Circuit board convenient for welding surface mount device

Abstract

The invention relates to the technical field of printed circuits, and discloses a circuit board convenient for welding a surface mount device, which comprises a flat plate, a round hole is formed in the top of the flat plate, an annular groove is formed in the top of the flat plate, a strip-shaped groove is formed in the bottom of the flat plate, and a groove is formed in the bottom of the flat plate. By arranging the fly wire mechanism, fly wire circuits needing to be processed independently are integrated into a standardized module, workers do not need to carry out tedious manual fly wire operation, circuit assembly is completed through prefabricated modular assemblies, on one hand, the number of welding points is greatly reduced through the modular structure, and on the other hand, the number of welding points is greatly reduced; on the other hand, the regularity and the consistency of fly wires at the bottom are ensured through the unified module design, the wiring quality is effectively improved, in addition, by reducing manual welding links, common process defects such as wrong welding and insufficient welding are fundamentally avoided, and the reliability of the circuit board sample plate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuits, and particularly to a circuit board facilitating the soldering of surface-mounted devices. Background Art

[0002] With the increasingly wide application of surface-mounted components, surface-mount technology has gradually become the mainstream technology for electronic assembly. There are two ways to solder surface-mounted components: manual soldering and automatic soldering. Manual soldering is suitable for small-batch production, maintenance, debugging, etc. Commonly used soldering tools include hot air desoldering stations, soldering irons, solder suckers, solder stencils, etc.

[0003] The patent application with the application number CN201620041864.2 discloses a circuit board facilitating the soldering of surface-mounted devices, including a circuit board body. The circuit board body includes a wiring layer, a conductive layer, and a soldering layer. Soldering bases are provided in the soldering areas of the surface-mounted devices in the soldering layer, and the soldering bases are embedded in the conductive layer; multiple groups of parallel grooves are opened in the soldering bases, solder positions are arranged in the parallel grooves, the ends of the parallel grooves are connected to inclined grooves, and a solder receiving groove for receiving redundant molten solder is arranged at the ends of the inclined grooves. Separate soldering bases are provided for surface-mounted devices, and each solder position is separated by a baffle between the parallel grooves. During soldering, the soldering iron can be smoothly drawn towards the solder receiving groove, efficiently receiving redundant molten solder, and effectively reducing defects such as false soldering and short circuits that occur in the soldering process of the printed circuit board.

[0004] In the production process of modern electronic products, before mass production is formally launched, engineers need to comprehensively verify the feasibility and reliability of the circuit design by making prototypes. This process can effectively detect potential defects in the circuit design. However, since the soldering of electronic components and the connection of circuits on the prototypes completely rely on manual operation, circuit adjustments are often required during the soldering process. And due to the high wiring density and small solder joint spacing, operators often need to perform wire flying, which directly leads to the chaos of the circuit layout at the bottom of the soldered board, easily increasing the risk of mis-soldering or false soldering. These problems may affect the test accuracy of the prototypes. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a circuit board facilitating the soldering of surface-mounted devices to solve the problems raised in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solution: A circuit board facilitating the soldering of surface-mounted devices, comprising a flat plate. A round hole is formed in the top of the flat plate, and an annular groove is formed in the top of the flat plate. A strip-shaped groove is formed in the bottom of the flat plate. By providing the strip-shaped groove, the staff can accurately place the solder strip at a predetermined position for soldering. Due to the constraint of the strip-shaped groove, the flow path and range of the solder are effectively controlled, avoiding the irregular diffusion of the solder. Secondly, this guided soldering method reduces the dependence on the skill level of the operator and reduces the soldering difficulty. Through the standardized soldering path, the quality problems such as mis-soldering and false soldering caused by the uncontrollable flow of the solder are fundamentally avoided. A groove is formed in the bottom of the flat plate, and a cross groove is formed in the bottom of the flat plate. Further included are: A flying wire mechanism. The flying wire mechanism includes a cross plate movably connected to the inner wall of the cross groove. One end of the cross plate away from the flat plate is fixedly connected to a first base. One end of the cross plate close to the square plate is fixedly connected to a magnet. A notch one is formed in the outer wall of the first base. An energizing head one is fixedly connected to the inner wall of the notch one. A positioning hole one is formed in the end of the first base away from the cross plate. A central hole one is formed in the end of the first base away from the cross plate. An elastic plate one is fixedly connected to the inner wall of the central hole one. A lifting assembly is movably connected to the inner wall of the central hole one. The first base is embedded in the flat plate through the cross plate, and a plurality of notch ones are formed in the outer wall, which serves to connect multiple lines. By providing the flying wire mechanism, the flying wire lines that need to be separately processed are integrated into a standardized module, enabling the staff to complete the circuit assembly through prefabricated modular components instead of performing cumbersome manual flying wire operations. On the one hand, the modular structure significantly reduces the number of soldering points and the process complexity. On the other hand, the unified module design ensures the regularity and consistency of the bottom flying wires, effectively improving the wiring quality. In addition, by reducing the manual soldering link, the common process defects such as mis-soldering and false soldering are fundamentally avoided, improving the reliability of the circuit board prototype.

[0007] According to the above technical solution, the lifting component includes a second base. One end of the second base close to the square plate is threadedly connected with a power-on column. One end of the second base close to the square plate is fixedly connected with a positioning column. The outer wall of the positioning column is movably connected with a first positioning hole. A notch two is formed in the outer wall of the second base. The inner wall of the notch two is fixedly connected with a third power-on head. A second positioning hole is formed in the side of the second base away from the square plate. A second central hole is formed in the side of the second base away from the square plate. The inner wall of the second central hole is fixedly connected with a second elastic plate. The power-on column is threadedly connected with the second base, and the power-on column can be installed or disassembled according to the specific wire splitting situation. By setting the lifting component, the flying wire device is equipped with the ability of multi-layer flying wires. When encountering complex wiring requirements, the lifting component can control the flying wire height to realize the multi-layer flying wire operation at the same position. This design not only improves the usage range and flexibility of the equipment, but more importantly, completely avoids the situation of having to use manual flying wires due to equipment function limitations, and improves the reliability of the circuit board sample.

[0008] According to the above technical solution, a blocking column is movably connected to the inner wall of the round hole. The top of the blocking column is fixedly connected with a round plate. The outer wall of the round plate is movably connected with an annular groove. A raised ring is fixedly connected to the outer wall of the blocking column. The blocking column blocks the round hole and plays a role in restricting the flowing position of the solder.

[0009] According to the above technical solution, a hollow column is movably connected to the inner wall of the round hole. The bottom of the hollow column is fixedly connected with an annular plate. The outer wall of the annular plate is fixedly connected with a square frame. The outer wall of the square frame is movably connected with a strip groove. The four sides of the square groove are all embedded in the strip groove, which plays a role in facilitating welding.

[0010] According to the above technical solution, a first U-shaped plate is movably connected to the inner wall of the strip groove. The top of the first U-shaped plate is fixedly connected with a third connecting plate. The bottom of the third connecting plate is fixedly connected with a second fixing plate. The outer wall of the second fixing plate is movably connected with a groove. The top of the third connecting plate is fixedly connected with a second power-on plate. The first U-shaped plate lifts the position where the wires need to be arranged, facilitating subsequent circuit connections.

[0011] According to the above technical solution, a second U-shaped plate is movably connected to the inner wall of the strip groove. Both ends of the second U-shaped plate are fixedly connected with fourth connecting plates. The bottoms of the two fourth connecting plates are both fixedly connected with third fixing plates. The outer walls of the third fixing plates are movably connected with grooves. The tops of the fourth connecting plates are fixedly connected with a third power-on plate. Both ends of the second U-shaped plate have fourth connecting plates, which play a role in continuous connection.

[0012] According to the above technical solution, the inner wall of the notch one is movably connected to a power-carrying plate four, the end of the power-carrying plate four away from the base one is fixedly connected to a connecting plate one, the end of the connecting plate one away from the power-carrying plate four is fixedly connected to a power-carrying head two, the inner wall of the power-carrying head two is movably connected to the power-carrying plate two, the outer wall of the power-carrying plate three is movably connected to the power-carrying head two, and the connecting plate one connects the base one and the U-shaped plate together.

[0013] According to the above technical solution, the inner wall of the groove is movably connected with a fixing plate 1, the top of the fixing plate 1 is fixedly connected with a connecting plate 2, the outer wall of the connecting plate 2 is fixedly connected with a convex point, both ends of the connecting plate 2 are fixedly connected with a power-on plate 1, the outer wall of the power-on plate 1 is movably connected with a notch 1, and the connecting plate 2 is connected between the base 1 and the base 1, and by setting a flying wire mechanism and adopting a flexible module combination scheme, the staff can quickly install and adjust the corresponding functional modules on the sample according to the actual flying wire requirements. This design improves the versatility of the equipment.

[0014] Compared with the prior art, the present invention provides a circuit board that is convenient for soldering surface mount devices, and has the following beneficial effects: 1. The present invention integrates the flying wire lines that need to be processed separately into standardized modules by setting up a flying wire mechanism, so that the staff does not need to perform tedious manual flying wire operations, but instead completes the line assembly through prefabricated modular components. On the one hand, the modular structure greatly reduces the number of welding points and reduces the process complexity. On the other hand, the unified module design ensures the regularity and consistency of the bottom flying wires, effectively improving the wiring quality. In addition, by reducing the manual welding links, common process defects such as wrong welding and cold welding are fundamentally avoided, and the reliability of the circuit board sample is improved.

[0015] 2. The present invention provides a lifting component so that the flying wire device has the ability of multi-layer flying wires. When encountering complex wiring requirements, the lifting component can control the flying wire height to achieve multi-layer flying wire operations at the same position. This design not only improves the use scope and flexibility of the equipment, but more importantly, completely avoids the situation where manual flying wires have to be used due to equipment function limitations, thereby improving the reliability of the circuit board sample.

[0016] 3. The present invention adopts a flexible module combination scheme by setting a flying wire mechanism, so that the staff can quickly install and adjust the corresponding functional modules on the sample board according to the actual flying wire requirements. This design improves the versatility of the equipment.

[0017] 4. By providing a strip-shaped groove, the present invention enables the staff to accurately place the solder bar at a predetermined position for soldering. Due to the constraint of the strip-shaped groove, the flow path and range of the solder are effectively controlled, avoiding the irregular diffusion of the solder. Secondly, this guided soldering method reduces the dependence on the skill level of the operator and the soldering difficulty. Through the standardized soldering path, the quality problems such as mis-soldering and false soldering caused by uncontrollable solder flow are fundamentally avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings: Figure 1 Schematic diagram of the overall structure of the present invention Figure 1 ; Figure 2 Schematic diagram of the overall structure of the present invention Figure 2 ; Figure 3 For the present invention Figure 1 Enlarged view of A in; Figure 4 For the present invention Figure 2 Enlarged view of B in; Figure 5 Schematic diagram of a partial structure of the present invention Figure 1 ; Figure 6 Schematic diagram of a partial structure of the present invention Figure 2 ; Figure 7 Schematic diagram of the flying wire mechanism of the present invention Figure 1 ; Figure 8 Schematic diagram of the flying wire mechanism of the present invention Figure 2 ; Figure 9 Schematic diagram of the flying wire mechanism of the present invention Figure 3 ; Figure 10 Schematic diagram of the flying wire mechanism of the present invention Figure 4 ; Figure 11 Schematic diagram of the lifting assembly of the present invention; Figure 12 Schematic diagram of the flying wire mechanism of the present invention Figure 5 ; Figure 13 Schematic diagram of the flying wire mechanism of the present invention Figure 6 ; Figure 14 Schematic diagram of the flying wire mechanism of the present invention Figure 7 ; Figure 15 Schematic diagram of the flying wire mechanism of the present inventionFigure 8 。

[0019] In the figure: 1. flat plate; 101. round hole; 102. annular groove; 103. strip groove; 104. groove; 105. cross groove; 106. hollow column; 107. annular plate; 108. square frame; 109. round plate; 1010. blocking column; 1011. convex ring; 2. flying wire mechanism; 201. cross plate; 202. base one; 203. notch one; 204. power-on head one; 205. positioning hole one; 206. central hole one; 207. elastic plate one; 208. magnet; 209. connecting plate one; 2010. power-on head two; 2011. fixing plate one; 2012. connecting plate two; 2013. bump; 2014. power-on plate one; 2015. U-shaped plate one; 2016. connecting plate three; 2017. fixing plate two; 2018. power-on plate two; 2019. U-shaped plate two; 2020. connecting plate four; 2021. power-on plate three; 2022. fixing plate three; 2023. power-on plate four; 21. lifting assembly; 211. base two; 212. power-on column; 213. positioning column; 214. notch two; 215. power-on head three; 216. central hole two; 217. positioning hole two; 218. elastic plate two. Specific implementation manners

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0021] Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation of the present invention.

[0022] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] Embodiment 1: Refer to Figures 1 - 6, the present invention provides a technical solution: a circuit board facilitating the soldering of surface-mounted devices, including a flat plate 1. A circular hole 101 is opened at the top of the flat plate 1, an annular groove 102 is opened at the top of the flat plate 1, a strip-shaped groove 103 is opened at the bottom of the flat plate 1, a groove 104 is opened at the bottom of the flat plate 1, and a cross-shaped groove 105 is opened at the bottom of the flat plate 1. A blocking column 1010 is movably connected to the inner wall of the circular hole 101. A circular plate 109 is fixedly connected to the top of the blocking column 1010. The outer wall of the circular plate 109 is movably connected to the annular groove 102. A raised ring 1011 is fixedly connected to the outer wall of the blocking column 1010. The blocking column 1010 blocks the circular hole 101, playing a role in restricting the flow position of solder. A hollow column 106 is movably connected to the inner wall of the circular hole 101. An annular plate 107 is fixedly connected to the bottom of the hollow column 106. A square frame 108 is fixedly connected to the outer wall of the annular plate 107. The outer wall of the square frame 108 is movably connected to the strip-shaped groove 103. When the device is in use, the hollow column 106 is inserted into the circular hole 101 where the electronic component needs to be soldered from the bottom of the flat plate 1. In the path where normal wiring is required, the circular holes 101 on the path through which the circuit passes are blocked by the blocking column 1010. In this way, while facilitating the soldering of electronic components, it can avoid excessive solder accumulation in the circular hole 101, thereby affecting the resistance value of the circuit.

[0024] Embodiment Two: Please refer to Figures 7 - 11 , on the basis of Embodiment One, the present invention provides a technical solution: a flying wire mechanism 2. The flying wire mechanism 2 includes a cross plate 201 movably connected to the inner wall of the cross-shaped groove 105. One end of the cross plate 201 away from the flat plate 1 is fixedly connected to a base one 202. One end of the cross plate 201 close to the square plate is fixedly connected to a magnet 208. A notch one 203 is opened on the outer wall of the base one 202. A power-on head one 204 is fixedly connected to the inner wall of the notch one 203. A positioning hole one 205 is opened at one end of the base one 202 away from the cross plate 201. A central hole one 206 is opened at one end of the base one 202 away from the cross plate 201. An elastic plate one 207 is fixedly connected to the inner wall of the central hole one 206. A lifting component 21 is movably connected to the inner wall of the central hole one 206. When flying wire is required, the cross base is inserted into the cross-shaped groove 105, and the magnet 208 at the bottom can strengthen the connection between the flying wire mechanism 2 and the flat plate 1. Then, the circuit that needs to be flown is inserted into the notch one 203, and the connection of the circuit is realized through the power-on head one 204.

[0025] The lifting component 21 includes a second base 211. One end of the second base 211 close to the square plate is threadedly connected with an energizing column 212. One end of the second base 211 close to the square plate is fixedly connected with a positioning column 213. The outer wall of the positioning column 213 is movably connected with the first positioning hole 205. A second notch 214 is formed in the outer wall of the second base 211. An energizing head three 215 is fixedly connected to the inner wall of the second notch 214. A second positioning hole 217 is formed in one side of the second base 211 away from the square plate. A second central hole 216 is formed in one side of the second base 211 away from the square plate. An elastic plate two 218 is fixedly connected to the inner wall of the second central hole 216. When multi-layer jumper wires are required, the energizing column 212 can be inserted into the first central hole 206, and the fitting of the elastic plate one 207 and the energizing column 212 ensures the stability of the circuit. When the number of layers is high but there is no need to energize with the bottom first base 202, the energizing column 212 at the bottom can be disassembled to ensure the correct connection of the circuit.

[0026] Embodiment 3: Please refer to Figures 12 - 15 , on the basis of Embodiment 1 and Embodiment 2, the present invention provides a technical solution: A U-shaped plate one 2015 is movably connected to the inner wall of the strip-shaped groove 103. A third connecting plate 2016 is fixedly connected to the top of the U-shaped plate one 2015. A second fixing plate 2017 is fixedly connected to the bottom of the third connecting plate 2016. The outer wall of the second fixing plate 2017 is movably connected with the groove 104. A second energizing plate 2018 is fixedly connected to the top of the third connecting plate 2016. The U-shaped plate one 2015 lifts the position where strip wires are required, facilitating subsequent circuit connection. A U-shaped plate two 2019 is movably connected to the inner wall of the strip-shaped groove 103. Both ends of the U-shaped plate two 2019 are fixedly connected with fourth connecting plates 2020. A third fixing plate 2022 is fixedly connected to the bottom of each of the two fourth connecting plates 2020. The outer wall of the third fixing plate 2022 is movably connected with the groove 104. A third energizing plate 2021 is fixedly connected to the top of the fourth connecting plate 2020. When jumper wires are required, the U-shaped plate one 2015 or the U-shaped plate two 2019 is installed in the strip-shaped groove 103, and the first fixing plate 2011 or the second fixing plate 2017 is inserted into the groove 104, and the square frame 108 is directly connected to the U-shaped plate one 2015 or the U-shaped plate two 2019 by soldering.

[0027] The inner wall of the first notch 203 is movably connected with a fourth energizing plate 2023. One end of the fourth energizing plate 2023 away from the first base 202 is fixedly connected with a first connecting plate 209. One end of the first connecting plate 209 away from the fourth energizing plate 2023 is fixedly connected with a second energizing head 2010. The inner wall of the second energizing head 2010 is movably connected with a second energizing plate 2018. The outer wall of the third energizing plate 2021 is movably connected with the second energizing head 2010. When making a jumper wire, connect the second energizing head 2010 with the second energizing plate 2018 or the third energizing plate 2021, and embed the fourth energizing plate 2023 on the other side into the first notch 203 of the first base 202.

[0028] The inner wall of the groove 104 is movably connected with a first fixing plate 2011. The top of the first fixing plate 2011 is fixedly connected with a second connecting plate 2012. The outer wall of the second connecting plate 2012 is fixedly connected with bumps 2013. Both ends of the second connecting plate 2012 are fixedly connected with first energizing plates 2014. The outer walls of the first energizing plates 2014 are movably connected with the first notch 203. When making a jumper wire, embed the energizing plates on both sides of the second connecting plate 2012 into the first notches 203 or the second notches 214 on both sides respectively to complete the connection between the first bases 202 and the first bases 202, or between the second bases 211 and the second bases 211.

[0029] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0030] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A circuit board for facilitating soldering of surface mount devices, comprising a flat plate (1), a circular hole (101) being provided at the top of the flat plate (1), an annular groove (102) being provided at the top of the flat plate (1), a strip groove (103) being provided at the bottom of the flat plate (1), a groove (104) being provided at the bottom of the flat plate (1), and a cross groove (105) being provided at the bottom of the flat plate (1), characterized in that: Also includes: The flying wire mechanism (2) comprises a cross plate (201) movably connected to the inner wall of the cross groove (105), the end of the cross plate (201) away from the flat plate (1) is fixedly connected to a base (202), the end of the cross plate (201) close to the square plate is fixedly connected to a magnet (208), the outer wall of the base (202) is provided with a notch (203), the inner wall of the notch (203) is fixedly connected to a power supply head (204), and the base (202) away from the cross groove (105) is fixedly connected to a power supply head (204). A positioning hole (205) is provided at one end of the letter plate (201), a center hole (206) is provided at one end of the base (202) away from the cross plate (201), an elastic plate (207) is fixedly connected to the inner wall of the center hole (206), and a lifting assembly (21) is movably connected to the inner wall of the center hole (206), the base (202) is embedded in the flat plate (1) through the cross plate (201), and a plurality of notches (203) are provided on the outer wall to connect a plurality of circuits.

2. A circuit board for facilitating soldering of surface mount devices according to claim 1, characterized in that: The lifting assembly (21) includes a second base (211), an end of the second base (211) close to the square plate is threadedly connected to a power-on column (212), an end of the second base (211) close to the square plate is fixedly connected to a positioning column (213), an outer wall of the positioning column (213) is movably connected to a first positioning hole (205), an outer wall of the second base (211) is provided with a second notch (214), an inner wall of the second notch (214) is fixedly connected to a third power-on head (215), a side of the second base (211) away from the square plate is provided with a second positioning hole (217), a side of the second base (211) away from the square plate is provided with a second center hole (216), an inner wall of the second center hole (216) is fixedly connected to a second elastic plate (218), the power-on column (212) and the second base (211) are threadedly connected, and the power-on column (212) can be installed or removed according to specific wiring conditions.

3. A circuit board for facilitating soldering of surface mount devices according to claim 2, characterized in that: The inner wall of the circular hole (101) is movably connected to a blocking column (1010), the top of the blocking column (1010) is fixedly connected to a circular plate (109), the outer wall of the circular plate (109) is movably connected to the annular groove (102), and the outer wall of the blocking column (1010) is fixedly connected to a raised ring (1011), and the blocking column (1010) blocks the circular hole (101) to play the role of positioning the current tin flow.

4. A circuit board for facilitating soldering of surface mount devices according to claim 3, characterized in that: The inner wall of the circular hole (101) is movably connected to a hollow column (106), the bottom of the hollow column (106) is fixedly connected to an annular plate (107), the outer wall of the annular plate (107) is fixedly connected to a square frame (108), the outer wall of the square frame (108) is movably connected to the strip groove (103), and the four square grooves are all embedded in the strip grooves to facilitate welding.

5. A circuit board for facilitating soldering of surface mount devices according to claim 4, characterized in that: The inner wall of the strip groove (103) is movably connected to a U-shaped plate 1 (2015), the top of the U-shaped plate 1 (2015) is fixedly connected to a connecting plate 3 (2016), the bottom of the connecting plate 3 (2016) is fixedly connected to a fixing plate 2 (2017), the outer wall of the fixing plate 2 (2017) is movably connected to the groove (104), the top of the connecting plate 3 (2016) is fixedly connected to a power-on plate 2 (2018), and the U-shaped plate 1 (2015) lifts the position where the strip line is required to facilitate subsequent line connection.

6. A circuit board for facilitating soldering of surface mount devices according to claim 5, characterized in that: The inner wall of the strip groove (103) is movably connected to a U-shaped plate 2 (2019), both ends of the U-shaped plate 2 (2019) are fixedly connected to a connecting plate 4 (2020), the bottoms of the two connecting plates 4 (2020) are fixedly connected to a fixing plate 3 (2022), the outer wall of the fixing plate 3 (2022) is movably connected to the groove (104), the top of the connecting plate 4 (2020) is fixedly connected to a power-on plate 3 (221), and both ends of the U-shaped plate 2 (2019) have connecting plates 4 (2020) to play a role of continuous connection.

7. A circuit board for facilitating soldering of surface mount devices according to claim 6, characterized in that: The inner wall of the notch one (203) is movably connected to a power-carrying plate four (2023); the end of the power-carrying plate four (2023) away from the base one (202) is fixedly connected to a connecting plate one (209); the end of the connecting plate one (209) away from the power-carrying plate four (2023) is fixedly connected to a power-carrying head two (2010); the inner wall of the power-carrying head two (2010) is movably connected to the power-carrying plate two (218); the outer wall of the power-carrying plate three (2021) is movably connected to the power-carrying head two (2010); and the connecting plate one (209) connects the base one (202) and the U-shaped plate together.

8. A circuit board for facilitating soldering of surface mount devices according to claim 7, characterized in that: The inner wall of the groove (104) is movably connected to a fixing plate 1 (2011), the top of the fixing plate 1 (2011) is fixedly connected to a connecting plate 2 (2012), the outer wall of the connecting plate 2 (2012) is fixedly connected to a protrusion (213), both ends of the connecting plate 2 (2012) are fixedly connected to a power-carrying plate 1 (2014), the outer wall of the power-carrying plate 1 (2014) is movably connected to the notch 1 (203), and the connecting plate 2 (212) connects the base 1 (202) to the base 1 (202).

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