Display module, heat dissipation composite film and display device

Abstract

The invention discloses a display module, a heat dissipation composite film and a display device. The display module comprises a display panel, a heat dissipation composite film and a flexible circuit board. A first metal conductor layer of the heat dissipation composite film is provided with a first glue leakage hole communicated with the first glue layer; a first electromagnetic shielding layer of the flexible circuit board is provided with a first electric leakage hole communicated with a second metal conductor layer, and the first electric leakage hole is located in the edge area of the first electromagnetic shielding layer. The orthographic projection of the first electromagnetic shielding layer on the first plane is located in the orthographic projection of the first glue leakage hole on the first plane, the thickness of the first electromagnetic shielding layer is smaller than that of the first metal conductor layer, and the orthographic projection of the first electric leakage hole on the first plane at least partially coincides with the orthographic projection of the first metal conductor layer on the first plane. According to the display module, hard contact between the second metal conductor layer and the first metal conductor layer can be achieved, the grounding stability of the display module is improved, and the grounding impedance of the display module meets the design requirement.

Description

Technical Field

[0001] This application belongs to the technical field of display devices, and particularly relates to a display module, a heat dissipation composite film, and a display device. Background Art

[0002] In the related art, the display module realizes the grounding function of the flexible printed circuit (FPC) through conductive adhesive bridging. However, this implementation method of the grounding function often has problems such as poor grounding impedance and unstable grounding.

[0003] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0004] This application aims to at least solve to a certain extent the technical problems of poor grounding impedance and unstable grounding existing in the display module. To this end, this application provides a display module, a heat dissipation composite film, and a display device.

[0005] A display module provided by an embodiment of this application, the display module includes:

[0006] A display panel, the display panel includes a display area and a bonding area connected to the display area;

[0007] A heat dissipation composite film, the heat dissipation composite film is at least laminated on the non-display side of the display area, the heat dissipation composite film includes a first adhesive layer and a first metal conductor layer laminated, the first metal conductor layer is located on the side of the first adhesive layer away from the display area, and the first metal conductor layer is provided with a first glue leakage hole communicating with the first adhesive layer; and,

[0008] A flexible printed circuit board, the flexible printed circuit board includes a first connection portion and a second connection portion connected to the first connection portion, the first connection portion is connected to the bonding area, at least the second connection portion is located on the side of the heat dissipation composite film away from the display area, the second connection portion includes a first electromagnetic shielding layer and a second metal conductor layer laminated, the first electromagnetic shielding layer is located on the side of the second metal conductor layer close to the first metal conductor layer, the first electromagnetic shielding layer is provided with a first leakage hole communicating with the second metal conductor layer, and the first leakage hole is located in the edge area of the first electromagnetic shielding layer;

[0009] Among them, the orthographic projection of the first electromagnetic shielding layer on the first plane is located within the orthographic projection of the first glue leakage hole on the first plane. The thickness of the first electromagnetic shielding layer is less than the thickness of the first metal conductor layer. The orthographic projection of the first leakage hole on the first plane coincides at least partially with the orthographic projection of the first metal conductor layer on the first plane. The first plane is the plane where the display area is located.

[0010] In some embodiments, the thickness of the first electromagnetic shielding layer is 10 μm to 30 μm less than the thickness of the first metal conductor layer.

[0011] In some embodiments, the first glue layer is a silicone gel layer.

[0012] In some embodiments, the heat dissipation composite film further includes a buffer layer. The buffer layer is laminated between the first metal conductor layer and the first glue layer. The buffer layer is provided with a second glue leakage hole communicating with the first glue layer. The orthographic projection of the first electromagnetic shielding layer on the first plane is located within the orthographic projection of the second glue leakage hole on the first plane.

[0013] In some embodiments, an adhesive is provided on one side of the buffer layer close to the first metal conductor layer.

[0014] In some embodiments, the heat dissipation composite film further includes a protective layer. The protective layer is laminated on one side of the first metal conductor layer away from the first glue layer. The protective layer is provided with a third glue leakage hole communicating with the first glue layer. The orthographic projection of the first electromagnetic shielding layer on the first plane is located within the orthographic projection of the third glue leakage hole on the first plane. The protective layer is further provided with a second leakage hole communicating with the first metal conductor layer. The orthographic projection of the first leakage hole on the first plane is located within the orthographic projection of the second leakage hole on the first plane.

[0015] In some embodiments, an adhesive is provided on one side of the protective layer close to the first metal conductor layer.

[0016] In some embodiments, the second connecting portion further includes a second electromagnetic shielding layer and a metal bridging body. The second electromagnetic shielding layer is laminated on one side of the second metal conductor layer away from the first electromagnetic shielding layer. The second electromagnetic shielding layer is provided with a third leakage hole communicating with the second metal conductor layer. The metal bridging body is connected to the second metal conductor layer and is located within the third leakage hole.

[0017] The display module further includes a protective composite film disposed on a side of the second electromagnetic shielding layer away from the display area. The protective composite film includes a first insulating layer, a third metal conductor layer, and a second insulating layer that are stacked in sequence. The first insulating layer is located on a side of the third metal conductor layer close to the second electromagnetic shielding layer. The third metal conductor layer includes a conductor region and a bridging region connected to the conductor region.

[0018] Wherein, a positive projection of the conductor region on the first plane is located within a positive projection of the first insulating layer on the first plane, a positive projection of the bridging region on the first plane is located outside the positive projection of the first insulating layer on the first plane, and at least a part of the positive projection of the bridging region on the first plane coincides with a positive projection of the metal bridging body on the first plane; a thickness by which the metal bridging body exceeds a side of the second electromagnetic shielding layer away from the third metal conductor layer is at least greater than a thickness of the first insulating layer; positive projections of the third metal conductor layer and the first insulating layer on the first plane are both located within a positive projection of the second insulating layer on the first plane.

[0019] In some embodiments, the third leakage hole is located in an internal region of the second electromagnetic shielding layer.

[0020] In some embodiments, the second connecting portion further includes a functional structure layer. The second metal conductor layer includes a first sub-layer and a second sub-layer. The first sub-layer is located on a side of the functional structure layer close to the first electromagnetic shielding layer, and the second sub-layer is located on a side of the functional structure layer close to the second electromagnetic shielding layer.

[0021] In some embodiments, a thickness by which the metal bridging body exceeds a side of the second electromagnetic shielding layer away from the second metal conductor layer is 5 μm to 30 μm greater than a thickness of the first insulating layer.

[0022] In some embodiments, a thickness by which the metal bridging body exceeds a side of the second electromagnetic shielding layer away from the second metal conductor layer is 10 μm to 30 μm.

[0023] In some embodiments, adhesives are provided on both a side of the first insulating layer close to the conductor region and a side of the first insulating layer close to the second electromagnetic shielding layer. A thickness of the metal bridging body is greater than a total thickness of the second electromagnetic shielding layer, the first insulating layer, and the adhesives on both sides of the first insulating layer.

[0024] In some embodiments, an adhesive is provided on a side of the second insulating layer close to the third metal conductor layer, and the second insulating layer is attached to the second electromagnetic shielding layer in a region where a positive projection of the second insulating layer on the first plane exceeds regions of the third metal conductor layer and the first insulating layer.

[0025] An embodiment of the present disclosure also provides a heat dissipation composite film for the above display module. The heat dissipation composite film includes a first adhesive layer, a first metal conductor layer, and a protective layer that are sequentially stacked. The first metal conductor layer is provided with a first glue leakage hole communicating with the first adhesive layer.

[0026] Wherein, the protective layer includes a protection area and a barrier area connected to the protection area. An adhesive is provided on a side of the protection area close to the first metal conductor layer. A positive projection of the first glue leakage hole on the first adhesive layer is located within a positive projection of the barrier area on the first adhesive layer, and the barrier area is a release film; or, a barrier layer is provided between the protective layer and the first metal conductor layer. An adhesive is provided on a side of the protective layer close to the first metal conductor layer. A positive projection of the first glue leakage hole on the first adhesive layer is located within a positive projection of the barrier layer on the first adhesive layer, and the barrier layer is a release film.

[0027] In some embodiments, when the protective layer includes a protection area and a barrier area connected to the protection area, a tear line is provided between the barrier area and the protection area.

[0028] An embodiment of the present disclosure also provides a display device, and the display device includes the above display module.

[0029] The embodiments of the present application at least have the following beneficial effects:

[0030] In the above display module, the first metal conductor layer is provided with a first glue leakage hole communicating with the first glue layer. Through the first glue leakage hole, a partial area of the first glue layer can be exposed. At the same time, the orthographic projection of the first electromagnetic shielding layer on the first plane is located within the orthographic projection of the first glue leakage hole on the first plane. Then, after the flexible circuit board and the heat dissipation composite film are assembled, the first electromagnetic shielding layer of the flexible circuit board is located in the area where the first glue leakage hole is located and is attached to the first glue layer leaking through the first glue leakage hole. That is, the flexible circuit board can be attached to the display panel through the first glue layer, which can save the flexible circuit board from separately setting a back glue layer for attaching to the display panel or the heat dissipation composite film, saving the back glue cost of the flexible circuit board. Further, the first electromagnetic shielding layer is provided with a first leakage hole communicating with the second metal conductor layer. The first leakage hole is located in the edge area of the first electromagnetic shielding layer. Through the first leakage hole, a partial area of the second metal conductor layer located in the edge area of the flexible circuit board can be exposed. At the same time, the thickness of the first electromagnetic shielding layer is less than the thickness of the first metal conductor layer, and the orthographic projection of the first leakage hole on the first plane and the orthographic projection of the first metal conductor layer on the first plane at least partially overlap. Then, after the flexible circuit board and the heat dissipation composite film are assembled, the second metal conductor layer of the flexible circuit board can overlap with the first metal conductor layer of the heat dissipation composite film in the area where the first leakage hole is located and generate interference in the thickness direction, so that a hard contact is achieved between the second metal conductor layer and the first metal conductor layer. Through the hard contact between the metal conductors, the conductivity and grounding effect between the flexible circuit board and the heat dissipation composite film can be ensured, thereby improving the grounding stability of the display module, making the grounding impedance of the display module meet the design requirements, and at the same time, the passing rate of the grounding impedance test of the display module can also be improved, thereby improving the manufacturing yield of the display module. In addition, the usage amount of the conductive adhesive material can also be cancelled, reducing the material cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 Shows a cross-sectional view of a display module according to an embodiment of the present disclosure;

[0033] Figure 2 Shows a cross-sectional view of a display module according to another embodiment of the present disclosure;

[0034] Figure 3 Shows Figure 2 a partial structural schematic diagram of the contact between the flexible circuit board and the heat dissipation composite film in

[0035] Figure 4 The bottom view of the flexible circuit board of the display module according to an embodiment of the present disclosure is shown;

[0036] Figure 5 It shows Figure 4 The A-A cross-sectional view of the flexible circuit board in

[0037] Figure 6 The top view of the first adhesive layer of the heat dissipation composite film of the display module according to an embodiment of the present disclosure is shown;

[0038] Figure 7 The top view of the first metal conductor layer of the heat dissipation composite film of the display module according to an embodiment of the present disclosure is shown;

[0039] Figure 8 The top view of the protective layer of the heat dissipation composite film of the display module according to an embodiment of the present disclosure is shown;

[0040] Figure 9 The top view of the buffer layer of the heat dissipation composite film of the display module according to an embodiment of the present disclosure is shown;

[0041] Figure 10 The top view of the stacked arrangement of the first adhesive layer and the first metal conductor layer of the heat dissipation composite film of the display module according to an embodiment of the present disclosure is shown;

[0042] Figure 11 It shows Figure 10 The top view after the heat dissipation composite film and the flexible circuit board are assembled in

[0043] Figure 12 It shows Figure 10 The B-B cross-sectional view in

[0044] Figure 13 The top view of the stacked arrangement of the first adhesive layer, the first metal conductor layer and the protective layer of the heat dissipation composite film of the display module according to an embodiment of the present disclosure is shown;

[0045] Figure 14 It shows Figure 13 The top view after the heat dissipation composite film and the flexible circuit board are assembled in

[0046] Figure 15 It shows Figure 14 The C-C cross-sectional view in

[0047] Figure 16 The top view of the stacked arrangement of the first adhesive layer, the buffer layer, the first metal conductor layer and the protective layer of the heat dissipation composite film of the display module according to an embodiment of the present disclosure is shown;

[0048] Figure 17 It shows Figure 16Top view of the assembled heat dissipation composite film and flexible circuit board;

[0049] Figure 18 Shows Figure 16 Cross-sectional view taken along the D-D direction in

[0050] Figure 19 Top view of the flexible circuit board of the display module according to an embodiment of the present disclosure;

[0051] Figure 20 Shows Figure 19 Cross-sectional view taken along the E-E direction of the flexible circuit board in

[0052] Figure 21 Top view of the first insulating layer of the protective composite film of the display module according to an embodiment of the present disclosure;

[0053] Figure 22 Top view of the third metal conductor layer of the protective composite film of the display module according to an embodiment of the present disclosure;

[0054] Figure 23 Top view of the second insulating layer of the protective composite film of the display module according to an embodiment of the present disclosure;

[0055] Figure 24 Top view perspective view of the stacked first insulating layer and the third metal conductor layer of the protective composite film of the display module according to an embodiment of the present disclosure;

[0056] Figure 25 Top view perspective view of the stacked first insulating layer, the third metal conductor layer and the third insulating layer of the protective composite film of the display module according to an embodiment of the present disclosure;

[0057] Figure 26 Shows Figure 25 Top view of the assembled protective composite film and flexible circuit board in

[0058] Figure 27 Shows Figure 26 Cross-sectional view taken along the F-F direction in

[0059] Figure 28 Bottom view of the flexible circuit board of the display module according to another embodiment of the present disclosure;

[0060] Figure 29 Shows Figure 28 Cross-sectional view taken along the G-G direction of the flexible circuit board in

[0061] Figure 30 Bottom view of the flexible circuit board of the display module according to another embodiment of the present disclosure;

[0062] Figure 31 ShowsFigure 30 Cross-sectional view of the flexible circuit board in the H-H direction;

[0063] Figure 32 Shows a top view of the heat dissipation composite film of the display module according to an embodiment of the present disclosure.

[0064] Reference numerals:

[0065] 100, display panel; 110, display area; 120, bonding area; 200, heat dissipation composite film; 210, first adhesive layer; 220, first metal conductor layer; 221, first glue leakage hole; 230, buffer layer; 231, second glue leakage hole; 240, protective layer; 241, third glue leakage hole; 242, second leakage hole; 243, protection area; 244, barrier area; 245, easy tear line; 300, flexible circuit board; 310, first connection part; 320, second connection part; 321, first electromagnetic shielding layer; 3211, first leakage hole; 322, second metal conductor layer; 3221, first sub-layer; 3222, second sub-layer; 323, functional structure layer; 324, second electromagnetic shielding layer; 3241 third leakage hole; 325, metal bridging body; 326, first auxiliary function layer; 327, second auxiliary function layer; 330, third connection part; 400, protection composite film; 410, first insulating layer; 420, third metal conductor layer; 421, conductor area; 422, bridging area; 430, second insulating layer; 500, back film; 600, driving chip. Detailed implementation manners

[0066] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0067] In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0068] Next, the present application will be described in conjunction with the accompanying drawings and with reference to specific embodiments:

[0069] In the related art, the display module realizes the grounding function of the circuit board through conductive adhesive bridging, that is, the heat dissipation composite film 200 is grounded and electrically connected to the flexible circuit board 300 through the conductive adhesive, and the flexible circuit board 300 is grounded and electrically connected to the composite protective film of the driving chip 600 through the conductive adhesive. However, this grounding implementation method often has problems of poor grounding impedance and unstable grounding. Poor grounding impedance and unstable grounding will not only cause the radio frequency signal of the terminal shooting device to be exposed, but also reduce the passing rate of the grounding impedance test. For example, it may cause the display module not to meet the 10Ω requirement of the impedance specification, resulting in a lower production yield of the display module and higher production costs.

[0070] Through research, it is found in this application that the reason for the poor grounding impedance and unstable grounding of the display module lies in the grounding implementation method through conductive adhesive bridging. Due to batch differences or performance differences in the conductive adhesive, it is easy to cause batch problems of poor grounding impedance of the display module and cannot meet the 10Ω requirement of the impedance specification.

[0071] In view of the technical problems of poor grounding impedance and unstable grounding of the display module, an embodiment of the present disclosure proposes a display module, as Figures 1 to 32 shown, the display module includes: a display panel 100, the display panel 100 includes a display area 110 and a bonding area 120 connected to the display area 110;

[0072] a heat dissipation composite film 200, the heat dissipation composite film 200 is at least stacked on the non-display side of the display area 110, the heat dissipation composite film 200 includes a first adhesive layer 210 and a first metal conductor layer 220 stacked, the first metal conductor layer 220 is located on the side of the first adhesive layer 210 away from the display area 110, and the first metal conductor layer 220 is provided with a first glue leakage hole 221 communicating with the first adhesive layer 210; and,

[0073] a flexible circuit board 300, the flexible circuit board 300 includes a first connection portion 310 and a second connection portion 320 connected to the first connection portion 310, the first connection portion 310 is connected to the bonding area 120, at least the second connection portion 320 is located on the side of the heat dissipation composite film 200 away from the display area 110, the second connection portion 320 includes a first electromagnetic shielding layer 321 and a second metal conductor layer 322 stacked, the first electromagnetic shielding layer 321 is located on the side of the second metal conductor layer 322 close to the first metal conductor layer 220, the first electromagnetic shielding layer 321 is provided with a first leakage hole 3211 communicating with the second metal conductor layer 322, and the first leakage hole 3211 is located in the edge area of the first electromagnetic shielding layer 321;

[0074] Among them, the positive projection of the first electromagnetic shielding layer 321 on the first plane is located within the positive projection of the first glue leakage hole 221 on the first plane, and the thickness of the first electromagnetic shielding layer 321 is less than the thickness of the first metal conductor layer 220; the positive projection of the first leakage hole 3211 on the first plane coincides with at least part of the positive projection of the first metal conductor layer 220 on the first plane; the first plane is the plane where the display area 110 is located.

[0075] The display module proposed in the embodiments of the present disclosure, such as Figures 1 to 18 As shown, the first metal conductor layer 220 is provided with a first glue leakage hole 221 communicating with the first glue layer 210. Through the first glue leakage hole 221, a partial area of the first glue layer 210 can be exposed. At the same time, the positive projection of the first electromagnetic shielding layer 321 on the first plane is located within the positive projection of the first glue leakage hole 221 on the first plane. After the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, the first electromagnetic shielding layer 321 of the flexible circuit board 300 is located in the area where the first glue leakage hole 221 is located and is attached to the first glue layer 210 leaking through the first glue leakage hole 221. That is, the flexible circuit board 300 can be attached to the display panel 100 through the first glue layer 210, so that the flexible circuit board 300 can save a separate back glue layer for attaching to the display panel 100 or the heat dissipation composite film 200, saving the back glue cost of the flexible circuit board 300; further, the first electromagnetic shielding layer 321 is provided with a first leakage hole 3211 communicating with the second metal conductor layer 322. The first leakage hole 3211 is located in the edge area of the first electromagnetic shielding layer 321. Through the first leakage hole 3211, a partial area of the second metal conductor layer 322 located in the edge area of the flexible circuit board 300 can be exposed. At the same time, the thickness of the first electromagnetic shielding layer 321 is less than the thickness of the first metal conductor layer 220, and the positive projection of the first leakage hole 3211 on the first plane coincides with at least part of the positive projection of the first metal conductor layer 220 on the first plane. After the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, the second metal conductor layer 322 of the flexible circuit board 300 can overlap with the first metal conductor layer 220 of the heat dissipation composite film 200 in the area where the first leakage hole 3211 is located and generate interference in the thickness direction, so that hard contact is achieved between the second metal conductor layer 322 and the first metal conductor layer 220. Through the hard contact between the metal conductors, the conductivity and grounding effect between the flexible circuit board 300 and the heat dissipation composite film 200 can be ensured, thereby improving the grounding stability of the display module, increasing the passing rate of the grounding impedance test of the display module, and further improving the manufacturing yield of the display module. In addition, the usage amount of the conductive glue material can also be cancelled, reducing the material cost.

[0076] In some embodiments of the present disclosure, the display panel 100 may be a rigid display panel 100 or a flexible display panel 100. Such as Figure 1As shown, when the display panel 100 is a rigid display panel 100, the driving chip 600 in the display module can adopt a chip on film (COF) packaging method. The driving chip 600 is placed in the flexible circuit board 300 in the flexible circuit board's cable, and then the second connection portion 320 of the flexible circuit board 300 is folded to the non-display side of the display module by using the flexibility of the flexible circuit board 300 itself, so that the second connection portion 320 is located on the side of the heat dissipation composite film 200 away from the display area 110. As Figure 2 shown, when the display panel 100 is a flexible display panel 100, the driving chip 600 in the display module can adopt a chip on plastic (COP) packaging method. The driving chip 600 is placed in the flexible cable of the flexible display panel 100, and the bonding area 120 of the flexible display panel 100 and the flexible circuit board 300 connected to the bonding area 120 are folded to the non-display side of the display module together by using the flexibility of the flexible display panel 100, so that the second connection portion 320 is located on the side of the heat dissipation composite film 200 away from the display area 110.

[0077] In some embodiments of the present disclosure, the first metal conductor layer 220 and the second metal conductor layer 322 can be prepared from metal materials with good electrical conductivity. For example, they can be metal materials such as copper, silver, gold, and aluminum. By forming a hard contact through the structural interference between metal materials with good electrical conductivity to replace the conductive adhesive bridging method, it can avoid the defects of poor grounding impedance and unstable grounding caused by batch differences or performance differences of the conductive adhesive.

[0078] In some embodiments of the present disclosure, optionally, as Figure 4 and Figure 5 shown, the first leakage hole 3211 is located in the edge area of the first electromagnetic shielding layer 321. For example, the first leakage hole 3211 can be located at the corner of the edge area of the first electromagnetic shielding layer 321 away from the first connection portion 310. After the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, the first leakage hole 3211 located in the edge area and the second metal conductor layer 322 leaking through the first leakage hole 3211 can more conveniently and easily interfere with the first metal conductor layer 220, and when the first electromagnetic shielding layer 321 of the first flexible circuit board 300 is attached to the first adhesive layer 210, it can apply a certain force towards the first metal conductor layer 220 to the second metal conductor layer 322 to ensure the hard contact between the second metal conductor layer 322 and the first metal conductor layer 220, and further ensure the grounding impedance stability between the second metal conductor layer 322 and the first metal conductor layer 220.

[0079] In some embodiments of the present disclosure, optionally, as Figures 1 to 3As shown, the display module further includes a back film 500, which is located on the non-display side of the display area 110 of the display panel 100, and the back film 500 is located between the display panel 100 and the heat dissipation composite film 200.

[0080] In some embodiments of the present disclosure, optionally, as Figure 6 shown, the first adhesive layer 210 is located on the non-display side of the display area 110 of the display panel 100, and is used to bond the first metal conductor layer 220 to the display panel 100 or the back film 500. Optionally, the first adhesive layer 210 may be provided with some avoidance holes to avoid some functional hole areas of the display panel 100. Optionally, the first adhesive layer 210 may be in a grid shape, and the grid of the first adhesive layer 210 can be used for exhausting air to avoid generating bonding bubbles.

[0081] In some embodiments of the present disclosure, optionally, as Figure 7 shown, the first metal conductor layer 220 is provided with a first glue leakage hole 221.

[0082] In some embodiments of the present disclosure, optionally, as Figure 10 shown, after the first metal conductor layer 220 is bonded to the first adhesive layer 210, the area of the first adhesive layer 210 corresponding to the first glue leakage hole 221 can be exposed; at the same time, in the thickness direction of the display module, the area where the first glue leakage hole 221 is located has a certain depression, and the thickness of the depression is the thickness of the first metal conductor layer 220.

[0083] In some embodiments of the present disclosure, optionally, as Figure 11 and Figure 12 shown, after the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, since the orthographic projection of the first electromagnetic shielding layer 321 on the first plane is located within the orthographic projection of the first glue leakage hole 221 on the first plane, the first electromagnetic shielding layer 321 of the flexible circuit board 300 can completely fall into the depression formed by the heat dissipation composite film 200 in the area where the first glue leakage hole 221 is located. At the same time, as Figure 12 shown, in the thickness direction of the display module, the thickness of the first metal conductor layer 220 is greater than the thickness of the first electromagnetic shielding layer 321, and the first metal conductor layer 220 protrudes a part towards the direction of the second electromagnetic shielding layer 324 relative to the first electromagnetic shielding layer 321. Then, in the overlapping area where the second metal conductor layer 322 coincides with the projection of the first metal conductor layer 220 at the first leakage hole 3211, there is a certain structural interference between the second metal conductor layer 322 and the first metal conductor layer 220, so that a hard contact is formed between the second metal conductor layer 322 and the first metal conductor layer 220, and thus a grounding electrical connection is formed between the second metal conductor layer 322 and the first metal conductor layer 220.

[0084] In some embodiments of the present disclosure, optionally, as Figure 4 and Figure 19 shown, the flexible circuit board 300 may further include a third connection portion 330, and the third connection portion 330 may be used to connect to structures such as a control main board.

[0085] As an optional implementation manner, the thickness of the first electromagnetic shielding layer 321 is 10 μm to 30 μm smaller than the thickness of the first metal conductor layer 220.

[0086] In some embodiments of the present disclosure, optionally, the thickness of the first electromagnetic shielding layer 321 is 10 μm to 30 μm smaller than the thickness of the first metal conductor layer 220. After the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, an interference amount of 10 μm to 30 μm can exist between the first metal conductor layer 220 and the second metal conductor layer 322 in the thickness direction, thereby ensuring a hard contact effect between the first metal conductor layer 220 and the second metal conductor layer 322. That is to say, the interference amount between the second metal conductor layer 322 and the first metal conductor layer 220 can be adjusted by adjusting the relative sizes of the thicknesses of the first electromagnetic shielding layer 321 and the first metal conductor layer 220, and by adjusting the overlapping area of the projection of the second metal conductor layer 322 and the first metal conductor layer 220 at the first leakage hole 3211.

[0087] In some embodiments of the present disclosure, for example, the thickness of the first electromagnetic shielding layer 321 may be 20 μm, and the thickness of the first metal conductor layer 220 may be 40 μm. After the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, the first electromagnetic shielding layer 321 is attached to the first adhesive layer 210, and the distance between the second metal conductor layer 322 and the first adhesive layer 210 is the thickness of the first electromagnetic shielding layer 321, that is, the distance between the second metal conductor layer 322 and the first adhesive layer 210 is 20 μm. However, since the thickness of the first metal conductor layer 220 is 40 μm, there is an interference amount of 20 μm in the overlapping area of the projection of the second metal conductor layer 322 and the first metal conductor layer 220 at the first leakage hole 3211, thereby ensuring the hard contact effect between the second metal conductor layer 322 and the first metal conductor layer 220. For another example, the thickness of the first electromagnetic shielding layer 321 may be 10 μm, and the thickness of the first metal conductor layer 220 may be 30 μm. After the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, the first electromagnetic shielding layer 321 is attached to the first adhesive layer 210, and the distance between the second metal conductor layer 322 and the first adhesive layer 210 is the thickness of the first electromagnetic shielding layer 321, that is, the distance between the second metal conductor layer 322 and the first adhesive layer 210 is 10 μm. However, since the thickness of the first metal conductor layer 220 is 30 μm, there is an interference amount of 20 μm in the overlapping area of the projection of the second metal conductor layer 322 and the first metal conductor layer 220 at the first leakage hole 3211, thereby ensuring the hard contact effect between the second metal conductor layer 322 and the first metal conductor layer 220.

[0088] In some embodiments of the present disclosure, optionally, the thickness of the first electromagnetic shielding layer 321 is 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm smaller than the thickness of the first metal conductor layer 220, that is, in the overlapping area of the projection of the second metal conductor layer 322 and the first metal conductor layer 220 at the first leakage hole 3211, the interference amount between the second metal conductor layer 322 and the first metal conductor layer 220 is 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm.

[0089] As an alternative embodiment, the first adhesive layer 210 is a silicone gel layer.

[0090] In some embodiments of the present disclosure, optionally, the first adhesive layer 210 may be a silicone gel layer. The silicone gel layer not only has good thermal conductivity but also has good adhesiveness, and can adhere to the first electromagnetic shielding layer 321 of the flexible circuit board 300, thereby fixing the flexible circuit board 300 in the non-display area of the display module.

[0091] As an alternative embodiment, as Figure 8 , Figures 16 to 18 shown, the heat dissipation composite film 200 further includes a buffer layer 230, the buffer layer 230 is stacked between the first metal conductor layer 220 and the first adhesive layer 210, the buffer layer 230 is provided with a second glue leakage hole 231 communicating with the first adhesive layer 210, and the orthographic projection of the first electromagnetic shielding layer 321 on the first plane is located within the orthographic projection of the second glue leakage hole 231 on the first plane.

[0092] In some embodiments of the present disclosure, optionally, as Figures 16 to 18 shown, the buffer layer 230 can be stacked between the first metal conductor layer 220 and the first adhesive layer 210. After the heat dissipation composite film 200 and the display panel 100 are assembled, the buffer layer 230 can buffer the stress of the display panel 100 to alleviate defects such as display module printing. Optionally, the buffer layer 230 can be prepared from a foam material.

[0093] In some embodiments of the present disclosure, optionally, as Figure 9 shown, the buffer layer 230 is provided with a second glue leakage hole 231 communicating with the first adhesive layer 210, and the orthographic projection of the first electromagnetic shielding layer 321 on the first plane is located within the orthographic projection of the second glue leakage hole 231 on the first plane. When the flexible circuit board 300 and the heat dissipation composite film 200 are assembled, the first electromagnetic shielding layer 321 can pass through the first glue leakage hole 221 and the second glue leakage hole 231 in sequence and fit with the first adhesive layer 210. The buffer layer 230 can avoid interfering with the fitting of the first electromagnetic shielding layer 321 and the first adhesive layer 210 through the second glue leakage hole 231.

[0094] In some embodiments of the present disclosure, optionally, the orthographic projection of the second glue leakage hole 231 on the first plane can completely coincide with the orthographic projection of the first glue leakage hole 221 on the first plane. Optionally, on the premise of ensuring that the orthographic projection of the first electromagnetic shielding layer 321 on the first plane is located within the orthographic projection of the second glue leakage hole 231 on the first plane, the orthographic projection of the second glue leakage hole 231 on the first plane can be located within the orthographic projection of the first glue leakage hole 221 on the first plane. Optionally, the orthographic projection of the first glue leakage hole 221 on the first plane can also be located within the orthographic projection of the second glue leakage hole 231 on the first plane to ensure that the orthographic projection of the second glue leakage hole 231 on the first plane exceeds the range of the first glue leakage hole 221 to ensure that the buffer layer 230 does not affect the fitting of the first electromagnetic shielding layer 321 and the first adhesive layer 210.

[0095] In some embodiments of the present disclosure, optionally, as Figure 16As shown, after the first adhesive layer 210, buffer layer 230, first metal conductor layer 220, and protective layer 240 of the heat dissipation composite film 200 are stacked in sequence, the first glue leakage holes 221 and the second glue leakage holes 231 can expose some areas of the first adhesive layer 210. Then, as Figure 17 shown, the first electromagnetic shielding layer 321 of the flexible circuit board 300 can be attached to the first adhesive layer 210. As Figure 18 shown, in the thickness direction of the display module, the areas where the first glue leakage holes 221 and the second glue leakage holes 231 are located have a certain depression, and the thickness of this depression is the total thickness of the first metal conductor layer 220 and the buffer layer 230. On the premise that the thickness of the first metal conductor layer 220 is greater than the thickness of the first electromagnetic shielding layer 321, the total thickness of the first metal conductor layer 220 and the buffer layer 230 is also greater than the thickness of the first electromagnetic shielding layer 321. Therefore, the presence of the buffer layer 230 will increase the interference amount between the first metal conductor layer 220 and the second metal conductor layer 322, and thus the interference amount between the first metal conductor layer 220 and the second metal conductor layer 322 can also be adjusted by adjusting the thickness of the buffer layer 230.

[0096] It should be noted that although in the embodiment as Figures 16 to 17 shown, a technical solution in which the heat dissipation composite film 200 is provided with both a buffer layer 230 and a protective layer 240 is shown, the relevant description of the foregoing buffer layer 230 is also applicable when the heat dissipation composite film 200 is not provided with a protective layer 240.

[0097] As an alternative embodiment, an adhesive is provided on the side of the buffer layer 230 close to the first metal conductor layer 220.

[0098] In some embodiments of the present disclosure, optionally, an adhesive is provided on the side of the buffer layer 230 close to the first metal conductor layer 220 so that the buffer layer 230 can be adhered to the first metal conductor layer 220 through the adhesive. Correspondingly, the adhesive needs to avoid the second glue leakage holes 231.

[0099] As an alternative embodiment, as Figure 8 、 Figures 13 to 15 shown, the heat dissipation composite film 200 further includes a protective layer 240. The protective layer 240 is stacked on the side of the first metal conductor layer 220 away from the first adhesive layer 210. The protective layer 240 is provided with a third glue leakage hole 241 communicating with the first adhesive layer 210. The orthographic projection of the first electromagnetic shielding layer 321 on the first plane is located within the orthographic projection of the third glue leakage hole 241 on the first plane; the protective layer 240 is further provided with a second leakage hole 242 communicating with the first metal conductor layer 220. The orthographic projection of the first leakage hole 3211 on the first plane is located within the orthographic projection of the second leakage hole 242 on the first plane.

[0100] In some embodiments of the present disclosure, as Figures 13 to 15 shown, the protective layer 240 may be stacked on a side of the first metal conductor layer 220 away from the first adhesive layer 210 to protect the first metal conductor layer 220.

[0101] In some embodiments of the present disclosure, optionally, as Figure 8 shown, the protective layer 240 is provided with a third glue leakage hole 241 communicating with the first adhesive layer 210, and a positive projection of the first electromagnetic shielding layer 321 on the first plane is located within a positive projection of the third glue leakage hole 241 on the first plane; to ensure that the first electromagnetic shielding layer 321 of the flexible circuit board 300 can pass through the third glue leakage hole 241 and be attached to the first adhesive layer 210, and to prevent the protective layer 240 from interfering with the attachment of the first electromagnetic shielding layer 321 and the first adhesive layer 210. The protective layer 240 is further provided with a second leakage hole 242 communicating with the first metal conductor layer 220. The second leakage hole 242 can expose a partial area of the first metal conductor layer 220 corresponding to the second leakage hole 242. The first leakage hole 3211 can expose a partial area of the second metal conductor layer 322 corresponding to the first leakage hole 3211. Meanwhile, a positive projection of the first leakage hole 3211 on the first plane is located within a positive projection of the second leakage hole 242 on the first plane, and the size of the second leakage hole 242 is larger than the size of the first leakage hole 3211, which can prevent the protective layer 240 from interfering with the second metal conductor layer 322 leaking out through the first leakage hole 3211, and further prevent affecting the hard contact between the second metal conductor layer 322 and the first metal conductor layer 220.

[0102] In some embodiments of the present disclosure, optionally, as Figure 13 shown, after the first adhesive layer 210, the first metal conductor layer 220, and the protective layer 240 of the heat dissipation composite film 200 are sequentially stacked, the first glue leakage hole 221 and the third glue leakage hole 241 can expose a partial area of the first adhesive layer 210, and the second leakage hole 242 can expose a partial area of the first metal conductor layer 220. Further, as Figure 14 shown, the first electromagnetic shielding layer 321 of the flexible circuit board 300 can be attached to the first adhesive layer 210. As Figure 15As shown, in the thickness direction of the display module, the regions where the first glue leakage hole 221 and the third glue leakage hole 241 are located have a certain depression, and the thickness of this depression is the total thickness of the first metal conductor layer 220 and the protective layer 240. On the premise that the thickness of the first metal conductor layer 220 is greater than the thickness of the first electromagnetic shielding layer 321, and the orthographic projection of the first electromagnetic shielding layer 321 on the first plane is located within the orthographic projection of the third glue leakage hole 241 on the first plane, the presence of the protective layer 240 will not affect the interference amount between the first metal conductor layer 220 and the second metal conductor layer 322. Therefore, by adjusting the thickness difference between the first metal conductor layer 220 and the first electromagnetic shielding layer 321, the purpose of adjusting the interference amount between the first metal conductor layer 220 and the second metal conductor layer 322 can be achieved. At the same time, as Figure 15 shown, the second leakage hole 242 can expose a part of the first metal conductor layer 220, so that the first metal conductor layer 220 is in contact with the second metal conductor layer 322.

[0103] As an alternative implementation, an adhesive is provided on the side of the protective layer 240 close to the first metal conductor layer 220.

[0104] In some embodiments of the present disclosure, optionally, an adhesive is provided on the side of the protective layer 240 close to the first metal conductor layer 220, so that the protective layer 240 can be bonded to the first metal conductor layer 220 through the adhesive. Correspondingly, the adhesive needs to avoid the third glue leakage hole 241 and the second leakage hole 242.

[0105] As an alternative implementation, as Figures 1 to 3 、 Figures 19 to 27 shown, the second connecting portion 320 further includes a second electromagnetic shielding layer 324 and a metal bridging body 3241 third leakage hole; 325. The second electromagnetic shielding layer 324 is stacked on the side of the second metal conductor layer 322 away from the first electromagnetic shielding layer 321. The second electromagnetic shielding layer 324 is provided with a third leakage hole communicating with the second metal conductor layer 322. The metal bridging body 3241 third leakage hole; 325 is connected to the second metal conductor layer 322 and is located within the third leakage hole;

[0106] The display module further includes a protective composite film 400. The protective composite film 400 is disposed on the side of the second electromagnetic shielding layer 324 away from the display area 110. The protective composite film 400 includes a first insulating layer 410, a third metal conductor layer 420, and a second insulating layer 430 stacked in sequence. The first insulating layer 410 is located on the side of the third metal conductor layer 420 close to the second electromagnetic shielding layer 324. The third metal conductor layer 420 includes a conductor region 421 and a bridging region 422 connected to the conductor region 421;

[0107] Among them, the orthographic projection of the conductor region 421 on the first plane is located within the orthographic projection of the first insulating layer 410 on the first plane. The orthographic projection of the bridging region 422 on the first plane is located outside the orthographic projection of the first insulating layer 410 on the first plane. The orthographic projection of the bridging region 422 on the first plane and the third leakage hole of the metal bridging body 3241; 325 overlap at least partially; the third leakage hole of the metal bridging body 3241; 325 exceeds the thickness of the second electromagnetic shielding layer 324 on the side away from the third metal conductor layer 420 by at least more than the thickness of the first insulating layer 410; the orthographic projection of the third metal conductor layer 420 on the first plane and the orthographic projection of the first insulating layer 410 on the first plane are both located within the orthographic projection of the second insulating layer 430 on the first plane.

[0108] In some embodiments of the present disclosure, as Figures 1 to 3 、 Figures 19 to 27 shown, the second connecting portion 320 further includes a second electromagnetic shielding layer 324 and a third leakage hole of the metal bridging body 3241; 325. The second electromagnetic shielding layer 324 is stacked on the side of the second metal conductor layer 322 away from the first electromagnetic shielding layer 321. The second electromagnetic shielding layer 324 is provided with a third leakage hole communicating with the second metal conductor layer 322. The metal bridging body 3241 third leakage hole; 325 is connected to the second metal conductor layer 322 and is located within the third leakage hole. The third leakage hole can expose the second metal conductor layer 322. At the same time, since the metal bridging body 3241 third leakage hole; 325 is connected to the second metal conductor layer 322 and is located within the third leakage hole, an electrical connection can be formed between the metal bridging body 3241 third leakage hole; 325 and the second metal conductor layer 322. Optionally, the metal bridging body 3241 third leakage hole; 325 can be made of a metal material with good electrical conductivity, such as copper, silver, gold, aluminum and other metal materials. The metal bridging body 3241 third leakage hole; 325 is made of a metal material with good electrical conductivity, which can ensure a good electrical connection effect between the metal bridging body 3241 third leakage hole; 325 and the second metal conductor layer 322.

[0109] In some embodiments of the present disclosure, as Figures 1 to 3 、 Figures 19 to 27As shown, the display module further includes a protective composite film 400. The protective composite film 400 is disposed on a side of the second electromagnetic shielding layer 324 away from the display area 110. The protective composite film 400 includes a first insulating layer 410, a third metal conductor layer 420, and a second insulating layer 430 that are stacked in sequence. The first insulating layer 410 is located on a side of the third metal conductor layer 420 close to the second electromagnetic shielding layer 324. The third metal conductor layer 420 includes a conductor region 421 and a bridging region 422 connected to the conductor region 421. The protective composite film 400 can be used to protect the flexible circuit board 300 and / or the driving chip 600, and can also be used for electromagnetic shielding of the flexible circuit board 300 and / or the driving chip 600.

[0110] In some embodiments of the present disclosure, optionally, as Figures 1 to 3 shown, optionally, the protective composite film 400 can cover a side of the flexible circuit board 300 and / or the driving chip 600 away from the display panel 100.

[0111] In some embodiments of the present disclosure, as Figures 1 to 3 、 Figures 19 to 27 shown, the first insulating layer 410 is located on a side of the third metal conductor layer 420 close to the second electromagnetic shielding layer 324. At the same time, a positive projection of the conductor region 421 in the first plane is located within a positive projection of the first insulating layer 410 in the first plane, then the first insulating layer 410 can isolate the conductor region 421 from the second electromagnetic shielding layer 324. The first insulating layer 410 is located on a side of the third metal conductor layer 420 close to the second electromagnetic shielding layer 324. At the same time, a positive projection of the bridging region 422 in the first plane is located outside a positive projection of the first insulating layer 410 in the first plane, then the bridging region 422 is blocked by the first insulating layer 410 between the second electromagnetic shielding layer 324 and the metal bridging body 3241 third leakage hole; 325. The bridging region 422 can be in direct contact with the second electromagnetic shielding layer 324 and / or the metal bridging body 3241 third leakage hole; 325. At the same time, since a positive projection of the bridging region 422 in the first plane and a positive projection of the metal bridging body 3241 third leakage hole; 325 in the first plane at least partially overlap, and the metal bridging body 3241 third leakage hole; 325 exceeds a thickness of a side of the second electromagnetic shielding layer 324 away from the third metal conductor layer 420 by at least greater than a thickness of the first insulating layer 410, that is, the metal bridging body 3241 third leakage hole; 325 protrudes relative to a side of the second electromagnetic shielding layer 324 away from the third metal conductor layer 420 and the protruding thickness is greater than the thickness of the first insulating layer 410, then it can be ensured that there is interference between the bridging region 422 and the metal bridging body 3241 third leakage hole; 325, and a hard contact can be formed, so that a relatively stable grounding electrical connection is provided between the flexible circuit board 300 and the protective composite film 400.

[0112] In some embodiments of the present disclosure, asFigures 1 to 3 , Figures 19 to 27 As shown in Figures 19 to 27 , the orthographic projection of the third metal conductor layer 420 on the first plane and the orthographic projection of the first insulating layer 410 on the first plane are both located within the orthographic projection of the second insulating layer 430 on the first plane. Then, the second insulating layer 430 has a portion that extends beyond the third metal conductor layer 420 and the second insulating layer 430, which can completely cover the third metal conductor layer 420 and the second insulating layer 430. The third metal conductor layer 420 can be protected by the second insulating layer 430, and leakage of the protective composite film 400 can be avoided.

[0113] As an alternative embodiment, as Figure 19 and Figure 20 shown, the third leakage hole is located in the inner region of the second electromagnetic shielding layer 324.

[0114] In some embodiments of the present disclosure, by locating the third leakage hole in the inner region of the second electromagnetic shielding layer 324, it is convenient to make the position of the metal bridge 3241 at the third leakage hole; 325 correspond to the position of the protective composite film 400. As an alternative embodiment, as Figures 1 to 31 shown, the second connecting portion 320 further includes a functional structure layer 323. The second metal conductor layer 322 includes a first sub-layer 3221 and a second sub-layer 3222. The first sub-layer 3221 is located on the side of the functional structure layer 323 close to the first electromagnetic shielding layer 321, and the first sub-layer 3221 is located on the side of the functional structure layer 323 close to the second electromagnetic shielding layer 324.

[0115] In some embodiments of the present disclosure, as Figures 1 to 31 shown, the second connecting portion 320 further includes a functional structure layer 323. The functional structure layer 323 is used to arrange the wiring of the flexible circuit board 300. Optionally, the functional structure layer 323 can be one layer, two layers, or more than three layers.

[0116] In some embodiments of the present disclosure, as Figures 1 to 31As shown, the second metal conductor layer 322 includes a first sub-layer 3221 and a second sub-layer 3222. The first sub-layer 3221 is located on the side of the functional structure layer 323 close to the first electromagnetic shielding layer 321, so as to expose the first sub-layer 3221 of the second metal conductor layer 322 by opening a first leakage hole 3211 in the first electromagnetic shielding layer 321 to form a hard contact with the first metal conductor layer 220; the first sub-layer 3221 is located on the side of the functional structure layer 323 close to the second electromagnetic shielding layer 324, so as to expose the third leakage hole by opening a third leakage hole in the second electromagnetic shielding layer 324 and arranging a metal bridging body 3241 at the third leakage hole; 325, so that the metal bridging body 3241 at the third leakage hole; 325 is electrically connected to the second sub-layer 3222 of the second metal conductor layer 322, and the metal bridging body 3241 at the third leakage hole; 325 can form a hard contact with the first metal conductor layer 220.

[0117] In some embodiments of the present disclosure, as Figures 28 to 30 shown, the flexible circuit board 300 may further include a first auxiliary function layer 326 located between the first electromagnetic shielding layer 321 and the first sub-layer 3221, and a second auxiliary function layer 327 located between the second electromagnetic shielding layer 324 and the second sub-layer 3222. The first auxiliary function layer 326 and the second auxiliary function layer 327 are used to implement the related functions of the flexible circuit board 300, which will not be elaborated here. It should be noted that it is necessary to ensure that the thickness of the first auxiliary function layer 326 does not affect the hard contact between the first sub-layer 3221 of the second metal conductor layer 322 and the first metal conductor layer 220, and the thickness of the second auxiliary function layer 327 does not affect the hard contact between the second sub-layer 3222 of the second metal conductor layer 322 and the third metal conductor layer 420.

[0118] As an alternative embodiment, the thickness by which the metal bridging body 3241 at the third leakage hole; 325 exceeds the thickness of the second electromagnetic shielding layer 324 on the side away from the second metal conductor layer 322 is 5 μm to 30 μm greater than the thickness of the first insulating layer 410.

[0119] In some embodiments of the present disclosure, after the protective composite film 400 and the flexible circuit board 300 are assembled, the distance between the third metal conductor layer 420 and the side of the second electromagnetic shielding layer 324 away from the second metal conductor layer 322 is the thickness of the first insulating layer 410. By making the metal bridge 3241 third leakage hole; 325 exceed the thickness of the second electromagnetic shielding layer 324 on the side away from the second metal conductor layer 322 by 5 μm to 30 μm, that is, the metal bridge 3241 third leakage hole; 325 protrudes from the side of the second electromagnetic shielding layer 324 away from the third metal conductor layer 420 by a thickness greater than the thickness of the first insulating layer 410 by 5 μm to 30 μm, it can ensure that there is an interference amount of 5 μm to 30 μm between the metal bridge 3241 third leakage hole; 325 and the third metal conductor layer 420, so as to ensure that the metal bridge 3241 third leakage hole; 325 and the third metal conductor layer 420 can form a hard contact effect. That is to say, the relative sizes of the thicknesses of the metal bridge 3241 third leakage hole; 325, the second electromagnetic shielding layer 324, and the first insulating layer 410 can be adjusted, and then the interference amount between the metal bridge 3241 third leakage hole; 325 and the third metal conductor layer 420 can be adjusted.

[0120] In some embodiments of the present disclosure, for example, the thickness of the second electromagnetic shielding layer 324 can be 30 μm, the thickness of the metal bridge 3241 third leakage hole; 325 can be 50 μm, and the thickness by which the metal bridge 3241 third leakage hole; 325 exceeds the side of the second electromagnetic shielding layer 324 away from the second metal conductor layer 322 is 20 μm; at the same time, the thickness of the first insulating layer 410 is 10 μm, then the protrusion thickness of the metal bridge 3241 third leakage hole; 325 relative to the side of the second electromagnetic shielding layer 324 away from the third metal conductor layer 420 is 10 μm greater than the thickness of the first insulating layer 410, that is, there is an interference amount of 10 μm between the metal bridge 3241 third leakage hole; 325 and the third metal conductor layer 420, which can ensure the hard contact effect between the metal bridge 3241 third leakage hole; 325 and the third metal conductor layer 420.

[0121] As an alternative embodiment, the thickness by which the metal bridge 3241 third leakage hole; 325 exceeds the side of the second electromagnetic shielding layer 324 away from the second metal conductor layer 322 is 10 μm to 30 μm.

[0122] In some embodiments of the present disclosure, the third leakage hole of the metal bridge 3241; 325 exceeds the thickness of the second electromagnetic shielding layer 324 on the side away from the second metal conductor layer 322 by 10 μm to 30 μm, that is, the thickness of the third leakage hole of the metal bridge 3241; 325 is 10 μm to 30 μm greater than the thickness of the second electromagnetic shielding layer 324, so as to ensure that the third leakage hole of the metal bridge 3241; 325 can exceed the second electromagnetic shielding layer 324, and further enable the third leakage hole of the metal bridge 3241; 325 to easily make hard contact with the third metal conductor layer 420.

[0123] As an alternative embodiment, adhesives are provided on both the side of the first insulating layer 410 close to the conductor region 421 and the side of the first insulating layer 410 close to the second electromagnetic shielding layer 324, and the thickness of the third leakage hole of the metal bridge 3241; 325 is greater than the total thickness of the second electromagnetic shielding layer 324, the first insulating layer 410, and the adhesives on both sides of the first insulating layer 410.

[0124] In some embodiments of the present disclosure, an adhesive is provided on the side of the first insulating layer 410 close to the conductor region 421, which can bond and fix the first insulating layer 410 to the conductor region 421; an adhesive is provided on the side of the first insulating layer 410 close to the second electromagnetic shielding layer 324, which can bond and fix the first insulating layer 410 to the second electromagnetic shielding layer 324. At the same time, it is necessary to ensure that the thickness of the third leakage hole of the metal bridge 3241; 325 is greater than the total thickness of the second electromagnetic shielding layer 324, the first insulating layer 410, and the adhesives on both sides of the first insulating layer 410, so that there is a certain interference amount between the third leakage hole of the metal bridge 3241; 325 and the third metal conductor layer 420, and hard contact can be achieved between the third leakage hole of the metal bridge 3241; 325 and the third metal conductor layer 420.

[0125] As an alternative embodiment, an adhesive is provided on the side of the second insulating layer 430 close to the third metal conductor layer 420, and the orthographic projection of the second insulating layer 430 on the first plane beyond the regions of the first three metal conductor layer and the first insulating layer 410 is adhered to the second electromagnetic shielding layer 324.

[0126] In some embodiments of the present disclosure, if the orthographic projection of the third metal conductor layer 420 on the first plane and the orthographic projection of the first insulating layer 410 on the first plane are both located within the orthographic projection of the second insulating layer 430 on the first plane, then an area of the orthographic projection of the second insulating layer 430 on the first plane that exceeds the third metal conductor layer 420 and the first insulating layer 410 can be obtained. At the same time, an adhesive is provided on a side of the second insulating layer 430 close to the second electromagnetic shielding layer 324. Then, the second insulating layer 430 can be bonded to the third metal conductor layer 420 through the adhesive, and a portion of the second insulating layer 430 that exceeds the third metal conductor layer 420 and the first insulating layer 410 can be bonded to the second electromagnetic shielding layer 324, capable of applying a certain force to the third metal conductor layer 420 toward the second metal conductor layer 322 to ensure hard contact between the third metal conductor layer 420 and the second metal conductor layer 322, thereby ensuring the stability of the grounding impedance between the third metal conductor layer 420 and the second metal conductor layer 322.

[0127] In some embodiments of the present disclosure, a change in the structure of any one or several of the heat dissipation composite film 200, the flexible circuit board 300, and the protective composite film 400 in the display module will not change the manufacturing process of the display module and its sequence. The display module can be prepared according to the manufacturing process sequence of the related art. For example, the manufacturing process of the display module according to an embodiment of the present disclosure includes the following steps: providing a display panel 100, polarizer lamination, protective glue (MCL) coating, contour cutting, driving chip 600 bonding (IC bonding), flexible circuit board 300 bonding (FPC bonding), ultraviolet glue dot coating, contour cutting of the driving chip 600 bonding part, transfer film lamination, optical glue coating, cover plate lamination, cover plate protective film lamination, heat dissipation composite film 200 lamination, pad bending, and protective composite film 400 lamination to obtain the display module.

[0128] Based on the same inventive concept, embodiments of the present disclosure also propose a heat dissipation composite film 200 for the above display module, as Figure 32 shown, the heat dissipation composite film 200 includes a first adhesive layer 210, a first metal conductor layer 220, and a protective layer 240 that are sequentially stacked, and the first metal conductor layer 220 is provided with a first glue leakage hole 221 communicating with the first adhesive layer 210;

[0129] Among them, the protective layer 240 includes a protection area 243 and a barrier area 244 connected to the protection area 243. An adhesive is provided on one side of the protection area 243 close to the first metal conductor layer 220. The orthographic projection of the first glue leakage hole 221 on the first glue layer 210 is located within the orthographic projection of the barrier area 244 on the first glue layer 210, and the barrier area 244 is a release film; alternatively, a barrier layer is provided between the protective layer 240 and the first metal conductor layer 220. An adhesive is provided on one side of the protective layer 240 close to the first metal conductor layer 220. The orthographic projection of the first glue leakage hole 221 on the first glue layer 210 is located within the orthographic projection of the barrier layer on the first glue layer 210, and the barrier layer is a release film.

[0130] In some embodiments of the present disclosure, as Figure 32 shown, the heat dissipation composite film 200 includes a first glue layer 210, a first metal conductor layer 220, and a protective layer 240 that are sequentially stacked. The first metal conductor layer 220 is provided with a first glue leakage hole 221 communicating with the first glue layer 210. Through the first glue leakage hole 221, a partial area of the first glue layer 210 can be exposed, so that when the flexible circuit board 300 is assembled with the heat dissipation composite film 200, the first electromagnetic shielding layer 321 of the flexible circuit board 300 can be attached to the first glue layer 210.

[0131] In some embodiments of the present disclosure, as Figure 32 shown, the heat dissipation composite film 200 includes a first glue layer 210, a first metal conductor layer 220, and a protective layer 240 that are sequentially stacked. The protective layer 240 is used to protect the first metal conductor layer 220.

[0132] In some embodiments of the present disclosure, when the protective layer 240 includes a protection area 243 and a barrier area 244 connected to the protection area 243, an adhesive is provided on one side of the protection area 243 close to the first metal conductor layer 220, which can make the protective layer 240 adhere to the first metal conductor layer 220 through the adhesive in the protection area 243. The existence of the first glue leakage hole 221 causes the barrier area 244 of the protective layer 240 to adhere to the first glue layer 210. By making the orthographic projection on the first glue layer 210 be located within the orthographic projection of the barrier area 244 on the first glue layer 210 and making the barrier area 244 be a release film, it is convenient to separate the barrier area 244 from the first glue layer 210 and avoid difficult film tearing. Optionally, when the heat dissipation composite film 200 is assembled with the flexible circuit board 300, the protective layer 240 can be removed from the heat dissipation composite film 200 as a whole; alternatively, the barrier area 244 can be removed from the heat dissipation composite film 200 separately, and the protection area 243 of the protective layer 240 is retained after the heat dissipation composite film 200 is assembled with the flexible circuit board 300.

[0133] In some embodiments of the present disclosure, when a barrier layer is provided between the protective layer 240 and the first metal conductor layer 220, an adhesive is provided on the side of the protective layer 240 close to the first metal conductor layer 220, so that the protective layer 240 can be adhered to the first metal conductor layer 220. At the same time, when a barrier layer is provided between the protective layer 240 and the first metal conductor layer 220, the orthographic projection of the first glue leakage hole 221 on the first glue layer 210 is located within the orthographic projection of the barrier layer on the first glue layer 210, and the barrier layer is a release film. The first glue layer 210 in the area corresponding to the first glue leakage hole 221 can be isolated from the protective layer 240, so as to avoid a large bonding force between the protective layer 240 and the first glue layer 210 in the area corresponding to the first glue leakage hole 221 due to bonding through the first glue layer 210 and the adhesive at the same time, and further reduce the risk of being difficult to tear off due to the large adhesion between the protective layer 240 and the first glue layer 210. Optionally, when the heat dissipation composite film 200 is assembled with the flexible circuit board 300, the protective layer 240 needs to be removed from the heat dissipation composite film 200 as a whole.

[0134] As an alternative embodiment, as Figure 32 shown, when the protective layer 240 includes a protection area 243 and a barrier area 244 connected to the protection area 243, a tear line 245 is provided between the barrier area 244 and the protection area 243.

[0135] In some embodiments of the present disclosure, as Figure 32 shown, when the protective layer 240 includes a protection area 243 and a barrier area 244 connected to the protection area 243, by providing a tear line 245 between the barrier area 244 and the protection area 243, the barrier area 244 can be more conveniently removed from the heat dissipation composite film 200 alone.

[0136] Based on the same inventive concept, an embodiment of the present disclosure also proposes a display device, as Figures 1 to 3 shown, the display device includes the above-mentioned display module.

[0137] Since the display device provided by the present invention includes the display module of the above technical solution, the display device provided by the present invention has all the beneficial effects of the above display module, which will not be elaborated here.

[0138] In this application, unless otherwise clearly defined or limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include contact between the first and second features through additional features therebetween rather than direct contact. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and diagonally above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and diagonally below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0139] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to this application.

[0140] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture. If this specific posture changes, then the directional indications will also change accordingly.

[0141] In this application, unless otherwise clearly defined or limited, the terms "connection", "fixation", etc. shall be understood in a broad sense. For example, "fixation" may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0142] In addition, in this application, descriptions such as "first", "second", etc. are only for descriptive purposes and should not be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second" may explicitly or implicitly include one or more of the said features. In the description of this application, "a plurality" means two or more, unless otherwise clearly and specifically defined.

[0143] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0144] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0145] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of this application. The scope of this application is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that: The display module comprises: A display panel, the display panel comprising a display area and a binding area connected to the display area; a heat dissipation composite film, the heat dissipation composite film being at least laminated on the non-display side of the display area, the heat dissipation composite film comprising a first adhesive layer and a first metal conductor layer laminated, the first metal conductor layer being located on a side of the first adhesive layer away from the display area, the first metal conductor layer being provided with a first adhesive leakage hole communicating with the first adhesive layer; and A flexible circuit board, the flexible circuit board comprising a first connection portion and a second connection portion connected to the first connection portion, the first connection portion being connected to the binding area, at least the second connection portion being located on a side of the heat dissipation composite film away from the display area, the second connection portion comprising a first electromagnetic shielding layer and a second metal conductor layer stacked, the first electromagnetic shielding layer being located on a side of the second metal conductor layer close to the first metal conductor layer, the first electromagnetic shielding layer being provided with a first leakage hole communicating with the second metal conductor layer, the first leakage hole being located in an edge region of the first electromagnetic shielding layer; Among them, the orthographic projection of the first electromagnetic shielding layer on the first plane is located within the orthographic projection of the first leakage hole on the first plane, the thickness of the first electromagnetic shielding layer is less than the thickness of the first metal conductor layer, and the orthographic projection of the first leakage hole on the first plane at least partially overlaps with the orthographic projection of the first metal conductor layer on the first plane; the first plane is the plane where the display area is located.

2. The display module according to claim 1, wherein: The thickness of the first electromagnetic shielding layer is 10 μm to 30 μm smaller than the thickness of the first metal conductor layer.

3. The display module according to claim 1, wherein: The first adhesive layer is a silicone gel layer.

4. The display module according to claim 1, wherein: The heat dissipation composite film also includes a buffer layer, which is stacked between the first metal conductor layer and the first adhesive layer. The buffer layer is provided with a second adhesive leakage hole connected to the first adhesive layer, and the orthographic projection of the first electromagnetic shielding layer on the first plane is located within the orthographic projection of the second adhesive leakage hole on the first plane.

5. The display module according to claim 4, characterized in that: An adhesive is disposed on a side of the buffer layer close to the first metal conductor layer.

6. The display module according to claim 1, wherein: The heat dissipation composite film also includes a protective layer, which is stacked on the side of the first metal conductor layer away from the first adhesive layer, and the protective layer is provided with a third leakage hole connected to the first adhesive layer, and the orthographic projection of the first electromagnetic shielding layer on the first plane is located within the orthographic projection of the third leakage hole on the first plane; the protective layer is also provided with a second leakage hole connected to the first metal conductor layer, and the orthographic projection of the first leakage hole on the first plane is located within the orthographic projection of the second leakage hole on the first plane.

7. The display module according to claim 6, wherein: The side of the protection layer close to the first metal conductor layer is arranged on the adhesive.

8. The display module according to any one of claims 1 to 7, characterized in that: The second connection portion further includes a second electromagnetic shielding layer and a metal bridge body, the second electromagnetic shielding layer is stacked and arranged on a side of the second metal conductor layer away from the first electromagnetic shielding layer, the second electromagnetic shielding layer is provided with a third leakage hole connected to the second metal conductor layer, and the metal bridge body is connected to the second metal conductor layer and is located in the third leakage hole; The display module further comprises a protective composite film, which is arranged on a side of the second electromagnetic shielding layer away from the display area, and comprises a first insulating layer, a third metal conductor layer and a second insulating layer which are stacked in one layer, wherein the first insulating layer is located on a side of the third metal conductor layer close to the second electromagnetic shielding layer, and the third metal conductor layer comprises a conductor area and a bridge area connected to the conductor area; The orthographic projection of the conductor area on the first plane is located within the orthographic projection of the first insulating layer on the first plane, the orthographic projection of the bridge area on the first plane is located outside the orthographic projection of the first insulating layer on the first plane, and the orthographic projection of the bridge area on the first plane at least partially overlaps with the orthographic projection of the metal bridge body on the first plane; the thickness of the metal bridge body on the side beyond the second electromagnetic shielding layer away from the third metal conductor layer is at least greater than the thickness of the first insulating layer; the orthographic projection of the third metal conductor layer on the first plane and the orthographic projection of the first insulating layer on the first plane are both located within the orthographic projection of the second insulating layer on the first plane.

9. The display module according to claim 8, wherein: The third leakage hole is located in an inner area of ​​the second electromagnetic shielding layer.

10. The display module according to claim 8, wherein: The second connecting part also includes a functional structure layer, and the second metal conductor layer includes a first sublayer and a second sublayer, the first sublayer is located on a side of the functional structure layer close to the first electromagnetic shielding layer, and the second sublayer is located on a side of the functional structure layer close to the second electromagnetic shielding layer.

11. The display module according to claim 8, wherein: The thickness of the metal bridge body on a side extending beyond the second electromagnetic shielding layer and away from the second metal conductor layer is 5 μm to 30 μm greater than the thickness of the first insulating layer.

12. The display module according to claim 8, wherein: The thickness of the metal bridge body beyond the second electromagnetic shielding layer and away from the second metal conductor layer is 10 μm to 30 μm.

13. The display module according to claim 8, wherein: Adhesive is provided on one side of the first insulating layer close to the conductor area and on one side of the first insulating layer close to the second electromagnetic shielding layer. The thickness of the metal bridge is greater than the total thickness of the second electromagnetic shielding layer, the first insulating layer and the adhesive on both sides of the first insulating layer.

14. The display module according to claim 8, wherein: An adhesive is provided on a side of the second insulating layer close to the third metal conductor layer, and the second insulating layer is bonded to the second electromagnetic shielding layer in a region where the orthographic projection of the second insulating layer on the first plane exceeds the third metal conductor layer and the first insulating layer.

15. A heat dissipation composite film for a display module according to any one of claims 1 to 14, characterized in that: The heat dissipation composite film comprises a first adhesive layer, a first metal conductor layer and a protective layer which are stacked in sequence, and the first metal conductor layer is provided with a first adhesive leakage hole which is connected with the first adhesive layer; The protective layer comprises a protection zone and a barrier zone connected to the protection zone, an adhesive is provided on a side of the protection zone close to the first metal conductor layer, an orthographic projection of the first glue leakage hole on the first glue layer is located within the orthographic projection of the barrier zone on the first glue layer, and the barrier zone is a release film; or, a barrier layer is provided between the protective layer and the first metal conductor layer, an adhesive is provided on a side of the protective layer close to the first metal conductor layer, an orthographic projection of the first glue leakage hole on the first glue layer is located within the orthographic projection of the barrier layer on the first glue layer, and the barrier layer is a release film.

16. The heat dissipation composite film according to claim 15, characterized in that: When the protective layer includes a protection area and a barrier area connected to the protection area, a tear line is provided between the barrier area and the protection area.

17. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 14.

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