Part size precision analysis method and device, electronic equipment and storage medium

Abstract

The invention discloses a part size precision analysis method and device, electronic equipment and a storage medium. The part size precision analysis method comprises the steps that a three-dimensional geometric model of a to-be-assembled part is constructed; based on the three-dimensional geometric model of the to-be-assembled part, determining part reference and matching characteristics; obtaining an assembly process, and determining an assembly sequence and an assembly positioning mode based on at least one of the assembly process, the part reference and the matching characteristics; performing assembly simulation on the three-dimensional geometric model of the to-be-assembled part according to the assembly sequence and the assembly positioning mode to obtain a virtual assembly model of the product; performing dimension chain analysis on the virtual assembly model, and determining a critical dimension and a tolerance accumulation condition; performing dimensional precision analysis according to the critical dimension and the tolerance accumulation condition to obtain a dimensional precision evaluation result of the to-be-assembled part; and performing size optimization design on the to-be-assembled part according to a size precision evaluation result. According to the method, the accuracy of part size precision analysis can be effectively improved, and meanwhile, the assembly efficiency is effectively improved through size optimization.

Description

Technical Field

[0001] The present application relates to the field of part parameter design, and particularly to a method and device for analyzing part dimension accuracy, an electronic device, and a storage medium. Background Art

[0002] In modern manufacturing, part dimension accuracy is one of the key factors in ensuring product quality, performance, and assembly efficiency. With the continuous development of manufacturing processes and technologies, the requirements for part dimension accuracy are getting higher and higher, which also poses higher challenges to quality control in the production process. However, in traditional dimension accuracy analysis methods, the 3D modeling of parts is mostly carried out through modeling software such as CAD, with poor modeling efficiency and accuracy, affecting the efficiency and accuracy of dimension accuracy analysis, and thus leading to error accumulation in the assembly process, affecting assembly efficiency and the quality of the final product. Summary of the Invention

[0003] The main purpose of the present application is to provide a method and device for analyzing part dimension accuracy, an electronic device, and a storage medium, aiming to solve the technical problem that the modeling efficiency and accuracy of parts in traditional dimension accuracy analysis methods are poor, affecting the efficiency and accuracy of dimension accuracy analysis, and thus leading to error accumulation in the assembly process, affecting assembly efficiency and the quality of the final product.

[0004] To achieve the above purpose, the present application proposes a method for analyzing part dimension accuracy, which includes:

[0005] Construct a three-dimensional geometric model of the parts to be assembled;

[0006] Determine part references and mating features based on the three-dimensional geometric model of the parts to be assembled;

[0007] Obtain the assembly process, and determine the assembly sequence and assembly positioning method based on at least one of the assembly process, the part references, and the mating features;

[0008] Perform assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and assembly positioning method to obtain a virtual assembly model of the product;

[0009] Perform dimension chain analysis on the virtual assembly model to determine the key dimensions and tolerance accumulation;

[0010] Perform dimension accuracy analysis based on the key dimensions and tolerance accumulation to obtain a dimension accuracy evaluation result of the parts to be assembled;

[0011] Perform dimension optimization design on the parts to be assembled according to the dimension accuracy evaluation result.

[0012] In one embodiment, constructing a three-dimensional geometric model of the parts to be assembled includes:

[0013] Obtaining geometric design information and geometric assembly feature information of the parts to be assembled, where the geometric design information at least includes the contour dimensions and shape features of the parts to be assembled, and the geometric assembly feature information at least includes hole positions, mating features, and assembly interfaces;

[0014] Converting the geometric design information into a voxel grid and determining the occupancy status of each voxel unit in the voxel grid;

[0015] Filling the voxel grid according to the occupancy status of each voxel unit and the geometric assembly feature information to obtain a three-dimensional geometric model of the parts to be assembled.

[0016] In one embodiment, determining part references and mating features based on the three-dimensional geometric model of the parts to be assembled includes:

[0017] Identifying geometric features in the three-dimensional geometric model of the parts to be assembled and classifying the geometric features to obtain multiple potential references;

[0018] Randomly combining the potential references to generate multiple reference feature combinations and using the multiple reference feature combinations as the initial population;

[0019] Evaluating the fitness of individuals in the initial population according to the geometric attributes of the potential references and assembly requirements to obtain individual fitness;

[0020] Selecting individuals from the initial population as parents according to the individual fitness and performing selection, crossover, and mutation operations on the parents to obtain new individuals;

[0021] Updating the initial population according to the new individuals to obtain a new population, using the new population as the initial population and re-executing the step of evaluating the fitness of individuals in the initial population according to the geometric attributes of the potential references and assembly requirements to obtain individual fitness until a preset number of iterations is reached or a convergence condition is satisfied, generating a target reference feature combination;

[0022] Determining part references based on the target reference feature combination and determining mating features that match the part references.

[0023] In one embodiment, obtaining an assembly process and determining an assembly sequence and an assembly positioning method based on at least one of the assembly process, the part references, and the mating features includes:

[0024] Obtaining an assembly process and determining assembly constraints according to the assembly process;

[0025] Select an assembly strategy based on the assembly constraints, and determine the assembly sequence according to the assembly strategy. Among them, the assembly strategy at least includes a top-down assembly strategy, a bottom-up assembly strategy, and a modular assembly strategy;

[0026] Determine the positioning reference surface according to the part datum, and determine the positioning reference point according to the mating feature;

[0027] Determine the assembly positioning method according to the positioning reference surface, the positioning reference point, and the assembly constraints. Among them, the assembly positioning method at least includes fixed positioning, adjustable positioning, and floating positioning.

[0028] In one embodiment, the three-dimensional geometric model of the parts to be assembled is assembled and simulated according to the assembly sequence and the assembly positioning method to obtain a virtual assembly model of the product, including:

[0029] Import the three-dimensional geometric models of the parts to be assembled into the virtual assembly environment in sequence according to the assembly sequence;

[0030] Position the three-dimensional geometric model of each part to be assembled in the virtual assembly environment according to the assembly positioning method to obtain an intermediate assembly state;

[0031] Perform collision detection and interference analysis on the intermediate assembly state to obtain an analysis result;

[0032] When the analysis result indicates that there are conflicts in the assembly process, adjust the assembly sequence or the assembly positioning method until the three-dimensional geometric models of all parts to be assembled are successfully assembled to obtain a virtual assembly model of the product.

[0033] In one embodiment, perform dimensional chain analysis on the virtual assembly model to determine the key dimensions and the tolerance accumulation situation, including:

[0034] Define a dimensional chain, where the dimensional chain includes the dimensions of each part and the assembly clearance that affect the assembly dimensional accuracy of the product;

[0035] Calculate the tolerance accumulation situation based on the virtual assembly model and the dimensional chain;

[0036] Calculate the contribution degree according to the tolerance accumulation situation to obtain the contribution degree of each part dimension;

[0037] Determine the key dimensions according to the priority of the contribution degree;

[0038] Among them, the calculation formula for the tolerance accumulation situation is:

[0039]

[0040] Among them, σL For the tolerance accumulation situation, D n Is the nth part dimension, where n is the total number of part dimensions in the dimension chain Is the part dimension D n Sensitivity to the assembly dimension L, σ Dn Is the part dimension D n Standard deviation of, G m The mth assembly clearance, where m is the total number of assembly clearances in the dimension chain Is the assembly clearance G m Sensitivity to the assembly dimension L, σ Gm Assembly clearance G m Standard deviation of

[0041] The calculation formula for the contribution degree is as follows:

[0042]

[0043] Among them, Is the part dimension D i Contribution degree to the assembly dimension Is the part dimension D i Sensitivity to the assembly dimension L, σ L Is the tolerance accumulation situation Part dimension D i Standard deviation of

[0044] In one embodiment, performing dimension accuracy analysis according to the critical dimension and the tolerance accumulation situation to obtain a dimension accuracy evaluation result of the parts to be assembled, including:

[0045] Inputting the critical dimension and the tolerance accumulation situation into a dimension accuracy analysis model, and determining the total assembly error through the dimension accuracy analysis model according to the critical dimension and the tolerance accumulation situation;

[0046] Calculating the dimension accuracy of the parts to be assembled according to the total assembly error;

[0047] Comparing the dimension accuracy of the parts to be assembled with a preset dimension accuracy to obtain a dimension accuracy difference;

[0048] Evaluating the dimension accuracy of the assembled parts according to the dimension accuracy difference to obtain a dimension accuracy evaluation result of the parts to be assembled;

[0049] Among them, the calculation formula for the total assembly error is as follows:

[0050]

[0051] Among them, ΔX total Is the total assembly error, Δx iis the tolerance of the i-th critical dimension, n is the number of critical dimensions, and f j is a function of the assembly dimension, and x k is the k-th critical dimension related to the function f j and m is the number of critical dimensions of the k-th critical dimension related to the function f j The number of critical dimensions, represents the influence degree of the critical dimension x k on the assembly dimension, and Δx k is the k-th critical dimension tolerance related to the function f j In addition, to achieve the above object, the present application also proposes a device for analyzing the dimensional accuracy of parts, and the device for analyzing the dimensional accuracy of parts includes:

[0052] A construction module for constructing a three-dimensional geometric model of the parts to be assembled;

[0053] A determination module for determining part references and mating features based on the three-dimensional geometric model of the parts to be assembled;

[0054] The determination module is further configured to obtain an assembly process and determine an assembly sequence and an assembly positioning method based on at least one of the assembly process, the part reference, and the mating feature;

[0055] A simulation module for performing assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and the assembly positioning method to obtain a virtual assembly model of the product;

[0056] An analysis module for performing dimensional chain analysis on the virtual assembly model to determine critical dimensions and tolerance accumulation;

[0057] The analysis module is further configured to perform dimensional accuracy analysis according to the critical dimensions and tolerance accumulation to obtain a dimensional accuracy evaluation result of the parts to be assembled;

[0058] An optimization module for performing dimensional optimization design on the parts to be assembled according to the dimensional accuracy evaluation result.

[0059] In addition, to achieve the above object, the present application also proposes an electronic device, and the device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the method for analyzing the dimensional accuracy of parts as described above.

[0060]

[0061] ​In addition, to achieve the above object, the present application further provides a storage medium, which is a computer-readable storage medium. A computer program is stored on the storage medium, and when the computer program is executed by a processor, the steps of the part dimension accuracy analysis method described above are implemented.

[0062] In addition, to achieve the above object, the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps of the part dimension accuracy analysis method described above are implemented.

[0063] One or more technical solutions proposed by the present application include constructing a three-dimensional geometric model of the parts to be assembled; determining part references and mating features based on the three-dimensional geometric model of the parts to be assembled; obtaining the assembly process, and determining the assembly sequence and assembly positioning method based on at least one of the assembly process, the part references, and the mating features; performing assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and assembly positioning method to obtain a virtual assembly model of the product; performing dimension chain analysis on the virtual assembly model to determine key dimensions and tolerance accumulation; performing dimension accuracy analysis based on the key dimensions and tolerance accumulation to obtain a dimension accuracy evaluation result of the parts to be assembled; and performing dimension optimization design on the parts to be assembled according to the dimension accuracy evaluation result. In this way, by constructing a three-dimensional geometric model of the parts to be assembled to determine the assembly sequence and assembly positioning method and performing assembly simulation, the simulation efficiency and accuracy are effectively improved. By analyzing the key dimensions and tolerance accumulation based on the generated virtual assembly model and performing dimension accuracy analysis, accurate and efficient analysis of part dimension accuracy is achieved. Furthermore, performing dimension optimization design according to the dimension accuracy evaluation result further improves the assembly efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] The accompanying drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0065] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for describing the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0066] Figure 1 It is a schematic flowchart provided for the first embodiment of the part dimension accuracy analysis method of the present application;

[0067] Figure 2 It is a schematic flowchart provided for the second embodiment of the part dimension accuracy analysis method of the present application;

[0068] Figure 3 It is a schematic diagram of the module structure of the part size accuracy analysis device according to the embodiment of the present application;

[0069] Figure 4 It is a schematic diagram of the device structure of the hardware operating environment involved in the part size accuracy analysis method according to the embodiment of the present application.

[0070] The realization of the purpose, functional characteristics and advantages of the present application will be further described with reference to the accompanying drawings in combination with the embodiments. Specific Embodiments

[0071] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0072] In order to better understand the technical solutions of the present application, the following will be described in detail in combination with the accompanying drawings of the specification and specific embodiments.

[0073] The main solution of the embodiment of the present application is: constructing a three-dimensional geometric model of the parts to be assembled; determining part benchmarks and mating features based on the three-dimensional geometric model of the parts to be assembled; obtaining the assembly process, and determining the assembly sequence and assembly positioning method based on at least one of the assembly process, the part benchmarks and the mating features; performing assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and assembly positioning method to obtain a virtual assembly model of the product; performing dimension chain analysis on the virtual assembly model to determine key dimensions and tolerance accumulation; performing dimension accuracy analysis according to the key dimensions and tolerance accumulation to obtain a dimension accuracy evaluation result of the parts to be assembled; and performing dimension optimization design on the parts to be assembled according to the dimension accuracy evaluation result.

[0074] In the traditional dimension accuracy analysis method, the 3D modeling of parts is mostly carried out through modeling software such as CAD, with poor modeling efficiency and accuracy, which affects the efficiency and accuracy of dimension accuracy analysis, and further leads to error accumulation during the assembly process, affecting the assembly efficiency and the quality of the final product.

[0075] The present application provides a solution. By constructing a three-dimensional geometric model of the parts to be assembled to determine the assembly sequence and assembly positioning method and performing assembly simulation, the simulation efficiency and accuracy are effectively improved. By analyzing the key dimensions and tolerance accumulation based on the generated virtual assembly model and performing dimension accuracy analysis, accurate and efficient analysis of part dimension accuracy is realized. Furthermore, dimension optimization design is carried out according to the dimension accuracy evaluation result, further improving the assembly efficiency of the product.

[0076] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program running functions, such as a tablet computer, a personal computer, a mobile phone, etc., or an electronic device, an electronic device, etc. that can implement the above functions. Hereinafter, an electronic device will be taken as an example to illustrate this embodiment and the following various embodiments.

[0077] Based on this, an embodiment of the present application provides a method for analyzing the dimensional accuracy of parts. Refer to Figure 1 , Figure 1 which is a schematic flowchart of the first embodiment of the method for analyzing the dimensional accuracy of parts in the present application.

[0078] In this embodiment, the method for analyzing the dimensional accuracy of parts includes steps S10 to S70:

[0079] Step S10: Construct a three-dimensional geometric model of the parts to be assembled.

[0080] It should be noted that the parts to be assembled refer to the parts for which dimensional accuracy analysis is required, such as mechanical parts, electronic parts, etc.

[0081] It should be understood that the three-dimensional geometric model of the parts to be assembled can be realized by tools such as three-dimensional modeling software. This three-dimensional geometric model should reflect as accurately as possible the shape, size, and assembly relationship and other information of the parts to be assembled.

[0082] Specifically, the three-dimensional geometric model of the parts to be assembled can be constructed according to the geometric design information and geometric assembly feature information of the parts to be assembled.

[0083] In a feasible implementation manner, step S10 may include: obtaining the geometric design information and geometric assembly feature information of the parts to be assembled, where the geometric design information at least includes the contour dimensions and shape features of the parts to be assembled, and the geometric assembly feature information at least includes hole positions, mating features, and assembly interfaces; converting the geometric design information into a voxel grid and determining the occupancy state of each voxel unit in the voxel grid; filling the voxel grid according to the occupancy state of each voxel unit and the geometric assembly feature information to obtain a three-dimensional geometric model of the parts to be assembled.

[0084] It should be noted that the geometric design information refers to the detailed design data of the parts to be assembled, including but not limited to the contour dimensions, shape features, etc. of the parts. The geometric assembly feature information involves the key parts in the assembly process of the parts, such as hole positions, mating features, and assembly interfaces. Among them, the hole position is the position for connecting or fixing between parts, for example, holes, grooves, threads; the mating feature refers to the shape or structure that cooperates with each other between parts, such as key grooves, protrusions, card slots, etc.; the assembly interface is the part where the parts are connected or cooperated with each other, such as threads, sockets, etc.

[0085] Specifically, in the process of converting geometric design information into a voxel grid, the geometric shape of the part is divided into a series of tiny cube units, i.e., voxels. Each voxel unit has a different occupancy state according to whether it is occupied by the part entity. For example, the voxel unit occupied by the part entity is marked as the occupied state, and the unoccupied voxel unit is marked as the empty state. Then, the voxel grid is filled according to the geometric assembly feature information to form a complete three-dimensional geometric model of the part to be assembled.

[0086] Step S20: Determine the part reference and mating features based on the three-dimensional geometric model of the part to be assembled.

[0087] It should be noted that the part reference is the positioning reference and measurement reference for determining the part during the assembly process, which is the key to ensuring assembly accuracy and dimensional consistency. The reference in this embodiment is the optimal assembly reference obtained through continuous iterative optimization by the genetic algorithm. The mating feature refers to the parts where the parts are in contact, connected, or mated with each other. When determining the part reference and mating features, based on the three-dimensional geometric model of the part to be assembled, by analyzing information such as the geometric shape, assembly relationship, and dimensional requirements of the part, the position, shape, size, and other parameters of the part reference and mating features can be accurately determined.

[0088] In a feasible embodiment, step S20 may include: identifying the geometric features in the three-dimensional geometric model of the part to be assembled, classifying the geometric features, and obtaining a plurality of potential references; randomly combining the potential references to generate a plurality of reference feature combinations, and using the plurality of reference feature combinations as the initial population; evaluating the fitness of the individuals in the initial population according to the geometric attributes and assembly requirements of the potential references to obtain individual fitness; selecting individuals from the initial population as parents according to the individual fitness, and performing selection, crossover, and mutation operations on the parents to obtain new individuals; updating the initial population according to the new individuals to obtain a new population, using the new population as the initial population and re-executing the step of evaluating the fitness of the individuals in the initial population according to the geometric attributes and assembly requirements of the potential references to obtain individual fitness until a preset number of iterations is reached or the convergence condition is satisfied, generating a target reference feature combination; determining the part reference based on the target reference feature combination, and determining the mating feature that matches it according to the part reference.

[0089] It should be noted that the geometric features in the three-dimensional geometric model of the part to be assembled include but are not limited to basic elements such as points, lines, surfaces, and solids, as well as specific shape features such as holes, grooves, protrusions, and threads. Classify the extracted geometric features and mark which ones are potential references. For example, identify a hole as a potential reference or identify a certain plane as a positioning reference.

[0090] Random combinations of potential benchmarks can generate multiple different combinations of benchmark features. These combinations serve as the initial population. Under the framework of the genetic algorithm, through processes such as simulating natural selection, crossover, and mutation, they are gradually iteratively optimized to find the optimal assembly benchmark. In each iteration, according to the geometric attributes of the potential benchmarks and the assembly requirements, the fitness of the individuals in the population is evaluated. Individuals with higher fitness have a greater chance of being selected as parents, and new individuals are generated through selection, crossover, and mutation operations. These new individuals form a new population and continue the next round of iterative optimization. This process continues until the preset number of iterations is reached or the convergence condition is met. At this time, the combination of benchmark features obtained is the optimal combination of benchmark features. Based on this optimal combination of benchmark features, the optimal benchmark for the part in the assembly process can be determined, and then the mating features that match it can be determined according to this benchmark. This method of randomly combining and iteratively optimizing potential benchmarks through the genetic algorithm can efficiently find the optimal assembly benchmark, thereby improving the assembly accuracy and efficiency.

[0091] Step S30: Obtain the assembly process, and determine the assembly sequence and the assembly positioning method based on at least one of the assembly process, the part benchmark, and the mating feature.

[0092] It should be noted that the assembly process is a technical document that guides the assembly process, including assembly steps, assembly methods, assembly tools, and precautions during assembly, etc. After obtaining the assembly process, the assembly sequence can be determined based on the requirements of the assembly process. On the basis of the requirements of the assembly process, combined with the already determined part benchmark and mating feature, the assembly positioning method is further determined.

[0093] It should be understood that the assembly sequence refers to the order of assembly of parts during the assembly process, and the assembly positioning method refers to the positioning method and positioning accuracy requirements of parts during the assembly process. A reasonable assembly sequence and assembly positioning method can ensure the correct assembly and positioning of parts during the assembly process, thereby improving the assembly accuracy and efficiency.

[0094] In a feasible implementation, step S30 may include: obtaining the assembly process, and determining the assembly constraints according to the assembly process; selecting an assembly strategy based on the assembly constraints, and determining the assembly sequence according to the assembly strategy, where the assembly strategy at least includes a top-down assembly strategy, a bottom-up assembly strategy, and a modular assembly strategy; determining a positioning reference surface according to the part benchmark, and determining a positioning reference point according to the mating feature; determining the assembly positioning method according to the positioning reference surface, the positioning reference point, and the assembly constraints, where the assembly positioning method at least includes fixed positioning, adjustable positioning, and floating positioning.

[0095] It should be noted that assembly constraints refer to the conditions or restrictions that must be met during the assembly process, including geometric constraints, mechanical constraints, assembly limitations, and interference constraints. Geometric constraints include positioning holes, card slots, mating surfaces, etc. between parts; mechanical constraints include considering how parts are stressed during the assembly process, such as whether certain parts need to be fixed in a certain order to avoid deformation; assembly limitations include that some parts must be installed before other parts are assembled, for example, fasteners need to be placed in advance, and subsequent parts are installed through these fasteners. Interference constraints include avoiding part interference through the assembly sequence, for example, some parts cannot be assembled before other parts are completely fixed.

[0096] It should be understood that when selecting an assembly strategy, the most suitable strategy can be selected from top-down assembly strategy, bottom-up assembly strategy, and modular assembly strategy according to the requirements of the assembly process and the characteristics of the parts. The top-down assembly strategy usually starts from large or main components and gradually assembles small or secondary components; the bottom-up assembly strategy starts from small or basic components and gradually assembles into large components; the modular assembly strategy pre-assembles parts into modules and then assembles the modules. Different assembly strategies are suitable for different assembly scenarios and requirements. Selecting the appropriate assembly strategy can significantly improve the assembly efficiency and accuracy.

[0097] When determining the assembly positioning method, the positioning reference surface is usually selected as the larger and flatter surface on the part to ensure the stability and accuracy of positioning; the positioning reference point is determined according to the mating features and is used to determine the specific position of the part during the assembly process. Based on the positioning reference surface, positioning reference point, and assembly constraints, an appropriate assembly positioning method can be determined, such as fixed positioning, adjustable positioning, or floating positioning, etc. These positioning methods can meet the positioning requirements in different assembly scenarios and ensure the correct positioning of parts during the assembly process. Fixed positioning means that the position of the part remains unchanged during the assembly process and is suitable for scenarios with high requirements for positioning accuracy; adjustable positioning allows the part to be finely adjusted during the assembly process to adapt to small errors during the assembly process; floating positioning allows the part to move freely within a certain range and is suitable for parts that need to adapt to different assembly conditions or have a certain elasticity during the assembly process. By selecting the appropriate assembly positioning method, the assembly accuracy and efficiency can be further improved.

[0098] Step S40: Perform an assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and the assembly positioning method to obtain a virtual assembly model of the product.

[0099] It should be noted that the assembly simulation is carried out in a virtual assembly environment, and the real assembly process is simulated in the virtual assembly environment. The three-dimensional geometric model of the parts to be assembled is assembled according to the determined assembly sequence and assembly positioning method.

[0100] It should be understood that during the assembly simulation process, the assembly relationship between parts can be monitored in real time to check for problems such as interference and misalignment, as well as whether the assembly accuracy meets the requirements. Through assembly simulation, problems that may occur during the assembly process can be discovered and corrected in a timely manner, and the assembly sequence and assembly positioning method can be optimized, thereby improving the assembly efficiency and accuracy, and finally obtaining a virtual assembly model of the product.

[0101] In a feasible implementation manner, step S40 may include: sequentially importing the three-dimensional geometric models of the parts to be assembled into the virtual assembly environment according to the assembly sequence; positioning the three-dimensional geometric models of each part to be assembled in the virtual assembly environment according to the assembly positioning method to obtain an intermediate assembly state; performing collision detection and interference analysis on the intermediate assembly state to obtain an analysis result; when the analysis result indicates that there are conflicts in the assembly process, adjusting the assembly sequence or the assembly positioning method until the three-dimensional geometric models of all parts to be assembled are successfully assembled, obtaining a virtual assembly model of the product.

[0102] It should be noted that the virtual assembly environment is a digital environment used to simulate the actual assembly process. In the virtual assembly environment, the three-dimensional geometric models of the parts to be assembled can be virtually assembled to verify the correctness of the assembly sequence and the assembly positioning method.

[0103] It should be understood that after importing into the virtual assembly environment, the three-dimensional geometric models of each part to be assembled are accurately positioned in the virtual assembly environment according to the assembly positioning method. This can ensure the correct assembly and positioning of the parts during the actual assembly process. Then, collision detection and interference analysis are performed on the intermediate assembly state. Collision detection is used to check whether there are physical collisions between parts, and interference analysis is used to check whether there are spatial interferences between parts. These analysis results can help discover potential problems in the assembly process in a timely manner, such as assembly conflicts and interferences. If the analysis result shows that there are conflicts in the assembly process, the assembly sequence or the assembly positioning method needs to be adjusted. This process may need to be repeated until the three-dimensional geometric models of all parts to be assembled are successfully assembled, and finally a virtual assembly model of the product is obtained. This virtual assembly model can not only be used to verify the correctness of the assembly sequence and the assembly positioning method, but also be used for subsequent dimensional accuracy analysis.

[0104] Step S50: Perform a dimension chain analysis on the virtual assembly model to determine the key dimensions and the cumulative tolerance situation.

[0105] It should be noted that dimension chain analysis refers to analyzing the dimension relationships between parts in a virtual assembly model to determine the key dimensions that affect the final dimension accuracy of the product. Key dimensions refer to the combinations of part dimensions that have an important impact on the final dimension accuracy of the product during the assembly process. The tolerance accumulation situation refers to the gradual accumulation of the tolerances of each part dimension during the assembly process, which ultimately leads to the deviation of the final dimension of the product.

[0106] In a feasible implementation manner, step S50 may include: defining a dimension chain, where the dimension chain includes each part dimension and assembly clearance that affect the assembly dimension accuracy of the product; calculating the tolerance accumulation situation based on the virtual assembly model and the dimension chain; performing contribution degree calculation according to the tolerance accumulation situation to obtain the contribution degrees of each part dimension; and determining the key dimensions according to the priority of the contribution degrees.

[0107] It should be noted that the dimension chain refers to the process in which, starting from a reference part (or reference surface), the dimensions of all parts are transmitted to the final assembled product through a series of mating relationships (holes, pins, contact surfaces, etc.). In this implementation manner, the dimension chain includes each part dimension and assembly clearance that affect the assembly dimension accuracy of the product.

[0108] Analyze each part dimension in the virtual assembly model one by one, considering the tolerance range of each part dimension in the dimension chain and the mating relationships between parts during the assembly process. By simulating the assembly process, calculate how the tolerances of each part dimension accumulate. The calculation formula for the tolerance accumulation situation is:

[0109]

[0110] where σ L is the tolerance accumulation situation, D n is the nth part dimension, n is the total number of part dimensions in the dimension chain, is the sensitivity of the part dimension D n to the assembly dimension L, σ Dn is the standard deviation of the part dimension D n , G m is the mth assembly clearance, m is the total number of assembly clearances in the dimension chain, is the sensitivity of the assembly clearance G m to the assembly dimension L, σ Gm is the standard deviation of the assembly clearance G m .

[0111] It should be understood that the contribution degree calculation is to evaluate the influence degree of each part dimension on the final dimension accuracy of the product according to the tolerance accumulation situation. By calculating the contribution degree, it can be determined which part dimensions are the key dimensions, that is, the dimensions that have the greatest influence on the final dimension accuracy of the product. The calculation formula for the contribution degree is:

[0112]

[0113] Among them, is the contribution degree of the part size D i to the assembly dimension, is the sensitivity of the part size D i to the assembly dimension L, σ L is the tolerance accumulation situation, σ Di The part size D i of the standard deviation.

[0114] Step S60: Perform dimensional accuracy analysis based on the key dimensions and tolerance accumulation situation to obtain the dimensional accuracy evaluation result of the parts to be assembled.

[0115] It should be noted that dimensional accuracy analysis refers to evaluating whether the dimensional accuracy of the parts to be assembled meets the design requirements by analyzing the key dimensions and tolerance accumulation situation, that is, the dimensional accuracy evaluation result of the parts to be assembled.

[0116] Specifically, a dimensional accuracy analysis model can be constructed, taking the key dimensions and tolerance accumulation situation as the model input and the total assembly error as the model output. The dimensional accuracy of the parts to be assembled is calculated based on the total assembly error, and then the dimensional accuracy evaluation result of the parts to be assembled is determined.

[0117] Step S70: Perform dimensional optimization design on the parts to be assembled according to the dimensional accuracy evaluation result.

[0118] It should be noted that dimensional optimization design is a process of adjusting and improving the dimensions of the parts to be assembled based on the dimensional accuracy evaluation result.

[0119] It should be understood that by comparing the evaluation result with the design requirements, parts with large dimensional deviations can be identified, and then corresponding optimization measures can be taken. These optimization measures may include adjusting the part dimensions, improving the manufacturing process, optimizing the assembly sequence or assembly positioning method, etc. In the optimization process, factors such as the functional requirements of the parts, manufacturing costs, and assembly efficiency need to be comprehensively considered to ensure that the optimized part dimensions can meet the design requirements and have good economy and practicality. Through dimensional optimization design, the assembly accuracy and overall performance of the product can be further improved, providing strong support for subsequent production manufacturing and quality control.

[0120] This embodiment provides a method for analyzing the dimensional accuracy of parts, which constructs a three-dimensional geometric model of the parts to be assembled; determines part references and mating features based on the three-dimensional geometric model of the parts to be assembled; obtains the assembly process, and determines the assembly sequence and assembly positioning method based on at least one of the assembly process, the part references, and the mating features; performs an assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and assembly positioning method to obtain a virtual assembly model of the product; performs a dimensional chain analysis on the virtual assembly model to determine the key dimensions and tolerance accumulation; performs a dimensional accuracy analysis based on the key dimensions and tolerance accumulation to obtain a dimensional accuracy evaluation result of the parts to be assembled; and performs a dimensional optimization design on the parts to be assembled according to the dimensional accuracy evaluation result. In the above manner, by constructing a three-dimensional geometric model of the parts to be assembled to determine the assembly sequence and assembly positioning method and performing an assembly simulation, the simulation efficiency and accuracy are effectively improved. By analyzing the key dimensions and tolerance accumulation based on the generated virtual assembly model and performing a dimensional accuracy analysis, the accurate and efficient analysis of the dimensional accuracy of the parts is realized. Furthermore, by performing a dimensional optimization design according to the dimensional accuracy evaluation result, the assembly efficiency of the product is further improved.

[0121] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar content as that in the above-mentioned Embodiment 1 can be referred to the above introduction and will not be repeated hereinafter. On this basis, please refer to Figure 2 , step S60 includes steps S601 to S604:

[0122] Step S601: Input the key dimensions and the tolerance accumulation into a dimensional accuracy analysis model, and determine the total assembly error through the dimensional accuracy analysis model according to the key dimensions and the tolerance accumulation.

[0123] It should be noted that the dimensional accuracy analysis model is constructed based on machine learning or statistical methods, can handle complex assembly dimensional relationships, and accurately predict the total assembly error. This model can calculate the total assembly error by comprehensively considering factors such as the mating relationship between parts, the assembly sequence, and the manufacturing process according to the input key dimensions and tolerance accumulation. Through this model, the influence of the dimensions of each part in the assembly process on the dimensions of the final product can be intuitively understood.

[0124] It can be understood that the dimensional accuracy analysis model is pre-trained, and its training data comes from a large number of assembly instances and experimental data. These data cover various types of parts, assembly processes, and manufacturing conditions, ensuring the accuracy and reliability of the model. During the training process, the model will learn the complex relationship between part dimensions, tolerance accumulation, and total assembly error, and can make accurate predictions based on these relationships.

[0125] Specifically, the calculation formula of the dimensional accuracy analysis model for the total assembly error is as follows:

[0126]

[0127] Among them, ΔX total is the total assembly error, Δx i is the tolerance of the i-th key dimension, n is the number of key dimensions, f j is the function of the assembly dimension, x k is the k-th key dimension related to the function f j m is the number of key dimensions of the k-th key dimension related to the function f j , represents the influence degree of the key dimension x k on the assembly dimension, Δx k is the tolerance of the k-th key dimension related to the function f j .

[0128] Step S602: Calculate the dimensional accuracy of the parts to be assembled according to the total assembly error.

[0129] In specific implementation, the tolerances of each key dimension of the parts to be assembled are analyzed one by one. Combining with the total assembly error, by comparing the relationship between the tolerances of each key dimension and the total assembly error, the dimensional accuracy of the parts to be assembled is determined.

[0130] Step S603: Compare the dimensional accuracy of the parts to be assembled with the preset dimensional accuracy to obtain the dimensional accuracy difference.

[0131] It should be noted that the preset dimensional accuracy is preset according to the product design requirements and technical specifications, representing the dimensional accuracy level that the product is expected to achieve. Comparing the calculated dimensional accuracy of the parts to be assembled with the preset dimensional accuracy can determine the difference degree between the two, that is, the dimensional accuracy difference. This difference reflects the gap between the current dimensional accuracy of the parts to be assembled and the expected dimensional accuracy.

[0132] Step S604: Evaluate the dimensional accuracy of the assembled parts according to the dimensional accuracy difference to obtain the dimensional accuracy evaluation result of the parts to be assembled.

[0133] It should be noted that if the dimensional accuracy difference exceeds the acceptable range, it means that the dimensional accuracy of the parts to be assembled does not meet the design requirements, and the key dimensions need to be adjusted. According to the magnitude and distribution of the dimensional accuracy difference, the direction and amplitude of the adjustment can be determined to ensure that the optimized dimensional accuracy of the parts can meet the design requirements.

[0134] It is understandable that by carefully evaluating the dimensional accuracy of assembled parts, dimensional accuracy problems can be discovered and solved in a timely manner, effectively improving the product assembly efficiency and product quality.

[0135] In this embodiment, the dimensional accuracy analysis model accurately predicts the total assembly error based on the key dimensions and tolerance accumulation, analyzes the dimensional accuracy of the parts to be assembled according to the total assembly error, effectively improves the accuracy of dimensional accuracy analysis, and then evaluates the dimensional accuracy of the parts to be assembled, facilitating the timely discovery and solution of dimensional accuracy problems, and effectively improving the product assembly efficiency and product quality.

[0136] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the method for analyzing the dimensional accuracy of parts of this application. Based on this technical concept, more forms of simple transformations are within the protection scope of this application.

[0137] This application also provides a device for analyzing the dimensional accuracy of parts. Please refer to Figure 3 The device for analyzing the dimensional accuracy of parts includes:

[0138] A construction module 10 for constructing a three-dimensional geometric model of the parts to be assembled.

[0139] A determination module 20 for determining part references and mating features based on the three-dimensional geometric model of the parts to be assembled.

[0140] The determination module 20 is further configured to obtain an assembly process and determine an assembly sequence and an assembly positioning method based on at least one of the assembly process, the part references, and the mating features.

[0141] A simulation module 30 for performing an assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and the assembly positioning method to obtain a virtual assembly model of the product.

[0142] An analysis module 40 for performing a dimension chain analysis on the virtual assembly model to determine key dimensions and tolerance accumulation.

[0143] The analysis module 40 is further configured to perform dimensional accuracy analysis based on the key dimensions and tolerance accumulation to obtain a dimensional accuracy evaluation result of the parts to be assembled.

[0144] An optimization module 50 for performing dimensional optimization design on the parts to be assembled according to the dimensional accuracy evaluation result.

[0145] The part dimension accuracy analysis device provided by this application adopts the part dimension accuracy analysis method in the above-mentioned embodiment, which can solve the technical problems that the traditional dimension accuracy analysis method has poor modeling efficiency and accuracy of parts, affects the efficiency and accuracy of dimension accuracy analysis, and further leads to error accumulation in the assembly process, affecting the assembly efficiency and the quality of the final product. Compared with the prior art, the beneficial effects of the part dimension accuracy analysis device provided by this application are the same as those of the part dimension accuracy analysis method provided by the above-mentioned embodiment, and other technical features in the part dimension accuracy analysis device are the same as the features disclosed in the method of the above-mentioned embodiment, which will not be elaborated here.

[0146] In one embodiment, the construction module 10 is further configured to obtain the geometric design information and geometric assembly feature information of the parts to be assembled. Among them, the geometric design information at least includes the contour dimensions and shape features of the parts to be assembled, and the geometric assembly feature information at least includes hole positions, mating features, and assembly interfaces; convert the geometric design information into a voxel grid, and determine the occupancy status of each voxel unit in the voxel grid; fill the voxel grid according to the occupancy status of each voxel unit and the geometric assembly feature information to obtain a three-dimensional geometric model of the parts to be assembled.

[0147] In one embodiment, the determination module 20 is further configured to identify geometric features in the three-dimensional geometric model of the parts to be assembled, classify the geometric features to obtain multiple potential benchmarks; randomly combine the potential benchmarks to generate multiple benchmark feature combinations, and use the multiple benchmark feature combinations as the initial population; evaluate the fitness of the individuals in the initial population according to the geometric attributes and assembly requirements of the potential benchmarks to obtain individual fitness; select individuals as parents from the initial population according to the individual fitness, and perform selection, crossover, and mutation operations on the parents to obtain new individuals; update the initial population according to the new individuals to obtain a new population, use the new population as the initial population and re-execute the step of evaluating the fitness of the individuals in the initial population according to the geometric attributes and assembly requirements of the potential benchmarks to obtain individual fitness until a preset number of iterations is reached or a convergence condition is met, generating a target benchmark feature combination; determine the part benchmark based on the target benchmark feature combination, and determine the mating feature that matches it according to the part benchmark.

[0148] In one embodiment, the determination module 20 is further configured to obtain an assembly process, and determine assembly constraints according to the assembly process; select an assembly strategy based on the assembly constraints, and determine an assembly sequence according to the assembly strategy, where the assembly strategy at least includes a top-down assembly strategy, a bottom-up assembly strategy, and a modular assembly strategy; determine a positioning reference surface according to the part reference, and determine a positioning reference point according to the mating feature; determine an assembly positioning method according to the positioning reference surface, the positioning reference point, and the assembly constraints, where the assembly positioning method at least includes fixed positioning, adjustable positioning, and floating positioning.

[0149] In one embodiment, the simulation module 30 is further configured to sequentially import the three-dimensional geometric models of the parts to be assembled into the virtual assembly environment according to the assembly sequence; position the three-dimensional geometric models of each part to be assembled in the virtual assembly environment according to the assembly positioning method to obtain an intermediate assembly state; perform collision detection and interference analysis on the intermediate assembly state to obtain an analysis result; when the analysis result indicates that there are conflicts in the assembly process, adjust the assembly sequence or the assembly positioning method until the three-dimensional geometric models of all parts to be assembled are successfully assembled to obtain a virtual assembly model of the product.

[0150] In one embodiment, the analysis module 40 is further configured to define a dimension chain, where the dimension chain includes the dimensions of each part and the assembly clearance that affect the assembly dimension accuracy of the product; calculate the tolerance accumulation situation based on the virtual assembly model and the dimension chain; perform contribution calculation according to the tolerance accumulation situation to obtain the contribution of each part dimension; determine the key dimensions according to the priority of the contribution.

[0151] Among them, the calculation formula for the tolerance accumulation situation is:

[0152]

[0153] Among them, σ L is the tolerance accumulation situation, D n is the nth part dimension, n is the total number of part dimensions in the dimension chain, is the sensitivity of the part dimension D n to the assembly dimension L, σ Dn is the standard deviation of the part dimension D n G m is the mth assembly clearance, m is the total number of assembly clearances in the dimension chain, is the sensitivity of the assembly clearance G m to the assembly dimension L, σ Gm is the standard deviation of the assembly clearance G m .

[0154] The calculation formula for the contribution is:

[0155]

[0156] Among them, is the contribution degree of the part dimension D i to the assembly dimension, is the sensitivity of the part dimension D i to the assembly dimension L, σ L is the tolerance accumulation situation, the part dimension D i standard deviation.

[0157] In one embodiment, the analysis module 40 is further configured to input the critical dimension and the tolerance accumulation situation into a dimension accuracy analysis model, and determine the total assembly error according to the critical dimension and the tolerance accumulation situation through the dimension accuracy analysis model; calculate the dimension accuracy of the parts to be assembled according to the total assembly error; compare the dimension accuracy of the parts to be assembled with a preset dimension accuracy to obtain a dimension accuracy difference; evaluate the dimension accuracy of the assembled parts according to the dimension accuracy difference to obtain a dimension accuracy evaluation result of the parts to be assembled;

[0158] Among them, the calculation formula of the total assembly error is:

[0159]

[0160] Among them, ΔX total is the total assembly error, Δx i is the tolerance of the i-th critical dimension, n is the number of critical dimensions, f j is a function of the assembly dimension, x k is the k-th critical dimension related to the function f j m is the number of critical dimensions of the k-th critical dimension related to the function f j related, represents the influence degree of the critical dimension x k on the assembly dimension, Δx k is the tolerance of the k-th critical dimension related to the function f j related.

[0161] This application provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the part dimension accuracy analysis method in the first embodiment above.

[0162] Next, refer to Figure 4, which shows a schematic structural diagram of an electronic device suitable for implementing the embodiments of the present application. The electronic device in the embodiments of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions, tablet computers), PMPs (Portable Media Players), in-vehicle terminals (such as in-vehicle navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Figure 4 The electronic device shown is merely an example and should not impose any limitations on the functions and usage scope of the embodiments of the present application.

[0163] As Figure 4 shown, the electronic device may include a processing device 1001 (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to the program stored in the ROM (Read Only Memory) 1002 or the program loaded from the storage device 1003 into the RAM (Random Access Memory) 1004. In the RAM 1004, various programs and data required for the operation of the electronic device are also stored. The processing device 1001, the ROM 1002, and the RAM 1004 are connected to each other through a bus 1005. The input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems may be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touch pad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, an LCD (Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the electronic device to communicate with other devices wirelessly or wiredly to exchange data. Although the figure shows an electronic device with various systems, it should be understood that it is not required to implement or have all the systems shown. Instead, more or fewer systems may be implemented or had.

[0164] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program contains program codes for executing the methods shown in the flowcharts. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by a processing device 1001, the above-mentioned functions defined in the methods of the embodiments disclosed in the present application are executed.

[0165] The electronic device provided by the present application adopts the part dimension accuracy analysis method in the above-mentioned embodiment, and can solve the technical problems that the traditional dimension accuracy analysis method has poor modeling efficiency and accuracy of parts, affects the efficiency and accuracy of dimension accuracy analysis, and further leads to error accumulation during the assembly process, affecting the assembly efficiency and the quality of the final product. Compared with the prior art, the beneficial effects of the electronic device provided by the present application are the same as those of the part dimension accuracy analysis method provided by the above-mentioned embodiment, and other technical features in the electronic device are the same as those disclosed in the method of the previous embodiment, and will not be elaborated here.

[0166] It should be understood that the various parts disclosed in the present application can be implemented by hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0167] As described above, the above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all of them should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0168] The present application provides a computer-readable storage medium having computer-readable program instructions (i.e., computer programs) stored thereon, and the computer-readable program instructions are used to execute the part dimension accuracy analysis method in the above-mentioned embodiment.

[0169] The computer-readable storage medium provided by this application can be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or components, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, RAM (Random Access Memory), ROM (Read Only Memory), EPROM (Erasable Programmable Read Only Memory or flash memory), optical fibers, CD-ROM (Compact Disc - Read Only Memory), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this embodiment, the computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, device, or component. The program code contained on the computer-readable storage medium can be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination of the above.

[0170] The above computer-readable storage medium can be included in an electronic device; or it can exist separately without being assembled into an electronic device.

[0171] The above computer-readable storage medium carries one or more programs. When the above one or more programs are executed by an electronic device, the electronic device is caused to: construct a three-dimensional geometric model of the parts to be assembled; determine part references and mating features based on the three-dimensional geometric model of the parts to be assembled; obtain an assembly process and determine an assembly sequence and an assembly positioning method based on at least one of the assembly process, the part references, and the mating features; perform an assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and the assembly positioning method to obtain a virtual assembly model of the product; perform a dimensional chain analysis on the virtual assembly model to determine key dimensions and tolerance accumulation; perform a dimensional accuracy analysis based on the key dimensions and tolerance accumulation to obtain a dimensional accuracy evaluation result of the parts to be assembled; and perform a dimensional optimization design on the parts to be assembled according to the dimensional accuracy evaluation result.

[0172] Computer program code for performing the operations of this application can be written in one or more programming languages or combinations thereof. The above-mentioned programming languages include object-oriented programming languages such as Java, Smalltalk, C++, and also include conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, executed as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any kind of network, including a LAN (Local Area Network) or a WAN (Wide Area Network), or it can be connected to an external computer (for example, by using an Internet service provider to connect through the Internet).

[0173] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in the flowchart or block diagram can represent a module, a program segment, or a part of the code, and this module, program segment, or part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order from that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0174] The modules described in the embodiments of this application can be implemented in software or in hardware. Among them, the name of the module does not constitute a limitation to the unit itself in some cases.

[0175] The readable storage medium provided by this application is a computer-readable storage medium. The computer-readable storage medium stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned part dimension accuracy analysis method, which can solve the technical problems that the modeling efficiency and accuracy of parts in traditional dimension accuracy analysis methods are poor, affecting the efficiency and accuracy of dimension accuracy analysis, and further leading to error accumulation in the assembly process, affecting the assembly efficiency and the quality of the final product. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided by this application are the same as those of the part dimension accuracy analysis method provided by the above embodiment, and will not be elaborated here.

[0176] This application also provides a computer program product, including a computer program, and when the computer program is executed by a processor, it realizes the steps of the part dimension accuracy analysis method as described above.

[0177] The computer program product provided by this application can solve the technical problems that the modeling efficiency and accuracy of parts in traditional dimension accuracy analysis methods are poor, affecting the efficiency and accuracy of dimension accuracy analysis, and further leading to error accumulation in the assembly process, affecting the assembly efficiency and the quality of the final product. Compared with the prior art, the beneficial effects of the computer program product provided by this application are the same as those of the part dimension accuracy analysis method provided by the above embodiment, and will not be elaborated here.

[0178] The above are only some embodiments of this application, and thus do not limit the patent scope of this application. Any equivalent structural transformation made under the technical concept of this application by using the content of the specification and drawings of this application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of this application.

Claims

1. A method for analyzing the dimensional accuracy of a part, characterized in that: The method comprises: Construct a 3D geometric model of the parts to be assembled; Determining part datums and matching features based on the three-dimensional geometric model of the part to be assembled; Acquire an assembly process, and determine an assembly sequence and an assembly positioning method based on at least one of the assembly process, the part reference, and the matching feature; Performing assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and assembly positioning method to obtain a virtual assembly model of the product; Performing dimension chain analysis on the virtual assembly model to determine key dimensions and tolerance accumulation; Perform dimensional accuracy analysis based on the key dimensions and tolerance accumulation to obtain dimensional accuracy evaluation results of the parts to be assembled; The dimensions of the parts to be assembled are optimized according to the dimensional accuracy evaluation results.

2. The method according to claim 1, characterized in that The three-dimensional geometric model of the parts to be assembled is constructed, comprising: Acquire geometric design information and geometric assembly feature information of the parts to be assembled, wherein the geometric design information at least includes the outline size and shape features of the parts to be assembled, and the geometric assembly feature information at least includes the hole position, matching features and assembly interface; Converting the geometric design information into a voxel grid and determining an occupancy state of each voxel unit in the voxel grid; The voxel grid is filled according to the occupation status of each voxel unit and the geometric assembly feature information to obtain a three-dimensional geometric model of the part to be assembled.

3. The method according to claim 1, characterized in that The determining of part datums and matching features based on the three-dimensional geometric model of the part to be assembled includes: Identifying geometric features in the three-dimensional geometric model of the part to be assembled, and classifying the geometric features to obtain a plurality of potential benchmarks; Randomly combining the potential benchmarks to generate a plurality of benchmark feature combinations, and using the plurality of benchmark feature combinations as an initial population; Performing fitness evaluation on individuals in the initial population according to the geometric properties and assembly requirements of the potential benchmark to obtain individual fitness; Selecting individuals from the initial population as parents according to the individual fitness, and performing selection, crossover and mutation operations on the parents to obtain new individuals; The initial population is updated according to the new individuals to obtain a new population, the new population is used as the initial population and the step of evaluating the fitness of the individuals in the initial population according to the geometric properties and assembly requirements of the potential benchmark is re-executed to obtain the individual fitness, until a preset number of iterations is reached or a convergence condition is met, and a target benchmark feature combination is generated; A part datum is determined based on the target datum feature combination, and a matching feature matching with the part datum is determined according to the part datum.

4. The method according to claim 1, characterized in that The obtaining of the assembly process, and determining the assembly sequence and the assembly positioning method based on at least one of the assembly process, the part reference and the matching feature, includes: Acquire an assembly process, and determine assembly constraints according to the assembly process; Selecting an assembly strategy based on the assembly constraint, and determining an assembly sequence according to the assembly strategy, wherein the assembly strategy at least includes a top-down assembly strategy, a bottom-up assembly strategy, and a modular assembly strategy; Determine a positioning reference surface according to the part reference, and determine a positioning reference point according to the matching feature; An assembly positioning method is determined according to the positioning reference surface, the positioning reference point and the assembly constraint, wherein the assembly positioning method at least includes fixed positioning, adjustable positioning and floating positioning.

5. The method according to claim 1, characterized in that The step of assembling the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and assembly positioning mode to obtain a virtual assembly model of the product includes: According to the assembly sequence, the three-dimensional geometric models of the parts to be assembled are sequentially imported into the virtual assembly environment; According to the assembly positioning method, the three-dimensional geometric model of each part to be assembled is positioned in the virtual assembly environment to obtain an assembly intermediate state; Performing collision detection and interference analysis on the intermediate state of the assembly to obtain analysis results; When the analysis result indicates that there is a conflict in the assembly process, the assembly sequence or assembly positioning method is adjusted until the three-dimensional geometric models of all parts to be assembled are successfully assembled to obtain a virtual assembly model of the product.

6. The method according to claim 1, characterized in that The step of performing dimension chain analysis on the virtual assembly model to determine key dimensions and tolerance accumulation includes: Defining a dimensional chain, wherein the dimensional chain includes various component dimensions and assembly clearances that affect the product assembly dimensional accuracy; Calculating tolerance accumulation based on the virtual assembly model and the dimension chain; Calculate the contribution based on the tolerance accumulation to get the contribution of each part size; Determining critical dimensions according to the priority of the contribution; The calculation formula for tolerance accumulation is: Among them, σ L is the tolerance accumulation, D n is the nth part size, n is the total number of part sizes in the dimensional chain, is the part size D n Sensitivity to assembly dimension L, σ Dn is the part size D n The standard deviation of G m The mth assembly gap, m is the total number of assembly gaps in the dimension chain, G is the assembly clearance m Sensitivity to assembly dimension L, σ Gm Assembly clearance G m The standard deviation of The contribution calculation formula is: in, is the part size D i Contribution to assembly size, is the part size D i Sensitivity to assembly dimension L, σ L is the tolerance accumulation, σ Di Part size D i The standard deviation of .

7. The method according to claim 1, characterized in that The dimensional accuracy analysis is performed according to the key dimensions and tolerance accumulation to obtain the dimensional accuracy evaluation results of the parts to be assembled, including: Inputting the critical dimension and the tolerance accumulation into a dimensional accuracy analysis model, and determining a total assembly error according to the critical dimension and the tolerance accumulation through the dimensional accuracy analysis model; Calculating the dimensional accuracy of the parts to be assembled according to the total assembly error; Comparing the dimensional accuracy of the part to be assembled with the preset dimensional accuracy to obtain a dimensional accuracy difference; Evaluate the dimensional accuracy of the assembly parts according to the dimensional accuracy difference to obtain a dimensional accuracy evaluation result of the parts to be assembled; Wherein, the calculation formula of the total assembly error is: Where ΔX total is the total assembly error, Δx i is the tolerance of the i-th critical dimension, n is the number of critical dimensions, f j is a function of the assembly size, x k is the function f j The kth key dimension associated with m is the function f j The number of key dimensions associated with the kth key dimension, Indicates the critical dimension x k Impact on assembly dimensions, Δx k is the function f j The tolerance of the associated kth critical dimension.

8. A device for analyzing the accuracy of part dimensions, characterized in that: The part size accuracy analysis device comprises: A construction module, used to construct a three-dimensional geometric model of the parts to be assembled; A determination module, used for determining part datum and matching features based on the three-dimensional geometric model of the part to be assembled; The determination module is further used to obtain an assembly process, and determine an assembly sequence and an assembly positioning method based on at least one of the assembly process, the part reference and the matching feature; A simulation module, used to perform assembly simulation on the three-dimensional geometric model of the parts to be assembled according to the assembly sequence and assembly positioning method, so as to obtain a virtual assembly model of the product; An analysis module is used to perform dimension chain analysis on the virtual assembly model to determine key dimensions and tolerance accumulation; The analysis module is further used to perform dimensional accuracy analysis based on the key dimensions and tolerance accumulation to obtain dimensional accuracy evaluation results of the parts to be assembled; The optimization module is used to optimize the size of the parts to be assembled according to the size accuracy evaluation result.

9. A part size accuracy analysis device, characterized in that: The part size accuracy analysis device includes: a memory, a processor, and a part size accuracy analysis program stored in the memory and executable on the processor, wherein the part size accuracy analysis program is configured to implement the part size accuracy analysis method according to any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium stores a part dimensional accuracy analysis program, and when the part dimensional accuracy analysis program is executed by the processor, the part dimensional accuracy analysis method according to any one of claims 1 to 7 is implemented.

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