Wafer clamping device and semiconductor equipment

Abstract

The invention belongs to the technical field of semiconductor processing and manufacturing, and discloses a wafer clamping device and semiconductor equipment. The wafer clamping device comprises a mounting plate, a movable clamping jaw assembly and a driven clamping jaw assembly. A fixedly connected driving piece and a rotationally connected transmission disc are arranged on the mounting plate; the movable clamping jaw assembly is in sliding connection with the mounting plate, the output end of the driving part is in transmission connection with the movable clamping jaw assembly, and when the driving part drives the movable clamping jaw assembly to move towards the circle center of the mounting plate, the movable clamping jaw assembly can slide along the guide groove of the transmission disc at the same time; the driven clamping jaw assembly is in sliding connection with the mounting plate and in transmission connection with the transmission disc, and when the movable clamping jaw assembly slides along the guide groove, the transmission disc can drive the driven clamping jaw assembly to move towards the circle center of the mounting plate. The wafer clamping device is small in occupied space, can clamp wafers of various sizes in a limited space, and is low in processing and manufacturing cost. The semiconductor equipment provided by the invention comprises the wafer clamping device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing and manufacturing, and particularly to a wafer clamping device and a semiconductor device. Background Art

[0002] Semiconductor devices are widely used in many industrial fields such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. With the rise of the semiconductor industry, the demand for semiconductor devices in these fields is increasing day by day.

[0003] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. Common wafers have various sizes such as 4 inches, 6 inches, 8 inches, and 12 inches. During the production and processing of wafers, an automated production line is required. Due to the complex wafer manufacturing process, multiple devices are needed to complete multiple processes during processing. Between different processes, a clamping device is required to transfer the wafer. The clamping device carries the wafer to transfer it between multiple devices. Existing clamping devices cannot be compatible with wafers of multiple sizes, or can be compatible with wafers of multiple sizes simultaneously but have a complex structure, occupy a large space, increase the processing cost, and cannot meet the market demand.

[0004] Therefore, there is an urgent need for a wafer clamping device and a semiconductor device to solve the above technical problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer clamping device and a semiconductor device, aiming to solve the problem that existing clamping devices cannot be compatible with wafers of multiple sizes, or even if they can be compatible with wafers of multiple sizes, they occupy a large space and have a high manufacturing cost. The wafer clamping device has a simple structure, occupies a small space, and can realize the clamping and transfer of wafers of multiple sizes to meet the market demand.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A wafer clamping device, comprising:

[0008] A mounting plate, on which a driving member fixedly connected and a transmission disk rotatably connected are provided;

[0009] A movable jaw assembly, which is slidably connected to the mounting plate. The output end of the driving member is in transmission connection with the movable jaw assembly. When the driving member drives the movable jaw assembly to move towards the center of the mounting plate, the movable jaw assembly can simultaneously slide along the guiding groove of the transmission disk;

[0010] The driven jaw assembly is slidably connected to the mounting plate. The driven jaw assembly is drivingly connected to the transmission disc. When the movable jaw assembly slides along the guiding groove, the transmission disc can drive the driven jaw assembly to move towards the center of the mounting plate.

[0011] In some possible embodiments, the movable jaw assembly includes a first jaw and a first connecting member. The first connecting member includes a first horizontal plate and a first vertical rod that are perpendicularly arranged. The first vertical rod slidably penetrates through the mounting plate and its upper end is connected to the output end of the driving member. The first horizontal plate is located below the mounting plate and is connected to the first jaw. A first extension plate is further provided at the upper end of the first vertical rod. The first extension plate protrudes with a first convex block that cooperates with the guiding groove.

[0012] In some possible embodiments, a first guiding member is provided on the first vertical rod or the first horizontal plate. The first guiding member has a sliding groove. A first long strip guiding block on the bottom surface of the mounting plate is slidably engaged with the sliding groove. The first long strip guiding block extends along the radial direction of the mounting plate.

[0013] In some possible embodiments, the transmission disc is provided with a plurality of guiding grooves. One of the guiding grooves is slidably engaged with the first convex block. The driven jaw assembly is provided with a plurality of them. The plurality of driven jaw assemblies are in one-to-one correspondence with the remaining guiding grooves and are slidably connected. When the first convex block slides along the guiding groove, the transmission disc can drive all the driven jaw assemblies to move towards the center of the mounting plate.

[0014] In some possible embodiments, the guiding groove is provided as an arc-shaped guiding groove.

[0015] In some possible embodiments, the driven jaw assembly includes a second jaw and a second connecting member. The second connecting member includes a second horizontal plate and a second vertical rod that are perpendicularly arranged. The second vertical rod slidably penetrates through the mounting plate and its upper end is provided with a second extension plate. The second extension plate protrudes with a second convex block that cooperates with the guiding groove. The second horizontal plate is located below the mounting plate and is connected to the second jaw;

[0016] A second guiding member is provided on the second horizontal plate or the second vertical rod. The second guiding member has a guiding groove. A second long strip guiding block on the bottom surface of the mounting plate is slidably engaged with the guiding groove. The second long strip guiding block extends along the radial direction of the mounting plate.

[0017] In some possible embodiments, both the first extension plate and the second extension plate are arranged in an L-shaped structure. The end of the first branch plate of the L-shaped structure is connected to the first vertical rod or the second vertical rod, and the first branch plate is perpendicular to the first vertical rod or the second vertical rod. The end of the second branch plate of the L-shaped structure is provided with the first convex block or the second convex block.

[0018] In some possible embodiments, the driving member includes a cylinder, an electric cylinder or a motor.

[0019] In some possible embodiments, the wafer clamping device further includes a photoelectric switch installed on the mounting plate and disposed near the output end of the driving member. The photoelectric switch is used to sense the distance that the output end of the driving member advances forward.

[0020] A semiconductor device includes the wafer clamping device according to any one of the above solutions.

[0021] Advantages of the present invention:

[0022] The wafer clamping device provided by the present invention, by setting a transmission disk, a movable jaw assembly and a driven jaw assembly, when the driving member drives the movable jaw assembly to move towards the center of the mounting plate, the movable jaw assembly can slide along the guiding groove of the transmission disk, and the transmission disk simultaneously drives the driven jaw assembly to move towards the center of the mounting plate, so that the movable jaw assembly and the driven jaw assembly simultaneously complete the clamping of the wafer. In actual use, according to the size of the wafer, the distance that the driving member drives the movable jaw assembly to advance can be adjusted, and then the distance that the driven jaw assembly moves towards the center of the mounting plate can be adjusted through the transmission disk, so as to realize the clamping and transfer of wafers of various sizes; the structure of the wafer clamping device is simple, occupies a small space, can realize the clamping of wafers of various sizes in a limited space, and has a low processing and manufacturing cost.

[0023] The semiconductor device provided by the present invention, by setting the above wafer clamping device, can complete the clamping and transfer of wafers of different sizes without increasing the occupied space. Description of the Drawings

[0024] Figure 1 is a three-dimensional view of the wafer clamping device provided by the embodiment of the present invention when clamping an 8-inch wafer;

[0025] Figure 2 is a three-dimensional view of the wafer clamping device provided by the embodiment of the present invention when clamping a 6-inch wafer;

[0026] Figure 3 is the working principle diagram of the wafer clamping device provided by the embodiment of the present invention;

[0027] Figure 4It is a cross-sectional view of the movable jaw assembly provided by an embodiment of the present invention;

[0028] Figure 5 It is a cross-sectional view of the driven jaw assembly provided by an embodiment of the present invention.

[0029] In the figure:

[0030] 100, mounting plate; 110, first long strip guide block; 200, driving member; 300, transmission disc; 310, guide groove; 400, movable jaw assembly; 410, first jaw; 420, first connecting member; 421, first horizontal plate; 422, first vertical rod; 423, first extension plate; 430, first guiding member; 500, driven jaw assembly; 510, second jaw; 520, second connecting member; 521, second horizontal plate; 522, second vertical rod; 523, second extension plate; 530, second guiding member; 610, first branch plate; 620, second branch plate; 700, photoelectric switch; 800, wafer. Detailed implementation manners

[0031] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, rather than all the structures.

[0032] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above the top of", and "on the top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below the bottom of", and "under the bottom of" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0034] In the description of this embodiment, the orientation or positional relationships such as "upper", "lower", "right", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0035] This embodiment provides a wafer clamping device, aiming to solve the problems that the existing clamping devices cannot be compatible with wafers of multiple sizes. Even if they can be compatible with wafers of multiple sizes, they occupy a large space and have a high manufacturing cost. The wafer clamping device has a simple structure, occupies a small space, and can realize the clamping and transfer of wafers of multiple sizes to meet the market demand.

[0036] As Figures 1 to 5 shown, the wafer clamping device includes a mounting plate 100, a movable jaw assembly 400, and a driven jaw assembly 500. A driving member 200 fixedly connected and a transmission disk 300 rotatably connected are provided on the mounting plate 100. Optionally, the transmission disk 300 can also be set as a gear-rack mechanism or a cam follower mechanism installed on the mounting plate 100, etc. The movable jaw assembly 400 is slidably connected to the mounting plate 100, and the output end of the driving member 200 is in transmission connection with the movable jaw assembly 400. When the driving member 200 drives the movable jaw assembly 400 to move towards the center of the mounting plate 100, the movable jaw assembly 400 can simultaneously slide along the guiding groove 310 of the transmission disk 300; the driven jaw assembly 500 is slidably connected to the mounting plate 100, and the driven jaw assembly 500 is in transmission connection with the transmission disk 300. When the movable jaw assembly 400 slides along the guiding groove 310, the transmission disk 300 can drive the driven jaw assembly 500 to move towards the center of the mounting plate 100. Optionally, the driving member 200 includes but is not limited to a cylinder, an electric cylinder, or a motor.

[0037] The above wafer clamping device is provided with a driving disk 300, a movable jaw assembly 400 and a driven jaw assembly 500. When the driving member 200 drives the movable jaw assembly 400 to move towards the center of the mounting plate 100, the movable jaw assembly 400 can slide along the guiding groove 310 of the driving disk 300. At the same time, the driving disk 300 drives the driven jaw assembly 500 to move towards the center of the mounting plate 100, so that the movable jaw assembly 400 and the driven jaw assembly 500 simultaneously clamp the wafer 800. In actual use, according to the size of the wafer 800, the distance that the driving member 200 drives the movable jaw assembly 400 to advance can be adjusted, and then the distance that the driven jaw assembly 500 moves towards the center of the mounting plate 100 can be adjusted through the driving disk 300, so as to realize the clamping and transfer of wafers 800 of various sizes; this wafer clamping device has a simple structure, occupies a small space, can clamp wafers 800 of various sizes in a limited space, and has a relatively low processing and manufacturing cost. It is easy to understand that the stroke of the driving member 200 and the driving disk 300 can be increased according to actual needs, and at the same time, the size of the mounting plate 100 can be increased to achieve compatibility with wafers 800 of more sizes.

[0038] See Figures 1 to 4 As shown, the movable jaw assembly 400 includes a first jaw 410 and a first connecting member 420. The first connecting member 420 includes a first horizontal plate 421 and a first vertical rod 422 which are perpendicularly arranged. The first vertical rod 422 slidably penetrates through the mounting plate 100 and its upper end is connected to the output end of the driving member 200. The first horizontal plate 421 is located below the mounting plate 100 and is connected to the first jaw 410. A first extension plate 423 is further provided at the upper end of the first vertical rod 422, and a first convex block cooperating with the guiding groove 310 protrudes from the first extension plate 423. When the driving member 200 drives the first connecting member 420 to slide along the mounting plate 100, the first convex block slides along the guiding groove 310, and the driving disk 300 rotates under the action of the first convex block, so that the driving disk 300 drives the driven jaw assembly 500 to move towards the center of the mounting plate 100, and the movable jaw assembly 400 and the driven jaw assembly 500 simultaneously clamp the wafer 800.

[0039] Further, a first guiding member 430 is provided on the first vertical rod 422 or the first horizontal plate 421. The first guiding member 430 has a sliding groove, and the first long-strip guiding block 110 on the bottom surface of the mounting plate 100 is in sliding fit with the sliding groove. The first long-strip guiding block 110 extends along the radial direction of the mounting plate 100. The matching structure of the first guiding member 430 and the first long-strip guiding block 110 can improve the movement stability of the first connecting member 420 when sliding along the mounting plate 100, and further improve the movement stability of the first clamping jaw 410. In specific implementation, the first guiding member 430 can be installed on the top surface of the first horizontal plate 421 or inserted into the first vertical rod 422, and the first clamping jaw 410 is directly connected to the bottom surface of the first horizontal plate 421. Optionally, the first clamping jaw 410 includes a first connecting plate and a first supporting plate that are perpendicular to each other. The first connecting plate is connected to the first horizontal plate 421, the first supporting plate faces inward, and a first supporting groove for supporting the wafer 800 is recessed at the end of the first supporting plate away from the first connecting plate.

[0040] Preferably, the driving disk 300 is provided with a plurality of guiding grooves 310. One of the guiding grooves 310 is in sliding fit with the first convex block. A plurality of driven clamping jaw assemblies 500 are provided. The plurality of driven clamping jaw assemblies 500 are in one-to-one correspondence with the remaining guiding grooves 310 and are slidably connected. When the first convex block slides along the guiding groove 310, the driving disk 300 can drive all the driven clamping jaw assemblies 500 to move towards the center of the mounting plate 100. In this embodiment, two driven clamping jaw assemblies 500 are provided. One movable clamping jaw assembly 400 and two driven clamping jaw assemblies 500 are evenly distributed along the circumferential direction of the mounting plate 100. When the first convex block slides along the guiding groove 310, the movable clamping jaw assembly 400 and the driven clamping jaw assemblies 500 move towards the center of the mounting plate 100 at the same time, so that the wafer 800 is clamped on the movable clamping jaw assembly 400 and the driven clamping jaw assemblies 500. In other embodiments, the number of the driven clamping jaw assemblies 500 can be set to other numbers, such as three or four, etc., which can be set according to needs.

[0041] In this embodiment, the guiding groove 310 is set as an arc-shaped guiding groove 310, and the arc-shaped guiding groove 310 can improve the movement smoothness of the movable clamping jaw assembly 400 and the driven clamping jaw assemblies 500. In other embodiments, the guiding groove 310 can also be set as a straight groove that forms an angle with the diameter of the driving disk 300.

[0042] Such as Figure 5As shown in the figure, the driven jaw assembly 500 includes a second jaw 510 and a second connecting member 520. The second connecting member 520 includes a second horizontal plate 521 and a second vertical rod 522 which are perpendicularly arranged. The second vertical rod 522 is slidably inserted through the mounting plate 100 and a second extension plate 523 is provided at its upper end. A second convex block which is matched with the guiding groove 310 is protruded on the second extension plate 523. The second horizontal plate 521 is located below the mounting plate 100 and is connected with the second jaw 510. When the driving disk 300 rotates, the driving disk 300 drives the driven jaw assembly 500 to move towards the center of the mounting plate 100, so that the movable jaw assembly 400 and the driven jaw assembly 500 simultaneously clamp the wafer 800.

[0043] Further, a second guiding member 530 is provided on the second horizontal plate 521 or the second vertical rod 522. The second guiding member 530 has a guiding groove, and a second long strip guiding block on the bottom surface of the mounting plate 100 is slidably matched with the guiding groove. The second long strip guiding block extends along the radial direction of the mounting plate 100. The matching structure of the second guiding member 530 and the second long strip guiding block can improve the movement stability of the second connecting member 520 when it slides along the mounting plate 100, and further improve the movement stability of the second jaw 510. In specific implementation, the second guiding member 530 can be installed on the top surface of the second horizontal plate 521 or inserted into the second vertical rod 522, and the second jaw 510 is directly connected with the bottom surface of the second horizontal plate 521. Optionally, the second jaw 510 includes a second connecting plate and a second supporting plate which are perpendicular to each other. The second connecting plate is connected with the second horizontal plate 521, the second supporting plate faces inwards, and a second supporting groove for supporting the wafer 800 is recessed at the end of the second supporting plate away from the second connecting plate.

[0044] Optionally, both the first extension plate 423 and the second extension plate 523 are arranged in an L-shaped structure. The end of the first branch plate 610 of the L-shaped structure is connected with the first vertical rod 422 or the second vertical rod 522, and the first branch plate 610 is perpendicular to the first vertical rod 422 or the second vertical rod 522. The end of the second branch plate 620 of the L-shaped structure is provided with a first convex block or a second convex block. The setting of the first branch plate 610 can leave more operating space for the connection between the driving member 200 and the first extension plate 423, and between the driving member 200 and the second extension plate 523, and improve the disassembly and assembly convenience.

[0045] Optionally, the wafer clamping device further includes a photoelectric switch 700 installed on the mounting plate 100 and disposed near the output end of the driving member 200. The photoelectric switch 700 is used to sense the advancing distance of the output end of the driving member 200. During assembly, the position and number of the photoelectric switch 700 can be adjusted according to requirements, so that the wafer clamping device can be adapted to wafers 800 of various different specifications. Specifically, both the photoelectric switch 700 and the driving member 200 can be electrically connected to the control board. The control board can automatically read the size of the wafer 800 to control the output end of the driving member 200 to advance different distances, thereby enabling the movable jaw assembly 400 and the driven jaw assembly 500 to change the clamping stations. At the same time, the photoelectric switch 700 can monitor the positions of the movable jaw assembly 400 and the driven jaw assembly 500 to achieve the mixed transfer and clamping of wafers 800 of multiple sizes.

[0046] In this embodiment, two photoelectric switches 700 are provided. The position of one photoelectric switch 700 corresponds to the clamping position of the 6-inch wafer 800, and the position of the other photoelectric switch 700 corresponds to the clamping position of the 8-inch wafer 800. In other embodiments, the number of photoelectric switches 700 can be set to four, and the positions can correspond to the clamping positions of 4-inch, 6-inch, 8-inch, and 12-inch wafers 800 respectively, which can be set according to needs.

[0047] This embodiment also provides a semiconductor device, including the above-mentioned wafer clamping device. By providing the wafer clamping device, the clamping and transfer of wafers 800 of different sizes can be completed without increasing the occupied space.

[0048] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments, and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A wafer clamping device, characterized in that: include: A mounting plate (100), wherein a fixedly connected driving member (200) and a rotatably connected transmission plate (300) are provided on the mounting plate (100); A movable jaw assembly (400) is slidably connected to the mounting plate (100); an output end of the driving member (200) is transmission-connected to the movable jaw assembly (400); when the driving member (200) drives the movable jaw assembly (400) to move toward the center of the mounting plate (100), the movable jaw assembly (400) can simultaneously slide along the guide groove (310) of the transmission disk (300); The driven jaw assembly (500) is slidably connected to the mounting plate (100), and the driven jaw assembly (500) is transmission-connected to the transmission disk (300). When the movable jaw assembly (400) slides along the guide groove (310), the transmission disk (300) can drive the driven jaw assembly (500) to move toward the center of the mounting plate (100).

2. The wafer clamping device according to claim 1, characterized in that: The movable clamping jaw assembly (400) includes a first clamping jaw (410) and a first connecting member (420), wherein the first connecting member (420) includes a first transverse plate (421) and a first vertical rod (422) which are perpendicularly arranged to each other, wherein the first vertical rod (422) is slidably arranged on the mounting plate (100) and an upper end thereof is connected to an output end of the driving member (200), the first transverse plate (421) is located below the mounting plate (100) and is connected to the first clamping jaw (410), and a first extension plate (423) is further arranged at an upper end of the first vertical rod (422), wherein the first extension plate (423) is provided with a first protrusion which cooperates with the guide groove (310).

3. The wafer clamping device according to claim 2, characterized in that: A first guide member (430) is provided on the first vertical rod (422) or the first horizontal plate (421), and the first guide member (430) has a slide groove. A first long strip guide block (110) on the bottom surface of the mounting plate (100) is slidably matched with the slide groove, and the first long strip guide block (110) extends radially along the mounting plate (100).

4. The wafer clamping device according to claim 2, characterized in that: The transmission disk (300) is provided with a plurality of guide grooves (310), one of which is slidably matched with the first protrusion, and the driven jaw assemblies (500) are provided with a plurality of driven jaw assemblies (500), and the plurality of driven jaw assemblies (500) correspond to the remaining guide grooves (310) one by one and are slidably connected. When the first protrusion slides along the guide groove (310), the transmission disk (300) can drive all the driven jaw assemblies (500) to move toward the center of the circle of the mounting plate (100).

5. The wafer clamping device according to claim 4, characterized in that: The guide groove (310) is configured as an arc-shaped guide groove (310).

6. The wafer clamping device according to claim 4, characterized in that: The driven clamping jaw assembly (500) comprises a second clamping jaw (510) and a second connecting member (520), wherein the second connecting member (520) comprises a second transverse plate (521) and a second vertical rod (522) which are perpendicularly arranged to each other, wherein the second vertical rod (522) is slidably arranged on the mounting plate (100) and a second extension plate (523) is arranged on the upper end thereof, wherein the second extension plate (523) is convexly provided with a second protrusion which cooperates with the guide groove (310), and the second transverse plate (521) is located below the mounting plate (100) and is connected to the second clamping jaw (510); A second guide member (530) is provided on the second transverse plate (521) or the second vertical rod (522), and the second guide member (530) has a guide groove, and a second elongated guide block on the bottom surface of the mounting plate (100) is slidably engaged with the guide groove, and the second elongated guide block extends radially along the mounting plate (100).

7. The wafer clamping device according to claim 6, characterized in that: The first extension plate (423) and the second extension plate (523) are both configured as L-shaped structures, the end of the first branch plate (610) of the L-shaped structure is connected to the first vertical rod (422) or the second vertical rod (522), and the first branch plate (610) is perpendicular to the first vertical rod (422) or the second vertical rod (522), and the end of the second branch plate (620) of the L-shaped structure is provided with the first protrusion or the second protrusion.

8. The wafer clamping device according to claim 1, characterized in that: The driving member (200) comprises a pneumatic cylinder, an electric cylinder or a motor.

9. The wafer clamping device according to claim 1, characterized in that: The wafer clamping device further comprises a photoelectric switch (700) mounted on the mounting plate (100) and arranged close to the output end of the driving member (200), wherein the photoelectric switch (700) is used to sense the distance the output end of the driving member (200) is advanced forward.

10. A semiconductor device, characterized in that It comprises a wafer clamping device as described in any one of claims 1 to 9.

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