Grinding and polishing sample carrier and grinding and polishing apparatus

Abstract

The present application relates to the technical field of semiconductor processing, and particularly relates to a polishing sample carrier and a polishing device, which comprises a carrier tray and an adhesive material layer, the carrier tray is suitable for detachable connection with a polishing head of the polishing device, the adhesive material layer is arranged on an end surface of the carrier tray which is away from the polishing head, and the adhesive material layer adopts a pyrolytic adhesive material or a photolytic adhesive material. In the polishing process, the polishing sample is first adhered to the adhesive material layer on the carrier tray, then the carrier tray is mounted on the polishing head of the polishing device, after the polishing process, the carrier tray is taken off from the polishing head without affecting the polishing sample, and due to the pyrolytic or photolytic characteristics of the adhesive material layer, the polishing sample can be automatically separated from the carrier tray after pyrolysis or photolysis, the warping or breaking risk of the sample after the polishing process is effectively reduced, and no additional cleaning process is needed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and in particular to a polishing sample carrier and a polishing device. BACKGROUND

[0002] In the process of semiconductor polishing (such as chemical mechanical polishing, grinding, etc.), the polishing sample (wafer) needs to be fixed on the polishing head of the polishing device for processing. The polishing head needs to provide uniformly distributed adsorption force to avoid local stress causing wafer warping or breakage. Therefore, the fixing design of the polishing sample on the polishing head is directly related to the process stability, wafer / sample surface uniformity and yield.

[0003] In the existing polishing process, the polishing sample is generally fixed directly on the polishing head, and the fixing of the polishing sample on the polishing head can be achieved mainly by vacuum adsorption, material adsorption, and paraffin adhesion. The vacuum adsorption is achieved by adsorbing the sample through the vacuum holes or grooves on the polishing head to ensure that the sample does not displace when rotating at high speed. The material adsorption is achieved by setting adsorbing materials on the polishing head to directly adsorb the sample, which can solve the problem of breakage of warped samples. The paraffin adhesion is achieved by directly adhering the sample with paraffin. However, the above fixing methods of directly fixing the polishing sample on the polishing head have some defects:

[0004] The vacuum adsorption method needs to introduce an additional vacuum system, which increases the complexity of the equipment. Moreover, the quality requirement of the sample is extremely high. If the warping degree is large, the sample will be broken. The material adsorption method is difficult to take down the adsorbed sample after thinning or polishing of large-size thin samples. Unbalanced force will also cause the sample to break. The paraffin adhesion method introduces paraffin, which will contaminate the sample and increase the additional cleaning cost. Moreover, after the paraffin is dissolved, it becomes liquid, which makes it difficult to ensure the uniformity of the adhesion of the sample to the polishing head. The thickness of the thinned or polished sample will have a deviation of several microns. SUMMARY

[0005] The present application provides a polishing sample carrier and a polishing device to solve the defects of the existing fixing method of directly fixing the polishing sample on the polishing head, realize the use of the carrier as an intermediate structure to solve the fixing problem between the sample and the polishing head of the polishing device, ensure uniformity and yield, and improve process efficiency.

[0006] The present application provides a polishing sample carrier, which comprises a carrier tray and an adhesion material layer. The carrier tray is adapted to be detachably connected to the polishing head of a polishing device. The adhesion material layer is arranged on the end surface of the carrier tray facing away from the polishing head. The adhesion material layer adopts pyrolytic adhesion material or photolytic adhesion material.

[0007] According to the polishing sample carrier provided by the application, the end surface of the carrier tray facing the grinding head is provided with a positioning reference mark and a quick connection structure, the positioning reference mark is a cross line or an optical alignment point, the quick connection structure comprises a vacuum suction hole array for being connected with a vacuum system of the grinding head, or comprises a magnetic adsorption layer for being adsorbed and fixed with corresponding magnetic structures of the grinding head, or comprises a buckle type mechanical locking mechanism for realizing quick disassembly and assembly with the grinding head.

[0008] According to the polishing sample carrier provided by the application, the end surface of the carrier tray facing the grinding head is provided with a positioning reference mark and a quick connection structure, the positioning reference mark is a cross line or an optical alignment point, the quick connection structure comprises a vacuum suction hole array for being connected with a vacuum system of the grinding head, or comprises a magnetic adsorption layer for being adsorbed and fixed with corresponding magnetic structures of the grinding head, or comprises a buckle type mechanical locking mechanism for realizing quick disassembly and assembly with the grinding head.

[0009] According to the polishing sample carrier provided by the application, the edge of the carrier tray is provided with an anti-collision buffer layer, the anti-collision buffer layer is made of a flexible material, and is used for preventing the carrier tray from being damaged by colliding with the grinding head during loading and unloading.

[0010] According to the polishing sample carrier provided by the application, the carrier tray is made of a composite material, the composite material is one of a carbon fiber reinforced polymer, a ceramic matrix composite material and a multi-layer metal structure, and the multi-layer metal structure comprises, from inside to outside, a titanium metal layer, a copper metal layer and a stainless steel metal layer.

[0011] According to the polishing sample carrier provided by the application, the surface of the adhesive material layer is formed with a micro-texture structure, and the micro-texture structure is one of a grid, a dot array or a groove.

[0012] According to the polishing sample carrier provided by the application, the outer periphery of the adhesive material layer is provided with a glue overflow blocking structure, and the glue overflow blocking structure is used for preventing the adhesive material layer from overflowing and polluting the sample during pressurization.

[0013] According to the polishing sample carrier provided by the application, the glue overflow blocking structure is an annular flange or a liquid-repellent coating layer fixedly arranged on the carrier tray, and a gap is reserved between the glue overflow blocking structure and the adhesive material layer.

[0014] According to the polishing sample carrier provided by the application, the glue overflow blocking structure is a shape memory alloy edge ring arranged around the edge of the adhesive material layer.

[0015] The application also provides a polishing equipment comprising a grinding head, and the grinding head is detachably connected with the polishing sample carrier according to any one of the above.

[0016] The grinding and polishing sample carrier provided by the application can be assembled on the grinding head of the grinding and polishing equipment, mainly comprises a carrier tray and an adhesive material layer, the carrier tray can be in any shape according to the condition of the grinding and polishing equipment, and is connected to the grinding head of the grinding and polishing equipment in a detachable manner, so that the installation and disassembly are facilitated; the adhesive material layer is arranged on the carrier tray and is used for bonding and fixing the grinding and polishing sample, and the adhesive material layer can be a pyrolytic material or a photolytic material. In the grinding and polishing process, the grinding and polishing sample is first bonded to the adhesive material layer on the carrier tray, then the carrier tray is assembled on the grinding head of the grinding and polishing equipment, after the grinding and polishing process, the carrier tray is taken off from the grinding head, and the grinding and polishing sample is not affected, since the adhesive material layer has the pyrolysis or photolysis characteristics, the grinding and polishing sample can be automatically separated from the carrier tray after pyrolysis or photolysis, the risk of warping or breaking of the sample after the grinding and polishing process is effectively reduced, and no additional cleaning process is needed. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the application or prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort.

[0018] Figure 1 Fig. 1 is a schematic view of the axis measurement structure of the grinding and polishing sample carrier provided by the application.

[0019] Figure 2 Fig. 2 is a schematic view of the cross-sectional structure of the grinding and polishing sample carrier provided by the application.

[0020] Reference signs:

[0021] 1, carrier tray; 2, adhesive material layer; 3, induction unit assembly; 4, anti-collision buffer layer; 5, glue overflow blocking structure; 6, grinding and polishing sample. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the application more clear, the technical solutions in the application will be described clearly and completely in the following with reference to the drawings in the application. Obviously, the described embodiments are some embodiments of the application, but not all the embodiments. Based on the embodiments in the application, all the other embodiments obtained by those skilled in the art without creative effort belong to the protection scope of the application.

[0023] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0024] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0025] In the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0026] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.

[0027] One embodiment of the present application provides a polishing sample carrier, which is combined with Figure 1 and Figure 2As shown, the polishing sample carrier includes a carrier tray 1 adapted to be detachably connected to a polishing head of a polishing device, and a layer of adhesive material 2 arranged on an end surface of the carrier tray 1 facing away from the polishing head, the layer of adhesive material 2 being made of a pyrolytic adhesive material or a photolytic adhesive material.

[0028] It can be understood that the polishing sample carrier of the embodiment can be assembled on the polishing head of the polishing device, mainly including the carrier tray 1 and the layer of adhesive material 2. The carrier tray 1 can be of any shape according to the condition of the polishing device, and is connected to the polishing head of the polishing device in a detachable manner, facilitating installation and removal. The layer of adhesive material 2 is arranged on the carrier tray 1 and used for bonding and fixing the polishing sample 6. The layer of adhesive material 2 can be a pyrolytic material (such as polylactic acid PLA or polyvinyl alcohol PVA, which can be softened or decomposed at 80-200°C) or a photolytic material (such as a photosensitive acrylic resin, which can be degraded under irradiation of a specific wavelength of ultraviolet light). During the polishing process, the polishing sample 6 is first bonded to the layer of adhesive material 2 on the carrier tray 1, and then the carrier tray 1 is assembled on the polishing head of the polishing device. After the polishing process, the carrier tray 1 is removed from the polishing head without affecting the polishing sample 6. Since the layer of adhesive material 2 has the characteristics of pyrolysis or photolysis, the polishing sample 6 can automatically separate from the carrier tray 1 after pyrolysis or photolysis, effectively reducing the risk of warping or breaking of the sample after the polishing process, and without increasing the additional cleaning process.

[0029] It should be understood that, in addition to the pyrolytic material and the photolytic material, the layer of adhesive material 2 can also be other adhesive materials suitable for decomposition, such as a temperature-sensitive adhesive layer with a working temperature range of 20-60°C (maintaining adhesive force >0.5MPa) and a debonding temperature of 80-200°C (adhesive force reduced to <0.01MPa); or an electric field responsive adhesive material with adhesive force reduced by 90% when a voltage of 1-5V is applied, a response time of <1s, no thermal effect, and being suitable for temperature-sensitive materials; or a pH value responsive hydrogel with adhesive force of 1-2MPa under neutral conditions, automatic debonding when pH>9 or pH<4, good biocompatibility, and being suitable for biochip processing.

[0030] In some embodiments of the polishing sample carrier of the present application, an end surface of the carrier tray 1 facing the polishing head is provided with a positioning reference mark and a quick connection structure (not shown in the figure). The positioning reference mark can be a crosshair or an optical alignment point, or can be a groove, a protrusion or a magnetic mark, etc., used for quickly aligning with the corresponding mounting structure of the polishing head of the polishing device, to ensure the position accuracy of the carrier tray 1 during installation.

[0031] The quick-connect structure of the carrier tray 1 can be a vacuum adsorption hole array for docking with the vacuum system of the grinding head; it can also be a magnetic adsorption layer (such as a permanent magnet or electromagnet) for adsorption and fixation with the corresponding magnetic structure of the grinding head; or it can be a snap-on mechanical locking mechanism for quick assembly and disassembly with the grinding head. The quick-connect structure of the carrier tray 1 allows for rapid assembly and disassembly with the grinding head. Before and after the grinding and polishing process, the grinding and polishing sample 6 can be bonded or detached from the grinding head from a position away from the grinding head. This simple operation solves the problem of uneven stress caused by misalignment between the carrier and the grinding head, improves grinding and polishing uniformity, reduces manual adjustment time, and increases production efficiency. It should be understood that the vacuum adsorption hole array, magnetic adsorption layer, or snap-on mechanical locking mechanism in this embodiment can all utilize existing known structures, and no specific structural limitations are imposed here.

[0032] In some embodiments of the polishing sample carrier of the present invention, see Figure 2 As shown, a sensing unit assembly 3 is embedded on the end face of the carrier tray 1 facing away from the grinding head. The sensing unit assembly 3 includes a temperature sensor and / or a stress sensing membrane. The sensing unit assembly 3 is located between the carrier tray 1 and the adhesive material layer 2.

[0033] Understandably, the temperature sensor and stress-sensing membrane of the sensing unit component 3 can monitor the temperature and deformation of the adhesive material layer 2 in real time, reflecting the temperature and stress state of the polished sample 6 during the polishing process. This avoids sample damage caused by overload or abnormal temperature, optimizes polishing parameters through sensor data, prevents overload or adhesive failure, and improves the level of process automation and yield. Furthermore, the temperature sensor and stress-sensing membrane can be equipped with an RFID chip for wireless data transmission, automatically recording usage history and process parameters, thus adding predictive maintenance functionality.

[0034] In some embodiments of the polishing sample carrier of the present invention, see again Figure 2 As shown, the edge of the carrier pallet 1 is provided with an anti-collision buffer layer 4. The anti-collision buffer layer 4 is made of a flexible material, such as silicone or polyurethane, to prevent the carrier pallet 1 from being damaged by collision with the grinding head during loading and unloading, thus extending its service life. The carrier pallet 1 is made of composite material, which is one of carbon fiber reinforced polymer, ceramic matrix composite material, and multilayer metal structure. The multilayer metal structure includes, from the inside out, a titanium metal layer, a copper metal layer, and a stainless steel metal layer.

[0035] It is understood that the carrier pallet 1 is made of a high-strength, high-flatness material, which can be glass, polymer (such as polyetheretherketone, polycarbonate), or metal (such as aluminum alloy, stainless steel), or a composite material as in this embodiment. The carrier pallet 1 is made of carbon fiber reinforced polymer, which has the advantages of being lightweight (density 1.5~1.8 g / cm³).3 Low coefficient of thermal expansion (2~5×10⁻⁶) -6 The advantages of using ceramic matrix composite materials to prepare the carrier tray 1 are good wear resistance and surface roughness Ra<0.1μm; the multi-layer metal structure formed by titanium metal layer, copper metal layer and stainless steel metal layer is used. The outer stainless steel metal layer enhances rigidity, the middle copper metal layer facilitates heat conduction, and the inner titanium metal layer is corrosion resistant.

[0036] In some embodiments of the polishing sample carrier of the present invention, the surface of the adhesive material layer 2 is formed with a microtextured structure, which is one of a grid, a dot matrix, or a groove. The thickness of the adhesive material layer 2 is generally 10~100μm, and the microtextured structure on the surface can enhance the bonding strength.

[0037] The surface of the adhesive material layer 2 is formed with a grid microtexture. The grid spacing is 0.5 mm, the line width is 0.1 mm, and the depth is 50 μm. The grid microtexture is orthogonally and uniformly distributed. The grid microtexture structure increases the surface area of ​​the adhesive material layer 2, thereby improving the mechanical interlocking force and bonding strength with the polished sample 6, increasing the bonding force by about 40% and preventing the sample from shifting during the polishing process. At the same time, the grid gaps provide diffusion channels for material decomposition during the pyrolysis or photolysis process. During the debonding, heat or ultraviolet light can be quickly transferred along the grid, so that the adhesive layer decomposes uniformly and reduces residue. The grid microtexture surface is suitable for the stable fixation of large-size samples (such as 12-inch wafers).

[0038] The surface of adhesive layer 2 is formed with a lattice microtexture. The lattice consists of an array of cylinders with a diameter of 100 μm and a height of 30 μm, spaced 200 μm apart. The lattice structure disperses adhesive stress through discrete contact points, while allowing the adhesive material to flow and fill the gaps under pressure, forming a uniform adhesive interface. This reduces air bubble residue between adhesive layer 2 and the polished sample 6, improves adhesive uniformity, and allows the lattice structure to decompose preferentially during debonding, reducing the mechanical force required for sample peeling. The lattice microtexture surface is suitable for ultra-thin samples (thickness <100 μm), avoiding cracking caused by localized stress.

[0039] The surface of the adhesive layer 2 is formed with grooved microtextures. The radial grooves are 80μm wide and 40μm deep, extending from the center outward. The groove structure guides the flow of coolant or polishing fluid during the grinding and polishing process, improves heat dissipation and chip removal, and reduces the temperature rise during the grinding and polishing process (measured to be 15℃ lower than the untextured structure). At the same time, the directional grooves control the pressure flow direction of the adhesive material, preventing the adhesive material from overflowing disorderly under pressure. Combined with the overflow blocking structure 5 mentioned later, it further reduces contamination. The grooved microtextured surface is suitable for high-speed grinding and polishing processes (speed > 500rpm).

[0040] Further, see also Figure 1As shown, the outer periphery of the adhesive material layer 2 is provided with a glue overflow blocking structure 5, which is used to prevent the adhesive material layer 2 from overflowing and contaminating the sample sheet when pressurized. The glue overflow blocking structure 5 can be an annular flange fixedly arranged on the carrier tray 1 or a liquid-repellent coating, with a gap reserved between the glue overflow blocking structure 5 and the adhesive material layer 2; or the glue overflow blocking structure 5 can be a shape memory alloy edge ring arranged around the edge of the adhesive material layer 2.

[0041] In some specific examples, the glue overflow blocking structure 5 adopts an annular flange structure, with a height of 0.5 mm and a width of 1 mm, and is made of stainless steel, with a gap of 0.2 mm between the edge of the adhesive material layer 2. When pressurized and bonded, the molten or softened adhesive material flows to the edge under pressure, and the annular flange forms a physical barrier to block the material from continuing to overflow, prevent the glue from contaminating the functional area of the sample sheet, and ensure the cleanliness of the polishing surface. The gap design allows a small amount of material to fill to balance the pressure and avoid local accumulation.

[0042] In other specific examples, the glue overflow blocking structure 5 adopts a liquid-repellent coating, which is a fluorinated liquid-repellent coating sprayed on the surface of the carrier tray 1, with a contact angle > 120°, and a coating width of 2 mm. The liquid-repellent coating has no physical protrusion from the adhesive material layer 2, and the liquid-repellent coating repels the adhesive material through the low surface energy property, so that the adhesive material cannot wet the coating area, thereby limiting the flow range. The liquid-repellent coating has no mechanical structure interference, is suitable for the flatness requirements of ultra-thin sample sheets (thickness < 50 μm), and avoids edge stress concentration caused by the flange.

[0043] In other specific examples, the glue overflow blocking structure 5 adopts a shape memory alloy edge ring, which can be a Ni-Ti alloy ring with an initial inner diameter that is 0.3 mm larger than the adhesive material layer 2, and a trigger temperature of 60℃. At room temperature, the shape memory alloy edge ring remains in an open state, facilitating the placement of the sample sheet during the bonding stage. When heated to 60℃, the shape memory alloy edge ring shrinks, with an inner diameter reduced by 0.2 mm, to form a tight enclosure for the adhesive material layer 2. When in the debonding stage, the shape memory alloy edge ring is heated to 80℃ again to undergo secondary shrinkage, assisting in the separation of the sample sheet. The shape memory alloy edge ring dynamically adapts to different pressure conditions, with better sealing performance than fixed structures, and the shrinkage force can help separate the adhesive layer from the sample sheet, reducing mechanical damage, and is particularly suitable for thermal debonding of the adhesive material.

[0044] Another aspect of the present application also provides a polishing equipment, which, in some embodiments, includes a polishing head, and the polishing head is detachably connected with the polishing sample carrier carrier of any one of the above embodiments or examples.

[0045] It can be understood that the grinding and polishing equipment of the embodiment has all the advantages of the grinding and polishing sample carrier in any of the above embodiments due to comprising the grinding and polishing sample carrier of the application. Specifically, the quick connection mechanism (such as a vacuum system, an electromagnetic adsorption structure or a buckle structure) matching the quick connection structure of the carrier tray 1 is arranged on the grinding head, and the quick connection mechanism can realize quick disassembly and assembly with the carrier tray 1, thereby reducing downtime. The vacuum system and the electromagnetic adsorption structure correspond to the vacuum adsorption hole array and the magnetic adsorption layer of the carrier tray 1 respectively, and can adapt to samples of different thicknesses by adjusting the adsorption force.

[0046] In some specific examples, during the grinding and polishing process, the grinding and polishing sample 6 is fixed to the carrier tray 1 through the adhesive material layer 2, and the carrier tray 1 is installed to the grinding head through the vacuum adsorption or quick connection mechanism; after the grinding and polishing is completed, the carrier tray 1 with the grinding and polishing sample 6 is removed from the grinding head, the adhesive material layer 2 is heated or irradiated with ultraviolet light to decompose it, and the grinding and polishing sample 6 is separated from the carrier tray 1.

[0047] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A polishing coupon carrier, comprising: The utility model relates to a kind of polishing sample carrier, including: Carrier tray (1), the carrier tray (1) is suitable for detachable connection with the polishing head of polishing equipment; Bonding material layer (2) is arranged on the end face of the carrier tray (1) facing away from the polishing head, and the bonding material layer (2) uses pyrolytic bonding material or photolytic bonding material; The outer periphery of the bonding material layer (2) is provided with glue overflow blocking structure (5), and the glue overflow blocking structure (5) is used to prevent the bonding material layer (2) from overflowing and polluting the sample when being pressed; The glue overflow blocking structure (5) is a shape memory alloy edge ring arranged around the edge of the bonding material layer (2), which is a Ni-Ti alloy ring with an initial inner diameter larger than the bonding material layer (2) and a trigger temperature of 60 DEG C. The shape memory alloy edge ring remains open at room temperature, facilitating sample bonding stage placement, and shrinks with a reduced inner diameter when heated to 60 DEG C, tightly surrounding the bonding material layer (2);When in debonding stage, the shape memory alloy edge ring shrinks again when heated to 80 DEG C, assisting in stripping the sample.

2. The polishing coupon carrier of claim 1, wherein, The end face of the carrier tray (1) facing the polishing head is provided with positioning reference marks and quick connection structure, the positioning reference marks are cross lines or optical alignment points, and the quick connection structure includes: Vacuum suction hole array for interfacing with the vacuum system of the polishing head; Or, Magnetic adsorption layer for adsorbing and fixing with the corresponding magnetic structure of the polishing head; Or, Buckle type mechanical locking mechanism for quick disassembly and assembly with the polishing head.

3. The polishing coupon carrier of claim 1, wherein, The end face of the carrier tray (1) facing away from the polishing head is embedded with an induction unit assembly (3), which includes a temperature sensor and / or a stress sensing film, and the induction unit assembly (3) is located between the carrier tray (1) and the bonding material layer (2).

4. The polishing coupon carrier of claim 1, wherein, The edge of the carrier tray (1) is provided with a collision buffer layer (4) made of flexible material to prevent damage to the polishing head during loading and unloading of the carrier tray (1).

5. The polishing coupon carrier of any one of claims 1 to 4, wherein The carrier tray (1) is made of composite material, which is one of carbon fiber reinforced polymer, ceramic matrix composite and multi-layer metal structure, and the multi-layer metal structure includes titanium metal layer, copper metal layer and stainless steel metal layer from inside to outside.

6. The polishing coupon carrier of claim 1, wherein, The surface of the bonding material layer (2) forms a micro-texture structure, which is one of grid, dot array or groove.

7. A polishing apparatus comprising a polishing head, characterized by The polishing head is detachably connected with the polishing sample carrier of any one of claims 1-6.

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