An efficient reflow soldering device for COB-LED modules

Abstract

The present invention relates to the technical field of reflow soldering, and provides a high-efficiency reflow soldering device for COB-LED modules, including a conveying mechanism and a soldering box body. A plurality of partition plates are arranged at both ends and inside the soldering box body. A spacing adjustment mechanism is arranged in the soldering box body. The lower end of each partition plate is movably connected with a telescopic plate, and the lower end part of the telescopic plate is inclined. A placement box is arranged on the conveying mechanism, and the module is placed in the placement box for soldering. Through the arrangement of the spacing adjustment mechanism and the partition plates, when performing reflow soldering, the corresponding temperature control curve information is retrieved according to the module model, the spacing between two adjacent partition plates is determined according to the temperature control curve information, and the position of the partition plates is adjusted through the spacing adjustment mechanism. In this way, the conveying mechanism has the same speed when passing through each area, and multiple modules can be transported at one time for reflow soldering, with high efficiency and being applicable to processing modules of different models.

Description

Technical Field

[0001] The present invention relates to the technical field of reflow soldering, and in particular to a high-efficiency reflow soldering device for COB-LED modules. Background Art

[0002] The COB-LED module is obtained by soldering LED chips on a PCB. Reflow soldering is one of the most commonly used methods for soldering LED chips to the PCB. During reflow soldering, solder paste (composed of solder powder and flux) is printed on the pads of the PCB, and then the LED chips are placed on the solder paste. Subsequently, the PCB and the LED chip module together pass through the reflow soldering device. The reflow soldering device is provided with a heating zone and a cooling zone, and the temperature curve inside the device melts the solder in the solder paste to connect the LED chips with the pads of the PCB. Reflow soldering has the advantages of high soldering quality, high production efficiency, and suitability for automated production.

[0003] When performing reflow soldering on modules of different models, their corresponding temperature control curves are different. Modules of different models have different heating times in the same heating zone, and modules of the same model also have different heating times in different heating zones. Currently, the space of each area inside the reflow soldering device is fixed. Thus, in order to meet diverse requirements, the transmission speed of the conveyor belt is different when passing through each heating area, resulting in only one module being able to be transmitted for reflow soldering at a time, and the efficiency is extremely low. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-efficiency reflow soldering device for COB-LED modules, aiming to solve the problems mentioned in the background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution. A high-efficiency reflow soldering device for COB-LED modules includes a conveying mechanism and a soldering box body. The soldering box body is installed on the conveying mechanism. A plurality of partition plates are provided at both ends and inside the soldering box body. The plurality of partition plates divide the interior of the soldering box body into multiple heating zones and a cooling zone. A spacing adjusting mechanism is provided in the soldering box body. The spacing adjusting mechanism is used to adjust the positions of the internal partition plates. The lower end of each partition plate is movably connected to a telescopic plate, and the lower end portion of the telescopic plate is inclined. A placement box is provided on the conveying mechanism. When performing reflow soldering, the corresponding temperature control curve information is retrieved according to the module model, the spacing between adjacent two partition plates is determined according to the temperature control curve information, the positions of the partition plates are adjusted through the spacing adjusting mechanism, and the module is placed in the placement box for soldering.

[0006] As a further solution of the present invention, the spacing adjustment mechanism includes a rotating motor, which is installed on the welding box body. A threaded shaft is connected to the output shaft of the rotating motor. The threaded shaft penetrates through a plurality of partition plates. Through holes and guide holes are provided on the partition plates inside the welding box body. Electromagnets are installed in the inner walls of the through holes. A ferromagnetic ring is fitted in the through holes. The inner hole of the ferromagnetic ring is a threaded hole, and the ferromagnetic ring is fitted with the threaded shaft. A guide shaft is fixedly installed in the welding box body, and the guide shaft is slidably fitted with the inner wall of the guide hole.

[0007] As a further solution of the present invention, the step of determining the spacing between two adjacent partition plates according to the temperature control curve information specifically includes:

[0008] Determine the transmission speed of the transmission mechanism according to the total time length of the temperature control curve information and the distance between the two end partition plates;

[0009] Determine the length of each heating zone and cooling zone according to the transmission speed of the transmission mechanism and the temperature control time of each temperature segment in the temperature control curve information, and then determine the position of each partition plate.

[0010] As a further solution of the present invention, a triangular block is connected to one side of the placement box, and a plug shaft is provided on the bottom surface of the placement box. The transmission mechanism is a chain plate conveyor, and jacks are provided on each chain plate of the chain plate conveyor, and the jacks are adapted to the plug shaft.

[0011] As a further solution of the present invention, a heating device is provided in the heating zone, and a refrigeration device is provided in the cooling zone. The heating device and the refrigeration device are both fixedly installed on the partition plate. The heating device and the refrigeration device are both provided with air outlets, and the air outlets are connected to the air inlet pipes of the air outlet disc through corrugated hoses. The air outlet disc moves synchronously with the placement box through a following movement mechanism.

[0012] As a further solution of the present invention, the following movement mechanism includes a guide sleeve, a guide plate and a lifting plate. The guide sleeve is slidably fitted with the guide shaft, and a first return spring is connected between the guide sleeve and the corresponding partition plate. The guide sleeve is fixedly connected to the air outlet disc through a connecting column; the lifting plate is slidably fitted with one side of the air outlet disc. The lifting plate is vertically arranged, and an inclined surface is provided at the lower end of the lifting plate. The guide plate is fixed on the top surface of the air outlet disc. A horizontal plate is slidably fitted in the guide plate. One side of the horizontal plate is connected to the guide plate through a second return spring. A through groove is provided on the surface of the horizontal plate, and the lifting plate can pass through the through groove. One side of the through groove is an inclined surface. When the second return spring is not subjected to external force, the lifting plate is misaligned with the through groove.

[0013] As a further solution of the present invention, a buffer plate is connected to the lower end of the partition plate, a first limiting block is connected to the side surface of the lifting plate, and a second limiting block is connected to the air outlet plate. When the second return spring is not under external force, the bottom surface of the first limiting block contacts the surface of the second limiting block. A sliding block is arranged on the lifting plate, and a sliding groove is arranged on the side surface of the air outlet plate. The sliding block is slidably connected with the sliding groove.

[0014] In summary, the beneficial effects of the present invention are as follows:

[0015] Through the setting of the spacing adjustment mechanism and the partition plate, during reflow soldering, according to the module model, the corresponding temperature control curve information is retrieved, and the spacing between adjacent two partition plates is determined according to the temperature control curve information. The position of the partition plate is adjusted through the spacing adjustment mechanism. In this way, the speed of the conveying mechanism passing through each area is the same, and multiple modules can be transmitted at one time for reflow soldering, with high efficiency and being applicable to processing modules of different models. In addition, through the setting of the telescopic plate, the heat insulation of each area is better, and the temperature control and energy-saving effect are better. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings, where:

[0017] Figure 1 is a three-dimensional structure schematic diagram of a high-efficiency reflow soldering device for COB-LED modules according to an embodiment of the present invention.

[0018] Figure 2 is an internal structure schematic diagram of a high-efficiency reflow soldering device for COB-LED modules according to an embodiment of the present invention Figure 1 .

[0019] Figure 3 is an internal structure schematic diagram of a high-efficiency reflow soldering device for COB-LED modules according to an embodiment of the present invention Figure 2 .

[0020] Figure 4 is Figure 1 a partial enlarged schematic diagram of part A in

[0021] Figure 5 is Figure 2 a partial enlarged schematic diagram of part B in

[0022] Figure 6 is Figure 3 a partial enlarged schematic diagram of part C in

[0023] Figure 7 is Figure 5 a partially enlarged schematic view of the D position in

[0024] Reference numerals: 1 - welding box body, 2 - conveying mechanism, 3 - chain plate, 4 - placement box, 5 - rotating motor, 6 - jack, 7 - triangular block, 8 - partition board, 9 - telescopic plate, 10 - threaded shaft, 11 - guide shaft, 12 - heating device, 13 - refrigeration device, 14 - air outlet plate, 15 - through hole, 16 - ferromagnetic ring, 17 - first return spring, 18 - guide sleeve, 19 - connecting column, 20 - buffer plate, 21 - air inlet pipe, 22 - lifting plate, 23 - horizontal plate, 24 - guide plate, 25 - second return spring, 26 - first limiting block, 27 - second limiting block, 28 - slider, 231 - through groove, 232 - inclined surface. Specific embodiments

[0025] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further elaborates on the present invention in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] The following elaborates on the specific implementation of the present invention in conjunction with specific embodiments.

[0027] Please refer to Figure 1 , Figure 2 and Figure 3, a high-efficiency reflow soldering device for COB-LED modules provided by an embodiment of the present invention includes a conveying mechanism 2 and a soldering box 1. The soldering box 1 is installed on the conveying mechanism 2. The conveying mechanism 2 is used to send the modules into the soldering box 1 for reflow soldering. A plurality of partitions 8 are provided at both ends and inside the soldering box 1. The partitions 8 are vertically arranged. The plurality of partitions 8 divide the interior of the soldering box 1 into multiple heating zones and a cooling zone. A spacing adjustment mechanism is provided in the soldering box 1. The spacing adjustment mechanism is used to adjust the position of the internal partitions 8. The partitions 8 inside the soldering box 1 are slidably connected to the inner wall of the soldering box 1. The partitions 8 at both ends are fixed. A telescopic plate 9 is movably connected to the lower end of each partition 8. The telescopic plate 9 can retract into the partition 8 or extend from the partition 8. The lower end portion of the telescopic plate 9 is inclined. A placement box 4 is provided on the conveying mechanism 2. The modules are placed in the placement box 4 for conveying and soldering. When the placement box 4 abuts against the telescopic plate 9, the telescopic plate 9 will retract upward. After the placement box 4 leaves the lower part of the telescopic plate 9, under the action of gravity, the telescopic plate 9 extends downward to close the inlet and outlet of the heating zone or the cooling zone, and the temperature control and energy-saving effect is better. When officially performing reflow soldering, it is necessary to retrieve the corresponding temperature control curve information according to the module model. A temperature control curve information needs to be formulated in advance for each module model. The temperature control curve information includes a plurality of temperature segments. Each temperature segment corresponds to a temperature value and a temperature control time. The embodiment of the present invention will automatically determine the spacing between two adjacent partitions 8 according to the temperature control curve information, and adjust the position of the partition 8 through the spacing adjustment mechanism so that the temperature control time of each temperature segment meets the requirements.

[0028] In the embodiment of the present invention, the spacing adjustment mechanism includes a rotary motor 5. The rotary motor 5 is installed on the soldering box 1. A threaded shaft 10 is connected to the output shaft of the rotary motor 5. The threaded shaft 10 penetrates through a plurality of partitions 8. Through holes 15 and guide holes are provided on the partitions 8 inside the soldering box 1. Electromagnets are installed in the inner walls of the through holes 15. A ferromagnetic ring 16 is fitted in the through holes 15. For example, the ferromagnetic ring 16 is made of iron. The inner hole of the ferromagnetic ring 16 is a threaded hole. The ferromagnetic ring 16 is connected to the threaded shaft 10 in a mating manner. When the electromagnet is energized, the ferromagnetic ring 16 is fixedly connected to the partition 8. When the electromagnet is de-energized, the ferromagnetic ring 16 is movably connected to the partition 8. A guide shaft 11 is fixedly installed in the soldering box 1. The guide shaft 11 is slidably connected to the inner wall of the guide hole. The guide shaft 11 and the threaded shaft 10 are both horizontally arranged. When it is necessary to adjust the position of a certain partition 8, the electromagnet on that partition 8 is energized, and the electromagnets on other partitions 8 are de-energized, and then the rotary motor 5 is started.

[0029] In the embodiment of the present invention, the step of determining the distance between two adjacent partitions 8 according to the temperature control curve information specifically includes: First step, determine the transmission speed of the transmission mechanism 2 according to the total time length of the temperature control curve information and the distance between the two end partitions 8, and adjust the transmission speed of the transmission mechanism 2; Second step, determine the length of each heating zone and cooling zone according to the transmission speed of the transmission mechanism 2 and the temperature control time of each temperature section in the temperature control curve information, and then determine the position of each partition 8. In this way, when performing reflow soldering on each model of COB-LED module, it can conform to the corresponding temperature control curve, and the welding quality is high.

[0030] Please refer to Figures 1 to 4 , in the embodiment of the present invention, a triangular block 7 is connected to one side of the placement box 4. During use, the triangular block 7 will abut against the telescopic plate 9. The bottom surface of the placement box 4 is fixedly connected with an insertion shaft. The transmission mechanism 2 is a chain plate conveyor, and each chain plate 3 of the chain plate conveyor is provided with an insertion hole 6, and the insertion hole 6 is adapted to the insertion shaft. During use, the insertion shaft needs to be inserted into the insertion hole 6.

[0031] Please refer to Figures 1 to 7 , in the embodiment of the present invention, a heating device 12 is provided in each heating zone. For example, the heating device 12 is a hot air blower, and a refrigeration device 13 is provided in the cooling zone. For example, the refrigeration device 13 is an air conditioner. The heating device 12 and the refrigeration device 13 are both fixedly installed on the partition 8 near the input end. The heating device 12 and the refrigeration device 13 are both provided with air outlets, and the air outlets are connected to the air inlet pipe 21 of the air outlet plate 14 through corrugated hoses (not shown in the figure). The air outlet plate 14 moves synchronously with the placement box 4 through a following motion mechanism. In this way, the air blown out by the air outlet plate 14 directly reaches the module, and the welding effect is better and more efficient.

[0032] In the embodiment of the present invention, the following motion mechanism includes a guide sleeve 18, a guide plate 24 and a lifting plate 22. The guide sleeve 18 is slidably connected to the guide shaft 11. A first return spring 17 is connected between the guide sleeve 18 and the corresponding partition 8 (close to the input end). The guide sleeve 18 is fixedly connected to the air outlet plate 14 through a connecting column 19, and the air outlet plate 14 is horizontally arranged; the lifting plate 22 is slidably connected to one side of the air outlet plate 14, and the side to be connected is close to the output end. The lifting plate 22 is vertically arranged, and the lower end of the lifting plate 22 is provided with The inclined surface, the triangular block 7 can contact the inclined surface, the guide plate 24 is fixed on the top surface of the air outlet plate 14, and the horizontal plate 23 is slidably connected to the guide plate 24. One side of the horizontal plate 23 is connected to the guide plate 24 through a second return spring 25. The surface of the horizontal plate 23 is provided with a through groove 231, and the lifting plate 22 can pass through the through groove 231. The side of the through groove 231 close to the second return spring 25 is an inclined surface 232. When the second return spring 25 is not subjected to external force, the lifting plate 22 is misaligned with the through groove 231.

[0033] In the embodiment of the present invention, a buffer plate 20 is connected to the lower end of the partition 8, a limit block 26 is connected to the side of the lifting plate 22, and a limit block 27 is connected to the air outlet plate 14. The limit block 27 is used to support the lifting plate 22. When the second return spring 25 is not subjected to external force, the bottom surface of the limit block 26 contacts the surface of the limit block 27. A slider 28 is provided on the lifting plate 22, and a slide groove is provided on the side of the air outlet plate 14. The slider 28 is slidably connected to the slide groove, and the slider 28 is trapezoidal in shape to prevent the slider 28 from detaching from the slide groove.

[0034] The working process of the embodiment of the present invention is as follows: determine the position of the partition 8 according to the module model, adjust the position of the partition 8 through the spacing adjustment mechanism, and then place the COB-LED module on the placement box 4, the placement box 4 is plugged into the chain plate 3, and the chain plate 3 brings the placement box 4 and the module into the heating zone and cooling zone in turn for reflow soldering. When just entering the heating zone or the cooling zone, the triangular block 7 lifts the telescopic plate 9, and then the placement box 4 continues to move forward. The triangular block 7 will conflict with the inclined surface under the lifting plate 22. At this time, the air outlet plate 14 is located directly above the module, and the placement box 4 continues to move forward. Under the action of the conflict, the lifting plate 22, the air outlet plate 14 and the guide sleeve 18 will also move forward. Until it is about to enter the next area, the horizontal plate 23 will contact the next partition 8, and the horizontal plate 23 cannot continue to move forward, while the lifting plate 22 continues to move forward a short distance until... The through groove 231 is located directly above the lifting plate 22. The lifting plate 22 will move upward, and the lifting plate 22 will not move forward with the placement box 4. Under the action of the first reset spring 17, the guide sleeve 18 will be reset, and the air outlet plate 14 will also be reset. The left side of the air outlet plate 14 will contact the buffer plate 20. In addition, under the action of the second reset spring 25, the horizontal plate 23 will be pushed outward, and the inclined surface 232 will squeeze the lifting plate 22 to move downward, and the lifting plate 22 will also be reset, which is convenient for operating the module on the next placement box 4.

[0035] For those skilled in the art, although several embodiments and examples of the present invention are described, these embodiments and examples are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the subject matter of the invention. These embodiments and their variations are included in the scope and subject matter of the invention, and are included in the invention described in the claims and the scope of their equivalents.

[0036] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An efficient reflow soldering device for a COB-LED module, comprising a conveying mechanism (2) and a soldering box body (1), the soldering box body (1) is installed on the conveying mechanism (2), and is characterized in that, A number of partitions (8) are provided at both ends and inside the welding box body (1). The number of partitions (8) divides the interior of the welding box body (1) into multiple heating zones and one cooling zone. A spacing adjustment mechanism is provided in the welding box body (1), and the spacing adjustment mechanism is used to adjust the positions of the internal partitions (8). The lower end of each partition (8) is movably connected to a telescopic plate (9), and the lower end portion of the telescopic plate (9) is inclined. A placement box (4) is provided on the conveying mechanism (2); when performing reflow soldering, the corresponding temperature control curve information is retrieved according to the module model, the spacing between two adjacent partitions (8) is determined according to the temperature control curve information, the positions of the partitions (8) are adjusted through the spacing adjustment mechanism, and the module is placed in the placement box (4) for soldering; a triangular block (7) is connected to one side of the placement box (4). When just entering the heating zone or the cooling zone, the triangular block (7) jacks up the telescopic plate (9), and then the placement box (4) continues to move forward.

2. The high-efficiency reflow soldering device for COB-LED modules according to claim 1, wherein The spacing adjustment mechanism includes a rotary motor (5). The rotary motor (5) is installed on the welding box body (1). A threaded shaft (10) is connected to the output shaft of the rotary motor (5). The threaded shaft (10) penetrates through a number of partitions (8). Through holes (15) and guide holes are provided on the partitions (8) inside the welding box body (1). Electromagnets are installed in the inner walls of the through holes (15). Ferromagnetic rings (16) are fitted in the through holes (15). The inner holes of the ferromagnetic rings (16) are threaded holes, and the ferromagnetic rings (16) are in threaded connection with the threaded shaft (10). A guide shaft (11) is fixedly installed in the welding box body (1), and the guide shaft (11) is in sliding fit with the inner wall of the guide hole.

3. The high-efficiency reflow soldering device for COB-LED modules according to claim 1, characterized in that, The steps of determining the spacing between two adjacent partitions (8) according to the temperature control curve information specifically include: Determining the transmission speed of the conveying mechanism (2) according to the total time length of the temperature control curve information and the distance between the two end partitions (8); Determining the lengths of each heating zone and the cooling zone according to the transmission speed of the conveying mechanism (2) and the temperature control time of each temperature segment in the temperature control curve information, and further determining the positions of each partition (8).

4. The high-efficiency reflow soldering device for COB-LED modules according to claim 1, characterized in that The bottom surface of the placement box (4) is provided with insertion shafts. The conveying mechanism (2) is a chain plate conveyor, and each chain plate (3) of the chain plate conveyor is provided with a jack (6), and the jack (6) is adapted to the insertion shaft.

5. The high-efficiency reflow soldering device for COB-LED modules according to claim 2, characterized in that, A heating device (12) is provided in the heating zone, and a refrigeration device (13) is provided in the cooling zone. The heating device (12) and the refrigeration device (13) are both fixedly installed on the partition (8). The heating device (12) and the refrigeration device (13) are both provided with air outlets. The air outlets are connected to the air inlet pipes (21) of the air outlet plate (14) through corrugated hoses. The air outlet plate (14) moves synchronously with the placement box (4) through a following motion mechanism.

6. The high-efficiency reflow soldering device for COB-LED modules according to claim 5, characterized in that, The following movement mechanism includes a guide sleeve (18), a guide plate (24) and a lifting plate (22). The guide sleeve (18) is slidably connected with a guide shaft (11). A first return spring (17) is connected between the guide sleeve (18) and the corresponding partition plate (8). The guide sleeve (18) is fixedly connected with the air outlet disc (14) through a connecting column (19). The lifting plate (22) is slidably connected with one side of the air outlet disc (14). The lifting plate (22) is vertically arranged, and the lower end of the lifting plate (22) is provided with an inclined surface. The guide plate (24) is fixed on the top surface of the air outlet disc (14). A horizontal plate (23) is slidably connected in the guide plate (24). One side of the horizontal plate (23) is connected with the guide plate (24) through a second return spring (25). A through groove (231) is arranged on the surface of the horizontal plate (23). The lifting plate (22) can pass through the through groove (231). One side surface of the through groove (231) is an inclined surface (232). When the second return spring (25) is not affected by an external force, the lifting plate (22) is misaligned with the through groove (231).

7. The high-efficiency reflow soldering device for COB-LED modules according to claim 6, characterized in that, A buffer plate (20) is connected to the lower end of the partition plate (8). A first limiting block (26) is connected to the side surface of the lifting plate (22). A second limiting block (27) is connected to the air outlet disc (14). When the second return spring (25) is not affected by an external force, the bottom surface of the first limiting block (26) contacts the surface of the second limiting block (27). A slider (28) is arranged on the lifting plate (22). A sliding groove is arranged on the side surface of the air outlet disc (14). The slider (28) is slidably connected with the sliding groove.

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