System and method for measuring the temperature of the outer surface of a spacecraft return capsule and computing device

Abstract

The application provides a system and method for measuring the surface temperature of a spacecraft return capsule and a computing device, the surface of the spacecraft return capsule has a thermal insulation layer, the system comprises a sensor assembly, the sensor assembly is embedded in the thermal insulation layer, and the sensor assembly is used for measuring the intensity of thermal radiation; a computing unit is arranged in the bottom cabin of the spacecraft return capsule, used for receiving the intensity of thermal radiation data from the sensor assembly, and calculating the surface temperature of the return capsule according to the intensity of thermal radiation data; a storage unit is in communication connection with the computing unit, used for saving the intensity of thermal radiation data of the sensor assembly and the calculation result of the computing unit. According to the technical scheme of the application, the surface temperature of the high-speed moving return capsule is measured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of space temperature measurement, and in particular to a system and method for measuring the temperature of the outer surface of a spacecraft return capsule and a computing device. BACKGROUND

[0002] A spacecraft is an important means of transportation for humans to build space stations in space. The return capsule is a cabin section for astronauts to return to Earth. Unlike the orbital cabin, the return capsule must maintain airtightness under high temperature and high pressure. When the return capsule of the spacecraft enters the atmosphere at high speed, it is in a state of burning and sticking with the surrounding gas molecules on the outer surface of the return capsule due to friction with the atmosphere. The surface temperature is not easy to dissipate, forming a high-temperature area with a temperature of several thousand degrees Celsius.

[0003] The extreme environment faced by the spacecraft return capsule when re-entering the Earth's atmosphere poses extremely high requirements for the thermal protection system design and temperature monitoring technology. During this process, it is crucial to research and ensure accurate temperature measurement.

[0004] Therefore, a technical solution is needed to measure the temperature of the outer surface of the return capsule moving at high speed. SUMMARY

[0005] The present application aims to provide a system and method for measuring the temperature of the outer surface of a spacecraft return capsule and a computing device, which can measure the temperature of the outer surface of the return capsule moving at high speed and meet the high precision of measurement.

[0006] According to an aspect of the present application, a system for measuring the temperature of the outer surface of a spacecraft return capsule is provided, which comprises:

[0007] A sensor assembly is embedded in the thermal insulation layer, and the sensor assembly is used to measure the intensity of thermal radiation.

[0008] A computing unit is arranged in the bottom cabin of the spacecraft return capsule, which is used to receive the thermal radiation intensity data from the sensor assembly and calculate the temperature of the outer surface of the return capsule according to the thermal radiation intensity data.

[0009] A storage unit is in communication connection with the computing unit, which is used to save the thermal radiation intensity data of the sensor assembly and the calculation results of the computing unit.

[0010] According to some embodiments, the sensor assembly comprises:

[0011] A photoelectric converter is used to sense the intensity of thermal radiation and convert the intensity of thermal radiation into an electrical signal.

[0012] an analog-to-digital converter that converts the electrical signal of the photoelectric converter into a digital signal.

[0013] According to some embodiments, the computing unit calculates the return cabin outer surface temperature according to the following formula:

[0014] ∮(γ, T) = αγ -5 (exp(β / γT) - 1) -1

[0015] wherein ∮(γ, T) is the thermal radiation intensity of the return cabin outer surface, γ is the radiation wavelength, T is the temperature value corresponding to the thermal radiation intensity, α and β are coefficients, the unit of α is watt·cm 2 , and the unit of β is cm·K, wherein α and β are pre-calibrated according to the temperature measurement range.

[0016] According to some embodiments, the thermal insulation layer comprises a first thermal insulation layer and a second thermal insulation layer, and the sensor assembly comprises a first group of sensors and a second group of sensors.

[0017] The first group of sensors is embedded in the first thermal insulation layer at a predetermined interval angle in the circumferential direction.

[0018] The second group of sensors is embedded in the second thermal insulation layer at a predetermined interval angle in the circumferential direction, and the second group of sensors is arranged staggered relative to the first group of sensors.

[0019] According to some embodiments, the first group of sensors comprises four sensors, and the interval between adjacent sensors is 90°.

[0020] The first group of sensors is arranged staggered relative to the second group of sensors by 45° in the circumferential direction.

[0021] According to another aspect of the present application, a method for measuring the temperature of the outer surface of a spacecraft return cabin is provided, comprising:

[0022] Obtaining thermal radiation intensity from a sensor assembly embedded in the thermal insulation layer of the outer surface of the spacecraft return cabin;

[0023] Calculating the temperature of the outer surface of the return cabin according to the thermal radiation intensity data.

[0024] According to some embodiments, the formula for calculating the temperature of the outer surface of the return cabin is:

[0025] ∮(γ, T) = αγ -5 (exp(β / γT) - 1) -1

[0026] In the formula, ∮(γ, T) is the thermal radiation intensity of the return cabin outer surface, γ is the radiation wavelength, T is the temperature value, and α and β are coefficients, the unit of α is watt·cm 2 , and the unit of β is cm·K, wherein the radiation wavelength γ is determined according to a temperature measurement range, and α and β are calibrated in advance according to the temperature measurement range.

[0027] According to some embodiments, acquiring the thermal radiation intensity comprises:

[0028] The thermal radiation intensity is sensed by a photoelectric converter in the sensor assembly and converted into an electrical signal.

[0029] The electrical signal of the photoelectric receiving element is converted into a digital signal by an analog-to-digital converter in the sensor assembly.

[0030] According to some embodiments, the sensor assembly is embedded in a thermal insulation layer of a spacecraft return cabin outer surface, and comprises:

[0031] The thermal insulation layer comprises a first thermal insulation layer and a second thermal insulation layer, and the sensor assembly comprises a first group of sensors and a second group of sensors, the first group of sensors being embedded in the first thermal insulation layer at a predetermined interval angle in the circumferential direction.

[0032] The second group of sensors is embedded in the second thermal insulation layer at a predetermined interval angle in the circumferential direction, and the second group of sensors is arranged staggered relative to the first group of sensors.

[0033] According to another aspect of the present application, a computing device is provided, comprising:

[0034] a processor; and

[0035] a memory storing a computer program, which, when executed by the processor, causes the processor to perform the method according to any one of the above.

[0036] According to embodiments of the present application, the sensor assembly is embedded in the thermal insulation layer, without affecting the state of the measured object, so that not only non-destructive detection of the temperature of the return cabin outer surface can be achieved, but also the thermal radiation intensity can be effectively measured. The computing unit receives the thermal radiation intensity data from the sensor assembly for calculating the temperature of the return cabin outer surface. The computing unit is arranged in the bottom cabin of the return cabin, away from the high temperature area, thereby reducing the risk of failure caused by overheating and enhancing the safety of the system. The storage unit is in communication connection with the computing unit, receives the data collected by the sensor and the information processed by the computing unit, and the storage unit retains the original data and the processing result, so that subsequent measurement data can be stored and retrieved.

[0037] According to some embodiments, the first group of sensors and the second group of sensors are embedded in the first thermal insulation layer and the second thermal insulation layer respectively, and the second group of sensors is arranged staggered relative to the first group of sensors. By embedding the sensor assemblies in the thermal insulation layer at a predetermined interval angle along the circumferential direction, the full range of the return capsule outer surface temperature can be monitored. Such a layout helps to capture the temperature distribution of the entire surface, avoiding errors in the calculation results due to the unmonitored local high temperature area. The second group of sensors is arranged staggered relative to the first group of sensors, forming a redundant system. If a group of sensors fails or fails, the other group of sensors can still provide effective temperature data, thereby improving the overall reliability and fault tolerance of the system.

[0038] According to some embodiments, the return capsule outer surface temperature is calculated by a formula, and the coefficient in the formula is determined by the data after black body calibration, thereby improving the accuracy of temperature measurement and ensuring the accuracy of the temperature measurement system in a specific temperature range.

[0039] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows.

[0041] Figure 1 A schematic diagram of a system for measuring the temperature of the outer surface of a spacecraft return capsule according to an example embodiment is shown.

[0042] Figure 2A A cross-sectional view showing the placement of a first group of sensors on the outer surface of a spacecraft return capsule according to an example embodiment is shown.

[0043] Figure 2B A cross-sectional view showing the placement of a second group of sensors on the outer surface of a spacecraft return capsule according to an example embodiment is shown.

[0044] Figure 3 A flowchart of a method for measuring the temperature of the outer surface of a spacecraft return capsule according to an example embodiment is shown.

[0045] Figure 4 A block diagram of a computing device according to an example embodiment is shown. DETAILED DESCRIPTION

[0046] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings. Example embodiments, however, can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. Like reference numerals refer to like elements throughout the several views and, thus, description of the same elements will not be repeated.

[0047] Moreover, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the

[0048] The block diagrams in the drawings show only the functionality and arrangement of physical blocks, these can not necessarily correspond to physical entities in an implementation. That is, these blocks can be implemented in software, or in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0049] The flow diagrams in the drawings show example sequences of operations, not necessarily to be understood as necessarily including all operations and steps, nor necessarily to be performed in the order described. For example, some operations / steps can be performed in different order, or combined or partially combined, and the actual order can vary from case to case.

[0050] It should be understood that although the terms first, second, third, etc. can be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. Thus, a first component discussed below could be termed a second component without departing from the teachings of the present concept. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0051] The user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties, and the collection, use and processing of the relevant data need to comply with the relevant laws, regulations and standards of the relevant countries and regions, and provide corresponding operation portals for the user to choose authorization or refusal.

[0052] Those skilled in the art can understand that the drawings are only schematic views of the example embodiments, and the modules or flows in the drawings are not necessarily essential for implementing the present application, and thus cannot be used to limit the protection scope of the present application.

[0053] When the return capsule of a spacecraft enters the atmosphere at a high speed, the thickness of the atmosphere is very large, and due to friction with the atmosphere, the surrounding gas molecules and the outer surface of the return capsule are in a burning and sticking state, the surface temperature is not easy to dissipate, and a high temperature zone is formed in this area, and the temperature can reach several thousand degrees Celsius.

[0054] Currently, there are three main methods for heat protection and heat dissipation of the return capsule internationally. The first method is to prevent the outer surface of the return capsule from being burned through the cabin wall due to severe friction with the atmosphere, and to coat the surface of the return capsule with ablation materials. These high polymer materials include phenolic and quartz glass, asbestos and other composite materials. The heat is dissipated by using the methods of melting, pyrolysis, evaporation, sublimation and gasification of the materials at high temperature. The second method is radiation heat protection, which uses ceramic and titanium alloy materials with very high emissivity to radiate heat. The third method is heat absorption heat protection, which uses metal materials with large heat capacity, high melting point and good heat conduction performance in some parts of the return capsule to absorb a large amount of aerodynamic heat.

[0055] Understanding the temperature of the return capsule at different altitudes during the return to the atmosphere, according to the different characteristics of heat protection of the return capsule at different altitudes, measuring the surface temperature of the return capsule during reentry, can promote the research on heat insulation high polymer, ceramic, titanium alloy and other materials. For the thermal stability and chemical stability of high-efficiency heat insulation materials, high-temperature aerogel materials and foam carbon materials under extreme high-temperature conditions, such as high-thermal-conductivity carbon-carbon bond composite materials such as nanometer b-alkyl pipe, and the thermal chemical properties of high-temperature resistant thermal control coating materials, targeted solutions are given to provide reliable data support.

[0056] Currently, most of the infrared temperature measurement at home and abroad adopts the emissivity correction scheme. The emissivity correction scheme sets the black body as the maximum emissivity of 1, and the actual object emissivity is less than 1, but is affected by factors such as the material, color and surface roughness of the actual object, and the specific value is difficult to determine.

[0057] Therefore, the present application provides a system for measuring the temperature of the outer surface of a spacecraft return capsule, which realizes the temperature measurement of the outer surface of the high-speed moving return capsule.

[0058] The example embodiments of the present application will be described below with reference to the drawings.

[0059] The return capsule re-enters the atmosphere under the action of gravity, due to the dramatic changes in air flow, in order to keep the high-speed flying return capsule stable attitude, made the bottom of the clock big small, to overcome the disturbance of high altitude air flow. In order to avoid the local overheating of the surface of the return capsule, the flight state is adjusted by self-rotation and rolling, so that the surface is uniformly heated. The outer surface of the spacecraft return capsule has a thermal insulation layer. When the return capsule enters the earth's atmosphere at high speed, the surface temperature will rise sharply due to the violent friction with air molecules, which may reach several thousand degrees Celsius. The main function of the thermal insulation layer is to protect the inside of the return capsule from the external high temperature, and at the same time to reduce the heat conduction to the inside as much as possible.

[0060] Figure 1 The system for measuring the temperature of the outer surface of the spacecraft return capsule according to the example embodiment is shown.

[0061] According to the example embodiment, referring to Figure 1 , the system for measuring the temperature of the outer surface of the spacecraft return capsule includes a sensor assembly 101, a computing unit 103 and a storage unit 105. The sensor assembly 101 is embedded in the thermal insulation layer, the sensor assembly 101 is used to measure the intensity of thermal radiation, the computing unit 103 is arranged in the bottom cabin of the spacecraft return capsule, and is used to receive the intensity of thermal radiation data from the sensor assembly 101, the storage unit 105 is in communication connection with the computing unit 103, and the storage unit 105 is used to save the intensity of thermal radiation data of the sensor assembly 101 and the calculation results of the computing unit 103.

[0062] The sensor assembly 101 is composed of a photoelectric converter and an analog-to-digital converter. When the spacecraft enters the atmosphere, due to the high temperature environment generated by high-speed friction, the photoelectric converter is used to monitor the temperature distribution of the outer surface of the return capsule. The high temperature radiation generated by the friction of the outer surface of the return capsule with the atmosphere is directly received by the photoelectric converter, and the intensity of the thermal radiation is converted into an electrical signal. The analog-to-digital converter processes and converts the electrical signal of the photoelectric converter. The analog signal generated by the photoelectric converter is converted into a form that is easier to process by the analog component, and the pre-processed electrical signal is converted into a digital signal by the digital quantity acquisition component.

[0063] The photoelectric converter and the analog-to-digital converter are calibrated at close range with a black body. The calibration object is the photoelectric converter and the complete circuit board of the analog-to-digital module. After the photoelectric converter is welded on the circuit board, the temperature calibration is carried out in front of the black body for measurement before actual application. For example, the digital voltage of the circuit board corresponding to the black body with a temperature of m (unit °C) is n (unit V). The intensity of the radiation is converted into an electrical signal, and then the electrical signal is matched with the temperature to provide a standard reference point for the photoelectric converter.

[0064] Figure 2AA cross-sectional view showing placement of a first set of sensors on the outer surface of a spacecraft return capsule according to an example embodiment.

[0065] Figure 2B A cross-sectional view showing placement of a second set of sensors on the outer surface of a spacecraft return capsule according to an example embodiment.

[0066] The spacecraft thermal insulation layer has a first thermal insulation layer 201 and a second thermal insulation layer 203, the sensor assembly can include a first set of sensors and a second set of sensors, the first set of sensors is embedded in the first thermal insulation layer 201 at a predetermined interval angle in the circumferential direction, the second set of sensors is embedded in the second thermal insulation layer 203 at a predetermined interval angle in the circumferential direction, and the first set of sensors is arranged staggered relative to the second set of sensors.

[0067] Each layer of the spacecraft thermal insulation layer has a certain thickness, for example, each layer of the thermal insulation layer is 3 centimeters thick, see Figure 2A The first set of sensors is embedded in the first thermal insulation layer 201 along the outer diameter of the return capsule, assuming that the first set of sensors has four sensors 101, then the interval between adjacent sensors 101 is 90°; see Figure 2B The second set of sensors is embedded in the second thermal insulation layer 203, and the second set of sensors also has four sensors 101, the interval between adjacent sensors is 90°, and the first set of sensors is arranged staggered by 45° in the circumferential direction relative to the second set of sensors.

[0068] The physical model of an ideal black body is described by Planck's formula:

[0069] W(λ, T) = C1λ -5 (exp(C2 / λT) - 1) -1

[0070] In the formula, W(λ, T) is the spectral power intensity of black body radiation, with units of watts·centimeter 2 ·micron -1 ; C1 = 3.74 x 10 -12 is the first radiation constant, with units of watts·centimeter 2 ; C2 = 1.43 is the second radiation constant, with units of centimeter·K. λ is the spectral radiation wavelength, with units of microns; and T is the black body temperature, with units of K.

[0071] In the Planck temperature measurement formula, C1 and C2 are only two constant terms applicable in the case of a black body radiator.

[0072] The inventor found that these two constants can be changed into variables that vary with factors such as the material composition, properties, shape, etc. of the radiator, and the concept of emissivity coefficient as a parameter is introduced. The temperature measurement formula still retains the kernel of the Planck formula, i.e. the temperature measurement formula according to the present application is a creative extension of the Planck formula.

[0073] According to an example embodiment, the calculation unit calculates the return cabin outer surface temperature by a predetermined formula as follows:

[0074] ∮(γ, T) = αγ -5 (exp(β / γT) - 1) -1

[0075] In the formula, ∮(γ, T) is the thermal radiation intensity of the return cabin outer surface, γ is the radiation wavelength, T is the temperature value corresponding to the thermal radiation intensity, α and β are coefficients, the unit of α is watt·cm 2 , and the unit of β is cm·K, wherein the radiation wavelength γ is determined according to the temperature measurement range, and α and β are calibrated in advance according to the temperature measurement range.

[0076] The coefficients α and β in the example embodiment are variable coefficients, and α and β change with the temperature and the radiation wavelength of the outer surface. The values of α and β also change in different temperature ranges. According to some embodiments, the process of determining α and β is as follows: first, the black body is adjusted to 1000°C and 1100°C, the sensor assembly is placed at a distance of 2 mm receiving aperture and 5 mm close distance, 5 mm is the distance between the sensor assembly and the surface of the measured material, and the thermal radiation intensity at the two temperatures is measured respectively. In engineering practice, the wavelength range and material corresponding to the photodetector are selected according to the temperature measurement range, for example, short-wave for high temperature measurement and long-wave for low temperature measurement. The radiation wavelength of 0.94 um is used for testing at the temperature range of 1000°C and 1100°C. The radiation intensity at 1000°C is ∮1(γ, 1000°C), and the radiation intensity at 1100°C is ∮2(γ, 1100°C).

[0077] The results of the calibration are substituted into the foregoing formula, and ∮1(γ, 1000°C) and ∮2(γ, 1100°C) obtained are solved to obtain:

[0078] ∮1(γ, 1000°C) = αγ -5 (exp(β / γ1000°C) - 1) -1

[0079] ∮2(γ, 1100°C) = αγ -5 (exp(β / γ1100°C) - 1) -1

[0080] The values of the coefficients α and β changing with the temperature and the radiation wavelength are obtained.

[0081] The obtained values of the coefficients α and β are substituted into the calculation formula, and the relationship between the thermal radiation intensity and the temperature can be determined, so that the return cabin outer surface temperature between 1000°C and 2000°C can be measured in real time.

[0082] Similarly, for higher return capsule outer surface temperature, black body calibration sensor assemblies of 2000°C and 2100°C can be selected to accurately measure the return capsule outer surface temperature in the temperature range of 2000°C to 3000°C. Black body calibration sensor assemblies of 2400°C and 2500°C can be selected to measure the return capsule outer surface temperature in the temperature range of 3000°C to 4000°C and higher.

[0083] According to some embodiments, a plurality of temperature can be used to obtain a plurality of parameter values and stored in a database. When actually measuring the temperature, the corresponding parameter values can be obtained from the database for temperature measurement calculation according to the measured temperature and temperature change.

[0084] Using the traditional method, a black body corresponding to the temperature must be physically calibrated. If a 3000°C black body cannot be made, calibration cannot be performed, and temperature measurement cannot be performed. Using the method of the example embodiment, only one calibration using a black body is required. Using data combined with a simple algorithm, the black body data at other temperatures can be calculated.

[0085] Through the black body calibration sensor assembly, two temperature points close to but not the same are set for calibration to capture the response characteristics of the sensor in the working temperature range. More temperature points close to but not the same can also be set for calibration, which helps to identify and compensate for the nonlinear response of the sensor. Using multi-point calibration helps to capture the response characteristics of the sensor in this temperature range and make appropriate corrections.

[0086] The segmented calibration strategy is suitable for spacecraft return capsules and other devices that need to work in extreme environments. As the temperature rises, the radiation characteristics of the material may change. Therefore, different temperature segments are recalibrated to adapt to new temperature conditions, ensuring the linearity and accuracy of the sensor assembly in different temperature ranges. Through accurate calibration, the reliability and accuracy of the temperature measurement system are improved.

[0087] Figure 3 A flowchart of a method for measuring the temperature of the outer surface of a spacecraft return capsule according to an example embodiment is shown.

[0088] Referring to Figure 3 In S101, the thermal radiation intensity is obtained, which is from a sensor assembly buried in the heat insulation layer of the outer surface of the spacecraft return capsule.

[0089] According to an example embodiment, the thermal radiation intensity is obtained using a sensor assembly. The thermal radiation intensity is sensed by a photoelectric converter in the sensor assembly and converted into an electrical signal. The electrical signal of the photoelectric receiving element is converted into a digital signal by an analog-to-digital converter in the sensor assembly.

[0090] The sensor assembly is embedded in a thermal insulation layer of an outer surface of a spacecraft return capsule, the thermal insulation layer having a first thermal insulation layer and a second thermal insulation layer, the sensor assembly having a first group of sensors and a second group of sensors. The first group of sensors is embedded in the first thermal insulation layer at a predetermined interval angle in a circumferential direction, and the second group of sensors is embedded in the second thermal insulation layer at a predetermined interval angle in the circumferential direction, the second group of sensors being staggered relative to the first group of sensors in the circumferential direction.

[0091] For example, the first group of sensor assembly has four sensors, and adjacent sensors are spaced apart by 90°; the second group of sensor assembly is embedded in the second thermal insulation layer, and the second group of sensor assembly also has four sensors, and adjacent sensors are spaced apart by 90°, and the first group of sensors is staggered relative to the second group of sensors by 45° in the circumferential direction.

[0092] At S103, the temperature of the outer surface of the return capsule is calculated according to the thermal radiation intensity data.

[0093] According to an example embodiment, the temperature of the outer surface of the return capsule is calculated by a predetermined formula, and the calculation formula is as follows:

[0094] ∮(γ, T) = αγ -5 (exp(β / γT) - 1) -1

[0095] In the formula, ∮(γ, T) is the thermal radiation intensity of the outer surface of the return capsule, γ is the radiation wavelength, T is the temperature value corresponding to the thermal radiation intensity, α and β are coefficients, the unit of α is watt·cm 2 , and the unit of β is cm·K, wherein the radiation wavelength γ is determined according to a temperature measurement range, and α and β are calibrated in advance according to the temperature measurement range.

[0096] The coefficients α and β in the example embodiment are variable coefficients, and α and β change with the temperature of the outer surface and the radiation wavelength. In different temperature ranges, the values of α and β also change.

[0097] According to some embodiments, the process of determining α and β is as follows: first, a black body is adjusted to 1000°C and 1100°C, and the thermal radiation intensity at these two temperatures is measured respectively. Multi-point calibration is selected, and setting two temperature points close to but not the same is helpful to capture the response characteristics of the sensor in this temperature range and to make appropriate correction.

[0098] The radiation intensity at 1000℃ is obtained as ∮1(γ, 1000℃) and the radiation intensity at 1100℃ is obtained as ∮2(γ, 1100℃). The calibration results are sent to the calculation and storage units. The obtained ∮1(γ, 1000℃) and ∮2(γ, 1100℃) are combined to obtain the coefficients α and β that vary with temperature and radiation wavelength. Substituting the obtained α and β coefficient values ​​into the calculation formula clarifies the relationship between thermal radiation intensity and temperature, allowing for real-time measurement of the reentry capsule's outer surface temperature between 1000℃ and 2000℃.

[0099] For higher temperatures on the outer surface of the return capsule, blackbody-calibrated sensor assemblies with 2000℃ and 2100℃ can be used to measure the outer surface temperature of the return capsule in the temperature range of 2000℃ to 3000℃. Blackbody-calibrated sensor assemblies with 2400℃ and 2500℃ can be used to measure the outer surface temperature of the return capsule in the temperature range of 3000℃ to 4000℃.

[0100] The method for measuring the outer surface temperature of a spacecraft reentry capsule proposed in this invention enables real-time measurement of the outer surface temperature of a high-speed moving reentry capsule, and has the advantages of high measurement accuracy and the ability to store and play back the measurement data.

[0101] Figure 4 A block diagram of a computing device according to an exemplary embodiment is shown.

[0102] like Figure 4 As shown, the computing device 30 includes a processor 12 and a memory 14. The computing device 30 may also include a bus 22, a network interface 16, and an I / O interface 18. The processor 12, memory 14, network interface 16, and I / O interface 18 can communicate with each other via the bus 22.

[0103] Processor 12 may include one or more general-purpose CPUs (Central Processing Units), microprocessors, or application-specific integrated circuits, for executing relevant program instructions. According to some embodiments, computing device 30 may also include a high-performance display adapter (GPU) 20 for accelerating processor 12.

[0104] Memory 14 may include a machine-readable medium in the form of volatile memory, such as random access memory (RAM), read-only memory (ROM), and / or cache memory. Memory 14 is used to store one or more programs containing instructions, as well as data. Processor 12 may read the instructions stored in memory 14 to perform the methods described above according to embodiments of the present invention.

[0105] The computing device 30 can also communicate with one or more networks via the network interface 16. The network interface 16 can be a wireless network interface.

[0106] Bus 22 can include an address bus, a data bus, a control bus, etc. Bus 22 provides a path for exchanging information between the components.

[0107] It should be noted that, in the actual implementation process, the computing device 30 can also include other components necessary for normal operation. In addition, those skilled in the art can understand that the above device can also only contain components necessary for the implementation of the embodiments of the present application, and does not necessarily contain all the components shown in the figure.

[0108] The present application also provides a computer readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above method. The computer readable storage medium can include but is not limited to any type of disk, including floppy disks, optical disks, DVDs, CD-ROMs, micro-drives, and magneto-optical disks, ROM, RAM, EPROM, EEPROM, DRAM, VRAM, flash memory device, magnetic or optical card, nanosystem (including molecular memory IC), network storage device, cloud storage device, or any type of medium or device suitable for storing instructions and / or data.

[0109] The embodiments of the present application also provide a computer program product, which includes a non-transitory computer readable storage medium storing a computer program, the computer program being operable to cause a computer to perform some or all of the steps of any one of the methods described in the above method embodiments.

[0110] Those skilled in the art can clearly understand that the technical solutions of the present application can be realized by means of software and / or hardware. The "unit" and "module" in the present specification refer to software and / or hardware that can independently complete or cooperate with other components to complete a specific function, wherein the hardware can be, for example, a field programmable gate array, an integrated circuit, etc.

[0111] It should be noted that for the foregoing method embodiments, in order to simply describe, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited by the described action sequence, because according to the present application, certain steps can be performed in other order or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the present application.

[0112] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0113] In several embodiments of the present application, it should be understood that the disclosed apparatus can be implemented in other manners. For example, the division of the apparatus embodiments is merely an example, and for other division manners, the embodiments of the present application can be implemented in other manners, or some features can be ignored, or some features can be combined. In addition, the coupling or direct coupling or communication connection between the shown or discussed units can be indirect coupling or communication connection, and can be in electrical, mechanical or other forms.

[0114] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one place or distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0115] In addition, the functional units in each embodiment of the present application can be integrated into a processing unit, or each unit can be physically present separately, or two or more units can be integrated into one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0116] If the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for making a computer device (which can be a personal computer, a server or a network device, etc.) execute all or part of the steps of the embodiments of the present application.

[0117] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0118] The exemplary embodiments of the present application are specifically shown and described above. It should be understood that the present application is not limited to the detailed structure, arrangement or implementation method described herein; on the contrary, the present application is intended to cover various modifications and equivalent arrangements within the spirit and scope of the appended clauses.

Claims

1. A system for measuring the temperature of the outer surface of a spacecraft reentry capsule, the outer surface of which has a heat-insulating layer, characterized in that, The system includes: A sensor assembly, embedded in the thermal insulation layer, is used to measure thermal radiation intensity; A computing unit, located inside the bottom compartment of the spacecraft's return capsule, is used to receive thermal radiation intensity data from the sensor assembly and calculate the temperature of the outer surface of the return capsule based on the thermal radiation intensity data. A storage unit, which is communicatively connected to the computing unit, is used to store the thermal radiation intensity data of the sensor assembly and the calculation results of the computing unit; in, The heat insulation layer includes a first heat insulation layer and a second heat insulation layer, and the sensor assembly includes a first set of sensors and a second set of sensors; The first set of sensors is embedded in the first heat insulation layer along the circumferential direction at predetermined intervals; The second set of sensors is embedded in the second heat insulation layer at predetermined intervals along the circumferential direction, and the second set of sensors is staggered relative to the first set of sensors.

2. The system according to claim 1, characterized in that, The sensor assembly includes: A photoelectric converter, wherein the photoelectric converter is used to sense the thermal radiation intensity and convert the thermal radiation intensity into an electrical signal; An analog-to-digital converter (ADC) converts the electrical signal from the photoelectric converter into a digital signal.

3. The system according to claim 1, characterized in that, The calculation unit calculates the outer surface temperature of the return capsule according to the following formula: (γ, T) = α γ -5 ﹝exp ( β / γT )-1﹞ -1 In the formula, (γ, T) represents the thermal radiation intensity of the outer surface of the return capsule, where γ is the radiation wavelength, T is the temperature value corresponding to the thermal radiation intensity, and α and β are coefficients, with α measured in watts. centimeter 2 The unit of β is centimeters. K, where α and β are pre-calibrated according to the temperature measurement range.

4. The system according to claim 1, characterized in that, The first group of sensors includes four sensors, with adjacent sensors spaced 90° apart; The first set of sensors is offset by 45° relative to the second set of sensors in the circumferential direction.

5. A method for measuring the temperature of the outer surface of a spacecraft reentry capsule, characterized in that, include: The thermal radiation intensity is obtained from a sensor assembly embedded in the thermal insulation layer on the outer surface of the spacecraft's return capsule. The external surface temperature of the return capsule was calculated based on the aforementioned thermal radiation intensity data. in, The heat insulation layer includes a first heat insulation layer and a second heat insulation layer, and the sensor assembly includes a first set of sensors and a second set of sensors; The first set of sensors is embedded in the first heat insulation layer along the circumferential direction at predetermined intervals; The second set of sensors is embedded in the second heat insulation layer at predetermined intervals along the circumferential direction, and the second set of sensors is staggered relative to the first set of sensors.

6. The method according to claim 5, characterized in that, The formula for calculating the outer surface temperature of the return capsule is: (γ, T) = α γ -5 ﹝exp ( β / γT )-1﹞ -1 In the formula, (γ, T) represents the thermal radiation intensity of the outer surface of the return capsule, where γ is the radiation wavelength, T is the temperature value, and α and β are coefficients, with α measured in watts. centimeter 2 The unit of β is centimeters. K, wherein the radiation wavelength γ is determined according to the temperature measurement range, and α and β are pre-calibrated according to the temperature measurement range.

7. The method according to claim 5, characterized in that, The sensor assembly includes: A photoelectric converter, wherein the photoelectric converter is used to sense the thermal radiation intensity and convert the thermal radiation intensity into an electrical signal; An analog-to-digital converter (ADC) converts the electrical signal from the photoelectric converter into a digital signal.

8. A computing device, characterized in that, include: processor; as well as A memory storing a computer program that, when executed by the processor, causes the processor to perform the method as described in any one of claims 5-7.

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