Printed circuit board

Abstract

The present disclosure provides a printed circuit board including: a magnetic structure including a magnetic layer having a through-hole, an insulating film disposed on a wall surface of the through-hole, the insulating film including an inorganic insulating material, and a conductor layer disposed on the insulating film, the conductor layer filling at least a portion of the through-hole, the conductor layer comprises metal; an insulating layer covering at least a portion of the magnetic structure; a wiring layer disposed on or in the insulating layer; and a via layer disposed in the insulating layer, the via layer including a first connection via connecting the conductor layer to the wiring layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0187033, filed with the Korean Intellectual Property Office on December 20, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a printed circuit board. Background Art

[0003] Recently, in order to thin semiconductor chips and improve their power efficiency, it has been necessary to embed various passive devices, such as capacitors and inductors, in a package substrate. Compared with chip components, according to related art, inductors need to improve inductance by changing their materials and structures. Summary of the Invention

[0004] One aspect of the present disclosure provides a printed circuit board for improving capacitance and inductance of an inductor.

[0005] Another aspect of the present disclosure provides a printed circuit board that is further thinned and has a higher degree of integration.

[0006] According to one aspect of the present disclosure, a through-hole may be formed in a magnetic layer, and then the through-hole may be filled with an insulating film and a conductor layer to form a magnetic structure, and the magnetic structure may be embedded in a substrate to directly form a magnetic composite inductor (MCI).

[0007] For example, a printed circuit board according to one aspect of the present disclosure may include: a magnetic structure including a magnetic layer having a through-hole, an insulating film provided on a wall surface of the through-hole, and a conductor layer provided on the insulating film, the insulating film including an inorganic insulating material, the conductor layer filling at least a part of the through-hole, the conductor layer including a metal; an insulating layer covering at least a part of the magnetic structure; a wiring layer provided on or in the insulating layer; and a via layer provided in the insulating layer, the via layer including connection vias connecting the conductor layer to the wiring layer.

[0008] For example, a printed circuit board according to another aspect of the present disclosure may include: a magnetic structure including a magnetic layer having a through hole, an insulating film provided on a wall surface of the through hole, and a conductor layer provided on the insulating film, the conductor layer filling at least a part of the through hole; an insulating layer covering at least a part of the magnetic structure; a wiring layer provided on or in the insulating layer; and a via layer provided in the insulating layer, the via layer including connection vias connecting the conductor layer to the wiring layer. A first surface of the magnetic layer, a first surface of the insulating film, and a first surface of the conductor layer may be substantially coplanar with each other. A second surface of the magnetic layer, a second surface of the insulating film, and a second surface of the conductor layer may be substantially coplanar with each other.

[0009] According to an exemplary embodiment of the present disclosure, the printed circuit board may improve the capacitance and inductance of an inductor.

[0010] In addition, the printed circuit board may be further thinned and may have a higher degree of integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 is a schematic block diagram of an example of an electronic device system; Figure 2 is a schematic perspective view of an example of an electronic device; Figure 3 is a schematic cross-sectional view of an example of a printed circuit board; Figures 4A to 4I is for manufacturing Figure 3 a schematic cross-sectional view of an example of a magnetic structure of a printed circuit board therein; Figure 5 is a schematic cross-sectional view of another example of a printed circuit board; Figures 6A to 6J is for manufacturing Figure 5 a schematic cross-sectional view of an example of a magnetic structure of a printed circuit board therein; Figure 7 is a schematic cross-sectional view of another example of a printed circuit board; Figures 8A to 8K is for manufacturing Figure 7 a schematic cross-sectional view of an example of a magnetic structure of a printed circuit board therein; and Figures 9A to 9F is applicable to Figure 3 , Figure 5 and Figure 7 schematic plan views of various examples of coils of a printed circuit board therein. DETAILED DESCRIPTION

[0012] In the following, example embodiments of the present disclosure are described with reference to the accompanying drawings. For a clearer description, the shapes and sizes of components in the drawings may be exaggerated or reduced.

[0013] Electronic device Figure 1 is a schematic block diagram of an example of an electronic device system.

[0014] Referring to the accompanying drawings, the electronic device 1000 may house a main board 1010. Chip-related components 1020, network-related components 1030, and other components 1040 may be physically and / or electrically connected to the main board 1010. Such components may be connected to other electronic components described below via various signal lines 1090.

[0015] The chip-related components 1020 may include: memory chips, such as volatile memory (e.g., dynamic random access memory (DRAM)), non-volatile memory (e.g., read-only memory (ROM), flash memory); application processor chips, such as a central processor (e.g., central processing unit (CPU)), graphics processor (e.g., graphics processing unit (GPU)), digital signal processor, cryptographic processor, microprocessor, or microcontroller; and logic chips, such as an analog-to-digital converter or an application-specific integrated circuit (ASIC). However, the chip-related components 1020 are not limited thereto and may include other types of chip-related components. In addition, the chip-related components 1020 may be combined with each other. The chip-related components 1020 may be in the form of a package including the above-mentioned chips or electronic components.

[0016] The network-related components 1030 may include components that are compatible with or operate according to protocols such as: Wi-Fi (Institute of Electrical and Electronics Engineers (IEEE) 802.11 series, etc.), Worldwide Interoperability for Microwave Access (WiMAX) (IEEE 802.16 series, etc.), IEEE 802.20, Long Term Evolution (LTE), Evolution-Data Optimized (Ev-DO), High Speed Packet Access+ (HSPA+), High Speed Downlink Packet Access+ (HSDPA+), High Speed Uplink Packet Access+ (HSUPA+), Global System for Mobile Communications (GSM), Enhanced Data Rates for GSM Evolution (EDGE), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Wireless LAN, Bluetooth ®, the third-generation mobile communication technology (3G) protocol, the fourth-generation mobile communication technology (4G) protocol, the fifth-generation mobile communication technology (5G) protocol, and any other wireless protocol and wired protocol specified after the above protocols. However, the network-related component 1030 is not limited thereto and may also include components that are compatible with or operate according to various other wireless standards or protocols or wired standards or protocols. In addition, the network-related component 1030 may be combined with each other together with the above chip-related component 1020.

[0017] The other components 1040 may include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, low-temperature co-fired ceramic (LTCC) components, electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCCs), etc. However, the other components 1040 are not limited thereto and may also include passive components for various other purposes. In addition, the other components 1040 may be combined with each other together with the above chip-related component 1020 and / or network-related component 1030.

[0018] According to the type of the electronic device 1000, the electronic device 1000 may include other electronic components that are physically and / or electrically connected to the main board 1010 or not physically and / or not electrically connected to the main board 1010. The other electronic components may include, for example, a camera 1050, an antenna 1060, a display 1070, a battery 1080, etc. However, the other electronic components are not limited thereto and may be an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage unit (e.g., a hard disk drive), a compact disc (CD), a digital versatile disc (DVD), etc. In addition, according to the type of the electronic device 1000, the electronic device 1000 may also include other electronic components for various purposes.

[0019] The electronic device 1000 may be a smart phone, a personal digital assistant (PDA), a digital video camera, a digital camera, a network system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a television, a video game console, a smart watch, an automotive component, etc. However, the electronic device 1000 is not limited thereto and may be any other electronic device capable of processing data.

[0020] Figure 2 is a schematic perspective view of an example of an electronic device.

[0021] Referring to the accompanying drawings, the electronic device may be, for example, a smart phone 1100. The main board 1110 may be accommodated in the smart phone 1100, and various electronic components 1120 may be physically and / or electrically connected to the main board 1110. Additionally, other electronic components (such as the camera module 1130 and / or the speaker 1140) that are physically and / or electrically connected to the main board 1110 or not physically and / or not electrically connected to the main board 1110 may be accommodated in the smart phone 1100. A part of the electronic components 1120 may be the above-mentioned chip-related components. For example, the component package 1121, but the present disclosure is not limited thereto. The component package 1121 may be in the form of a printed circuit board on which electronic components including active components and / or passive components are surface-mounted. The electronic device is not necessarily limited to the smart phone 1100 and may be other electronic devices as described above.

[0022] Printed circuit board Figure 3 Is a schematic cross-sectional view of an example of a printed circuit board.

[0023] Referring to the accompanying drawings, the printed circuit board 100A according to an example may include: a magnetic structure 150A including a magnetic layer 151 having a through hole h, an insulating film 152 provided on the wall surface of the through hole h, and a conductor layer 153 provided on the insulating film 152, the conductor layer 153 filling at least a part of the through hole h; an insulating layer 110 covering at least a part of the magnetic structure 150A; a wiring layer 120 provided on or in the insulating layer 110; and a via layer 130 provided in the insulating layer 110. As needed, the printed circuit board 100A may further include a first electronic component 170 buried in the insulating layer 110 and a second electronic component 190 mounted on the insulating layer 110.

[0024] The insulating film 152 may include an inorganic insulating material. For example, the insulating film 152 may include an inorganic oxide film. For example, the inorganic insulating material included in the insulating film 152 may include at least one of an oxide of Zn and an oxide of Sn. For example, the inorganic insulating material included in the insulating film 152 may include at least one of Al2O3, TiO2, ZnO, ZnO2, ZrO2, SnO, SnO2, HfO2, and SiO2, but the present disclosure is not limited thereto. The insulating film 152 may be formed using the above inorganic insulating material by a deposition process, and thus may be formed to have a small thickness. Therefore, the magnetic layer 151 may be formed thick enough. For example, in a cross-section in a direction perpendicular to the wall surface of the via hole h, the width t1 of the insulating film 152 located between the wall surface of the via hole h and the side surface of the conductor layer 153 may be smaller than the width t2 of the magnetic layer 151 located between the wall surface of the via hole h and the outer side surface of the magnetic layer 151. For example, in a cross-section in a direction perpendicular to the wall surface of the via hole h, the width t1 of the insulating film 152 located between the wall surface of the via hole h and the side surface of the conductor layer 153 may be less than or equal to 2 μm, and for example, may be about 1 μm to 2 μm. Therefore, an inductor (such as a magnetic composite inductor (MCI)) formed using the magnetic structure 150 in the printed circuit board 100A may have an increased capacitance and may also have an increased inductance. That is, the printed circuit board may include an MCI, and the MCI may include the magnetic structure 150 and at least a part of a wiring layer connected to the magnetic structure 150.

[0025] The upper surface and the lower surface of the magnetic structure 150 may be substantially flat. For example, a planarization process such as polishing may be performed. Therefore, the upper surfaces of the magnetic layer 151, the insulating film 152, and the conductor layer 153 may be substantially coplanar with each other. In addition, the lower surfaces of the magnetic layer 151, the insulating film 152, and the conductor layer 153 may be substantially coplanar with each other. Therefore, the insulating layer 110 covering them may also have more excellent flatness. Therefore, it may be easier to form the wiring layer 120 and the via hole layer 130.

[0026] A plurality of magnetic structures 150 may be provided. The plurality of magnetic structures 150 may be arranged to be spaced apart from each other. The conductor layers 153 of the plurality of magnetic structures 150 may be connected to each other through the wiring layer 120 and the via layer 130 to form one or more coils. Optionally, the magnetic layer 151 of the magnetic structure 150 may have a plurality of through-holes h, and the insulating film 152 and the conductor layer 153 may be formed in each of the plurality of through-holes h. The conductor layers 153 in the plurality of through-holes h may be connected to each other through the wiring layer 120 and the via layer 130 to form one or more coils. Optionally, both the conductor layer 153 of the magnetic structure 150 and the conductor layer 153 in the through-hole h may be combined with each other to form one or more coils. For example, at least one of the plurality of magnetic structures 150 may have a plurality of through-holes h, and the insulating film 152 and the conductor layer 153 may be formed in each of the plurality of through-holes h, and the conductor layer 153 of each of the plurality of magnetic structures 150 and / or the conductor layer 153 in each of the plurality of through-holes h may be connected to each other through the wiring layer 120 and the via layer 130 to form one or more coils. Accordingly, an MCI may be formed in the printed circuit board 100A. Accordingly, the printed circuit board 100A may be further thinned and may have a higher degree of integration. For example, the mounting area on the printed circuit board 100A may be increased, and the current path between the electronic components and the inductor may be minimized.

[0027] The via layer 130 may include a first connection via 131 that connects the conductor layer 153 of the magnetic structure 150 to the wiring layer 120. For example, the via layer 130 may include a first-first connection via 131-1 that passes through a part of the upper side of the insulating layer 110 and a first-second connection via 131-2 that passes through a part of the lower side of the insulating layer 110. The first-first connection via 131-1 is directly connected to the upper surface of the conductor layer 153, the first-second connection via 131-2 is directly connected to the lower surface of the conductor layer 153, and the first connection via 131 may include the first-first connection via 131-1 and the first-second connection via 131-2. As described, in the printed circuit board 100A according to the example, the conductor layer 153 of the magnetic structure 150 may be directly connected to the first connection via 131 of the via layer 130. Accordingly, the process of manufacturing the printed circuit board 100A may be further simplified. The printed circuit board 100A may be further thinned and may have a higher degree of integration.

[0028] The first electronic component 170 may be disposed in the insulating layer 110 and may include at least one of a voltage regulator and a power management integrated circuit, but the present disclosure is not limited thereto. The first electronic component 170 may be connected to at least a part of the conductor layer 153 of the magnetic structure 150 through the wiring layer 120 and the via layer 130. In addition, the second electronic component 190 may be disposed on the insulating layer 110 and may include at least one of a memory chip, an application processor chip, and a logic chip, but the present disclosure is not limited thereto. The second electronic component 190 may also be connected to at least another part of the conductor layer 153 of the magnetic structure 150 through the wiring layer 120 and the via layer 130. As described above, the first electronic component 170 and the second electronic component 190 may be disposed inside and outside the printed circuit board 100A to be connected to the conductor layer 153 of the magnetic structure 150, so that the printed circuit board 100A may be further thinned and may have a higher integration degree. For example, the mounting area on the printed circuit board 100A may be further increased, and the current path between the first electronic component 170 and the second electronic component 190 and the MCI may be minimized.

[0029] Hereinafter, the components of the printed circuit board 100A according to the example will be described in more detail with reference to the drawings.

[0030] The insulating layer 110 may include a first insulating layer 111, a second insulating layer 112, a third insulating layer 113, and a fourth insulating layer 114. The first insulating layer 111 may have a first through portion H1 in which at least a part of the magnetic structure 150 is disposed and a second through portion H2 in which at least a part of the first electronic component 170 is disposed. The first insulating layer 111 may be a core layer. The second insulating layer 112 may cover at least a part of each of the first insulating layer 111, the magnetic structure 150, and the first electronic component 170, and may fill at least a part of each of the first through portion H1 and the second through portion H2. For example, the second insulating layer 112 may be disposed on the upper surface and the lower surface of the first insulating layer 111. The third insulating layer 113 may be disposed on the upper surface of the second insulating layer 112. The fourth insulating layer 114 may be disposed on the lower surface of the second insulating layer 112. The second insulating layer 112, the third insulating layer 113, and the fourth insulating layer 114 may be stacked layers. Stacked layers may be further formed on each of the third insulating layer 113 and the fourth insulating layer 114. The first through portion H1 and the second through portion H2 may respectively pass through the region between the upper surface and the lower surface of the first insulating layer 111, but may pass through only a part of the first insulating layer 111 from the upper surface. For example, the first through portion H1 and the second through portion H2 may be through cavities and / or blind cavities.

[0031] The first insulating layer 111, the second insulating layer 112, the third insulating layer 113, and the fourth insulating layer 114 may include an inorganic insulating material and / or an organic insulating material. As a non-limiting example, the first insulating layer 111, the second insulating layer 112, the third insulating layer 113, and the fourth insulating layer 114 may all include an organic insulating material. Optionally, the first insulating layer 111 may include an inorganic insulating material, and the second insulating layer 112, the third insulating layer 113, and the fourth insulating layer 114 may include an organic insulating material. However, the present disclosure is not limited thereto. The organic insulating material may include a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a material including inorganic fillers, organic fillers, and / or glass fibers (such as glass fabric of glass cloth) and a resin. For example, the organic insulating material may be a copper-clad laminate (CCL), a prepreg (PPG), an Ajinomoto build-up film (ABF), a photosensitive dielectric (PID), etc., but the present disclosure is not limited thereto. The inorganic insulating material may include a glass substrate, a silicon substrate, and / or a ceramic substrate. For example, the glass substrate may include glass. The glass may include, for example, pure silica (about 100% SiO2), soda-lime glass, borosilicate glass, aluminosilicate glass, etc. However, the present disclosure is not limited thereto, and alternative glass materials such as fluorine glass, phosphate glass, chalcogenide glass, etc. may also be used as the material of the glass layer. In addition, other additives may be further included to form glass having specific physical properties. The above additives may be magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, and carbonates (e.g., calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda)) and / or oxides of the above elements or other elements. The glass may be distinguished from the glass fibers (such as glass fabric of glass cloth) included in the organic insulating material. In addition, the silicon substrate may include silicon (Si), and an oxide layer formed on the silicon (Si) may be included as needed. In addition, the silicon substrate may include a nitride layer formed on the oxide layer. The oxide layer may include a silicon oxide film, and the nitride layer may include a silicon nitride film, but the present disclosure is not limited thereto. In addition, the ceramic substrate may include ceramics, and the ceramics may include, for example, alumina (Al2O3), aluminum nitride (AlN), silicon carbide (SiC), silicon nitride (Si3N4), etc., but the present disclosure is not limited thereto.

[0032] The wiring layer 120 may include a first wiring layer 121 disposed on the upper surface of the second insulating layer 112, a second wiring layer 122 disposed on the lower surface of the second insulating layer 112, a third wiring layer 123 disposed on the upper surface of the first insulating layer 111, a fourth wiring layer 124 disposed on the lower surface of the first insulating layer 111, a fifth wiring layer 125 disposed on the upper surface of the third insulating layer 113, and a sixth wiring layer 126 disposed on the lower surface of the fourth insulating layer 114. The third wiring layer 123 is at least partially embedded in the second insulating layer 112, and the fourth wiring layer 124 is at least partially embedded in the second insulating layer 112. When the insulating layer 110 further includes a stacking layer, the wiring layer 120 may further include a stacked wiring layer. The first wiring layer 121, the second wiring layer 122, the third wiring layer 123, the fourth wiring layer 124, the fifth wiring layer 125, and the sixth wiring layer 126 may each include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or their alloys. The metal may preferably include copper (Cu), but the present disclosure is not limited thereto. The first wiring layer 121, the second wiring layer 122, the third wiring layer 123, the fourth wiring layer 124, the fifth wiring layer 125, and the sixth wiring layer 126 may perform various functions according to their designs. For example, it may include signal patterns, power patterns, ground patterns, etc. The patterns may each have various forms such as lines, planes, pads, etc. The first wiring layer 121, the second wiring layer 122, the third wiring layer 123, the fourth wiring layer 124, the fifth wiring layer 125, and the sixth wiring layer 126 may each include a seed layer and a plating layer formed on the seed layer. The seed layer may be an electroless plating layer (e.g., electroless copper plating layer) and / or a sputtering layer, and the plating layer may be an electrolytic plating layer (e.g., electrolytic copper plating layer), but the present disclosure is not limited thereto.

[0033] The via layer 130 may include: a first-first connection via 131-1 that passes through a part of the upper side of the second insulating layer 112, and the first-first connection via 131-1 connects the upper surface of the conductor layer 153 to at least a part of the first wiring layer 121; a first-second connection via 131-2 that passes through a part of the lower side of the second insulating layer 112, and the first-second connection via 131-2 connects the lower surface of the conductor layer 153 to at least a part of the second wiring layer 122; a second connection via 132 that passes through another part of the lower side of the second insulating layer 112, and the second connection via 132 connects the first electronic component 170 to at least another part of the second wiring layer 122; a third connection via 133 that passes through another part of the upper side of the second insulating layer 112, and the third connection via 133 connects at least a part of the first wiring layer 121 and at least a part of the third wiring layer 123 to each other; a fourth connection via 134 that passes through another part of the lower side of the second insulating layer 112, and the fourth connection via 134 connects at least a part of the second wiring layer 122 and at least a part of the fourth wiring layer 124 to each other; a fifth connection via 135 that passes through a part of the third insulating layer 113, and the fifth connection via 135 connects at least a part of the first wiring layer 121 and at least a part of the fifth wiring layer 125 to each other; a sixth connection via 136 that passes through a part of the fourth insulating layer 114, and the sixth connection via 136 connects at least a part of the second wiring layer 122 and at least a part of the sixth wiring layer 126 to each other; and a through via that passes through a part of the first insulating layer 111, and the through via connects at least a part of the third wiring layer 123 and at least a part of the fourth wiring layer 124 to each other. The first connection via 131 may include the first-first connection via 131-1 and the first-second connection via 131-2. When the insulating layer 110 further includes a stacked insulating layer, the via layer 130 may further include a stacked via layer.

[0034] The first connection via 131, the second connection via 132, the third connection via 133, the fourth connection via 134, the fifth connection via 135, the sixth connection via 136, and the through via 137 may each include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or their alloys. The metal may preferably include copper (Cu), but the present disclosure is not limited thereto. The first connection via 131, the second connection via 132, the third connection via 133, the fourth connection via 134, the fifth connection via 135, the sixth connection via 136, and the through via 137 may each include a filling type via filling a via hole or a conformal via provided along the wall surface of the via hole or the through hole. The first connection via 131, the second connection via 132, the third connection via 133, the fourth connection via 134, the fifth connection via 135, the sixth connection via 136, and the through via 137 may perform various functions according to their designs. For example, it may include a ground via, a power via, a signal via, etc. The first connection via 131, the second connection via 132, the third connection via 133, the fourth connection via 134, the fifth connection via 135, the sixth connection via 136, and the through via 137 may each include an electroless plating layer (e.g., electroless copper plating layer) and an electrolytic plating layer (e.g., electrolytic copper plating layer). Instead of the electroless plating layer (e.g., electroless copper plating layer), a sputtering layer may be included, or both may be included. The first connection via 131, the second connection via 132, the third connection via 133, the fourth connection via 134, the fifth connection via 135, and the sixth connection via 136 may each have a tapered shape in cross section. The through via 137 may have a cylindrical shape in cross section. A filler p may be provided in the through via 137, and the filler p may include an insulating material or a conductive material.

[0035] The magnetic structure 150 may include a magnetic layer 151 having a through hole h, an insulating film 152 provided on the wall surface of the through hole h, and a conductor layer 153 provided on the insulating film 152 to fill at least a part of the through hole h. A plurality of magnetic structures 150 may be provided, and the plurality of magnetic structures 150 may be arranged to be spaced apart from each other. The conductor layers 153 of the plurality of magnetic structures 150 may be connected to each other through the wiring layer 120 and the via layer 130 to form one or more coils. Optionally, the magnetic layer 151 of the magnetic structure 150 may have a plurality of through holes h, and the insulating film 152 and the conductor layer 153 may be formed in each of the plurality of through holes h. The conductor layers 153 in the plurality of through holes h may be connected to each other through the wiring layer 120 and the via layer 130 to form one or more coils. Optionally, both the conductor layer 153 of the magnetic structure 150 and the conductor layer 153 in the through hole h may be combined with each other to form one or more coils. For example, at least one of the plurality of magnetic structures 150 may have a plurality of through holes h, and the insulating film 152 and the conductor layer 153 may be formed in each of the plurality of through holes h, and the conductor layer 153 of each of the plurality of magnetic structures 150 and / or the conductor layer 153 in each of the plurality of through holes h may be connected to each other through the wiring layer 120 and the via layer 130 to form one or more coils. Accordingly, the MCI may be formed in the printed circuit board 100A.

[0036] The magnetic layer 151 may include a magnetic material. The magnetic material may include, for example, a ferrite-based material, a permalloy-based material, etc. For example, the magnetic material may include Ni-based ferrite, Ni-Zn-based ferrite, Ni-Zn-Cu-based ferrite, Fe-Si-Al (Sendust), Ni-Mo-Fe (a molypermalloy powder (MPP) core), Ni-Fe (a high flux core), etc., but the present disclosure is not limited thereto, and the magnetic material may include other known ferrite-based materials, permalloy-based materials, etc. In addition, various types of magnetic materials including other magnetic powders and / or magnetic particles may be used. The magnetic layer 151 may be solidified in the form of a magnetic film or a magnetic sheet, and may be provided in the first through portion H1. Accordingly, the magnetic layer 151 may be provided to be spaced apart from the first insulating layer 111.

[0037] The insulating film 152 may include an insulating material, for example, an inorganic insulating material. For example, the insulating film 152 may include an inorganic oxide film. For example, the inorganic insulating material included in the insulating film 152 may include at least one of Al2O3, TiO2, ZnO, ZnO2, ZrO2, SnO, SnO2, HfO2, and SiO2, but the present disclosure is not limited thereto. The insulating film 152 may be formed using an inorganic insulating material by a deposition process to have a small thickness. For example, in a cross-section in a direction perpendicular to the wall surface of the through-hole h, the width t1 of the insulating film 152 located between the wall surface of the through-hole h and the side surface of the conductor layer 153 may be smaller than the width t2 of the magnetic layer 151 located between the wall surface of the through-hole h and the outer side surface of the magnetic layer 151. For example, in a cross-section in a direction perpendicular to the wall surface of the through-hole h, the width t1 of the insulating film 152 located between the wall surface of the through-hole h and the side surface of the conductor layer 153 may be less than or equal to 2 μm, for example, it may be about 1 μm to about 2 μm.

[0038] The conductor layer 153 may include a conductive material such as a metal. For example, the conductor layer 153 may include metal pillars. The metal pillars may be, for example, cylindrical, elliptical cylindrical, rectangular pillar, etc., but the present disclosure is not limited thereto. For example, the metal included in the conductor layer 153 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or their alloys. The metal may preferably include copper (Cu), but the present disclosure is not limited thereto. The conductor layer 153 may include a seed layer and a plating layer formed on the seed layer. The seed layer may be an electroless plating layer (e.g., electroless copper plating layer) and / or a sputtering layer, and the plating layer may be an electrolytic plating layer (e.g., electrolytic copper plating layer), but the present disclosure is not limited thereto. The seed layer may be provided on the lower surface and the side surface of the plating layer using a planarization process (such as polishing) described below, but not on the upper surface of the plating layer, and the upper surface of the seed layer and the upper surface of the plating layer may be substantially coplanar with each other. For example, the seed layer may be provided to have a predetermined small thickness to completely surround the lower surface and the side surface of the plating layer except for the upper surface, and the plating layer may fill the space formed by the seed layer. However, the present disclosure is not limited thereto, and the seed layer covering the lower surface of the plating layer may also be removed using a polishing process. In this case, the seed layer may be provided only on the side surface of the plating layer, and the seed layer and the plating layer may have upper and lower surfaces that are substantially coplanar with each other. For example, the seed layer may be provided to have a predetermined small thickness to completely surround the side surface of the plating layer.

[0039] The first electronic component 170 may include at least one of a voltage regulator and a power management integrated circuit. A plurality of first electronic components 170 may be provided. In this case, the plurality of first electronic components 170 may be disposed in the second through portion H2, or may be respectively disposed in a plurality of second through portions H2. As needed, the first electronic component 170 may further include an integrated passive device (IPD). For example, the IPD may be an integrated passive component (IPC) or an embedded passive component (EPC).

[0040] The second electronic component 190 may include a semiconductor chip. The semiconductor chip may be an integrated circuit (IC) die in which hundreds to millions of devices are integrated in a single chip. The integrated circuit die may be formed based on an active wafer. In this case, silicon (Si), germanium (Ge), gallium arsenide (GaAs), etc. may be used as the substrate material of the main body of each integrated circuit die. Various circuits may be formed in the main body. Connection pads may be formed on the front surface of the main body, and the connection pads may include conductive materials such as aluminum (Al), copper (Cu), etc. The semiconductor chip may include: a memory chip, such as a volatile memory (e.g., DRAM), a non-volatile memory (e.g., ROM or flash memory); an application processor chip, such as a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor, a cryptographic processor, a microprocessor, or a microcontroller; and a logic chip, such as an analog-to-digital converter or an application-specific IC (ASIC), but the present disclosure is not limited thereto. The second electronic component 190 may be connected to the fifth wiring layer 125 through an electrically connected metal 195. The electrically connected metal 195 may include a low melting point metal such as tin (Sn), for example, solder, but the present disclosure is not limited thereto.

[0041] Figures 4A to 4I is a schematic cross-sectional view of an example of a magnetic structure of a printed circuit board in Figure 3 manufacturing.

[0042] Referring to Figure 4A , a plurality of magnetic films 151-1, 151-2, 151-3, and 151-4 may be prepared. The plurality of magnetic films 151-1, 151-2, 151-3, and 151-4 may include substantially the same material, for example, the magnetic material as described above.

[0043] Referring to Figure 4B , the plurality of magnetic films 151-1, 151-2, 151-3, and 151-4 may be stacked, pressed, and then sintered. Thereby, the magnetic layer 151 may be formed.

[0044] Referring to Figure 4C, as needed, the first cover layer 161 and the second cover layer 162 can be respectively attached to the upper surface and the lower surface of the magnetic layer 151. The first cover layer 161 and the second cover layer 162 can include an insulating material, and their materials are not particularly limited.

[0045] Referring to Figure 4D , a plurality of through-holes h can be formed in the magnetic layer 151. The plurality of through-holes h can be formed using CNC (Computer Numerical Control) drilling or the like. The plurality of through-holes h can also pass through the first cover layer 161 and the second cover layer 162.

[0046] Referring to Figure 4E , the carrier film 210 can be attached to the lower side of the magnetic layer 151. For example, the carrier film 210 can be attached to the lower surface of the second cover layer 162. The material of the carrier film 210 is not particularly limited.

[0047] Referring to Figure 4F , an insulating film 152 can be formed on the magnetic layer 151. For example, a thin insulating film 152 can be formed using a deposition process such as chemical vapor deposition (CVD) or atomic layer deposition (ALD). The insulating film 152 can cover the upper surface of the first cover layer 161, the wall surface of each of the plurality of through-holes h, and the exposed upper surface of the carrier film 210.

[0048] Referring to Figure 4G , a conductor layer 153 can be formed on the insulating film 152. The conductor layer 153 can fill the remaining space of each of the plurality of through-holes h. The conductor layer 153 can be formed using a plating process. For example, the conductor layer 153 can be formed using electroless plating, electroplating, or the like.

[0049] Referring to Figure 4H , the carrier film 210 can be removed and the upper surface and the lower surface of the magnetic layer 151 can be planarized. During such a process, the first cover layer 161 and the second cover layer 162 respectively provided on the upper surface and the lower surface of the magnetic layer 151, and the portions of the insulating film 152 and the conductor layer 153 that are above the upper surface of the magnetic layer 151 and below the lower surface of the magnetic layer 151 can be removed. As needed, the upper side and / or the lower side of the magnetic layer 151 can be partially removed, and at least a part of each of the insulating film 152 and the conductor layer 153 can be further removed. Thus, a flat upper surface and a flat lower surface can be provided. For example, as a planarization process, a polishing process such as chemical mechanical polishing (CMP) can be used.

[0050] Referring to Figure 4I, a cutting process can be performed. The cutting process can be used to form a plurality of magnetic structures 150A-1 and 150A-2. At least one of the plurality of magnetic structures 150A-1 and 150A-2, i.e., the magnetic structure 150A-2, can have a plurality of through holes h, and insulating films 152-1 and 152-2 and conductor layers 153-1 and 153-2 can be respectively disposed in the plurality of through holes h.

[0051] A series of processes can be used to form a plurality of magnetic structures 150A-1 and 150A-2 that can be applied to the printed circuit board 100A according to the example. Other content can be substantially the same as that described for the printed circuit board 100A according to the example, and thus repeated descriptions will be omitted.

[0052] Figure 5 is a schematic cross-sectional view of another example of a printed circuit board.

[0053] Referring to the drawings, compared with the printed circuit board 100A according to the example, in the printed circuit board 100B according to another example, the magnetic structure 150B can further include: a first pad 154 disposed on the upper surface of the conductor layer 153 and the upper surface of the insulating film 152, and the first pad 154 is connected to the upper surface of the conductor layer 153; and a second pad 155 disposed on the lower surface of the conductor layer 153 and the lower surface of the insulating film 152, and the second pad 155 is connected to the lower surface of the conductor layer 153. In this case, the first-first connection via 131-1 and the first-second connection via 131-2 can be respectively connected to the first pad 154 and the second pad 155. Therefore, the first pad 154 and the second pad 155 can be easily connected to the first-first connection via 131-1 and the first-second connection via 131-2, thereby obtaining more excellent reliability.

[0054] The first pad 154 and the second pad 155 may each include a metal. For example, the metal included in each of the first pad 154 and the second pad 155 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or their alloys. The metal may preferably include copper (Cu), but the present disclosure is not limited thereto. The first pad 154 and the second pad 155 may each include a seed layer and a plating layer formed on the seed layer. The seed layer may be an electroless plating layer (e.g., electroless copper plating layer) and / or a sputtering layer, and the plating layer may be an electrolytic plating layer (e.g., electrolytic copper plating layer), but the present disclosure is not limited thereto. The seed layer of the first pad 154 and the seed layer of the second pad 155 may have a relatively small thickness to cover the upper surface and the lower surface of each of the conductor layer 153 and the insulating film 152, respectively, and the plating layer of the first pad 154 and the plating layer of the second pad 155 may have a relatively large thickness to cover the upper surface of the seed layer of the first pad 154 and the lower surface of the seed layer of the second pad 155, respectively. Other contents may be substantially the same as those described for the printed circuit board 100A according to the example, and thus repeated descriptions will be omitted.

[0055] Figures 6A to 6J is a schematic cross-sectional view of an example of a magnetic structure of a printed circuit board in Figure 5 manufacture.

[0056] Referring to Figures 6A to 6H , a process substantially the same as the process described with reference to Figures 4A to 4H may be performed.

[0057] Referring to Figure 6I , a first resist layer 221 and a second resist layer 222 each having an opening pattern may be formed on the upper surface and the lower surface of the magnetic layer 151, respectively, and the opening patterns may be filled with plating to form the first pad 154 and the second pad 155. The first resist layer 221 and the second resist layer 222 may be formed by coating and curing a solder resist or laminating a solder resist film. The first resist layer 221 and the second resist layer 222 may be removed after the first pad 154 and the second pad 155 are formed, but the present disclosure is not limited thereto. If necessary, the first resist layer 221 and the second resist layer 222 may also be retained around the first pad 154 and the second pad 155 even after the cutting process described below.

[0058] Referring to Figure 6J, a cutting process can be performed. The cutting process can be used to form a plurality of magnetic structures 150B-1 and 150B-2. At least one of the plurality of magnetic structures 150B-1 and 150B-2, i.e., magnetic structure 150B-2, can have a plurality of through-holes h, and insulating films 152-1 and 152-2 and conductor layers 153-1 and 153-2 can be respectively disposed in the plurality of through-holes h, and first pads 154-1 and 154-2 and second pads 155-1 and 155-2 can be respectively disposed on the upper side and the lower side of the plurality of through-holes h.

[0059] A series of processes can be used to form a plurality of magnetic structures 150B-1 and 150B-2 that can be applied to a printed circuit board 100B according to another example. Other contents can be substantially the same as those described for the printed circuit board 100A according to the example and the printed circuit board 100B according to another example, and thus repeated descriptions will be omitted.

[0060] Figure 7 is a schematic cross-sectional view of another example of a printed circuit board.

[0061] Referring to the drawings, compared with the printed circuit board 100B according to another example, in the printed circuit board 100C according to another example, the magnetic structure 150C may further include a filler g disposed in the conductor layer 153. The first pad 154 and the second pad 155 may further cover the upper surface and the lower surface of the filler g, respectively. The upper surface of the filler g may be substantially coplanar with each of the upper surface of the magnetic layer 151, the upper surface of the insulating film 152, and the upper surface of the conductor layer 153. The lower surface of the filler g may be substantially coplanar with each of the lower surface of the magnetic layer 151, the lower surface of the insulating film 152, and the lower surface of the conductor layer 153. Therefore, the insulating layer 110 covering them may also have better flatness, making it easier to form the wiring layer 120 and the via layer 130.

[0062] The filler g may include an insulating ink containing an insulating resin such as epoxy resin, but the present disclosure is not limited thereto, and may also include a conductive ink. For example, the filler g may include an insulating material and / or a conductive material. Other contents can be substantially the same as those described for the printed circuit board 100A according to the example and the printed circuit board 100B according to another example, and thus repeated descriptions will be omitted.

[0063] Figures 8A to 8K is for manufacturing Figure 7 a schematic cross-sectional view of an example of the magnetic structure of the printed circuit board in.

[0064] Referring to Figures 8A to 8F a process substantially the same as the process described with reference to Figures 4A to 4F can be performed.

[0065] Referring to Figure 8G, a conductor layer 153 may be formed on the insulating film 152. The conductor layer 153 may conformally fill a part of each of the plurality of through-holes h to a predetermined thickness. The conductor layer 153 may be formed using a plating process. For example, the conductor layer 153 may be formed using electroless plating, electrolytic plating, or the like.

[0066] Referring to Figure 8H , the space between the conductor layers 153 may be filled with the filler g. The filler g may be formed using a plugging process.

[0067] Referring to Figure 8I , the carrier film 210 may be removed and the upper and lower surfaces of the magnetic layer 151 may be planarized. During such a process, the first cover layer 161 and the second cover layer 162 respectively provided on the upper and lower surfaces of the magnetic layer 151, and the portions of the insulating film 152, the conductor layer 153, and the filler g that are provided above the upper surface of the magnetic layer 151 and the portions that are provided below the lower surface of the magnetic layer 151 may be removed. As needed, the upper side and / or the lower side of the magnetic layer 151 may be partially removed, and at least a part of each of the insulating film 152, the conductor layer 153, and the filler g may be further removed. Accordingly, a flat upper surface and a flat lower surface may be provided. For example, as a planarization process, a polishing process (such as CMP) may be used.

[0068] Referring to Figure 8J , a first resist layer 221 and a second resist layer 222 each having an opening pattern may be formed on the upper and lower surfaces of the magnetic layer 151, respectively, and the opening patterns may be filled with plating to form a first pad 154 and a second pad 155. The first resist layer 221 and the second resist layer 222 may be formed by coating and curing a solder resist or laminating a solder resist film. The first resist layer 221 and the second resist layer 222 may be removed after the first pad 154 and the second pad 155 are formed, but the present disclosure is not limited thereto. As needed, the first resist layer 221 and the second resist layer 222 may also be retained around the first pad 154 and the second pad 155, even after the dicing process described below.

[0069] Referring to Figure 8K , a dicing process may be performed. A plurality of magnetic structures 150C-1 and 150C-2 may be formed using the dicing process. At least one of the plurality of magnetic structures 150C-1 and 150C-2, i.e., the magnetic structure 150C-2, may have a plurality of through-holes h, and the insulating films 152-1 and 152-2, the conductor layers 153-1 and 153-2, and the fillers g1 and g2 may be respectively provided in the plurality of through-holes h, and the first pads 154-1 and 154-2 and the second pads 155-1 and 155-2 may be respectively provided on the upper and lower sides of the plurality of through-holes h.

[0070] A series of processes can be used to form a plurality of magnetic structures 150C-1 and 150C-2 that can be applied to a printed circuit board 100C according to another example. Other content can be substantially the same as that described for the printed circuit board 100A according to the example, the printed circuit board 100B according to another example, and the printed circuit board 100C according to another example, and thus the repeated description will be omitted.

[0071] Figures 9A to 9F is applicable to Figure 3 、 Figure 5 and Figure 7 Schematic plan views of various examples of coils for printed circuit boards in.

[0072] Referring to Figure 9A , the coil portion c may include a plurality of coils c1 and c2 arranged in parallel in a straight line. The plurality of coils c1 and c2 may be arranged to be spaced apart from each other. Different wirings may be provided between the plurality of coils c1 and c2.

[0073] Referring to Figure 9B , the coil portion c may include a coil c3 that is arranged in a straight line and then bent to the right to be arranged in a straight line again.

[0074] Referring to Figure 9C , the coil portion c may include a coil c4 that is arranged to repeatedly bend upward, extend horizontally, bend downward, and extend horizontally.

[0075] Referring to Figure 9D , the coil portion c may include a coil c5 that is repeatedly arranged to be inclined in one direction and extend vertically.

[0076] Referring to Figure 9E , the coil portion c may include a coil c6 that is repeatedly arranged to be inclined in one direction and then bent to the right to be repeatedly arranged to be inclined in the opposite direction again.

[0077] Referring to Figure 9F , the coil portion c may include a coil c7 that is repeatedly arranged to have an X shape.

[0078] For example, the coil portion C including coils c1, c2, c3, c4, c5, c6, and c7 of various shapes can be applied to the above-mentioned printed circuit boards 100A, 100B, and 100C. However, the shape of the coil portion C is not limited to the above examples. Other content can be substantially the same as that described for the printed circuit board 100A according to the example, the printed circuit board 100B according to another example, and the printed circuit board 100C according to another example, and thus the repeated description will be omitted.

[0079] As used herein, the term "cover" may include complete covering and at least partial covering, and may include direct covering and indirect covering. Additionally, the term "fill" may include not only complete filling but also approximate filling, for example, it may include cases where there are some voids, pores, etc. Further, the term "surround" may include not only complete surrounding but also approximate surrounding. Additionally, exposure may include not only complete exposure but also exposing at least a part of a structure, and exposure may mean exposing a component from another component in which the component is embedded. For example, an opening that exposes a pad may expose the pad from a resist layer, and a surface treatment layer, etc. may be further provided on the exposed pad.

[0080] As used herein, in a cross-section, an object disposed in a through portion or a via hole may include not only the case where the object is completely disposed in the through portion or the via hole but also the case where a part of the object protrudes upward or downward. Additionally, in a plan view, the case where an object is disposed in a through portion or a via hole may be determined in a broader sense.

[0081] As used herein, it may include measurement errors, process errors or position deviations that occur in a manufacturing process, etc. For example, "substantially perpendicular" may include not only "completely perpendicular" but also "approximately perpendicular". Additionally, "substantially coplanar" may include not only "completely coplanar" but also "approximately coplanar". For example, elements that are substantially coplanar may be in planes that are different from each other by 1° or less, and the distance between parallel planes may be 5% or less of the thickness of any one of the substantially coplanar elements.

[0082] As used herein, the same insulating material may mean not only exactly the same insulating material but also the same type of insulating material. Therefore, the composition of the insulating material may be substantially the same, but its specific composition ratio may vary slightly.

[0083] As used herein, the shape in a cross-section may refer to the cross-sectional shape when an object is vertically cut, or the cross-sectional shape of the object when observed from a side view. Additionally, the shape on a plane may be the shape of the object when the object is horizontally cut, or the planar shape of the object when observed from a top view or a bottom view.

[0084] As used herein, the upper side, upper portion, upper surface, etc. are used to refer to the direction upward based on the cross-section of the drawing, and the lower side, lower portion, lower surface, etc. are used to refer to the opposite direction. However, the above directions are defined for convenience of description. Therefore, it should be understood that the scope of the claims is not particularly limited by the above directions, and the concepts of "upper" and "lower" may change at any time.

[0085] As used herein, the term "connection" may refer not only to "direct connection" but also to "indirect connection" via an adhesive layer or the like. The term "electrical connection" may include both cases where components are "physically connected" and cases where components are "not physically connected". Additionally, terms such as "first", "second", etc. may be used to distinguish one component from another component, and may not limit the order and / or importance, etc. associated with the component. In some cases, without departing from the scope of the exemplary embodiments, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

[0086] As used herein, thickness, width, length, depth, line width, pitch, interval, pitch distance, surface roughness, etc. may be measured using a scanning microscope or an optical microscope based on a cross-section obtained by polishing or cutting a printed circuit board. Even if not described in this disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used. The cross-section may be a vertical cross-section or a horizontal cross-section, and each value may be measured based on the desired cross-section. For example, the width of the upper end and / or the lower end of a via may be measured in a cross-section taken along the central axis of the via. When the value is not constant, the value may be determined as the average of values measured at five arbitrary points.

[0087] As used herein, the term "example" does not mean the same exemplary embodiment and is provided to emphasize different unique features. However, the examples presented above do not exclude implementation in combination with the features of other examples. For example, unless described to be contrary to or inconsistent with the content in other examples, the content described in a particular example may be used in other examples even if not described in those other examples.

[0088] The terms used herein only describe particular examples, and the present disclosure is not limited thereby. As used herein, unless the context clearly indicates otherwise, the singular forms are also intended to include the plural forms.

[0089] Although the exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A printed circuit board, comprising: Magnetic structure, including: A magnetic layer having a through hole, an insulating film provided on a wall surface of the through hole, the insulating film comprising an inorganic insulating material, and A conductor layer, disposed on the insulating film, the conductor layer fills at least a portion of the through hole, and the conductor layer comprises metal; an insulating layer covering at least a portion of the magnetic structure; a wiring layer disposed on or in the insulating layer; and A via layer is provided in the insulating layer, and the via layer includes a first connection via connecting the conductor layer to the wiring layer.

2. The printed circuit board according to claim 1, wherein: The inorganic insulating material includes at least one of Al2O3, TiO2, ZnO, ZnO2, ZrO2, SnO, SnO2, HfO2 and SiO2.

3. The printed circuit board according to claim 1, wherein: In a cross section of the printed circuit board along the stacking direction and in a direction perpendicular to the wall surface of the through hole, a width of the insulating film between the wall surface of the through hole and a side surface of the conductor layer is smaller than a width of the magnetic layer between the wall surface of the through hole and an outer side surface of the magnetic layer.

4. The printed circuit board according to claim 3, wherein: In the cross section, a width of the insulating film between the wall surface of the through hole and the side surface of the conductor layer is 2 μm or less.

5. The printed circuit board of claim 1, comprising a plurality of the magnetic structures, the plurality of the magnetic structures being arranged to be spaced apart from each other, in, The conductor layers in the plurality of magnetic structures are connected to each other through the wiring layer and the via layer to form one or more coils.

6. The printed circuit board according to claim 1, wherein: The magnetic layer has a plurality of through holes. The insulating film and the conductor layer are provided in each of the plurality of through holes, and The conductor layers in the plurality of through holes are connected to each other through the wiring layer and the via layer to form one or more coils.

7. The printed circuit board according to claim 1, further comprising: A first electronic component is disposed in the insulating layer, wherein the first electronic component comprises at least one of a voltage regulator and a power management integrated circuit, and The first electronic component is connected to at least a first portion of the conductor layer through the wiring layer and the via layer.

8. The printed circuit board according to claim 7, further comprising: A second electronic component is disposed on the insulating layer, Wherein, the second electronic component comprises a semiconductor chip, and The second electronic component is connected to at least a second portion of the conductor layer through the wiring layer and the via layer.

9. The printed circuit board according to claim 1, wherein: The insulating layer comprises: a first insulating layer having a through portion, at least a portion of the magnetic structure being disposed in the through portion, and a second insulating layer covering at least a portion of each of the first insulating layer and the magnetic structure, the second insulating layer filling at least a portion of the through portion, The wiring layer comprises: a first wiring layer disposed on a first surface of the second insulating layer, and a second wiring layer, disposed on a second surface of the second insulating layer, The first connecting vias include a first-first connecting via and a first-second connecting via, The first-first connection via passes through a first portion of a first side of the second insulating layer, the first-first connection via connects a first surface of the conductor layer to at least a portion of the first wiring layer, and The first-second connection via passes through a first portion of a second side of the second insulating layer, and the first-second connection via connects the second surface of the conductor layer to at least a portion of the second wiring layer.

10. The printed circuit board according to claim 9, wherein The wiring layer further includes: a third wiring layer disposed on the first surface of the first insulating layer, the third wiring layer being at least partially buried in the second insulating layer, and a fourth wiring layer disposed on the second surface of the first insulating layer, the fourth wiring layer being at least partially buried in the second insulating layer, and The via layer further comprises: a third connection via hole passing through a second portion of the first side of the second insulating layer, the third connection via hole connecting at least a portion of the first wiring layer and at least a portion of the third wiring layer to each other, a fourth connection via passing through a second portion of the second side of the second insulating layer, the fourth connection via connecting at least a portion of the second wiring layer and at least a portion of the fourth wiring layer to each other; and A through via penetrates the first insulating layer, the through via connecting at least a portion of the third wiring layer and at least a portion of the fourth wiring layer to each other.

11. The printed circuit board according to claim 9, wherein: The first-first connection via and the first-second connection via are directly connected to the first surface and the second surface of the conductor layer, respectively.

12. The printed circuit board according to claim 9, wherein: The magnetic structure further comprises: a first pad provided on the first surface of the conductor layer and on the first surface of the insulating film, the first pad being connected to the first surface of the conductor layer, and a second pad provided on the second surface of the conductor layer and on the second surface of the insulating film, the second pad being connected to the second surface of the conductor layer, and The first-first connection via and the first-second connection via are connected to the first pad and the second pad, respectively.

13. The printed circuit board according to claim 12, wherein: The magnetic structure further includes a filler disposed in the conductor layer, The first pad and the second pad also cover the first surface and the second surface of the filler, respectively.

14. The printed circuit board according to claim 1, wherein: The inorganic insulating material includes an inorganic oxide.

15. The printed circuit board according to claim 14, wherein: The inorganic oxide includes at least one of an oxide of Zn and an oxide of Sn.

16. The printed circuit board according to claim 14, wherein: The inorganic oxide includes at least one selected from Al2O3, TiO2, ZrO2, HfO2 and SiO2.

17. The printed circuit board according to claim 1, wherein: The magnetic layer is in the form of a magnetic sheet or a magnetic film.

18. A printed circuit board, comprising: Magnetic structure, including: A magnetic layer having a through hole, an insulating film provided on a wall surface of the through hole, and A conductor layer, disposed on the insulating film, the conductor layer filling at least a portion of the through hole; an insulating layer covering at least a portion of the magnetic structure; a wiring layer disposed on or in the insulating layer; and a via layer, disposed in the insulating layer, the via layer comprising connecting vias connecting the conductor layer to the wiring layer, wherein the first surface of the magnetic layer, the first surface of the insulating film, and the first surface of the conductor layer are substantially coplanar with each other, and The second surface of the magnetic layer, the second surface of the insulating film, and the second surface of the conductor layer are substantially coplanar with each other.

19. The printed circuit board according to claim 18, wherein: The magnetic structure further comprises: A filler is provided in the conductor layer, a first pad disposed on the first surface of the conductor layer, the first surface of the filler, and the first surface of the insulating film, and a second pad disposed on the second surface of the conductor layer, the second surface of the filler, and the second surface of the insulating film, The first surface of the filler is substantially coplanar with each of the first surface of the magnetic layer, the first surface of the insulating film, and the first surface of the conductor layer, and The second surface of the filler is substantially coplanar with each of the second surface of the magnetic layer, the second surface of the insulating film, and the second surface of the conductor layer.

20. The printed circuit board of claim 18, further comprising: A magnetic composite inductor includes the magnetic structure and at least a portion of the wiring layer connected to the magnetic structure.

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