow (the wind speed is increased by 0.4 meters per second), reflecting the dual benefits of structural optimization.

[0064] The cooling enhancement unit focuses on active heat dissipation enhancement of key heat-generating components. Key components refer to components with the highest risk of over-temperature. For example, the junction temperature of the IGBT module in a certain inverter reaches 145 degrees Celsius when fully loaded, which exceeds the safety threshold by 5 degrees Celsius. In response to this, active cooling enhancement can use micro-vortex tube cooling technology, install cooling channels on the surface of the module, and pass compressed air with a pressure of 600 kPa. Transient cooling is achieved through the Joule-Thomson effect. The junction temperature can be controlled at 96 degrees Celsius in actual measurements. This active intervention is like an emergency measure, achieving fast and accurate temperature control in a limited space.

[0065] When combining optimized layout with active cooling, it is necessary to ensure system-level coordination. For example, in a cabinet improvement, the radiator position was moved back 50 mm to reserve air duct space, and an axial fan group with a diameter of 100 mm was installed. When the fan runs at 1500 revolutions per minute, the optimized flow channel increases the air volume to 1.2 cubic meters per second, compared with 0.7 cubic meters per second before the improvement, and the heat transfer coefficient of the radiator surface increases from 30 watts per square meter per degree Celsius to 65 watts. This collaborative design is like the cooperation of a symphony orchestra, with structural improvements setting the stage and active cooling playing a strong note to jointly achieve the temperature control goal.

[0066] Furthermore, the heat dissipation enhancement module further includes: a standardization production unit for standardizing the production of the heat dissipation optimization structure and generating a maintenance strategy for the production process through an intelligent monitoring system; and an execution unit for executing the maintenance strategy through the intelligent monitoring system.

[0067] Specifically, the core role of the standardization production unit is to convert a verified heat dissipation design solution into a replicable manufacturing process. The heat dissipation optimization structure refers to the final improved solution determined through simulation and experiments. For example, a certain type of radiator is determined to use aluminum fins with a thickness of 2 millimeters, a cross-arrangement with a spacing of 5 millimeters, and twelve diversion holes with a diameter of 3 millimeters at the bottom. These parameters are like the standard drawings of a building, providing precise dimensional tolerances (such as the fin height tolerance controlled within ±0.1 millimeter) and material specifications (aluminum alloy grade 6063-T5) for mass production, ensuring the consistency of product performance.

[0068] During the implementation of standardization production, a stable process control system needs to be established. For example, after the improvement of the heat dissipation structure of an electronic device housing, the production line adjusts the opening angle of the stamping die to 120 degrees, reduces the stamping speed from 15 times per minute to 10 times to ensure forming accuracy, and at the same time changes to an aluminum alloy plate with a thermal conductivity of 230 watts per meter per degree Celsius. This standardization transformation is like the metronome of an assembly line, ensuring that each product meets the designed heat dissipation performance (the flatness error of the radiator substrate is less than or equal to 0.05 millimeter) by solidifying process parameters (such as the welding temperature of 380 degrees Celsius for 30 seconds).

[0069] The intelligent monitoring system plays the role of a quality guardian in this process. For example, in the injection molding process of the heat sink, the system real-time monitors twelve parameters such as the mold temperature (controlled within the range of 180 degrees Celsius to 200 degrees Celsius) and the injection pressure (maintained at 600 MPa). When it detects that the deviation of the screw rotation speed exceeds 5%, it automatically triggers an alarm. These monitoring data are like the health indicators of the production line, building a quality protection network covering the entire process by collecting process data 200 times per minute.

[0070] The maintenance strategy generated by analyzing production data has a predictive feature. The strategy formulation is like an automobile maintenance plan, based on dual indicators of operation duration and performance degradation, shortening the failure downtime. The execution unit converts the maintenance plan into specific operations. The intelligent monitoring system is converted into an execution center at this stage. For example, when the barrel temperature sensor of the injection molding machine detects an abnormal value, it immediately cuts off the heating power supply and starts the cooling program, and at the same time pushes an alarm message containing a fault code (such as E-045) and a disposal guide to the operation and maintenance personnel.

[0071] In summary, the medium-voltage switchgear heat conduction and air flow coupling heat dissipation system provided by the present application has the following technical effects: by evaluating the heat dissipation requirements for the heat source data obtained from identifying the heat sources in the medium-voltage switchgear, the temperature rise threshold is determined; through optimizing the heat conduction path with the heat source data and the temperature rise threshold, the heat dissipation structure data is obtained; based on the heat dissipation structure data, the air flow organization design and flow optimization are carried out to obtain the flow optimization plan; according to the heat dissipation structure data and the flow optimization plan, the heat-fluid coupling simulation is performed to obtain the heat-fluid simulation results; the structure is optimized and the heat dissipation is enhanced for the heat-fluid simulation results, and the engineering implementation is carried out through the obtained optimized heat dissipation structure. That is to say, by achieving the technical goal of collaborative optimization of the entire design-manufacturing-operation and maintenance link, the technical effects of improving the energy efficiency consistency of the heat dissipation system, reducing the product performance dispersion, and enhancing the adaptability to complex working conditions are achieved.

[0072] Embodiment 2. Based on the medium-voltage switchgear heat conduction and air flow coupling heat dissipation system in the foregoing embodiment and with the same inventive concept, the present application further provides a medium-voltage switchgear heat conduction and air flow coupling heat dissipation method. Please refer to the attached Figure 2 , including: evaluating the heat dissipation requirements for the heat source data obtained from identifying the heat sources in the medium-voltage switchgear to determine the temperature rise threshold; optimizing the heat conduction path with the heat source data and the temperature rise threshold to obtain the heat dissipation structure data; carrying out the air flow organization design and flow optimization based on the heat dissipation structure data to obtain the flow optimization plan; performing the heat-fluid coupling simulation according to the heat dissipation structure data and the flow optimization plan to obtain the heat-fluid simulation results; optimizing the structure and enhancing the heat dissipation for the heat-fluid simulation results, and carrying out the engineering implementation through the obtained optimized heat dissipation structure.

[0073] Furthermore, the medium-voltage switchgear heat conduction and air flow coupling heat dissipation method further includes: identifying the heat sources of the medium-voltage switchgear to obtain heat sources, where the heat sources include circuit breakers, busbars, and cable joints; determining the temperature rise threshold according to the temperature resistance state of the insulating materials of the circuit breakers, busbars, and cable joints and in combination with the ambient temperature.

[0074] Furthermore, the medium-voltage switchgear heat conduction and air flow coupling heat dissipation method further includes: filling the space between the heating element and the heat dissipation substrate with a high thermal conductivity material by using the heat source data and the temperature rise threshold to obtain the result of reduced contact thermal resistance; increasing the area of the heat dissipation fins to obtain the result of enlarged heat dissipation area; performing heat simulation verification on the result of reduced contact thermal resistance and the result of enlarged heat dissipation area to obtain the heat dissipation structure data.

[0075] Further, the method for heat conduction and air flow coupled heat dissipation of a medium voltage switchgear cabinet further includes: performing natural convection design and calculating the area of ventilation holes; identifying key heat generating areas based on the heat dissipation structure data, installing axial fans in the key heat generating areas for air duct optimization, and obtaining the flow optimization scheme.

[0076] Further, the method for heat conduction and air flow coupled heat dissipation of a medium voltage switchgear cabinet further includes: obtaining multi-physical field modeling data through the heat conduction equation of the coupled heat dissipation structure data and the fluid dynamics equation of the flow optimization scheme; setting boundary conditions for the multi-physical field modeling data to obtain the heat-fluid simulation results.

[0077] Further, the method for heat conduction and air flow coupled heat dissipation of a medium voltage switchgear cabinet further includes: improving the heat dissipation structure according to the heat-fluid simulation results to obtain an optimized component layout; enhancing the active cooling of key components, and combining the optimized component layout to obtain the optimized heat dissipation structure.

[0078] Further, the method for heat conduction and air flow coupled heat dissipation of a medium voltage switchgear cabinet further includes: standardizing the production of the optimized heat dissipation structure, generating a maintenance strategy for the production process through an intelligent monitoring system; and executing the maintenance strategy through the intelligent monitoring system.

[0079] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The heat conduction and air flow coupled heat dissipation system and specific examples in the foregoing Embodiment 1 are equally applicable to the method for heat conduction and air flow coupled heat dissipation of a medium voltage switchgear cabinet in this embodiment. Through the foregoing detailed description of the heat conduction and air flow coupled heat dissipation system of a medium voltage switchgear cabinet, those skilled in the art can clearly know the method for heat conduction and air flow coupled heat dissipation of a medium voltage switchgear cabinet in this embodiment. Therefore, for the sake of brevity of the specification, it will not be described in detail herein.

[0080] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0081] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalent technologies, the present application is also intended to include these changes and variations.

Claims

1. A medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system, characterized in that: include: The heat dissipation demand assessment module is used to evaluate the heat dissipation demand of the heat source data obtained by heat source identification in the medium-voltage switchgear and determine the temperature rise threshold; A heat conduction path optimization module, used to optimize the heat conduction path through the heat source data and the temperature rise threshold to obtain heat dissipation structure data; A flow optimization module, used to perform airflow organization design and flow optimization based on the heat dissipation structure data to obtain a flow optimization solution; A coupling simulation module, used for performing a thermal-fluid coupling simulation according to the heat dissipation structure data and the flow optimization scheme to obtain a thermal-fluid simulation result; The heat dissipation enhancement module is used to perform structural optimization and heat dissipation enhancement on the thermal-fluid simulation results, and to perform engineering implementation through the obtained heat dissipation optimized structure.

2. A medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system according to claim 1, characterized in that: The heat dissipation demand assessment module comprises: A heat source identification unit, used for identifying the heat source of the medium voltage switch cabinet to obtain the heat source, wherein the heat source includes a circuit breaker, a bus bar and a cable connector; The temperature rise threshold determination unit is used to determine the temperature rise threshold according to the temperature resistance state of the insulating materials of the circuit breaker, busbar and cable connector in combination with the ambient temperature.

3. A medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system as claimed in claim 1, characterized in that: The heat conduction path optimization module comprises: A filling unit, used to fill the space between the heating element and the heat dissipation substrate with a high thermal conductivity material according to the heat source data and the temperature rise threshold, so as to obtain a contact thermal resistance reduction result; Add units to increase the area of ​​the heat dissipation ribs, and obtain the result of expanding the heat dissipation area; The thermal simulation verification unit is used to perform thermal simulation verification on the contact thermal resistance reduction result and the heat dissipation area enlargement result to obtain heat dissipation structure data.

4. A medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system according to claim 1, characterized in that: The flow optimization module comprises: Convection design unit, used to perform natural convection design and calculate ventilation hole area; The air duct optimization unit is used to identify key heating areas based on the heat dissipation structure data, install axial fans in the key heating areas to optimize the air duct, and obtain the flow optimization solution.

5. A medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system as claimed in claim 1, characterized in that: The coupling simulation module comprises: A coupling unit, used for obtaining multi-physics field modeling data by coupling the heat conduction equation of the heat dissipation structure data with the fluid dynamics equation of the flow optimization scheme; The boundary condition setting unit is used to set the boundary conditions for the multi-physics field modeling data to obtain the thermal-fluid simulation result.

6. A medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system according to claim 1, characterized in that: The heat dissipation enhancement module comprises: A heat dissipation structure improvement unit, used to improve the heat dissipation structure according to the heat-flow simulation result to obtain an optimized component layout; A cooling enhancement unit is used to actively enhance cooling of key components, and is combined with the optimized component layout to obtain the heat dissipation optimization structure.

7. A medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system according to claim 1, characterized in that: The heat dissipation enhancement module further includes: A standardized production unit, used for carrying out standardized production of the heat dissipation optimization structure, and generating a maintenance strategy for the production process through an intelligent monitoring system; An execution unit is used to execute the maintenance strategy through the intelligent monitoring system.

8. A heat dissipation method for medium voltage switch cabinet by heat conduction and airflow coupling, characterized in that: The steps for implementing the medium voltage switch cabinet heat conduction and airflow coupling heat dissipation system as described in any one of claims 1 to 7 include: Evaluate the heat source demand based on the heat source data obtained from heat source identification in the medium voltage switchgear and determine the temperature rise threshold; Optimizing the heat conduction path through the heat source data and the temperature rise threshold to obtain heat dissipation structure data; Perform airflow organization design and flow optimization based on the heat dissipation structure data to obtain a flow optimization solution; Performing a thermal-fluid coupling simulation according to the heat dissipation structure data and the flow optimization scheme to obtain a thermal-fluid simulation result; The heat-flow simulation results are subjected to structural optimization and heat dissipation enhancement, and engineering implementation is performed using the obtained heat dissipation optimized structure.

Images