Multifunctional wafer measuring and sorting device

Abstract

The invention discloses a wafer multifunctional measuring and sorting device which comprises a conveying platform, a double-belt conveying module, a feeding module, a first feeding module, a second feeding module, a centering module, a detecting module and a sorting module. Wherein the conveying platform is provided with a pair of parallel first limiting grooves; the double-belt conveying module is arranged on the conveying platform; the feeding module and the double-belt conveying module are arranged adjacently and are used for providing wafers; the first loading module is connected with the material supply module and is used for sending out the wafers in the material supply module; the wafer conveying module is connected with the first feeding module and used for conveying wafers to the double-belt conveying module; the centering module is arranged on the conveying platform and is used for centering the wafer; the detection module is arranged on the conveying platform and is used for detecting the performance of the wafer; and the sorting module is connected with the detection module and is used for separately storing the wafers. According to the invention, automatic and stable conveying of wafers, accurate detection of various performances and automatic sorting of qualified and unqualified wafers can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and particularly relates to a wafer multi-functional measurement and sorting device. Background Art

[0002] In the process of semiconductor manufacturing, the wafer is an important basic material, and its performance directly affects the quality and performance of semiconductor devices. In order to ensure that the produced semiconductor devices meet the quality standards, it is necessary to accurately measure multiple performance indicators of the wafer and effectively sort the qualified wafers from the unqualified wafers.

[0003] At present, there are many problems with the existing wafer measurement and sorting equipment. Most enterprises still use the method of manually placing wafers one by one on the belt conveying mechanism during wafer detection feeding, and then the belt conveying mechanism conveys the wafers to each detection position for detection. This traditional manual feeding mode has significant defects: firstly, the manual operation efficiency is extremely low, which is difficult to meet the high-efficiency production requirements of large-scale wafer detection and seriously restricts the overall detection progress; secondly, during the process of manually placing wafers, it is easy to cause collisions of wafers, which not only affects the detection accuracy but also may cause wafer damage and increase production costs.

[0004] Secondly, in the process of wafer production and manufacturing, the wafer conveyor is a key device for realizing the automatic transmission of wafers. As an important transmission component of the wafer conveyor, the tension of the belt directly affects the stability and accuracy of wafer transmission. If the belt tension is insufficient, slipping is likely to occur, resulting in deviation of the wafer transmission position and even causing wafer dropping and damage; while if the tension is too large, it will increase the wear of the belt and transmission components and shorten the service life of the equipment. The existing belt tensioning mechanism of the wafer conveyor has problems such as inconvenient adjustment and unstable tensioning effect, and it is difficult to meet the increasingly high wafer production requirements.

[0005] In addition, a pre - centering and positioning system for a semiconductor wafer testing system disclosed in a Chinese patent document with the publication number CN201859153U includes a signal sensing module, which includes a test platform, a shading photoelectric sensor, a reflective photoelectric sensor, and a stepping motor; a signal processing and operation module, which includes a signal processing module, an analog - to - digital conversion module, a microprocessor, a stepping motor driver, a solenoid valve driver, and an Ethernet interface; and a mechanical execution module, which includes a chuck, an X - direction limit sensor, a Z - direction limit sensor, a vacuum solenoid valve, and three stepping motors for respectively controlling the X - direction, Z - direction, and rotational movements of the chuck. Among them, the signal sensing module is connected to the signal processing and operation module, and the signal processing and operation module is connected to the mechanical execution module. The pre - centering and positioning system for the semiconductor wafer testing system in this patent can be applied to the precise centering of semiconductor wafers with various thicknesses, sizes, and weights, and has characteristics such as non - contact, fast, accurate, and flexible. However, due to the involvement of multiple intelligent modules in this device, the cost is relatively high. If a centering module with a lower cost can be developed for replacement, the overall device cost will be greatly reduced. Summary of the Invention

[0006] According to an embodiment of the present invention, there is provided a wafer multi - functional measurement and sorting device, comprising: A conveying platform, on which a pair of parallel first limiting grooves are provided; A double - belt conveying module, which is arranged on the conveying platform; A feeding module, which is arranged adjacent to the double - belt conveying module and is used for providing wafers; A first loading module, which is connected to the feeding module and is used for sending out the wafers in the feeding module; A second loading module, which is connected to the first loading module and is used for sending the wafers to the double - belt conveying module; A centering module, which is arranged on the conveying platform and is used for centering the wafers; A detection module (prior art), which is arranged on the conveying platform and is used for detecting the performance of the wafers; A sorting module, which is connected to the detection module and is used for separately storing qualified and unqualified wafers.

[0007] Furthermore, the double - belt conveying module includes: A pair of first conveyor belts, which are respectively slidably connected to a pair of first limiting grooves, and the first limiting grooves are used for restricting the positions of the first conveyor belts; A pair of first driving mechanisms, which are respectively arranged at both ends of the conveying platform and are used for driving the first conveyor belts to move; A tensioning mechanism, which is arranged below the conveying platform and is connected to the first conveyor belts and is used for tensioning the first conveyor belts.

[0008] Furthermore, the tensioning mechanism includes: A first fixing bracket; A pair of guide shafts, and both ends of the pair of guide shafts are detachably connected to the first fixing bracket through supports; A sliding bracket, the sliding bracket is slidably connected to the pair of guide shafts, and a pair of first tensioning wheels are arranged on the sliding bracket; A tension spring, one end of the tension spring is connected to the sliding bracket, and the other end is connected to the first fixing bracket; A second fixing bracket, the second fixing bracket is detachably connected to the first fixing bracket, and a pair of second tensioning wheels are arranged on the second fixing bracket.

[0009] Furthermore, the tensioning mechanism further includes: A third fixing bracket, the third fixing bracket is detachably connected to the first fixing bracket, a pair of third tensioning wheels are arranged on the third fixing bracket, and the pair of third tensioning wheels correspond to the pair of first tensioning wheels one by one; A fourth fixing bracket, the fourth fixing bracket is connected to the first fixing bracket; A fourth tensioning wheel, both ends of the fourth tensioning wheel are connected to the fourth fixing bracket; One end of the tension spring is connected to the sliding bracket, and the other end is connected to the fourth tensioning wheel.

[0010] Furthermore, the feeding module includes: A material box, a plurality of inserting slots are arranged on the material box, and the inserting slots are used for placing wafers; a first opening is arranged at the bottom of the material box; A positioning fixture, the positioning fixture is used for positioning the material box, a second opening is arranged on the positioning fixture, and the second opening is connected to the first opening; A linear module, the output end of the linear module is connected to the positioning fixture and can drive the positioning fixture to move up and down.

[0011] Furthermore, a plurality of first positioning steps are symmetrically arranged at the front end of the positioning fixture, and a plurality of second positioning steps are symmetrically arranged at the rear end. The cooperation of the first positioning steps and the second positioning steps can fix the material box on the positioning fixture; a first detection sensor is also arranged on the positioning fixture for detecting whether the material box is placed on the positioning fixture.

[0012] Furthermore, the first loading module includes: A first fixing seat, the first fixing seat is arranged below the positioning fixture; A first rotating shaft, the first rotating shaft is rotatably arranged at one end of the first fixing seat, a first pulley is arranged at each end of the first rotating shaft, and a pair of second pulleys are rotatably arranged at the other end of the first fixing seat, and the second pulleys correspond to the first pulleys; A plurality of second conveyor belts, one end of each second conveyor belt is sleeved on the first pulley, and the other end is sleeved on the second pulley; The second driving mechanism is connected to the first fixing seat, and its output end is connected to the first rotating shaft, capable of driving the first rotating shaft to rotate; The second detection sensor is arranged on the first fixing seat and is used for detecting whether the wafer is in place.

[0013] Furthermore, the second loading module includes: The second fixing seat, which includes a first bottom plate and a pair of first support plates. The pair of first support plates are respectively fixedly connected to the first bottom plate; A pair of avoidance grooves are arranged on the first support plate. The pair of avoidance grooves divide the first support plate into three sections, and a third detection sensor is arranged inside each section of the support plate; A number of third belt pulleys are arranged along the edge of the first support plate; A third conveyor belt is sleeved on the number of third belt pulleys; The second rotating shaft is rotatably connected to the pair of first support plates respectively. A third belt pulley at the corresponding position on each first support plate is sleeved on the second rotating shaft and can rotate following the second rotating shaft; The third driving mechanism is arranged between the pair of first support plates, and its output end is connected to the second rotating shaft, capable of driving the second rotating shaft to rotate; The first lifting mechanism is arranged below the second fixing seat, and its output end is connected to the second fixing seat, capable of driving the second fixing seat to move up and down.

[0014] Furthermore, the detection module includes: a thickness detection mechanism and a resistivity detection mechanism; the thickness detection mechanism and the resistivity detection mechanism are arranged in sequence on the conveying platform.

[0015] Furthermore, the centering module includes: The fifth fixing frame; The fourth driving mechanism is connected to the fifth fixing frame; At least two first clamping components, and the first clamping components are connected to the fourth driving mechanism; At least one second clamping component, and the second clamping component is connected to the fourth driving mechanism; The first clamping components and the second clamping component are arranged in a circular sequence on the fifth fixing frame. The fourth driving mechanism can drive the first clamping components and the second clamping component to clamp the wafer to center the wafer; The first clamping component includes: a first rotating part and a first clamping part; One end of the first rotating part is connected to the output end of the fourth driving mechanism, and the other end is connected to the first clamping part; A rubber sleeve is sleeved on the first clamping part for clamping the wafer; The second clamping assembly includes: a second rotating member, a third rotating member, a second clamping member, and a spring; One end of the second rotating member is connected to the output end of the fourth driving mechanism, and the other end is hinged to the third rotating member; The third rotating member is connected to the second clamping member; A rubber sleeve is sleeved on the second clamping member for clamping the wafer; One end of the spring is connected to the second rotating member, and the other end is connected to the third rotating member, enabling the second clamping member to rotate relative to the second rotating member during the process of clamping the wafer; A second lifting mechanism (which belongs to the prior art) is provided below the conveying platform and can lift the wafer on the double-belt conveying module.

[0016] Furthermore, the sorting module includes: A first blanking module is provided below the output end of the double-belt conveying module for conveying the wafer; the structure of the first blanking module is the same as that of the second loading module; A pair of second blanking modules are symmetrically arranged on both sides of the first blanking module respectively for conveying the wafer; the structure of the second blanking module is the same as that of the first loading module.

[0017] The first blanking module conveys the qualified wafers to one of the second blanking modules and the unqualified wafers to the other second blanking module; A receiving module is further provided at the output end of each second blanking module for collecting the wafers, and the structure of the receiving module is the same as that of the feeding module.

[0018] The beneficial effects of the present invention are as follows: 1. Through the design of the double-belt conveying module, the position of the first conveyor belt is restricted by the first limiting groove, and combined with the innovative tensioning mechanism to ensure the tension degree of the conveyor belt, the stable conveying of the wafer can be realized, effectively avoiding problems such as offset and jitter of the wafer during the conveying process, improving the stability and reliability of the wafer conveying, and further ensuring the accuracy of subsequent detection and sorting. This tensioning mechanism solves the problems of inconvenient belt tension adjustment and unstable effect in the prior art through the elastic automatic adjustment function of the tension spring, keeping the belt tension always within the optimal range, avoiding the slipping phenomenon caused by insufficient tension and preventing component wear caused by excessive tension, thus extending the service life of the equipment.

[0019] 2. The sorting module can automatically separate and store the qualified and unqualified wafers according to the detection results of the detection module, reducing manual participation, improving the automation degree and accuracy of sorting, effectively enhancing the production efficiency of semiconductor manufacturing, and reducing the labor cost and sorting error rate.

[0020] 3. The reasonable design of the feeding module, the first loading module and the second loading module realizes the automatic loading process of the wafer from the material box to the detection module. The modules cooperate with each other to ensure that the wafer can be smoothly and accurately transported to the designated position, solving the problems of low efficiency and easy collision and damage to the wafer in the traditional manual loading mode, and further improving the automation level and work efficiency of the entire device.

[0021] 4. The centering module can not only quickly center the wafer but also prevent the wafer from being pinched, and the overall production cost is reduced through the design of the mechanical structure.

[0022] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a centering module in the prior art according to an embodiment of the present invention; Figure 2 for Figure 1 A is an enlarged view; Figure 3 for Figure 1 B is an enlarged view; Figure 4 for Figure 1 A top view of Figure 5 for Figure 1 A schematic diagram of the structure from another perspective; Figure 6 is a structural schematic diagram of a tensioning mechanism according to an embodiment of the present invention; Figure 7 for Figure 6 A front view of Figure 8 It is a first structural schematic diagram of the cooperation between the feeding module and the first loading module according to an embodiment of the present invention; Figure 9 is a structural schematic diagram of a first loading module according to an embodiment of the present invention; Figure 10 A second structural schematic diagram of the cooperation between the feeding module and the first loading module according to an embodiment of the present invention; Figure 11 It is a schematic diagram of the structure of a pair of first loading modules and a second loading module cooperating with each other according to an embodiment of the present invention; Figure 12 is a schematic structural diagram of a second loading module according to an embodiment of the present invention; Figure 13 It is a schematic diagram of the local structure of the improved centering module according to an embodiment of the present invention; Figure 14Schematic structural diagram of the centering module according to an embodiment of the present invention; Figure 15 is Figure 14 front view; Figure 16 Schematic structural diagram of the centering module when clamping a wafer according to an embodiment of the present invention; Figure 17 Schematic diagram of the cartridge being stuck between the first positioning step and the second positioning step according to an embodiment of the present invention; Figure 18 is Figure 17 top view. Detailed implementation manners

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and the present invention will be further elaborated.

[0025] First, Figures 1 - 18 a wafer multi-functional measurement and sorting device according to an embodiment of the present invention will be described, which is used for wafer detection and has a wide range of application scenarios.

[0026] As Figures 1 - 18 shown, the wafer multi-functional measurement and sorting device according to an embodiment of the present invention includes: a conveying platform 1, on which a pair of parallel first limiting grooves 11 are provided; a double-belt conveying module 2, which is arranged on the conveying platform 1; a feeding module 3, which is arranged adjacent to the double-belt conveying module 2 and is used to provide wafers 9; a first loading module 4, which is connected to the feeding module 3 and is used to send out the wafers 9 in the feeding module 3; a second loading module 5, which is connected to the first loading module 4 and is used to send the wafers 9 to the double-belt conveying module 2; a centering module 8, which is arranged on the conveying platform 1 and is used for centering the wafers 9; a detection module (prior art), which is arranged on the conveying platform 1 and is used to detect the performance of the wafers 9; a sorting module 7, which is connected to the detection module and is used to separately store qualified and unqualified wafers 9.

[0027] Preferably, as Figure 1 shown, in this embodiment, two feeding modules 3 and two first loading modules 4 are selected and symmetrically arranged on both sides of the second loading module 5, and one of the two feeding modules 3 and two first loading modules 4 is used as a backup.

[0028] Furthermore, as Figures 1 - 2, as shown in FIGS. 5, in this embodiment, the double-belt conveying module 2 includes: A pair of first conveyor belts 21, and the pair of first conveyor belts 21 are respectively slidably connected to a pair of first limiting grooves 11, and the first limiting grooves 11 are used to limit the positions of the first conveyor belts 21; A pair of first driving mechanisms 22, and the pair of first driving mechanisms 22 are respectively arranged at both ends of the conveying platform 1 and are used to drive the first conveyor belts 21 to move; A tensioning mechanism 23, and the tensioning mechanism 23 is arranged below the conveying platform 1 and is connected to the first conveyor belts 21 and is used to tension the first conveyor belts 21.

[0029] Further, as Figures 6 - 7 shown, in this embodiment, the tensioning mechanism 23 includes: A first fixing frame 231, and the first fixing frame 231 is arranged below the conveying platform 1 and is fixedly connected to the conveying platform 1; A pair of guide shafts 232, and both ends of the pair of guide shafts 232 are detachably connected to the first fixing frame 231 through supports 2321; A sliding frame 233, and the sliding frame 233 is slidably connected to the pair of guide shafts 232, and a pair of first tensioning wheels 2331 are arranged on the sliding frame 233; A tension spring 234, one end of the tension spring 234 is connected to the sliding frame 233, and the other end is connected to the first fixing frame 231; A second fixing frame 235, and the second fixing frame 235 is detachably connected to the first fixing frame 231, and a pair of second tensioning wheels 2351 are arranged on the second fixing frame 235.

[0030] Further, as Figures 6 - 7 shown, in this embodiment, the tensioning mechanism 23 further includes: A third fixing frame 236, and the third fixing frame 236 is detachably connected to the first fixing frame 231, and a pair of third tensioning wheels 2361 are arranged on the third fixing frame 236, and the pair of third tensioning wheels 2361 correspond to the pair of first tensioning wheels 2331 one by one; A fourth fixing frame 237, and the fourth fixing frame 237 is connected to the first fixing frame 231; A fourth tensioning wheel 2371, and both ends of the fourth tensioning wheel 2371 are connected to the fourth fixing frame 237; One end of the tension spring 234 is connected to the sliding frame 233, and the other end is connected to the fourth tensioning wheel 2371.

[0031] Through the elastic action of the tension spring 234, the position of the sliding bracket 233 can be automatically adjusted, thereby adjusting the tension of the first conveyor belt 21 by the first tension pulley 2331, the second tension pulley 2351, the third tension pulley 2361, and the fourth tension pulley 2371, ensuring that the first conveyor belt 21 always maintains an appropriate tension level and avoiding affecting the conveyance of the wafers 9 due to belt slack. The design of this tensioning mechanism 23 solves the problems of inconvenient belt tension adjustment and unstable effect in the prior art. Through the elastic automatic adjustment of the tension spring 234, the tension can be adjusted in real time according to the actual state of the belt, keeping the belt tension within the optimal range at all times.

[0032] Furthermore, as shown in Figure 2 , 8 , 10, 17 - 18, in this embodiment, the feeding module 3 includes: A cassette 31, on which a number of insertion slots 311 are provided for placing the wafers 9. Multiple wafers 9 can be placed in each cassette 31; a first opening 312 is provided at the bottom of the cassette 31; A positioning jig 32 (a conventional technology), which is used for positioning the cassette 31. A second opening 321 is provided on the positioning jig 32, and the second opening 321 is connected to the first opening 312; the first loading module 4 is arranged below the second opening 321, and the settings of the first opening 312 and the second opening 321 prevent the first loading module 4 from interfering with the positioning jig 32 or the cassette 31; A linear module 33, the output end of which is connected to the positioning jig 32 and can drive the positioning jig 32 to move up and down.

[0033] First, place the cassette 31 containing the wafers 9 on the positioning jig 32. The linear module 33 drives the positioning jig 32 to descend until the lowermost wafer 9 in the cassette 31 contacts the first loading module 4. Then the linear module 33 stops, and the first loading module 4 uses friction to send out the wafer 9.

[0034] Furthermore, as shown in Figure 8 , 17 - 18, in this embodiment, a number of first positioning steps 322 are symmetrically arranged at the front end of the positioning jig 32, and a number of second positioning steps 323 are symmetrically arranged at the rear end. The cooperation of the first positioning steps 322 and the second positioning steps 323 can fix the cassette 31 on the positioning jig 32. The multiple first positioning steps 322 and multiple second positioning steps 323 are used to adapt to various types of cassettes 31; a first detection sensor 34 is also provided on the positioning jig 32 for detecting whether the cassette 31 is placed on the positioning jig 32.

[0035] Furthermore, as shown in Figure 2 , 8As shown in FIGS. 0 to 9, in this embodiment, the first loading module 4 includes: A first fixed seat 41, which is arranged below the positioning fixture 32; A first rotating shaft 42, which is rotatably arranged at one end of the first fixed seat 41. A first pulley 421 is arranged at each end of the first rotating shaft 42. A pair of second pulleys 411 are rotatably arranged at the other end of the first fixed seat 41, and the second pulleys 411 correspond to the first pulleys 421; A plurality of second conveyor belts 43, one end of the second conveyor belt 43 is sleeved on the first pulley 421, and the other end is sleeved on the second pulley 411; A second driving mechanism 44, which is connected to the first fixed seat 41, and its output end is connected to the first rotating shaft 42, and can drive the first rotating shaft 42 to rotate. The first rotating shaft 42 drives the second conveyor belt 43 to move through the first pulleys 421 at both ends; A second detection sensor 45, which is arranged on the first fixed seat 41 and is used to detect whether the wafer 9 is in place; when the second detection sensor 45 detects that the wafer 9 is in place, the second driving mechanism 44 drives the second conveyor belt 43 to send the wafer 9 out from the bottom of the cassette 31.

[0036] Furthermore, as Figures 11 - 12 shown, in this embodiment, the second loading module 5 includes: A second fixed seat 51, which includes a first bottom plate 511 and a pair of first support plates 512, and the pair of first support plates 512 are respectively fixedly connected to the first bottom plate 511; A pair of avoidance grooves 5121 are arranged on the first support plate 512, and the avoidance grooves 5121 are used to prevent interference between the first support plate 512 and the first conveyor belt 21 during the rising process of the second fixed seat 51; the pair of avoidance grooves 5121 divide the first support plate 512 into three sections, namely the left, middle, and right sections. The left and right ends are symmetrically arranged with respect to the middle section, and the middle section faces the pair of first conveyor belts 21. The wafer 9 can enter the middle section from the left section or the right section, and then enter the first conveyor belt 21; a third detection sensor 58 is arranged inside each section of the support plate, and the third detection sensor 58 is used to detect the position of the wafer 9; A number of third pulleys 53 are arranged along the edge of the first support plate 512. Among them, a third pulley 53 is arranged on both sides of the top of the avoidance groove 5121, and a third pulley 53 is arranged below; A third conveyor belt 54 is sleeved on a number of third pulleys 53, and the third conveyor belt 54 is used to convey the wafer 9; Setting a plurality of third pulleys 53 enables only one belt to connect a plurality of third pulleys 53 on one side of the corresponding first support plate 512; The second rotating shaft 55 is rotatably connected to a pair of first support plates 512 respectively. A third pulley 53 at a corresponding position on each first support plate 512 is sleeved on the second rotating shaft 55 and can rotate following the second rotating shaft 55. The third driving mechanism 56 is arranged between a pair of first support plates 512. Its output end is connected to the second rotating shaft 55 and can drive the second rotating shaft 55 to rotate. The second rotating shaft 55 drives the third conveyor belt 54 to move through the third pulleys 53 at both ends. The first lifting mechanism 57 is arranged below the second fixed seat 51. Its output end is connected to the second fixed seat 51 and can drive the second fixed seat 51 to move up and down. In the initial state, the top of the third conveyor belt 54 is higher than the first conveyor belt 21 to prevent the wafer 9 from interfering with the first conveyor belt 21 during the process of being conveyed from the first conveyor belt 21 to the second conveyor belt 43. When the wafer 9 moves to the center of the middle section of the first support plate 512, the third driving mechanism 56 stops, and the first lifting mechanism 57 drives the second fixed seat 51 to descend until the wafer 9 contacts the first conveyor belt 21, and then the first conveyor belt 21 conveys the wafer 9 to the next station.

[0037] Preferably, in this embodiment, the first lifting mechanism 57 is preferably a cylinder or an electric cylinder.

[0038] Furthermore, in this embodiment, the first driving mechanism 22, the second driving mechanism 44, and the third driving mechanism 56 all use a servo motor plus a timing belt for power transmission, which belongs to conventional technical means.

[0039] Furthermore, as Figure 1 shown, in this embodiment, the detection module includes: a thickness detection mechanism 61 (prior art) and a resistivity detection mechanism 62 (prior art); the thickness detection mechanism 61 and the resistivity detection mechanism 62 are arranged on the conveying platform 1 in sequence.

[0040] Furthermore, as Figures 13 - 16 shown, in this embodiment, the centering module 8 includes: A fifth fixing frame 81, which is fixedly connected to the conveying platform 1; A fourth driving mechanism 82 (belonging to conventional technical means), which is connected to the fifth fixing frame 81; At least two first clamping components 83, which are connected to the fourth driving mechanism 82; At least one second clamping component 84, which is connected to the fourth driving mechanism 82; The first clamping assembly 83 and the second clamping assembly 84 are arranged annularly on the fifth fixing bracket 81 in sequence. The fourth driving mechanism 82 can drive the first clamping assembly 83 and the second clamping assembly 84 to clamp the wafer 9, so that the wafer 9 is centered. The first clamping assembly 83 includes: a first rotating member 831 and a first clamping member 832; One end of the first rotating member 831 is connected to the output end of the fourth driving mechanism 82, and the other end is connected to the first clamping member 832; A rubber sleeve is sleeved on the first clamping member 832 for clamping the wafer 9; The second clamping assembly 84 includes: a second rotating member 841, a third rotating member 842, a second clamping member 843 and a spring 844; One end of the second rotating member 841 is connected to the output end of the fourth driving mechanism 82, and the other end is hinged to the third rotating member 842; The third rotating member 842 is connected to the second clamping member 843; A rubber sleeve is sleeved on the second clamping member 843 for clamping the wafer 9; One end of the spring 844 is connected to the second rotating member 841, and the other end is connected to the third rotating member 842, so that the second clamping member 843 can rotate relative to the second rotating member 841 during the process of clamping the wafer 9; The second lifting mechanism (which belongs to the prior art) is arranged below the conveying platform 1 and can lift the wafer 9 on the double-belt conveying module 2.

[0041] Further, as Figure 16 shown, in this embodiment, a rubber sleeve is sleeved on the second clamping member of the first clamping member for preventing the wafer 9 from being scratched.

[0042] Further, as Figure 14 shown, in this embodiment, the fourth driving mechanism 82 includes: a servo motor 821, a transmission component 822 and several transmission shafts 823; The servo motor 821 is arranged on the fifth fixing bracket 81, and its output end is connected to the input end of the transmission component 822; The output end of the transmission component 822 is connected to the input ends of several transmission shafts 823 and can drive the transmission shafts 823 to rotate; Several transmission shafts 823 are rotatably arranged on the fifth fixing bracket 81, and their output ends are connected to the first clamping assembly 83 or the second clamping assembly 84 to drive the corresponding first clamping assembly 83 or the second clamping assembly 84 to rotate.

[0043] Further, as Figure 14 shown, in this embodiment, the transmission component 822 includes: The first synchronous pulley 8221 is sleeved on the output shaft of the servo motor 821; The second synchronous pulley 8222 is sleeved on one of the transmission shafts 823; One end of the first synchronous belt 8223 meshes with the first synchronous pulley 8221, and the other end meshes with the second synchronous pulley 8222; A plurality of third synchronous pulleys 8224 are respectively sleeved on the transmission shafts 823; The second synchronous belt 8225 meshes with a plurality of third synchronous pulleys 8224 respectively.

[0044] Furthermore, as Figure 13 、 15 shown, in this embodiment, the second lifting mechanism 85 includes a lifting cylinder 851 and a lifting plate 852; the lifting plate 852 is connected to the output end of the lifting cylinder 851 and can drive the lifting plate 852 to move up and down. Preferably, the lifting plate 852 is a vacuum chuck, and a plurality of vacuum adsorption holes are arranged on the vacuum chuck. The lower ends of the vacuum adsorption holes are communicated with a vacuum generator through vacuum tubes; when the lifting plate 852 drives the wafer 9 to move up and down, the lifting plate 852 adsorbs the wafer 9 to prevent sliding between the wafer 9 and the lifting plate 852.

[0045] When the first conveyor belt 21 stops moving after conveying the wafer 9 above the second lifting mechanism 85, the lifting cylinder 851 is activated to drive the lifting plate 852 to move upward, adsorb and steadily lift the wafer 9 to an operable height between the first clamping assembly 83 and the second clamping assembly 84, and then the adsorption holes lose air. At this time, the servo motor 821 starts to work, and the output shaft drives the first synchronous pulley 8221 to rotate. The first synchronous pulley 8221 transmits power to the second synchronous pulley 8222 through the first synchronous belt 8223, thereby driving the connected transmission shaft 823 to rotate; at the same time, the second synchronous belt 8225 drives other transmission shafts 823 to rotate synchronously under the driving action of a plurality of third synchronous pulleys 8224.

[0046] When each transmission shaft 823 rotates, it drives the first clamping assembly 83 and the second clamping assembly 84 to act synchronously. When the first clamping member 832 of the first clamping assembly 83 is driven by the first rotating member 831, it clamps one side of the wafer 9 by using a rubber sleeve; the second clamping member 843 of the second clamping assembly 84 approaches the wafer 9 under the drive of the second rotating member 841 and the third rotating member 842. After contacting the wafer 9, due to the action of the spring 844, the second clamping member 843 can drive the third rotating member 842 to rotate relative to the second rotating member 841, adaptively fit the surface of wafers 9 with different shapes, and clamp the other side of the wafer 9 through the rubber sleeve. Multiple first clamping assemblies 83 and second clamping assemblies 84 cooperate from different directions to achieve precise centering of wafers 9 of multiple models. The centering module 8 enables the wafer 9 to be quickly centered, prevents the wafer 9 from being scratched, and reduces the overall production cost through the design of the mechanical structure.

[0047] After centering is completed, the lifting plate 852 adsorbs the wafer 9 again, the first clamping assembly 83 and the second clamping assembly 84 release the wafer 9, and the lifting cylinder 851 drives the lifting plate 852 to move downward, so that the centered wafer 9 returns to the first conveyor belt 21 again.

[0048] Furthermore, as Figure 3 shown, in this embodiment, the sorting module 7 includes: The first blanking module 71 is arranged below the output end of the double-belt conveying module 2 and is used for conveying the wafer 9; the structure of the first blanking module 71 is the same as that of the second loading module 5; A pair of second blanking modules 72 are symmetrically arranged on both sides of the first blanking module 71 respectively and are used for conveying the wafer 9; the second blanking module 72 has the same structure as the first loading module 4.

[0049] The first blanking module 71 conveys the qualified wafers 9 to one of the second blanking modules 72 and conveys the unqualified wafers 9 to the other second blanking module 72; A receiving module 73 is further arranged at the output end of each second blanking module 72, and the receiving module 73 is used for collecting the wafers 9. The structure of the receiving module 73 is the same as that of the feeding module 3.

[0050] Working principle: First, the wafers 9 to be detected are inserted into the insertion slots 311 of the cassette 31 one by one. Then, the cassette 31 is placed on the positioning jig 32 for positioning. The first detection sensor 34 is triggered, and the linear module 33 drives the positioning jig 32 to descend until the wafer 9 at the lowermost end of the cassette 31 contacts the second conveyor belt 43. The second detection sensor 45 is triggered, and the second driving mechanism 44 drives the second conveyor belt 43 to convey the wafer 9 from the cassette 31 to the second loading module 5. The third driving mechanism 56 moves to drive the third conveyor belt 54 to convey the wafer 9 above the first conveyor belt 21. The first lifting mechanism 57 drives the second fixing seat 51 to descend, causing the wafer 9 to fall onto a pair of first conveyor belts 21. Then, the first conveyor belt 21 conveys the wafer 9 to the centering module 8 for centering. After centering, the first conveyor belt 21 continues to drive the wafer 9 to the thickness detection station and the resistivity detection station for detection. Then, the wafer 9 is conveyed to the first unloading module 71. The first unloading module 71 separates the qualified and unqualified wafers 9 and conveys them to the corresponding second unloading modules 72. The second unloading modules 72 then convey the wafers 9 into the cassettes 31 of the receiving module 73.

[0051] As above, with reference to Figures 1 - 18 The multifunctional wafer measurement and sorting device according to the embodiment of the present invention is described. It can achieve automatic and stable conveyance of wafers, precise detection of various performances, and automatic sorting of qualified and unqualified wafers. At the same time, through the innovative design of the tensioning mechanism, the problems of inconvenient belt tension adjustment and unstable effect are solved, improving the production efficiency and product quality of semiconductor manufacturing. The centering module can not only quickly center the wafers but also prevent the wafers from being scratched, and reduces the overall production cost through the design of the mechanical structure.

[0052] It should be noted that in this specification, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "comprising..." do not exclude the existence of additional identical elements in the process, method, article or device comprising the elements.

[0053] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and substitutions to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A wafer multi-functional measurement and sorting device, characterized in that, Comprising: A conveying platform, on which a pair of parallel first limiting grooves are provided; A double-belt conveying module, which is arranged on the conveying platform; A feeding module, which is arranged adjacent to the double-belt conveying module and is used to provide wafers; A first loading module, which is connected to the feeding module and is used to send out the wafers in the feeding module; A second loading module, which is connected to the first loading module and is used to send the wafers to the double-belt conveying module; An alignment module, which is arranged on the conveying platform and is used for wafer alignment; A detection module, which is arranged on the conveying platform and is used to detect the performance of the wafers; A sorting module, which is connected to the detection module and is used to separately store qualified and unqualified wafers; The double-belt conveying module comprises: A pair of first conveyor belts, which are respectively slidably connected to the pair of first limiting grooves, and the first limiting grooves are used to limit the positions of the first conveyor belts; A pair of first driving mechanisms, which are respectively arranged at both ends of the conveying platform and are used to drive the first conveyor belts to move; A tensioning mechanism, which is arranged below the conveying platform and is connected to the first conveyor belts and is used to tension the first conveyor belts; The feeding module comprises: A cassette, on which a plurality of insertion slots are provided for placing wafers; a first opening is provided at the bottom of the cassette; A positioning fixture, which is used for positioning the cassette, and a second opening is provided on the positioning fixture, and the second opening is connected to the first opening; A linear module, the output end of which is connected to the positioning fixture and can drive the positioning fixture to move up and down.

2. The wafer multi-functional measurement and sorting device according to claim 1, characterized in that, The tensioning mechanism comprises: A first fixing frame; A pair of guide shafts, the two ends of which are respectively detachably connected to the first fixing frame through supports; A sliding frame, which is slidably connected to the pair of guide shafts, and a pair of first tensioning wheels are arranged on the sliding frame; A tension spring, one end of which is connected to the sliding frame and the other end is connected to the first fixing frame; A second fixing frame, which is detachably connected to the first fixing frame, and a pair of second tensioning wheels are arranged on the second fixing frame.

3. The wafer multi-functional measurement and sorting device according to claim 2, characterized in that, The tensioning mechanism further comprises: A third fixing frame, which is detachably connected to the first fixing frame, and a pair of third tensioning wheels are arranged on the third fixing frame, and the pair of third tensioning wheels correspond to the pair of first tensioning wheels one by one; A fourth fixing frame, which is connected to the first fixing frame; A fourth tensioning wheel, the two ends of which are connected to the fourth fixing frame; One end of the tension spring is connected to the sliding frame and the other end is connected to the fourth tensioning wheel.

4. The wafer multi-functional measurement and sorting device according to claim 1, wherein, A number of first positioning steps are symmetrically arranged at the front end of the positioning fixture, and a number of second positioning steps are symmetrically arranged at the rear end. The cooperation of the first positioning steps and the second positioning steps can fix the cartridge on the positioning fixture; a first detection sensor is also arranged on the positioning fixture for detecting whether the cartridge is placed on the positioning fixture.

5. The wafer multi-functional measurement and sorting device according to claim 1, wherein The first loading module includes: A first fixed seat, which is arranged below the positioning fixture; A first rotating shaft, which is rotatably arranged at one end of the first fixed seat. A first pulley is arranged at each end of the first rotating shaft, and a pair of second pulleys are rotatably arranged at the other end of the first fixed seat. The second pulleys correspond to the first pulleys; A number of second conveyor belts, one end of each second conveyor belt is sleeved on the first pulley, and the other end is sleeved on the second pulley; A second driving mechanism, which is connected to the first fixed seat, and its output end is connected to the first rotating shaft, and can drive the first rotating shaft to rotate; A second detection sensor, which is arranged on the first fixed seat for detecting whether the wafer is in place.

6. The wafer multi-functional measurement and sorting device according to claim 1, characterized in that, The second loading module includes: A second fixed seat, which includes a first bottom plate and a pair of first support plates, and the pair of first support plates are respectively fixedly connected to the first bottom plate; A pair of avoidance grooves are arranged on the first support plate. The pair of avoidance grooves divide the first support plate into three sections, and a third detection sensor is arranged on the inner side of each section of the support plate; A number of third pulleys are arranged along the edge of the first support plate; A number of third conveyor belts are sleeved on the third pulleys; A second rotating shaft, which is rotatably connected to a pair of the first support plates respectively. A third pulley at a corresponding position on each first support plate is sleeved on the second rotating shaft and can rotate following the second rotating shaft; A third driving mechanism, which is arranged between the pair of first support plates, and its output end is connected to the second rotating shaft, and can drive the second rotating shaft to rotate; A first lifting mechanism, which is arranged below the second fixed seat, and its output end is connected to the second fixed seat, and can drive the second fixed seat to move up and down.

7. The wafer multi-functional measurement and sorting device according to claim 1, characterized in that, The detection module includes: a thickness detection mechanism and a resistivity detection mechanism; the thickness detection mechanism and the resistivity detection mechanism are arranged on the conveying platform in sequence.

8. The wafer multi-functional measurement and sorting device according to claim 1, wherein The centering module includes: A fifth fixing frame; A fourth driving mechanism, which is connected to the fifth fixing frame; At least two first clamping components, which are connected to the fourth driving mechanism; At least one second clamping component, which is connected to the fourth driving mechanism; The first clamping components and the second clamping components are arranged annularly on the fifth fixing frame in sequence. The fourth driving mechanism can drive the first clamping components and the second clamping components to clamp the wafer to center the wafer; The first clamping component includes: a first rotating part and a first clamping part; One end of the first rotating member is connected to the output end of the fourth driving mechanism, and the other end is connected to the first clamping member; A rubber sleeve is sleeved on the first clamping member for clamping the wafer; The second clamping assembly includes: a second rotating member, a third rotating member, a second clamping member and a spring; One end of the second rotating member is connected to the output end of the fourth driving mechanism, and the other end is hinged to the third rotating member; The third rotating member is connected to the second clamping member; A rubber sleeve is sleeved on the second clamping member for clamping the wafer; One end of the spring is connected to the second rotating member, and the other end is connected to the third rotating member, so that the second clamping member can rotate relative to the second rotating member during the process of clamping the wafer; A second lifting mechanism, which is arranged below the conveying platform and can lift the wafer on the double-belt conveying module.

9. The wafer multi-functional measurement and sorting device according to claim 1, wherein, The sorting module includes: A first blanking module, which is arranged below the output end of the double-belt conveying module for conveying the wafer; A pair of second blanking modules, which are respectively arranged on both sides of the first blanking module for conveying the wafer; A receiving module is further arranged at the output end of each second blanking module, and the receiving module is used for collecting the wafer.

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