Microfluidic chip

Abstract

The application provides a microfluidic chip, which comprises a first substrate, a second substrate and a blowing assembly. The first substrate and the second substrate are oppositely and spacedly arranged, and the first substrate and the second substrate enclose a containing space for containing a droplet. The blowing assembly is arranged on the side of the first substrate and the second substrate, and the air outlet of the blowing assembly is communicated with the containing space. The first substrate and the second substrate are used for forming a preset electric field, the blowing assembly is used for blowing air to the droplet, and the preset electric field and the blowing assembly jointly drive the droplet to move on the first substrate. Therefore, the application jointly drives the droplet to move through the blowing assembly and the driving electrode, reduces the voltage of the driving electrode, avoids damage of the TFT device in the driving circuit layer caused by high voltage, and improves the service life of the microfluidic chip.

Description

microfluidic chip Technical Field

[0001] This application relates to the field of microfluidics, and more particularly to a microfluidic chip. Background Technology

[0002] Microfluidics integrates the basic operational units of biological, chemical, and medical analysis processes—such as sample preparation, reaction, separation, and detection—onto a single chip at the micrometer scale, automating the entire analytical process. Microfluidic chips offer advantages such as high throughput, high speed, low power consumption, and low material consumption.

[0003] Microfluidic chips can drive the movement of liquids within them; however, the voltage required to drive this flow is typically quite high, usually around 100V. This high voltage can damage the thin-film transistor (TFT) devices within the microfluidic chip, thus reducing its lifespan.

[0004] Therefore, how to solve the problem of excessively high voltage driving liquid flow in existing microfluidic chips in order to improve the lifespan of microfluidic chips is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a microfluidic chip that aims to solve the problem of excessively high voltage in the prior art for driving liquid flow in microfluidic chips, so as to improve the service life of microfluidic chips.

[0006] To address the aforementioned technical problems, this application provides a microfluidic chip, comprising a first substrate, a second substrate, and an air blowing assembly. The first substrate and the second substrate are positioned opposite each other and spaced apart, forming a accommodating space for containing the droplet. The air blowing assembly is disposed around the periphery of the first substrate and the second substrate, and its outlet communicates with the accommodating space. The first substrate and the second substrate form a preset electric field, and the air blowing assembly blows air onto the droplet. The preset electric field and the air blowing assembly together drive the droplet to move on the first substrate.

[0007] In existing technologies, the driving electrode drives the droplet flow, and its voltage is typically around 100V. Higher voltages can easily damage the TFT devices within the driving circuit layer, thus reducing the lifespan of the microfluidic chip. Therefore, this application utilizes the air-blowing assembly and the driving electrode to jointly drive the droplet movement, reducing the voltage of the driving electrode and thus preventing damage to the TFT devices within the driving circuit layer due to higher voltages, thereby improving the lifespan of the microfluidic chip.

[0008] In an exemplary embodiment, the microfluidic chip further includes multiple baffles, which are spaced apart from each other and arranged in an array. The multiple baffles are disposed between the first substrate and the second substrate, forming multiple first channels and multiple second channels within the accommodating space. The droplet moves within the multiple first channels and the multiple second channels.

[0009] In an exemplary embodiment, the air-blowing assembly includes a first air-blowing element, a second air-blowing element, a third air-blowing element, and a fourth air-blowing element. The first air-blowing element and the second air-blowing element are positioned opposite each other and spaced apart, and the third air-blowing element and the fourth air-blowing element are positioned opposite each other and spaced apart. The air outlet of the first air-blowing element is connected to each of the first channels, the air outlet of the second air-blowing element is connected to each of the first channels, the air outlet of the third air-blowing element is connected to each of the second channels, and the air outlet of the fourth air-blowing element is connected to each of the second channels.

[0010] In an exemplary embodiment, the accommodating space further includes a first connecting channel, a second connecting channel, a third connecting channel, and a fourth connecting channel. The first connecting channel and the second connecting channel are opposite to and spaced apart from each other, and the third connecting channel and the fourth connecting channel are opposite to and spaced apart from each other. The first connecting channel communicates with each of the first channels, the second connecting channel communicates with each of the first channels, the third connecting channel communicates with each of the second channels, and the fourth connecting channel communicates with each of the second channels. The first connecting channel also communicates with the fourth connecting channel, and the second connecting channel also communicates with the third connecting channel. The air blowing assembly includes a first air blowing element and a second air blowing element. The air outlet of the first air blowing element is connected to the connection point between the first connecting channel and the fourth connecting channel, and the air outlet of the second air blowing element is connected to the connection point between the second connecting channel and the third connecting channel.

[0011] In an exemplary embodiment, the microfluidic chip further includes multiple flexible components. Multiple flexible components are disposed within each first channel and within each second channel. Each flexible component includes a first flexible element and a second flexible element. The first flexible element is disposed on the first substrate, and the second flexible element is disposed on the second substrate. The flexible component is used to receive air blown by the air blowing component, causing the first flexible element and the second flexible element to separate. The droplet is used to block the air blowing.

[0012] In an exemplary embodiment, the microfluidic chip further includes a power supply and current detection unit. The first flexible element of each flexible component is electrically connected to the power supply, and the second flexible element of each flexible component is electrically connected to the current detection unit. The current detection unit is used to detect whether all of the multiple flexible components within each first channel are conductive.

[0013] In an exemplary embodiment, both the first flexible member and the second flexible member are made of polyimide and indium tin oxide.

[0014] In an exemplary embodiment, the first substrate includes a first base, a driving circuit layer, a plurality of driving electrodes, and a first hydrophobic layer. The driving circuit layer is disposed on the first base, and the first hydrophobic layer is disposed on the surface of the driving circuit layer opposite to the first base, and the first hydrophobic layer covers the plurality of driving electrodes to the surface of the driving circuit layer opposite to the first base. The surface of the first hydrophobic layer opposite to the driving circuit layer faces the second substrate.

[0015] In an exemplary embodiment, the second substrate includes a second base, a common electrode, and a second hydrophobic layer. The common electrode is disposed on a surface of the second base, and the second hydrophobic layer is disposed on the surface of the common electrode facing away from the second base. The surface of the second hydrophobic layer facing away from the common electrode faces the first substrate, and the second hydrophobic layer and the first hydrophobic layer are disposed opposite to and spaced apart from each other, forming the accommodating space.

[0016] In an exemplary embodiment, the contact angle of the droplet on the first hydrophobic layer is greater than 90 degrees, and the contact angle of the droplet on the second hydrophobic layer is greater than 90 degrees. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 is a schematic diagram of the first layer structure of the microfluidic chip disclosed in the embodiments of this application;

[0019] Figure 2 is a first top view of the microfluidic chip disclosed in the embodiments of this application;

[0020] Figure 3 is a cross-sectional schematic diagram of the microfluidic chip shown in Figure 2 along direction II;

[0021] Figure 4 is a top view schematic diagram of the second type of microfluidic chip disclosed in the embodiments of this application;

[0022] Figure 5 is a schematic diagram of the second layer structure of the microfluidic chip disclosed in the embodiments of this application;

[0023] Figure 6 is a schematic diagram of the first working state of the flexible component in the first channel;

[0024] Figure 7 is a schematic diagram of the second working state of the flexible component in the first channel;

[0025] Figure 8 is a schematic diagram of the electrical connection architecture of the flexible component disclosed in the embodiments of this application.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1-Microfluidic chip; 1a-Accommodation space; 2-Droplet; 2a-First sub-droplet; 2b-Second sub-droplet;

[0028] 10-First substrate; 11-First base; 12-Driving circuit layer; 13-Driving electrode; 13a-First driving electrode

[0029] Electrode; 13b-Second driving electrode; 14-First hydrophobic layer; 20-Second substrate; 21-Second base; 22-Common electrode; 23-Second hydrophobic layer; 30-Blowing assembly; 31-Blowing element; 31a-First blowing element; 31b-Second blowing element; 31c-Third blowing element; 31d-Fourth blowing element; 40-Block; a1-First channel; a2-Second channel; b1-First connecting channel; b2-Second connecting channel; b3-Third connecting channel; b4-Fourth connecting channel; 50-Flexible component; 50a-First flexible component; 50b-Second flexible component; 51-First flexible element; 52-Second flexible element; 60-Power supply; 70-Current detection unit. Detailed Implementation

[0030] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0031] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. The component designations used herein, such as "first," "second," etc., are merely for distinguishing the described objects and do not have any sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages). Directional terms used in this application, such as "up," "down," "front," "rear," "left," "right," "inner," "outer," and "side," are also used.

[0032] The terms "face" and "side" are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for the purpose of better and clearer explanation and understanding of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising," "may include," "include," or "may include" used in this application indicate the presence of the corresponding disclosed function, operation, element, etc., and do not limit one or more other functions, operations, elements, etc. Moreover, the terms "comprising" or "include" indicate the presence of the corresponding features, number, steps, operations, elements, components, or combinations thereof disclosed in the specification, but do not exclude the presence or addition of one or more other features, number, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusion. It is also important to understand that “at least one” as described in this article means one or more, such as one, two or three, while “multiple” means at least two, such as two or three, unless otherwise explicitly specified.

[0034] The terms "parallel" and "perpendicular" are relative to the current technological level, not absolute mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, with the angle between them ranging from 0 to 5 degrees. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, with the angle between them ranging from 85 to 95 degrees.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0036] Microfluidic chips are applied in fields such as drug screening, microbial identification, and medical devices, and have advantages such as high throughput, high speed, low power consumption, and low material consumption. Please refer to Figure 1, which is a schematic diagram of the first layer structure of the microfluidic chip disclosed in this application embodiment. The microfluidic chip 1 of this application embodiment includes a first substrate 10, a second substrate 20, and an air blowing assembly 30. The first substrate 10 and the second substrate 20 are opposite to each other and spaced apart. The air blowing assembly 30 is disposed on the periphery of the first substrate 10 and the periphery of the second substrate 20. The first substrate 10 and the second substrate 20 form a accommodating space 1a, which is used to accommodate a droplet 2. The air outlet of the air blowing assembly 30 communicates with the accommodating space 1a. The first substrate 10 and the second substrate 20 are used to form a preset electric field. The air blowing assembly 30 is used to blow air onto the droplet 2. The preset electric field and the air blowing assembly 30 together drive the droplet 2 to move within the accommodating space 1a.

[0037] It should be noted that in this embodiment, without the air blowing component 30, the droplet 2 cannot be driven to move solely by a preset electric field. Without the preset electric field, the droplet 2 cannot be driven to move solely by the air blowing component 30.

[0038] For ease of description, the width direction of the microfluidic chip 1 is defined as the X-axis, the length direction of the microfluidic chip 1 is defined as the Y-axis, and the height direction of the microfluidic chip 1 is defined as the Z-axis. The X-axis, Y-axis, and Z-axis are all mutually perpendicular.

[0039] In this embodiment, the first substrate 10 and the second substrate 20 are disposed and spaced apart along the Z-axis. In this embodiment, the first substrate 10 includes a first base 11, a driving circuit layer 12, a plurality of driving electrodes 13, and a first hydrophobic layer 14. The driving circuit layer 12 is disposed on the surface of the first base 11 facing the Z-axis. The plurality of driving electrodes 13 are arranged in an array and spaced apart from each other; that is, the plurality of driving electrodes 13 are arranged in multiple rows along the X-axis, with the plurality of driving electrodes 13 in each row spaced apart from each other, and the plurality of driving electrodes 13 are arranged in multiple columns along the Y-axis, with the plurality of driving electrodes 13 in each column spaced apart from each other. A plurality of driving electrodes 13 are disposed on the surface of the driving circuit layer 12 opposite to the first substrate 11, and a first hydrophobic layer 14 is disposed on the surface of the driving circuit layer 12 opposite to the first substrate 11, and the first hydrophobic layer 14 covers the plurality of driving electrodes 13, that is, the first hydrophobic layer 14 covers the plurality of driving electrodes 13 onto the driving circuit layer 12, and the surface of the first hydrophobic layer 14 opposite to the driving circuit layer 12 faces the second substrate 20.

[0040] The driving circuit layer 12 is connected and electrically connected to the plurality of driving electrodes 13, and the driving circuit layer 12 is used to provide voltage to the driving electrodes 13. The first hydrophobic layer 14 is hydrophobic to the droplet 2, reducing the contact area between the droplet 2 and the first hydrophobic layer 14, which is beneficial for driving the droplet 2 to move on the surface of the first hydrophobic layer 14. The first hydrophobic layer 14 also serves to insulate the droplet 2 from the driving electrodes 13.

[0041] In an exemplary embodiment, the driving circuit layer 12 provides a driving voltage to the driving electrode 13 in an active driving manner. Active driving means that the driving circuit layer 12 equips each driving electrode 13 with a thin film transistor (TFT) with a switching function.

[0042] In an exemplary embodiment, the contact angle of the droplet 2 on the first hydrophobic layer 14 is greater than 90 degrees, for example, 91 degrees, 100 degrees, 109 degrees, 120 degrees, 124 degrees, 140 degrees, 145 degrees, 155 degrees, or other values. This application does not impose specific limitations on this.

[0043] In this embodiment, the second substrate 20 includes a second base 21, a common electrode 22, and a second hydrophobic layer 23. The common electrode 22 is disposed on the surface of the second base 21 facing away from the Z-axis, and the second hydrophobic layer 23 is disposed on the surface of the common electrode 22 facing away from the second base 21. The first hydrophobic layer 14 and the second hydrophobic layer 23 are disposed opposite to each other and spaced apart, forming the accommodating space a. The common electrode 22 and the driving electrode 13 are used to form the preset electric field. The second hydrophobic layer 23 is hydrophobic to the droplet 2, reducing the contact area between the droplet 2 and the second hydrophobic layer 23, which is beneficial for the movement of the droplet 2 within the accommodating space a and for maintaining the shape of the droplet 2. The second hydrophobic layer 23 also serves to insulate the droplet 2 from the common electrode 22.

[0044] In an exemplary embodiment, the contact angle of the droplet 2 on the second hydrophobic layer 23 is greater than 90 degrees, for example, 93 degrees, 107 degrees, 110 degrees, 116 degrees, 125 degrees, 130 degrees, 140 degrees, 153 degrees, or other values. This application does not impose specific limitations on this.

[0045] In this embodiment, the droplet 2 contacts both the first hydrophobic layer 14 and the second hydrophobic layer 23. The driving electrode 13 and the common electrode 22 are used to form a preset electric field, which is used to change the surface tension of the droplet 2, thereby changing the contact angle (i.e., wetting angle) of the droplet 2 in the first hydrophobic layer 14, so that the droplet 2 can move within the accommodating space a.

[0046] The following example illustrates the process using multiple driving electrodes 13, including a first driving electrode 13a and a second driving electrode 13b, and the droplet to be analyzed 2, including a first sub-droplet 2a and a second sub-droplet 2b. The first sub-droplet 2a is the portion of the droplet 2 facing the X-axis, and the second sub-droplet 2b is the portion of the droplet 2 facing away from the X-axis. The first driving electrode 13a and the second driving electrode 13b are adjacent and spaced apart. The first sub-droplet 2a is above the first driving electrode 13a, meaning its orthographic projection on the first hydrophobic layer 14 coincides with the orthographic projection of the first driving electrode 13a on the first hydrophobic layer 14. The second sub-droplet 2b is above the second driving electrode 13b, meaning its orthographic projection on the first hydrophobic layer 14 coincides with the orthographic projection of the second driving electrode 13b on the first hydrophobic layer 14. The X-axis direction and the direction away from the X-axis are opposite.

[0047] The first driving electrode 13a and the common electrode 22 form the preset electric field, the surface tension of the first sub-droplet 2a decreases, the contact angle of the first sub-droplet 2a in the first hydrophobic layer 14 increases, that is, the first sub-droplet 2a has a tendency to move in the X-axis direction, so that the droplet 2 as a whole has a tendency to move in the X-axis direction.

[0048] The above description illustrates how the first driving electrode 13a and the common electrode 22 form a preset electric field, causing the droplet 2 to tend to move in the X-axis direction. Simultaneously, the air blowing assembly 30 provides gas moving in the X-axis direction, driving the droplet 2 to move in that direction as well. The first driving electrode 13a and the air blowing assembly 30 jointly drive the droplet 2 to move in the X-axis direction. That is, the preset electric field generates a driving force that propels the droplet 2 in the X-axis direction, and the gas provided by the air blowing assembly 30 generates another driving force that propels the droplet 2 in the X-axis direction. Under the combined action of these two driving forces, the droplet 2 moves in the X-axis direction.

[0049] The second driving electrode 13b and the common electrode 22 form a preset electric field, the surface tension of the second sub-droplet 2b decreases, and the contact angle of the second sub-droplet 2b in the first hydrophobic layer 14 increases, that is, the second sub-droplet 2b has a tendency to move away from the X-axis direction, so that the droplet 2 as a whole has a tendency to move away from the X-axis direction.

[0050] The above description illustrates how the second driving electrode 13b and the common electrode 22 form a preset electric field, causing the droplet 2 to tend to move away from the X-axis. Simultaneously, the air blowing assembly 30 provides gas that moves away from the X-axis, further driving the droplet 2 in this direction. The second driving electrode 13b and the air blowing assembly 30 jointly drive the droplet 2 to move away from the X-axis. In other words, the preset electric field creates a driving force that propels the droplet 2 away from the X-axis, and the gas provided by the air blowing assembly 30 also creates a driving force that propels the droplet 2 away from the X-axis. Under the combined action of these two driving forces, the droplet 2 moves away from the X-axis.

[0051] Understandably, the driving electrode 13 drives the flow of the droplet 2, and its voltage is generally around 100V. Higher voltages can easily damage the TFT devices within the driving circuit layer 12, thereby reducing the lifespan of the microfluidic chip 1. Therefore, this application uses the air blowing assembly 30 and the driving electrode 13 to jointly drive the movement of the droplet 2, reducing the voltage of the driving electrode 13, thus avoiding damage to the TFT devices within the driving circuit layer 12 due to higher voltages, and improving the lifespan of the microfluidic chip 1.

[0052] Please refer to Figures 2 and 3. Figure 2 is a first top view of the microfluidic chip disclosed in this application embodiment, and Figure 3 is a cross-sectional view of the microfluidic chip shown in Figure 2 along the II direction. The microfluidic chip 1 further includes a plurality of baffles 40, which are spaced apart from each other and arranged in an array. That is, the baffles 40 are arranged in multiple rows along the X-axis and in multiple columns along the Y-axis. The baffles 40 arranged in a row are spaced apart from each other, and the baffles 40 arranged in a column are spaced apart from each other. The baffles 40 are disposed between the first substrate 10 and the second substrate 20.

[0053] The accommodating space 'a' includes multiple first channels 'a1' and multiple second channels 'a2'. The dotted lines in Figure 2 show the positions of the first channels 'a1' and the second channels 'a2'. The multiple first channels 'a1' are arranged sequentially along the Y-axis and spaced apart from each other. Each first channel 'a' extends along the X-axis; that is, the multiple first channels 'a1' are distributed in multiple rows along the X-axis and spaced apart sequentially along the Y-axis. The multiple second channels 'a2' are arranged sequentially along the X-axis and spaced apart from each other. Each second channel 'a2' extends along the Y-axis; that is, the multiple second channels 'a2' are distributed in multiple columns along the Y-axis and spaced apart sequentially along the X-axis. One first channel 'a1' is connected to multiple second channels 'a2', and one second channel 'a2' is connected to multiple first channels 'a1'.

[0054] The baffle 40 serves as the channel wall for both the first channel a1 and the second channel a2. In other words, the baffle 40 divides the accommodating space a into multiple first channels a1 and multiple second channels a2. The baffle 40 prevents the droplet 2 from moving, allowing the droplet 2 to move within both the multiple first channels a1 and the multiple second channels b2.

[0055] It should be noted that the baffle 40 and the driving electrode 13 are not directly visible in Figure 2. For ease of illustration, the positions of the baffle 40 and the driving electrode 13 are shown with dashed lines in Figure 2. The number of baffles 40 and the driving electrode 13, as well as the distribution density of the baffles 40 and the driving electrode 13 in Figure 2, are merely examples. The number of baffles 40 and the driving electrode 13, as well as the distribution density of the baffles 40 and the driving electrode 13 in the microfluidic chip 1, can be adaptively changed according to the parameters and physical properties of the droplet and the function of the microfluidic chip 1. This application does not impose specific limitations in this regard.

[0056] In an exemplary embodiment, the orthographic projection of the driving electrode 13 in the Z-axis direction is spaced apart from the orthographic projection of the retaining wall 40 in the Z-axis direction.

[0057] In an exemplary embodiment, the material of the retaining wall 40 includes polyimide (PI).

[0058] In an exemplary embodiment, the first substrate 10 is generally rectangular, and the second substrate 20 is generally rectangular.

[0059] In this embodiment of the application, the air blowing assembly 30 includes four air blowing elements 31, which are arranged around the periphery of the first substrate 10 and around the periphery of the second substrate 20.

[0060] Taking four air-blowing components 31 as an example, namely the first air-blowing component 31a, the second air-blowing component 31b, the third air-blowing component 31c, and the fourth air-blowing component 31d, the air-blowing assembly 30 includes the first air-blowing component 31a, the second air-blowing component 31b, the third air-blowing component 31c, and the fourth air-blowing component 31d. The first air-blowing component 31a and the second air-blowing component 31b are arranged opposite to each other and spaced apart along the X-axis, and the third air-blowing component 31c and the fourth air-blowing component 31d are arranged opposite to each other and spaced apart along the X-axis.

[0061] The first air-blowing member 31a is disposed on the surface of the first substrate 10 facing the X-axis direction, and the air outlet of the first air-blowing member 31a is connected to each of the first channels a1. The second air-blowing member 31b is disposed on the surface of the first substrate 10 opposite to the X-axis direction, and the air outlet of the second air-blowing member 31b is connected to each of the first channels a1. The third air-blowing member 31c is disposed on the surface of the first substrate 10 facing the Y-axis direction, and the air outlet of the third air-blowing member 31c is connected to each of the second channels a2. The fourth air-blowing member 31d is disposed on the surface of the first substrate 10 opposite to the Y-axis direction, and the air outlet of the fourth air-blowing member 31d is connected to each of the second channels a2.

[0062] If it is necessary to drive the droplet 2 to move in the X-axis direction, the second air blowing member 31b blows air into the plurality of first channels a1. If it is necessary to drive the droplet 2 to move away from the X-axis direction, the first air blowing member 31a blows air into the plurality of first channels a1. If it is necessary to drive the droplet 2 to move in the Y-axis direction, the fourth air blowing member 31d blows air into the plurality of second channels a2. If it is necessary to drive the droplet 2 to move away from the Y-axis direction, the third air blowing member 31c blows air into the plurality of second channels a2.

[0063] In an exemplary embodiment, the first channel a1 has two air inlets, which are arranged opposite to each other along the X-axis. Both air inlets of the first channel a1 are trumpet-shaped, which helps to concentrate the gas blown out by the air blowing element 31. The second channel a2 also has two air inlets, which are arranged opposite to each other along the Y-axis. Both air inlets of the second channel a2 are trumpet-shaped, which also helps to concentrate the gas blown out by the air blowing element 31.

[0064] Please refer to Figure 4, which is a second top view schematic diagram of the microfluidic chip disclosed in this application embodiment. The difference between the microfluidic chip shown in Figure 4 and the microfluidic chip shown in Figure 2 is that the number of air blowing elements 31 is two. For a description of the structural similarities between the microfluidic chip shown in Figure 4 and the microfluidic chip shown in Figure 2, please refer to the relevant description in Figure 2, which will not be repeated here.

[0065] Specifically, the accommodating space a further includes a first connecting channel b1, a second connecting channel b2, a third connecting channel b3, and a fourth connecting channel b4. The dotted lines in Figure 4 show the positions of the first channel a1, the second channel a2, the first connecting channel b1, the second connecting channel b2, the third connecting channel b3, and the fourth connecting channel b4.

[0066] The first connecting channel b1 and the second connecting channel b2 are positioned opposite each other and spaced apart along the X-axis, and both the first connecting channel b1 and the second connecting channel b2 extend along the Y-axis. The third connecting channel b3 and the fourth connecting channel b4 are positioned opposite each other and spaced apart along the Y-axis, and both the third connecting channel b3 and the fourth connecting channel b4 extend along the X-axis.

[0067] The first connecting channel b1 is respectively disposed at the air inlet of each first channel a1 facing the X-axis, and the first connecting channel b1 is connected to each first channel a1. The second connecting channel b2 is respectively disposed at the air inlet of each first channel a1 facing away from the X-axis, and the second connecting channel b2 is connected to each first channel a1. The third connecting channel b3 is respectively disposed at the air inlet of each second channel a2 facing the Y-axis, and the third connecting channel b3 is connected to each second channel a2. The fourth connecting channel b4 is respectively disposed at the air inlet of each second channel a2 facing away from the Y-axis, and the fourth connecting channel b4 is connected to each second channel a2.

[0068] The first connection channel b1 is also connected to the fourth connection channel b4, and the second connection channel b2 is also connected to the third connection channel b3.

[0069] The first air blowing element 31a and the second air blowing element 31b are arranged diagonally, that is, the line connecting the first air blowing element 31a and the second air blowing element 31b forms an angle with the X-axis and the Y-axis, respectively. The first air blowing element 31a is located at the junction of the first connecting channel b1 and the fourth connecting channel b4, and the air outlet of the first air blowing element 31a is connected to both the first connecting channel b1 and the fourth connecting channel b4. The second air blowing element 31b is located at the junction of the second connecting channel b2 and the third connecting channel b3, and the air outlet of the second air blowing element 31b is connected to both the second connecting channel b2 and the third connecting channel b3.

[0070] If the droplet 2 needs to move in the Y-axis direction, the first air blowing element 31a blows air; if the droplet 2 needs to move away from the X-axis direction, the first air blowing element 31a blows air. If the droplet 2 needs to move in the X-axis direction, the second air blowing element 31b blows air; if the droplet 2 needs to move away from the Y-axis direction, the second air blowing element 31b blows air.

[0071] Understandably, one air-blowing component blows air simultaneously into both the first and second channels a1 and a2 via the first connecting channel b1 and the second connecting channel b2, enabling one air-blowing component to blow air in two directions simultaneously. Another air-blowing component blows air simultaneously into both the first and second channels a1 and a2 via the third connecting channel b3 and the fourth connecting channel b4, enabling one air-blowing component to blow air in two directions simultaneously. Therefore, by additionally setting the first connecting channel b1, the second connecting channel b2, the third connecting channel b3, and the fourth connecting channel b4, only two air-blowing components are needed to achieve air blowing in four directions, reducing the number of air-blowing components and saving costs.

[0072] Please refer to Figure 5, which is a schematic diagram of the second layer structure of the microfluidic chip disclosed in this application embodiment. The difference between the microfluidic chip 1 shown in Figure 5 and the microfluidic chip 1 shown in Figure 3 is that the microfluidic chip shown in Figure 5 also includes multiple flexible components 50. For a description of the structural similarities between the microfluidic chip 1 shown in Figure 5 and the microfluidic chip 1 shown in Figure 3, please refer to the relevant description in Figure 3, which will not be repeated here.

[0073] In this embodiment of the application, a plurality of flexible components 50 are disposed in each first channel a1 and a plurality of flexible components 50 are disposed in each second channel a2. Each flexible component 50 includes a first flexible element 51 and a second flexible element 52. The first flexible element 51 is disposed on the first hydrophobic layer 14 of the first substrate 10, and the second flexible element 52 is disposed on the second hydrophobic layer 23 of the second substrate 20.

[0074] In an exemplary embodiment, when the air blowing element 31 does not provide gas, the first flexible element 51 and the second flexible element 52 are connected and electrically conductive. The flexible component 50 receives the air blowing from the air blowing element 31, and the first flexible element 51 and the second flexible element 52 are separated, with an open circuit between them, i.e., no electrical connection between them. The droplet 2 is used to block the air blowing from the air blowing element.

[0075] For example, please refer to Figures 6 and 7. Figure 6 is a schematic diagram of the first working state of the flexible component in the first channel, and Figure 7 is a schematic diagram of the second working state of the flexible component in the first channel. In Figure 6, the first channel a1 contains no droplet 2, while in Figure 7, the first channel a1 contains droplet 2. The first channels a1 shown in Figure 6 and Figure 7 can be any two of the first channels a1 in Figure 2, or any two of the first channels a1 in Figure 4.

[0076] For example, the arrow in Figure 6 indicates the blowing direction. The blowing component 31 provides air blowing away from the X-axis direction. Since the droplet 2 is not within the first channel a1 shown in Figure 6, the first flexible component 51 and the second flexible component 52 of all flexible components 50 within the first channel a1 in Figure 6 are separated. It should be noted that after the blowing ends, under the action of gravity, the first flexible component 51 and the second flexible component 52 reconnect and become conductive.

[0077] The arrow in Figure 7 indicates the blowing direction. The blowing component 31 provides blowing air away from the X-axis direction. Since the droplet 2 blocks the blowing air, the first flexible component 51 and the second flexible component 52 of the first flexible component 50 in the first channel a1 are separated, and the first flexible component 51 and the second flexible component 52 of the second flexible component 50 are connected.

[0078] Understandably, the location of droplet 2 within a specific first channel a1 can be determined by checking whether the first flexible element 51 and the second flexible element 52 of all flexible components 50 within the first channel a1 have completely separated. Similarly, the location of droplet 2 within a specific second channel a2 can be determined by checking whether the first flexible element 51 and the second flexible element 52 of all flexible components 50 within the second channel a2 have completely separated. Therefore, the intersection of a specific first channel a1 and a specific second channel a2 is the location of droplet 2.

[0079] In an exemplary embodiment, please refer to Figures 7 and 8. Figure 8 is a schematic diagram of the electrical connection architecture of the flexible component disclosed in this application embodiment. The microfluidic chip 1 further includes a power supply 60 and a current detection unit 70. The first flexible element 51 of each flexible component 50 is electrically connected to the power supply 60, and the second flexible element 52 of each flexible component 50 is electrically connected to the current detection unit 70. The current detection unit 70 is used to detect whether all of the multiple flexible components 50 in each first channel a1 are conductive. If not all of the multiple flexible components 50 in a certain first channel a1 are conductive, then the droplet 2 is in that first channel a1.

[0080] The current detection unit 70 is also used to detect whether all the flexible components 50 in each second channel a2 are turned on. If all the flexible components 50 in a certain second channel a2 are not turned on, the droplet 2 is in that second channel a2.

[0081] Understandably, in order to perform further manipulation or processing on the droplet 2, the microfluidic chip 1 needs to detect the position of the droplet 2 in real time. This application uses a current detection unit 70 to detect the droplet 2 within a certain first channel a1 and a certain second channel a2, thereby detecting the specific position of the droplet 2. The intersection of the first channel a1 and the second channel a2 where the droplet 2 is located is the specific position of the droplet 2.

[0082] It should be noted that the flow rate of the air provided by the air blowing component 31 needs to be limited within a preset flow rate range in order to achieve the above-mentioned scheme for detecting the position of the droplet 2. For example, if the flow rate of the air provided by the air blowing component 31 is too low, the air blowing will not be able to separate the first flexible component 51 and the second flexible component 52 of all flexible components 50 in the first channel a1 shown in FIG. 6. If the flow rate of the air blowing component 31 is too high, the air blowing may separate the first flexible component 51 and the second flexible component 52 of all flexible components 50 in the first channel a1 shown in FIG. 7.

[0083] In an exemplary embodiment, the materials of the first flexible member 51 and the second flexible member 52 both include polyimide and indium tin oxide. The polyimide gives the first flexible member 51 and the second flexible member 52 a certain degree of flexibility, and the indium tin oxide gives the first flexible member 51 and the second flexible member 52 conductive properties.

[0084] In an exemplary embodiment, the number of flexible components 50 in each first channel a1 can be 2, 5, 7, 10, or other numbers, and this application does not impose a specific limitation thereon. The number of flexible components 50 in each second channel a2 can be 2, 5, 7, 10, or other numbers, and this application does not impose a specific limitation thereon.

[0085] In summary, the microfluidic chip 1 provided in this application includes a first substrate 10, a second substrate 20, and an air blowing assembly 30. The first substrate 10 and the second substrate 20 are arranged opposite to each other and spaced apart, forming a receiving space a, in which the droplet 2 is received. The air blowing assembly 30 is disposed on the periphery of the first substrate 10 and the second substrate 20, and the air outlet of the air blowing assembly 30 is connected to the receiving space a. The first substrate 10 and the second substrate 20 are used to form a preset electric field, and the air blowing assembly 30 is used to blow air onto the droplet 2. The preset electric field and the air blowing assembly 30 together drive the droplet 2 to move on the first substrate 10. In the prior art, the driving electrode is used to drive the droplet flow, and its voltage is generally around 100V. Higher voltages can easily damage the TFT devices in the driving circuit layer, thereby reducing the service life of the microfluidic chip. Therefore, this application reduces the voltage of the driving electrode 13 by having the air blowing assembly 30 and the driving electrode 13 work together to drive the droplet 2, thereby avoiding damage to the TFT device in the driving circuit layer 12 caused by high voltage and improving the service life of the microfluidic chip 1.

[0086] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0087] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments, and making equivalent changes according to the claims of this application, still falls within the scope of this application.

Claims

1. A microfluidic chip for containing droplets, characterized in that, The microfluidic chip includes a first substrate, a second substrate, and an air blowing component. The first substrate and the second substrate are opposite to each other and spaced apart, forming a receiving space for accommodating the droplet. The air blowing component is disposed around the periphery of the first substrate and the second substrate, and its outlet communicates with the receiving space. The first substrate and the second substrate form a preset electric field, and the air blowing component blows air onto the droplet. The preset electric field and the air blowing component together drive the droplet to move on the first substrate. The microfluidic chip also includes multiple baffles and multiple flexible components. The baffles are spaced apart from each other and arranged in an array, and the multiple baffles protect the droplet from the liquid. The accommodating space forms multiple first channels and multiple second channels. The multiple first channels are arranged in multiple rows and are spaced apart sequentially. The multiple second channels are arranged in multiple columns and are spaced apart sequentially. The droplet moves within the multiple first channels and multiple second channels. Each first channel is provided with multiple flexible components, and each second channel is provided with multiple flexible components. Each flexible component includes a first flexible element and a second flexible element. The first flexible element is disposed on the first substrate, and the second flexible element is disposed on the second substrate. The flexible component is used to receive air blown by the air blowing component, causing the first flexible element and the second flexible element to separate. The droplet is used to block the air blowing.

2. The microfluidic chip as described in claim 1, characterized in that, Multiple barriers are disposed between the first substrate and the second substrate.

3. The microfluidic chip as described in claim 2, characterized in that, The air blowing assembly includes a first air blowing element, a second air blowing element, a third air blowing element, and a fourth air blowing element. The first air blowing element and the second air blowing element are opposite to each other and spaced apart. The third air blowing element and the fourth air blowing element are opposite to each other and spaced apart. The air outlet of the first air blowing element is connected to each of the first channels. The air outlet of the second air blowing element is connected to each of the first channels. The air outlet of the third air blowing element is connected to each of the second channels. The air outlet of the fourth air blowing element is connected to each of the second channels.

4. The microfluidic chip as described in claim 2, characterized in that, The accommodating space further includes a first connecting channel, a second connecting channel, a third connecting channel, and a fourth connecting channel. The first connecting channel and the second connecting channel are opposite to each other and spaced apart. The third connecting channel and the fourth connecting channel are opposite to each other and spaced apart. The first connecting channel is connected to each of the first channels, the second connecting channel is connected to each of the first channels, the third connecting channel is connected to each of the second channels, and the fourth connecting channel is connected to each of the second channels. The first connecting channel is also connected to the fourth connecting channel, and the second connecting channel is also connected to the third connecting channel. The air blowing assembly includes a first air blowing element and a second air blowing element. The air outlet of the first air blowing element is connected to the connection between the first connecting channel and the fourth connecting channel, and the air outlet of the second air blowing element is connected to the connection between the second connecting channel and the third connecting channel.

5. The microfluidic chip as described in claim 2, characterized in that, The microfluidic chip also includes a power supply and current detection unit. The first flexible element of each flexible component is electrically connected to the power supply, and the second flexible element of each flexible component is electrically connected to the current detection unit. The current detection unit is used to detect whether all of the multiple flexible components in each first channel are turned on.

6. The microfluidic chip as described in claim 2, characterized in that, Both the first flexible component and the second flexible component are made of polyimide and indium tin oxide.

7. The microfluidic chip according to any one of claims 1-6, characterized in that, The first substrate includes a first base, a driving circuit layer, a plurality of driving electrodes and a first hydrophobic layer. The driving circuit layer is disposed on the first base. The first hydrophobic layer is disposed on the surface of the driving circuit layer opposite to the first base. The first hydrophobic layer covers the plurality of driving electrodes to the surface of the driving circuit layer opposite to the first base. The surface of the first hydrophobic layer opposite to the driving circuit layer faces the second substrate.

8. The microfluidic chip as described in claim 7, characterized in that, The second substrate includes a second base, a common electrode, and a second hydrophobic layer. The common electrode is disposed on a surface of the second base, and the second hydrophobic layer is disposed on the surface of the common electrode facing away from the second base. The surface of the second hydrophobic layer facing away from the common electrode faces the first substrate. The second hydrophobic layer and the first hydrophobic layer are opposite to each other and spaced apart, forming the accommodating space.

9. The microfluidic chip as described in claim 8, characterized in that, The contact angle of the droplet on the first hydrophobic layer is greater than 90 degrees, and the contact angle of the droplet on the second hydrophobic layer is greater than 90 degrees.

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