Wafer carrier and testing method thereof

Abstract

The invention relates to a wafer carrier and a testing method thereof, and relates to the field of semiconductors. According to the wafer carrier provided by the technical scheme, the unified bearing of different sizes of common wafers, blue film wafers and warped wafers is realized in a breakthrough manner through the replaceable and selectable bearing suction cups, the divisible bearing suction cups, the selectable number of the adsorption assemblies and dynamic vacuum adjustment, and the adaptive capacity is improved by more than 80% compared with that of a traditional scheme. According to the integrated structure design, a set of adsorption lifting mechanism is used for replacing multiple sets of independent carriers, through a modularized micropore array and an annular notch composite adsorption face, stress dispersion of blue film wafers (local stress is reduced by 40%) and stable adsorption of warped wafers (displacement is smaller than 5 microns) are ensured, the equipment purchase cost is reduced by 60%, the occupied space is reduced by 70%, and the production efficiency is improved. And key support is provided for miniaturization of semiconductor equipment.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a wafer carrier and a testing method thereof. Background Art

[0002] Current semiconductor manufacturing equipment has significant defects in wafer fixing compatibility. Traditional vacuum adsorption carriers are designed based on a single physical structure and are difficult to adapt to the different characteristics of ordinary wafers, blue film wafers, and warped wafers. Ordinary wafers require high flatness (TTV ≤ 1 μm), while the blue adhesive film (with a thickness of about 50 - 100 μm) attached to the back of the blue film wafer will cause local stress concentration during adsorption, affecting the vacuum uniformity; the curved surface of the warped wafer (WARP value > 200 μm) reduces the contact area, resulting in uneven distribution of the vacuum adsorption force and easily causing wafer displacement or detachment during the detection process. Existing equipment needs to design carriers separately for each type of wafer. For example, blue film wafers need to be equipped with special carriers with adhesive film support structures, and warped wafers need to be equipped with adjustable pressure compensation devices, resulting in a 30% - 50% increase in equipment procurement costs. Moreover, switching between different carriers requires re-calibration, which takes up to 2 - 4 hours each time, seriously affecting the production line efficiency.

[0003] In terms of wafer size compatibility, the existing technology has structural limitations. Mainstream semiconductor equipment adopts a fixed mechanical positioning design and only supports wafers of a single size (such as 12 inches or 8 inches). When it is necessary to switch to producing multi-specification wafers of 4 - 12 inches, the entire carrier and the supporting vacuum pipeline need to be replaced. This rigid design requires enterprises to invest in multiple sets of equipment to cover the full-size product line, increasing the equipment floor area by 1.5 - 2 times and raising the operation and maintenance costs by more than 40%. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer carrier and a testing method thereof to solve the problems existing in the above-mentioned prior art.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows: In the first aspect, the present invention provides a wafer carrier, including a bottom plate. The wafer carrier further includes: A blue film wafer carrying suction cup for adsorbing the blue film wafer, which has a porous ceramic adsorption surface; A warped wafer carrying suction cup for adsorbing ordinary wafers or warped wafers, which has an annular groove adsorption surface; A plurality of support seats are spacedly installed on the bottom plate, and the blue film wafer carrying suction cup and the warped wafer carrying suction cup are replaceably connected to the plurality of support seats; An adsorption lifting component, which is installed on the bottom plate and is used to assist the blue film wafer carrying suction cup in adsorbing the blue film wafer, or is used to assist the warped wafer carrying suction cup in adsorbing the ordinary wafer or the warped wafer; A fixed adsorption component, which is installed on the bottom plate and is used to assist the blue film wafer carrying suction cup in adsorbing the blue film wafer; and A suction cup ventilation component, which is installed on the bottom plate and is used to provide adsorption force to the porous ceramic adsorption surface or to provide adsorption force to the annular groove adsorption surface; Wherein, the adsorption lifting component, the fixed adsorption component, and the suction cup ventilation component are all connected to an external vacuum power source through a ventilation panel installed on the bottom plate, and the ventilation panel can control the opening and closing of different air paths.

[0006] In a possible implementation manner, the porous ceramic adsorption surface includes a first porous ceramic adsorption area and a second porous ceramic adsorption area located outside the first porous ceramic adsorption area to adapt to blue film wafers of different sizes; The annular groove adsorption surface includes a first annular groove adsorption area, a second annular groove adsorption area, a third annular groove adsorption area, and a fourth annular groove adsorption area that are distributed in sequence from inside to outside to adapt to ordinary wafers or warped wafers of different sizes.

[0007] In a possible implementation manner, the suction cup ventilation component includes: A first ventilation rod, which is docked with the ventilation hole at the bottom of the first porous ceramic adsorption area or the ventilation hole at the bottom of the first annular groove adsorption area; A second ventilation rod, which is docked with the ventilation hole at the bottom of the second annular groove adsorption area; A third ventilation rod, which is docked with the ventilation hole at the bottom of the third annular groove adsorption area; and A fourth ventilation rod, which is docked with the ventilation hole at the bottom of the second porous ceramic adsorption area or the ventilation hole at the bottom of the fourth annular groove adsorption area; Wherein, the air paths of the first ventilation rod, the second ventilation rod, the third ventilation rod, and the fourth ventilation rod can all be individually controlled to open and close through the ventilation panel.

[0008] In a possible implementation manner, the adsorption lifting component includes a first group of lifting adsorption rods, a second group of lifting adsorption rods, a third group of lifting adsorption rods, and a fourth group of lifting adsorption rods that are distributed in sequence from inside to outside; The air paths of the first group of lifting adsorption rods, the second group of lifting adsorption rods, the third group of lifting adsorption rods, and the fourth group of lifting adsorption rods can all be individually controlled to open and close through the ventilation panel; When the blue film wafer carrier suction cup is connected to the multiple support seats, the second group of lifting suction rods and the third group of lifting suction rods are liftably inserted into corresponding through holes reserved on the blue film wafer carrier suction cup; When the warped wafer carrier suction cup is connected to the multiple support seats, the first group of lifting suction rods and the third group of lifting suction rods are liftably inserted into corresponding through holes reserved on the warped wafer carrier suction cup; Wherein, the fourth group of lifting suction rods is located on the outer periphery of the blue film wafer carrier suction cup and the warped wafer carrier suction cup.

[0009] In a possible implementation manner, the adsorption and lifting assembly further includes: A horizontal driving member, which is installed on the bottom plate, and is a pneumatic telescopic cylinder or an electric telescopic cylinder, and is used to provide a driving force in the horizontal direction; and A horizontal guiding member, which is installed on the bottom plate, and is used to cooperate with the vertical lifting member to convert the horizontal driving force provided by the horizontal driving member into a vertical driving force of the vertical lifting member; Wherein, the vertical lifting member is used to drive the first group of lifting suction rods, the second group of lifting suction rods, the third group of lifting suction rods, and the fourth group of lifting suction rods to perform lifting movements.

[0010] In a possible implementation manner, the horizontal guiding member includes: A horizontal guide rail, which is installed on the bottom plate; A horizontal slider, which is slidably connected to the horizontal guide rail and is connected to the driving end of the horizontal driving member; and A cam plate, which is installed on the horizontal slider and has a kidney-shaped inner hole with a first side higher than a second side; Wherein, the horizontal guiding member cooperates with the vertical lifting member through the cam plate.

[0011] In a possible implementation manner, the vertical lifting member includes: A lifting plate, to which the first group of lifting suction rods, the second group of lifting suction rods, the third group of lifting suction rods, and the fourth group of lifting suction rods are all detachably connected; A vertical guiding rod, which is installed on the bottom plate along the vertical direction, and the lifting plate is slidably connected to the vertical guiding rod through a linear bearing; and A cam bearing, whose first end is connected to the lifting plate, and whose second end is located in the kidney-shaped inner hole of the cam plate; Wherein, when the cam plate moves in the horizontal direction, the kidney-shaped inner hole of the cam plate drives the cam bearing to perform a lifting movement.

[0012] In a possible implementation, the fixed adsorption assembly includes a first group of fixed adsorption rods, a second group of fixed adsorption rods, and a third group of fixed adsorption rods which are distributed in sequence from the inside to the outside; The first group of fixed adsorption rods, the second group of fixed adsorption rods, and the third group of fixed adsorption rods are installed on the bottom plate through the fixed adsorption rod bases; The air paths of the first group of fixed adsorption rods, the second group of fixed adsorption rods, and the third group of fixed adsorption rods can all be individually controlled to open and close through the ventilation panel; When the blue film wafer carrier suction cups are connected to the plurality of support seats, the first group of fixed adsorption rods and the second group of fixed adsorption rods penetrate through the corresponding through holes reserved on the blue film wafer carrier suction cup; Wherein, the third group of fixed adsorption rods is located on the outer periphery of the blue film wafer carrier suction cup.

[0013] In a second aspect, the present invention provides a method for testing a blue film wafer by a wafer carrier, the method being applicable to the wafer carrier as described above, and the method includes: S1. According to blue film wafers to be tested with different sizes, control one or more groups of lifting adsorption rods of the adsorption lifting assembly to rise to a position higher than the porous ceramic adsorption surface; S2. Place the blue film wafers to be tested on one or more groups of lifting adsorption rods of the adsorption lifting assembly, and open the vacuum adsorption air path of the corresponding lifting adsorption rods, with the vacuum pressure being -50 kPa to -95 kPa; S3. After the blue film wafers to be tested are adsorbed on one or more groups of lifting adsorption rods of the adsorption lifting assembly, control one or more groups of lifting adsorption rods of the adsorption lifting assembly to descend to the same height as the porous ceramic adsorption surface; S4. Based on blue film wafers to be tested with different sizes, open the vacuum adsorption air paths of one or more adsorption regions of the porous ceramic adsorption surface and open the vacuum adsorption air paths of one or more groups of fixed adsorption rods of the fixed adsorption assembly, with the vacuum pressure being -50 kPa to -95 kPa; S5. After the porous ceramic adsorption surface adsorbs the blue film and the wafer body of the blue film wafers to be tested and the fixed adsorption assembly adsorbs the crystal ring of the blue film wafers to be tested, the blue film wafers to be tested are closely attached to the porous ceramic adsorption surface, and close the vacuum adsorption air path of the adsorption lifting assembly, then the blue film wafers to be tested can be tested.

[0014] In a third aspect, the present invention provides a method for testing a common wafer or a warped wafer by a wafer carrier, the method being applicable to the wafer carrier as described above, and the method includes: S1. According to common wafers or warped wafers to be tested with different sizes, control one or more groups of lifting adsorption rods of the adsorption lifting assembly to rise to a position higher than the annular groove adsorption surface; S2. Place the ordinary wafer or warped wafer to be measured on one or more lifting and adsorbing rods of the adsorption lifting assembly, and turn on the vacuum adsorption air path of the corresponding lifting and adsorbing rod. The vacuum pressure is -50 kPa to -95 kPa. S3. After the ordinary wafer or warped wafer to be measured is adsorbed on one or more lifting and adsorbing rods of the adsorption lifting assembly, control one or more lifting and adsorbing rods of the adsorption lifting assembly to descend to the same height as the annular groove adsorption surface. S4. Based on the ordinary wafers or warped wafers to be measured with different sizes, turn on the vacuum adsorption air path of one or more adsorption areas of the annular groove adsorption surface. The vacuum pressure is -50 kPa to -95 kPa. S5. After the annular groove adsorption surface completes the adsorption of the wafer body of the ordinary wafer or warped wafer to be measured, the ordinary wafer or warped wafer to be measured is closely attached to the annular groove adsorption surface. Turn off the vacuum adsorption air path of the adsorption lifting assembly, and then the ordinary wafer or warped wafer to be measured can be tested.

[0015] The beneficial effects brought by the technical solution provided by the present invention at least include: The wafer carrier provided by this technical solution realizes the unified loading of ordinary wafers, blue film wafers and warped wafers with different sizes through replaceable selection of the loading suction cups, partitionable loading suction cups, selectable number of adsorption components and dynamic vacuum adjustment. Its adaptability is improved by more than 80% compared with the traditional solution. Its integrated structure design replaces multiple sets of independent carriers with a set of adsorption lifting mechanism. Through the modular microporous array and the annular groove composite adsorption surface, it not only ensures the stress dispersion of the blue film wafer (local stress is reduced by 40%) and the stable adsorption of the warped wafer (displacement < 5 μm), but also reduces the equipment procurement cost by 60% and the space occupation by 70%, providing key support for the miniaturization of semiconductor equipment. Description of the Drawings

[0016] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention.

[0017] Figure 1 It shows a schematic structural diagram of the wafer carrier provided by an exemplary embodiment of the present invention when installing the blue film wafer loading suction cup.

[0018] Figure 2 It shows a schematic structural diagram of the wafer carrier provided by an exemplary embodiment of the present invention when installing the warped wafer loading suction cup.

[0019] Figure 3 It shows a schematic side view of the wafer carrier provided by an exemplary embodiment of the present invention.

[0020] Figure 4 The top view schematic diagram of a wafer carrier provided by an exemplary embodiment of the present invention is shown.

[0021] Figure 5 The side sectional schematic diagram of a wafer carrier provided by an exemplary embodiment of the present invention along the first direction is shown.

[0022] Figure 6 The side sectional schematic diagram of a wafer carrier provided by an exemplary embodiment of the present invention along the second direction is shown.

[0023] Figure 7 The structural schematic diagram of the adsorption lifting assembly of a wafer carrier provided by an exemplary embodiment of the present invention is shown.

[0024] Figure 8 The structural schematic diagram of the fixed adsorption assembly of a wafer carrier provided by an exemplary embodiment of the present invention is shown.

[0025] Figure 9 The structural schematic diagram of a blue film wafer provided by an exemplary embodiment of the present invention is shown.

[0026] Figure 10 The structural schematic diagram of an ordinary wafer or a warped wafer provided by an exemplary embodiment of the present invention is shown.

[0027] Figure 11 The flow schematic diagram of a method for a wafer carrier to test a blue film wafer provided by an exemplary embodiment of the present invention is shown.

[0028] Figure 12 The flow schematic diagram of a method for a wafer carrier to test an ordinary wafer or a warped wafer provided by an exemplary embodiment of the present invention is shown.

[0029] In the figure: 100, blue film wafer carrying suction cup; 101, porous ceramic adsorption surface; 1011, first porous ceramic adsorption area; 1012, second porous ceramic adsorption area; 200, warped wafer carrying suction cup; 201, annular groove adsorption surface; 2011, first annular groove adsorption area; 2012, second annular groove adsorption area; 2013, third annular groove adsorption area; 2014, fourth annular groove adsorption area; 300. Adsorption lifting assembly; 301. Horizontal driving member; 302. Horizontal guiding member; 3021. Horizontal guide rail; 3022. Horizontal slider; 3023. Cam plate; 303. Vertical lifting member; 3031. Cam bearing; 3032. Vertical guiding rod; 3033. Linear bearing; 3034. Lifting plate; 304. First group of lifting adsorption rods; 305. Second group of lifting adsorption rods; 306. Third group of lifting adsorption rods; 307. Fourth group of lifting adsorption rods; 308. Bottom plate; 400. Ventilation panel; 500. Carrier suction cup ventilation assembly; 501. First ventilation rod; 502. Second ventilation rod; 503. Third ventilation rod; 504. Fourth ventilation rod; 600. Fixed adsorption assembly; 601. First group of fixed adsorption rods; 602. Second group of fixed adsorption rods; 603. Third group of fixed adsorption rods; 604. Fixed adsorption rod base; 700. Support seat; 001. Crystal ring; 002. Blue film; 003. Wafer body; 004. Wafer body. Detailed implementation manner

[0030] Next, the accompanying drawings in the embodiments of the present invention will be combined to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] Among them, the same components are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the accompanying drawings of the present invention specification, and the words "bottom surface" and "top surface", "inner" and "outer" refer to facing or away from a specific component respectively. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention specification, "a plurality" means two or more.

[0032] First, the structures of the blue film wafer, ordinary wafer, and warped wafer are introduced. Figure 9 The schematic structural diagram of the blue film wafer provided by an exemplary embodiment of the present invention is shown. The blue film wafer includes a wafer body 003, a blue film 002, and a crystal ring 001. Figure 10The structural schematic diagram of a common wafer or warped wafer provided by an exemplary embodiment of the present invention is shown. The common wafer or warped wafer includes a wafer body 004.

[0033] Specifically, the blue film wafer consists of three parts: The outermost layer is the annular frame - crystal ring 001, usually made of metal or high-strength plastic material. The inner diameter is adapted to the wafer size (for example, a 12-inch wafer corresponds to a 170mm crystal ring), and the surface is commonly coated with white, blue-green, etc., which is used to fix the wafer edge and provide UV film adsorption support; The middle layer is the blue adhesive film - blue film 002, with a thickness of about 50 - 100μm, which is adhered to the inner side of the crystal ring by electrostatic adsorption or hot melt adhesive, playing a role in protecting the back of the wafer and preventing the die from flying during cutting; The inner layer is the wafer body 003, made of single-crystalline silicon material, with high-density integrated circuits distributed on the surface. There are unused areas (scrap) at the edge due to the cutting process. The common wafer is a standard substrate structure, only containing the silicon wafer body 004, without an additional coating on the surface, and the process calibration is achieved through the edge positioning notch. The warped wafer is also based on the silicon wafer body, but due to manufacturing stress or environmental temperature changes, the overall flatness is abnormal, manifested as a convex or concave center area, and the WARP value (warpage) is usually > 200μm, and the thickness at the thinnest part can be as low as 50μm. This curved surface morphology makes the traditional adsorption method prone to local stress concentration or insufficient contact area, affecting the uniformity of precision processes such as lithography and etching. The present invention realizes the stable loading of wafers with different structures through the structural design of a porous ceramic adsorption surface (porosity 30% - 60%) and an alternatively annular groove adsorption surface.

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0035] Figure 1 The structural schematic diagram of the wafer carrier when installing a blue film wafer bearing suction cup provided by an exemplary embodiment of the present invention is shown. Figure 2The figure shows a schematic structural diagram of a wafer carrier when mounting a warped wafer-bearing suction cup provided by an exemplary embodiment of the present invention. The wafer carrier includes a bottom plate 308, and the wafer carrier further includes: a blue film wafer-bearing suction cup 100 for adsorbing blue film wafers, which has a porous ceramic adsorption surface 101; a warped wafer-bearing suction cup 200 for adsorbing ordinary wafers or warped wafers, which has an annular groove adsorption surface 201; a plurality of support seats 700 spacedly mounted on the bottom plate 308, and the blue film wafer-bearing suction cup 100 and the warped wafer-bearing suction cup 200 are replaceably connected to the plurality of support seats 700; an adsorption lifting assembly 300 mounted on the bottom plate 308, which is used to assist the blue film wafer-bearing suction cup 100 in adsorbing blue film wafers, or to assist the warped wafer-bearing suction cup 200 in adsorbing ordinary wafers or warped wafers; a fixed adsorption assembly 600 mounted on the bottom plate 308, which is used to assist the blue film wafer-bearing suction cup 100 in adsorbing blue film wafers; and a bearing suction cup ventilation assembly 500 mounted on the bottom plate 308, which is used to provide adsorption force to the porous ceramic adsorption surface 101 or to provide adsorption force to the annular groove adsorption surface 201; wherein, the adsorption lifting assembly 300, the fixed adsorption assembly 600, and the bearing suction cup ventilation assembly 500 are all connected to an external vacuum power source through a ventilation panel 400 mounted on the bottom plate 308, and the ventilation panel 400 can control the opening and closing of different air paths.

[0036] In an embodiment of the present application, the blue film wafer-bearing suction cup 100 and the warped wafer-bearing suction cup 200 are replaceably mounted on the support seats 700 by bolts. Without replacing the entire carrier, only the corresponding suction cup needs to be replaced, which greatly improves the use efficiency and cost-effectiveness.

[0037] Furthermore, the porous ceramic adsorption surface 101 includes a first porous ceramic adsorption region 1011 and a second porous ceramic adsorption region 1012 located outside the first porous ceramic adsorption region 1011 to adapt to blue film wafers of different sizes; the annular groove adsorption surface 201 includes a first annular groove adsorption region 2011, a second annular groove adsorption region 2012, a third annular groove adsorption region 2013, and a fourth annular groove adsorption region 2014 distributed in sequence from the inside to the outside to adapt to ordinary wafers or warped wafers of different sizes.

[0038] In an embodiment of the present application, the partition design of the porous ceramic adsorption surface and the annular groove adsorption surface is to better adapt to wafers of different sizes. For blue film wafers, the two regions of the porous ceramic adsorption surface can select a suitable adsorption region according to their sizes, ensuring the adsorption effect while avoiding unnecessary waste of adsorption force. For ordinary or warped wafers, the four regions of the annular groove adsorption surface can also adjust the adsorption region according to the wafer size, enhancing the compatibility of the carrier with wafers of different sizes.

[0039] Figure 3 The side view schematic diagram of the wafer carrier provided by an exemplary embodiment of the present invention is shown. Figure 4 The top view schematic diagram of the wafer carrier provided by an exemplary embodiment of the present invention is shown. The carrier suction cup ventilation assembly 500 includes: a first ventilation rod 501, which is docked with the ventilation holes at the bottom of the first porous ceramic adsorption area 1011 or the ventilation holes at the bottom of the first annular groove adsorption area 2011; a second ventilation rod 502, which is docked with the ventilation holes at the bottom of the second annular groove adsorption area 2012; a third ventilation rod 503, which is docked with the ventilation holes at the bottom of the third annular groove adsorption area 2013; and a fourth ventilation rod 504, which is docked with the ventilation holes at the bottom of the second porous ceramic adsorption area 1012 or the ventilation holes at the bottom of the fourth annular groove adsorption area 2014. Among them, the gas paths of the first ventilation rod 501, the second ventilation rod 502, the third ventilation rod 503, and the fourth ventilation rod 504 can all be individually controlled to open and close through the ventilation panel 400.

[0040] In the embodiment of the present application, the design of the docking relationship between the four ventilation rods and different adsorption areas, and the gas paths of each ventilation rod can be individually controlled to open and close through the ventilation panel enables precise control of the adsorption force of each adsorption area when adsorbing wafers of different sizes and types, flexibly adjusting the gas path according to actual needs to achieve precise adsorption. For example, for wafers of a smaller size, only the gas path of the corresponding adsorption area can be opened, avoiding energy waste and improving the pertinence and stability of adsorption.

[0041] Figure 7 The structural schematic diagram of the adsorption lifting assembly of the wafer carrier provided by an exemplary embodiment of the present invention is shown. The adsorption lifting assembly 300 includes a first group of lifting adsorption rods 304, a second group of lifting adsorption rods 305, a third group of lifting adsorption rods 306, and a fourth group of lifting adsorption rods 307 that are distributed in sequence from the inside to the outside. The gas paths of the first group of lifting adsorption rods 304, the second group of lifting adsorption rods 305, the third group of lifting adsorption rods 306, and the fourth group of lifting adsorption rods 307 can all be individually controlled to open and close through the ventilation panel 400. When the blue film wafer carrier suction cups 100 are connected to multiple support seats 700, the second group of lifting adsorption rods 305 and the third group of lifting adsorption rods 306 can be lifted and lowered through the corresponding through holes reserved on the blue film wafer carrier suction cups 100. When the warped wafer carrier suction cups 200 are connected to multiple support seats 700, the first group of lifting adsorption rods 304 and the third group of lifting adsorption rods 306 can be lifted and lowered through the corresponding through holes reserved on the warped wafer carrier suction cups 200. Among them, the fourth group of lifting adsorption rods 307 is located on the outer periphery of the blue film wafer carrier suction cups 100 and the warped wafer carrier suction cups 200.

[0042] It is worth mentioning that when the blue film wafer carrier suction cup 100 is connected to multiple support seats 700, the second set of lifting suction rods 305 and the third set of lifting suction rods 306 are slidably disposed through corresponding through holes reserved on the blue film wafer carrier suction cup 100. At this time, the first set of lifting suction rods 304 needs to be removed. When the warped wafer carrier suction cup 200 is connected to multiple support seats 700, the first set of lifting suction rods 304 and the third set of lifting suction rods 306 are slidably disposed through corresponding through holes reserved on the warped wafer carrier suction cup 200. At this time, the second set of lifting suction rods 305 needs to be removed.

[0043] In one example, each set of lifting suction rods has 3 lifting suction rods, and the first set of lifting suction rods 304, the second set of lifting suction rods 305, the third set of lifting suction rods 306, and the fourth set of lifting suction rods 307 are concentrically arranged.

[0044] Figure 5 Fig. shows a side cross-sectional view of a wafer carrier provided by an exemplary embodiment of the present invention along a first direction. Figure 6 Fig. shows a side cross-sectional view of a wafer carrier provided by an exemplary embodiment of the present invention along a second direction. Figure 7 Fig. shows a structural diagram of a suction and lifting assembly of a wafer carrier provided by an exemplary embodiment of the present invention. The suction and lifting assembly 300 further includes: a horizontal driving member 301, which is mounted on the bottom plate 308 and is a pneumatic telescopic cylinder or an electric telescopic cylinder for providing a driving force in the horizontal direction; and a horizontal guiding member 302, which is mounted on the bottom plate 308 and is used to cooperate with the vertical lifting member 303 to convert the horizontal driving force provided by the horizontal driving member 301 into a vertical driving force of the vertical lifting member 303. Wherein, the vertical lifting member 303 is used to drive the first set of lifting suction rods 304, the second set of lifting suction rods 305, the third set of lifting suction rods 306, and the fourth set of lifting suction rods 307 to perform lifting movements.

[0045] Further, the horizontal guiding member 302 includes: a horizontal guide rail 3021, which is mounted on the bottom plate 308; a horizontal slider 3022, which is slidably connected to the horizontal guide rail 3021 and is connected to the driving end of the horizontal driving member 301; and a cam plate 3023, which is mounted on the horizontal slider 3022 and has a kidney-shaped inner hole with a first side higher than a second side. Wherein, the horizontal guiding member 302 cooperates with the vertical lifting member 303 through the cam plate 3023.

[0046] Further, the vertical lifting member 303 includes: a lifting plate 3034, to which the first set of lifting suction rods 304, the second set of lifting suction rods 305, the third set of lifting suction rods 306, and the fourth set of lifting suction rods 307 are all detachably connected; a vertical guide rod 3032, which is installed on the bottom plate 308 in the vertical direction, and the lifting plate 3034 is slidably connected to the vertical guide rod 3032 through a linear bearing 3033; and a cam bearing 3031, whose first end is connected to the lifting plate 3034 and whose second end is located in the kidney-shaped inner hole of the cam plate 3023; wherein, when the cam plate 3023 moves horizontally, the kidney-shaped inner hole of the cam plate 3023 drives the cam bearing 3031 to perform a lifting motion.

[0047] In the embodiment of the present application, the horizontal guide rail and the horizontal slider ensure the stability and linearity of the horizontal movement; the lifting plate connects the four sets of lifting suction rods together to ensure their synchronous movement; the cooperation of the vertical guide rod and the linear bearing ensures the linearity and stability of the lifting movement; the cooperation between the kidney-shaped inner hole of the cam plate and the cam bearing realizes the conversion from horizontal movement to vertical movement. This structural design enables the lifting suction rods to lift according to a predetermined trajectory and speed, ensuring that the wafer can be accurately received and placed during the adsorption process, thereby improving the accuracy and reliability of adsorption.

[0048] Figure 8 The structural schematic diagram of the fixed adsorption assembly of the wafer carrier provided by an exemplary embodiment of the present invention is shown. Figure 1 The structural schematic diagram of the wafer carrier when installing the blue film wafer carrying suction cup provided by an exemplary embodiment of the present invention is shown. The fixed adsorption assembly 600 includes a first set of fixed adsorption rods 601, a second set of fixed adsorption rods 602, and a third set of fixed adsorption rods 603 that are distributed in sequence from the inside to the outside; the first set of fixed adsorption rods 601, the second set of fixed adsorption rods 602, and the third set of fixed adsorption rods 603 are installed on the bottom plate 308 through a fixed adsorption rod base 604; the air circuits of the first set of fixed adsorption rods 601, the second set of fixed adsorption rods 602, and the third set of fixed adsorption rods 603 can all be individually controlled to open and close through an air supply panel 400; when a blue film wafer carrying suction cup 100 is connected to a plurality of support seats 700, the first set of fixed adsorption rods 601 and the second set of fixed adsorption rods 602 pass through corresponding through holes reserved on the blue film wafer carrying suction cup 100; wherein, the third set of fixed adsorption rods 603 is located on the outer periphery of the blue film wafer carrying suction cup 100.

[0049] In the embodiment of the present application, when adsorbing the blue film wafer, the fixed adsorption assembly can assist the porous ceramic adsorption surface to adsorb the crystal ring of the blue film wafer, enhancing the stability and firmness of adsorption.

[0050] It is worth mentioning that when the warped wafer carrier suction cups 200 are connected to multiple support bases 700, the first set of fixed suction rods 601 and the second set of fixed suction rods 602 need to be removed.

[0051] Figure 11 The flowchart shows the method for a wafer carrier to test a blue film wafer provided by an exemplary embodiment of the present invention. This method for a wafer carrier to test a blue film wafer is applicable to the above-mentioned wafer carrier, and the method includes: Step S1: According to blue film wafers to be tested with different sizes, control one or more groups of lifting suction rods of the adsorption lifting assembly to rise to a position higher than the porous ceramic adsorption surface; Step S2: Place the blue film wafer to be tested on one or more groups of lifting suction rods of the adsorption lifting assembly, and turn on the vacuum suction gas path of the corresponding lifting suction rods. The vacuum pressure is -50 kPa to -95 kPa; Step S3: After the blue film wafer to be tested is adsorbed on one or more groups of lifting suction rods of the adsorption lifting assembly, control one or more groups of lifting suction rods of the adsorption lifting assembly to descend to the same height as the porous ceramic adsorption surface; Step S4: Based on blue film wafers to be tested with different sizes, turn on the vacuum suction gas paths of one or more adsorption areas of the porous ceramic adsorption surface and turn on the vacuum suction gas paths of one or more groups of fixed suction rods of the fixed adsorption assembly. The vacuum pressure is -50 kPa to -95 kPa; Step S5: After the porous ceramic adsorption surface adsorbs the blue film and the wafer body of the blue film wafer to be tested, and the fixed adsorption assembly adsorbs the crystal ring of the blue film wafer to be tested, the blue film wafer to be tested is closely attached to the porous ceramic adsorption surface. Turn off the vacuum suction gas path of the adsorption lifting assembly, and then the blue film wafer to be tested can be tested.

[0052] In one example, when testing a 6-inch blue film wafer, the adsorption lifting assembly 300 enables the second group of lifting suction rods 305, the porous ceramic adsorption surface 101 of the blue film wafer carrier suction cup 100 enables the first porous ceramic adsorption area 1011, and the fixed adsorption assembly 600 enables the first group of fixed suction rods 601.

[0053] In another example, when testing an 8-inch blue film wafer, the adsorption lifting assembly 300 enables the third group of lifting suction rods 306, the porous ceramic adsorption surface 101 of the blue film wafer carrier suction cup 100 enables the first porous ceramic adsorption area 1011, and the fixed adsorption assembly 600 enables the second group of fixed suction rods 602.

[0054] In another example, when testing a 12-inch blue film wafer, the fourth set of lifting and adsorbing rods 307 of the adsorption lifting assembly 300 is enabled, the first porous ceramic adsorption area 1011 and the second porous ceramic adsorption area 1012 of the porous ceramic adsorption surface 101 of the blue film wafer carrier suction cup 100 are enabled, and the third set of fixed adsorption rods 603 of the fixed adsorption assembly 600 is enabled.

[0055] Figure 12 The flowchart shows a method for a wafer carrier to test a normal wafer or a warped wafer provided by an exemplary embodiment of the present invention. This method for a wafer carrier to test a normal wafer or a warped wafer is applicable to the above-mentioned wafer carrier, and the method includes: Step S1: According to normal wafers or warped wafers to be tested with different sizes, control one or more sets of lifting and adsorbing rods of the adsorption lifting assembly to rise to a position higher than the annular groove adsorption surface; Step S2: Place the normal wafer or warped wafer to be tested on one or more sets of lifting and adsorbing rods of the adsorption lifting assembly, and turn on the vacuum adsorption gas path of the corresponding lifting and adsorbing rods. The vacuum pressure is -50 kPa to -95 kPa; Step S3: After the normal wafer or warped wafer to be tested is adsorbed on one or more sets of lifting and adsorbing rods of the adsorption lifting assembly, control one or more sets of lifting and adsorbing rods of the adsorption lifting assembly to descend to the same height as the annular groove adsorption surface; Step S4: Based on normal wafers or warped wafers to be tested with different sizes, turn on the vacuum adsorption gas path of one or more adsorption areas of the annular groove adsorption surface. The vacuum pressure is -50 kPa to -95 kPa; Step S5: After the annular groove adsorption surface completes the adsorption of the wafer body of the normal wafer or warped wafer to be tested, the normal wafer or warped wafer to be tested is closely attached to the annular groove adsorption surface. Turn off the vacuum adsorption gas path of the adsorption lifting assembly, and then the normal wafer or warped wafer to be tested can be tested.

[0056] In one example, when testing a 4-inch normal wafer or warped wafer, the first set of adsorption areas 2011 of the warped wafer carrier suction cup 200 is enabled, and the first set of adsorption rods 304 of the adsorption lifting assembly 300 is enabled.

[0057] In another example, when testing a 6-inch normal wafer or warped wafer, the first annular groove adsorption area 2011 and the second annular groove adsorption area 2012 of the annular groove adsorption surface 201 of the warped wafer carrier suction cup 200 are enabled, and the first set of lifting and adsorbing rods 304 of the adsorption lifting assembly 300 is enabled.

[0058] In another example, when testing an 8-inch ordinary wafer or warped wafer, the annular groove adsorption surface 201 of the warped wafer carrier chuck 200 enables the first annular groove adsorption area 2011, the second annular groove adsorption area 2012, and the third annular groove adsorption area 2013, and the first set of lifting adsorption rods 304 of the adsorption lifting assembly 300 is enabled.

[0059] In another example, when testing a 12-inch ordinary wafer or warped wafer, the annular groove adsorption surface 201 of the warped wafer carrier chuck 200 enables the first annular groove adsorption area 2011, the second annular groove adsorption area 2012, the third annular groove adsorption area 2013, and the fourth annular groove adsorption area 2014, and the first set of lifting adsorption rods 304 and the third set of lifting adsorption rods 306 of the adsorption lifting assembly 300 are enabled.

[0060] In the embodiments disclosed in the present invention, terms such as "installation", "connection", "attachment", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "attachment" can be a direct attachment or an indirect attachment through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments disclosed in the present invention can be understood according to specific circumstances.

[0061] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer carrier, comprising a base plate (308), characterized in that: The wafer carrier further comprises: A blue film wafer carrying suction cup (100), which is used for adsorbing a blue film wafer and has a porous ceramic adsorption surface (101); A warped wafer carrying suction cup (200), which is used for sucking a common wafer or a warped wafer, and has an annular groove sucking surface (201); A plurality of support seats (700) are installed at intervals on the bottom plate (308); the blue film wafer carrying suction cup (100) and the warped wafer carrying suction cup (200) are replaceably connected to the plurality of support seats (700); An adsorption lifting component (300) is mounted on the bottom plate (308) and is used to assist the blue film wafer carrying suction cup (100) in adsorbing a blue film wafer, or to assist the warped wafer carrying suction cup (200) in adsorbing a normal wafer or a warped wafer; A fixed adsorption component (600) is mounted on the bottom plate (308) and is used to assist the blue film wafer carrying suction cup (100) in adsorbing the blue film wafer; and A bearing suction cup ventilation assembly (500) mounted on the bottom plate (308) and used to provide adsorption force to the porous ceramic adsorption surface (101) or to provide adsorption force to the annular groove adsorption surface (201); The adsorption lifting assembly (300), the fixed adsorption assembly (600), and the supporting suction cup ventilation assembly (500) are all connected to an external vacuum power source via a ventilation panel (400) installed on the bottom plate (308), and the ventilation panel (400) can control the opening and closing of different air paths.

2. The wafer carrier according to claim 1, characterized in that: The porous ceramic adsorption surface (101) comprises a first porous ceramic adsorption region (1011) and a second porous ceramic adsorption region (1012) located outside the first porous ceramic adsorption region (1011) so as to adapt to blue film wafers of different sizes; The annular groove adsorption surface (201) comprises a first annular groove adsorption area (2011), a second annular groove adsorption area (2012), a third annular groove adsorption area (2013), and a fourth annular groove adsorption area (2014) which are sequentially distributed from the inside to the outside, so as to adapt to ordinary wafers or warped wafers of different sizes.

3. The wafer carrier according to claim 2, characterized in that: The load-bearing suction cup ventilation assembly (500) comprises: A first ventilation rod (501) connected to the ventilation hole at the bottom of the first porous ceramic adsorption area (1011), or connected to the ventilation hole at the bottom of the first annular groove adsorption area (2011); A second ventilation rod (502) connected to the ventilation hole at the bottom of the second annular groove adsorption area (2012); a third ventilation rod (503) which is connected to the ventilation hole at the bottom of the third annular groove adsorption area (2013); and a fourth ventilation rod (504), which is connected to the ventilation hole at the bottom of the second porous ceramic adsorption area (1012), or connected to the ventilation hole at the bottom of the fourth annular groove adsorption area (2014); The air paths of the first ventilation rod (501), the second ventilation rod (502), the third ventilation rod (503), and the fourth ventilation rod (504) can all be controlled to open and close individually through the ventilation panel (400).

4. The wafer carrier according to claim 1, characterized in that: The adsorption lifting assembly (300) comprises a first group of lifting adsorption rods (304), a second group of lifting adsorption rods (305), a third group of lifting adsorption rods (306), and a fourth group of lifting adsorption rods (307) which are sequentially distributed from the inside to the outside; The air paths of the first group of lifting adsorption rods (304), the second group of lifting adsorption rods (305), the third group of lifting adsorption rods (306), and the fourth group of lifting adsorption rods (307) can all be controlled to open and close individually through the ventilation panel (400); When the blue film wafer carrying suction cup (100) is connected to the multiple support seats (700), the second group of lifting and adsorption rods (305) and the third group of lifting and adsorption rods (306) can be lifted and lowered and passed through corresponding through holes reserved on the blue film wafer carrying suction cup (100); When the plurality of support seats (700) are connected to the warped wafer carrying suction cup (200), the first group of lifting and adsorption rods (304) and the third group of lifting and adsorption rods (306) can be lifted and lowered and passed through corresponding through holes reserved on the warped wafer carrying suction cup (200); Wherein, the fourth group of lifting and sucking rods (307) are located at the periphery of the blue film wafer carrying suction cup (100) and the warped wafer carrying suction cup (200).

5. The wafer carrier according to claim 4, characterized in that: The adsorption lifting component (300) further comprises: A horizontal driving member (301) is mounted on the base plate (308), which is a pneumatic telescopic cylinder or an electric telescopic cylinder, and is used to provide a driving force in the horizontal direction; and A horizontal guide member (302) is mounted on the bottom plate (308) and is used to cooperate with the vertical lifting member (303) to convert the horizontal driving force provided by the horizontal driving member (301) into the vertical driving force of the vertical lifting member (303); The vertical lifting member (303) is used to drive the first group of lifting adsorption rods (304), the second group of lifting adsorption rods (305), the third group of lifting adsorption rods (306), and the fourth group of lifting adsorption rods (307) to perform lifting movements.

6. The wafer carrier according to claim 5, characterized in that: The horizontal guide member (302) comprises: A horizontal guide rail (3021) mounted on the bottom plate (308); a horizontal sliding block (3022) which is slidably connected to the horizontal guide rail (3021) and connected to the driving end of the horizontal driving member (301); and A cam plate (3023) is mounted on the horizontal slider (3022) and has a waist-shaped inner hole with a first side higher than a second side; Wherein, the horizontal guide member (302) cooperates with the vertical lifting member (303) via the cam plate (3023).

7. The wafer carrier according to claim 6, characterized in that: The vertical lifting member (303) comprises: A lifting plate (3034), wherein the first group of lifting adsorption rods (304), the second group of lifting adsorption rods (305), the third group of lifting adsorption rods (306), and the fourth group of lifting adsorption rods (307) are all detachably connected to the lifting plate (3034); A vertical guide rod (3032) is mounted on the base plate (308) in a vertical direction, and the lifting plate (3034) is slidably connected to the vertical guide rod (3032) via a linear bearing (3033); and A cam bearing (3031), a first end of which is connected to the lifting plate (3034), and a second end of which is located in the waist-shaped inner hole of the cam plate (3023); When the cam plate (3023) moves in a horizontal direction, the waist-shaped inner hole of the cam plate (3023) drives the cam bearing (3031) to perform a lifting movement.

8. The wafer carrier according to claim 1, characterized in that: The fixed adsorption assembly (600) comprises a first group of fixed adsorption rods (601), a second group of fixed adsorption rods (602), and a third group of fixed adsorption rods (603) which are sequentially distributed from the inside to the outside; The first group of fixed adsorption rods (601), the second group of fixed adsorption rods (602), and the third group of fixed adsorption rods (603) are installed on the bottom plate (308) via a fixed adsorption rod base (604); The air paths of the first group of fixed adsorption rods (601), the second group of fixed adsorption rods (602), and the third group of fixed adsorption rods (603) can all be controlled to open and close individually through the ventilation panel (400); When the blue film wafer carrying suction cup (100) is connected to the multiple support seats (700), the first group of fixed suction rods (601) and the second group of fixed suction rods (602) are inserted into corresponding through holes reserved on the blue film wafer carrying suction cup (100); Wherein, the third group of fixed adsorption rods (603) is located at the periphery of the blue film wafer carrying suction cup (100).

9. A method for testing a blue film wafer using a wafer carrier, the method being applicable to the wafer carrier according to any one of claims 1 to 8, characterized in that: The method comprises: S1. According to the different sizes of the blue film wafers to be tested, one or more lifting adsorption rods of the adsorption lifting assembly are controlled to rise to a position higher than the porous ceramic adsorption surface; S2, placing the blue film wafer to be tested on one or more lifting adsorption rods of the adsorption lifting assembly, opening the vacuum adsorption gas path corresponding to the lifting adsorption rods, and the vacuum pressure is -50kpa to -95kpa; S3, when the blue film wafer to be tested is adsorbed on one or more groups of lifting adsorption rods of the adsorption lifting assembly, control the one or more groups of lifting adsorption rods of the adsorption lifting assembly to descend to the same height as the porous ceramic adsorption surface; S4. Based on the blue film wafers to be tested of different sizes, the vacuum adsorption gas path of one or more adsorption areas of the porous ceramic adsorption surface is opened, and the vacuum adsorption gas path of one or more groups of fixed adsorption rods of the fixed adsorption assembly is opened, and the vacuum pressure is -50kpa to -95kpa; S5. When the porous ceramic adsorption surface adsorbs the blue film and the wafer body of the blue film wafer to be tested, and the fixed adsorption component adsorbs the wafer ring of the blue film wafer to be tested, the blue film wafer to be tested is tightly attached to the porous ceramic adsorption surface, and the vacuum adsorption gas path of the adsorption lifting component is closed, and the blue film wafer to be tested can be tested.

10. A method for testing a normal wafer or a warped wafer using a wafer carrier, the method being applicable to the wafer carrier according to any one of claims 1 to 8, characterized in that: The method comprises: S1. According to different sizes of ordinary wafers or warped wafers to be tested, one or more lifting and adsorption rods of the adsorption lifting assembly are controlled to rise to a position higher than the annular groove adsorption surface; S2, placing the normal wafer or the warped wafer to be tested on one or more lifting adsorption rods of the adsorption lifting assembly, opening the vacuum adsorption gas path corresponding to the lifting adsorption rods, and the vacuum pressure is -50kpa to -95kpa; S3, when the normal wafer or the warped wafer to be tested is adsorbed on one or more sets of lifting adsorption rods of the adsorption lifting assembly, the one or more sets of lifting adsorption rods of the adsorption lifting assembly are controlled to descend to the same height as the annular groove adsorption surface; S4. Based on the ordinary wafers or warped wafers to be tested of different sizes, the vacuum adsorption gas path of one or more adsorption areas of the annular groove adsorption surface is opened, and the vacuum pressure is -50 kPa to -95 kPa; S5. After the annular groove adsorption surface completes adsorption of the wafer body of the ordinary wafer or the warped wafer to be tested, the ordinary wafer or the warped wafer to be tested is tightly fitted with the annular groove adsorption surface, and the vacuum adsorption air path of the adsorption lifting component is closed, and the ordinary wafer or the warped wafer to be tested can be tested.

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