Semiconductor wafer back cleaning equipment for semiconductor production

Abstract

The invention belongs to the technical field of semiconductor processing, and discloses semiconductor wafer back cleaning equipment for semiconductor production, which comprises two first mounting racks, second mounting racks are symmetrically and fixedly mounted on the upper and lower sides of the middle parts of the two first mounting racks, and first telescopic rods are fixedly mounted in the middle parts of the two second mounting racks; a middle hole is formed in the middle of a telescopic shaft of the first telescopic rod, and clamping mechanisms are arranged in the middles of the two first mounting frames. According to the device, the wafer is driven to rotate through the curved surface of the wafer, dirt on the surface of the wafer falls off from the surface of the wafer under the action of centrifugal force, meanwhile, the rotating wafer is damped through liquid cleaning liquid, and meanwhile, wafer vibration and edge abrasion caused by direct contact between the rotating wafer and the inner curved surface of the middle sleeve shell are avoided; therefore, the problem that when an existing clamping device clamps and flushes the edge of the wafer, the wafer is bent and deformed is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor processing, and specifically relates to a semiconductor wafer backside cleaning device for semiconductor production. Background Art

[0002] During the semiconductor production process, the cleanliness of the wafer is crucial for ensuring the quality and performance of the final product. Although most cleaning steps mainly focus on the side of the wafer with the circuit pattern, the cleaning of the backside of the wafer is equally important, especially in advanced manufacturing processes.

[0003] In the prior art, when clamping and flushing the edge of the wafer, since the cleaning liquid impacts the wafer surface, it is easy to cause the wafer to bend and deform. This not only affects the cleaning effect but also may cause wafer damage, reducing the production yield. Secondly, it is difficult to clamp wafers of different sizes in the backside etching cavity, resulting in the need to frequently adjust the device settings or replace the fixture when changing wafers, greatly reducing the wafer changing efficiency and increasing the process complexity and downtime. In addition, existing devices usually need to support the upper and lower parts of the wafer, and this support method will inevitably cause damage to the wafer surface, affecting the quality and performance of the final product. The existence of these problems makes the current wafer cleaning and processing technologies unable to meet the growing demand for high-precision and high-efficiency manufacturing. Therefore, there is an urgent need for a new type of wafer backside cleaning device to overcome the above drawbacks, improve the cleaning quality, reduce wafer damage, and enhance the adaptability of the device to wafers of different sizes, so as to improve the overall production efficiency and product reliability. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor wafer backside cleaning device for semiconductor production to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A semiconductor wafer back cleaning device for semiconductor production, comprising two first mounting brackets. On the upper and lower sides of the middle parts of the two first mounting brackets, second mounting brackets are symmetrically and fixedly installed. In the middle parts of the two second mounting brackets, first telescopic rods are fixedly installed. A middle hole is provided in the middle of the telescopic shaft of the first telescopic rod. In the middle parts of the two first mounting brackets, clamping mechanisms are provided. The clamping mechanism includes a driving member. The driving member is fixedly installed in the middle of the side of the first mounting bracket away from the first telescopic rod. The output shaft of the driving member is movably sleeved with the first mounting bracket. On the side of the output end of the driving member close to the first telescopic rod, a sleeve block is fixedly installed. A sliding rod is slidably sleeved on the side of the sleeve block away from the first telescopic rod. The contact surface between the sliding rod and the sleeve block is a smooth surface. On the side of the sleeve block close to the first telescopic rod, a second telescopic rod is fixedly sleeved. The telescopic end of the second telescopic rod is fixedly connected to the sliding rod. Above the two clamping mechanisms, a top cover mechanism is provided. Below the two clamping mechanisms, a bottom sleeve mechanism is provided. In the middle of the two clamping mechanisms, an outer ring mechanism is provided. In the middle of the outer ring mechanism, a middle ring mechanism is provided. An inner ring mechanism is sleeved on the outside of the top cover mechanism.

[0006] Preferably, the top cover mechanism includes a top shell. The top shell is fixedly connected to the upper parts of the two sliding rods. The upper part of the inner curved surface of the top shell is fixedly sleeved with a first socket. In the middle of the first socket, a first one-way valve is fixedly sleeved. The output port of the first one-way valve faces the outer ring mechanism. The telescopic end of the upper first telescopic rod is slidably sleeved with the top shell. On the upper part of the outer curved surface of the top shell, an electromagnetic seat is fixedly installed. At the bottom of the electromagnetic seat, two electromagnetic coils with different diameters are fixedly sleeved. One electromagnetic coil is located inside the other electromagnetic coil.

[0007] Preferably, the bottom sleeve mechanism includes a bottom shell, the bottom shell is fixedly connected to the bottoms of the two sliding rods, the inner curved surface of the bottom shell is fixedly sleeved with a second socket, the middle of the second socket is fixedly sleeved with a second one-way valve, and the output port of the second one-way valve faces the outer ring mechanism. A plurality of first guiding grooves are equidistantly arranged in a circumferential manner on the outer curved surface of the bottom shell. A first installation groove is arranged at the top end of the first guiding groove. A first sliding block is slidably sleeved in the middle of the first guiding groove. A first elastic member is fixedly installed at the bottom of the inner cavity of the first sliding block, and the top end of the first elastic member is fixedly connected to the top end of the first installation groove. The outer curved surface of the bottom shell is slidably sleeved with a first bottom sleeve, and the contact surface between the bottom shell and the first bottom sleeve is a smooth surface. The first sliding block is fixedly connected to the bottom of the inner curved surface of the first bottom sleeve. A plurality of second guiding grooves are equidistantly arranged in a circumferential manner on the outer curved surface of the first bottom sleeve. A second installation groove is arranged at the top end of the second guiding groove. A second sliding block is slidably sleeved in the middle of the second guiding groove. A second elastic member is fixedly installed at the bottom of the inner cavity of the second sliding block, and the top end of the second elastic member is fixedly connected to the top end of the second installation groove. The outer curved surface of the first bottom sleeve is slidably sleeved with a second bottom sleeve, and the second sliding block is fixedly connected to the bottom of the inner curved surface of the second bottom sleeve.

[0008] Preferably, the outer ring mechanism includes an outer sleeve shell, the outer sleeve shell is fixedly installed in the middle of the two sleeve blocks. First guiding grooves are symmetrically arranged on the upper and lower sides of the inner curved surface of the outer sleeve shell. First magnetic rings are symmetrically arranged on the upper and lower sides of the inner curved surface of the outer sleeve shell, and the magnetic directions of the adjacent sides of the first magnetic rings and the second magnetic rings are opposite.

[0009] Preferably, the middle ring mechanism includes a middle sleeve shell, the middle sleeve shell is slidably sleeved in the middle of the outer sleeve shell. Second guiding grooves are symmetrically arranged on the upper and lower sides of the inner curved surface of the middle sleeve shell. Second magnetic rings are symmetrically and fixedly sleeved on the upper and lower sides of the outer curved surface of the middle sleeve shell. Third magnetic rings are symmetrically and fixedly sleeved on the upper and lower sides of the inner curved surface of the middle sleeve shell, and the magnetic directions of the adjacent sides of the third magnetic rings are opposite.

[0010] Preferably, the inner ring mechanism includes an inner sleeve shell, the inner sleeve shell is slidably sleeved at the bottom of the outer curved surface of the top shell. Third guiding grooves are symmetrically arranged on the upper and lower sides of the inner curved surface of the inner sleeve shell. Two third magnetic rings are symmetrically and fixedly installed on the upper and lower sides of the outer curved surface of the inner sleeve shell, and the outer curved surface of the inner sleeve shell and the inner curved surface of the middle sleeve shell are both smooth surfaces.

[0011] The beneficial effects of the present invention are as follows:

[0012] 1. The present invention adjusts the reversing valve of the external cleaning liquid, enabling the cleaning liquid to preferentially flow through the lower first telescopic rod and the bottom sleeve mechanism into the inner cavity of the middle sleeve housing until the liquid level of the cleaning liquid in the inner cavity of the middle sleeve housing rises to the middle position of the second guide groove. Then, the wafer to be cleaned is moved to the middle of the middle sleeve housing by the external clamping device, and the wafer is slidably sleeved with the inner curved surface of the middle sleeve housing. At this time, the cleaning liquid located on the inner curved surface of the middle sleeve housing supports the bottom surface of the wafer. Then, the reversing valve is further adjusted to spray the cleaning liquid onto the surface of the wafer through the upper first telescopic rod and the top cover mechanism, and at the same time, the cleaning liquid is continuously injected into the inner cavity of the middle sleeve housing through the lower first telescopic rod, causing the liquid level of the cleaning liquid in the inner cavity of the middle sleeve housing to rise. At this time, the cleaning liquid in the inner cavity of the middle sleeve housing flows along the second guide groove and flows out of the device from the top of the middle sleeve housing. At the same time, the cleaning liquid flowing into the second guide groove is guided by the second guide groove, drives the wafer to rotate through the curved surface of the wafer, so that the dirt on the surface of the wafer falls off from the surface of the wafer under the action of centrifugal force. At the same time, the liquid cleaning liquid damps the rotating wafer, and at the same time, it avoids the direct contact between the rotating wafer and the inner curved surface of the middle sleeve housing, causing wafer vibration and edge wear.

[0013] 2. The present invention starts the second telescopic rod, and the second telescopic rod drives the top cover mechanism and the bottom sleeve mechanism to move downward through the sliding rod. When the top cover mechanism drives the inner ring mechanism to move downward along the inner curved surface of the middle sleeve housing until the electromagnetic seat contacts the top of the middle sleeve housing, at this time, when the power supply of the inner side electromagnetic coil is disconnected, the electromagnetic coil stops adsorbing the inner sleeve housing, and the third magnetic ring adsorbs the third magnetic ring, enabling the inner sleeve housing to be sleeved on the inner curved surface of the middle sleeve housing. When the second telescopic rod drives the top cover mechanism and the bottom sleeve mechanism to move upward through the sliding rod, the top cover mechanism is separated from the inner ring mechanism. At the same time, the bottom sleeve mechanism moves upward, and the inner sleeve housing presses the first bottom sleeve to drive the second sliding block to slide downward. The second sliding block pulls the second elastic member to elongate, and the bottom shell slides upward and is sleeved into the bottom of the inner curved surface of the inner sleeve housing, thereby placing the wafer with a small size into the inner curved surface of the inner ring mechanism to realize the cleaning of the wafer with a small size. On the contrary, the middle sleeve housing is sleeved upward on the outer curved surface of the inner sleeve housing to realize the cleaning of the wafer with a large size. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall external structure of the present invention;

[0015] Figure 2 is a schematic diagram of the structure of the inner ring mechanism of the present invention;

[0016] Figure 3 is a schematic diagram of the structure of the bottom sleeve mechanism of the present invention;

[0017] Figure 4 is a schematic diagram of the structure of the middle ring mechanism of the present invention;

[0018] Figure 5 is a schematic diagram of the structure of the first sliding block of the present invention.

[0019] In the figure: 1, the first mounting bracket; 2, the second mounting bracket; 3, the first telescopic rod; 4, the clamping mechanism; 401, the driving member; 402, the sleeve block; 403, the sliding rod; 404, the second telescopic rod; 5, the top cover mechanism; 501, the top shell; 502, the first socket; 503, the first one-way valve; 504, the electromagnetic seat; 505, the electromagnetic coil; 6, the bottom sleeve mechanism; 601, the bottom shell; 602, the second socket; 603, the second one-way valve; 604, the first sliding block; 605, the first elastic member; 606, the first bottom sleeve; 607, the second sliding block; 608, the second elastic member; 609, the second bottom sleeve; 7, the outer ring mechanism; 701, the outer shell; 702, the first guide groove; 703, the first magnetic ring; 8, the middle ring mechanism; 801, the middle shell; 802, the second guide groove; 803, the second magnetic ring; 804, the third magnetic ring; 9, the inner ring mechanism; 901, the inner shell; 902, the third guide groove; 903, the third magnetic ring. Specific embodiments

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] As Figures 1 to 5As shown in the figure, an embodiment of the present invention provides a semiconductor wafer backside cleaning device for semiconductor production, which includes two first mounting brackets 1. On the upper and lower sides of the middle parts of the two first mounting brackets 1, second mounting brackets 2 are symmetrically and fixedly installed. In the middle parts of the two second mounting brackets 2, first telescopic rods 3 are fixedly installed. A middle hole is opened in the middle of the telescopic shaft of the first telescopic rod 3, so as to facilitate the subsequent cleaning liquid to flow into the inner cavity surfaces of the top shell 501 and the bottom shell 601 through the middle hole opened at the telescopic end of the first telescopic rod 3. At the same time, when the clamping mechanism 4 flips the top cover mechanism 5 and the bottom sleeve mechanism 6 up and down, the first telescopic rod 3 can be quickly separated from the top cover mechanism 5 and the bottom sleeve mechanism 6. In the middle parts of the two first mounting brackets 1, there are clamping mechanisms 4. The clamping mechanism 4 includes a driving member 401. The driving member 401 is fixedly installed in the middle of the first mounting bracket 1 on the side away from the first telescopic rod 3. The output shaft of the driving member 401 is movably sleeved with the first mounting bracket 1. On the side of the output end of the driving member 401 close to the first telescopic rod 3, a sleeve block 402 is fixedly installed. A sliding rod 403 is slidably sleeved on the side of the sleeve block 402 away from the first telescopic rod 3. The contact surface between the sliding rod 403 and the sleeve block 402 is a smooth surface, so as to reduce the frictional resistance between the sliding rod 403 and the sleeve block 402, and further reduce the load of the second telescopic rod 404 when the sliding rod 403 drives the top cover mechanism 5 and the bottom sleeve mechanism 6 to move up and down. A second telescopic rod 404 is fixedly sleeved on the side of the sleeve block 402 close to the first telescopic rod 3. The telescopic end of the second telescopic rod 404 is fixedly connected to the sliding rod 403. Above the two clamping mechanisms 4, there is a top cover mechanism 5. Below the two clamping mechanisms 4, there is a bottom sleeve mechanism 6. In the middle of the two clamping mechanisms 4, there is an outer ring mechanism 7. In the middle of the outer ring mechanism 7, there is a middle ring mechanism 8. An inner ring mechanism 9 is sleeved outside the top cover mechanism 5.

[0022] As Figures 1 to 2 shown, the top cover mechanism 5 includes a top shell 501. The top shell 501 is fixedly connected to the upper parts of the two sliding rods 403. The upper part of the inner curved surface of the top shell 501 is fixedly sleeved with a first socket 502. In the middle of the first socket 502, a first one-way valve 503 is fixedly sleeved. The output port of the first one-way valve 503 faces the outer ring mechanism 7, so as to prevent the cleaning liquid on the inner curved surface of the top shell 501 from flowing out of the top shell 501 through the first one-way valve 503 when the clamping mechanism 4 flips the top cover mechanism 5. At the same time, the cleaning liquid input into the upper first telescopic rod 3 can flow into the inner cavity of the top shell 501 through the first one-way valve 503. The telescopic end of the upper first telescopic rod 3 is slidably sleeved with the top shell 501. The upper part of the outer curved surface of the top shell 501 is fixedly installed with an electromagnetic seat 504. Two electromagnetic coils 505 with different diameters are fixedly sleeved at the bottom of the electromagnetic seat 504. One electromagnetic coil 505 is located inside the other electromagnetic coil 505.

[0023] As Figures 1 to 3 、 Figure 5As shown, the bottom sleeve mechanism 6 includes a bottom shell 601. The bottom shell 601 is fixedly connected to the bottoms of two sliding rods 403. The inner curved surface of the bottom shell 601 is fixedly sleeved with a second socket 602. A second one-way valve 603 is fixedly sleeved in the middle of the second socket 602. The output port of the second one-way valve 603 faces the outer ring mechanism 7, so as to prevent the cleaning liquid on the inner curved surface of the bottom shell 601 from flowing out of the bottom shell 601 through the second one-way valve 603 when the clamping mechanism 4 flips the bottom sleeve mechanism 6. At the same time, the cleaning liquid input into the lower first telescopic rod 3 can flow into the inner cavity of the bottom shell 601 through the second one-way valve 603. A plurality of first guide grooves are equidistantly arranged in a circular pattern on the outer curved surface of the bottom shell 601. A first installation groove is opened at the top of the first guide groove. A first sliding block 604 is slidably sleeved in the middle of the first guide groove. A first elastic member 605 is fixedly installed at the bottom of the inner cavity of the first sliding block 604. The top of the first elastic member 605 is fixedly connected to the top of the first installation groove. A first bottom sleeve 606 is slidably sleeved on the outer curved surface of the bottom shell 601. The contact surface between the bottom shell 601 and the first bottom sleeve 606 is a smooth surface, so as to improve the sealing performance between the bottom shell 601 and the first bottom sleeve 606 and prevent the cleaning liquid on the inner curved surface of the middle sleeve shell 801 from leaking along the contact gap between the bottom shell 601 and the first bottom sleeve 606. The first sliding block 604 is fixedly connected to the bottom of the inner curved surface of the first bottom sleeve 606. A plurality of second guide grooves are equidistantly arranged in a circular pattern on the outer curved surface of the first bottom sleeve 606. A second installation groove is opened at the top of the second guide groove. A second sliding block 607 is slidably sleeved in the middle of the second guide groove. A second elastic member 608 is fixedly installed at the bottom of the inner cavity of the second sliding block 607. The top of the second elastic member 608 is fixedly connected to the top of the second installation groove. A second bottom sleeve 609 is slidably sleeved on the outer curved surface of the first bottom sleeve 606. The second sliding block 607 is fixedly connected to the bottom of the inner curved surface of the second bottom sleeve 609.

[0024] As Figures 1 to 3 shown, the outer ring mechanism 7 includes an outer sleeve shell 701. The outer sleeve shell 701 is fixedly installed in the middle of two sleeve blocks 402. First guide grooves 702 are symmetrically opened on the upper and lower sides of the inner curved surface of the outer sleeve shell 701. First magnetic rings 703 are symmetrically arranged on the upper and lower sides of the inner curved surface of the outer sleeve shell 701. The magnetic directions of the sides of the first magnetic rings 703 adjacent to the second magnetic rings 803 are opposite, so that when the middle sleeve shell 801 is slidably sleeved on the inner curved surface of the outer sleeve shell 701, the first magnetic rings 703 adsorb the second magnetic rings 803, making the middle sleeve shell 801 tightly sleeved in the inner cavity of the outer sleeve shell 701 and preventing the middle sleeve shell 801 from sliding downward along the inner curved surface of the outer sleeve shell 701.

[0025] As Figure 1 、 Figure 2 、 Figure 4As shown in the figure, the middle ring mechanism 8 includes a middle housing 801. The middle housing 801 is slidably sleeved in the middle of the outer housing 701. Second guide grooves 802 are symmetrically formed on the upper and lower sides of the inner curved surface of the middle housing 801. Second magnetic rings 803 are symmetrically and fixedly sleeved on the upper and lower sides of the outer curved surface of the middle housing 801. Third magnetic rings 804 are symmetrically and fixedly sleeved on the upper and lower sides of the inner curved surface of the middle housing 801. The magnetic directions of the adjacent sides of the third magnetic ring 804 and the third magnetic ring 903 are opposite. Therefore, when the inner housing 901 is slidably sleeved on the inner curved surface of the middle housing 801, the third magnetic ring 804 adsorbs the third magnetic ring 903, so that the inner housing 901 is tightly sleeved in the inner cavity of the middle housing 801, preventing the inner housing 901 from sliding downward along the inner curved surface of the middle housing 801.

[0026] As Figures 1 to 2 shown in the figure, the inner ring mechanism 9 includes an inner housing 901. The inner housing 901 is slidably sleeved at the bottom of the outer curved surface of the top housing 501. Third guide grooves 902 are symmetrically formed on the upper and lower sides of the inner curved surface of the inner housing 901. Two third magnetic rings 903 are symmetrically and fixedly installed on the upper and lower sides of the outer curved surface of the inner housing 901. The outer curved surface of the inner housing 901 and the inner curved surface of the middle housing 801 are both smooth surfaces, thereby improving the sealing performance between the inner housing 901 and the middle housing 801, preventing the cleaning liquid on the inner curved surface of the middle housing 801 from leaking along the contact gap between the middle housing 801 and the inner housing 901 when the inner housing 901 slides downward and is sleeved on the inner curved surface of the middle housing 801, resulting in the wafer contacting the top of the top housing 501 after the clamping mechanism 4 drives the top cover mechanism 5 to flip, causing wear on the top surface of the wafer.

[0027] Working principle:

[0028] Before the present invention is used, the output pipe of the external cleaning liquid is connected to the telescopic ends of the upper and lower first telescopic rods 3, so that the cleaning liquid can flow into the inner cavity of the top housing 501 through the middle of the telescopic end of the upper first telescopic rod 3 and the first one-way valve 503 and flow into the inner cavity of the bottom housing 601 through the middle of the telescopic end of the lower first telescopic rod 3 and the second one-way valve 603.

[0029] During use, first adjust the reversing valve of the external cleaning liquid so that the cleaning liquid preferentially flows into the inner cavity of the bottom shell 601 through the middle of the retracted end of the lower first telescopic rod 3 and the second one-way valve 603, and flows through the micropores in the upper part of the bottom shell 601 into the inner cavity of the middle sleeve shell 801 until the liquid level of the cleaning liquid in the inner cavity of the middle sleeve shell 801 rises to the middle position of the second guide groove 802. Then, move the wafer to be cleaned to the middle of the middle sleeve shell 801 through the external clamping device, so that the wafer is slidably sleeved with the inner curved surface of the middle sleeve shell 801. At this time, the cleaning liquid on the inner curved surface of the middle sleeve shell 801 supports the bottom surface of the wafer. Then, continue to adjust the reversing valve so that the cleaning liquid flows into the inner cavity of the top shell 501 through the middle of the telescopic end of the upper first telescopic rod 3 and the first one-way valve 503, and the cleaning liquid is sprayed onto the surface of the wafer through the micropores opened at the bottom of the top shell 501. At the same time, continue to inject the cleaning liquid into the inner cavity of the middle sleeve shell 801 through the lower first telescopic rod 3 to raise the liquid level of the cleaning liquid in the inner cavity of the middle sleeve shell 801. At this time, the cleaning liquid in the inner cavity of the middle sleeve shell 801 flows along the second guide groove 802 and flows out of the device from the top of the middle sleeve shell 801. At the same time, the cleaning liquid flowing into the second guide groove 802 drives the wafer to rotate under the guidance of the second guide groove 802, so that the dirt on the surface of the wafer falls off from the surface of the wafer under the action of centrifugal force. At the same time, the liquid cleaning liquid damps the rotating wafer, and at the same time avoids the direct contact between the rotating wafer and the inner curved surface of the middle sleeve shell 801, causing wafer vibration and edge wear;

[0030] In addition, when it is necessary to clean the back surface of the wafer, the reversing valve is adjusted, and the cleaning liquid stops flowing to the first telescopic rod 3 at the bottom and continues to flow to the first telescopic rod 3 at the upper part. Then, the second telescopic rod 404 is started, and the telescopic end of the second telescopic rod 404 moves downward. The second telescopic rod 404 drives the sliding rod 403 to move downward, and the sliding rod 403 drives the top cover mechanism 5 and the bottom sleeve mechanism 6 to move downward. At this time, the first bottom sleeve 606 moves downward along the inner curved surface of the middle sleeve housing 801, reducing the liquid level of the cleaning liquid in the inner cavity of the middle sleeve housing 801. The wafer in the inner cavity of the middle sleeve housing 801 moves downward together with the liquid level of the cleaning liquid. At this time, the inner sleeve housing 901 moves downward and slidably sleeved with the inner curved surface of the middle sleeve housing 801, and fills the cleaning liquid above the wafer on the inner curved surface of the middle sleeve housing 801, so that the wafer is located in the middle of the cleaning liquid in the inner cavity of the middle sleeve housing 801. Then, the first telescopic rod 3 is started to separate the telescopic ends of the upper and lower first telescopic rods 3 from the top shell 501 and the bottom shell 601. After that, the driving member 401 is started, and the output end of the driving member 401 drives the top cover mechanism 5, the bottom sleeve mechanism 6 and the outer ring mechanism 7 to turn up and down through the sleeve block 402 and the second telescopic rod 404. The outer ring mechanism 7 drives the middle ring mechanism 8 to turn up and down. At this time, the second telescopic rod 404 is started again, and the second telescopic rod 404 continues to drive the top cover mechanism 5 and the bottom sleeve mechanism 6 to move upward through the sliding rod 403. The top cover mechanism 5 drives the inner ring mechanism 9 to move upward along the inner curved surface of the middle sleeve housing 801. The top cover mechanism 5 and the inner ring mechanism 9 push the wafer to the upper part of the inner curved surface of the middle sleeve housing 801 again through the cleaning liquid in the inner cavity of the middle sleeve housing 801, and the first telescopic rod 3 is started. At this time, the telescopic end of the upper first telescopic rod 3 is slidably sleeved with the bottom shell 601, and the telescopic end of the lower first telescopic rod 3 is slidably sleeved with the top shell 501. At this time, the top cover mechanism 5 cleans the upper surface of the wafer, thus realizing the flipping of the wafer;

[0031] In addition, when the device is in use, the second telescopic rod 404 is activated. The second telescopic rod 404 drives the top cover mechanism 5 and the bottom sleeve mechanism 6 to move downward through the sliding rod 403. When the top cover mechanism 5 drives the inner ring mechanism 9 to move downward along the inner curved surface of the middle sleeve housing 801 until the electromagnetic seat 504 contacts the top end of the middle sleeve housing 801, at this time, the power supply of the inner side electromagnetic coil 505 is disconnected, and the electromagnetic coil 505 stops adsorbing the inner sleeve housing 901. The third magnetic ring 804 adsorbs the third magnetic ring 903, so that the inner sleeve housing 901 is sleeved on the inner curved surface of the middle sleeve housing 801. When the second telescopic rod 404 drives the top cover mechanism 5 and the bottom sleeve mechanism 6 to move upward through the sliding rod 403, the top cover mechanism 5 is separated from the inner ring mechanism 9. At the same time, the bottom sleeve mechanism 6 moves upward, and the inner sleeve housing 901 presses the first bottom sleeve 606 to drive the second sliding block 607 to slide downward. The second sliding block 607 pulls the second elastic member 608 to elongate, and the bottom case 601 slides upward and is sleeved into the bottom of the inner curved surface of the inner sleeve housing 901, so as to place the wafer with a small size into the inner curved surface of the inner ring mechanism 9, realizing the cleaning of the wafer with a small size. On the contrary, the middle sleeve housing 801 is sleeved upward on the outer curved surface of the inner sleeve housing 901 to realize the cleaning of the wafer with a large size.

[0032] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer backside cleaning device for semiconductor production, characterized in that: The invention comprises two first mounting frames (1), wherein second mounting frames (2) are symmetrically fixedly mounted on the upper and lower sides of the middle of the two first mounting frames (1), wherein a first telescopic rod (3) is fixedly mounted on the middle of the two second mounting frames (2), wherein a middle hole is provided in the middle of the telescopic axis of the first telescopic rod (3), wherein a clamping mechanism (4) is provided in the middle of the two first mounting frames (1), wherein the clamping mechanism (4) comprises a driving member (401), wherein the driving member (401) is fixedly mounted on the middle of the first mounting frame (1) away from the first telescopic rod (3), wherein the output shaft of the driving member (401) is movably sleeved with the first mounting frame (1), and a sleeve block (402) is fixedly mounted on the side of the output end of the driving member (401) close to the first telescopic rod (3). ), a sliding rod (403) is slidably sleeved on a side of the sleeve block (402) away from the first telescopic rod (3), the contact surface between the sliding rod (403) and the sleeve block (402) is a smooth surface, a second telescopic rod (404) is fixedly sleeved on a side of the sleeve block (402) close to the first telescopic rod (3), the telescopic end of the second telescopic rod (404) is fixedly connected to the sliding rod (403), a top cover mechanism (5) is provided on the upper part of the two clamping mechanisms (4), a bottom sleeve mechanism (6) is provided on the bottom of the two clamping mechanisms (4), an outer ring mechanism (7) is provided in the middle part of the two clamping mechanisms (4), a middle ring mechanism (8) is provided in the middle part of the outer ring mechanism (7), and an inner ring mechanism (9) is sleeved on the outer side of the top cover mechanism (5).

2. The semiconductor wafer backside cleaning device for semiconductor production according to claim 1, characterized in that: The top cover mechanism (5) comprises a top shell (501), wherein the top shell (501) is fixedly connected to the upper parts of the two sliding rods (403), a first sleeve (502) is fixedly sleeved on the upper part of the inner curved surface of the top shell (501), a first one-way valve (503) is fixedly sleeved on the middle part of the first sleeve (502), an output port of the first one-way valve (503) faces the outer ring mechanism (7), the telescopic end of the first telescopic rod (3) at the upper part is slidably sleeved on the top shell (501), an electromagnetic seat (504) is fixedly installed on the upper part of the outer curved surface of the top shell (501), and two electromagnetic coils (505) of different diameters are fixedly sleeved on the bottom of the electromagnetic seat (504), and one of the electromagnetic coils (505) is located on the inner side of the other electromagnetic coil (505).

3. The semiconductor wafer backside cleaning device for semiconductor production according to claim 2, characterized in that: The bottom sleeve mechanism (6) comprises a bottom shell (601), wherein the bottom shell (601) is fixedly connected to the bottoms of the two sliding rods (403), the inner curved surface of the bottom shell (601) is fixedly sleeved with a second sleeve seat (602), the middle part of the second sleeve seat (602) is fixedly sleeved with a second one-way valve (603), the output port of the second one-way valve (603) faces the outer ring mechanism (7), the outer curved surface of the bottom shell (601) is equidistantly provided with a plurality of first guide grooves, the top of the first guide groove is provided with a first mounting groove, the middle part of the first guide groove is slidably sleeved with a first sliding block (604), the bottom of the inner cavity of the first sliding block (604) is fixedly installed with a first elastic member (605), the top of the first elastic member (605) is fixedly connected to the top of the first mounting groove, the bottom of the bottom shell (601) is provided with a plurality of first guide grooves, the top of the first elastic member (605) is fixedly connected to the top of the first mounting groove, The outer curved surface is slidably sleeved with a first bottom sleeve (606); the contact surface between the bottom shell (601) and the first bottom sleeve (606) is a smooth surface; the first sliding block (604) is fixedly connected to the bottom of the inner curved surface of the first bottom sleeve (606); a plurality of second guide grooves are equidistantly provided on the circumference of the outer curved surface of the first bottom sleeve (606); a second mounting groove is provided at the top of the second guide groove; a second sliding block (607) is slidably sleeved in the middle of the second guide groove; a second elastic member (608) is fixedly installed at the bottom of the inner cavity of the second sliding block (607); the top of the second elastic member (608) is fixedly connected to the top of the second mounting groove; the outer curved surface of the first bottom sleeve (606) is slidably sleeved with a second bottom sleeve (609); the second sliding block (607) is fixedly connected to the bottom of the inner curved surface of the second bottom sleeve (609).

4. The semiconductor wafer backside cleaning device for semiconductor production according to claim 3, characterized in that: The outer ring mechanism (7) comprises an outer shell (701), the outer shell (701) being fixedly mounted in the middle of the two sleeve blocks (402), the first guide grooves (702) being symmetrically provided on the upper and lower sides of the inner curved surface of the outer shell (701), the first magnetic ring (703) being symmetrically provided on the upper and lower sides of the inner curved surface of the outer shell (701), the first magnetic ring (703) having a magnetic direction opposite to that of the second magnetic ring (803) on the side adjacent to the first magnetic ring (703).

5. The semiconductor wafer backside cleaning device for semiconductor production according to claim 4, characterized in that: The middle ring mechanism (8) comprises a middle shell (801), wherein the middle shell (801) is slidably sleeved on the middle part of the outer shell (701), and second guide grooves (802) are symmetrically provided on the upper and lower sides of the inner curved surface of the middle shell (801), and a second magnetic ring (803) is symmetrically fixedly sleeved on the upper and lower sides of the outer curved surface of the middle shell (801), and a third magnetic ring (804) is symmetrically fixedly sleeved on the upper and lower sides of the inner curved surface of the middle shell (801), and the magnetic direction of the third magnetic ring (804) is opposite to that of the third magnetic ring (903) on one side adjacent to the third magnetic ring (803).

6. The semiconductor wafer backside cleaning device for semiconductor production according to claim 5, characterized in that: The inner ring mechanism (9) comprises an inner sleeve shell (901), the inner sleeve shell (901) is slidably sleeved on the bottom of the outer curved surface of the top shell (501), third guide grooves (902) are symmetrically provided on the upper and lower sides of the inner curved surface of the inner sleeve shell (901), two third magnetic rings (903) are symmetrically fixedly installed on the upper and lower sides of the outer curved surface of the inner sleeve shell (901), and the outer curved surface of the inner sleeve shell (901) and the inner curved surface of the middle sleeve shell (801) are both smooth surfaces.

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