Inductor component

Abstract

Provided is an inductor component capable of improving inductance acquisition efficiency. The inductor component includes: a green body including a first main surface and a second main surface facing each other; a coil which is provided on the body and is wound in a spiral shape along an axis; and a first external electrode and a second external electrode that are provided on the body, are electrically connected to the coil, and are disposed such that the axis of the coil is parallel to the first main surface, the coil including: a plurality of first coil wirings that are provided on the first main surface side with respect to the axis, and that are arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on the opposite side of the first through wiring with respect to the axis, and arranged along the axis. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are sequentially connected according to the order of the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring to form at least a part of a spiral shape. At least one of two end first coil wirings located at two ends in the axial direction among the plurality of first coil wirings and two end second coil wirings located at two ends in the axial direction among the plurality of second coil wirings is a wide coil wiring. The maximum width in the axial direction of the wide coil wiring is greater than the maximum width in the axial direction of at least one of the inner coil wirings, which are coil wirings other than the first coil wirings at both ends and the second coil wirings at both ends, among the plurality of first coil wirings and the plurality of second coil wirings.

Description

Technical Field

[0001] The present disclosure relates to an inductor component. Background Art

[0002] Conventionally, as an inductor component, there is a component described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has a green body, a coil disposed in the green body and wound along an axis, and a first external electrode and a second external electrode disposed on the green body and electrically connected to the coil.

[0003] The coil has a plurality of coil patterns laminated along the axis. The coil patterns adjacent in the axial direction are connected via conductive vias. The coil pattern has a wiring portion extending in a direction orthogonal to the axis and a pad portion provided at an end of the wiring portion and connected to the conductive via. In order to improve the connectivity between the pad portion and the conductive via, the width of the pad portion is wider than the width of the wiring portion.

[0004] Patent Document 1: Japanese Patent No. 6652280

[0005] However, in the inductor component as described above, since the width of the pad portion is wider than the width of the wiring portion, a part of the pad portion is located on the inner side in the radial direction of the coil compared with the wiring portion. Therefore, the inner diameter of the coil becomes smaller, and the acquisition efficiency of the inductance is not necessarily high. Summary of the Invention

[0006] Therefore, the present disclosure provides an inductor component capable of improving the acquisition efficiency of inductance.

[0007] To solve the above problems, an inductor component according to one aspect of the present disclosure includes:

[0008] A green body including a first main surface and a second main surface facing each other;

[0009] A coil disposed on the green body and wound in a spiral shape along an axis; and

[0010] A first external electrode and a second external electrode disposed on the green body and electrically connected to the coil,

[0011] The axis of the coil is arranged parallel to the first main surface,

[0012] The coil includes:

[0013] A plurality of first coil wirings disposed on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface;

[0014] A plurality of second coil wirings disposed on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface;

[0015] A plurality of first through wirings extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring and are arranged along the above-mentioned axis; and

[0016] A plurality of second through wirings extend from the above-mentioned first coil wiring toward the above-mentioned second coil wiring, are disposed on the opposite side of the above-mentioned axis from the above-mentioned first through wirings, and are arranged along the above-mentioned axis,

[0017] By connecting the above-mentioned first coil wiring, the above-mentioned first through wiring, the above-mentioned second coil wiring, and the above-mentioned second through wiring in sequence in the order of the above-mentioned first coil wiring, the above-mentioned first through wiring, the above-mentioned second coil wiring, and the above-mentioned second through wiring, at least a part of the above-mentioned spiral shape is formed,

[0018] At least one of two end first coil wirings located at both ends in the above-mentioned axial direction among the above-mentioned plurality of first coil wirings and two end second coil wirings located at both ends in the above-mentioned axial direction among the above-mentioned plurality of second coil wirings is a wide-width coil wiring,

[0019] The maximum width in the above-mentioned axial direction of the above-mentioned wide-width coil wiring is larger than the maximum width in the above-mentioned axial direction of at least one coil wiring among the inner coil wirings, and the above-mentioned inner coil wirings are the inner coil wirings among the above-mentioned plurality of first coil wirings and the above-mentioned plurality of second coil wirings other than the above-mentioned end first coil wirings and the above-mentioned end second coil wirings.

[0020] Here, the axis refers to the intersection line of a first plane passing through the center between the first coil wiring and the second coil wiring and a second plane passing through the center between the first through wiring and the second through wiring. The maximum width in the axial direction of the wide-width coil wiring refers to the maximum value of the width in the axial direction of the wide-width coil wiring when viewed from a direction orthogonal to the first main surface of the green body. The maximum width in the axial direction of at least one coil wiring among the inner coil wirings is defined in the same manner.

[0021] "The external electrode is provided on the green body" specifically means that the external electrode is provided on the outer surface side of the green body. For example, it includes the case where the external electrode is provided directly above the outer surface of the green body, the case where the external electrode is provided outside the green body via other components on the green body, and the case where the external electrode is provided on the outer surface in a state where a part of the external electrode is buried in the green body.

[0022] According to the above method, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. By sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring, at least a part of the spiral shape is formed. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of the inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0023] Further, when viewed from a direction orthogonal to the first main surface of the green compact, at least a part of the wide-width coil wiring can be disposed in the dead zones existing at both axial ends of the green compact where coil wiring has not existed in the past. As a result, the dead zones of the green compact can be effectively utilized, and the resistance of the entire coil can be reduced compared with the past, and the Q value of the inductor component can be increased.

[0024] In one embodiment of the inductor component, preferably

[0025] The maximum width in the axial direction of the above-mentioned wide-width coil wiring is larger than the maximum width in the axial direction of all the above-mentioned inner coil wirings.

[0026] According to the above embodiment, the resistance of the entire coil can be reduced compared with the past, and the Q value of the inductor component can be further increased.

[0027] In one embodiment of the inductor component, preferably

[0028] The above-mentioned first external electrode is provided on the above-mentioned first main surface of the above-mentioned green compact.

[0029] The above-mentioned wide-width coil wiring is included only in the above-mentioned plurality of first coil wirings.

[0030] According to the above embodiment, the connection reliability between the first external electrode and the coil can be improved.

[0031] In one embodiment of the inductor component, preferably

[0032] The above-mentioned first external electrode is provided on the above-mentioned first main surface of the above-mentioned green compact.

[0033] The above-mentioned wide-width coil wiring is included only in the above-mentioned plurality of second coil wirings.

[0034] According to the above embodiment, compared with the case where the wide-width coil wiring is included in the plurality of first coil wirings, the distance between the wide-width coil wiring and the first external electrode can be increased. Therefore, the parasitic capacitance between the wide-width coil wiring and the first external electrode can be reduced, and the self-resonant frequency (SRF: Self-Resonant Frequency) can be increased.

[0035] In one embodiment of the inductor component, preferably

[0036] The width in the axial direction of the above-mentioned wide-width coil wiring is not constant in a direction orthogonal to the axial direction.

[0037] According to the above embodiment, the dead zones of the green compact can be utilized more effectively.

[0038] In one embodiment of the inductor component, preferably

[0039] The above-mentioned first external electrode has a conduction portion connected to the above-mentioned coil,

[0040] The above-mentioned conduction portion is connected to the above-mentioned wide-width coil wiring,

[0041] The area of the contact surface of the above-mentioned wide-width coil wiring with the above-mentioned conduction portion is larger than the area of the contact surface of at least one of the above-mentioned inner coil wirings with the above-mentioned first through-wiring.

[0042] According to the above-mentioned embodiment, the connection strength between the first external electrode and the wide-width coil wiring can be improved.

[0043] Preferably, in an embodiment of the inductor component,

[0044] The above-mentioned first external electrode has a plurality of conduction portions connected to the above-mentioned coil,

[0045] The above-mentioned plurality of conduction portions are connected to the above-mentioned wide-width coil wiring.

[0046] According to the above-mentioned embodiment, since a plurality of conduction portions are connected to the wide-width coil wiring, the connection strength between the first external electrode and the wide-width coil wiring can be improved as compared with the case of connecting one conduction portion.

[0047] Preferably, in an embodiment of the inductor component,

[0048] The thickness of the above-mentioned wide-width coil wiring is thinner than the thickness of at least one of the above-mentioned inner coil wirings.

[0049] Since the maximum width in the axial direction of the wide-width coil wiring is relatively large, even if the thickness is thinned, an increase in resistance can be suppressed. Therefore, according to the above-mentioned embodiment, it is possible to reduce the resistance of the entire coil as compared with the conventional case and to provide a thin inductor component.

[0050] Preferably, in an embodiment of the inductor component,

[0051] The above-mentioned wide-width coil wiring is included only in any one of the first group composed of the above-mentioned plurality of first coil wirings and the second group composed of the above-mentioned plurality of second coil wirings,

[0052] The thickness of all the coil wirings in the group including the above-mentioned wide-width coil wiring among the above-mentioned first group and the above-mentioned second group is thinner than the thickness of all the coil wirings in the group not including the above-mentioned wide-width coil wiring.

[0053] According to the above-mentioned embodiment, a thinner inductor component can be realized.

[0054] Preferably, in an embodiment of the inductor component,

[0055] Any one of the plurality of first coil wirings and the plurality of second coil wirings is constituted only by the wide-width coil wiring.

[0056] According to the above embodiment, the resistance of the entire coil can be reduced compared with the prior art.

[0057] Preferably, in an embodiment of the inductor component,

[0058] When viewed from a direction orthogonal to the first main surface,

[0059] The ratio of the total area of the plurality of first coil wirings to the area of the first main surface is 50% or more and 95% or less.

[0060] The ratio of the total area of the plurality of second coil wirings to the area of the first main surface is 50% or more and 95% or less.

[0061] According to the above embodiment, by making the ratio of the total area of the plurality of first coil wirings to the area of the first main surface 50% or more, leakage of magnetic flux to the radial outside of the coil can be suppressed. By making the ratio of the total area of the plurality of first coil wirings to the area of the first main surface 95% or less, monolithic integration of the inductor component can be easily achieved. Similarly, by making the ratio of the total area of the plurality of second coil wirings to the area of the first main surface 50% or more, leakage of magnetic flux to the radial outside of the coil can be suppressed. By making the ratio of the total area of the plurality of second coil wirings to the area of the first main surface 95% or less, monolithic integration of the inductor component can be easily achieved.

[0062] Preferably, in an embodiment of the inductor component,

[0063] The wide-width coil wiring is included in at least one of a first group composed of the plurality of first coil wirings and a second group composed of the plurality of second coil wirings.

[0064] When viewed from a direction orthogonal to the first main surface,

[0065] The ratio of the total area of all the coil wirings in the group including the wide-width coil wiring in the first group and the second group to the area of the first main surface is 65% or more.

[0066] According to the above embodiment, leakage of magnetic flux to the radial outside of the coil can be further suppressed.

[0067] Preferably, in an embodiment of the inductor component,

[0068] The above wide-width coil wiring is included only in any one of the first group composed of the above plurality of first coil wirings and the second group composed of the above plurality of second coil wirings.

[0069] When viewed from a direction orthogonal to the above first main surface,

[0070] The ratio of the total area of all the coil wirings in the group including the above wide-width coil wiring in the above first group and the above second group to the area of the above first main surface is larger than the ratio of the total area of all the coil wirings in the group not including the above wide-width coil wiring to the area of the above first main surface.

[0071] According to the above embodiment, while ensuring the number of turns of the coil, the above ratio of all the coil wirings in the group including the wide-width coil wiring can be increased.

[0072] Preferably, in an embodiment of the inductor component,

[0073] The above wide-width coil wiring is included in both the above plurality of first coil wirings and the above plurality of second coil wirings.

[0074] According to the above embodiment, the resistance of the entire coil can be further reduced compared with the prior art.

[0075] Preferably, in an embodiment of the inductor component,

[0076] When viewed from a direction orthogonal to the above first main surface,

[0077] The above wide-width coil wiring has a corner portion on the radially outer side of the above coil and on the central side of the above green body along the above axial direction.

[0078] The above wide-width coil wiring is connected to the above first through-wiring at the above corner portion.

[0079] According to the above embodiment, the coil length can be shortened, so the Q value can be further increased.

[0080] Preferably, in an embodiment of the inductor component,

[0081] When viewed from a direction orthogonal to the above first main surface,

[0082] The outer shape of the above wide-width coil wiring has a portion along the outer shape of the above green body and a portion along the outer shapes of the above first coil wiring and the above second coil wiring that are adjacent to the above wide-width coil wiring in the above axial direction and in the same plane.

[0083] According to the above-described embodiment, when viewed from a direction orthogonal to the first main surface, the wide-width coil wiring can be arranged in the dead zone so that the gap with the green body is minimized. The dead zone may be generated between the outer shape of the green body and the outer shapes of the first coil wiring and the second coil wiring that are axially adjacent to the wide-width coil wiring in the same plane. Therefore, the dead zone of the green body can be utilized more effectively, and thus the maximum width in the axial direction of the wide-width coil wiring can be further increased. As a result, the resistance of the entire coil can be further reduced compared with the prior art, and the Q value of the inductor component can be further increased.

[0084] Preferably, in one embodiment of the inductor component,

[0085] The above wide-width coil wiring is connected to the above first through-wiring,

[0086] The area of the contact surface of the above wide-width coil wiring with the above first through-wiring is larger than the area of the contact surface of at least one of the inner coil wirings with the above first through-wiring.

[0087] According to the above-described embodiment, the resistance of the first through-wiring connected to the wide-width coil wiring can be reduced compared with the resistance of other first through-wirings. As a result, the resistance of the entire coil can be further reduced compared with the prior art.

[0088] Preferably, in one embodiment of the inductor component,

[0089] One end face in the extending direction of the above first through-wiring is connected to any one of the above first coil wiring and the above second coil wiring,

[0090] The other end face in the extending direction of the above first through-wiring is connected to the other of the above first coil wiring and the above second coil wiring,

[0091] The above wide-width coil wiring is connected to at least the above first end face among the above first end face and the above second end face,

[0092] The area of the above first end face is larger than the area of the above second end face.

[0093] According to the above-described embodiment, the resistance of the first through-wiring connected to the wide-width coil wiring can be reduced compared with the resistance of other first through-wirings. As a result, the resistance of the entire coil can be reduced compared with the prior art.

[0094] According to the inductor component as one aspect of the present disclosure, the acquisition efficiency of inductance can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0095] Figure 1It is a schematic bottom view of the inductor component according to the first embodiment, observed from the bottom side.

[0096] Figure 2 It is Figure 1 a sectional view taken along line II-II.

[0097] Figure 3 It is Figure 1 a sectional view taken along line III-III.

[0098] Figure 4 It is Figure 1 an enlarged view of a part of

[0099] Figure 5A It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0100] Figure 5B It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0101] Figure 5C It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0102] Figure 5D It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0103] Figure 5E It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0104] Figure 5F It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0105] Figure 5G It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0106] Figure 5H It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0107] Figure 5I It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0108] Figure 5J It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0109] Figure 5K It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0110] Figure 5L It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0111] Figure 5M It is a schematic sectional view for explaining the manufacturing method of the inductor component.

[0112] Figure 6A It is a cross-sectional view showing a first modified example of an inductor component.

[0113] Figure 6B It is a cross-sectional view showing a second modified example of an inductor component.

[0114] Figure 6C It is a cross-sectional view showing a third modified example of an inductor component.

[0115] Figure 6D It is a cross-sectional view showing a fourth modified example of an inductor component.

[0116] Figure 7 It is a schematic bottom view of the inductor component of the second embodiment as viewed from the bottom side.

[0117] Figure 8 It is a schematic bottom view of the inductor component of the third embodiment as viewed from the bottom side.

[0118] Figure 9 It is Figure 8 the IX - IX cross-sectional view.

[0119] Figure 10 It is a schematic bottom view of the inductor component of the fourth embodiment as viewed from the bottom side.

[0120] Figure 11 It is a schematic bottom view of the inductor component of the fifth embodiment as viewed from the bottom side.

[0121] Figure 12 It is Figure 11 the XII - XII cross-sectional view.

[0122] Figure 13 It is a schematic bottom view of the inductor component of the sixth embodiment as viewed from the bottom side.

[0123] Figure 14 It is Figure 13 the XIV - XIV cross-sectional view.

[0124] Figure 15 It is Figure 13 an enlarged view of a part.

[0125] Figure 16A It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0126] Figure 16B It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0127] Figure 16C It is a schematic cross-sectional view for explaining the manufacturing method of the inductor component.

[0128] Figure 16D It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0129] Figure 16E It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0130] Figure 16F It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0131] Figure 16G It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0132] Figure 16H It is a schematic cross-sectional view showing a method of manufacturing an inductor component.

[0133] Figure 17A It is a cross-sectional view showing a first modification example of the inductor component.

[0134] Figure 17B It is a cross-sectional view showing a second modification example of the inductor component.

[0135] Figure 17C It is a cross-sectional view showing a third modification example of the inductor component. Detailed Description of the Invention

[0136] Hereinafter, the inductor component as one aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. In addition, the drawings include some schematic drawings, and there are cases where the actual dimensions and ratios are not reflected.

[0137] <First Embodiment>

[0138] Hereinafter, the inductor component 1 of the first embodiment will be described. Figure 1 It is a schematic bottom view of the inductor component 1 viewed from the bottom side. Figure 2 It is Figure 1 the cross-sectional view taken along line II-II of Figure 3 It is Figure 1 the cross-sectional view taken along line III-III of Figure 1 In Figure 1 for convenience, the external electrodes are depicted by a two-dot chain line. In addition, in

[0139] 1. General Structure

[0140] The general structure of the inductor component 1 will be described. The inductor component 1 is, for example, a surface-mount type inductor component for a high-frequency signal transmission circuit. As Figure 1 , Figure 2 and Figure 3As shown, the inductor component 1 includes a green body 10, a coil 110 disposed on the green body 10 and wound in a spiral shape along the axis AX, and a first external electrode 121 and a second external electrode 122 disposed on the green body 10 and electrically connected to the coil 110.

[0141] The green body 10 has a length, a width, and a height. The green body 10 has a first end face 100e1 and a second end face 100e2 on both end sides in the length direction, a first side face 100s1 and a second side face 100s2 on both end sides in the width direction, and a bottom face 100b and a top face 100t on both end sides in the height direction. In other words, the outer surface 100 of the green body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b and the top face 100t. The bottom face 100b is an example of the "first main face" described in the claims, and the top face 100t is an example of the "second main face" described in the claims.

[0142] In addition, as shown in the drawings, hereinafter, for convenience of explanation, the length direction (long side direction) of the green body 10, which is the direction from the first end face 100e1 toward the second end face 100e2, is defined as the X direction. In addition, the width direction of the green body 10, which is the direction from the first side face 100s1 toward the second side face 100s2, is defined as the Y direction. In addition, the height direction of the green body 10, which is the direction from the bottom face 100b toward the top face 100t, is defined as the Z direction. The X direction, the Y direction, and the Z direction are mutually orthogonal directions, and when arranged in the order of X, Y, Z, they form a right-handed system.

[0143] In this specification, the "outer surface 100 of the green body" including the first end face 100e1, the second end face 100e2, the first side face 100s1, the second side face 100s2, the bottom face 100b, and the top face 100t of the green body 10 does not merely mean the face facing the outer peripheral side of the green body 10, but rather the face that forms the boundary between the outside and the inside of the green body 10. In addition, the "above the outer surface 100 of the green body 10" does not refer to an absolute direction such as the vertical above defined in the gravitational direction, but rather refers to the direction toward the outside among the outside and the inside with the outer surface 100 as the boundary, based on the outer surface 100. Therefore, the "above the outer surface 100" is a relative direction determined according to the orientation of the outer surface 100. In addition, for a certain element, "above" includes not only the above separated from the element, that is, the position on the upper side of another object on the element, the upper side position separated by a distance, but also the directly above position (on) in contact with the element.

[0144] The axis AX of the coil 110 is arranged to be parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom wirings 11b disposed on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX in a plane parallel to the bottom surface 100b, a plurality of top wirings 11t disposed on the top surface 100t side with respect to the axis AX and arranged along the axis AX in a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom wirings 11b toward the top wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom wirings 11b toward the top wirings 11t, disposed on the side opposite to the first through wirings 13 with respect to the axis AX, and arranged along the axis AX. By sequentially connecting the bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14, at least a part of a spiral shape is formed.

[0145] The bottom wiring 11b is an example of the "first coil wiring" described in the claims, and the top wiring 11t is an example of the "second coil wiring" described in the claims. The axis AX refers to the intersection line of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t and a second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction orthogonal to the axis AX.

[0146] According to the above structure, the coil 110 includes the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14. By sequentially connecting the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14, at least a part of a spiral shape is formed. Therefore, the inner diameter of the coil 110 can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0147] Specifically, the pad portion of the conventional inductor component, the bottom wiring 11b and the top wiring 11t of the present embodiment are the "receiving portions" of the wirings (the conductive through holes of the conventional inductor component or the first through wiring 13 and the second through wiring 14 of the present embodiment) passing through the green body, so they have a shape that expands perpendicular to the direction of the green body. Here, in the structure of the conventional inductor component, since the conductive through holes extend in the direction parallel to the axis of the coil, the pad portion expands in the direction perpendicular to the axis of the coil, and it is likely to form a structure that blocks the magnetic flux generated in the axial direction of the coil.

[0148] In contrast, in the present embodiment, since the first through-wiring 13 and the second through-wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, the bottom surface wiring 11b and the top surface wiring 11t extend in a direction parallel to the axis AX of the coil 110. As a result, the bottom surface wiring 11b and the top surface wiring 11t are not easily configured to block the magnetic flux generated in the direction of the axis AX. That is, in the present embodiment, a configuration that does not easily block the magnetic flux can be achieved, and the inductance acquisition efficiency and Q value can be improved.

[0149] At least one of the two bottom surface wirings 11b located at both ends in the direction of the axis AX among the plurality of bottom surface wirings 11b and the two top surface wirings 11t located at both ends in the direction of the axis AX among the plurality of top surface wirings 11t is a wide-width coil wiring. The two bottom surface wirings 11b at both ends correspond to an example of the "first coil wiring at both ends" described in the claims, and are also referred to as the two bottom surface wirings 11b at both ends. The two top surface wirings 11t at both ends correspond to an example of the "second coil wiring at both ends" described in the claims, and are also referred to as the two top surface wirings 11t at both ends. In this embodiment, the two bottom surface wirings 11b located at both ends in the direction of the axis AX among the plurality of bottom surface wirings 11b and the two top surface wirings 11t located at both ends in the direction of the axis AX among the plurality of top surface wirings 11t are all wide-width coil wirings.

[0150] Hereinafter, the wide-width coil wiring located at the position closest to the first end face 100e1 side among the plurality of bottom surface wirings 11b is referred to as the "first wide-width coil wiring W1", the wide-width coil wiring located at the position closest to the second end face 100e2 side among the plurality of bottom surface wirings 11b is referred to as the "second wide-width coil wiring W2", the wide-width coil wiring located at the position closest to the first end face 100e1 side among the plurality of top surface wirings 11t is referred to as the "third wide-width coil wiring W3", and the wide-width coil wiring located at the position closest to the second end face 100e2 side among the plurality of top surface wirings 11t is referred to as the "fourth wide-width coil wiring W4". In addition, the coil wirings other than the two bottom surface wirings 11b (the two bottom surface wirings 11b at both ends) located at both ends in the direction of the axis AX among the plurality of bottom surface wirings 11b are referred to as "narrow-width bottom surface wirings 11nb", and the coil wirings other than the two top surface wirings 11t (the two top surface wirings 11t at both ends) located at both ends in the direction of the axis AX among the plurality of top surface wirings 11t are referred to as "narrow-width top surface wirings 11nt". The narrow-width bottom surface wirings 11nb and the narrow-width top surface wirings 11nt correspond to an example of the "inner coil wiring" described in the claims.

[0151] Figure 4 is Figure 1 an enlarged view of a part. Specifically, Figure 4It is an enlarged view of the first wide coil wiring 11w1, the narrow bottom surface wiring 11nb adjacent to the first wide coil wiring 11w1 in the axial direction of the axis AX, the third wide coil wiring 11w3, and the narrow top surface wiring 11nt adjacent to the third wide coil wiring 11w3 in the axial direction of the axis AX.

[0152] As Figure 4 shown, the maximum width W1 of the first wide coil wiring 11w1 in the axial direction of the axis AX is larger than the maximum width of at least one of the narrow bottom surface wiring 11nb and the narrow top surface wiring 11nt in the axial direction of the axis AX. The maximum width W3 of the third wide coil wiring 11w3 in the axial direction of the axis AX is larger than the maximum width of at least one of the narrow bottom surface wiring 11nb and the narrow top surface wiring 11nt in the axial direction of the axis AX.

[0153] The maximum width W1 of the first wide coil wiring 11w1 in the axial direction of the axis AX refers to the maximum value of the width of the first wide coil wiring 11w1 in the axial direction of the axis AX when observed from the direction (Z direction) orthogonal to the bottom surface 100b. The maximum width W3 of the third wide coil wiring 11w3 is defined in the same way.

[0154] In this embodiment, when observed from the Z direction, the shape of the first wide coil wiring 11w1 is a substantially triangular shape in which the width in the axial direction of the axis AX increases as it goes from the second side surface 100s2 side toward the first side surface s1 side. Specifically, when observed from the Z direction, the shape of the first wide coil wiring 11w1 is a substantially triangular shape having three sides including one side parallel to the X direction, one side parallel to the Y direction, and one side parallel to the extending direction of the narrow bottom surface wiring 11nb adjacent in the axial direction of the axis AX.

[0155] The maximum width W1 of the first wide coil wiring 11w1 in the axial direction of the axis AX is larger than the maximum width W2 of the narrow bottom surface wiring 11nb in the axial direction of the axis AX. The maximum width W1 of the first wide coil wiring 11w1 in the axial direction of the axis AX is larger than the maximum width W4 of the narrow top surface wiring 11nt in the axial direction of the axis AX. In addition, the maximum width W1 may be larger than either the maximum width W2 or the maximum width W4.

[0156] When observed from the Z direction, the shape of the third wide coil wiring 11w3 is a substantially rectangular shape extending in the Y direction. Specifically, when observed from the Z direction, the shape of the third wide coil wiring 11w3 is a substantially rectangular shape having four sides including two sides parallel to the X direction and two sides parallel to the Y direction.

[0157] The maximum width W3 of the third wide coil wiring 11w3 in the axial direction of the axis AX is larger than the maximum width W2 of the narrow bottom surface wiring 11nb in the axial direction of the axis AX. The maximum width W3 of the third wide coil wiring 11w3 in the axial direction of the axis AX is larger than the maximum width W4 of the narrow top surface wiring 11nt in the axial direction of the axis AX. The maximum width W2 and the maximum width W4 are defined in the same manner as the maximum width W1. In addition, the maximum width W3 may be larger than any one of the maximum width W2 and the maximum width W4.

[0158] In addition, although the maximum widths of the first wide coil wiring W1 and the third wide coil wiring W3 have been described, the same applies to the maximum widths of the second wide coil wiring W2 and the fourth wide coil wiring W4. That is, the maximum width of the second wide coil wiring 11w2 in the axial direction of the axis AX is larger than the maximum width in the axial direction of the axis AX of at least one of the narrow bottom surface wiring 11nb and the narrow top surface wiring 11nt. The maximum width of the fourth wide coil wiring 11w4 in the axial direction of the axis AX is larger than the maximum width in the axial direction of the axis AX of at least one of the narrow bottom surface wiring 11nb and the narrow top surface wiring 11nt.

[0159] According to the above structure, when viewed from a direction orthogonal to the bottom surface 100b, at least a part of the first to fourth wide coil wirings 11w1 to 11w4 can be arranged in the dead zones existing at both ends of the green body 10 in the axial direction of the axis AX where there was no coil wiring in the past. As a result, the dead zones of the green body 10 can be effectively utilized, and the resistance of the entire coil 110 can be reduced compared to the past, and the Q value of the inductor component 1 can be increased.

[0160] Specifically, in Figure 1 , for example, when the bottom surface wiring 11b closest to the first end surface 100e1 side is not a wide coil wiring but a coil wiring that linearly extends in a direction parallel to the narrow bottom surface wiring 11nb adjacent in the axial direction of the axis AX and has the same wiring width as the narrow bottom surface wiring 11nb, there may be a dead zone where the bottom surface wiring 11b does not exist at the corner of the green body 10 at the position where the first end surface 100e1 intersects the first side surface 100s1. According to the above structure, since the maximum width W1 of the first wide coil wiring 11w1 in the axial direction of the axis AX is relatively large, a part of the first wide coil wiring 11w1 can be arranged in the dead zone. The same applies to the second to fourth wide coil wirings 11w2 to 11w4. As a result, the dead zones of the green body 10 can be effectively utilized, and the resistance of the entire coil 110 can be reduced compared to the past, and the Q value of the inductor component 1 can be increased.

[0161] 2. Structure of each part

[0162] (Inductor component 1)

[0163] Preferably, the volume of the inductor component 1 is 0.08 mm 3 or less, and the size of the long side of the inductor component 1 is 0.65 mm or less. The size of the long side of the inductor component 1 refers to the maximum value among the length, width, and height of the inductor component 1, and in this embodiment, it refers to the length in the X direction. According to the above structure, since the volume of the inductor component 1 is small and the long side of the inductor component 1 is also short, the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. In addition, preferably, the thickness of the inductor component 1 is 200 μm or less. Accordingly, the inductor component 1 can be made thinner.

[0164] Specifically, the dimensions (length (X direction) × width (Y direction) × height (Z direction)) of the inductor component 1 are 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. In addition, the width and height may not be equal, and for example, it may also be 0.4 mm × 0.2 mm × 0.3 mm, etc.

[0165] (Green body 10)

[0166] Preferably, the green body 10 contains SiO2. Accordingly, insulation and rigidity can be imparted to the green body 10. The green body 10 is composed of, for example, a glass sintered body. The glass sintered body may also contain alumina, which can further improve the strength of the green body.

[0167] For example, a glass sintered body is formed by laminating insulating layers containing multiple glasses. The lamination direction of the multiple insulating layers is the Z direction. That is, the insulating layer is in a layered form having a main surface extending in the XY plane. In addition, in the green body 10, the interfaces between the multiple insulating layers may become unclear due to firing or the like.

[0168] In addition, for example, the green body 10 may be composed of a glass substrate. The glass substrate may also be a single-layer glass substrate. Since most of the green body is glass, losses such as eddy current loss at high frequencies can be suppressed.

[0169] (Coil 110)

[0170] The coil 110 includes a plurality of bottom surface wirings 11b, a plurality of top surface wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom surface wiring 11b, the first through wiring 13, the top surface wiring 11t, and the second through wiring 14 are connected in sequence to form at least a part of the coil 110 wound in the axial direction of the axis AX.

[0171] According to the above structure, the coil 110 is a coil 110 of a so-called spiral shape. Therefore, in a cross-section orthogonal to the axis AX, the area where the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 are parallel along the winding direction of the coil 110 can be reduced, and the stray capacitance in the coil 110 can be lowered.

[0172] Here, the spiral shape means that the number of turns of the entire coil is greater than one turn, and the number of turns of the coil in a cross-section orthogonal to the axis is less than one turn. More than one turn means that in a cross-section orthogonal to the axis, the wiring of the coil has a state where the parts are adjacent in the radial direction and parallel in the winding direction when viewed from the axial direction, and less than one turn means that in a cross-section orthogonal to the axis, the wiring of the coil does not have a state where the parts are adjacent in the radial direction and parallel in the winding direction when viewed from the axial direction.

[0173] The narrow-width bottom surface wiring 11nb extends only in one direction. Specifically, the narrow-width bottom surface wiring 11nb extends in the Y direction while being slightly inclined in the X direction. A plurality of narrow-width bottom surface wirings 11nb are arranged in parallel along the X direction. The maximum widths of the plurality of narrow-width bottom surface wirings 11nb in the axis AX direction may be the same or different, but in this embodiment, they are the same. Here, in a photolithography process, if deformed illumination such as annular illumination or dipole illumination is used, the pattern resolution in a specific direction can be improved, and a finer pattern can be formed. According to the above structure, since the narrow-width bottom surface wiring 11nb extends only in one direction, by using, for example, deformed illumination in the photolithography process, a minute narrow-width bottom surface wiring 11nb can be formed, and the inductor component 1 can be miniaturized.

[0174] The narrow-width top surface wiring 11nt extends only in one direction. Specifically, the narrow-width top surface wiring 11nt has a shape extending in the Y direction. A plurality of narrow-width top surface wirings 11nt are arranged in parallel along the X direction. The maximum widths of the plurality of narrow-width top surface wirings 11nt in the axis AX direction may be the same or different, but in this embodiment, they are made the same. According to the above structure, since the narrow-width top surface wiring 11nt extends only in one direction, by using, for example, deformed illumination in the photolithography process, a minute narrow-width top surface wiring 11nt can be formed, and the inductor component 1 can be miniaturized.

[0175] The bottom surface wiring 11b and the top surface wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy thereof. The bottom surface wiring 11b and the top surface wiring 11t may be a metal film formed by electroplating, evaporation plating, sputtering, etc., or a metal sintered body formed by coating a conductor paste and sintering it. In addition, the bottom surface wiring 11b and the top surface wiring 11t may also be a multilayer structure in which a plurality of metal layers are laminated. Preferably, the thickness of the bottom surface wiring 11b and the top surface wiring 11t is 5 μm or more and 50 μm or less.

[0176] The first through-wiring 13 is disposed on the first side surface 100s1 side with respect to the axis AX within the through-hole V of the green body 10, and the second through-wiring 14 is disposed on the second side surface 100s2 side with respect to the axis AX within the through-hole V of the green body 10. The first through-wiring 13 and the second through-wiring 14 extend in directions orthogonal to the bottom surface 100b and the top surface 100t, respectively. Accordingly, the lengths of the first through-wiring 13 and the second through-wiring 14 can be shortened, and thus the DC resistance (Rdc) can be suppressed. A plurality of first through-wirings 13 and a plurality of second through-wirings 14 are arranged in parallel along the X direction.

[0177] Preferably, the first through-wiring 13 contains SiO2. Accordingly, when the green body 10 contains SiO2, the coefficient of linear expansion of the first through-wiring 13 can be made consistent with that of the green body 10, and cracks between the first through-wiring 13 and the green body 10 can be suppressed. The first through-wiring 13 uses, for example, a conductive paste. The conductive material is Ag, Cu, etc. Preferably, the second through-wiring 14 also contains SiO2.

[0178] Preferably, at least one of the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 contains a void portion or a resin portion. Accordingly, the stress caused by the difference in the coefficient of linear expansion between the wiring and the green body 10 can be absorbed by the void portion or the resin portion, and the stress can be alleviated. As a method of forming the void portion, for example, a component that burns out by sintering can be used in the material of the wiring, and the void portion can be formed by sintering the wiring. As a method of forming the resin portion, for example, the resin portion can be formed by using a conductive paste in the material of the wiring.

[0179] Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t contains SiO2. Accordingly, when the green body 10 contains SiO2, the coefficient of linear expansion of the wiring can be made consistent with that of the green body 10, and cracks between the wiring and the green body 10 can be suppressed.

[0180] Preferably, the first external electrode 121 is provided on the bottom surface 100b of the green body 10, and only the wide-width coil wiring is included in the plurality of bottom surface wirings 11b. In this case, the wide-width coil wiring is not included in the plurality of top surface wirings 11t. According to this structure, the connection reliability between the first external electrode 121 and the coil 110 can be improved. Specifically, since the maximum width of the wide-width coil wiring in the axial direction of the axis AX is relatively large, the contact area between the first external electrode 121 and the wide-width coil wiring can be increased compared with the prior art. In addition, even when a positional deviation occurs in at least one of the first external electrode 121 and the wide-width coil wiring, the wide-width coil wiring can suppress the influence of the positional deviation and connect the first external electrode 121 and the wide-width coil wiring more reliably. As a result, the connection reliability between the first external electrode 121 and the coil 110 can be improved.

[0181] Preferably, the wide-width coil wiring is included in both the plurality of bottom surface wirings 11b and the plurality of top surface wirings 11t. According to this structure, the resistance of the entire coil 110 can be further reduced compared with the prior art.

[0182] Preferably, the width of the wide-width coil wiring in the axial direction of the axis AX is not constant in the direction orthogonal to the axial direction of the axis AX. Specifically, in each of the wide-width coil wirings of the first wide-width coil wiring 11w1 and the second wide-width coil wiring 11w2, the width of the central region except for both end portions in the direction orthogonal to the axial direction of the axis AX is not constant in the direction orthogonal to the axial direction of the axis AX. According to this structure, the dead zone of the green body 10 can be more effectively utilized.

[0183] Preferably, the maximum width of each of the first to fourth wide-width coil wirings 11w1 to 11w4 in the axial direction of the axis AX is larger than the maximum width of all the narrow-width bottom surface wirings 11nb and all the narrow-width top surface wirings 11nt in the axial direction of the axis AX. According to this structure, the resistance of the entire coil 110 can be further reduced compared with the prior art, and the Q value of the inductor component 1 can be further increased.

[0184] As Figure 1 and Figure 4 shown, preferably, when viewed from the direction orthogonal to the bottom surface 100b, the first wide-width coil wiring 11w1 has a corner C1 on the radially outer side of the coil 110 and on the central side of the green body 10, and the first wide-width coil wiring 11w1 is connected to the first through-wiring 13 at the corner C1. According to this structure, the coil length of the coil 110 can be shortened, so the Q value can be further increased. The coil length refers to the length of the coil 110 in the axial direction of the axis AX.

[0185] Similarly, preferably when viewed from a direction orthogonal to the bottom surface 100b, the fourth wide-width coil wiring 11w4 has a corner portion on the radially outer side of the coil 110 and on the central side of the green body 10, and the fourth wide-width coil wiring 11w4 is connected to the first through-wiring 13 at the corner portion.

[0186] Preferably when viewed from a direction orthogonal to the bottom surface 100b, the third wide-width coil wiring 11w3 has a corner portion C2 on the radially outer side of the coil 110 and on the central side of the green body 10, and the third wide-width coil wiring 11w3 is connected to the second through-wiring 14 at the corner portion C2. According to this structure, the coil length of the coil 110 can be shortened, so the Q value can be further increased.

[0187] Similarly, preferably when viewed from a direction orthogonal to the bottom surface 100b, the second wide-width coil wiring 11w2 has a corner portion on the radially outer side of the coil 110 and on the central side of the green body 10, and the second wide-width coil wiring 11w2 is connected to the second through-wiring 14 at the corner portion.

[0188] Preferably when viewed from a direction orthogonal to the bottom surface 100b, the outer shape of the first wide-width coil wiring 11w1 has a portion along the outer shape of the green body 10, and a portion along the outer shapes of the bottom surface wiring 11b and the top surface wiring 11t of the coil wiring adjacent in the axial direction AX on the same plane as the first wide-width coil wiring 11w1. Specifically, as Figure 1 and Figure 4 shown, the outer shape of the first wide-width coil wiring 11w1 has a portion P1 along the outer shape of the first end surface 100e1 of the green body 10, a portion P2 along the outer shape of the first side surface 100s1 of the green body 10, and a portion P3 along the outer shape of the narrow-width bottom surface wiring 11nb adjacent in the axial direction AX on the same plane as the first wide-width coil wiring 11w1. In addition, in Figure 4 for convenience, the portion P1 and the portion P2 are shown by a dotted line, and the portion P3 is shown by a double dotted line.

[0189] According to the above structure, when viewed from a direction orthogonal to the bottom surface 100b, the first wide-width coil wiring 11w1 can be arranged in the dead zone that may be generated between the outer shape of the green body 10 and the outer shape of the narrow-width bottom surface wiring 11nb and the gap with the green body 10 can be minimized. Therefore, the dead zone of the green body 10 can be utilized more effectively, so the maximum width W1 in the axial direction AX of the first wide-width coil wiring 11w1 can be further increased. As a result, the resistance of the entire coil 110 can be further reduced compared with the prior art, and the Q value of the inductor component 1 can be further increased.

[0190] Similarly, when viewed from a direction orthogonal to the bottom surface 100b, the outer shape of the second to fourth wide-width coil wirings 11w2 to 11w4 has a portion along the outer shape of the green compact 10 and a portion along the outer shapes of the bottom surface wiring 11b and the top surface wiring 11t that are adjacent to the wide-width coil wiring in the axial direction AX on the same plane.

[0191] Preferably, when viewed from a direction orthogonal to the bottom surface 100b, the ratio of the total area of the plurality of bottom surface wirings 11b to the area of the bottom surface 100b is 50% or more and 95% or less, and the ratio of the total area of the plurality of top surface wirings 11t to the area of the bottom surface 100b is 50% or more and 95% or less.

[0192] According to the above structure, by making the ratio of the total area of the plurality of bottom surface wirings 11b to the area of the bottom surface 100b 50% or more, magnetic flux leakage to the radial outside of the coil 110 can be suppressed. In addition, the resistance of the bottom surface wiring 11b can be further reduced. Moreover, the strength of the green compact 10 can be increased, and the heat dissipation of the inductor component 1 can be improved. By making the ratio of the area of the plurality of bottom surface wirings 11b to the area of the bottom surface 100b 95% or less, the inductor component 1 can be easily made into a single chip. Similarly, by making the ratio of the total area of the plurality of top surface wirings 11t to the area of the bottom surface 100b 50% or more, magnetic flux leakage to the radial outside of the coil 110 can be suppressed. In addition, the resistance of the top surface wiring 11t can be further reduced. Moreover, the strength of the green compact 10 can be increased, and the heat dissipation of the inductor component 1 can be improved. By making the ratio of the area of the plurality of top surface wirings 11t to the area of the bottom surface 100b 95% or less, the inductor component 1 can be easily made into a single chip.

[0193] In conventional inductor components, the pattern of the coil wiring of the same shape is repeated, and the pattern of the coil wiring is formed inside the green compact 10 so that the coil wiring does not protrude outside the green compact 10. Therefore, it is difficult to increase the above ratio. In the inductor component 1, since the plurality of bottom surface wirings 11b and the plurality of top surface wirings 11t include wide-width coil wirings, the above ratio can be increased. On the other hand, when the above ratio is 100% or approximately 100%, since the coil wiring and the green compact 10 are made of different materials, the processing difficulty increases during singulation. And considering that the coil wiring may be formed to deviate from the design position or there may be processing deviations, etc., the coil wiring may protrude from the green compact 10. Therefore, a side gap is provided from the outer surface of the green compact 10 toward the inside to limit the formation area of the coil wiring. For example, when the size of the bottom surface 100b is 0.4 mm × 0.2 mm and the side gap is 10 μm, the above ratio is 93%.

[0194] Preferably, the wide-width coil wiring is included in at least one of a first group composed of a plurality of bottom surface wirings 11b and a second group composed of a plurality of top surface wirings 11t. When viewed from a direction orthogonal to the bottom surface 100b, the ratio of the area of all the coil wirings in the group including the wide-width coil wiring in the first group and the second group to the area of the bottom surface 100b is 65% or more. According to this structure, it is possible to further suppress the leakage of magnetic flux to the radially outer side of the coil 110.

[0195] (The first external electrode 121 and the second external electrode 122)

[0196] The first external electrode 121 is connected to the first end of the coil 110, and the second external electrode 122 is connected to the second end of the coil 110. The first external electrode 121 is disposed on the first end surface 100e1 side with respect to the center of the green body 10 in the X direction so as to be exposed from the outer surface 100 of the green body 10. The second external electrode 122 is disposed on the second end surface 100e2 side with respect to the center of the green body 10 in the X direction so as to be exposed from the outer surface 100 of the green body 10.

[0197] When viewed from a direction orthogonal to the bottom surface 100b, preferably, the first external electrode 121 and the second external electrode 122 are located inside compared to the outer surface 100 of the green body 10. In other words, preferably, the first external electrode 121 and the second external electrode 122 are located inside compared to the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, and the second side surface 100s2 of the green body 10.

[0198] According to the above structure, since the first external electrode 121 and the second external electrode 122 do not contact the outer surface 100 of the green body 10, when singulating each inductor component, the load applied to the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component is miniaturized, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0199] In addition, the first external electrode 121 may be continuously provided on the bottom surface 100b and the first end surface 100e1. Accordingly, since the first external electrode 121 is a so-called L-shaped electrode, when mounting the inductor component 1 to a mounting substrate, a solder leg can be formed on the first external electrode 121. Similarly, the second external electrode 122 may also be continuously provided on the bottom surface 100b and the second end surface 100e2.

[0200] The first external electrode 121 has a bottom surface portion 121b provided on the bottom surface 100b and a conduction portion 121v embedded in the bottom surface 100b. The conduction portion 121v is connected to the bottom surface portion 121b. The conduction portion 121v is connected to the first wide-width coil wiring 11w.

[0201] The second external electrode 122 has a bottom surface portion 122b provided on the bottom surface 100b and a conduction portion 122v embedded in the bottom surface 100b. The conduction portion 122v is connected to the bottom surface portion 122b. The conduction portion 122v is connected to the second wide-width coil wiring 11w2.

[0202] The first external electrode 121 has a base layer 121e1 and a plating layer 121e2 covering the base layer 121e1. The base layer 121e1 contains conductive materials such as Ag and Cu, for example. The plating layer 121e2 contains conductive materials such as Ni and Sn, for example. A part of the bottom surface portion 121b and the conduction portion 121v are formed by the base layer 121e1. Another part of the bottom surface portion 121b is formed by the plating layer 121e2. Similarly, the second external electrode 122 has a base layer and a plating layer covering the base layer. In addition, the first external electrode 121 and the second external electrode 122 may be formed of a single-layer conductive material.

[0203] In this embodiment, the first external electrode 121 has a plurality of conduction portions 121v. Specifically, the first external electrode 121 has two conduction portions 121v arranged and configured in the Y direction. The two conduction portions 121v are connected to the end portion on the second side surface 100s2 side of the first wide-width coil wiring 11w1. Similarly, the second external electrode 122 has a plurality of conduction portions 121v. Specifically, the second external electrode 122 has two conduction portions 122v arranged and configured in the Y direction. The two conduction portions 122v are connected to the end portion on the first side surface 100s1 side of the second wide-width coil wiring 11w2. In addition, the number of each of the conduction portion 121v and the conduction portion 122v is not particularly limited, and may be three or more. Also, only one of the conduction portion 121v and the conduction portion 122v may exist in plurality.

[0204] According to the above structure, since a plurality of conduction portions 121v are connected to the first wide-width coil wiring 11w1, the connection strength between the first external electrode 121 and the first wide-width coil wiring 11w1 can be increased as compared with the case where one conduction portion 121v is connected. Similarly, since a plurality of conduction portions 122v are connected to the second wide-width coil wiring 11w2, the connection strength between the second external electrode 122 and the second wide-width coil wiring 11w2 can be increased as compared with the case where one conduction portion 122v is connected.

[0205] (Method for manufacturing inductor component 1)

[0206] Next, use Figures 5A - 5M to explain the manufacturing method of the inductor component 1. Figures 5A - 5H , Figure 5K , Figure 5L is a diagram corresponding to the II-II cross-section of Figure 1 . Figure 5I , Figure 5J , Figure 5M are diagrams corresponding to the III-III cross-section of Figure 1 .

[0207] As Figure 5A shown, the first insulating layer 1011 is provided on the base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc., and the material of the first insulating layer 1011 is, for example, a resin such as epoxy resin or polyimide, an inorganic insulating film such as SiO or SiN.

[0208] As Figure 5B shown, the second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed, for example, by a photolithography process. In addition, the groove can also be formed as a printing pattern from the beginning.

[0209] As Figure 5C shown, the top surface conductor layer 1011t is provided on the groove 1012a by printing. The material of the top surface conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc. At this time, for example, the top surface conductor layer 1011t is formed to remain only on the groove 1012a as a printing pattern. In addition, after printing the top surface conductor layer 1011t onto the second insulating layer 1012, the top surface conductor layer 1011t can also be made to remain only on the groove 1012a by a photolithography process.

[0210] As Figure 5D shown, the third insulating layer 1013 is provided on the second insulating layer 1012 by printing. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed by the same method as Figure 5B .

[0211] As Figure 5E shown, the first through-conductor layer 1131 of the first layer is provided in the first groove 1013a by printing, and the second through-conductor layer 1141 of the first layer is provided in the second groove 1013b by printing. By the same method as Figure 5CThe first through-conductor layer 1131 of the first layer and the second through-conductor layer 1141 of the first layer are formed by the same method.

[0212] Repeat the above process. As Figure 5F shown, a fourth insulating layer 1014 is provided on the third insulating layer 1013, and the first through-conductor layer 1132 of the second layer and the second through-conductor layer 1142 of the second layer are respectively provided on two grooves provided in the fourth insulating layer 1014. Further, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and the first through-conductor layer 1133 of the third layer and the second through-conductor layer 1143 of the third layer are respectively provided on two grooves provided in the fifth insulating layer 1015.

[0213] As Figure 5G shown, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a bottom conductor layer 1011b is provided in a groove provided in the sixth insulating layer 1016. The material of the bottom conductor layer 1011b is the same as that of the top conductor layer 1011t. As Figure 5H shown, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016.

[0214] As Figure 5I shown, a groove 1017a is provided in the seventh insulating layer 1017 to expose a part of the bottom conductor layer 1011b. As Figure 5J shown, a base conductor layer 1121e1 is provided on the seventh insulating layer 1017 and in the groove 1017a. The material of the base conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.

[0215] As Figure 5K shown, the entire laminate is sintered in a furnace at a high temperature (e.g., 500 °C or higher). The first to seventh insulating layers 1011 - 1017 are sintered to form a green body 10, the top conductor layer 1011t is sintered to form a top wiring 11t, the bottom conductor layer 1011b is sintered to form a bottom wiring 11b, the first through-conductor layers 1131 - 1133 of the first to third layers are sintered to form a first through-wiring 13, the second through-conductor layers 1141 - 1143 of the first to third layers are sintered to form a second through-wiring 14, and the base conductor layer 1121e1 is sintered to form a base layer 121e1. Therefore, sintering the insulating layer can improve the strength. In addition, by sintering the conductor layer, unnecessary resin components contained in the conductor layer can be volatilized, and the conductor materials contained in the conductor layer are melted to achieve a high conductivity. The base substrate 1000 can be peeled off by surface decomposition during sintering, or can be removed by mechanical methods such as grinding before and after sintering, or can be removed by chemical methods such as etching before and after sintering.

[0216] As Figure 5L shown, it is singulated along the cutting line C. As Figure 5M shown, the electroplated layer 121e2 is formed to cover the base layer 121e1 by barrel plating to form the first external electrode 121. Thus, as Figure 2 shown, the inductor component 1 is manufactured.

[0217] 3. Modified Example

[0218] (First Modified Example)

[0219] Figure 6A is a diagram corresponding to the II-II cross-section of the first modified example of the inductor component and Figure 1 As Figure 6A shown, in the inductor component 1A of the first modified example, when viewed in a direction parallel to the axis AX of the coil 110, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be widened, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0220] Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center so that the interval therebetween is wider at the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 at the center in the Z direction. Further, the first through-wiring 13 and the second through-wiring 14 each have a stepped shape along the Z direction. According to the above structure, in the case where the first through-wiring 13 and the second through-wiring 14 are respectively formed by laminating a plurality of conductor layers, the first through-wiring 13 and the second through-wiring 14 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0221] (Second Modified Example)

[0222] Figure 6B is a diagram corresponding to the II-II cross-section of the second modified example of the inductor component and Figure 1 As Figure 6B shown, in the inductor component 1B of the second modified example, when viewed in a direction parallel to the axis AX of the coil 110, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be widened, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0223] Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance between them becomes wider toward the top surface wiring 11t side in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 as they approach the top surface wiring 11t in the Z direction. Thus, when viewed from the direction of the axis AX, the coil 110 has a trapezoidal shape. With the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a straight line to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0224] (Third Modified Example)

[0225] Figure 6C is a diagram corresponding to the II-II cross-section of the third modified example of the inductor component and Figure 1 as shown. As Figure 6C shown, in the inductor component 1C of the third modified example, compared with the inductor component 1A of the first modified example shown Figure 6A in the figure, it includes a first coil 110A and a second coil 110B.

[0226] In the first coil 110A, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110A can be enlarged, and the Q value can be improved.

[0227] Specifically, the first through-wiring 13 has the same structure as the first through-wiring 13 of the inductor component 1A of the first modified example. On the other hand, the second through-wiring 14 has a straight shape parallel to the Z direction. In other words, the first through-wiring 13 is bent at the center such that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the center in the Z direction. The first through-wiring 13 has a stepped shape along the Z direction. With the above structure, when the first through-wiring 13 is formed by laminating a plurality of conductor layers, the first through-wiring 13 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0228] In the second coil 110B, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110B can be enlarged, and the Q value can be improved.

[0229] Specifically, the second through-wiring 14 has the same structure as the second through-wiring 14 of the inductor component 1A of the first modification. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is bent at the center such that the interval between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the center in the Z direction. The second through-wiring 14 has a stepped shape along the Z direction. According to the above structure, when forming the second through-wiring 14 by laminating a plurality of conductor layers, the second through-wiring 14 can be easily formed into a stepped shape by staggering the conductor layers of each layer.

[0230] (Fourth Modification)

[0231] Figure 6D is a diagram corresponding to the II-II cross-section of the fourth modification of the inductor component Figure 1 As shown in Figure 6D In the inductor component 1D of the fourth modification, compared with the inductor component 1B of the second modification shown in Figure 6B it includes a first coil 110A and a second coil 110B.

[0232] In the first coil 110A, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0233] Specifically, the first through-wiring 13 has the same structure as the first through-wiring 13 of the inductor component 1B of the second modification. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 becomes wider toward the top surface wiring 11t side in the Z direction. According to the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed into a linear shape to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0234] In the second coil 110B, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0235] Specifically, the second through-wiring 14 has the same structure as the second through-wiring 14 of the inductor component 1B of the second modification. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 is wider on the side of the top surface wiring 11t in the Z direction. According to the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape, and the resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0236] <Second Embodiment>

[0237] Figure 7 is a schematic bottom view showing a second embodiment of the inductor component as viewed from the bottom side. In Figure 7 for convenience, the external electrodes are depicted by a two-dot chain line. Further, in Figure 7 in order to easily understand the structure, the green body 10 is depicted transparently. Further, in Figure 7 for convenience, the description of the second end face side of the green body is omitted. The structure of the conduction part of the external electrode in the second embodiment is different from that in the first embodiment, and the different structure will be described below. Other structures are the same as those in the first embodiment, and the description thereof is omitted.

[0238] As Figure 7 shown, the first external electrode 121E has a conduction part 121vE connected to the coil 110. The conduction part 121vE is connected to the first wide-width coil wiring 11w1. The area of the contact surface CF1 between the first wide-width coil wiring 11w1 and the conduction part 121vE is larger than the area of the contact surface CF2 between the narrow-width bottom surface wiring 11nb and the narrow-width top surface wiring 11nt and the first through-wiring 13.

[0239] Specifically, the first external electrode 121E has one conduction part 121vE. The conduction part 121vE is connected to the end of the second side surface 100s2 side of the first wide-width coil wiring 11w1. When viewed from the Z direction, the shape of the conduction part 121vE is an elliptical shape having a major axis parallel to the Y direction. The area of the contact surface CF1 between the first wide-width coil wiring 11w1 and the conduction part 121vE is larger than the area of the contact surface CF2 between the narrow-width bottom surface wiring 11nb and the first through-wiring 13. According to this structure, the connection strength between the first external electrode 121E and the first wide-width coil wiring 11w1 can be improved.

[0240] In addition, although not shown, the conduction part of the second external electrode 122 may also have the same structure as the conduction part 121vE and has the same effect as the above-mentioned conduction part 121vE.

[0241] <Third Embodiment>

[0242] Figure 8 FIG. 5 is a schematic bottom view of a third embodiment of an inductor component as viewed from the bottom side. Figure 9 is Figure 8 a sectional view taken along line IX-IX in FIG. 5. In Figure 8 FIG. 5, for convenience, the external electrodes are depicted by a two-dot chain line. Further, in Figure 8 FIG. 5, the green body 10 is depicted transparently so that the structure can be easily understood. Further, in Figure 8 FIG. 5, for convenience, the description of the second end face side of the green body is omitted. The third embodiment is different from the first embodiment in that there is no wide-width coil wiring on the bottom surface wiring side and the thickness of the wide-width coil wiring on the top surface wiring side is different. The different structures will be described below. Other structures are the same as those of the first embodiment, and the description thereof is omitted.

[0243] As shown in Figure 8 and Figure 9 FIG. 5, the thickness of the third wide-width coil wiring 11w3 is thinner than the thicknesses of the narrow-width bottom surface wiring 11nb and the narrow-width top surface wiring 11nt.

[0244] Specifically, in this embodiment, the bottom surface wiring 11b located at the position closest to the first end face 100e1 side is not a wide-width coil wiring. The bottom surface wiring 11b extends linearly in a direction parallel to the narrow-width bottom surface wiring 11nb. The wiring width of the bottom surface wiring 11b is the same as the wiring width of the narrow-width bottom surface wiring 11nb. Further, although not shown, the thickness of the bottom surface wiring 11b in the Z direction is the same as the thickness of the narrow-width bottom surface wiring 11nb in the Z direction.

[0245] The thickness t2 of the third wide-width coil wiring 11w3 in the Z direction is thinner than the thickness t1 of the bottom surface wiring 11b located at the position closest to the first end face 100e1 side in the Z direction. In other words, the thickness t2 of the third wide-width coil wiring 11w3 is thinner than the thickness of the narrow-width bottom surface wiring 11nb (not shown) in the Z direction. Further, as long as the thickness t2 of the third wide-width coil wiring 11w3 is thinner than the thickness of at least one of the plurality of narrow-width bottom surface wirings 11nb and the plurality of narrow-width top surface wirings 11nt.

[0246] Since the maximum width of the third wide-width coil wiring 11w3 in the axis AX direction is relatively large, even if the thickness is made thinner, an increase in resistance can be suppressed. Therefore, according to the above structure, the resistance of the entire coil 110F can be reduced as compared with the conventional case, and a thin inductor component 1F can be realized.

[0247] Preferably, the first external electrode 121 is provided on the bottom surface 100b of the green body 10, and the wide-width coil wiring is included only in the plurality of top surface wirings 11t. According to this structure, compared with the case where the wide-width coil wiring is included in the plurality of bottom surface wirings 11b, the distance between the wide-width coil wiring and the first external electrode 121 can be increased. Therefore, the parasitic capacitance between the wide-width coil wiring and the first external electrode 121 can be reduced, and the self-resonant frequency (SRF: Self-Resonant Frequency) can be increased. Similarly, the second external electrode 122 may be provided on the bottom surface 100b of the green body 10, and the wide-width coil wiring is included only in the plurality of top surface wirings 11t.

[0248] Preferably, the wide-width coil wiring is included only in any one of the first group composed of the plurality of bottom surface wirings 11b and the second group composed of the plurality of top surface wirings 11t, and the thickness of all the coil wirings in the group including the wide-width coil wiring in the first group and the second group is thinner than the thickness of all the coil wirings in the group not including the wide-width coil wiring. According to this structure, a thinner inductor component 1F can be realized.

[0249] <Fourth Embodiment>

[0250] Figure 10 is a schematic bottom view observed from the bottom surface side showing the fourth embodiment of the inductor component. In Figure 10 for convenience, the external electrodes are depicted by double-dashed lines. Further, in Figure 10 for the sake of being able to easily understand the structure, the green body 10 is depicted transparently. Further, in Figure 10 for convenience, the description of the second end face side of the green body is omitted. The structure of the first through-wiring connected to the wide-width coil wiring in the fourth embodiment is different from that in the third embodiment, and the different structure will be described below. Other structures are the same as those in the third embodiment, and their descriptions are omitted.

[0251] As Figure 10 shown, the first wide-width coil wiring 11w1 is connected to the first through-wiring 13G, and the area of the contact surface CF3 of the first wide-width coil wiring 11w1 with the first through-wiring 13G is larger than the area of the contact surface CF4 of the narrow-width bottom surface wiring 11nb and the narrow-width top surface wiring 11nt with the first through-wiring 13.

[0252] Specifically, the first through-wiring 13G located at the position closest to the first end face 100e1 side is connected to the end on the first side face 100s1 side of the first wide-width coil wiring 11w1. When viewed from the Z direction, the shape of the first through-wiring 13G is an elliptical shape having a major axis parallel to the X direction. The area of the contact surface CF3 of the first wide-width coil wiring 11w1 with the first through-wiring 13G is larger than the area of the contact surface CF4 of the narrow-width bottom wiring 11nb with the first through-wiring 13.

[0253] According to the above structure, it is possible to reduce the resistance of the first through-wiring 13G connected to the first wide-width coil wiring 11w1 compared to the resistance of other first through-wirings 13. As a result, it is possible to reduce the resistance of the entire coil 110G compared to the conventional case.

[0254] In addition, although not shown, the second through-wiring connected to the second wide-width coil wiring 11w2 may also have the same structure as the first through-wiring 13G and have the same effect as the above-described first through-wiring 13G.

[0255] <Fifth Embodiment>

[0256] Figure 11 It is a schematic bottom view of a fifth embodiment of an inductor component as viewed from the bottom side. Figure 12 is Figure 11 the XII - XII cross-sectional view. In Figure 11 , for convenience, the external electrodes are depicted by double-dashed lines. In addition, in Figure 11 , in order to easily understand the structure, the green body 10 is depicted transparently. In addition, in Figure 11 , for convenience, the description of the second end face side of the green body is omitted. The structure of the first through-wiring connected to the wide-width coil wiring in the fifth embodiment is different from that in the third embodiment, and the different structure will be described below. Other structures are the same as those in the third embodiment, and their descriptions are omitted.

[0257] As Figure 11 and Figure 12 shown, the first end face EF1 in the extending direction of the first through-wiring 13H is connected to the top surface wiring 11t. The first end face EF1 is the end face of the first through-wiring 13H on the top surface 100t side. The second end face EF2 in the extending direction of the first through-wiring 13H is connected to the bottom surface wiring 11b. The second end face EF2 is the end face of the first through-wiring 13H on the bottom surface 100b side. A third wide-width coil wiring 11w3 is connected to the first end face EF1. The area of the first end face EF1 is larger than the area of the second end face EF2.

[0258] Specifically, the side surface of the first through-wiring 13H located at the position closest to the first end surface 100e1 side is formed in a stepped shape, so that in a cross-section including the extending direction of the first through-wiring 13H, as going from the bottom surface 100b side toward the top surface 100t side, the width in the X direction increases step by step. Therefore, the area of the first end surface EF1 is larger than the area of the second end surface EF2.

[0259] According to the above structure, it is possible to reduce the resistance of the first through-wiring 13H connected to the third wide-width coil wiring 11w3 compared with the resistance of the other first through-wirings 13. As a result, it is possible to reduce the resistance of the entire coil 110H compared with the conventional one.

[0260] In addition, as long as the area of the first end surface EF1 is larger than the area of the second end surface EF2, the shape of the first through-wiring 13H does not have to be a stepped shape. For example, the side surface of the first through-wiring 13H may also be linear, curved, or a shape combining these shapes, such that in a cross-section including the center line of the first through-wiring 13H, as going from the bottom surface 100b side toward the top surface 100t side, the width in the X direction increases. In other words, the first through-wiring 13H may also continuously or step by step increase the area of the cross-section orthogonal to the extending direction as going from the second end surface EF2 toward the first end surface EF1.

[0261] In addition, although not shown, the second through-wiring located at the position closest to the second end surface 100e2 side may also have the same structure as the first through-wiring 13H and have the same effect as the above-mentioned first through-wiring H.

[0262] <Sixth Embodiment>

[0263] Figure 13 is a schematic bottom view observed from the bottom surface side showing the sixth embodiment of the inductor component. Figure 14 is Figure 13 the XIV-XIV cross-sectional view. In Figure 13 , for convenience, the insulating layer is omitted from the drawing, and the external electrodes are drawn by double-dot dash lines. In addition, in Figure 13 , in order to easily understand the structure, the green body 10 is drawn transparently. The sixth embodiment is mainly different from the first embodiment in the position of the axis of the coil, the structure of the wide-width coil wiring, the orientation of the through-wiring, the material of the green body, and the setting of the insulating layer. The following mainly describes these different structures. Other structures are the same as those of the first embodiment, and their descriptions are omitted.

[0264] 1. Structure of Each Part

[0265] (Inductor Component 1I)

[0266] As Figure 13As shown, in the inductor component 1I, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the green body 10 in the X direction. Accordingly, the interference of the first external electrode 121 and the second external electrode 122 with the magnetic flux of the coil 110 can be reduced, and the acquisition efficiency of the inductance can be improved.

[0267] The length of the coil 110 in the direction of the axis AX is shorter than the inner diameter of the coil 110. Accordingly, the coil length is shortened and the coil inner diameter is increased, so the Q value can be improved. The inner diameter of the coil refers to the circular equivalent diameter based on the minimum area of the region surrounded by the coil 110 when viewed through in the direction of the axis AX.

[0268] (Green body 10)

[0269] The green body 10 is an inorganic insulator. Preferably, the material of the green body 10 is glass. Accordingly, due to the high insulation of glass, eddy currents can be suppressed and the Q value can be improved. Preferably, the green body 10 contains Si element. Accordingly, the thermal stability of the green body 10 is improved. Therefore, the variation in the size of the green body 10 caused by heat can be suppressed, and the electrical characteristic deviation can be reduced.

[0270] Preferably, the green body 10 is a single-layer glass plate. Accordingly, the strength of the green body 10 can be ensured. In addition, in the case of a single-layer glass plate, since the dielectric loss is small, the Q value at high frequencies can be improved. In addition, since there is no sintering process like that of a sintered body, the deformation of the green body 10 during sintering can be suppressed, thereby suppressing pattern shift and providing an inductor component with a small inductance tolerance.

[0271] As the material of the single-layer glass plate, from the viewpoint of the manufacturing method, a photosensitive glass plate represented by Foturan II (registered trademark of Schott AG) is preferred. In particular, it is preferred that the single-layer glass plate contains cerium oxide (cerium oxide: CeO2). In this case, the cerium oxide becomes a sensitizer, and the processing based on photolithography becomes easier.

[0272] However, the single-layer glass plate can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching processing using a photoresist / metal mask, laser processing, etc., so it can also be a non-photosensitive glass plate. In addition, the single-layer glass plate can be a glass plate obtained by sintering a glass paste or can be formed by a known method such as the float method.

[0273] (Insulator 22)

[0274] As Figure 14As shown, the inductor component 1I has an insulator 22. The insulator 22 covers the bottom surface 100b and the top surface 100t of the green body 10, respectively. In addition, the insulator 22 may be provided only on the bottom surface 100b among the bottom surface 100b and the top surface 1100t.

[0275] The insulator 22 is a component that covers the wirings (bottom surface wiring 11b, top surface wiring 11t), and has the functions of protecting the wirings from external forces and preventing damage to the wirings, and improving the insulation of the wirings. It is preferable that the insulator 22 is an organic insulator. For example, the insulator 22 may be a resin film such as epoxy resin or polyimide that is easy to form. In particular, it is preferable that the insulator 22 is made of a material with a low dielectric constant. Thus, when there is an insulator 22 between the coil 110 and the external electrodes 121 and 122, the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 can be reduced. For example, the insulator 22 can be formed by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.), or coating a paste-like resin and then performing thermal curing. In addition, the insulator 22 may be an inorganic film such as an oxide, nitride, or oxynitride of silicon, hafnium, etc., which has excellent insulation and thin film properties.

[0276] It is preferable that the green body 10 is an inorganic insulator. When the insulator 22 is an organic insulator, when viewed from a direction orthogonal to the bottom surface 100b, the outer surface of the organic insulator is located inside compared to the outer surface 100 of the inorganic insulator. Accordingly, since there is an organic insulator, the organic insulator is easy to impart fluidity. When covering the wirings (bottom surface wiring 11b, top surface wiring 11t) with the organic insulator, the organic insulator can be easily filled between adjacent wirings, and the insulation can be improved. In addition, since the organic insulator does not contact the outer surface of the inorganic insulator, when singulating each inductor component, the load applied to the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0277] (Coil 110)

[0278] As Figure 13 shown, the bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b has a shape extending in the X direction. A plurality of bottom surface wirings 11b are arranged in parallel along the Y direction. In this embodiment, the wiring widths of the respective bottom surface wirings 11b are the same, and the coil wirings at both ends in the axis AX direction among the plurality of bottom surface wirings 11b are not wide-width coil wirings.

[0279] The multiple top surface wirings 11t are composed only of wide-width coil wirings. Specifically, the multiple top surface wirings 11t include a fifth wide-width coil wiring 11w5 disposed on the second side surface 100s2 side of the blank 10, and a sixth wide-width coil wiring 11w6 disposed on the first side surface 100s1 side of the blank 10. When viewed from the Z direction, the fifth wide-width coil wiring 11w5 has a substantially triangular shape in which the width in the axial direction of the axis AX becomes narrower as it goes from the first end surface 100e1 side of the blank 10 toward the second end surface 100e2 side. When viewed from the Z direction, the sixth wide-width coil wiring 11w6 has a substantially triangular shape in which the width in the axial direction of the axis AX becomes narrower as it goes from the second end surface 100e2 side of the blank 10 toward the first end surface 100e1 side.

[0280] The first through-wiring 13 is disposed on the first end surface 100e1 side with respect to the axis AX within the through-hole V of the blank 10, and the second through-wiring 14 is disposed on the second end surface 100e2 side with respect to the axis AX within the through-hole V of the blank 10. The first through-wiring 13 and the second through-wiring 14 each extend in a direction orthogonal to the bottom surface 100b and the top surface 100t. The multiple first through-wirings 13 and the multiple second through-wirings 14 are respectively arranged in parallel along the Y direction.

[0281] Figure 15 is Figure 13 an enlarged view of a part of. Specifically, Figure 15 is an enlarged view of the fifth wide-width coil wiring 11w5 and the narrow-width bottom surface wiring 11nb. As Figure 15 shown, the maximum width W5 in the axial direction of the axis AX of the fifth wide-width coil wiring 11w5 is larger than the maximum width W6 in the axial direction of the axis AX of the narrow-width bottom surface wiring 11nb. The same applies to the sixth wide-width coil wiring 11w6. That is, the maximum width in the axial direction of the axis AX of the sixth wide-width coil wiring 11w6 is larger than the maximum width W6 in the axial direction of the axis AX of the narrow-width bottom surface wiring 11nb.

[0282] According to the above structure, when viewed from a direction orthogonal to the bottom surface 100b of the blank 10, at least a part of the fifth wide-width coil wiring 11w5 and the sixth wide-width coil wiring 11w6 can be disposed in the dead zones existing at both ends in the axial direction of the axis AX of the blank 10 where there was no coil wiring in the past. As a result, the dead zones of the blank 10 can be effectively utilized, and the resistance of the entire coil 110 can be reduced compared to the past, and the Q value of the inductor component 1I can be increased.

[0283] In addition, since the multiple top surface wirings 11t are composed only of wide-width coil wirings, in an inductor component with a small number of turns, the resistance of the entire coil 110 can be reduced compared to the past.

[0284] The wide-width coil wiring is included only in either the first group composed of a plurality of bottom wirings 11b or the second group composed of a plurality of top wirings 11t. When viewed from a direction orthogonal to the bottom surface 100b, the ratio of the total area of all the coil wirings in the group (either the first group or the second group) that includes the wide-width coil wiring to the area of the bottom surface 100b is larger than the ratio of the total area of all the coil wirings in the group that does not include the wide-width coil wiring to the area of the bottom surface 100b.

[0285] Specifically, as described above, the coil 110 includes a fifth wide-width coil wiring 11w5 and a sixth wide-width coil wiring 11w6. As the wide-width coil wirings, the fifth wide-width coil wiring 11w5 and the sixth wide-width coil wiring 11w6 are included only in the second group among the first group and the second group. When viewed from a direction orthogonal to the bottom surface 100b, the ratio of the total area of all the top wirings 11t (i.e., the fifth wide-width coil wiring 11w5 and the sixth wide-width coil wiring 11w6) in the second group to the area of the bottom surface 100b is larger than the ratio of the total area of all the bottom wirings 11b in the first group to the area of the bottom surface 100b. As an example, the ratio of the total area of all the top wirings 11t described above to the area of the bottom surface 100b is 70.5%, and the ratio of the total area of all the bottom wirings 11b described above to the area of the bottom surface 100b is 55.7%.

[0286] According to the above structure, while ensuring the number of turns of the coil 110, the above ratio of all the top wirings 11t in the second group including the wide-width coil wiring can be increased. As a result, the leakage of magnetic flux to the radial outside of the coil 110 can be further suppressed. Specifically, considering the case where the plurality of top wirings 11t do not include the wide-width coil wiring, each top wiring 11 is shaped to linearly extend in the X direction while being slightly inclined in the Y direction. In this case, the number of turns is approximately two turns, and the above ratio becomes smaller compared to the case where the plurality of top wirings 11t include the wide-width coil wiring. On the other hand, according to the above structure, while ensuring approximately two turns of the number of turns, the above ratio can be increased compared to the case where the plurality of top wirings 11t do not include the wide-width coil wiring.

[0287] (Manufacturing method of the inductor component 1I)

[0288] Next, use Figures 16A - 16H to describe the manufacturing method of the inductor component 1I. Figures 16A - 16H is a diagram corresponding to the XIV-XIV cross-section of Figure 13

[0289] As Figure 16A ​As shown, a copper foil 2001 is provided on a base substrate 2000. The material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.

[0290] As Figure 16B shown, a glass substrate 2010 that becomes a green body 10 is provided on the base substrate 2000. For example, jigs such as conductive tapes, pins, and frames are used to closely adhere the base substrate 2000 and the glass substrate 2010. The glass substrate 2010 has a through hole V. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. The TGV substrate is a substrate on which through holes have been formed in advance by laser, photolithography, or the like. The glass substrate 2010 can also be, for example, a TSV (Through Silicon Via) substrate, or it can be other than that. Additionally, Ti / Cu or other required conductive materials can be vapor-deposited on the surface of the glass substrate 2010 in advance by sputtering or the like as seeds.

[0291] As Figure 16C shown, a first through-conductor layer 2013 that becomes a first through-wiring 13 is formed in the through hole V of the glass substrate 2010. Although not shown, a second through-conductor layer that becomes a second through-wiring 14 is similarly formed in the through hole V. Specifically, power is supplied from the copper foil 2001 on the base substrate 2000, and the first through-conductor layer 2013 is formed by electrolytic electroplating in the through hole V of the glass substrate 2010. In addition to this, a seed layer can also be formed on the surface of the glass substrate 2010 and the inner surface of the through hole V by sputtering or the like, and a through-conductor layer can be formed using known methods such as filling electroplating, conformal electroplating, and printing and filling method of conductive paste. When there is unwanted electroplating growth on the surface of the glass substrate 2010, the unwanted portions are removed by grinding, CMP, wet etching (etching), or dry etching.

[0292] As Figure 16D shown, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 can be removed by mechanical methods such as grinding, or it can be removed by chemical methods such as etching.

[0293] As Figure 16EAs shown, a bottom conductor layer 2011b that forms the bottom surface wiring 11b and a top conductor layer 2011t that forms the top surface wiring 11t are formed on a glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed on the seed layer in the opening of the photoresist by electrolytic plating. The photoresist and the seed layer are removed by wet etching or dry etching. Thus, the bottom conductor layer 2011b and the top conductor layer 2011t patterned into an arbitrary shape are formed. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t can be formed one by one, or both can be formed simultaneously.

[0294] As Figure 16F shown, an insulating layer 2022 that forms the insulator 22 is provided on the top and bottom surfaces of the glass substrate 2010 to cover the conductor layer. At this time, the bottom-side insulating layer 2022 and the top-side insulating layer 2022 can be formed one by one, or both can be formed simultaneously. Thereafter, holes 2022a are provided in the bottom conductor layer 2011b of the bottom-side insulating layer 2022 using photolithography or laser processing.

[0295] As Figure 16G shown, a first external electrode conductor layer 2121 that forms the first external electrode 121 is provided on the bottom-side insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b via the holes 2022a. Specifically, a Pd catalyst (not shown) is provided on the bottom-side insulating layer 2022, and a Ni and Au plating layer is formed by electroless plating. A patterned photoresist is formed on the plating layer. The plating layer in the opening of the photoresist is removed by wet etching or dry etching. Thus, the first external electrode conductor layer 2121 patterned into an arbitrary shape is formed. Alternatively, a seed layer (not shown) is provided on the bottom-side insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the opening of the photoresist is removed by wet etching or dry etching. A Ni and Au plating layer can also be formed by electroless plating on the remaining seed layer. Although not shown, a second external electrode conductor layer that forms the second external electrode 122 is similarly provided on the bottom-side insulating layer 2022.

[0296] Here, since the first external electrode conductor layer 2121 is formed following the shape of the upper surface of the bottom-side insulating layer 2022, the upper surface of the first external electrode conductor layer 2121 has a depression in the region overlapping the holes 2022a. In addition, the upper surface of the first external electrode conductor layer 2121 can also be formed flat.

[0297] As Figure 16HAs shown, singulation is performed along the cutting line C. Thus, as Figure 14 shown, an inductor component 1I is manufactured.

[0298] 2. Modification Examples

[0299] (First Modification Example)

[0300] Figure 17A is a diagram corresponding to the XIV - XIV cross-section of a first modification example of an inductor component and Figure 13 shown. As Figure 17A shown, in the inductor component 1J of the first modification example, the first external electrode 121 is not connected to the bottom surface wiring 11b, but is connected to the first through-wiring 13. In other words, the first end portion of the first through-wiring 13 is connected to the first external electrode 121, and the second end portion of the first through-wiring 13 is connected to the fifth wide coil wiring 11w5. Accordingly, even if the number of turns of the coil is changed, the coil can be easily connected to the first external electrode 121. Similarly, the second external electrode 122 may not be connected to the bottom surface wiring 11b, but may be connected to the second through-wiring 14.

[0301] (Second Modification Example)

[0302] Figure 17B is a diagram corresponding to the XIV - XIV cross-section of a second modification example of an inductor component and Figure 13 shown. As Figure 17B shown, in the inductor component 1K of the second modification example, the first through-wiring 13 extends in a direction orthogonal to the bottom surface wiring 11b, and the cross-sectional areas of both end portions 13e in the extending direction of the first through-wiring 13 are larger than the cross-sectional area of the central portion 13m in the extending direction of the first through-wiring 13. In other words, on the cross-section of the first through-wiring 13 along the extending direction, the width of the first through-wiring 13 in the direction orthogonal to the extending direction continuously increases from the central portion 13m toward the end portions 13e.

[0303] Accordingly, the cross-sectional area of the end portion 13e of the first through-wiring 13 can be increased, and the connectivity between the first through-wiring 13 and at least one of the bottom surface wiring 11b and the top surface wiring 11t can be improved. In addition, when a through-hole V as a hole portion is formed in the green body 10 and a conductive material is filled in the through-hole V by electroplating or the like to form the first through-wiring 13 in the through-hole V, it is easy to fill the conductive material on the opening side of the through-hole V. Moreover, since the cross-sectional area of the end portion 13e of the first through-wiring 13 is large and the cross-sectional area of the central portion 13m of the first through-wiring 13 is small, it is easy to form the first through-wiring 13.

[0304] In addition, it is sufficient that the cross-sectional area of one end portion 13e of the first through-wiring 13 is larger than the cross-sectional area of the central portion 13m of the first through-wiring 13. Similarly, the cross-sectional area of at least one end portion of the second through-wiring 14 may be larger than the cross-sectional area of the central portion 13m of the first through-wiring 13.

[0305] (Third modified example)

[0306] Figure 17C is a diagram corresponding to the XIV-XIV cross-section showing a third modified example of the inductor component Figure 13 As shown in FIG. Figure 17C In the inductor component 1L of the third modified example, when viewed from the direction in which the first through-wiring 13 extends, the first through-wiring 13 has a conductive layer 13s located on the outer peripheral side and a non-conductive layer 13u located inside the conductive layer 13s. Accordingly, when used in a high-frequency band, due to the skin effect, current mainly flows on the surface of the first through-wiring 13, so the Q value is not reduced due to the conductive layer 13s being provided on the outer peripheral side. In addition, by providing the non-conductive layer 13u inside, stress can be alleviated, and in addition, the manufacturing cost can be reduced by not using a conductor.

[0307] An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through-hole V of the green body 10 by sputtering or electroless plating. Then, an electroplated layer is formed on the seed layer by electroplating. In this way, a plurality of conductive layers 13s such as Ti / Cu / electrolytic Cu or Pd / electroless Cu / electrolytic Cu can be formed on the outer peripheral side of the first through-wiring 13. Thereafter, the inside of the conductive layer 13s is sealed with resin by printing or hot pressing, etc., to form a non-conductive layer 13u made of resin. In this way, current can flow on the surface (conductive layer 13s) of the first through-wiring 13, and stress can be alleviated by the non-conductive layer 13u inside the first through-wiring 13.

[0308] Similarly, when viewed from the direction in which the second through-wiring 14 extends, the second through-wiring 14 may also have a conductive layer located on the outer peripheral side and a non-conductive layer located inside the conductive layer.

[0309] In addition, the present disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the gist of the present disclosure. For example, various combinations of the characteristic points of the first to sixth embodiments can also be made.

[0310] In the above-described embodiments, the plurality of bottom surface wirings and the plurality of top surface wirings include two or more wide-width coil wirings, but it is sufficient that at least one wide-width coil wiring is included.

[0311] In the above-described third embodiment, the thickness of the third wide-width coil wiring is relatively thin. However, in the case where the coil includes wide-width coil wirings other than the first wide-width coil wiring, the second wide-width coil wiring, and the fourth wide-width coil wiring, the thickness of the wide-width coil wiring other than these may also be relatively thin.

[0312] In the above-described fifth embodiment, the bottom surface wiring at the position closest to the first end face side of the green compact is not wide-width coil wiring, while the top surface wiring at the position closest to the first end face side of the green compact is wide-width coil wiring. However, it is also possible that the bottom surface wiring at the position closest to the first end face side of the green compact is wide-width coil wiring, while the top surface wiring at the position closest to the first end face side of the green compact is not wide-width coil wiring. In this case, it is also possible that the area of the end face on the bottom surface wiring side of the first through-wiring at the position closest to the first end face side of the green compact is larger than the area of the end face on the top surface wiring side. The same applies to the second through-wiring at the position closest to the second end face side of the green compact.

[0313] In the above-described sixth embodiment, the plurality of top surface wirings are composed only of wide-width coil wirings. However, it is also possible that the plurality of bottom surface wirings are composed only of wide-width coil wirings. In this case, the plurality of top surface wirings may not include wide-width coil wirings.

[0314] The present disclosure includes the following aspects.

[0315] <1> An inductor component, comprising:

[0316] A green compact including a first main surface and a second main surface that face each other;

[0317] A coil provided on the above-described green compact and wound in a spiral shape along an axis; and

[0318] A first external electrode and a second external electrode provided on the above-described green compact and electrically connected to the above-described coil,

[0319] The axis of the above-described coil is arranged parallel to the above-described first main surface,

[0320] The above-described coil includes:

[0321] A plurality of first coil wirings provided on the first main surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described first main surface;

[0322] A plurality of second coil wirings provided on the second main surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described second main surface;

[0323] A plurality of first through-wirings extending from the above-described first coil wirings toward the above-described second coil wirings and arranged along the above-described axis; and

[0324] A plurality of second through wirings extend from the above-described first coil wiring toward the above-described second coil wiring, are provided on the opposite side of the above-described axis from the above-described first through wiring, and are arranged along the above-described axis.

[0325] By connecting the above-described first coil wiring, the above-described first through wiring, the above-described second coil wiring, and the above-described second through wiring in this order, at least a part of the above-described spiral shape is formed.

[0326] At least one of two end first coil wirings located at both ends in the above-described axial direction among the above-described plurality of first coil wirings and two end second coil wirings located at both ends in the above-described axial direction among the above-described plurality of second coil wirings is a wide-width coil wiring.

[0327] The maximum width in the above-described axial direction of the above-described wide-width coil wiring is larger than the maximum width in the above-described axial direction of at least one of the inner coil wirings, and the inner coil wirings are coil wirings other than the above-described end first coil wirings and the above-described end second coil wirings among the above-described plurality of first coil wirings and the above-described plurality of second coil wirings.

[0328] <2> The inductor component according to <1>.

[0329] The maximum width in the above-described axial direction of the above-described wide-width coil wiring is larger than the maximum width in the above-described axial direction of all of the above-described inner coil wirings.

[0330] <3> The inductor component according to <1> or <2>.

[0331] The above-described first external electrode is provided on the above-described first main surface of the above-described green body.

[0332] The above-described wide-width coil wiring is included only in the above-described plurality of first coil wirings.

[0333] <4> The inductor component according to <1> or <2>.

[0334] The above-described first external electrode is provided on the above-described first main surface of the above-described green body.

[0335] The above-described wide-width coil wiring is included only in the above-described plurality of second coil wirings.

[0336] <5> The inductor component according to any one of <1> to <4>.

[0337] The width of the above-described wide-width coil wiring in the above-described axial direction is not constant in the direction orthogonal to the above-described axial direction.

[0338] <6>The inductor component according to any one of <1> to <5>

[0339] The first external electrode has a conduction portion connected to the coil.

[0340] The conduction portion is connected to the wide-width coil wiring.

[0341] The area of the contact surface of the wide-width coil wiring with the conduction portion is larger than the area of the contact surface of at least one of the inner coil wirings with the first through-wiring.

[0342] <7>The inductor component according to any one of <1> to <6>

[0343] The first external electrode has a plurality of conduction portions connected to the coil.

[0344] The plurality of conduction portions are connected to the wide-width coil wiring.

[0345] <8>The inductor component according to any one of <1> to <7>

[0346] The thickness of the wide-width coil wiring is thinner than the thickness of at least one of the inner coil wirings.

[0347] <9>The inductor component according to any one of <1> to <8>

[0348] The wide-width coil wiring is included only in any one of the first group composed of the plurality of first coil wirings and the second group composed of the plurality of second coil wirings.

[0349] The thickness of all the coil wirings in the group including the wide-width coil wiring among the first group and the second group is thinner than the thickness of all the coil wirings in the group not including the wide-width coil wiring.

[0350] <10>The inductor component according to any one of <1> to <9>

[0351] Any one of the plurality of first coil wirings and the plurality of second coil wirings is composed only of the wide-width coil wiring.

[0352] <11>The inductor component according to any one of <1> to <10>

[0353] When viewed from a direction orthogonal to the first main surface,

[0354] The ratio of the total area of the plurality of first coil wirings to the area of the first main surface is 50% or more and 95% or less.

[0355] The ratio of the total area of the plurality of second coil wirings to the area of the first main surface is 50% or more and 95% or less.

[0356] <12> The inductor component according to any one of <1> to <11>,

[0357] The wide-width coil wiring is included in at least one of the first group composed of the plurality of first coil wirings and the second group composed of the plurality of second coil wirings.

[0358] When viewed from a direction orthogonal to the first main surface,

[0359] The ratio of the total area of all the coil wirings in the group including the wide-width coil wiring in the first group and the second group to the area of the first main surface is 65% or more.

[0360] <13> The inductor component according to any one of <1> to <12>,

[0361] The wide-width coil wiring is included only in any one of the first group composed of the plurality of first coil wirings and the second group composed of the plurality of second coil wirings.

[0362] When viewed from a direction orthogonal to the first main surface,

[0363] The ratio of the total area of all the coil wirings in the group including the wide-width coil wiring in the first group and the second group to the area of the first main surface is larger than the ratio of the total area of all the coil wirings in the group not including the wide-width coil wiring to the area of the first main surface.

[0364] <14> The inductor component according to any one of <1> to <9>,

[0365] The wide-width coil wiring is included in both the plurality of first coil wirings and the plurality of second coil wirings.

[0366] <15> The inductor component according to any one of <1> to <14>,

[0367] When viewed from a direction orthogonal to the first main surface,

[0368] The wide-width coil wiring has a corner portion on the radially outer side of the coil and on the central side of the green compact along the axial direction.

[0369] The wide-width coil wiring is connected to the first through-wiring at the corner portion.

[0370] <16>The inductor component according to any one of <1> to <15>

[0371] When viewed from a direction orthogonal to the first main surface,

[0372] The outer shape of the wide-width coil wiring has a portion along the outer shape of the green body and a portion along the outer shapes of the first coil wiring and the second coil wiring that are adjacent to the wide-width coil wiring in the axial direction and in the same plane.

[0373] <17>The inductor component according to any one of <1> to <16>

[0374] The wide-width coil wiring is connected to the first through-wiring,

[0375] The area of the contact surface of the wide-width coil wiring with the first through-wiring is larger than the area of the contact surface of at least one of the inner coil wirings with the first through-wiring.

[0376] <18>The inductor component according to any one of <1> to <17>

[0377] One end surface in the extending direction of the first through-wiring is connected to either the first coil wiring or the second coil wiring,

[0378] The other end surface in the extending direction of the first through-wiring is connected to the other of the first coil wiring and the second coil wiring,

[0379] The wide-width coil wiring is connected to at least the first end surface among the first end surface and the second end surface,

[0380] The area of the first end surface is larger than the area of the second end surface.

[0381] Description of reference numerals

[0382] 1, 1A - 1L... Inductor components, 10... Green body, 11b... Bottom surface wiring (first coil wiring), 11nb... Narrow bottom surface wiring, 11t... Top surface wiring (second coil wiring), 11nt... Narrow top surface wiring, 11w1 - 11w6... Wide coil wiring, 13, 13G, 13H... First through - wiring, 13e... End portion, 13m... Central portion, 13s... Conductive layer, 13u... Non - conductive layer, 14... Second through - wiring, 22... Insulator, 100b... Bottom surface (first main surface), 100t... Top surface (second main surface), 100e1... First end face, 100e2... Second end face, 100s1... First side face, 100s2... Second side face, 110, 110F, 110G, 110H... Coils, 121... First external electrode, 121b... Bottom surface portion, 121v, 121vE... Conductive portion, 121e1... Base layer, 121e2... Plated layer, 122... Second external electrode, 122b... Bottom surface portion, 122v... Conductive portion, AX... Axis, C1, C2... Corner portions, CF1 - CF4... Contact surfaces, EF1, EF2... End faces, t1, t2... Thickness, V... Through - hole, W1 - W6... Maximum axial width.

Claims

1. An inductor component, wherein, Comprising: A green body including a first main surface and a second main surface opposed to each other; A coil disposed on the above-mentioned green body and wound in a spiral shape along an axis; and A first external electrode and a second external electrode disposed on the above-mentioned green body and electrically connected to the above-mentioned coil, The above-mentioned axis of the above-mentioned coil is arranged parallel to the above-mentioned first main surface, The above-mentioned coil includes: A plurality of first coil wirings disposed on the first main surface side with respect to the above-mentioned axis and arranged along the above-mentioned axis in a plane parallel to the above-mentioned first main surface; A plurality of second coil wirings disposed on the second main surface side with respect to the above-mentioned axis and arranged along the above-mentioned axis in a plane parallel to the above-mentioned second main surface; A plurality of first through wirings extending from the above-mentioned first coil wirings toward the above-mentioned second coil wirings and arranged along the above-mentioned axis; and A plurality of second through wirings extending from the above-mentioned first coil wirings toward the above-mentioned second coil wirings, disposed on the side opposite to the above-mentioned first through wirings with respect to the above-mentioned axis, and arranged along the above-mentioned axis, By connecting the above-mentioned first coil wirings, the above-mentioned first through wirings, the above-mentioned second coil wirings, and the above-mentioned second through wirings in sequence in the order of the above-mentioned first coil wirings, the above-mentioned first through wirings, the above-mentioned second coil wirings, and the above-mentioned second through wirings, at least a part of the above-mentioned spiral shape is formed, At least one of two end first coil wirings located at both ends in the above-mentioned axial direction among the above-mentioned plurality of first coil wirings and two end second coil wirings located at both ends in the above-mentioned axial direction among the above-mentioned plurality of second coil wirings is a wide-width coil wiring, The maximum width in the above-mentioned axial direction of the above-mentioned wide-width coil wiring is larger than the maximum width in the above-mentioned axial direction of at least one coil wiring among the inner coil wirings, and the inner coil wirings are coil wirings among the above-mentioned plurality of first coil wirings and the above-mentioned plurality of second coil wirings other than the above-mentioned end first coil wirings and the above-mentioned end second coil wirings.

2. The inductor component according to claim 1, wherein, The maximum width in the above-mentioned axial direction of the above-mentioned wide-width coil wiring is larger than the maximum width in the above-mentioned axial direction of all the above-mentioned inner coil wirings.

3. The inductor component according to claim 1 or 2, wherein, The above-mentioned first external electrode is disposed on the above-mentioned first main surface of the above-mentioned green body, The above-mentioned wide-width coil wiring is only included in the above-mentioned plurality of first coil wirings.

4. The inductor component according to claim 1 or 2, wherein, The above-mentioned first external electrode is disposed on the above-mentioned first main surface of the above-mentioned green body, The above-mentioned wide-width coil wiring is only included in the above-mentioned plurality of second coil wirings.

5. The inductor component according to any one of claims 1 to 4, wherein, The width of the above-mentioned wide-width coil wiring in the direction orthogonal to the above-mentioned axial direction is not constant.

6. The inductor component according to any one of claims 1 to 5, wherein, The above-mentioned first external electrode has a conduction part connected to the above-mentioned coil, The above-mentioned conduction part is connected to the above-mentioned wide-width coil wiring, The area of the contact surface of the above-mentioned wide-width coil wiring with the above-mentioned conduction part is larger than the area of the contact surface of at least one coil wiring among the above-mentioned inner coil wirings with the above-mentioned first through wiring.

7. The inductor component according to any one of claims 1 to 6, wherein, The above-mentioned first external electrode has a plurality of conduction parts connected to the above-mentioned coil, The above-mentioned plurality of conduction parts are connected to the above-mentioned wide-width coil wiring.

8. The inductor component according to any one of claims 1 to 7, wherein, The thickness of the above-mentioned wide-width coil wiring is thinner than the thickness of at least one coil wiring among the above-mentioned inner coil wirings.

9. The inductor component according to any one of claims 1 to 8, wherein, The above-mentioned wide-width coil wiring is included in only one of the first group composed of the above-mentioned multiple first coil wirings and the second group composed of the above-mentioned multiple second coil wirings. The thickness ratio of all the coil wirings in the group (including the wide-width coil wiring) among the above-mentioned first group and the above-mentioned second group is thinner than the thickness of all the coil wirings in the group that does not include the wide-width coil wiring.

10. The inductor component according to any one of claims 1 to 9, wherein, Any one of the above-mentioned multiple first coil wirings and the above-mentioned multiple second coil wirings is composed only of the above-mentioned wide-width coil wiring.

11. The inductor component according to any one of claims 1 to 10, wherein, When observing from a direction orthogonal to the above-mentioned first main surface, The ratio of the total area of the above-mentioned multiple first coil wirings to the area of the above-mentioned first main surface is 50% or more and 95% or less. The ratio of the total area of the above-mentioned multiple second coil wirings to the area of the above-mentioned first main surface is 50% or more and 95% or less.

12. The inductor component according to any one of claims 1 to 11, wherein, The above-mentioned wide-width coil wiring is included in at least one of the first group composed of the above-mentioned multiple first coil wirings and the second group composed of the above-mentioned multiple second coil wirings. When observing from a direction orthogonal to the above-mentioned first main surface, The ratio of the total area of all the coil wirings in the group (including the wide-width coil wiring) among the above-mentioned first group and the above-mentioned second group to the area of the above-mentioned first main surface is 65% or more.

13. The inductor component according to any one of claims 1 to 12, wherein, The above-mentioned wide-width coil wiring is included in only one of the first group composed of the above-mentioned multiple first coil wirings and the second group composed of the above-mentioned multiple second coil wirings. When observing from a direction orthogonal to the above-mentioned first main surface, The ratio of the total area of all the coil wirings in the group (including the wide-width coil wiring) among the above-mentioned first group and the above-mentioned second group to the area of the above-mentioned first main surface is larger than the ratio of the total area of all the coil wirings in the group that does not include the wide-width coil wiring to the area of the above-mentioned first main surface.

14. The inductor component according to any one of claims 1 to 9, wherein, The above-mentioned wide-width coil wiring is included in both the above-mentioned multiple first coil wirings and the above-mentioned multiple second coil wirings.

15. The inductor component according to any one of claims 1 to 14, wherein, When observing from a direction orthogonal to the above-mentioned first main surface, The above-mentioned wide-width coil wiring has a corner portion on the radially outer side of the above-mentioned coil and on the central side of the above-mentioned green body along the above-mentioned axial direction. The above-mentioned wide-width coil wiring is connected to the above-mentioned first through-wiring at the above-mentioned corner portion.

16. The inductor component according to any one of claims 1 to 15, wherein, When observing from a direction orthogonal to the above-mentioned first main surface, The outer shape of the above-mentioned wide-width coil wiring has a part along the outer shape of the above-mentioned green body and a part along the outer shapes of the above-mentioned first coil wiring and the above-mentioned second coil wiring that are adjacent to the above-mentioned wide-width coil wiring in the above-mentioned axial direction and in the same plane.

17. The inductor component according to any one of claims 1 to 16, wherein, The above-mentioned wide-width coil wiring is connected to the above-mentioned first through-wiring. The area of the contact surface of the above-mentioned wide-width coil wiring with the above-mentioned first through-wiring is larger than the area of the contact surface of at least one of the above-mentioned inner-side coil wirings with the above-mentioned first through-wiring.

18. The inductor component according to any one of claims 1 to 17, wherein, The first end surface in the extending direction of the above-mentioned first through-wiring is connected to any one of the above-mentioned first coil wiring and the above-mentioned second coil wiring. The second end surface in the extending direction of the above-mentioned first through-wiring is connected to the other one of the above-mentioned first coil wiring and the above-mentioned second coil wiring. At least the first end face of the above-mentioned first end face and the above-mentioned second end face is connected with the above-mentioned wide-width coil wiring, The area of the above-mentioned first end face is larger than the area of the above-mentioned second end face.

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