Grinding and polishing sample wafer carrier and grinding and polishing equipment

Abstract

The invention relates to the technical field of semiconductor processing, in particular to a grinding and polishing sample wafer carrier and grinding and polishing device.The grinding and polishing sample wafer carrier comprises a carrier tray and a bonding material layer, the carrier tray is suitable for being detachably connected with a grinding head of the grinding and polishing device, and the bonding material layer is arranged on the end face, opposite to the grinding head, of the carrier tray; the bonding material layer is made of a pyrolysis bonding material or a photolysis bonding material. In the grinding and polishing process, firstly, a grinding and polishing sample wafer is bonded to the bonding material layer on the carrier tray, then the carrier tray is installed on a grinding head of grinding and polishing equipment, after the grinding and polishing process, the carrier tray is taken down from the grinding head, the grinding and polishing sample wafer is not influenced, and due to the fact that the bonding material layer has the characteristic of pyrolysis or photolysis, the bonding material layer is subjected to pyrolysis or photolysis, and the bonding material layer is subjected to pyrolysis or photolysis. The grinding and polishing sample piece can be automatically separated from the carrier tray, so that the warping or cracking risk of the sample piece after the grinding and polishing process is effectively reduced, and an additional cleaning process is not added.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and particularly to a polishing sample carrier and a polishing device. Background Art

[0002] In semiconductor polishing (such as chemical mechanical polishing, grinding, etc.) processes, it is necessary to fix a polishing sample (wafer) on the polishing head of a polishing device for processing. The polishing head needs to provide uniformly distributed adsorption force to avoid warping or cracking of the wafer caused by local stress. Therefore, the fixing design of the polishing sample on the polishing head is directly related to process stability, surface uniformity and yield of the wafer / sample.

[0003] In existing polishing processes, generally, the polishing sample is directly fixed on the polishing head. The fixing of the polishing sample on the polishing head can be mainly achieved by means of vacuum adsorption, material adsorption, paraffin bonding, etc. Among them, vacuum adsorption adsorbs the sample through vacuum holes or grooves on the polishing head to ensure that there is no displacement when the sample rotates at high speed; material adsorption is to set adsorption material on the polishing head and directly adsorb the sample by using the adsorption material, which can solve the problem of cracking of warped samples; paraffin bonding is to directly bond the sample with paraffin. However, the above fixing methods of directly fixing the polishing sample on the polishing head have some defects: Adopting the method of vacuum adsorption requires an additional introduction of a vacuum system, which increases the complexity of the equipment, and has extremely high requirements for the quality of the sample. If the warpage degree is large, it will cause the sample to crack; for large-size thin samples in the method of material adsorption, after thinning or polishing processes, it is very difficult to take down the adsorbed sample, and unbalanced force will also cause the sample to crack; adopting the method of paraffin bonding introduces paraffin, which will contaminate the sample, increase the additional cleaning cost, and since paraffin is in a liquid state after dissolution, it is very difficult to ensure the uniformity of the bonding between the sample and the polishing head. For the thinned or polished sample, there will be a deviation of several micrometers in thickness. Summary of the Invention

[0004] The present invention provides a polishing sample carrier and a polishing device to solve the defects existing in the existing fixing methods of directly fixing the polishing sample on the polishing head, and to realize using the carrier as an intermediate structure to solve the fixing problem between the sample and the polishing head on the polishing device, ensure uniformity and yield, and improve process efficiency.

[0005] The present invention provides a polishing sample carrier, including a carrier tray and an adhesive material layer. The carrier tray is adapted to be detachably connected to the polishing head of the polishing device, and the adhesive material layer is disposed on the end surface of the carrier tray facing away from the polishing head. The adhesive material layer adopts a thermolytic adhesive material or a photolytic adhesive material.

[0006] According to a polishing sample carrier provided by the present invention, a positioning reference mark and a quick connection structure are provided on the end surface of the carrier tray facing the grinding head, the positioning reference mark is a cross mark or an optical alignment point, the quick connection structure includes a vacuum adsorption hole array for docking with the vacuum system of the grinding head, or includes a magnetic adsorption layer for adsorbing and fixing with the corresponding magnetic structure of the grinding head, or includes a snap-on mechanical locking mechanism for quick disassembly and assembly with the grinding head.

[0007] According to a polishing sample carrier provided by the present invention, a sensing unit component is embedded on the end surface of the carrier tray facing away from the grinding head, and the sensing unit component includes a temperature sensor and / or a stress sensing film, and the sensing unit component is located between the carrier tray and the adhesive material layer.

[0008] According to a polishing sample carrier provided by the present invention, an anti-collision buffer layer is provided at the edge of the carrier tray. The anti-collision buffer layer is made of a flexible material and is used to prevent the carrier tray from colliding with the grinding head and being damaged during loading and unloading.

[0009] According to a grinding and polishing sample carrier provided by the present invention, the carrier tray is made of a composite material, and the composite material is one of a carbon fiber reinforced polymer, a ceramic-based composite material and a multi-layer metal structure. The multi-layer metal structure includes a titanium metal layer, a copper metal layer and a stainless steel metal layer from the inside to the outside.

[0010] According to a polishing sample carrier provided by the present invention, a micro-texture structure is formed on the surface of the bonding material layer, and the micro-texture structure is one of a grid, a dot matrix or a groove.

[0011] According to a polishing sample carrier provided by the present invention, an overflow glue blocking structure is arranged on the periphery of the adhesive material layer, and the overflow glue blocking structure is used to prevent the adhesive material layer from overflowing and contaminating the sample when pressurized.

[0012] According to a polishing sample carrier provided by the present invention, the overflow glue blocking structure is an annular flange or a liquid-repellent coating fixedly arranged on the carrier tray, and a gap is reserved between the overflow glue blocking structure and the adhesive material layer.

[0013] According to a polishing sample carrier provided by the present invention, the overflow glue blocking structure is a shape memory alloy edge ring arranged around the edge of the adhesive material layer.

[0014] The present invention further provides a grinding and polishing device, comprising a grinding head, to which any one of the above-mentioned grinding and polishing sample carriers is detachably connected.

[0015] The polishing sample carrier provided by the present invention can be assembled on the polishing head of a polishing device. It mainly includes a carrier tray and an adhesive material layer. The carrier tray can be of any shape according to the situation of the polishing device and is connected to the polishing head of the polishing device in a detachable connection manner, which is convenient for installation and disassembly. The adhesive material layer is arranged on the carrier tray and is used for adhesively fixing the polishing sample. The adhesive material layer can be a pyrolytic material or a photolytic material. During the polishing process, first, the polishing sample is adhered to the adhesive material layer on the carrier tray, and then the carrier tray is installed on the polishing head of the polishing device. After the polishing process, the carrier tray is removed from the polishing head without affecting the polishing sample. Due to the pyrolytic or photolytic characteristics of the adhesive material layer, after pyrolysis or photolysis, the polishing sample can automatically separate from the carrier tray, effectively reducing the risk of warping or cracking of the sampled piece after the polishing process, and without adding an additional cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 FIG. is an isometric structural schematic diagram of the polishing sample carrier provided by the present invention.

[0018] Figure 2 FIG. is a cross-sectional structural schematic diagram of the polishing sample carrier provided by the present invention.

[0019] Reference Signs: 1, carrier tray; 2, adhesive material layer; 3, induction unit assembly; 4, anti-collision buffer layer; 5, overflow glue blocking structure; 6, polishing sample. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following will clearly and completely describe the technical solutions in the present invention in conjunction with the drawings in the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0021] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0022] In the description of the embodiments of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0023] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0024] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with that embodiment or example are included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0025] An embodiment of the present invention provides a polishing sample carrier, in combination with Figure 1 and Figure 2As shown in the figure, the polishing sample carrier includes a carrier tray 1 and an adhesive material layer 2. The carrier tray 1 is adapted to be detachably connected to the grinding head of the polishing equipment. The adhesive material layer 2 is disposed on the end face of the carrier tray 1 facing away from the grinding head, and the adhesive material layer 2 uses a thermolytic adhesive material or a photolytic adhesive material.

[0026] It can be understood that such a polishing sample carrier of this embodiment can be assembled on the grinding head of the polishing equipment, mainly including a carrier tray 1 and an adhesive material layer 2. The carrier tray 1 can be of any shape according to the situation of the polishing equipment and is connected to the grinding head of the polishing equipment in a detachable connection manner, which is convenient for installation and disassembly. The adhesive material layer 2 is disposed on the carrier tray 1 and is used for adhesively fixing the polishing sample 6. The adhesive material layer 2 can be a thermolytic material (such as polylactic acid PLA, polyvinyl alcohol PVA, which can be softened or decomposed at 80°C to 200°C) or a photolytic material (such as photosensitive acrylic resin, which can be degraded under ultraviolet irradiation of a specific wavelength). During the polishing process, first, the polishing sample 6 is adhered to the adhesive material layer 2 on the carrier tray 1, then the carrier tray 1 is installed on the grinding head of the polishing equipment. After the polishing process, the carrier tray 1 is removed from the grinding head without affecting the polishing sample 6. Due to the thermolytic or photolytic characteristics of the adhesive material layer 2, after thermolysis or photolysis, the polishing sample 6 can be automatically separated from the carrier tray 1, effectively reducing the risk of warping or cracking of the sampled piece after the polishing process, and without adding an additional cleaning process.

[0027] It should be understood that in addition to thermolytic materials and photolytic materials, the adhesive material layer 2 can also be other adhesive materials suitable for decomposition. For example, a temperature-sensitive adhesive layer can be used, with a working temperature range of 20 - 60°C (maintaining an adhesive force > 0.5 MPa) and a debonding temperature of 80 - 200°C (adhesive force dropping to < 0.01 MPa); another example is to use an electric field-responsive adhesive material, where the adhesive force decreases by 90% when a voltage of 1 - 5 V is applied, with a response time < 1 second and no thermal effect, suitable for temperature-sensitive materials; and also a pH-responsive hydrogel can be used, with an adhesive force of 1 - 2 MPa under neutral conditions and automatic debonding when pH > 9 or pH < 4, having good biocompatibility and being suitable for biochip processing.

[0028] In some embodiments of the polishing sample carrier of the present invention, positioning reference marks and a quick connection structure (not shown in the figure) are provided on the end face of the carrier tray 1 facing the grinding head. Among them, the positioning reference marks can be crosshairs or optical alignment points, or can also be grooves, protrusions, or magnetic marks, etc., for quickly aligning with the corresponding installation structure of the grinding head of the polishing equipment to ensure the position accuracy during the installation of the carrier tray 1.

[0029] The quick connection structure of the carrier tray 1 can be an array of vacuum adsorption holes for docking with the vacuum system of the grinding head; it can also be a magnetic adsorption layer (such as a permanent magnet or an electromagnet) for adsorbing and fixing with the corresponding magnetic structure of the grinding head; it can also be a snap-type mechanical locking mechanism for realizing quick disassembly and assembly with the grinding head. Through the quick connection structure of the carrier tray 1, quick disassembly and assembly with the grinding head can be achieved. Before and after the grinding and polishing process, the bonding or detachment of the grinding and polishing sample 6 can be carried out at a position far from the grinding head. The operation is simple, which can solve the problem of uneven stress caused by inaccurate alignment between the carrier and the grinding head, improve the grinding and polishing uniformity, reduce the manual adjustment time at the same time, and improve the production efficiency. It should be understood that the array of vacuum adsorption holes, magnetic adsorption layer or snap-type mechanical locking mechanism in this embodiment can all be applied using existing known structures, and no specific structure is defined here.

[0030] In some embodiments of the grinding and polishing sample carrier of the present invention, refer to Figure 2 As shown, an induction unit assembly 3 is embedded on the end face of the carrier tray 1 facing away from the grinding head. The induction unit assembly 3 includes a temperature sensor and / or a stress sensing film. The induction unit assembly 3 is located between the carrier tray 1 and the bonding material layer 2.

[0031] It can be understood that the temperature sensor and stress sensing film of the induction unit assembly 3 can monitor the temperature and deformation of the bonding material layer 2 in real time, reflecting the temperature and stress state of the grinding and polishing sample 6 during the grinding and polishing process, avoiding sample damage caused by overload or abnormal temperature, optimizing the grinding and polishing parameters through sensor data, preventing overload or bonding failure, and improving the process automation level and the yield rate. Further, an RFID chip can be equipped for the temperature sensor and the stress sensing film for wireless data transmission, automatically recording the usage history and process parameters, adding a predictive maintenance function.

[0032] In some embodiments of the grinding and polishing sample carrier of the present invention, refer to again Figure 2 As shown, an anti-collision buffer layer 4 is provided at the edge of the carrier tray 1. The anti-collision buffer layer 4 is made of a flexible material, which can be silicone or polyurethane, and is used to prevent the carrier tray 1 from colliding and being damaged with the grinding head during loading and unloading, and prolong the service life. The carrier tray 1 is made of a composite material, and the composite material is one of carbon fiber reinforced polymer, ceramic matrix composite and multi-layer metal structure. The multi-layer metal structure includes a titanium metal layer, a copper metal layer and a stainless steel metal layer in sequence from the inside to the outside.

[0033] It can be understood that the carrier tray 1 is made of a material with high strength and high flatness, which can be a glass material, a polymer (such as polyether ether ketone, polycarbonate) or a metal (such as aluminum alloy, stainless steel), or the composite material in this embodiment. Among them, using carbon fiber reinforced polymer to prepare the carrier tray 1 has the advantages of light weight (density 1.5 - 1.8 g / cm3 ), having the advantages of low coefficient of thermal expansion (2 - 5×10 -6 / °C); Using ceramic matrix composites to prepare the carrier tray 1 has the advantages of good wear resistance and a surface roughness of up to Ra < 0.1μm; Using a multi-layer metal structure formed by a titanium metal layer, a copper metal layer, and a stainless steel metal layer, the outer stainless steel metal layer enhances rigidity, the middle copper metal layer facilitates heat conduction, and the inner titanium metal layer is corrosion-resistant.

[0034] In some embodiments of the polishing sample carrier of the present invention, a micro-texture structure is formed on the surface of the adhesive material layer 2, and the micro-texture structure is one of a grid, a dot matrix, or a groove. The thickness of the adhesive material layer 2 is generally 10 - 100μm, and the micro-texture structure on the surface can enhance the bonding strength.

[0035] A grid micro-texture is formed on the surface of the adhesive material layer 2. The grid spacing is 0.5mm, the line width is 0.1mm, and the depth is 50μm, showing an orthogonal and uniform distribution. The grid micro-texture structure increases the surface area of the adhesive material layer 2, improves the mechanical bite force and bonding strength with the polishing sample 6, increases the bonding force by about 40%, and avoids the displacement of the sample during the polishing process; At the same time, the grid gap provides a diffusion channel for material decomposition during the pyrolysis or photolysis process. During debonding, heat or ultraviolet light can be quickly transmitted along the grid, enabling the bonding layer to decompose uniformly and reducing residues. The grid micro-texture surface is suitable for the stable fixation of large-sized samples (such as 12-inch wafers).

[0036] A dot matrix micro-texture is formed on the surface of the adhesive material layer 2. The dot matrix is an array of cylinders with a diameter of 100μm and a height of 30μm, and the spacing is 200μm. The dot matrix structure disperses the bonding stress through discrete contact points, and at the same time allows the adhesive material to flow and fill the gaps under pressure, forming a uniform bonding interface. Reduces the bubble residue between the bonding layer 2 and the polishing sample 6, improves the bonding uniformity. During debonding, the dot matrix structure decomposes first, reducing the mechanical force required for sample peeling. The dot matrix micro-texture surface is suitable for ultra-thin samples (thickness < 100μm), avoiding rupture caused by local stress.

[0037] A groove micro-texture is formed on the surface of the adhesive material layer 2. The radial groove width is 80μm and the depth is 40μm, extending from the center outwards. The groove structure guides the flow of coolant or polishing fluid during the polishing process, improves heat dissipation and chip removal, reduces the temperature rise during the polishing process (measured 15°C lower than that without the texture structure), and at the same time controls the pressure-induced flow direction of the adhesive material through the directional grooves, preventing the disorderly overflow of the adhesive material under pressure. Combined with the glue overflow blocking structure 5 mentioned later, it further reduces contamination. The groove micro-texture surface is suitable for high-speed polishing processes (rotation speed > 500rpm).

[0038] Further, continue to refer to Figure 1As shown in the figure, an overflow glue blocking structure 5 is provided on the outer periphery of the adhesive material layer 2. The overflow glue blocking structure 5 is used to prevent the adhesive material layer 2 from overflowing and contaminating the sample piece during pressurization. The overflow glue blocking structure 5 can be an annular flange or a liquid-repellent coating fixedly arranged on the carrier tray 1. A gap is reserved between the overflow glue blocking structure 5 and the adhesive material layer 2; the overflow glue blocking structure 5 can also be a shape memory alloy edge ring arranged around the edge of the adhesive material layer 2.

[0039] In some specific examples, the overflow glue blocking structure 5 adopts an annular flange structure. The height of the annular flange is 0.5 mm, the width is 1 mm, and it is made of stainless steel. The gap with the edge of the adhesive material layer 2 is 0.2 mm. During pressurized bonding, the molten or softened adhesive material is extruded and flows towards the edge. The annular flange forms a physical barrier to block the continuous overflow of the material, preventing the glue from contaminating the functional area of the sample piece and ensuring the cleanliness of the grinding and polishing surface. The gap design allows a small amount of material to fill in to balance the pressure and avoid local accumulation.

[0040] In some other specific examples, the overflow glue blocking structure 5 adopts a liquid-repellent coating. A fluorinated liquid-repellent coating is sprayed on the surface of the carrier tray 1, with a contact angle > 120°. The width of the coating is 2 mm, and there is no physical protrusion with the adhesive material layer 2. The liquid-repellent coating repels the adhesive material through its low surface energy property, making it unable to wet the coating area, thereby restricting the flow range. Using a liquid-repellent coating has no mechanical structure interference and is suitable for the flatness requirements of ultra-thin sample pieces (thickness < 50 μm), avoiding edge stress concentration caused by flanges.

[0041] In some other specific examples, the overflow glue blocking structure 5 adopts a shape memory alloy edge ring. The shape memory alloy edge ring can adopt a Ni-Ti alloy ring. The initial inner diameter is 0.3 mm larger than that of the adhesive material layer 2, and the triggering temperature is 60 °C. At room temperature, the shape memory alloy edge ring remains in an open state, facilitating the placement during the sample piece bonding stage. After heating to 60 °C, the shape memory alloy edge ring shrinks, and the inner diameter decreases by 0.2 mm, forming a tight enclosure for the adhesive material layer 2; when in the debonding stage, the shape memory alloy edge ring is heated to 80 °C again and undergoes secondary shrinkage to assist in peeling the sample piece. Using a shape memory alloy edge ring can dynamically adapt to different pressure conditions, with better sealing performance than a fixed structure. The shrinkage force can help separate the adhesive layer from the sample piece and reduce mechanical damage, especially suitable for thermally debondable adhesives.

[0042] On the other hand, the present invention also provides a grinding and polishing device. In some embodiments, the grinding and polishing device includes a grinding head, and a grinding and polishing sample carrier in any one of the above embodiments or examples is detachably connected to the grinding head.

[0043] It can be understood that this polishing equipment of the present embodiment, since it includes the polishing sample carrier of the present invention, thus has all the advantages of the polishing sample carrier in any one of the above embodiments. Specifically, a quick-connection mechanism (such as a vacuum system, an electromagnetic adsorption structure or a snap structure) matching the quick-connection structure of the carrier tray 1 is provided on the grinding head, and the quick-connection mechanism can be quickly disassembled and assembled with the carrier tray 1 to reduce the downtime. Among them, the vacuum system and the electromagnetic adsorption structure respectively correspond to the vacuum adsorption hole array and the magnetic adsorption layer of the carrier tray 1, and the adsorption force can be adjusted to adapt to different thickness samples.

[0044] In some specific examples, during the polishing process, the polishing sample 6 is fixed to the carrier tray 1 through the adhesive material layer 2, and the carrier tray 1 is installed on the grinding head through vacuum adsorption or a quick-connection mechanism; after polishing, the carrier tray 1 together with the polishing sample 6 is removed from the grinding head, and the adhesive material layer 2 is heated or irradiated with ultraviolet light to decompose it, separating the polishing sample 6 from the carrier tray 1.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A polishing sample carrier, characterized in that: include: A carrier tray (1), wherein the carrier tray (1) is suitable for being detachably connected to a grinding head of a grinding and polishing device; The adhesive material layer (2) is arranged on the end surface of the carrier tray (1) facing away from the grinding head, and the adhesive material layer (2) is made of a thermally degradable adhesive material or a photodegradable adhesive material.

2. The polishing sample carrier according to claim 1, characterized in that: A positioning reference mark and a quick connection structure are provided on the end surface of the carrier tray (1) facing the grinding head, wherein the positioning reference mark is a cross mark or an optical alignment point, and the quick connection structure comprises: A vacuum adsorption hole array, used for docking with the vacuum system of the grinding head; or, A magnetic adsorption layer, used for adsorbing and fixing with the corresponding magnetic structure of the grinding head; or, The snap-on mechanical locking mechanism is used to achieve quick disassembly and assembly with the grinding head.

3. The polishing sample carrier according to claim 1, characterized in that: A sensing unit component (3) is embedded on the end surface of the carrier tray (1) facing away from the grinding head, the sensing unit component (3) comprising a temperature sensor and / or a stress sensing film, and the sensing unit component (3) is located between the carrier tray (1) and the adhesive material layer (2).

4. The polishing sample carrier according to claim 1, characterized in that: An anti-collision buffer layer (4) is provided on the edge of the carrier tray (1); the anti-collision buffer layer (4) is made of a flexible material and is used to prevent the carrier tray (1) from being damaged by collision with the grinding head during loading and unloading.

5. The polishing sample carrier according to any one of claims 1 to 4, characterized in that: The carrier tray (1) is made of a composite material, wherein the composite material is one of a carbon fiber reinforced polymer, a ceramic matrix composite material and a multilayer metal structure, wherein the multilayer metal structure comprises, from the inside to the outside, a titanium metal layer, a copper metal layer and a stainless steel metal layer.

6. The polishing sample carrier according to claim 1, characterized in that: A micro-texture structure is formed on the surface of the adhesive material layer (2), and the micro-texture structure is one of a grid, a dot matrix or a groove.

7. The polishing sample carrier according to claim 6, characterized in that: An overflow glue blocking structure (5) is provided on the periphery of the adhesive material layer (2), and the overflow glue blocking structure (5) is used to prevent the adhesive material layer (2) from overflowing and contaminating the sample when pressurized.

8. The polishing sample carrier according to claim 7, characterized in that: The overflow glue blocking structure (5) is an annular flange or a liquid-repellent coating fixedly arranged on the carrier tray (1), and a gap is reserved between the overflow glue blocking structure (5) and the adhesive material layer (2).

9. The polishing sample carrier according to claim 7, characterized in that: The glue overflow blocking structure (5) is a shape memory alloy edge ring arranged around the edge of the adhesive material layer (2).

10. A grinding and polishing device, comprising a grinding head, characterized in that: The grinding head is detachably connected to the grinding and polishing sample carrier according to any one of claims 1 to 9.

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