Cutting, punching and drilling integrated machining device and machining equipment

By designing an integrated cutting, punching and drilling processing device, the laser cutting parts and drilling bit parts move in the vertical direction, solving the problem that the plate needs to be cut and then punched after laser cutting, achieving an efficient cutting and drilling process, and cleaning dust by suctioning components, improving the overall processing efficiency and quality.

CN120190629APending Publication Date: 2025-06-24SHENZHEN HANS MP LASER TECH CO LTD
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Patent Information

Application Number
CN202510514786.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-23
Publication Date
2025-06-24

AI Technical Summary

Technical Problem

In the prior art, the plate needs to be discharged after laser cutting and then transported to the drill bit for drilling, resulting in low processing efficiency.

Method used

A cutting and drilling integrated processing device is designed, including processing components, bases and suction components. The laser cutting parts and drilling bit parts can move in the vertical direction to achieve the integration of cutting and drilling. The air inlet is used to pump dust.

Benefits of technology

There is no need to discharge the material after laser cutting, and directly transfer the plate to the drill bit for drilling, saving transportation and loading and unloading time, improving processing efficiency, and effectively cleaning dust through the suction assembly to ensure processing quality.

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Abstract

The invention discloses a cutting, punching and drilling integrated machining device and equipment, the cutting, punching and drilling integrated machining device comprises a machining assembly, the machining assembly comprises a machining connecting piece, a laser cutting piece and a drill bit piece, the laser cutting piece can move in the vertical direction relative to the machining connecting piece, and the drill bit piece can move in the vertical direction relative to the machining connecting piece; the base is used for bearing a plate; and the suction assembly comprises an air inlet, and the air inlet is used for sucking dust generated when the plate is machined by the machining assembly. According to the embodiment of the invention, a plate can be cut and drilled, the plate can also be processed by the drill bit, cutting, punching and drilling integration is realized, and the production efficiency is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly relates to a cutting, punching and drilling integrated processing device and a processing equipment. Background Art

[0002] With the continuous popularization of laser processing technology, laser cutting technology can be used to cut and drill plates. In related technologies, when producing plates that require both laser cutting technology and drill bit processing, usually all the plates are first laser cut and then transported to the drill bit processing area for processing, resulting in low processing efficiency. Summary of the Invention

[0003] An embodiment of the present invention provides a cutting, punching and drilling integrated processing device and a processing equipment, which can not only cut and drill plates, but also process the plates with a drill bit, realizing the integration of cutting, punching and drilling and improving production efficiency.

[0004] The cutting, punching and drilling integrated processing device proposed by the present invention includes: a processing component, the processing component includes a processing connecting piece, a laser cutting piece and a drill bit piece, the laser cutting piece can move relative to the processing connecting piece in the vertical direction, and the drill bit piece can move relative to the processing connecting piece in the vertical direction;

[0005] A base for carrying the plate;

[0006] A suction component, the suction component includes an air inlet for sucking dust and chips generated when the processing component processes the plate.

[0007] Optionally, the air inlet includes a dust suction port and a chip suction port, the size of the dust suction port is larger than that of the chip suction port, the dust suction port is used for sucking dust generated by the laser cutting piece, and the chip suction port is used for sucking chips generated by the drill bit piece.

[0008] Optionally, the suction component further includes a blanking piece, the blanking piece is provided with a blanking port, the blanking piece is arranged on the base, the blanking port is located below the laser cutting piece, and the blanking port is communicated with the dust suction port.

[0009] Optionally, the suction component further includes a dust suction component, the dust suction component includes a dust suction pipe, the dust suction pipe is provided with a dust suction air outlet, a dust suction cavity and a dust suction port, the dust suction cavity communicates the dust suction port and the dust suction air outlet, and the dust suction port is located below the blanking port.

[0010] Optionally, the dust suction component further includes a dust suction plate, the dust suction plate is provided with a plurality of dust suction ports, the dust suction plate is arranged at the dust suction port, and the plurality of dust suction ports are communicated with the dust suction cavity.

[0011] Optionally, the cutting, punching and drilling integrated processing device also includes a collection box, which is arranged below the material drop port, and the base is provided with a waste channel, which connects the material drop port and the collection box, and the waste channel is used for waste to fall into the collection box from the material drop port, and the dust extraction port is connected to the waste channel, and the dust extraction port and the waste channel are spaced apart.

[0012] Optionally, the drill bit component includes a processing drill bit, which is located at one end of the processing assembly close to the base. The suction assembly also includes a chip extraction assembly, which includes a drill bit cover, and the drill bit cover is provided with the chip extraction port, a first chip extraction chamber and a first chip extraction air outlet. The first chip extraction chamber connects the first chip extraction air outlet and the chip extraction port. The drill bit cover is arranged around the processing drill bit, and the chip extraction port is located on a side of the drill bit cover close to the base.

[0013] Optionally, the base includes a matching block, which is arranged below the processing drill bit; the drill bit cover is connected to the processing assembly; the drill bit cover can move in a vertical direction relative to the processing assembly so that the lower end of the drill bit cover can press the plate onto the matching block; the chip extraction port includes a make way port, which is arranged below the processing drill bit to make way for the processing drill bit.

[0014] Optionally, the chip extraction assembly further comprises a chip extraction duct, the chip extraction duct being provided with a second chip extraction outlet, a second chip extraction chamber and a chip extraction inlet, the second chip extraction chamber being connected to the second chip extraction outlet and the chip extraction inlet, and the chip extraction inlet being connected to the first chip extraction outlet.

[0015] Optionally, the suction assembly further comprises a switching member, and the switching member is used to cover the dust extraction port or the chip extraction port.

[0016] Optionally, the base includes a dust outlet and a chip outlet, the dust outlet is connected to the dust port to provide suction for the dust port, the chip outlet is connected to the chip port to provide suction for the chip port, the switching member is slidably connected to the base, and the switching member can move relative to the base to adjust the switching member to cover the chip outlet or cover the dust outlet.

[0017] Optionally, the integrated cutting, punching and drilling processing device further includes a plate moving structure, wherein the plate moving structure is disposed on the base, and the plate moving structure is used to drive the plate to move in a horizontal direction.

[0018] Optionally, the base includes a support and a carrier. The carrier is disposed on the support. The carrier is provided with a first relief channel and a second relief channel. Both the first relief channel and the second relief channel extend along a first direction. The first relief channel and the second relief channel are arranged at intervals in sequence along a second direction. The first direction and the second direction are perpendicular to each other. Both the first direction and the second direction are arranged horizontally. The sheet moving structure includes two moving connectors, a first moving member, and a second moving member. The two moving connectors respectively pass through the first relief channel and the second relief channel and are slidably connected to the support along the first direction. The first moving member is disposed on the two moving connectors. The second moving member is slidably connected to the first moving member along the second direction. The second moving member is used to limit the sheet.

[0019] Optionally, the second moving member includes a plurality of clamping jaws. The plurality of clamping jaws are arranged in sequence along the second direction.

[0020] The present invention also provides a processing device, including the cutting and punching integrated processing device according to any one of the above embodiments.

[0021] In the cutting and punching integrated processing device and the processing device provided by the embodiments of the present invention, the laser cutting member can perform laser cutting on the sheet on the base, and the drill bit member can perform punching on the sheet on the base. The sheet does not need to be cut and then reloaded onto the drill bit member for punching after laser cutting, saving the transportation, loading and unloading, and alignment processes, effectively improving the processing efficiency. In addition, the air inlet can suck the dust generated by the processing assembly during the processing of the sheet, avoiding the influence of the dust on the processing effect. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0023] Figure 1 It is a schematic structural diagram of an embodiment of the cutting and punching integrated processing device of the present invention;

[0024] Figure 2 It is a schematic structural diagram of another embodiment of the cutting and punching integrated processing device of the present invention;

[0025] Figure 3 For Figure 2 The partial enlarged view of A in

[0026] Figure 4Schematic diagram of another embodiment of the integrated cutting, punching and drilling device of the present invention;

[0027] Figure 5 is Figure 4 partial enlarged view at position B in;

[0028] Figure 6 Schematic diagram of still another embodiment of the integrated cutting, punching and drilling device of the present invention;

[0029] Figure 7 Schematic diagram of still another embodiment of the integrated cutting, punching and drilling device of the present invention;

[0030] Figure 8 is Figure 7 cross-sectional view taken along line C-C in;

[0031] Figure 9 Schematic diagram of still another embodiment of the integrated cutting, punching and drilling device of the present invention;

[0032] Figure 10 Schematic diagram of still another embodiment of the integrated cutting, punching and drilling device of the present invention;

[0033] Figure 11 Partial schematic diagram of still another embodiment of the integrated cutting, punching and drilling device of the present invention;

[0034] Figure 12 Partial schematic diagram of still another embodiment of the integrated cutting, punching and drilling device of the present invention;

[0035] Explanation of reference numerals in the drawings:

[0036] Integrated cutting, punching and drilling device 100;

[0037] Processing assembly 10, processing connecting piece 11, laser cutting piece 13, drill bit piece 15, processing drill bit 151;

[0038] Base 20, waste channel 21, fitting block 23, dust extraction outlet 25, chip extraction outlet 27, support 28, bearing piece 29, first relief channel 291, second relief channel 293;

[0039] Suction assembly 30, air inlet 31, dust extraction port 311, chip extraction port 313, relief port 3131, blanking piece 33, blanking port 331, dust extraction assembly 35, dust extraction pipeline 351, dust extraction outlet 3511, dust extraction cavity 3513, dust extraction plate 353, dust suction port 3531, chip extraction assembly 37, drill bit cover 371, first chip extraction cavity 3713, first chip extraction outlet 3715, chip extraction pipeline 373, second chip extraction outlet 3731, second chip extraction cavity 3733, chip extraction air inlet 3735, switching piece 39;

[0040] Aggregate box 40;

[0041] Sheet moving structure 50, moving connecting piece 51, first moving piece 53, second moving piece 55, clamping jaw 551;

[0042] Sheet 200;

[0043] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0045] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention.

[0047] It should be understood that the term "and / or" used in the specification and appended claims of the present invention refers to any combination and all possible combinations of one or more of the related listed items, and includes these combinations.

[0048] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0049] Please refer to Figures 1 to 3 and Figure 6, an embodiment of the present invention provides a cutting and drilling integrated processing device 100, which includes a processing component 10, a base 20, and a suction component 30. The processing component 10 includes a processing connector 11, a laser cutting member 13, and a drill bit member 15. The laser cutting member 13 can move relative to the processing connector 11 in the vertical direction, and the drill bit member 15 can move relative to the processing connector 11 in the vertical direction. The base 20 is used to carry the plate 200. The suction component 30 includes an air inlet 31, and the air inlet 31 is used to suck the dust generated by the processing component 10 when processing the plate 200.

[0050] In the embodiment of the present invention, the laser cutting member 13 can perform laser cutting on the plate 200 on the base 20, and the drill bit member 15 can perform drilling on the plate 200 on the base 20. The plate 200 does not need to be unloaded after laser cutting and then reloaded onto the drill bit member 15 for drilling, saving the transportation, loading and unloading, and alignment processes, effectively improving the processing efficiency. In addition, the air inlet 31 can suck the dust generated by the processing component 10 when processing the plate 200, avoiding the influence of dust on the processing effect.

[0051] Specifically, there are many plates 200 that need to be both laser cut and drilled. In a certain embodiment, the plate 200 needs to be provided with a countersunk hole. First, the laser cutting member 13 can be used to cut a through hole on the plate 200, and then the drill bit can be used to drill the through hole. Just using the cutting and drilling integrated processing device 100 can meet the requirement of the plate 200 being provided with a countersunk hole.

[0052] It can be understood that there are many ways for the laser cutting member 13 to move relative to the processing connector 11 in the vertical direction. In a certain embodiment, the laser cutting member 13 is connected to the processing connector 11 through a cutting slide rail. The cutting slide rail is arranged in the vertical direction. The processing assembly further includes a cutting driving member, and the cutting driving member drives the laser cutting member 13 to move along the cutting slide rail. It can be understood that the laser cutting member 13 can also be slidably connected to the processing connector 11 through structures such as ball screws and rollers. The present application does not make specific limitations.

[0053] The laser cutting member 13 is used to perform laser cutting on the plate 200. It can be understood that the laser cutting member 13 can include structures such as a laser generator and lenses. The present application does not make specific elaborations.

[0054] It can be understood that there are many ways for the drill bit member 15 to move relative to the processing connector 11 in the vertical direction. In a certain embodiment, the drill bit member 15 is connected to the processing connector 11 through a drill bit slide rail. The drill bit slide rail is arranged in the vertical direction. The processing component 10 further includes a drill bit driving member, and the drill bit driving member drives the drill bit member 15 to move along the drill bit slide rail. It can be understood that the drill bit member 15 can also be slidably connected to the processing connector 11 through structures such as ball screws and rollers. The present application does not make specific limitations.

[0055] The drill bit member 15 is used for punching and drilling the sheet material 200. It can be understood that the drill bit member 15 may include structural components such as a processing drill bit 151 and a driving member, etc., which are not specifically described in this application.

[0056] The suction assembly 30 is used for sucking the dust and chips generated by the processing assembly 10 during the processing of the sheet material 200. It can be understood that the air inlet 31 can be provided on the processing assembly 10, the air inlet 31 can be provided on the base 20, the air inlet 31 can be separately provided around the processing assembly 10, and the position of the air inlet 31 only needs to be able to suck the dust and chips generated by the processing assembly 10 during the processing of the sheet material 200, and this application does not make specific restrictions.

[0057] It can be understood that there are many ways to provide suction force for the air inlet 31. It can be that the suction assembly 30 is provided with a negative pressure device, and the negative pressure device is communicated with the air inlet 31, or it can be that the suction assembly 30 is communicated with the negative pressure device, and the air inlet 31 is communicated with the negative pressure device. This application does not make specific restrictions.

[0058] Please refer to Figure 2 、 Figure 3 and Figure 6 In the embodiment of the present invention, the air inlet 31 includes a dust suction port 311 and a chip suction port 313. The size of the dust suction port 311 is larger than that of the chip suction port 313. The dust suction port 311 is used for sucking the dust and chips generated by the laser cutting member 13, and the chip suction port 313 is used for sucking the dust and chips generated by the drill bit member 15.

[0059] In this way, the dust suction port 311 has a larger size and a larger suction area, and can better suck the dust and chips generated by the laser cutting member 13. The chip suction port 313 has a smaller size and a larger suction force, and can better suck the dust and chips generated by the drill bit member 15.

[0060] Specifically, the laser cutting of the sheet material 200 usually generates smoke and dust, which is lighter in weight and easy to disperse, and requires a larger suction area; the drill bit punching of the sheet material 200 usually generates chips, which are heavier in weight and require a larger suction force. Therefore, the dust suction port 311 is used for sucking the dust and chips generated by the laser cutting member 13, and the dust suction port 311 is set to have a larger size. The chip suction port 313 is used for sucking the dust and chips generated by the drill bit member 15, and the chip suction port 313 is set to have a smaller size, so that the suction force of the chip suction port 313 is larger.

[0061] It can be understood that the dust suction port 311 can be provided on the laser cutting member 13, the dust suction port 311 can be provided on the base 20, and the dust suction port 311 only needs to be able to suck the dust and chips generated by the laser cutting member 13. This application does not make specific restrictions. The chip suction port 313 can be provided on the drill bit member 15, the chip suction port 313 can be provided on the base 20, and the chip suction port 313 only needs to be able to suck the dust and chips generated by the drill bit member 15. This application does not make specific restrictions.

[0062] Further, please refer to Figures 4 to 8 The suction assembly 30 further includes a blanking member 33. The blanking member 33 is provided with a blanking port 331. The blanking member 33 is disposed on the base 20. The blanking port 331 is located below the laser cutting member 13, and the blanking port 331 is communicated with the dust suction port 311.

[0063] In this way, the waste cut from the sheet 200 by the laser cutting member 13 can fall from the blanking port 331, avoiding the influence of the waste on subsequent processing. The dust suction port 311 is communicated with the blanking port 331, so that the dust suction port 311 can provide a certain suction force for the blanking port 331. Therefore, while the blanking port 331 discharges the waste, it can also suck the dust chips, reducing the probability of dust chips floating and dispersing.

[0064] It can be understood that the blanking port 331 can be opened in the vertical direction, or can be opened in a direction at a certain angle to the vertical direction, as long as the blanking port 331 can discharge the waste. In a certain embodiment, the blanking port 331 is opened in the vertical direction. In this way, it is convenient for the waste to be discharged from the blanking port 331 under the action of gravity, reducing the probability of friction between the waste and the blanking member 33.

[0065] Furthermore, please refer to Figures 4 to 8 The suction assembly 30 further includes a dust suction assembly 35. The dust suction assembly 35 includes a dust suction pipe 351. The dust suction pipe 351 is provided with a dust suction air outlet 3511, a dust suction chamber 3513 and a dust suction port 311. The dust suction chamber 3513 communicates the dust suction port 311 and the dust suction air outlet 3511, and the dust suction port 311 is located below the blanking port 331.

[0066] In this way, during the process of the laser cutting member 13 processing the sheet 200, the dust chips fall along the blanking port 331, and the dust suction port 311 sucks the falling dust chips, so that the soot in the dust chips is discharged along the directions of the dust suction port 311, the dust suction chamber 3513 and the dust suction air outlet 3511. In addition, the setting of the dust suction pipe 351 can provide suction force for the dust suction port 311, facilitating the connection of a negative pressure device that provides negative pressure.

[0067] It can be understood that since the dust suction air outlet 3511 is communicated with the dust suction port 311 through the dust suction chamber 3513, connecting a negative pressure device that provides negative pressure to the dust suction air outlet 3511 can provide suction force for the dust suction port 311. The position of the dust suction port 311 usually needs to be set according to the dust suction requirements. Therefore, the position where the dust suction port 311 is located may not be convenient for direct connection with the negative pressure device. Instead, the position of the dust suction air outlet 3511 can be set according to the need for convenient connection, so as to facilitate the indirect connection of the negative pressure device to the dust suction port 311 through the dust suction air outlet 3511, facilitating the design and arrangement of the position of the dust suction port 311 and also facilitating the connection between the negative pressure device and the dust suction port 311.

[0068] Furthermore, please refer toFigures 5 to 8 The dust extraction assembly 35 further includes a dust extraction plate 353. The dust extraction plate 353 is provided with a plurality of dust suction ports 3531. The dust extraction plate 353 is arranged at the dust extraction port 311, and the plurality of dust suction ports 3531 communicate with the dust extraction chamber 3513.

[0069] In this way, the dust extraction plate 353 can protect the dust extraction chamber 3513, preventing large debris from being sucked in and colliding with the inner wall of the dust extraction chamber 3513. The dust and debris enter the dust extraction port 311 and the dust extraction chamber 3513 through the plurality of dust suction ports 3531.

[0070] It can be understood that the size of the dust suction ports 3531 can be adjusted according to the size of the debris to be intercepted, and no specific limitation is made in this application. The plurality of dust suction ports 3531 can be evenly arranged on the dust extraction plate 353, or the plurality of dust suction ports 3531 can be unevenly arranged on the dust extraction plate 353, and no specific limitation is made in this application. It can be understood that the dust suction ports 3531 can be circular, square, triangular or other shapes, and no specific limitation is made in this application.

[0071] Furthermore, please refer to Figure 2 、 Figure 7 and Figure 8 The cutting and drilling integrated processing device 100 further includes an aggregate box 40. The aggregate box 40 is arranged below the blanking port 331. The base 20 is provided with a waste channel 21. The waste channel 21 connects the blanking port 331 and the aggregate box 40. The waste channel 21 allows waste to fall from the blanking port 331 into the aggregate box 40. The dust extraction port 311 communicates with the waste channel 21, and the dust extraction port 311 is spaced from the waste channel 21.

[0072] In this way, the aggregate box 40 can collect the cut waste, facilitating the disposal of the waste. In addition, the dust extraction port 311 is spaced from the waste channel 21. The waste falls into the aggregate box 40 along the waste channel 21 under the action of gravity, preventing the waste from entering the dust extraction port 311 under the action of gravity. The suction force of the dust extraction port 311 can suck the smoke and dust with smaller gravity, so that the dust and debris generated during the cutting process, the heavier waste in the dust and debris enters the aggregate box 40 through the waste channel 21, and the lighter smoke and dust in the dust and debris are discharged through the dust extraction port 311, achieving a better waste cleaning and dust extraction effect.

[0073] It can be understood that the waste channel 21 is used to represent the set of paths through which the waste falls from the blanking port 331 into the aggregate box 40. That is, the dust extraction port 311 is spaced from the waste channel 21, which means that the waste does not pass through the dust extraction port 311 during the process of falling from the blanking port 331 into the aggregate box 40.

[0074] In a certain embodiment, the blanking port 331 is opened in the vertical direction, the aggregate box 40 is arranged directly below the blanking port 331, and the dust extraction port 311 is opened in the horizontal direction. In this way, the heavier waste can fall into the aggregate box 40 from the blanking port 331 under the action of gravity, reducing the probability of friction between the waste and the blanking member 33. The dust extraction port 311 is opened in the horizontal direction, further avoiding the waste from falling into the dust extraction port 311 under the action of gravity, reducing the probability of the waste entering the dust extraction port 311, and reducing the wear of the dust extraction pipeline 351 by the waste.

[0075] Please refer to Figure 2 and Figure 3 In the embodiment of the present invention, the drill bit member 15 includes a processing drill bit 151. The processing drill bit 151 is located at one end of the processing assembly 10 close to the base 20. The dust extraction assembly 30 further includes a chip extraction assembly 37. The chip extraction assembly 37 includes a drill bit cover 371. The drill bit cover 371 is provided with a chip extraction port 313, a first chip extraction cavity 3713 and a first chip extraction air outlet 3715. The first chip extraction cavity 3713 communicates with the first chip extraction air outlet 3715 and the chip extraction port 313. The drill bit cover 371 surrounds the processing drill bit 151, and the chip extraction port 313 is located on the side of the drill bit cover 371 close to the base 20.

[0076] In this way, the dust and chips generated during the processing of the processing drill bit 151 on the plate 200 are discharged in the direction of the chip extraction port 313, the first chip extraction cavity 3713 and the first chip extraction air outlet 3715, avoiding the influence of the dust and chips on the processing of the plate 200. In addition, since the chip extraction port 313 and the processing drill bit 151 are arranged on the same side of the plate 200, the chip extraction port 313 can timely suck away the chips generated during the processing of the processing drill bit 151, avoiding the situation that the chip extraction port 313 cannot timely suck the chips due to the shielding of the plate 200 in the processing where the processing drill bit 151 does not penetrate the plate 200.

[0077] It can be understood that in this embodiment, the chip extraction port 313 is arranged on the drill bit cover 371, and the drill bit cover 371 surrounds the processing drill bit 151. There is no need to set the chip extraction port 313 on the base 20, so that the base 20 can better bear the plate 200 processed by the processing drill bit 151, avoiding the situation of bending and damage of the plate 200 caused by insufficient support when one side of the plate 200 is the chip extraction port 313 and the other side is processed by the drill bit. It can be understood that during the working process of the drill bit, the plate 200 bears the pressure applied by the drill bit, while in the laser processing process, the plate 200 basically does not need to bear the pressure applied by the laser on the plate 200. Therefore, a blanking port 331 can be provided below the laser cutting member 13 to facilitate dust extraction by the dust extraction port 311 and waste discharge, while the base 20 is required below the drill bit member 15 to provide corresponding bearing capacity to resist the pressure applied by the drill bit.

[0078] Further, please refer to Figures 3 to 5, the base 20 includes a mating block 23. The mating block 23 is disposed below the processing drill bit 151. The drill bit cover 371 is connected to the processing assembly 10. The drill bit cover 371 can move relative to the processing assembly 10 in the vertical direction so that the lower end of the drill bit cover 371 can press the plate 200 against the mating block 23. The chip extraction port 313 includes a clearance port 3131. The clearance port 3131 is disposed below the processing drill bit 151 to make way for the processing drill bit 151.

[0079] In this way, the mating block 23 can provide good support for the plate 200, avoiding deformation of the plate 200 under the pressure of the processing drill bit 151. The lower end of the drill bit cover 371 can press the plate 200 against the mating block 23 to achieve further support and limitation of the plate 200, avoiding rotation and displacement of the plate 200 under the action of the processing drill bit 151 and ensuring the processing quality. In addition, the clearance port 3131 can make way for the processing drill bit 151, facilitating the processing drill bit 151 to penetrate the drill bit cover 371 to process the plate 200.

[0080] It can be understood that the clearance port 3131 can not only allow the processing drill bit 151 to penetrate the drill bit cover 371 to process the plate 200, but also suck the dust and chips generated during the processing.

[0081] Specifically, there are many ways for the drill bit cover 371 to move relative to the processing assembly 10 in the vertical direction. The drill bit cover 371 can be connected to the processing assembly 10 through a cylinder, and the cylinder drives the drill bit cover 371 to move in the vertical direction. The drill bit cover 371 can be connected to the processing assembly 10 through a ball screw and a motor. The present application does not make specific limitations.

[0082] It can be understood that in a certain embodiment, the drill bit cover 371 is disposed on the drill bit member 15, and the drill bit cover 371 can move relative to the drill bit member 15 in the vertical direction. In this way, before the drill bit member 15 processes the plate 200, the drill bit member 15 moves vertically closer to the plate 200 until the drill bit cover 371 abuts against the plate 200, realizing the common limitation of the plate 200 by the drill bit cover 371 and the mating block 23. The processing drill bit 151 extends out of the drill bit cover 371 through the clearance opening to drill the plate 200.

[0083] Please refer to Figure 6 、 Figure 9 and Figure 10 , in the embodiment of the present invention, the chip extraction assembly 37 further includes a chip extraction pipeline 373. The chip extraction pipeline 373 is provided with a second chip extraction air outlet 3731, a second chip extraction cavity 3733 and a chip extraction air inlet 373531. The second chip extraction cavity 3733 communicates with the second chip extraction air outlet 3731 and the chip extraction air inlet 373531. The chip extraction air inlet 373531 communicates with the first chip extraction air outlet 3715.

[0084] In this way, the chip extraction pipeline 373 is communicated with the first chip extraction air outlet 3715, realizing the sequential communication of the chip extraction port 313, the first chip extraction chamber 3713, the first chip extraction air outlet 3715, the chip extraction air inlet 373531, the second chip extraction chamber 3733, and the second chip extraction air outlet 3731. That is, communicating with the second chip extraction air outlet 3731 can provide negative pressure for the chip extraction port 313. The position and size of the second chip extraction air outlet 3731 can be set according to needs, which is convenient for connecting to a negative pressure device that provides negative pressure.

[0085] Please refer to Figure 9 and Figure 10 In the embodiment of the present invention, the suction assembly 30 further includes a switching member 39, and the switching member 39 is used to cover the dust extraction port 311 or the chip extraction port 313.

[0086] In this way, it is possible to realize the switching between sucking the dust extraction port 311 and sucking the chip extraction port 313, avoiding waste of wind power and saving costs.

[0087] It can be understood that laser cutting and punching are usually not carried out simultaneously. Therefore, in the laser cutting process, the chip extraction port 313 does not need to be sucked, and in the punching process, the dust extraction port 311 does not need to be sucked. Therefore, the switching member 39 is provided to switch the working states of the dust extraction port 311 and the chip extraction port 313, avoiding energy waste.

[0088] It can be understood that there are many structures of the switching member 39. In a certain embodiment, the switching member 39 includes a first pipeline member and a second pipeline member. The first pipeline member is arranged in the dust extraction pipeline 351, and the first pipeline member is rotatably connected to the dust extraction pipeline 351. The first pipeline member rotates relative to the dust extraction pipeline 351 to cover or open the dust extraction pipeline 351. The second pipeline member is arranged in the chip extraction pipeline 373, and the second pipeline member is rotatably connected to the chip extraction pipeline 373. The second pipeline member rotates relative to the chip extraction pipeline 373 to cover or open the dust extraction pipeline 351.

[0089] Further, please refer to Figure 9 and Figure 10 The base 20 includes a dust extraction outlet 25 and a chip extraction outlet 27. The dust extraction outlet 25 is communicated with the dust extraction port 311 to provide suction for the dust extraction port 311. The chip extraction outlet 27 is communicated with the chip extraction port 313 to provide suction for the chip extraction port 313. The switching member 39 is slidably connected to the base 20, and the switching member 39 can move relative to the base 20 to adjust the switching member 39 to cover the chip extraction outlet 27 or the dust extraction outlet 25.

[0090] In this way, the switching member 39 can simply and conveniently cover the chip extraction port 313 by covering the chip extraction outlet 27, and can simply and conveniently cover the dust extraction port 311 by covering the dust extraction outlet 25.

[0091] It can be understood that the chip extraction outlet 27 can be the second chip extraction air outlet 3731, and the dust extraction outlet 25 can be the dust extraction air outlet 3511. The present application does not make specific restrictions.

[0092] There are many ways for the switching member 39 to move relative to the base 20. In a certain embodiment, the cutting and drilling integrated processing device 100 further includes a switching cylinder. The switching cylinder is arranged on the base 20 and connected to the switching member 39. The switching cylinder drives the switching member 39 to move relative to the base 20.

[0093] Please refer to Figure 1 , in the embodiment of the present invention, the cutting and drilling integrated processing device 100 further includes a plate moving structure 50. The plate moving structure 50 is arranged on the base 20, and the plate moving structure 50 is used to drive the plate 200 to move in the horizontal direction.

[0094] In this way, the moving requirement of the processing component can be reduced. By moving the plate to realize the horizontal movement of the plate, the processing component only needs to be able to move in the vertical direction, that is, the adjustment requirement of the relative position relationship between the processing component and the plate can be realized, thereby reducing the complexity of the processing component structure and reducing the difficulty of wiring and installation of the processing component.

[0095] It is worth noting that during the processing of the plate 200 by the laser cutting member 13, the blanking port 331 is required to discharge waste materials, chips, etc. during the laser processing. Therefore, the base 20 should be provided with an opening corresponding to the laser cutting member 13. However, during the processing of the plate 200 by the drill bit member 15, the plate 200 will be subjected to a large pressure. Therefore, the base 20 needs to provide better support for the plate 200, that is, the bearing member 30 needs to be provided with a fitting block 23 below the drill bit member 15 that can better abut and support the plate 200. Therefore, the bearing requirements of the laser cutting member 13 for the base 20 and the bearing requirements of the drill bit for the bearing member 30 are different. If the cutting and drilling integrated processing device 100 can also move in the horizontal direction, it is difficult for the base 20 to provide both the blanking port 331 and the fitting block 23 that can better support the plate 200 everywhere. Therefore, the cutting and drilling integrated processing device 100 moves in the vertical direction, and the plate 200 moves in the horizontal direction, ensuring that the laser cutting member 13 is always above the blanking port 331 and the drill bit member 15 is always above the fitting block 23, ensuring the leakage of materials during the laser processing and reducing the probability of deformation of the plate 200 under pressure during the drilling process.

[0096] It can be understood that in a certain embodiment, the cutting and drilling integrated processing device 100 further includes a plurality of brushes. The brushes are arranged on the side of the base 20 close to the plate 200. In this way, the brushes can support the plate 200, and when the plate 200 moves, the brushes will not leave scratches on the plate 200.

[0097] Further, please refer to Figure 11 andFigure 12 The base 20 includes a support 28 and a carrier 29. The carrier 29 is disposed on the support 28. The carrier 29 is provided with a first relief channel 291 and a second relief channel 293. Both the first relief channel 291 and the second relief channel 293 extend along a first direction. The first relief channel 291 and the second relief channel 293 are arranged at intervals in sequence along a second direction. The first direction and the second direction are perpendicular to each other. Both the first direction and the second direction are arranged along the horizontal direction. The sheet moving structure 50 includes two moving connectors 51, a first moving member 53 and a second moving member 55. The two moving connectors 51 respectively pass through the first relief channel 291 and the second relief channel 293 and are slidably connected to the support 28 along the first direction. The first moving member 53 is disposed on the two moving connectors 51. The carrier 29 is located between the first moving member 53 and the support 28. The second moving member 55 is slidably connected to the first moving member 53 along the second direction. The second moving member 53 is used to limit the sheet 200.

[0098] In this way, the function of moving the sheet 200 along the first direction and the second direction by the sheet moving structure 50 is realized. In addition, since the support 28 is disposed below the carrier 29 and the moving connector 51 passes through the carrier 29, the space for the first moving member 53 to be slidably connected along the first direction on both sides of the carrier 29 is saved, ensuring that there is enough space for the carrier 29 to be disposed, and improving the space utilization rate.

[0099] Specifically, compared with the related art on both sides of the first moving member and the carrier, in this embodiment, since the support 28 slidably connected to the first moving member 53 is located below the carrier 29, the space above the support 28 can also be used to dispose the carrier 29, ensuring that the carrier 29 has enough bearing area to accommodate a larger-sized sheet 200 for processing and a sheet 200 with a larger moving range for processing, effectively improving the space utilization rate.

[0100] Further, please refer to Figure 11 The second moving member 55 includes a plurality of clamping jaws 551. The plurality of clamping jaws 551 are arranged in sequence along the second direction.

[0101] In this way, the sheet 200 can be sufficiently limited, ensuring the stability of the sheet 200 during the processing.

[0102] The embodiment of the present invention further provides a processing device. The processing device includes a cutting, punching and drilling integrated processing device 100. The specific structure of the cutting, punching and drilling integrated processing device 100 refers to the above embodiment. Since this processing device adopts all the technical solutions of the above all embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments.

[0103] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A cutting, punching and drilling integrated processing device, characterized in that: include: A processing assembly, the processing assembly comprising a processing connection piece, a laser cutting piece and a drill piece, the laser cutting piece can move in a vertical direction relative to the processing connection piece, and the drill piece can move in a vertical direction relative to the processing connection piece; A base, the base being used to support the plate; A suction component includes an air inlet, and the air inlet is used to suck dust generated by the processing component processing the plate.

2. The cutting, punching and drilling integrated processing device according to claim 1, characterized in that: The air inlet includes a dust extraction port and a chip extraction port. The size of the dust extraction port is larger than that of the chip extraction port. The dust extraction port is used to suck dust generated by the laser cutting part, and the chip extraction port is used to suck dust generated by the drill bit.

3. The cutting, punching and drilling integrated processing device according to claim 2, characterized in that: The suction assembly also includes a blanking piece, which is provided with a blanking port. The blanking piece is arranged on the base, the blanking port is located below the laser cutting piece, and the blanking port is connected to the dust extraction port.

4. The cutting, punching and drilling integrated processing device according to claim 3, characterized in that: The suction component also includes a dust extraction component, which includes a dust extraction pipe. The dust extraction pipe is provided with a dust extraction air outlet, a dust extraction chamber and a dust extraction port. The dust extraction chamber is connected to the dust extraction port and the dust extraction air outlet. The dust extraction port is located below the drop port.

5. The cutting, punching and drilling integrated processing device according to claim 4, characterized in that: The dust extraction component also includes a dust extraction plate, the dust extraction plate is provided with a plurality of dust extraction ports, the dust extraction plate is arranged at the dust extraction ports, and the plurality of dust extraction ports are connected to the dust extraction chamber.

6. The cutting, punching and drilling integrated processing device according to claim 5, characterized in that: The integrated cutting, punching and drilling processing device also includes a material collection box, which is arranged below the material drop port. The base is provided with a waste channel, which connects the material drop port and the material collection box. The waste channel is used for waste to fall into the material collection box from the material drop port. The dust extraction port is connected to the waste channel, and the dust extraction port and the waste channel are spaced apart.

7. The cutting, punching and drilling integrated processing device according to claim 2, characterized in that: The drill bit component includes a processing drill bit, and the processing drill bit is located at one end of the processing assembly close to the base. The suction assembly also includes a chip extraction assembly, and the chip extraction assembly includes a drill bit cover, and the drill bit cover is provided with the chip extraction port, a first chip extraction chamber and a first chip extraction air outlet, and the first chip extraction chamber is connected to the first chip extraction air outlet and the chip extraction port. The drill bit cover is arranged around the processing drill bit, and the chip extraction port is located on a side of the drill bit cover close to the base.

8. The cutting, punching and drilling integrated processing device according to claim 7, characterized in that: The base includes a matching block, which is arranged below the processing drill bit. The drill head cover is connected to the processing assembly. The drill head cover can move in a vertical direction relative to the processing assembly so that the lower end of the drill head cover can press the plate onto the matching block. The chip extraction port includes a clearance port, which is arranged below the processing drill bit to make way for the processing drill bit.

9. The cutting, punching and drilling integrated processing device according to claim 7, characterized in that: The chip extraction assembly also includes a chip extraction duct, which is provided with a second chip extraction outlet, a second chip extraction chamber and a chip extraction inlet, wherein the second chip extraction chamber is connected to the second chip extraction outlet and the chip extraction inlet, and the chip extraction inlet is connected to the first chip extraction outlet.

10. The cutting, punching and drilling integrated processing device according to claim 2, characterized in that: The suction assembly further comprises a switching member, and the switching member is used for sealing the dust extraction port or sealing the debris extraction port.

11. The cutting, punching and drilling integrated processing device according to claim 10, characterized in that: The base includes a dust outlet and a chip outlet, the dust outlet is connected with the dust port to provide suction for the dust port, the chip outlet is connected with the chip port to provide suction for the chip port, the switching member is slidably connected with the base, and the switching member can move relative to the base to adjust the switching member to cover the chip outlet or cover the dust outlet.

12. The cutting, punching and drilling integrated processing device according to claim 1, characterized in that: The cutting, punching and drilling integrated processing device further comprises a plate moving structure, wherein the plate moving structure is arranged on the base, and the plate moving structure is used for driving the plate to move in a horizontal direction.

13. The cutting, punching and drilling integrated processing device according to claim 12, characterized in that: The base includes a support and a bearing member, the bearing member is arranged on the support, the bearing member is provided with a first give way channel and a second give way channel, the first give way channel and the second give way channel both extend along a first direction, the first give way channel and the second give way channel are arranged in sequence along the second direction, the first direction and the second direction are perpendicular to each other, the first direction and the second direction are both arranged along a horizontal direction, the plate moving structure includes two moving connecting members, a first moving member and a second moving member, the two moving connecting members respectively penetrate the first give way channel and the second give way channel and are slidably connected with the support along the first direction, the first moving member is arranged on the two moving connecting members, the bearing member is located between the first moving member and the support, the second moving member is slidably connected to the first moving member along the second direction, and the second moving member is used to limit the plate.

14. The cutting, punching and drilling integrated processing device according to claim 13, characterized in that: The second moving member includes a plurality of clamping claws, and the plurality of clamping claws are arranged in sequence along the second direction.

15. A processing equipment, characterized in that: It comprises the cutting, punching and drilling integrated processing device as described in any one of claims 1 to 14.

Citation Information

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